A liquid carbon dioxide based server cooling apparatus and method of use thereof

Abstract

The application relates to the technical field of cooling devices, in particular to a server cooling device based on liquid carbon dioxide and a use method thereof, which comprises a mainboard, a cooler arranged on the mainboard, a control box arranged on one side of the mainboard, a heat dissipation plate installed in the cooler, a plurality of retention plates rotatably installed on the heat dissipation plate, and a fin plate rotatably installed in each retention plate, a temperature difference adjusting assembly comprising a first detection rod and a second detection rod arranged on two symmetrical surfaces of the heat dissipation plate, balance plates arranged on the other two symmetrical surfaces of the heat dissipation plate, and adjusting pieces arranged in the balance plates. The first detection rod and the second detection rod are arranged on the two symmetrical surfaces of the heat dissipation plate respectively, the temperature difference signal is converted into the displacement of the piston disc, the retention plate and the fin plate are driven to rotate by a corresponding angle through a mechanical linkage structure, the self-adaptive adjustment of the cooling strength is realized, and the cooling effect is more accurate and efficient.

Description

Technical Field

[0001] This invention relates to the field of cooling device technology, specifically to a server cooling device based on liquid carbon dioxide and its usage method. Background Technology

[0002] With the rapid development of big data, cloud computing, and artificial intelligence technologies, the computing speed and integration of servers in data centers are constantly increasing, and the power consumption density of processor chips is continuously rising. Heat dissipation has become a key bottleneck restricting the stable operation and performance of servers. Traditional server heat dissipation methods are mainly divided into two categories: air cooling and liquid cooling. Air cooling relies on a cooling fan to drive airflow over heat sink fins to remove heat. It has a simple structure and low cost, but as processor power consumption increases, the heat exchange efficiency of air cooling is limited by the specific heat capacity and flow rate of air, and its heat dissipation capacity is nearing its limit. Under high load conditions, it is difficult to control the processor temperature within the ideal range. Liquid cooling uses water or other coolants as the heat exchange medium. Its thermal conductivity and specific heat capacity are much higher than air, and its heat dissipation efficiency is significantly better than air cooling. However, most existing liquid cooling systems use fixed-structure cold plates or water blocks, and the path and flow rate of the coolant over the processor surface are relatively fixed, making it impossible to dynamically adjust the heat dissipation capacity according to the actual heat generation of the processor.

[0003] More importantly, during server processor operation, heat generation is often uneven across different areas, with significant temperature differences between the chip core and edge regions, as well as between different computing units. However, existing cooling systems typically employ a uniform heat dissipation structure, with relatively fixed residence time and distribution of coolant on the processor surface. This prevents targeted cooling of localized high-temperature areas, resulting in poor overall processor temperature uniformity and prominent localized hotspots. Furthermore, existing cooling systems often lack real-time sensing capabilities for processor surface temperature distribution, failing to dynamically adjust the flow path and heat transfer intensity of the cooling medium based on temperature changes. This makes on-demand cooling difficult, wasting cooling resources and causing lag in processor temperature response under load fluctuations, impacting server operational stability and lifespan. Therefore, there is an urgent need for a server cooling device capable of real-time monitoring of processor surface temperature differences and adaptively adjusting cooling intensity based on these changes, addressing the technical problems of poor cooling performance and the inability to adjust cooling in real-time in existing technologies. Summary of the Invention

[0004] In view of the above-mentioned shortcomings of the existing technology, the present invention provides a server cooling device based on liquid carbon dioxide and its usage method, which can effectively solve the problems of poor cooling effect and inability to adjust in real time in the existing technology.

[0005] To achieve the above objectives, the present invention provides the following technical solution: This invention provides a server cooling device based on liquid carbon dioxide, including a motherboard, and further comprising: A cooling unit is mounted on the main board, and a control box is located on one side of the main board, with circulating airflow between the control box and the cooling unit. A heat sink is installed in the cooler, and the bottom surface of the heat sink is in full contact with the motherboard. Multiple retaining plates are rotatably installed on the heat sink, and each retaining plate is rotatably installed with a fin. The temperature difference adjustment component includes a first detection rod and a second detection rod disposed on two symmetrical surfaces of a heat sink. A balance plate is disposed on the other two symmetrical surfaces of the heat sink. The balance plate is provided with a detection element for detecting the temperature difference between the first detection rod and the second detection rod. An adjustment element is also disposed in the balance plate. The adjustment element adjusts the angle of the retention plate and the fin plate according to the temperature difference between the first detection rod and the second detection rod.

