Signal processing apparatus and method

Abstract

The embodiment of the present application provides a signal processing device and method, the signal processing device comprises: an optical component, which is used for receiving a downlink electrical signal and a detection electrical signal transmitted by a circuit processing unit, and converting the downlink electrical signal and the detection electrical signal into a downlink optical signal and a detection optical signal respectively; and is also used for performing wavelength combining processing on the downlink optical signal and the detection optical signal, and transmitting the obtained combined optical signal to an external optical fiber. Therefore, the embodiment of the present application can solve the problems that in the existing implementation of the integrated sensing and communication, part of the communication board card is usually replaced by a detection board card, resulting in the increase of the maintenance cost of the single board and the shortage of the space of the machine room, and further achieves the effects of reducing the maintenance cost and improving the space utilization of the machine room.

Description

Technical Field

[0001] This application relates to the field of communication technology, and more specifically, to a signal processing apparatus and method. Background Technology

[0002] With the rapid development of access network technology, fiber optic communication technology, and fifth-generation mobile communication technology (5G), users are placing higher demands on network bandwidth and latency. Especially in the 5G era, high-speed data transmission and real-time communication have become the norm, posing new challenges to Passive Optical Network (PON) systems. At the same time, considering that large-scale fiber optic access networks have been in operation for 20 years, the need for network maintenance and testing is becoming increasingly urgent. Figure 1 As shown, the demand for perception and detection across the entire network has also surged.

[0003] Currently, in PON systems, communication services and sensing / detection functions are typically handled by different devices. Specifically, communication services are implemented through dedicated communication boards, while sensing / detection is performed by detection boards. The following issues are commonly encountered in achieving integrated communication and sensing:

[0004] (1) Increased cost: When implementing sensing and detection functions, such as Figure 2 As shown, it is necessary to transfer the port and replace the original communication board with an optical time-domain reflectometer (OTDR) board to realize sensing and detection, and add wavelength division multiplexing (WDM), which not only increases maintenance costs, but also increases the complexity of the equipment.

[0005] (2) Insufficient space: Adding OTDR boards requires additional computer room space. As the testing demand increases, the space requirement also increases accordingly, which will lead to insufficient computer room space.

[0006] (3) Maintenance difficulties: Port transfer and board function replacement make maintenance work more complicated, especially during troubleshooting and daily operation and maintenance. This complexity will significantly increase maintenance costs and time.

[0007] In summary, no effective solution has yet been proposed in the relevant technologies. Summary of the Invention

[0008] This application provides a signal processing apparatus and method to at least solve the problems of increased maintenance costs and insufficient data center space caused by replacing some communication boards with detection boards in existing integrated communication and sensing systems. This achieves the effect of reducing maintenance costs and improving data center space utilization.

[0009] According to one embodiment of this application, a signal processing apparatus is provided. The signal processing apparatus includes: an optical component for receiving a downlink electrical signal and a detection electrical signal transmitted by a circuit processing unit, and converting the downlink electrical signal and the detection electrical signal into a downlink optical signal and a detection optical signal, respectively; and for performing a multiplexing process on the downlink optical signal and the detection optical signal, and transmitting the resulting multiplexed optical signal to an external optical fiber.

[0010] According to another embodiment of this application, a signal processing method is provided, comprising: receiving a downlink electrical signal and a detection electrical signal transmitted by a receiving circuit processing unit, and converting the downlink electrical signal and the detection electrical signal into a downlink optical signal and a detection optical signal, respectively; combining the downlink optical signal and the detection optical signal to obtain a composite optical signal; and injecting the composite optical signal into an external optical fiber so that a signal processing device performs a syn-sensing integrated operation based on the composite optical signal.

[0011] The above embodiments of this application provide a signal processing device that integrates optical components. The optical components receive downlink electrical signals and detection electrical signals emitted by the circuit processing unit, and convert the downlink electrical signals and detection electrical signals into downlink optical signals and detection optical signals, respectively. By performing multiplexing processing, optical signals of different wavelengths are combined, ensuring the quality of the optical signals and the stability of communication services. In other words, the conversion and multiplexing processing of downlink electrical signals and detection electrical signals emitted by the circuit processing unit are realized, thereby integrating communication and sensing detection functions within the signal processing device. This greatly improves the integration and multifunctionality of the device. Therefore, it can solve the problem that in existing integrated communication and sensing systems, some communication boards are usually replaced with detection boards, which leads to increased maintenance costs for individual boards and insufficient data center space. This achieves the effect of reducing maintenance costs and improving data center space utilization. Attached Figure Description

[0012] Figure 1 This is a schematic diagram of the OTDR detection principle in existing technology;

[0013] Figure 2 This is a system architecture diagram of the coexistence of sensing and communication technologies in existing technologies;

[0014] Figure 3 This is a structural diagram of a sensor-integrated optical transceiver according to an embodiment of this application;

[0015] Figure 4This is a PON network system architecture diagram according to an embodiment of this application;

[0016] Figure 5 This is a structural block diagram of a signal processing apparatus according to an embodiment of this application;

