Method and apparatus for improving cooling performance of dual in-line memory modules

Abstract

The present disclosure relates to methods and apparatuses that improve cooling performance of dual in-line memory modules. An example apparatus includes a heat pipe extending between a first dual in-line memory module (DIMM) and a second DIMM. A first end of the heat pipe extends beyond a first end of the first DIMM and the second DIMM. A second end of the heat pipe extends beyond a second end of the first DIMM and the second DIMM. The example apparatus also includes an array of fins thermally coupled to the first end of the heat pipe.

Description

Background Technology

[0001] With the rise of big data applications, artificial intelligence (AI) applications, and other high-performance and / or centralized computing (e.g., cloud computing) applications, processor chips are being pushed to ever higher performance levels. Furthermore, there is a growing demand for more memory capacity to operate in conjunction with higher-performance processor chips. Efforts to meet this increased memory demand include improving the performance and / or density of transistors on a given memory chip and / or implementing systems that include a greater number of memory chips. Attached Figure Description

[0002] Figure 1 An exemplary server component constructed in accordance with the teachings disclosed herein is shown.

[0003] Figure 2 yes Figure 1 The exemplary heatsink assembly shown is a perspective view omitting the motherboard and DIMM.

[0004] Figure 3 yes Figure 1 A top view of an exemplary heatsink assembly on the motherboard shown.

[0005] Figure 4 This is an exemplary heatsink assembly omitting the motherboard and DIMM components. Figure 3 A similar top view.

[0006] Figure 5 Along an exemplary heatsink assembly on the motherboard Figure 3 The cross-sectional view shown is taken by line 5-5.

[0007] Figure 6 This is an exemplary heatsink assembly omitting the motherboard and DIMM components. Figure 5 Similar sectional views.

[0008] Figure 7 yes Figure 1 A side view of an exemplary heatsink assembly on the motherboard shown.

[0009] Figure 8 This is an exemplary heatsink assembly omitting the motherboard and DIMM components. Figure 7 A similar side view.

[0010] Figure 9 This is a bottom perspective view of an exemplary third fin array of a heat sink assembly.

[0011] Figure 10 It shows Figures 1-9 The exemplary heat pipe sandwiched between two DIMMs and the associated exemplary heat diffuser are shown in the exemplary heat sink assembly.

[0012] Figure 11 It means manufacturing Figures 1-10 A flowchart illustrating an exemplary method of an exemplary heat sink assembly. Detailed Implementation

[0013] Generally, the same reference numerals are used throughout the accompanying drawings and written description to denote the same or similar parts. The drawings are not necessarily drawn to scale. Instead, the thickness of layers or regions may be enlarged in the drawings. Although the drawings show layers and regions with clearly defined lines and boundaries, some or all of these lines and / or boundaries may be idealized. In reality, boundaries and / or lines may be unobservable, mixed, and / or irregular.

[0014] With the explosive growth in demand for AI, machine learning, and large language models, a massive number of parameters need to be processed during the training phase. To handle these parameters, batch processing requires more memory capacity, leading to an increased demand for Dual In-line Memory Module (DIMM) slots in servers. Furthermore, there is a growing demand for higher-performance processor chips (e.g., CPU packages) to handle large amounts of data. Increasingly larger processor chips meet the demands for processor performance, leaving less and less space for DIMM slots on servers. This challenge is exacerbated by the fact that server motherboards are typically size-constrained to fit into a standard 19-inch rack. One solution is to cluster the DIMM slots more closely together. Specifically, known motherboards include DIMM slots spaced apart with a 0.297-inch pitch. Examples disclosed herein include DIMM slots with a pitch or spacing less than 0.29 inches (e.g., less than or equal to 0.28 inches, less than or equal to 0.27 inches, less than or equal to 0.26 inches, less than or equal to 0.25 inches, etc.). While the smaller spacing allows DIMMs to be installed in a smaller area, positioning the DIMMs more closely together presents a challenge to the proper dissipation of heat generated by such DIMMs. Specifically, DIMMs are typically cooled by forcing air through and between adjacent DIMMs. By positioning the DIMMs more closely together, the space for cooling air to pass through and carry away heat becomes smaller.

[0015] As memory chip performance increases (e.g., from 3600 megabytes per second (MT / s) to 8800 MT / s), DIMM thermal management becomes more challenging, associated with a significant increase in power consumption and associated heat generation. More specifically, some known DDR5-3200 DIMMs consume approximately 10 watts (W) per DIMM, while some known DDR5-8800 DIMMs using multiplexer combination class (MCR) consume approximately 22W per DIMM.

[0016] The challenges associated with heat dissipation from DIMMs can be further exacerbated by the environment in which they are implemented. Many servers are implemented in temperature-controlled rooms within data centers. However, for edge computing and / or edge AI applications, servers can be implemented in small enclosures that experience fluctuating temperatures based on local weather conditions. As a result, system operating temperatures can be significantly higher than those faced in temperature-controlled rooms within data centers (e.g., up to 65 degrees Celsius or higher).

[0017] Past approaches to DIMM cooling have included limiting the DIMM's thermal design power (TDP) based on the system's cooling capacity. However, this approach compromises some higher bandwidth and / or higher performance DIMM models. Another known method is to implement closed-loop thermal throttling (CLTT) based on thermal sensors on a given DIMM. However, throttling adversely affects performance to a degree that is no longer sufficient to meet the increasingly important demands of AI and / or other high-performance applications.

