electronic device

Abstract

The present application provides an electronic device (1) comprising: a bulk (2); an internal conductor (10) disposed in the bulk (2); a plurality of terminal electrodes disposed on a main surface (2d) of the bulk (2), the plurality of terminal electrodes being electrically connected to the internal conductor (10), and each of the plurality of terminal electrodes having a plating layer M on a surface thereof; a non-conducting electrode (8) disposed on the main surface (2d) of the bulk (2) and having a plating layer M on a surface thereof; and a dummy electrode (9) disposed on a side surface (2f) of the bulk (2), wherein the non-conducting electrode (8) is electrically connected to the dummy electrode (9).

Description

Technical Field

[0001] This invention relates to an electronic device. Background Technology

[0002] Patent document 1 discloses an electronic device comprising: a body formed by stacking ferrite layers, a coil conductor composed of a conductor layer stacked in the body, and a pair of end electrodes disposed on the mounting surface of the body and electrically connected to one end of the coil conductor.

[0003] Existing technical documents Patent documents Patent Document 1: Japanese Patent Application Publication No. 2019-125605 Summary of the Invention

[0004] (a) Technical problems to be solved The end electrode has a sintered layer and a plating layer formed on the sintered layer. The plating layer is formed by electroplating. When the plating layer is formed by electroplating, if the deposition rate of the plating layer is slow, the substrate will be immersed in the plating solution for a long time until the plating layer reaches the specified thickness. If the substrate is immersed in the plating solution for a long time, the substrate is prone to damage due to the corrosion of the substrate (surface side) by the plating solution. In the configuration where the end electrode is placed on the mounting surface, since the end electrode is only placed on one side of the substrate, it is difficult to establish an electron supply path from the cathode electrode to the end electrode during electroplating, and the deposition rate of the plating layer is slowed down. Therefore, in the configuration where the end electrode is placed on the mounting surface, the slower deposition rate of the plating layer leads to the substrate being immersed in the plating solution for a long time, which in turn makes the substrate prone to damage.

[0005] One aspect of the present invention is to provide an electronic device that can shorten the deposition time of the coating when the coating is formed by electroplating.

[0006] (II) Technical Solution (1) An electronic device of one side of the present invention comprises: a body having a mounting surface and a main surface opposite to each other, and four sides connecting the mounting surface and the main surface; an internal conductor disposed within the body; a plurality of end electrodes disposed on the mounting surface of the body, the plurality of end electrodes being electrically connected to the internal conductor, and each of the plurality of end electrodes having a plating layer on its surface; a non-conductive electrode disposed on the mounting surface of the body and having a plating layer on its surface; and a side electrode disposed on one of the four sides, wherein the non-conductive electrode is electrically connected to the side electrode.

[0007] The electronic device of the present invention comprises: a non-conductive electrode disposed on a mounting surface of a substrate, and a side electrode disposed on one of the four sides. In the electronic device, the non-conductive electrode and the side electrode are electrically connected. In this configuration, the non-conductive electrode disposed on the mounting surface is electrically connected to the side electrode disposed on one side, thus, during the manufacturing process of the electronic device, when plating is deposited on the terminal electrodes and the non-conductive electrode, an electron path is formed from the side electrode to the non-conductive electrode. Consequently, electrons are also supplied to the multiple terminal electrodes disposed on the mounting surface along with the non-conductive electrode. Therefore, during electroplating, it is easy to establish an electron supply path from the cathode electrode to the terminal electrode. Therefore, when a plating layer is formed by electroplating, the deposition time of the plating layer can be shortened.

[0008] (2) In the electronic device described in (1) above, one side can be the side closest to the non-conductive electrode. If the connection structure between the side electrode disposed on one side and the non-conductive electrode becomes complicated, the connection structure will deviate. If the connection structure deviates, the deposition rate of the plating layer may also deviate. In the above configuration, the complexity of the connection structure between the side electrode disposed on one side and the non-conductive electrode can be avoided. Therefore, the deviation in plating deposition caused by the deviation in the connection structure between the side electrode and the non-conductive electrode can be suppressed.

