Ceramic heating plate and method of processing thereof

Abstract

The application discloses a ceramic heating disc and a processing method thereof, wherein the ceramic heating disc comprises a base and a control column which are connected with each other, and the base is provided with an assembly hole, a heating wire and a terminal. A threaded joint, a transition metal block and a solder are further arranged on the base and used for electrically connecting the terminal with an external electrode rod. The threaded joint comprises a sleeve and a sealing plate, the sleeve is screwed on the assembly hole, and the sealing plate is provided with a limiting hole; the transition metal block comprises a first part and a limiting part, the first part is arranged in the sleeve, and the limiting part is arranged in the limiting hole; and the electrode rod is arranged on the side of the transition metal block which is away from the terminal. In the application, pre-assembly operation can be realized, the assembly difficulty is greatly reduced, an operator can conveniently and timely determine the installation positions of the transition metal block and the solder sheet, the installation accuracy is ensured, the upper and lower planes of the transition metal block can be kept horizontal, good plane contact is formed, and the reliability of the soldering connection is ensured.

Description

Technical Field

[0001] This application relates to the technical field of semiconductor component manufacturing, and in particular to a ceramic heating plate and its processing method. Background Technology

[0002] Heaters are widely used in semiconductor chip processing, such as thin film deposition and etching. Based on material, they include metal heaters and ceramic heaters.

[0003] The ceramic heating plate includes a substrate and a hollow column. Generally, a heating wire and terminals are installed in the substrate, and an electrode rod is installed in the hollow column. One end of the electrode rod is electrically connected to the terminals, thereby realizing the circuit conduction of the heating wire, terminals, and electrode rod. The electrode rod is connected to the outside so that current flows into the heating wire to supply heat.

[0004] Electrode rods are typically made of pure nickel or nickel-based heat-resistant alloys, while the substrate is ceramic. The two materials have significantly different coefficients of thermal expansion, and direct welding can lead to low strength and ceramic cracking. Therefore, in related technologies, the electrode rod is not directly welded to the ceramic substrate. Referring to Chinese invention patent CN120432445A, this technology uses an intermediate transition metal block and a fixed connector to achieve this connection. The transition metal block is generally made of a low-expansion material such as Kovar alloy, with a coefficient of thermal expansion between that of the electrode rod and the ceramic substrate. Therefore, the thermal expansion stress is buffered in two stages, forming a sufficiently gentle connection structure.

[0005] However, the following problems still exist with this technology: After the hollow column is connected to the substrate, the electrode rod is placed in the brazing material. The limited space inside the hollow column significantly increases the difficulty of operation and the uncertainty of the position of the brazing material, which reduces the brazing success rate, such as desoldering, incomplete welding, cracks, etc. Summary of the Invention

[0006] This application provides a ceramic heating plate and its processing method to solve the technical problem of brazing yield of the electrode rod lead-out structure.

[0007] A ceramic heating plate includes: a base having opposing heating surfaces and mounting surfaces, the mounting surfaces having mounting holes, a heating wire and a terminal disposed within the base, the terminal being at least partially exposed in the mounting holes; a hollow column connected to the mounting surfaces; a threaded connector including a sleeve and a sealing plate, the sleeve being screwed into the mounting holes, the sealing plate sealing the end of the sleeve facing the terminal, the sealing plate having a limiting hole; a transition metal block including a first part and a limiting part, the first part being disposed within the sleeve, the limiting part passing through the limiting hole; and an electrode rod disposed on the side of the transition metal block opposite to the terminal; wherein a first connecting layer is formed between the electrode rod and the transition metal block, and a second connecting layer is formed between the transition metal block and the terminal.

[0008] In the implementation scheme of this application, firstly, the structural design of the sealing plate and the transition metal block allows the transition metal block to be pre-assembled inside the threaded joint. This structure further allows the transition metal block and the first solder sheet forming the first connecting layer to be pre-assembled outside the hollow column, relieving the constraints of the internal space of the hollow column and greatly reducing the assembly difficulty. Operators can easily and promptly determine the installation position of the transition metal block and the first solder sheet, facilitating adjustments to ensure installation accuracy. Secondly, through the cooperation of the limiting hole and the limiting part, as well as the cooperation between the inner wall of the threaded joint and the first part, these two limiting mechanisms ensure that the upper and lower planes of the transition metal block remain horizontal. When the threaded joint is screwed to the predetermined position, the transition metal block reaches the predetermined position and thus makes good planar contact with the second solder sheet forming the second connecting layer, ensuring the reliability of the subsequent welding connection.

