An address coding method and address coding system for a display module

Abstract

The application relates to an address writing method and system of a display module, the address writing method comprising the following steps: receiving a writing instruction and reading a storage area burning mark bit in the writing instruction; receiving an external trigger signal, identifying and determining a light-emitting module needing to burn an address code in the display module according to the external trigger signal; and burning the address code according to the storage area burning mark bit and writing the address code into an address storage unit of the light-emitting module. According to the application, the storage area burning mark bit can be read through the writing instruction, the specific and accurate address code is burned according to the storage area burning mark bit, the light-emitting module needing to burn the address code in the display module is identified according to the external trigger signal, that is, the specific single light-emitting module needing to burn the address code can be accurately positioned, the address code is burned for the specific light-emitting module and written into the address storage unit of the light-emitting module, the accuracy of the writing is improved, and the physical gating of the specific single module can be realized.

Description

Technical Field

[0001] This application relates to the field of display module control technology, specifically to an address writing method and system for a display module. Background Technology

[0002] With the widespread application of transparent display technology in daily life, such as in smart building glass, commercial windows, and automotive displays, LED display films are highly favored due to their thinness and high transparency. To achieve complex dynamic display effects, independent addressing and control of the numerous light-emitting units on the display film are required. Therefore, efficient, accurate, and reliable address coding technology has become a crucial element in ensuring the normal operation of the display system.

[0003] In current display module driving solutions, address coding typically relies on electrical signal transmission. A common practice is to send the encoded instructions to the driver chip via data signal lines, where the address information is stored internally. However, relying entirely on electrical signals for triggering and transmission makes it susceptible to electromagnetic interference, reducing coding accuracy and making it difficult to physically select specific individual modules when modules are densely arranged.

[0004] Therefore, it is necessary to design a new address coding method and system for display modules to overcome the above problems. Summary of the Invention

[0005] This application provides a method and system for writing the address code of a display module, which can solve the technical problems of low writing accuracy and difficulty in achieving physical selection of a specific single module in related technologies.

[0006] In a first aspect, embodiments of this application provide a method for writing the address of a display module, comprising: Receive the write command and read the memory area programming flag bit in the write command; Receive external trigger signals, identify and determine the light-emitting modules in the display module that need to have their address codes burned based on the external trigger signals; The address code is burned into the address storage unit of the light-emitting module according to the burning mark bit in the storage area.

[0007] In conjunction with the first aspect, in one embodiment, the step of burning the address code according to the burning flag bit in the storage area and writing it into the address storage unit of the light-emitting module includes: The fuse at a specified location within the address storage unit of the light-emitting module is triggered by burning a marker bit into the storage area. Read the on / off state of the fuse inside the address storage unit, latch it as a fixed address code, and write it into the address storage unit.

[0008] In conjunction with the first aspect, in one embodiment, the step of burning the address code according to the burning flag bit in the storage area and writing it into the address storage unit of the light-emitting module includes: The high-voltage pulse generator inside the light-emitting module is activated, and a high-voltage pulse is output to blow the fuse at the specified position based on the marked bit burned in the storage area. Turn off the high-voltage pulse generator and restore the normal drive voltage; Read the on / off status of the internal fuse, latch it as a fixed address code, and write it to the address storage unit.

[0009] In conjunction with the first aspect, in one embodiment, the read address storage unit's internal fuse on / off state is latched as a fixed address code and written into the address storage unit, comprising: If the address storage unit already has a burning mark, then ignore the address code this time; if the address storage unit does not have a burning mark, then write the address code into the address storage unit and generate a permanent burning mark at the same time.

[0010] In conjunction with the first aspect, in one embodiment, the external trigger signal is a light signal, and before receiving the external trigger signal, the method further includes: In response to the address bit strobe command, the illumination unit controls the illumination of a single or an entire row of light-emitting modules in the display module that require the address code to be burned.

[0011] In conjunction with the first aspect, in one implementation, the write instruction includes a target address code, and the memory area burning flag is determined based on the target address code.

[0012] In conjunction with the first aspect, in one implementation, before receiving the write instruction, the method further includes: It receives the programming mode command and controls the switching unit of the light-emitting module to disconnect.

[0013] Secondly, embodiments of this application provide an address coding system for a display module, comprising: a host control module for issuing coding instructions; a display module including multiple light-emitting modules, wherein the light-emitting modules are configured to receive coding instructions and read the burning flag bits in the storage area of ​​the coding instructions; and to receive external trigger signals, identify and determine the light-emitting modules in the display module that need to have their address codes burned according to the external trigger signals; and to burn the address codes according to the burning flag bits in the storage area and write them into the address storage unit of the light-emitting modules.

