Heat exchange mechanism, work device, and working machine

Abstract

The present application provides a heat exchange mechanism, a working device and a working machine, comprising a micro-channel unit and a temperature-providing unit. The base of the micro-channel unit is provided with a joint surface and internally provided with a plurality of inlets, a plurality of micro-channels and a plurality of outlets. Each inlet can input fluid with a preset temperature into each micro-channel. The fluid in the plurality of micro-channels and the joint surface are used for intensive multi-zone micro-area heat exchange. The heat-exchanged fluid in each micro-channel is discharged by each outlet. The temperature-providing unit is provided with at least one temperature-providing member on the base of the micro-channel unit. The temperature-providing member is matched with the plurality of micro-channels and the fluid inside the micro-channels to quickly maintain the uniform temperature of the joint surface and effectively improve the heat exchange efficiency.

Description

Technical Field

[0001] This invention relates to a heat exchange mechanism that can perform dense multi-zone micro-area heat exchange, thereby improving temperature control efficiency. Background Technology

[0002] Currently, operating devices are equipped with pressing mechanisms, transfer mechanisms, pre-cooling / preheating mechanisms, or conveying mechanisms to perform preset and temperature-controlled operations on electronic components. Taking cold testing as an example, the testing mechanism uses a tester to hold and test electronic components. A pressing mechanism is located above the tester, and the pressing mechanism is equipped with a pressing tool and a flow channel seat. The pressing tool can press the electronic components, and the flow channel seat has a single flow channel inside. One end of the flow channel has an inlet for injecting refrigerant, and the refrigerant flows towards the outlet at the other end of the flow channel, so that the pressing tool presses the electronic components of the tester at a preset test low temperature and controls the temperature of the tester, thus subjecting the electronic components to a temperature environment that simulates their future use, and performing cold testing.

[0003] However, although the flow channel seat can initially have a preset test temperature on the side of the bottom surface of the lower pressure fixture relative to the inlet due to the input of a refrigerant with a preset low temperature at the inlet of the flow channel, the refrigerant will gradually heat up as it flows in the flow channel, through heat exchange between the lower pressure fixture and the electronic components. As the refrigerant flows closer to the outlet of the flow channel, it cannot maintain the preset test low temperature. Consequently, the side of the bottom surface of the lower pressure fixture relative to the outlet cannot maintain the preset test low temperature, resulting in a temperature difference between the two sides of the bottom surface of the lower pressure fixture. This makes it impossible to uniformly control the temperature of the electronic components, thereby affecting the test quality of the electronic components. Summary of the Invention

[0004] The purpose of this invention is to provide a heat exchange mechanism, a working device, and a working machine.

[0005] The technical solution adopted in this invention is as follows:

[0006] A heat exchange mechanism, characterized in that it comprises:

[0007] Microchannel unit: A base with a mounting surface and a mating surface is provided, and a plurality of inlets, a plurality of microchannels and a plurality of outlets are provided on the base. The plurality of inlets can input fluid into the plurality of microchannels, the plurality of microchannels can enable the fluid to perform dense multi-zone micro-area heat exchange with the mating surface, and the plurality of outlets can output the heat-exchanged fluid from the plurality of microchannels.

[0008] Temperature supply unit: At least one temperature supply element is provided in the base and / or the microchannel of the microchannel unit. The temperature supply element can be combined with the fluid of the plurality of microchannels to keep the joint surface at a uniform temperature.

[0009] The heat exchange mechanism, wherein the base of the microchannel unit is integrally formed.

[0010] The heat exchange mechanism, wherein the base of the microchannel unit comprises a plurality of stacked plates.

[0011] The heat exchange mechanism, wherein: the base comprises a plurality of plates including a first plate and a second plate, the second surface of the first plate is defined as the mating surface and has a plurality of microchannels inside, the second plate is stacked and assembled on the first plate and is defined as the mounting surface on the first surface, and the interior of the second plate has a plurality of inlets and a plurality of outlets.

[0012] The heat exchange mechanism, wherein at least one of the heating elements of the heating unit is disposed on one or more of the first plate, the second plate and the microchannel of the base.

