inverter

Abstract

The application discloses an inverter, belonging to the field of photovoltaic systems. The inverter comprises a bottom shell, a surface shell, a cover plate, a circuit board, a PV connector and a power conversion circuit. The bottom shell and the surface shell enclose to form a first chamber, and the surface of the bottom shell away from the surface shell is provided with first heat dissipation fins; the cover plate is located in the first chamber and encloses with the bottom shell to form a second chamber, and the surface of the cover plate away from the bottom shell is provided with second heat dissipation fins; the circuit board is fixed in the second chamber; one end of the PV connector is located in the second chamber and electrically connected with the circuit board, and the other end of the PV connector penetrates through the side wall of the bottom shell and is used for connecting a photovoltaic module; the power conversion circuit comprises a switching tube, which is fixed on the circuit board and located in the second chamber, and the switching tube is in abutment with one of the bottom shell and the cover plate. The inverter is based on a larger heat dissipation area, significantly enhances the heat dissipation efficiency, especially the heat dissipation efficiency of the switching tube, so that it can match a higher heat generation, and is suitable for the miniaturization and high density development of the inverter.

Description

Technical Field

[0001] This disclosure relates to the field of photovoltaic systems, and in particular to inverters. Background Technology

[0002] Inverters, as power conversion devices, can convert direct current (DC) to alternating current (AC) and are commonly used in photovoltaic (PV) or wind power generation systems. To ensure reliable operation, inverters require heat dissipation design.

[0003] In related technologies, inverters include a bottom shell and a top shell. Switching transistors, power inductors, and other devices are fixed to a circuit board and are housed inside a cavity formed by the bottom shell and the top shell. Heat dissipation fins are provided on the surface of the bottom shell away from the top shell, which dissipate heat from the cavity to the outside.

[0004] However, as inverters develop towards miniaturization and high density, the heat generated by their switching transistors, power inductors and other components also increases. Currently, the heat dissipation capacity of inverters is difficult to match their high heat generation, making it impossible for the heat of inverters to be dissipated in a timely and effective manner, thus increasing the probability of them being damaged due to high temperature. Summary of the Invention

[0005] This disclosure provides an inverter that can solve the technical problem in the related art that the heat dissipation capacity of the inverter is difficult to match its high heat generation. Specifically, the technical solution is as follows.

[0006] An inverter includes: a bottom shell, a front shell, a cover plate, a circuit board, a PV connector, and a power conversion circuit. The bottom shell and the front shell enclose a first chamber, and the surface of the bottom shell facing away from the front shell has first heat dissipation fins. The cover plate is located within the first chamber and, together with the bottom shell, encloses a second chamber, and the surface of the cover plate facing away from the bottom shell has second heat dissipation fins. The circuit board is fixed within the second chamber. One end of the PV connector is located within the second chamber and electrically connected to the circuit board, and the other end of the PV connector penetrates the side wall of the bottom shell and is used to connect a photovoltaic module. The power conversion circuit is used to convert direct current (DC) from the photovoltaic module into alternating current (AC). The power conversion circuit includes a switching transistor, which is fixed to the circuit board and located within the second chamber, and the switching transistor abuts against one of the bottom shell and the cover plate.

[0007] The inverter provided in this embodiment features a cover plate within a first cavity formed by a bottom shell and a top shell. The surface of the cover plate facing away from the bottom shell has second heat dissipation fins, and the surface of the bottom shell facing away from the top shell has first heat dissipation fins. This double-sided heat dissipation design increases the heat dissipation area. Furthermore, the cover plate and bottom shell together form a second cavity. On one hand, the connection between the cover plate and bottom shell facilitates thermal conductivity between the first and second heat dissipation fins, enhancing the heat dissipation efficiency for the circuit board and its components due to the larger heat dissipation area. On the other hand, the circuit board with fixedly connected components is located within the second cavity between the cover plate and the bottom shell. Specifically, the circuit board with fixedly connected components is situated within the receiving space between the double-sided heat dissipation fins. This includes a high-heat-generating switching transistor located in the second cavity and in contact with one of the bottom shell and the cover plate. The heat from the switching transistor can be transferred to either the first or second heat dissipation fins through the bottom shell and the cover plate, thereby effectively utilizing the inverter's larger heat dissipation area to achieve rapid heat dissipation of the switching transistor. As can be seen, the inverter provided in this disclosure, based on a larger heat dissipation area, not only achieves stronger heat dissipation efficiency but also facilitates a more uniform temperature distribution within the inverter, reducing localized overheating and significantly improving the inverter's operational stability and reliability. The heat dissipation scheme of the inverter involved in this disclosure, with its strong heat dissipation capacity, can handle higher heat generation, ensuring that the heat generated by the inverter during operation is dissipated in a timely and effective manner. This has strong adaptability to the miniaturization and high-density development of inverters.

[0008] In some possible implementations, the inverter includes a heat-conducting pillar located on at least one of the side of the bottom housing facing the circuit board and the side of the cover plate facing the circuit board, the heat-conducting pillar being used to thermally connect the circuit board to at least one of the bottom housing and the cover plate.

[0009] By further providing heat-conducting pillars on at least one of the sides of the bottom shell facing the circuit board and the side of the cover plate facing the circuit board, the heat-conducting pillars are used to thermally connect the circuit board to at least one of the bottom shell and the cover plate, thereby shortening the heat transfer path between the circuit board and the first heat dissipation fins of the bottom shell and the second heat dissipation fins of the cover plate. Thus, when the devices on the circuit board generate heat during operation, the heat can be transferred to at least one of the bottom shell and the cover plate in a timely manner through the heat-conducting pillars, thereby enhancing heat dissipation efficiency. In particular, when heat-conducting pillars are simultaneously provided on both the side of the bottom shell facing the circuit board and the side of the cover plate facing the circuit board, thermal connection between the first heat dissipation fins and the second heat dissipation fins can be achieved based on the heat-conducting pillars on both sides of the circuit board, which is more beneficial for reducing the thermal resistance of the inverter. In summary, the heat dissipation scheme for the inverter involved in the embodiments of this disclosure has a strong heat dissipation capacity, enabling it to match higher heat generation and ensuring that the heat generated by the inverter during operation is dissipated in a timely and effective manner. This has strong adaptability to the miniaturization and high-density development of inverters.

[0010] In some possible implementations, the heat-conducting pillars include: a first heat-conducting pillar and a second heat-conducting pillar distributed along a direction perpendicular to the circuit board; the first heat-conducting pillar is located on the side of the bottom shell facing the circuit board, and the second heat-conducting pillar is located on the side of the cover plate facing the circuit board, with both the first heat-conducting pillar and the second heat-conducting pillar abutting against the circuit board.

[0011] The first and second heat-conducting pillars abut against both sides of the circuit board. The first pillar thermally connects the circuit board to the bottom shell, while the second pillar thermally connects the circuit board to the cover plate. Thus, the bottom shell and cover plate are indirectly thermally connected via the circuit board, providing a direct and efficient path for heat transfer to the circuit board and its components. Heat can then be rapidly transferred to the connected bottom shell and cover plate via the first and second heat-conducting pillars. The first heat dissipation fins quickly dissipate the heat absorbed by the bottom shell to the external environment, and the second heat dissipation fins quickly dissipate the heat absorbed by the cover plate to the first chamber, where heat exchange occurs between the first chamber and the outside environment. Finally, the heat is dissipated to the surrounding environment by the first and second heat dissipation fins. Compared to single-sided heat dissipation, its heat dissipation capacity is significantly improved. This heat dissipation scheme effectively avoids heat accumulation on the circuit board, shortens the heat conduction distance from the circuit board to the heat dissipation fins, reduces thermal resistance, and improves heat dissipation efficiency. Furthermore, this heat dissipation scheme eliminates the need for openings in the circuit board, which is beneficial for maintaining the structural stability of the circuit board.

