A computer server multi-fan heat dissipation flow guide structure

Abstract

The application relates to the technical field of computer servers, and discloses a computer server multi-fan heat dissipation flow guide structure, which comprises a server body, a partition plate is arranged in the server body, a fan body is arranged on the front side of the server body, and an air outlet adjusting assembly is arranged on the rear side of the rectifying net. According to the application, the honeycomb-shaped rectifying net is arranged between the adjustable partition plate and the heat dissipation fan, the turbulent airflow generated by the variable diameter is combed into straight flow, the running noise of the fan is reduced, and the running efficiency of the impeller is improved. Meanwhile, the grid flow guide plate with the angle capable of being independently adjusted is matched, the pre-embedded low-melting-point paraffin phase change core body and the staggered micro-sawtooth rib are combined, the sudden increase in heat can be buffered during short-time peak heating, local temperature rush is avoided, the fan full rotation is prevented, parallel laminar flow can be cut into micro-scale turbulent flow, the heat exchange efficiency with the heating element is greatly improved, and the low-noise, high-efficiency and self-adaptive full-scene heat dissipation effect is realized.

Description

Technical Field

[0001] This invention relates to the field of computer server technology, specifically to a multi-fan heat dissipation and airflow guiding structure for computer servers. Background Technology

[0002] A computer server is a high-performance dedicated computer device that provides centralized computing, storage and service support for network environments. It is designed for multi-user concurrent access scenarios and is different from ordinary personal computers. Its core objectives are to ensure stable operation under high load for a long time, data security and multi-task parallel processing capabilities.

[0003] With the rapid development of high-density computing clusters, the hardware configuration of current computer servers is constantly being upgraded. The heat flux density of core heat-generating components such as CPUs, GPUs, and high-speed storage has exceeded the carrying capacity threshold of conventional heat dissipation systems. Traditional multi-fan cooling structures with fixed airflow have gradually exposed many pain points that make them difficult to adapt to high-load scenarios. They can only change the overall cooling airflow by adjusting the fan speed, and cannot dynamically adjust the air intake distribution ratio according to the real-time temperature of different areas inside the server. When the server is operating under low load, excessive air intake redundancy will bring unnecessary fan noise and power consumption waste. When there is a short-term peak computing load, the fixed air intake structure cannot quickly match the sudden high heat flux density, which can easily cause the temperature of local hot spots to rise instantly, triggering the fans to run at full speed or even hardware overheating and frequency reduction, seriously affecting the stability of server operation. Therefore, a multi-fan cooling airflow structure for computer servers is proposed to solve the above-mentioned problems. Summary of the Invention

[0004] (a) Technical problems to be solved

[0005] To address the shortcomings of existing technologies, this invention provides a multi-fan heat dissipation and airflow guiding structure for computer servers. This structure offers superior heat dissipation performance and solves the pain points of traditional fixed-airflow multi-fan heat dissipation structures, which are increasingly difficult to adapt to high-load scenarios. These structures can only change the overall airflow by adjusting the fan speed and cannot dynamically adjust the airflow distribution ratio according to the real-time temperature of different areas inside the server. When the server is operating under low load, excessive airflow redundancy can lead to unnecessary fan noise and power consumption waste. Furthermore, when there is a short-term peak computing load, the fixed airflow structure cannot quickly match the sudden high heat flux density, which can easily cause a sudden surge in the temperature of local hot spots, triggering forced full-speed fans or even hardware overheating and frequency throttling, seriously affecting the stability of server operation.

[0006] Technical solution

[0007] To achieve the above-mentioned good heat dissipation effect, the present invention provides the following technical solution: a multi-fan heat dissipation and airflow guiding structure for a computer server, including a server body, a partition plate installed inside the server body, a fan body arranged on the front side of the server body, a dustproof net arranged on the rear side of the server body, and an auxiliary mechanism arranged inside the server body.

