A middle frame assembly, a manufacturing method thereof and an electronic device

Abstract

The application provides a middle frame assembly, a manufacturing method thereof and an electronic device. The middle frame assembly comprises a middle frame outer ring, a middle frame inner container and a fixing structure. The middle frame outer ring surrounds the outer periphery of the middle frame inner container and is fixedly connected with the middle frame inner container. The fixing structure is fixedly connected to the middle frame inner container and is used for limiting and fixing internal components of the electronic device. The middle frame outer ring comprises an outer ring metal part and an outer ring plastic part. The outer ring plastic part is formed on the inner side of the outer ring metal part by an integral injection molding process. The middle frame inner container is fixedly connected with the outer ring plastic part. The middle frame assembly provided by the application has a small proportion of the outer ring metal part. Except for special areas (such as areas requiring antenna connection), a metal wall thickness can be formed on the appearance surface, and the remaining part can be filled with plastic, thereby reducing the weight of the middle frame assembly. When the middle frame assembly is applied to the electronic device, the weight of the whole machine can be reduced.

Description

Technical Field

[0001] This application relates to terminal devices, and more specifically, to a mid-frame component and its manufacturing method, and electronic devices. Background Technology

[0002] With the development of electronic devices such as mobile phones and tablets, including leaps in battery capacity, larger camera modules, and numerous new hardware features, these devices are becoming increasingly heavy. The weight of a mobile phone (such as a candybar phone) is concentrated in the screen, camera module, battery, circuit board assembly, and structural components. Structural components account for approximately one-third of the total weight, and the mid-frame accounts for about half of the structural component weight. Therefore, the mid-frame accounts for a very large proportion of the phone's weight, making mid-frame weight reduction an urgent priority.

[0003] The current solution is to reduce the volume of the metal parts in the mid-frame during the design phase, commonly known as "slimming down." However, there are currently bottlenecks in slimming down the mid-frame, and excessively reducing the metal parts of the mid-frame can also affect the reliability of the entire device.

[0004] Therefore, there is a need to provide a mid-frame component that can reduce its own weight while still ensuring the reliability of the entire device. Summary of the Invention

[0005] This application provides a mid-frame assembly and its manufacturing method, as well as an electronic device. The mid-frame assembly can be used in electronic devices, which can reduce the weight of the mid-frame assembly and the whole device, and ensure the reliability of the whole device.

[0006] In a first aspect, a mid-frame assembly is provided for use in an electronic device. The mid-frame assembly includes an outer mid-frame ring, an inner mid-frame liner, and a fixing structure. The outer mid-frame ring surrounds the outer periphery of the inner mid-frame liner and is fixedly connected to the inner mid-frame liner. The fixing structure is connected to the inner mid-frame liner and is used to limit and fix the internal components of the electronic device. The outer mid-frame ring includes an outer metal portion and an outer plastic portion. The outer plastic portion is formed on the inner side of the outer metal portion by an integral injection molding process. The inner mid-frame liner is fixedly connected to the outer plastic portion.

[0007] In this embodiment, the mid-frame assembly includes an outer mid-frame ring, an inner mid-frame liner, and fixing structural members. The outer mid-frame ring includes an outer metal portion and an outer plastic portion. The outer plastic portion can be integrally injection molded onto the inner side of the outer metal portion. The outer metal portion provides both antenna functionality and a metallic appearance. The outer metal portion occupies a relatively small proportion; except for special areas (such as areas requiring antenna connection), only a single layer of metal wall thickness can be formed on the outer surface, with the remainder filled with plastic. This reduces the weight of the mid-frame assembly, thus reducing the overall weight when applied to electronic devices. Furthermore, the fixing structural members can be directly connected to the inner mid-frame liner. Fixing structural members are placed at locations where electronic components need to be secured, eliminating the need for extensive fixing structures and further reducing the weight of the mid-frame assembly. Additionally, the inner mid-frame liner is fixedly connected to the outer mid-frame ring. The inner mid-frame liner supports components such as the motherboard, circuit boards, and battery of the electronic device, and the fixing structural members on the inner mid-frame liner secure these components, ensuring the overall reliability of the device.

[0008] In conjunction with the first aspect, in some implementations of the first aspect, the tensile strength of the inner frame liner is greater than or equal to a first threshold, the yield strength of the inner frame liner is greater than or equal to a second threshold, and the elongation of the inner frame liner is greater than or equal to a third threshold.

[0009] For example, the first threshold can be 200 MPa, the second threshold can be 100 MPa, and the third threshold can be 3%. That is, the tensile strength of the inner frame liner 220 is ≥200 MPa, the yield strength of the inner frame liner 220 is ≥100 MPa, and the elongation of the inner frame liner 220 is ≥3%. For example, the tensile strength of the inner frame liner 220 is 300 MPa, the yield strength of the inner frame liner 220 is 200 MPa, and the elongation of the inner frame liner 220 is 5%. It should be understood that the tensile strength, yield strength, and elongation may vary depending on the material of the inner frame liner 220.

[0010] In this embodiment, the strength of the inner frame meets a preset threshold, and the inner frame assembly has high strength. When components such as the motherboard, small board, and battery are installed on the inner frame, it can provide strong support for each component of the electronic device, thereby ensuring the reliability of the whole machine.

[0011] In conjunction with the first aspect, in some implementations of the first aspect, the inner liner of the middle frame is made of metal, and the thickness of the inner liner of the middle frame is 0.1mm-0.3mm.

[0012] For example, the thickness of the inner frame can be 0.1mm, 0.2mm, or 0.3mm. In some examples, the inner frame can have unequal thicknesses; for instance, the thickness of the portion of the inner frame corresponding to the motherboard can be 0.2mm, and the thickness of the portion of the inner frame corresponding to the battery can be 0.1mm.

[0013] In this embodiment, the inner frame can be made of metal (e.g., high-strength aluminum sheet), and the metal inner frame is relatively thin, thereby reducing the weight and thickness of the inner frame assembly, and consequently reducing the overall weight of the device. Furthermore, the metal inner frame facilitates heat conduction and dissipation for the entire device.

[0014] In conjunction with the first aspect, in some implementations of the first aspect, the inner liner of the middle frame and the outer ring of the middle frame are fixedly connected by any one of the following methods: adhesive application, welding, screw fastening, or insert injection molding. The inner liner of the middle frame and the plastic portion of the outer ring can be fixedly connected by any one of the following methods: adhesive application, welding, screw fastening, or insert injection molding.

[0015] In this embodiment, the metal inner frame and the plastic outer ring can be fixedly connected by means of glue application, screw locking, or insert injection molding, thereby ensuring the connection stability between the inner frame and the outer ring and thus ensuring the reliability of the whole machine.