[0009] As one of the optional embodiments of this solution, the transition metal block further includes a second part, which is disposed on the side of the sealing plate opposite to the first part. The second part is detachably connected to the first part and / or the limiting part, and the second part covers the limiting hole.

[0010] In the implementation scheme of this application, the metal block has a split structure. Firstly, the second part is detachable, so that in the event of a poor solder joint or detachment between the second part and the terminal, the second part can be easily disassembled and replaced, enabling convenient maintenance of the second part and reducing maintenance costs. Secondly, the size of the second part can be adapted to the size of the terminal, maximizing the matching of the contact area between the second solder sheet and the terminal, thereby improving the reliability of the welding connection. Thirdly, thermal expansion occurs when the second solder sheet melts. If only the limiting part is used for connection, the expansion force may push the limiting part upward, increasing the gap between the transition metal block and the terminal and reducing welding reliability. However, the second part abuts against the outer side of the sealing plate, which can prevent the limiting part and the first part from being lifted by the expansion force, thereby ensuring the melting space of the second solder sheet and ensuring welding reliability.

[0011] As one of the optional embodiments of this solution, the peripheral outer wall of the second part contacts the inner wall of the assembly hole, and a floating gap is left between the second part and the sealing plate.

[0012] In this embodiment, it is understood that thermal expansion stress is generated when the second solder sheet melts. In related technologies, a deformation gap is left between the periphery of the transition metal block and the inner wall of the mounting hole or threaded joint to allow the liquid solder to overflow. However, this setting makes it difficult to accurately control the amount of liquid solder overflow, which may reduce the amount of solder actually used for welding and thus affect the welding reliability. In this embodiment, the second part completely covers the second solder sheet, and the melted liquid solder will not overflow, ensuring that the liquid solder fills the gap between the second part and the terminal, improving the welding effect. The expansion stress is buffered by the floating gap, and will not generate compressive stress on the bottom terminal or ceramic substrate, ensuring the welding quality.

[0013] As one of the optional embodiments of this solution, a reinforcing gap is left between the second part and the limiting part, and a third connecting layer is formed in the reinforcing gap, which is used to connect the second part and the limiting part.

[0014] In this embodiment, the third connecting layer connects the first and second parts, increasing the circuit conduction path and significantly enhancing the conductivity between the first and second parts, thus ensuring circuit continuity along the path of the terminal, transition metal block, and electrode rod. It is understandable that because the transition metal block is designed as a split structure, the conductivity between the two parts will decrease. To ensure conductivity, a third connecting layer is provided between the second part and the limiting part.

[0015] As one optional embodiment of this solution, a fourth connecting layer is formed between the second part and the sealing plate, the fourth connecting layer being used to connect the second part and the sealing plate.

[0016] As one of the optional embodiments of this solution, a redundant gap is left between the threaded connector and the assembly hole, the fourth connecting layer includes a flat part and a vertical part, the vertical part is disposed in the redundant gap, the flat part fills the floating gap, and the flat part is integral with the third connecting layer.

[0017] In the embodiment of this application, due to the vertical part, when the solder melts, it can completely fill the floating gap and the reinforcing gap by relying on gravity and liquid flow characteristics. Furthermore, due to the state of the liquid solder, it will not affect the release of the upward expansion force of the second part, while ensuring the stable formation of the third connecting layer. The fourth connecting layer can significantly improve the connection reliability between the second part and the sealing plate, and further enhance the overall welding reliability.

[0018] As one of the optional embodiments of this solution, the electrode rod and the threaded connector are made of pure nickel or a nickel-based alloy.

[0019] As one of the optional embodiments of this solution, the material of the transition metal block is one of molybdenum, tungsten, molybdenum-tungsten alloy, tungsten-copper-nickel alloy, or Kovar alloy.

[0020] A method for processing a ceramic heating plate, comprising: S1. Machining the assembly hole and placing the second solder piece into the assembly hole; S2. The threaded joint, transition metal block, first solder sheet, third solder sheet and fourth solder sheet are pre-assembled outside the hollow column to form a pre-assembled body; S3. Screw the pre-assembled body into the assembly hole; S4. Detect whether the pre-assembled body has reached the predetermined position; S5, Brazing.

[0021] As one of the optional embodiments of this solution, the detection in step S4 includes the following steps: measuring the height of the electrode rod protruding from the top of the hollow column and comparing it with the standard protrusion height. If the measured dimension and the standard dimension error are within the allowable range, it is determined that the screw is tightened in place.

