An electronic device support and electronic device

Abstract

This application provides an electronic device bracket and an electronic device. The electronic device bracket is made of metal and includes: a top cover, the position of which corresponds to the position of at least a portion of the device to be protected; a side edge, including a first side edge away from the surface to be soldered and a second side edge close to the surface to be soldered, the first side edge surrounding and connecting to the edge of the top cover; and a skirt, the skirt surrounding and connecting to at least a portion of the second side edge, the skirt including a first skirt surface capable of conforming to the surface to be soldered, the first skirt surface being used for soldering to pads on the surface to be soldered; wherein the distance between the top cover and the surface to be soldered is greater than 0. This application relates to the field of electronic device technology. The technical solution provided by this application can simplify the manufacturing process of the electronic device bracket, reduce the manufacturing cost of the electronic device bracket, improve manufacturing efficiency, and shorten the manufacturing cycle.

Description

Technical Field

[0001] This application relates to the field of electronic device technology, and more particularly to an electronic device holder and an electronic device. Background Technology

[0002] In recent years, with the rapid development and popularization of smart mobile terminals, the stability and reliability of smart mobile terminals have received much attention.

[0003] To ensure sufficient structural strength for smart mobile terminals, brackets need to be installed at corresponding locations on electronic components such as cameras and batteries, or on printed circuit boards (PCBs), to protect these components or PCBs from damage during drops or vibrations.

[0004] However, to achieve lightweight support structures, existing structures often combine plastic and metal. This involves first stamping a metal sheet into a die to form the desired shape. Then, the stamped metal sheet is placed in an injection mold, and plastic is injected. The stamped metal sheet forms a support structure with a plastic-metal composite within the injection mold. Due to these process limitations, support structures formed in this way suffer from high cost, low manufacturing efficiency, long manufacturing cycles, and complex mold repair requirements. Summary of the Invention

[0005] To address the aforementioned technical problems, this application provides an electronic device bracket and an electronic device, which can simplify the manufacturing process, reduce manufacturing costs, improve manufacturing efficiency, and shorten the manufacturing cycle.

[0006] In a first aspect, embodiments of this application provide an electronic device bracket, which is made of metal and includes: a top cover, the position of which corresponds to the position of at least a portion of the device to be protected; a side edge, including a first side edge away from the surface to be soldered and a second side edge close to the surface to be soldered, the first side edge surrounding and connecting to the edge of the top cover; and a skirt, the skirt surrounding and connecting to at least a portion of the second side edge, the skirt including a first skirt surface capable of fitting with the surface to be soldered, the first skirt surface being used for soldering to the pads of the surface to be soldered; wherein, the distance between the top cover and the surface to be soldered is greater than 0.

[0007] The electronic device bracket of this invention adopts an integrated metal structure, which can reduce processes such as injection molding in related technologies, simplify the manufacturing process, thereby reducing manufacturing costs, improving manufacturing efficiency, and shortening the manufacturing cycle.

[0008] In some possible implementations, the electronic component bracket is manufactured using a stamping process. Stamping offers high processing efficiency and also provides the electronic component bracket with good integrity and strength.

[0009] In some possible implementations, the side includes a transition portion and an upright portion. The first side edge of the transition portion surrounds the edge connecting to the top cover, and the second side edge of the transition portion connects to the first side edge of the upright portion. A skirt surrounds and connects to at least a portion of the second side edge of the upright portion. The transition portion includes a first transition section, which includes an inner surface of the section located on the recessed side of the electronic device support and an outer surface of the section located on the protruding side of the electronic device support. The inner surface of the transition portion is a first cylindrical surface, and the outer surface of the transition portion is a second cylindrical surface. The generatrix of the first cylindrical surface is a first straight generatrix, and the generatrix of the second cylindrical surface is a second straight generatrix. Both the first straight generatrix and the second straight generatrix are parallel to a first straight line. The first side edge of the upright portion extends toward the second side edge of the upright portion in a direction perpendicular to the surface to be welded. The first straight line is parallel to the plane containing the surface to be welded.

[0010] The relatively rounded raised structure of the top cover and sides not only facilitates stamping but also increases the structural strength of the bracket, thereby improving its protective performance. Alternatively, it can save material by using thinner metal sheets to form the bracket, thus providing a basis for the thinner and lighter design of electronic devices.

[0011] In some possible implementations, the cross-section of the first transition portion along the first plane is a fan-shaped ring; wherein the first straight line is perpendicular to the first plane. A design with uniform thickness and consistent curvature throughout the transition portion can provide it with superior bending resistance, thereby improving the overall mechanical strength of the electronic device support.

[0012] In some possible implementations, the skirt includes a skirt body and a skirt connector. The skirt body is used to weld pads to the surface to be welded, and the skirt connector is used to connect to the external structure. The skirt's design, serving as both a bending-resistant structural component and a pad connection part, as well as a connector to the external structure, can reduce the number of metal parts on the protected device, thereby lowering costs and improving assembly efficiency.

[0013] In some possible implementations, the skirt connection includes a threaded portion with a threaded hole. This facilitates the threaded connection between the electronic component support and the external structure.

[0014] In some possible implementations, the skirt connector includes a plug-in portion for insertion into a mounting slot in the external structure. This facilitates the connection between the electronic component support and the external structure.

[0015] In some possible implementations, the connector includes a first bent portion, a first straight portion, a second bent portion, and a second straight portion connected in sequence. The first end of the first bent portion connects to the skirt body, and the second end of the first bent portion connects to the first end of the first straight portion. The first bent portion extends with a 90-degree rounded bend, and the first straight portion extends from the first end of the first straight portion to the second end, with the extension direction perpendicular to the surface to be welded and away from the top cover. The first end of the second bent portion connects to the second end of the first straight portion, and the second end of the second bent portion connects to the first end of the second straight portion. The second bent portion extends with a 90-degree rounded bend, and the second straight portion extends from the first end of the second straight portion to the second end of the second straight portion. The second end of the second straight portion is used to insert into the mounting slot of the external structure. The design of the two bent portions facilitates the opening of corresponding grooves in the middle frame. Furthermore, the 90-degree rounded bend enhances the bending strength of the connector at the bent portions.

