Method for manufacturing electronic component and apparatus for applying conductive paste

Abstract

The present invention provides a method for manufacturing an electronic component and an apparatus for applying a conductive paste. The method for manufacturing the electronic component includes the following steps: preparing a conductive paste and a blank (3) including an end face (3a); preparing a removal member (142) including a mesh (MS); applying the conductive paste to the end face (3a); and reducing the amount of conductive paste (50) adhering to the end face (3a) while leaving conductive paste (50) on the end face (3a). The step of reducing the amount of adhering includes the following steps: moving the removal member (142) and the blank (3) relative to each other to a position where the conductive paste (50) and the mesh (MS) are in contact with each other in the opening direction of the mesh (MS); and moving the removal member (142) and the blank (3) relative to each other from the position where the conductive paste (50) and the mesh (MS) are in contact with each other in a direction of separation between the removal member (142) and the blank (3).

Description

Technical Field

[0001] This disclosure relates to a method for manufacturing electronic components and an apparatus for applying conductive paste. Background Technology

[0002] A known method for manufacturing an electronic component includes the following steps: preparing a conductive paste and a blank including end faces; preparing a removal member; applying the conductive paste to the end faces of the blank; and reducing the amount of conductive paste adhering to the end faces while leaving conductive paste on them (for example, see Japanese Patent Application Laid-Open No. 2006-3517). In this method for manufacturing an electronic component, the removal member includes two opposing faces, one of which has a plurality of recesses with bottoms. The step of reducing the amount of adhesion includes the following steps: moving the removal member and the blank relative to each other to a position where the conductive paste applied to the end faces contacts the removal member in the opening direction of the recesses; and moving the removal member and the blank relative to each other from the position where the conductive paste applied to the end faces contacts the removal member in the direction of separation between the removal member and the blank. Summary of the Invention

[0003] In the above-described method for manufacturing electronic components, during the step of applying a conductive paste to the end face of the blank, for example, the amount of conductive paste adhering to the end face is sometimes greater than the desired amount. Therefore, in the above-described method for manufacturing electronic components, the excess portion of the applied conductive paste is removed by reducing the amount of conductive paste adhering to the end face of the blank.

[0004] However, in the above-described method for manufacturing electronic components, since the multiple recesses formed on one side of the removal member each have a bottom, when reducing the amount of conductive paste adhering to the end face, a closed space is formed within the conductive paste by the end face and the bottom of the recess. When a closed space is formed within the conductive paste, the pressure within the conductive paste is lower than the pressure in the external space. When the pressure within the conductive paste is lower than the pressure in the external space, bubbles may be generated within the conductive paste when the removal member and the blank are moved relative to each other in the direction separating the removal member and the blank. If the conductive paste is cured while bubbles are present in the conductive paste applied to the end face of the blank, and the electronic component is manufactured, the reliability of the electronic component decreases. That is, the reliability of the electronic component manufactured in the above-described method may be reduced.

[0005] The purpose of this disclosure is to provide a method for manufacturing electronic components that suppresses the degradation of the reliability of electronic components.

[0006] Another objective of this disclosure is to provide a device for applying a conductive paste to suppress the degradation of the reliability of electronic components.

[0007] A method for manufacturing an electronic component according to one technical solution of this disclosure includes the following steps: preparing a conductive paste and a blank including an end face; preparing a removal member including a mesh; applying the conductive paste to the end face; and an adhesion reduction step, which reduces the amount of conductive paste adhering to the end face while leaving conductive paste on it. The adhesion reduction step includes the following steps: a relative movement step, in which the removal member and the blank are moved relative to each other to a position where the conductive paste applied to the end face and the mesh are in contact with each other in the opening direction of the mesh; and a separation direction relative movement step, in which the removal member and the blank are moved relative to each other from the position where the conductive paste applied to the end face and the mesh are in contact along the separation direction of the removal member and the blank.

[0008] In one of the above technical solutions, the removal component and the blank are moved relative to each other until the conductive paste applied to the end face and the mesh come into contact with each other in the opening direction of the mesh. Then, the removal component and the blank are moved relative to each other from the position where the conductive paste applied to the end face and the mesh come into contact with each other along the separation direction of the removal component and the blank. In the above technical solution, since the removal component includes a mesh, when the removal component and the blank are moved relative to each other along the separation direction, the formation of closed spaces in the conductive paste can be prevented. Therefore, when the removal component and the blank are moved relative to each other along the separation direction, the generation of air bubbles in the conductive paste remaining on the end face of the blank can be suppressed. Based on the above, the above technical solution suppresses the reduction of reliability of electronic components.

[0009] In one of the above technical solutions, the relative movement step may include the following steps: moving the removal component and the blank relative to each other until their end faces contact the mesh. The separation direction relative movement step may include the following steps: moving the removal component and the blank relative to each other from the position where their end faces contact the mesh along the separation direction.

[0010] In cases where the relative movement step includes moving the removal component and the blank relative to each other to a position where the end face contacts the mesh, the amount of conductive paste removed from the end face increases during the relative movement step in the separation direction. Therefore, after the adhesion reduction step, it is difficult for the amount of conductive paste adhering to the end face to be greater than the desired amount. Based on the above, in this case, it is possible to control the amount of conductive paste adhering to the end face to the desired amount.

[0011] In one of the above technical solutions, the relative movement step may include the following steps: moving the removal component and the blank relative to each other to a position where the end face is separated from the mesh. The separation direction relative movement step may include the following steps: moving the removal component and the blank relative to each other from the position where the end face is separated from the mesh along the separation direction.

[0012] In cases where the relative movement step includes moving the removal component and the blank relative to each other to a position where the end face is separated from the mesh, the amount of conductive paste removed from the end face can be suppressed during the relative movement step in the separation direction. Therefore, after the adhesion reduction step, the amount of conductive paste adhering to the end face is unlikely to be less than the desired amount. Based on the above, in this case, the amount of conductive paste adhering to the end face can be controlled to the desired amount.

[0013] In one of the above technical solutions, the adhesion reduction step may include the following steps before the separation direction relative movement step: with the conductive paste applied to the end face in contact with the mesh, the removal component and the blank are moved relative to each other from the position where the conductive paste applied to the end face is in contact with the mesh in a direction that intersects with the opening direction of the mesh.

[0014] When the adhesion reduction step includes the step of moving the removal member and the blank relative to each other in a direction intersecting the opening direction of the mesh, the amount of conductive paste removed from the end face increases during the relative movement step in the separation direction. Therefore, after the adhesion reduction step, it is difficult for the amount of conductive paste adhering to the end face to be greater than the desired amount. Based on the above, in this case, it is possible to control the amount of conductive paste adhering to the end face to the desired amount.

[0015] In one of the above technical solutions, the adhesion reduction step may include the following steps: while changing the position where the conductive paste applied to the end face contacts the mesh, the relative movement step and the separation direction relative movement step are repeated.

[0016] When the adhesion reduction step includes the aforementioned repeated steps, the amount of conductive paste removed from the end face further increases during the relative movement step in the separation direction because the conductive paste comes into contact with the mesh multiple times. Therefore, after the adhesion reduction step, the amount of conductive paste adhering to the end face is reliably unlikely to exceed the desired amount. Based on the above, in this case, it is possible to further control the amount of conductive paste adhering to the end face to the desired amount.

[0017] In one of the above technical solutions, the manufacturing method of electronic components may include the following steps after the attachment amount reduction step: collecting the conductive paste removed from the end face and the conductive paste attached to the mesh.

[0018] When the manufacturing method of an electronic component includes the above-described collection step, the collected conductive paste can be applied to the end face of another blank. That is, the collected conductive paste can be reused. Therefore, in this case, the cost required to apply conductive paste to the end face of the blank can be reduced.

[0019] Another technical solution of this disclosure provides a conductive paste application device comprising a holding member, an application mechanism, a removal member, and a moving mechanism. The removal member includes a mesh. The holding member holds a blank including an end face in a manner that exposes the end face. The application mechanism includes a surface to which conductive paste is applied to the end face. The moving mechanism moves the holding member holding the blank relative to the aforementioned surface and the removal member. The moving mechanism moves the holding member and the application mechanism to a position where the conductive paste supplied to the aforementioned surface contacts the end face, moves the removal member and the holding member relative to each other to a position where the conductive paste applied to the end face contacts the mesh in the opening direction of the mesh, and moves the removal member and the holding member relative to each other from the position where the conductive paste applied to the end face contacts the mesh in the direction of separation between the removal member and the blank.

[0020] In another technical solution described above, a conductive paste supplied to the end face of the blank is applied to the surface of the blank via a feeding mechanism. The removal member and the blank are moved relative to each other until the conductive paste applied to the end face contacts the mesh in the opening direction of the mesh. Then, the removal member and the blank are moved relative to each other from the position where the conductive paste applied to the end face contacts the mesh in the direction of separation between the removal member and the blank. In this other technical solution, since the removal member includes a mesh, the formation of closed spaces within the conductive paste can be prevented when the removal member and the blank are moved relative to each other in the separation direction. Therefore, the generation of air bubbles within the conductive paste remaining on the end face of the blank can be suppressed when the removal member and the blank are moved relative to each other in the separation direction. Based on the above, this other technical solution suppresses the reduction of reliability of electronic components.

[0021] In another technical solution described above, the conductive paste applicator may include a collection mechanism that collects the conductive paste removed from the end face and which is the conductive paste attached to the mesh.

[0022] In the aforementioned application device with a collection mechanism, the collected conductive paste can be applied to the end face of another blank. That is, the collected conductive paste can be reused. Therefore, the aforementioned application device with a collection mechanism can reduce the cost required to apply conductive paste to the end face of a blank.

