Dispatching method, device, medium and product of real-time dispatching system

Abstract

The present application relates to the technical field of semiconductor manufacturing, and more particularly to a dispatching method, device, medium and product of a real-time dispatching system. The method comprises: in a dispatching task, determining a state parameter corresponding to each of a plurality of cavities in a machine; the state parameter is used to indicate whether the cavity is about to be in or is currently in an idle state; according to the state parameter, at least one target cavity is determined from the plurality of cavities; from a plurality of wafer batches to be dispatched, a wafer batch matched with the at least one target cavity is selected as a target batch of the current dispatching task, and a corresponding dispatching instruction is generated; the dispatching instruction is used to dispatch the target batch to the machine. The method generates a dispatching instruction based on whether the cavity is about to be idle, thereby avoiding the idle of part of the cavities, balancing the load of the cavities, and improving the utilization rate of the cavities and the output rate of the machine.

Description

Technical Field

[0001] This application relates to the field of semiconductor manufacturing technology, and more specifically to a dispatching method, apparatus, medium, and product for a real-time dispatching system. Background Technology

[0002] In semiconductor integrated circuit manufacturing, the real-time dispatch (RTD) system is mainly responsible for sorting the batches of wafers to be processed on the machine and then dispatching the batches of wafers to be processed to the machine in sequence for processing.

[0003] Each chamber in a chamber-type wafer assemblies is an independently operating processing unit that can perform the same or different processes. The assemblies have multiple load ports for placing wafer containers, which hold batches of wafers to be processed. Current dispatching methods dispatch wafers based on batch importance. When multiple batches of wafers on a load port need to be processed in a chamber performing the same process, subsequent batches must wait for the preceding batches to complete before reaching the load port and entering the chamber. This inevitably leads to an imbalance in the chamber load, with some chambers having too many wafers to process while others are idle; it also results in the inefficient use of load ports.

[0004] Therefore, how to rationally dispatch work in a real-time dispatching system to improve the utilization rate of the cavity and the output rate of the machine has become an urgent technical problem to be solved. Summary of the Invention

[0005] This application is made in consideration of the above-mentioned problems. This application provides a dispatching method, equipment, medium, and product for a real-time dispatching system, which can balance the load of the cavity and improve the utilization rate of the cavity and the output rate of the machine.

[0006] According to a first aspect of this application, a dispatching method for a real-time dispatching system is provided. In one round of dispatching tasks, the method includes: determining a state parameter corresponding to each of a plurality of cavities in a machine; the state parameter is used to indicate whether the cavity is about to be in or is currently in an idle state; determining at least one target cavity from the plurality of cavities based on the state parameter; selecting a wafer batch that matches the at least one target cavity from a plurality of wafer batches to be dispatched as the target batch of the current round of dispatching tasks, and generating a corresponding dispatching instruction; the dispatching instruction is used to dispatch the target batch to the machine.

[0007] In some embodiments, the status parameters include one or more of the following parameters: a target time when the number of remaining unprocessed wafers is less than or equal to a preset number; the number of remaining unprocessed wafers; or, the remaining processing time; wherein the remaining processing time is the time required to process the remaining unprocessed wafers.

[0008] In some embodiments, the status parameters include the remaining processing time or the number of remaining unprocessed wafers; determining at least one target cavity from a plurality of cavities based on the status parameters includes: selecting the cavity with the shortest remaining processing time from the plurality of cavities as the target cavity based on the remaining processing time corresponding to each of the plurality of cavities; or, selecting the cavity with the fewest remaining unprocessed wafers from the plurality of cavities as the target cavity based on the number of remaining unprocessed wafers corresponding to each of the plurality of cavities.

[0009] In some embodiments, determining at least one target cavity from a plurality of cavities based on state parameters includes: determining that the target cavity is about to be or is currently in an idle state when the state parameters corresponding to the target cavity satisfy one or more of the following conditions, and determining at least one target cavity from the plurality of cavities: the difference between the current time and the target time corresponding to the target cavity is less than or equal to a predetermined first threshold; the number of remaining unprocessed wafers corresponding to the target cavity is less than or equal to a predetermined second threshold; or, the remaining processing time is less than or equal to a predetermined third threshold.

[0010] In some embodiments, determining the state parameters corresponding to each cavity among the multiple cavities in the machine includes: obtaining a list of wafer batches to be processed by the machine; determining the remaining unprocessed wafer batches at the current moment based on the wafer batch list; determining the identification information of at least one unprocessed wafer remaining in each cavity among the multiple cavities in the machine according to a preset machine wafer extraction logic among the remaining unprocessed wafer batches at the current moment; calculating the estimated processing time for each wafer among the at least one wafer based on the identification information of the at least one wafer and historical processing data; and determining the state parameters corresponding to each cavity among the multiple cavities in the machine based on the number of the at least one unprocessed wafer and the estimated processing time for each wafer.

[0011] In some embodiments, after determining the state parameters corresponding to each of the multiple cavities in the machine, the method further includes: triggering the next round of work assignment according to a preset time interval; and in the next round of work assignment, re-determining the state parameters corresponding to each of the multiple cavities in the machine.

[0012] In some embodiments, selecting a wafer batch that matches the target cavity from multiple wafer batches to be dispatched as the target batch for this round of dispatching includes: selecting a set of wafer batches that match the target cavity from multiple wafer batches to be dispatched according to pre-generated process recipe information; and selecting the wafer batch with the highest priority from the set of wafer batches as the target batch for this round of dispatching according to the priority of each wafer batch in the set of wafer batches.

[0013] According to a second aspect of this application, an electronic device is provided, comprising: a processor, and a memory communicatively connected to the processor; the memory storing computer-executable instructions; the processor executing the computer-executable instructions stored in the memory to implement a dispatching method of a real-time dispatching system as described in any one of the first aspects.