[0014] In conjunction with the second aspect, in one embodiment, the upper-level control module is further used to issue address bit strobe instructions; the address coding system further includes a trigger module, which is signal-connected to the upper-level control module, and the trigger module is used to receive address bit strobe instructions and send trigger signals to the light-emitting modules in the display module that need to have address codes programmed.

[0015] In conjunction with the second aspect, in one embodiment, the light-emitting module is provided with a switching unit and a main control unit. The main control unit is used to control the switching unit to open before programming and to control the switching unit to close again after programming is completed.

[0016] In conjunction with the second aspect, in one embodiment, the display module has at least two rows of light-emitting modules arranged longitudinally, each row of light-emitting modules having a plurality of light-emitting modules arranged laterally; a DI line is provided on one side of each row of light-emitting modules, and each light-emitting module is connected to the DI line, the light-emitting modules in each row are connected in parallel to each other, and the DI lines of adjacent rows of light-emitting modules are disconnected from each other.

[0017] The beneficial effects of the technical solutions provided in this application include: The writing instruction can read the programming marker bits in the storage area. Based on the external trigger signal, the light-emitting modules in the display module that need to have their address codes programmed can be identified. In other words, a specific single light-emitting module that needs to have its address code programmed can be accurately located. For this specific light-emitting module, the specific programming operation to be performed in the light-emitting module is determined based on the programming marker bits in the storage area (e.g., determining which fuse to blow). Thus, a specific and accurate address code is programmed into the light-emitting module and written into the address storage unit of the light-emitting module. This improves the accuracy of writing and enables physical selection of a specific single module. It solves the technical problems of low writing accuracy and difficulty in achieving physical selection of a specific single module in related technologies. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 A flowchart illustrating an address writing method for a display module provided in an embodiment of this application; Figure 2 This is a schematic diagram of the write-code structure of the display module provided in the embodiments of this application; Figure 3 This is a schematic diagram of the structure of a display module provided in an embodiment of this application; Figure 4 This is a schematic diagram of the display layer structure provided in an embodiment of this application; Figure 5 A side view of the display layer provided in an embodiment of this application; Figure 6This is a schematic diagram of the structure of the dimming film layer provided in the embodiments of this application; Figure 7 This is a schematic diagram of the structure of the conductive line layer provided in an embodiment of this application; Figure 8 This is a schematic diagram of the wiring structure provided in an embodiment of this application; Figure 9 Line spacing diagram provided for embodiments of this application.

[0020] In the picture: 1. Dimming film layer; 11. Surface insulating protective layer; 12. First transparent conductive electrode layer; 13. Liquid crystal microdroplet layer; 14. Second transparent conductive electrode layer; 15. Bottom insulating protective layer; 2. Display layer; 21. Conductive circuit layer; 211. VDD circuit; 212. GND circuit; 213. DI circuit; 214. Chip mounting circuit; 2141. IC input signal pad; 2142. IC power pad; 2143. IC ground pad; 2144. IC control pad; 2145. LED chip pad; 22. Light-emitting module; 23. Encapsulating adhesive layer; 24. Covering film. Detailed Implementation

[0021] To enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present application, and not all embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present application.

[0022] This application provides an address coding method and system for a display module, which can solve the technical problems of low coding accuracy and difficulty in achieving physical selection of a specific single module in related technologies.

[0023] See Figure 1 As shown in the figure, this application embodiment provides a method for writing the address code of a display module, which includes the following steps: S100: Receives the write command and reads the memory area burning flag bit in the write command.

[0024] S200: Receives an external trigger signal, identifies and determines the light-emitting module 22 in the display module that needs to have its address code burned based on the external trigger signal.

[0025] S300: Burn the address code according to the burning flag bit in the storage area and write it into the address storage unit of the light-emitting module 22.

[0026] Preferably, in step S100 above, the write instruction is a control instruction issued by the upper control module. This instruction contains a target address code, and the memory area burning flag is determined based on the target address code. The memory area burning flag is the address bit to be burned in the write instruction (e.g., binary address bit "01"). This write instruction is used to trigger the address burning process and carries the specific address information to be written. In this embodiment, in the address code writing step, the upper control module will issue a control instruction (i.e., a write instruction), which contains the target address code. The IC chip in the light-emitting module 22 first reads the memory area burning flag from the target address code, and then determines the specific operation for subsequent burning based on the memory area burning flag (e.g., determining which fuse to blow), thereby burning a specific and accurate address code. Once burning is complete, an address code consistent with the target address code is obtained. If the target address code is "2", then the memory area burning flag is binary "01", and the burned address code represents the second light-emitting module 22.

[0027] It should be understood that in step S200 above, the external trigger signal is a specific signal used for physical selection, such as an illumination signal (UV light). This external trigger signal is generated by the trigger module (such as the illumination unit) in response to the "address bit selection instruction" issued by the upper control module, illuminating a single or an entire row of light-emitting modules in the display module that need to have their address codes programmed. After receiving the external trigger signal, the IC chip in the light-emitting module 22 automatically identifies and selects the light-emitting module 22 that needs to be programmed, thereby achieving precise positioning and physical selection of a specific single light-emitting module that needs to have its address codes programmed.