[0012] For example, the orthographic projection of the first heat-conducting pillar on the circuit board coincides with the orthographic projection of the second heat-conducting pillar on the circuit board. The advantages of this coincident projection scheme are: in terms of heat dissipation, it enhances local heat dissipation and optimizes the heat conduction path. This is because the first and second heat-conducting pillars can simultaneously conduct heat from the same location or area on the circuit board to the bottom shell and cover plate, forming a concentrated heat dissipation effect, which is particularly suitable for the design around devices that generate significant heat on the circuit board. Furthermore, the coincident projections mean that heat can be conducted along a relatively concentrated and direct heat dissipation path, reducing heat loss and scattering during conduction, thus optimizing the heat conduction path. In terms of structural performance, since the first and second heat-conducting pillars apply force to the circuit board at the same location, they not only evenly distribute the external force on the circuit board, enhancing its structural support, but also help maintain the overall mechanical balance of the inverter, improving its reliability and stability during long-term use.

[0013] For example, the orthographic projections of the first heat-conducting pillar and the second heat-conducting pillar on the circuit board are separate. The advantage of this orthographic projection separation scheme is that the first and second heat-conducting pillars act at different locations on the circuit board, which helps to expand the heat dissipation coverage area, more comprehensively absorb the heat generated in different areas of the circuit board, make the temperature distribution on the circuit board more uniform, and improve the heat dissipation effect of the circuit board. Moreover, it offers greater adaptability to the layout of components and circuits on the circuit board. This is because the first and second heat-conducting pillars, with their orthographic projections separated, can be flexibly arranged according to the specific location and heat generation of different components or circuits, making the wiring and component arrangement on the circuit board more flexible.

[0014] In some possible implementations, the heat-conducting pillar extends through the circuit board, with one end of the heat-conducting pillar located on the side of the cover plate facing the circuit board, and the other end of the heat-conducting pillar away from the cover plate abutting against the bottom shell; or, one end of the heat-conducting pillar is located on the side of the bottom shell facing the circuit board, and the other end of the heat-conducting pillar away from the bottom shell abuts against the cover plate.

[0015] The heat-conducting pillars penetrate the circuit board and abut against the opposite bottom shell or cover plate. This shortens the thermal path, allowing heat to be transferred more quickly from the circuit board to the bottom shell and cover plate, and between them. The heat is ultimately dissipated into the surrounding environment by the first and second heat dissipation fins. Compared to single-sided heat dissipation, this significantly improves heat dissipation capacity. This implementation is particularly advantageous for reducing heat loss during transfer, significantly lowering thermal resistance, and improving heat dissipation efficiency. Furthermore, the heat-conducting pillars penetrating the circuit board and connecting the bottom shell and cover plate create a stable physical connection, acting like a "pillar" to enhance the inverter's structural stability. This makes the relative positions of the bottom shell, circuit board, and cover plate more fixed, effectively reducing displacement and loosening of components when the inverter is subjected to vibration, impact, or other external forces, thus lowering the risk of component damage due to structural instability.

[0016] In some possible implementations, the inverter further includes a switching transistor fixed to the circuit board and located in the second chamber, the switching transistor abutting against one of the bottom shell and the cover plate; the distance between the switching transistor and the heat-conducting pillar along a direction parallel to the circuit board is less than or equal to a set distance threshold. By having the end of the switching transistor facing away from the circuit board abut against one of the bottom shell and the cover plate, the heat transfer path between the switching transistor and the first heat dissipation fin on the bottom shell or the second heat dissipation fin on the cover plate is shortened, improving the heat dissipation effect on the switching transistor. Simultaneously, this arrangement also provides support for the circuit board, improving the stability of the circuit board layout.

[0017] In some possible implementations, the inverter further includes a power inductor fixed to the circuit board and located in the second chamber, with one end of the power inductor facing away from the circuit board abutting against one of the bottom shell and the cover plate, and the other end of the power inductor facing the circuit board abutting against the heat-conducting pillar arranged through the circuit board.

[0018] By having the end of the power inductor facing away from the circuit board abut against one of the bottom case or the cover plate, the heat transfer path between the power inductor and the first heat sink fin on the bottom case or the second heat sink fin on the cover plate is shortened, thus improving the heat dissipation effect of the power inductor. By having the end of the power inductor facing the circuit board abut against a heat-conducting pillar arranged through the circuit board, the heat generated by the power inductor is rapidly transferred to the first heat sink fin on the bottom case or the second heat sink fin on the cover plate through the heat-conducting pillar, further optimizing the heat dissipation of the power inductor. It is evident that the above-described double-sided heat dissipation scheme for the power inductor significantly improves its heat dissipation effect.

[0019] In some possible implementations, at least one of the bottom shell and the cover plate includes: a protrusion that protrudes in a direction away from the circuit board; the side of the protrusion facing away from the circuit board has a first heat dissipation fin or a second heat dissipation fin, and the side of the protrusion facing the circuit board has a third heat dissipation fin.

[0020] By having a third heat dissipation fin on the side of the protrusion facing the circuit board, and obviously, the third heat dissipation fin is located inside the second cavity, this design draws on the concept of bionic teeth, allowing the third heat dissipation fin to be rooted in the cavity. This can further increase the heat dissipation area within a limited space. Furthermore, the first, second, and third heat dissipation fins are distributed in different positions on the inverter, enabling the inverter to exchange heat with the surrounding air both inside and outside the cavity. All of the above is more beneficial for enhancing the inverter's heat dissipation efficiency and improving heat exchange efficiency.

[0021] For example, the bottom shell or the cover plate has a boss or a groove on the side facing the circuit board, and one end of the heat-conducting pillar abuts against the boss or is located in the groove.

[0022] Bosses or grooves provide precise positioning and stable support for the heat-conducting pillars, making the contact between the pillars and the base or cover plate more stable and reliable. This ensures continuous and stable heat transfer, avoiding problems such as increased thermal resistance and decreased heat dissipation efficiency caused by poor contact. Furthermore, during inverter assembly, bosses or grooves ensure that the heat-conducting pillars are accurately installed in the predetermined positions, achieving precise alignment with the circuit board and base or cover plate. This reduces installation errors, improves installation accuracy and consistency, simplifies installation, and increases installation efficiency.

[0023] For example, the heat-conducting pillar is connected to at least one of the bottom shell, the cover plate, and the circuit board by fasteners.

[0024] On the one hand, the fastening force provided by the fasteners ensures a tight physical contact between the heat-conducting pillar and the base or cover plate, reducing contact thermal resistance and the thickness of the heat-conducting medium at the interface. This ensures that heat can be transferred more efficiently through the heat-conducting pillar to the base or cover plate, and then dissipated into the surrounding environment by the heat dissipation fins on the base or cover plate, thus optimizing the heat dissipation path and improving heat dissipation efficiency. On the other hand, using fasteners such as screws to connect the heat-conducting pillar to the base or cover plate provides a reliable and high-strength mechanical connection, strengthening the connection and providing precise positioning and position retention characteristics, preventing the heat-conducting pillar from shifting due to external forces or thermal expansion and contraction.

[0025] In some possible implementations, a thermally conductive medium is present between the heat-conducting pillar and at least one of the bottom shell, the cover plate, and the circuit board. Providing a thermally conductive medium between the contact interfaces offers advantages such as enhanced thermal conductivity, improved heat dissipation efficiency, filling interface gaps, buffering protection, and insulation and moisture protection.

[0026] In some possible implementations, the inverter further includes an electric fan located within the second chamber and electrically connected to the circuit board.

[0027] By further installing an electric fan inside the second chamber of the inverter, air cooling can be achieved inside the inverter. When the electric fan is running, it can promote the rapid flow of air in the second chamber, forming forced convection and realizing turbulence inside the chamber. This is very beneficial for accelerating the heat transfer rate, balancing the chamber temperature, and improving heat dissipation efficiency.

