Electronic assemblies and boards

Abstract

This disclosure provides an electronic component and a board. The electronic component includes: a capacitor including a body and an outer electrode, the body including a dielectric layer and an inner electrode, the outer electrode being disposed on the body; a connection terminal disposed on the outer electrode; and a bonding layer disposed between the outer electrode and the connection terminal, the bonding layer including Au. The outer electrode includes an electrode layer connected to the inner electrode, a Ni plating layer disposed on the electrode layer, and a Sn plating layer disposed on the Ni plating layer. When the average thickness of the bonding layer is defined as T1 and the average thickness of the Sn plating layer is defined as T2, T2 > T1.

Description

[0001] This application claims the benefit of priority to Korean Patent Application No. 10-2025-0039948, filed on March 28, 2025, with the Korean Intellectual Property Office, the entire disclosure of which is incorporated herein by reference. Technical Field

[0002] This disclosure relates to an electronic component and a board. Background Technology

[0003] Multilayer ceramic capacitors (MLCCs) are chip capacitors mounted on printed circuit boards in various types of electronic products, such as imaging devices including liquid crystal displays (LCDs) and plasma display panels (PDPs), computers, smartphones, mobile phones, and circuits such as on-board chargers (OBCs) and DC-DC converters for electric vehicles, and can be used to charge or discharge them.

[0004] The dielectric layer included in an MLCC can be piezoelectric and electrostrictive. Therefore, when a DC or AC voltage is applied to an MLCC, piezoelectricity may occur between the internal electrodes, causing vibration.

[0005] Such vibrations can be transmitted through the external electrodes of the MLCC to the printed circuit board on which the MLCC is mounted, thereby generating vibrational sound. Vibrational sound can correspond to audible frequencies in the range of 20Hz to 20000Hz that cause discomfort to humans, and vibrational sound that causes discomfort can be defined as acoustic noise.

[0006] In the prior art, attempts have been made to reduce acoustic noise by placing connection terminals on one surface of the external electrode of an MLCC.

[0007] However, MLCCs and connectors can be formed separately and then bonded together. Therefore, in the process of mounting electronic components in which MLCCs and connectors are bonded together onto a substrate, misalignment due to self-alignment may occur between the MLCCs and connectors, and the adhesive strength may be reduced due to insufficient bonding strength.

[0008] To maximize acoustic noise reduction, slits can be formed in the connector terminals to reduce the height of the solder fillet formed during mounting. When slits are formed in the connector terminals, the printed circuit board and connector terminals can have different forms. As the contact area between the connector terminals and the external electrodes of the capacitor decreases, the likelihood of misalignment defects and adhesion strength defects due to insufficient bond strength may increase.

[0009] Therefore, there is a need for an improved bonding structure between the MLCC and the connector, which can prevent misalignment defects between the MLCC and the connector and the reduction in adhesive strength due to insufficient bonding strength between the MLCC and the connector. Summary of the Invention

[0010] One aspect of this disclosure is to mitigate misalignment defects that occur between the capacitor and the connection terminals.

[0011] Another aspect of this disclosure is to prevent a decrease in adhesive strength due to insufficient bonding strength between the capacitor and the connecting terminals.

[0012] However, the aspects of this disclosure are not limited to those set forth herein, and will be more readily understood in the process of describing specific exemplary embodiments of this disclosure.

[0013] According to one aspect of this disclosure, an electronic component is provided, the electronic component comprising: a capacitor including a body and an external electrode, the body including a dielectric layer and an internal electrode, the external electrode disposed on the body; a connection terminal disposed on the external electrode; and a bonding layer disposed between the external electrode and the connection terminal, the bonding layer comprising Au. The external electrode may include an electrode layer connected to the internal electrode, a Ni plating layer disposed on the electrode layer, and a Sn plating layer disposed on the Ni plating layer. When the average thickness of the bonding layer is defined as T1 and the average thickness of the Sn plating layer is defined as T2, T2 > T1 can be satisfied.

[0014] According to another aspect of this disclosure, a board is provided, the board comprising: a substrate; electrode pads disposed on the substrate; and electronic components as described above disposed on the electrode pads.

[0015] According to an example embodiment of this disclosure, a bonding layer including Au can be disposed between the external electrode of the capacitor and the connection terminal, thereby mitigating misalignment defects in the bonding between the capacitor and the connection terminal.

[0016] According to an example embodiment of this disclosure, a bonding layer including Au can be disposed between the external electrode of the capacitor and the connection terminal, thereby preventing a reduction in the adhesive strength between the capacitor and the connection terminal due to insufficient bonding strength.