[0016] In conjunction with the first aspect, in some implementations of the first aspect, the material of the inner liner of the middle frame is any one of aluminum alloy, titanium alloy, stainless steel, magnesium alloy, and nickel-based high-temperature alloy.

[0017] In this application embodiment, there are multiple options for the type of metal material of the inner frame liner, and users can choose a suitable material to make the inner frame liner according to requirements such as cost and strength.

[0018] In conjunction with the first aspect, in some implementations of the first aspect, the inner liner of the middle frame is made of non-metallic material, and the thickness of the inner liner of the middle frame is 0.1mm-0.4mm.

[0019] For example, the thickness of the inner frame can be 0.1mm, 0.2mm, 0.3mm, or 0.4mm. In some examples, the inner frame can have unequal thicknesses; for instance, the thickness of the portion of the inner frame corresponding to the motherboard can be 0.3mm, and the thickness of the portion of the inner frame corresponding to the battery can be 0.2mm.

[0020] In this embodiment of the application, the material of the inner frame can be a non-metallic material (e.g., high-strength fiber), and the thickness of the non-metallic inner frame is relatively thin, which has a relatively lighter weight compared to the metallic material, thereby further reducing the weight of the inner frame assembly, and thus further reducing the weight of the whole machine.

[0021] In conjunction with the first aspect, in some implementations of the first aspect, the inner liner of the middle frame and the outer plastic part are fixedly connected by hot pressing or injection molding.

[0022] In this embodiment, the non-metallic inner frame and the plastic outer ring can be fixedly connected by hot pressing, injection molding, etc., thereby ensuring the connection stability between the inner frame and the outer ring, and thus ensuring the reliability of the whole machine.

[0023] In conjunction with the first aspect, in some implementations of the first aspect, the material of the inner liner of the middle frame is any one of carbon fiber, aramid fiber, ultra-high molecular weight polyethylene, poly(p-phenylenebenzodioxazole) fiber, glass fiber, boron fiber, and ceramic fiber.

[0024] In this embodiment, there are multiple options for the non-metallic material of the inner frame liner, and users can choose a suitable material to make the inner frame liner according to requirements such as cost and strength.

[0025] In conjunction with the first aspect, in some implementations of the first aspect, the inner frame includes a metal material and a non-metal material, wherein the portion of the inner frame corresponding to the motherboard area of ​​the electronic device is made of a non-metal material, the portion of the inner frame corresponding to the small board area of ​​the electronic device is made of a non-metal material, and the portion of the inner frame corresponding to the battery area of ​​the electronic device is made of a metal material.

[0026] For example, the inner frame may include a first part, a second part, and a third part. The first part corresponds to the motherboard area of ​​the electronic device, the second part corresponds to the small board area of ​​the electronic device, and the third part corresponds to the battery area of ​​the electronic device. The first and second parts may be made of non-metallic materials, and the third part may be made of metallic materials.

[0027] In this embodiment, the inner frame can be a composite inner frame made of metal and non-metal materials. Metal materials can be used in areas where the inner frame is thinner (such as the battery area) to increase its strength. Non-metal materials can be used in other areas of the inner frame (such as the motherboard area, the small board area, etc.) to reduce its weight. Thus, the weight of the inner frame can be reduced while its strength can be increased, thereby reducing the weight of the inner frame assembly and the whole device, while ensuring the strength and reliability of the whole device.

[0028] In conjunction with the first aspect, in some implementations of the first aspect, the thickness of the connection area between the inner frame liner and the outer plastic portion is greater than the thickness of other areas of the inner frame liner.

[0029] For example, the inner frame liner can be made of a multi-layered fiber material, and the strength can be increased by increasing the number of fiber layers in areas of structural weakness. For instance, to provide greater bonding strength when bonded to the outer frame, the thickness of the connection area between the inner frame liner and the outer plastic portion can be increased.

[0030] In this embodiment, by setting the thickness of the connection area between the inner frame liner and the outer plastic part to be greater than the thickness of other areas of the inner frame liner, the connection stability between the inner frame liner and the outer frame can be increased, thus avoiding the problem of the inner frame liner and the outer frame liner falling off.

[0031] In conjunction with the first aspect, in some implementations of the first aspect, the thickness of the inner frame in the motherboard region of the electronic device is greater than the thickness of the inner frame in the battery region of the electronic device, and the thickness of the inner frame in the small board region of the electronic device is greater than the thickness of the inner frame in the battery region of the electronic device.

[0032] For example, the inner frame can be made of a multi-layered fiber material. In the battery area of ​​the electronic device, the number of fiber layers in the inner frame can be less, thereby reducing the overall thickness of the device; in the motherboard / small board area of ​​the electronic device, the number of fiber layers in the inner frame can be more, thereby enhancing the structural stability of the inner frame.

[0033] In this embodiment, the thickness of the inner frame of the battery area of ​​the electronic device can be less than the thickness of the motherboard area and the small board area of ​​the electronic device, thereby ensuring the strength of the inner frame while reducing the thickness and weight of the inner frame assembly.

[0034] In conjunction with the first aspect, in some implementations of the first aspect, the fixing structure is welded to the inner liner of the middle frame, and / or the fixing structure is thermally fused to the inner liner of the middle frame.

[0035] For example, when the inner frame is made of metal, the fixing structure can be spot-welded to the inner frame; when the inner frame is made of non-metallic material, the fixing structure can be heat-fused into the inner frame; when the inner frame includes both metallic and non-metallic materials, the fixing structure can be spot-welded to the metallic inner frame or heat-fused into the non-metallic inner frame.

[0036] In this embodiment, the fixing structure can be welded and / or heat-fused to the inner liner of the middle frame, thereby achieving a stable connection between the fixing structure and the inner liner of the middle frame, and thus ensuring the reliability of the whole machine.

[0037] In a second aspect, an electronic device is provided, the electronic device including the mid-frame component described in the first aspect and any implementation thereof.

[0038] In some examples, the electronic device also includes a display screen and a back cover, which are located on either side of the mid-frame assembly.

[0039] In the embodiments of this application, the electronic device may include a mid-frame assembly, which is lightweight and strong. When the mid-frame assembly is applied to the electronic device, the weight of the whole device can be reduced and the reliability of the whole device can be guaranteed.

[0040] Thirdly, a method for manufacturing a mid-frame assembly is provided. The mid-frame assembly includes an outer mid-frame ring, an inner mid-frame liner, and a fixing structure. The outer mid-frame ring includes an outer metal portion and an outer plastic portion. The manufacturing method includes: injection molding the outer metal portion to form the outer plastic portion inside the outer metal portion; fixing the fixing structure to the inner mid-frame liner, the fixing structure being used to limit and fix the internal components of the electronic device; and fixing the inner mid-frame liner to the outer plastic portion.

