Heat dissipation module and electronic device

Abstract

This application provides a heat dissipation module and electronic device, relating to the field of electronic device technology. The heat dissipation module includes a first heat-conducting structure, a second heat-conducting structure, a first heat dissipation structure, a second heat dissipation structure, and a first drive pump. The first heat-conducting structure forms a first medium flow channel, with its two ends connected to the input and output ends of the first drive pump, respectively. The first heat-conducting structure includes a first region and a second region, arranged along the extension direction of the first medium flow channel, with the first heat dissipation structure located in the first region. The second heat-conducting structure includes a third region and a fourth region, with the third region overlapping and connected to the second region, and the second heat dissipation structure located in the fourth region. This allows for simple and efficient heat transfer from the heat-generating element to multiple heat dissipation structures located at different positions.

Description

Technical Field

[0001] This application relates to the field of electronic device technology, and in particular to a heat dissipation module and electronic device. Background Technology

[0002] To maintain the performance of electronic devices such as mobile phones and laptops, these devices need to have good heat dissipation capabilities.

[0003] In related technologies, the heat dissipation module of an electronic device can include a heat dissipation structure and a heat-conducting component. The heat-generating element of the electronic device can be connected to the heat dissipation structure through the heat-conducting component, and the heat generated by the heat-generating element can be conducted to the heat dissipation structure for cooling. When the heat dissipation capacity of a single heat dissipation structure is limited, the heat dissipation module can include multiple heat dissipation structures distributed in different locations, so that the heat generated by the heat-generating element can be dissipated through multiple heat dissipation structures located in different locations, thereby improving the heat dissipation capacity of the electronic device and enabling the heat dissipation module to meet the heat dissipation requirements of high-power electronic devices.

[0004] However, how to simply and efficiently conduct the heat generated by the heat-generating element to multiple heat dissipation structures located in different positions has become an urgent problem to be solved in the field of electronic device technology. Summary of the Invention

[0005] This application provides a heat dissipation module and electronic device that can simply and efficiently conduct the heat generated by the heat-generating element to multiple heat dissipation structures located at different positions.

[0006] A first aspect of this application provides a heat dissipation module, which includes a first heat-conducting structure, a second heat-conducting structure, a first heat dissipation structure, a second heat dissipation structure, and a first drive pump. The first heat-conducting structure is used to enclose and form a first medium flow channel. The two ends of the first medium flow channel are respectively connected to the input end and the output end of the first drive pump, and the first medium flow channel and the first drive pump form a first medium circulation loop. The first heat-conducting structure includes a first region and a second region, which are arranged along the extension direction of the first medium flow channel. The first heat dissipation structure is disposed in the first region. The second heat-conducting structure includes a third region and a fourth region, which overlap and are connected to the second region. The second heat dissipation structure is disposed in the fourth region.

[0007] One of the first and second thermally conductive structures is used to connect to the heating element.

[0008] The heat dissipation module provided in this application embodiment forms a heat dissipation path with a first heat-conducting structure and a first heat dissipation structure, and another heat dissipation path with a second heat-conducting structure and a second heat dissipation structure. Through the stacked third and second regions, heat can be conducted between the first and second heat-conducting structures, allowing the heat generated by the heating element to be dissipated through the first and second heat dissipation structures. In this case, the heat generated by the heating element can be distributed on the first and second heat-conducting structures, resulting in relatively low temperatures on both structures, which is beneficial for meeting the heat dissipation requirements of high-power electronic devices. Furthermore, by using the first and second heat-conducting structures to conduct the heat generated by the heating element to the first and second heat dissipation structures respectively, the heat conduction paths of both structures are short, resulting in efficient heat conduction between the heating element and the two structures. Additionally, it is not necessary to have the medium within the same heat dissipation path flow separately to the first and second heat dissipation structures, eliminating the need for a flow distribution structure or flow control, thus simplifying the efficient conduction of heat generated by the heating element to the first and second heat dissipation structures. Driven by the first driving pump, the heat generated by the heating element can be quickly conducted to the first heat dissipation structure through the medium for heat dissipation. The temperature difference between the first heat dissipation structure and the heating element, as well as the temperature difference between the first heat dissipation structure and the second heat conduction structure, are small, which facilitates efficient heat dissipation through the first heat dissipation structure and the second heat dissipation structure.

[0009] In one possible implementation, along the extension direction of the first medium flow channel, the second region is located between the first region and the output end of the first drive pump. In this way, the medium in the first medium flow channel dissipates heat in the first region before flowing to the input end of the first drive pump, resulting in a lower temperature of the medium at the first drive pump and thus higher driving efficiency of the first drive pump. Furthermore, the lower temperature of the medium at the first drive pump also reduces the likelihood of leakage at the connection between the first drive pump and the first heat-conducting structure, resulting in better sealing of the first medium circulation loop.

[0010] In one possible implementation, the first medium flow channel includes a first flow channel section located in a first region, and the inner wall of the flow channel section is provided with a first heat exchange structure. This allows for higher heat exchange efficiency between the medium within the first flow channel section and the first heat dissipation structure, and also results in higher efficiency for the medium within the first flow channel section to dissipate heat through the first heat dissipation structure.

[0011] In one possible implementation, the first medium flow channel includes a second flow channel section located in the second region, and the inner wall of the flow channel section is provided with a second heat exchange structure. This allows for higher heat exchange efficiency between the medium within the second flow channel section and the second heat-conducting structure, facilitating heat conduction between the first and second heat-conducting structures, and further facilitating heat dissipation from the heat-generating element through the first and second heat dissipation structures.

[0012] In one possible implementation, the first heat-conducting structure further includes a fifth region for connection to a heating element. The first, second, and fifth regions are arranged along the extension direction of the first medium flow channel. The first medium flow channel includes a third flow channel section located in the fifth region, and the inner wall of the third flow channel section is provided with a third heat exchange structure. This allows for higher heat exchange efficiency between the medium in the third flow channel section and the heating element, facilitating the transfer of heat from the heating element to the first heat-conducting structure.

[0013] In one possible implementation, along the extension direction of the first medium flow channel, the fifth region is located between the first region and the output end of the first drive pump. In this way, the medium in the first medium flow channel, after cooling in the first region, flows to the input end of the first drive pump, resulting in a lower temperature of the medium at the first drive pump, thus increasing the driving efficiency of the first drive pump and improving the sealing of the first medium circulation loop.

[0014] In one possible implementation, along the extension direction of the first medium flow channel, the fifth region is located between the second region and the output end of the first drive pump. In this way, the medium in the first medium flow channel conducts heat to the second heat-conducting structure in the second region before flowing to the input end of the first drive pump. This results in a lower temperature of the medium at the first drive pump, leading to higher driving efficiency of the first drive pump and better sealing of the first medium circulation loop.