[0006] Furthermore, the cooler is provided with an external air guide frame. The top wall and one side wall of the air guide frame are provided with air inlet ports. The air guide frame is provided with an air inlet slot that communicates with the cooler, and both air inlet ports are connected to the air inlet slot. The top wall and another side wall of the air guide frame are provided with air outlet ports. The air guide frame is provided with an air outlet slot that communicates with the cooler, and both air outlet ports are connected to the air inlet slot.

[0007] Furthermore, the control box has two air inlet ports and two air outlet ports. An air inlet pipe is connected between adjacent air inlet ports and air inlet ports, and an air outlet pipe is connected between adjacent air outlet ports and air outlet ports.

[0008] Furthermore, the heat sink is provided with multiple storage slots, each of which is provided with multiple retention slots, and the retention plate is rotatably installed in the heat sink.

[0009] Furthermore, the detection component includes two first piston tubes disposed in the balance plate, each of the two first piston tubes having a piston disc slidably mounted therein, and each of the two piston discs having a telescopic rod mounted on a side close to each other, and the telescopic ends of the two telescopic rods movably penetrating through the inner wall of the first piston tube and being fixedly connected thereto. Each of the first detection rod and the second detection rod is provided with a detection airbag, and the two detection airbags are respectively connected to the two first piston tubes one-to-one.

[0010] Furthermore, the adjusting component includes a rack slidably mounted in the balance plate, a rotating shaft is fixedly mounted at the bottom end of the stabilizing plate and rotates through the outer wall of the balance plate, and a gear that meshes with the rack is fixedly mounted at the end of the rotating shaft.

[0011] Furthermore, the adjusting component also includes adjusting plates symmetrically fixedly installed on the top wall of the rack, and push plates are fixedly installed on the telescopic ends of the two telescopic rods, with the adjusting plate located between the two push plates, and the telescopic ends of the telescopic rods movably passing through the adjusting plate.

[0012] Furthermore, a driving airbag is fixedly installed on the rack, and a second piston tube is fixedly installed on the inner wall of the retention plate. The second piston tube is connected to the driving airbag. When the push plate squeezes the driving airbag, the second piston tube extends and pushes the fin plate to rotate.

[0013] Furthermore, the stagnation plate is provided with a guide plate, the fin is provided with a first vent hole, and the guide plate is provided with a second vent hole.

[0014] Furthermore, the control box is provided with a third piston tube, and a third piston rod is movably inserted into the third piston tube. A sliding rheostat is fixedly installed in the control box, and a slider is slidably installed on the sliding rheostat. The slider and the third piston rod are fixedly connected. A connecting pipe connects the third piston tube and the two first piston tubes.

[0015] Furthermore, the control box is externally connected to a first connecting pipe and a second connecting pipe. An air pump is externally connected to the first connecting pipe. The air pump's inlet is connected to an air storage tank. A cooler is installed in the air storage tank. The air storage tank and the second connecting pipe are connected. The air storage tank stores low-temperature carbon dioxide.

[0016] A method of using a cooling device, applied to the aforementioned server cooling device based on liquid carbon dioxide, includes the following steps: S1: Place the cooler on the processor side of the motherboard and secure it in place; S2: Delivers cold air to the cooler; S3: Real-time monitoring of the temperature difference between the two ends of the processor using a detection device; S4: Adjust the angle of the stagnation plate and fins according to the temperature difference to change the residence time of the airflow in the processor, while increasing the flow rate of the cold air and reducing the temperature of the cold air.

[0017] The technical solution provided by this invention has the following advantages compared with the known prior art: By setting a first detection rod and a second detection rod on two symmetrical surfaces of the heat sink, and setting a first piston tube connected to the detection airbag in the balance plate, the temperature difference in different areas of the processor can be sensed in real time. The temperature difference signal is converted into the displacement of the piston disc, and then the mechanical linkage structure drives the retention plate and fins to rotate at the corresponding angle, realizing the adaptive adjustment of the cooling intensity. This allows the cooling device to dynamically adjust the heat exchange strategy according to the actual temperature distribution on the processor surface, resulting in a more precise and efficient cooling effect.