[0016] In some possible implementations, the first bending section, the first straight section, the second bending section, and the second straight section each include a protrusion, two transition zones, and two side wings; the two transition zones are respectively connected to both sides of the protrusion, and the two side wings are each connected to the side of the corresponding transition zone away from the protrusion. A cross-section of the connector is taken along the second plane, and the cross-section of the connector is U-shaped; the portion of the connector forming the cross-section with the second plane extends perpendicularly to the second plane; or, the tangent direction of the extension curve of the connector is perpendicular to the second plane, and the tangent point is located within the second plane. The U-shaped cross-section design enhances the bending strength of the connector.

[0017] In some possible implementations, the width of the side wing is ≥0.5mm. Side wings that meet this width can provide stronger bending resistance to the connector.

[0018] In some possible implementations, the width of the skirt body is between 0.1mm and 0.2mm. This width ensures both the mechanical strength of the bracket and facilitates the placement of bracket pads of appropriate width, ensuring welding reliability while avoiding excessive space occupied for pad placement.

[0019] In some possible implementations, the skirt connector includes a snap-fit ​​portion, which includes a latch for engaging an external structure. This provides a method for pre-fixing the electronic device bracket to an external structure.

[0020] In some possible implementations, the top cover includes a sub-plate area and a vibration motor area, the sub-plate area corresponding to at least a portion of the sub-plate location, and the vibration motor area corresponding to the location of the vibration motor. Both the sub-plate and the vibration motor can be simultaneously fixed by a single bracket, reducing the number of brackets and improving assembly efficiency.

[0021] In some possible implementations, the device to be protected includes a first through-hole and a second through-hole, and the top cover includes a sound pickup channel. The first end of the sound pickup channel corresponds to the position of the first through-hole, and the second end of the sound pickup channel corresponds to the position of the second through-hole. The first end and the second end of the sound pickup channel are interconnected. The sound pickup channel is used to transmit sound passing through the first through-hole to the second through-hole. Reusing the top cover as a sound pickup channel achieves integration of the top cover and the sound pickup channel, reduces the number of components, and improves assembly efficiency.

[0022] In some possible implementations, the sub-board area includes a shielding sub-area, the location of which corresponds to the location of the first group of components on the sub-board. The bracket is reused as a shielding cover to provide electromagnetic shielding for the first group of components, reducing the number of components and improving assembly efficiency.

[0023] In some possible implementations, the top cover includes a motherboard area and a rear camera area, with the motherboard area positioned to correspond to at least a portion of the motherboard location, and the rear camera area positioned to correspond to the location of the rear camera. This simultaneously fixes the rear camera and motherboard, reducing the number of components and improving assembly efficiency.

[0024] In some possible implementations, the top cover includes a heat dissipation shielding area that directly or indirectly contacts the surface of the device to be protected. This allows the bracket to be reused as both a heat dissipation component and a shielding cover, reducing the number of components and improving assembly efficiency.

[0025] In some possible implementations, the electronic component support is made of copper. Copper has high thermal conductivity, thus providing good heat dissipation for the components to be cooled.

[0026] In some possible implementations, the top cover includes a front-facing camera area and a second set of component areas. The position of the front-facing camera area corresponds to the position of the front-facing camera, and the position of the second set of component areas corresponds to the position of the second set of components, which are located on the display panel. This achieves protection for both the front-facing camera and components such as chips, resistors, and capacitors on the display panel.

[0027] Secondly, embodiments of this application provide an electronic device, including any of the above-mentioned electronic device brackets. Attached Figure Description

[0028] Figure 1 A schematic diagram of the front structure of a mobile phone provided in an embodiment of this application;

[0029] Figure 2 A schematic diagram of the back structure of a mobile phone provided in an embodiment of this application;

[0030] Figure 3 This is a structural block diagram of a mobile phone according to an embodiment of this application;

[0031] Figure 4 This is a schematic diagram of the structure of a sub-plate and a vibration motor provided in an embodiment of this application;

[0032] Figure 5 This application provides a schematic diagram of the structure of a sub-plate with a sub-plate bracket installed, as an embodiment of the present application.

[0033] Figure 6 This is a schematic diagram of the structure of a sub-plate support provided in an embodiment of this application;

[0034] Figure 7 For along Figure 6 A cross-sectional view of the section formed by AA' in the middle;

[0035] Figure 8 for Figure 6 Enlarged view of region B in the middle;

[0036] Figure 9 This is another structural schematic diagram of a sub-plate bracket provided in an embodiment of this application;

[0037] Figure 10 for Figure 9 Enlarged view of region C in the middle;

[0038] Figure 11 For along Figure 10 A cross-sectional view of the section formed by DD' in the middle;

[0039] Figure 12 This is a schematic diagram of another sub-plate support provided in an embodiment of this application;

[0040] Figure 13 For along Figure 12 A cross-sectional view of the section formed by A”A”’;

[0041] Figure 14 This is another structural schematic diagram of a different sub-plate bracket provided in an embodiment of this application;

[0042] Figure 15 for Figure 14 Enlarged view of region E in the middle;

[0043] Figure 16 Another structural schematic diagram of a sub-plate bracket provided in an embodiment of this application;

[0044] Figure 17 for Figure 16 Enlarged view of region C' in the middle;

[0045] Figure 18 For along Figure 17A cross-sectional view of the section formed by the middle D”D”';

[0046] Figure 19 This is a schematic diagram of the structure of the first side of a sub-plate provided in an embodiment of this application;

[0047] Figure 20 This is a schematic diagram of the structure of the second side of a sub-plate provided in an embodiment of this application;

[0048] Figure 21 A schematic diagram of the structure of a motherboard and a rear camera provided in an embodiment of this application;

[0049] Figure 22 This is a schematic diagram of a motherboard with a motherboard bracket installed, provided as an embodiment of this application. Detailed Implementation

[0050] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0051] In this article, the term "and / or" is merely a description of the relationship between related objects, indicating that there can be three relationships. For example, A and / or B can represent three situations: A exists alone, A and B exist simultaneously, and B exists alone.