[0014] According to a third aspect of this application, a computer-readable storage medium is provided, wherein computer-executable instructions are stored therein, which, when executed, cause a computer to perform a dispatching method of a real-time dispatching system as described in any one of the first aspects.

[0015] According to a fourth aspect of this application, a computer program product is provided, comprising a computer program that, when executed by a processor, implements a dispatching method of a real-time dispatching system as described in any one of the first aspects.

[0016] The dispatching method of the real-time dispatching system of this application generates dispatching instructions based on the remaining usage time of the cavity, thereby avoiding some cavities being idle, balancing the load of the cavities, and improving the utilization rate of the cavities and the output rate of the machine. Attached Figure Description

[0017] The above and other objects, features, and advantages of the present invention will become more apparent from the more detailed description of the embodiments of the invention in conjunction with the accompanying drawings. The drawings are provided to further illustrate the embodiments of the invention and form part of the specification. They are used together with the embodiments of the invention to explain the invention and do not constitute a limitation thereof. In the drawings, the same reference numerals generally represent the same parts or steps.

[0018] Figure 1 This is a schematic diagram illustrating the dispatching of tasks based solely on importance priority in related technologies.

[0019] Figure 2 This is a schematic block diagram of an electronic device used in the dispatching method of the real-time dispatching system in the embodiments of this application.

[0020] Figure 3 This is a schematic flowchart of a dispatching method of a real-time dispatching system according to an embodiment of this application;

[0021] Figure 4 This is a schematic diagram comparing the dispatching method of the real-time dispatching system proposed in this application embodiment with the dispatching sorting method in related technologies that simply sorts dispatching according to importance priority;

[0022] Figure 5 This is a flowchart illustrating the determination of state parameters in one embodiment of the dispatching method of the real-time dispatching system proposed in this application.

[0023] Figure 6 This is a schematic diagram of the chamber usage of a batch of wafers processed in a chamber in one embodiment of the dispatching method of the real-time dispatching system proposed in this application. Detailed Implementation

[0024] To make the objectives, technical solutions, and advantages of the present invention more apparent, exemplary embodiments according to the present invention will be described in detail below with reference to the accompanying drawings. Obviously, the described embodiments are merely a part of the embodiments of the present invention, and not all of the embodiments of the present invention. It should be understood that the present invention is not limited to the exemplary embodiments described herein. Based on the embodiments of the present invention described herein, all other embodiments obtained by those skilled in the art without inventive effort should fall within the protection scope of the present invention.

[0025] To facilitate understanding of the solutions proposed in the embodiments of this application, the relevant technical terms will be explained first:

[0026] Real-time dispatch (RTD) system;

[0027] Equipment (EQP);

[0028] Load Port (LP, the load target of the load port is the Carrier, i.e., the vehicle);

[0029] Chamber;

[0030] Process recipe (the process recipe is associated with the cavity to be used);

[0031] Carrier (the wafers corresponding to a wafer batch are housed within a carrier);

[0032] Wafer Lot (one wafer lot corresponds to a maximum of 25 wafers);

[0033] Wafer.

[0034] In semiconductor integrated circuits, the real-time dispatch (RTD) system is mainly responsible for sorting the Lots to be processed in the EQP of the machine tool, and then dispatching the Lots to be processed to the EQP of the machine tool in sequence for processing.

[0035] RTD (Rate Decision) sorting comprehensively considers factors such as lot importance, output maximization, machine utilization, production targets, and load balancing between machines and cavities. Modifications to dispatch rules also have specific objectives, and achieving these objectives will improve related metrics. For example, balancing the load of cavities will increase machine output and utilization.

[0036] A chamber-type EQP includes multiple chambers located in the processing area, each of which is an independently operating processing device. These chambers can be used to perform the same or different processing techniques. The EQP may include multiple (e.g., four) load ports located in the loading area for placing workpieces, such as wafers corresponding to a specific lot. These wafers are housed in a carrier and then placed on the LP (Process Loader). In related technologies, dispatching methods emphasize the importance of the lot, using its importance as the sole basis for dispatching order. This results in load imbalances in some chambers, with some chambers having many wafers to process while others remain idle.

[0037] like Figure 1 As shown, the machine includes six chambers, CH1-CH6. The chambers used for each recipe are as follows: Recipe A uses Chambers 1-4; Recipe B uses Chambers 5-6. That is, chambers CH1-CH4 are used for processing according to Recipe A. Chambers CH5-CH6 are used for processing according to Recipe B. Lots 1-4 on the LP represent four wafer batches to be processed.

[0038] In related technologies, when assigning work, priority is generally set simply according to the importance of the Lot, and work is assigned in order of priority. For example, suppose the current Lot list (wafer batch list) waiting to be processed includes 6 Lots, namely Lot1-Lot6, sorted by importance and their corresponding process formulas as follows:

[0039] Lot 1Recipe A, Lot 2Recipe A, Lot 3Recipe A, Lot 4Recipe A, Lot 5RecipeB, Lot 6Recipe B.

[0040] like Figure 1 As shown, if the work is assigned in order of importance based solely on the Lot, all four loading areas of the machine will be occupied by Lot1-Lot4, which have higher priority. At this time, Chamber 5 (CH5) and Chamber 6 (CH6) may be idle. However, Lot5 and Lot6 have lower priority and need to wait for Lot1-Lot4 to finish processing. During the waiting period, the idle chambers CH5 and CH6 will be wasted.

[0041] Specifically, on the one hand, from the perspective of the cavity, the above-mentioned dispatching mechanism may lead to the cavities being idle, such as Chamber-5 and Chamber-6 being idle; on the other hand, from the perspective of the Lot, the cavities in which the Lot can work are limited, and Lot 2 / Lot 3 / Lot 4 need to wait until Lot 1 has completed processing before they can enter the cavity to work.