[0017] However, the various advantages and effects of this disclosure are not limited to those set forth herein, and will be more readily understood in the process of describing specific exemplary embodiments of this disclosure. Attached Figure Description

[0018] The above and other aspects, features and advantages of this disclosure will become clearer from the following detailed embodiments, taken in conjunction with the accompanying drawings, in which: Figure 1 This is a schematic perspective view of an electronic component according to an exemplary embodiment of the present disclosure; Figure 2 This is a schematic perspective view of an electronic component according to an exemplary embodiment of the present disclosure, excluding the connecting electrode portion; Figure 3 It is along Figure 1 A schematic cross-sectional view taken from line I-I' in the diagram; Figure 4 It is along Figure 1 A schematic cross-sectional view taken from line II-II' in the diagram; Figure 5 yes Figure 3 A schematic enlarged view of the region "P" in the diagram; Figure 6 This is a schematic cross-sectional view of an electronic component mounted on a substrate according to an exemplary embodiment of the present disclosure; Figure 7 A schematic perspective view of an electronic component according to another exemplary embodiment of this disclosure; and Figure 8 It is along Figure 7 A schematic cross-sectional view taken from line III-III' in the diagram. Detailed Implementation

[0019] In the following description, exemplary embodiments of the present disclosure are illustrated with reference to the accompanying drawings. However, the present disclosure may be exemplified in many different forms and should not be construed as limited to the specific exemplary embodiments set forth herein. Additionally, exemplary embodiments of the present disclosure may be provided to describe the present disclosure more completely to those skilled in the art. Therefore, for clarity of description, the shape and size of elements in the drawings may be exaggerated, and elements denoted by the same reference numerals in the drawings may be the same elements.

[0020] For clarity of this disclosure, parts irrelevant to the description have been omitted, and dimensions (e.g., thickness) have been enlarged to clearly indicate layers and regions. Throughout the specification, the same reference numerals denote the same parts that have the same function within the same area. Throughout the specification, unless otherwise expressly stated, when an element is defined as “including” or “comprising,” it means that it may also include other elements, rather than excluding them.

[0021] In the accompanying drawings, the X direction can be the thickness direction, the Y direction can be the length direction, the Z direction can be the width direction, and the stacking direction (e.g., the stacking direction) of the inner electrodes 121 and 122 and / or the dielectric layer 111 can be the thickness direction or the width direction.

[0022] Figure 1 This is a schematic perspective view of an electronic component according to an exemplary embodiment of the present disclosure.

[0023] Reference Figure 1 The electronic component 1000 may include a body 110 and conductive portions 171 and 172 disposed on the body 110. Conductive portions 171 and 172 may be regions including external electrodes 131 and 132 (described below), connection terminals 141 and 142, and bonding layers 161 and 162. In some cases, conductive portions 171 and 172 may be regions including connection electrode portions 151 and 152 disposed on the external electrodes 131 and 132 and the connection terminals 141 and 142.

[0024] Figure 2 This is a schematic perspective view of an electronic component according to an exemplary embodiment of the present disclosure, excluding the connecting electrode portion.

[0025] Reference Figure 1 and Figure 2 The electronic component 1000 may include: a capacitor 100, including a body 110 and external electrodes 131 and 132 disposed on the body 110; and connection terminals 141 and 142 disposed on the external electrodes 131 and 132.

[0026] The specific shape of the main body 110 is not limited. However, as Figure 2 As shown, the body 110 may have a hexahedral shape or a shape similar to a hexahedron. During the sintering process, the ceramic powder particles included in the body 110 may shrink, so that the body 110 may not have a hexahedral shape with perfectly straight lines, but may have a generally hexahedral shape.

[0027] The main body 110 may have: a first surface 1 and a second surface 2, which are opposite to each other in a first direction (e.g., the X direction); a third surface 3 and a fourth surface 4, which are connected to the first surface 1 and the second surface 2, and are opposite to each other in a second direction (e.g., the Y direction) perpendicular to the first direction; and a fifth surface 5 and a sixth surface 6, which are connected to the first surface 1 and the second surface 2 and connected to the third surface 3 and the fourth surface 4, and are opposite to each other in a third direction (e.g., the Z direction) perpendicular to the first direction and the second direction.

[0028] Figure 3 It is along Figure 1 A schematic cross-sectional view taken from line I-I' in the diagram.

[0029] Reference Figure 3 The main body 110 may include a dielectric layer 111 and internal electrodes 121 and 122.

[0030] The dielectric layer 111 and the internal electrodes 121 and 122 may be alternately arranged in a first direction. That is, in the present disclosure, the first direction may refer to the lamination direction of the dielectric layer 111 and the internal electrodes 121 and 122.

[0031] The dielectric layers 111 may be in a sintered state, and adjacent dielectric layers 111 may be integrated with each other, such that the boundaries therebetween are not easily distinguishable without using a scanning electron microscope (SEM). The number of laminated dielectric layers is not limited, and the number of laminated dielectric layers may be determined in consideration of the size of the electronic component. For example, the body may be formed by laminating 400 or more dielectric layers.