[0028] In step S300 above, the address code is precisely programmed into the address storage unit in the light-emitting module 22 selected in step S200 according to the instruction of the programming mark bit in the storage area, so that the address code is written into the address storage unit. The address storage unit is a specific storage area set inside the IC chip of the light-emitting module, used to permanently or semi-permanently store the unique identifier (i.e., address code) of the module.

[0029] See Figure 2 As shown, a display module is provided, which illustrates a configuration of two rows of light-emitting modules 22 (i.e., two strings; in other embodiments, three or more strings may be used, one string per row). Each row of light-emitting modules 22 has a VDD and a DI line on one side and a GND line on the other side. The VDD lines of the upper and lower rows of light-emitting modules 22 are interconnected, as are their GND lines. The DI lines of the upper and lower rows of light-emitting modules 22 are disconnected. Each row of light-emitting modules 22 is connected to its corresponding VDD, DI, and GND lines, and the rows of light-emitting modules 22 are connected in parallel.

[0030] It should be understood that each light-emitting module 22 contains an IC chip and multiple light-emitting chips, such as RGB chips. In this embodiment, the address code is programmed into the address storage unit within the IC chip.

[0031] Each of the above-mentioned light-emitting modules 22 is equipped with a switch unit. In the initial state, each switch unit is in the closed state by default. All light-emitting modules 22 are interconnected with the bus. Each light-emitting module 22's IC chip is equipped with an address storage unit. The address storage unit is initially empty and has no programmed marks.

[0032] This embodiment reads the programming mark bit in the storage area through the writing instruction, and identifies the light-emitting module 22 in the display module that needs to be programmed with the address code according to the external trigger signal. That is, it can accurately locate a specific light-emitting module 22 that needs to be programmed with the address code. For this specific light-emitting module 22, the specific programming operation to be performed in the light-emitting module 22 is determined according to the programming mark bit in the storage area (for example, determining which fuse to blow). Thus, a specific and accurate address code that is consistent with the target address code is programmed in the light-emitting module 22 and written into the address storage unit of the light-emitting module 22. This improves the accuracy of writing and enables physical selection of a specific single module. It solves the technical problems of low writing accuracy and difficulty in achieving physical selection of a specific single module in related technologies.

[0033] Furthermore, in some embodiments, before receiving the write instruction, the process may further include: Step S10: Receive the programming mode command and control the switching unit of the light-emitting module 22 to turn off.

[0034] In this embodiment, after entering the programming mode, the upper control module will issue a programming mode command, which will be received by the IC chip of each light-emitting module 22. After receiving the command, the main control unit in the IC chip controls the switching unit of each light-emitting module 22 to disconnect, cutting off the bus link between this level and the subsequent level module, thereby realizing single-module isolated addressing.

[0035] Furthermore, in some embodiments, the step of programming the address code according to the programming flag bit in the storage area and writing it into the address storage unit of the light-emitting module may include: Step 1: Burn the fuse at a specified position in the address storage unit of the light-emitting module based on the marked bit in the storage area.

[0036] Step 2: Read the on / off state of the fuse inside the address storage unit, latch it as a fixed address code, and write it into the address storage unit.

[0037] It should be understood that in step 1 above, when the fuse is blown, the blowing operation is performed according to the programming address bit (i.e., the memory area programming mark bit) to be executed by the writing instruction, and the corresponding position of the resistor wire is blown according to binary. Define "1" in binary = blown, "0" = not blown. If the memory area programming mark bit is "01" in binary, then the first fuse will not blow, only the second fuse will blow. In this way, the fuse at the specified position is precisely blown. After the fuse is blown, the internal register of the light-emitting module 22 reads the on / off state of the fuse and latches it as a fixed address code to write to the address storage unit.

[0038] Furthermore, in one embodiment, the step of burning the address code according to the burning flag bit in the storage area and writing it into the address storage unit of the light-emitting module 22 may include: S301: Activate the high-voltage pulse generator inside the light-emitting module 22, outputting a high-voltage pulse to blow the fuse at the specified position based on the memory area programming mark bit. It should be understood that in this step, when blowing the fuse, the blowing operation is performed according to the programming address bit (i.e., the memory area programming mark bit) to be executed by the writing instruction, and the resistance wire at the corresponding position is blown according to binary.

[0039] S302: Turn off the high-voltage pulse generator and restore the normal drive voltage.

[0040] S303: Read the on / off status of the internal fuse, latch it as a fixed address code, and write it to the address storage unit.