[0023] In another technical solution described above, the collection mechanism may include a scraper that slides on the mesh and a collection section disposed below the removal member.

[0024] The collection mechanism, including the aforementioned scraper and collection section, easily collects the conductive paste adhering to the mesh.

[0025] In another technical solution described above, the moving mechanism may include an adjustment section that adjusts the relative height position of the holding member holding the blank relative to the surface and the removal member.

[0026] The moving mechanism, including the structure of the adjusting part, easily realizes the steps of moving the imparting mechanism and the blank relative to each other, and the steps of moving the removal component and the blank relative to each other.

[0027] One technical solution disclosed herein provides a method for manufacturing electronic components that suppresses the degradation of the reliability of electronic components.

[0028] Another technical solution disclosed herein provides an apparatus for applying a conductive paste to suppress the degradation of the reliability of electronic components. Attached Figure Description

[0029] Figure 1 This is a perspective view showing an electronic component manufactured using a manufacturing method according to one embodiment.

[0030] Figure 2 It means Figure 1 A top view of the electronic components shown.

[0031] Figure 3 It means Figure 1 A diagram showing the cross-sectional structure of the electronic component.

[0032] Figure 4 This is a diagram showing the structure of the feeding device in this embodiment.

[0033] Figure 5 This is a diagram showing the structure of the feeding device and the blank in this embodiment.

[0034] Figure 6 This is a diagram showing the structure of the feeding device and the blank in this embodiment.

[0035] Figure 7 It is a 3D view showing the removal of components.

[0036] Figure 8 It is a diagram showing the cross-sectional structure after removing the components.

[0037] Figure 9 This is a schematic diagram illustrating the manufacturing process of the electronic component according to this embodiment.

[0038] Figure 10 This is a schematic diagram illustrating the manufacturing method of this embodiment.

[0039] Figure 11 This is a schematic diagram illustrating the manufacturing method of this embodiment.

[0040] Figure 12This is a schematic diagram illustrating the manufacturing method of this embodiment.

[0041] Figure 13 This is a schematic diagram illustrating the manufacturing method of this embodiment.

[0042] Figure 14 This is a schematic diagram illustrating the manufacturing method of this embodiment.

[0043] Figure 15 This is a schematic diagram illustrating the manufacturing method of this embodiment.

[0044] Figure 16 This is a schematic diagram illustrating the manufacturing method of this embodiment.

[0045] Figure 17 This is a schematic diagram illustrating the manufacturing method of this embodiment.

[0046] Figure 18 This is a schematic diagram illustrating the manufacturing method of this embodiment.

[0047] Figure 19 This is a schematic diagram illustrating the manufacturing method of this embodiment.

[0048] Figure 20 This is a schematic diagram illustrating the manufacturing method of this embodiment.

[0049] Figure 21 This is a schematic diagram illustrating the manufacturing process of a modified example of this embodiment.

[0050] Figure 22 This is a graph used to illustrate the amount of conductive paste adhered.

[0051] Figure 23 It is a graph illustrating the experimental results related to the amount of conductive paste adhered.

[0052] Figure 24 This is a schematic diagram illustrating the manufacturing process of another variation of this embodiment.

[0053] Figure 25 This is a schematic diagram illustrating the manufacturing process of another variation of this embodiment.

[0054] Figure 26 This is a schematic diagram illustrating the manufacturing process of another variation of this embodiment. Detailed Implementation

[0055] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings. Furthermore, in the description, the same reference numerals are used for the same elements or elements having the same elements, and repeated descriptions are omitted.

[0056] Reference Figure 1 , Figure 2 and Figure 3 The structure of an electronic component manufactured using the electronic component manufacturing method of this embodiment will be explained. Figure 1 This is a perspective view showing an electronic component manufactured using the manufacturing method of this embodiment. Figure 2 It means Figure 1 A top view of the electronic components shown. Figure 3 It means Figure 1 A diagram showing the cross-sectional structure of the electronic component.

[0057] like Figures 1-3 As shown, the electronic component 1 includes a blank 3, an external electrode 5, a plurality of internal electrodes 7, and a plurality of internal electrodes 9. In this embodiment, the electronic component 1 includes a pair of external electrodes 5.

[0058] In this embodiment, electronic component 1 includes a stacked capacitor.

[0059] The blank 3 is rectangular parallelepiped in shape. The rectangular parallelepiped shape includes, for example, a rectangular parallelepiped with chamfered corners and edges, and a rectangular parallelepiped with rounded corners and edges. The blank 3 includes end faces 3a, side faces 3c, and side faces 3e. In this embodiment, the blank 3 includes a pair of end faces 3a, a pair of side faces 3c, and a pair of side faces 3e. In this embodiment, the pair of end faces 3a are opposite each other in a first direction D1, the pair of side faces 3c are opposite each other in a second direction D2, and the pair of side faces 3e are opposite each other in a third direction D3. The first direction D1, the second direction D2, and the third direction D3 intersect each other, for example. In this embodiment, the first direction D1, the second direction D2, and the third direction D3 are orthogonal to each other. The pair of side faces 3c and the pair of side faces 3e extend along the first direction D1, respectively, adjacent to and connecting the pair of end faces 3a.

[0060] The height of billet 3 includes its length in the third direction D3. The width of billet 3 includes its length in the second direction D2. The length of billet 3 includes its length in the first direction D1.

[0061] A pair of end faces 3a, a pair of side faces 3c, and a pair of side faces 3e are, for example, rectangular in shape. In this embodiment, as... Figure 2As shown, the pair of end faces 3a are square in shape. Therefore, the length L1 on the second direction D2 of the end face 3a and the length L2 on the third direction D3 of the end face 3a are equal to each other. For example, the length L1 is 0.2 mm or more and 5.0 mm or less, and the length L2 is 0.2 mm or more and 5.0 mm or less. In this embodiment, the lengths L1 and L2 are 2.5 mm. For example, the length L1 corresponds to the width of the blank 3, and the length L2 corresponds to the height of the blank 3. The pair of end faces 3a may also be rectangular in shape.

[0062] The pair of side surfaces 3c and 3e are rectangular in shape. In this embodiment, the first direction D1 corresponds to the long side direction of the pair of side surfaces 3c and 3e, and the third direction D3 corresponds to the short side direction of the pair of side surfaces 3c and 3e. In the blank 3, the first direction D1 may also correspond to the short side direction of the pair of side surfaces 3c and 3e, and the third direction D3 may correspond to the long side direction of the pair of side surfaces 3c and 3e. The pair of side surfaces 3c and 3e may also be square in shape.

[0063] The green body 3 is constructed by stacking multiple dielectric layers. Each dielectric layer is stacked on a third direction D3. The green body 3 includes multiple stacked dielectric layers. Each dielectric layer is, for example, a dielectric ceramic of the BaTiO3 system, Ba(Ti,Zr)O3 system, (Ba,Ca)TiO3 system, CaZrO3 system, or (Ca,Sr)ZrO3 system. The dielectric layers are integrated to the extent that the boundaries between the dielectric layers are not visually discernible.

[0064] like Figure 3 As shown, internal electrodes 7 and 9 are disposed at different positions on the third direction D3. Internal electrodes 7 and 9 are alternately arranged within the blank 3 in a spaced-apart manner opposite each other on the third direction D3. Multiple internal electrodes 7 and 9 are opposite each other on the third direction D3. The polarities of internal electrodes 7 and 9 are different from each other. Internal electrode 7 includes an end 7a exposed on one of a pair of end faces 3a. Internal electrode 9 includes an end 9a exposed on the other end face 3a of the pair of end faces 3a. Internal electrodes 7 and 9 contain a conductive material. The conductive material includes, for example, Cu, Ni, or Pt. Internal electrodes 7 and 9 are configured as a sintered body containing a conductive paste of the aforementioned conductive material.

[0065] External electrode 5 is disposed on end face 3a. For example... Figure 1As shown, external electrodes 5 are respectively disposed on a pair of end faces 3a. The pair of external electrodes 5 are separated from each other in the first direction D1. In this embodiment, external electrodes 5 are also disposed on a portion of each of a pair of side faces 3c and a pair of side faces 3e. A portion of the external electrodes 5 disposed on side face 3c is disposed close to end face 3a. A portion of the external electrodes 5 disposed on side face 3e is disposed close to end face 3a. External electrodes 5 may also be disposed only on end face 3a. External electrodes 5 may also be disposed on at least one of the pair of side faces 3c and the pair of side faces 3e and end face 3a. The portion of the external electrodes 5 disposed on end face 3a is configured to cover the exposed ends 7a and 9a of the corresponding internal electrodes 7 and 9 on end face 3a.

[0066] The external electrode 5 may include, for example, a sintered metal layer. This sintered metal layer is formed by drying and sintering a conductive paste applied to the end face 3a of the blank 3. The sintered metal layer may be made of Cu or Ag. The conductive paste may contain, for example, metal powder made of Cu or Ag, glass, resin, and organic solvent. The external electrode 5 may also include a plating layer formed on the sintered metal layer. The external electrode 5 may also include a conductive resin layer formed on the sintered metal layer and a plating layer formed on the conductive resin layer.

[0067] Next, refer to Figure 4 , Figure 5 , Figure 6 , Figure 7 and Figure 8 The conductive paste application device 100 of this embodiment will be described. Figure 4 This is a diagram showing the structure of the feeding device in this embodiment. Figure 5 and Figure 6 This is a diagram showing the structure of the feeding device and the blank in this embodiment. Figure 7 It is a 3D view showing the removal of components. Figure 8 It is a diagram showing the cross-sectional structure after removing the components.