[0032] The dielectric layer 111 may be formed by the following steps: preparing a ceramic slurry including ceramic powder particles, an organic solvent and a binder, coating the ceramic slurry on a carrier film and drying it to prepare a ceramic green sheet, and then sintering the ceramic green sheet. The ceramic powder particles are not limited as long as sufficient capacitance can be obtained therewith, and the ceramic powder particles may be, for example, barium titanate-based (BaTiO3-based) powder particles and CaZrO3-based paraelectric powder particles. As a more specific example, the barium titanate-based (BaTiO3-based) powder particles may be BaTiO3, (Ba 1-x Ca x )TiO3 (0<x<1), Ba(Ti 1-y Ca y )O3 (0<y<1), (Ba 1-x Ca x )(Ti 1-y Zr y )O3 (0<x<1, 0<y<1) and Ba(Ti 1-y Zr y )O3 (0<y<1), and the CaZrO3-based paraelectric powder particles may be (Ca 1-x Sr x )(Zr 1-y Ti y )O3 (0<x<1, 0<y<1).

[0033] The thickness td of the dielectric layer 111 is not limited.

[0034] The thickness td of the dielectric layer 111 may refer to the average thickness td of the dielectric layer 111. For example, in order to more easily achieve high capacitance and miniaturization of the electronic component 1000, the average thickness td of the dielectric layer 111 may be 0.35 μm or less. In order to improve the reliability of the electronic component 1000 under high temperature and high voltage conditions, the average thickness td of the dielectric layer 111 may be 1 μm or more.

[0035] The average thickness td of dielectric layer 111 can refer to the average thickness of one or more dielectric layers in a first direction.

[0036] The average thickness of the dielectric layer 111 in the first direction can be measured by scanning an image of the electronic assembly 1000 in both the first and second directions using a SEM at a magnification of 10,000. More specifically, the average thickness of a single dielectric layer 111 in the first direction can refer to the average thickness of a single dielectric layer 111 measured at four points spaced apart from each other at equal intervals in the second direction of the scanned image. The four points spaced apart from each other at equal intervals can be specified in the capacitor forming section Ac. Furthermore, when such an average measurement is performed on all four dielectric layers 111, the average thickness of the dielectric layer 111 in the first direction can be more generalized.

[0037] The main body 110 may include: a capacitor forming portion Ac disposed in the main body 110, wherein the capacitor forming portion Ac forms a capacitor by including a first inner electrode 121 and a second inner electrode 122 alternately disposed with the dielectric layer 111; and covering portions 112 and 113 disposed on the upper and lower portions of the capacitor forming portion Ac in a first direction.

[0038] The capacitor forming portion Ac can be a part that contributes to the capacitance of the capacitor 100, and can be formed by repeatedly stacking a plurality of first inner electrodes 121 and a plurality of second inner electrodes 122 with a dielectric layer 111 between the first inner electrodes 121 and the second inner electrodes 122, and can refer to the region where the first inner electrodes 121 and the second inner electrodes 122 are stacked on each other in the first direction. In addition, the first inner electrode 121 can be disposed at the uppermost end of the capacitor forming portion Ac in the first direction, and the second inner electrode 122 can be disposed at the lowermost end of the capacitor forming portion Ac in the first direction.

[0039] The inner electrodes 121 and 122 may include a first inner electrode 121 and a second inner electrode 122. The first inner electrode 121 and the second inner electrode 122 may be alternately arranged opposite each other, and a dielectric layer 111 is disposed between the first inner electrode 121 and the second inner electrode 122, and the first inner electrode 121 and the second inner electrode 122 may be exposed on the third surface 3 and the fourth surface 4 of the body 110, respectively. That is, in the example embodiment, one end of the first inner electrode 121 in the second direction may contact the third surface 3, and one end of the second inner electrode 122 in the second direction may contact the fourth surface 4.

[0040] The first inner electrode 121 can be connected to the first outer electrode 131, and the second inner electrode 122 can be connected to the second outer electrode 132.

[0041] The first inner electrode 121 may not be connected to the second outer electrode 132, but may be connected to the first outer electrode 131; similarly, the second inner electrode 122 may not be connected to the first outer electrode 131, but may be connected to the second outer electrode 132. That is, the first inner electrode 121 may be formed to be spaced apart from the fourth surface 4 by a predetermined distance, and the second inner electrode 122 may be formed to be spaced apart from the third surface 3 by a predetermined distance. Furthermore, the first inner electrode 121 and the second inner electrode 122 may be configured to be spaced apart from the fifth and sixth surfaces of the body 110.

[0042] The conductive metal included in the inner electrodes 121 and 122 may include one or more of Ni, Cu, Pd, Ag, Au, Pt, In, Sn, Al, Ti and alloys thereof, but this disclosure is not limited thereto.

[0043] The thickness te (e.g., average thickness te) of each of the inner electrodes 121 and 122 is not limited.

[0044] To more easily achieve high capacitance and miniaturization of the electronic component 1000, the average thickness te of each of the inner electrodes 121 and 122 can be 0.35 μm or less. To improve the reliability of the electronic component 1000 under high temperature and high voltage conditions, the average thickness te of each of the inner electrodes 121 and 122 can be 1 μm or greater.

[0045] The average thickness te of each of the inner electrodes 121 and 122 may refer to the average thickness of one or more of the inner electrodes 121 and 122 in the first direction.