[0017] Figure 6 This is a system architecture diagram of an integrated optical transceiver according to an embodiment of this application;

[0018] Figure 7 This is an optical path frame diagram of the optical components in the integrated optical transceiver according to an embodiment of this application;

[0019] Figure 8 This is a flowchart of a signal processing method according to an embodiment of this application;

[0020] Figure 9 This is an overall structural block diagram of the optical component according to an embodiment of this application;

[0021] Figure 10 This is a structural block diagram of the transmitting cavity according to an embodiment of this application;

[0022] Figure 11 This is a schematic diagram of the beam combining optical path according to an embodiment of this application;

[0023] Figure 12 This is a schematic diagram of a wave-locked optical path according to an embodiment of this application;

[0024] Figure 13 This is a flowchart of a signal processing method according to an embodiment of this application. Detailed Implementation

[0025] The embodiments of this application will be described in detail below with reference to the accompanying drawings and examples.

[0026] It should be noted that the terms "first," "second," etc., in the specification, claims, and drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence.

[0027] Currently, communication services and network detection functions in PON networks are typically handled by different devices. Specifically, communication services are implemented through dedicated communication boards, while detection is accomplished through OTDR boards. A key challenge is achieving integrated communication and detection within existing data centers without requiring expansion. Traditional solutions involve reducing the number of existing communication boards and adding OTDR boards for detection. However, this approach requires port relocation and replacing existing communication boards with detection boards, increasing maintenance costs and potentially causing space constraints within the data center.

[0028] In view of the above problems, embodiments of this application provide a sensor-integrated optical transceiver device, such as... Figure 3 As shown, the integrated optical transceiver device includes: optical components 1, circuit processing unit 2, and housing 3. It enables the entire optoelectronic system to complete the integrated work of communication and network sensing detection. This device is a photoelectric conversion and network node sensing detection device. It uses wavelength division multiplexing technology to realize the uplink and downlink transmission and reception of communication services, and can also perform sensing detection on the entire network node to achieve intelligent maintenance.

[0029] Specifically, in this embodiment, a WDM transmitting optical component is used to combine three different wavelength optical signals: one from a Gigabit-capable passive optical network (GPON) (e.g., 1480–1500 nm), one from a 10-Gigabit-capable symmetric passive optical network (10G PON) (e.g., 1575–1580 nm), and one from an OTDR (e.g., 1520–1570 nm). The combined optical signal is then coupled into an optical fiber for output. Figure 4 As shown, the optical signals (e.g., λ1 to λ5 optical signals) emitted from the optical network unit (ONU) laser are input into the integrated optical transceiver device. The GPON receiving wavelength, 10G PON receiving wavelength, and OTDR reflected signal wavelength are received by the WDM wavelength division multiplexing optical component, and then converted into electrical signals. After processing, the signals are output through the signal pins of the integrated optical transceiver device. The ONU laser may include GPON ONU laser and 10G PON laser.

[0030] Through the above embodiments, such as Figure 4 As shown, this application can package two generations of PON into a small optical module of the Small Form-factor Pluggable Double Density (SFP-DD) standard. This optical module is compatible with SFP packaging and can achieve integrated communication and sensing without changing the port density, thereby reducing maintenance costs and improving the utilization of data center space.

[0031] This application embodiment is used for an integrated optical transceiver device that combines the communication and detection functions of a PON network. By integrating these two functions into one device, it not only reduces the space occupied in the equipment room and lowers the cost, but also improves the network's intelligent maintenance capabilities and operating efficiency, making it a key component on the optical line terminal (OLT) side of the PON network system.

[0032] Figure 5 This is a structural block diagram of a signal processing apparatus according to an embodiment of this application, such as... Figure 5 As shown, the signal processing device includes: an optical component; the optical component is used to receive the downlink electrical signal and the detection electrical signal emitted by the circuit processing unit, and convert the downlink electrical signal and the detection electrical signal into a downlink optical signal and a detection optical signal, respectively; it is also used to perform multiplexing processing on the downlink optical signal and the detection optical signal, and transmit the resulting multiplexed optical signal to an external optical fiber.

[0033] In this embodiment, the optical component can perform multiplexing of the downlink optical signal and the detection optical signal, and transmit the multiplexed optical signal to the external optical fiber. The downlink optical signal includes downlink optical signals of two PON standards (e.g., GPON / 10G PON), and the detection optical signal is the OTDR detection optical signal.

[0034] In one embodiment, the signal processing device further includes: a circuit processing unit; the circuit processing unit includes a passive optical network transceiver module circuit and a detection transceiver module circuit, the passive optical network transceiver module circuit being used to transmit the downlink electrical signal to the optical component, and the detection transceiver module circuit being used to transmit the detection electrical signal to the optical component.

[0035] In this embodiment, this application provides a PON network-based integrated optical transceiver device (i.e., signal processing device) in an SFP-DD package that integrates GPON / 10G PON / OTDR. This integrated optical transceiver device is compatible with existing PON standards (e.g., GPON / 10G PON) and adds a sensing and detection standard (e.g., OTDR). It has high integration and a single PON board can accommodate 16 optical modules, greatly improving space resource utilization and realizing integrated sensing and detection.