[0013] The heat exchange mechanism, wherein: the plurality of plates of the base include a first plate, a second plate and a third plate, the first plate is provided with a plurality of microchannels penetrating the first surface and the second surface, the first surface of the second plate is defined as the mounting surface, and the second surface is stacked and assembled on the first surface of the first plate, the second plate is provided with a plurality of inlets and a plurality of outlets, the second surface of the third plate is defined as the mating surface, and the first surface is stacked and assembled on the second surface of the first plate.

[0014] The heat exchange mechanism wherein: at least one of the heating elements of the heating unit is disposed on one or more of the second plate, the third plate and the microchannel of the base.

[0015] The heat exchange mechanism wherein: the microchannel of the microchannel unit has a height difference with the inlet and the outlet.

[0016] The heat exchange mechanism, wherein the temperature supply element of the temperature supply unit has a thermally conductive and insulating covering.

[0017] The heat exchange mechanism, wherein: the mating surface of the microchannel unit is provided with at least one protective element.

[0018] A working device, characterized in that it comprises:

[0019] At least one device;

[0020] At least one of the heat exchange mechanisms described herein: the mounting surface of its base is mounted on the bracket;

[0021] At least one working component: the mating surface of the base on which the heat exchange mechanism is provided, or the working component is defined on the mating surface, the working component being used to perform preset operations on electronic components.

[0022] A work machine, characterized in that it comprises:

[0023] Machine tool;

[0024] Feeding device: disposed on the machine and equipped with at least one feeder for holding the electronic components to be tested;

[0025] Receiving device: disposed on the machine and equipped with at least one receiving device for accommodating the measured electronic component;

[0026] Testing apparatus: configured on the machine tool and equipped with at least one tester for testing the electronic component;

[0027] At least one of the aforementioned operating devices is configured on the machine tool for performing preset operations on the electronic component and temperature-controlling the electronic component;

[0028] Central control unit: Used to control and integrate the actions of various devices to perform automated operations.

[0029] This invention provides a heat exchange mechanism comprising a microchannel unit and a temperature supply unit. The base of the microchannel unit has a mating surface and contains a plurality of inlets, a plurality of microchannels, and a plurality of outlets. The plurality of inlets can input a plurality of fluids into the plurality of microchannels, and the plurality of microchannels enable the plurality of fluids to perform dense multi-zone micro-area heat exchange with the mating surface. The plurality of outlets can output the heat-exchanged fluids from the plurality of microchannels. The temperature supply unit contains at least one temperature supply element inside the base of the microchannel unit and / or within the microchannels. The temperature supply element can work in conjunction with the fluids in the plurality of microchannels to rapidly maintain a uniform temperature at the mating surface, thereby reducing channel temperature loss and expanding the uniform temperature range of the mating surface, thus effectively improving temperature control performance.

[0030] The present invention provides a heat exchange mechanism in which the microchannel unit can be provided with stepped multi-layer microchannels, which can increase the flow rate of fluid without increasing the length of the microchannel, thereby improving the heat exchange efficiency and temperature control quality of the interface.

[0031] The present invention provides an operating device comprising at least one mounting device, at least one heat exchange mechanism, and at least one operating component; the at least one heat exchange mechanism is mounted on the mounting device and is provided with a microchannel unit and a temperature supply unit for temperature control of electronic components; the at least one operating component is disposed on the mating surface of the heat exchange mechanism or is defined on the mating surface, the operating component being used to perform preset operations on the electronic components; thereby improving operating efficiency.

[0032] The present invention provides a workpiece comprising a machine base, a feeding device, a receiving device, a testing device, a working device, and a central control device. The feeding device is disposed on the machine base and is provided with at least one feeder for holding electronic components to be tested; the receiving device is disposed on the machine base and is provided with at least one receiving device for holding electronic components that have already been tested; the testing device is disposed on the machine base and is provided with at least one tester for testing electronic components; the working device is disposed on the machine base and is provided with at least one mounting device, at least one heat exchange mechanism, and at least one working component for temperature control of electronic components and performing preset operations on electronic components; the central control device is used to control and integrate the actions of each device to perform automated operation. Attached Figure Description

[0033] Figure 1 This is a schematic diagram of the first embodiment of the heat exchange mechanism of the present invention.

