A heat dissipation structure for software engineering elements

Abstract

The application discloses a software engineering element heat dissipation structure, and aims at solving the shortage of the existing heat dissipation mode. The structure is mainly composed of a protective shell, a heat conduction sheet, a fan, a water inlet, lower and upper cooling pipes, a water outlet, a fixing plate, a valve, the water outlet, a hanging buckle, a hollow plate and the like. The protective shell provides protection and support, the heat conduction sheet cooperates with the element to absorb heat and transmit the heat to the cooling pipe, the fan performs secondary heat dissipation, the water inlet sends liquid to the cooling pipe through the valve, the lower cooling pipe mainly dissipates heat, the upper cooling pipe assists, and the heated liquid is discharged through the water outlet and the hollow plate. The structure realizes efficient heat dissipation, accurate flow control, convenient installation and stable circulation through the synergistic effect of various modes, improves heat dissipation efficiency, stability and reliability, prolongs the service life of the element, and has important value in the field of software engineering element heat dissipation.

Description

Technical Field

[0001] This invention relates to the field of heat dissipation technology for software engineering components, and more particularly to a heat dissipation structure for software engineering components. Background Technology

[0002] With the rapid development of software engineering technology, the performance of various software engineering components is constantly improving, and their computing speed and processing capabilities are increasing day by day. However, while these components are operating at high performance, they generate a lot of heat. If this heat cannot be dissipated in a timely and effective manner, it will lead to excessively high component temperatures.

[0003] High temperatures can have numerous adverse effects on software engineering components. On one hand, excessively high temperatures reduce component efficiency, slowing data processing and impacting the overall smoothness of the software system. For example, in some large data center servers, chips automatically reduce their operating frequency to minimize heat generation when the temperature exceeds the normal range, leading to increased data processing latency. On the other hand, prolonged exposure to high temperatures can severely affect the lifespan of components and may even cause permanent damage. Research indicates that for certain sensitive semiconductor components, a 10°C increase in temperature can multiply their failure rate several times over.

[0004] Existing heat dissipation methods for software engineering components mainly include air cooling and liquid cooling. Air cooling has a simple structure and low cost, but its heat dissipation efficiency is limited, often failing to meet the cooling requirements of high-power, high-heat-generating software engineering components. While liquid cooling has strong heat dissipation capabilities, the system is usually more complex, difficult to install and maintain, and some liquid cooling devices suffer from uneven coolant distribution, leading to unstable heat dissipation and an inability to comprehensively and efficiently cool software engineering components. This can easily cause localized overheating, affecting the overall performance and reliability of the components. Therefore, there is an urgent need for a heat dissipation structure for software engineering components that is highly efficient, structurally sound, easy to install and maintain, and provides uniform and stable heat dissipation. Summary of the Invention

[0005] The purpose of this invention is to provide a heat dissipation structure for software engineering components to solve the problems mentioned in the background art.

[0006] To achieve the above objectives, the present invention provides a heat dissipation structure for software engineering components, which mainly consists of a protective shell, a heat-conducting plate, a fan, a water inlet, a lower cooling pipe, an upper cooling pipe, a water outlet, a fixing plate, a first valve, a second valve, a lower water outlet, an upper water outlet, a hook, and a hollow plate.

[0007] In some embodiments, a fan is located on top of the protective shell, and the fan is fixed to the top of the protective shell by a mounting plate. The interior of the protective shell contains a heat-conducting plate, which includes a lower cooling pipe and an upper cooling pipe.

[0008] In some embodiments, the inlet is connected to a first valve and a second valve, through which the cooling liquid is delivered in stages to the lower cooling pipe and the upper cooling pipe for cooling. The first valve controls the opening and closing of the lower cooling pipe, and the second valve controls the upper cooling pipe. The lower cooling pipe absorbs more heat than the upper cooling pipe. Therefore, in this invention, the opening range of the first valve is greater than that of the second valve.

[0009] In some embodiments, after the heat-conducting plate absorbs heat, it transfers the heat to the lower cooling pipe and the upper cooling pipe for primary heat dissipation, followed by secondary heat dissipation through a fan.

[0010] In some embodiments, the water outlet is connected to a hollow plate, which is connected to a lower water outlet and an upper water outlet. The hollow plate collects the liquid from the four pipes, concentrates the liquid through the hollow plate, and finally discharges it through the water outlet.

[0011] In some embodiments, both the lower cooling pipe and the upper cooling pipe are made of thermally conductive materials.

