Electronic device

Abstract

The present disclosure provides an electronic device, which is applied to the field of electronic device heat dissipation technology. The electronic device comprises: a heat sink arranged on the side of a processor away from a substrate, and a heat conduction layer is arranged between the heat sink and the processor; an ejection mechanism arranged on the heat sink, the ejection mechanism comprising a first state and a second state; wherein in the first state, the heat sink, the processor and the heat conduction layer are in close contact; in the second state, the ejection mechanism is used to apply a separation force in the direction away from the processor to the heat sink through a rotary motion, so that the heat sink and the processor are separated.

Description

Technical Field

[0001] This disclosure relates to the field of heat dissipation technology for electronic devices, and more particularly to an electronic device. Background Technology

[0002] Thermal paste is typically applied between the central processing unit (CPU) and the heat dissipation module of electronic devices to fill microscopic gaps and improve heat transfer efficiency. However, after prolonged operation in high-temperature environments, the thermal paste becomes significantly more viscous, making it difficult to separate the CPU and the heat dissipation module. Summary of the Invention

[0003] In view of this, the present disclosure provides an electronic device.

[0004] According to a first aspect of this disclosure, an electronic device is provided, comprising: a heat sink disposed on the side of a processor away from a substrate, wherein a thermally conductive layer is provided between the heat sink and the processor; and an ejection mechanism disposed on the heat sink, the ejection mechanism including a first state and a second state; wherein, in the first state, the heat sink, the processor, and the thermally conductive layer are in contact; and in the second state, the ejection mechanism is used to apply a separation force away from the processor to the heat sink by a rotational motion, thereby separating the heat sink from the processor.

[0005] According to an embodiment of this disclosure, the ejection mechanism includes: a rotating part rotatably connected to the heat sink; and an abutting part connected to the rotating part, wherein the rotating part and the abutting part are located on opposite sides of the rotation axis of the rotating part; wherein the rotating part includes a first end away from the abutting part and a second end close to the abutting part, and in a second state, the first end of the rotating part rotates in a direction away from the processor, causing the abutting part to rotate in a direction close to the processor, and the abutting part interacts with the processor to form a separation force of the heat sink away from the processor, thereby separating the heat sink from the processor.

[0006] According to embodiments of this disclosure, it further includes a limiting member, in a second state, the limiting member being used to limit the rotation angle of the rotating part in a direction away from the processor.

[0007] According to an embodiment of this disclosure, the limiting member includes: a blocking member disposed on a heat sink, the blocking member being located in the rotation path of the rotating part; in a second state, in response to the rotating part rotating to a preset angle, the blocking member abuts against the second end of the rotating part to limit the rotation angle of the first end of the rotating part in the direction away from the processor; and / or the second end of the rotating part has a slope, in the second state, in response to the rotating part rotating to a preset angle, the slope abuts against the heat sink to limit the rotation angle of the first end of the rotating part in the direction away from the processor; wherein, in the first state, the angle between the slope and the heat sink is a preset angle.

[0008] According to an embodiment of this disclosure, the ejection mechanism further includes: a rotating member for rotatably connecting the rotating part to the radiator; the rotating member includes: a first connecting part fixedly connected to the radiator through a first mounting hole in the radiator; a second connecting part connected to the end of the first connecting part away from the radiator, the second connecting part having a larger cross-sectional area in a direction perpendicular to the rotation axis than the first connecting part, the rotating part having a second mounting hole, the second connecting part passing through the second mounting hole, the rotating part being rotatably connected to the second connecting part, and the end face of the second connecting part near the radiator fitting against the radiator; a third connecting part connected to the end of the second connecting part away from the radiator, the third connecting part having a larger cross-sectional area in a direction perpendicular to the rotation axis than the second connecting part and the second mounting hole, the rotating part having a third mounting hole communicating with the second mounting hole, and the third connecting part being at least partially located within the third mounting hole; wherein the first connecting part, the second connecting part, and the third connecting part are coaxially arranged.

[0009] According to an embodiment of this disclosure, it further includes: a bracket disposed on the heat sink, a rotating part movably connected to the bracket, the bracket having a first mounting hole, a first connecting part fixedly connected to the bracket through the first mounting hole, a second connecting part close to the end face of the bracket fitting against the bracket, a first mating part disposed on the side of the rotating part close to the bracket, and a second mating part disposed on the side of the bracket close to the rotating part; wherein, in a first state, a limiting fit is formed between the first mating part and the second mating part, and in a second state, the first mating part and the second mating part are separated from each other.

[0010] According to an embodiment of this disclosure, the rotating part includes: two first connecting segments, which are rotatably connected to the radiator and are respectively located on opposite sides of the radiator and arranged in parallel; and a second connecting segment, which is located between the two first connecting segments and whose two ends are respectively connected to the ends of the first connecting segments away from the contact portion. The two first connecting segments and the second connecting segment enclose a rotating space, and at least part of the radiator is located within the rotating space.

[0011] According to an embodiment of this disclosure, the first connecting segment includes: a first connecting sub-segment rotatably connected to a heat sink, with one end of the first connecting sub-segment away from the second connecting segment connected to an abutment portion; and a second connecting sub-segment connected to one end of the first connecting sub-segment near the second connecting segment. In a second state, the second connecting sub-segment moves in a direction away from the processor, causing the end of the first connecting sub-segment near the second connecting segment to rotate in a direction away from the processor, and the end of the first connecting sub-segment away from the second connecting segment to rotate in a direction near the processor.

[0012] According to embodiments of this disclosure, the ejection mechanism further includes: a third mating part disposed on the rotating part, the radiator having a fourth mating part, wherein in a first state, the third mating part and the fourth mating part form a limiting fit to fix the relative position between the rotating part and the radiator; and / or a fifth mating part disposed on the abutting part, the radiator having a sixth mating part, wherein in a first state, the fifth mating part and the sixth mating part form a limiting fit to fix the relative position between the abutting part and the radiator.

[0013] According to an embodiment of the present disclosure, the heat sink has a first recess on the side facing the abutment portion, the first recess has a first opening on the side facing the processor, and the side of the abutment portion near the heat sink is located in the first recess; the side of the abutment portion facing the heat sink has an extension portion, the side of the first recess away from the abutment portion has a second recess, the extension portion is located in the second recess, and the side of the second recess facing the processor has a second opening.