[0042] From the perspective of the loading area (LP), the LP may be invalidally occupied. For example, Lot 2 / Lot 3 / Lot 4 cannot be immediately extracted after being sent to the machine, causing the loading area to be occupied for a long time, and subsequent Lots cannot be loaded into the LP.

[0043] In view of this, in order to solve at least one of the above problems, embodiments of this application propose a dispatching method of timely dispatching or real-time dispatching, which comprehensively considers the effective utilization rate of Load Port and the load balancing between chambers.

[0044] Real-time job assignment means that when assigning jobs, the next Lot to be assigned to the machine is determined based on whether multiple chambers on the machine are about to be idle or are currently idle. When a chamber is about to be idle or is currently idle, the next Lot is assigned. This Lot is matched with the idle chamber according to the process recipe.

[0045] In other words, the Just-In-Time dispatching method adjusts the dispatching sequence, dispatching a Lot to the machine only when the chamber it needs to use is about to complete the processing of the previous batch of Lots. The core concept of this dispatching method is to execute the corresponding task at the "exact" moment; this avoids the unused use of load ports and ensures that each chamber of the machine is evenly allocated the number of wafers to be processed, achieving loading balance between chambers, thereby preventing idle chambers from affecting production capacity.

[0046] Specifically, in response to the problem that existing real-time dispatching systems dispatch based on the importance of batches, resulting in unbalanced cavity loads with some cavities having too many wafers to process while others are idle, this application proposes a dispatching method, device, medium, and product for a real-time dispatching system, which will be described in detail below.

[0047] First, refer to Figure 2 An example control device 100 for implementing the methods of embodiments of the present invention is described below.

[0048] like Figure 1As shown, the control device 100 includes one or more processors 101, one or more storage devices 102, input devices 103, and output devices 104. These components are interconnected via a bus system 105 and / or other forms of connection mechanisms (not shown). It should be noted that... Figure 1 The components and structure of the control device 100 shown are merely exemplary and not limiting; the control device may also have other components and structures as needed.

[0049] The processor 101 may be a microcontroller unit (MCU), a central processing unit (CPU), a digital signal processor (DSP), a microcontroller, an embedded device, or other processing units with data processing capabilities and / or instruction execution capabilities, and may control other components in the electronic device 100 to perform desired functions.

[0050] The storage device 102 may include one or more computer program products, which may include various forms of computer-readable storage media, such as volatile memory and / or non-volatile memory. The volatile memory may include, for example, random access memory (RAM) and / or cache memory. The non-volatile memory may include, for example, read-only memory (ROM), hard disk, flash memory, etc. One or more computer program instructions may be stored on the computer-readable storage medium, and the processor 101 may execute the program instructions to implement the client functions (implemented by the processor) in the embodiments of the present invention described below, and / or other desired functions. Various applications and various data may also be stored in the computer-readable storage medium, such as various data used and / or generated by the applications.

[0051] The input device 103 may be a device used by a user to input commands, and may include a microphone or touch screen and other input devices.

[0052] The output device 104 can output various information (such as images or sounds) to the outside (e.g., a user) and may include one or more of a display, a speaker, etc.

[0053] Next, refer to Figure 3 , 4 This application describes a dispatching method for a real-time dispatching system according to embodiments of the present application.

[0054] like Figure 3As shown, the present application provides a dispatching method for a real-time dispatching system, which is applied in a real-time dispatching system. In a round of dispatching tasks, the method may include the following steps S210-S220.

[0055] In step S210, the state parameters corresponding to each of the multiple cavities in the machine tool are determined.

[0056] The status parameter is used to indicate whether the cavity is about to be in or is currently in an idle state.

[0057] In some embodiments, the state parameter may include one or more of the following parameters:

[0058] Target time: The time when the number of remaining unprocessed wafers is less than or equal to a preset number. For example, if the preset number is 3, the target time is the time when the chamber will have only 3 wafers left to process.

[0059] Number of wafers: The number of unprocessed wafers remaining. For example, if there are 3 unprocessed wafers remaining, then the number of wafers = 3.

[0060] Remaining processing time: Remaining processing time is the time required to process the remaining unprocessed wafers, for example, the time required to process the remaining 3 wafers.

[0061] It should be noted that the aforementioned remaining unprocessed wafers refer to the remaining unprocessed wafers in the current Lot being processed by the machine at the current moment. The current Lot being processed by the machine at the current moment includes the Lot to which the wafers being processed in the chamber belong. In some embodiments, the current Lot being processed at the current moment may also include Lots waiting to enter the chamber for processing. However, it is understood that when using this dispatching method, dispatching is only performed when a chamber is about to be used up, which can reduce the number of Lots waiting to enter the chamber for processing. For example, in each round of dispatching tasks, when determining the status parameters, the number of Lots waiting to enter the chamber for processing is usually 0.

[0062] In this application, the equipment can be used for wafer manufacturing and processing, including processes such as cleaning, etching, ion implantation, and photolithography, such as equipment for film deposition processes like chemical vapor deposition or physical vapor deposition, but it should not be limited thereto. Specifically, in this embodiment, the equipment has at least two cavities, each of which can independently perform different processes or perform the same process.

[0063] In this application, the machine tool has at least two carriers, each used to carry and transfer different batches of wafers. Each wafer batch includes multiple wafers; in one specific implementation, a wafer batch includes at most 25 wafers. Each wafer is processed only in one cavity of the machine tool. Before processing, the wafers are placed in a wafer container and on the carrier. During processing, the machine tool uses an automated arm to pick up the wafers one by one and transfer them to the corresponding cavities for processing.