[0012] This invention discloses a heat dissipation structure for software engineering components. Its advantages include: rapid heat conduction via heat-conducting plates; primary heat absorption by the lower cooling pipe and auxiliary uniform heat dissipation by the upper cooling pipe; and efficient heat dissipation achieved by combining a fan to accelerate heat dissipation from the surface of the heat-conducting plates. The first and second valves work in tandem to precisely control the flow rate of the cooling liquid, adapting to different heat dissipation needs. A protective shell provides stable support and protection for the components and facilitates installation, fixing, and position adjustment via hooks. A hollow plate ensures orderly and stable liquid circulation. This effectively solves many drawbacks of existing heat dissipation methods, significantly improving the heat dissipation efficiency, stability, and reliability of software engineering components. It strongly promotes high-performance operation and extends the service life of these components in suitable temperature environments, demonstrating significant application value and broad prospects.

[0013] Other features and advantages of the present invention will be set forth in the following description. Attached Figure Description

[0014] Figure 1 This is a perspective view of the present invention;

[0015] Figure 2 This is a right view of the present invention;

[0016] Figure 3 This is a front view of the present invention;

[0017] Figure 4 This is a top view of the present invention;

[0018] Figure 5 This is a top cross-sectional view of the heat-conducting sheet of the present invention;

[0019] In the diagram: 1-protective shell, 2-heat conduction plate, 3-fan, 4-water inlet, 5-lower cooling pipe, 6-upper cooling pipe, 7-water outlet, 8-fixing plate, 9-first valve, 10-second valve, 11-lower water outlet, 12-upper water outlet, 13-hook, 14-hollow plate. Detailed Implementation

[0020] The technical solutions of the present invention will now be clearly and completely described with reference to the accompanying drawings of the embodiments of the present invention. It should be understood that the specific embodiments described herein are for illustration and explanation only and are not intended to limit the present invention.

[0021] This invention relates to a heat dissipation structure for a software engineering component, which mainly consists of a protective shell 1, a heat-conducting plate 2, a fan 3, a water inlet 4, a lower cooling pipe 5, an upper cooling pipe 6, a water outlet 7, a fixing plate 8, a first valve 9, a second valve 10, a lower water outlet 11, an upper water outlet 12, a hook 13, and a hollow plate 14.

[0022] The protective shell 1 serves as the external protection and support frame for the entire heat dissipation structure. It houses components such as the heat-conducting plate 2 and cooling pipes. A fan 3 is fixed above it, and the inlet 4 and outlet 7 are connected to its sides, providing stable mounting positions for each component, protecting the internal components, and ensuring the overall stability of the heat dissipation structure. The heat-conducting plate 2 is located inside the protective shell 1, in close contact with the lower cooling pipe 5 and the upper cooling pipe 6. It also works in conjunction with the software engineering components (assuming a tight fit), quickly absorbing the heat generated by the components and transferring it to the cooling pipes, thus achieving heat transfer from the components to the cooling pipes. The fan 3 is fixed above the protective shell 1 by a mounting plate 8, positioned to blow air onto the heat-conducting plate 2. It starts after the heat-conducting plate 2 has transferred heat to the cooling pipes, accelerating air circulation to remove heat from the surface of the heat-conducting plate 2 for secondary heat dissipation.

[0023] The inlet 4 connects to an external cooling liquid source and the first valve 9 and the second valve 10, providing a cooling liquid inlet for the lower cooling pipe 5 and the upper cooling pipe 6. The flow rate and direction of the liquid are controlled by the valves. The lower cooling pipe 5 is located inside the heat-conducting plate 2, in close contact with it. It is connected to the outside via the inlet 4 and the first valve 9, and then connected to the outlet 7 via the hollow plate 14. Because it is close to the area with more heat, it undertakes the main task of heat absorption. The cooling liquid flowing inside absorbs heat to achieve primary heat dissipation. The upper cooling pipe 6 is located inside the heat-conducting plate 2, in contact with it. It is connected to the outside and the outlet 7 via related components, assisting the lower cooling pipe 5 in heat dissipation and making the heat dissipation of the heat-conducting plate 2 more uniform. The outlet 7 is connected to the hollow plate 14, collecting and discharging the cooled liquid after heating, maintaining the continuous heat dissipation process. The fixing plate 8 fixes the fan 3 above the protective shell 1, ensuring the stable operation of the fan 3. The first valve 9 controls the flow of cooling liquid into the lower cooling pipe 5, and the opening range is adjusted to meet its heat dissipation needs. The second valve 10 controls the inflow of cooling liquid into the upper cooling pipe 6, cooperating with the first valve 9 to achieve reasonable distribution of liquid flow. The lower outlet 11 and upper outlet 12 are respectively connected to the hollow plate 14, providing a discharge path for the heated liquid in the lower and upper cooling pipes 5 and 6, allowing the liquid to smoothly collect in the hollow plate 14 before being discharged. The hook 13 is installed on the outside of the protective shell 1, cooperating with the external fixing structure to facilitate the installation, fixing, and position adjustment of the heat dissipation structure. The hollow plate 14 connects to the outlet 7, lower outlet 11, and upper outlet 12, collecting the heated liquid and discharging it through the outlet 7, ensuring orderly and stable liquid discharge and maintaining the continuity of liquid circulation in the heat dissipation system.

