Energy storage high voltage box and energy storage battery cabinet

Abstract

The present application relates to the technical field of energy storage device heat dissipation, and particularly relates to an energy storage high-voltage box and an energy storage battery cabinet. The energy storage high-voltage box comprises a box body and a mounting base plate, a heating element is arranged on one side of the mounting base plate, and a semiconductor refrigeration plate is arranged on the other side of the mounting base plate, the cold end of the semiconductor refrigeration plate is used for refrigerating the mounting base plate, and the hot end of the semiconductor refrigeration plate is provided with a heat dissipation fin. The energy storage battery cabinet comprises a cabinet body and the energy storage high-voltage box arranged in the cabinet body, the heat dissipation fin on the hot end of the semiconductor refrigeration plate of the energy storage high-voltage box is adjacent to and faces a liquid cooling plate, and the heat dissipation fin is cooled by the liquid cooling plate. By arranging the heat dissipation fin on the hot end of the semiconductor refrigeration plate of the energy storage high-voltage box adjacent to the liquid cooling plate of the energy storage battery pack, the refrigeration effect of the semiconductor refrigeration plate and the liquid cooling effect of the liquid cooling plate are fully exerted, and the refrigeration effect of the semiconductor refrigeration plate and the liquid cooling efficiency of the liquid cooling plate are improved.

Description

Technical Field

[0001] This invention relates to the technical field of heat dissipation in energy storage devices, and in particular to an energy storage high-voltage box and an energy storage battery cabinet. Background Technology

[0002] In energy storage high-voltage boxes, heat dissipation technology is crucial. These boxes generate a significant amount of heat during operation; if this heat cannot be effectively dissipated, it can lead to overheating, affecting normal operation, shortening the equipment's lifespan, and potentially causing safety accidents. Therefore, heat dissipation technology for high-voltage boxes has always been a hot research topic.

[0003] However, existing energy storage high-voltage boxes typically use mechanical methods such as fans and heat sinks for heat dissipation. This method is inefficient and cannot effectively reduce the operating temperature of the equipment, thus affecting its normal operation. Summary of the Invention

[0004] The purpose of this invention is to provide an energy storage high-voltage box and an energy storage battery cabinet to improve the heat dissipation efficiency of the energy storage high-voltage box.

[0005] The energy storage high-voltage box of this application includes a box body and a mounting base plate disposed in the box body. A heating element is disposed on one side of the mounting base plate, and a semiconductor cooling plate is disposed on the other side of the mounting base plate. The cold end of the semiconductor cooling plate is used to cool the mounting base plate, and heat dissipation fins are disposed on the hot end of the semiconductor cooling plate.

[0006] Furthermore, the heat dissipation fins and the housing are sealed together using thermally conductive structural adhesive.

[0007] Furthermore, a thermal pad is sandwiched between the mounting base plate and the semiconductor cooling plate.

[0008] Furthermore, the thermal pad is a thermally conductive silicone pad.

[0009] Furthermore, the heat dissipation fins are straight fins or curved fins.

[0010] Furthermore, it also includes a temperature and humidity sensor and a battery management system. The temperature and humidity sensor is used to detect the temperature and humidity inside the box and feed them back to the battery management system. The battery management system is used to adjust the cooling power of the semiconductor refrigeration plate based on the data fed back by the temperature and humidity sensor.

[0011] This application also provides an energy storage battery cabinet, including a cabinet body and an energy storage high voltage box disposed in the cabinet body as described in any of the above technical solutions. The cabinet body is further provided with an energy storage battery pack adjacent to the energy storage high voltage box. The energy storage battery pack has a liquid cooling plate. The heat dissipation fins on the hot end of the semiconductor cooling plate of the energy storage high voltage box are adjacent to the liquid cooling plate and face the liquid cooling plate. The liquid cooling plate cools the heat dissipation fins.

[0012] Furthermore, there is a gap between the liquid cooling plate and the heat dissipation fins.