[0009] (3) In the electronic device described in (1) or (2) above, the side electrode can be positioned close to the mounting surface on one side, in the direction opposite to the main surface. In this configuration, since the side electrode and the non-conductive electrode are positioned close together, space-saving structures for connecting the side electrode and the non-conductive electrode can be achieved. This allows for efficient utilization of the space within the device, thus increasing the design freedom of the internal conductors.

[0010] (4) In any of the electronic devices described in (1) to (3) above, when viewed from the direction opposite to the mounting surface and the main surface, at least a portion of the internal conductor and the non-conductive electrode can overlap. In this configuration, since the space overlapping with the non-conductive electrode can be effectively utilized in the aforementioned opposite direction, the design freedom of the internal conductor can be improved.

[0011] (5) In any of the electronic devices described in (1) to (4) above, the non-conductive electrode and the side electrode may have different areas. In this configuration, the area of ​​the side electrode can be set according to the desired plating thickness.

[0012] (6) In any of the electronic devices described in (1) to (5) above, multiple side electrodes may be provided, and the non-conductive electrode is electrically connected to each of the multiple side electrodes. In this configuration, since the multiple side electrodes are in contact with the plating solution, an electronic path from the side electrodes to the non-conductive electrode can be formed more reliably.

[0013] (7) In any of the above (1) to (6), the electronic device may have a plurality of non-conductive electrodes and a plurality of side electrodes, and each of the plurality of non-conductive electrodes is electrically connected to each of the plurality of side electrodes.

[0014] (8) In any of the electronic devices described in (1) to (7) above, at least a portion of the side electrode can protrude outward from one side. In this configuration, the side electrode can easily come into contact with the plating solution. Therefore, an electronic path from the side electrode to the non-conductive electrode can be formed more reliably.

[0015] (9) In any of the electronic devices mentioned in (1) to (8) above, the non-conducting electrode may not be electrically connected to the internal conductor and may not be physically connected to the internal conductor.

[0016] (10) In any of the above (1) to (8), the internal conductor may include a pair of capacitor conductors constituting a capacitor, and the non-conducting electrode is electrically connected to one of the capacitor conductors of the pair of capacitor conductors.

[0017] (III) Beneficial Effects According to one aspect of the present invention, it is possible to shorten the deposition time of the coating when the coating is formed by electroplating. Attached Figure Description

[0018] Figure 1 (a) and Figure 1 (b) is a perspective view of an electronic device in one embodiment.

[0019] Figure 2 A diagram illustrating the configuration of the terminal electrodes.

[0020] Figure 3 (a) is viewed from one side. Figure 1 The diagram shows the electronic devices shown. Figure 3 (b) is viewed from one end face side. Figure 1 The diagram shows the electronic device.

[0021] Figure 4 A diagram illustrating the general outline of electroplating.

[0022] Figure 5 (a) is a diagram showing the electronic device of another embodiment viewed from one side. Figure 5 (b) is a diagram showing the electronic device of another embodiment viewed from one end face.

[0023] Figure 6 (a) and Figure 6(b) is a diagram showing the electronic device of another embodiment viewed from one side.

[0024] Figure 7 A diagram showing the electronic device of another implementation scheme viewed from one side.

[0025] Figure 8 (a) is a diagram showing the electronic device of another embodiment viewed from one side. Figure 8 (b) is a diagram showing the electronic device of another embodiment viewed from one end face. Detailed Implementation

[0026] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. Furthermore, in the description of the drawings, the same or equivalent elements are labeled with the same reference numerals, and repeated descriptions are omitted.