[0041] In this embodiment, firstly, an outer ring plastic portion can be injection molded inside the outer ring metal portion, and the outer ring metal portion and the outer ring plastic portion form the outer ring of the middle frame assembly; secondly, a fixing structure can be connected to the inner liner of the middle frame; finally, the inner liner of the middle frame can be fixedly connected to the outer ring plastic portion of the outer ring of the middle frame. This processing method can reduce the impact on other components during manufacturing. Furthermore, the resulting middle frame assembly has good stability and a relatively light weight.

[0042] In conjunction with the third aspect, in some implementations of the third aspect, the fixed connection of the fixing structural member to the inner frame includes: welding the fixing structural member to the inner frame at a predetermined position in the inner frame, and / or thermally fusing the fixing structural member to the inner frame; the method further includes: performing CNC processing on the surface of the fixing structural member to form a predetermined shape.

[0043] In this embodiment, the fixing structure can be welded and / or heat-fused to the inner liner of the middle frame, and the surface of the fixing structure can be CNC processed to obtain the required shape features, which can achieve a stable connection between the fixing structure and the inner liner of the middle frame, thereby ensuring the reliability of the whole machine.

[0044] In conjunction with the third aspect, in some implementations of the third aspect, the tensile strength of the inner frame liner is greater than a first threshold, the yield strength of the inner frame liner is greater than a second threshold, and the elongation of the inner frame liner is greater than a third threshold.

[0045] In this embodiment, the strength of the inner frame meets a preset threshold, and the inner frame assembly has high strength. When components such as the motherboard, small board, and battery are installed on the inner frame, it can provide strong support for each component of the electronic device, thereby ensuring the reliability of the whole machine.

[0046] In conjunction with the third aspect, in some implementations of the third aspect, the inner liner of the middle frame is made of metal, and the thickness of the inner liner of the middle frame is 0.1mm-0.3mm.

[0047] In this embodiment, the inner frame can be made of metal (e.g., high-strength aluminum sheet), and the metal inner frame is relatively thin, thereby reducing the weight and thickness of the inner frame assembly, and consequently reducing the overall weight of the device. Furthermore, the metal inner frame facilitates heat conduction and dissipation for the entire device.

[0048] In conjunction with the third aspect, in some implementations of the third aspect, the fixed connection between the inner frame liner and the outer plastic part includes: fixing the inner frame liner to the outer plastic part by any one of the following methods: dispensing glue, welding, screwing, or insert injection molding.

[0049] In this embodiment, the metal inner frame and the plastic outer ring can be fixedly connected by means of dispensing, welding, screwing, or insert injection molding, thereby ensuring the connection stability between the inner frame and the outer ring and thus ensuring the reliability of the whole machine.

[0050] In conjunction with the third aspect, in some implementations of the third aspect, the material of the inner liner of the middle frame is any one of aluminum alloy, titanium alloy, stainless steel, magnesium alloy, and nickel-based high-temperature alloy.

[0051] In this application embodiment, there are multiple options for the type of metal material of the inner frame liner, and users can choose a suitable material to make the inner frame liner according to requirements such as cost and strength.

[0052] In conjunction with the third aspect, in some implementations of the third aspect, the inner liner of the middle frame is made of non-metallic material, and the thickness of the inner liner of the middle frame is 0.1mm-0.4mm.

[0053] In this embodiment of the application, the material of the inner frame can be a non-metallic material (e.g., high-strength fiber), and the thickness of the non-metallic inner frame is relatively thin, which has a relatively lighter weight compared to the metallic material, thereby further reducing the weight of the inner frame assembly, and thus further reducing the weight of the whole machine.

[0054] In conjunction with the third aspect, in some implementations of the third aspect, the fixed connection between the inner frame liner and the outer plastic part includes: fixing the inner frame liner to the outer plastic part by hot pressing or injection molding.

[0055] In this embodiment, the non-metallic inner frame and the plastic outer ring can be fixedly connected by hot pressing, injection molding, etc., thereby ensuring the connection stability between the inner frame and the outer ring, and thus ensuring the reliability of the whole machine.

[0056] In conjunction with the third aspect, in some implementations of the third aspect, the material of the inner liner of the middle frame is any one of carbon fiber, aramid fiber, ultra-high molecular weight polyethylene, PBO fiber, glass fiber, boron fiber, and ceramic fiber.

[0057] In this embodiment, there are multiple options for the non-metallic material of the inner frame liner, and users can choose a suitable material to make the inner frame liner according to requirements such as cost and strength.

[0058] In conjunction with the third aspect, in some implementations of the third aspect, the inner frame includes both metallic and non-metallic materials. The portion of the inner frame corresponding to the motherboard area of ​​the electronic device is made of non-metallic material, the portion of the inner frame corresponding to the small board area of ​​the electronic device is made of non-metallic material, and the portion of the inner frame corresponding to the battery area of ​​the electronic device is made of metallic material.

[0059] In this embodiment, the inner frame can be a composite inner frame made of metal and non-metal materials. Metal materials can be used in areas where the inner frame is thinner (such as the battery area) to increase its strength. Non-metal materials can be used in other areas of the inner frame (such as the motherboard area, the small board area, etc.) to reduce its weight. Thus, the weight of the inner frame can be reduced while its strength can be increased, thereby reducing the weight of the inner frame assembly and the whole device, while ensuring the strength and reliability of the whole device.

[0060] In conjunction with the third aspect, in some implementations of the third aspect, the thickness of the connection area between the inner frame liner and the outer plastic portion is greater than the thickness of other areas of the inner frame liner.

[0061] In this embodiment, by setting the thickness of the connection area between the inner frame liner and the outer plastic part to be greater than the thickness of other areas of the inner frame liner, the connection stability between the inner frame liner and the outer frame can be increased, thus avoiding the problem of the inner frame liner and the outer frame liner falling off.

[0062] In conjunction with the third aspect, in some implementations of the third aspect, the thickness of the inner frame in the motherboard region of the electronic device is greater than the thickness of the inner frame in the battery region of the electronic device, and the thickness of the inner frame in the small board region of the electronic device is greater than the thickness of the inner frame in the battery region of the electronic device.

[0063] In this embodiment, the thickness of the inner frame of the battery area of ​​the electronic device can be less than the thickness of the motherboard area and the small board area of ​​the electronic device, thereby ensuring the strength of the inner frame while reducing the thickness and weight of the inner frame assembly. Attached Figure Description

[0064] Figure 1 This is a front view of an electronic device provided in an embodiment of this application.