[0036] Figure 6 This is a system architecture diagram of an integrated optical transceiver according to an embodiment of this application, such as... Figure 6As shown, the circuit processing unit 2 includes transceiver module circuits of the following three types: OTDR transceiver module circuit 1021, 10G PON OLT transceiver module circuit 1022, and GPON OLT transceiver module circuit 1023. Among them, 10G PON OLT transceiver module circuit 1022 and GPON OLT transceiver module circuit 1023 are passive optical network transceiver module circuits, and OTDR transceiver module circuit 1021 is a detection transceiver module circuit.

[0037] Specifically, the OTDR transceiver module circuit 1021 is configured to send the pulse detection electrical signal of the OTDR to the optical component 1 to generate a corresponding optical signal (1520~1570nm), and to etch reflection gratings of different wavelengths on the PON network. The quality of the optical fiber is determined by the transmitted OTDR pulse detection signal through the splitting node or breakpoint, and different OTDR transmission wavelengths reflect different fiber gratings to distinguish the optical fibers. After the OTDR reflection wavelength is received by the optical component 1, it is converted into an analog electrical signal and input to the OTDR transceiver module circuit 1021.

[0038] The 10G PON OLT transceiver module circuit 1022 is configured to transmit the downlink electrical signal of the 10G PON OLT TX to the optical component 1 to generate a corresponding optical signal (1575~1581nm). The uplink received optical signal (1260~1280nm) of the 10G PON ONU provided by the optical component 1 is received and converted into an analog electrical signal and input to the 10G PON OLT transceiver module circuit 1022.

[0039] The GPON OLT transceiver module circuit 1023 is configured to send the downlink electrical signal of the GPON OLT TX to the optical component 1 to generate a corresponding optical signal (1480~1500nm). The uplink received optical signal (1290~1330nm) of the GPON OLT RX provided by the GPON ONU is received by the optical component 1 and converted into an analog electrical signal, which is then input to the GPON OLT transceiver module circuit 1023.

[0040] In one embodiment, the optical component is further configured to receive uplink optical signals emitted by the optical network unit and reflected optical signals from the optical time domain reflectometer (OTDR), and to perform wavelength division processing on the uplink optical signals to obtain uplink optical signals of different wavelengths.

[0041] In this embodiment, the optical components can perform wavelength division of the uplink optical signals emitted by the ONU terminals of the two PON systems (GPON / 10G PON) and process the OTDR reflected optical signals.

[0042] In one embodiment, the optical component is further configured to convert the uplink optical signals and OTDR reflected optical signals of different wavelengths into multiple analog electrical signals.

[0043] In this embodiment, the optical components are capable of converting the reflected light signal RX from the GPON OLT RX / 10G PON OLT RX / OTDR into an analog electrical signal.

[0044] In one embodiment, the optical components include a wavelength division multiplexing (WDM) transmitting optical component and a WDM demultiplexing optical component; the WDM transmitting optical component is used to convert the received downlink electrical signal and the detection electrical signal into a downlink optical signal and a detection optical signal, respectively, and to perform multiplexing processing on the downlink optical signal and the detection optical signal; the WDM demultiplexing optical component is used to perform wavelength division processing on the received uplink optical signal.

[0045] In this embodiment, Figure 7 This is an optical path diagram of the optical components in the integrated optical transceiver according to an embodiment of this application, such as... Figure 7 As shown, the optical components include: WDM transmitting optical components and WDM receiving optical components (i.e., WDM wavelength division multiplexing optical components).

[0046] Among them, the WDM transmitting optical component is used to combine the three wavelength optical signals emitted by the GPON OLT TX transmitting optical chip, the 10G PON OLT TX transmitting optical chip, and the OTDR TX transmitting optical chip to form a single beam, which is then output as parallel light through the WDM wavelength division optical component; the WDM wavelength division optical component is used to perform wavelength division processing on the received uplink optical signal.

[0047] It should be noted that the OTDR TX transmitting optical chip is a tunable optical chip, which can output a stable fixed wavelength signal within a certain wavelength range for OTDR transmitting optical signals to perform fiber optic identification and detection.

[0048] In this embodiment, the GPON OLT RX uplink optical signal provided by the GPON ONU transmitted from the Optical Distribution Network (ODN) is defined as λ4, the 10G PON OLT RX uplink optical signal provided by the 10G PON ONU is defined as λ5, and the OTDR reflected optical signal reflected back from the network is defined as λ3-3. These signals enter the integrated optical transceiver device via the network. The ONU optical signal first enters the WDM wavelength division multiplexing optical component, where the optical signal is converted into its respective electrical signal and output through the transceiver module circuit. In particular, the OTDR reflected optical signal reflected back from the network is output through the beam splitter or beam splitter waveguide in the WDM wavelength division multiplexing optical component (the beam splitter or beam splitter waveguide has a certain transmission-to-reflection ratio). The reflected optical signal is demodulated into a detection optical signal, and the transmitted optical signal is diffusely reflected inside the device as stray light.

[0049] In one embodiment, the WDM wavelength division optical component includes an absorber for absorbing stray light inside the device or directing the stray light outside the device.