[0018] The examples disclosed herein relate to an enhanced volumetric air cooling (EVAC) solution based on a radiator assembly configured to enhance heat dissipation of DIMMs spaced at a narrower pitch than known methods, without requiring throttling or other performance suppression actions. More specifically, the exemplary EVAC solution includes a DIMM thermal diffuser positioned adjacent to the respective DIMM (and / or between adjacent pairs of DIMMs). The DIMM thermal diffuser is thermally coupled to a corresponding flat heat pipe extending to an array of outward-extending fins adjacent to one or both ends of the DIMM. The fin array is aligned with the airflow direction for cooling air. Thus, heat generated by the DIMM is drawn by the thermal diffuser to the heat pipe, which then transfers the heat to the fin array, where it is ultimately transferred to the cooling air flowing through the system.

[0019] Simulations and experimental tests have demonstrated that the examples disclosed herein provide enhanced cooling compared to previously known methods, enabling DIMMs to be positioned more tightly clustered without overheating concerns and / or enabling DIMMs with higher performance than previously possible. More specifically, simulations show that the exemplary EVAC solution disclosed herein reduces DIMM temperature by more than 20 degrees Celsius and thermal resistance by more than 1 degree Celsius / watt (C / W) compared to DIMMs using forced air cooling without an exemplary EVAC solution. Furthermore, this reduction in DIMM temperature is achieved even in simulated high operating temperature environments, making the exemplary EVAC solution disclosed herein a suitable option for implementation in edge computing applications where servers may be exposed to relatively extreme temperatures based on local weather patterns. Additionally, this temperature reduction is achieved through forced air rather than through more expensive liquid cooling systems (e.g., cold plate and / or immersion cooling systems) that could cause concerns about coolant leakage. Moreover, the more efficient cooling achieved by the examples disclosed herein saves power by reducing fan power and / or fan speed per minute (RPM) relative to known air cooling solutions.

[0020] Figure 1 An exemplary server component 100 constructed in accordance with the teachings disclosed herein is shown. In this example, the server component 100 includes a motherboard 101 (e.g., a server board, a main printed circuit board), the motherboard 101 including a processor socket 102 positioned between two (e.g., first and second) memory banks 104, 106 (e.g., DIMM memory banks) in a DIMM slot 108 (e.g., a DIMM receptacle). The processor socket 102 is configured to receive a corresponding processor chip (e.g., a processor die, an integrated circuit (IC) package, etc.), which has been omitted for clarity. Furthermore, in Figure 1 In the illustrated example, each DIMM slot 108 includes a corresponding DIMM 110 (e.g., a memory card, memory stick, memory board, etc.), which is inserted into the DIMM slot 108 to define an array of DIMM 110s. As shown in the illustrated example, the DIMM 110 includes a base circuit board 112 (e.g., a printed circuit board (PCB)) and a plurality of memory chips 114 (e.g., memory dies) mounted on the base circuit board 112. In some examples, all the memory chips 114 of a given DIMM 110 are mounted on the same side of the corresponding base circuit board 112. In other examples, the memory chips 114 are mounted on both sides of the corresponding base circuit board 112. In some examples, the DIMM 110 includes more or fewer memory chips 114 than shown in the illustrated example.

[0021] exist Figure 1 In one example, an exemplary heatsink assembly 116 (e.g., an EVAC solution) is positioned adjacent to and between DIMMs 110 in the first memory bank 104 of the DIMM slot 108. In some instances, a similar heatsink assembly 116 is also positioned adjacent to DIMMs 110 in the second memory bank 106. However, for illustrative purposes, the heatsink assembly 116 associated with the second row 106 is omitted. Figures 2-8 It shows Figure 1 Different views of the exemplary heat sink assembly 116 are shown. Specifically, Figure 2 yes Figure 1 The exemplary heat sink assembly 116 shown is a perspective view omitting the motherboard 101 and DIMM 110. Figure 3 yes Figure 1 A top view of an exemplary heatsink assembly 116 on the motherboard 101 shown. Figure 4 The exemplary heatsink assembly 116 omits the motherboard 101 and DIMM 110. Figure 3 A similar top view. Figure 5 Along the exemplary heatsink assembly 116 on motherboard 101 Figure 3 The cross-sectional view shown is taken by line 5-5. Figure 6 The exemplary heatsink assembly 116 omits the motherboard 101 and DIMM 110. Figure 5 Similar sectional views. Figure 7 yes Figure 1 Side view of an exemplary heatsink assembly 116 on the motherboard 101 shown. Figure 8 The exemplary heatsink assembly 116 omits the motherboard 101 and DIMM 110. Figure 7 A similar side view.

[0022] In the illustrated example, each of memory modules 104 and 106 includes a row of eight DIMM slots 108 spaced apart with a pitch of approximately 0.26 inches (e.g., 0.26 + / - 0.005 inches) corresponding to 6.6 millimeters (mm). In other examples, memory modules 104 and 106 include more or fewer DIMM slots 108 than the eight shown. Furthermore, in some examples, the DIMM slots 108 may be spaced apart with any other suitable pitch, including 0.297 inches (implemented on many known motherboards) and / or smaller pitches (e.g., less than or equal to 0.29 inches, less than or equal to 0.28 inches, less than or equal to 0.27 inches, less than or equal to 0.26 inches, less than or equal to 0.25 inches, etc.). In the illustrated example, the thickness of the DIMM 110 (including the base circuit board 112 and the memory chip 114 mounted on the base circuit board 112) is approximately 0.13 inches (e.g., 3.3 mm). With a DIMM slot 108 pitch of 0.26 inches, the gap or space between adjacent DIMMs 110 is approximately 0.13 inches (e.g., 3.3 mm).