[0018] By setting up multiple retaining plates and fins that are rotatably mounted in the heat sink, when the temperature difference between the two ends of the processor is small, the retaining plates and fins maintain their initial angle, and the cool air passes through at a normal flow rate. When the temperature difference increases, the regulating component first drives the retaining plates to rotate, causing the retaining plates to deflect towards the side with a higher temperature, prolonging the residence time of the cool air in that area and enhancing the heat exchange effect. If the temperature difference continues to increase, the push plate further squeezes the drive airbag, causing the second piston tube to extend and push the fins to rotate relative to the retaining plates. The contact area and guiding angle between the fins and the airflow are further changed, allowing more cool air to converge on the high-temperature area, achieving enhanced cooling of local hot spots. The heat dissipation capacity is improved in a stepwise manner, effectively improving the temperature uniformity of the processor surface.

[0019] By setting up a circulating airflow loop between the control box and the cooler, and using a storage tank to store low-temperature carbon dioxide, the low-temperature carbon dioxide is delivered to the cooler by an air pump to absorb the heat from the processor. The carbon dioxide gas carrying heat then flows back to the storage tank through the outlet pipe, is cooled again by the refrigerator, and is then recycled. This achieves a closed-loop recycling of the cooling medium, which avoids the waste caused by direct carbon dioxide emissions, ensures a continuous low-temperature supply of the cooling medium, and reduces operating costs.

[0020] By synchronously transmitting the temperature difference signal to the third piston tube in the control box, the third piston rod drives the slider to slide on the sliding rheostat as the temperature difference changes, thereby adjusting the output power of the air pump and the cooling intensity of the cooler in real time. When the temperature difference is large, the air flow rate is automatically increased and the air temperature is reduced; when the temperature difference is small, the air flow rate is reduced and the air temperature is increased. This achieves dynamic matching between the supply of cooling resources and the actual heat dissipation needs of the processor, avoiding excessive consumption of cooling resources and resulting in significant energy-saving effects. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the accompanying drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are merely some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without any creative effort.

[0022] Figure 1 This is an overall schematic diagram of the present invention; Figure 2 This is a schematic diagram of the air deflector section; Figure 3 This is a structural diagram of the heat sink section; Figure 4 This is a schematic diagram of the cross-sectional structure of the heat sink with the fins closed. Figure 5This is a cross-sectional view of the heat sink with the fins open. Figure 6 for Figure 5 Enlarged view of the structure of part A in the middle; Figure 7 for Figure 5 The front view; Figure 8 This is a schematic diagram of the internal structure of the balance plate; Figure 9 This is a schematic diagram of the second piston tube section; Figure 10 This is a diagram showing the changes in the working state of the heat sink.

[0023] The labels in the diagram represent: 1. Mainboard; 2. Cooler; 3. Air guide; 4. Air inlet; 5. Air outlet; 6. Control box; 7. Air inlet socket; 8. Air outlet socket; 9. Air inlet pipe; 10. Air outlet pipe; 11. First connecting pipe; 12. Second connecting pipe; 13. Air inlet slot; 14. Air outlet slot; 15. Heat sink; 16. Retention slot; 17. Retention plate; 18. Fin plate; 19. First vent; 20. Air guide. 21. Plate; 22. Second vent hole; 23. First detection rod; 24. Second detection rod; 25. Balance plate; 26. First piston tube; 27. Piston disc; 28. Telescopic rod; 29. ​​Return spring; 30. Push plate; 31. Gear; 32. Rack; 33. Adjusting plate; 34. Drive airbag; 35. Second piston tube; 36. Third piston tube; 37. Connecting pipe; 38. Sliding plate; 39. Sliding rheostat. Detailed Implementation

[0024] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative effort are within the scope of protection of the present invention.

[0025] The present invention will be further described below with reference to embodiments.