[0041] The display module contains multiple light-emitting modules 22. During the address code writing process, it is necessary to first determine which light-emitting module 22 to write the address code to. In this embodiment, the IC chip can automatically identify and select the corresponding fuse bit that needs to be written to based on the external trigger signal. That is, based on the external trigger signal, it can identify which light-emitting module 22 in the display module needs to be programmed with the address code this time. Then, it controls the internal low-voltage power supply of the IC chip to switch to the built-in high-voltage pulse generator to start, accurately outputting microsecond-level narrow high-voltage pulses, and only blowing the fuse at the specified position (accurately determined based on the programming mark bit in the memory area). When the pulse ends, the high voltage is turned off, and the normal driving low voltage is restored. The internal register reads the fuse on / off state, latches it as a fixed address code, and then writes it into the address storage unit of the light-emitting module 22.

[0042] In this embodiment, only a conventional low-voltage power supply is needed externally during the programming process; no external high-voltage programming equipment is required. The high voltage is generated instantaneously within the IC chip, reducing the complexity and cost of external circuit design and avoiding the risk of breakdown or personal safety hazards that external high voltage might pose. Furthermore, the high voltage is generated only within microseconds, resulting in extremely low overall energy consumption. Simultaneously, the narrow pulse reduces heat accumulation, preventing thermal damage to other sensitive components or surrounding packaging materials within the chip. This embodiment uses a physical fuse as the storage medium, which is non-volatile. Even if the system is powered off, restarted, or subjected to strong electromagnetic interference, the address code will not be lost or reset, ensuring the long-term reliability of the display system.

[0043] Furthermore, in some embodiments, reading the on / off state of the fuse inside the address storage unit and latching it as a fixed address code to write to the address storage unit may include: if the address storage unit already has a programming mark, then ignoring the current address code; if the address storage unit has no programming mark, then writing the address code to the address storage unit and simultaneously generating a permanent programming mark. In this embodiment, after the address code programming is completed, the IC chip will check whether there is a programming record in the address storage unit. If there is already a programming mark: then directly ignoring the current address code, rejecting duplicate writing, and preventing address tampering; if there is no programming mark: writing the address code transmitted by the bus to the address storage unit, and simultaneously generating a permanent programming mark.

[0044] Furthermore, in one embodiment, the external trigger signal is a light illumination signal. Before receiving the external trigger signal, it may also include: responding to an address bit strobe instruction to control the light illumination unit to illuminate a single or an entire row of light-emitting modules 22 in the display module that need to have their address codes burned.

[0045] In this embodiment, during the address code writing process, the upper control module will issue an address bit strobe instruction. The illumination unit receives the address bit strobe instruction and selects a single or entire column of light-emitting modules 22 indicated in the address bit strobe instruction. The selected light-emitting modules 22 are then illuminated (UV light is preferred in this embodiment). The IC chip in the light-emitting module 22 receives the illumination signal and automatically identifies the corresponding fuse bit that needs to be written.

[0046] In the above embodiments, after the coding is completed and the writing is successful, the main control switch unit is restored to closure, the module returns to the normal communication link, and after the entire coding is completed, the upper control module exits the burning mode.

[0047] See Figure 2As shown in the diagram, "1", "2", "3", and "4" represent the written address codes. Within the entire display module (all DI data), multiple light-emitting modules 22 share the same address. For example, all DI data in the first row are connected in parallel, and each light-emitting module 22 has a unique address. However, the second row of DI data and the first row of DI data have no overlap (they are disconnected), thus allowing for identical addresses (such as 1~4). This is because different DI data operate independently without any overlap or influence. Within the same row, only a single address code number is allowed (e.g., only one 1 or one 2 can appear), and two 1s or two 2s are not permitted. The maximum number of address codes in a row is determined by referring to the formula for the maximum load capacity of the light-emitting module 22.

[0048] The maximum number of LED modules 22 that can be connected is X = IC chip transmission rate / (grayscale of a single LED module 22 (RGB) * display frame rate). Assuming a transmission rate of 3Mbps and a display frame rate of 60Hz, the maximum number of modules x = 3,000,000 / 60 * 48 = 1041 pcs. At this point, the DI can connect a maximum of 1041 LED modules 22 in parallel (one LED module 22 can be understood as one LED bead). Beyond this number, each module must be connected in a separate DI port. Within the maximum load capacity, LED modules 22 can be connected in parallel arbitrarily through the DI data ports until the maximum load capacity is reached.

[0049] Preferably, during the above coding process, the light-emitting modules 22 can be coded in the form of illumination from left to right (or from right to left) in sequence (using UV light, starting from the light-emitting module 22 at position 1, then the light-emitting module 22 at position 2, and so on, to complete the coding of the entire display module).