[0013] Furthermore, the gap is 2-15 mm.

[0014] Furthermore, the heat dissipation fins of the energy storage high-voltage box are adjacent to and in contact with the liquid cooling plate.

[0015] Compared with the prior art, the present invention has at least the following beneficial effects:

[0016] The energy storage high-voltage box of this application is equipped with a semiconductor cooling plate. The cold end of the semiconductor cooling plate cools the mounting base plate, and the hot end of the semiconductor cooling plate is equipped with heat dissipation fins. By utilizing the cooperation of the semiconductor cooling plate and the heat dissipation fins, the energy storage high-voltage box can be efficiently cooled and cooled, resulting in a good cooling effect.

[0017] In the energy storage battery cabinet of this application, the heat dissipation fins on the hot end of the semiconductor cooling plate of the energy storage high-voltage box are arranged adjacent to the liquid cooling plate of the energy storage battery pack. The liquid cooling plate cools the heat dissipation fins, allowing it to cool both the battery pack and the heat dissipation fins on the hot end of the semiconductor cooling plate simultaneously. This cooling of the heat dissipation fins further facilitates cooling of the mounting base plate by the semiconductor cooling system. This allows the liquid cooling plate and the semiconductor cooling plate to work synergistically, fully utilizing the cooling and liquid cooling effects of both systems. This improves the cooling efficiency of both systems, enabling the energy storage high-voltage box to operate at lower temperatures, thus enhancing the stability and lifespan of the equipment. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the structure of an embodiment of the energy storage battery cabinet of the present invention;

[0019] Figure 2 for Figure 1 A schematic diagram of the internal structure of the high-voltage energy storage box in the energy storage battery cabinet;

[0020] Figure 3 for Figure 2 A schematic diagram of the internal structure of the energy storage high-voltage box from another perspective;

[0021] Figure 4 for Figure 3 A schematic diagram of the external structure of the high-voltage energy storage box in the middle;

[0022] Figure 5 for Figure 4 A BB-direction cross-sectional view of the energy storage high-voltage box in the middle;

[0023] Figure 6 for Figure 1 The hardware circuit wiring diagram of the high-voltage energy storage box in the energy storage battery cabinet.

[0024] Figure label:

[0025] 1. Cabinet; 2. High-voltage energy storage box; 3. Energy storage battery pack; 4. Liquid cooling plate; 5. Current-carrying connector; 6. Fuse; 7. Communication connector; 8. High-voltage relay; 9. Pre-charge relay; 10. Pre-charge resistor; 11. Hall current sensor; 12. Temperature and humidity sampling point; 13. Temperature and humidity controller; 14. Battery management system;

[0026] 21. Box body; 22. Mounting base plate; 23. Semiconductor cooling plate; 24. Heat sink fins; 25. Thermally conductive structural adhesive; 26. Thermal pad. Detailed Implementation

[0027] The energy storage high-voltage box and energy storage battery cabinet of the present invention will be described below with reference to the schematic diagrams, which illustrate preferred embodiments of the invention. It should be understood that those skilled in the art can modify the invention described herein while still achieving the advantageous effects of the invention. Therefore, the following description should be understood as being of general knowledge to those skilled in the art and is not intended to limit the invention.

[0028] The serial numbers assigned to components in this document, such as "first," "second," etc., are merely used to distinguish the described objects and have no sequential or technical meaning. The terms "connection" and "linkage" used in this application, unless otherwise specified, include both direct and indirect connections (linkages). In the description of this invention, it should be understood that the terms "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing the invention and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the invention.

[0029] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "over," and "on top" of the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0030] The invention is described more specifically by way of example in the following paragraphs with reference to the accompanying drawings. The advantages and features of the invention will become clearer from the following description and claims. It should be noted that the drawings are in a very simplified form and use non-precise proportions, and are only used to facilitate and clarify the illustration of the embodiments of the invention.