[0050] In this embodiment, the WDM wavelength division optical component also includes an absorber, which has two main functions: one is to absorb stray light inside the device; the other is to guide stray light out of the device, reduce interference, improve the signal-to-noise ratio, reduce the ratio of light received by the OTDR RX, and improve the signal-to-noise ratio of the OTDR received signal.

[0051] In one embodiment, the circuit processing unit is further configured to receive analog electrical signals emitted by the optical component.

[0052] In this embodiment, the circuit processing unit can convert the system-side digital electrical signal into a downlink electrical signal that can drive the optical chip at the GPON OLT TX end and input it into the optical component, and process the GPON OLT RX uplink analog electrical signal into a GPON OLT RX uplink digital electrical signal and output it from the optical module to the system end.

[0053] The circuit processing unit can convert the system-side digital electrical signals into downlink electrical signals that can drive the 10G PON OLT TX optical chip and input them into the optical components, and process the 10G PON OLT RX uplink analog electrical signals into 10G PON OLT TX uplink digital electrical signals and output them from the optical module to the system side.

[0054] The circuit processing unit can convert the system-side digital electrical signals into downlink detection electrical signals that can drive the OTDR TX optical chip and input them into the optical components, and process the OTDR reflected light RX uplink analog electrical signals into OTDR reflected light uplink digital electrical signals that are output from the optical module to the system side.

[0055] In one embodiment, the signal processing apparatus further includes a housing for encapsulating the optical components and the circuit processing unit.

[0056] In this embodiment, the housing is a shell in which the optical components and the circuit processing unit PCBA are assembled and fixed and packaged into a standard structural form.

[0057] This application provides a signal processing method operating on the above-described signal processing device. Figure 8 This is a flowchart of a signal processing method according to an embodiment of this application, such as... Figure 8 As shown, the process includes the following steps:

[0058] Step S802: The receiving circuit processes the downlink electrical signal and the detection electrical signal transmitted by the receiving circuit processing unit, and converts the downlink electrical signal and the detection electrical signal into a downlink optical signal and a detection optical signal, respectively;

[0059] In this embodiment, the circuit processing unit includes a passive optical network transceiver module circuit and a detection transceiver module circuit; the passive optical network transceiver module circuit transmits the downlink electrical signal to the optical component, and the detection transceiver module circuit transmits the detection electrical signal to the optical component; wherein, the passive optical network transceiver module circuit includes a first passive optical network transceiver module circuit and a second passive optical network transceiver module circuit, and the downlink electrical signal includes a first downlink electrical signal and a second downlink electrical signal.

[0060] In this embodiment, the first passive optical network transceiver module circuit is a GPON OLT transceiver module circuit, the second passive optical network transceiver module circuit is a 10G PON OLT transceiver module circuit, the first downlink electrical signal is a GPON OLT TX downlink electrical signal, the second downlink electrical signal is a 10G PON OLT TX downlink electrical signal, and the detection electrical signal is an OTDR detection electrical signal.

[0061] Step S804: Combine the downlink optical signal and the detection optical signal to obtain a composite optical signal;

[0062] In step S804 of this embodiment, the downlink optical signal and the detection optical signal are combined to obtain a composite optical signal, including: driving a first transmitting optical chip to emit a first downlink optical signal according to the first downlink electrical signal; driving a second transmitting optical chip to emit a second downlink optical signal according to the second downlink electrical signal; driving a third transmitting optical chip to emit a detection optical signal according to the detection electrical signal; and combining the first downlink optical signal, the second downlink optical signal, and the detection optical signal through a combining optical component to obtain a composite optical signal.

[0063] In this embodiment, the first transmitting optical chip is a GPON OLT TX transmitting optical chip, the second transmitting optical chip is a 10GPON OLT TX transmitting optical chip, the third transmitting optical chip is an OTDR TX transmitting optical chip, the first downlink optical signal is a GPON OLT TX downlink optical signal, the second downlink optical signal is a 10G PON OLT TX downlink optical signal, and the detection optical signal is an OTDR detection optical signal.

[0064] In one embodiment, Figure 9 This is an overall structural block diagram of the optical component according to an embodiment of this application, such as... Figure 9 As shown, the optical components specifically include: BOX transmitting component 12, OTDR RX receiving unit 14, OTDR RX receiving isolation filter 15, GPON receiving unit 16, 10G GPON receiving unit 17, 10G PON receiving isolation filter 18, pin assembly 19, coupling and converging light output lens 20, 10G GPON reflection filter 21, PON communication wavelength division multiplexing filter 22, GPON RX receiving unit 23, GPON receiving isolation filter 24, GPON reflection filter 25, OTDR wavelength division multiplexing filter 26, and OTDR reflection filter 27.

[0065] In one embodiment, Figure 10 This is a structural block diagram of the transmitting cavity according to an embodiment of this application, as shown below. Figure 10 As shown, the BOX transmitting component 12 includes: a GPON OLT TX transmitting optical chip 121 (outputting 1480-1500nm optical signals), a 10G PONOLT TX transmitting optical chip 122 (outputting 1575-1581nm optical signals), an OTDR TX transmitting optical chip 123 (outputting 1520-1570nm optical signals), a collimating lens 124, a beam combining optical component 126, an OTDR front light detection and monitoring component, and a standard etalon 127.