[0034] Figure 2 This is a schematic diagram of a heat exchange mechanism applied to a first embodiment of a working device.

[0035] Figures 3 to 5 This is a schematic diagram illustrating the use of the working device.

[0036] Figure 6 This is a schematic diagram of a second embodiment of the heat exchange mechanism of the present invention.

[0037] Figure 7 This is a schematic diagram of a second embodiment of the working device.

[0038] Figure 8 This is a schematic diagram of the machine used in this invention.

[0039] Explanation of reference numerals in the attached drawings: Operating device 10; Base 11; Assembly surface 111; Joint surface 112; Inlet 113; Microchannel 114; Outlet 115; Protective component 12; Heating wire 13; Base 14; First plate 141; Second plate 142; Third plate 143; Assembly surface 144; Joint surface 145; Microchannel 146; First microchannel 1461; Second microchannel 1462; Inlet 147; Outlet 148; Heating wire 15; Water inlet channel 211; Inlet branch channel 2111; Water outlet channel 212; Outlet branch channel 2121; Water inlet channel 213; Water outlet channel 214; Transfer arm 22; Preheating stage 23; First conveyor 24; Second conveyor 25; Third conveyor 26; Testing device 30; Circuit board 31; Testing base 32; Machine base 40; Electronic components 50; Feeding device 60; Receiving device 70. Detailed Implementation

[0040] To provide a better understanding of the present invention, a preferred embodiment is described in detail below with reference to the accompanying drawings:

[0041] Please see Figure 1 As shown, the first embodiment of the present invention provides a heat exchange mechanism, which includes a microchannel unit and a temperature supply unit.

[0042] The microfluidic unit is equipped with a base having an assembly surface and a mating surface. The base has a plurality of inlets, a plurality of microfluidic channels and a plurality of outlets. The plurality of inlets can input fluid into the plurality of microfluidic channels, the plurality of microfluidic channels can enable the fluid to perform dense multi-zone micro-area heat exchange with the mating surface, and the plurality of outlets can output the heat-exchanged fluid from the plurality of microfluidic channels.

[0043] Depending on the operational requirements, the base can be a single piece or consist of multiple stacked and assembled plates.

[0044] Depending on the operational requirements, the base is integrally molded. Its first surface (such as the top surface) is defined as the assembly surface, and its second surface (such as the bottom surface) is opposite to the first surface and is defined as the mating surface. The base has multiple inlets, multiple microchannels and multiple outlets inside.

[0045] According to the operational requirements, the base includes a plurality of stacked and assembled plates, including a first plate and a second plate. The second surface (such as the bottom surface) of the first plate is defined as the mating surface and has a plurality of microchannels inside. The first surface (such as the top surface) of the second plate is defined as the assembly surface, and its second surface is stacked and assembled on the first surface (such as the top surface) of the first plate. The interior of the second plate has a plurality of inlets and a plurality of outlets.

[0046] As described above, at least one heating element of the heating unit is disposed on one or more of the first plate, the second plate, and the microchannels of the base.

[0047] According to the operational requirements, the base consists of a plurality of plates including a first plate, a second plate and a third plate. The first plate has a plurality of microchannels that penetrate the first surface (such as the top surface) and the second surface (such as the bottom surface). The first surface (such as the top surface) of the second plate is defined as the assembly surface, and the second surface is stacked and assembled on the first surface of the first plate. The second plate has a plurality of inlets and a plurality of outlets. The second surface (such as the bottom surface) of the third plate is defined as the mating surface, and the first surface is stacked and assembled on the second surface (such as the bottom surface) of the first plate.

[0048] As described above, at least one heating element of the heating unit is disposed on one or more of the second plate, the third plate, and the microchannels of the base.

[0049] Depending on the operational requirements, the microchannels of the microchannel unit have a height difference with the inlet and outlet.

[0050] Depending on the operational requirements, the joint surface of the microchannel unit is equipped with at least one protective component to increase the strength of the joint surface.

[0051] Depending on the operational requirements, the fluid can be refrigerant, low-temperature water, or high-temperature water, etc., and is not limited to this embodiment.