[0023] As illustrated in the example, portions of the heatsink assembly 116 extend through the gaps between adjacent pairs of DIMMs 110 to facilitate heat transfer away from the DIMMs 110. More specifically, in some embodiments, the heatsink assembly 116 includes a plurality of heat pipes 118 located between adjacent pairs of DIMMs 110 near the top edge of the DIMMs 110. As used in this context, the top edge of the DIMM 110 corresponds to the edge of the DIMM 110 furthest from (e.g., opposite to) the motherboard 101.

[0024] In some instances, such as Figure 5 and Figure 6As most clearly shown in the cross-sectional view, heat pipe 118 is hollow to contain a liquid coolant capable of evaporating (e.g., boiling) and condensing to facilitate heat transfer along the length of heat pipe 118, more specifically from the central region of heat pipe 118 (where DIMM 110 is disposed) to the opposite first end 120 and second end 122 of heat pipe 118. In some instances, the walls of heat pipe 118 comprise any suitable thermally conductive material (e.g., copper, aluminum alloy, etc.). In some instances, heat pipe 118 is flatter or narrower, meaning that heat pipe 118 has a cross-section defined by a width (or height) that is multiple times its thickness, similar to a vapor chamber. Therefore, in some instances, heat pipe 118 can be implemented by a vapor chamber and / or referred to as a vapor chamber. In some instances, the length of heat pipe 118 is multiple times its height. More specifically, in some instances, the length of heat pipe 118 is significantly longer than DIMM. In this context, the width or height of heat pipe 118 corresponds to the dimension measured in the direction perpendicular to motherboard 101, the thickness of heat pipe 118 corresponds to the dimension measured in the direction perpendicular to DIMM 110, and the length of heat pipe 118 corresponds to the dimension measured in the direction parallel to both motherboard 101 and DIMM 110.

[0025] In the illustrated example, the heat sink assembly 116 also includes a plurality of heat diffusers 124, with different heat diffusers of the heat diffusers 124 attached to corresponding heat pipes in the heat pipes 118. Thus, like the heat pipes 118, the heat diffusers 124 are positioned between adjacent pairs of DIMMs 110. In some examples, in addition to extending between adjacent pairs of DIMMs 110, the heat sink assembly 116 also includes heat pipes 118 and corresponding heat diffusers 124 located outside the outermost DIMM 110. Thus, in some examples, each DIMM 110 is sandwiched between two heat pipes 118 and two heat diffusers 124. In other words, in some examples, at least one heat pipe 118 is closer to the processor socket 102 than the DIMM 110 in the first memory bank 104 that is closest to the processor socket 102. Furthermore, in some instances, at least one heat pipe 118 is further from the processor socket 102 than the DIMM 110 in the first storage body 104 that is furthest from the processor socket 102.

[0026] In some instances, the heat diffuser 124 is a solid plate or sheet of a thermally conductive material (e.g., copper, aluminum alloy, etc.). In some instances, the heat diffuser 124 has a shorter length (measured in a direction parallel to DIMM 110 and parallel to motherboard 101) than the heat pipe 118. More specifically, in some instances, the heat diffuser 124 has a length substantially corresponding to the length of DIMM 110. In contrast, the heat pipe 118 has a length extending significantly beyond the end of DIMM 110. In some instances, the heat diffuser 124 may be longer or shorter than shown in the illustrated examples. However, in some instances, the heat diffuser 124 is at least long enough to cover a substantial portion (e.g., all) of the outer surface of memory chip 114 on DIMM 110 and / or to mat with memory chip 114. Although the length of the heat diffuser 124 is shorter than that of the heat pipe 118, in some instances, the heat diffuser 124 has a larger width (or height). Specifically, in some instances, the heat diffuser 124 extends downward from the heat pipe 118 (e.g., toward the motherboard 101) over a large portion of the width (or height) of the corresponding DIMM 110. More specifically, in some instances, the width (or height) of the heat diffuser 124 is sufficient to cover a substantial portion (e.g., all) of the outward-facing surface of the memory chip 114 on the DIMM 110 and / or to dock with the memory chip 114.

[0027] The heat diffuser 124 is sized to cover and / or interface with the memory chip 114 on the DIMM 110 to absorb heat generated by the memory chip 114. As heat is absorbed by the heat diffuser 124, it is transferred to the heat pipe 118 and along its length (e.g., through evaporation and condensation of liquid within the heat pipe 118) to a first end 120 and a second end 122 of the heat pipe 118. As illustrated in the example, the ends 120, 122 of the heat pipe 118 are thermally coupled (e.g., embedded within) to a first heat-conducting plate 126 and a second heat-conducting plate 128, which are supported by corresponding first fin arrays 130 and 132. Based on this arrangement, heat is transferred from heat pipe 118 to heat conduction plates 126, 128 to fin arrays 130, 132 before being dissipated into the cooling air blowing over server component 100. In this example, both the fins in fin arrays 130, 132 and DIMM 110 are oriented to extend in planes that are generally parallel to each other and generally parallel to the airflow direction 134 of the cooling air, in order to improve cooling efficiency by allowing air to pass through the fins in fin arrays 130, 132. As used herein, "generally parallel" is defined as meaning precise parallelism within 5 degrees.