[0031] The following is in conjunction with the instruction manual appendix. Figure 1 To be continued Figure 6 The energy storage battery cabinet of the present invention will be described.

[0032] In one embodiment, such as Figure 1 , Figure 2 , Figure 4 and Figure 5 As shown, the energy storage battery cabinet includes a cabinet body 1 and an energy storage high-voltage box 2 disposed within the cabinet body 1. The energy storage high-voltage box 2 includes a box body 21 and a mounting base plate 22 disposed within the box body 21. A heating element is disposed on one side of the mounting base plate 22, and a semiconductor cooling plate 23 is disposed on the other side of the mounting base plate 22. The cold end of the semiconductor cooling plate 23 is used to cool the mounting base plate 22, and a heat dissipation fin 24 is disposed on the hot end of the semiconductor cooling plate 23.

[0033] The cabinet 1 is also equipped with an energy storage battery pack 3 adjacent to the energy storage high voltage box 2. The energy storage battery pack 3 has a liquid cooling plate 4. The heat dissipation fins 24 of the energy storage high voltage box 2 are adjacent to the liquid cooling plate 4 and face the liquid cooling plate 4. The liquid cooling plate 4 cools the heat dissipation fins 24.

[0034] This application arranges the heat dissipation fins 24 on the hot end of the semiconductor cooling plate 23 of the energy storage high-voltage box 2 adjacent to the liquid cooling plate 4 of the energy storage battery pack 3. The liquid cooling plate 4 cools the heat dissipation fins 24, allowing it to simultaneously cool the energy storage battery pack 3 and the heat dissipation fins 24 on the hot end of the semiconductor cooling plate 23. The cooling of the heat dissipation fins 24 facilitates further cooling of the mounting base 22 by the semiconductor cooling system. This allows the liquid cooling plate 4 and the semiconductor cooling plate 23 to work synergistically, fully utilizing the cooling effect of the semiconductor cooling plate 23 and the liquid cooling effect of the liquid cooling plate 4. This improves the cooling efficiency of the semiconductor cooling plate 23 and the liquid cooling efficiency of the liquid cooling plate 4, enabling the energy storage high-voltage box 2 to operate at lower temperatures and enhancing the stability and lifespan of the equipment.

[0035] In one embodiment, there are multiple energy storage battery packs 3 inside the cabinet 1, which are arranged sequentially from top to bottom at intervals. The energy storage high voltage box 2 is arranged below the bottommost energy storage battery pack 3. The heat dissipation fins 24 of the energy storage high voltage box 2 are adjacent to and face the liquid cooling plate 4 of the bottommost energy storage battery pack 3. The liquid cooling plate 4 cools the heat dissipation fins 24.

[0036] In one embodiment, there is a gap between the liquid cooling plate 4 and the heat dissipation fins 24.

[0037] Specifically, the gap design between the liquid cooling plate 4 and the heat dissipation fins 24 gives the technical solution of this application the following advantages: First, by setting the gap, direct contact between the liquid cooling plate 4 and the heat dissipation fins 24 is avoided, thereby reducing the generation of thermal stress and improving the reliability and service life of the equipment. Second, the gap design makes the installation process simpler and reduces the possibility of bumps and knocks during installation. Finally, the gap can also serve as an insulation gap, improving the safety of the equipment and preventing the energy storage battery pack 3 from being accidentally energized and conducting electricity to the energy storage high-voltage box 2, thus preventing damage to the energy storage high-voltage box 2.

[0038] Furthermore, in one embodiment, the gap between the heat dissipation fins 24 and the liquid cooling plate 4 is 2-15 mm. The gap can be 10 mm, and in other embodiments, it can be 5 mm, 11 mm, or 13 mm.

[0039] The selection of this clearance range is based on a balance between safety, heat dissipation efficiency, and space utilization. It facilitates installation, reduces thermal stress, and improves equipment safety.

[0040] In another embodiment, the heat dissipation fins 24 of the energy storage high-voltage box 2 are adjacent to and in contact with the liquid cooling plate 4.