[0022] As one of the optional embodiments of this solution, the detection also includes the following steps: energizing the heating wire and measuring the resistance value of the electrode rod. If the measured resistance value is within the allowable range of the error between the measured resistance value and the standard resistance value, it is determined whether the transition metal block is in good contact with the first solder sheet.

[0023] In this embodiment of the application, the protrusion height of the electrode rod can be measured to determine whether the threaded joint is screwed to the predetermined position, and the resistance value of the electrode rod can be measured to ensure good planar contact between the second solder sheet and the second part. After both methods are determined, the welding reliability can be effectively improved.

[0024] As one optional embodiment of this solution, step S5 includes the following brazing step: placing the entire component into a vacuum brazing furnace for brazing, with a brazing temperature of 800-1200℃ and a vacuum degree of 10. -4 mmHg, heat treatment time 25-120 min, after brazing, cool to room temperature under inert atmosphere protection.

[0025] As one of the optional embodiments of this solution, step S5 may further include: pressing a fixed weight onto the electrode rod.

[0026] One of the above technical solutions has the following advantages or beneficial effects: In this application implementation, the structural design of the sealing plate and the transition metal block allows the transition metal block to be pre-assembled inside the threaded joint. This structure further allows the transition metal block and the first solder sheet forming the first connecting layer to be pre-assembled outside the hollow column, relieving the constraint of the internal space of the hollow column, greatly reducing the assembly difficulty, and allowing operators to conveniently and promptly determine the installation position of the transition metal block and the first solder sheet, facilitating adjustments to ensure installation accuracy. Through the cooperation of the limiting hole and the limiting part, as well as the cooperation between the inner wall of the threaded joint and the first part, these two limiting mechanisms ensure that the upper and lower planes of the transition metal block remain horizontal. When the threaded joint is screwed to the predetermined position, the transition metal block reaches the predetermined position, thereby making good planar contact with the second solder sheet forming the second connecting layer, ensuring the reliability of subsequent welding connections. Attached Figure Description

[0027] The technical solution and other beneficial effects of this application will become apparent from the following detailed description of specific embodiments in conjunction with the accompanying drawings.

[0028] Figure 1 This is a schematic diagram used in the relevant background technology to mainly illustrate the electrode rod lead-out structure; Figure 2 This is an overall structural diagram of the ceramic disc provided in the embodiments of this application; Figure 3 This is a partial enlarged view provided in the embodiments of this application, mainly used to illustrate part A of the electrode rod lead-out structure; Figure 4 This is an exploded structural diagram provided in an embodiment of this application to illustrate the assembly sequence; Figure 5 This is a cross-sectional view provided in an embodiment of this application to illustrate the pre-assembled structure; Figure 6 This is a flowchart illustrating the process steps for processing a ceramic disc according to an embodiment of this application.

[0029] Reference numerals: 1. Base; 1a. Heating surface; 1b. Mounting surface; 10. Assembly hole; 11. Heating wire; 12. Terminal; 2. Hollow column; 3. Threaded connector; 31. Sleeve body; 32. Sealing plate; 30. Limiting hole; 4. Transition metal block; 41. First part; 42. Limiting part; 43. Second part; 5. Electrode rod; 101. First connection layer; 102. Second connection layer; 6. Floating gap; 61. Fourth connecting layer; 611. Straight section; 612. Vertical section; 7. Reinforcing gap; 71. Third connecting layer; 8. Redundant gaps; 100. Pre-assembled components. Detailed Implementation

[0030] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0031] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the term "and / or" in this document is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. Furthermore, the character " / " in this document, unless otherwise specified, generally indicates that the preceding and following related objects have an "or" relationship.

[0032] The following is in conjunction with the appendix Figure 1 The relevant technologies involved in this application will be further described.

[0033] Reference Figure 1 The diagram illustrates the structure of a ceramic heating plate in the related art, with a focus on the lead-out structure of the electrode rod 5 in the related art.

[0034] In this related technical system, after the hollow column 2 is connected to the substrate 1, the electrode rod 5 is placed in the brazing material, such as solder, transition metal block 4, threaded joint 3, etc. The limited space increases the difficulty of operation and uncertainty, which makes the brazing preparation flawed and the position of the brazing material difficult to guarantee, resulting in a reduced brazing success rate, such as desoldering, incomplete welding, cracks, etc.