[0028] In some instances, the heat pipes 118 and the heat diffuser 124 substantially fill the gaps or spaces between adjacent pairs of DIMMs 110, allowing less air to pass through or between the DIMMs 110. Therefore, in some instances, a second fin array 132 downstream of the heat diffuser 124 (and associated second heat-conducting plate 128) is spaced apart from the heat diffuser 124 (and associated DIMMs 110) to provide a first gap 135 between the heat pipes 118 through which air can reach the second (downstream) fin array 132 (after passing the top of the DIMMs 110 and the remainder of the radiator assembly 116). Furthermore, the separation between the second fin array 132 (and associated second heat-conducting plate 128) and the heat diffuser 124 (and associated DIMM 110) is further provided by a second gap 136 below the heat pipe 118, through which air can reach the second (downstream) fin array 132 (after extending along either side of DIMM 110). In some instances, similar spaces or gaps 135, 136 are provided between the first (upstream) fin array 130 and the heat diffuser 124 (and associated DIMM 110).

[0029] In some instances, the space between the fin arrays 130, 132 (and associated heat-conducting plates 126, 128) and the heat diffuser 124 (and associated DIMM 110) is additionally and / or alternatively provided to allow space for other components on the motherboard 101. As discussed further below, in some such instances, these other components (e.g., voltage regulator components) are thermally coupled to the fin arrays 130, 132, such that the fins facilitate heat dissipation from these other components. In some instances, the space or distance between the heat diffuser 124 (and associated DIMM 110) and the first (upstream) fin array 130 differs from the space or distance between the heat diffuser 124 (and associated DIMM 110) and the second (downstream) fin array 130.

[0030] In some instances, one or more clips 138 are attached to the heat pipe 118 at locations corresponding to the space between the DIMM 110 and the fin arrays 130, 132 (and the associated heat-conducting plate 126). In some instances, the clips 138 provide structural support to the heat pipe 118 along the space between the DIMM 110 and the ends 120, 122 of the heat pipe within the heat-conducting plates 126, 128. In some instances, the clips 138 comprise any suitable material that is more rigid than the heat pipe 118 (e.g., stainless steel, aluminum alloy, etc.). In some instances, the material used for the clips 138 is thermally conductive to facilitate heat transfer between the heat pipes 118. In some instances, one or more of the clips 138 are omitted (e.g., all of them).

[0031] In some instances, the heat sink assembly 116 includes a first mounting bracket 140 attached to the bottom side of the first fin array 130 (e.g., opposite to the first heat-conducting plate 126) and a second mounting bracket 142 attached to the bottom side of the second fin array 132 (e.g., opposite to the second heat-conducting plate 128). In some instances, the mounting brackets 140, 142 include one or more mounting holes 144 for attaching the heat sink assembly 116 (e.g., via corresponding threaded fasteners) to the motherboard 101. In some instances, the shape of the mounting brackets 140, 142 and / or the location of the mounting holes 144 may differ from those shown in the illustrated examples.

[0032] pass Figure 3 and Figure 4 The gap 135 between the heat pipe 118 adjacent to the second heat-conducting plate 128 is visible, and... Figure 7 and Figure 8 As shown more clearly in the image, the exemplary heat sink assembly 116 includes a third fin array 302. Figure 9 This is a more detailed bottom perspective view of the heat sink assembly 116, showing the third fin array 302. In this example, the third fin array 302 is an extension of a subset of the fins in the second fin array 132. That is, the fins in the third array 302 are continuous extensions of the corresponding fins in the second array 132. In some examples, all the fins in the second array 132 include extensions or protrusions corresponding to the fins in the third array 302. In some examples, the third fin array 302 has the same height as the second fin array 132, and the third fin array 302 extends from the second fin array 132. However, in other cases, as shown in the illustrated example, the third fin array 302 includes fins that are shorter than those in the second fin array 132. More specifically, as... Figure 8 As shown, the top edge 802 of the fins in the third fin array 302 is lower than the top edge 804 of the fins in the first fin array 132. Furthermore, the bottom edge 806 of the fins in the third fin array 302 is higher than the bottom edge 808 of the fins in the first fin array 132. In some embodiments, the bottom edge 806 of the fins in the third fin array 302 rests on (e.g., is attached to and / or supported by) the raised platform 810 of the second mounting bracket 142. In some embodiments, the raised platform 810 is positioned on the voltage regulator component 702 attached to the main board 101. Figure 7Above the top of the (shown in the diagram). More specifically, in some instances, the raised platform 810 is thermally coupled to the voltage regulator component 702 (e.g., directly and / or via a thermal interface material), such that heat generated by the voltage regulator component 702 can be transferred through the raised platform to the third array fins 302 for dissipation into the cooling air blowing across the server assembly 100. In some such instances, the size of a separate heatsink for the voltage regulator component 702 can be eliminated and / or reduced. In some instances, to facilitate alignment of the heatsink assembly 116 with the voltage regulator component 702, mounting holes 144 in the mounting brackets 140, 142 are positioned to align with mounting holes associated with the voltage regulator component 702.

[0033] In the illustrated example, as described above, the third fin array 302 is adjacent to (and is an extension of) the second fin array 132. In some examples, the third fin array 302 is adjacent to (and is an extension of) the first fin array 130. In some examples, both the first fin array 130 and the second fin array 132 include a correspondingly smaller fin array similar to the third fin array 302. Therefore, the third fin array 302 can be positioned upstream and / or downstream of the DIMM 110. In the illustrated example, the third fin array 302 is shown and described as being closer to the heat diffuser 124 than either the first fin array 130 or the second fin array 132. That is, in some examples, the third (smaller) fin array 302 is located between the second (larger) fin array 132 (and / or the first fin array 130) and the heat diffuser 124. In other instances, the third fin array 302 is further from the heat diffuser 124 than either the first fin array 130 or the second fin array 132. That is, in some instances, the second (larger) fin array 132 (and / or the first fin array 130) is located between the third (smaller) fin array 302 and the heat diffuser 124. In some instances, the third fin array 302 is omitted. In some such instances, the associated raised platform 810 is also omitted.