[0065] Figure 2 This is a schematic diagram of the back of an electronic device provided in an embodiment of this application.

[0066] Figure 3 This is an exploded structural diagram of an electronic device provided in an embodiment of this application.

[0067] Figure 4 and Figure 5 This is an exploded structural diagram of a mid-frame component provided in an embodiment of this application.

[0068] Figure 6 This is a top view schematic diagram of a partial structure of a mid-frame component provided in an embodiment of this application.

[0069] Figures 7 to 11 This is a cross-sectional schematic diagram of a portion of the structure of the mid-frame component provided in an embodiment of this application.

[0070] Figure 12 This is a top view schematic diagram of a partial structure of another mid-frame component provided in an embodiment of this application.

[0071] Figures 13 to 15 This is a cross-sectional schematic diagram of a portion of the structure of the mid-frame component provided in an embodiment of this application.

[0072] Figure 16 This is a top view schematic diagram of a partial structure of another mid-frame component provided in an embodiment of this application.

[0073] Figure 17 This is a cross-sectional schematic diagram of a portion of the structure of the mid-frame component provided in an embodiment of this application. Detailed Implementation

[0074] The technical solutions in this application will now be described with reference to the accompanying drawings.

[0075] In the description of the embodiments of this application, unless otherwise stated, " / " means "or". For example, A / B can mean A or B. "And / or" in this document is merely a description of the relationship between related objects, indicating that there can be three relationships. For example, A and / or B can mean: A exists alone, A and B exist simultaneously, and B exists alone.

[0076] In the embodiments of this application, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined with "first," "second," etc., may explicitly or implicitly include one or more of that feature. Furthermore, in the description of the embodiments of this application, "multiple" refers to two or more, and "at least one" and "one or more" refer to one, two, or more. The singular expressions "a," "an," "the," "the," "the," and "this" are intended to also include expressions such as "one or more," unless the context explicitly indicates otherwise. The terms "comprising," "including," "having," and variations thereof all mean "including but not limited to," unless otherwise specifically emphasized.

[0077] In the description of the embodiments of this application, the terms "upper," "lower," "inner," "outer," etc., indicate the orientation or positional relationship relative to the orientation or position of the components shown in the drawings. It should be understood that these directional terms are relative concepts, used for relative description and clarification, and not to indicate or imply that the device or component referred to must have a specific orientation, or be constructed and operated in a specific orientation. They can change accordingly depending on the orientation of the components in the drawings, and therefore should not be construed as limiting this application.

[0078] In this application, the same reference numerals are used to denote the same components. For the same components in this application, only one component may be labeled with a reference numeral in the figures. It should be understood that the reference numerals also apply to other identical components. Furthermore, for the sake of brevity, detailed descriptions of the same components are omitted in different embodiments. In addition, the components in the figures are not drawn to actual scale, and the dimensions and sizes of the components shown in the figures are merely exemplary and should not be construed as limiting this application.

[0079] This application provides a mid-frame component and its manufacturing method, as well as an electronic device, aimed at reducing the weight of the mid-frame component. It should be understood that the mid-frame component provided in this application can be applied to electronic devices, such as mobile phones, tablets, tablet accessories, laptops, ultra-mobile personal computers (UMPCs), netbooks, personal digital assistants (PDAs), wearable devices, in-vehicle devices, augmented reality (AR) / virtual reality (VR) devices, and other mobile terminals. Alternatively, it can be professional shooting equipment such as digital cameras, SLR cameras / mirrorless cameras, action cameras, gimbal cameras, and drones. This application does not impose special limitations on the specific form of the electronic device; for ease of understanding, the following description uses a mobile phone as an example.

[0080] Before describing the specific structure of the electronic device with reference to the accompanying drawings, the coordinate system of the drawings is first defined. In the drawings, the x, y, and z directions are mutually perpendicular. The x direction can be understood as the width direction of the electronic device, the y direction as the length direction, and the z direction as the thickness direction.

[0081] Figure 1 This is a front view of an electronic device provided in an embodiment of this application. Figure 2 yes Figure 1 A schematic diagram of the back of the electronic device shown. Figure 3 yes Figure 1 The diagram shows the exploded structure of the electronic device.

[0082] refer to Figure 1 , Figure 2 and Figure 3 The electronic device 1000 includes a display screen 100, a mid-frame assembly 200, and a back cover 300. The display screen 100 and the back cover 300 are located on opposite sides of the mid-frame assembly 200 along its thickness direction (i.e., the z-direction). A receiving cavity can be formed between the display screen 100, the mid-frame assembly 200, and the back cover 300, within which various components of the electronic device 1000 can be disposed. The side of the mid-frame assembly 200 facing the back cover 300 typically has a recess to form a battery compartment, and the back cover 300 seals the battery compartment. The material of the back cover 300 is not limited herein; in practical applications, those skilled in the art can select it according to actual needs. For example, the back cover 300 can be made of metal, plastic, ceramic, or glass, etc.

[0083] In some examples, the mid-frame assembly 200 and the rear cover 300 can be a single, integrally formed structure, together constituting the housing of the electronic device 1000. The housing of the electronic device has two main functions: firstly, to provide a mounting base for the various components of the electronic device; and secondly, to provide protection for some components.

[0084] At least a portion of the display screen 100 is supported on and connected to the mid-frame assembly 200 for displaying images. The display screen 100 can be a flexible or rigid display screen. The flexible display screen provides a foldable function, enabling folding and other operations of the electronic device 1000 in conjunction with the structural design of the housing. The display screen 100 can be a regular screen or an irregularly shaped screen; for example, the outer edge of the display screen 100 can be curved to form a curved screen.

[0085] The display screen 100 can be located on the front of the electronic device 1000, on the back of the electronic device 1000, or on both the front and back of the electronic device 1000. The front of the electronic device 1000 can be understood as the side facing the user when using the electronic device 1000. Figure 1 The back of the electronic device 100, where the display screen 100 is located, can be understood as the side facing away from the user when using the electronic device 1000. Taking the front of the electronic device 1000 as an example, in some examples, the display screen 100 can cover the entire front area of ​​the electronic device 1000, forming a full-screen electronic device 1000. In this case, the display screen 100 not only has display function but also usually has touch function, meaning that the electronic device 1000 can be operated by clicking on the display screen 100. In some examples, the display screen 100 may only cover a partial area of ​​the front of the electronic device 1000. The specific placement of the display screen 100 is not limited and can be selected according to actual needs. In this case, the display screen 100 may have touch function or only display function.