[0027] Figure 1 (a) and Figure 1 (b) is a perspective view of the electronic device in one embodiment. Figure 1 (a) and Figure 1 As shown in (b), the electronic device 1 includes a body 2, a first terminal electrode 3, a second terminal electrode 4, a third terminal electrode 5, a fourth terminal electrode 6 and a fifth terminal electrode 7, a non-conductive electrode 8 and a virtual electrode (side electrode) 9.

[0028] Substance 2 is rectangular parallelepiped in shape. The rectangular parallelepiped shape includes both cuboids with chamfered corners and edges, and cuboids with rounded corners and edges. Substance 2 has a pair of end faces 2a and 2b; a pair of main faces 2c and 2d; and a pair of side faces 2e and 2f as its outer surfaces. End faces 2a and 2b are opposite each other. Main faces 2c and 2d are opposite each other. Side faces 2e and 2f are opposite each other. Hereinafter, the direction in which end faces 2a and 2b are opposite each other is designated as the first direction D1, the direction in which main faces 2c and 2d are opposite each other is designated as the second direction D2, and the direction in which side faces 2e and 2f are opposite each other is designated as the third direction D3. The first direction D1, the second direction D2, and the third direction D3 are approximately orthogonal to each other.

[0029] End faces 2a and 2b extend along a second direction D2, connecting to main faces 2c and 2d. End faces 2a and 2b also extend along a third direction D3, connecting to side faces 2e and 2f. Main faces 2c and 2d extend along a first direction D1, connecting to end faces 2a and 2b. Main faces 2c and 2d also extend along a third direction D3, connecting to side faces 2e and 2f. Side faces 2e and 2f extend along a first direction D1, connecting to end faces 2a and 2b. Side faces 2e and 2f also extend along a second direction D2, connecting to main faces 2c and 2d.

[0030] Main surface 2d is the mounting surface. For example, when mounting electronic device 1 to other electronic devices (e.g., circuit substrates or stacked electronic devices), main surface 2d is the surface opposite to the other electronic devices. End surfaces 2a and 2b are continuous surfaces starting from the mounting surface (i.e., main surface 2d). A mark IM is provided on main surface 2c. The mark IM indicates the orientation and direction of electronic device 1. Alternatively, the mark IM may not be provided.

[0031] The length of the first direction D1 of the substrate 2 is longer than the length of the second direction D2 and the length of the third direction D3 of the substrate 2. The length of the second direction D2 of the substrate 2 is shorter than the length of the third direction D3 of the substrate 2. That is, in this embodiment, the end faces 2a and 2b, the main faces 2c and 2d, and the side faces 2e and 2f are rectangular. The length of the second direction D2 of the substrate 2 can be equal to or longer than the length of the third direction D3 of the substrate 2.

[0032] In addition, in this embodiment, "equivalent" can also refer to values ​​that include minor differences or manufacturing errors within a predetermined range, in addition to being equal. For example, if multiple values ​​are contained within ±5% of the average of the multiple values, then the multiple values ​​are defined as equivalent.

[0033] The base body 2 is formed by stacking multiple insulating layers (not shown) in the second direction D2. That is, the stacking direction of the base body 2 is the second direction D2. In the actual base body 2, the multiple insulating layers can be integrated to the extent that their interlayer boundaries are not distinguishable, or they can be integrated in a way that makes the interlayer boundaries distinguishable.

[0034] The insulating layer is, for example, composed of a sintered body of a ceramic green sheet containing a dielectric material. The dielectric material includes, for example, at least one selected from BaTiO3-based materials, Ba(Ti,Zr)O3-based materials, (Ba,Ca)TiO3-based materials, glass materials, or alumina materials.

[0035] First end electrode 3, second end electrode 4, third end electrode 5, fourth end electrode 6, and fifth end electrode 7 are respectively disposed on the substrate 2. First end electrode 3, second end electrode 4, third end electrode 5, fourth end electrode 6, and fifth end electrode 7 are respectively disposed on the main surface 2d of substrate 2. First end electrode 3, second end electrode 4, and third end electrode 5 are disposed near the side surface 2e. Fourth end electrode 6 and fifth end electrode 7 are disposed near the side surface 2f.