[0052] In this embodiment, the base 11 of the microchannel unit is made of thermally conductive, non-conductive ceramic. A first surface (e.g., the top surface) of the base 11 is defined as a mounting surface 111, capable of mounting at least one mounting device (e.g., a transfer arm, not shown). A second surface opposite the first surface is defined as a mating surface 112, capable of pressing electronic components or mounting at least one working component (e.g., a pressing fixture, not shown). The base 11 has a plurality of inlets 113, a plurality of microchannels 114, and a plurality of outlets 115. Each inlet 113 has a diameter of 0.2 mm and communicates with the water inlet channel 211 and the microchannels 114 located on the base 11. There is a height difference between the inlets 113 and the microchannels 114. The inlet branch channel 2111 of the water inlet channel 211 connects to the plurality of inlets 113, allowing the water inlet channel 211 to transport fluid (e.g., refrigerant) to the plurality of inlets 113 via the inlet branch channel 2111. The base 11 has a plurality of microchannels 114 evenly arranged in an array near the mating surface 112. Each microchannel 114 is arranged in the X direction and has a length of 0.4 mm. One end of each microchannel 114 is connected to an inlet 113, and the other end is connected to an outlet 115. The inlet 113 allows fluid to be introduced into the microchannels 114, enabling the fluid in the plurality of microchannels 114 to undergo dense multi-zone micro-area heat exchange with the mating surface 112. Each outlet 115 has a diameter of 0.2 mm and is connected to the water outlet channel 212 and the microchannels 114 located on the base 11. The outlets 115 and the microchannels 114 have a height difference. The branch channel 2121 of the water outlet channel 212 is connected to the plurality of outlets 115. The outlets 115 can collect the heat-exchanged fluid output from the microchannels 114 into the branch channel 2121 and then discharge it from the water outlet channel 212.

[0053] Depending on the operational requirements, a metal protective element 12 can be disposed on the mating surface 112 of the ceramic base 11. The protective element 12 increases the strength of the base 11 to facilitate the crimping and temperature control electronic components (not shown in the figure).

[0054] A plurality of inlets 113 may be connected to a single water inlet channel 211 to supply fluid, or a plurality of inlets 113 may be connected to a plurality of water inlet channels 211 to supply fluid separately, not limited to this embodiment.

[0055] A plurality of outlets 115 may be connected to a single water outlet channel 212 to output heat-exchanged fluid, or a plurality of outlets 115 may be connected to a plurality of water outlet channels 212 to each output heat-exchanged fluid, not limited to this embodiment.

[0056] The heating unit has at least one heating element on the base 11 and / or the microchannel 114 of the microchannel unit. The heating element can work with the fluid in the plurality of microchannels to keep the interface 112 at a uniform temperature. Furthermore, the heating element may be a heating wire or a cooling chip, etc., and is not limited to this embodiment.

[0057] For example, at least one heating wire may be disposed within the wall thickness of the base 11, the heating temperature of which can be matched with the temperature of the fluid, and the temperature control interface 112 may have a preset test temperature. For example, at least one heating wire may be disposed inside at least one plate of the base 11. For example, at least one heating wire may be disposed in the microchannel 114, and the heating wire may be covered with a thermally conductive and non-conductive covering, so that when the heating wire is energized, its heating temperature can be matched with the temperature of the fluid, and the temperature control interface 112 may have a preset test temperature; this is not limited to this embodiment.

[0058] In this embodiment, the heating unit is provided with heating elements that can be heating wires 13 on the upper and lower wall thicknesses of the base 11. The heating temperature of the heating wires 13 can be matched with the temperature of the fluid, and the mating surface 112 of the temperature control base 11 has a preset test temperature.

[0059] Please see Figure 2 As shown, the present invention provides a working device 10, comprising at least one mounting device, at least one heat exchange mechanism, and at least one working component; the mounting device is for mounting the heat exchange mechanism of the present invention, the heat exchange mechanism comprising a microchannel unit and a temperature supply unit for temperature control electronic components; the working component can be disposed on the mating surface of the heat exchange mechanism, or the mating surface defines the working component, the working component is for performing preset operations on the electronic components.