[0035] Understandably, after the hollow column 2 is connected to the substrate 1, the electrode rod 5 is inserted to braze the required materials. The interior of the hollow column 2 is a long and narrow cylindrical space. Generally, it is necessary to use a sufficiently long metal clamp to pick up and put in the materials. This operation process can easily cause the interior of the ceramic hollow column 2 or the surface of the substrate 1 to be scratched or bumped by the metal clamp. Furthermore, due to verticality, dimensional tolerance or operator skill, situations may occur such as the threaded connector 3 not being tightened to the predetermined position, the solder sheet being difficult to place horizontally, or the transition metal block 4 being difficult to install to the predetermined position. Sometimes, it is necessary to use external force to strike the clamp to strike and press the solder or transition metal block 4 to ensure that it is installed in place. This operation can easily cause impact damage and unstable welding.

[0036] The technical solution proposed in this application aims to solve the aforementioned technical problems by improving the structural design and operation method.

[0037] The following is in conjunction with the appendix Figure 2-6 The technical solutions involved in this application will be further described.

[0038] Reference Figure 2 and Figure 3 This application provides a ceramic heating plate, including a base 1 and a hollow column 2. The base 1 has a heating surface 1a and a mounting surface 1b opposite to each other, and the hollow column 2 is connected to the mounting surface 1b. An assembly hole 10 is provided on the base 1 from the mounting surface 1b. A heating wire 11 and a terminal 12 are provided inside the base 1, and the terminal 12 is at least partially exposed in the assembly hole 10.

[0039] Reference Figure 3 A terminal 12 lead-out structure is provided in the assembly hole 10 for electrically connecting the terminal 12 to the outside. The terminal 12 lead-out structure includes a threaded connector 3, a transition metal block 4, an electrode rod 5, and a solder layer for electrically connecting the various parts.

[0040] Reference Figure 4 and Figure 5 The threaded connector 3 includes a sleeve 31 and a sealing plate 32. The sleeve 31 is screwed into the assembly hole 10, and the sealing plate 32 is sealed at the end of the sleeve 31 facing the terminal 12. The sealing plate 32 has a limiting hole 30. The transition metal block 4 includes a first part 41 and a limiting part 42. The first part 41 is disposed inside the sleeve 31, and the limiting part 42 passes through the limiting hole 30. The electrode rod 5 is disposed on the side of the transition metal block 4 away from the terminal 12. A first connecting layer 101 is formed between the electrode rod 5 and the transition metal block 4, and a second connecting layer 102 is formed between the transition metal block 4 and the terminal 12.

[0041] In this implementation scheme, firstly, the structural design of the sealing plate 32 and the transition metal block 4 allows the transition metal block 4 to be pre-assembled inside the threaded joint 3. This structure further enables the transition metal block 4 and the first solder sheet forming the first connecting layer 101 to be pre-assembled outside the hollow column 2, relieving the constraints of the internal space of the hollow column 2 and greatly reducing the assembly difficulty. Operators can easily and promptly determine the installation position of the transition metal block 4 and the first solder sheet, facilitating adjustments to ensure installation accuracy. Secondly, through the cooperation of the limiting hole 30 and the limiting part 42, and the cooperation between the inner wall of the threaded joint 3 and the first part 41, these two limiting mechanisms ensure that the upper and lower planes of the transition metal block 4 remain horizontal. When the threaded joint 3 is screwed to the predetermined position, the transition metal block 4 reaches the predetermined position and thus makes good planar contact with the second solder sheet forming the second connecting layer 102, ensuring the reliability of subsequent welding connections.

[0042] In some examples, both the substrate 1 and the hollow column 2 are made of ceramic material; alternatively, the substrate 1 and the hollow column 2 may be made of aluminum nitride and are welded together. The electrode rod 5 and the threaded connector 3 are made of metal; in some examples, both are made of pure nickel or a nickel-based alloy.

[0043] In some examples, the terminal 12 is integrated into the powder forming the substrate 1 during the hot pressing stage, and after processes such as isostatic pressing and sintering, the terminal 12 is fixed in the substrate 1.

[0044] In some embodiments, gaps are provided between the outer peripheral wall of the electrode rod 5 and the inner wall of the threaded connector 3, and between the first part 41 and the inner wall of the threaded connector 3. These gaps allow for stress release during thermal expansion of the electrode rod 5 and the first part 41 during use, and allow some solder to enter the space between the electrode rod 5 and the inner wall of the threaded connector 3 in a liquid state through capillary action, thereby increasing the welding area and further strengthening the connection between the two. For example, optionally, the gap size is between 0.01 and 0.15 mm. If the gap is too small, the expansion stress is difficult to release, making assembly difficult; if the gap is too large, the solder will overflow excessively into the gap when it melts into a liquid state, resulting in an excessively reduced amount of solder between the end faces of the electrode rod 5 and the threaded connector 3, reducing the welding quality. Furthermore, a large gap can also lead to inaccurate assembly coaxiality, reducing the assembly quality.