[0034] Figure 10 The image shows the device sandwiched between two DIMM 110s. Figure 1-9An exemplary heat pipe 118 and an associated exemplary heat diffuser 124 are shown in the exemplary heat sink assembly 116. In this example, DIMMs 110 are spaced apart by a pitch 1002 of about 0.26 inches (e.g., 0.26 + / - 0.005 inches) corresponding to about 6.6 mm, wherein the gap or distance 1004 between the DIMMs 110 corresponds to about 0.13 inches (e.g., 0.13 + / - 0.005 inches) of about 3.3 mm. As shown in the illustrated example, the heat diffuser 124 substantially fills the space between the DIMMs 110 with a first thickness 1006 (e.g., a main thickness) of about 0.12 inches (e.g., 0.12 + / - 0.005 inches) corresponding to about 3.1 mm. In this example, the heat diffuser 124 includes a second (narrower) thickness 1008 (e.g., a reduced thickness) to accommodate the heat pipe 118. In some instances, the second thickness 1008 corresponds to approximately 0.08 inches (e.g., 0.08 + / - 0.005 inches) of approximately 2.1 mm. In such instances, the thickness 1010 of the heat pipe 118 corresponds to approximately 0.04 inches (e.g., 0.04 + / - 0.005 inches) of approximately 1 mm. Therefore, in this instance, the thickness of the heat pipe 118 and the second thickness 1008 of the heat diffuser 124 together correspond to the first thickness 1006 of the heat diffuser 124. The dimensions outlined above leave a gap of approximately 0.004 inches (e.g., 0.004 + / - 0.002 inches) corresponding to approximately 0.1 mm on either side of the heat diffuser 124 to be filled by an exemplary thermal interface material 1012 (e.g., a thermal interface pad). The thermal interface material 1012 ensures reliable thermal coupling between the DIMM 110 and the heat diffuser 124 (and the associated heat pipe 118) to improve heat transfer efficiency. In some instances, thermal interface material 1012 is attached to DIMM 110. In some instances, thermal interface material 1012 is attached to thermal diffuser 124 (and heat pipe 118). In some instances, thermal interface material 1012 is omitted.

[0035] As described above and in Figure 10As shown in the examples, heat pipe 118 is relatively flat or narrow and has a width or height 1014 greater than the thickness 1010. In some examples, the height 1014 of heat pipe 118 is a multiple of the thickness 1010 (e.g., at least 2 times, at least 3 times, at least 4 times, at least 5 times, at least 6 times, at least 7 times, at least 8 times, etc.). In some examples, the height 1014 of heat pipe 118 is about 0.34 inches (e.g., 0.34 + / - 0.005 inches) corresponding to about 8.7 mm. However, heat pipe 118 may have any other suitable height 1014. Furthermore, in some examples, the width or height 1016 of heat diffuser 124 is greater than the height 1014 of heat pipe 118. In some examples, the height 1016 of heat diffuser 124 is a multiple of the height 1014 of heat pipe 118 (e.g., at least 2 times, at least 3 times, at least 4 times, etc.). In some examples, Figure 10 Any of the dimensions 1002, 1004, 1006, 1008, 1010, 1014, and 1016 shown may be greater than and / or smaller than the dimensions shown and / or described above.

[0036] Figure 11 It means manufacturing Figures 1-10 A flowchart illustrating an exemplary method for an exemplary heat sink assembly 116. In some instances, Figure 11 Some or all of the operations outlined in the exemplary methods are performed automatically by manufacturing equipment programmed to perform the operations. Although the references Figure 11 The flowcharts shown illustrate an exemplary manufacturing method; however, many other methods may be used alternatively. For example, the execution order of the boxes may be changed, and / or some of the described boxes may be combined, divided, rearranged, omitted, eliminated, and / or implemented in any other way. Furthermore, in some instances, additional processing operations may be performed before, between, and / or after any of the blocks represented in the illustrated examples.

[0037] Figure 11The exemplary method begins at block 1102, which relates to manufacturing heat pipe 118. At block 1104, the exemplary method relates to manufacturing heat diffuser 124. In some instances, heat diffuser 124 is manufactured with recessed regions having dimensions for receiving heat pipes in heat pipe 118. At block 1106, the exemplary method relates to attaching some heat pipes in heat pipe 118 to corresponding heat diffusers in heat diffuser 124. At block 1108, the exemplary method relates to attaching the ends of heat pipe 118 to heat-conducting plates 126, 128. At block 1110, the exemplary method relates to attaching clips to heat pipe 118. At block 1112, the exemplary method relates to attaching fin arrays 130, 132, 302 to heat-conducting plates 126, 128. At block 1114, the exemplary method relates to attaching mounting brackets to fin arrays 130, 132, 302. The exemplary manufacturing method then concludes.