[0046] The average thickness of each of the inner electrodes 121 and 122 in the first direction can be measured by scanning an image of the electronic assembly 1000 in both the first and second directions using a SEM at a magnification of 10,000x. More specifically, the average thickness of a single inner electrode in the first direction can refer to the average thickness of the single inner electrode measured at four points spaced apart from each other at equal intervals in the second direction of the scanned image. These four points spaced apart from each other at equal intervals can be specified in the capacitor forming section Ac. Furthermore, performing such an average measurement on the four inner electrodes 121 and 122 further generalizes the average thickness of each of the inner electrodes 121 and 122 in the first direction.

[0047] Reference Figure 3 External electrodes 131 and 132 may be disposed on the main body 110, and more specifically, external electrodes 131 and 132 may be disposed on the third surface 3 and the fourth surface 4 of the main body 110.

[0048] The external electrodes 131 and 132 may include a first external electrode 131 disposed on the third surface 3 of the body 110 and a second external electrode 132 disposed on the fourth surface 4 of the body 110.

[0049] The outer electrodes 131 and 132 may include electrode layers 131a and 132a disposed on the body 110, and the electrode layers 131a and 132a are connected to the inner electrodes 121 and 122.

[0050] Electrode layers 131a and 132a can be connected to inner electrodes 121 and 122 respectively, and can therefore be used to ensure electrical connectivity between outer electrodes 131 and 132 and inner electrodes 121 and 122.

[0051] Electrode layers 131a and 132a may include a conductive metal. Materials with excellent conductivity can be used as the conductive metal, and the material is not limited. For example, the conductive metal may be one or more of nickel (Ni), copper (Cu), and alloys thereof, and electrode layers 131a and 132a may include Cu to ensure conductivity and bonding strength by forming an alloy with the inner electrode comprising Ni.

[0052] As a more specific example of electrode layers 131a and 132a, electrode layers 131a and 132a may be sintered electrodes comprising conductive metal and glass or resin-based electrodes comprising conductive metal and resin.

[0053] Electrode layers 131a and 132a can be formed as a structure in which a sintered electrode and a resin-based electrode are sequentially formed on a body. Furthermore, the electrode layers can be formed by transferring a sheet including a conductive metal onto the body or by transferring a sheet including a conductive metal onto a sintered electrode.

[0054] The plating layers 131b, 132b, 131c and 132c can be disposed on the electrode layers 131a and 132a.

[0055] Coatings 131b, 132b, 131c, and 132c can be used to improve the sealing or mounting performance of electronic component 1000.

[0056] As a more specific example of plating layers 131b, 132b, 131c, and 132c, plating layers 131b, 132b, 131c, and 132c may include Ni plating layers 131b and 132b containing Ni and Sn plating layers 131c and 132c disposed on Ni plating layers 131b and 132b, the Sn plating layers 131c and 132c containing Sn. Additionally, Ni-Sn alloy layers 131b' and 132b' may be formed between Ni plating layers 131b and 132b and Sn plating layers 131c and 132c.

[0057] Reference Figure 3Connection terminals 141 and 142 may be disposed on external electrodes 131 and 132. More specifically, connection terminals 141 and 142 may be disposed on one of the upper and lower surfaces of external electrodes 131 and 132 in a first direction.

[0058] The connecting terminals 141 and 142 can connect the capacitor 100 to the printed circuit board described below, and can be used to reduce the acoustic noise of electronic components by absorbing vibrations generated in the capacitor 100.

[0059] When the connecting terminals 141 and 142 are formed using insulating material, the connecting terminals 141 and 142 may have pad patterns on their upper and lower surfaces for use as signal terminals and ground (GND) terminals.

[0060] When the connecting terminals 141 and 142 are formed using a conductive material, electrical connection can be achieved through all surfaces.

[0061] Figure 4 It is along Figure 1 A schematic cross-sectional view taken from line II-II' in the diagram.

[0062] Reference Figure 4 Cover portions 112 and 113 may be disposed on the upper and lower surfaces of the capacitor forming portion Ac in the first direction.

[0063] The covers 112 and 113 can be used to prevent damage to the internal electrodes due to physical and / or chemical stress.

[0064] Cover portions 112 and 113 may include the same material as the dielectric layer 111. That is, cover portions 112 and 113 may include ceramic materials, such as barium titanate-based ((BaTiO3)-based) ceramic materials.

[0065] The thickness tc of each of the covers 112 and 113 is not limited. For example, the thickness tc of each of the covers 112 and 113 can be 20 μm or less.

[0066] The average thickness tc of each of the covers 112 and 113 may refer to the dimension in the first direction, and may be the average of the dimensions of each of the covers 112 and 113 in the first direction measured at five points spaced apart from each other at equal intervals on the upper or lower part of the capacitor forming part Ac.

[0067] Reference Figure 4 Edge portions 114 and 115 may be provided on the side surface of capacitor forming portion Ac.

[0068] Edge portions 114 and 115 may include a first edge portion 114 disposed on one surface of the capacitor forming portion Ac in the width direction and a second edge portion 115 disposed on another surface of the capacitor forming portion Ac in the width direction. That is, edge portions 114 and 115 may be disposed on two surfaces of the capacitor forming portion Ac in the width direction, respectively.