[0008] The auxiliary heat dissipation mechanism includes a rectifier mesh, an air vent adjustment component, a baffle, a grille frame, a rotating shaft, a motor, a guide plate, a temperature sensor, a fan, and heat dissipation fins. The rectifier mesh is installed inside the server body, and the air vent adjustment component is installed behind the rectifier mesh. The baffle is installed inside the server body, and the grille frame is installed behind the baffle. A rotating shaft is installed inside the grille frame, and a motor is fixedly installed at one end of the rotating shaft. A guide plate is installed outside the rotating shaft, and a temperature sensor is installed outside the grille frame. Heat dissipation fins are fixedly installed on the outer wall of the server body.

[0009] Preferably, the rectifier mesh has a honeycomb pattern and is located between the fan body and the baffle.

[0010] Preferably, the four partitions divide the server body into five placement cavities, and the fan body consists of five groups. Each placement cavity is equipped with two baffles.

[0011] Preferably, the air vent adjustment assembly includes a dual-axis motor, lead screws, and sliding sleeves. The dual-axis motor is fixedly installed inside the partition plate. Lead screws are installed on both the left and right sides of the dual-axis motor. Sliding sleeves are sleeved on the outside of the two lead screws. The tops of the two sliding sleeves are respectively connected to the bottoms of the two baffles.

[0012] Preferably, the baffle has fold lines on its outer side, a rubber pad on its top, and the rotating shaft is rotatably connected to the inner wall of the grid frame on the side away from the motor.

[0013] Preferably, there are two sets of heat dissipation fins, and the two sets of heat dissipation fins are respectively connected to the left and right sides of the server body, and a cleaning mechanism is provided on the rear side of the server body.

[0014] Preferably, the cleaning mechanism includes an electric slide, a cleaning roller, a sludge collection box, and a drain pipe. Two electric slides are fixedly installed on the outside of the server body. The cleaning roller is slidably connected to the outside of the electric slide. A sludge collection box is provided on the outside of the server body. A drain pipe is installed on the outside of the sludge collection box. A solenoid valve is installed on the outside of the drain pipe.

[0015] Preferably, each guide plate has a low-melting-point paraffin phase change core embedded inside, and the surface of the guide plate is provided with micro-serrated ribs that are staggered with those of the adjacent guide plates.

[0016] Preferably, the misaligned micro-serrated ribs can cut the originally parallel laminar airflow into micro-scale turbulence, greatly improving the contact heat exchange efficiency between the airflow and the server's heating elements.

[0017] Beneficial effects

[0018] Compared with the prior art, the present invention provides a multi-fan heat dissipation and airflow guiding structure for computer servers, which has the following beneficial effects:

[0019] This multi-fan cooling airflow structure for computer servers utilizes a honeycomb-shaped rectifier mesh between adjustable baffles and cooling fans to streamline the turbulent airflow generated by variable diameter changes into a uniform direct current. This reduces fan noise and improves impeller efficiency. Simultaneously, it incorporates independently adjustable grille baffles, along with a pre-embedded low-melting-point paraffin phase-change core and staggered micro-serrated ribs. This design buffers sudden heat spikes during short-term peak heating, preventing localized temperature surges that could trigger full-speed fan operation. Furthermore, it breaks down parallel laminar flow into micro-scale turbulence, significantly enhancing heat exchange efficiency with heat-generating components. This results in low-noise, high-efficiency, and adaptive cooling performance across various scenarios. Attached Figure Description

[0020] Figure 1 This is a frontal three-dimensional schematic diagram of the present invention;

[0021] Figure 2 This is a rear-view three-dimensional schematic diagram of the present invention;

[0022] Figure 3 This is a front view schematic diagram of the rectifier grid of the present invention;

[0023] Figure 4 This is a cross-sectional view of the present invention;

[0024] Figure 5 For the present invention Figure 4 Enlarged view of point A in the middle;

[0025] Figure 6 This is a schematic diagram of the auxiliary heat dissipation mechanism of the present invention;

[0026] Figure 7 This is a schematic diagram of the cleaning mechanism of the present invention;

[0027] Figure 8 This is a schematic diagram of the micro-serrated rib of the present invention.