[0036] The first end electrode 3 is located on the end face 2a side, and the third end electrode 5 is located on the end face 2b side. The second end electrode 4 is located between the first end electrode 3 and the third end electrode 5 in the first direction D1. The fourth end electrode 6 is located on the end face 2a side, and the fifth end electrode 7 is located on the end face 2b side. The first end electrode 3 and the fourth end electrode 6 are arranged opposite each other in the third direction D3. The third end electrode 5 and the fifth end electrode 7 are arranged opposite each other in the third direction D3.

[0037] The first end electrode 3, the second end electrode 4, the third end electrode 5, the fourth end electrode 6, and the fifth end electrode 7 are all rectangular in shape. They are arranged with each side along either a first direction D1 or a third direction D3. The first end electrode 3, the second end electrode 4, the third end electrode 5, the fourth end electrode 6, and the fifth end electrode 7 protrude from the main surface 2d. That is, in this embodiment, the surfaces of each of the first end electrode 3, the second end electrode 4, the third end electrode 5, the fourth end electrode 6, and the fifth end electrode 7 are not concentric with the main surface 2d.

[0038] The non-conductive electrode 8 is disposed on the main surface 2d of the substrate 2. The non-conductive electrode 8 is disposed near the side surface 2f. The non-conductive electrode 8 is located between the fourth end electrode 6 and the fifth end electrode 7 in the first direction D1. The second end electrode 4 and the non-conductive electrode 8 are disposed opposite each other in the third direction D3.

[0039] The non-conductive electrode 8 is rectangular in shape. The non-conductive electrode 8 is arranged with each side along either a first direction D1 or a third direction D3. The non-conductive electrode 8 protrudes from its main surface 2d. That is, in this embodiment, the surface of the non-conductive electrode 8 and the main surface 2d are not on the same plane. In this embodiment, the non-conductive electrode 8 has the same configuration (shape and size) as the first terminal electrode 3, the second terminal electrode 4, the third terminal electrode 5, the fourth terminal electrode 6, and the fifth terminal electrode 7, respectively.

[0040] Figure 2 A diagram illustrating the configuration of the terminal electrodes. (See diagram below.) Figure 2 As shown, the first terminal electrode 3, the second terminal electrode 4, the third terminal electrode 5, the fourth terminal electrode 6, the fifth terminal electrode 7, and the non-conductive electrode 8 each have a sintered electrode E and a plating layer M. The sintered electrode E is made of a conductive material (e.g., Cu). The plating layer M is formed on the sintered electrode E by electroplating. The plating layer M may contain, for example, Ni, Sn, Au, etc. The plating layer M may have, for example, a Ni plating film containing Ni and covering the first terminal electrode 3, the second terminal electrode 4, the third terminal electrode 5, the fourth terminal electrode 6, the fifth terminal electrode 7, and the non-conductive electrode 8, and an Au plating film containing Au and covering the Ni plating film.

[0041] A virtual electrode 9 is disposed on the side surface 2f of the substrate 2. In this embodiment, the virtual electrode 9 is disposed on the side surface 2f at the center in the first direction D1 and near the main surface 2d in the second direction D2. The virtual electrode 9 is rectangular in shape. The virtual electrode 9 protrudes from the side surface 2f. That is, in this embodiment, the surface of the virtual electrode 9 is not in the same plane as the side surface 2f. The virtual electrode 9 is the same as each of the electrodes of the first end electrode 3, the second end electrode 4, the third end electrode 5, the fourth end electrode 6, the fifth end electrode 7, and the non-conductive electrode 8, and has a sintered electrode E and a plating layer M.