[0069] like Figure 4 As shown, the edges 114 and 115 may refer to the region between the two ends of each of the first inner electrode 121 and the second inner electrode 122 and the outer surface of the body 110 in a cross-section cut in the width and thickness directions of the body 110.

[0070] Edges 114 and 115 can be used to prevent damage to the internal electrode due to physical and / or chemical stress.

[0071] Edges 114 and 115 can be formed by applying conductive paste to the portion of the ceramic green sheet other than the portion where the edge will be formed, to form an internal electrode.

[0072] The width wm (e.g., average width wm) of each of the edge portions 114 and 115 is not limited. For example, the average width wm of each of the edge portions 114 and 115 can be 20 μm or less.

[0073] The average width wm of each of the edge portions 114 and 115 may refer to the average size of the region between the inner electrode and the fifth surface in the third direction and the average size of the region between the inner electrode and the sixth surface in the third direction, and may be the average size of the dimensions of the edge portions 114 and 115 in the third direction measured at five points equally spaced apart from each other on the side surface of the capacitor forming portion Ac.

[0074] Figure 5 yes Figure 3 A schematic enlarged view of region "P" in the diagram. Since the structure of the second conductive part 172 is similar to the structure of the first conductive part 171, therefore... Figure 5 The structure of the second conductive part 172 is also shown accordingly.

[0075] In the prior art, attempts have been made to reduce acoustic noise by placing the connection terminals 141 and 142 on one surface of the external electrodes 131 and 132 of the capacitor 100.

[0076] However, since capacitor 100 and connecting terminals 141 and 142 can be manufactured separately and then bonded together, misalignment may occur between capacitor 100 and connecting terminals 141 and 142 due to self-alignment phenomena in the process of mounting electronic components 1000 on a printed circuit board. Additionally, adhesive strength may decrease when the bond strength is insufficient.

[0077] Therefore, in the exemplary embodiments of this disclosure, bonding layers 161 and 162 including Au can be disposed between the external electrodes 131 and 132 of the capacitor 100 and the connection terminals 141 and 142, and the electronic assembly 1000 can mitigate or prevent misalignment defects between the capacitor and the connection terminals and the reduction in adhesive strength caused by insufficient bonding strength between the capacitor and the connection terminals.

[0078] Specifically, refer to Figure 5 In an exemplary embodiment of this disclosure, the outer electrodes 131 and 132 may include electrode layers 131a and 132a electrically connected to the inner electrodes, Ni plating layers 131b and 132b disposed on the electrode layers 131a and 132a, and Sn plating layers 131c and 132c disposed on the Ni plating layers 131b and 132b. Bonding layers 161 and 162 comprising Au may be disposed between the outer electrodes 131 and 132 of the capacitor 100 and the connection terminals 141 and 142, thereby forming a strong Au-Sn metallic bond between the Sn plating layers 131c and 132c and the bonding layers 161 and 162. Therefore, it is possible to mitigate misalignment defects in the bonding between the capacitor and the connection terminals of the electronic component 1000 and the reduced adhesive strength caused by insufficient bonding strength between the capacitor and the connection terminals of the electronic component 1000.

[0079] The relationship between the average thickness T1 of each of the bonding layers 161 and 162 and the average thickness T2 of each of the Sn plating layers 131c and 132c can be appropriately adjusted to improve the bonding strength and mitigate bonding misalignment defects. Specifically, in the example embodiments of this disclosure, T2 > T1 can be satisfied, thereby further improving the bonding strength of the electronic component 1000 and mitigating bonding misalignment defects of the electronic component 1000.

[0080] When T2 / T1 is greater than 1000, the proportion of Sn at the bonding sites between Sn plating layers 131c and 132c and bonding layers 161 and 162 may be too large, and Au may be insufficient to aid bonding, potentially leading to bonding misalignment defects. Therefore, in the example embodiment, T2 / T1 can be greater than 1 and less than or equal to 1000, thereby maintaining the effect of mitigating bonding misalignment defects and suppressing their occurrence.

[0081] In an example embodiment, the average thickness T1 of each of the bonding layers 161 and 162 and the average thickness T2 of each of the Sn plating layers 131c and 132 can be measured in a cross section in a first and second direction obtained by polishing the electronic component 1000 to a third-direction upward midpoint, in the region where the external electrodes 131 and 132 are connected to each other with the connection terminals 141 and 142.

[0082] Specifically, the composition of each layer can be observed and analyzed in EDS mode of SEM, transmission electron microscopy (TEM), or scanning transmission electron microscopy (STEM). The average thickness of the region where Au is present can be measured as the average thickness T1 of each of the bonding layers 161 and 162, and the average thickness of the region where the Sn content is 90 at% or higher can be measured as the average thickness T2 of each of the Sn plating layers 131c and 132c. The average thickness T1 of each of the bonding layers 161 and 162 and the average thickness T2 of each of the Sn plating layers 131c and 132c can refer to the average thickness in a first direction measured at three or more points spaced apart from each other at equal intervals on the first surface 1 or the second surface 2 of the body 110. Other methods and / or tools understood by those skilled in the art may be used even if not described in this disclosure.

