Heat dissipation structure and circuit board module

Abstract

A heat dissipation structure is disclosed for dissipating heat from a heat source on a substrate of a circuit board. The heat dissipation structure is disposed on the circuit board and includes a first leak-proof layer, a second leak-proof layer, a thermally conductive material, and a heat sink. The first leak-proof layer is coupled to the substrate and has a first opening, within which the heat source is located. The second leak-proof layer is coupled to the circuit board and has a second opening. The first leak-proof layer and the substrate are located within the second opening. The thermally conductive material is located within the first opening and in contact with the heat source. The heat sink covers the first and second openings and is connected to the first and second leak-proof layers. The heat dissipation structure separates the thermally conductive material from at least one first electronic component on the circuit board through the first and second leak-proof layers. A circuit board module is also mentioned.

Description

Technical Field

[0001] This invention relates to a heat dissipation structure and a circuit board module, and more particularly to a heat dissipation structure disposed on a circuit board and a circuit board module having the above-mentioned heat dissipation structure. Background Technology

[0002] As the efficiency of electronic devices continues to improve, some commercially available electronic devices currently use liquid metal for heat dissipation. However, when electronic devices are tilted or vibrated, liquid metal may leak onto the substrate or circuit board, causing short circuits and affecting heat dissipation performance. Therefore, how to achieve good heat dissipation in electronic devices while avoiding short circuits on the substrate or circuit board is a problem that this field is dedicated to exploring. Summary of the Invention

[0003] One objective of this invention is to provide a heat dissipation structure that has good heat dissipation effect and can avoid short circuits in the substrate or circuit board.

[0004] Another object of the present invention is to provide a circuit board module having the above-described heat dissipation structure.

[0005] A heat dissipation structure of the present invention is suitable for dissipating heat from a heat source on a substrate of a circuit board. The heat dissipation structure is disposed on the circuit board and includes a first leak-proof layer, a second leak-proof layer, a thermally conductive material, and a heat sink. The first leak-proof layer is coupled to the substrate and has a first opening, within which the heat source is located. The second leak-proof layer is coupled to the circuit board and has a second opening, wherein the first leak-proof layer and the substrate are located within the second opening. The thermally conductive material is located within the first opening and in contact with the heat source. The heat sink covers the first and second openings and is connected to the first and second leak-proof layers. The heat dissipation structure separates the thermally conductive material from at least one first electronic component on the circuit board through the first and second leak-proof layers.

[0006] A circuit board module of the present invention includes a circuit board, a processor, and a heat dissipation structure. The processor is disposed on the circuit board and includes a substrate and a heat source, the heat source being disposed on the substrate. The heat dissipation structure is disposed on the circuit board, in contact with the processor, and includes a first leak-proof layer, a second leak-proof layer, a thermally conductive material, and a heat sink. The first leak-proof layer is coupled to the substrate and has a first opening, the heat source being located within the first opening. The second leak-proof layer is coupled to the circuit board and has a second opening, wherein the first leak-proof layer and the substrate are located within the second opening. The thermally conductive material is located within the first opening and in contact with the heat source. The heat sink covers the first and second openings and is connected to the first and second leak-proof layers, wherein the heat dissipation structure separates the thermally conductive material from at least one first electronic component on the circuit board through the first and second leak-proof layers.

[0007] In one embodiment of the present invention, the above-mentioned heat dissipation structure further includes an insulating layer located between the substrate and the first leak-proof layer. The insulating layer has a third opening, which corresponds to the first opening, and the heat source and the heat-conducting material are located within the third opening.

[0008] In one embodiment of the present invention, the insulating layer described above covers at least one second electronic component on the substrate.

[0009] In one embodiment of the present invention, the heat dissipation structure further includes a coating layer, which is located between the circuit board and the second leak-proof layer and covers at least one first electronic component on the circuit board.

[0010] In one embodiment of the present invention, the second leak-proof layer is composed of a thermally conductive gel, and the heat of at least one first electronic component is adapted to be conducted to the heat sink through the second leak-proof layer.

[0011] In one embodiment of the present invention, the first leak-proof layer is composed of another thermally conductive gel, and the conductivity of the other thermally conductive gel of the first leak-proof layer is less than the conductivity of the thermally conductive gel of the second leak-proof layer.

[0012] Based on the above, the heat dissipation structure of the circuit board module of the present invention includes a first leak-proof layer surrounding the thermally conductive material and a second leak-proof layer surrounding the first leak-proof layer and the substrate. Accordingly, the first leak-proof layer reduces the probability of thermally conductive material leaking to the substrate, and the second leak-proof layer further reduces the probability of thermally conductive material leaking to the circuit board, thereby reducing the probability of short circuits on the substrate or circuit board. Furthermore, since the thermally conductive material of the present invention is located between the heat sink and the heat source, heat from the heat source can be conducted to the heat sink via the thermally conductive material, resulting in good heat dissipation. Attached Figure Description

[0013] Figure 1 This is a schematic diagram of a circuit board module according to an embodiment of the present invention.