[0086] For example, the display screen 100 may include a liquid crystal display (LCD), a light emitting diode (LED) display panel, an organic light-emitting diode (OLED) display panel, an active-matrix organic light-emitting diode (AMOLED) display panel, a flexible light-emitting diode (FLED) display panel, a quantum dot light-emitting diode (QLED) display panel, etc., and the embodiments of this application do not limit this.

[0087] The mid-frame assembly 200 serves as a support frame within the electronic device 1000, primarily providing structural support for the entire device. For example, the mid-frame assembly 200 can be used to support and secure the display screen 100 and internal components of the electronic device 1000. Considering that the mid-frame assembly 200 accounts for a significant portion of the weight of the electronic device 1000, reducing its weight is beneficial to the trend towards thinner and lighter electronic devices. This application aims to explore how to reduce the weight of the mid-frame assembly 200, which will be described in detail below with reference to the accompanying drawings.

[0088] Figure 4 and Figure 5 This is an exploded structural diagram of the mid-frame component 200 provided in an embodiment of this application. Figure 6 This is a top view of a portion of the structure of the middle frame component 200, that is, a projection diagram of a portion of the structure of the middle frame component 200 on the xy plane. Figure 7 and Figure 8 This is a cross-sectional schematic diagram of a portion of the structure of the middle frame component 200, that is, a partial cross-sectional schematic diagram of a portion of the structure of the middle frame component 200 along the xz plane.

[0089] refer to Figure 4 , Figure 5 and Figure 6 The mid-frame assembly 200 may include an outer mid-frame ring 210, an inner mid-frame liner 220, and a fixing structure 230. The outer mid-frame ring 210 surrounds the outer periphery of the inner mid-frame liner 220 and is fixedly connected to the inner mid-frame liner 220. The inner mid-frame liner 220 is used to support the internal components of the electronic device 1000. The fixing structure 230 is fixedly connected to the inner mid-frame liner 220 and is used to limit and fix the internal components of the electronic device 1000, such as batteries, motherboards, and small boards.

[0090] It should be understood that the fixing structure 230 can be directly connected to the inner frame 220. The fixing structure 230 is placed at the location where electronic components need to be fixed, eliminating the need for a large number of fixing structures 230, thus reducing the weight of the inner frame assembly 200 to some extent. Furthermore, the inner frame 220 is fixedly connected to the outer frame 210. The inner frame 220 can support components such as the motherboard, circuit boards, and battery of the electronic device, and the fixing structure 230 located on the inner frame 220 can secure these components, thereby ensuring the reliability of the entire device.

[0091] For example, the outer ring 210 of the middle frame may have unequal widths. That is, the width of the outer ring 210 of the middle frame in the x direction may not be equal. For example, the surface of the inner wall of the outer ring 210 of the middle frame (i.e., the side of the outer ring 210 of the middle frame near the inner liner 220 of the middle frame) may be uneven.

[0092] In some examples, reference Figure 7 In (a), the outer ring 210 of the middle frame may include an outer metal part 211 and an outer plastic part 212. The outer plastic part 212 is formed on the inner side of the outer metal part 211 by an integral injection molding process. The inner liner 220 of the middle frame is fixedly connected to the outer plastic part 212. The outer metal part 211 can realize antenna function and metal appearance effect. The proportion of the outer metal part 211 is small. Except for special areas (such as areas where antennas need to be connected), only a layer of metal wall thickness can be formed on the appearance surface as a metal appearance, and the rest can be filled with plastic, thereby reducing the weight of the middle frame assembly 200. When the middle frame assembly 200 is applied to the electronic device 1000, the weight of the whole device can be reduced.

[0093] For example, the wall thickness of the metal exterior surface of the inner frame outer ring 210 is approximately 0.2mm-0.6mm, such as 0.2mm, 0.3mm, 0.4mm, 0.5mm, 0.6mm, etc.

[0094] In some examples, reference Figure 7 In (b), the outer metal portion 211 includes a first metal piece 2111 extending into the inner frame 220. The first metal piece 2111 can be used to transmit antenna signals. The first metal piece 2111 can penetrate the outer plastic portion 212, that is, one end of the first metal piece 2111 is connected to the outer metal portion 211, and the other end of the first metal piece 2111 is connected to the copper sheet 213. In other words, the metal of the inner frame (the first metal piece 2111) is extended in at the location where the antenna needs to be connected, and the copper sheet 213 is spot-welded to the side to achieve electrical connection.

[0095] In some examples, reference Figure 7In (c), the outer ring 210 of the middle frame can be made of a non-metallic material (such as plastic). The plastic outer ring 210 can be molded into a ring structure surrounding the inner liner 220 of the middle frame. The middle frame assembly 200 may also include a second metal piece 214, which can be used to realize the transmission of antenna signals. For example, the second metal piece 214 can be completely wrapped inside the plastic outer ring 210 of the middle frame, with its end exposed and connected to the copper sheet 213, that is, the copper sheet 213 is spot-welded to the side to achieve electrical connection for antenna radiation. As another example, one end of the second metal piece 214 can be exposed on the outer surface of the plastic outer ring 210 of the middle frame, and the other end of the second metal piece 214 can be spot-welded to the copper sheet 213 to achieve electrical connection for antenna radiation. For example, the copper sheet 213 can be an L-shaped structure.

[0096] For example, in the outer ring 210 of the middle frame, except for the antenna radiator which is made of metal, the rest can be made of plastic, thereby minimizing the weight of the outer ring 210 of the middle frame.

[0097] The inner liner 220 of the middle frame can be fixedly connected to the outer plastic part 212 of the outer ring 210 of the middle frame, or the inner liner 220 of the middle frame can be fixedly connected to the outer metal part 211 of the outer ring 210 of the middle frame, or the inner liner 220 of the middle frame can be directly connected to the plastic outer ring 210 of the middle frame.

[0098] The strength of the inner frame 220 should meet certain requirements. When the motherboard, small board and battery and other components are installed on the inner frame 220, it can provide strong support for the various components of the electronic device 1000, thereby ensuring the reliability of the whole machine.

[0099] For example, the tensile strength of the inner frame liner 220 is greater than or equal to a first threshold, the yield strength of the inner frame liner 220 is greater than or equal to a second threshold, and the elongation of the inner frame liner 220 is greater than or equal to a third threshold. The first threshold can be 200 MPa, the second threshold can be 100 MPa, and the third threshold can be 3%. That is, the tensile strength of the inner frame liner 220 is ≥200 MPa, the yield strength of the inner frame liner 220 is ≥100 MPa, and the elongation of the inner frame liner 220 is ≥3%. For example, the tensile strength of the inner frame liner 220 is 300 MPa, the yield strength of the inner frame liner 220 is 200 MPa, and the elongation of the inner frame liner 220 is 5%. It should be understood that the tensile strength, yield strength, and elongation may vary depending on the material of the inner frame liner 220.