[0026] Example 1:

[0027] A server cooling device based on liquid carbon dioxide includes a motherboard 1 and a cooler 2 mounted on the motherboard 1. A control box 6 is located on one side of the motherboard 1, and there is a circulating airflow between the control box 6 and the cooler 2. A guide frame 3 is provided on the outside of the cooler 2. The top wall and one side wall of the guide frame 3 are each provided with an air inlet 4. An air inlet slot 13 communicating with the cooler 2 is provided in the guide frame 3, and both air inlets 4 are connected to the air inlet slot 13. An air outlet 5 is provided on the top wall and another side wall of the guide frame 3, and an air outlet slot 14 communicating with the cooler 2 is provided in the guide frame 3, and both air outlet slots 5 are connected to the air inlet slot 13. The control box 6 has two air inlet holes 7 and two air outlet holes 8. An air inlet pipe 9 connects adjacent air inlets 4 and air inlet holes 7. An exhaust pipe 10 is connected between the adjacent exhaust port 5 and exhaust socket 8. A third piston tube 35 is provided in the control box 6, and a third piston rod 36 is movably inserted in the third piston tube 35. A sliding rheostat 39 is fixedly installed in the control box 6. A slider 38 is slidably installed on the sliding rheostat 39, and the slider 38 and the third piston rod 36 are fixedly connected. A connecting pipe 37 is connected between the third piston tube 35 and the two first piston tubes 25. A first connecting pipe 11 and a second connecting pipe 12 are connected to the control box 6 respectively. An air pump is connected to the first connecting pipe 11. An air tank is connected to the air inlet of the air pump. A refrigerator is provided in the air tank. The air tank and the second connecting pipe 12 are connected. The air tank stores low-temperature carbon dioxide. The sliding rheostat 39 is used to control the output power of the air pump and the cooling intensity of the refrigerator.

[0028] like Figure 1 As shown, in use, the server cooling device based on liquid carbon dioxide of the present invention first places the cooler 2 on top of the processor on the motherboard 1, ensuring that the bottom surface of the heat sink 15 is in full contact with the surface of the processor to improve heat conduction efficiency. After the cooler 2 is placed in place, it is fixed by conventional fixing structures (such as clips or screws).

[0029] After installation, connect the first connecting pipe 11 on the control box 6 to the outlet of the external air pump. The inlet of the air pump is connected to the outlet of the gas storage tank via a pipe. The gas storage tank contains low-temperature carbon dioxide gas cooled by the refrigerator. The return port of the gas storage tank is connected to the second connecting pipe 12 on the control box 6 via a pipe, forming a closed loop. After starting the air pump, the low-temperature carbon dioxide gas in the gas storage tank is extracted, enters the control box 6 through the first connecting pipe 11, and then flows out from the two air inlet holes 7 on the control box 6, and is delivered to the two air inlet connection ports 4 on the guide frame 3 via two air inlet pipes 9. Figure 2As shown, after entering the guide frame 3, the low-temperature carbon dioxide gas is collected in the inlet slot 13 connected to the cooler 2, and then evenly fed into the cooler 2 through the inlet slot 13. It flows over the surface of the heat sink 15 and the retention plate 17 and fins 18 installed on it, exchanging heat with the processor heat absorbed by the heat sink 15. The carbon dioxide gas, after absorbing heat, increases in temperature and is collected in the outlet slot 14 of the cooler 2, flowing out from the two outlet ports 5 on the guide frame 3. It is then transported through two outlet pipes 10 to the two outlet sockets 8 on the control box 6, and then flows back to the storage tank through the internal channel of the control box 6 via the second connecting pipe 12. The cooler in the storage tank further cools the returned high-temperature carbon dioxide gas. The cooled carbon dioxide gas is then drawn out again by the air pump and sent back to the cooler 2, thus achieving the recycling of low-temperature carbon dioxide.

[0030] The control box 6 contains a third piston tube 35, which is connected to two first piston tubes 25 via a connecting pipe 37. Changes in gas pressure inside the two first piston tubes 25 are transmitted to the third piston tube 35 through the connecting pipe 37, causing the third piston rod 36 inside the third piston tube 35 to extend or retract according to the temperature difference. A slider 38 on a sliding rheostat 39 is fixedly connected to the end of the third piston rod 36. The slider 38 slides on the sliding rheostat 39 as the third piston rod 36 extends or retracts, thereby changing the resistance value of the sliding rheostat 39 connected to the circuit. The sliding rheostat 39 is electrically connected to the air pump and the cooler in the air tank. When the temperature difference increases, the slider 38 slides to reduce the connection resistance, which increases the output power of the air pump and the flow rate of the cold air. At the same time, the cooling intensity of the cooler increases, resulting in a lower temperature and a larger flow rate of carbon dioxide gas delivered to the cooling unit 2, thereby further improving the cooling effect. When the temperature difference decreases, the slider 38 slides in the opposite direction to increase the connection resistance, which reduces the power of the air pump and the cooler accordingly, achieving energy-saving operation.