[0038] "Comprising" and "including" (and all their forms and tenses) are used herein as open-ended terms. Therefore, whenever a claim uses any form of "comprising" or "including" (e.g., including, having, etc.) as a preamble or within the recounting of any type of claim, it should be understood that there may be additional elements, terms, etc., that do not fall outside the scope of the corresponding claim or recounting. As used herein, the phrase "at least" is open-ended when used as a transitional term, for example, in the preamble of a claim, in the same way that the terms "comprising" and "including" are open-ended. When used in the form of, for example, A, B, and / or C, the term "and / or" refers to any combination or subset of A, B, and C, such as (1) A alone, (2) B alone, (3) C alone, (4) A and B, (5) A and C, (6) B and C, or (7) A and B and C. As used herein in the context of describing structures, components, articles, objects, and / or things, the phrase "at least one of A and B" means an implementation that includes (1) at least one A, (2) at least one B, or (3) any one of at least one A and at least one B. Similarly, as used herein in the context of describing structures, components, articles, objects, and / or things, the phrase "at least one of A or B" means an implementation that includes (1) at least one A, (2) at least one B, or (3) any one of at least one A and at least one B. As used herein in the context of describing the implementation or execution of processes, instructions, actions, activities, etc., the phrase "at least one of A and B" means an implementation that includes (1) at least one A, (2) at least one B, or (3) any one of at least one A and at least one B. Similarly, as used herein in the context of describing the implementation or execution of processes, instructions, actions, activities, etc., the phrase “at least one of A or B” means an implementation that includes (1) at least one A, (2) at least one B, or (3) any one of at least one A and at least one B.

[0039] As used herein, references to the singular (e.g., “a,” “an,” “first,” “second,” etc.) do not exclude the plural. As used herein, the term “a” or “an” refers to one or more of those objects. The terms “a” (or “an”), “one or more,” and “at least one” are used interchangeably herein. Furthermore, although listed separately, multiple means, elements, or actions may be implemented by, for example, the same entity or object. Additionally, although individual features may be included in different instances or claims, these features may be combined, and inclusion in different instances or claims does not imply that the combination of features is impractical and / or advantageous.

[0040] As used herein, unless otherwise stated, the term "above" describes the relationship of two parts relative to the Earth (the ground). The first part is above the second part if the second part has at least one part located between the ground and the first part. Similarly, as used herein, the first part is "below" the second part when the first part is closer to the ground than the second part. As stated above, the first part can be above or below the second part, falling into one or more of the following categories: there are other parts between the first and second parts; there are no other parts between the first and second parts; the first and second parts are in contact with each other; or the first and second parts are not in direct contact with each other.

[0041] As used in this patent, a description of any component (e.g., layer, film, region, area, or plate) being on another component in any way (e.g., positioned on another component, located on another component, disposed on another component, or formed on another component, etc.) indicates that the mentioned component is in contact with the other component, or that the mentioned component is above the other component and one or more intermediate components are located between the mentioned component and the other component.

[0042] As used herein, unless otherwise stated, references to connection (e.g., attachment, coupling, joining, and engagement) may include intermediate components between the elements mentioned by the reference to connection and / or relative movement between those elements. Therefore, a reference to connection does not necessarily imply that two elements are directly connected and / or in a fixed relationship with each other. As used herein, stating that any component is in “contact” with another component is defined as meaning that there is no intermediate component between the two components.

[0043] Unless otherwise expressly stated, the use of descriptive terms such as “first,” “second,” and “third” herein does not in any way imply any meaning of priority, physical order, arrangement in a list, and / or sorting, but is merely used as labels and / or arbitrary names to distinguish elements for ease of understanding of the disclosed instances. In some instances, the descriptive term “first” may be used to refer to an element in a particular embodiment, while the same element may be referred to in the claims using different descriptive terms (e.g., “second” or “third”). In such cases, it should be understood that such descriptive terms are used only to explicitly identify those elements that may otherwise share the same name, for example, within the context of the discussion (e.g., within the claims).

[0044] As used herein, “approximately” and “about” modify their subject / numerical value to identify possible variations that may occur in real-world applications. For example, as those skilled in the art will understand, “approximately” and “about” may modify dimensions that may not be precise due to manufacturing tolerances and / or other real-world defects. For example, unless otherwise stated herein, “approximately” and “about” may indicate that such a dimension is within a tolerance of + / - 10%.

[0045] As used in this article, "substantially real-time" means occurring in a near-instantaneous manner, recognizing that there may be real-world delays in computation time, transmission, etc. Therefore, unless otherwise stated, "substantially real-time" means real-time plus 1 second.

[0046] As used herein, the phrase “communicate with” (including its variations) covers direct and / or indirect communication through one or more intermediate components, and does not require direct physical (e.g., wired) communication and / or continuous communication, but additionally includes selective communication at periodic intervals, scheduled intervals, non-periodic intervals and / or one-off events.

[0047] As used herein, “programmable circuit” is defined as including (i) one or more special-purpose circuits (e.g., special-purpose circuits (ASICs)) configured to perform specific operations and including one or more semiconductor-based logic devices (e.g., electrical hardware implemented by one or more transistors); and / or (ii) one or more general-purpose semiconductor-based circuits that can be programmed with instructions to perform specific functions and / or operations and include one or more semiconductor-based logic devices (e.g., electrical hardware implemented by one or more transistors). Examples of programmable circuits include programmable microprocessors, such as a central processing unit (CPU) capable of executing a first instruction to perform one or more operations and / or functions; a field-programmable gate array (FPGA) that can be programmed with a second instruction to configure and / or structure an FPGA to instantiate one or more operations and / or functions corresponding to the first instruction; a graphics processing unit (GPU) capable of executing a first instruction to perform one or more operations and / or functions; a digital signal processor (DSP) capable of executing a first instruction to perform one or more operations and / or functions; an XPU; a network processing unit (NPU) capable of executing a first instruction to perform one or more operations and / or functions; and one or more microcontrollers and / or integrated circuits (e.g., application-specific integrated circuits (ASICs)) capable of executing a first instruction to perform one or more operations and / or functions. For example, an XPU can be implemented by a heterogeneous computing system that includes multiple types of programmable circuits (e.g., one or more FPGAs, one or more CPUs, one or more GPUs, one or more NPUs, one or more DSPs, etc., and / or any combination thereof) and orchestration techniques (e.g., application programming interfaces (APIs)) that can assign computational tasks to any of the multiple types of programmable circuits suitable for and available for performing the computational tasks.