[0045] In some examples, the first part 41 and the limiting part 42 are integrally connected, with the first part 41 being larger than the limiting part 42, and the two forming a T-shaped structure. The limiting part 42 is inserted into the limiting hole 30. In some other examples, it is possible that there are multiple limiting holes 30, for example, there are multiple arrays of limiting holes 30, and multiple limiting parts 42 are inserted into each of the limiting holes 30.

[0046] In some embodiments, the transition metal block 4 further includes a second part 43, which is disposed on the side of the sealing plate 32 away from the first part 41. The second part 43 is detachably connected to the first part 41 and / or the limiting part 42, and covers the limiting hole 30.

[0047] Specifically, the second part 43 is provided with a threaded protrusion, and the limiting part 42 is provided with a threaded hole, and the two are threadedly connected. In some other alternative examples, the second part 43 can be directly connected to the first part 41, for example, by making a hole in the sealing plate 32, and providing a convex shaft on the second part 43, the convex shaft passing through the sealing plate 32 and being interference-fitted into the second part 43.

[0048] In this embodiment, the transition metal block 4 has a split structure. Firstly, the second part 43 is detachably connected. When there is a poor solder joint or detachment between the second part 43 and the terminal 12, the second part 43 can be easily disassembled and replaced, enabling convenient maintenance of the second part 43 and reducing maintenance costs. Secondly, the size of the second part 43 can be adapted to the size of the terminal 12, maximizing the matching of the contact area between the second solder sheet and the terminal 12, thereby improving the reliability of the solder connection. Thirdly, thermal expansion occurs when the second solder sheet melts. If only the limiting part 42 is used for connection, the expansion force may push the limiting part 42 upward, increasing the gap between the transition metal block 4 and the terminal 12 and reducing the welding reliability. However, by setting the second part 43 to abut against the outer side of the sealing plate 32, the limiting part 42 and the first part 41 can be prevented from being lifted by the expansion force, thereby ensuring the melting space of the second solder sheet and ensuring the welding reliability.

[0049] It should be noted that the first connecting layer 101, the second connecting layer 102, the third connecting layer 71 and the fourth connecting layer 61 mentioned in this application are connecting layer structures formed after the solder melts. Before the solder melts, the solder can be a layered material integrated with powder, or a solid solder sheet structure, or a paste-like solder paste. When the solder melts, it becomes liquid, flows in the gap, solidifies and finally takes shape.

[0050] In some embodiments, the peripheral outer wall of the second part 43 contacts the inner wall of the mounting hole 10, and a floating gap 6 is left between the second part 43 and the sealing plate 32.

[0051] It should be noted that the contact mentioned above does not simply mean that the second part 43 and the inner wall of the mounting hole 10 are completely in contact without any gap. Rather, it can be considered that the purpose of this setting is to prevent the expansion stress of the solder when it melts from causing the liquid solder to overflow from the gap. Therefore, if the gap between the second part 43 and the mounting hole 10 is maintained below a certain value, such as below 0.1mm, very little liquid solder will overflow into the gap, ensuring sufficient solder in the welding area and guaranteeing welding quality.

[0052] Specifically, when the second part 43 is screwed into place, a gap is left between the side wall of the second part 43 facing the sealing plate 32 and the sealing plate 32 to form the aforementioned floating gap 6.

[0053] In the implementation of this application, it is understood that thermal expansion stress will be generated when the second solder sheet melts. The approach in the related art is to leave a deformation gap between the periphery of the transition metal block 4 and the inner wall of the assembly hole 10 or the threaded joint 3 for the liquid solder to overflow. However, this setting makes it difficult to accurately control the amount of liquid solder overflow, which may lead to a reduction in the amount of solder actually used for welding, thereby affecting the welding reliability.

[0054] Even so, due to thermal expansion, the expansion of the molten solder will generate an upward lifting force on the transition metal block 4. In the related technology, the transition metal block 4 is within the constraint range of the sleeve part of the threaded joint 3 in the vertical space, which allows the transition metal block 4 to float partially upward, thereby avoiding the thermal expansion force from exerting a squeezing force on the terminal below.