[0066] Specifically, the GPON OLT TX transmitting optical chip 121 is driven by the GPON OLT TX downlink electrical signal to emit the GPON OLT TX downlink optical signal, the 10G PON OLT TX transmitting optical chip 122 is driven by the 10G PON OLT TX downlink electrical signal to emit the 10G PON OLT TX downlink optical signal, and the OTDR TX transmitting optical chip 123 is driven by the OTDR detection electrical signal to emit the OTDR detection optical signal. The GPON OLT TX downlink optical signal, the 10G PON OLT TX downlink optical signal, and the OTDR detection optical signal are combined by the multiplexing optical component 126 to obtain a composite optical signal.

[0067] In one embodiment, combining the first downlink optical signal, the second downlink optical signal, and the detection optical signal using a combining optical component to obtain a composite optical signal includes: passing the first downlink optical signal through a first collimating lens and a first 45-degree parallelogram prism, and through a first cemented surface to obtain a first sub-downlink optical signal; passing the second downlink optical signal through a second collimating lens and a second 45-degree parallelogram prism, and through reflection from the first cemented surface to the second cemented surface to obtain a second sub-downlink optical signal; passing the detection optical signal through a third collimating lens, and through a second cemented surface to obtain a detection sub-optical signal; and combining the first sub-downlink optical signal, the second sub-downlink optical signal, and the detection sub-optical signal to obtain a composite optical signal.

[0068] In this embodiment, the first adhesive surface reflects the second downlink optical signal and transmits the first downlink optical signal, and the second adhesive surface reflects the second downlink optical signal and transmits the detection optical signal.

[0069] In this embodiment, as Figure 10 and Figure 11As shown, firstly, the GPON OLT TX emitting light chip (outputting a 1480–1500nm optical signal λ1), the 10G PON OLT TX emitting light chip (outputting a 1575–1581nm optical signal λ2), and the OTDR TX emitting light chip (outputting a 1520–1570nm optical signal λ3) are shaped into parallel light by collimating lenses 124 (λ1 passes through a first collimating lens, λ2 through a second collimating lens, and λ3 through a third collimating lens, where the first, second, and third collimating lenses can all be referred to as collimating lens 124). The optical signal λ1 is then deflected 90 degrees by the 45-degree reflecting surface 1 of the first 45-degree parallelogram prism 1262 of the wave-combining optical prism assembly. The optical signal λ2 enters the second 45-degree parallelogram prism 1263. The light path is reflected and deflected by 90 degrees at the glued surface 1 (i.e., the first glued surface). The glued surface 1 has the characteristic of transmitting λ1 and reflecting λ2. λ2 is reflected and deflected upwards again by the glued surface 2. λ3 is transmitted through the glued surface 2 (i.e., the second glued surface). λ1 and λ3 achieve wave combination. The glued surface 2 reflects 90% or less of the wavelengths of λ1 and λ2 and transmits 10% or more. The glued surface 2 transmits 90% or less of the wavelength of λ3 and reflects 10% or more.

[0070] Step S806: The composite optical signal is injected into an external optical fiber so that the signal processing device performs a synergistic operation based on the composite optical signal.

[0071] In this embodiment, transmitting the composite optical signal into an external optical fiber includes: transmitting the composite optical signal into the external optical fiber through a filter, an optical lens, and a ferrule assembly, wherein the filter includes at least one of the following: a wavelength division multiplexing filter, a first reflection filter, and a communication wavelength division multiplexing filter.

[0072] In this embodiment, as Figure 11 As shown, the composite optical signal of λ1 to λ3 is transmitted to the adhesive surface 3 with 50% of the light energy being transmitted and 50% being reflected. The transmitted light energy of 50% is transmitted through the reflective filter 1267. The reflective filter 1267 only transmits λ3 and reflects all other optical signals. The optical signal with wavelength λ3 transmitted from the reflective filter 1267 is λ3-2.

[0073] like Figure 12 As shown, the transmitted light signal λ3-2 passes through the etalon 128 and is incident on the monitoring component 127. The PD1 in the component monitors 1272. The etalon 128 is a periodic filter device with sinusoidal periodic transmission-reflection ratio characteristics. Figure 9The light signal reflected back by the standard etalon 128 re-enters the equal-division right-angle prism 1268, where it is reflected by the cemented surface 3 to form an upward-facing light signal λ3-1. The light signal λ3-1 passes through the cemented surface 4 of the reflecting right-angle prism 1266 and the auxiliary prism 1264, where it is deflected 90 degrees again, changing its path before being transmitted. The light signal λ3-1 is received by the PD2 monitoring 1271 in the monitoring component 127, and the two PDs establish a proportional relationship to lock the wavelength of λ3. The auxiliary prism 1264 may not be included in the optical component, serving only as a plane. The cemented surface 4 only reflects the light signals λ3 and λ3-2. The composite light signals λ1 to λ3 pass through the OTDR wavelength division filter 26, the GPON reflection filter 25 (i.e., the first reflection filter), the PON communication wavelength division filter 22, and the coupling and converging light-emitting lens 20, respectively, and are then coupled into the pin assembly 19 for output. The composite optical signals λ1~λ3 pass through the OTDR wavelength division filter 26, which has a splitting ratio characteristic that satisfies the following formula:

[0074] T+R=1 (1)

[0075] Where T is the transmittance and R is the reflectance.

