Conductive film and display device

Abstract

Provided is a conductive film that can be easily pulled out even when wound into a roll shape, and a display device. The conductive film of the present invention includes: a substrate; a conductor disposed on a first surface of the substrate; a first resin layer disposed on the first surface of the substrate; and a second resin layer disposed on a second surface of the substrate. At least one of the first resin layer and the second resin layer is a filler-containing resin layer containing a resin and a plurality of filler particles, and the filler-containing resin layer has a region in which two or more filler particles exist inside a virtual square surface when the filler-containing resin layer is cross-sectionally observed, the side length of the square being the average thickness of the filler-containing resin layer.

Description

Technical Field

[0001] This invention relates to conductive films and display devices. Background Technology

[0002] A conductive film has been known to have a substrate, a mesh conductor pattern disposed on the surface of the substrate, and a resin layer disposed on the surface of the substrate (see, for example, Patent Document 1 below). It also discloses that, in order to prevent damage to the substrate, a protective layer containing resin and inorganic fillers is disposed on the back side of the substrate.

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: International Publication No. 2024 / 202800 Summary of the Invention

[0006] The technical problem that the invention aims to solve

[0007] The aforementioned conductive film is typically stored in a rolled-up state, and the appropriate amount is pulled out and cut for use as needed.

[0008] However, there is still room for improvement in the ease of pulling out the aforementioned conductive film.

[0009] Therefore, the object of the present invention is to provide a conductive film that can be easily pulled out even when wound into a roll, and a display device.

[0010] Technical solutions for solving technical problems

[0011] One aspect of the present invention provides a conductive film comprising: a substrate; a conductor disposed on a first surface of the substrate; a first resin layer disposed on the first surface of the substrate; and a second resin layer disposed on a second surface of the substrate opposite to the first surface, wherein at least one of the first resin layer and the second resin layer is a filler-containing resin layer containing resin and a plurality of filler particles, and when the filler-containing resin layer is viewed in cross-section, the filler-containing resin layer has a region in which two or more of the filler particles are present inside a square virtual face, the side length of the square being the average thickness of the filler-containing resin layer.

[0012] Another aspect of the present invention provides a display device having the above-described conductive film.

[0013] Invention Effects

[0014] According to the present invention, a conductive film that can be easily pulled out even when wound into a roll, and a display device, can be provided. Attached Figure Description

[0015] Figure 1 This is a plan view illustrating one embodiment of the conductive film of the present invention.

[0016] Figure 2 It is along Figure 1 A cross-sectional view of line II-II.

[0017] Figure 3 It is shown Figure 2 A magnified view of the area enclosed by the double-dotted line.

[0018] Figure 4 It is shown Figure 3 A magnified view of a portion of it.

[0019] Figure 5 It is shown Figure 1 A magnified view of a portion of it.

[0020] Figure 6 This is a cross-sectional view illustrating one embodiment of the display device of the present invention. Detailed Implementation

[0021] The embodiments of the present invention will now be described in detail. However, the present invention is not limited to the following embodiments.

[0022] <Conductive film>

[0023] First, refer to Figures 1-5 This section describes embodiments of the conductive film of the present invention. Figure 1 This is a plan view illustrating one embodiment of the conductive film of the present invention. Figure 2 It is along Figure 1 Cross-sectional view of line II-II, Figure 3 It is shown Figure 2 A magnified view of the region P enclosed by the double-dotted line. Figure 4 It is shown Figure 3 A magnified image of a portion. Figure 5 It is shown Figure 1 A magnified view of a portion of it.

[0024] The conductive film 20 comprises: a film-shaped substrate 1; a conductor 2 disposed on a first surface 1a of the substrate 1; a first resin layer 3 disposed on the first surface 1a of the substrate 1; and a second resin layer 4 disposed on a second surface 1b of the substrate 1 on the side opposite to the first surface 1a, wherein the first resin layer 3 contains resin 3a (see reference). Figure 1 and Figure 2 The second resin layer 4 is a filler-containing resin layer containing resin 4a and filler particles 4b (see reference). Figure 3 and Figure 4When the second resin layer 4 is viewed in cross-section, the second resin layer 4 has a region R in which more than two filler particles 4b are present inside the virtual face of a square in region R. The side length of the square is the average thickness T2 of the second resin layer 4 (refer to...). Figure 4 ).