[0068] The conductive paste applicator 100 applies conductive paste to the end face 3a of the blank 3 and reduces the amount of conductive paste adhering to the end face 3a. The applicator 100 reduces the amount of conductive paste adhering to the end face 3a, for example, by removing only a portion of the conductive paste applied to the end face 3a.

[0069] The amount of conductive paste 50 adhering on end face 3a includes, for example, the thickness of conductive paste 50 on end face 3a. The thickness of conductive paste 50 on end face 3a may include, for example, the thickness of conductive paste 50 at approximately the center of a third direction D3 on end face 3a. Alternatively, the thickness of conductive paste 50 on end face 3a may also include the thickness of conductive paste 50 at a position on a third direction D3 of the internal electrode 7 disposed closest to one side face 3e, and may also include the thickness of conductive paste 50 at a position on a third direction D3 of the internal electrode 9 disposed closest to the other side face 3e.

[0070] like Figure 4 As shown, the applicator 100 includes a holding mechanism 110, a moving mechanism 120, a stage S1, an applicator 130, and a removal mechanism 140.

[0071] The holding mechanism 110 holds the blank 3. The holding mechanism 110 includes, for example, a holding member 111 and a conveying section 112. The holding member 111 holds the blank 3 with its end face 3a exposed. The holding member 111 holds, for example, multiple blanks 3. In this embodiment, the holding member 111 includes two opposing pairs 111a and 111b. Hereinafter, the direction in which the opposing pairs 111a and 111b face each other is defined as the Z-axis direction, the direction orthogonal to the Z-axis direction is defined as the Y-axis direction, and the direction orthogonal to both the Z-axis and Y-axis directions is defined as the X-axis direction. In the feeding device 100, for example, the Z-axis direction may correspond to the height direction, and the Y-axis and X-axis directions may correspond to the horizontal direction.

[0072] In the feeding device 100, surface 111b is located above surface 111a. In this embodiment, an adhesive layer is provided on surface 111a. The retaining member 111 adheres the end face 3a of the blank 3 to the adhesive layer such that one end face 3a is opposite to surface 111a in the Z-axis direction, thereby retaining the blank 3. Thus, as Figure 4 As shown, the blank 3 is held by the holding member 111 with its other end face 3a exposed.

[0073] As described above, in this embodiment, the direction in which a pair of end faces 3a face each other is the first direction D1. Therefore, when the blank 3 is held by the holding member 111, the first direction D1 is parallel to the Z-axis direction. Moreover, when the blank 3 is held by the holding member 111, the second direction D2 is parallel to the X-axis direction, and the third direction D3 is parallel to the Y-axis direction.

[0074] The conveying unit 112 conveys the blank 3 held by the holding member 111 to the moving mechanism 120. For example, the conveying unit 112 conveys the holding member 111 and the blank 3 to the moving mechanism 120 by moving along the Z-axis while holding the side of the holding member 111. In this embodiment, the conveying unit 112 includes a servo motor and a ball screw. In the conveying unit 112 of this embodiment, the servo motor rotates the shaft of the ball screw, thereby moving the conveying unit 112 along the Z-axis.

[0075] The moving mechanism 120 moves the holding member 111 holding the blank 3 relative to the surface 131a of the worktable 131 and the removal member 142, which will be described later. In this embodiment, the moving mechanism 120 moves along the X-axis, Y-axis, and Z-axis directions. That is, in this embodiment, the moving mechanism 120 moves the holding member 111 relative to the surface 131a and the removal member 142 by moving the holding member 111.

[0076] The moving mechanism 120 includes, for example, an adjustment unit 121, an adjustment unit 122, and an adjustment unit 123. The adjustment units 121, 122, and 123 adjust the position of the moving mechanism 120 in corresponding directions among the X-axis, Y-axis, and Z-axis directions. In this embodiment, the adjustment unit 121 adjusts the position of the moving mechanism 120 in the X-axis direction. The adjustment unit 122 adjusts the position of the moving mechanism 120 in the Y-axis direction. The adjustment unit 123 adjusts the position of the moving mechanism 120 in the Z-axis direction. In this embodiment, the adjustment units 123, 122, and 121 are arranged sequentially along the Z-axis direction in the moving mechanism 120.

[0077] In this embodiment, adjustment units 121, 122, and 123 each include a servo motor and a ball screw. In this embodiment, adjustment units 121, 122, and 123 rotate the axis of the ball screw via the servo motor, thereby causing the moving mechanism 120 to move along corresponding directions in the X-axis, Y-axis, and Z-axis directions.

[0078] The moving mechanism 120 adsorbs the holding member 111 that holds the blank 3. Thus, the moving mechanism 120 holds the blank 3 by means of the holding member 111. For example, the moving mechanism 120 adsorbs the holding member 111 by vacuum adsorption. In this embodiment, as... Figure 6 As shown, the lower surface 121a of the adjustment part 121 adsorbs the surface 111b of the holding member 111 by vacuum adsorption.

[0079] The movement of the aforementioned moving mechanism 120 is performed, for example, when the holding member 111 holding the blank 3 is adsorbed onto the moving mechanism 120. That is, the moving mechanism 120 with the holding member 111 adsorbed moves the blank 3 held by the holding member 111 along the X-axis, Y-axis, and Z-axis directions. This adjusts the height and horizontal position of the holding member 111 relative to the surface 131a of the worktable 131 and the removal member 142. Therefore, in this embodiment, adjustment units 121 and 122 adjust the horizontal position of the holding member 111 relative to the surface 131a of the worktable 131 and the removal member 142, and adjustment unit 123 adjusts the height of the holding member 111 relative to the surface 131a of the worktable 131 and the removal member 142.

[0080] Alternatively, while the holding member 111 of the blank 3 is held in place by the moving mechanism 120, the adjusting parts 121, 122, and 123 adjust the position of the blank 3 in the corresponding directions of the X-axis, Y-axis, and Z-axis. This adjustment of the blank 3's position by the moving mechanism 120 can be performed, for example, when applying a conductive paste to the end face 3a or when reducing the amount of conductive paste adhering to the end face 3a.

[0081] On the stage S1, for example, the steps of applying conductive paste to the end face 3a and reducing the amount of conductive paste adhering to the end face 3a described above are performed. In the application device 100, an application mechanism 130 and a removal mechanism 140 are provided on the stage S1.

[0082] The applicator 130 applies a conductive paste to the end face 3a. The applicator 130 includes, for example, a worktable 131, a paste return member 132, and a scraper 133.

[0083] A worktable 131 is disposed on a stage S1. The worktable 131 moves, for example, on the stage S1. In this embodiment, the worktable 131 moves along the Y-axis on the stage S1. The worktable 131 includes, for example, a surface 131a. A conductive paste, which is applied to the end face 3a of the blank 3, is supplied to the surface 131a. That is, the application mechanism 130 includes the surface 131a to which the conductive paste is applied to the end face 3a is supplied.

[0084] The paste return component 132 spreads the conductive paste supplied to surface 131a. For example... Figure 4 As shown, the paste return member 132 is configured to be located on the worktable 131. The paste return member 132 moves relative to the worktable 131. In this embodiment, the paste return member 132 moves relative to the worktable 131 along the Y-axis direction. In this embodiment, the paste return member 132 spreads the conductive paste on the surface 131a by pressing the conductive paste onto the surface 131a while moving on the surface 131a.

[0085] The scraper 133 adjusts the thickness of the conductive paste spread on the surface 131a. The scraper 133 adjusts the thickness of the conductive paste, for example, in a way that makes the thickness of the conductive paste spread on the surface 131a more uniform. This forms, for example, a paste film of approximately uniform thickness on the surface 131a. In this embodiment, the scraper 133 is positioned on the worktable 131 in the same manner as the paste return member 132. The scraper 133 moves relative to the worktable 131. In this embodiment, the scraper 133 moves rearward from the direction of movement of the paste return member 132, together with the paste return member 132. That is, the scraper 133 also moves along the Y-axis direction, just like the paste return member 132. In this embodiment, the scraper 133 adjusts the thickness of the paste film by moving on the surface 131a together with the paste return member 132 from behind it.

[0086] The removal mechanism 140 reduces the amount of conductive paste adhering to the end face 3a. The removal mechanism 140 includes, for example, a worktable 141, a removal member 142, a scraper 143, a scraper 144, and a collection section 145.

[0087] The worktable 141 is disposed on the stage S1. The worktable 141 moves, for example, on the stage S1. In this embodiment, the worktable 141 moves along the Y-axis on the stage S1.

[0088] The removal member 142 leaves conductive paste on the end face 3a of the blank 3 while reducing the amount of conductive paste adhering to the end face 3a. In this embodiment, the removal member 142 is disposed on the worktable 141. The removal member 142 includes a mesh MS. The mesh in this specification is formed by weaving wires into a mesh shape. Therefore, a structure with multiple through holes in a plate-shaped component, such as a perforated plate, is different from the mesh in this specification.

[0089] In this embodiment, the removal member 142 comprises only a mesh MS. The mesh MS includes, for example, wires 142a and 142b. In this embodiment, the removal member 142 is formed by weaving the wires 142a and 142b into a mesh shape. The mesh MS is, for example, a metal mesh woven from the wires 142a and 142b as warp and weft yarns. The wires 142a and 142b are aligned in mutually orthogonal directions. The alignment directions of wires 142a and 142b may not be mutually orthogonal. The alignment directions of wires 142a and 142b only need to intersect each other.