[0060] Depending on the operational requirements, the mounting device can be configured as fixed or movable; for example, the mounting device can be a frame, machine base or fixed seat, etc., for fixed assembly of heat exchange mechanism; for example, the mounting device can be a transfer arm or movable seat that can move in at least one direction, so as to drive the heat exchange mechanism to move in at least one direction.

[0061] Depending on the operational requirements, the working components may be mating surfaces, pressing fixtures, pressing and transferring fixtures, precooling / preheating tables, or carriers, etc., and are not limited to this embodiment.

[0062] In this embodiment, the mounting device is a transfer arm 22, which is driven by a drive source (not shown) to perform at least one Z-direction displacement. The transfer arm 22 is used to mount the mounting surface 111 of the base 11 of the heat exchange mechanism, thereby driving the heat exchange mechanism to move synchronously in the Z-direction. The mating surface 112 of the base 11 of the heat exchange mechanism is defined as a working component, which is a pressing component, that is, the mating surface 112 can perform pressing operations on electronic components. However, in this embodiment, to increase the strength of the mating surface 112, the mating surface 112 can be connected to the protective member 12 to facilitate temperature control and pressing of electronic components (not shown).

[0063] Depending on the operational requirements, a float (not shown in the figure) can be installed between the base 11 of the heat exchange mechanism and the mounting device, so that the base 11 can float and buffer displacement, which is also acceptable.

[0064] Depending on the operational requirements, a temperature controller can be configured above the base 11 of the heat exchange mechanism. The temperature controller can be a cooling chip or a refrigerant device containing refrigerant. For example, the multiple microchannels 114 of the heat exchange mechanism can be supplied with fluids that are low-temperature water. A temperature controller can be configured above the heat exchange mechanism. The temperature controller can be a refrigerant device containing refrigerant, so that the heat exchange mechanism can be equipped with a refrigerant device to more quickly improve the temperature control efficiency, which is not limited to this embodiment.

[0065] Please see Figures 3 to 4 The diagram shows the usage of the working device 10 and the testing device 30 of the present invention. The testing device 30 is disposed on the machine base 40 and is equipped with at least one tester for testing electronic components 50. In this embodiment, the tester includes an electrically connected circuit board 31 and a test socket 32, which is used to hold and test the electronic components 50. The working device 10 is disposed above the test socket 32, and the transfer arm 22 can drive the base 11, the mating surface 112, and the protective member 12 of the heat exchange mechanism to move in the Z direction toward the test socket 32 ​​and the electronic components 50.

[0066] In the cold test operation, the water inlet channel 211 of the working device 10 inputs a fluid containing refrigerant into the inlet branch channel 2111 of the base 11. The inlet branch channel 2111 rapidly and evenly distributes the fluid to a plurality of inlets 113 of the heat exchange mechanism. Each inlet 113 inputs the refrigerant from top to bottom into the microchannels 114. The microchannels 114 are close to the joint surface 112. With the design of a plurality of short-path microchannels 114 densely arrayed above the joint surface 112 and reducing channel temperature loss, the refrigerant in the plurality of microchannels 114 of the heat exchange mechanism quickly exchanges heat with the joint surface 112 at a preset low temperature. Combined with the heating temperature of a plurality of heating wires 13, the joint surface 112 achieves a uniform temperature. The joint surface 112 then performs the cold test operation in a preset low temperature environment through the electronic components 50 of the temperature control tester 32 of the protective component 12, thereby improving the test yield.

[0067] The refrigerant that has been heat-exchanged in each microchannel 114 of the heat exchange mechanism flows from bottom to top to the outlet 115. Multiple outlets 115 converge into the branch channel 2121, which then transports the heat-exchanged refrigerant to the outlet channel 212 for discharge.