[0028] In the diagram: 1 Server body, 2 Partition plate, 3 Fan body, 4 Dustproof net, 5 Auxiliary heat dissipation mechanism, 501 Rectifier net, 502 Air outlet adjustment component, 5021 Dual-axis motor, 5022 Lead screw, 5023 Sliding sleeve, 503 Baffle, 504 Grille frame, 505 Rotary shaft, 506 Motor, 507 Guide plate, 5071 Miniature serrated rib, 508 Temperature sensor, 509 Fan, 510 Heat dissipation fins, 6 Cleaning mechanism, 601 Electric slide, 602 Cleaning roller, 603 Sludge collection box, 604 Drain pipe. Detailed Implementation

[0029] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0030] Please see Figure 1-8 A multi-fan heat dissipation and airflow guiding structure for a computer server includes a server body 1, a partition plate 2 installed inside the server body 1, a fan body 3 arranged on the front side of the server body 1, a dustproof net 4 arranged on the rear side of the server body 1, and an auxiliary mechanism 5 arranged inside the server body 1.

[0031] The auxiliary heat dissipation mechanism 5 includes a rectifier mesh 501, an air vent adjustment component 502, a baffle 503, a grille frame 504, a rotating shaft 505, a motor 506, a guide plate 507, a temperature sensor 508, a fan 509, and heat dissipation fins 510. The rectifier mesh 501 is installed inside the server body 1, and the air vent adjustment component 502 is installed on the rear side of the rectifier mesh 501. The baffle 503 is installed inside the server body 1, and the grille frame 504 is installed on the rear side of the baffle 503. The rotating shaft 505 is installed inside the grille frame 504, and the motor 506 is fixedly installed at one end of the rotating shaft 505. The guide plate 507 is installed on the outside of the rotating shaft 505, and the temperature sensor 509 is installed on the outside of the grille frame 504. Heat dissipation fins 510 are fixedly installed on the outer wall of the server body 1.

[0032] exist Figure 1 and Figure 2 In the middle, the rectifier mesh 501 has a honeycomb-shaped mesh and is located between the fan body 3 and the baffle 503.

[0033] Specifically, by setting up a rectifier mesh 501, this honeycomb rectifier mesh is arranged between the fan body 3 and the air outlet adjustment component 502. Its main function is to rectify, reduce noise, and improve efficiency. It will straighten the turbulence and deflection that may be generated after passing through the adjustable baffle into a stable and uniform straight airflow. By pre-sorting the airflow, it creates stable and uniform air intake conditions for the subsequent fan body 3 and air guiding system. This not only reduces the operating noise of the fan, but also significantly improves the operating efficiency and service life of the fan, and prevents uneven impeller force and vibration caused by uneven airflow.

[0034] exist Figure 1 and Figure 3 In the middle, four partition plates 2 divide the server body 1 into five placement cavities, and there are five sets of fan bodies 3. Each placement cavity is equipped with two baffles 503.

[0035] exist Figure 2 and Figure 4 In the middle, the air outlet adjustment component 502 includes a dual-axis motor 5021, a lead screw 5022 and a sliding sleeve 5023. The dual-axis motor 5021 is fixedly installed inside the partition plate 2. Lead screws 5022 are installed on both the left and right sides of the dual-axis motor 5021. Sliding sleeves 5023 are sleeved on the outside of the two lead screws 5022. The tops of the two sliding sleeves 5023 are respectively connected to the bottoms of the two baffles 503.

[0036] Specifically, by setting up an air vent adjustment component 502 and a baffle 503, the air vent adjustment component 502 is mainly composed of a dual-axis motor 5021, a lead screw 5022, and a sliding sleeve 5023, which drives the paired baffles 503 to move horizontally, realizing intelligent stepless adjustment of the air inlet area. This solves the pain points of traditional constant air volume solutions. The system can dynamically adjust the air intake volume according to the overall or zoned thermal load status of the server body 1. When the load is low, the opening is reduced to save energy and reduce noise; when the load is high, the opening is increased to provide sufficient cool air. This component, combined with the subsequent intelligent airflow guidance, forms a closed loop of dynamic air volume management with total volume control and fine distribution.