[0052] The terms "up," "down," "left," and "right," used in this document to indicate direction, are intended only to clearly explain the embodiments and describe one possible arrangement or layout of the components. They are not intended to limit the relationship between components or the orientation of the components.

[0053] The terms "first" and "second," etc., used in the specification and claims of this application are used to distinguish different objects, not to describe a specific order of objects. For example, "first target object" and "second target object," etc., are used to distinguish different target objects, not to describe a specific order of target objects.

[0054] In the embodiments of this application, the terms "exemplary" or "for example" are used to indicate that something is an example, illustration, or description. Any embodiment or design that is described as "exemplary" or "for example" in the embodiments of this application should not be construed as being more preferred or advantageous than other embodiments or designs. Specifically, the use of the terms "exemplary" or "for example" is intended to present the relevant concepts in a specific manner.

[0055] In the description of the embodiments in this application, unless otherwise stated, "multiple" means two or more. For example, multiple processing units means two or more processing units; multiple systems means two or more systems.

[0056] This application provides an electronic device, which may be a mobile phone, tablet computer, personal digital assistant (PDA), in-vehicle computer, smart wearable device, smart home device, etc. This application does not impose any special limitation on the specific form of the above-mentioned electronic device. Figure 1 This is a schematic diagram of the front structure of a mobile phone provided in an embodiment of this application. Figure 2 This is a schematic diagram of the back structure of a mobile phone provided in an embodiment of this application. See also... Figure 1 and Figure 2 For ease of explanation, the following description uses a mobile phone as an example. To clearly describe the various structural features and their positional relationships, the X, Y, and Z axes are used to define the positional relationships of the structures within the phone. The X-axis represents the width of the phone, the Y-axis represents its length, and the Z-axis represents its thickness.

[0057] Figure 3 This is a structural block diagram of a mobile phone according to an embodiment of this application. See also... Figures 1 to 3 For example, mobile phone 100 may include a mid-frame 110, a back cover 120, a display panel 130, a motherboard 140, a sub-board 150, a battery 160, antenna 1, antenna 2, an audio module 170, an environmental sensor module 180, a button sensor 190, a vibration motor 1010, an indicator 1020, a front-facing camera 1030, a rear-facing camera 1040, a universal serial bus (USB) interface 1050, a motherboard bracket 1060, and a sub-board bracket 1070. The environmental sensor module 180 may include a magnetic sensor 180A, a proximity sensor 180B, and an ambient light sensor 180C. The motherboard 140 may be soldered with a processor 141, internal memory 142, external memory interface 143, charging management module 144, power management module 145, mobile communication module 146, wireless communication module 147, and a subscriber identification module (SIM) card interface 148, etc.

[0058] The rear shell 120 and the display panel 130 are positioned opposite each other, with the middle frame 110 located between them. The middle frame 110, the rear shell 120, and the display panel 130 can form a receiving cavity. The main board 140, sub-board 150, battery 160, antenna 1, antenna 2, audio module 170, vibration motor 1010, main board bracket 1060, and sub-board bracket 1070 can all be housed within this cavity. The main board bracket 1060 is connected to the main board 140, and the sub-board bracket 1070 is connected to the sub-board 150, serving to stabilize the positions of the main board 140 and the sub-board 150 and protect the components on them.

[0059] Processor 141 may include one or more processing units, such as: application processor (AP), modem processor, graphics processing unit (GPU), image signal processor (ISP), controller, video codec, digital signal processor (DSP), baseband processor, and / or neural network processing unit (NPU), etc. Different processing units may be independent devices or integrated into one or more processors. Processor 141 is used to invoke computer instructions to cause mobile phone 100 to perform corresponding operations. Internal memory 142 is used to store computer program code. The computer program code includes computer instructions.

[0060] USB interface 1050 is an interface compliant with the USB standard specification. USB interface 1050 can be used for data transfer between mobile phone 100 and peripheral devices. For example, USB interface 1050 can be a Type-C USB interface.

[0061] The charging management module 144 is used to receive charging input from the charger.

[0062] The wireless communication function of mobile phone 100 can be implemented through antenna 1, antenna 2, mobile communication module 146, wireless communication module 147, modem processor and baseband processor.

[0063] Antenna 1 and antenna 2 are used to transmit and receive electromagnetic wave signals. Each antenna in mobile phone 100 can be used to cover one or more communication frequency bands. Different antennas can also be reused to improve antenna utilization. For example, antenna 1 can be reused as a diversity antenna for a wireless local area network. In some other embodiments, the antennas can be used in conjunction with a tuning switch.

[0064] Mobile communication module 146 can provide solutions for wireless communication applications including 2G / 3G / 4G / 5G for mobile phone 100. Mobile communication module 146 may include at least one filter, switch, power amplifier, low-noise amplifier (LNA), etc. Wireless communication module 147 can provide solutions for wireless communication applications including wireless local area networks (WLAN) (such as wireless fidelity (Wi-Fi) networks), Bluetooth (BT), global navigation satellite system (GNSS), frequency modulation (FM), near field communication (NFC), infrared (IR), etc., for mobile phone 100.

[0065] In some embodiments, the antenna 1 of the mobile phone 100 is coupled to the mobile communication module 146, and the antenna 2 is coupled to the wireless communication module 147, so that the mobile phone 100 can communicate with the network and other devices through wireless communication technology.

[0066] The mobile phone 100 implements display functions through a GPU, a display panel 130, and an application processor. The GPU is a microprocessor for image processing, connected to the display panel 130 and the application processor. The GPU is used to perform mathematical and geometric calculations and for graphics rendering. The processor 110 may include one or more GPUs, which execute program instructions to generate or modify display information.