[0064] Wafers from the same batch can be processed in the same cavity or in different cavities, but the same process is performed, resulting in identical products. When wafers from the same batch are processed in different cavities, multiple wafers are typically arranged evenly and sequentially in multiple cavities to improve cavity utilization and increase production efficiency. However, this is not the only approach. In some implementations, the distribution rules of the wafers in multiple cavities can be set according to actual needs, depending on the specific circumstances.

[0065] Different cavities within the same machine can be used to perform different processes, and one machine can process multiple wafer batches simultaneously. In a specific implementation, the machine includes M cavities, of which N cavities are processing the first batch of wafers, and (MN) cavities are processing the second batch of wafers. In step S210, for all current wafer batches being processed by the machine, i.e., the first batch and the second batch, the state parameters of each cavity in the machine need to be determined to proceed to step S220. That is, in step S1, for all current wafer batches being processed by the machine, the state parameters of each cavity in the machine used to process all current wafer batches are determined.

[0066] Specifically, during the manufacturing process, each product is assigned a corresponding batch number, the required processing steps, and the sequence of those steps when the production process is established, generating process information data. This process information data is stored within the machine, and the wafer is processed according to this data.

[0067] In this application, the remaining processing time refers to the time that the currently processed batch of wafers still needs to use the cavity. When wafers in a batch are processed in one cavity, the processing of that batch of wafers in the cavity will end when the remaining processing time ends, meaning that the cavity and stage occupied by that batch of wafers in the machine will be idle. When wafers in a batch are distributed across multiple cavities for the same processing, the processing of that batch of wafers in that cavity will end when the remaining processing time in one cavity ends, meaning that the cavity occupied by that batch of wafers in the machine will be idle and the stage will soon be idle. Specifically, the remaining processing time of a cavity can be determined based on the number of unprocessed wafers in the corresponding cavity.

[0068] Similarly, when the number of remaining unprocessed wafers is 0, or when the target time is reached, the corresponding cavity and stage are idle. The target time and the number of wafers can be determined based on the number of unprocessed wafers in the corresponding cavity, which will be explained in detail later.

[0069] In step S220, at least one target cavity is determined from multiple cavities based on the state parameters.

[0070] For example, in some embodiments, the status parameter can be the remaining processing time. Based on the remaining processing time corresponding to each of the multiple cavities on the machine, the target cavity is determined from the multiple cavities if the remaining processing time corresponding to the target cavity is the shortest; that is, the cavity with the shortest remaining processing time is selected as the target cavity. A remaining processing time of 0 indicates that the cavity is currently in an idle state, and this cavity can be preferentially selected as the target cavity.

[0071] Alternatively, the state parameter can be the number of remaining unprocessed wafers. Based on the number of remaining unprocessed wafers corresponding to each of the multiple cavities, the target cavity is determined from the multiple cavities if it has the fewest remaining unprocessed wafers. For example, if CH2 has 2 remaining unprocessed wafers, CH3 has 3 remaining unprocessed wafers, and all other cavities have more than 3 remaining unprocessed wafers, then cavity CH2 is selected as the target cavity. In other embodiments, determining the target cavity from the multiple cavities based on the state parameter can be done by determining that the target cavity is about to be or is currently in an idle state if the state parameter corresponding to the target cavity meets predetermined conditions, and then determining the target cavity from the multiple cavities. For example, the predetermined conditions may include one or more of the following conditions:

[0072] Condition (1): The difference between the current time and the target time corresponding to the target cavity is less than or equal to a predetermined first threshold. The first threshold is a threshold used to control the time difference.

[0073] Condition (2): The number of remaining unprocessed wafers corresponding to the target cavity is less than or equal to a predetermined second threshold. The second threshold is a threshold used to control the range of the number of wafers.

[0074] Condition (3): The remaining processing time is less than or equal to the predetermined third threshold. The third threshold is a threshold used to control the time range.

[0075] Optionally, if the target cavity cannot be identified, no work will be assigned. The target cavity cannot be identified, for example, if no cavity meets the conditions (1) to (3).

[0076] In step S230, from the multiple wafer batches to be dispatched, the wafer batch that matches at least one target cavity is selected as the target batch for this round of dispatching tasks, and the corresponding dispatching instruction is generated.

[0077] The dispatch instruction is used to assign the target batch to the machine. Specifically, the dispatch instruction can be used to control the conveying equipment to transport the target batch to an unoccupied loading area. The conveying equipment is, for example, an overhead crane, but this application does not specifically limit it.

[0078] In some embodiments, a set of wafer batches may be selected based on the availability of the cavity, and each set of wafer batches may include at least one Lot. When the number of Lots waiting to be processed in the set is greater than or equal to 2, the Lot with the highest priority may be selected as the lot for this dispatch and dispatched to the machine according to the priority of the multiple Lots waiting to be processed.

[0079] Specifically, based on the pre-generated process recipe information, a set of wafer batches matching the target cavity can be selected from multiple wafer batches to be dispatched; then, based on the priority of each wafer batch in the set of wafer batches, the wafer batch with the highest priority is selected from the set of wafer batches as the target batch for this round of dispatching tasks.

[0080] For example, such as Figure 4 As shown in the figure, the left side is a schematic diagram of dispatching in related technologies, and the right side is a schematic diagram of dispatching using the scheme proposed in the embodiments of this application.

[0081] In the diagram on the right, four loading areas on the machine are loaded with Lot1, Lot5, Lot2, and Lot6 respectively. This can be understood as follows: after Lot1 is transferred to the first loading area (in left-to-right order), a new round of dispatching tasks is triggered. In this round of dispatching tasks, based on the status parameters, cavity CH5 is determined to be in an idle state, and cavity CH5 is selected as the target cavity. According to the pre-generated process recipe, the group matching CH5 is Recipe B. Therefore, Recipe B is selected from at least one group waiting to be processed. Recipe B corresponds to two Lots waiting to be processed: Lot5 and Lot6. Lot5 has a higher priority than Lot6, so the higher-priority Lot5 is selected as the target batch for this dispatching and dispatched to the machine via a dispatching command.