[0037] exist Figure 2 and Figure 3 In the middle, the baffle 503 has a folded line on its outside, and a rubber pad is provided on the top of the baffle 503. The side of the rotating shaft 505 away from the motor 506 is rotatably connected to the inner wall of the grid frame 504.

[0038] exist Figure 4 and Figure 5 In the middle, there are two sets of heat dissipation fins 510. The two sets of heat dissipation fins 510 are connected to the left and right sides of the server body 1 respectively. A cleaning mechanism 6 is provided on the rear side of the server body 1.

[0039] exist Figure 6In the process, the cleaning mechanism 6 includes an electric slide table 601, a cleaning roller 602, a sludge collection box 603, and a drain pipe 604. Two electric slide tables 601 are fixedly installed on the outside of the server body 1. The cleaning roller 602 is slidably connected to the outside of the electric slide table 601. A sludge collection box 603 is provided on the outside of the server body 1. A drain pipe 604 is installed on the outside of the sludge collection box 603. A solenoid valve is installed on the outside of the drain pipe 604.

[0040] Specifically, the electric slide 601 drives the cleaning roller 602 to slide and sweep along the surface of the heat sink 510, and the swept dust falls into the collection box 603 below. Maintenance personnel can open the solenoid valve of the drain pipe 604 at specific times to discharge the dust.

[0041] exist Figure 8 In this process, each guide plate 507 has a low-melting-point paraffin phase change core embedded inside, and the surface of the guide plate 507 is provided with micro-serrated ribs 5071 that are staggered with the adjacent guide plates 507.

[0042] Specifically, the low-melting-point paraffin phase change core embedded inside the serrated rib 5071 can absorb part of the heat conducted by the airflow. The micro serrated ribs 5071 on its surface, which are staggered with the adjacent guide plate 507, can disrupt the airflow boundary layer, smooth out peaks and fill valleys, and buffer the heat energy. When the server body 1 experiences a sudden peak power consumption that causes the airflow temperature to rise sharply, the phase change material quickly melts and absorbs a large amount of latent heat, temporarily storing excess heat and slowing down the temperature rise. This provides time for the active cooling system to react, preventing the fan from frequently starting and stopping or running at full speed to cope with short-term thermal shocks. The staggered micro serrated ribs 5071 cut the originally smooth laminar airflow into micro-scale turbulence, greatly enhancing the turbulent mixing of the airflow and the surface of the heat-generating element, significantly improving the heat exchange efficiency between the airflow and the solid surface, and allowing the cooling airflow to play its maximum role.

[0043] exist Figure 6 In this design, the misaligned micro-serrated ribs 5071 can cut the originally parallel laminar airflow into micro-scale turbulence, greatly improving the contact heat exchange efficiency between the airflow and the server's heat-generating components.

[0044] When in use, server 1 is powered on and started, fan 3 runs at low speed, dust filter 4 prevents external dust from entering, system control program is initialized, and all baffles 503 and guide plates 507 are in a preset low load or medium opening / angle initial position.

[0045] Temperature sensors 508 in each placement chamber continuously collect data. If the overall load of the server body 1 is low and the temperature data is normal, the baffle 503 of the air outlet adjustment component 502 will maintain a small opening to reduce unnecessary external air inflow, thereby achieving energy saving and noise reduction. If the overall load of the server body 1 increases, such as the CPU utilization rate exceeding 80%, the main control unit will drive the dual-axis motor 5021 to drive the lead screw 5022 to rotate according to the overall temperature signal, so that the sliding sleeve 5023 drags the baffle 503 to slide, increasing the air inlet area and increasing the total air intake.

[0046] The system analyzes data from sensors 508 in each area in real time. If the temperature of the second placement cavity of the server is significantly higher than that of other areas, the system will precisely control the rotation of the corresponding motor 506 of a specific guide plate 507 in the grid frame 504 of that area, adjust the angle of the guide plate 507 on the corresponding rotating shaft 505, and guide more cooling airflow to preferentially flow through the GPU card and its corresponding heat sink 510 in the second placement cavity to achieve hot spot cooling. At this time, the angle of the guide plate 507 in other cavities may also be finely adjusted to balance the airflow pressure of the entire air duct.