[0067] Display panel 130 may include, for example, a liquid crystal display (LCD) panel, an organic light-emitting diode (OLED) display panel, and an LED display panel, wherein the LED display panel may include, for example, a micro-LED display panel and a mini-LED display panel. This application embodiment does not limit the type of display panel 130. In some embodiments, mobile phone 100 may include one or N display panels 130, where N is a positive integer greater than 1.

[0068] The mobile phone 100 can achieve shooting functions through ISP, front camera 1030 or rear camera 1040, video codec, GPU, display panel 130 and application processor.

[0069] The front-facing camera 1030 or the rear-facing camera 1040 is used to capture still images or videos. An object is projected onto a photosensitive element through the lens, generating an optical image. The photosensitive element can be a charge-coupled device (CCD) or a complementary metal-oxide-semiconductor (CMOS) phototransistor. The photosensitive element converts the light signal into an electrical signal, which is then passed to the ISP for conversion into a digital image signal. The ISP outputs the digital image signal to the DSP for processing. The DSP converts the digital image signal into image signals in standard RGB, YUV, or other formats. In some embodiments, the number of front-facing cameras 1030 or rear-facing cameras 1040 can be N, where N is a positive integer greater than 1.

[0070] The material of the back cover 120 may include, for example, opaque materials such as plastic, vegan leather, and fiberglass; or it may include translucent materials such as glass. This application does not limit the material of the back cover 120.

[0071] The vibration motor 1010, under the control of the processor 141, emits a vibration signal to alert the user to the mobile phone 100. For example, when a call comes in, the processor 141 can control the audio module 170 to ring and cause the vibration motor 1010 to vibrate. This way, even in noisy environments, the user can still perceive the incoming call and prevent missing calls. Figure 4 This is a schematic diagram of a sub-plate and a vibration motor provided in an embodiment of this application. Figure 5 A schematic diagram of a sub-plate with a sub-plate bracket provided in an embodiment of this application is shown below. Figure 4 and Figure 5 To improve the integration of the mobile phone 100, the vibration motor 1010 can be placed in the area where the sub-board 150 is located. The shape of the sub-board 150 is designed to match the shape of the vibration motor 1010. To reliably fix the vibration motor 1010 and the sub-board 150, a sub-board bracket 1070 is provided, which securely fixes the vibration motor 1010 and the sub-board 150 to the mid-frame 110. One side of the sub-board bracket 1070 is the display panel 130, and the other side is the motor 1010 and the sub-board 150. The sub-board bracket 1070 also prevents the vibration motor 1010 from falling off and coming into contact with the back of the display panel 130, which could damage the display panel 130 when the motor 1010 vibrates.

[0072] Figure 6 This is a schematic diagram of a sub-plate support provided in an embodiment of this application. Figure 7 For along Figure 6See the cross-sectional view of the section formed by AA'. Figure 6 and Figure 7 The sub-plate support 1070 is made of metal, such as steel. Along the Z-axis, the sub-plate support 1070 sequentially includes a top cover 1071, a side edge 1072, and a skirt 1073. The surfaces of the top cover 1071 and the skirt 1073 facing away from the sub-plate 150 are parallel to the planes containing the X and Y axes, respectively. The side edge 1072 connects the top cover 1071 and the skirt 1073, forming a structure where the top cover 1071, side edge 1072, and skirt 1073 are sequentially connected. That is, the side edge 1072 surrounds the top cover 1071, and the skirt 1073 surrounds the side edge 1072. The inverted sub-plate support 1070 forms a groove structure with the top cover 1071 as the bottom surface and the side edge 1072 as the side surface. Side 1072 may include an upright portion 10721 and a transition portion 10722. One side of the upright portion 10721 is connected to the skirt 1073, and the surface of the upright portion 10721 is parallel to the Z-axis. One side of the transition portion 10722 is connected to the upright portion 10721, and the other side is connected to the top cover 1071. The transition portion 10722 connecting the upright portion 10721 and the top cover 1071 forms a 90-degree rounded corner, making the top cover 1071 and side 1072 form a relatively rounded protruding structure. The processing method for forming the sub-plate bracket 1070 can be a stamping process, that is, the prepared steel sheet is placed into a stamping die, and then the stamping die presses the steel sheet together, forming it in one step. It can be seen that the above-mentioned all-metal sub-plate bracket 1070 can be produced in only one stamping, which greatly simplifies the manufacturing process of the sub-plate bracket 1070, improves the manufacturing efficiency of the sub-plate bracket 1070, and reduces labor costs. Furthermore, the relatively rounded protruding structure formed by the top cover 1071 and the side 1072 not only facilitates stamping but also increases the structural strength of the sub-board bracket 1070, thereby improving its protective performance. Alternatively, it can save materials by using thinner metal sheets to form the sub-board bracket 1070, thus providing a basis for the thinning and lightening of electronic devices.

[0073] The skirt 1073 includes a skirt body 10731 and a skirt connecting portion 10732. The skirt body 10731 at least partially surrounds the side 1072 and the top cover 1071. A sub-board support pad (not shown) is provided on the PCB of the sub-board 150 near the sub-board bracket 1070, corresponding to the position of at least a portion of the skirt body 10731. The sub-board 150 can be soldered to the skirt body 10731 of the sub-board bracket 1070 via the sub-board support pad. The soldering between the sub-board 150 and the sub-board bracket 1070 can be performed using SMT (Surface Mount Technology). Specifically, the side of the PCB of the sub-board 150 with the sub-board support pad can be facing upwards. Solder paste can then be applied to the pads on this side that need to be soldered. The components to be soldered can then be placed at the corresponding pad positions, and the sub-board bracket 1070 can be placed at the same time. Finally, the sub-board 150 is placed in the reflow soldering equipment to complete the soldering of the side of the sub-board PCB with the sub-board support pads. This allows the sub-board 150 to be fixed to the sub-board support 1070 simultaneously while soldering surface-mount components on the sub-board 150. The width of the skirt body 10731 can be between 0.1mm and 0.2mm. This width ensures both the mechanical strength of the sub-board support 1070 and facilitates the placement of sub-board support pads of appropriate width, ensuring soldering reliability. To reduce processing difficulty and ensure the flatness of the sub-board support 1070, the length and width of the sub-board support 1070 in the X and Y axes can be limited to within 45mm.