[0050] This application embodiment also provides an address coding system for a display module, which may include: a host control module for issuing coding instructions; a display module including multiple light-emitting modules 22, wherein the light-emitting modules 22 are used to receive coding instructions and read the burning flag bits in the storage area of ​​the coding instructions; and are also used to receive external trigger signals, identify and determine the light-emitting modules 22 in the display module that need to have their address codes burned according to the external trigger signals; and burn the address codes according to the burning flag bits in the storage area and write them into the address storage unit of the light-emitting modules 22.

[0051] Preferably, in the above embodiment, the IC chip inside the light-emitting module 22 is used to receive the writing instruction and read the burning mark bit in the storage area of ​​the writing instruction; it is also used to receive the external trigger signal, identify and determine the light-emitting module 22 in the display module that needs to be burned with the address code according to the external trigger signal; and burn the address code according to the burning mark bit in the storage area and write it into the address storage unit of the light-emitting module 22.

[0052] Furthermore, in one embodiment, the IC chip inside the light-emitting module 22 is also used to activate the high-voltage pulse generator inside the light-emitting module 22, output a high-voltage pulse, and melt the fuse at a specified position based on the marked bit burned in the storage area; turn off the high-voltage pulse generator and restore the normal driving voltage; read the on / off state of the internal fuse, latch it as a fixed address code, and write it into the address storage unit.

[0053] Preferably, the IC chip inside the light-emitting module 22 is also used to ignore the current address code if the address storage unit already has a burning mark; if the address storage unit does not have a burning mark, the address code is written into the address storage unit, and a permanent burning mark is generated at the same time.

[0054] Preferably, the write instruction includes a target address code, and the IC chip inside the light-emitting module 22 determines the memory area burning flag bit based on the target address code.

[0055] Furthermore, in one embodiment, the upper-level control module is also used to issue address bit strobe instructions; the address coding system also includes a trigger module, which is signal-connected to the upper-level control module. The trigger module is used to receive address bit strobe instructions and send trigger signals to the light-emitting module 22 in the display module that needs to have address codes programmed.

[0056] In this embodiment, the external trigger signal is a light signal, the trigger module is a light unit, and the trigger module is used to respond to the address bit strobe instruction to control the light to illuminate a single or a row of light-emitting modules 22 in the display module that need to be programmed with address codes, so as to send a light signal to the light-emitting modules 22.

[0057] Furthermore, in some embodiments, the light-emitting module 22 is provided with a switching unit and a main control unit. The main control unit is used to control the switching unit to open before programming and to control the switching unit to close again after programming is completed.

[0058] Furthermore, in one embodiment, the display module has at least two rows of light-emitting modules 22 arranged longitudinally, and each row of light-emitting modules 22 has a plurality of light-emitting modules 22 arranged laterally; each side of each row of light-emitting modules 22 is provided with a DI line, and each light-emitting module 22 is connected to the DI line; the light-emitting modules 22 in each row are connected in parallel to each other, and the DI lines of adjacent rows of light-emitting modules 22 are disconnected from each other.

[0059] See Figure 2As shown, each row of light-emitting modules 22 has a VDD line and a DI line on one side and a GND line on the other side. The VDD lines of the upper and lower rows of light-emitting modules 22 are connected together, and the GND lines of the upper and lower rows of light-emitting modules 22 are connected together. The DI lines of the upper and lower rows of light-emitting modules 22 are disconnected. Each row of light-emitting modules 22 is connected to the VDD line, DI line, and GND line of that row, and the light-emitting modules 22 within each row are connected in parallel. In this embodiment, all control signal pins of each light-emitting module 22 are connected in parallel (i.e., connected in parallel to the DI line). When the DI pin of a light-emitting module 22 cannot receive a signal / the DI pin is open-circuited, it can solve the problem of any light-emitting module 22 failing without affecting the overall display effect. Moreover, the control signals between light-emitting modules 22 are not affected by transmission attenuation / signal interruption.

[0060] See Figure 3 As shown, a display module is illustrated, which may include: a dimming film layer 1; a display layer 2, the display layer 2 including a conductive circuit layer 21, the conductive circuit layer 21 being grown on the dimming film layer 1, and a light-emitting module 22 disposed on the side of the conductive circuit layer 21 away from the dimming film layer 1, the light-emitting module 22 being electrically connected to the conductive circuit layer 21, and an encapsulating adhesive layer 23 disposed on the surface of the light-emitting module 22.

[0061] See Figure 3 As shown, in this embodiment, the display layer 2 is fixed on the dimming film layer 1. The dimming film layer 1 is preferably a polymer-dispersed liquid crystal dimming film, used to adjust the color and haze of the finished film material; the upper display layer 2 is used for full-color / monochrome display. It should be understood that the light-emitting module 22 disposed on the conductive circuit layer 21 includes bare die chips such as IC chips and light-emitting chips. Both the IC chip and the light-emitting chip are electrically connected to the conductive circuit layer 21, so that the IC chip can drive the light-emitting chip to light up. An encapsulating adhesive layer 23 is also provided on the surface of the light-emitting module 22 to protect the light-emitting module 22.