[0015] In one possible implementation, along the extension direction of the first medium flow channel, the fifth region is located between the second region and the output end of the first drive pump, and the second region is located between the fifth region and the first region. In this way, while the medium temperature at the first drive pump is relatively low, during the heat conduction from the heating element to the first heat dissipation structure, some of the heat on the first heat-conducting structure can be conducted to the second heat-conducting structure through the second region, making the heat conduction of the first heat-conducting structure simpler and more efficient. Furthermore, since the heat from the heating element is first conducted to the second region and then to the first region, the temperature in the second region is relatively high, which facilitates the transfer of some heat from the first heat-conducting structure to the second heat-conducting structure and its dissipation through the second heat dissipation structure.

[0016] In one possible implementation, the second heat-conducting structure further includes a first connecting region. The two ends of the first connecting region are spaced apart along the overlap direction of the third and second regions. The third and fourth regions are staggered along the overlap direction of the third and second regions, and are connected by the first connecting region, forming a first accommodating space between the third region and the first connecting region. At least a portion of the second region is located within the first accommodating space, and the second heat dissipation structure and the second region are respectively located on opposite sides of the second heat-conducting structure along the overlap direction of the third and second regions. Thus, when the heat-generating element is connected to the first heat-conducting structure, the positions of the first and fourth regions can overlap along the overlap direction of the third and second regions, which is beneficial for having a smaller size of the heat dissipation module along the overlap direction of the third and second regions while allowing for a larger size of the second heat dissipation structure along the overlap direction of the third and second regions.

[0017] In one possible implementation, the first heat-conducting structure further includes a second connecting region. The two ends of the second connecting region are spaced apart along the overlap direction of the third region and the second region. The first region and the second region are staggered along the overlap direction of the third region and the second region, and are connected by the second connecting region, forming a second accommodating space between the second region and the second connecting region. At least a portion of the third region is located within the second accommodating space, and the first heat dissipation structure and the third region are respectively located on both sides of the first heat-conducting structure along the overlap direction of the third region and the second region. Thus, when the heat-generating element is connected to the second heat-conducting structure, the positions of the first region and the fourth region can overlap along the overlap direction of the third region and the second region, which is beneficial for having a smaller size of the heat dissipation module along the overlap direction of the third region and the second region while allowing the first heat dissipation structure to have a larger size along the overlap direction of the third region and the second region.

[0018] In one possible implementation, the third region forms part of the channel wall of the first medium flow channel. This allows the dimensions of the third and second regions to be smaller in their overlapping direction, which is beneficial for arranging the heat dissipation module in a thinner and lighter electronic device.

[0019] In one possible implementation, the second heat-conducting structure is a passive heat-conducting structure. This reduces the number of drive pumps in the heat dissipation module, which helps reduce vibration during operation and improves its reliability. Furthermore, the reduced number of drive pumps also helps reduce the energy consumption of the heat dissipation module.

[0020] When the heating element is connected to the second heat-conducting structure, and the second heat-conducting structure is a passive heat-conducting structure, when the power consumption of the heating element is low, the first drive pump can be not activated or can operate at low power. The heating element is mainly cooled by the second heat dissipation structure connected to the second heat-conducting structure. This helps improve the reliability of the heat dissipation module and reduce its energy consumption. When the power consumption of the heating element is high, the first drive pump can be activated. The heat conducted from the heating element to the second heat-conducting structure can be carried to the first heat dissipation structure by the medium flowing within the first heat-conducting structure for cooling, and the heat conducted from the heating element to the second heat-conducting structure can be transferred to the second heat dissipation structure for cooling, thus meeting the heat dissipation requirements of the heating element under high power consumption.

[0021] In one possible implementation, the heat dissipation module further includes a second drive pump. A second thermally conductive structure is used to enclose and form a second medium flow channel. The two ends of the second medium flow channel are connected to the input and output ends of the second drive pump, respectively, forming a second medium circulation loop. Thus, the flow rate of the medium within the first and second medium flow channels can be controlled by controlling the first and second drive pumps, thereby distributing the heat dissipated through the first and second heat dissipation structures. Furthermore, the active thermally conductive component has high thermal conductivity, and the heat-generating element transfers heat to the first and second heat dissipation structures efficiently, resulting in high heat dissipation efficiency for the heat dissipation module. In addition, the overall temperature of the active thermally conductive component is lower, which reduces the high-temperature area of ​​the heat dissipation module, thus helping to lower the temperature of the housing components.

[0022] A second aspect of this application provides an electronic device, including a heat-generating element and a heat dissipation module as described in any of the above embodiments. The heat-generating element is connected to one of a first heat-conducting structure and a second heat-conducting structure of the heat dissipation module.

[0023] When the heating element is connected to the first heat-conducting structure, the heat generated by the heating element can be easily and efficiently conducted to the first and second heat dissipation structures. Furthermore, the heating element is connected to an active heat-conducting component. The active heat-conducting component is less prone to complete evaporation of the medium due to the high temperature of the heating element, which would otherwise lead to a decrease in thermal conductivity and thus improve the maximum power consumption of the heating element. In addition, the heating element connected to the active heat-conducting component is less likely to cause a large-area, significant temperature rise in the active heat-conducting component, resulting in a smaller high-temperature area in the heat dissipation module and thus helping to reduce the temperature of the housing components.

[0024] In one possible implementation, when the heating element is connected to the first heat-conducting structure: along the extension direction of the first medium flow channel of the heat dissipation module, the connection point of the first heat-conducting structure to the heating element is located between the first region of the first heat-conducting structure and the output end of the first drive pump of the heat dissipation module. In this way, the medium in the first medium flow channel, after being cooled in the first region, flows to the input end of the first drive pump, resulting in a lower temperature of the medium at the first drive pump, higher driving efficiency of the first drive pump, and better sealing of the first medium circulation loop.

[0025] In one possible implementation, when the heating element is connected to the first heat-conducting structure: along the extension direction of the first medium flow channel of the heat dissipation module, the connection point of the first heat-conducting structure to the heating element is located between the second region of the first heat-conducting structure and the output end of the first drive pump of the heat dissipation module. In this way, the medium in the first medium flow channel conducts heat to the second heat-conducting structure in the second region, and then flows to the input end of the first drive pump. This results in a lower temperature of the medium at the first drive pump, leading to higher driving efficiency of the first drive pump and better sealing of the first medium circulation loop.

[0026] In one possible implementation, when the heating element is connected to the first heat-conducting structure: along the extension direction of the first medium flow channel of the heat dissipation module, the location where the first heat-conducting structure connects to the heating element is located between the second region of the first heat-conducting structure and the output end of the first drive pump of the heat dissipation module, and the second region is located between the first region and the location where the first heat-conducting structure connects to the heating element. In this way, while the medium temperature at the first drive pump is relatively low, during the heat conduction from the heating element to the first heat dissipation structure, some of the heat on the first heat-conducting structure can be conducted to the second heat-conducting structure through the second region, making the heat conduction of the first heat-conducting structure simpler and more efficient. Furthermore, the heat from the heating element is first conducted to the second region and then to the first region. The temperature in the second region is relatively high, which facilitates the transfer of some heat from the first heat-conducting structure to the second heat-conducting structure and its dissipation through the second heat dissipation structure.