[0100] In some embodiments, the inner frame liner 220 can be made of metal. For example, the inner frame liner 220 can be made of any one of aluminum alloy, titanium alloy, stainless steel, magnesium alloy, or nickel-based high-temperature alloy. When the inner frame liner 220 is made of metal, its thickness can be 0.1mm-0.3mm, for example, 0.1mm, 0.2mm, 0.3mm, etc. It should be understood that the thinner thickness of the metal inner frame liner 220 allows for weight reduction and thinning of the inner frame assembly 200, thereby reducing the overall weight of the device. Furthermore, the metal inner frame liner 220 is beneficial for the heat conduction and heat dissipation functions of the entire device.

[0101] For example, the metal inner frame liner 220 and the outer plastic part 212 (or the plastic outer frame liner 210) can be fixedly connected by any one of the following methods: dispensing, screwing, or insert injection molding; the metal inner frame liner 220 and the outer metal part 211 can be fixedly connected by welding.

[0102] For example, refer to Figure 8 In (a), the inner frame liner 220 and the outer plastic part 212 can be fixedly connected by a dispensing process, that is, the inner frame liner 220 is fixedly connected to the outer plastic part 212 by the adhesive 10.

[0103] For example, refer to Figure 8 In (b), the inner frame 220 and the outer metal part 211 can be fixedly connected by welding. The outer metal part 211 extends into the interior of the electronic device. The inner frame 220 and the extended part of the outer metal part 211 are directly welded to form a weld point 20, which makes the connection between the inner frame 220 and the outer frame 210 more stable and the space ratio is relatively small.

[0104] For example, refer to Figure 8 In (c), the inner frame liner 220 and the outer plastic portion 212 can be fixedly connected by screws. For example, the mating part 30 can be disposed inside the outer plastic portion 212 along the z-direction, and the fastener 40 (such as a screw) can penetrate the inner frame liner 220 along the z-direction and be locked inside the mating part 30, thereby locking the inner frame liner 220 to the outer plastic portion 212 and achieving a stable connection between the inner frame liner 220 and the outer frame 210.

[0105] For example, refer to Figure 8 In (d), the inner frame liner 220 and the outer plastic part 212 can be fixedly connected by an insert injection molding process. To increase the connection stability between the inner frame liner 220 and the outer plastic part 212, the connection between the inner frame liner 220 and the outer plastic part 212 can be made into a bent structure.

[0106] Considering the large weight and volume of batteries in electronic devices, welding or screw fastening can be used to connect the inner frame 220 and the outer frame 210 near the battery area to ensure a more secure connection between the inner frame 220 and the outer frame 210.

[0107] Figure 9 This is a partial cross-sectional schematic diagram of the middle frame component 200 along the xz plane. Figure 9 The diagram shows the connection between the inner frame 220 and the outer frame 210 of the battery area.

[0108] In some examples, reference Figure 9 In (a), on the side of the battery 500, the inner frame 220 and the outer metal part 211 can be fixedly connected by welding. The outer metal part 211 extends into the interior of the electronic device, and the inner frame 220 and the extended part of the outer metal part 211 are directly welded to form a weld point 20, thereby making the connection between the inner frame 220 and the outer frame 210 more stable and the space occupied is relatively small.

[0109] In some examples, reference Figure 9 (b) On the side of the battery 500, the inner frame liner 220 and the outer plastic portion 212 can be fixedly connected by side-mounted screws. The inner frame liner 220 can be configured as an L-shaped structure, and the short side of the L-shaped inner frame liner 220 and the inner wall of the outer plastic portion 212 can be fixedly connected by fasteners 40 (such as screws). Specifically, the mating part 30 can be disposed inside the outer plastic portion 212 along the x-direction, and the fastener 40 (such as screws) can penetrate the inner frame liner 220 along the x-direction and be locked inside the mating part 30, thereby locking the inner frame liner 220 to the outer plastic portion 212 and achieving a stable connection between the inner frame liner 220 and the outer frame 210. It should be understood that the side-mounted screw method can also reduce the space ratio of the middle frame assembly 200 in the thickness direction, which is beneficial for thinning electronic devices.

[0110] In some examples, reference Figure 9 (c) On the side of the battery 500, the inner frame liner 220 and the outer plastic part 212 can be fixedly connected by bottom screws. The mating part 30 can be positioned within the outer plastic part 212 along the z-direction, and the fastener 40 (such as a screw) can penetrate the inner frame liner 220 along the z-direction and be locked within the mating part 30, thereby locking the inner frame liner 220 to the outer plastic part 212, achieving a stable connection between the inner frame liner 220 and the outer frame 210. It should be understood that the bottom screw connection method will occupy a certain amount of thickness space in the electronic device.

[0111] In some embodiments, the inner frame liner 220 can be made of a non-metallic material. For example, the inner frame liner 220 can be made of any one of the following materials: carbon fiber, aramid fiber, ultra-high molecular weight polyethylene, poly-p-phenylenebenzobisoxazole (PBO) fiber, glass fiber, boron fiber, and ceramic fiber. When the inner frame liner 220 is made of a non-metallic material, its thickness is 0.1mm-0.4mm. For example, the thickness of the inner frame liner can be 0.1mm, 0.2mm, 0.3mm, 0.4mm, etc. It should be understood that the inner frame liner 220 can be made of a non-metallic material (e.g., high-strength fiber), and the non-metallic inner frame liner 220 is thinner and lighter than a metallic material, thereby further reducing the weight of the inner frame assembly 200 and consequently further reducing the overall weight of the device.

[0112] For example, the non-metallic inner frame liner 220 and the plastic outer ring liner 212 can be fixedly connected by hot pressing, injection molding, etc., thereby ensuring the connection stability between the inner frame liner 220 and the outer frame liner 210, and thus ensuring the reliability of the whole machine.

[0113] For example, the inner frame liner 220 can have unequal thickness. That is, the thickness of the inner frame liner 220 in the z direction can be unequal.

[0114] Figure 10 and Figure 11 A schematic cross-sectional view of a portion of the mid-frame assembly 200 along the yz plane is shown. In some examples, reference... Figure 10 and Figure 11 The thickness of the inner frame liner 220 in the motherboard area of ​​the electronic device is greater than its thickness in the battery area, and the thickness of the inner frame liner 220 in the small board area is also greater than its thickness in the battery area. In other words, the thickness of the inner frame liner 220 in the battery area can be less than the thickness of the inner frame liner 220 in the motherboard and small board areas, thus ensuring the strength of the inner frame liner 220 while reducing the thickness and weight of the middle frame assembly 200. For example, the thickness of the portion of the inner frame liner 220 corresponding to the motherboard can be 0.3mm, and the thickness of the portion corresponding to the battery can be 0.2mm.