[0074] See also Figure 6 The skirt connection portion 10732 may include a screw-in portion 107321 and a plug-in portion 107322. Figure 8 for Figure 6 See the enlarged view of region B in the middle. Figure 8 The screw connector 107321 includes a screw hole 1073211, and the position of the screw hole 1073211 of the sub-plate bracket 1070 corresponds to the position of the screw hole of the middle frame 110. Figure 9 This is another structural schematic diagram of a sub-plate bracket provided in an embodiment of this application. Figure 10 for Figure 9 See the enlarged view of region C in the middle. Figure 9 and Figure 10The connector 107322 includes a first bent portion 1073221, a longitudinal portion 1073222, a second bent portion 1073223, and a transverse portion 1073224 connected in sequence. One end of the first bent portion 1073221 is connected to the skirt body 10731, and the other end is connected to the longitudinal portion 1073222. The first bent portion 1073221 has a 90-degree rounded corner, bending the extension direction of the connector 107322 from a direction parallel to the plane containing the X and Y axes to a direction parallel to the Z axis, and the bending direction is away from the top cover 1071. The longitudinal portion 1073222 extends parallel to the Z axis and continues the bending direction of the first bent portion 1073221. The second bending portion 1073223 has a 90-degree rounded corner, bending the extension direction of the connector portion 107322 from the direction parallel to the Z-axis of the longitudinal portion 1073222 to the extension direction parallel to the Y-axis of the transverse portion 1073224, and the extension direction is away from the top cover 1071. The first bending portion 1073221, the longitudinal portion 1073222, the second bending portion 1073223, and the transverse portion 1073224 are all provided with stamped protrusions, two transition areas, and two side wings. Figure 11 For along Figure 10 See the cross-sectional view of the section formed by DD' in the middle. Figure 11 Taking the horizontal segment 1073224 as an example, the horizontal segment 1073224 includes a horizontal segment protrusion 10732241, a horizontal segment transition area 10732242, and a horizontal segment side wing 10732243. The two horizontal segment transition areas 10732242 are located on either side of the horizontal segment protrusion 10732241 and are connected to it. The two horizontal segment side wings 10732243 are each connected to the corresponding side of the horizontal segment transition area 10732242. The planes containing the surfaces of the horizontal segment protrusion 10732241 and the horizontal segment side wings 10732243 are parallel to each other. A horizontal transition zone 10732242 is disposed between the horizontal protrusion 10732241 and the horizontal wing 10732243. One end of the horizontal transition zone 10732242 is connected to the horizontal protrusion 10732241, and the other end is connected to the horizontal wing 10732243. The horizontal transition zone 10732242 can use its two consecutive rounded corners to connect and compensate for the height difference between the horizontal protrusion 10732241 and the horizontal wing 10732243. The resulting plug-in part 107322 has high structural strength. After the plug-in part 107322 is obliquely inserted into the corresponding groove of the middle frame 110, it can work together with the screw part 107321 to press the sub-plate bracket 1070 onto the middle frame 110. The width of the side wing can be greater than or equal to 0.5mm, which makes the plug part 107322 more resistant to bending and has better mechanical strength.

[0075] See also Figure 6 In the plane containing the X and Y axes, the top cover 1071 may include a sub-plate area 10711 and a vibration motor area 10712. The sub-plate area 10711 corresponds to the position of at least a portion of the sub-plate 150, and the vibration motor area 10712 corresponds to the position of the vibration motor 1010. The vibration motor area 10712 can be pressed against one side of the vibration motor 1010 to fix the vibration motor 1010. The sub-plate area 10711, together with the side edge 1072 and the skirt edge 1073, presses the sub-plate 150 against the middle frame 110, fixing and protecting the sub-plate 150. By using a single bracket to simultaneously fix the sub-plate 150 and the vibration motor 1010, the number of parts is reduced, thereby reducing costs and improving assembly efficiency.

[0076] The specific structure of another type of subplate support 1070 is described below.

[0077] Figure 12 This is a schematic diagram of another sub-plate support provided in an embodiment of this application. Figure 13 For along Figure 12 See the cross-sectional view of the section formed by A”A”’. Figure 12 and Figure 13The sub-plate support 1070 is made of metal, such as steel. Along the Z-axis, the sub-plate support 1070 sequentially includes a top cover 1071, a side edge 1072, and a skirt 1073. The surfaces of the top cover 1071 and the skirt 1073 are parallel to the planes containing the X and Y axes, respectively. The side edge 1072 connects the top cover 1071 and the skirt 1073, forming a structure where the top cover 1071, side edge 1072, and skirt 1073 are sequentially connected. That is, the side edge 1072 surrounds the top cover 1071, and the skirt 1073 surrounds the side edge 1072. The inverted sub-plate support 1070 forms a groove structure with the top cover 1071 as the bottom surface and the side edge 1072 as the side surface. Side 1072 may include an upright portion 10721 and a transition portion 10722. One side of the upright portion 10721 is connected to the skirt 1073, and the surface of the upright portion 10721 is parallel to the Z-axis. One side of the transition portion 10722 is connected to the upright portion 10721, and the other side is connected to the top cover 1071. The transition portion 10722 connecting the upright portion 10721 and the top cover 1071 forms a 90-degree rounded corner, making the top cover 1071 and side 1072 form a relatively rounded protruding structure. The processing method for forming the sub-plate bracket 1070 can be a stamping process, that is, the prepared steel sheet is placed into a stamping die, and then the stamping die presses the steel sheet together, forming it in one step. It can be seen that the above-mentioned all-metal sub-plate bracket 1070 can be produced in only one stamping, which greatly simplifies the manufacturing process of the sub-plate bracket 1070, improves the manufacturing efficiency of the sub-plate bracket 1070, and reduces labor costs. Furthermore, the relatively rounded protruding structure formed by the top cover 1071 and the side 1072 not only facilitates stamping but also increases the structural strength of the sub-board bracket 1070, thereby improving its protective performance. Alternatively, it can save materials by using thinner metal sheets to form the sub-board bracket 1070, thus providing a basis for the thinning and lightening of electronic devices.