[0090] like Figure 7As shown, in the removal member 142, wire 142b is woven in relative to the straight-extending wire 142a. Therefore, in the removal member 142, only wire 142b is bent. This structure is also called a three-dimensional braided structure. In the removal member 142, both wire 142a and wire 142b may be bent.

[0091] Wires 142a and 142b may include, for example, metal wires or synthetic resin wires. Metal wires may include, for example, stainless steel wires. Synthetic resin wires may include, for example, nylon wires. In this embodiment, wires 142a and 142b comprise nylon wires. Wires 142a and 142b may, for example, have a wire diameter of 20 μm or more and 100 μm or less. In this embodiment, wires 142a and 142b have a wire diameter of 80 μm.

[0092] The aperture L3 of the mesh MS can be, for example, 40 μm or more and 300 μm or less. In this embodiment, the aperture L3 is 240 μm. The aperture L3 is defined, for example, by the spacing between adjacent wires 142a. The aperture L3 can also be defined, for example, by the spacing between adjacent wires 142b. The aperture L3 is different from the lengths L1 and L2 of the end face 3a. In this embodiment, the aperture L3 is smaller than the lengths L1 and L2 of the end face 3a. For example, the aperture L3 can be less than 1 / 2 times the lengths L1 and L2, or less than 1 / 10 times the lengths L1 and L2. For example, the opening direction of the mesh MS includes the direction in which the mesh MS opens. In this embodiment, the opening direction of the mesh MS includes the Z-axis direction. The opening direction of the mesh MS can also include a direction inclined relative to the Z-axis direction.

[0093] Scraper 143, scraper 144, and collection section 145 collect the conductive paste removed from the end face 3a of the blank 3 by the removal member 142, and the conductive paste is adhered to the mesh MS. In this embodiment, as Figure 4 As shown, scraper 143 is positioned on the removal member 142. Scraper 144 is positioned on the side opposite to scraper 143, separated from the removal member 142. That is, scraper 144 is positioned below the removal member 142. Collection unit 145 is positioned below scraper 144. In this embodiment, collection unit 145 is positioned below scraper 144 within the worktable 141.

[0094] Scraper 143 and scraper 144 slide on the mesh MS. As described above, scraper 143 is disposed on the removal member 142, and scraper 144 is disposed on the side opposite to scraper 143 across the removal member 142. Therefore, in this embodiment, scraper 143 slides on the surface of the mesh MS, and scraper 144 slides on the back side of the mesh MS. In this embodiment, scraper 143 and scraper 144 slide on the mesh MS along the Y-axis direction. For example, scraper 143 and scraper 144 can slide on the mesh MS while maintaining the same position in the Y-axis direction. Alternatively, scraper 143 and scraper 144 can slide on the mesh MS with different positions in the Y-axis direction. In this case, the distance between scraper 143 and scraper 144 in the Y-axis direction can be, for example, smaller than the aperture L3.

[0095] For example, scraper 143 slides on the surface of mesh MS while pressing the conductive paste adhered to mesh MS onto the mesh MS, and scraper 144 slides together with scraper 143 on the back side of mesh MS. As a result, the conductive paste adhered to mesh MS moves along scraper 144 through the opening of mesh MS and falls into collection section 145. Thus, the conductive paste removed from end face 3a is collected in collection section 145. In this way, in the application device 100, the conductive paste removed from end face 3a and adhered to mesh MS is collected using scraper 143, scraper 144, and collection section 145 included in the removal mechanism 140. That is, in this embodiment, the removal mechanism 140 also serves as a collection mechanism for the conductive paste removed from end face 3a and adhered to mesh MS.

[0096] The feeding device 100 also includes, for example, a control unit (not shown). The control unit is connected, for example, to the conveying unit 112, the moving mechanism 120, the worktable 131, and the worktable 141. The control unit controls the operation of the conveying unit 112, the moving mechanism 120, the worktable 131, and the worktable 141. In this embodiment, the movement of the conveying unit 112, the moving mechanism 120, the worktable 131, and the worktable 141 is based on control signals from the control unit. Physically, the control unit may include, for example, a processor such as a CPU, and a storage medium such as RAM or ROM. The control unit may, for example, load a program stored in ROM into RAM and execute the program loaded into RAM using the CPU, thereby controlling the operation of the conveying unit 112, the moving mechanism 120, the worktable 131, and the worktable 141.

[0097] Next, refer to Figures 9-20 The manufacturing method of the electronic component in this embodiment will be explained. Figures 9-20This is a schematic diagram illustrating the manufacturing process of the electronic component according to this embodiment. The manufacturing process of the electronic component in this embodiment includes applying a conductive paste to the end face 3a of the blank 3.

[0098] In this manufacturing method, a blank 3 including an end face 3a and a conductive paste applied to the end face 3a are first prepared. In this embodiment, a blank 3 with internal electrodes 7 and 9 disposed internally is prepared. The blank 3 with internal electrodes 7 and 9 disposed internally is prepared, for example, in the following manner.

[0099] First, a ceramic paste for forming the dielectric layer and an internal electrode paste (conductive paste) for forming the internal electrodes 7 and 9 are prepared. The ceramic paste, for example, comprises raw material powder of the dielectric material described above and an organic carrier. The organic carrier comprises a binder and a solvent. The solvent is, for example, an organic solvent. The ceramic paste may also contain a dispersant, plasticizer, dielectric, glass powder, or insulator. Ceramic pastes are known in the art, and further detailed descriptions are omitted.

[0100] Internal electrode pastes may, for example, comprise powders of the aforementioned conductive materials and an organic carrier. The conductive material powder may be, for example, a metal powder. The powder may be spherical or flake-like. The organic carrier comprises a binder and a solvent. The solvent may be, for example, an organic solvent. Internal electrode pastes may also comprise inorganic compounds. Internal electrode pastes may also comprise plasticizers. Internal electrode pastes are known in the art, and further detailed descriptions are omitted.

[0101] The ceramic paste described above is used to form ceramic green sheets. In this manufacturing method, for example, after applying the ceramic paste in a sheet form onto a carrier, the sheet-like ceramic paste is dried. Thus, a ceramic green sheet is obtained. The carrier is, for example, made of PET (Polyethylene terephthalate). The ceramic paste is applied, for example, by a doctor blade method.

[0102] Multiple internal electrode patterns are formed on a ceramic green sheet using an internal electrode paste. In this manufacturing method, for example, after patterning the internal electrode paste on the ceramic green sheet, the internal electrode paste is dried. This results in multiple internal electrode patterns. The internal electrode paste is applied, for example, by screen printing.

[0103] A green body laminate is formed using ceramic green sheets with internal electrode patterns. In this manufacturing method, for example, after the ceramic green sheets are standardized to a specified size, a specified number of ceramic green sheets are laminated. Then, for example, pressure is applied to the laminated ceramic green sheets in the lamination direction. Thus, a green body laminate is obtained.

[0104] Multiple green wafers are obtained from a green laminate. In this manufacturing method, the green laminate is cut into wafer shapes, for example, using a cutting machine. Thus, multiple green wafers of a specified size are obtained.

[0105] After the binder is removed from the green die, the green die is baked. This baking process yields a blank 3 with multiple internal electrodes 7 and 9 disposed therein. Subsequently, an R-shaped chamfer may be performed on the blank 3. The R-shaped chamfer may be, for example, tumbling. The binder removal is performed, for example, by heating the green die in a reducing atmosphere. The reducing atmosphere may be, for example, a mixture of N2 and H2 or air. Baking is performed, for example, by heating the green die with the binder removed in a reducing atmosphere. The removal of the binder and baking are known in the art, and further details are omitted.

[0106] Next, the retaining member 111 holds the prepared blank 3. In this manufacturing method, the retaining member 111 holds the blank 3 by bonding one end face 3a of the blank 3 to an adhesive layer formed on the face 111a. Thus, the blank 3 is held in the retaining member 111 with the other end face 3a exposed.

[0107] Next, the holding member 111 is conveyed to the moving mechanism 120 by the conveying unit 112. In this manufacturing method, the conveying unit 112 conveys the holding member 111, which holds the blank 3, to the adjusting unit 121 of the moving mechanism 120. In this manufacturing method, the conveying unit 112 moves along the Z-axis direction while holding the holding member 111 to convey the holding member 111 to the adjusting unit 121. The movement of the conveying unit 112 is performed, for example, using a servo motor and ball screw included in the conveying unit 112. Then, as... Figure 9 As shown, the holding member 111 holding the blank 3 is adsorbed onto the lower surface 121a of the adjustment part 121.

[0108] Next, in the applicator 130, a conductive paste is supplied to the surface 131a of the worktable 131 to the end face 3a. In this manufacturing method, the conductive paste supplied to the surface 131a is spread and coated on the surface 131a by the paste return member 132. Then, the thickness of the spread conductive paste is adjusted using a scraper 133, thereby forming a paste film P1 on the surface 131a.

[0109] Next, as Figure 10 As shown, with a paste film P1 formed on surface 131a, the worktable 131 moves to a position below the holding member 111. In this manufacturing method, the worktable 131 moves along the Y-axis on the stage S1 to a position below the holding member 111. This movement of the worktable 131 is performed, for example, using a servo motor and ball screw included in the worktable 131.

[0110] Next, the moving mechanism 120 moves the holding member 111 and the applying mechanism 130 relative to each other until the conductive paste supplied to the surface 131a contacts the exposed end face 3a. In this embodiment, as... Figure 11 As shown, the moving mechanism 120 moves the holding member 111 and the imparting mechanism 130 relative to each other until the paste film P1 formed on the surface 131a is in contact with the end face 3a.