[0027] In one possible implementation, when the heating element is connected to the first heat-conducting structure, the heating element is connected to the fifth region of the first heat-conducting structure. This allows for higher heat exchange efficiency between the medium in the third flow channel section and the heating element, facilitating the transfer of heat from the heating element to the first heat-conducting structure.

[0028] In one possible implementation, when the heating element is connected to the second heat-conducting structure, the third region of the second heat-conducting structure is located between the point where it connects to the heating element and the fourth region of the second heat-conducting structure. This allows some of the heat on the second heat-conducting structure to be conducted to the first heat-conducting structure through the third region during the heat conduction from the heating element to the second heat dissipation structure, making the heat conduction of the second heat-conducting structure simpler and more efficient. Furthermore, since the heat from the heating element is first conducted to the third region and then to the fourth region, the temperature in the third region is relatively high, which facilitates the transfer of some heat from the second heat-conducting structure to the first heat-conducting structure and its subsequent dissipation through the first heat dissipation structure. Attached Figure Description

[0029] Figure 1 A schematic diagram of an electronic device provided in an embodiment of this application;

[0030] Figure 2 A schematic diagram of yet another electronic device provided in an embodiment of this application;

[0031] Figure 3 This is a schematic diagram of a heat dissipation module provided in an embodiment of this application;

[0032] Figure 4 A top view schematic diagram of another heat dissipation module provided in the embodiments of this application;

[0033] Figure 5 for Figure 4 A side view of the heat dissipation module provided in the diagram;

[0034] Figure 6 A top view schematic diagram of another heat dissipation module provided in the embodiments of this application;

[0035] Figure 7 for Figure 6 A side view of the heat dissipation module provided in the diagram;

[0036] Figure 8 A top view schematic diagram of another heat dissipation module provided in the embodiments of this application;

[0037] Figure 9 A cross-sectional schematic diagram of a heat dissipation module at the second and third regions provided in an embodiment of this application;

[0038] Figure 10 A cross-sectional schematic diagram of another heat dissipation module provided in an embodiment of this application at the second and third regions.

[0039] Explanation of reference numerals in the attached figures:

[0040] 10. Housing assembly; 11. First housing; 12. Second housing; 20. Motherboard; 30. Heating element; 40. Heat dissipation module; 41. Thermally conductive component; 42. Heat dissipation structure; 42a. First heat dissipation structure; 42b. Second heat dissipation structure; 43. Fan; 43a. First fan; 43b. Second fan; 50. Display screen; 60. Thermal interface material;

[0041] 100. First heat-conducting structure; 110. First region; 120. Second region; 130. Fifth region; 140. Second connection region; 150. Third connection region;

[0042] 200, Second heat-conducting structure; 210, Third region; 220, Fourth region; 230, First connecting region; 240, Sixth region;

[0043] 300. First drive pump;

[0044] 410. First heat exchange structure; 420. Second heat exchange structure; 430. Third heat exchange structure; 440. Fourth heat exchange structure;

[0045] 510. First accommodating space; 520. Second accommodating space;

[0046] 600. Second drive pump. Detailed Implementation

[0047] The terminology used in the implementation section of this application is only for explaining specific embodiments of this application and is not intended to limit this application. The implementation of the embodiments of this application will be described in detail below with reference to the accompanying drawings.

[0048] This application provides an electronic device, which may include, but is not limited to, mobile phones, portable Android devices (PADs), laptops, personal digital assistants (PDAs), handheld devices with wireless communication capabilities, computing devices, in-vehicle devices, wearable devices, virtual reality (VR) terminal devices, augmented reality (AR) terminal devices, wireless terminals in industrial control, wireless terminals in self-driving, wireless terminals in remote medical care, wireless terminals in smart grids, wireless terminals in transportation safety, wireless terminals in smart cities, and wireless terminals in smart homes, etc. This electronic device may be a foldable device or a non-foldable device.

[0049] Figure 1 This is a schematic diagram of an electronic device provided in an embodiment of this application.

[0050] like Figure 1 As shown in the embodiment of this application, the electronic device includes a housing assembly 10, a motherboard 20, a heating element 30, and a heat dissipation module 40. The housing assembly 10 is used to enclose and form a device mounting cavity. The motherboard 20 and the heating element 30 are disposed within the device mounting cavity. The heating element 30 may be disposed on the motherboard 20 and is electrically connected to the motherboard 20. The heat dissipation module 40 may be disposed within the device mounting cavity, and the heating element 30 is connected to the heat dissipation module 40, allowing the heating element 30 to dissipate heat through the heat dissipation module 40.

[0051] For example, the heat-generating element 30 may include, but is not limited to, a central processing unit (CPU), a graphics processing unit (GPU), a data processing unit (DPU), a power supply, etc.

[0052] For example, the heat dissipation module 40 may be connected to one or more heat-generating elements 30.

[0053] In some examples, the electronic device may also include a display screen 50 disposed on the housing assembly 10, which may be electrically connected to the motherboard 20.

[0054] When the electronic device is a non-foldable device, the display screen 50 can be arranged with the housing assembly 10 to form a device mounting cavity, and the motherboard 20, the heating element 30 and the heat dissipation module 40 can be disposed in the device mounting cavity formed by the display screen 50 and the housing assembly 10.

[0055] like Figure 1 As shown, when the electronic device is a foldable device, the housing assembly 10 may include multiple housings and a pivot mechanism that rotatably connects two adjacent housings, with each housing used to enclose and form a device mounting cavity. For example, the housing assembly 10 may include a first housing 11, a second housing 12, and a pivot mechanism that rotatably connects the first housing 11 and the second housing 12. The motherboard 20, the heat-generating element 30, and the heat dissipation module 40 are disposed within the device mounting cavity enclosed by the first housing 11, and the display screen 50 may be disposed in the second housing 12.

[0056] For example, foldable devices may include, but are not limited to, foldable phones, laptops, etc.

[0057] Figure 2 This is a schematic diagram of yet another electronic device provided in an embodiment of this application.

[0058] like Figure 2 As shown, the heat dissipation module 40 may include a heat-conducting component 41 and a heat dissipation structure 42. The heat-generating element 30 is connected to the heat-conducting component 41, and the heat-conducting component 41 is connected to the heat dissipation structure 42, so that the heat-generating element 30 is connected to the heat dissipation structure 42 through the heat-conducting component 41, and the heat generated by the heat-generating element 30 can be conducted to the heat dissipation structure 42 through the heat-conducting component 41 for heat dissipation.

[0059] For example, the heating element 30 can be connected to the heat-conducting component 41 through a thermal interface material 60 (TIM) to improve the heat exchange efficiency between the heating element 30 and the heat-conducting component 41.