[0078] The skirt 1073 includes a skirt body 10731 and a skirt connecting portion 10732. The skirt body 10731 at least partially surrounds the side 1072 and the top cover 1071. The PCB of the sub-board 150, near the sub-board bracket 1070, has sub-board bracket pads (not shown) corresponding to the positions of at least a portion of the skirt body 10731. The sub-board 150 can be soldered to the skirt body 10731 of the sub-board bracket 1070 via the sub-board bracket pads. The soldering between the sub-board 150 and the sub-board bracket 1070 can be performed using SMT (Surface Mount Technology). Specifically, the side of the sub-board 150's PCB with the sub-board bracket pads can be facing upwards. Solder paste can then be applied to the pads on this side, and the components to be soldered can be placed at the corresponding pad positions. The sub-board bracket 1070 can then be placed in the same position. Finally, the sub-board 150 is placed in the reflow soldering equipment to complete the soldering of the side of the sub-board PCB with the sub-board support pads. This allows the sub-board 150 to be fixed to the sub-board support 1070 simultaneously while soldering surface-mount components on the sub-board 150. The width of the skirt body 10731 can be between 0.1mm and 0.2mm. This width ensures both the mechanical strength of the sub-board support 1070 and facilitates the placement of sub-board support pads of appropriate width, ensuring soldering reliability. To reduce processing difficulty and ensure the flatness of the sub-board support 1070, the length and width of the sub-board support 1070 in the X and Y axes can be limited to within 45mm.

[0079] Figure 14 This is another structural schematic diagram of a different sub-plate bracket provided in an embodiment of this application. Figure 15 for Figure 14 See the enlarged view of region E in the middle. Figure 14 and Figure 15 The skirt connecting portion 10732 may include a screw-in portion 107321, a plug-in portion 107322, and a snap-fit ​​portion 107323. The screw-in portion 107321 includes a screw hole 1073211, the position of which corresponds to the screw hole position of the middle frame 110. The snap-fit ​​portion 107323 includes a latch 1073231, which has a wedge-shaped structure. The first end of the latch 1073231 is a smooth small end, and the second end is a large end with a flat surface. Figure 16 This is another schematic diagram of a different sub-plate bracket provided in an embodiment of this application. Figure 17 for Figure 16 See the enlarged view of region C' in the middle. Figure 16 and Figure 17The connector 107322 includes a first bent portion 1073221, a longitudinal portion 1073222, a second bent portion 1073223, and a transverse portion 1073224 connected in sequence. One end of the first bent portion 1073221 is connected to the skirt body 10731, and the other end is connected to the longitudinal portion 1073222. The first bent portion 1073221 has a 90-degree rounded corner, bending the extension direction of the connector 107322 from a direction parallel to the plane containing the X and Y axes to a direction parallel to the Z axis, and the bending direction is away from the top cover 1071. The longitudinal portion 1073222 extends parallel to the Z axis and continues the bending direction of the first bent portion 1073221. The second bending portion 1073223 has a 90-degree rounded corner, bending the extension direction of the connector portion 107322 from the direction parallel to the Z-axis of the longitudinal portion 1073222 to the extension direction parallel to the Y-axis of the transverse portion 1073224, and the extension direction is away from the top cover 1071. The first bending portion 1073221, the longitudinal portion 1073222, the second bending portion 1073223, and the transverse portion 1073224 are all provided with stamped protrusions, two transition areas, and two side wings. Figure 18 For along Figure 17 See the cross-sectional view of the section formed by the middle D”D”’. Figure 18Taking the horizontal segment 1073224 as an example, the horizontal segment 1073224 includes a horizontal segment protrusion 10732241, a horizontal segment transition area 10732242, and a horizontal segment side wing 10732243. The two horizontal segment transition areas 10732242 are located on either side of the horizontal segment protrusion 10732241 and are connected to it. The two horizontal segment side wings 10732243 are each connected to the corresponding side of the horizontal segment transition area 10732242. The planes containing the surfaces of the horizontal segment protrusion 10732241 and the horizontal segment side wings 10732243 are parallel to each other. A horizontal transition zone 10732242 is positioned between the horizontal protrusion 10732241 and the horizontal wing 10732243. One end of the horizontal transition zone 10732242 connects to the horizontal protrusion 10732241, and the other end connects to the horizontal wing 10732243. The horizontal transition zone 10732242 can utilize its two consecutive rounded corners to connect and compensate for the height difference between the horizontal protrusion 10732241 and the horizontal wing 10732243. This results in a highly structurally strong plug-in sub-part 107322. After the plug-in sub-part 107322 is obliquely inserted into the corresponding groove of the middle frame 110, the sub-plate bracket 1070 is pushed into the assembly position, at which point the latch 1073231 engages with the middle frame. The sub-plate bracket 1070 is pre-assembled by engaging the snap fastener 1073231 with the plug-in part 107322. Then, the screw shank is passed through the screw hole 1073211 and screwed into the screw hole of the middle frame 110, so that the plug-in part 107322, together with the screw part 107321, fixes the sub-plate bracket 1070 to the middle frame 110. The width of the side wing can be greater than or equal to 0.5mm, which gives the plug-in part 107322 strong bending resistance and good mechanical strength.

[0080] See also Figure 12 In the plane containing the X and Y axes, the top cover 1071 may include a sub-plate area 10711 and a vibration motor area 10712. The sub-plate area 10711 corresponds to the position of at least a portion of the sub-plate 150, and the vibration motor area 10712 corresponds to the position of the vibration motor 1010. The vibration motor area 10712 can be pressed against one side of the vibration motor 1010 to fix the vibration motor 1010. The sub-plate area 10711, together with the side edge 1072 and the skirt edge 1073, presses the sub-plate 150 against the middle frame 110, fixing and protecting the sub-plate 150. By using a single bracket to simultaneously fix the sub-plate 150 and the vibration motor 1010, the number of parts is reduced, thereby reducing costs and improving assembly efficiency.