[0041] This design improves heat dissipation efficiency through direct contact. Specifically, the close contact between the heat dissipation fins 24 and the liquid cooling plate 4 ensures effective heat transfer, reduces thermal resistance, and thus improves heat dissipation. This structural design effectively solves the heat problem generated by the energy storage high-voltage box 2 during operation, ensuring the normal operation of the equipment and extending its service life.

[0042] Specifically, the bonding between the heat dissipation fins 24 and the liquid cooling plate 4 can be achieved in various ways. For example, the heat dissipation fins 24 can be fixed to the liquid cooling plate 4 using thermally conductive structural adhesive 25 to ensure close contact between the two.

[0043] In one embodiment, the heat dissipation fins 24 and the housing 21 are sealed together using a thermally conductive structural adhesive 25. The thermally conductive structural adhesive 25 is an adhesive with good thermal conductivity, capable of forming a stable sealing layer between the heat dissipation fins 24 and the housing 21. This sealing method effectively prevents heat loss in the gap between the heat dissipation fins 24 and the housing 21, thereby improving heat dissipation efficiency. The thermally conductive structural adhesive 25 not only has good thermal conductivity but also provides a stable sealing effect, ensuring tight contact between the heat dissipation fins 24 and the housing 21, avoiding reduced heat dissipation efficiency and overheating problems caused by poor sealing. Through this technique, the heat from the heat dissipation fins 24 can be more effectively transferred to the outside of the housing 21, and then dissipated through the housing 21, improving the overall heat dissipation performance and reliability of the equipment.

[0044] Specifically, the thermally conductive structural adhesive 25 can be implemented in various forms, such as thermally conductive silicone or thermally conductive epoxy resin. These materials, after curing, form a robust sealing layer with a sealing rating of IP65 or higher, while also providing good vibration damping and thermal conductivity. As a preferred embodiment, the thermally conductive structural adhesive 25 can be uniformly applied between the heat sink fins 24 and the housing 21 to ensure effective sealing and thermal conductivity across the entire contact surface. Furthermore, the thickness of the thermally conductive structural adhesive 25 can be adjusted according to actual needs to achieve optimal sealing and thermal conductivity.

[0045] Furthermore, in one embodiment, a thermal pad 26 is sandwiched between the mounting base 22 and the semiconductor cooling plate 23.

[0046] The thermal pad 26, as an intermediate layer, effectively improves the heat transfer efficiency between the two. The material selection and thickness design of the thermal pad 26 can further optimize the heat transfer performance, ensuring that the cold end of the semiconductor cooling plate 23 can efficiently cool the mounting base plate 22, thereby improving the overall heat dissipation effect of the energy storage high-voltage box 2.

[0047] Specifically, the thermal pad 26 can be made of thermally conductive silicone. This material has good thermal conductivity and flexibility, which can effectively fill the tiny gap between the mounting base plate 22 and the thermoelectric cooling plate 23, fit tightly against the mounting base plate 22 and the thermoelectric cooling plate 23, reduce thermal resistance, and thus improve the heat transfer efficiency.

[0048] The thickness of the thermally conductive silicone pad can be adjusted according to the gap between the mounting base 22 and the thermoelectric cooler 23, typically between 0.5 mm and 2 mm, to achieve optimal heat conduction. Preferably, the thermal conductivity of the thermally conductive silicone pad is 10 W / mK, and a thermoelectric cooler 23 with a cooling power of 350 W can be selected.

[0049] Furthermore, the thermally conductive silicone pad can be made of silicone material with a higher thermal conductivity to further improve thermal conductivity. Additionally, the surface of the thermally conductive silicone pad can be designed with a microstructure; for example, the surface of the thermally conductive pad 26 can be designed with an uneven structure to increase the contact area with the mounting base 22 and the thermoelectric cooling plate 23, further improving heat transfer efficiency.

[0050] Furthermore, in one embodiment, the heat dissipation fins 24 are straight fins or curved fins.