[0111] In this manufacturing method, such as Figure 12 As shown, the holding member 111 and the dispensing mechanism 130 are moved relative to each other until the paste film P1 is in contact with the end face 3a, a portion of each of the pair of side faces 3c, and a portion of each of the pair of side faces 3e. The portions of the pair of side faces 3c and the pair of side faces 3e that are in contact with the paste film P1 are positioned close to the end face 3a. At this time, the end face 3a may or may not be in contact with the surface 131a of the worktable 131.

[0112] In this manufacturing method, the relative movement between the holding member 111 and the feeding mechanism 130 is achieved by moving the holding member 111. For example, with the position of the feeding mechanism 130 (worktable 131) fixed in the Y-axis direction, the adjusting unit 123 moves the position of the moving mechanism 120 in the Z-axis direction toward the surface 131a. As a result, the holding member 111 holding the blank 3 moves toward the surface 131a, and the end face 3a comes into contact with the paste film P1.

[0113] Next, the moving mechanism 120 moves the holding member 111 and the dispensing mechanism 130 relative to each other from the position where the paste film P1 is in contact with the end face 3a along the direction in which the preform 3 separates from the paste film P1. In this manufacturing method, in this case, the relative movement between the holding member 111 and the dispensing mechanism 130 is also performed by moving the holding member 111. For example, as Figure 13 As shown, with the position of the worktable 131 fixed in the Y-axis direction, the adjustment unit 123 moves the position of the moving mechanism 120 in the Z-axis direction away from the surface 131a. As a result, the holding member 111 holding the blank 3 moves away from the surface 131a, and the end face 3a separates from the paste film P1.

[0114] In this manufacturing method, a conductive paste 50 is applied to the end face 3a by bringing it into contact with the paste film P1. As described above, in this manufacturing method, in addition to the end face 3a, a portion of each of the pair of side faces 3c and a portion of each of the pair of side faces 3e also contact the paste film P1. Therefore, in this manufacturing method, as... Figure 14As shown, conductive paste 50 is also applied to a portion of each of a pair of side surfaces 3c and a portion of each of a pair of side surfaces 3e. Thus, a chip 30 comprising a blank 3, internal electrodes 7 and 9, and conductive paste 50 is fabricated. At the point in time that the chip 30 is fabricated, the amount of conductive paste 50 adhering to the end face 3a is, for example, greater than the desired amount.

[0115] Next, the worktable 141 moves to a position below the holding member 111. In this manufacturing method, the worktable 141 moves along the Y-axis on the stage S1 to a position below the holding member 111. The movement of the worktable 141 is performed, for example, using a servo motor and ball screw included in the worktable 141.

[0116] Next, as Figure 15 As shown, the moving mechanism 120 moves the removal member 142 and the blank 3 relative to each other until the conductive paste and the mesh MS are in contact in the opening direction of the mesh MS. In this manufacturing method, as... Figure 16 As shown, the moving mechanism 120 moves the removal member 142 and the blank 3 relative to each other until the end face 3a, which is coated with conductive paste 50, comes into contact with the mesh MS. At this time, the end face 3a coated with conductive paste 50 only needs to come into contact with at least one of the wires 142a and 142b contained in the mesh MS.

[0117] In this manufacturing method, the relative movement between the preform 3 and the removal member 142 is achieved by moving the holding member 111. For example, with the position of the removal member 142 (worktable 141) fixed in the Y-axis direction, the adjustment unit 123 moves the position of the moving mechanism 120 in the Z-axis direction toward the removal member 142. As a result, the holding member 111 holding the preform 3 moves toward the removal member 142, and the conductive paste 50 applied to the end face 3a comes into contact with the mesh MS.

[0118] In this manufacturing method, the moving mechanism 120 can also move the removal member 142 and the blank 3 relative to each other from the position where the end face 3a, to which the conductive paste 50 is applied, is in contact with the mesh MS, along the direction in which the removal member 142 approaches the blank 3. In this case, the relative movement between the blank 3 and the removal member 142 is also performed by moving the holding member 111. For example, the adjusting part 123 moves the position of the moving mechanism 120 in the Z-axis direction further toward the removal member 142, thereby moving the holding member 111 holding the blank 3 further toward the removal member 142. As a result, the end face 3a is pressed into the mesh MS.

[0119] Next, as Figure 17As shown, the moving mechanism 120 moves the removal member 142 and the blank 3 relative to each other from the position where the end face 3a, to which the conductive paste 50 is applied, is in contact with the mesh MS, along the direction in which the removal member 142 separates from the blank 3. In this manufacturing method, in this case, the relative movement between the removal member 142 and the blank 3 is also performed by moving the holding member 111. For example, with the position of the worktable 141 fixed in the Y-axis direction, the adjusting unit 123 moves the position of the moving mechanism 120 in the Z-axis direction away from the removal member 142. As a result, when the conductive paste 50 separates from the mesh MS, only a portion of the conductive paste 50 is removed by the mesh MS of the removal member 142, leaving a portion of the conductive paste 50 on the mesh MS. Therefore, in this manufacturing method, by the relative movement between the removal member 142 and the blank 3, the amount of conductive paste 50 adhering to the end face 3a is reduced while leaving the conductive paste 50 on the end face 3a. In this manufacturing method, in addition to reducing the amount of conductive paste 50 adhering to the end face 3a, the amount of conductive paste 50 adhering to a pair of side faces 3c and a pair of side faces 3e can also be reduced.

[0120] Thus, regarding the conductive paste 50 applied to end face 3a, through the relative movement between the removal member 142 and the blank 3, a portion remains on end face 3a, and the remainder remains on the mesh MS. As described above, at the point in time when the chip 30 is manufactured, for example, the amount of conductive paste 50 adhering to end face 3a is greater than the desired amount. Therefore, in this manufacturing method, it can also be said that the excess portion of conductive paste 50 on end face 3a is removed by the relative movement between the removal member 142 and the blank 3, and the conductive paste 50 remaining on the mesh MS can also be said to be conductive paste 50 removed from end face 3a. In the following description, in order to distinguish between the conductive paste 50 remaining on end face 3a and the conductive paste 50 remaining on the mesh MS, the conductive paste 50 remaining on end face 3a is sometimes referred to as conductive paste 51, and the conductive paste 50 remaining on the mesh MS is sometimes referred to as conductive paste P2.

[0121] Next, as Figure 18 As shown, the worktable 141 disengages from below the holding member 111. In this manufacturing method, the worktable 141 disengages from below the holding member 111 by moving on the stage S1 in the opposite direction to the direction of movement below the holding member 111. This movement of the worktable 141 is also performed, for example, using a servo motor and ball screw included in the worktable 141.

[0122] Next, as Figure 19As shown, conductive paste P2 remaining on the mesh MS is collected. In this manufacturing method, when collecting the conductive paste P2, scrapers 143 and 144 slide on the mesh MS. In this case, due to the sliding of scraper 143, the conductive paste P2 moves through the opening of the mesh MS on scraper 144 and falls into the collection section 145. Thus, the conductive paste P2 is collected in the collection section 145.

[0123] Next, as Figure 20 As shown, the holding member 111 of the holding chip 30 is removed from the adjustment section 121 of the moving mechanism 120 by the transport section 112. In this manufacturing method, the transport section 112 moves in the Z-axis direction away from the moving mechanism 120 while holding the holding member 111, thereby removing the holding member 111 from the adjustment section 121. The movement of the transport section 112 is also performed, for example, by using a servo motor and ball screw included in the transport section 112.

[0124] Next, the chip 30, including the blank 3, internal electrodes 7 and 9, and conductive paste 51, is removed from the holding member 111. Then, the conductive paste 51 of the chip 30 is cured. This forms an external electrode 5 disposed on a portion of each of a pair of side surfaces 3c, a portion of each of a pair of side surfaces 3e, and an end face 3a. By forming the external electrode 5 on the other end face 3a based on the above process, a... Figure 1 Electronic component 1 is shown.

[0125] As described above, this manufacturing method includes the following steps: preparing a conductive paste and a blank 3 including an end face 3a; preparing a removal member 142 including a mesh MS; applying the conductive paste to the end face 3a; and reducing the amount of conductive paste 50 adhering to the end face 3a while leaving conductive paste 50 on the end face 3a. The step of reducing the amount of conductive paste adhering includes the following steps: moving the removal member 142 and the blank 3 relative to each other to a position where the conductive paste 50 applied to the end face 3a contacts the mesh MS in the opening direction of the mesh MS; and moving the removal member 142 and the blank 3 relative to each other from the position where the conductive paste 50 applied to the end face 3a contacts the mesh MS in the direction of separation between the removal member 142 and the blank 3.

[0126] According to this manufacturing method, the removal member 142 and the blank 3 are moved relative to each other to a position where the conductive paste 50 and the mesh MS are in contact with each other in the opening direction of the mesh MS. Then, the removal member 142 and the blank 3 are moved relative to each other from the position where the conductive paste 50 and the mesh MS are in contact along the separation direction of the removal member 142 and the blank 3. In this manufacturing method, since the removal member 142 includes the mesh MS, when the removal member 142 and the blank 3 are moved relative to each other along the separation direction, it is possible to prevent the formation of closed spaces in the conductive paste 50. Therefore, when the removal member 142 and the blank 3 are moved relative to each other along the separation direction, it is possible to suppress the generation of air bubbles in the conductive paste 51 remaining on the end face of the blank 3. Based on the above, this manufacturing method suppresses the reduction of reliability of electronic components.