[0025] A mesh-like trench 3b is formed in the first resin layer 3, and the conductor 2 is disposed within the trench 3b (see reference). Figure 2 and Figure 5 Thus, conductor 2 forms a mesh-like conductor pattern. Conductor 2 can also fill the trench 3b.

[0026] In addition, Figure 1 In the conductive film 20 shown, the conductor 2 is disposed near one of the short sides of the conductive film 20, but there is no particular limitation on the placement of the conductor 2, and the conductor 2 can also be disposed near the long side.

[0027] In the conductive film 20, the second resin layer 4 has a region R in which two or more filler particles 4b are present inside a square virtual face. The side length of the square is equal to the average thickness T2 of the second resin layer 4, and the filler particles 4b are present in a high proportion in the second resin layer 4. That is, the proportion of resin 4a in the second resin layer 4 is reduced. Therefore, even if the conductive film 20 is wound into a roll to make the second resin layer 4 adhere tightly to the first resin layer 3, the adhesion strength of the first resin layer 3 to the second resin layer 4 can be reduced. Therefore, when the conductive film 20 is pulled out later, the peel resistance of the conductive film 20 to the wound state can be improved, and the conductive film 20 can be easily pulled out. Furthermore, when the conductive film 20 is pulled out, it is possible to suppress the occurrence of defects in the first resin layer 3 due to a portion of the resin 3a of the first resin layer 3 following the second resin layer 4, or the occurrence of defects in the second resin layer 4 due to a portion of the resin 4a of the second resin layer 4 following the first resin layer 3. As a result, even when the conductive film 20 is assembled into a display device, it is possible to suppress the decrease in visibility in the display device caused by the aforementioned defects.

[0028] The conductive film 20 will be described in detail below.

[0029] (Substrate)

[0030] In this embodiment, the substrate 1 has a light-transmitting support film 11. The support film 11 has the required level of light transmittance when the conductive film 20 is assembled into the display device. Specifically, the total light transmittance of the support film 11 can be 90% to 100%. The haze of the support film 11 can be 0% to 5%.

[0031] The support film 11 can be, for example, a transparent resin film, including transparent resins such as polyethylene terephthalate (PET), polycarbonate (PC), polyethylene naphthalate (PEN), cyclic olefin polymer (COP), polymethyl methacrylate (PMMA), or polyimide (PI). The support film 11 can also be a glass substrate.

[0032] The support film 11 may include a main body 11a and inorganic filler particles 11b. The main body 11a may be the aforementioned transparent resin film or a glass substrate. The inorganic filler particles 11b may be uniformly dispersed within the support film 11 or may be biased towards the second resin layer 4 of the support film 11.

[0033] Here, at least a portion of the inorganic filler particles 11b may or may not be in contact with the filler particles 4b in the second resin layer 4. If they are in contact, the adhesion between the support film 11 and the second resin layer 4 can be further improved.

[0034] The inorganic filler particles 11b can be either insulating or conductive. Examples of inorganic filler particles 11b include silica filler particles, zirconium oxide filler particles, and titanium dioxide filler particles.

[0035] For example, such as Figure 2 As shown, the substrate 1 can also be a laminate having a support film 11 and an intermediate resin layer 12 and a base layer 13 sequentially disposed on the support film 11. The base layer 13 is a layer provided for forming the conductor 2 by chemical plating or the like. When the conductor 2 is formed by methods other than chemical plating, the base layer 13 is not necessarily required. The intermediate resin layer 12 may also be omitted between the support film 11 and the base layer 13.