[0060] For example, the heat dissipation structure 42 may include, but is not limited to, a fin array, a needle fin array, a heat dissipation fin array, etc.

[0061] In some examples, the heat dissipation structure 42 can dissipate heat through natural heat dissipation.

[0062] In some examples, the heat dissipation module 40 may also include a fan 43, which drives the airflow at the heat dissipation structure 42, that is, the fan 43 is used to perform air cooling on the heat dissipation structure 42.

[0063] As electronic devices become increasingly thinner and lighter, the space available for arranging the heat dissipation module 40 along its thickness is constantly being compressed. This results in the cooling structure 42 and the fan 43 becoming smaller. The reduced size of the cooling structure 42 weakens its heat dissipation capacity. Similarly, the reduced size of the fan 43 decreases its airflow, further weakening its air-cooling effect on the cooling structure 42.

[0064] Figure 3 This is a schematic diagram of a heat dissipation module provided in an embodiment of this application.

[0065] like Figure 3 As shown, when the heat dissipation capacity of a single heat dissipation structure 42 is limited, the heat dissipation module 40 may include multiple heat dissipation structures 42 distributed at different locations. This allows the heat generated by the heat-generating element 30 to be dissipated through the multiple heat dissipation structures 42 located at different locations, thereby improving the heat dissipation capacity of the electronic device and enabling the heat dissipation module 40 to meet the heat dissipation requirements of high-power electronic devices. For example, the heat dissipation module 40 may include a first heat dissipation structure 42a and a second heat dissipation structure 42b. Both the first heat dissipation structure 42a and the second heat dissipation structure 42b are connected to the heat-conducting component 41, so that the heat-generating element 30 can be connected to the first heat dissipation structure 42a and the second heat dissipation structure 42b through the heat-conducting component 41. The heat generated by the heat-generating element 30 can be conducted to the first heat dissipation structure 42a and the second heat dissipation structure 42b through the heat-conducting component 41 for heat dissipation.

[0066] For example, the first heat dissipation structure 42a, the second heat dissipation structure 42b and the heating element 30 can be connected to the surface of the heat-conducting component 41 on the same side.

[0067] For example, at least one of the first heat dissipation structure 42a and the second heat dissipation structure 42b may be provided with a fan 43, so that the fan 43 can perform air cooling on at least one of the first heat dissipation structure 42a and the second heat dissipation structure 42b.

[0068] In some examples, a fan 43 is provided at the first heat dissipation structure 42a. The fan 43 at the first heat dissipation structure 42a is called the first fan 43a. The first fan 43a is used to drive the airflow at the first heat dissipation structure 42a to achieve air cooling of the first heat dissipation structure 42a. The second heat dissipation structure 42b may not have a fan 43, and the second heat dissipation structure 42b can dissipate heat naturally.

[0069] In some examples, a fan 43 is provided at the second heat dissipation structure 42b. The fan 43 at the second heat dissipation structure 42b is called the second fan 43b. The second fan 43b is used to drive the airflow at the second heat dissipation structure 42b to achieve air cooling of the second heat dissipation structure 42b. The first heat dissipation structure 42a may not have a fan 43, and the first heat dissipation structure 42a can dissipate heat naturally.

[0070] In some examples, a fan 43 is provided at both the first heat dissipation structure 42a and the second heat dissipation structure 42b. The fan 43 provided at the first heat dissipation structure 42a is the first fan 43a, which is used to drive the airflow at the first heat dissipation structure 42a to achieve air cooling of the first heat dissipation structure 42a. The fan 43 provided at the second heat dissipation structure 42b is the second fan 43b, which is used to drive the airflow at the second heat dissipation structure 42b to achieve air cooling of the second heat dissipation structure 42b.

[0071] In some related technologies, the heat-conducting component can be a passive heat-conducting structure such as a heat pipe or a vapor chamber (VC). Multiple heat dissipation structures located at different positions are connected to the heat-generating element through a single passive heat-conducting structure. In this type of solution, when the temperature of the heat-generating element is high, the flow rate of the medium within the passive heat-conducting structure is relatively fast. This fast flow rate leads to a large flow resistance within the passive heat-conducting structure, making it difficult for the heat generated by the heat-generating element to be efficiently conducted to the multiple heat dissipation structures located at different positions. Consequently, this type of solution is difficult to meet the heat dissipation requirements of high-power electronic devices. Furthermore, when the thickness of the electronic device is small, the size of the passive heat-conducting structure in the thickness direction of the electronic device is small, which further increases the flow resistance within the passive heat-conducting structure, further increasing the difficulty of conducting the heat generated by the heat-generating element to the multiple heat dissipation structures located at different positions.

[0072] To meet the heat dissipation requirements of high-power electronic devices, in some related technologies, the heat-conducting component can be an active heat-conducting component. In this case, the heat-conducting component can include a heat-conducting structure for forming a medium flow channel and a drive pump for driving the medium to circulate within the medium flow channel. Multiple heat dissipation structures located at different positions are connected to the heat-generating element through the heat-conducting structure. The parts of the heat-conducting structure connecting the heat dissipation structures at different positions can be connected in series or in parallel. When the parts of the heat-conducting structure connecting the heat dissipation structures at different positions are connected in series, the heat conduction path of the heat-conducting structure is relatively long, and the efficiency of heat transfer from the heat-generating element to the heat dissipation structure is relatively low. When the parts of the heat-conducting structure connecting the heat dissipation structures at different positions are connected in parallel, it is necessary to distribute the flow rate at different positions within the medium flow channel, which makes the structure within the medium flow channel more complex and the control of the flow rate distribution within the medium flow channel more complex.

[0073] Figure 4 This is a top view schematic diagram of another heat dissipation module provided in an embodiment of this application. Figure 5 for Figure 4 The diagram shows a side view of the heat dissipation module. In the diagram, the direction indicated by the dashed arrows represents the flow direction of the medium within the first medium circulation loop.

[0074] like Figure 4 , Figure 5 As shown, based on this, in this embodiment of the application, the heat-conducting component 41 includes a first heat-conducting structure 100 and a first driving pump 300. The first heat-conducting structure 100 is used to enclose and form a first medium flow channel. The two ends of the first medium flow channel are respectively connected to the input end and the output end of the first driving pump 300. The first medium flow channel and the first driving pump 300 are used to form a first medium circulation loop. That is, the first heat-conducting structure 100 and the first driving pump 300 form an active heat-conducting component. Here, an active heat-conducting component refers to a component that needs to rely on external energy to achieve heat transfer. For example, the external energy can be electrical energy. The first driving pump 300 can be driven by external electrical energy to make the medium circulate in the first medium circulation loop. The first heat-conducting structure 100 achieves heat transfer through the medium circulating in the first medium circulation loop.

[0075] The first heat-conducting structure 100 includes a first region 110 and a second region 120. The first region 110 and the second region 120 are arranged along the extension direction of the first medium flow channel. The first heat dissipation structure 42a is disposed in the first region 110 and on the outer wall of the first region 110.