[0014] It should be understood that the description in this section is not intended to identify key or essential features of the embodiments of this disclosure, nor is it intended to limit the scope of this disclosure. Other features of this disclosure will become readily apparent from the following description. Attached Figure Description

[0015] The above and other objects, features and advantages of this disclosure will become clearer from the following description of embodiments with reference to the accompanying drawings, in which:

[0016] Figure 1 This schematic diagram illustrates the structure of an electronic device according to an embodiment of the present disclosure, wherein the ejection mechanism is in a first state;

[0017] Figure 2 This schematic diagram illustrates the structure of an electronic device according to an embodiment of the present disclosure, wherein the ejection mechanism is in a second state;

[0018] Figure 3A This schematic diagram illustrates one of the structural schematics of an ejection mechanism according to an embodiment of the present disclosure;

[0019] Figure 3B A second schematic diagram of the ejection mechanism according to an embodiment of the present disclosure is shown.

[0020] Figure 4A A schematic diagram of the ejection mechanism according to another embodiment of the present disclosure is shown.

[0021] Figure 4B The diagram illustrates an assembly schematic of an ejection mechanism according to another embodiment of the present disclosure;

[0022] Figure 4CA schematic diagram illustrating the state of the ejection mechanism according to another embodiment of the present disclosure is shown.

[0023] Figure 4D An exploded view schematically illustrates an ejection mechanism according to another embodiment of the present disclosure;

[0024] Figure 5 A schematic diagram of the structure of the rotating member according to an embodiment of the present disclosure is shown.

[0025] Figure 6A This schematically illustrates one of the structural diagrams of an ejection mechanism according to yet another embodiment of the present disclosure;

[0026] Figure 6B The diagram illustrates a second structural schematic of an ejection mechanism according to yet another embodiment of the present disclosure.

[0027] [Explanation of Labels in the Attached Images]

[0028] 100. Electronic equipment; 110. Heat sink; 111. Fourth mating part; 112. Sixth mating part; 113. First recess; 114. Second recess; 115. First mounting hole; 120. Ejection mechanism; 121. Rotating part; 1211. First connecting section; 1211a. First connecting sub-section; 1211b. Second connecting sub-section; 1212. Second connecting section; 122. Abutment part; 1221. Extension part; 1222. Fifth mating part; 23. Second mounting hole; 124. Third mounting hole; 125. First mating part; 126. Third mating part; 130. Limiting member; 131. Blocking member; 132. Inclined surface; 140. Rotating member; 141. First connecting part; 142. Second connecting part; 143. Third connecting part; 150. Bracket; 151. First bracket; 152. Second bracket; 153. Second mating part; 160. Thermal conductive layer; 200. Substrate; 300. Processor. Detailed Implementation

[0029] The embodiments of the present disclosure will now be described with reference to the accompanying drawings. However, it should be understood that these descriptions are exemplary only and are not intended to limit the scope of the disclosure. In the following detailed description, numerous specific details are set forth to provide a thorough understanding of the embodiments of the present disclosure for ease of explanation. However, it will be apparent that one or more embodiments may be practiced without these specific details. Furthermore, descriptions of well-known structures and techniques are omitted in the following description to avoid unnecessarily obscuring the concepts of the present disclosure.

[0030] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit this disclosure. The terms “comprising,” “including,” etc., as used herein indicate the presence of features, steps, operations, and / or components, but do not exclude the presence or addition of one or more other features, steps, operations, or components.

[0031] All terms used herein (including technical and scientific terms) have the meanings commonly understood by those skilled in the art, unless otherwise defined. It should be noted that the terms used herein are to be interpreted in a manner consistent with the context of this specification, and not in an idealized or overly rigid way.

[0032] When using expressions such as "at least one of A, B and C", they should generally be interpreted in accordance with the meaning that is commonly understood by those skilled in the art (e.g., "a system having at least one of A, B and C" should include, but is not limited to, a system having A alone, a system having B alone, a system having C alone, a system having A and B, a system having A and C, a system having B and C, and / or a system having A, B and C, etc.).

[0033] This disclosure provides an electronic device. Before introducing the technical solutions provided by this disclosure, the relevant technologies involved in this disclosure will be described first.

[0034] Thermal paste is typically applied between the central processing unit (CPU) and the heat dissipation module of electronic devices to fill microscopic gaps and improve heat transfer efficiency. After prolonged operation in high-temperature environments, the silicone polymer within the thermal paste undergoes cross-linking and curing, resulting in significantly increased viscosity and the formation of a strong adhesive interface. Although the screws securing the CPU mount have O-ring springs that provide some pre-tightening force after loosening, the elastic ejection force of these springs is far less than the adhesive force generated by the cured thermal paste during actual disassembly, making it difficult to detach the heat dissipation module from the motherboard.

[0035] To address the aforementioned issues, repair personnel currently use specialized tools to pry the heatsink module from a specific location to remove it from the motherboard. However, this process requires removing other components around the heatsink module first, making the operation cumbersome. Therefore, finding a way to easily remove the heatsink module within the limited space of the motherboard is a pressing problem that needs to be solved.

[0036] The following will be through Figures 1-6B The electronic device according to embodiments of this disclosure will be described in detail.

[0037] Figure 1 This schematic diagram illustrates the structure of an electronic device according to an embodiment of the present disclosure, wherein the ejection mechanism is in a first state; Figure 2The schematic diagram illustrates the structure of an electronic device according to an embodiment of the present disclosure, wherein the ejection mechanism is in a second state.

[0038] The electronic device may be a device having a processor 300 and a heat sink 110, with a thermally conductive layer 160 between the processor 300 and the heat sink 110, and the processor 300 and the heat sink 110 are bonded together by the thermally conductive layer 160. For example, the electronic device may be a server, a laptop computer, etc.

[0039] like Figure 1 and 2 As shown, the electronic device 100 of this embodiment includes a heat sink 110 and an ejection mechanism 120.

[0040] A heat sink 110 is disposed on the side of the processor 300 away from the substrate 200, and a thermally conductive layer 160 is provided between the heat sink 110 and the processor 300. An ejection mechanism 120 is disposed on the heat sink 110 and includes a first state and a second state. In the first state, the heat sink 110, the processor 300 and the thermally conductive layer 160 are in contact. In the second state, the ejection mechanism 120 is used to apply a separation force away from the processor 300 to the heat sink 110 by rotational movement, so as to separate the heat sink 110 from the processor 300.

[0041] For example, substrate 200 may be a printed circuit board (PCB), i.e. a motherboard. Substrate 200 provides mechanical support and electrical connection for processor 300.