[0036] The thickness of the support film 11 can be 10 μm or more, 20 μm or more, or 35 μm or more, and can be less than 500 μm, less than 200 μm, or less than 100 μm.

[0037] By providing an intermediate resin layer 12, the adhesion between the support film 11 and the base layer 13 can be improved. Even without a base layer 13, by providing the intermediate resin layer 12 between the support film 11 and the first resin layer 3, the adhesion between the support film 11 and the first resin layer 3 can be improved.

[0038] The intermediate resin layer 12 is a layer containing resin. The intermediate resin layer 12 may further contain inorganic fillers. Examples of resins constituting the intermediate resin layer 12 include acrylic resin. Examples of inorganic fillers include silica.

[0039] The thickness of the intermediate resin layer 12 can be, for example, 5 nm or more, 100 nm or more, or 200 nm or more, and can be less than 10 μm, less than 5 μm, or less than 2 μm.

[0040] The base layer 13 may be a layer containing a catalyst and a resin. The resin may be a cured product of a curable resin composition. Examples of curable resins included in a curable resin composition include acrylic resins, amino resins, cyanate resins, isocyanate resins, polyimide resins, epoxy resins, oxetane resins, polyesters, allyl resins, phenolic resins, benzoxazine resins, xylene resins, ketone resins, furan resins, COPNA resins, silicone resins, dicyclopentadiene resins, benzocyclobutene resins, episulfide resins, ene-thiol resins, polyoxymethylene resins, polyvinylbenzyl ether compounds, acenaphthylene, and UV-curable resins (which contain functional groups such as unsaturated double bonds, cyclic ethers, and vinyl ethers that undergo polymerization reactions due to ultraviolet light).

[0041] The catalyst contained in the substrate layer 13 can be an electroless plating catalyst. The electroless plating catalyst can be a metal selected from Pd, Cu, Ni, Co, Au, Ag, Rh, Pt, In, and Sn, or it can be Pd. Regarding the catalyst, one type can be used alone, or two or more types can be used in combination. Typically, the catalyst is dispersed in the resin as catalyst particles.

[0042] Based on the total amount of the substrate 13, the catalyst content in the substrate 13 can be more than 3% by mass, more than 4% by mass, or more than 5% by mass, and can be less than 50% by mass, less than 40% by mass, or less than 25% by mass.

[0043] The thickness of the substrate 13 can be above 10nm, above 20nm, or above 30nm, and can be below 500nm, below 300nm, or below 150nm.

[0044] (First resin layer)

[0045] The first resin layer 3 comprises a light-transmitting resin 3a. For example... Figure 2 As shown, the first resin layer 3 can form a flat surface with the conductor 2 disposed in the trench 3b. That is, the height of the surface of the first resin layer 3 (the side opposite to the substrate 1) from the first surface 1a of the substrate 1 can be the same as the height of the surface of the conductor 2 from the first surface 1a of the substrate 1. The height of the surface of the first resin layer 3 from the first surface 1a can also be lower or higher than the height of the surface of the conductor 2 from the first surface 1a.

[0046] The total light transmittance of the first resin layer 3 can be 90-100%. The haze of the first resin layer 3 can be 0-5%.

[0047] The difference between the refractive index of the support film 11 and the refractive index of the first resin layer 3 can be 0.2 or less. Therefore, when the conductive film 20 is assembled into the display device, it is easier to ensure good visibility of the displayed image. The refractive index (nd25) of the first resin layer 3 can be, for example, 1.0 or more, and can be 1.7 or less, 1.6 or less, or 1.5 or less. The refractive index can be measured using a reflective spectrophotometer.