[0048] As used herein, an integrated circuit / circuit is defined as one or more semiconductor packages containing one or more circuit elements (e.g., transistors, capacitors, inductors, resistors, current paths, diodes, etc.). For example, an integrated circuit can be implemented as one or more of an ASIC, FPGA, chip, microchip, programmable circuit, semiconductor substrate coupled with multiple circuit elements, system-on-a-chip (SoC), etc.

[0049] Based on the foregoing, it can be understood that exemplary systems, apparatuses, articles of art, and methods for enhancing the cooling performance of DIMMs on a server motherboard have been disclosed. This cooling enhancement allows DIMMs to be placed more compactly together, occupying less space and thus allowing more space for larger processor chips. The disclosed exemplary heatsink assembly includes a heat diffuser and flat heat pipes located on either side of the DIMM, wherein the heat pipes extend beyond both ends of the DIMM between corresponding fin arrays aligned with the airflow direction of the cooling air. While the heatsink assembly can result in higher airflow resistance, the cooling efficiency is significantly improved compared to direct air cooling of the DIMM without such a heatsink assembly. Therefore, the disclosed systems, apparatuses, articles of art, and methods relate to one or more improvements to the operation of machines such as computers or other electronic devices and / or mechanical devices.

[0050] Other examples and combinations thereof include the following:

[0051] Example 1 includes a device comprising: a heat pipe extending between a first dual in-line memory module (DIMM) and a second DIMM, a first end of the heat pipe extending beyond a first end of the first DIMM and the second DIMM, a second end of the heat pipe extending beyond a second end of the first DIMM and the second DIMM; and a fin array thermally coupled to the first end of the heat pipe.

[0052] Example 2 includes any of the foregoing provisions as described in Example 1, wherein the fins extend in a plane substantially parallel to the first DIMM and the second DIMM.

[0053] Example 3 includes any of the foregoing provisions according to any one or more of Examples 1-2, wherein the heat pipe has a thickness, a height, and a length, the height being a multiple of the thickness and the length being a multiple of the height.

[0054] Example 4 includes any of the foregoing provisions according to any one or more of Examples 1-3, and also includes a heat diffuser extending between the first DIMM and the second DIMM, the heat diffuser having a first thickness determined to extend between the first DIMM and the heat pipe, the heat diffuser having a second thickness greater than the first thickness at a location spaced apart from the heat pipe, the second thickness extending between the first DIMM and the second DIMM.

[0055] Example 5 includes any of the foregoing provisions according to any one or more of Examples 1-4, and further includes: a first thermal interface material located between the thermal diffuser and the first DIMM, the first thermal interface material contacting both the thermal diffuser and the first DIMM; and a second thermal interface material located between the thermal diffuser and the second DIMM and between the heat pipe and the second DIMM, the second thermal interface material contacting each of the thermal diffuser, the heat pipe, and the second DIMM.

[0056] Example 6 includes any of the foregoing provisions according to any one or more of Examples 1-5, wherein the fin array is a first fin array and the device includes a second fin array thermally coupled to the second end of the heat pipe.

[0057] Example 7 includes any of the foregoing provisions according to any one or more of Examples 1-6, wherein the fin array is a first fin array, and the device includes a second fin array extending from the first fin array.

[0058] Example 8 includes any of the foregoing provisions according to any one or more of Examples 1-7, wherein some of the fins in the second fin array are continuous extensions of corresponding fins in the first fin array.

[0059] Example 9 includes any of the foregoing provisions as described in any one or more of Examples 1-8, wherein the second fin array is smaller than the first fin array.

[0060] Example 10 includes any of the foregoing provisions as described in any one or more of Examples 1-9, wherein the second fin array is closer to the first DIMM and the second DIMM than the first fin array.

[0061] Example 11 includes any of the foregoing provisions according to any one or more of Examples 1-10, and further includes a mounting bracket to which the first fin array is attached, the mounting bracket including a raised platform, and the second fin array being attached to the raised platform.

[0062] Example 12 includes any of the foregoing terms as described in any one or more of Examples 1-11, including: the first DIMM and the second DIMM; and a circuit board that supports DIMM slots into which the first DIMM and the second DIMM are inserted, the first DIMM and the second DIMM being spaced apart at a pitch less than an exemplary 0.29 inches.

[0063] Example 13 includes any of the foregoing provisions according to any one or more of Examples 1-12, and further includes a mounting bracket attached to the fin array having mounting holes aligned with corresponding holes in a circuit board for mounting voltage regulator components to the circuit board.

[0064] Example 14 includes any of the foregoing provisions according to any one or more of Examples 1-13, wherein the first DIMM and the second DIMM are included in an array of multiple DIMMs, and the heat pipe is a heat pipe in a heat pipe array, wherein different heat pipes in the heat pipe are located between each pair of DIMMs.

[0065] Example 15 includes any of the foregoing provisions according to any one or more of Examples 1-14, wherein the outermost DIMM of the array of the plurality of DIMMs is sandwiched between the respective heat pipes in the heat pipe array.

[0066] Example 16 includes a device comprising: a heat pipe; a first fin array thermally coupled to a first end of the heat pipe; and a second fin array thermally coupled to a second end of the heat pipe, the first and second fin arrays being mounted to a circuit board to be adjacent to opposite ends of a dual in-line memory module (DIMM) array inserted into a slot on the circuit board, the heat pipe extending between adjacent pairs of DIMMs.