[0127] In this manufacturing method, the aforementioned relative movement step includes the following steps: moving the removal member 142 and the blank 3 relative to each other to a position where the end face 3a contacts the mesh MS. The aforementioned relative movement along the separation direction step includes the following steps: moving the removal member 142 and the blank 3 relative to each other from the position where the end face 3a contacts the mesh MS along the aforementioned separation direction. In this case, during the aforementioned relative movement along the separation direction step, the amount of conductive paste 50 removed from the end face 3a increases. Therefore, after the step of reducing the amount of conductive paste 50 adhering, the amount of conductive paste 51 adhering to the end face 3a is unlikely to be greater than the desired amount. Based on the above, this manufacturing method can control the amount of conductive paste 51 adhering to the end face 3a to the desired amount.

[0128] This manufacturing method includes the following steps after the step of reducing the amount of conductive paste 50 adhered: collecting the conductive paste P2 removed from the end face 3a and the conductive paste P2 adhered to the mesh MS.

[0129] In this case, the collected conductive paste P2 can be applied to the end face 3a of another blank 3. That is, the collected conductive paste P2 can be reused. Therefore, in this manufacturing method, the cost required to apply conductive paste to the end face 3a of the blank 3 can be reduced.

[0130] The applicator 100 includes a holding member 111, an applicating mechanism 130, a removing member 142, and a moving mechanism 120. The removing member 142 includes a mesh MS. The holding member 111 holds a blank 3 including an end face 3a in such a way that the end face 3a is exposed. The applicating mechanism 130 includes a surface 131a to which conductive paste 50 is supplied for applicating the end face 3a. The moving mechanism 120 moves the holding member 111 holding the blank 3 relative to the surface 131a and the removing member 142. The moving mechanism 120 moves the holding member 111 and the applicating mechanism 130 relative to each other until the conductive paste supplied to the surface 131a contacts the end face 3a. The moving mechanism 120 moves the removing member 142 and the blank 3 relative to each other until the conductive paste 50 contacts the mesh MS in the opening direction of the mesh MS. The moving mechanism 120 moves the removal component 142 and the blank 3 relative to each other from the position where the conductive paste 50 and the mesh MS are in contact, along the direction in which the removal component 142 separates from the blank 3.

[0131] In the application device 100, a conductive paste supplied to the surface 131a is applied to the end face 3a of the blank 3. The amount of conductive paste 50 adhering to the end face 3a is reduced by bringing the conductive paste 50 applied to the end face 3a into contact with the mesh MS. In the application device 100, since the removal member 142 includes the mesh MS, the formation of closed spaces within the conductive paste 50 can be prevented when the removal member 142 and the blank 3 move relative to each other in the aforementioned separation direction. Therefore, the generation of air bubbles within the conductive paste 51 remaining on the end face of the blank 3 can be suppressed when the removal member 142 and the blank 3 move relative to each other in the aforementioned separation direction. Based on the above, the application device 100 suppresses a decrease in the reliability of electronic components.

[0132] In the applicator 100, the removal mechanism 140 includes a scraper 143 that slides on the mesh MS and a collection section 145 disposed below the mesh MS.

[0133] The device 100 can easily collect the conductive paste P2 attached to the mesh MS.

[0134] In the application device 100, the removal mechanism 140 includes a scraper 144 in addition to a scraper 143 and a collection section 145. The scraper 144 is positioned opposite to the scraper 143 across the removal member 142 and slides on the back side of the mesh MS. By using the scraper 143 sliding on the surface of the mesh MS and the scraper 144 sliding on the back side of the mesh MS, the scrapers 143 and 144 slide up and down on the mesh MS, thus efficiently allowing the conductive paste P2 to fall from the opening of the mesh MS. Therefore, the application device 100 can more easily collect the conductive paste P2 adhering to the mesh MS.

[0135] In the feeding device 100, the moving mechanism 120 includes an adjustment part 121, which adjusts the relative height position of the holding member 111 of the blank 3 with respect to the surface 131a and the removal member 142.

[0136] The feeding device 100 can easily realize the steps of moving the feeding mechanism 130 and the blank 3 relative to each other and the steps of moving the removal member 142 and the blank 3 relative to each other.

[0137] Next, refer to Figure 21 A modified example of the step of reducing the amount of conductive paste 50 applied to end face 3a will be described. Figure 21 This is a schematic diagram illustrating the manufacturing process of a modified example of this embodiment. In this modified example, the positional relationship between the end face 3a and the mesh MS in the step of reducing the amount of conductive paste 50 applied differs from that in the embodiment described above. Hereinafter, the differences between the embodiment described above and this modified example will be mainly explained.

[0138] In this modified example, after the worktable 141 moves below the holding member 111, the moving mechanism 120 moves the removal member 142 and the blank 3 relative to each other until the end face 3a with the conductive paste 50 is separated from the mesh MS. Furthermore, in this modified example, the conductive paste 50 comes into contact with the mesh MS through the relative movement between the blank 3 and the removal member 142. Therefore, in this modified example, the position where the end face 3a with the conductive paste 50 is separated from the mesh MS includes the position where the conductive paste 50 is in contact with the mesh MS. Next, the moving mechanism 120 moves the removal member 142 and the blank 3 relative to each other from the position where the end face 3a with the conductive paste 50 is separated from the mesh MS along the direction of separation between the removal member 142 and the blank 3. In this modified example, when the conductive paste 50 separates from the mesh MS, only a portion of the conductive paste 50 is removed by the mesh MS, leaving a portion of the conductive paste 50 on the mesh MS. Therefore, in this modified example, through the relative movement between the removal member 142 and the blank 3, while leaving the conductive paste 50 on the end face 3a, the amount of conductive paste 50 adhering to the end face 3a is reduced.

[0139] In a modified example, the relative movement step includes the following steps: moving the removal member 142 and the blank 3 relative to each other to a position where the end face 3a is separated from the mesh MS. The aforementioned relative movement step along the separation direction includes the following steps: moving the removal member 142 and the blank 3 relative to each other from the position where the end face 3a is separated from the mesh MS along the aforementioned separation direction.

[0140] In this modified example, by reducing the amount of adhesive, the amount of conductive paste 50 removed from the end face 3a can be suppressed. Therefore, after the step of reducing the amount of adhesive, the amount of conductive paste 51 adhering to the end face 3a is unlikely to be less than the desired amount. Based on the above, in this modified example, the amount of conductive paste 51 adhering to the end face 3a can be controlled to the desired amount.

[0141] In the above embodiments, the moving mechanism 120 can also move the removal member 142 and the blank 3 relative to each other until the end face 3a is in contact with the mesh MS. The moving mechanism 120 can also move the removal member 142 and the blank 3 relative to each other from the position where the end face 3a is in contact with the mesh MS along the direction in which the removal member 142 and the blank 3 approach each other. The moving mechanism 120 can also move the removal member 142 and the blank 3 relative to each other until the end face 3a is separated from the mesh MS.

[0142] In the manufacturing method of electronic component 1, the amount of conductive paste 50 removed varies depending on the positional relationship between the end face 3a and the mesh MS. Hereinafter, the positional relationship between the end face 3a and the mesh MS when the removal member 142 and the blank 3 are moved relative to each other to a position where the end face 3a contacts the mesh MS is referred to as the first positional relationship. The positional relationship between the end face 3a and the mesh MS when the removal member 142 and the blank 3 are moved relative to each other from the position where the end face 3a contacts the mesh MS along a direction approaching the blank 3 is referred to as the second positional relationship. The positional relationship between the end face 3a and the mesh MS when the removal member 142 and the blank 3 are moved relative to each other to a position where the end face 3a separates from the mesh MS is referred to as the third positional relationship.

[0143] Here, refer to Figure 22 and Figure 23 The amount of conductive paste 51 adhered under each of the first, second, and third positional relationships is described in more detail. Figure 22 This is a graph used to illustrate the amount of conductive paste adhered. Figure 23 It is a graph illustrating the experimental results related to the amount of conductive paste adhered.

[0144] In order to determine the amount of conductive paste 51 adhered under each of the first, second, and third positional relationships, the inventors conducted experiments. In these experiments, under each of the first, second, and third positional relationships, a step was taken to reduce the amount of conductive paste 50 adhered to the end face 3a, and then the amount of conductive paste 51 adhered was determined.

[0145] In Experimental Example 1, after applying conductive paste 50 to the end face 3a of the blank 3 using the manufacturing method described in the above embodiment, a step of reducing the amount of conductive paste 50 adhering to the end face 3a is performed in the first positional relationship. The step of reducing the amount of conductive paste 50 adhering is performed in the same manner as the manufacturing method described in the above embodiment. Then, length L4, length L5, and ratio R1 are determined as indicators of the amount of conductive paste 51 adhering. Furthermore, in the first positional relationship, length L6 is determined as an indicator of the amount of conductive paste 51 applied to the sides 3c and 3e sufficiently ensuring its application.

[0146] like Figure 22 As shown, length L4 is the length between end face 3a at approximately the center of the third direction D3 and the surface of the conductive paste 51 located on end face 3a. Length L4 can also be described as the thickness of the conductive paste 51 at approximately the center of the third direction D3.

[0147] Length L5 is the length between the end face 3a and the surface of the conductive paste 51 located on the end face 3a at the third-direction D3 position of the internal electrode 7 closest to one side 3e. Length L5 can also be described as the thickness of the conductive paste 51 at the third-direction D3 position of the internal electrode 7 closest to one side 3e. Length L5 can also be the length between the end face 3a and the surface of the conductive paste 51 located on the end face 3a at the third-direction D3 position of the internal electrode 9 closest to the other side 3e. In this case, length L5 can also be described as the thickness of the conductive paste 51 at the third-direction D3 position of the internal electrode 9 closest to the other side 3e.