[0028] In some possible implementations, the heat-conducting pillars are arranged in a plurality of spaced-apart configurations along a direction parallel to the circuit board. A greater number of heat-conducting pillars results in a more significant optimization of the heat dissipation effect, thereby substantially enhancing the heat dissipation performance. Attached Figure Description

[0029] Figure 1 A combination diagram of an exemplary inverter provided in an embodiment of this disclosure;

[0030] Figure 2 for Figure 1 The exploded view of the inverter shown is shown.

[0031] Figure 3 for Figure 1 The diagram shows the structure of the bottom casing of the inverter from a top-down view.

[0032] Figure 4 for Figure 1 The cross-sectional view of the inverter along line A1-A1 is shown.

[0033] Figure 5 for Figure 1 The diagram shows a cross-sectional view of the inverter taken along line A2-A2.

[0034] Figure 6 A schematic cross-sectional view of a first exemplary inverter provided in an embodiment of this disclosure;

[0035] Figure 7 for Figure 6 A1 is a magnified view of a portion of region A in the middle.

[0036] Figure 8 for Figure 6 A magnified view of a variant of region A in the middle, A2;

[0037] Figure 9 for Figure 6 A magnified view of another variant of region A in the middle, A3;

[0038] Figure 10 for Figure 6 A magnified view of another variant of region A in the middle, A4;

[0039] Figure 11 for Figure 6 A magnified view of another variant of region A in the middle, A5;

[0040] Figure 12 for Figure 1 A schematic diagram of the cover plate in the inverter shown from a downward viewing angle;

[0041] Figure 13 for Figure 6 A magnified view of another variant of region A in the middle, A6;

[0042] Figure 14 for Figure 6 A magnified view of another variant of region A in the middle, A7;

[0043] Figure 15 for Figure 6 A magnified view of another variant of region A in the middle, A8;

[0044] Figure 16 This is a schematic cross-sectional view of a second exemplary inverter provided in an embodiment of this disclosure;

[0045] Figure 17 A cross-sectional schematic diagram of a third exemplary inverter provided in an embodiment of this disclosure;

[0046] Figure 18 A schematic cross-sectional view of a fourth exemplary inverter provided in an embodiment of this disclosure;

[0047] Figure 19 A schematic cross-sectional view of a fifth exemplary inverter provided in an embodiment of this disclosure;

[0048] Figure 20 A cross-sectional schematic diagram of a sixth exemplary inverter provided in this disclosure embodiment;

[0049] Figure 21 This is a schematic cross-sectional view of a sixth exemplary inverter provided in an embodiment of this disclosure.

[0050] in, Figure 6 as well as Figures 16-21 for Figure 1 A schematic diagram of expansion schemes for inverters other than the one shown, and, Figure 6 as well as Figures 16-21All are cross-sectional views obtained along the AA section line of the corresponding inverter. This AA section line can be used as a reference. Figure 1 The A1-A1 or A2-A2 section lines in the inverter are used to illustrate the arrangement of the components in the inverter in the AA section direction.

[0051] The reference numerals in the attached figures represent:

[0052] 1. Base shell; 11. First heat sink fin; 12. Switch assembly;

[0053] 2. Face shell;

[0054] 3. Cover plate; 31. Second heat dissipation fins;

[0055] 4. Circuit board;

[0056] 5. PV connector;

[0057] 6. Heat-conducting pillar; 61. First heat-conducting pillar; 62. Second heat-conducting pillar; 63. Boss; 64. Groove; 65. Fastener;

[0058] 7. Thermal conductive medium;

[0059] 81. Switching transistor; 82. Power inductor; 821. Inductor body; 822. Inductor leads; 83. Surface mount device;

[0060] 9. Fan;

[0061] 001, Protrusion; 002, Third heat dissipation fin; 003, Thermal contact part. Detailed Implementation

[0062] Inverters, as power conversion devices, convert direct current (DC) to alternating current (AC) and are commonly used in photovoltaic (PV) or wind power systems. Taking a PV system as an example, also known simply as a photovoltaic system, it converts light energy into electrical energy based on the photovoltaic effect. A PV system includes PV modules and inverters. PV modules consist of multiple solar panels connected in series or parallel. The output of the PV modules is electrically connected to the inverter, which converts the DC power from the PV modules into fixed-frequency, fixed-voltage or frequency- and voltage-regulated AC power for grid connection or direct power supply to loads.

[0063] Inverters contain components such as switching transistors and power inductors, which generate heat during operation. To ensure reliable operation, a heat dissipation design is necessary. In related technologies, inverters consist of a bottom shell and a top shell. The switching transistors, power inductors, and other components are fixed to a circuit board and housed within a cavity formed by the bottom and top shells. Heat dissipation fins are located on the surface of the bottom shell facing away from the top shell, dissipating heat from the cavity to the outside.

[0064] However, as inverters develop towards miniaturization and high density, the heat generated by their switching transistors, power inductors and other components also increases. Currently, the heat dissipation capacity of inverters is difficult to match their high heat generation, making it impossible for the heat of inverters to be dissipated in a timely and effective manner, thus increasing the probability of them being damaged due to high temperature.

[0065] To address the technical problems existing in related technologies, this disclosure provides an inverter, as shown in the attached figure. Figure 1 -Appendix Figure 5 As shown, the inverter includes: a base shell 1, a front shell 2, a cover plate 3, a circuit board 4, a PV connector 5, and a power conversion circuit. Regarding the components mentioned above, it should be noted that the base shell 1 can be configured with side walls and a base plate, thus giving the cavity of the base shell 1 a certain depth. The front shell 2 can be fixedly connected to the end of the side wall of the base shell 1. The cover plate 3 can be fixedly connected to the side wall or the inner surface of the side wall of the base shell 1. The base plate of the base shell 1 can face the circuit board 4. The cover plate 3 can be configured as a cap (i.e., having a cavity) or a cover plate, depending on the actual needs. The circuit board 4 can be a printed circuit board (PCB), on which switching transistors, power inductors, and other devices are fixedly connected. These devices generate heat during operation, so a heat dissipation design is necessary for the inverter. In the PV connector 5, PV refers to photovoltaic.

[0066] Combined with appendix Figure 4 and attached Figure 5 The bottom shell 1 and the top shell 2 enclose a first chamber. The surface of the bottom shell 1 facing away from the top shell 2 has first heat dissipation fins 11. A cover plate 3 is located in the first chamber and, together with the bottom shell 1, forms a second chamber. The surface of the cover plate 3 facing away from the bottom shell 1 has second heat dissipation fins 31. A circuit board 4 is fixed in the second chamber. One end of a PV connector 5 is located in the second chamber and is electrically connected to the circuit board 4. The other end of the PV connector 5 penetrates the side wall of the bottom shell 1 and is used to connect to the photovoltaic module. A power conversion circuit is used to convert the direct current from the photovoltaic module into alternating current. The power conversion circuit includes a switching transistor 81, which is fixed to the circuit board 4 and located in the second chamber. The switching transistor 81 abuts against one of the bottom shell 1 and the cover plate 3.

[0067] For inverter heat dissipation solutions, including but not limited to the following: In some examples, air is used as the cooling medium to dissipate heat from the inverter. In natural or forced convection environments, the first heat sink fin 11 and the second heat sink fin 31 can promote air convection and improve heat dissipation efficiency. In other examples, liquid cooling medium can also be used to dissipate heat from the inverter. One implementation scheme is that the first heat sink fin 11 and the second heat sink fin 31 are connected to a cooling system located outside the inverter. The liquid cooling medium from the cooling system can flow through the flow channels provided inside the first heat sink fin 11 and the second heat sink fin 31, carrying away the heat generated by the internal components of the inverter, reducing the inverter's temperature under steady-state operation, and achieving temperature control of the inverter.