[0048] The resin 3a contained in the first resin layer 3 may be a cured product of a curable resin composition (a light-curable resin composition or a thermosetting resin composition). The curable resin composition contains a curable resin. Examples of curable resins include acrylic resins, polyurethane resins, amino resins, cyanate ester resins, isocyanate ester resins, polyimide resins, epoxy resins, oxetane resins, polyesters, allyl resins, phenolic resins, benzoxazine resins, xylene resins, ketone resins, furan resins, COPNA resins, silicone resins, dicyclopentadiene resins, benzocyclobutene resins, cyclic sulfide resins, olefin-thiol resins, polyoxymethylene resins, polyvinylbenzyl ether compounds, acenaphthene, and ultraviolet-curable resins (which contain functional groups such as unsaturated double bonds, cyclic ethers, and vinyl ethers that undergo polymerization reactions due to ultraviolet light).

[0049] The average thickness T1 of the first resin layer 3 can be 0.5 μm or more, 0.8 μm or more, 1.0 μm or more, 1.5 μm or more, or 2.0 μm or more. If the average thickness T1 of the first resin layer 3 is 1.5 μm or more, the cross-sectional area of ​​the conductor 2 can be increased without increasing the width of the conductor 2, and the resistance of the conductor 2 can be effectively reduced.

[0050] The average thickness T1 of the first resin layer 3 can be less than 10 μm, less than 5 μm, less than 2 μm, less than 1 μm, less than 800 nm, less than 600 nm, less than 500 nm, or less than 400 nm.

[0051] (conductor)

[0052] Conductor 2 is disposed within a trench 3b formed in the first resin layer 3. For example... Figure 5 As shown, in this embodiment, since the trench 3b is formed into a mesh pattern, the conductor 2 disposed within the trench 3b also forms a mesh pattern. That is, the conductor 2 has multiple intersecting linear portions. The conductor 2 with the mesh pattern can function well, for example, as a radiating conductor of an antenna and a power supply line. Furthermore, in Figure 5In the diagram, the mesh pattern of conductor 2 is a regular pattern, but the mesh pattern can also be an irregular pattern.

[0053] The conductor 2 may further have a planar pattern disposed in an opening (not shown) formed separately from the trench 3b in the first resin layer 3. The planar pattern of the conductor 2 functions as a terminal and a grounding pad.

[0054] Conductor 2 may contain a metal. Conductor 2 may contain at least one metal selected from copper, nickel, cobalt, palladium, silver, gold, platinum, and tin, and may also contain copper. Conductor 2 may be a metal plating formed by a plating method. Within the range of maintaining appropriate conductivity, conductor 2 may further contain non-metallic elements such as phosphorus.

[0055] The conductor 2 can be a laminate composed of multiple layers. Furthermore, the surface layer of the conductor 2, which is the side opposite to the substrate 1, may further have a blackening layer. The blackening layer helps to improve the visibility of the display device on which the conductive film 20 is assembled. Additionally, the surface layer of the conductor 2, which is the side opposite to the substrate 1, may also have a blackening layer.

[0056] (Second resin layer)

[0057] The second resin layer 4 is disposed on the second surface 1b of the substrate 1. By providing the second resin layer 4, damage to the substrate 1 can be suppressed. The second resin layer 4 comprises resin 4a and filler particles 4b (see reference). Figure 3 and Figure 4 ).

[0058] Regarding the second resin layer 4, when a cross-section of the second resin layer 4, which is a filler-containing resin layer, is observed (i.e., when the cross-section of the second resin layer 4 is observed), the second resin layer 4 has a region R in which two or more filler particles 4b are present inside the virtual face of a square in the region R, and the side length of the square is the average thickness T2 of the second resin layer 4.

[0059] Here, the average thickness T2 (nm) refers to the average thickness of the second resin layer 4 measured at least three points using a SEM ruler within the field of view when observing the cross-section of the second resin layer 4.

[0060] Furthermore, "the presence of two or more filler particles 4b on the inner side of the surface" means that two or more filler particles 4b exist as a whole on the inner side of the surface.

[0061] Region R is defined by aligning one side with the thickness direction of the second resin layer 4 and the other side with the boundary line B between the second resin layer 4 and the substrate 1. Furthermore, region R is configured such that a filler particle 4b is housed inside the square virtual surface, and at least one other filler particle 4b is also present.