[0051] Straight fins typically offer higher heat dissipation efficiency and are suitable for applications where space allows; while curved fins can provide a larger heat dissipation area in limited spaces, making them suitable for space-constrained environments. By selecting fin shapes, heat dissipation can be optimized, ensuring that the heat generated by the energy storage high-voltage box 2 during operation is effectively dissipated, thereby preventing overheating, extending equipment lifespan, and improving safety.

[0052] Specifically, straight fins typically employ a linear structure, offering high heat dissipation efficiency and making them suitable for applications with ample space. The manufacturing process for straight fins is relatively simple, cost-effective, and easy to install and maintain. Curved fins, on the other hand, utilize a bent or wavy structure, providing a larger heat dissipation area within limited space, making them suitable for space-constrained environments. While curved fins can improve heat dissipation by increasing the surface area of ​​the fins, their manufacturing process is more complex and costly.

[0053] As a preferred embodiment, straight fins can be made of aluminum alloy, which has high thermal conductivity and mechanical strength. Curved fins can be made of copper alloy, which has better thermal conductivity and corrosion resistance. Furthermore, parameters such as fin thickness, spacing, and height can be adjusted according to specific heat dissipation requirements to further optimize heat dissipation.

[0054] In one embodiment, such as Figure 2As shown, the energy storage high-voltage box 2 also includes structural components such as a current-carrying connector 5, a fuse 6, a communication connector 7, a high-voltage relay 8, a pre-charge relay 9, a pre-charge resistor 10, a Hall current sensor 11, and a contactor. Among these, the high-voltage relay 8, the contactor, and the fuse 6 are the main heat-generating components and are fixedly connected to the mounting base plate 22.

[0055] Furthermore, in one embodiment, such as Figure 3 and Figure 6 As shown, the energy storage high-voltage box 2 is also equipped with a temperature and humidity sensor and a battery management system (BMS). The temperature and humidity sensor is used to detect the temperature and humidity inside the box 21 and feeds back the detected data to the battery management system 14. Based on the data fed back by the temperature and humidity sensor, the battery management system 14 dynamically adjusts the cooling power of the semiconductor cooling plate 23 to maintain the temperature and humidity inside the box 21 at the optimal operating state.

[0056] Specifically, combined Figure 3 and Figure 6 The housing 21 is equipped with a temperature and humidity controller 13 and multiple temperature and humidity sampling points 12, such as sampling points T1, T2, T3, and T4. Each sampling point is equipped with a corresponding temperature and humidity sensor to comprehensively monitor the temperature and humidity distribution within the housing 21 and feed the temperature and humidity data back to the temperature and humidity controller 13. The temperature and humidity controller 13 then feeds the temperature and humidity data back to the battery management system 14. The battery management system 14 can calculate the required cooling power based on the data from the temperature and humidity sensors using a preset algorithm or model and control the operating state of the semiconductor cooling plate 23.

[0057] When the temperature or humidity inside the housing 21 exceeds a preset safe range, the battery management system 14 can increase the cooling power of the semiconductor cooling plate 23 to quickly reduce the temperature and humidity; when the temperature and humidity return to a safe range, the battery management system 14 can appropriately reduce the cooling power to save energy. For example, Figure 1 As shown, when the temperature is greater than 40℃ or the humidity is greater than 60%, select to turn on 50% of the rated power of the semiconductor cooling, and for every 5% increase in temperature or 5% increase in humidity, the rated power of the semiconductor cooling increases by 10%.

[0058] Among them, the high-voltage relay 8, contactor and fuse 6 are the main heat-generating components and are fixedly connected to the mounting base plate 22. When cooling, the normal maximum temperature can reach 70°C. When cooling is turned on, the temperature inside the energy storage high-voltage box 2 in this embodiment can be controlled within 50°C.