[0082] After a predetermined time interval, the next round of task assignment is triggered. Assuming that in the next round of task assignment, the identified idle cavities are CH1-CH4, and CH1-CH4 match Recipe A, then Lot2, with the highest priority, is selected as the target batch for this assignment from the remaining Lot2, Lot3, and Lot4 waiting to be processed corresponding to Recipe A. Similarly, in the next round of task assignment, if the identified idle cavities are CH5 and CH6, and CH5 and CH6 match Recipe B, then Lot6, the only remaining (and naturally highest priority) Lot6 waiting to be processed corresponding to Recipe B, is selected as the target batch for this assignment.

[0083] In summary, the dispatching mechanism provided in this application comprehensively considers the cavity's idle state and the Lot's priority (or importance). It first selects a cavity that is about to become idle or is currently idle from among multiple cavities, and then selects the Lot with the highest priority from the group that matches that cavity to dispatch the work to the machine.

[0084] Combination Figure 4 As can be seen, this embodiment of the application adjusts the dispatching order and dispatches work in real time. When the Chamber is about to be idle, a Lot is dispatched, thus freeing up two Load-Port areas for Lot5 and Lot6 to use. This avoids the idleness of Chambers 5 and 6, improves the utilization rate of the machine, and reduces the waiting time of Lot5 and Lot6 at the processing station.

[0085] It should be noted that, in this embodiment of the application, multiple rounds of dispatching tasks can be executed periodically at preset time intervals, with each round dispatching task dispatching a Lot to the machine. During the execution of this round of dispatching tasks, either during the determination of the status parameters or after obtaining the status parameters, the next round of dispatching tasks can be triggered at preset time intervals. In the next round of dispatching tasks, the status parameters corresponding to each of the multiple cavities in the machine are re-determined.

[0086] Optionally, if the target cavity cannot be identified in a round of dispatching, no dispatching will be carried out in this round, and the target cavity will be re-identified in the next round of dispatching after a preset time interval.

[0087] The following description, using specific examples, further elaborates on the process. In one embodiment, the dispatching method may include the following steps:

[0088] S310: Determine the state parameters of each of the multiple cavities.

[0089] In this embodiment, the state parameters include the target time, which is the time when the number of remaining unprocessed wafers reaches a preset number (e.g., 3 wafers).

[0090] For example, data reported by the equipment can be collected, and software can perform calculations every 2-4 minutes (e.g., 3 minutes) to predict the estimated processing completion time for each unprocessed wafer. Based on the estimated processing completion time for each wafer, it can be determined at which point in time the chamber has only 3 wafers remaining to be processed.

[0091] S320: Based on the status parameters, select one cavity from multiple cavities that is currently idle or about to become idle.

[0092] S330: Based on the pre-generated process recipe (e.g., Recipe A or Recipe B), select a group (e.g., Recipe A) that matches a cavity selected in S320, select the highest priority Lot from the group as the target batch (or target Lot) for this round of dispatching tasks, and generate the corresponding dispatching instructions.

[0093] In practical applications, after determining a group that matches a cavity selected by S320, the highest priority Lot may not meet the dispatchable conditions. For Lots that do not meet the dispatchable conditions, the reason for not being dispatchable is displayed on the dispatch interface. Within that group, the remaining dispatchable Lots are then selected according to their importance, and the highest priority Lot that is also dispatchable is selected as the target batch for this dispatch.

[0094] In this embodiment, the dispatching of a Lot can be terminated after each round (e.g., every 3 minutes) by reserving a Lot. The dispatching of a round can also be terminated if no target cavity is determined in the current round. Before the next round of dispatching, steps S310 to S330 are executed again to determine which Lots are dispatchable.

[0095] After determining when the cavity has 3 wafers remaining (at the target time), a dispatch command will be generated upon reaching the target time, dispatching the corresponding matching Lot to the machine. Optionally, the specific information of the Lot to be dispatched can be displayed on the dispatch system interface. If the Lot matching the idle cavity does not meet the conditions, the specific reason why dispatching is not possible can be displayed on the interface.

[0096] The following details how the state parameters of each of the multiple cavities are determined in S310 or S210.

[0097] For example, such as Figure 5 As shown, the state parameters can be determined using the following steps S3101-S3104.

[0098] S3101: Obtain the start-to-end operation time of the wafer in the cavity.

[0099] Specifically, the MES system can collect machine operation data to obtain the time required for a wafer to be processed in the corresponding chamber.

[0100] Specifically, based on the machine's log data (historical job data), the time required for a wafer to be processed in the corresponding chamber can be extracted; this time is the historical job duration. It can be understood that this log data includes historical job durations differentiated based on different process recipes. Each wafer awaiting subsequent processing has an identification identifier, and the process recipe corresponds to this identifier. In subsequent steps, the corresponding historical job duration can be selected based on the correspondence between the identifier and the process recipe.

[0101] S3102: Obtain a list of Lots that need to be processed on the machine and / or in the chamber, and identify which Lots have not yet been processed.

[0102] Specifically, the RTD system can calculate the number of wafers that have not yet been processed: obtain the list of batches to be processed in the machine / chamber (Lot List), calculate which wafers have not yet been processed, and store the results in a table.

[0103] In S3102, the table can be refreshed periodically through a Software Defined Radio (SDR) system. For example, the execution of S3102 can be triggered every 2-4 minutes (e.g., 3 minutes).

[0104] S3103: Determine the identification information of the wafers to be processed in the chamber, and the processing time required for each wafer.