[0014] Figure 2 yes Figure 1 An exploded view of the circuit board module.

[0015] Figure 3 yes Figure 1 A partial cross-sectional view of the circuit board module.

[0016] Figure 4 This is a partial cross-sectional schematic diagram of a circuit board module according to another embodiment of the present invention.

[0017] Figure 5 This is a partial cross-sectional schematic diagram of a circuit board module according to another embodiment of the present invention.

[0018] Figure 6This is a partial cross-sectional schematic diagram of a circuit board module according to another embodiment of the present invention.

[0019] Figure 7 This is a schematic diagram of a heat sink and a second leak-proof layer according to another embodiment of the present invention from another perspective.

[0020] The attached figures are labeled as follows:

[0021] 100, 100a, 100b, 100c: Circuit board modules

[0022] 110: Processor

[0023] 111: Substrate

[0024] 1111: Second electronic component

[0025] 113: Heat source

[0026] 120, 120a, 120b, 120c: Heat dissipation structure

[0027] 121: First leak-proof layer

[0028] 1211: First opening

[0029] 122: Second leak-proof layer

[0030] 1221: Second opening

[0031] 123: Thermal conductive materials

[0032] 124: Radiator

[0033] 125: Insulation layer

[0034] 1251: Third opening

[0035] 126: Coating layer

[0036] 130: Circuit board

[0037] 131: First electronic component Detailed Implementation

[0038] Figure 1 This is a schematic diagram of a circuit board module according to an embodiment of the present invention. Figure 2 yes Figure 1 An exploded view of the circuit board module. Figure 3 yes Figure 1 A partial cross-sectional view of the circuit board module. See also... Figures 1 to 3The circuit board module 100 (e.g., a graphics card) in this embodiment includes a processor 110, a heat dissipation structure 120, and a circuit board 130. The processor 110 is disposed on the circuit board 130 and includes a substrate 111 and a heat source 113, with the heat source 113 disposed on the substrate 111. The heat dissipation structure 120 is disposed on the circuit board 130 and contacts the processor 110 to dissipate heat from the heat source 113. In this embodiment, the heat source 113 is, for example, a die of a graphics processing unit (GPU) or a central processing unit (CPU), but is not limited thereto.

[0039] Please refer to Figure 2 and Figure 3 Specifically, the heat dissipation structure 120 includes a first leak-proof layer 121, a second leak-proof layer 122, a thermally conductive material 123, and a heat sink 124. The first leak-proof layer 121 is coupled to the substrate 111 and has a first opening 1211. A heat source 113 is located within the first opening 1211. The second leak-proof layer 122 is coupled to the circuit board 130 and has a second opening 1221, with the first leak-proof layer 121 and the substrate 111 located within the second opening 1221. The thermally conductive material 123 is located within the first opening 1211 and in contact with the heat source 113. The heat sink 124 covers the first opening 1211 and the second opening 1221 and is connected to the first leak-proof layer 121 and the second leak-proof layer 122. The heat dissipation structure 120 separates the thermally conductive material 123 from at least one first electronic component 131 (shown as two) on the circuit board 130 through a first leak-proof layer 121 and a second leak-proof layer 122.

[0040] In this embodiment, the first electronic component 131 is, for example, a metal-oxide-semiconductor field-effect transistor (MOSFET) or a video random access memory (VRAM). The thermally conductive material 123 is, for example, thermal paste, liquid metal, composite metal thermal paste, or other thermally conductive materials that may be in liquid form. However, the types of the first electronic component 131 and the thermally conductive material 123 are not limited to those described above.

[0041] It is worth mentioning that, in this embodiment, the heat dissipation structure 120 of the circuit board module 100 surrounds the thermally conductive material 123 with a first leak-proof layer 121 to reduce the probability of the thermally conductive material 123 leaking to the substrate 111, and surrounds the substrate 111 with a second leak-proof layer 122 to further reduce the probability of the thermally conductive material 123 leaking to the circuit board 130, thereby reducing the probability of short circuits in the substrate 111 or the circuit board 130. In addition, in this embodiment, the circuit board module 100 contacts the heat source 113 through the heat dissipation structure 120, so that the heat from the heat source 113 is conducted to the heat sink 124 via the thermally conductive material 123, thereby giving the heat source 113 a good heat dissipation effect.