[0059] Due to the influence of the battery's charging and discharging power, the main heat-generating components such as the high-voltage relay 8, contactor, and fuse 6 generate different amounts of heat, resulting in different detected temperatures. The BMS receives the feedback temperature and humidity information and adjusts the amount of heat generated by the semiconductor cooling system accordingly based on the current temperature.

[0060] In a preferred embodiment, the temperature and humidity sensor can be a digital sensor to improve detection accuracy and response speed. The battery management system 14 can employ a microprocessor or application-specific integrated circuit (ASIC) to achieve efficient data processing and power control. Furthermore, the cooling power of the thermoelectric cooler 23 can be adjusted by changing the input current or voltage, thereby achieving precise control of the cooling effect.

[0061] This application also provides an energy storage high-voltage box, including a box body and a mounting base plate disposed in the box body. A heating element is disposed on one side of the mounting base plate, and a semiconductor cooling plate is disposed on the other side of the mounting base plate. The cold end of the semiconductor cooling plate is used to cool the mounting base plate, and heat dissipation fins are disposed on the hot end of the semiconductor cooling plate.

[0062] The cold end of the semiconductor cooling plate on the energy storage high-voltage box cools the mounting base plate, and the hot end of the semiconductor cooling plate is provided with heat dissipation fins. The cooperation between the semiconductor cooling plate and the heat dissipation fins enables efficient cooling and temperature reduction of the energy storage high-voltage box, resulting in good cooling performance. The specific structure of the energy storage high-voltage box is the same as that of any embodiment of the energy storage high-voltage box in the aforementioned energy storage battery cabinet, and will not be described again here.

[0063] Obviously, those skilled in the art can make various modifications and variations to this invention without departing from its spirit and scope. Therefore, if these modifications and variations fall within the scope of the claims of this invention and their equivalents, this invention also intends to include these modifications and variations.

Claims

1. A high-voltage energy storage box, characterized in that, The device includes a housing and a mounting base plate disposed within the housing. A heating element is disposed on one side of the mounting base plate, and a thermoelectric cooling plate is disposed on the other side of the mounting base plate. The cold end of the thermoelectric cooling plate is used to cool the mounting base plate, and heat dissipation fins are disposed on the hot end of the thermoelectric cooling plate.

2. The energy storage high-voltage box according to claim 1, characterized in that, The heat dissipation fins and the housing are sealed together with thermally conductive structural adhesive.

3. The energy storage high-voltage box according to claim 1, characterized in that, A thermal pad is sandwiched between the mounting base plate and the semiconductor cooling plate.

4. The energy storage high-voltage box according to claim 3, characterized in that, The thermal pad is a thermally conductive silicone pad.

5. The energy storage high-voltage box according to claim 1, characterized in that, The heat dissipation fins are either straight fins or curved fins.

6. The energy storage high-voltage box according to claim 1, characterized in that, It also includes a temperature and humidity sensor and a battery management system. The temperature and humidity sensor is used to detect the temperature and humidity inside the box and feed them back to the battery management system. The battery management system is used to adjust the cooling power of the semiconductor refrigeration plate based on the data fed back by the temperature and humidity sensor.

7. An energy storage battery cabinet, characterized in that, The device includes a cabinet and an energy storage high-voltage box as described in any one of claims 1 to 6 disposed within the cabinet. The cabinet also contains an energy storage battery pack adjacent to the energy storage high-voltage box. The energy storage battery pack has a liquid cooling plate. The heat dissipation fins on the hot end of the semiconductor cooling plate of the energy storage high-voltage box are adjacent to and face the liquid cooling plate, and the liquid cooling plate cools the heat dissipation fins.

8. The energy storage battery cabinet according to claim 7, characterized in that, There is a gap between the liquid cooling plate and the heat dissipation fins.

9. The energy storage battery cabinet according to claim 8, characterized in that, The gap is 2-15 mm.

10. The energy storage battery cabinet according to claim 7, characterized in that, The heat dissipation fins of the energy storage high-voltage box are adjacent to and in contact with the liquid cooling plate.

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