[0105] Specifically, the RTD system can simulate the wafer picking logic of the machine to determine which wafers need to be processed in each chamber. This involves identifying the wafers to be processed and, obviously, determining the number of wafers to be processed in each chamber. Furthermore, the processing time for each wafer also needs to be determined. Identification information can be, for example, an ID or wafer category information. This identification information is used to find the processing time data for the same type of wafer in historical job data.

[0106] For example, the wafer extraction logic can be used to simulate the wafer extraction process to determine the working chamber of the unprocessed wafer. Based on the wafer identification information, the corresponding historical working time can be found in the historical working time obtained in step S3101. The processing time of the same type of wafer in multiple historical operations can be calculated from the historical working time. The average of the multiple historical processing times can be used to obtain the estimated working time (estimated processing time) for each wafer.

[0107] S3104: The target time when the number of unprocessed wafers remaining in each chamber is less than or equal to a preset number.

[0108] Specifically, the target time is determined based on the identification information of the wafers to be processed in the chamber obtained in step S3103, and the processing time required for each wafer.

[0109] For example, refer to the appendix Figure 4 In the embodiment shown, in step S3103, it is confirmed that the number of wafers to be processed in CH1 to CH6 are 4, 6, 6, 6, 5, and 6 respectively. The estimated processing time for CH1 to CH4 is 30 seconds, and the estimated processing time for CH5 and CH6 is 2 minutes. The preset number is 3. Therefore, it can be determined that in this round of dispatching, the target times for CH1 to CH6 are 30 seconds, 90 seconds, 90 seconds, 90 seconds, 4 minutes, and 6 minutes respectively.

[0110] After step S3104 is completed, the state parameters are determined. Subsequently, the target cavity can be determined and dispatched based on the state parameters. That is, when there is a cavity that satisfies the condition that the difference between the current time and the corresponding target time is less than or equal to a predetermined first threshold, the cavity is determined as the target cavity, and dispatch is performed on the target cavity.

[0111] For example, the first threshold is 1 minute, CH1 is the target cavity, and the dispatching in this round generates a dispatching instruction for CH1.

[0112] Based on the above exemplary description, the specific method for determining the state parameters corresponding to each cavity among multiple cavities in the machine can be summarized as follows: First, obtain the list of wafer batches to be processed by the machine; based on the wafer batch list, determine the remaining unprocessed wafer batches at the current moment; among the remaining unprocessed wafer batches at the current moment, according to the preset machine wafer extraction logic, determine the identification information (e.g., category information, or wafer ID, etc.) of at least one remaining unprocessed wafer in each of the multiple cavities in the machine; based on the identification information of at least one wafer and historical processing data, calculate the estimated processing time for each wafer in at least one wafer; based on the number of remaining unprocessed wafers and the estimated processing time for each wafer, determine the state parameters corresponding to each cavity among the multiple cavities in the machine.

[0113] In the above example, when the number of remaining unprocessed wafers is less than or equal to a preset target time, and the difference between the current time and the target time corresponding to the target cavity is less than or equal to a predetermined first threshold, it is determined that the target cavity is about to be or is currently in an idle state, and at least one target cavity is determined from multiple cavities. However, it is understood that the state parameters and the rules for determining the target cavity based on the state parameters can be set according to actual needs.

[0114] Specifically, the status parameter can be the remaining processing time. The remaining processing time of each wafer batch being processed in each cavity of the current machine can be obtained in real time. When there are one or more cavities with a remaining processing time less than or equal to a preset time threshold, at least one cavity (target cavity) is selected. For one or more subsequent wafer batches, the wafer batch that matches the target cavity is selected as the target batch for this dispatch, and a dispatch instruction is generated to be processed in the corresponding cavity.

[0115] In other embodiments, the status parameter can be the number of remaining unprocessed wafers. The number of remaining unprocessed wafers in each cavity of the current machine batch being processed can be obtained in real time. When there are one or more cavities with a number of remaining unprocessed wafers less than or equal to a preset threshold, at least one cavity (target cavity) is selected. For subsequent one or more wafer batches, the wafer batch matching the target cavity is selected as the target batch for this dispatch, and a dispatch instruction is generated to process the wafers in the corresponding cavity.

[0116] The dispatching method of the real-time dispatching system of this application generates dispatching instructions based on the idle state of the cavity, and prioritizes the Lot corresponding to the idle cavity for dispatching, thereby avoiding the impact of some cavities being idle on the production capacity, balancing the load of the cavity, improving the utilization rate of the cavity and the output rate of the machine; at the same time, it can also improve the effective utilization rate of the platform.

[0117] In this embodiment, the idle status of the cavity and the importance of the batch can be taken into account when dispatching. The real-time dispatching system dispatches tasks based on the importance of the batch and the loading balance between cavities, thereby improving the utilization rate of the machine and the cavity and maximizing output.

[0118] For example, the equipment can be a chemical vapor deposition (CVD) apparatus used to form thin films on the wafer surface. (Refer to Table 1 and...) Figure 6 The machine has four cavities: A, B, C, and D. Table 1 shows the number of wafers, priority, available cavities, and usage order (i.e., wafer extraction logic) for each wafer batch. There are three wafer batches to be processed: batch 1, batch 2, and batch 3, with 6, 8, and 6 wafers respectively. Batch 1 has the highest priority (1), followed by batches 2 and 3, and so on. Each wafer in each batch has a processing time of 30 minutes. Wafers from batches 1 and 3 can be processed in cavities A, B, C, and D, while wafers from batch 2 can only be processed in cavities B, C, and D.