[0042] Figure 3 (a) is viewed from one side. Figure 1 The diagram shows the electronic device 1. Figure 3 (b) is viewed from one end face side. Figure 1 The diagram shows electronic device 1. Figure 3 (a) and Figure 3 As shown in (b), an internal conductor 10 is disposed within the body 2. The internal conductor 10, for example, when viewed from the second direction D2, may overlap at least a portion of each of the first terminal electrode 3, the second terminal electrode 4, the third terminal electrode 5, the fourth terminal electrode 6, the fifth terminal electrode 7, and the non-conductive electrode 8. The internal conductor 10 may be a coil conductor, a capacitor conductor, a grounding conductor, a connecting conductor (via conductor, through-hole conductor), etc. The internal conductor 10 may contain multiple conductors (patterns). The internal conductor 10 may be appropriately designed according to the function of the electronic device 1 (filter, etc.).

[0043] In this embodiment, the internal conductor 10 can be directly or indirectly electrically connected to the first terminal electrode 3, the second terminal electrode 4, the third terminal electrode 5, the fourth terminal electrode 6, and the fifth terminal electrode 7. The first terminal electrode 3, the second terminal electrode 4, the third terminal electrode 5, the fourth terminal electrode 6, and the fifth terminal electrode 7 can be input terminals, output terminals, or ground terminals. In this embodiment, the non-conductive electrode 8 is neither electrically connected to nor physically connected to the internal conductor 10. That is, the non-conductive electrode 8 is an electrode electrically isolated from the internal conductor 10. Viewed from the second direction D2, at least a portion of the non-conductive electrode 8 overlaps with a portion of the internal conductor 10. That is, relative to the non-conductive electrode 8, the internal conductor 10 is positioned on the main surface 2c side.

[0044] The virtual electrode 9 is electrically connected to the non-conductive electrode 8. The side 2f of the body 2 on which the virtual electrode 9 is disposed is the side closest to the non-conductive electrode 8. "Closest" means that when the main surface 2d is viewed from the second direction D2, the distance between the non-conductive electrode 8 and the side is the shortest.

[0045] The non-conductive electrode 8 and the dummy electrode 9 are connected by a connecting conductor 11. The connecting conductor 11 is configured to include a first connecting conductor 11A and a second connecting conductor 11B. The first connecting conductor 11A extends in the second direction D2. The first connecting conductor 11A is, for example, composed of multiple via conductors. One end of the first connecting conductor 11A is connected to the non-conductive electrode 8. The other end of the first connecting conductor 11A is connected to the second connecting conductor 11B. The second connecting conductor 11B is plate-shaped. The second connecting conductor 11B extends, for example, in the third direction D3. One end of the second connecting conductor 11B is exposed on the side 2f and connected to the dummy electrode 9.

[0046] In this embodiment, the non-conductive electrode 8 and the virtual electrode 9 have different areas. The area of ​​the non-conductive electrode 8 observed from the second direction D2 is different from the area of ​​the virtual electrode 9 observed from the third direction D3. In this embodiment, the area of ​​the virtual electrode 9 is larger than the area of ​​the non-conductive electrode 8. In other words, the area of ​​the non-conductive electrode 8 is smaller than the area of ​​the virtual electrode 9. The area of ​​the non-conductive electrode 8 can be the same as or different from the areas of each of the first terminal electrode 3, the second terminal electrode 4, the third terminal electrode 5, the fourth terminal electrode 6, and the fifth terminal electrode 7. In this embodiment, the area of ​​the non-conductive electrode 8 is the same as the area of ​​each of the first terminal electrode 3, the second terminal electrode 4, the third terminal electrode 5, the fourth terminal electrode 6, and the fifth terminal electrode 7. The area of ​​the virtual electrode 9 can be appropriately set according to the thickness of the coating M.

[0047] Next, the manufacturing method of electronic device 1 will be described.

[0048] An insulating resin and solvent are mixed to prepare a slurry. The prepared slurry is then applied to a substrate (such as a PET film) using a doctor blade coating method to form a green sheet that serves as an insulating layer.