[0081] Figure 19 This is a schematic diagram of the structure of the first side of a sub-plate provided in an embodiment of this application. Figure 20A schematic diagram of the structure of the second side of a sub-plate provided in an embodiment of this application is shown below. Figure 12 , Figure 19 and Figure 20 The sub-board 150 includes a microphone sensor 151, a first through-hole 152, and a second through-hole 153. The microphone sensor 151 is soldered to the first surface of the sub-board 150, and the first through-hole 152 and the second through-hole 153 penetrate the first and second surfaces of the sub-board 150. The sub-board area 10711 of the sub-board bracket 1070 includes a sound pickup channel 107111. The sound guide channel of the middle frame is located on the first surface of the sub-board 150, transmitting external sound to the first through-hole 152 on the first surface of the sub-board 150. The sound passes through the first through-hole 152 and reaches one end of the sound pickup channel 107111. The sound passes through the sound pickup channel 107111 and from the first through-hole 152 on the second surface of the sub-board 150, it is transmitted to the second through-hole 153 on the second surface of the sub-board 150. Then, it passes through the second through-hole 153 and reaches the sound pickup hole of the microphone sensor 151. The microphone sensor 151 generates a corresponding electrical signal based on the sound collected by the sound pickup hole. This setup allows for the integration of the microphone pickup channel with the sub-board bracket 1070, thereby reducing the number of assembly parts and improving assembly efficiency.

[0082] In some other embodiments, the sub-board 150 includes a first group of devices such as surface mount resistors, surface mount capacitors, and / or chips. The sub-board region 10711 may include a shielded sub-region located at a position corresponding to the first group of devices. The all-metal sub-board support 1070 can provide strong electromagnetic interference immunity for the first group of devices.

[0083] Figure 21 This is a schematic diagram of the structure of a motherboard and a rear camera provided in an embodiment of this application. Figure 22 This application provides a schematic diagram of a motherboard with a motherboard bracket installed, as shown in the embodiment of the present application. Figure 21 and Figure 22The motherboard 140 has a windowed area, within which a rear-facing camera 1040 is located. The motherboard 140 includes a charging management module 144. The motherboard bracket 1060 is made of copper, aluminum, or steel. Along the Z-axis, the motherboard bracket 1060 sequentially includes a motherboard bracket top cover 1061, a motherboard bracket side (not shown), and a motherboard bracket skirt (not shown). The motherboard 140 has motherboard bracket pads (not shown) for soldering to the motherboard bracket skirt. The motherboard bracket top cover 1061 may include a motherboard area 10611 and a rear-facing camera area 10612. The rear-facing camera area 10612 supports and fixes the rear-facing camera 1040. The motherboard area 10611 includes a heat dissipation shielding area 106111. The bottom surface of the heat dissipation shielding area 106111 can contact the top surface of the charging management module 144, thereby dissipating heat from the charging management module 144 and maintaining its normal operating temperature. Alternatively, thermally conductive material can be filled between the bottom surface of the heat dissipation shielding area 106111 and the top surface of the charging management module 144 to dissipate the heat generated by the charging management module 144 during operation. For example, thermally conductive silicone can be adhered between the bottom surface of the heat dissipation shielding area 106111 and the top surface of the charging management module 144, or liquid metal can be filled between the bottom surface of the heat dissipation shielding area 106111 and the top surface of the charging management module 144, or the bottom surface of the heat dissipation shielding area 106111 and the top surface of the charging management module 144 can be connected by a brazing process. The charging management module 144 is then directed to the motherboard bracket 1060. Especially when the motherboard bracket 1060 is made of copper, the high thermal conductivity of the copper motherboard bracket 1060 can be utilized to quickly conduct heat to the copper motherboard bracket 1060 for large-area heat dissipation. This achieves the effect of cooling the charging management module 144 while also providing electromagnetic shielding for the charging management module 144, preventing interference from the external electromagnetic environment.

[0084] The above example illustrates an implementation method that uses the motherboard bracket 1060 to provide heat dissipation and electromagnetic shielding for the charging management module 144. In fact, the above implementation method can not only provide the aforementioned functions for the charging management module 144, but also utilize the above structure to provide heat dissipation and electromagnetic shielding effects for any corresponding device.

[0085] The front-facing camera 1030 is mounted on the display panel 130. A second set of components, such as surface-mount resistors, surface-mount capacitors, and / or chips, are disposed around the front-facing camera 1030 on the display panel 130. The mobile phone 100 may also include a front-facing camera bracket. Along the Z-axis, the front-facing camera bracket includes a top cover, sides, and skirts. The top cover may include the front-facing camera area and the second set of component areas. The front-facing camera area is used to fix and support the front-facing camera 1030. The front-facing camera bracket not only protects the second set of components from external impacts and damage but also shields them from external electromagnetic interference, providing electromagnetic shielding for the second set of components.

[0086] The embodiments provided in this invention can be applied to both candybar phones and foldable phones. This invention does not limit the specific body structure of the phone 100. The above embodiments only exemplarily describe several types of stands; in actual implementation, the stand structure described in this application can be applied to any desired position according to actual needs. It should be noted that, for ease of understanding, the above embodiments use the phone 100 as an example. In fact, the embodiments provided in this application can be applied to any electronic device other than a mobile phone.

[0087] The embodiments of this application have been described above with reference to the accompanying drawings. However, this application is not limited to the specific embodiments described above. The specific embodiments described above are merely illustrative and not restrictive. Those skilled in the art can make many variations under the guidance of this application without departing from the spirit and scope of the claims. Those skilled in the art will understand that this invention is not limited to the specific embodiments described herein. Various obvious changes, readjustments, combinations and substitutions can be made by those skilled in the art without departing from the scope of protection of this invention, and all such changes and substitutions are within the scope of protection of this application.