[0119] Table 1

[0120]

[0121] For example, the first batch of 6 wafers are processed in four cavities: A, B, C, and D. Cavity A processes the first and fifth wafers, cavity B processes the second and sixth wafers, cavity C processes the third wafer, and cavity D processes the fourth wafer. In this embodiment, at least one target cavity is determined from multiple cavities by determining that the target cavity is about to be or is currently in an idle state if the number of remaining unprocessed wafers corresponding to the target cavity is less than or equal to a predetermined second threshold (3 wafers). In the 8:30 dispatch round, the number of remaining unprocessed wafers in cavities A, B, C, and D is less than 3. Therefore, cavities A, B, C, and D are all target cavities, and Lot2 is dispatched to cavities B, C, and D. In the 9:00 dispatch round, the number of remaining unprocessed wafers in cavities A, B, C, and D is less than 3. Therefore, cavities A, B, C, and D are all target cavities, and Lot3 is dispatched to cavities A, B, C, and D. Cavities B, C, and D will process Lot2 first, and Lot3 will continue to be processed after Lot2 is completed.

[0122] It should be noted that the process of assigning tasks only when there are a few wafers left to be processed in the cavity can be adjusted according to the machine, thereby avoiding the cavity from being idle.

[0123] Specifically, for batches that do not meet the conditions for dispatching, the reason why dispatching is not possible will be displayed on the dispatching interface.

[0124] Table 2 shows the allocation of wafers in the chamber for each batch. Following the above steps, the final processing time for each batch of wafers is shown in Table 2 below.

[0125] Table 2

[0126] 8:00-8:30 8:30-9:00 9:00-9:30 9:30-10:00 10:00-10:30 Cavity A Batch 1 Batch 1 Batch 3 Batch 3 Batch 3 Cavity B Batch 1 Batch 1 Batch 2 Batch 2 Batch 3 Cavity C Batch 1 Batch 2 Batch 2 Batch 2 Batch 3 Cavity D Batch 1 Batch 2 Batch 2 Batch 2 Batch 3

[0127] It should be noted that in the dispatching mechanism proposed in this application embodiment, each machine can have its own dispatching rules. For example, different machines can use different state parameters or different thresholds to identify idle states. For instance, the decision to dispatch only when a certain number of wafers remain to be processed can be adjusted by machine. Different machines can use different wafer number thresholds or different remaining processing time thresholds. For example, one machine can be set to identify an upcoming idle state when the number of unprocessed wafers is equal to or less than 3; while another machine can be set to identify an upcoming idle state when the number of unprocessed wafers is less than or equal to 2. In other words, the decision to dispatch only when a certain number of wafers remain to be processed can be adjusted by machine. Some machines have short processing times per wafer, and for some machines, dispatching only when 3 wafers remain may cause the cavity to be idle. Therefore, the state parameters and thresholds corresponding to different machines can be flexibly configured according to specific circumstances.

[0128] The dispatching rules proposed in this application can be applied to CVD machines or other cavity-type machines.

[0129] In summary, the dispatching method proposed in this application can achieve the following technical effects:

[0130] Chamber angle: Effectively reduces the idle rate of each chamber of the machine;

[0131] Lot perspective: The average wait time for Lot in the loading region is reduced.

[0132] This application also provides an electronic device, including: a processor and a memory communicatively connected to the processor; the memory stores computer-executable instructions; the processor executes the computer-executable instructions stored in the memory to implement the dispatching method of the real-time dispatching system as described in any of the above embodiments.

[0133] This application also provides a computer-readable storage medium storing computer-executable instructions, which, when executed, cause the computer to perform the dispatching method of the real-time dispatching system as described in any of the preceding embodiments.

[0134] It should be noted that the aforementioned computer-readable storage media can be read-only memory (ROM), programmable read-only memory (PROM), erasable programmable read-only memory (EPROM), electrically erasable programmable read-only memory (EEPROM), magnetic random access memory (FRAM), flash memory, magnetic surface memory, optical disc, or compact disc read-only memory (CD-ROM), etc. It can also be various electronic devices that include one or any combination of the above-mentioned memories, such as mobile phones, computers, tablet devices, personal digital assistants, etc.

[0135] This application also provides a computer program product, including a computer program that, when executed by a processor, implements the dispatching method of the real-time dispatching system as described in any of the preceding embodiments.

[0136] Although exemplary embodiments have been described herein with reference to the accompanying drawings, it should be understood that the above exemplary embodiments are merely illustrative and are not intended to limit the scope of the invention. Various changes and modifications can be made therein by those skilled in the art without departing from the scope and spirit of the invention. All such changes and modifications are intended to be included within the scope of the invention as claimed in the appended claims.

[0137] Those skilled in the art will recognize that the units and algorithm steps of the various examples described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are implemented in hardware or software depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementations should not be considered beyond the scope of this invention.

[0138] In the several embodiments provided in this application, it should be understood that the disclosed devices and methods can be implemented in other ways. For example, the device embodiments described above are merely illustrative. For instance, the division of units is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another device, or some features may be ignored or not executed.

[0139] Numerous specific details are set forth in the specification provided herein. However, it will be understood that embodiments of the invention may be practiced without these specific details. In some instances, well-known methods, structures, and techniques have not been shown in detail so as not to obscure the understanding of this specification.

[0140] Similarly, it should be understood that, in order to streamline the invention and aid in understanding one or more of the various aspects of the invention, features of the invention are sometimes grouped together in a single embodiment, figure, or description thereof in the description of exemplary embodiments of the invention. However, this method of the invention should not be construed as reflecting an intention that the claimed invention requires more features than are expressly recited in each claim. Rather, as reflected in the corresponding claims, its inventive point lies in solving the corresponding technical problem with fewer features than all of those in a single disclosed embodiment. Therefore, the claims following the detailed description are hereby expressly incorporated into that detailed description, wherein each claim itself is a separate embodiment of the invention.