[0042] The processor 300 is mounted on the substrate 200. The heat sink 110 is located on the side of the processor 300 away from the substrate 200. The heat sink 110 includes a base and multiple heat dissipation fins fixed on the base. The base of the heat sink 110 is opposite to the top cover of the processor 300. The heat sink 110 is fixedly mounted on the substrate 200 by mounting screws or fasteners, so that it is pressed against the top cover of the processor 300.

[0043] To efficiently conduct heat generated by the processor 300 to the heat sink 110, a thermally conductive layer 160 is provided between the base of the heat sink 110 and the top cover of the processor 300. The thermally conductive layer 160 can be a liquid thermal paste with a high thermal conductivity (e.g., thermal grease). The thermally conductive layer 160 can fill the microscopic air gaps at the contact surface between the two, establishing a low thermal resistance heat conduction path. After the electronic device 100 has been in operation for a long time, the thermally conductive paste of the thermally conductive layer 160 will cross-link and solidify, forming a strong interfacial bond, causing the base of the heat sink 110 to be firmly bonded to the top cover of the processor 300 by the thermally conductive layer 160.

[0044] The first and second states can be two operating states of the ejection mechanism 120. (Refer to...) Figure 1The first state can be the assembly posture of the electronic device 100 in normal operation. In the first state, the ejection mechanism 120 does not participate in the force application to the heat sink 110, and the heat sink 110, processor 300, and thermal conductive layer 160 form a tightly fitted structure to ensure the heat dissipation efficiency of the electronic device 100 during normal operation. (Refer to...) Figure 2 The second state can be that the electronic device 100 is in a disassembly posture for maintenance. In the second state, the ejection mechanism 120 participates in the force application action on the heat sink 110. The ejection mechanism 120 converts the rotational motion into an axial (opposite to the direction of the processor 300) linear separation force. The separation force is greater than the adhesive force of the thermal conductive layer 160 on the heat sink 110 and the processor 300, thereby enabling the heat sink 110 to separate from the processor 300.

[0045] Understandably, by integrating an ejector mechanism 120 with two working states into the heat sink 110, the heat sink 110, the heat-conducting layer 160, and the processor 300 remain in close contact during normal operation of the equipment, ensuring that the heat conduction efficiency is not affected. When disassembly and maintenance are required, the operator only needs to rotate the ejector mechanism 120 to convert the rotational motion into a linear separation force away from the processor 300, thereby overcoming the adhesion force generated by the heat-conducting layer 160 after long-term use, achieving a smooth separation of the heat sink 110 and the processor 300, and improving the convenience and safety of equipment maintenance.

[0046] Figure 3A One of the structural schematic diagrams of an ejection mechanism according to an embodiment of the present disclosure is shown.

[0047] As described above, in some embodiments... Figure 3A As shown, the ejection mechanism 120 includes a rotating part 121 and an abutting part 122.

[0048] A rotating part 121 is rotatably connected to the heat sink 110; an abutting part 122 is connected to the rotating part 121. The rotating part 121 and the abutting part 122 are located on opposite sides of the rotation axis of the rotating part 121. The rotation axis of the rotating part 121 is the geometric axis around which the rotating part 121 rotates. The rotating part 121 includes a first end away from the abutting part 122 and a second end close to the abutting part 122. In the second state, the first end of the rotating part 121 rotates away from the processor 300, causing the abutting part 122 to rotate closer to the processor 300. The abutting part 122 interacts with the processor 300, forming a separation force on the heat sink 110 away from the processor 300, causing the heat sink 110 to separate from the processor 300.

[0049] For example, the rotating part 121 can be a rigid member made of metal. The rotating part 121 is hinged to the radiator 110, so that the rotating part 121 can rotate relative to the radiator 110 about the rotation axis. The first end and the second end of the rotating part 121 are located on opposite sides of the rotation axis, the first end can serve as a handle end for the operator to directly apply force; the second end is connected to the abutment part 122.

[0050] The abutment portion 122 can be a contact member connected to the second end of the rotating portion 121. The end face of the abutment portion 122 facing the processor 300 can cooperate with the top cover of the processor 300 to directly abut against the processor 300 and transmit force in the second state.

[0051] The rotating part 121 and the abutting part 122 are distributed on opposite sides with the rotation axis as the boundary. The rotating part 121, the rotation axis and the abutting part 122 together constitute a lever structure. The first end of the rotating part 121 is the force-applying end and the side where the abutting part 122 is located is the force-output end.

[0052] It should be noted that if the base of the heat sink 110 has a base plate, the heat sink 110 is fixedly connected to the top plate of the processor 300 through the base plate. In this case, a rotating through hole is provided at the corresponding position of the base plate and the abutment portion 122. At least part of the end of the abutment portion 122 near the processor 300 passes through the rotating through hole and abuts against the surface of the heat sink 110. During the rotation of the abutment portion 122 with the rotating part 121, the abutment portion 122 remains within the rotating through hole.

[0053] In the second state, the operator lifts the first end of the rotating part 121 away from the processor 300, and the rotating part 121 rotates around the rotation axis. Since the first end of the rotating part 121 and the abutment part 122 are distributed on opposite sides of the rotation axis, the rotation of the first end of the rotating part 121 away from the processor 300 causes the second end of the rotating part 121 and the abutment part 122 connected thereto to move towards the processor 300. The abutment part 122 abuts against the processor 300, and the processor 300 generates a reaction force on the abutment part 122 away from the processor 300. This reaction force is transmitted to the rotation axis through the rotating part 121, and the rotation axis applies a separation force to the heat sink 110 away from the processor 300. When this separation force exceeds the adhesive force of the thermal conductive layer 160 between the heat sink 110 and the processor 300, the heat sink 110 is pushed out, realizing separation from the processor 300.

[0054] Understandably, by designing the ejection mechanism 120 as a lever structure consisting of a rotating part 121 and a contact part 122, the separation between the processor 300 and the heat sink 110 can be completed by rotating the first end of the rotating part 121 during operation, without the need for external tools, thus balancing ease of operation and reliability of disassembly.

[0055] As described above, in some embodiments, the electronic device 100 may further include a limiting member 130, which, in a second state, limits the rotation angle of the rotating part 121 in a direction away from the processor 300.

[0056] For example, the limiting member 130 may be used to apply a restraining force to the rotation of the rotating part 121 during the operation of the ejection mechanism 120, so that the rotation angle of the rotating part 121 is limited to within a preset angle.