[0083] The type of Au-Sn metallic bonding between the Sn plating layers 131c and 132c and the bonding layers 161 and 162 is not limited. However, the Sn in the Sn plating layers 131c and 132c and the Au in the bonding layers 161 and 162 may diffuse into each other to form an intermetallic compound comprising Au and Sn. That is, in the example embodiment, bonding layers 161 and 162 may comprise an intermetallic compound comprising Au and Sn.

[0084] Intermetallic compounds including Au and Sn can be stable and have high mechanical strength, thereby improving the adhesive strength between capacitor 100 and connection terminals 141 and 142 in electronic assembly 1000 and suppressing misalignment defects in the bonding between capacitor 100 and connection terminals 141 and 142 in electronic assembly 1000.

[0085] Examples of intermetallic compounds including Au and Sn may include AuSn, Au5Sn, AuSn2, and AuSn4, and the bonding layers 161 and 162 according to the example embodiments may include one or more of AuSn, Au5Sn, AuSn2, and AuSn4.

[0086] In the example embodiment, bonding layers 161 and 162 may be in direct contact with the Sn plating layers 131c and 132c of the external electrodes 131 and 132, and bonding layers 161 and 162 may not contain glass or resin. Specifically, bonding layers 161 and 162 may be plating layers that are substantially free of glass or resin. The statement that bonding layers 161 and 162 are substantially free of glass or resin may mean that the ratio of the metal element content to the total element content of bonding layers 161 and 162 is 90 at% or higher, but this disclosure is not limited thereto.

[0087] Reference Figure 3 In an example embodiment, connection terminals 141 and 142 may be disposed between the two ends of external electrodes 131 and 132 in the second direction. More specifically, connection terminals 141 and 142 may be configured not to extend beyond one end and the other end of external electrodes 131 and 132 in the second direction, thereby enabling high-density and high-integration mounting of the electronic component 1000. For example, a first connection terminal 141 may be disposed between the two ends of the first external electrode 131 in the second direction, and a second connection terminal 142 may be disposed between the two ends of the second external electrode 132 in the second direction.

[0088] Reference Figure 1 and Figure 3 The electronic component 1000 according to the example embodiment may further include connection electrode portions 151 and 152 that connect the external electrodes 131 and 132 to each other with connection terminals 141 and 142. The connection electrode portions 151 and 152 can be used to more securely bond the external electrodes 131 and 132 of the capacitor 100 to the connection terminals 141 and 142.

[0089] Reference Figure 3 The connecting electrode portions 151 and 152 can cover the outermost surfaces of the outer electrodes 131 and 132 and the outermost surfaces of the connecting terminals 141 and 142. That is, the connecting electrode portions 151 and 152 can be the outermost layers of the conductive portions 171 and 172 of this disclosure.

[0090] Although not shown, the connecting electrode portions 151 and 152 may have a single-layer structure, or the connecting electrode portions 151 and 152 may have, for example, a single-layer structure. Figure 3 The multilayer structure is shown. When the connecting electrode portions 151 and 152 have a single-layer structure, the connecting electrode portions 151 and 152 can be Sn-plated portions. When the connecting electrode portions 151 and 152 have a multilayer structure, the connecting electrode portions 151 and 152 can have a structure in which Ni-plated portions 151a and 152a and Sn-plated portions 151b and 152b are sequentially arranged.

[0091] The plating portions 151a, 152a, 151b, and 152b included in the connecting electrode portions 151 and 152 are referred to as "plating portions" to distinguish them from the plating layers 131b, 131c, 132b, and 132c of the outer electrodes 131 and 132. However, the plating portions may have a composition substantially the same as that of the plating layers 131b, 131c, 132b, and 132c.

[0092] When the connecting terminals 141 and 142 are formed using a conductive material, the connecting terminals 141 and 142 may include terminal bodies 141a and 142a and terminal layers 141b and 142b disposed on the terminal bodies 141a and 142a. In this case, the terminal bodies 141a and 142a can be used to further reduce acoustic noise, and the terminal layers 141b and 142b can be used to further improve the bonding strength with the bonding layers 161 and 162, or to alleviate the stress caused by the interlayer bonding between the connecting terminals 141 and 142 and the external electrodes 131 and 132.

[0093] Specifically, terminal bodies 141a and 142a may include Cu to more effectively reduce acoustic noise, and terminal layers 141b and 142b may be formed as Ni plating layers including Ni, thereby further improving the bonding strength with bonding layers 161 and 162 or reducing the stress caused by the interlayer bonding between connecting terminals 141 and 142 and external electrodes 131 and 132.

[0094] Reference Figure 2 The connecting terminals 141 and 142 may include recesses (e.g., grooves) R1 and R2 that are recessed inwardly from the ends of the connecting terminals 141 and 142 in a second direction. The recesses R1 and R2 can serve as solder pockets, which are accommodated in the substrate 200 on which the electronic component 1000 according to the example embodiment is mounted (e.g., ...) on the substrate 200. Figure 6 Solders 221 and 222 are used on the substrate (shown in the figure). Therefore, the electronic component 1000 according to the example embodiment can reduce acoustic noise by suppressing the transmission of vibrations from the capacitor 100 to the substrate 200.