[0076] This application also provides a signal processing method operating on the above-described signal processing device. Figure 13 This is a flowchart of a signal processing method according to an embodiment of this application, such as... Figure 13 As shown, the process includes the following steps:

[0077] Step S1302: Receive the uplink optical signal transmitted by the optical network unit and the OTDR reflected optical signal;

[0078] In this embodiment, the uplink optical signal includes a first uplink optical signal and a second uplink optical signal, and the analog electrical signal includes a first analog electrical signal, a second analog electrical signal, and a third analog electrical signal.

[0079] In this embodiment, the first uplink optical signal is a GPON OLT RX uplink optical signal, the second uplink optical signal is a 10G PON OLT RX uplink optical signal, the first analog electrical signal is a GPON OLT RX uplink analog electrical signal, the second analog electrical signal is a 10G PON OLT RX uplink analog electrical signal, and the third analog electrical signal is an OTDR reflected light RX uplink analog electrical signal.

[0080] Step S1304: The uplink optical signal is split into wavelengths, and the OTDR reflected optical signal and the split uplink optical signal are converted into analog electrical signals respectively, so as to send the analog electrical signals into the circuit processing unit.

[0081] In this embodiment, the uplink optical signal is wavelength divided, and the OTDR reflected optical signal and the wavelength-divided uplink optical signal are converted into analog electrical signals so that the analog electrical signals are fed into the circuit processing unit. This includes: feeding the first uplink optical signal into a first receiving unit through reflection by a communication wavelength division filter, reflection by a first reflection filter, and transmission through a first receiving isolation filter; and converting the first uplink optical signal into a first analog electrical signal through the first receiving unit; feeding the second uplink optical signal into a second receiving unit through transmission by the communication wavelength division filter, reflection by a second reflection filter, and transmission through a second receiving isolation filter; and converting the second uplink optical signal into a second analog electrical signal through the second receiving unit; feeding the OTDR reflected optical signal into a third receiving unit through transmission by the second reflection filter, reflection by the wavelength division filter, and transmission through a transmission filter; and converting the OTDR reflected optical signal into a third analog electrical signal through the third receiving unit; and feeding the first analog electrical signal, the second analog electrical signal, and the third analog electrical signal into the circuit processing unit respectively.

[0082] In this embodiment, the 10G PON OLT RX uplink optical signal (1260-1280nm) provided by the 10G PON ONU is defined as λ4, the GPON OLT RX uplink optical signal (1290-1330nm) provided by the GPON ONU is defined as λ5, and the OTDR optical signal reflected back through the network is defined as λ3-3. These signals enter the pin assembly 19 of the optical component through the network. The optical signals λ4, λ5, and λ3-3 are respectively shaped into parallel light for transmission by the coupling and converging light-emitting lens 20.

[0083] Specifically, optical signals λ4, λ5, and λ3-3 pass through the PON communication wavelength division multiplexing filter 22. λ4 is reflected, while λ5 and λ3-3 are transmitted through the PON communication wavelength division multiplexing filter 22. The reflected optical signal λ4 is then reflected again by the 10G GPON reflection filter 21 (the second reflection filter), changing the optical path upwards to the 10G GPON receiving isolation filter 18 (the first receiving isolation filter). This 10G GPON receiving isolation filter 18 only transmits to optical signal λ4, isolating and reflecting other optical signal wavelengths. Optical signal λ4 is then converted into a second analog electrical signal by the 10G GPON receiving unit 17 (the first receiving unit) and output to the 10G GPON OLT transceiver module circuit as an integrated optical transceiver device.

[0084] The λ5 and λ3-3 optical signals continue to propagate inward. The λ5 optical signal is deflected downwards at a 90-degree angle by the GPON reflective filter 25, while the λ3-3 optical signal passes through the GPON reflective filter 25. After passing through the GPON receiving isolation filter 24 (the second receiving isolation filter), the λ5 optical signal is received by the GPON RX receiving unit 23 and the GPON receiving unit 16 (the second receiving unit), and converted into a first analog electrical signal for output to the GPON OLT transceiver module circuit of the integrated optical transceiver device.

[0085] The λ3-3 optical signal, after passing through the GPON reflective filter 25, continues to propagate backward to the OTDR wavelength division multiplexing filter 26. Due to its wavelength division characteristics, the λ3-3 signal generates an optical signal with a certain ratio R, λ3-4. After a 90-degree turn, it propagates upward and passes through the OTDR RX receiving isolation filter 15, where it is received by the OTDR RX receiving unit 14 (the third receiving unit). This signal is then converted into a third analog electrical signal and output to the OTDR transceiver module circuit as an integrated optical transceiver device. A portion of this signal also passes through the OTDR wavelength division multiplexing filter 26, and after a 90-degree turn, propagates downward to the OTDR reflective filter 27 for reflection.