[0031] Example 2:

[0032] like Figure 4 As shown - Figure 7 As shown, a heat sink 15 is installed in the cooler 2, and the bottom surface of the heat sink 15 is in full contact with the main board 1. Multiple retaining plates 17 are rotatably installed on the heat sink 15, and each retaining plate 17 has a fin 18 rotatably installed in it. Multiple storage slots are opened on the heat sink 15, and multiple retaining slots 16 are provided in each storage slot. The retaining plates 17 are rotatably installed in the heat sink 15, and a guide plate 20 is provided in the retaining plate 17. The fin 18 has a first vent hole 19, and the guide plate 20 has a second vent hole 21.

[0033] The temperature difference regulating component includes a first detection rod 22 and a second detection rod 23 disposed on two symmetrical surfaces of the heat sink 15. A balance plate 24 is disposed on the other two symmetrical surfaces of the heat sink 15. The balance plate 24 is provided with a detection element for detecting the temperature difference between the first detection rod 22 and the second detection rod 23. The detection element includes two first piston tubes 25 disposed in the balance plate 24. A piston disc 26 is slidably installed in each of the two first piston tubes 25. A telescopic rod 27 is installed on the side of the two piston discs 26 that is close to each other. The telescopic ends of the two telescopic rods 27 are movable through the inner wall of the first piston tube 25 and fixedly connected. A detection airbag is provided in each of the first detection rods 22 and the second detection rod 23. The two detection airbags are respectively connected to the two first piston tubes 25 one by one.

[0034] like Figure 8 As shown, the balance plate 24 is also equipped with an adjusting component. The adjusting component adjusts the angle of the retention plate 17 and the fin plate 18 according to the temperature difference between the first detection rod 22 and the second detection rod 23. The adjusting component includes a rack 31 slidably installed in the balance plate 24. A rotating shaft is fixedly installed at the bottom end of the retention plate 17 and rotates through the outer wall of the balance plate 24. A gear 30 that meshes with the rack 31 is fixedly installed at the end of the rotating shaft. The adjusting component also includes adjusting plates 32 symmetrically fixedly installed on the top wall of the rack 31. Push plates 29 are fixedly installed at the telescopic ends of the two telescopic rods 27, and the adjusting plate 32 is located between the two push plates 29. The telescopic ends of the telescopic rods 27 move through the adjusting plate 32. A driving airbag 33 is fixedly installed on the rack 31. A second piston tube 34 is fixedly installed on the inner wall of the retention plate 17. The second piston tube 34 is connected to the driving airbag 33. When the push plate 29 squeezes the driving airbag 33, the second piston tube 34 extends and pushes the fin plate 18 to rotate.

[0035] During server operation, different areas of the processor generate varying amounts of heat, resulting in uneven temperature distribution on the processor surface. The heatsink 15, attached to the processor surface, rapidly conducts heat from different areas of the processor, causing the temperature of the parts of the heatsink 15 corresponding to the high-temperature areas of the processor to rise, while the temperature of the parts corresponding to the low-temperature areas of the processor remains relatively low.

[0036] like Figure 3As shown, a first detection rod 22 located on one side of the heat sink 15 and a second detection rod 23 located on the opposite side of the heat sink 15 respectively contact two different areas of the heat sink 15. Both the first detection rod 22 and the second detection rod 23 have detection airbags inside. When the temperature of the area where the first detection rod 22 is located rises, the detection airbag inside expands due to heat, increasing its volume. This increases the gas volume and is then forced into the first piston tube 25 in the balance plate 24, which is connected to the corresponding detection airbag, through a connecting pipe. Similarly, when the temperature of the area where the second detection rod 23 is located changes, the detection airbag inside it expands or contracts accordingly, and the gas is forced into or extracted from the other first piston tube 25 in the balance plate 24, which is connected to the corresponding second detection rod 23, through a connecting pipe.