[0115] For example, the inner frame liner 220 can be made of a multi-layered fiber material. In the battery area of ​​the electronic device, the inner frame liner 220 can have fewer fiber layers, thereby reducing the overall thickness of the device; in the motherboard / small board area of ​​the electronic device, the inner frame liner 220 can have more fiber layers, thereby enhancing the structural stability of the inner frame liner.

[0116] In some examples, the thickness of the connection area between the inner frame liner 220 and the outer plastic portion 212 is greater than the thickness of other areas of the inner frame liner 220, thereby increasing the stability of the connection between the inner frame liner 220 and the outer frame 210 and preventing detachment. For example, the strength of the inner frame liner 220 can be increased by increasing the number of fiber layers at structurally weak points. For instance, to provide greater bonding force when bonded to the outer frame 210, the thickness of the connection area between the inner frame liner 220 and the outer plastic portion 212 can be increased.

[0117] In some embodiments, the inner frame liner 220 may include both metallic and non-metallic materials. The portion of the inner frame liner 220 corresponding to the motherboard area of ​​the electronic device is made of non-metallic material, the portion corresponding to the small board area of ​​the electronic device is made of non-metallic material, and the portion corresponding to the battery area of ​​the electronic device is made of metallic material. In other words, the inner frame liner 220 can be a composite liner made of metallic and non-metallic materials. Metallic materials can be used in thinner areas of the inner frame liner 220 (such as the battery area) to increase its strength; non-metallic materials can be used in other areas of the inner frame liner 220 (such as the motherboard area, small board area, etc.) to reduce its weight. This reduces the weight of the inner frame liner 220 while increasing its strength, thereby reducing the weight of the inner frame assembly 200 and the entire device, while ensuring the strength and reliability of the entire device.

[0118] For example, refer to Figure 11 The inner frame 220 may include a first part 221, a second part 222 and a third part 223. The first part 221 corresponds to the motherboard area of ​​the electronic device, the second part 222 corresponds to the small board area of ​​the electronic device, and the third part 223 corresponds to the battery area of ​​the electronic device. The first part 221 and the second part 222 may be made of non-metallic material, and the third part 223 may be made of metallic material.

[0119] Figure 12 This is a top view of a portion of the structure of a mid-frame component 200 provided in an embodiment of this application, that is, a projection diagram of a portion of the structure of the mid-frame component 200 on the xy plane. Figure 13 , Figure 14 and Figure 15 This is a cross-sectional schematic diagram of a portion of the structure of the middle frame component 200, that is, a partial cross-sectional schematic diagram of a portion of the structure of the middle frame component 200 along the xz plane.

[0120] refer to Figure 12The fixing structure 230 is fixedly connected to the inner liner 220 of the middle frame. The fixing structure 230 is used to limit and fix the internal components of the electronic device 1000 (e.g., motherboard 400, battery 500, small board 600, etc.). For example, the fixing structure 230 includes a first structure 231 and a second structure 232. The first structure 231 is used to limit the internal components of the electronic device, and the second structure 232 is used to fix the internal components of the electronic device.

[0121] In some examples, there may be multiple first structural members 231, and these multiple first structural members 231 may protrude toward the rear cover 300 of the electronic device (see reference). Figure 3 This divides the inner frame 220 into multiple areas, such as an area for placing the motherboard 400, an area for placing the battery 500, and an area for placing the small board 600, thereby limiting the internal components of the electronic device.

[0122] In some examples, the first structural member 231 may be provided with a notch 2311. There may be multiple first structural members 231. The notches 2311 of multiple first structural members 231 may be respectively locked at the four corners or diagonal positions of the motherboard 400, battery 500, and small board 600, thereby limiting the internal components of the electronic device.

[0123] In some examples, the second structural member 232 is positioned on the side of the inner liner 220 facing the rear cover 300 (see reference). Figure 3 The second structural component 232 may be provided with a threaded hole 2321. The fastener 40 may pass through the internal components of the electronic device (such as the motherboard 400, battery 500, and small board 600) and lock them in the threaded hole 2321 to fix the motherboard 400, battery 500, small board 600 and other components on the inner liner 220 of the middle frame.

[0124] refer to Figure 13 and Figure 14 The fixed structural component 230 can be welded to the inner liner 220 of the middle frame, and / or, see reference. Figure 15 The fixing component 230 can be heat-fused to the inner liner 220 of the middle frame. This ensures a stable connection between the fixing component 230 and the inner liner 220 of the middle frame, thereby guaranteeing the reliability of the entire machine.

[0125] For example, when the inner frame liner 220 is made of metal, the fixing structure 230 can be spot-welded to the inner frame liner 220; when the inner frame liner 220 is made of non-metallic material, the fixing structure 230 can be heat-fused into the inner frame liner 220; when the inner frame liner 220 includes both metallic and non-metallic materials, the fixing structure 230 can be spot-welded to the metallic inner frame liner 220 or heat-fused into the non-metallic inner frame liner 220.

[0126] Figure 16 This is a top view of a partial structure of another mid-frame component 200 provided in this application embodiment, that is, a projection diagram of a partial structure of the mid-frame component 200 on the xy plane. Figure 17 This is a cross-sectional schematic diagram of a portion of the structure of the middle frame component 200, that is, a partial cross-sectional schematic diagram of a portion of the structure of the middle frame component 200 along the xz plane.

[0127] refer to Figure 16 and Figure 17 In some examples, the outer ring 210 of the middle frame may include an extension rib 240 extending into the inner liner 220 of the middle frame. The extension rib 240 is located on the inner liner 220 of the middle frame, and a first structural member 231 and a second structural member 232 are formed on the extension rib 240.

[0128] and Figures 12 to 15 The difference is, Figure 16 and Figure 17 The fixed structural component 230 is not directly machined on the inner liner 220 of the middle frame, but is connected to the outer metal part 211 and / or the outer plastic part 212. This structure is easy to manufacture and more readily implemented.