[0047] When a server encounters a sudden high-computing task, the CPU and GPU heat up rapidly. The temperature of the airflow passing through it will rise rapidly in a short period of time. The air deflector 507 with a phase change core starts to function. The core absorbs a large amount of heat and undergoes a phase change to melt, buffering the rise in airflow temperature and preventing thermal shock from directly affecting the hardware. The system may also adjust the air outlet adjustment and air deflector 507 in a coordinated manner to dynamically respond to load changes.

[0048] During any of the above adjustments, after passing through the baffle 503 and the fan 3, the airflow will flow through the rectifier mesh 501. The rectifier mesh 501 will smooth out the turbulent airflow caused by changes in opening or fan suction, protect the subsequent fan body 3, and ensure the stability of the airflow sent into the air guiding system.

[0049] Dust filter 4, when left external for extended periods, will attract dust. The control system automatically activates the cleaning mechanism 6 at preset intervals based on ambient dust levels or when the temperature sensor indicates a baseline drop in heat dissipation performance. The electric slide 601 drives the cleaning roller 602 to slide and sweep along the surface of the heat dissipation fins 510, and the swept dust falls into the collection box 603 below. Maintenance personnel can open the solenoid valve of the drain pipe 604 at specific times to discharge the dust.

[0050] As the server load decreases, all temperatures drop, the air vent adjustment component 502 reduces the opening of the baffle 503, and each air guide plate 507 gradually returns to its preset base angle.

[0051] In summary, this multi-fan cooling and airflow guiding structure for a computer server, by setting up an air vent adjustment component 502 and baffles 503, and by driving the paired baffles 503 to move, achieves intelligent stepless adjustment of the air inlet area, solving the pain points of traditional constant airflow solutions. The system can dynamically adjust the airflow according to the overall or zoned thermal load status of the server body 1. Under low load, the opening is reduced to save energy and reduce noise; under high load, the opening is increased to provide sufficient cool air. This component, combined with the subsequent intelligent airflow guiding, forms a closed loop of dynamic airflow management with total volume control and fine distribution.

[0052] The key to personalized and differentiated heat dissipation is achieved by setting up a grille frame 504, a motor 506, and adjustable air guides 507. Each air guide 507 in the placement chamber is driven by an independent rotating shaft 505 and a motor 506, allowing its angle to be adjusted individually and precisely. A temperature sensor 508 can monitor the temperature of different heat-generating components such as CPU, memory, and hard drive in each placement chamber. When a hot spot appears in a certain area, the main control system can adjust the angle of the corresponding air guide 507 to precisely guide more airflow to that area, enhancing local heat dissipation. This completely solves the problem that existing solutions cannot allocate airflow on demand. The phase change core inside the air guide 507 and the low-melting-point paraffin phase change core pre-embedded inside the serrated ribs 5071 are also included. The micro-serrated ribs 5071, which can absorb some of the heat conducted by the airflow, and are staggered with the adjacent guide plate 507, can disrupt the airflow boundary layer, smooth out peaks and fill valleys, and buffer the heat energy. When the server body 1 experiences a sudden peak power consumption that causes the airflow temperature to rise sharply, the phase change material quickly melts and absorbs a large amount of latent heat, temporarily storing excess heat and slowing down the rate of temperature rise. This provides time for the active cooling system to react, avoiding the fan from frequently starting and stopping or running at full speed to cope with short-term thermal shocks. The staggered micro-serrated ribs 5071 cut the originally smooth laminar airflow into micro-scale turbulence, greatly enhancing the turbulent mixing of the airflow and the surface of the heat-generating element, significantly improving the heat exchange efficiency between the airflow and the solid surface, and allowing the cooling airflow to play its maximum role.

[0053] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes the element.