[0037] Taking the case where the temperature on one side of the processor is higher than on the other side as an example: Assuming the temperature in the area where the first detection rod 22 is located is higher, and the temperature in the area where the second detection rod 23 is located is lower, the detection bladder in the first detection rod 22 will expand more, forcing more gas into the first piston tube 25 connected to it through the pipeline. This increases the internal pressure of the first piston tube 25, pushing the piston disc 26 inside it towards the other first piston tube 25. Simultaneously, the detection bladder in the second detection rod 23 will expand less or even contract, resulting in a relatively lower internal pressure in the other first piston tube 25 connected to it. Figure 8 As shown, the pressure difference between the two piston discs 26 causes relative displacement between them. Telescopic rods 27 are installed on the adjacent sides of both piston discs 26. The telescopic ends of both telescopic rods 27 movably penetrate the inner wall of the corresponding first piston tube 25 and are fixedly connected to each other. Therefore, the displacement of the two piston discs 26 will cause the telescopic ends of the two telescopic rods 27 to perform corresponding telescopic movements. A return spring 28 is sleeved on the telescopic rod 27 to provide a restoring force after the temperature difference is eliminated.

[0038] During server operation, different areas of the processor generate varying amounts of heat, resulting in uneven temperature distribution on the processor surface. The heatsink 15, attached to the processor surface, rapidly conducts heat from different areas of the processor, causing the temperature of the parts of the heatsink 15 corresponding to the high-temperature areas of the processor to rise, while the temperature of the parts corresponding to the low-temperature areas of the processor remains relatively low.

[0039] like Figure 3As shown, a first detection rod 22 located on one side of the heat sink 15 and a second detection rod 23 located on the opposite side of the heat sink 15 respectively contact two different areas of the heat sink 15. Both the first detection rod 22 and the second detection rod 23 have detection airbags inside. When the temperature of the area where the first detection rod 22 is located rises, the detection airbag inside expands due to heat, increasing its volume. This increases the gas volume and is then forced into the first piston tube 25 in the balance plate 24, which is connected to the corresponding detection airbag, through a connecting pipe. Similarly, when the temperature of the area where the second detection rod 23 is located changes, the detection airbag inside it expands or contracts accordingly, and the gas is forced into or extracted from the other first piston tube 25 in the balance plate 24, which is connected to the corresponding second detection rod 23, through a connecting pipe.

[0040] Taking the case where the temperature on one side of the processor is higher than on the other side as an example: Assuming the temperature in the area where the first detection rod 22 is located is higher, and the temperature in the area where the second detection rod 23 is located is lower, the detection bladder in the first detection rod 22 will expand more, forcing more gas into the first piston tube 25 connected to it through the pipeline. This increases the internal pressure of the first piston tube 25, pushing the piston disc 26 inside it towards the other first piston tube 25. Simultaneously, the detection bladder in the second detection rod 23 will expand less or even contract, resulting in a relatively lower internal pressure in the other first piston tube 25 connected to it. Figure 8 As shown, the pressure difference between the two piston discs 26 causes relative displacement between them. Telescopic rods 27 are installed on the adjacent sides of both piston discs 26. The telescopic ends of both telescopic rods 27 movably penetrate the inner wall of the corresponding first piston tube 25 and are fixedly connected to each other. Therefore, the displacement of the two piston discs 26 will cause the telescopic ends of the two telescopic rods 27 to perform corresponding telescopic movements. A return spring 28 is sleeved on the telescopic rod 27 to provide a restoring force after the temperature difference is eliminated.

[0041] Push plates 29 are fixedly installed at the telescopic ends of both telescopic rods 27. The push plates 29 are displaced as the telescopic rods 27 extend and retract. When the temperature difference between the two ends of the processor is small, the displacement of the telescopic ends of the two telescopic rods 27 is small, and the push plates 29 only push the adjusting plate 32 to produce a small amount of movement. The adjusting plate 32 is fixedly installed on the top wall of the rack 31, so the rack 31 moves in the same direction as the adjusting plate 32. The rack 31 meshes with the gear 30 fixedly installed on the bottom shaft of the retaining plate 17. The movement of the rack 31 drives the gear 30 to rotate. The gear 30 drives the retaining plate 17 to rotate around the axis of the shaft, so that the retaining plate 17 tilts at a certain angle relative to the top surface of the heat sink 15. The tilt angle causes the retaining plate 17 to deflect towards the side with higher temperature, that is, towards the side where the first detection rod 22 is located. This causes the cold air entering from the air inlet slot 13 to be blocked and guided by the tilted surface of the retaining plate 17 when passing through it. The flow path of the cold air on the side with higher temperature is lengthened and the flow velocity is slowed, increasing the contact time between the cold air and the high-temperature area of ​​the heat sink 15, thus improving heat exchange efficiency. At this time, the fin 18 has not yet rotated and is in a closed state, such as... Figure 4 As shown, the relative positions between the first vent 19 and the second vent 21 allow airflow to pass through via a conventional path.