[0129] The above combination Figures 1 to 16This application provides a detailed description of the mid-frame assembly 200 and the electronic device 1000 provided in the embodiments of this application. It should be noted that this application also provides a processing method for the mid-frame assembly 200. This processing method may include: injection molding the outer ring metal portion 211 to form an outer ring plastic portion 212 on the inner side of the outer ring metal portion 211; fixing a fixing structure 230 to the inner liner of the mid-frame 220, the fixing structure 230 being used to limit and fix the internal components of the electronic device; and fixing the inner liner of the mid-frame 220 to the outer ring plastic portion 212. In this embodiment, firstly, an outer ring plastic portion 212 can be injection molded inside the outer ring metal portion 211, and the outer ring metal portion 211 and the outer ring plastic portion 212 form the outer ring 210 of the middle frame assembly; secondly, a fixing structure 230 can be connected to the inner liner 220 of the middle frame; finally, the inner liner 220 of the middle frame can be fixedly connected to the outer ring plastic portion 212 of the outer ring 210 of the middle frame. This processing method can reduce the impact on other components during manufacturing. Furthermore, the resulting middle frame assembly 200 has good stability and a relatively light weight.

[0130] In some embodiments, fixing the fixing structure 230 to the inner frame 220 includes: welding the fixing structure 230 to the inner frame 220 at a predetermined position (such as where internal components of an electronic device need to be fixed), and / or heat-melting the fixing structure 230 to the inner frame 220. The method further includes: performing computerized numerical control (CNC) processing on the surface of the fixing structure 230 to form a predetermined shape, such as forming the aforementioned notch and threaded hole. In this embodiment, the fixing structure 230 can be welded and / or heat-melted to the inner frame 220, and the surface of the fixing structure 230 can be CNC processed to obtain the required shape features, achieving a stable connection between the fixing structure 230 and the inner frame 220, thereby ensuring the reliability of the entire device.

[0131] In some embodiments, fixing the inner frame liner 220 to the outer plastic portion 212 includes fixing the inner frame liner 220 to the outer plastic portion 212 by any one of the following methods: dispensing, welding, screwing, or insert injection molding. In this embodiment, the metal inner frame liner 220 and the plastic outer plastic portion 212 can be fixedly connected by dispensing, welding, screwing, or insert injection molding, thereby ensuring the connection stability between the inner frame liner 220 and the outer frame 210, and thus ensuring the reliability of the entire machine.

[0132] In some embodiments, fixing the inner frame liner 220 to the outer plastic portion 212 includes fixing the inner frame liner 220 to the outer plastic portion 212 by hot pressing or injection molding. In this embodiment, the non-metallic inner frame liner 220 and the plastic outer plastic portion 212 can be fixedly connected by hot pressing, injection molding, etc., thereby ensuring the connection stability between the inner frame liner 220 and the outer frame liner 210, and thus ensuring the reliability of the entire machine.

[0133] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A mid-frame component, characterized in that, Applied to electronic devices, including an outer ring of the middle frame, an inner liner of the middle frame, and a fixing structure, wherein the outer ring of the middle frame surrounds the outer periphery of the inner liner of the middle frame and is fixedly connected to the inner liner of the middle frame, and the fixing structure is connected to the inner liner of the middle frame, and the fixing structure is used to limit and fix the internal components of the electronic device; The outer ring of the middle frame includes an outer metal part and an outer plastic part. The outer plastic part is formed on the inside of the outer metal part by an integral injection molding process. The inner liner of the middle frame is fixedly connected to the outer plastic part.

2. The mid-frame assembly according to claim 1, characterized in that, The tensile strength of the inner frame is ≥200MPa, the yield strength of the inner frame is ≥100MPa, and the elongation of the inner frame is ≥3%.

3. The mid-frame assembly according to claim 1 or 2, characterized in that, The inner liner of the middle frame is made of metal, and the thickness of the inner liner of the middle frame is 0.1mm-0.3mm.

4. The mid-frame assembly according to claim 3, characterized in that, The inner liner of the middle frame and the outer plastic part are fixedly connected by any one of the following methods: glue application, screw locking, or insert injection molding.

5. The mid-frame assembly according to claim 3 or 4, characterized in that, The inner liner of the middle frame is made of any one of the following materials: aluminum alloy, titanium alloy, stainless steel, magnesium alloy, and nickel-based high-temperature alloy.

6. The mid-frame assembly according to claim 1 or 2, characterized in that, The inner liner of the middle frame is made of non-metallic material, and the thickness of the inner liner of the middle frame is 0.1mm-0.4mm.

7. The mid-frame assembly according to claim 6, characterized in that, The inner liner of the middle frame and the outer plastic part are fixedly connected by hot pressing or injection molding.

8. The mid-frame assembly according to claim 6 or 7, characterized in that, The inner liner of the middle frame is made of any one of the following materials: carbon fiber, aramid fiber, ultra-high molecular weight polyethylene, poly(p-phenylenebenzodioxazole) fiber, glass fiber, boron fiber, and ceramic fiber.

9. The mid-frame assembly according to claim 1 or 2, characterized in that, The inner frame is made of both metal and non-metal materials. The portion of the inner frame corresponding to the motherboard area of ​​the electronic device is made of non-metal material, the portion of the inner frame corresponding to the small board area of ​​the electronic device is made of non-metal material, and the portion of the inner frame corresponding to the battery area of ​​the electronic device is made of metal material.

10. The mid-frame assembly according to any one of claims 6 to 9, characterized in that, The thickness of the connection area between the inner frame liner and the outer plastic part is greater than the thickness of other areas of the inner frame liner.

11. The mid-frame assembly according to any one of claims 6 to 10, characterized in that, The thickness of the inner frame in the motherboard area of ​​the electronic device is greater than the thickness of the inner frame in the battery area of ​​the electronic device, and the thickness of the inner frame in the small board area of ​​the electronic device is greater than the thickness of the inner frame in the battery area of ​​the electronic device.

12. The mid-frame assembly according to any one of claims 1 to 11, characterized in that, The fixing structural member is welded to the inner liner of the middle frame, and / or the fixing structural member is heat-fused to the inner liner of the middle frame.

13. An electronic device, characterized in that, Includes the mid-frame assembly as described in any one of claims 1 to 12.

14. A method for manufacturing a mid-frame component, characterized in that, The middle frame assembly includes an outer ring, an inner liner, and a fixing structure. The outer ring includes a metal portion and a plastic portion. The manufacturing method includes: The outer ring metal portion is injection molded to form the outer ring plastic portion inside the outer ring metal portion; The fixing structure is connected to the inner liner of the middle frame. The fixing structure is used to limit and fix the internal components of the electronic device. The inner liner of the middle frame is fixedly connected to the outer plastic part.

15. The manufacturing method according to claim 14, characterized in that, The process of connecting the fixing structural member to the inner liner of the middle frame includes: At a predetermined position within the inner frame, the fixing structure is welded to the inner frame, and / or the fixing structure is heat-fused to the inner frame. The method further includes: The surface of the fixed structural component is processed by computer digital control (CNC) to form a preset shape.

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