[0062] The cross-section of the second resin layer 4 refers to the cross-section along the thickness direction of the second resin layer 4.

[0063] The cross-section of the second resin layer 4 was observed using a scanning electron microscope (SEM).

[0064] In region R, there are multiple filler particles 4b, and the number of filler particles 4b can be two or more, or three or more. The more filler particles 4b there are, the higher the proportion of filler particles 4b in region R, and the easier it is to pull out the conductive film 20 when it is pulled out from its wound state. In region R, the number of filler particles 4b can be six or less, or five or less.

[0065] When observing the cross-section of the second resin layer 4, if multiple squares with a side length equal to the average thickness T2 of the second resin layer 4 can be set within the second resin layer 4, these squares are arranged in a row along the boundary line B between the second resin layer 4 and the substrate 1. In this case, the proportion r of the number of regions R among all the set squares can be 50% or more, 55% or more, or 60% or more. The larger this proportion r is, the easier it is to pull out the conductive film 20 when it is pulled out from its wound state.

[0066] The percentage r can be below 95%, below 90%, or below 85%.

[0067] Regarding the average particle size of filler particles 4b, there are no particular restrictions as long as the second resin layer 4 has region R. For example, it can be above 10nm, above 20nm, or above 50nm. If it is above 20nm, the surface of the second resin layer 4 becomes more uneven, and the surface sliding property is further improved.

[0068] The average particle size of the filler particles 4b can be less than 100nm, less than 80nm, or less than 70nm. When the value is less than 70nm, the proportion of resin 4a between adjacent filler particles 4b becomes smaller, and the surface sliding property is further improved.

[0069] The average particle size of filler particle 4b refers to the average length D1 of all filler particles 4b when the length D1 of the line segment of filler particle 4b that overlaps with the virtual line X (which extends in a direction orthogonal to the thickness direction of the second resin layer 4) is taken as the particle size of filler particle 4b at the center of the thickness direction of the second resin layer 4.

[0070] When the support membrane 11 has inorganic filler particles 11b, the average particle size of the filler particles 4b in the second resin layer 4 can be the same as or different from the average particle size of the inorganic filler particles 11b. When the average particle size of the filler particles 4b in the second resin layer 4 is different from the average particle size of the inorganic filler particles 11b, the adhesion between the support membrane 11 and the second resin layer 4 is improved. Here, the average particle size of the inorganic filler particles 11b refers to the average value of the maximum diameter d1 of all inorganic filler particles 11b when the maximum diameter d1 of the inorganic filler particles 11b that overlaps with the line X1 parallel to the above-mentioned virtual line X is taken as the particle size of the inorganic filler particles. Here, the maximum diameter d1 refers to the largest diameter among the diameters of the lines parallel to the above-mentioned line X1. The line X1 parallel to the above-mentioned virtual line X is the line that intersects all inorganic filler particles 11b, but when the line X1 does not intersect all inorganic filler particles 11b, the line that intersects with the most inorganic filler particles 11b is taken as line X1.

[0071] When the average particle size of the filler particles 4b in the second resin layer 4 is different from the average particle size of the inorganic filler particles 11b, and the average particle size of the filler particles 4b in the second resin layer 4 is smaller than the average particle size of the inorganic filler particles 11b, that is, when the ratio A0 of the average particle size of the filler particles 4b in the second resin layer 4 to the average particle size of the inorganic filler particles 11b is less than 1, the filling rate of the filler particles 4b can be increased without increasing the thickness of the second resin layer 4.

[0072] The ratio A0 mentioned above can be less than 0.8, less than 0.6, less than 0.4, or less than 0.2.

[0073] The ratio A0 mentioned above can be greater than 0.05, greater than 0.1, or greater than 0.15.

[0074] In region R, multiple filler particles 4b may or may not overlap in the thickness direction of the second resin layer 4. When they overlap, the hardness of the second resin layer 4 can be increased, which can further suppress damage to the substrate 1.