[0057] The preset angle can be 0 to 30 degrees. When the ejector mechanism 120 is in the first state, the preset angle is 0 degrees. When the ejector mechanism 120 is in the second state, the operator lifts the first end of the rotating part 121 away from the processor 300. The rotating part 121 rotates around the rotation axis, driving the abutment part 122 to move closer to the processor 300 and abut against the processor 300. The heat sink 110 is subjected to a separation force away from the processor 300. As the rotation angle of the rotating part 121 continues to increase, when the rotating part 121 rotates to 30 degrees, the rotating part 121 abuts against the limiting member 130, preventing the rotating part 121 from continuing to rotate. At this time, the separation force is maintained within the effective range for separating the heat sink 110 from the processor 300. Under the action of this separation force, the heat sink 110 is safely separated from the processor 300.

[0058] It should be noted that the present invention does not impose a specific limitation on the size of the preset angle, and the preset angle can be adjusted according to the actual application of the heat sink 110 and the processor 300.

[0059] Understandably, the limiting member 130 constrains the rotating part 121 when it rotates to a preset angle, limiting the rotation angle of the rotating part 121 away from the processor 300 to within the preset angle, so that the force of the contact part 122 on the processor 300 is always within a controllable range. This ensures that the separation force is sufficient to overcome the adhesive force of the heat-conducting layer 160 and smoothly separate the heat sink 110 from the processor 300, while also preventing the rotating part 121 from rotating excessively and causing the contact part 122 to exert an excessive force on the processor 300, which could damage the processor 300 or the ejection mechanism 120.

[0060] Figure 3B The diagram illustrates a second structural schematic of an ejection mechanism according to an embodiment of the present disclosure.

[0061] As described above, in one possible implementation, the limiting member 130 includes a blocking member 131.

[0062] The blocking member 131 is disposed on the heat sink 110 and is located in the rotation path of the rotating part 121. In the second state, in response to the rotating part 121 rotating to a preset angle, the blocking member 131 abuts against the second end of the rotating part 121 to limit the rotation angle of the first end of the rotating part 121 in the direction away from the processor 300.

[0063] In one example, such as Figure 3B As shown, the blocking member 131 can be a target portion of the radiator 110, which is located on the rotation path of the second end of the rotating part 121. For example, the radiator 110 has a first recess 113 on the side near the rotating part 121, and the second end of the rotating part 121 and the abutment portion 122 are located in the first recess 113. The blocking member 131 can be the inner wall of the first recess 113 near the first end of the rotating part 121. When the rotating part 121 rotates to a preset angle, the second end of the rotating part 121 abuts against the inner wall of the first recess 113 near the first end of the rotating part 121, thereby limiting the rotation angle of the rotating part 121.

[0064] In another example, the blocking member 131 can also be a protrusion fixedly disposed on the periphery of the heat sink 110, located on the rotation path of the rotating part 121. Specifically, the protrusion can be located on the rotation path of the second end of the rotating part 121, or it can be located on the rotation path of the first end of the rotating part 121. The position of the protrusion on the heat sink 110 corresponds to the position reached by the second end of the rotating part 121 when it rotates to a preset angle on its rotation path. For example, the rotating part 121 is rotatably disposed on the outer periphery of the heat sink 110, and a protrusion is provided on the side of the heat sink 110 near the second end of the rotating part 121. When the rotating part 121 rotates to the preset angle, the second end of the rotating part 121 abuts against the protrusion, thereby limiting the rotation angle of the rotating part 121.

[0065] Figure 4A A schematic diagram of the ejection mechanism according to another embodiment of the present disclosure is shown. Figure 4B The diagram illustrates an assembly schematic of an ejection mechanism according to another embodiment of the present disclosure; Figure 4C A schematic diagram illustrating the state of the ejection mechanism according to another embodiment of the present disclosure is shown. Figure 4D An exploded view of an ejection mechanism according to another embodiment of the present disclosure is shown schematically.

[0066] In another possible implementation, such as... Figure 4A , 4BAs shown in 4C and 4D, the limiting member 130 includes: a second end of the rotating part 121 having a slope 132, in a second state, in response to the rotating part 121 rotating to a preset angle, the slope 132 abuts against the heat sink 110 to limit the rotation angle of the first end of the rotating part 121 in a direction away from the processor 300; wherein, in the first state, the angle between the slope 132 and the heat sink 110 is a preset angle.

[0067] For example, the second end of the rotating part 121 has an inclined surface 132. In the first state, the inclined surface 132 is arranged obliquely upward from the rotation axis of the rotating part 121 toward the side away from the first end of the rotating part 121, and the angle formed between the inclined surface 132 and the plane where the heat sink 110 is located is equal to a preset angle.

[0068] Vertical plates are provided on opposite sides of the heat sink 110, and the arrangement direction of the vertical plates is perpendicular to the rotation axis of the rotating part 121. In the first state, the side of the first end of the rotating part 121 near the vertical plate is in contact with the side of the vertical plate away from the processor 300. In the second state, the first end of the rotating part 121 gradually moves away from the vertical plate, and the second end of the rotating part 121 gradually moves closer to the vertical plate. When the rotating part 121 rotates to a preset angle, the inclined surface 132 of the second end of the rotating part 121 abuts against the side of the vertical plate away from the processor 300, thereby limiting the rotation angle of the rotating part 121. This is to prevent the rotating part 121 from exerting excessive force on the processor 300 due to excessive rotation, which could damage the processor 300 or the ejection mechanism 120.

[0069] Figure 5 A schematic diagram of the structure of a rotating member according to an embodiment of the present disclosure is shown.

[0070] As described above, in some embodiments, the ejection mechanism 120 further includes a rotating member 140 for rotatably connecting the rotating part 121 to the heat sink 110.

[0071] The rotating component 140 includes: a first connecting portion 141, which is fixedly connected to the radiator 110 through a first mounting hole 115; a second connecting portion 142, which is connected to the end of the first connecting portion 141 away from the radiator 110, the cross-sectional area of ​​the second connecting portion 142 in the direction perpendicular to the rotation axis is larger than that of the first connecting portion 141; a rotating component 121 has a second mounting hole 123, the second connecting portion 142 passes through the second mounting hole 123, the rotating component 121 is rotatably connected to the second connecting portion 142, and the second connecting portion 142 is close to the radiator 110. The end face of 0 is in contact with the heat sink 110; the third connecting part 143 is connected to the end of the second connecting part 142 away from the heat sink 110, the cross-sectional area of ​​the third connecting part 143 in the direction perpendicular to the rotation axis is larger than that of the second connecting part 142 and the second mounting hole 123, the rotating part 121 has a third mounting hole 124, the third mounting hole 124 communicates with the second mounting hole 123, and the third connecting part 143 is at least partially located in the third mounting hole 124; wherein, the first connecting part 141, the second connecting part 142 and the third connecting part 143 are arranged coaxially.