[0068] It should be noted that, based on different application scenarios, the inverter provided in this embodiment can also replace the switching transistor 81 with a power module. For example, an inverter with a switching transistor 81 can be applied to small electronic devices, solar photovoltaic power generation systems (e.g., for use in homes or small commercial spaces), etc., while an inverter with a power module can be applied to large-scale solar and wind power plants, new energy vehicle charging facilities, etc.

[0069] The inverter provided in this embodiment features a cover plate 3 within a first cavity formed by a bottom shell 1 and a front shell 2. The surface of the cover plate 3 facing away from the bottom shell 1 has second heat dissipation fins 31, and the surface of the bottom shell 1 facing away from the front shell 2 has first heat dissipation fins 11. This double-sided heat dissipation design increases the heat dissipation area. The cover plate 3 and the bottom shell 1 together form the second cavity. The connection between the cover plate 3 and the bottom shell 1 facilitates thermal conductivity between the first and second heat dissipation fins 11 and 31. Based on the larger heat dissipation area, this enhances the heat dissipation efficiency for the circuit board 4 and its components. On the other hand, the circuit board 4, with the fixedly connected components, is disposed in the second cavity between the cover plate 3 and the bottom shell 1. That is, the circuit board 4 with the fixedly connected components is located within the receiving space between the double-sided heat dissipation fins. This includes: the high-heat-generating switching transistor 81 is located in the second cavity and abuts against one of the bottom shell 1 and the cover plate 3. The heat from the switching transistor 81 can be transferred to the first heat dissipation fin 11 or the second heat dissipation fin 31 through one of the bottom shell 1 and the cover plate 3, thereby making reasonable use of the large heat dissipation area of ​​the inverter to achieve rapid heat dissipation of the switching transistor. It can be seen that the inverter provided in this embodiment, based on a large heat dissipation area, not only achieves stronger heat dissipation efficiency but also facilitates the uniform distribution of internal temperature, reduces local overheating, and significantly improves the operational stability and reliability of the inverter. The heat dissipation scheme of the inverter involved in this embodiment has a strong heat dissipation capacity, enabling it to match higher heat generation and ensuring that the heat generated by the inverter during operation is dissipated in a timely and effective manner. This has strong adaptability to the miniaturization and high-density development of inverters.

[0070] Further details are attached. Figure 3 -Appendix Figure 5 As shown, the inverter also includes a heat-conducting pillar 6, located at least one of the side of the bottom housing 1 facing the circuit board 4 and the side of the cover plate 3 facing the circuit board 4. The heat-conducting pillar 6 is used to thermally connect the circuit board 4 to at least one of the bottom housing 1 and the cover plate 3. For example, Figure 4 The example shows the heat-conducting pillar 6 located on the side of the bottom shell 1 facing the circuit board 4.

[0071] By providing heat-conducting pillars 6 on at least one of the sides of the bottom shell 1 facing the circuit board 4 and the side of the cover plate 3 facing the circuit board 4, the heat-conducting pillars 6 are used to thermally connect the circuit board 4 to at least one of the bottom shell 1 and the cover plate 3, thereby shortening the heat transfer path between the circuit board 4 and the first heat dissipation fin 11 of the bottom shell 1 and the second heat dissipation fin 31 of the cover plate 3. Thus, when the devices on the circuit board 4 generate heat during operation, the heat can be transferred to at least one of the bottom shell 1 and the cover plate 3 in a timely manner through the heat-conducting pillars 6, thereby enhancing heat dissipation efficiency. In particular, when the heat-conducting pillars 6 are simultaneously provided on both the side of the bottom shell 1 facing the circuit board 4 and the side of the cover plate 3 facing the circuit board 4, thermal connection between the first heat dissipation fin 11 and the second heat dissipation fin 31 can be achieved based on the heat-conducting pillars 6 on both sides of the circuit board 4, which is more beneficial for reducing the thermal resistance of the inverter. It can be seen that the inverter provided in this embodiment, based on a larger heat dissipation area, not only achieves stronger heat dissipation efficiency but also facilitates a uniform temperature distribution inside the inverter, reduces local overheating, and significantly improves the operational stability and reliability of the inverter. In summary, the heat dissipation scheme for inverters disclosed in this embodiment has a strong heat dissipation capacity, enabling it to match higher heat generation and ensuring that the heat generated by the inverter during operation is dissipated in a timely and effective manner. This has strong adaptability to the miniaturization and high-density development of inverters.

[0072] A heat-conducting pillar 6 can be provided on one side of the switching tube 81 (see, for example, [reference]). Figure 4 , Figure 5 and Figure 6 Alternatively, multiple heat-conducting pillars 6 can be provided on multiple sides of the switching tube 81. For example, a heat-conducting pillar 6 can be provided on each side of the switching tube 81 along the length of the inverter, or a heat-conducting pillar 6 can be provided on each side of the switching tube 81 along the width of the inverter.

[0073] The more heat-conducting pillars there are, the better the heat dissipation effect of the inverter will be, but they will occupy more internal space of the inverter. The design can be adapted according to actual needs and the actual internal space layout of the inverter.

[0074] As attached Figure 3As shown, along the direction parallel to the circuit board 4, multiple heat-conducting pillars 6 are arranged at intervals. Multiple heat-conducting pillars 6 can be set in the inverter at any position corresponding to any idle area on the circuit board 4. The more heat-conducting pillars 6 there are, the more obvious the optimization of heat dissipation effect will be, and the purpose of significantly enhancing the heat dissipation effect will be achieved.

[0075] To give a further example, see attached Figure 3 As shown, along the length of the inverter, the heat-conducting pillars 6 can be arranged in multiple rows, and each row of heat-conducting pillars 6 includes multiple heat-conducting pillars 6 spaced apart along the width of the inverter. The heat-conducting pillars 6 can be configured with regular geometric shapes, such as rectangular or near-rectangular blocks, or trapezoidal blocks. They can also be configured with irregular geometric shapes to adapt to specific spaces. See also Figure 3 The example shows that the heat-conducting pillar 6 is a rectangular block, and the length and width directions of the heat-conducting pillar 6 are consistent with the length and width directions of the inverter, respectively.

[0076] In some examples, devices with large heat generation, such as switching transistors 81 and power inductors 82, can be placed between any two adjacent heat-conducting columns 6 in the same column. The spacing between two adjacent heat-conducting columns 6 can be adaptively designed according to the volume and shape of the switching transistors 81 and power inductors 82, so that the heat-conducting columns 6 are as close as possible to the switching transistors 81 and power inductors 82.

[0077] In other examples, devices that generate a lot of heat, such as the switching transistor 81 and the power inductor 82, can be placed between two adjacent columns of heat-conducting pillars 6.

[0078] The space between any two adjacent columns of heat-conducting pillars 6 can be used not only for devices with high heat generation, such as the aforementioned switching transistors 81 and power inductors 82, but also for other devices with high heat generation, such as capacitors. For example, the space between two adjacent columns of heat-conducting pillars 6 can be designed as a cavity, which is beneficial for placing devices with high heat generation and large volume within it.

[0079] In summary, the above scheme allows for the placement of high-heat-generating devices within the space surrounding multiple heat-conducting pillars 6, maximizing their utilization. Furthermore, it permits the placement of devices on both sides of some heat-conducting pillars 6, ensuring improved heat dissipation efficiency while also facilitating a more compact internal layout within the inverter, thus promoting the miniaturization of the inverter.

[0080] In some implementation schemes, while ensuring the thermal conductivity of the heat-conducting pillars 6, the material of the heat-conducting pillars 6 is adaptively selected to give them electromagnetic shielding properties. In this way, the multiple heat-conducting pillars 6 arranged at intervals also help to reduce electromagnetic interference between different devices on the circuit board 4.