[0055] In this embodiment, the second part 43 completely covers the second solder sheet, and the melted liquid solder will not overflow, ensuring that the liquid solder fills the gap between the second part 43 and the terminal 12, thereby improving the welding effect. The expansion stress is buffered by the floating gap 6, and will not generate compressive stress on the bottom terminal 12 or the ceramic substrate 1, thus ensuring the welding quality.

[0056] The dimensions of the floating gap 6 are calculated based on the expansion volume of the second solder sheet and the cross-sectional area of ​​the mounting hole 10. For example, the material of the second solder sheet can be nickel-based solder, gold-based solder, silver-copper-nickel solder, etc., and the expansion coefficient is designed differently depending on the selected material. For example, optionally, when using nickel-based solder, the brazing temperature difference is 600 to 900 degrees Celsius, the volume expansion is 3%-4%, and the cross-section remains unchanged. Then, the thickness of the second solder sheet multiplied by 3%-4% can be used as the thickness dimension of the floating gap 6.

[0057] In some embodiments, a reinforcing gap 7 is provided between the second part 43 and the limiting part 42, and a third connecting layer 71 is formed in the reinforcing gap 7 to connect the second part 43 and the limiting part 42.

[0058] In this embodiment, the third connecting layer 71 connects the first part 41 and the second part 43, increasing the circuit conduction path and significantly increasing the conductivity between the first part 41 and the second part 43, ensuring the circuit continuity along the path of terminal 12, transition metal block 4, and electrode rod 5. It is understood that because the transition metal block 4 is designed as a split structure, the conductivity between the two parts will decrease. To ensure conductivity, the third connecting layer 71 is provided between the second part 43 and the limiting part 42.

[0059] In some embodiments, a fourth connecting layer 61 is formed between the second part 43 and the cover plate 32, the fourth connecting layer 61 being used to connect the second part 43 and the cover plate 32.

[0060] In some embodiments, a redundant gap 8 is provided between the threaded connector 3 and the assembly hole 10. The fourth connecting layer 61 includes a straight portion 611 and a vertical portion 612. The vertical portion 612 is disposed in the redundant gap 8, and the straight portion 611 fills the floating gap 6. The straight portion 611 is integral with the third connecting layer 71.

[0061] In this embodiment of the application, due to the setting of the vertical part 612, when the solder melts, it can completely fill the floating gap 6 and the reinforcing gap 7 by relying on gravity and liquid flow characteristics. Furthermore, due to the state of the liquid solder, it will not affect the release of the upward expansion force of the second part 43, while ensuring the stable formation of the third connecting layer 71. The fourth connecting layer 61 can significantly improve the connection reliability between the second part 43 and the sealing plate 32, and further improve the overall welding reliability.

[0062] In some embodiments, the electrode rod 5 and the threaded connector 3 are made of pure nickel or a nickel-based alloy.

[0063] In some embodiments, the transition metal block 4 is made of molybdenum, tungsten, molybdenum-tungsten alloy, tungsten-copper-nickel alloy, or Kovar alloy.

[0064] In some embodiments, the solder used may be one or more of nickel-based solder, gold-based solder, and silver-copper-nickel solder.

[0065] Reference Figure 4 and Figure 6 This application also discloses a method for processing a ceramic heating plate, used to produce the aforementioned ceramic heating plate, comprising: S1. Machining assembly hole 10, fixing and connecting hollow column 2, and placing the second solder piece in assembly hole 10; Specifically, the mounting hole 10 is machined. The second solder sheet melts and then solidifies to form the second connecting layer 102. It should be noted that in the embodiments of this application, the solder in the initial state of the second connecting layer 102 is a solid second solder sheet. However, in some other optional embodiments, the solder can also be in the form of solder paste, solder powder, etc., which is not limited here. For example, if it is solder powder, the solder powder can be placed into the bottom of the mounting hole using a conduit or other tools, and then flattened with a pressing tool.

[0066] It should be noted that the second solder sheet can be held in place by a clamp and placed into the bottom of the assembly hole 10, or it can be picked up by a suction nozzle and placed into the bottom of the assembly hole 10. No restrictions are imposed here.