[0076] The heat-conducting component 41 also includes a second heat-conducting structure 200, which includes a third region 210 and a fourth region 220. The third region 210 overlaps with the second region 120 and is connected to the second region 120. The second heat dissipation structure 42b is disposed in the fourth region 220 and is disposed on the outer wall of the fourth region 220.

[0077] The heating element 30 is connected to one of the first heat-conducting structure 100 and the second heat-conducting structure 200.

[0078] In this way, the first heat-conducting structure 100 and the first heat-dissipating structure 42a form one heat dissipation path, and the second heat-conducting structure 200 and the second heat-dissipating structure 42b form another heat dissipation path. Through the stacked third region 210 and the second region 120, heat can be conducted between the first heat-conducting structure 100 and the second heat-conducting structure 200, allowing the heat generated by the heating element 30 to be dissipated through the first heat-dissipating structure 42a and the second heat-dissipating structure 42b. At this time, the heat generated by the heating element 30 can be distributed on the first heat-conducting structure 100 and the second heat-conducting structure 200, resulting in relatively low temperatures on both the first heat-conducting structure 100 and the second heat-conducting structure 200, which is beneficial for meeting the heat dissipation requirements of high-power electronic devices. In addition, by conducting the heat generated by the heating element 30 to the first heat-dissipating structure 42a and the second heat-dissipating structure 42b through the first heat-conducting structure 100 and the second heat-conducting structure 200, respectively, the heat conduction paths of the first heat-conducting structure 100 and the second heat-conducting structure 200 are relatively short, and the heat conduction between the heating element 30 and the first heat-dissipating structure 42a and the second heat-dissipating structure 42b is highly efficient. In addition, it is not necessary to make the medium in the same heat dissipation path flow to the first heat dissipation structure 42a and the second heat dissipation structure 42b respectively, there is no need to set up a structure for distributing the flow of the medium, nor is it necessary to control the flow of the medium. It is relatively simple to efficiently conduct the heat generated by the heating element 30 to the first heat dissipation structure 42a and the second heat dissipation structure 42b.

[0079] Driven by the first drive pump 300, the heat generated by the heating element 30 can be quickly conducted to the first heat dissipation structure 42a through the medium for heat dissipation. The temperature difference between the first heat dissipation structure 42a and the heating element 30, as well as the temperature difference between the first heat dissipation structure 42a and the second heat conduction structure 200, are small, which facilitates efficient heat dissipation through the first heat dissipation structure 42a and the second heat dissipation structure 42b.

[0080] For example, the third region 210 overlaps with the second region 120 along the thickness direction of the electronic device.

[0081] For example, the second region 120 and the third region 210 are arranged offset from the heating element 30 and the fan 43 on a plane perpendicular to the thickness direction of the electronic device.

[0082] For example, the first heat-conducting structure 100 may be a liquid cooling plate.

[0083] In some possible implementations, along the extension direction of the first medium flow channel, the second region 120 is located between the first region 110 and the output end of the first drive pump 300.

[0084] In this way, the medium in the first medium flow channel dissipates heat in the first region 110 before flowing to the input end of the first drive pump 300, which keeps the temperature of the medium at the first drive pump 300 low, resulting in higher driving efficiency of the first drive pump 300. Furthermore, the lower temperature of the medium at the first drive pump 300 also reduces the likelihood of leakage at the connection between the first drive pump 300 and the first heat-conducting structure 100, thus improving the sealing performance of the first medium circulation loop.

[0085] In some possible implementations, the first medium flow channel includes a first flow channel segment located in the first region 110, and the inner wall of the flow channel segment is provided with a first heat exchange structure 410.

[0086] This allows for higher heat exchange efficiency between the medium in the first flow channel section and the first heat dissipation structure 42a, and also ensures that the medium in the first flow channel section dissipates heat efficiently through the first heat dissipation structure 42a.

[0087] For example, the first heat exchange structure 410 is used to increase the heat exchange surface between the flow channel wall of the first flow channel section and the medium in the first flow channel section, so as to improve the heat exchange efficiency between the medium in the first flow channel section and the first heat dissipation structure 42a. For example, the first heat exchange structure 410 may include, but is not limited to, a fin array, a heat-conducting pillar array, a heat-conducting block array, a heat-conducting rib array, etc.

[0088] In some possible implementations, the first medium flow channel includes a second flow channel section located in the second region 120, and the inner wall of the flow channel section is provided with a second heat exchange structure 420.

[0089] In this way, the heat exchange efficiency between the medium in the second flow channel section and the second heat-conducting structure 200 is relatively high, which is conducive to the conduction of heat between the first heat-conducting structure 100 and the second heat-conducting structure 200, and further facilitates the heat dissipation of the heat-generating element 30 through the first heat dissipation structure 42a and the second heat dissipation structure 42b.

[0090] For example, the second heat exchange structure 420 is used to increase the heat exchange surface between the flow channel wall of the second flow channel section and the medium in the second flow channel section, so as to improve the heat exchange efficiency between the medium in the second flow channel section and the second heat-conducting structure 200. For example, the second heat exchange structure 420 may include, but is not limited to, a fin array, a heat-conducting pillar array, a heat-conducting block array, a heat-conducting rib array, etc.

[0091] In some possible implementations, the second heat-conducting structure 200 is a passive heat-conducting structure.

[0092] This reduces the number of drive pumps in the heat dissipation module 40, which helps reduce vibration during operation and improves its reliability. Furthermore, the reduced number of drive pumps also helps lower the energy consumption of the heat dissipation module 40.

[0093] A passive heat-conducting structure refers to a structure that transfers heat solely through the thermal conductivity of the material or structure itself, without relying on external energy sources. Examples of passive heat-conducting structures include, but are not limited to, heat pipes and vapor chambers.

[0094] In some examples, the heating element 30 is connected to the second heat-conducting structure 200. The heat generated by the heating element 30 is first conducted to the second heat-conducting structure 200. Part of the heat on the second heat-conducting structure 200 can be conducted to the second heat dissipation structure 42b for heat dissipation, and part of it can be conducted to the first heat-conducting structure 100 through the third region 210.

[0095] In the example where the heating element 30 is connected to the second heat-conducting structure 200, the second heat-conducting structure 200 further includes a sixth region 240, to which the heating element 30 is connected.