[0148] Ratio R1 is the ratio of length L5 to length L4.

[0149] Length L6 is the length between side 3c and the surface of the conductive paste 51 located on side 3c. Length L6 can also be described as the thickness of the conductive paste 51 on side 3c. Length L6 can also be the length between side 3e and the surface of the conductive paste 51 located on side 3e. In this case, length L6 can also be described as the thickness of the conductive paste 51 on side 3e.

[0150] Lengths L4 and L6 can be measured, for example, as follows.

[0151] First, a cross-sectional photograph of the billet 3 is obtained. This cross-sectional photograph is, for example, a photograph taken at approximately the center of the billet 3 in the second direction D2, cutting along a plane in the third direction D3, with the conductive paste 51 applied to the end face 3a. The cross-sectional photograph is, for example, a SEM (scanning electron microscope) photograph. The obtained cross-sectional photograph is subjected to software-based image processing to determine the position of the end face 3a, the position of the side face 3c, and the position of the surface of the conductive paste 51, and to calculate the lengths L4 and L6 on the obtained cross-sectional photograph.

[0152] The ratio R1 is calculated by dividing the length L4, which is measured as described above, by the length L5.

[0153] The length L5 can be measured, for example, as follows. First, a cross-sectional photograph of the blank 3 is obtained. This cross-sectional photograph is, for example, a photograph taken at a position corresponding to the end in the second direction D2 of the internal electrodes 7, 9, with the blank 3 having the conductive paste 51 applied to the end face 3a cut along the plane of the third direction D3. The cross-sectional photograph is, for example, a SEM (scanning electron microscope) photograph. The obtained cross-sectional photograph is subjected to software-based image processing to determine the position of the end face 3a and the position of the surface of the conductive paste 51, and the length L5 on the obtained cross-sectional photograph is calculated.

[0154] In Experiment 2, except for the step of reducing the amount of conductive paste 50 applied to end face 3a under the second positional relationship, the lengths L4, L5, L6 and the ratio R1 were determined in the same manner as in Experiment 1.

[0155] In Experiment 3, except for the step of reducing the amount of conductive paste 50 applied to end face 3a under the third positional relationship, the lengths L4, L5, L6 and the ratio R1 were determined in the same manner as in Experiment 1.

[0156] The results of Experiments 1, 2 and 3 are shown in Figure 23 .Depend on Figure 23 It can be seen that the length L4 in Experimental Example 1 and Experimental Example 2 is smaller than the length L4 in Experimental Example 3. That is, it can be seen that by moving the removal member 142 and the blank 3 relative to each other to a position where at least the end face 3a is in contact with the mesh MS, the amount of conductive paste 50 removed from the end face 3a increases at approximately the center of the third direction D3 of the end face 3a.

[0157] In contrast, it can be seen that the length L5 in Experimental Example 1, Experimental Example 2, and Experimental Example 3 are the same. That is, it can be seen that even if the positional relationship between the end face 3a and the mesh MS is changed, the amount of conductive paste 50 removed from the end face 3a at the position on the third direction D3 of the internal electrodes 7 and 9 arranged closest to the side 3e is difficult to change. Along with this, it can be seen that by moving the removal member 142 and the blank 3 relative to each other to a position where at least the end face 3a is in contact with the mesh MS, the ratio R1 is reduced.

[0158] Furthermore, it is known that the length L6 in Experimental Example 1 and Experimental Example 2 is smaller than the length L6 in Experimental Example 3. That is, it is known that by moving the removal member 142 and the blank 3 relative to each other to a position where at least the end face 3a is in contact with the mesh MS, the amount of conductive paste 50 removed from the sides 3c and 3e increases.

[0159] Thus, in the manufacturing method of electronic component 1, the amount of conductive paste 50 removed varies depending on the positional relationship between the end face 3a and the mesh MS. Therefore, by adopting any one of the first, second, and third positional relationships according to the amount of conductive paste 50 to be removed, the amount of conductive paste 51 adhered can be easily controlled to the desired amount.

[0160] Furthermore, uniformity of the thickness of the conductive paste 51 on the end face 3a can be achieved in each of the first, second, and third positional relationships. To demonstrate that uniformity of the thickness of the conductive paste 51 on the end face 3a can be achieved, the inventors conducted further experiments.

[0161] In Experiment 4, a flat plate-shaped removal member was prepared to replace the removal member 142, which included the mesh MS. In Experiment 4, after applying the conductive paste 50 to the end face 3a of the blank 3 using the method described in the above embodiment, the flat plate-shaped removal member was used to reduce the amount of conductive paste 50 adhering to the end face 3a. In Experiment 4, when reducing the amount of conductive paste 50 adhering to the end face 3a, firstly, the removal member and the blank 3 were moved relative to each other until the conductive paste 50 applied to the end face 3a was in contact with the flat plate-shaped removal member. Then, the flat plate-shaped removal member and the blank 3 were moved relative to each other from the position where the conductive paste 50 was in contact with the flat plate-shaped removal member in the direction of separation between the flat plate-shaped removal member and the blank 3. Then, the length L4, length L5, and ratio R1 were determined as indicators of the amount of conductive paste 50 adhering to the end face 3a.

[0162] The results in Experiment Example 4 are shown in Figure 23As described above, length L4 can also be considered as the thickness of the conductive paste 51 at approximately the center of the third direction D3, and length L5 can also be considered as the thickness of the conductive paste 51 at the position on the third direction D3 of the internal electrode 9 disposed closest to the other side 3e. Therefore, the ratio of length L5 to length L4, i.e., ratio R1, can also be considered as an indicator of the uniformity of the thickness of the conductive paste 51 on the end face 3a. For example, the closer the ratio R1 is to 1.0, the smaller the difference between length L4 and length L5, and the more uniform the thickness of the conductive paste 51 on the end face 3a.

[0163] Depend on Figure 23 It is evident that the ratio R1 in Experimental Example 4 is greater than the ratio R1 in Experimental Examples 1, 2, and 3. Therefore, it can be concluded that by using the removal member 142 including the mesh MS, compared to using a flat removal member, uniformity of the thickness of the conductive paste 51 on the end face 3a can be achieved. Furthermore, it is evident that the ratio R1 in Experimental Examples 1 and 2 is smaller than the ratio R1 in Experimental Example 3. Therefore, it can be concluded that by moving the removal member 142 and the blank 3 relative to each other to a position where at least the end face 3a is in contact with the mesh MS, uniformity of the thickness of the conductive paste 51 on the end face 3a can be reliably achieved.

[0164] Next, refer to Figure 24 Another variation of the step of reducing the amount of conductive paste 50 applied to end face 3a will be described. Figure 24 This is a schematic diagram illustrating a manufacturing method of another variation of this embodiment. In this variation, the positional relationship between the end face 3a and the mesh MS in the step of reducing the amount of conductive paste 50 applied differs from that in the embodiments and variations described above. Hereinafter, the differences between the embodiments and variations described above and this variation will be mainly explained.

[0165] For example, when the conductive paste 50 is in contact with the mesh MS, the moving mechanism 120 moves the removal member 142 and the blank 3 relative to each other from the position where the conductive paste 50 and the mesh MS are in contact, in a direction intersecting the opening direction of the mesh MS. This step of moving the removal member 142 and the blank 3 relative to each other in a direction intersecting the opening direction of the mesh MS is performed before the step of moving the removal member 142 and the blank 3 in a direction separating them. In this modified example, when the conductive paste 50 is in contact with the mesh MS, the moving mechanism 120 moves the removal member 142 and the blank 3 relative to each other from the position where the conductive paste 50 and the mesh MS are in contact, in the Y-axis direction. In this modified example, the relative movement between the removal member 142 and the blank 3 is also performed by moving the holding member 111 via the moving mechanism 120. For example, when the position of the worktable 141 in the Y-axis direction is fixed, the adjustment unit 122 moves the position of the moving mechanism 120 in the Y-axis direction. Therefore, the blank 3 moves relative to the mesh MS along the Y-axis. That is, it can also be said that the moving mechanism 120 makes the blank 3 slide relative to the mesh MS in a direction that intersects with the opening direction of the mesh MS while the conductive paste 50 is in contact with the mesh MS.

[0166] As described above, by moving the removal member 142 and the blank 3 relative to each other in a direction intersecting the opening direction of the mesh MS, the amount of conductive paste 50 adhering to the end face 3a is also reduced during this movement. Here, in Figure 24 In the example shown, to distinguish between the conductive paste 50 before and after movement, the conductive paste 50 before movement is illustrated as conductive paste 50A, and the conductive paste 50 after movement is illustrated as conductive paste 50B. For example, the amount of conductive paste 50B adhering to the end face 3a can be greater than the desired amount. From the viewpoint of ensuring the thickness of conductive paste 50B at the corner of the blank 3, a protective film of conductive paste 50B can also be formed on the end face 3a, for example, after the removal member 142 and the blank 3 are moved relative to each other in a direction intersecting the opening direction of the mesh MS.

[0167] In this modified example, except when the conductive paste 50 separates from the removal member 142, a portion of the conductive paste 50 is also removed by the mesh MS when the removal member 142 and the blank 3 are moved relative to each other in a direction intersecting the opening direction of the mesh MS. That is, in the step of reducing the amount of conductive paste 50 adhering, the amount of conductive paste removed from the end face increases.

[0168] Therefore, after the step of reducing the amount of adhesion, it is difficult for the amount of conductive paste adhering to the end face to be greater than the desired amount. Based on the above, in this modified example, the amount of conductive paste adhering to the end face can be controlled to the desired amount.