[0054] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A multi-fan heat dissipation and airflow guiding structure for a computer server, comprising a server body (1), characterized in that: The server body (1) is equipped with a partition plate (2), a fan body (3) is provided on the front side of the server body (1), a dustproof net (4) is provided on the rear side of the server body (1), and an auxiliary mechanism (5) is provided inside the server body (1). The auxiliary heat dissipation mechanism (5) includes a rectifier mesh (501), an air vent adjustment assembly (502), a baffle (503), a grille frame (504), a rotating shaft (505), a motor (506), a guide plate (507), a temperature sensor (508), a fan (509), and heat dissipation fins (510). The rectifier mesh (501) is installed inside the server body (1), and the air vent adjustment assembly (502) is installed on the rear side of the rectifier mesh (501). The server body (1) is equipped with a baffle (503) inside, a grid frame (504) is provided on the rear side of the baffle (503), a rotating shaft (505) is installed inside the grid frame (504), a motor (506) is fixedly installed at one end of the rotating shaft (505), a guide plate (507) is installed on the outside of the rotating shaft (505), a temperature sensor (509) is installed on the outside of the grid frame (504), and heat dissipation fins (510) are fixedly installed on the outer wall of the server body (1).

2. The multi-fan heat dissipation and airflow guiding structure for a computer server according to claim 1, characterized in that: The rectifier mesh (501) has a honeycomb-shaped mesh and is located between the fan body (3) and the baffle (503).

3. The multi-fan heat dissipation and airflow guiding structure for a computer server according to claim 1, characterized in that: The four partitions (2) divide the server body (1) into five placement cavities. The fan body (3) consists of five groups, and each placement cavity is equipped with two baffles (503).

4. The multi-fan heat dissipation and airflow guiding structure for a computer server according to claim 1, characterized in that: The air vent adjustment assembly (502) includes a dual-axis motor (5021), a lead screw (5022), and a sliding sleeve (5023). The dual-axis motor (5021) is fixedly installed inside the partition plate (2). Lead screws (5022) are installed on both the left and right sides of the dual-axis motor (5021). Sliding sleeves (5023) are sleeved on the outside of the two lead screws (5022). The tops of the two sliding sleeves (5023) are respectively connected to the bottoms of the two baffles (503).

5. The multi-fan heat dissipation and airflow guiding structure for a computer server according to claim 1, characterized in that: The baffle (503) has a zigzag line on its exterior and a rubber pad on its top. The rotating shaft (505) is rotatably connected to the inner wall of the grid frame (504) on the side away from the motor (506).

6. The multi-fan heat dissipation and airflow guiding structure for a computer server according to claim 1, characterized in that: There are two sets of heat dissipation fins (510), and the two sets of heat dissipation fins (510) are respectively connected to the left and right sides of the server body (1). A cleaning mechanism (6) is provided on the rear side of the server body (1).

7. The multi-fan heat dissipation and airflow guiding structure for a computer server according to claim 1, characterized in that: The cleaning mechanism (6) includes an electric slide (601), a cleaning roller (602), a sludge collection box (603), and a drain pipe (604). Two electric slides (601) are fixedly installed on the outside of the server body (1). The cleaning roller (602) is slidably connected to the outside of the electric slide (601). A sludge collection box (603) is provided on the outside of the server body (1). A drain pipe (604) is installed on the outside of the sludge collection box (603). A solenoid valve is installed on the outside of the drain pipe (604).

8. The multi-fan heat dissipation and airflow guiding structure for a computer server according to claim 1, characterized in that: Each guide plate (507) has a low-melting-point paraffin phase change core embedded inside, and the surface of the guide plate (507) is provided with micro-serrated ribs (5071) that are staggered from those of the adjacent guide plates (507).

9. A multi-fan heat dissipation and airflow guiding structure for a computer server according to claim 8, characterized in that: The misaligned micro-serrated ribs (5071) can cut the originally parallel laminar airflow into micro-scale turbulence, greatly improving the contact heat exchange efficiency between the airflow and the server's heat-generating components.

Images