[0096] In the example where the heating element 30 is connected to the second heat-conducting structure 200, and the second heat-conducting structure 200 is a passive heat-conducting structure, when the power consumption of the heating element 30 is low, the first drive pump 300 can be left unactivated or operate at low power. The second heat dissipation structure 42b connected to the second heat-conducting structure 200 is primarily used to dissipate heat from the heating element 30. This improves the reliability of the heat dissipation module 40 and reduces its energy consumption. When the power consumption of the heating element 30 is high, the first drive pump 300 can be activated. A portion of the heat conducted from the heating element 30 to the second heat-conducting structure 200 can be carried by the flowing medium within the first heat-conducting structure 100 to the first heat dissipation structure 42a for cooling, and a portion of the heat conducted from the heating element 30 to the second heat-conducting structure 200 can be conducted to the second heat dissipation structure 42b for cooling, thus meeting the heat dissipation requirements of the heating element 30 at high power consumption. When the power consumption of the heating element 30 is high, the first heat-conducting structure 100 carries away some of the heat from the second heat-conducting structure 200, making it less likely that the high-temperature heating element 30 will cause the temperature of the second heat-conducting structure 200 to be high. At this time, even if the second heat-conducting structure 200 is a passive heat-conducting structure, the medium inside the second heat-conducting structure 200 is less likely to fail to flow to the second heat dissipation structure 42b due to the high temperature of the second heat-conducting structure 200. This allows some heat to be conducted to the second heat dissipation structure 42b through the second heat-conducting structure 200 and to the first heat dissipation structure 42a through the second heat-conducting structure 200 and the first heat-conducting structure 100 when the power consumption of the heating element 30 is high.

[0097] In some examples where the heating element 30 is connected to the second heat-conducting structure 200, the third region 210 of the second heat-conducting structure 200 is located between the point where the heating element 30 is connected to the second heat-conducting structure 200 and the fourth region 220 of the second heat-conducting structure 200. That is, the third region 210 is located between the sixth region 240 and the fourth region 220. In this way, during the heat conduction from the heating element 30 to the second heat dissipation structure 42b, some of the heat on the second heat-conducting structure 200 can be conducted to the first heat-conducting structure 100 through the third region 210, making the heat conduction of the second heat-conducting structure 200 simpler and more efficient. In addition, the heat from the heating element 30 is first conducted to the third region 210 and then to the fourth region 220. The temperature at the third region 210 is relatively high, which is conducive to conducting some of the heat on the second heat-conducting structure 200 to the first heat-conducting structure 100 and dissipating it through the first heat dissipation structure 42a.

[0098] For example, the fourth region 220 and the sixth region 240 are located at opposite ends of the second heat-conducting structure 200 in the extending direction of the second heat-conducting structure 200.

[0099] In some examples where the heating element 30 is connected to the second heat-conducting structure 200, the first heat-conducting structure 100 further includes a second connecting region 140. The two ends of the second connecting region 140 are spaced apart in the overlapping direction of the third region 210 and the second region 120. The first region 110 and the second region 120 are staggered in the overlapping direction of the third region 210 and the second region 120, and are connected through the second connecting region 140, forming a second accommodating space 520 between the second region 120 and the second connecting region 140. At least a portion of the third region 210 is located within the second accommodating space 520, and the first heat dissipation structure 42a and the third region 210 are located on opposite sides of the first heat-conducting structure 100 in the overlapping direction of the third region 210 and the second region 120, respectively.

[0100] In this way, when the heating element 30 is connected to the second heat-conducting structure 200, the positions of the first region 110 and the fourth region 220 can overlap in the overlapping direction of the third region 210 and the second region 120. This is beneficial to make the size of the heat dissipation module 40 smaller in the overlapping direction of the third region 210 and the second region 120, while making the size of the first heat dissipation structure 42a larger in the overlapping direction of the third region 210 and the second region 120.

[0101] For example, the second heat dissipation structure 42b and the second region 120 are located on the same side of the second heat conduction structure 200 in the overlapping direction of the third region 210 and the second region 120.

[0102] For example, the heating element 30 and the second region 120 are located on the same side of the second thermally conductive structure 200 in the overlapping direction of the third region 210 and the second region 120.

[0103] For example, the first heat-conducting structure 100 further includes a third connecting region 150, the two ends of the third connecting region 150 being spaced apart in the overlapping direction of the third region 210 and the second region 120, the second region 120 being connected to the output end of the first drive pump 300 through the third connecting region 150, and a second accommodating space 520 being formed between the second region 120, the second connecting region 140 and the third connecting region 150.

[0104] In this way, by setting the third connection area 150, the portion of the first heat-conducting structure 100 connected to the output end of the first drive pump 300 can be raised, so as to form a clearance space for avoiding other components at the portion of the first heat-conducting structure 100 connected to the output end of the first drive pump 300.

[0105] In some examples, the heating element 30 is connected to the first heat-conducting structure 100. The heat generated by the heating element 30 is first conducted to the first heat-conducting structure 100. Part of the heat on the first heat-conducting structure 100 is conducted to the first heat dissipation structure 42a for heat dissipation, and part of it can be conducted to the second heat-conducting structure 200 through the second region 120.

[0106] In this way, the heating element 30 is connected to the active heat-conducting component, which is less likely to experience complete evaporation of the medium due to the high temperature of the heating element 30, thus reducing its thermal conductivity and improving the maximum power consumption of the heating element 30. Furthermore, the heating element 30 connected to the active heat-conducting component is less likely to cause a large-area, significant temperature rise in the component, resulting in a smaller high-temperature area in the heat dissipation module 40, which helps to reduce the temperature of the housing assembly 10.

[0107] Figure 6 This is a top view schematic diagram of another heat dissipation module provided in an embodiment of this application. Figure 7 for Figure 6 The diagram shows a side view of the heat dissipation module provided in the image.

[0108] like Figure 6 , Figure 7 As shown, in some examples where the heating element 30 is connected to the first heat-conducting structure 100, along the extension direction of the first medium flow channel of the heat dissipation module 40, the connection point of the first heat-conducting structure 100 to the heating element 30 is located between the first region 110 of the first heat-conducting structure 100 and the output end of the first drive pump 300 of the heat dissipation module 40. In this way, the medium in the first medium flow channel flows to the input end of the first drive pump 300 after heat dissipation in the first region 110, resulting in a lower temperature of the medium at the first drive pump 300, higher driving efficiency of the first drive pump 300, and better sealing of the first medium circulation loop.

[0109] In some examples where the heating element 30 is connected to the first heat-conducting structure 100, along the extension direction of the first medium flow channel of the heat dissipation module 40, the connection point of the first heat-conducting structure 100 to the heating element 30 is located between the second region 120 of the first heat-conducting structure 100 and the output end of the first drive pump 300 of the heat dissipation module 40. In this way, the medium in the first medium flow channel conducts heat to the second heat-conducting structure 200 in the second region 120, and then flows to the input end of the first drive pump 300. This results in a lower temperature of the medium at the first drive pump 300, leading to higher driving efficiency of the first drive pump 300 and better sealing of the first medium circulation loop.