[0081] Regarding the inverters mentioned above, the following sections will discuss them in conjunction with the appendix. Figure 6 -Appendix Figure 21 This paper provides an example of some heat dissipation solutions included in the inverter. (Appendix) Figure 6 -Appendix Figure 21 In China, only the following is attached. Figure 12 and Figure 1 The inverter structure shown is directly related to the diagram, while the remaining figures are for illustrative purposes only. It should be noted that, provided the inventive concept of the embodiments of this disclosure is satisfied, the inverters shown in these illustrative figures can be used as a reference. Figure 1 The inverter structure shown can also be used with Figure 1 The inverter structures shown are different. For example, the number, position and structure of components such as the internal heat-conducting column 6, the switching tube 81, and the power inductor 82 can be changed.

[0082] In some examples (1), as shown in the appendix Figure 6 Appendix Figure 7 and attached Figure 8 As shown, the heat-conducting pillar 6 includes a first heat-conducting pillar 61 and a second heat-conducting pillar 62 distributed along a direction perpendicular to the circuit board 4; the first heat-conducting pillar 61 is located on the side of the bottom shell 1 facing the circuit board 4, and the second heat-conducting pillar 62 is located on the side of the cover plate 3 facing the circuit board 4, and both the first heat-conducting pillar 61 and the second heat-conducting pillar 62 abut against the circuit board 4.

[0083] In example (1) above, the first heat-conducting pillar 61 is located on the side of the bottom shell 1 facing the circuit board 4. That is, the first heat-conducting pillar 61 is arranged to protrude from the bottom shell 1 towards the circuit board 4. The first heat-conducting pillar 61 can be integrally formed on the bottom plate of the bottom shell 1, which helps to reduce the thermal resistance between the first heat-conducting pillar 61 and the bottom shell 1. Of course, it is not excluded that the first heat-conducting pillar 61 can also be fixedly connected to the bottom shell 1 by a fixed connection method (such as welding, screw connection, bonding, etc.). Similarly, the second heat-conducting pillar 62 is located on the side of the cover plate 3 facing the circuit board 4. The second heat-conducting pillar 62 can be integrally formed on the cover plate 3, which helps to reduce the thermal resistance between the second heat-conducting pillar 62 and the cover plate 3. It is not excluded that the second heat-conducting pillar 62 can be fixedly connected to the cover plate 3 by a fixed connection method (such as welding, screw connection, bonding, etc.).

[0084] As mentioned above, both the first heat-conducting pillar 61 and the second heat-conducting pillar 62 abut against the circuit board 4. The first heat-conducting pillar 61 and the second heat-conducting pillar 62 can directly abut against the two side surfaces of the circuit board 4 respectively, or the first heat-conducting pillar 61 and the second heat-conducting pillar 62 can abut against the two side surfaces of the circuit board 4 through the heat-conducting medium 7. This is more beneficial for reducing thermal resistance and improving heat dissipation efficiency.

[0085] The solution described in example (1) above has at least the following advantages: the first heat-conducting pillar 61 and the second heat-conducting pillar 62 are respectively attached to both sides of the circuit board 4. The first heat-conducting pillar 61 makes the circuit board 4 thermally connected to the bottom shell 1, and the second heat-conducting pillar 62 makes the circuit board 4 thermally connected to the cover plate 3. Thus, the bottom shell 1 and the cover plate 3 are indirectly thermally connected through the circuit board 4, providing a direct and efficient path for heat transfer to the circuit board 4 and the devices on it. Heat can then be quickly transferred to the connected bottom shell 11 and cover plate 31 through the first heat-conducting pillar 61 and the second heat-conducting pillar 62. The first heat dissipation fin 11 can quickly dissipate the heat absorbed by the bottom shell 1 to the external environment, and the second heat dissipation fin 31 can quickly dissipate the heat absorbed by the cover plate 3 to the first chamber through the cover plate, where heat exchange occurs between the first chamber and the outside. Finally, the heat is dissipated to the surrounding environment by the first heat dissipation fin 11 and the second heat dissipation fin 31. Compared to single-sided heat dissipation, its heat dissipation capacity is significantly improved. As can be seen, this heat dissipation solution can effectively prevent heat accumulation on circuit board 4, shorten the heat conduction distance from circuit board 4 to the heat sink fins, thereby reducing thermal resistance and improving heat dissipation efficiency. Moreover, this heat dissipation solution does not require openings in circuit board 4, which is beneficial for maintaining the structural stability of circuit board 4.

[0086] Combining with the above example (1), Figure 7 for Figure 6 The enlarged view of the arrangement of the heat-conducting pillars 6 of the type shown shows that the orthographic projection of the first heat-conducting pillar 61 on the circuit board 4 coincides with the orthographic projection of the second heat-conducting pillar 62 on the circuit board 4. For this orthographic projection coincidence scheme, the area of ​​the orthographic projection of the first heat-conducting pillar 61 on the circuit board 4 can be greater than, less than, or equal to the area of ​​the orthographic projection of the second heat-conducting pillar 62 on the circuit board 4, and can be adaptively designed according to actual needs or the actual operating space on the circuit board 4.

[0087] The advantages of the above-mentioned orthographic projection overlap scheme are as follows: In terms of heat dissipation, it is beneficial to enhance local heat dissipation and optimize the heat conduction path. This is because the first heat-conducting pillar 61 and the second heat-conducting pillar 62 can simultaneously conduct heat from the same location or area on the circuit board 4 to the bottom shell 1 and the cover plate 3, forming a concentrated heat dissipation effect. This is particularly suitable for the above design on the periphery of devices with high heat generation on the circuit board 4. Moreover, the overlapping orthographic projection means that heat can be conducted along a relatively concentrated and direct heat dissipation path, reducing heat loss and scattering during conduction, thus optimizing the heat conduction path. In terms of structural performance, since the first heat-conducting pillar 61 and the second heat-conducting pillar 62 apply force to the circuit board 4 at the same location, it can not only evenly distribute the external force on the circuit board 4 and enhance the structural support of the circuit board 4, but also help maintain the overall mechanical balance of the inverter, improving its reliability and stability during long-term use. Based on the effects achieved by the orthographic projection overlap scheme, the choice of whether to select such a scheme can be determined according to actual needs. Figure 7 The above is a scheme for coincident orthographic projection.

[0088] Combining with the above example (1), Figure 8 Another type of heat-conducting pillar arrangement is illustrated in the attached diagram. Figure 8 As shown, the orthographic projection of the first heat-conducting pillar 61 on the circuit board 4 can be separated from the orthographic projection of the second heat-conducting pillar 62 on the circuit board 4. For this orthographic projection separation scheme, the area of ​​the orthographic projection of the first heat-conducting pillar 61 on the circuit board 4 can be greater than, less than or equal to the area of ​​the orthographic projection of the second heat-conducting pillar 62 on the circuit board 4, and can be adapted to the actual needs or the actual operating space on the circuit board 4.

[0089] The advantage of separating the projected heat-conducting pillars 61 and 62 on the circuit board 4 is that the first and second heat-conducting pillars 61 and 62 act on different positions on the circuit board 4, which helps to expand the heat dissipation coverage area, more comprehensively absorb the heat generated in different areas of the circuit board 4, make the temperature distribution on the circuit board 4 more uniform, and improve the heat dissipation effect of the circuit board 4. Moreover, it offers greater adaptability to the layout of components and circuits on the circuit board 4. This is because the separated projected heat-conducting pillars 61 and 62 can be flexibly arranged according to the specific location and heat generation of different components or circuits, making the wiring and component arrangement on the circuit board 4 more flexible. Based on the effects achieved by the projected separation scheme, the choice of whether to adopt this scheme can be determined according to actual needs. Figure 8 The orthographic projection separation scheme is shown.