[0067] S2. The threaded connector 3, the transition metal block 4, the first solder sheet, the third solder sheet and the fourth solder sheet are pre-assembled outside the hollow column 2 to form a pre-assembled body 100. Specifically, the first solder sheet, the third solder sheet, and the fourth solder sheet form the first connecting layer 101, the third connecting layer 71, and the fourth connecting layer 61, respectively. In some examples, the third solder sheet and the fourth solder sheet are an integral structure. During installation: first, the third solder sheet and the fourth solder sheet are fitted onto the outer side of the end of the sealing plate 32, then the first part 41 and the limiting part 42 are inserted, and the second part 43 is screwed into the limiting part 42 so that the second part 43 presses the third solder sheet and the fourth solder sheet tightly. Finally, the first solder sheet is placed on the side of the first part 41 away from the second part 43 using tweezers, a suction nozzle, or other clamps.

[0068] At this stage, it is possible to check whether each part of the material is assembled in place. For example, whether the first solder piece is assembled horizontally can be checked visually or by measuring the distance between the first solder piece and the top of the sleeve 31. Since the assembly is done on the outside of the hollow column 2, the inspection is relatively convenient and accurate.

[0069] Understandably, because the first solder sheet is relatively thin and multiple sheets need to be stacked, when using a clamp to hold it in place, only the side of the first solder sheet can be clamped and tilted in. Once the bottom of the first solder sheet contacts the first part 41, the clamp is removed, and then a pressing tool is inserted into the sleeve 31 to push the first solder sheet into a horizontal position. This operation, if performed inside the hollow column 2, is difficult to perform accurately and can easily cause scratches on the inner wall of the sleeve 31. Therefore, in this application, pre-assembling part of the structure outside the hollow column 2 greatly reduces the difficulty of operation.

[0070] In some examples, a suction nozzle clamp is used to pick up the first solder sheet from its surface and place it along the axis of the sleeve 31 to reduce the tilt of the first solder sheet and make it easier to change the level of the first solder sheet.

[0071] S3. Screw the pre-assembled part into the assembly hole; In some examples, notches are made in the pre-assembly 100 for a screwing tool to be fitted, and the pre-assembly is rotated until significant resistance is encountered, at which point it can be stopped.

[0072] In some examples, a special torque screwdriver can be used, which stops screwing when the torque reaches a specified value.

[0073] S4. Check whether the pre-assembled assembly has reached the predetermined position; S5, Brazing.

[0074] In some embodiments, the detection in step S4 includes the following steps: S41: Measure the height of the electrode rod 5 protruding from the top of the hollow column 2 and compare it with the standard protrusion height. If the measured dimension and the standard dimension error are within the allowable range, it is determined that the screw is tightened in place.

[0075] In some embodiments, the detection further includes the following steps: S42: energize the heating wire and measure the resistance value of the electrode rod 5. If the error between the measured resistance value and the standard resistance value is within the allowable range, it is determined that the transition metal block 4 is in good contact with the first solder sheet.

[0076] In this embodiment of the application, by measuring the protrusion height of the electrode rod 5, it can be determined whether the threaded joint 3 is screwed to the predetermined position and whether the first solder sheet is kept horizontal. By measuring the resistance value of the electrode rod 5, it can be ensured that the second solder sheet and the second part 43 have good planar contact. The two detection methods can ensure the accuracy of material placement and effectively improve welding reliability.

[0077] It should be noted that both steps S41 and S42 must meet the requirements before the brazing process can proceed. If either step S41 or S42 fails to meet the requirements, a rework process must be performed, which involves removing the pre-assembled body 100, inspecting the second solder piece, inspecting the inner wall of the assembly hole 10, and reassembling the pre-assembled body 100. After the rework is completed, step S3 and subsequent steps can be performed.

[0078] In some embodiments, step S5 includes: placing the entire component into a vacuum brazing furnace for brazing at a temperature of 800-1200°C and a vacuum degree of 10. -4 mmHg, heat treatment time 25-120 min, after brazing, cool to room temperature under inert atmosphere protection.

[0079] In some embodiments, before step S5, a pressing object of fixed weight is pressed onto the electrode rod 5. In this embodiment, pressing a fixed weight onto the electrode rod 5 can avoid displacement errors that may be caused by the thermal expansion force of the second solder sheet, thereby ensuring welding reliability.

[0080] The above are only some implementation methods of the embodiments of this application, and are not intended to limit the application in any way. The protection scope of the embodiments of this application is not limited thereto. Any simple modifications, equivalent changes and modifications that can be easily conceived by those skilled in the art within the technical scope disclosed in the embodiments of this application should be included within the protection scope of the embodiments of this application.