[0110] In some examples where the heating element 30 is connected to the first heat-conducting structure 100, along the extension direction of the first medium flow channel of the heat dissipation module 40, the connection point of the first heat-conducting structure 100 to the heating element 30 is located between the second region 120 of the first heat-conducting structure 100 and the output end of the first drive pump 300 of the heat dissipation module 40. The second region 120 is located between the first region 110 and the connection point of the first heat-conducting structure 100 to the heating element 30. Thus, while the medium temperature at the first drive pump 300 is relatively low, during the heat conduction from the heating element 30 to the first heat dissipation structure 42a, some of the heat on the first heat-conducting structure 100 can be conducted to the second heat-conducting structure 200 through the second region 120, making the heat conduction of the first heat-conducting structure 100 simple and efficient. Furthermore, the heat from the heating element 30 is first conducted to the second region 120 and then to the first region 110. The temperature at the second region 120 is relatively high, which facilitates the conduction of some of the heat on the first heat-conducting structure 100 to the second heat-conducting structure 200 and dissipation through the second heat dissipation structure 42b.

[0111] In some examples where the heating element 30 is connected to the first heat-conducting structure 100, the first heat-conducting structure 100 further includes a fifth region 130. The first region 110, the second region 120, and the fifth region 130 are arranged along the extension direction of the first medium flow channel. The first medium flow channel includes a third flow channel section located in the fifth region 130. The inner wall of the flow channel section is provided with a third heat exchange structure 430. The heating element 30 is connected to the fifth region 130 of the first heat-conducting structure 100.

[0112] This allows for higher heat exchange efficiency between the medium in the third flow channel section and the heating element 30, which is beneficial for the heating element 30 to conduct heat to the first heat-conducting structure 100.

[0113] For example, the third heat exchange structure 430 is used to increase the heat exchange surface between the flow channel wall of the third flow channel section and the medium in the third flow channel section, so as to improve the heat exchange efficiency between the medium in the third flow channel section and the heating element 30. For example, the third heat exchange structure 430 may include, but is not limited to, a fin array, a heat-conducting pillar array, a heat-conducting block array, a heat-conducting rib array, etc.

[0114] For example, along the extension direction of the first medium flow channel, the fifth region 130 is located between the first region 110 and the output end of the first drive pump 300.

[0115] For example, along the extension direction of the first medium flow channel, the fifth region 130 is located between the second region 120 and the output end of the first drive pump 300.

[0116] For example, along the extension direction of the first medium flow channel, the fifth region 130 is located between the second region 120 and the output end of the first drive pump 300, and the second region 120 is located between the fifth region 130 and the first region 110.

[0117] In some possible implementations, the second heat-conducting structure 200 further includes a first connecting region 230. The two ends of the first connecting region 230 are spaced apart in the overlapping direction of the third region 210 and the second region 120. The third region 210 and the fourth region 220 are staggered in the overlapping direction of the third region 210 and the second region 120, and are connected through the first connecting region 230, forming a first accommodating space 510 between the third region 210 and the first connecting region 230. At least a portion of the second region 120 is located within the first accommodating space 510, and the second heat dissipation structure 42b and the second region 120 are respectively located on both sides of the second heat-conducting structure 200 in the overlapping direction of the third region 210 and the second region 120.

[0118] In this way, when the heating element 30 is connected to the first heat-conducting structure 100, the positions of the first region 110 and the fourth region 220 can overlap in the overlapping direction of the third region 210 and the second region 120. This is beneficial to make the size of the heat dissipation module 40 smaller in the overlapping direction of the third region 210 and the second region 120, while making the size of the second heat dissipation structure 42b larger in the overlapping direction of the third region 210 and the second region 120.

[0119] For example, the first heat dissipation structure 42a and the third region 210 are located on the same side of the first heat conduction structure 100 in the overlapping direction of the third region 210 and the second region 120.

[0120] For example, the heating element 30 and the third region 210 are located on the same side of the first heat-conducting structure 100 in the overlapping direction of the third region 210 and the second region 120.

[0121] Figure 8 This is a top view schematic diagram of another heat dissipation module provided in an embodiment of this application.

[0122] like Figure 8 As shown, in some possible embodiments, the heat dissipation module 40 further includes a second drive pump 600, and a second heat-conducting structure 200 is used to form a second medium flow channel. The two ends of the second medium flow channel are respectively connected to the input end and the output end of the second drive pump 600. The second medium flow channel and the second drive pump 600 form a second medium circulation loop. That is, the second heat-conducting structure 200 and the second drive pump 600 form an active heat-conducting component.

[0123] In this way, the flow rate of the medium in the first and second medium channels can be controlled by controlling the first drive pump 300 and the second drive pump 600, thereby distributing the heat dissipated through the first heat dissipation structure 42a and the second heat dissipation structure 42b. Furthermore, the active heat-conducting component has high thermal conductivity, and the heat-generating element 30 transfers heat to the first heat dissipation structure 42a and the second heat dissipation structure 42b efficiently through the first heat-conducting structure 100 and the second heat-conducting structure 200, resulting in high heat dissipation efficiency of the heat dissipation module 40. In addition, the overall temperature of the active heat-conducting component is lower, which reduces the high-temperature area of ​​the heat dissipation module 40, thus helping to lower the temperature of the housing assembly 10.

[0124] In some examples, the heat dissipation module 40 also includes a second drive pump 600. The inner wall of the channel wall of the portion of the second medium channel located in the fourth region 220 may be provided with a fourth heat exchange structure 440, and the inner wall of the channel wall of the portion of the second medium channel located in the third region 210 may be provided with a fifth heat exchange structure. The heating element 30 may be connected to the first heat conduction structure 100 or the second heat conduction structure 200.

[0125] Figure 9 This is a cross-sectional schematic diagram of a heat dissipation module provided in an embodiment of this application at the second and third regions.

[0126] In some possible implementations, the third region 210 forms part of the flow channel wall of the first medium flow channel. Specifically, the third region 210 forms part of the flow channel wall of the second flow channel segment.

[0127] This allows the third region 210 and the second region 120 to have smaller dimensions in the overlapping direction, which is beneficial for arranging the heat dissipation module 40 in a thinner electronic device.

[0128] For example, the second region 120 and the third region 210 enclose a second flow channel segment.

[0129] In some examples where the third region 210 forms part of the flow channel wall of the first medium flow channel, the second heat exchange structure 420 can be provided in the third region 210, so that the heat exchange efficiency between the medium in the second flow channel section and the third region 210 is high.

[0130] Figure 10 A cross-sectional schematic diagram of another heat dissipation module provided in an embodiment of this application at the second and third regions.

[0131] In some other possible implementations, the channel wall of the first medium flow channel is formed by the first heat-conducting structure 100, the third region 210 is located outside the first medium flow channel, the third region 210 is connected to the outer wall of the second region 120, and the second heat exchange structure 420 is disposed in the second region 120.

[0132] In some possible implementations, the heat dissipation module 40 may further include a third heat-conducting structure and a third heat dissipation structure. A portion of the third heat-conducting structure may overlap with and be connected to a portion of the first heat-conducting structure 100 or the second heat-conducting structure 200, so that the heat from the first heat-conducting structure 100 or the second heat-conducting structure 200 can be conducted to the third heat-conducting structure. The third heat dissipation structure is disposed on the third heat-conducting structure, so that the heat-generating element 30 can dissipate heat through the first heat dissipation structure 42a, the second heat dissipation structure 42b and the third heat dissipation structure.