[0049] Through-holes are formed on the green sheet at predetermined locations for via conductors using laser processing. Next, conductive paste is filled into the through-holes of the green sheet. The conductive paste is made by mixing conductive metal powder and binder resin, etc. Then, a conductor serving as the internal conductor 10 and the second connecting conductor 11B is placed on the green sheet. This conductor is formed, for example, by printing conductive paste using screen printing. At this time, the conductor is connected to the conductive paste within the through-hole.

[0050] Next, green wafers are laminated. Here, multiple green wafers, each containing a conductor, are peeled from the substrate and laminated, with pressure applied in the lamination direction to form a laminate. Then, the laminate of green wafers is cut into chips of a specified size using a cutting machine to obtain green wafer blanks. Next, the green wafer blanks are fired. Through firing, the binder resin contained in each part is removed (decomposed).

[0051] Next, conductive paste is printed into the green chip at predetermined locations for forming the first terminal electrode 3, the second terminal electrode 4, the third terminal electrode 5, the fourth terminal electrode 6, the non-conductive electrode 8, the fifth terminal electrode 7, and the dummy electrode 9, for example, by screen printing. Then, the green chip with the conductive paste printed on it is sintered. This forms the sintered electrode E on the substrate 2.

[0052] Finally, the sintered electrode E is plated to form a plating layer M. Through the above processes, the electronic device 1 is obtained. In this embodiment, the plating layer M is formed by electroplating. Figure 4 A diagram illustrating the general outline of electroplating. (See diagram below.) Figure 4 As shown, electroplating is performed using a barrel plating apparatus 100. The barrel plating apparatus 100 includes a plating bath 102, a plating roller 103, an anode electrode 104, and a cathode electrode 105.

[0053] Plating solution R is contained in plating bath 102. Various plating solutions can be used for plating solution R. The amount of plating solution R is only required to be at least enough to immerse all the chip devices W contained in the plating roller 103. The chip devices W are the objects to be plated, which are the substrates 2 with sintered electrodes E formed on them.

[0054] The plating roller 103 is rotatably disposed within the plating bath 102. The plating roller 103 rotates, for example, counterclockwise. The plating roller 103 is driven to rotate by a motor (not shown).

[0055] An anode electrode 104 is disposed within a plating bath 102. The anode electrode 104 is connected to a power supply 110 via a wire 107. A cathode electrode 105 is held by an electrode holding part 106. The cathode electrode 105 is disposed at the front end of the electrode holding part 106. The cathode electrode 105 is connected to the power supply 110 via a wire 108.

[0056] If a voltage is applied between the anode electrode 104 and the cathode electrode 105 outside the plating roller 103 located in the plating bath 102 via the power supply 110, each chip device W inside the plating roller 103 is energized via the cathode electrode 105 and its surface is plated. In the chip device W, in addition to the sintered electrodes E of the first end electrode 3, second end electrode 4, third end electrode 5, fourth end electrode 6, non-conductive electrode 8, and fifth end electrode 7 disposed on the main surface 2d of the substrate 2, a sintered electrode E of a virtual electrode 9 is also disposed on the side surface 2f of the substrate 2. Through the sintered electrode E of the virtual electrode 9, the supply path of electrons supplied by the cathode electrode 105 is easily established. Thus, electrons are supplied from the virtual electrode 9 to the non-conductive electrode 8 via the connecting conductor 11.