[0062] In this embodiment, a conductive circuit layer 21 electrically connected to the light-emitting module 22 is grown on the dimming film layer 1. The conductive circuit layer 21 is directly prepared on the surface of the dimming film layer 1, eliminating the need for a separate integrated circuit board and the PET substrate between the integrated circuit board and the metal layer. This can greatly reduce the thickness of the entire display module, directly reducing the thickness by at least 0.2mm to 0.4mm. The reduced thickness improves the transparency of the display module, solving the technical problems of thick finished film materials and poor transparency in related technologies.

[0063] Preferred, Figure 5As shown, the aforementioned light-emitting modules 22 all adopt a fully flip-chip structure. By introducing a conductive circuit layer 21 and fully flip-chip wafer-level packaging technology on the dimming film layer 1, the transparency of the film is further improved while ensuring current overload capacity. At the same time, the introduction of fully flip-chip wafer-level packaging technology can effectively improve chip heat dissipation, resulting in low overall cost and high mass production maturity. The conductive circuit layer 21 (e.g., copper foil) is grown on the dimming film layer 1 (typically 0.4mm thick), and then a fully flip-chip die bonding process (with encapsulation as thin as 0.2mm) is used, making the film thickness as thin as 0.6mm. Conventional transparent display film materials are generally 1.0mm+ thick. The display module of this embodiment can achieve multi-functionality, thinness, and easy installation. By combining the PDLC dimming film layer 1 with the function of full-color display, the film material can retain the traditional PDLC dimming characteristics while being compatible with the effect of full-color display, and is compatible with high-contrast and high-definition display.

[0064] Further, in one embodiment, the conductive circuit layer 21 is bonded to the dimming film layer 1 via a conductive adhesive layer. In this embodiment, the conductive adhesive layer is preferably an ACF (Anisotropic Conductive Film) conductive adhesive layer. In this embodiment, the conductive circuit layer 21 is fixed to the dimming film layer 1 using a low-temperature conductive adhesive bonding process (conductive circuit layer 21 is bonded), employing dry bonding, which avoids chemical corrosion and strong solvent contact. Specific process details are shown in Table 1 below: Table 1 Bonding process

[0065] In this embodiment, the core of the dimming film layer 1 is liquid crystal microdroplets, which are highly sensitive to high temperatures, strong solvents, and high pressures. This embodiment utilizes the aforementioned low-temperature bonding process with conductive adhesive to directly fix the conductive circuit layer 21 to the surface of the dimming film layer 1 without damaging or affecting its performance.

[0066] Furthermore, in one embodiment, a cover film 24 is disposed on the surface of the conductive circuit layer 21, and the light-emitting module 22 is disposed on the surface of the cover film 24. See also Figure 4 As shown, in this embodiment, a cover film 24 is provided on the surface of the conductive circuit layer 21. The cover film 24 can typically be made of polyimide adhesive (PI adhesive) and used to protect the circuit.

[0067] Further, in some embodiments, the dimming film layer 1 comprises, from top to bottom, a surface insulating protective layer 11, a first transparent conductive electrode layer 12, an inner insulating barrier layer, a liquid crystal microdroplet layer 13, a second transparent conductive electrode layer 14, and a bottom insulating protective layer 15; the thickness of the surface insulating protective layer 11 is 12~25 μm, and the thickness of the inner insulating barrier layer is 5~15 μm; the conductive circuit layer 21 is grown on the surface insulating protective layer 11. See also Figure 6As shown, in this embodiment, the outermost layer of the dimming film layer 1 is a surface insulating protective layer 11, which can be a polycarbonate board (PC board). The bottommost bottom insulating protective layer 15 can be made of the same material as the surface insulating protective layer 11. The surface insulating protective layer 11 and the bottom insulating protective layer 15 serve as mechanical protection. The first transparent conductive electrode layer 12 is the second layer of the dimming film layer 1 from top to bottom. This electrode layer is a transparent layer. The material of the first transparent conductive electrode layer 12 can be indium tin oxide (ITO). The second transparent conductive electrode layer 14 can be made of the same material as the first transparent conductive electrode layer 12. The first transparent conductive electrode layer 12 and the second transparent conductive electrode layer 14 achieve a uniform electric field conduction, with a light transmittance > 90%. The aforementioned liquid crystal microdroplet layer 13 is the core dimming region, consisting of liquid crystal microdroplets (50-2000nm) uniformly distributed on the polymer surface. An inner insulating barrier layer is also provided between the first transparent conductive electrode layer 12 and the liquid crystal microdroplet layer 13. The surface insulating protective layer 11 and the inner insulating barrier layer ensure that the fabrication process of the conductive circuit layer 21 does not disrupt the liquid crystal arrangement of the lower liquid crystal microdroplet layer 13, thus not affecting the dimming function. Table 2 below describes the materials of the surface insulating protective layer 11 and the inner insulating barrier layer. Table 2