[0133] For example, the third heat-conducting structure can be a passive heat-conducting structure, and a portion of the third heat-conducting structure overlaps with and is connected to a portion of the first heat-conducting structure 100.

[0134] The devices or elements referred to in the embodiments of this application or implied herein must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as limiting the embodiments of this application. In the description of the embodiments of this application, "a plurality of" means two or more, unless otherwise precisely specified.

[0135] The terms "first," "second," "third," "fourth," etc. (if present) in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that embodiments of the present application described herein can be implemented, for example, in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0136] The term "multiple" in this article refers to two or more. The term "and / or" in this article is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A alone, A and B simultaneously, or B alone. Furthermore, the character " / " in this article generally indicates an "or" relationship between the preceding and following related objects; in formulas, the character " / " indicates a "division" relationship between the preceding and following related objects.

[0137] It is understood that the various numerical designations used in the embodiments of this application are merely for descriptive convenience and are not intended to limit the scope of the embodiments of this application.

[0138] It is understood that, in the embodiments of this application, the order of the above-mentioned process numbers does not imply the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of this application.

Claims

1. A heat dissipation module (40), characterized in that, It includes a first heat-conducting structure (100), a second heat-conducting structure (200), a first heat dissipation structure (42a), a second heat dissipation structure (42b), and a first drive pump (300). The first heat-conducting structure (100) is used to enclose and form a first medium flow channel, and the two ends of the first medium flow channel are respectively connected to the input end of the first drive pump (300) and the output end of the first drive pump (300); The first heat-conducting structure (100) includes a first region (110) and a second region (120), the first region (110) and the second region (120) are arranged along the extension direction of the first medium flow channel, and the first heat dissipation structure (42a) is disposed in the first region (110). The second heat-conducting structure (200) includes a third region (210) and a fourth region (220). The third region (210) overlaps with the second region (120) and is connected to the second region (120). The second heat dissipation structure (42b) is located in the fourth region (220).

2. The heat dissipation module (40) according to claim 1, characterized in that, Along the extension direction of the first medium flow channel, the second region (120) is located between the first region (110) and the output end of the first drive pump (300).

3. The heat dissipation module (40) according to claim 1 or 2, characterized in that, The first medium flow channel includes a first flow channel section located in the first region (110), and the inner wall of the flow channel section is provided with a first heat exchange structure (410).

4. The heat dissipation module (40) according to any one of claims 1-3, characterized in that, The first medium flow channel includes a second flow channel section located in the second region (120), and the inner wall of the flow channel section is provided with a second heat exchange structure (420).

5. The heat dissipation module (40) according to any one of claims 1-4, characterized in that, The first heat-conducting structure (100) further includes a fifth region (130), wherein the first region (110), the second region (120) and the fifth region (130) are arranged along the extension direction of the first medium flow channel; The first medium flow channel includes a third flow channel section located in the fifth region (130), and the inner wall of the flow channel section is provided with a third heat exchange structure (430).

6. The heat dissipation module (40) according to claim 5, characterized in that, Along the extension direction of the first medium flow channel, the fifth region (130) is located between the first region (110) and the output end of the first drive pump (300).

7. The heat dissipation module (40) according to claim 5 or 6, characterized in that, Along the extension direction of the first medium flow channel, the fifth region (130) is located between the second region (120) and the output end of the first drive pump (300).

8. The heat dissipation module (40) according to any one of claims 5-7, characterized in that, The second heat-conducting structure (200) also includes a first connection region (230); The two ends of the first connecting region (230) are spaced apart in the overlapping direction of the third region (210) and the second region (120). The third region (210) and the fourth region (220) are staggered in the overlapping direction of the third region (210) and the second region (120). The third region (210) and the fourth region (220) are connected through the first connecting region (230). A first accommodating space (510) is formed between the third region (210) and the first connecting region (230). At least a portion of the second region (120) is located within the first accommodating space (510), and the second heat dissipation structure (42b) and the second region (120) are located on both sides of the second heat conduction structure (200) in the overlapping direction of the third region (210) and the second region (120).

9. The heat dissipation module (40) according to any one of claims 1-4, characterized in that, The first heat-conducting structure (100) further includes a second connection region (140). The two ends of the second connecting region (140) are spaced apart in the overlapping direction of the third region (210) and the second region (120). The first region (110) and the second region (120) are staggered in the overlapping direction of the third region (210) and the second region (120). The first region (110) and the second region (120) are connected through the second connecting region (140). A second accommodating space (520) is formed between the second region (120) and the second connecting region (140). At least a portion of the third region (210) is located within the second accommodating space (520), and the first heat dissipation structure (42a) and the third region (210) are located on opposite sides of the first heat-conducting structure (100) in the overlapping direction of the third region (210) and the second region (120).

10. The heat dissipation module (40) according to any one of claims 1-9, characterized in that, The third region (210) forms part of the channel wall of the first medium channel.

11. The heat dissipation module (40) according to any one of claims 1-10, characterized in that, The second heat-conducting structure (200) is a passive heat-conducting structure.

12. The heat dissipation module (40) according to any one of claims 1-10, characterized in that, It also includes a second drive pump (600); The second heat-conducting structure (200) is used to enclose and form a second medium flow channel, the two ends of which are respectively connected to the input end of the second drive pump (600) and the output end of the second drive pump (600).

13. An electronic device, characterized in that, It includes a heat-generating element (30) and a heat dissipation module (40) as described in any one of claims 1-12. The heating element (30) is connected to one of the first heat-conducting structure (100) and the second heat-conducting structure (200) of the heat dissipation module (40).

14. The electronic device according to claim 13, characterized in that, When the heating element (30) is connected to the first heat-conducting structure (100): along the extension direction of the first medium flow channel of the heat dissipation module (40), the first heat-conducting structure (100) is located between the first region (110) of the first heat-conducting structure (100) and the output end of the first drive pump (300) of the heat dissipation module (40) when the heating element (30) is connected to the first heat-conducting structure (100).

15. The electronic device according to claim 13 or 14, characterized in that, When the heating element (30) is connected to the first heat-conducting structure (100): along the extension direction of the first medium flow channel of the heat dissipation module (40), the first heat-conducting structure (100) is located between the second region (120) of the first heat-conducting structure (100) and the output end of the first drive pump (300) of the heat dissipation module (40) at the point where the heating element (30) is connected.

16. The electronic device according to any one of claims 13-15, characterized in that, When the heating element (30) is connected to the first heat-conducting structure (100): the heating element (30) is connected to the fifth region (130) of the first heat-conducting structure (100).

17. The electronic device according to claim 13, characterized in that, When the heating element (30) is connected to the second heat-conducting structure (200): the third region (210) of the second heat-conducting structure (200) is located between the second heat-conducting structure (200) where the heating element (30) is connected and the fourth region (220) of the second heat-conducting structure (200).

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