[0090] Of course, it is not excluded that the orthographic projection of the first heat-conducting pillar 61 on the circuit board 4 and the orthographic projection of the second heat-conducting pillar 62 on the circuit board 4 may partially overlap and partially separate.

[0091] The separation of the orthographic projections of the first heat-conducting pillar 61 and the second heat-conducting pillar 62 on the circuit board 4 is suitable for heat transfer scenarios where the circuit board 4 serves as an intermediate heat-conducting medium. The heat can originate from components on the circuit board 4 that generate significant heat, such as relays, surface-mount devices (SMD resistors, SMD capacitors, SMD inductors, SMD diodes, etc.). The heat generated by these components is rapidly transferred via the circuit board 4 to at least one of the first and second heat-conducting pillars 61 and 62, and ultimately to at least one of the bottom shell 1 and the cover plate 3, thereby enhancing heat dissipation efficiency. Further, at least one of the first and second heat-conducting pillars 61 and 62 can be positioned adjacent to these components to shorten the heat transfer path.

[0092] In some examples (2), Figure 9 Another type of heat-conducting pillar arrangement is illustrated in the attached diagram. Figure 9 As shown, the heat-conducting pillar 6 penetrates the circuit board 4. One end of the heat-conducting pillar 6 is located on the side of the cover plate 3 facing the circuit board 4, and the other end of the heat-conducting pillar 6, away from the cover plate 3, abuts against the bottom shell 1. Alternatively, Figure 10 Another type of heat-conducting pillar arrangement is illustrated in the attached diagram. Figure 10 As shown, one end of the heat-conducting pillar 6 is located on the side of the bottom shell 1 facing the circuit board 4, and the other end of the heat-conducting pillar 6 away from the bottom shell 1 abuts against the cover plate 3.

[0093] In example (2) above, the heat-conducting pillar 6 can be integrally formed on the bottom plate of the bottom shell 1, which helps to reduce the thermal resistance between the first heat-conducting pillar 61 and the bottom shell 1. The heat-conducting pillar can also be integrally formed on the cover plate 3, which helps to reduce the thermal resistance between the second heat-conducting pillar 62 and the cover plate 3. Of course, it is not excluded that the heat-conducting pillar 6 can also be fixedly connected to the bottom shell 1 or the cover plate 3 by a fixed connection method (such as welding, screw connection, bonding, etc.).

[0094] As mentioned above, the heat-conducting column 6 can abut against the bottom shell 1 or the cover plate 3. The heat-conducting column 6 can directly contact the bottom shell 1 or the cover plate 3, or it can abut against the bottom shell 1 or the cover plate 3 through the heat-conducting medium 7. This is more beneficial for reducing thermal resistance and improving heat dissipation efficiency.

[0095] The solution described in example (2) above has at least the following advantages: the heat-conducting pillar 6 penetrates the circuit board 4 and abuts against the bottom shell 1 or cover plate 3 opposite to it, which helps to shorten the thermal link (i.e., the heat transfer path). Heat is transferred more quickly from the circuit board 4 to the bottom shell 1 and cover plate 3, and between the bottom shell 1 and cover plate 3. The heat is finally dissipated to the surrounding environment by the first heat dissipation fin 11 and the second heat dissipation fin 31. Compared with single-sided heat dissipation, its heat dissipation capacity is significantly improved. This implementation scheme is particularly advantageous for reducing heat loss during the transfer process, significantly reducing thermal resistance and improving heat dissipation efficiency. In addition, the heat-conducting pillar 6 penetrates the circuit board 4 and connects the bottom shell 1 and cover plate 3, which can form a stable physical connection between the three, playing a role similar to a "pillar", enhancing the structural stability of the inverter, making the relative positions between the bottom shell 1, circuit board 4 and cover plate 3 more fixed. When the inverter is subjected to external forces such as vibration and impact, it can effectively reduce the displacement and loosening between the components, and reduce the risk of component damage caused by structural instability.

[0096] In this embodiment of the present disclosure, when the end of the heat-conducting column 6 abuts against the bottom shell 1 or the cover plate 3, the position on the bottom shell 1 or the cover plate 3 that contacts the heat-conducting column 6 can be designed without additional design, that is, the original structure can be maintained. Alternatively, an installation structure can be provided on the bottom shell 1 or the cover plate 3 at the position that contacts the heat-conducting column 6. The following is an exemplary description of the installation structure setting scheme.

[0097] Figure 11 and Figure 13 Two other different arrangements of the heat-conducting pillars 6 are illustrated in the appendix. Figure 11 -Appendix Figure 13 As shown, the bottom shell 1 or cover plate 3 has a boss 63 or a groove 64 on the side facing the circuit board 4, and one end of the heat-conducting pillar 6 abuts against the boss 63 or is located in the groove 64. Figure 11 and attached Figure 12 Both examples illustrate that the side of the cover plate 3 facing the circuit board 4 has a boss 63, and the heat-conducting pillar 6 is located on the side of the bottom shell 1 facing the circuit board 4, penetrates the circuit board 4, and abuts against the boss 63. (See attached image.) Figure 12 A further example is shown where the end of the boss 63 that contacts the heat-conducting post 6 has a heat-conducting medium 7. Figure 13 The example shows that the bottom shell 1 has a groove 64 on the side facing the circuit board 4, and the heat-conducting pillar 6 is located on the side of the cover plate 3 facing the circuit board 4, passes through the circuit board 4 and abuts against the groove 64.

[0098] The boss 63 or groove 64 provides precise positioning and stable support for the heat-conducting pillar 6, making the contact between the heat-conducting pillar 6 and the bottom shell 1 or cover plate 3 more stable and reliable. This ensures continuous and stable heat transfer, avoiding problems such as increased thermal resistance and decreased heat dissipation efficiency due to poor contact. Furthermore, during inverter assembly, the boss 63 or groove 64 ensures that the heat-conducting pillar 6 is accurately installed in the predetermined position, achieving precise alignment with the circuit board 4 and the bottom shell 1 or cover plate 3. This reduces installation errors, improves installation accuracy and consistency, simplifies installation difficulty, and increases installation efficiency.

[0099] The groove 64 is designed to fit with the end of the heat-conducting pillar 6 with a clearance. In addition, the groove 64 also helps to increase the contact area with the heat-conducting pillar 6 (because not only the bottom wall of the groove 64 contacts the heat-conducting pillar 6, but also the side wall of the groove), which is also beneficial to improving the heat dissipation effect.

[0100] Furthermore, in conjunction with example (2) above, see [link to example]. Figure 5 Furthermore, the heat-conducting pillar 6 can be connected to at least one of the bottom shell 1, cover plate 3, and circuit board 4 via a fastener 65. For example, the fastener 65 can be a screw, rivet, etc., such as a screw.

[0101] On the one hand, the fastening force provided by the fastener 65 ensures that the heat-conducting pillar 6 maintains close physical contact with at least one of the bottom shell 1, cover plate 3, and circuit board 4, reducing contact thermal resistance and the thickness of the heat-conducting medium 7 at the interface. This ensures that heat can be transferred more efficiently to the bottom shell 1 or cover plate 3 through the heat-conducting pillar 6, and then dissipated into the surrounding environment by the heat dissipation fins on the bottom shell 1 or cover plate 3, thereby optimizing the heat dissipation path and improving heat dissipation efficiency. On the other hand, using fasteners such as screws to connect the heat-conducting pillar 6 to at least one of the bottom shell 1, cover plate 3, and circuit board 4 provides a reliable and high-strength mechanical connection, strengthens the connection strength, provides precise positioning and position retention characteristics, and prevents the heat-conducting pillar 6 from shifting due to external forces or thermal expansion and contraction.