[0141] Those skilled in the art will understand that, apart from the mutual exclusion of features, all features disclosed in this specification (including the accompanying claims, abstract, and drawings) and all processes or units of any method or apparatus so disclosed can be combined in any combination. Unless otherwise expressly stated, each feature disclosed in this specification (including the accompanying claims, abstract, and drawings) may be replaced by an alternative feature that serves the same, equivalent, or similar purpose.

[0142] Furthermore, those skilled in the art will understand that although some embodiments described herein include certain features but not others included in other embodiments, combinations of features from different embodiments are intended to be within the scope of the invention and form different embodiments. For example, in the claims, any of the claimed embodiments can be used in any combination.

[0143] The various component embodiments of the present invention can be implemented in hardware, or as software modules running on one or more processors, or a combination thereof. Those skilled in the art will understand that microprocessors or digital signal processors can be used in practice to implement some or all of the functions of some modules in the article analysis device according to embodiments of the present invention. The present invention can also be implemented as an apparatus program (e.g., a computer program and computer program product) for performing part or all of the methods described herein. Such programs implementing the present invention can be stored on a computer-readable medium, or can be in the form of one or more signals. Such signals can be downloaded from an Internet website, provided on a carrier signal, or provided in any other form.

[0144] It should be noted that the above embodiments are illustrative of the invention and not restrictive, and that those skilled in the art can devise alternative embodiments without departing from the scope of the appended claims. In the claims, any reference signs placed between parentheses should not be construed as limiting the claims. The word "comprising" does not exclude the presence of elements or steps not listed in the claims. The word "a" or "an" preceding an element does not exclude the presence of a plurality of such elements. The invention can be implemented by means of hardware comprising several different elements and by means of a suitably programmed computer. In the unit claims enumerating several means, several of these means may be embodied by the same item of hardware. The use of the words first, second, and third, etc., does not indicate any order. These words can be interpreted as names.

[0145] The above description is merely a specific embodiment of the present invention or an explanation of that embodiment. The scope of protection of the present invention is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in the present invention should be included within the scope of protection of the present invention. The scope of protection of the present invention should be determined by the scope of the claims.

Claims

1. A dispatching method for a real-time dispatching system, characterized in that, In a round of task assignment, the method includes: Determine the state parameters corresponding to each of the multiple cavities in the machine tool; the state parameters are used to indicate whether the cavity is about to be in or is currently in an idle state. Based on the state parameters, at least one target cavity is determined from the plurality of cavities; From multiple wafer batches awaiting dispatch, select the wafer batch that matches the at least one target cavity as the target batch for this round of dispatching tasks, and generate a corresponding dispatching instruction; the dispatching instruction is used to dispatch the target batch to the machine.

2. The method as described in claim 1, characterized in that, The state parameters include one or more of the following parameters: The target time when the number of remaining unprocessed wafers is less than or equal to the preset number; The number of remaining unprocessed wafers; Alternatively, the remaining processing time; wherein the remaining processing time is the time required to process the remaining unprocessed wafers.

3. The method as described in claim 2, characterized in that, The status parameters include the remaining processing time or the number of remaining unprocessed wafers; Based on the state parameters, at least one target cavity is determined from the plurality of cavities, including: Based on the remaining processing time corresponding to each of the multiple cavities, select the cavity with the shortest remaining processing time from the multiple cavities as the target cavity; or, Based on the number of remaining unprocessed wafers corresponding to each of the multiple cavities, the cavity with the fewest remaining unprocessed wafers is selected as the target cavity.

4. The method as described in claim 2, characterized in that, Determining at least one target cavity from the plurality of cavities based on the state parameters includes: determining that the target cavity is about to be or is currently in an idle state when the state parameters corresponding to the target cavity satisfy one or more of the following conditions, thereby determining at least one target cavity from the plurality of cavities; The difference between the current time and the target time corresponding to the target cavity is less than or equal to a predetermined first threshold. The number of remaining unprocessed wafers corresponding to the target cavity is less than or equal to a predetermined second threshold. Alternatively, the remaining processing time is less than or equal to a predetermined third threshold.

5. The method as described in claim 1, characterized in that, Determine the state parameters corresponding to each of the multiple cavities in the machine tool, including: Obtain the list of wafer batches to be processed by the machine, and determine the remaining unprocessed wafer batches at the current moment based on the wafer batch list; In the current batch of unprocessed wafers, according to the preset machine extraction logic, the identification information of at least one unprocessed wafer remaining in each of the multiple cavities of the machine is determined. Based on the identification information and historical processing data of the at least one wafer, calculate the estimated processing time for each of the at least one wafers; Based on the number of the remaining unprocessed at least one wafer and the estimated processing time for each wafer, the state parameters corresponding to each of the multiple cavities in the machine are determined.

6. The method according to any one of claims 1-5, characterized in that, After determining the state parameters corresponding to each of the multiple cavities in the machine tool, the method further includes: The next round of work assignment is triggered at a preset time interval; in the next round of work assignment, the status parameters of each cavity in the machine are redefined.

7. The method according to any one of claims 1-5, characterized in that, From multiple wafer batches awaiting dispatch, the wafer batch matching the target cavity is selected as the target batch for this round of dispatching tasks, including: Based on the pre-generated process recipe information, select a set of wafer batches that match the target cavity from multiple wafer batches to be dispatched; Based on the priority of each wafer batch in the set of wafer batches, the wafer batch with the highest priority is selected from the set of wafer batches as the target batch for this round of dispatching tasks.

8. An electronic device, characterized in that, include: A processor, and a memory communicatively connected to the processor; The memory stores computer-executable instructions; the processor executes the computer-executable instructions stored in the memory to implement the method as described in any one of claims 1-7.

9. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores computer-executable instructions that, when executed, cause the computer to perform the method as described in any one of claims 1-7.

10. A computer program product, comprising a computer program, characterized in that, When the computer program is executed by a processor, it implements the method as described in any one of claims 1-7.

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