[0072] For example, the first mounting hole 115 can be formed on the base of the radiator 110, the radial dimension of the first connecting part 141 matches the diameter of the first mounting hole 115, the first connecting part 141 can be fixed in the first mounting hole 115 by interference fit, or the first connecting part 141 can be assembled in the first mounting hole 115 by threaded connection, so that a stable fixed connection is formed between the rotating part 140 and the radiator 110, and the rotating part 140 cannot rotate or move axially relative to the radiator 110.

[0073] The second connecting portion 142 is connected to the end of the first connecting portion 141 away from the radiator 110. The cross-sectional area of ​​the second connecting portion 142 in the direction perpendicular to the rotation axis is larger than that of the first connecting portion 141. Since the radial dimension of the cross-section of the second connecting portion 142 is larger than that of the cross-section of the first connecting portion 141, the end face of the second connecting portion 142 near the radiator 110 can fit against the surface of the radiator 110, thus providing axial restraint to the rotating portion 121 in the direction close to the radiator 110 and preventing the rotating portion 121 from dislodging in the direction close to the radiator 110. The rotating portion 121 has a second mounting hole 123, through which the second connecting portion 142 passes. The rotating portion 121 and the second connecting portion 142 are rotatably connected, and the rotating portion 121 can rotate relative to the radiator 110 about the axis of rotation of the second connecting portion 142.

[0074] The third connecting portion 143 is connected to the end of the second connecting portion 142 away from the radiator 110. The cross-sectional area of ​​the third connecting portion 143 in the direction perpendicular to the rotation axis is larger than that of the second connecting portion 142 and the second mounting hole 123, that is, the radial dimension of the cross-section of the third connecting portion 143 is larger than the diameter of the second mounting hole 123. The rotating portion 121 also has a third mounting hole 124, which communicates with the second mounting hole 123. The third connecting portion 143 is at least partially located in the third mounting hole 124. The end face of the third connecting portion 143 near the second connecting portion 142 can axially limit the rotating portion 121 in the direction away from the radiator 110, preventing the rotating portion 121 from coming off in the direction away from the radiator 110.

[0075] In one example, such as Figure 5 As shown, the rotating member 140 can be a stepped pin. The cross-sections of the first connecting part 141, the second connecting part 142, and the third connecting part 143 are all circular, and their outer diameters increase sequentially, forming a stepped structure along the rotation axis. The second mounting hole 123 and the third mounting hole 124 on the rotating part 121 form a stepped hole. This stepped hole consists of a small hole section near the radiator 110 (i.e., the second mounting hole 123) and a large hole section away from the radiator 110 (i.e., the third mounting hole 124). The two hole sections are interconnected inside the rotating part 121. During assembly, the stepped pin passes through the stepped hole of the rotating part 121 from the side away from the radiator 110 along the direction close to the radiator 110, and the first connecting part 141 is threaded into the first mounting hole 115 of the radiator 110 base until the end face of the second connecting part 142 near the radiator 110 is tightly fitted with the surface of the radiator 110. At this time, the second mounting hole 123 of the rotating part 121 is sleeved on the outside of the second connecting part 142, and the second connecting part 142 acts as a rotating bearing to support the rotation of the rotating part 121. The third connecting part 143 is embedded in the third mounting hole 124 of the rotating part 121, and the end face of the third connecting part 143 near the second connecting part 142 abuts against the stepped surface of the stepped hole, forming an axial constraint on the rotating part 121 away from the radiator 110 direction, so that the rotating part 121 is held between the surface of the radiator 110 and the third connecting part 143, and can rotate freely around the axis of the second connecting part 142.

[0076] It is understandable that by setting the rotating part 140 as a stepped structure with three coaxial sections of the first connecting part 141, the second connecting part 142 and the third connecting part 143, the three connecting sections cooperate to enable the rotating part 121 to maintain a stable rotational connection with the radiator 110.

[0077] As described above, in some embodiments... Continue to refer to... Figure 4DThe heat dissipation module may further include: a bracket 150 disposed on the heat sink 110; a rotating part 121 movably connected to the bracket 150; the bracket 150 having a first mounting hole 115; a first connecting part 141 fixedly connected to the bracket 150 through the first mounting hole 115; a second connecting part 142 having its end face near the bracket 150 in contact with the bracket 150; a first mating part 125 disposed on the side of the rotating part 121 near the bracket 150; and a second mating part 153 disposed on the side of the bracket 150 near the rotating part 121. In a first state, the first mating part 125 and the second mating part 153 form a limiting fit; in a second state, the first mating part 125 and the second mating part 153 are separated from each other.

[0078] For example, the bracket 150 can be a metal stamping part. The bracket 150 is fixed to the base surface of the radiator 110 by screws, providing a structural carrier for the movable connection of the rotating part 121 and the fixed installation of the rotating part 140.

[0079] Unlike the previous embodiment where the rotating component 140 was directly mounted on the radiator 110, in this embodiment, the rotating component 140 is connected to the radiator 110 via a bracket 150. The bracket 150 has a first mounting hole 115, and a first connecting portion 141 is fixedly connected to the bracket 150 through the first mounting hole 115, thus fixing the rotating component 140 to the bracket 150. This indirectly fixes the rotating component 140 to the radiator 110. Correspondingly, the end face of the second connecting portion 142 near the bracket 150 is in contact with the surface of the bracket 150, forming a limiting constraint on the rotating portion 121 in the axial direction near the bracket 150, preventing the rotating portion 121 from dislodging towards the radiator 110.

[0080] The first mating part 125 can be a first groove provided on the surface of the rotating part 121 near the bracket 150, and the second mating part 153 can be a first protrusion provided on the surface of the bracket 150 near the rotating part 121. The first protrusion and the first groove are engaged and adapted. In the first state, the first protrusion is embedded in the first groove, and the relative positions of the rotating part 121 and the bracket 150 are kept fixed under the constraint of the engagement of the first protrusion and the first groove. In the second state, the operator rotates the first end of the rotating part 121 away from the processor 300. The rotating part 121 rotates around the rotation axis, the first protrusion disengages from the first groove, and the first mating part 125 and the second mating part 153 separate from each other. The rotating part 121 can continue to rotate relative to the bracket 150. At the same time, the second end of the rotating part 121 drives the abutting part 122 to move closer to the processor 300. An interaction force is formed between the abutting part 122 and the processor 300, so that the heat sink 110 obtains a separation force away from the processor 300, which overcomes the adhesive force of the heat-conducting layer 160, thereby achieving a smooth separation of the heat sink 110 from the processor 300.