[0068] Further, in one embodiment, the conductive circuit layer 21 includes at least two rows of metal circuits arranged longitudinally. Each row of metal circuits includes a VDD line 211, a GND line 212, and a DI line 213 extending laterally. Each row of metal circuits also includes a plurality of chip fixing lines 214, which are arranged laterally at intervals. Each row of chip fixing lines 214 is independently electrically connected to the VDD line 211, the GND line 212, and the DI line 213, so that each chip fixing line 214 is parallel to each other. Each of the chip fixed lines 214 includes an IC input signal pad 2141, an IC power pad 2142, an IC ground pad 2143, multiple IC control pads 2144, and multiple light-emitting chip pads 2145. The light-emitting module 22 includes an IC chip and multiple light-emitting chips. The IC chip is electrically connected to the IC input signal pad 2141, the IC power pad 2142, the IC ground pad 2143, and the multiple IC control pads 2144. The light-emitting chip is electrically connected to the light-emitting chip pads 2145.

[0069] See Figure 7As shown, this is a specific structure of the conductive circuit layer 21. In this embodiment, two rows of metal lines are shown (in other embodiments, there can be three, four, or even more rows, which is not limited here). Each row of metal lines includes a row of independent chip fixing lines 214. These chip fixing lines 214 are connected in parallel to VDD line 211, GND line 212, and DI line 213. VDD line 211 and DI line 213 are located on the same side of the chip fixing lines 214, while GND line 212 is located on the other side. The chip fixing lines 214 include an IC input signal pad 2141 electrically connected to the IC chip, an IC power pad 2142, an IC ground pad 2143, and three IC control pads 2144. Each IC control pad 2144 is electrically connected to a corresponding light-emitting chip pad 2145. This arrangement ensures that multiple light-emitting modules 22 in a row of light-emitting modules 22 are connected in parallel. When the DI pin of the light-emitting module 22 cannot receive a signal / the DI pin is open-circuited, it can resolve the failure of any light-emitting module 22 without affecting the overall display effect. Moreover, the control signal between light-emitting modules 22 will not be affected by transmission attenuation / signal interruption.

[0070] In the above embodiment, the conductive circuit layer 21 needs to be electrically connected to the flip-chip IC. The IC chip's electrodes include at least one VDD (positive), GND (negative), DI (data transmission port), OUTR (connected to the negative terminal of the red light chip), OUTG (connected to the negative terminal of the green light chip), and OUTB (connected to the negative terminal of the blue light chip). The VDD (positive) terminals in the display module need to be connected in parallel (not only in parallel with a single string, but also in parallel with the VDD of the entire display module for power supply), while GND needs to be connected in parallel with the GND of the entire display module for power supply. The connection method of DI is determined by the performance of the IC chip. The maximum number of light-emitting modules 22 that can be connected is X = IC chip transmission rate / (grayscale of a single light-emitting module 22 (RGB) * display frame rate). Assuming a transmission rate of 3Mbps and a display frame rate of 60Hz, the number of modules that can be connected is x = 3000000 / 60 * 48 = 1041 pcs. At this time, DI can connect a maximum of 1041 light-emitting modules 22 in parallel. Beyond this number, only a single DI port can be connected. Within the maximum load capacity range, any number of light-emitting modules 22 can be connected in parallel at the DI data port until the number of light-emitting modules 22 reaches the maximum load capacity.

[0071] Furthermore, in one embodiment, the VDD lines 211 of all the metal lines are electrically connected together, the GND lines 212 of all the metal lines are electrically connected together, and the DI lines 213 of all the metal lines are disconnected from each other. See also Figure 7As shown, in the two rows of metal lines, the VDD line 211 of the first row is electrically connected to the VDD line 211 of the second row, and the GND line 212 of the first row is electrically connected to the GND line 212 of the second row. However, the DI line 213 of the first row is not electrically connected to the DI line 213 of the second row. With this configuration, when writing address codes to the display module, the addresses of the light-emitting modules 22 in the same row are different, while the addresses of the light-emitting modules 22 in different rows can be the same. For example... Figure 2 As shown, in the entire display module (all DI data), there are multiple light-emitting modules 22 with the same address. All DI data in the first row are connected in parallel, and the address of each light-emitting module 22 is unique. However, the data in the second row of DI and the first row of DI have no overlap, so the same address (1~4) is allowed, because different DI data are run independently and have no overlap or influence.