[0057] As described above, the electronic device 1 of this embodiment includes a non-conductive electrode 8 disposed on the main surface 2d of the substrate 2 and a virtual electrode 9 disposed on the side surface 2f of the substrate 2. The non-conductive electrode 8 and the virtual electrode 9 are electrically connected via a connecting conductor 11. In this configuration, the non-conductive electrode 8 disposed on the main surface 2d of the substrate 2 and the virtual electrode 9 disposed on the side surface 2f are electrically connected. Therefore, during the manufacturing process of the electronic device 1, when the plating layer M of the first terminal electrode 3, the second terminal electrode 4, the third terminal electrode 5, the fourth terminal electrode 6, the fifth terminal electrode 7, and the non-conductive electrode 8 of the electronic device 1 is deposited, an electron path from the virtual electrode 9 to the non-conductive electrode 8 can be formed. Consequently, electrons are also supplied to the first terminal electrode 3, the second terminal electrode 4, the third terminal electrode 5, the fourth terminal electrode 6, and the fifth terminal electrode 7 disposed on the main surface 2d along with the non-conductive electrode 8. Therefore, during electroplating, it is easy to establish an electron supply path from the cathode electrode 105 to the first terminal electrode 3, the second terminal electrode 4, the third terminal electrode 5, the fourth terminal electrode 6, and the fifth terminal electrode 7. Thus, the deposition time of the coating M can be shortened when the coating M is formed by electroplating. As a result, prolonged immersion of the substrate 2 in the plating solution R can be avoided, thereby preventing the plating solution R from corroding the substrate 2 (the surface side of the substrate 2). Therefore, damage to the substrate 2 can be suppressed.

[0058] In the electronic device 1 of this embodiment, the side 2f of the body 2 where the virtual electrode 9 is disposed is the side closest to the non-conductive electrode 8. If the connection structure between the virtual electrode 9 and the non-conductive electrode 8 becomes complex, deviations will occur in the connection structure. If deviations occur in the connection structure, the deposition rate of the plating layer may deviate. The above configuration can avoid complicating the connection structure (connecting conductor 11) between the virtual electrode 9 and the non-conductive electrode 8. Therefore, deviations in plating layer deposition caused by deviations in the connection structure between the virtual electrode 9 and the non-conductive electrode 8 can be suppressed.

[0059] In the electronic device 1 of this embodiment, the virtual electrode 9 is disposed on the side 2f of the substrate 2, near the main surface 2d in the second direction D2. In this configuration, the virtual electrode 9 and the non-conductive electrode 8 are disposed close together, thus enabling space-saving in the structure (connecting conductor 11) that electrically connects the virtual electrode 9 and the non-conductive electrode 8. This effectively utilizes the space within the substrate 2, thereby increasing the design freedom of the internal conductor 10.

[0060] In the electronic device 1 of this embodiment, when viewed from the second direction D2, the internal conductor 10 overlaps with at least a portion of the non-conductive electrode 8. This configuration can effectively utilize the space overlapping with the non-conductive electrode 8 in the second direction D2, thereby increasing the design freedom of the internal conductor 10.

[0061] In the electronic device 1 of this embodiment, the areas of the non-conductive electrode 8 and the virtual electrode 9 can be different. In this configuration, the area of ​​the virtual electrode 9 can be set according to the desired thickness of the plating layer M.

[0062] In the electronic device 1 of this embodiment, the virtual electrode 9 is disposed on the side 2f of the substrate 2, so the position of the mark IM can be freely set on the main surface 2c of the substrate 2.

[0063] The embodiments of the present invention have been described above, but the present invention is not limited to the above embodiments and various modifications can be made without departing from its spirit.

[0064] In the above embodiment, an example is described where the virtual electrode 9 is electrically connected to the non-conductive electrode 8, and the non-conductive electrode 8 is neither electrically nor physically connected to the internal conductor 10. However, the non-conductive electrode 8 may also be connected to a portion of the internal conductor 10.

[0065] Figure 5 (a) is a diagram showing the electronic device of another embodiment viewed from one side. Figure 5 (b) is a diagram showing the electronic device of another embodiment viewed from one end face. Figure 5 (a) and Figure 5 As shown in (b), the electronic device 1 has a capacitor C. The capacitor C is composed of a pair of capacitor conductors 12 and 13 contained in the internal conductor 10. The non-conducting electrode 8 is electrically connected to capacitor conductor 12 of the pair of capacitor conductors 12 and 13.