[0102] To ensure a secure installation of the fastener 65, the dimensions of at least one of the bottom shell 1, the cover plate 3, the circuit board 4, and the area corresponding to the installation of the fastener 65 on the heat-conducting pillar 6 can be set to a larger size. See [reference needed]. Figure 12 The example shows that the boss 63 on the cover plate 3 is set as an arc-shaped boss corresponding to the mounting area of ​​the fastener 65, while the other areas of the boss 63 are set as elongated bosses. The radial dimension of the arc-shaped boss is larger than the width dimension of the elongated boss, thereby allowing the fastener 65 to be firmly installed here, achieving a reliable mechanical connection.

[0103] For a design where the heat-conducting pillar 6 penetrates the circuit board 4 and is located on one side of the bottom shell 1 or cover plate 3, to reduce the assembly path of the fastener 65, the fastener 65 can be fixedly connected to the end of the heat-conducting pillar 6 facing the bottom shell 1 or cover plate 3 via the bottom shell 1 or cover plate 3. Figure 11 For example, it illustrates that the fastener 65 is fixedly connected to the end of the heat-conducting pillar 6 facing the cover plate 3 via the cover plate 3 and the boss 63 thereon.

[0104] For the heat-conducting pillar 6, where the first heat-conducting pillar 61 and the second heat-conducting pillar 62 have separate orthogonal projections on the circuit board 4, the fastener 65 can be fixedly connected to the side of the circuit board 4 facing the first heat-conducting pillar 61 via the bottom shell 1 and the first heat-conducting pillar 61 thereon; or, the fastener 65 can be fixedly connected to the side of the circuit board 4 facing the second heat-conducting pillar 62 via the cover plate 3 and the second heat-conducting pillar 62 thereon (see [reference]). Figure 8 ).

[0105] In the above-described scheme, the fasteners 65 are all fixedly connected to the heat-conducting pillars 6. This method does not occupy additional space around the heat-conducting pillars 6, achieving full and rational utilization of the internal space of the inverter and facilitating its compact layout. Furthermore, in this case, the fasteners 65 can be made of a high thermal conductivity material or the same material as the heat-conducting pillars 6 to ensure that the fasteners 65 do not degrade the heat conduction effect of the heat-conducting pillars 6, and may even enhance it.

[0106] Of course, it is not excluded that the fastener 65 may not pass directly through the heat-conducting pillar 6, but may be located on the adjacent side of the heat-conducting pillar 6 (see...). Figure 8 For example, a mounting boss is provided at a position adjacent to the heat-conducting pillar 6 in at least one of the bottom shell 1, cover plate 3, and circuit board 4, so that the fastener 65 passes through the mounting boss for installation, so as to achieve a fixed connection between any two of the bottom shell 1, cover plate 3, and circuit board 4, and the heat-conducting pillar 6 is pressed into it accordingly, which can also achieve the effect of reducing the contact thermal resistance between the interfaces.

[0107] It should be noted that, Figure 8 The presence of fastener 65 is illustrated, however, embodiments of this disclosure also include... Figure 8 A solution to remove one or all fasteners 65.

[0108] Regardless of the arrangement, it is desirable that the position of the fastener 65 avoids necessary components or circuits. For example, the fastener 65 should avoid circuits on the circuit board 4, or the position of the fastener 65 should avoid the second heat sink fin 31 on one side of the cover plate 3, or the position of the fastener 65 should avoid the first heat sink fin 11 on one side of the bottom shell 1. See also Figure 11The example shows a fastener 65 positioned at the edge of the heat-conducting pillar 6 to avoid the second heat dissipation fin 31 on one side of the cover plate 3.

[0109] The above example illustrates the solution where heat-conducting pillars 6 are present on both sides of the circuit board 4. However, it is not excluded that the solution in example (3) below can also be adopted. Figure 14 and Figure 15 Two other different arrangements of the heat-conducting pillars 6 are illustrated in the appendix. Figure 14 and attached Figure 15 As shown, the heat-conducting pillar 6 can also be configured to include one of a first heat-conducting pillar 61 and a second heat-conducting pillar 62. The first heat-conducting pillar 61 is located on the side of the bottom shell 1 facing the circuit board 4, and the second heat-conducting pillar 62 is located on the side of the cover plate 3 facing the circuit board 4. Although the heat dissipation effect of this solution is slightly inferior to the heat dissipation solutions mentioned above, it can still achieve a better heat dissipation effect compared to related technologies.

[0110] When multiple heat-conducting pillars 6 are set, the arrangement schemes of the multiple heat-conducting pillars 6 can be the same, different from each other, or partially the same and the remaining parts different. For example, the arrangement schemes of the multiple heat-conducting pillars 6 can adopt the above-mentioned example (1) scheme, or the above-mentioned example (2) scheme, or at least two of the above-mentioned example (1), example (2) scheme, and example (3) scheme can be adopted at the same time. For example, some heat-conducting pillars 6 can be arranged through the circuit board 4 or symmetrically arranged on both sides of the circuit board 4, and some heat-conducting pillars 6 can be abutted to one side of the circuit board 4. The design can be carried out according to the actual needs.

[0111] For any of the inverters mentioned above, it is mentioned that one end of the heat-conducting pillar 6 can abut against at least one of the bottom shell 1, the cover plate 3, and the circuit board 4. This abutment can be direct or indirect. For indirect abutment, one embodiment is that a heat-conducting medium 7 (see...) exists between the heat-conducting pillar 6 and at least one of the bottom shell 1, the cover plate 3, and the circuit board 4. Figure 9 , Figure 10 or Figure 12 ).

[0112] For example, the thermal conductive medium 7 can be a thermal conductive material such as thermal conductive grease, thermal conductive pad, thermal conductive silicone sheet, thermal conductive gel, or thermal conductive phase change material. By setting the thermal conductive medium 7 between the contact interfaces, it has the advantages of enhancing thermal conductivity, improving heat dissipation efficiency, filling interface gaps, providing buffer protection, and providing insulation and moisture protection.

[0113] For any of the inverters mentioned above, various devices are fixedly connected to circuit board 4, and these devices may include switching transistor 81 (see...). Figure 16 ), power inductor 82 (see) Figure 16 ), Surface mount devices 83 (see Figure 17The circuit includes a switch 81 for converting DC to AC, a power inductor 82 which may include an energy storage inductor, a filter inductor, a voltage conversion inductor, a power conversion inductor, etc., and a surface mount device 83 which includes at least a surface mount resistor to limit current in the circuit and suppress interference and noise, and may also include a surface mount capacitor for storing charge. The bus capacitor stores and smooths DC voltage, and the driver chip controls the operation of the switch 81, power inductor 82, surface mount device 83, etc. These components can be categorized into first components and second components, wherein the heat generation and at least one dimension along the direction perpendicular to the circuit board 4 of the first component are greater than the heat generation and related dimensions of the second component. For example, the first component includes a switch 81, a power inductor 82, a bus capacitor, a driver chip, etc., and the second component includes a surface mount device 83, a sensor, etc.

[0114] In some examples, the first device can be placed on one of the front and back sides of the circuit board 4, and the second device can be placed on the other side of the front and back sides of the circuit board 4. The front side of the circuit board 4 refers to the surface of the circuit board 4 facing the cover plate 3, and the back side of the circuit board 4 refers to the surface of the circuit board 4 facing the bottom shell 1. It can be seen that by placing devices with different heat generation or different sizes on both sides of the circuit board 4, the internal space of the first chamber of the inverter can be fully utilized, which is conducive to the miniaturization and high-density development of the inverter.