[0072] Furthermore, in some embodiments, in each row of metal lines, the VDD line 211 and the DI line 213 are located on the same side of the plurality of chip fixing lines 214, and the VDD line 211 and the GND line 212 are located on opposite sides of the plurality of chip fixing lines 214; the VDD line 211, the GND line 212, the DI line 213 and the chip fixing lines 214 all adopt a metal mesh structure formed by interlacing metal lines, and the line width of a single metal line is 5~15μm, and the spacing between two adjacent metal lines is 800μm~1500μm.

[0073] In this embodiment, since the loop-emitting module 22 requires a large overload current, directly increasing the width of the conductive line layer 21 would affect the overall transparency of the display module. Therefore, a completely new structural design is needed. This embodiment ensures current overload while also considering the transparency of the film material. The specific structure of the conductive line layer 21 can be as follows: Figure 8 As shown. The structure is mainly divided into three categories. The first structure (1) is a conventional matrix structure with alternating rows and columns. The second structure (2) is a matrix polygon structure, and the third structure (3) is an irregular cellular structure. Moreover, the line width of a single wiring must meet the requirement of 5~15μm, and the distance d between wirings must meet the requirement of 800μm~1500μm. Figure 9 (As shown).

[0074] In the description of this application, it should be noted that the terms "upper," "lower," etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. Unless otherwise expressly specified and limited, the terms "installed," "connected," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication between two elements. For those skilled in the art, the specific meaning of the above terms in this application can be understood according to the specific circumstances.

[0075] It should be noted that in this application, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0076] The above description is merely a specific embodiment of this application, enabling those skilled in the art to understand or implement this application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of this application. Therefore, this application is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features claimed herein.

Claims

1. A method for writing address codes to a display module, characterized in that, It includes: Receive the write command and read the memory area programming flag bit in the write command; Receive external trigger signals, identify and determine the light-emitting modules in the display module that need to have their address codes burned based on the external trigger signals; The address code is burned into the address storage unit of the light-emitting module according to the burning mark bit in the storage area.

2. The address writing method for the display module as described in claim 1, characterized in that, The address storage unit for burning address codes according to the burning flag bits in the storage area and writing them into the light-emitting module includes: The fuse at a specified location within the address storage unit of the light-emitting module is triggered by burning a marker bit into the storage area. Read the on / off state of the fuse inside the address storage unit, latch it as a fixed address code, and write it into the address storage unit.

3. The address writing method for the display module as described in claim 2, characterized in that, The process of reading the on / off state of the fuse inside the address storage unit and latching it as a fixed address code for writing into the address storage unit includes: If the address storage unit already has a burning mark, then ignore the address code this time; if the address storage unit does not have a burning mark, then write the address code into the address storage unit and generate a permanent burning mark at the same time.

4. The address writing method for the display module as described in claim 1, characterized in that, The address storage unit for burning address codes according to the burning flag bits in the storage area and writing them into the light-emitting module includes: The high-voltage pulse generator inside the light-emitting module is activated, and a high-voltage pulse is output to blow the fuse at the specified position based on the marked bit burned in the storage area. Turn off the high-voltage pulse generator and restore the normal drive voltage; Read the on / off status of the internal fuse, latch it as a fixed address code, and write it to the address storage unit.

5. The address writing method for the display module as described in claim 1, characterized in that, The external trigger signal is a light signal, and before receiving the external trigger signal, the following steps are also included: In response to the address bit strobe command, the illumination unit controls the illumination of a single or an entire row of light-emitting modules in the display module that require the address code to be burned.

6. The address writing method for the display module as described in claim 1, characterized in that, The write instruction includes a target address code, and the memory area burning flag is determined based on the target address code.

7. The address writing method for the display module as described in claim 1, characterized in that, Before receiving the write command, it also includes: It receives the programming mode command and controls the switching unit of the light-emitting module to disconnect.

8. An address coding system for a display module, characterized in that, It includes: The host control module is used to issue write commands. The display module includes multiple light-emitting modules. The light-emitting modules are used to receive writing instructions and read the burning flag bits in the storage area of ​​the writing instructions; they are also used to receive external trigger signals, identify and determine the light-emitting modules in the display module that need to be burned with address codes according to the external trigger signals; and burn the address codes according to the burning flag bits in the storage area and write them into the address storage unit of the light-emitting modules.

9. The address writing system as described in claim 8, characterized in that, The upper-level control module is also used to issue address bit selection instructions; The address coding system also includes a trigger module, which is signal-connected to the host control module. The trigger module is used to receive address bit selection instructions and send trigger signals to the light-emitting modules in the display module that need to be programmed with address codes.

10. The address writing system as described in claim 8, characterized in that, The light-emitting module is equipped with a switching unit and a main control unit. The main control unit is used to control the switching unit to open before programming and to control the switching unit to close again after programming is completed.

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