[0081] Understandably, the rotating part 121 and the bracket 150 are kept in a fixed relative position under the constraint of the first mating part 125 and the second mating part, so as to prevent the ejection mechanism 120 from malfunctioning due to external vibration or accidental contact during normal operation of the electronic device 100, and to ensure that the contact state between the heat-conducting layer 160 and the heat sink 110 and the processor 300 is not disturbed.

[0082] As described above, in some embodiments, the rotating part 121 includes: two first connecting segments 1211, which are rotatably connected to the radiator 110, and are respectively located on opposite sides of the radiator 110 and arranged in parallel; and a second connecting segment 1212, located between the two first connecting segments 1211, with both ends of the second connecting segment 1212 connected to the ends of the first connecting segments 1211 away from the contact part 122, the two first connecting segments 1211 and the second connecting segment 1212 forming a rotating space, and at least part of the radiator 110 is located within the rotating space.

[0083] For example, the first connecting segment 1211 can be a long, rod-shaped structure. Two first connecting segments 1211 are symmetrically distributed on opposite sides of the base of the radiator 110 with reference to the central axis of the radiator 110. Each first connecting segment 1211 is rotatably connected to the radiator 110 or the bracket 150 disposed on the radiator 110 through the rotating member 140 of the above embodiment. The axis of rotation is perpendicular to the length extension direction of the first connecting segment 1211. The two first connecting segments 1211 are parallel to each other, ensuring that the rotating part 121 is subjected to symmetrical forces on both sides and rotates smoothly during rotation.

[0084] The second connecting segment 1212 is located between the two first connecting segments 1211. Both ends of the second connecting segment 1212 are connected to the ends of the two first connecting segments 1211 furthest from the contact portion 122, thus connecting the two first connecting segments 1211 together to form the structure of the rotating part 121. The two first connecting segments 1211 and the second connecting segment 1212 enclose a rotating space, within which at least a portion of the radiator 110 is located. The second connecting segment 1212 is always located on the outer periphery of the radiator 110.

[0085] In one example, continue to refer to Figure 3A Taking the example of each first connecting segment 1211 being rotatably connected to the heat sink 110 via a rotating member 140, the rotating part 121 can be integrally bent from metal wire, forming a U-shaped structure. The two first connecting segments 1211 constitute two parallel sides of the U-shaped structure, and the second connecting segment 1212 constitutes the top side of the U-shaped structure. The rotational space formed by the two segments is the internal region of the U-shaped structure, with the heat dissipation fins of the heat sink 110 located within this rotational space. The rotating part 121 is fitted onto the outside of the heat sink 110. The open end of the U-shaped structure faces the side of the heat sink 110 closest to the processor 300. The abutment parts 122 are respectively connected to the ends of the two first connecting segments 1211 near the open end. The rotation axis passes through the ends of the two first connecting segments 1211 near the abutment parts 122, forming a symmetrical lever structure.

[0086] In another example, continue to refer to Figure 4D Taking, for example, each first connecting segment 1211 is rotatably connected to a bracket 150 disposed on the radiator 110 via a rotating member 140. The bracket 150 includes a first bracket 151 and a second bracket 152. A first connecting segment 1211 is rotatably connected to the first bracket 151 via the rotating member 140, that is, the first connecting part 141 is fixedly connected to the first bracket 151. One end of a first connecting segment 1211 near the first bracket 151 is movably sleeved on the second connecting part 142. The third connecting part 143 is located on the side of a first connecting segment 1211 away from the first bracket 151. One side of a first connecting segment 1211 is in contact with the first bracket 151, and the other side is in contact with the third connecting part 143. Another first connecting segment 1211 is rotatably connected to the second bracket 152 via a rotating member 140, that is, the first connecting part 141 is fixedly connected to the second bracket 152. The end of the other first connecting segment 1211 near the second bracket 152 is movably sleeved on the second connecting part 142. The third connecting part 143 is located on the side of the other first connecting segment 1211 away from the second bracket 152. One side of the other first connecting segment 1211 is in contact with the second bracket 152, and the other side is in contact with the third connecting part 143.

[0087] It is understandable that by setting the rotating part 121 as a U-shaped integral structure formed by two first connecting sections 1211 and one second connecting section 1212, the ejection mechanism 120 has a compact structure and effectively saves installation space; at the same time, the operator can drive the entire rotating part 121 to rotate synchronously on both sides by applying force to the second connecting section 1212, making the operation simple.

[0088] Figure 6A This schematically illustrates one of the structural diagrams of an ejection mechanism according to yet another embodiment of the present disclosure; Figure 6B The diagram illustrates a second structural schematic of an ejection mechanism according to yet another embodiment of the present disclosure.

[0089] As described above, in some embodiments... Figure 6A and 6B As shown, the first connecting segment 1211 includes: a first connecting sub-segment 1211a, rotatably connected to the heat sink 110, with one end of the first connecting sub-segment 1211a away from the second connecting segment 1212 connected to the abutment portion 122; and a second connecting sub-segment 1211b, connected to the end of the first connecting segment 1211a near the second connecting segment 1212. In the second state, the second connecting sub-segment 1211b moves in a direction away from the processor 300, causing the end of the first connecting segment 1211a near the second connecting segment 1212 to rotate in a direction away from the processor 300, and the end of the first connecting segment 1211a away from the second connecting segment 1212 to rotate in a direction near the processor 300.

[0090] For example, the first connecting end may include a first connecting segment 1211a and a second connecting segment 1211b. The first connecting segment 1211a may be a strip-shaped plate extending in a direction parallel to the substrate 200. The first connecting segment 1211a is rotatably connected to the heat sink 110 via a rotating member 140. The second connecting segment 1211b may be a strip-shaped rod extending in a direction perpendicular to the substrate 200. The second connecting segment 1211b and the first connecting segment 1211a form a bend at the connection point, so that the two constitute a bent extension arm. One end of the second connecting segment 1211b away from the first connecting segment 1211a is fixedly connected to a second connecting segment 1212. The second connecting segment 1212 is located above the heat sink 110 and spans across the heat sink 110.