Claims

1. A ceramic heating plate, characterized in that, include: The substrate (1) has a heating surface (1a) and a mounting surface (1b) opposite to each other. The mounting surface (1b) is provided with a mounting hole (10). A heating wire (11) and a terminal (12) are provided in the substrate (1). The terminal (12) is at least partially exposed in the mounting hole (10). Hollow column (2), connected to the mounting surface (1b); The threaded connector (3) includes a sleeve (31) and a sealing plate (32). The sleeve (31) is screwed into the assembly hole (10). The sealing plate (32) is sealed at one end of the sleeve (31) facing the terminal (12). The sealing plate (32) has a limit hole (30). The transition metal block (4) includes a first part (41) and a limiting part (42). The first part (41) is disposed inside the sleeve (31), and the limiting part (42) passes through the limiting hole (30). The electrode rod (5) is disposed on the side of the transition metal block (4) away from the terminal (12); A first connection layer (101) is formed between the electrode rod (5) and the transition metal block (4), and a second connection layer (102) is formed between the transition metal block (4) and the terminal (12).

2. The ceramic heating plate as described in claim 1, characterized in that, The transition metal block (4) further includes a second part (43), which is disposed on the side of the sealing plate (32) away from the first part (41). The second part (43) is detachably connected to the first part (41) and / or the limiting part (42), and the second part (43) covers the limiting hole (30).

3. The ceramic heating plate as described in claim 2, characterized in that, The outer peripheral wall of the second part (43) contacts the inner wall of the assembly hole (10), and a floating gap (6) is left between the second part (43) and the sealing plate (32).

4. The ceramic heating plate as described in claim 3, characterized in that, A reinforcing gap (7) is provided between the second part (43) and the limiting part (42), and a third connecting layer (71) is formed in the reinforcing gap (7). The third connecting layer (71) is used to connect the second part (43) and the limiting part (42).

5. The ceramic heating plate as described in claim 4, characterized in that, A fourth connecting layer (61) is formed between the second part (43) and the sealing plate (32), the fourth connecting layer (61) being used to connect the second part (43) and the sealing plate (32).

6. The ceramic heating plate as described in claim 5, characterized in that, A redundant gap (8) is left between the threaded connector (3) and the assembly hole (10). The fourth connecting layer (61) includes a straight part (611) and a vertical part (612). The vertical part (612) is disposed in the redundant gap (8). The straight part (611) fills the floating gap (6). The straight part (611) is integral with the third connecting layer (71).

7. The ceramic heating plate according to any one of claims 1-6, characterized in that, The electrode rod (5) and the threaded connector (3) are made of pure nickel or a nickel-based alloy.

8. The ceramic heating plate according to any one of claims 1-6, characterized in that, The transition metal block (4) is made of molybdenum, tungsten, molybdenum-tungsten alloy, tungsten-copper-nickel alloy, or Kovar alloy.

9. A method for processing a ceramic heating plate, used to process the ceramic heating plate according to any one of claims 1-8, characterized in that, include: S1. Machining the assembly hole (10) and placing the second solder sheet into the assembly hole (10); S2. The threaded connector (3), transition metal block (4), first solder sheet, third solder sheet and fourth solder sheet are pre-assembled outside the hollow column (2) to form a pre-assembled body (100); S3. Screw the pre-assembled body (100) into the assembly hole (10); S4. Detect whether the pre-assembled body (100) has reached the predetermined position; S5, Brazing.

10. The method for processing a ceramic heating plate as described in claim 9, characterized in that, The detection in step S4 includes the following steps: measuring the height of the electrode rod (5) protruding from the top of the hollow column (2), comparing it with the standard protrusion height, and if the measured dimension is within the allowable range of the error between the measured dimension and the standard dimension, then it is determined that the screw is tightened in place.

11. The method for processing a ceramic heating plate as described in claim 10, characterized in that, The detection also includes the following steps: the heating wire (11) is energized, and the resistance value of the electrode rod (5) is measured. If the measured resistance value is within the allowable range of the error between the measured resistance value and the standard resistance value, it is determined whether the transition metal block (4) is in good contact with the first solder sheet.

12. The ceramic heating plate processing method as described in claim 9, characterized in that, In step S5, the brazing step includes: placing the entire component into a vacuum brazing furnace for brazing at a temperature of 800-1200℃ and a vacuum degree of 10. -4 mmHg, heat treatment time 25-120 min, after brazing, cool to room temperature under inert atmosphere protection.

13. The method for processing a ceramic heating plate as described in claim 12, characterized in that, Before step S5, the method further includes pressing a fixed weight onto the electrode rod (5).

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