[0086] Through the above steps, the GPON OLT RX uplink analog electrical signal, the 10G PON OLT RX uplink analog electrical signal, and the OTDR reflected light RX uplink analog electrical signal are respectively injected into the corresponding circuit processing units.

[0087] In one embodiment, the signal processing method includes: absorbing stray light, or transmitting the stray light.

[0088] In this embodiment, stray light generated in the integrated optical transceiver device can be absorbed by the absorber 27 or transmitted out.

[0089] Through the above steps, a signal processing device is provided, which integrates optical components. The optical components receive downlink electrical signals and detection electrical signals emitted by the circuit processing unit, and convert the downlink electrical signals and detection electrical signals into downlink optical signals and detection optical signals, respectively. By combining optical signals of different wavelengths through multiplexing processing, the quality of the optical signals and the stability of communication services are ensured. In other words, the conversion and multiplexing processing of downlink electrical signals and detection electrical signals emitted by the circuit processing unit are realized, thereby integrating communication and sensing detection functions within the signal processing device. This greatly improves the integration and multifunctionality of the device. Therefore, it can solve the problem in existing integrated communication and sensing systems where some communication boards are usually replaced with detection boards, resulting in increased maintenance costs for individual boards and insufficient equipment room space. This achieves the effect of reducing maintenance costs and improving equipment room space utilization.

[0090] Through the embodiments of this application, two PON standards (GPON / 10G PON) and OTDR functions are integrated and packaged into the SFP-DD standard to achieve integrated communication and sensing detection. The low-cost optical path design and circuit architecture design enable communication and network detection to coexist and operate without interference. In addition, there is no need to expand the equipment room area, effectively reducing maintenance costs.

[0091] In this application embodiment, a PON standard and OTDR function can also be integrated and packaged into an SFP-DD standard to achieve integrated communication and sensing detection.

[0092] Through the above description of the embodiments, those skilled in the art can clearly understand that the methods according to the above embodiments can be implemented by means of software plus necessary general-purpose hardware platforms. Of course, they can also be implemented by hardware, but in many cases the former is a better implementation method. Based on this understanding, the technical solution of this application, in essence, or the part that contributes to the prior art, can be embodied in the form of a software product. This computer software product is stored in a storage medium (such as ROM / RAM, magnetic disk, optical disk) and includes several instructions to cause a terminal device (which may be a mobile phone, computer, server, or network device, etc.) to execute the methods described in the various embodiments of this application.

[0093] It should be noted that the above modules can be implemented by software or hardware. For the latter, they can be implemented in the following ways, but are not limited to: all the above modules are located in the same processor; or, the above modules are located in different processors in any combination.

[0094] Specific examples in this embodiment can be found in the examples described in the above embodiments and exemplary implementations, and will not be repeated here.

[0095] Obviously, those skilled in the art should understand that the modules or steps of this application described above can be implemented using general-purpose computing devices. They can be centralized on a single computing device or distributed across a network of multiple computing devices. They can be implemented using computer-executable program code, and thus can be stored in a storage device for execution by a computing device. In some cases, the steps shown or described can be performed in a different order than those presented here, or they can be fabricated as separate integrated circuit modules, or multiple modules or steps can be fabricated as a single integrated circuit module. Thus, this application is not limited to any particular hardware and software combination.

[0096] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the principles of this application should be included within the protection scope of this application.

Claims

1. A signal processing apparatus, characterized in that, include: Optical components; The optical component is used to receive downlink electrical signals and detection electrical signals transmitted by the circuit processing unit, and to convert the downlink electrical signals and detection electrical signals into downlink optical signals and detection optical signals, respectively; it is also used to perform multiplexing processing on the downlink optical signals and detection optical signals, and to transmit the resulting multiplexed optical signal to an external optical fiber.

2. The apparatus according to claim 1, characterized in that, Also includes: Circuit processing unit; The circuit processing unit includes a passive optical network transceiver module circuit and a detection transceiver module circuit. The passive optical network transceiver module circuit is used to transmit the downlink electrical signal to the optical component, and the detection transceiver module circuit is used to transmit the detection electrical signal to the optical component.

3. The apparatus according to claim 1, characterized in that, in, The optical components are also used to receive uplink optical signals emitted by the optical network unit and reflected optical signals from the optical time domain reflectometer (OTDR), and to perform wavelength division processing on the uplink optical signals to obtain uplink optical signals of different wavelengths.

4. The apparatus according to claim 3, characterized in that, in, The optical component is also used to convert the uplink optical signals and OTDR reflected optical signals of different wavelengths into multiple analog electrical signals.

5. The apparatus according to claim 1, characterized in that, in, The optical components include wavelength division multiplexing (WDM) transmission optical components and WDM wavelength division optical components; The WDM transmitting optical component is used to convert the received downlink electrical signal and the detection electrical signal into downlink optical signal and detection optical signal, respectively, and to perform multiplexing processing on the downlink optical signal and the detection optical signal; The WDM wavelength division optical component is used to perform wavelength division processing on the received uplink optical signal.