[0075] Furthermore, the term "overlapping" of multiple filler particles 4b means that when viewed in the thickness direction of the second resin layer 4, the multiple filler particles 4b overlap each other. The multiple filler particles 4b may or may not be in contact with each other.

[0076] In the second resin layer 4, in a direction orthogonal to the thickness direction of the second resin layer 4, the average distance between adjacent filler particles 4b can be less than the average particle size of the filler particles 4b, or it can be equal to or greater than the average particle size of the filler particles 4b. When the distance is less than the average particle size of the filler particles 4b, that is, when the ratio A1 of the average distance between the filler particles 4b to the average particle size of the filler particles 4b is less than 1, the gap between adjacent filler particles 4b becomes narrower, which reduces the proportion of resin 4a in the second resin layer 4, making it easier to pull out the conductive film 20 when it is pulled out from its wound state.

[0077] Here, the average distance between adjacent filler particles 4b refers to the average value of the line segment length G1 between all adjacent filler particles 4b when the line segment length G1 between adjacent filler particles 4b on the virtual line X (which extends in a direction orthogonal to the thickness direction of the second resin layer 4) is taken as the distance between adjacent filler particles 4b.

[0078] The ratio A1 mentioned above can be less than 0.8, less than 0.6, less than 0.4, or less than 0.2.

[0079] The ratio A1 mentioned above can be greater than 0.05, greater than 0.1, or greater than 0.15.

[0080] The proportion of filler particles 4b in the second resin layer 4 can be 10% by mass or more, 20% by mass or more, 30% by mass or more, 40% by mass or more, 50% by mass or more, or 60% by mass or more. When the proportion of filler particles 4b is 50% by mass or more, the slippage of the surface of the second resin layer 4 is improved, and the conductive film 20 can be easily pulled out when it is pulled out from its wound state.

[0081] The proportion of filler particles 4b in the second resin layer 4 can be less than 90% by mass, less than 80% by mass, or less than 70% by mass.

[0082] The average thickness T2 of the second resin layer 4 can be 5 nm or more, 10 nm or more, 20 nm or more, 30 nm or more, 40 nm or more, or 50 nm or more. When the average thickness T2 of the second resin layer 4 is 50 nm or more, the hardness of the second resin layer 4 increases, which can suppress damage to the substrate 1.

[0083] The average thickness T2 of the second resin layer 4 can be less than 10 μm, less than 5 μm, less than 2 μm, less than 1 μm, less than 800 nm, less than 600 nm, less than 500 nm, or less than 400 nm. When the average thickness T2 of the second resin layer 4 is less than 500 nm, the visibility of the display device on which the conductive film 20 is assembled can be improved.

[0084] The average thickness T2 of the second resin layer 4 can be less than the average thickness T1 of the first resin layer 3, or it can be equal to or greater than the average thickness T1 of the first resin layer 3. When it is less than the average thickness T1 of the first resin layer 3 (that is, the ratio A2 of the average thickness T2 of the second resin layer 4 to the average thickness T1 of the first resin layer 3 is less than 1), the deterioration of haze can be suppressed.

[0085] The ratio A2 mentioned above can be less than 0.8, less than 0.6, less than 0.4, or less than 0.2.

[0086] The ratio A2 mentioned above can be greater than 0.01, greater than 0.015, or greater than 0.02.

[0087] As resin 4a, the same resin as resin 3a contained in the first resin layer 3 can be used.

[0088] The filler particle 4b can be an inorganic filler particle. The filler particle 4b can be an insulating particle or a conductive particle.

[0089] Examples of inorganic filler particles include silica filler particles and zirconia filler particles.

[0090] The conductive film 20 can be manufactured by a method including, for example, a step of forming a pattern based on an imprinting method. An example of a method for manufacturing the conductive film 20 includes the following steps: preparing a substrate 1, wherein the substrate 1 has a support film 11 and an intermediate resin layer 12 and a base layer 13 sequentially disposed on a main surface of the support film 11; forming a curable resin layer on a first surface 1a (the surface on the side of the base layer 13) of the substrate 1; forming a first resin layer 3 by forming trenches 3b in the curable resin layer in a manner that exposes the base layer 13 using an imprinting method with a mold having protrusions; forming a conductor 2 disposed in the trenches 3b by chemical plating to grow metal plating from the base layer 13; and forming a second resin layer 4 on a second surface 1b of the substrate 1.