[0042] As the temperature difference between the two ends of the processor increases further, the displacement of the extension ends of the two telescopic rods 27 increases accordingly. The push plate 29 further pushes the adjusting plate 32 and the rack 31 to move. The rack 31 drives the retaining plate 17 to continue rotating through the gear 30, further increasing the tilt angle of the retaining plate 17 and extending the residence time of the cold air in the high-temperature area. At the same time, as the push plate 29 continues to move, it begins to compress the driving airbag 33 fixedly installed on the rack 31. After being compressed, the internal gas pressure of the driving airbag 33 increases, and the gas is transported through the connecting pipe to the second piston tube 34 fixedly installed on the inner wall of the retaining plate 17. The increased gas pressure inside the second piston tube 34 pushes the piston rod inside to extend. The end of the extended piston rod abuts against the fin 18, causing the fin 18 to rotate relative to the retaining plate 17. After the fin 18 rotates, its angle relative to the airflow direction changes. At this time, the fin 18 is in the open state, such as... Figure 5 and Figure 7 As shown, the fin plate 18 is provided with a first vent 19, and the retaining plate 17 is provided with a guide plate 20, which is provided with a second vent 21. Figure 6 As shown (for) Figure 5(Enlarged view of part A of the structure) When the fin 18 rotates to a specific angle, the relative position and overlapping area between the first vent 19 and the second vent 21 change. The flow resistance and flow direction of the airflow when passing through the fin 18 and the guide plate 20 also change, so that more cold air is guided to the area with higher temperature, which further enhances the heat exchange effect of the local high temperature area. Figure 10 The diagram shows the working state changes of the heat sink under different temperature differences. The left side is the initial state (fin 18 is closed), the middle part is the deflection state of the retaining plate 17, and the right side is the state in which the retaining plate 17 and the fin 18 deflect simultaneously.

[0043] Through the above-mentioned step-by-step adjustment process, when the temperature difference on the processor surface is small, basic temperature balance adjustment is achieved only by the small-angle deflection of the retaining plate 17; when the temperature difference continues to increase, the angle of the retaining plate 17 is further increased and the fin plate 18 is triggered to rotate, thereby enhancing heat dissipation. This allows the cooling capacity to be dynamically matched with the actual heat demand of the processor, and the temperature balance and cooling effect of the processor are significantly improved.

[0044] A method of using a cooling device, applied to a server cooling device based on liquid carbon dioxide according to any one of claims 1-11, characterized by comprising the following steps: S1: Place the cooler 2 on the processor of the motherboard 1 and secure it. S2: Deliver the cold air to the cooler 2; S3: Real-time monitoring of the temperature difference between the two ends of the processor using a detection device; S4: Adjust the angle of the stagnation plate 17 and the fin plate 18 according to the temperature difference to change the residence time of the airflow in the processor, while increasing the flow rate of the cold air and reducing the temperature of the cold air.

[0045] The above embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit it. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions will not cause the essence of the corresponding technical solutions to deviate from the protection scope of the technical solutions of the embodiments of the present invention.

Claims

1. A server cooling device based on liquid carbon dioxide, comprising a motherboard, characterized in that, Also includes: A cooling unit is mounted on the main board, and a control box is located on one side of the main board, with circulating airflow between the control box and the cooling unit. A heat sink is installed in the cooler, and the bottom surface of the heat sink is in full contact with the motherboard. Multiple retaining plates are rotatably installed on the heat sink, and each retaining plate is rotatably installed with a fin. The temperature difference adjustment component includes a first detection rod and a second detection rod disposed on two symmetrical surfaces of a heat sink. A balance plate is disposed on the other two symmetrical surfaces of the heat sink. The balance plate is provided with a detection element for detecting the temperature difference between the first detection rod and the second detection rod. An adjustment element is also disposed in the balance plate. The adjustment element adjusts the angle of the retention plate and the fin plate according to the temperature difference between the first detection rod and the second detection rod.