[0068] Please see Figure 6As shown, the design of the first embodiment of the heat exchange mechanism is generally the same as that of the second embodiment. The difference is that the base 14 of the microchannel unit includes a plurality of stacked plates, including a first plate 141, a second plate 142 and a third plate 143. The second plate 142 is stacked on top of the first surface of the first plate 141. The first surface of the second plate 142 defines a mounting surface 144 for mounting at least one mounting device and / or a fluid supply mechanism (i.e., a mechanism for supplying / discharging fluid). The third plate 143 is stacked below the second surface of the first plate 141. The third plate 143 defines a mating surface 145, which can be used to connect electronic components or assemble at least one working part (not shown in the figure).

[0069] The base 14 has a plurality of rows of microchannels 146 extending through the first and second surfaces on the first plate 141. Each microchannel 146 has a stepped, multi-layered microchannel section, which can increase the fluid flow rate without increasing the length of the microchannel 146, thereby improving the heat exchange efficiency and temperature control quality of the mating surface 145. In this embodiment, the microchannels 146 are arranged in the X direction and have a length of 0.4 mm. They have stepped, multi-layered, interconnected first microchannel section 1461 and second microchannel section 1462 along the Z direction. The first microchannel section 1461 is close to the second plate 142, and the second microchannel section 1462 is close to the third plate 143 and the mating surface 145.

[0070] In this embodiment, the second plate 142 of the base 14 is provided with a plurality of inlets 147, each inlet 147 having a diameter of 0.2 mm, and communicating with the microchannel 146 and the water inlet channel 213. The water inlet channel 213 inputs fluid into the microchannel 146 via the inlets 147.

[0071] Depending on the operational requirements, a plurality of inlets 147 may be connected to a single water inlet channel to supply fluid, or a plurality of inlets 147 may be connected to a plurality of water inlet channels to supply fluid separately; this is not limited to this embodiment.

[0072] Depending on the operational requirements, the inlet 147 can be located in the microchannel 146, and the water inlet channel 213 can be connected to the inlet 147 from the periphery of the base 14, which is also acceptable.

[0073] In this embodiment, the second plate 142 of the base 14 is provided with a plurality of outlets 148, each outlet 148 having a diameter of 0.2 mm and communicating with the microchannel 146 and the water outlet channel 214. The outlet 148 transports the heat-exchanged fluid in the microchannel 146 to the water outlet channel 214 for discharge.

[0074] As described above, the plurality of outlets 148 can be connected to a single water outlet channel to output the heat-exchanged fluid, or the plurality of outlets 148 can be connected to a plurality of water outlet channels to output the heat-exchanged fluid separately; this is not limited to this embodiment.

[0075] The heating unit is provided with heating elements for heating wires 15 on the second plate 142 and the third plate 143 of the base 14, and the heating temperature can be matched with the temperature of the fluid. The mating surface 145 of the temperature control base 14 has a preset test temperature.

[0076] Please see Figure 7 As shown, in the second embodiment of the application of the working device 10, the mounting device is a machine base 40. The mounting surface 111 of the base 11 of the heat exchange mechanism is disposed on the machine base 40 via a fluid supply mechanism. The mating surface 112 of the base 11 is used to assemble a working component as a preheating stage 23. The multiple microchannels 114 of the microchannel unit of the heat exchange mechanism are matched with the heating wire 13 of the heating unit, which can make the mating surface 112 perform dense multi-zone micro-area heat exchange and achieve uniform temperature, so as to facilitate rapid temperature control of the preheating stage 23 and electronic components (not shown in the figure).

[0077] Please see Figures 1 to 5 , Figure 8 As shown, the working device 10 of the present invention is applied to an electronic component processing machine. The processing machine includes a machine base 40, a feeding device 60, a receiving device 70, a processing device 10, a testing device 30, and a central control device (not shown). The feeding device 60 is disposed on the machine base 40 and is provided with at least one feeder to accommodate at least one electronic component to be tested; the receiving device 70 is disposed on the machine base 40 and is provided with at least one receiving device to accommodate at least one tested electronic component; the testing device 30 is disposed on the machine base 40 and is provided with at least one tester for testing electronic components; at least one processing device 10 is disposed on the machine base 40 and includes at least one mounting device, at least one heat exchange mechanism, and at least one processing component, and further includes at least one conveying mechanism, which is provided with at least one conveyor for conveying electronic components; in this embodiment, the conveying mechanism is provided with a first conveyor 24 to pick up the electronic component to be tested from the feeder of the feeding device 60. The components are transferred to the second conveyor 25, which is used by the third conveyor 26 to pick up the components. The third conveyor 26 transfers the electronic components to be tested to the testing device 30 for testing. The heat exchange mechanism of the working device 10 presses and temperature-controls the electronic components with the mating surface 112. The third conveyor 26 moves the tested electronic components into the second conveyor 25. The first conveyor 24 takes out the tested electronic components from the second conveyor 25 and, according to the test results, transports the tested electronic components to the receiving device 70 for sorting and storage. The central control device (not shown) is used to control and integrate the actions of each device to perform automated operations and achieve practical benefits in improving work efficiency.