[0091] By curing the curable resin layer while the mold is pressed into it, the first resin layer 3 is formed with a pattern including grooves 3b (which have the reverse shape of the protrusions of the mold). The method for forming the first resin layer 3 is not limited to imprinting, and any method such as photolithography can be used.

[0092] The second resin layer 4 can be obtained by applying a resin composition containing resin 4a or its precursor and filler particles 4b onto the second surface 1b of the substrate 1 and heating it.

[0093] <Display Device>

[0094] Next, refer to Figure 6 This invention describes one embodiment of the display device. Figure 6 This is a cross-sectional view illustrating one embodiment of the display device of the present invention.

[0095] Figure 6 The display device 100 shown includes: an image display unit 10 having an image display area 10S, a conductive film 20, a polarizing plate 30, and a glass cover 40.

[0096] The conductive film 20, the polarizing plate 30, and the glass cover 40 are stacked sequentially on the image display area 10S side of the image display unit 10, starting from the image display unit 10 side.

[0097] The conductive film 20 functions, for example, as a planar transparent antenna. The display device 100 may be, for example, a liquid crystal display device or an organic EL display device. That is, the image display unit 10 may be, for example, a liquid crystal display unit or an organic EL display unit.

[0098] In the conductive film 20, the first resin layer 3 can be disposed on the polarizing plate 30 side, and the second resin layer 4 can be disposed on the image display section 10 side.

[0099] The structure of the display device is not limited to Figure 6 The form of the polarizing plate 30 can be modified as needed. For example, the polarizing plate 30 can also be disposed between the image display unit 10 and the conductive film 20. The polarizing plate 30 and the glass cover 40 can be polarizing plates and glass covers commonly used in display devices. The polarizing plate 30 and the glass cover 40 are not strictly necessary.

[0100] The display device 100 has a conductive film 20. According to the conductive film 20, when the conductive film 20 is pulled out and wound into a roll, it is possible to suppress defects in the first resin layer 3 caused by a portion of resin from the first resin layer 3 following the second resin layer 4, or defects in the second resin layer 4 caused by a portion of resin 4a from the second resin layer 4 following the first resin layer 3. Therefore, the display device 100 with this conductive film 20 can suppress the decrease in visibility caused by defects in the first resin layer 3 or the second resin layer 4.

[0101] The present invention is not limited to the embodiments described above. For example, in the above embodiments, the second resin layer 4 is a filler-containing resin layer; however, the first resin layer 3 may also be a filler-containing resin layer (the same as the second resin layer 4), or the second resin layer 4 may not be a filler-containing resin layer, while the first resin layer 3 is a filler-containing resin layer.

[0102] Furthermore, in the above embodiments, the conductive film 20 has a conductor 2 on the first surface 1a of the substrate 1, but it may also have a conductor 2 on the second surface 1b of the substrate 1. Alternatively, the conductor 2 may not be present on the first surface 1a of the substrate 1, but may be present on the second surface 1b of the substrate 1.

[0103] The general outline of this invention is as follows.

[0104] [1] A conductive film, wherein,

[0105] have:

[0106] Substrate;

[0107] A conductor disposed on the first surface of the substrate;

[0108] A first resin layer disposed on a first surface of the substrate; and

[0109] A second resin layer disposed on the second surface of the substrate.

[0110] At least one of the first resin layer and the second resin layer is a filler-containing resin layer containing resin and a plurality of filler particles.

[0111] When the filler-containing resin layer is observed in cross section, the filler-containing resin layer has a region in which more than two filler particles are present inside a square virtual face, the side length of which is the average thickness of the filler-containing resin layer.