2. The server cooling device based on liquid carbon dioxide according to claim 1, characterized in that, The cooler is provided with an external air guide frame. The top wall and one side wall of the air guide frame are provided with air inlet ports. The air guide frame is provided with an air inlet slot that communicates with the cooler, and both air inlet ports are connected to the air inlet slot. The top wall and another side wall of the air guide frame are provided with air outlet ports. The air guide frame is provided with an air outlet slot that communicates with the cooler, and both air outlet ports are connected to the air inlet slot.

3. A server cooling device based on liquid carbon dioxide according to claim 2, characterized in that, The control box has two air inlet ports and two air outlet ports. An air inlet pipe is connected between the adjacent air inlet ports and air inlet ports, and an air outlet pipe is connected between the adjacent air outlet ports and air outlet ports.

4. A server cooling device based on liquid carbon dioxide according to claim 1, characterized in that, The heat sink has multiple storage slots, and each storage slot has multiple retention slots. The retention plate is rotatably installed in the heat sink.

5. A server cooling device based on liquid carbon dioxide according to claim 1, characterized in that, The detection component includes two first piston tubes disposed in a balance plate. A piston disc is slidably installed in each of the two first piston tubes. A telescopic rod is installed on the side of the two piston discs that are close to each other. The telescopic ends of the two telescopic rods movably penetrate the inner wall of the first piston tube and are fixedly connected. A detection airbag is provided in each of the first and second detection rods. The two detection airbags are respectively connected to the two first piston tubes one by one.

6. A server cooling device based on liquid carbon dioxide according to claim 5, characterized in that, The adjusting component includes a rack slidably mounted in the balance plate, a rotating shaft fixedly mounted at the bottom end of the stabilizing plate and rotating through the outer wall of the balance plate, and a gear meshing with the rack fixedly mounted at the end of the rotating shaft.

7. A server cooling device based on liquid carbon dioxide according to claim 6, characterized in that, The adjusting component also includes adjusting plates symmetrically fixedly installed on the top wall of the rack. Push plates are fixedly installed at the telescopic ends of the two telescopic rods, and the adjusting plate is located between the two push plates. The telescopic ends of the telescopic rods can move through the adjusting plate.

8. A server cooling device based on liquid carbon dioxide according to claim 7, characterized in that, A driving airbag is fixedly installed on the rack, and a second piston tube is fixedly installed on the inner wall of the retention plate. The second piston tube is connected to the driving airbag. When the push plate squeezes the driving airbag, the second piston tube extends and pushes the fin plate to rotate.

9. A server cooling device based on liquid carbon dioxide according to claim 1, characterized in that, The retention plate is provided with a flow guide plate, the fin is provided with a first vent hole, and the flow guide plate is provided with a second vent hole.

10. A server cooling device based on liquid carbon dioxide according to claim 1, characterized in that, The control box is equipped with a third piston tube, and a third piston rod is movably inserted into the third piston tube. A sliding rheostat is fixedly installed in the control box, and a slider is slidably installed on the sliding rheostat. The slider and the third piston rod are fixedly connected. A connecting pipe connects the third piston tube and the two first piston tubes.

11. A server cooling device based on liquid carbon dioxide according to claim 1, characterized in that, The control box is externally connected to a first connecting pipe and a second connecting pipe. An air pump is externally connected to the first connecting pipe. The air pump's inlet is connected to an air storage tank. A cooler is installed in the air storage tank. The air storage tank and the second connecting pipe are connected. The air storage tank stores low-temperature carbon dioxide.

12. A method of using a cooling device, applied to a server cooling device based on liquid carbon dioxide as described in any one of claims 1-11, characterized in that, Includes the following steps: S1: Place the cooler on the processor side of the motherboard and secure it in place; S2: Delivers cold air to the cooler; S3: Real-time monitoring of the temperature difference between the two ends of the processor using a detection device; S4: Adjust the angle of the stagnation plate and fins according to the temperature difference to change the residence time of the airflow in the processor, while increasing the flow rate of the cold air and reducing the temperature of the cold air.

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