[0091] In the second state, the operator holds the second connecting segment 1212 and lifts it away from the processor 300. The second connecting sub-segment 1211b moves synchronously away from the processor 300 along with the second connecting segment 1212. Through its connection with the first connecting sub-segment 1211a, it pulls the end of the first connecting sub-segment 1211a away from the abutment 122 to rotate away from the processor 300. With the rotating connection point as the fulcrum, the end of the first connecting sub-segment 1211a near the abutment 122 rotates towards the processor 300, driving the abutment 122 to move towards the processor 300 and form abutment with the processor 300. The interaction force generated between the abutment 122 and the processor 300 forms a separation force on the heat sink 110 away from the processor 300. The separation force is greater than the adhesive force of the thermal conductive layer 160 between the heat sink 110 and the processor 300, thereby allowing the heat sink 110 to detach smoothly from the processor 300.

[0092] In other embodiments, the second connecting segment 1212 can be removed, and the second connecting sub-segment 1211b can be designed as a pull rope. For example, the pull rope can be a cable, and a pull ring can be provided at the end of the pull rope away from the first connecting sub-segment 1211a, so that the operator can pull the pull rope through the pull ring, thereby driving the rotating part to rotate.

[0093] Understandably, the second connecting segment 1211b bends and extends at the end of the first connecting segment 1211a and connects to the second connecting segment 1212, thereby further extending the effective lever arm between the operator's point of force application and the pivot point, thus generating a separation force sufficient to overcome the adhesive force of the thermal paste with a smaller operating force; at the same time, the structure requires less rotation space during operation, saving installation space.

[0094] As described above, in some embodiments... Continue to refer to... Figure 3A and Figure 3B The ejection mechanism 120 further includes: a third mating part 126 disposed on the rotating part 121, the radiator 110 having a fourth mating part 111, in a first state, the third mating part 126 and the fourth mating part 111 form a limiting fit to fix the relative position between the rotating part 121 and the radiator 110; and / or a fifth mating part 1222 disposed on the abutting part 122, the radiator 110 having a sixth mating part 112, in a first state, the fifth mating part 1222 and the sixth mating part 112 form a limiting fit to fix the relative position between the abutting part 122 and the radiator 110.

[0095] It should be noted that the third mating part 126 and the fourth mating part 111 can be provided separately, the fifth mating part 1222 and the sixth mating part 112 can be provided separately, or the third mating part 126 and the fourth mating part 111 and the fifth mating part 1222 and the sixth mating part 112 can be provided simultaneously. This embodiment does not impose specific limitations on these aspects and can be adjusted according to actual applications.

[0096] In one example, the following description is provided with both the third mating part 126 and the fourth mating part 111, and the fifth mating part 1222 and the sixth mating part 112. The third mating part 126 can be a second protrusion provided on the side of the first connecting section 1211 of the rotating part 121 facing the side wall of the heat sink 110, and the fourth mating part 111 can be a second groove formed on the side wall of the heat sink 110, with the second protrusion and the second groove engaging and fitting together. The fifth mating part 1222 can be a third protrusion provided on the side of the abutment part 122 facing the heat sink 110, and the sixth mating part 112 can be a third groove formed at a corresponding position on the surface of the heat sink 110 facing the processor 300, with the third protrusion and the third groove engaging and fitting together. Both the second and third protrusions can be made of elastic material with a certain elastic deformation capability, and can undergo elastic deformation and disengage or engage from the corresponding grooves when subjected to external force.

[0097] In the first state, the first connecting section 1211 of the rotating part 121 unfolds along the side wall of the heat sink 110 and is tightly attached to the side wall of the heat sink 110. The second protrusion and the third protrusion are respectively snapped into the second groove and the third groove of the side wall of the heat sink 110, and the rotating part 121 is constrained to the storage posture corresponding to the first state. Under the vibration generated when the electronic device 100 is working normally, the constraint force provided by the second protrusion and the second groove makes the rotating part 121 less prone to shaking and keeps its position fixed. At the same time, the constraint force provided by the third protrusion and the third groove constrains the abutment part 122 to the storage position corresponding to the first state, and it is not prone to shaking.

[0098] In the second state, the operator applies force to the second connecting section 1212 in a direction away from the processor 300. The rotating part 121 is driven by the rotational torque, and the second protrusion disengages from the second groove, and the rotating part 121 enters a rotational motion state. As the rotating part 121 continues to rotate, the abutting part 122 moves towards the processor 300 under the linkage drive of the first connecting section 1211, and the third protrusion disengages from the third groove. The abutting part 122 continues to move towards the processor 300 and forms abutment with the processor 300, forming a separation force on the heat sink 110 away from the processor 300. The separation force is greater than the adhesive force of the thermal conductive layer 160 between the heat sink 110 and the processor 300, causing the heat sink 110 to separate from the processor 300.

[0099] It is understandable that by setting the third and fourth mating parts 111, the fifth mating part 1222 and the sixth mating part 112, the ejection mechanism 120 is less likely to rotate or deviate when the electronic device 100 is subjected to vibration and impact, thus avoiding the risk of the ejection mechanism 120 colliding with surrounding electronic components when it is not in operation.

[0100] As described above, in some embodiments... Continue to refer to... Figure 2 and Figure 3B The heat sink 110 has a first recess 113 on the side facing the abutment portion 122, and the first recess 113 has a first opening on the side facing the processor 300. The side of the abutment portion 122 near the heat sink 110 is located in the first recess 113. The side of the abutment portion 122 facing the heat sink 110 has an extension portion 1221. The side of the first recess 113 away from the abutment portion 122 has a second recess 114. The extension portion 1221 is located in the second recess 114. The side of the second recess 114 facing the processor 300 has a second opening.

[0101] In one example, the base of the heat sink 110 has a first recess 113 on the side facing the rotating part 121. The second end of the rotating part 121 has a locking block on the side near the heat sink 110. In a first state, the locking block is located in the first recess 113, and the abutment part 122 is located in the first recess 113. The first recess 113 has a first opening on the side facing the processor 300, so that the abutment part 122 can move linearly in a direction perpendicular to the substrate 200 through the first opening.

[0102] The second recess 114 can be a groove further recessed into the bottom wall of the first recess 113 on the side away from the rotating part 121, and the cross-sectional dimension of the second recess 114 is smaller than that of the first recess 113. The abutment part 122 has an extension 1221 on the side near the heat sink 110, and in the first state, the extension 1221 is located in the second recess 114. The second recess 114 has a second opening on the side facing the processor 300, so that the extension 1221 can rotate towards the side closer to the processor through the second opening.