[0024] The above embodiments are only for illustrating the technical concept and features of the present invention, and are intended to enable those skilled in the art to understand the content of the present invention and implement it accordingly. They should not be construed as limiting the scope of protection of the present invention. All equivalent changes or modifications made in accordance with the spirit and essence of the present invention should be covered within the scope of protection of the present invention.

Claims

1. A heat dissipation structure for a software engineering component, characterized in that, include: The protective shell (1) serves as an external protective and support frame, and internally houses components such as heat-conducting plates (2), fan (3), lower cooling pipe (5), and upper cooling pipe (6). The fan (3) is fixed at the top, and the water inlet (4) and water outlet (7) are connected to the side. The heat-conducting plate (2) is located inside the protective shell (1), and is in close contact with the lower cooling tube (5) and the upper cooling tube (6) and cooperates with the software engineering components to absorb the heat of the components and transfer it to the cooling tubes; The fan (3) is fixed above the protective shell (1) by the fixing plate (8). The position is conducive to blowing air onto the heat-conducting plate (2). After the heat-conducting plate (2) transfers heat to the cooling pipe, it starts to accelerate the air circulation to remove the heat from the surface of the heat-conducting plate (2). The inlet (4) is connected to an external cooling liquid source and the first valve (9) and the second valve (10) to provide a cooling liquid inlet for the lower cooling pipe (5) and the upper cooling pipe (6); The lower cooling pipe (5) is located inside the heat-conducting plate (2) and is in close contact with the heat-conducting plate (2). It is connected to the outside through the water inlet (4) and the first valve (9), and then connected to the water outlet (7) through the hollow plate (14). It undertakes the main task of heat absorption. The upper cooling pipe (6) is located inside and above the heat-conducting plate (2), in contact with the heat-conducting plate (2), and is connected to the outside through related components. Connect the water outlet (7) to assist the cooling pipe (5) below in dissipating heat; The outlet (7) is connected to the hollow plate (14) and is used to collect the cooled liquid after heating and discharge it. Fixing plate (8) to fix fan (3) above protective shell (1); The first valve (9) controls the flow of cooling liquid into the lower cooling pipe (5); The second valve (10) controls the flow of cooling liquid into the upper cooling pipe (6), and works in conjunction with the first valve (9) to achieve a reasonable distribution of liquid flow. The lower outlet (11) is connected to the hollow plate (14) to provide a discharge path for the heated liquid in the lower cooling pipe (5); The upper outlet (12) is connected to the hollow plate (14) to provide a discharge path for the heated liquid in the upper cooling pipe (6); The hook (13) is installed on the outside of the protective shell (1) and cooperates with the external fixing structure for the installation, fixing and position adjustment of the heat dissipation structure; Hollow plate (14) is connected to water outlet (7), lower water outlet (11) and upper water outlet (12). The heated liquid is collected and discharged through water outlet (7).

2. The heat dissipation structure for software engineering components according to claim 1, characterized in that, The heat-conducting sheet (2) is closely attached to the software engineering component to efficiently transfer heat.

3. The heat dissipation structure of the software engineering component according to claim 1, characterized in that, The fan (3) directs the airflow toward the heat-conducting plate (2), and its speed can be adjusted to meet different heat dissipation needs.

4. The heat dissipation structure for software engineering components according to claim 1, characterized in that, The opening degree of the first valve (9) and the second valve (10) can be adjusted independently to achieve precise control of the cooling liquid flow rate of the lower cooling pipe (5) and the upper cooling pipe (6).

5. The heat dissipation structure for software engineering components according to claim 1, characterized in that, The hollow plate (14) has a flow guiding structure inside to ensure that the heated liquid is smoothly collected to the outlet (7) and discharged stably.

6. The heat dissipation structure for software engineering components according to claim 1, characterized in that, The hook (13) can be installed in multiple positions on the outside of the protective shell (1) and is compatible with a variety of external fixing structures.

Images