[0066] The above embodiment is illustrated by taking a scheme in which a virtual electrode 9 is disposed on the side surface 2f of the substrate 2 as an example. However, the virtual electrode 9 can be disposed on at least one of the end faces 2a and 2b and the side surfaces 2e and 2f of the substrate 2.

[0067] In the above embodiment, an example is given where the virtual electrode 9 is positioned on the side surface 2f of the substrate 2 near the main surface 2d. However, the position of the virtual electrode 9 is not limited. The virtual electrode 9 can also be positioned arbitrarily on the side surface 2f (end surfaces 2a, 2b; side surface 2e).

[0068] The above embodiment is illustrated by an example where a non-conductive electrode 8 is disposed on the main surface 2d and a virtual electrode 9 is disposed on the side surface 2f of the substrate 2. However, multiple non-conductive electrodes 8 and virtual electrodes 9 may also be disposed. For example, as shown in... Figure 6As shown in (a), there are two non-conductive electrodes 8 and two dummy electrodes 9. In this configuration, one non-conductive electrode 8 is electrically connected to one dummy electrode 9, and the other non-conductive electrode 8 is electrically connected to the other dummy electrode 9.

[0069] In addition, it can also be like Figure 6 The configuration shown in (b) has two non-conductive electrodes 8 and a dummy electrode 9. In this configuration, the two non-conductive electrodes 8 and 8 are electrically connected to the dummy electrode 9.

[0070] In addition, it can also be like Figure 7 The configuration shown includes a non-conductive electrode 8 and two dummy electrodes 9. In this configuration, the non-conductive electrode 8 is electrically connected to the two dummy electrodes 9.

[0071] In the above embodiments, the shape of the virtual electrode 9 is not limited. For example, the virtual electrode 9 can be as follows: Figure 8 As shown in (a), extending in the first direction D1, the virtual electrode 9 can also be as follows: Figure 8 As shown in (b), it extends in the second direction D2. Furthermore, the virtual electrode 9 can be circular, polygonal, or the like.

Claims

1. An electronic device comprising: A basic body having a mounting surface and a main surface facing each other, and four side surfaces connecting the mounting surface and the main surface; An internal conductor disposed within the body; A plurality of end electrodes are disposed on the mounting surface of the substrate, the plurality of end electrodes being electrically connected to the internal conductor, and each of the plurality of end electrodes having a plating layer on its surface; A non-conductive electrode disposed on the mounting surface of the substrate and having a coating on its surface; and Side electrodes configured on one of the four sides, The non-conductive electrode is electrically connected to the side electrode.

2. The electronic device according to claim 1, wherein, One of the sides is the side closest to the non-conductive electrode.

3. The electronic device according to claim 1 or 2, wherein, The side electrode is located on one side surface, positioned close to the mounting surface in the direction opposite to the main surface.

4. The electronic device according to claim 1 or 2, wherein, Viewed from the direction opposite to the main surface of the mounting surface, the internal conductor overlaps with at least a portion of the non-conductive electrode.

5. The electronic device according to claim 1 or 2, wherein, The non-conductive electrode has a different area than the side electrode.

6. The electronic device according to claim 1 or 2, wherein, The electronic device has a plurality of side electrodes, and the non-conducting electrode is electrically connected to each of the plurality of side electrodes.

7. The electronic device according to claim 1 or 2, wherein, The electronic device has a plurality of non-conductive electrodes and a plurality of side electrodes, wherein each of the plurality of non-conductive electrodes is electrically connected to each of the plurality of side electrodes.

8. The electronic device according to claim 1 or 2, wherein, At least a portion of the side electrode protrudes outward from one of the sides.

9. The electronic device according to claim 1 or 2, wherein, The non-conducting electrode is neither electrically connected to nor physically connected to the internal conductor.

10. The electronic device according to claim 1 or 2, wherein, The internal conductor includes a pair of capacitor conductors constituting a capacitor, and the non-conducting electrode is electrically connected to one of the capacitor conductors in the pair.

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