[0169] Next, refer to Figure 25 and Figure 26 Another variation of the step of reducing the amount of conductive paste 50 applied to end face 3a will be described. Figure 25 and Figure 26 This is a schematic diagram illustrating a manufacturing method of another variation of this embodiment. In this variation, the positional relationship between the end face 3a and the mesh MS in the step of reducing the amount of conductive paste 50 applied differs from that in the embodiments and variations described above. Hereinafter, the differences between the embodiments and variations described above and this variation will be mainly explained.

[0170] In this modified example, the moving mechanism 120 repeats the steps of moving the removal member 142 and the blank 3 relative to each other and moving the removal member 142 and the blank 3 in the direction of separation, as described in the above embodiments. The moving mechanism 120 repeats the steps of relative movement and movement in the direction of separation while changing the position where the conductive paste 50 applied to the end face 3a contacts the mesh MS.

[0171] In this modified example, firstly, similar to the manufacturing method in the above-described embodiments, after the moving mechanism 120 applies the conductive paste 50 to the end face 3a of the blank 3, it moves the removal member 142 and the blank 3 relative to each other until the conductive paste 50 contacts the mesh MS. In this modified example, the position where the conductive paste 50 contacts the mesh MS can be either the position where the end face 3a contacts the mesh MS or the position where the end face 3a and the mesh MS are separated. For example, in Figure 25 In the example shown, the conductive paste 50 is in contact with the mesh MS at the position where the end face 3a is in contact with the mesh MS. In region MSa on the mesh MS, the end face 3a is in contact with the mesh MS.

[0172] Next, similar to the manufacturing method in the above embodiments, the moving mechanism 120 moves the removal member 142 and the blank 3 relative to each other from the position where the conductive paste 50 and the removal member 142 are in contact along the direction in which the removal member 142 separates from the blank 3. Thus, when the conductive paste 50 separates from the mesh MS, only a portion of the conductive paste 50 is removed by the mesh MS of the removal member 142.

[0173] Here, in Figure 25 and Figure 26In the example shown, the conductive paste 50 applied to the end face 3a when the end face 3a and the mesh MS are in contact with each other in the region MSa is illustrated as conductive paste 50C, and the conductive paste 50 remaining on the end face 3a after the conductive paste 50C separates from the mesh MS is illustrated as conductive paste 50D.

[0174] Next, the moving mechanism 120 moves the removal member 142 and the blank 3 relative to each other from the position where the conductive paste 50D and the mesh MS are separated to the position where the conductive paste 50D and the mesh MS are in contact. This position where the conductive paste 50D and the mesh MS are in contact is a different position from the previous position where the conductive paste 50C and the mesh MS were in contact. In this modified example, the other position where the conductive paste 50D and the mesh MS are in contact can be either the position where the end face 3a is in contact with the mesh MS, or the position where the end face 3a is separated from the mesh MS. For example, in Figure 26 In the example shown, the conductive paste 50D is in contact with the mesh MS at the position where end face 3a is in contact with the mesh MS. In region MSb on the mesh MS, end face 3a is in contact with the mesh MS.

[0175] Next, similar to the manufacturing method in the above embodiment, the moving mechanism 120 moves the removal member 142 and the blank 3 relative to each other from the position where the conductive paste 50D and the removal member 142 are in contact, along the direction in which the removal member 142 separates from the blank 3. Thus, when the conductive paste 50D separates from the removal member 142, only a portion of the conductive paste 50D is removed by the mesh MS of the removal member 142, leaving conductive paste 51 on the mesh MS as part of the conductive paste 50D.

[0176] Thus, in this modified example, the regions MSa where the conductive paste 50C contacts the mesh MS and the regions MSb where the conductive paste 50D contacts the mesh MS are different from each other. That is, in this modified example, the step of reducing the amount of conductive paste 50 adhering to the end face 3a can be said to include the following steps: in multiple different regions on the mesh MS, the conductive paste 50 applied to the end face 3a is brought into contact with the mesh MS.

[0177] In this modified example, the step of reducing the amount of conductive paste 50 attached includes the following steps: while changing the position where the conductive paste 50 applied to the end face 3a contacts the mesh MS, the steps of relative movement described above and relative movement along the separation direction described above are repeated.

[0178] In this modified example, since the conductive paste 50 comes into contact with the mesh MS multiple times, the amount of conductive paste 50 removed from the end face 3a is further increased during the step of reducing the amount of conductive paste 50 adhering to the end face 3a. Therefore, after the step of reducing the amount of conductive paste 50 adhering to the end face 3a, the amount of conductive paste 51 adhering to the end face 3a is reliably unlikely to exceed the desired amount. Based on the above, in this modified example, the amount of conductive paste 51 adhering to the end face 3a can be further controlled to the desired amount.

[0179] The embodiments and variations of this disclosure have been described above, but this disclosure is not necessarily limited to the above embodiments and variations, and various changes can be made without departing from its spirit.

[0180] The removal mechanism 140 may also exclude the scraper 144. Even in this case, the conductive paste P2 is caused to fall from the opening of the mesh MS by the scraper 143 sliding on the mesh MS, thereby collecting the conductive paste P2 in the collection section 145.

[0181] In the above-described variation, the steps of moving the removal member 142 and the blank 3 relative to each other and moving the removal member 142 and the blank 3 in the direction of separation are repeated twice, but the number of repetitions is not limited to twice. That is, the number of repetitions can be three or more. For example, the number of repetitions can also be set according to the desired amount of conductive paste 51 adhering to the end face 3a. Moreover, after the above repetitions, the steps of moving the removal member 142 and the blank 3 relative to each other in the direction intersecting the opening direction of the mesh MS and moving the removal member 142 and the blank 3 in the direction of separation can also be performed.

[0182] In the above-described variation, when the removal member 142 and the blank 3 move relative to each other in a direction intersecting the opening direction of the mesh MS, the moving mechanism 120 moves the removal member 142 and the blank 3 relative to each other in the Y-axis direction. However, the direction of movement when the removal member 142 and the blank 3 move relative to each other in a direction intersecting the opening direction of the mesh MS is not limited to the Y-axis direction. For example, when the removal member 142 and the blank 3 move relative to each other in a direction intersecting the opening direction of the mesh MS, the moving mechanism 120 may also move the removal member 142 and the blank 3 relative to each other in the X-axis direction.

Claims

1. A method for manufacturing an electronic component, wherein, The manufacturing method of this electronic component includes the following steps: Prepare a conductive paste and a preform including the end faces; Prepare a removal component, including a mesh; The conductive paste is applied to the end face; and The adhesion reduction step involves leaving the conductive paste on the end face while simultaneously reducing the amount of conductive paste adhering to the end face. The adhesion reduction step includes the following steps: The relative movement step involves moving the removal member and the blank relative to each other until the conductive paste applied to the end face is in contact with the mesh in the opening direction of the mesh; and The separation direction relative movement step involves moving the removal component and the blank from the position where the conductive paste applied to the end face contacts the mesh in the direction of separation between the removal component and the blank.

2. The method for manufacturing an electronic component according to claim 1, wherein, The relative movement step includes the following steps: moving the removal component and the blank relative to each other until the end face contacts the mesh. The separation direction relative movement step includes the following steps: moving the removal component and the blank from the position where the end face contacts the mesh relative to each other along the separation direction.

3. The method for manufacturing an electronic component according to claim 1, wherein, The relative movement step includes the following steps: moving the removal component and the blank relative to each other to a position where the end face is separated from the mesh. The separation direction relative movement step includes the following steps: moving the removal component and the blank from the position where they are separated from the mesh along the separation direction.

4. The method for manufacturing an electronic component according to any one of claims 1 to 3, wherein, The adhesion reduction step further includes the following step before the separation direction relative movement step: with the conductive paste applied to the end face in contact with the mesh, the removal member and the blank are moved relative to each other from the position where the conductive paste applied to the end face is in contact with the mesh in a direction intersecting the opening direction of the mesh.

5. The method for manufacturing an electronic component according to any one of claims 1 to 4, wherein, The adhesion reduction step includes the following steps: while changing the position where the conductive paste applied to the end face contacts the mesh, the relative movement step and the separation direction relative movement step are repeated.

6. The method for manufacturing an electronic component according to any one of claims 1 to 5, wherein, The process further includes the following step after the adhesion reduction step: collecting the conductive paste removed from the end face and the conductive paste adhered to the mesh.

7. A device for applying a conductive paste, wherein, The device for applying the conductive paste includes: A retaining member that holds a blank, including an end face, in a manner that exposes the end face; A coating mechanism, comprising a surface to which a conductive paste is supplied to the end face; Remove components, including mesh; and A moving mechanism that moves the holding member holding the blank relative to the surface and the removing member. The moving mechanism moves the blank and the applying mechanism relative to each other until the conductive paste supplied to the surface contacts the end face, moves the removing member and the blank relative to each other until the conductive paste supplied to the end face contacts the mesh in the opening direction of the mesh, and moves the removing member and the blank relative to each other from the position where the conductive paste supplied to the end face contacts the mesh in the direction of separation between the removing member and the blank.

8. The apparatus for applying the conductive paste according to claim 7, wherein, The conductive paste applicator also includes a collection mechanism that collects the conductive paste removed from the end face and the conductive paste adhering to the mesh.

9. The apparatus for applying the conductive paste according to claim 8, wherein, The collection mechanism includes a scraper that slides on the mesh and a collection section disposed below the mesh.

10. The apparatus for applying the conductive paste according to any one of claims 7 to 9, wherein, The moving mechanism includes an adjustment section that adjusts the relative height position of the holding member holding the blank relative to the surface and the removing member.

Images