[0067] Example 17 includes any of the foregoing provisions as described in Example 16, and further includes: a first heat-conducting plate that thermally couples the heat pipe to the first fin array; and a second heat-conducting plate that thermally couples the heat pipe to the second fin array.

[0068] Example 18 includes a device comprising: a motherboard having a set of dual in-line memory module (DIMM) slots; and a heatsink assembly attached to the motherboard, the heatsink assembly including: a heat pipe extending along either side of a DIMM inserted into the DIMM slot; and a heat diffuser extending along either side of a DIMM adjacent to the heat pipe, the heat pipe being longer than the heat diffuser.

[0069] Example 19 includes any of the foregoing provisions as described in Example 18, wherein the height of the heat diffuser is greater than the height of the heat pipe.

[0070] Example 20 includes any of the foregoing provisions as described in any one or more of Examples 18-19, and also includes clips for structurally connecting different heat pipes in the heat pipe at a location between the end of the heat pipe and the DIMM slot.

[0071] The appended claims are incorporated herein by reference in the Detailed Description section. While exemplary systems, devices, articles of manufacture, and methods have been disclosed herein, the scope of this patent is not limited thereto. Rather, this patent covers all systems, devices, articles of manufacture, and methods that reasonably fall within the scope of the claims of this patent.

Claims

1. An apparatus comprising: A heat pipe extends between a first dual in-line memory module (DIMM) and a second DIMM, with a first end of the heat pipe extending beyond the first end of the first DIMM and the first end of the second DIMM, and a second end of the heat pipe extending beyond the second end of the first DIMM and the second DIMM. as well as A fin array that is thermally coupled to the first end of the heat pipe.

2. The device of claim 1, wherein the fins extend in a plane substantially parallel to the first DIMM and the second DIMM.

3. The device according to claim 1, wherein the heat pipe has a thickness, a height, and a length, the height being a multiple of the thickness, and the length being a multiple of the height.

4. The device of claim 1 further includes a heat diffuser extending between the first DIMM and the second DIMM, the heat diffuser having a first thickness defined as extending between the first DIMM and the heat pipe, the heat diffuser having a second thickness greater than the first thickness at a location spaced apart from the heat pipe, the second thickness extending between the first DIMM and the second DIMM.

5. The device according to claim 4, further comprising: A first thermal interface material is located between the thermal diffuser and the first DIMM, and the first thermal interface material contacts both the thermal diffuser and the first DIMM. as well as A second thermal interface material is located between the thermal diffuser and the second DIMM and between the heat pipe and the second DIMM, and the second thermal interface material contacts each of the thermal diffuser, the heat pipe and the second DIMM.

6. The device according to any one of claims 1-5, wherein the fin array is a first fin array, and the device includes a second fin array thermally coupled to the second end of the heat pipe.

7. The device according to any one of claims 1-5, wherein the fin array is a first fin array, and the device includes a second fin array extending from the first fin array.

8. The device of claim 7, wherein some of the fins in the second fin array are continuous extensions of corresponding fins in the first fin array.

9. The device according to claim 7, wherein the second fin array is smaller than the first fin array.

10. The device of claim 7, wherein the second fin array is closer to the first DIMM and the second DIMM than the first fin array.

11. The device of claim 7, further comprising a mounting bracket, wherein the first fin array is attached to the mounting bracket, the mounting bracket including a raised platform, and the second fin array is attached to the raised platform.

12. The device according to any one of claims 1-5, comprising: The first DIMM and the second DIMM; as well as A circuit board that supports DIMM slots, in which the first DIMM and the second DIMM are inserted, the first DIMM and the second DIMM being spaced apart with a pitch of less than 0.29 inches.

13. The device according to any one of claims 1-5, further comprising a mounting bracket attached to the fin array, the mounting bracket having mounting holes aligned with corresponding holes in a circuit board for mounting voltage regulator components to the circuit board.

14. The device according to any one of claims 1-5, wherein the first DIMM and the second DIMM are included in an array of a plurality of DIMMs, and the heat pipe is a heat pipe in a heat pipe array, wherein different heat pipes in the heat pipe are located between each pair of DIMMs.

15. The device of claim 14, wherein the outermost DIMM of the array of the plurality of DIMMs is sandwiched between corresponding heat pipes in the heat pipe array.

16. An apparatus comprising: Heat pipe; A first fin array is thermally coupled to a first end of the heat pipe; as well as A second fin array thermally coupled to a second end of the heat pipe, the first fin array and the second fin array are mounted to a circuit board so as to be adjacent to the opposite ends of a dual in-line memory module (DIMM) array inserted into a slot on the circuit board, the heat pipe extending between adjacent pairs of DIMMs.

17. The apparatus of claim 16, further comprising: A first heat-conducting plate thermally couples the heat pipe to the first fin array; as well as The second heat-conducting plate thermally couples the heat pipe to the second fin array.

18. An apparatus comprising: The motherboard has a set of dual in-line memory module (DIMM) slots; as well as A heatsink assembly, attached to the motherboard, the heatsink assembly comprising: A heat pipe that extends along either side of the DIMM inserted into the DIMM slot; as well as A heat diffuser extends along either side of a DIMM adjacent to the heat pipe, the heat pipe being longer than the heat diffuser.

19. The device of claim 18, wherein the height of the heat diffuser is greater than the height of the heat pipe.

20. The device according to any one of claims 18 or 19, comprising a clip for structurally connecting different heat pipes in the heat pipe at a location between the end of the heat pipe and the DIMM slot.

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