6. The apparatus according to claim 5, characterized in that, in, The WDM wavelength division optical component includes a wave-absorbing plate for absorbing stray light inside the device or guiding the stray light outside the device.

7. The apparatus according to claim 2 or 4, characterized in that, in, The circuit processing unit is also used to receive analog electrical signals emitted by the optical components.

8. The apparatus according to claim 1, characterized in that, Also includes: A housing for encapsulating the optical components and the circuit processing unit.

9. A signal processing method, characterized in that, The signal processing apparatus according to any one of claims 1-8 comprises: The receiving circuit processing unit transmits downlink electrical signals and detection electrical signals, and converts the downlink electrical signals and detection electrical signals into downlink optical signals and detection optical signals, respectively. The downlink optical signal and the detection optical signal are combined to obtain a composite optical signal; The composite optical signal is injected into an external optical fiber so that the signal processing device can perform a syn-sensing operation based on the composite optical signal.

10. The signal processing method according to claim 9, characterized in that, The circuit processing unit includes a passive optical network transceiver module circuit and a detection transceiver module circuit; The passive optical network transceiver module circuit transmits the downlink electrical signal to the optical component, and the detection transceiver module circuit transmits the detection electrical signal to the optical component; wherein, the passive optical network transceiver module circuit includes a first passive optical network transceiver module circuit and a second passive optical network transceiver module circuit, and the downlink electrical signal includes a first downlink electrical signal and a second downlink electrical signal.

11. The signal processing method according to claim 10, characterized in that, The downlink optical signal and the detection optical signal are combined to obtain a composite optical signal, including: The first downlink electrical signal drives the first transmitting optical chip to emit the first downlink optical signal; The second downlink electrical signal drives the second transmitting optical chip to emit the second downlink optical signal; The detection electrical signal drives the third emitting optical chip to emit a detection optical signal; The first downlink optical signal, the second downlink optical signal, and the detection optical signal are combined using a wave-combining optical component to obtain a composite optical signal.

12. The method according to claim 11, characterized in that, The first downlink optical signal, the second downlink optical signal, and the detection optical signal are combined using a multiplexing optical component to obtain a composite optical signal, including: The first downlink optical signal is injected into the first collimating lens and the first 45-degree parallelogram prism, and passes through the first cemented surface to obtain the first sub-downlink optical signal; The second downlink optical signal is incident on the second collimating lens and the second 45-degree parallelogram prism, and after being reflected by the first cemented surface, it is incident on the second cemented surface to obtain the second sub-downlink optical signal. The detection light signal is directed into the third collimating lens and passes through the second cemented surface to obtain the detection sub-light signal; The first sub-downlink optical signal, the second sub-downlink optical signal, and the detection sub-optical signal are combined to obtain a composite optical signal.

13. The method according to claim 12, characterized in that, The first adhesive surface reflects and transmits the second downlink optical signal, and the second adhesive surface reflects and transmits the second downlink optical signal.

14. The method according to claim 9, characterized in that, Injecting the composite optical signal into an external optical fiber includes: The composite optical signal is transmitted into an external optical fiber through a filter, an optical lens, and a ferrule assembly, wherein the filter includes at least one of the following: a wavelength division multiplexing filter, a first reflection filter, and a communication wavelength division multiplexing filter.

15. The method according to claim 9, characterized in that, Also includes: Receives uplink optical signals transmitted by the optical network unit and reflected optical signals from the OTDR; The uplink optical signal is split into wavelengths, and the OTDR reflected optical signal and the split uplink optical signal are converted into analog electrical signals, respectively, so that the analog electrical signals are injected into the circuit processing unit.

16. The method according to claim 15, characterized in that, The uplink optical signal includes a first uplink optical signal and a second uplink optical signal, and the analog electrical signal includes a first analog electrical signal, a second analog electrical signal, and a third analog electrical signal.

17. The method according to claim 16, characterized in that, The uplink optical signal is split into wavelengths, and the OTDR reflected optical signal and the split uplink optical signal are converted into analog electrical signals, which are then fed into the circuit processing unit, including: The first uplink optical signal is reflected by the communication wavelength division filter, reflected by the first reflection filter, and transmitted through the first receiving isolation filter to the first receiving unit, and the first receiving unit converts the first uplink optical signal into a first analog electrical signal. The second uplink optical signal is transmitted through the communication wavelength division filter, reflected by the second reflection filter, and transmitted through the second receiving isolation filter to the second receiving unit, and the second receiving unit converts the second uplink optical signal into a second analog electrical signal. The OTDR reflected light signal is transmitted through the second reflective filter, reflected by the wavelength division filter, and transmitted through the transmission filter to the third receiving unit, and the third receiving unit converts the OTDR reflected light signal into a third analog electrical signal. The first analog electrical signal, the second analog electrical signal, and the third analog electrical signal are respectively input into the circuit processing unit.

18. The method according to claim 9, characterized in that, include: Absorb stray light, or transmit the stray light.

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