[0042] In this embodiment, the first leak-proof layer 121 is composed of, for example, 3 watts of thermally conductive gel, and the second leak-proof layer 122 is composed of, for example, 6 watts of thermally conductive gel. Accordingly, the heat from the heat source 113 on the substrate 111 is adapted to be conducted to the heat sink 124 through the first leak-proof layer 121, and the heat from the first electronic component 131 on the circuit board 130 is adapted to be conducted to the heat sink 124 through the second leak-proof layer 122, thereby enabling both the heat source 113 and the first electronic component 131 to have good heat dissipation.

[0043] Furthermore, because the thermally conductive gel constituting the first leak-proof layer 121 and the second leak-proof layer 122 is flexible and compressible, the heat dissipation structure 120 can adapt to contact surfaces of different shapes and sizes, thereby enabling the heat dissipation structure 120 to have good mechanical stability and durability. In other embodiments, the first leak-proof layer 121 may also be made of a material with a mesh structure (e.g., foam, sponge), which can absorb the thermally conductive material 123, thereby improving the leak-proof effect.

[0044] In this embodiment, the conductivity of the thermally conductive gel of the first leak-proof layer 121 (e.g., a 3-watt thermally conductive gel) is less than that of the thermally conductive gel of the second leak-proof layer 122 (e.g., a 6-watt thermally conductive gel), thereby preventing the first leak-proof layer 121 from reacting chemically with the thermally conductive material 123.

[0045] Figure 4 This is a partial cross-sectional schematic diagram of a circuit board module according to another embodiment of the present invention. Please refer to... Figure 4 The difference between the heat dissipation structure 120a of the circuit board module 100a in this embodiment and the heat dissipation structure 120 of the circuit board module 100 described above is that the heat dissipation structure 120a in this embodiment further includes an insulating layer 125, which is located between the substrate 111 and the first leak-proof layer 121. The insulating layer 125 has a third opening 1251, which corresponds to the first opening 1211, and the heat source 113 and the thermally conductive material 123 are located within the third opening 1251. The insulating layer 125 covers at least one second electronic component 1111 (e.g., a capacitor, shown as two) on the substrate 111. Accordingly, the circuit board module 100a of this embodiment can prevent the leaked thermally conductive material 123 from causing a short circuit in the substrate 111 by providing the insulating layer 125. In this embodiment, the insulating layer 125 is made of, for example, an insulating pad or an ultraviolet-curable adhesive (UV adhesive), but is not limited to the above.

[0046] The remaining configuration and function of the heat dissipation structure 120a in this embodiment are the same as or similar to those of the heat dissipation structure 120a in this embodiment. Figures 1 to 3 The heat dissipation structure 120 of the embodiment shown will not be described in detail here.

[0047] Figure 5This is a partial cross-sectional schematic diagram of a circuit board module according to another embodiment of the present invention. Please refer to... Figure 5 The difference between the heat dissipation structure 120b of the circuit board module 100b in this embodiment and the heat dissipation structure 120 of the circuit board module 100 described above is that the heat dissipation structure 120b in this embodiment further includes a coating layer 126. The coating layer 126 is located between the circuit board 130 and the second leak-proof layer 122 and covers at least one first electronic component 131 on the circuit board 130. Accordingly, the circuit board module 100b of this embodiment, by means of the coating layer 126 disposed on the circuit board 130, can provide the circuit board 130 with protection against corrosion, moisture, and short circuits. In this embodiment, the coating layer 126 is, for example, composed of conformal coating, but is not limited thereto.

[0048] The remaining configuration and function of the heat dissipation structure 120b in this embodiment are the same as or similar to those of the heat dissipation structure 120b in this embodiment. Figures 1 to 3 The heat dissipation structure 120 of the embodiment shown will not be described in detail here.

[0049] Figure 6 This is a partial cross-sectional schematic diagram of a circuit board module according to another embodiment of the present invention. Please refer to... Figure 6 The difference between the heat dissipation structure 120c of the circuit board module 100c in this embodiment and the heat dissipation structure 120b of the circuit board module 100b in the above embodiment is that the heat dissipation structure 120c in this embodiment has the above-mentioned... Figure 4 The insulating layer 125 shown can work together with the coating layer 126 to prevent the exposed thermally conductive material 123 from causing a short circuit in the substrate 111 or circuit board 130.

[0050] The remaining configuration and function of the heat dissipation structure 120c in this embodiment are the same as or similar to those of the heat dissipation structure 120c in this embodiment. Figure 5 The heat dissipation structure 120b of the embodiment shown will not be described in detail here.