[0103] Understandably, the first sinker 113 and the second sinker 114 form a stepped nested sinker structure. The main body of the abutment portion 122 is constrained within the first sinker 113, and the extension portion 1221 is constrained within the second sinker 114. This provides stronger anti-tilting capability throughout the movement of the abutment portion 122, preventing the abutment portion 122 from deflecting when subjected to the driving force from the rotating portion 121. Simultaneously, the stepped nested sinker structure of the first sinker 113 and the second sinker 114 can limit the ejection mechanism, making it less prone to wobbling.

[0104] Those skilled in the art will understand that the features described in the various embodiments and / or claims of this disclosure can be combined or combined in various ways, even if such combinations or combinations are not explicitly described in this disclosure. In particular, the features described in the various embodiments and / or claims of this disclosure can be combined or combined in various ways without departing from the spirit and teachings of this disclosure. All such combinations and / or combinations fall within the scope of this disclosure.

[0105] The embodiments of this disclosure have been described above. However, these embodiments are for illustrative purposes only and are not intended to limit the scope of this disclosure. Although various embodiments have been described above, this does not mean that the measures in the various embodiments cannot be used advantageously in combination. The scope of this disclosure is defined by the appended claims and their equivalents. Various substitutions and modifications can be made by those skilled in the art without departing from the scope of this disclosure, and all such substitutions and modifications should fall within the scope of this disclosure.

Claims

1. An electronic device, comprising: A heat sink is disposed on the side of the processor away from the substrate, and a thermally conductive layer is provided between the heat sink and the processor; An ejection mechanism is disposed on the heat sink, and the ejection mechanism includes a first state and a second state; In the first state, the heat sink, the processor, and the thermally conductive layer are in contact. In the second state, the ejection mechanism is used to apply a separation force away from the processor to the heat sink through rotational motion, so as to separate the heat sink from the processor.

2. The electronic device according to claim 1, wherein the ejection mechanism comprises: The rotating part is rotatably connected to the radiator. The abutting part is connected to the rotating part, and the rotating part and the abutting part are located on opposite sides of the rotation axis of the rotating part; The rotating part includes a first end away from the abutting part and a second end close to the abutting part. In the second state, the first end of the rotating part rotates away from the processor, causing the abutting part to rotate closer to the processor. The abutting part and the processor interact to form a separation force of the heat sink away from the processor, causing the heat sink to separate from the processor.

3. The electronic device according to claim 2, further comprising: In the second state, the limiting member is used to limit the rotation angle of the rotating part in a direction away from the processor.

4. The electronic device according to claim 3, wherein the limiting member comprises: A blocking member is disposed on the heat sink. The blocking member is located in the rotation path of the rotating part. In the second state, in response to the rotating part rotating to a preset angle, the blocking member abuts against the second end of the rotating part to limit the rotation angle of the first end of the rotating part away from the processor. and / or The second end of the rotating part has an inclined surface. In the second state, in response to the rotating part rotating to a preset angle, the inclined surface abuts against the heat sink to limit the rotation angle of the first end of the rotating part in the direction away from the processor. In the first state, the angle between the inclined plane and the heat sink is the preset angle.

5. The electronic device according to claim 2, wherein the ejection mechanism further comprises: A rotating component is used to achieve a rotatable connection between the rotating part and the radiator; The rotating component includes: The first connecting part is fixedly connected to the radiator through the first mounting hole of the radiator; The second connecting part is connected to the end of the first connecting part away from the heat sink. The cross-sectional area of ​​the second connecting part in the direction perpendicular to the rotation axis is larger than that of the first connecting part. The rotating part has a second mounting hole. The second connecting part passes through the second mounting hole. The rotating part is rotatably connected to the second connecting part. The end face of the second connecting part near the heat sink is in contact with the heat sink. The third connecting part is connected to the end of the second connecting part away from the heat sink. The cross-sectional area of ​​the third connecting part in the direction perpendicular to the rotation axis is larger than that of the second connecting part and the second mounting hole. The rotating part has a third mounting hole that communicates with the second mounting hole. The third connecting part is at least partially located inside the third mounting hole. The first connecting part, the second connecting part, and the third connecting part are arranged coaxially.

6. The electronic device according to claim 5, further comprising: A bracket is disposed on the radiator. The rotating part is movably connected to the bracket. The bracket has a first mounting hole. The first connecting part is fixedly connected to the bracket through the first mounting hole. The end face of the second connecting part near the bracket is in contact with the bracket. A first mating part is provided on the side of the rotating part near the bracket. A second mating part is provided on the side of the bracket near the rotating part. In the first state, the first mating part and the second mating part form a limiting fit, and in the second state, the first mating part and the second mating part are separated from each other.

7. The electronic device according to any one of claims 2 to 6, wherein the rotating part comprises: Two first connecting sections are rotatably connected to the radiator, and the two first connecting sections are located on opposite sides of the radiator and arranged in parallel. The second connecting segment is located between the two first connecting segments. The two ends of the second connecting segment are respectively connected to the ends of the first connecting segments away from the abutment portion. The two first connecting segments and the second connecting segment enclose a rotation space, and at least part of the heat sink is located within the rotation space.

8. The electronic device according to claim 7, wherein the first connection segment comprises: The first connecting segment is rotatably connected to the radiator, and the end of the first connecting segment away from the second connecting segment is connected to the abutting part; The second connecting segment is connected to the end of the first connecting segment closest to the second connecting segment; In the second state, the second connection segment moves in a direction away from the processor, causing the end of the first connection segment closest to the second connection segment to rotate in a direction away from the processor, and the end of the first connection segment away from the second connection segment to rotate in a direction close to the processor.

9. The electronic device according to claim 6, wherein the ejection mechanism further comprises: A third mating part is disposed on the rotating part, and the heat sink has a fourth mating part. In the first state, the third mating part and the fourth mating part form a limiting fit to fix the relative position between the rotating part and the heat sink; and / or A fifth mating part is provided on the abutting part, and the radiator has a sixth mating part. In the first state, the fifth mating part and the sixth mating part form a limiting fit to fix the relative position between the abutting part and the radiator.

10. The electronic device according to claim 2, wherein the heat sink has a first recess on the side facing the abutment portion, the first recess has a first opening on the side facing the processor, and the side of the abutment portion near the heat sink is located in the first recess; The abutment portion has an extension on the side facing the heat sink, the first recess has a second recess on the side away from the abutment portion, the extension is located in the second recess, and the second recess has a second opening on the side facing the processor.

Images