Claims

1. An electronic device bracket, characterized in that, The electronic device support is made of metal, and the electronic device support includes: A top cover, the position of which corresponds to the position of at least a portion of the device to be protected; The side includes a first edge of the side away from the surface to be welded, and a second edge of the side closer to the surface to be welded, the first edge of the side surrounding the edge connecting the top cover; A skirt, the skirt surrounding and connecting at least a portion of the second edge of the side, the skirt including a first skirt surface capable of conforming to the surface to be welded, the first skirt surface being used for welding to the pads of the surface to be welded; Wherein, the distance between the top cover and the surface to be welded is greater than 0.

2. The electronic device bracket according to claim 1, characterized in that, The electronic device bracket is manufactured using a stamping process.

3. The electronic device bracket according to claim 1, characterized in that, The side includes a transition section and an upright section, the first side edge of the transition section surrounds and connects to the edge of the top cover, the second side edge of the transition section connects to the first side edge of the upright section, and the skirt surrounds and connects to at least a portion of the second side edge of the upright section; The transition portion includes a first transition section, which includes an inner surface of the section located on the recessed side of the electronic device bracket and an outer surface of the section located on the protruding side of the electronic device bracket. The inner surface of the transition portion is a first cylindrical surface, and the outer surface of the transition portion is a second cylindrical surface. The generatrix of the first cylindrical surface is a first straight generatrix, and the generatrix of the second cylindrical surface is a second straight generatrix. Both the first straight generatrix and the second straight generatrix are parallel to the first straight line. The first side edge of the upright portion extends toward the second side edge of the upright portion, and the extension direction is perpendicular to the surface to be welded; The first straight line is parallel to the plane containing the surface to be welded.

4. The electronic device bracket according to claim 3, characterized in that, Along the first plane, the cross-section of the first transition section is cut into a fan-shaped ring. Wherein, the first straight line is perpendicular to the first plane.

5. The electronic device bracket according to claim 1, characterized in that, The skirt includes a skirt body and a skirt connecting part. The skirt body is used to weld the pads on the surface to be welded, and the skirt connecting part is used to connect the external structure.

6. The electronic device bracket according to claim 5, characterized in that, The skirt connecting part includes a threaded part, and the threaded part includes a threaded hole.

7. The electronic device bracket according to claim 5, characterized in that, The skirt connection includes a plug-in portion for insertion into the mounting slot of the external structure.

8. The electronic device bracket according to claim 7, characterized in that, The connector sub-part includes a first bent portion, a first straight portion, a second bent portion, and a second straight portion connected in sequence; The first end of the first bent portion is connected to the skirt body, the second end of the first bent portion is connected to the first end of the first straight portion, the first bent portion extends with a 90-degree rounded corner, and the first straight portion extends from the first end of the first straight portion to the second end of the first straight portion, with the extension direction being perpendicular to the surface to be welded and the extension direction being away from the top cover. The first end of the second bent portion is connected to the second end of the first straight portion, the second end of the second bent portion is connected to the first end of the second straight portion, the second bent portion extends with a 90-degree rounded corner, the second straight portion extends from the first end of the second straight portion to the second end of the second straight portion, and the second end of the second straight portion is used to insert into the mounting groove of the external structure.

9. The electronic device bracket according to claim 8, characterized in that, The first bending section, the first straight section, the second bending section and the second straight section each comprise a protrusion, two transition regions and two side wings; The two transition regions are respectively connected to two sides of the protrusion, and the two side wings are each connected to a side of the corresponding transition region away from the protrusion. A cross-section of the plug sub-portion is taken along a second plane, and the cross-section of the plug sub-portion is in a shape of "Ji"; The extension direction of the part of the plug sub-portion forming a cross-section with the second plane is perpendicular to the second plane; or, the tangent direction of the extension curve of the plug sub-portion is perpendicular to the second plane, and the tangent point is located in the second plane.

10. The electronic device bracket according to claim 9, characterized in that, The width of the side wing is ≥ 0.5 mm.

11. The electronic device bracket according to claim 5, characterized in that, The width of the skirt body is between 0.1 mm and 0.2 mm.

12. The electronic device bracket according to claim 5, characterized in that, The skirt connecting portion comprises a clamping sub-portion, the clamping sub-portion comprises a buckle, and the clamping sub-portion is configured to clamp the external structure through the buckle.

13. The electronic device bracket according to claim 1, characterized in that, The top cover comprises a sub-board region and a vibration motor region, the position of the sub-board region corresponds to the position of at least part of a sub-board, and the position of the vibration motor region corresponds to the position where the vibration motor is located.

14. The electronic device bracket according to claim 1, characterized in that, The device to be protected comprises a first through hole and a second through hole, the top cover comprises a sound pickup channel, a first end of the sound pickup channel corresponds to the position of the first through hole, a second end of the sound pickup channel corresponds to the position of the second through hole, the first end of the sound pickup channel is in communication with the second end of the sound pickup channel, and the sound pickup channel is configured to transmit sound passing through the first through hole to the second through hole.

15. The electronic device bracket according to claim 13, characterized in that, The sub-board region comprises a shielding sub-region, and the position of the shielding sub-region corresponds to the position of a first group of devices of the sub-board.

16. The electronic device bracket according to claim 1, characterized in that, The top cover comprises a main board region and a rear camera region, the position of the main board region corresponds to the position of at least part of a main board, and the position of the rear camera region corresponds to the position where a rear camera is located.

17. The electronic device bracket according to claim 1, characterized in that, The top cover comprises a heat dissipation and shielding region, and the heat dissipation and shielding region is in direct or indirect contact with a device to be heat-dissipated on a surface of the device to be protected.

18. The electronic device bracket according to claim 17, characterized in that, The material of the electronic device bracket is copper.

19. The electronic device bracket according to claim 1, characterized in that, The top cover comprises a front camera region and a second group of device regions, the position of the front camera region corresponds to the position of a front camera, the position of the second group of device regions corresponds to the position where a second group of devices is located, and the second group of devices is arranged on a display panel.

20. An electronic device, characterized in that, Comprises the electronic device bracket according to any one of claims 1-19.

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