[0051] Figure 7 This is a schematic diagram of a heat sink and a second leak-proof layer according to another embodiment of the present invention, viewed from another perspective. Please refer to... Figure 7 Since the second leak-proof layer 122 in this embodiment is composed of a flexible and compressible thermally conductive gel as described above, the user can make the second leak-proof layer 122 have different shapes according to the design of the circuit board 130. Furthermore, the user can also add thermally conductive gel to other locations requiring enhanced protection. In addition, during assembly, the assembler can automatically apply the second leak-proof layer 122 to the heat sink 124 first, and then assemble the heat sink 124 and the second leak-proof layer 122 together with the remaining components of the heat dissipation structure 120, the processor 110, and the circuit board 130, thus achieving better assembly efficiency.

[0052] In summary, the heat dissipation structure of the circuit board module of the present invention includes a first leak-proof layer surrounding the thermally conductive material and a second leak-proof layer surrounding the first leak-proof layer and the substrate. Accordingly, the first leak-proof layer reduces the probability of thermally conductive material leaking to the substrate, and the second leak-proof layer further reduces the probability of thermally conductive material leaking to the circuit board, thereby reducing the probability of short circuits in the substrate or circuit board. Furthermore, since the thermally conductive material of the present invention is located between the heat sink and the heat source, heat from the heat source can be conducted to the heat sink via the thermally conductive material, resulting in good heat dissipation.

Claims

1. A heat dissipation structure suitable for dissipating heat from a heat source on a substrate of a circuit board, characterized in that, The heat dissipation structure is disposed on the circuit board and includes: A first leak-proof layer is coupled to the substrate and has a first opening, the heat source being located inside the first opening; A second leak-proof layer is coupled to the circuit board and has a second opening, wherein the first leak-proof layer and the substrate are located in the second opening; A thermally conductive material is located within the first opening and in contact with the heat source; and A radiator covers the first opening and the second opening and is connected to the first leak-proof layer and the second leak-proof layer. The heat dissipation structure separates the thermally conductive material from at least one first electronic component on the circuit board through the first leak-proof layer and the second leak-proof layer.

2. The heat dissipation structure as described in claim 1, characterized in that, It also includes an insulating layer, wherein the insulating layer is located between the substrate and the first leak-proof layer, the insulating layer having a third opening corresponding to the first opening and the heat source and the thermally conductive material being located within the third opening.

3. The heat dissipation structure as described in claim 2, characterized in that, The insulating layer covers at least one second electronic component on the substrate.

4. The heat dissipation structure as described in claim 1, characterized in that, It also includes a coating layer, wherein the coating layer is located between the circuit board and the second leak-proof layer and covers the at least one first electronic component on the circuit board.

5. The heat dissipation structure as described in claim 1, characterized in that, The second leak-proof layer is composed of a thermally conductive gel, and the heat from the at least one first electronic component is adapted to be conducted to the heat sink through the second leak-proof layer.

6. The heat dissipation structure as described in claim 5, characterized in that, The first leak-proof layer is composed of another thermally conductive gel, and the conductivity of the other thermally conductive gel in the first leak-proof layer is less than that of the thermally conductive gel in the second leak-proof layer.

7. A circuit board module, characterized in that, include: A circuit board; A processor is disposed on the circuit board and includes a substrate and a heat source, the heat source being disposed on the substrate; as well as A heat dissipation structure is disposed on the circuit board, in contact with the processor, and includes: A first leak-proof layer is coupled to the substrate and has a first opening, the heat source being located inside the first opening; A second leak-proof layer is coupled to the circuit board and has a second opening, wherein the first leak-proof layer and the substrate are located in the second opening; A thermally conductive material is located within the first opening and in contact with the heat source; and A radiator covers the first opening and the second opening and is connected to the first leak-proof layer and the second leak-proof layer. The heat dissipation structure separates the thermally conductive material from at least one first electronic component on the circuit board through the first leak-proof layer and the second leak-proof layer.

8. The circuit board module as described in claim 7, characterized in that, The heat dissipation structure also includes an insulating layer located between the substrate and the first leak-proof layer. The insulating layer has a third opening corresponding to the first opening, and the heat source and the thermally conductive material are located within the third opening.

9. The circuit board module as described in claim 8, characterized in that, The insulating layer covers at least one second electronic component on the substrate.

10. The circuit board module as described in claim 7, characterized in that, The heat dissipation structure also includes a coating layer located between the circuit board and the second leak-proof layer and covering the at least one first electronic component on the circuit board.

11. The circuit board module as described in claim 7, characterized in that, The second leak-proof layer is composed of a thermally conductive gel, and the heat from the at least one first electronic component is adapted to be conducted to the heat sink through the second leak-proof layer.

12. The circuit board module as described in claim 11, characterized in that, The first leak-proof layer is composed of another thermally conductive gel, and the conductivity of the other thermally conductive gel in the first leak-proof layer is less than that of the thermally conductive gel in the second leak-proof layer.

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