[0095] When the connecting terminals 141 and 142 include recesses R1 and R2 that are recessed inwardly from the ends of the connecting terminals 141 and 142 in the second direction, the shape of the substrate 200 and the electrode pads 211 and 212 (as shown in the figure) are also considered. Figure 6 The shapes of each of the components (shown in the diagram) may differ from one another. For example, substrate 200 has a rectangular shape, and electrode pads 211 and 212 have shapes including recessed portions. Compared to conventional cases where both the substrate and pads have rectangular shapes, this difference in shape may lead to problems due to a reduction in contact area. Consequently, misalignment and reduced adhesive strength may occur between the electronic component 1000 and substrate 200.

[0096] However, in the exemplary embodiments of this disclosure, bonding layers 161 and 162, including Au, may be disposed between the external electrodes 131 and 132 of the capacitor 100 and the connection terminals 141 and 142, thereby forming a strong adhesion between the external electrodes 131 and 132 of the capacitor 100 and the connection terminals 141 and 142, thus suppressing misalignment of the bonding between the electronic component 1000 and the substrate 200. As a result, the reduction in adhesive strength can also be mitigated.

[0097] Reference Figure 2 The shape of each of the grooves R1 and R2 can be a curved shape. More specifically, the length of each of the connecting terminals 141 and 142 in the second direction can be reduced toward the central portion of each of the connecting terminals 141 and 142 in the third direction. Therefore, the manufacturability of the connecting terminals 141 and 142 can be improved. However, the shape of each of the grooves R1 and R2 is not limited to a curved shape, and the shape of each of the grooves R1 and R2 can be changed in various ways.

[0098] Figure 6 This is a schematic cross-sectional view of an electronic component mounted on a substrate according to an exemplary embodiment of the present disclosure.

[0099] Reference Figure 6 Electronic components 1000 according to exemplary embodiments of the present disclosure and electronic components 1000' (described below) according to various variant embodiments of the present disclosure may be mounted on substrate 200. Specifically, electrode pads 211 and 212 may be disposed on substrate 200, and electronic components 1000 may be disposed on electrode pads 211 and 212. Electrode pads 211 and 212 may be in direct contact with conductive portions 171 and 172 of electronic components 1000, and solder 221 and 222 may be disposed between electrode pads 211 and 212 and conductive portions 171 and 172.

[0100] Figure 7 This is a schematic perspective view of an electronic component according to another exemplary embodiment of the present disclosure.

[0101] Figure 8 It is along Figure 7 A schematic cross-sectional view taken from line III-III' in the diagram.

[0102] Reference Figure 7 and Figure 8 According to another example embodiment of the present disclosure, the electronic component 1000' may include conductive portions 171' and 172' disposed on the body 110.

[0103] Electronic component 1000' according to another exemplary embodiment of the present disclosure may include capacitor 100, capacitor 100 including body 110 and external electrodes 131 and 132 (which are substantially the same as the body 110 and external electrodes 131 and 132 of capacitor 100 of electronic component 1000 according to an exemplary embodiment of the present disclosure).

[0104] According to another example embodiment of the present disclosure, the electronic component 1000' may include lower connecting terminals 141 and 142 disposed on the lower surface of the capacitor 100 in a first direction and upper connecting terminals 141' and 142' disposed on the upper surface of the capacitor 100 in the first direction.

[0105] The characteristics of the lower connecting terminals 141 and 142 and the upper connecting terminals 141' and 142' are substantially the same as those of the connecting terminals 141 and 142 of the electronic component 1000 according to an exemplary embodiment of the present disclosure. Specifically, the upper connecting terminals 141' and 142' may include terminal bodies 141a' and 142a' containing Cu and terminal layers 141b' and 142b' containing Ni, the terminal layers 141b' and 142b' being disposed on the terminal bodies 141a' and 142a'.

[0106] (Experimental Example) Table 1 shows the results of evaluating the effect of the ratio T2 / T1 between the average thickness T1 of the bonding layer including Au and the average thickness T2 of the Sn coating on the adhesive strength and bonding alignment according to an example embodiment of the present disclosure.

[0107] The adhesive strength of the samples was evaluated using a bare die shear force tester (Dage 4000+). Each sample was mounted on a PCB substrate, and the maximum force (N) applied until the sample detached was measured using a measurement tip. Ten samples were used for each test number. A test number was considered NG if any of the ten samples had an adhesive strength not exceeding 5N. Table 1 shows the experiments conducted using samples with a size of 1005.

[0108] The misalignment of the joint was evaluated using an automated optical inspection (AOI) system. Ten samples were tested for each test number, with sample dimensions corresponding to 1005. A sample for a given test number was considered NG if any of the ten samples had a connection terminal deviated from its designated position by 75 μm or more.