Claims

1. A heat exchange mechanism, characterized in that, Include: Microchannel unit: A base with a mounting surface and a mating surface is provided, and a plurality of inlets, a plurality of microchannels and a plurality of outlets are provided on the base. The plurality of inlets can input fluid into the plurality of microchannels, the plurality of microchannels can enable the fluid to perform dense multi-zone micro-area heat exchange with the mating surface, and the plurality of outlets can output the heat-exchanged fluid from the plurality of microchannels. Temperature supply unit: At least one temperature supply element is provided in the base and / or the microchannel of the microchannel unit. The temperature supply element can be combined with the fluid of the plurality of microchannels to keep the joint surface at a uniform temperature.

2. The heat exchange mechanism as described in claim 1, characterized in that: The base of this microchannel unit is integrally molded.

3. The heat exchange mechanism as described in claim 1, characterized in that: The base of the microchannel unit comprises a plurality of stacked plates.

4. The heat exchange mechanism as described in claim 3, characterized in that: The base comprises a plurality of plates including a first plate and a second plate. The second surface of the first plate is defined as the mating surface and has a plurality of microchannels inside. The second plate is stacked and assembled on the first plate and has a first surface defined as the mounting surface. The interior of the second plate has a plurality of inlets and a plurality of outlets.

5. The heat exchange mechanism as described in claim 4, characterized in that: At least one of the heating elements of the heating unit is disposed on one or more of the first plate, the second plate and the microchannel of the base.

6. The heat exchange mechanism as described in claim 3, characterized in that: The base comprises a plurality of plates including a first plate, a second plate and a third plate. The first plate has a plurality of microchannels penetrating a first surface and a second surface. The first surface of the second plate is defined as the mounting surface, and the second surface is stacked and assembled on the first surface of the first plate. The second plate has a plurality of inlets and a plurality of outlets. The second surface of the third plate is defined as the mating surface, and the first surface is stacked and assembled on the second surface of the first plate.

7. The heat exchange mechanism as described in claim 6, characterized in that: At least one of the heating elements of the heating unit is disposed on one or more of the second plate, the third plate and the microchannel of the base.

8. The heat exchange mechanism as described in any one of claims 1 to 7, characterized in that: The microchannel of the microchannel unit has a height difference with the inlet and the outlet.

9. The heat exchange mechanism as described in any one of claims 1 to 7, characterized in that: The heating element of the heating unit has a thermally conductive and insulating cover.

10. The heat exchange mechanism as described in any one of claims 1 to 7, characterized in that: The mating surface of the microchannel unit is provided with at least one protective element.

11. A working device, characterized in that, Include: At least one device; At least one heat exchange mechanism as described in any one of claims 1 to 7: the mounting surface of its base is fitted to the bracket; At least one working component: the mating surface of the base on which the heat exchange mechanism is provided, or the working component is defined on the mating surface, the working component being used to perform preset operations on electronic components.

12. A work machine, characterized in that, Include: Machine tool; Feeding device: It is configured on the machine and is equipped with at least one feeder to hold the electronic components to be tested; Material receiving device: disposed on the machine and equipped with at least one material receiving device for accommodating the measured electronic component; Testing apparatus: configured on the machine tool and equipped with at least one tester for testing the electronic component; At least one operating device as described in claim 11: disposed on the machine tool for performing preset operations on the electronic component and temperature controlling the electronic component; Central control unit: Used to control and integrate the actions of various devices to perform automated operations.

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