[0112] [2] According to the conductive film of [1], wherein the filler-containing resin layer has a portion in which a plurality of the filler particles overlap in its thickness direction.

[0113] [3] According to the conductive film of [1] or [2], wherein, in a direction orthogonal to the thickness direction of the filler-containing resin layer, the average distance between adjacent filler particles among the plurality of filler particles is less than the average particle size of the filler particles.

[0114] [4] The conductive film according to any one of [1] to [3], wherein the filler-containing resin layer is the second resin layer.

[0115] [5] The conductive film according to any one of [1] to [4], wherein the thickness of the second resin layer is less than the thickness of the first resin layer.

[0116] [6] The conductive film according to any one of [1] to [5], wherein the substrate has a support film, and the support film has inorganic filler particles on the second side of the substrate.

[0117] At least a portion of the inorganic filler particles are in contact with the filler particles in the filler-containing resin layer.

[0118] [7] According to the conductive film of [6], the average particle size of the filler particles in the second resin layer is different from the average particle size of the inorganic filler particles.

[0119] [8] According to the conductive film of [7], wherein the average particle size of the filler particles in the second resin layer is smaller than the average particle size of the inorganic filler particles.

[0120] [9] The conductive film according to any one of [1] to [8], wherein the first resin layer has a trench penetrating the first resin layer.

[0121] The conductor is disposed within the trench.

[0122]

[10] According to the conductive film of [9], wherein the trenches form a mesh pattern.

[0123] The conductor is arranged within the pattern.

[0124]

[11] A display device comprising any one of [1] to

[10] a conductive film.

[0125] Explanation of reference numerals in the attached figures

[0126] 1: Substrate, 1a: First surface, 1b: Second surface, 2: Conductor, 3: First resin layer, 3b: Groove, 4: Second resin layer, 4a: Resin, 4b: Filler particles, 11b: Inorganic filler particles, 20: Conductive film, 100: Display device, R: Area, T1: Thickness of the first resin layer, T2: Thickness of the second resin layer, X: Virtual line, X1: Line parallel to the virtual line.

Claims

1. A conductive film, wherein, have: Substrate; A conductor disposed on the first surface of the substrate; A first resin layer disposed on a first surface of the substrate; and A second resin layer disposed on the second surface of the substrate. At least one of the first resin layer and the second resin layer is a filler-containing resin layer containing resin and a plurality of filler particles. When the filler-containing resin layer is observed in cross section, the filler-containing resin layer has a region in which more than two filler particles are present inside a square virtual face, the side length of which is the average thickness of the filler-containing resin layer.

2. The conductive film according to claim 1, wherein, The filler-containing resin layer has a portion in which a plurality of the filler particles overlap in its thickness direction.

3. The conductive film according to claim 1, wherein, In a direction orthogonal to the thickness direction of the filler-containing resin layer, the average distance between adjacent filler particles among the plurality of filler particles is less than the average particle size of the filler particles.

4. The conductive film according to claim 1, wherein, The filler-containing resin layer is the second resin layer.

5. The conductive film according to claim 1, wherein, The thickness of the second resin layer is less than the thickness of the first resin layer.

6. The conductive film according to claim 1, wherein, The substrate has a support film, and the support film has inorganic filler particles on the second side of the substrate. At least a portion of the inorganic filler particles are in contact with the filler particles in the filler-containing resin layer.

7. The conductive film according to claim 6, wherein, The average particle size of the filler particles in the second resin layer is different from the average particle size of the inorganic filler particles.

8. The conductive film according to claim 7, wherein, The average particle size of the filler particles in the second resin layer is smaller than the average particle size of the inorganic filler particles.

9. The conductive film according to claim 1, wherein, The first resin layer has a groove penetrating the first resin layer. The conductor is disposed within the trench.

10. The conductive film according to claim 9, wherein, The grooves form a mesh pattern. The conductor is arranged within the pattern.

11. A display device, wherein, The conductive film comprising any one of claims 1 to 10.

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