[0109] [Table 1]

[0110] Referring to Table 1, for test numbers 10 and 11, a decrease in adhesive strength can be confirmed if the ratio T2 / T1 of the average thickness T2 of the Sn coating to the average thickness T1 of the Au-containing bonding layer is 1 or less.

[0111] Furthermore, for test number 1, where the ratio T2 / T1 of the average thickness T2 of the Sn coating to the average thickness T1 of the bonding layer including Au is greater than 1000, the bonding misalignment evaluation result can be confirmed as NG.

[0112] Therefore, as in the example embodiments of this disclosure, when the ratio T2 / T1 of the average thickness T2 of the Sn plating layer to the average thickness T1 of the bonding layer including Au is greater than 1 and less than or equal to 1000, it can be confirmed that both the reduction in the adhesive strength of the electronic component and the misalignment of the bonding can be mitigated simultaneously.

[0113] While exemplary embodiments have been shown and described above, it will be readily understood by those skilled in the art that modifications and variations may be made without departing from the scope of this disclosure as defined by the appended claims.

[0114] Furthermore, the term "example embodiment" as used herein does not refer to the same example embodiment, but is provided to emphasize a particular feature or characteristic that differs from a particular feature or characteristic of another example embodiment. However, the example embodiments provided herein are considered to be achievable by combining them, in whole or in part. For example, unless a contrary or contradictory description is provided herein, even if an element described in a particular example embodiment is not described in another example embodiment, it may be understood as a description relating to the other example embodiment.

[0115] The terminology used herein is for the purpose of describing particular exemplary embodiments only and is not intended to limit the scope of the exemplary embodiments. Unless the context clearly indicates otherwise, the singular forms as used herein are intended to include the plural forms as well.

Claims

1. An electronic component, comprising: A capacitor includes a body and an outer electrode, the body including a dielectric layer and an inner electrode, and the outer electrode disposed on the body; A connection terminal is disposed on the external electrode; as well as A bonding layer is disposed between the external electrode and the connection terminal, the bonding layer comprising Au. The outer electrode includes an electrode layer connected to the inner electrode, a Ni plating layer disposed on the electrode layer, and a Sn plating layer disposed on the Ni plating layer. When the average thickness of the bonding layer is defined as T1 and the average thickness of the Sn coating is defined as T2, T2>T1 is satisfied.

2. The electronic component according to claim 1, wherein, T2 / T1 is greater than 1 and less than or equal to 1000.

3. The electronic component according to claim 1, wherein, Au included in the bonding layer exists in the form of an intermetallic compound comprising Au and Sn.

4. The electronic component according to claim 1, wherein, The Au included in the bonding layer exists in one or more forms selected from the group consisting of AuSn, Au5Sn, AuSn2 and AuSn4.

5. The electronic component according to claim 1, wherein, The bonding layer does not contain glass.

6. The electronic component according to claim 1, wherein, The connection terminal is disposed on one of the first and second surfaces of the external electrode that are opposite to each other.

7. The electronic component according to claim 1, wherein, The connection terminals are disposed on the first and second surfaces of the external electrodes that are opposite to each other.

8. The electronic component according to claim 1, wherein, The external electrodes include a first external electrode and a second external electrode spaced apart from each other in a second direction. The connection terminals include a first connection terminal disposed on the first external electrode and a second connection terminal disposed on the second external electrode, and The first connection terminal is disposed between the two ends of the first external electrode that are opposite to each other in the second direction, and the second connection terminal is disposed between the two ends of the second external electrode that are opposite to each other in the second direction.

9. The electronic component according to claim 1, wherein, The external electrodes include a first external electrode and a second external electrode spaced apart from each other in a second direction, and The connecting terminal includes a groove that is recessed inward from the end of the connecting terminal in the second direction.

10. The electronic component according to claim 9, wherein, When the inner electrode and the dielectric layer are stacked in a first direction, and the direction perpendicular to the first and second directions is defined as a third direction, the length of the connection terminal in the second direction decreases toward the central portion of the connection terminal in the third direction.

11. The electronic component according to claim 1, wherein, The electronic component also includes a connecting electrode section that connects the external electrode and the connecting terminal to each other.

12. The electronic component according to claim 11, wherein, The connecting electrode portion covers the outermost surface of the outer electrode and the outermost surface of the connecting terminal.

13. The electronic component according to claim 11, wherein, The connecting electrode portion includes: a Ni-plated portion covering the outermost surface of the outer electrode and the outermost surface of the connecting terminal; and a Sn-plated portion disposed on the Ni-plated portion.

14. The electronic component according to claim 1, wherein, The connection terminal includes: a terminal body comprising Cu; and a terminal layer disposed on the terminal body, the terminal layer comprising Ni.

15. The electronic component according to claim 14, wherein, The Sn plating layer, the bonding layer, and the terminal layer are arranged sequentially.

16. The electronic component according to claim 1, wherein, The external electrode also includes a Ni-Sn alloy layer disposed between the Ni coating and the Sn coating.

17. A board, comprising: substrate; Electrode pads are disposed on the substrate; as well as The electronic component according to any one of claims 1-16 is disposed on the electrode pad.

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