[0115] When the first component is positioned on the front of circuit board 4, it can be assumed that the components in the inverter adopt a single-board front-mounting scheme (see [reference]). Figure 19 and Figure 20 Conversely, when the second device is located on the reverse side of circuit board 4, it can be considered that the devices in the inverter adopt a single-board flip-chip scheme (see [reference]). Figures 16-18 For both single-board upright and single-board inverted mounting schemes, the surface of the front shell 2 can be set to a flat surface. The bottom plate of the bottom shell 1 can be set to a flat surface or an uneven surface, depending on the requirements. Similarly, the cover plate 3 can be set to a flat surface or an uneven surface, depending on the requirements.

[0116] For example, in a single-board inverted mounting configuration, the bottom plate of the base shell 1 can be made into an uneven shape, and the cover plate 3 can be made either flat or uneven (the reason for this configuration can be found below). In a single-board upright mounting configuration, the bottom plate of the base shell 1 can be flat, and the cover plate 3 can be made either flat or uneven (the reason for this configuration can be found below).

[0117] The switching transistor 81 is a relatively heat-generating component in the inverter. An example of a heat dissipation solution for the switching transistor 81 is shown in the attached figure. Figure 16 As shown, the switching tube 81 is fixed to the circuit board 4 and located in the second chamber. The switching tube 81 abuts against one of the bottom shell 1 and the cover plate 3. Along the direction parallel to the circuit board 4, the distance between the switching tube 81 and the heat-conducting column 6 is less than or equal to the set distance threshold.

[0118] Figure 16 The example shows that the switching transistor 81 is located between the circuit board 4 and the base shell 1 and abuts against the base shell 1, which corresponds to the single-board flip-chip configuration. For the single-board standard configuration, please refer to [link to relevant documentation]. Figure 19 The example shows that the switch 81 is located between the circuit board 4 and the cover plate 3 and abuts against the cover plate 3.

[0119] By having the end of the switching transistor 81 facing away from the circuit board 4 abut against one of the bottom shell 1 and the cover plate 3, the heat transfer path between the switching transistor 81 and the first heat dissipation fin 11 on the bottom shell 1 or the second heat dissipation fin 31 on the cover plate 3 is shortened, thereby improving the heat dissipation effect on the switching transistor 81. At the same time, this arrangement also helps to provide support for the circuit board 4 and improve the stability of the circuit board 4.

[0120] In some examples, when the bottom shell 1 or cover plate 3 abuts against the end of the switching tube 81, the position of the bottom shell 1 or cover plate 3 corresponding to the switching tube 81 can be configured to protrude towards the switching tube 81 to form a thermally conductive contact portion 003 protruding into the cavity (see...). Figure 16 or Figure 18 At this time, the thermally conductive contact part 003 is configured with an uneven shape corresponding to the bottom plate of the bottom shell 1 mentioned above (or the cover plate 3 is configured with an uneven shape). Based on the thermally conductive contact part, it abuts against the switching tube 81, shortening the heat transfer path of the switching tube 81. Correspondingly, the length of the heat dissipation fins provided on the outer surface of the bottom shell 1 or the cover plate 3 that is opposite to the thermally conductive contact part 003 is increased accordingly, thereby increasing the heat dissipation area. The above is particularly beneficial for improving the heat dissipation effect of the switching tube 81.

[0121] Specifically, one or more heat-conducting pillars 6 can be arranged adjacent to the switching transistor 81, thereby further optimizing the heat dissipation of the switching transistor 81 based on the heat-conducting pillars 6. Along the direction parallel to the circuit board 4, the distance between the switching transistor 81 and the heat-conducting pillars 6 is less than or equal to a set distance threshold. Since the heat-conducting pillars 6 are typically located in unused areas on the circuit board 4 (e.g., areas where no components are placed, and further, unwired areas, which is mainly applicable to schemes where the heat-conducting pillars 6 penetrate the circuit board 4), the position of the heat-conducting pillars 6 is set according to the actual arrangement of the unused areas of the circuit board 4, so that the heat-conducting pillars 6 are as close to the switching transistor 81 as possible. Therefore, along the direction parallel to the circuit board 4, the distance between the switching transistor 81 and the heat-conducting pillars 6 is as small as possible, making it less than or equal to the set distance threshold. For example, this distance threshold is less than or equal to 5mm, and can further be less than or equal to 4mm, 3mm, 2mm, 1mm, etc.

[0122] The power inductor 82 is also a relatively high-heat-generating component in the inverter. An example of a heat dissipation solution for the power inductor 82 is shown in the attached figure. Figure 16 As shown, the power inductor 82 is fixed to the circuit board 4 and located in the second chamber. The end of the power inductor 82 facing away from the circuit board 4 abuts against one of the bottom shell 1 and the cover plate 3, and the end of the power inductor 82 facing the circuit board 4 abuts against the heat-conducting pillar 6 arranged through the circuit board 4.

[0123] Figure 16 The example illustrates a power inductor 82 positioned between circuit board 4 and base case 1, with one end abutting against base case 1, corresponding to a single-board flip-chip configuration. In this case, the other end of power inductor 82 abuts against a heat-conducting pillar 6 extending to cover plate 3 and penetrating circuit board 4. For a single-board standard-mount configuration, see [link to relevant documentation]. Figure 19 The power inductor 82 is located between the circuit board 4 and the cover plate 3, with one end abutting against the cover plate 3, and the other end of the power inductor 82 abutting against the heat-conducting pillar 6 that extends to the bottom shell 1 and passes through the circuit board 4 (not shown in the figure).

[0124] by Figure 16 Taking the illustrated scheme as an example, on the one hand, by making the end of the power inductor 82 away from the circuit board 4 abut against one of the bottom shell 1 and the cover plate 3, it is beneficial to shorten the heat transfer path between the power inductor 82 and the first heat dissipation fin 11 on the bottom shell 1 or the second heat dissipation fin 31 on the cover plate 3, thereby improving the heat dissipation effect of the power inductor 82.

[0125] Furthermore, when the bottom shell 1 or the cover plate 3 abuts against the end of the power inductor 82, the position of the bottom shell 1 or the cover plate 3 corresponding to the power inductor 82 can be arranged to protrude towards the power inductor 82 to form another thermally conductive contact portion 003 protruding into the cavity (at this time, the bottom plate corresponding to the bottom shell 1 mentioned above is set to an uneven shape or the cover plate 3 is set to an uneven shape). Based on the thermally conductive contact portion, it abuts against the power inductor 82, shortening the heat transfer path of the power inductor 82. Correspondingly, the length of the heat dissipation fins provided on the outer surface of the bottom shell 1 or the cover plate 3 opposite to the thermally conductive contact portion 003 is increased accordingly, thereby increasing the heat dissipation area. The above is particularly beneficial for improving the heat dissipation effect of the power inductor 82.

[0126] On the other hand, by making the end of the power inductor 82 facing the circuit board 4 abut against the heat-conducting pillar 6 arranged through the circuit board 4, the heat generated by the power inductor 82 is quickly transferred to the first heat dissipation fin 11 on the bottom shell 1 or the second heat dissipation fin 31 on the cover plate 3 through the heat-conducting pillar 6, thereby further optimizing the heat dissipation of the power inductor 82. It can be seen that the above-described double-sided heat dissipation scheme for the power inductor 82 significantly improves the heat dissipation effect of the power inductor 82.

[0127] It should be noted that, as shown in the attached document... Figure 16 As shown, the power inductor 82 includes an inductor body 821 and an inductor pin 822. Normally, the inductor pin 822 is located on the periphery of the inductor body 821. The power inductor 82 is fixedly connected to the circuit board 4 through the inductor pin 822. The end of the inductor body 821 facing away from the circuit board 4 abuts against either the bottom shell 1 or the cover plate 3. The end of the inductor body 821 facing the circuit board 4 abuts against the heat-conducting pillar 6 arranged through the circuit board 4.

[0128] Continue with Figure 16 For example, when the inductor body 821 of the power inductor 82 is disposed between the circuit board 4 and the bottom shell 1, the inductor pin 822 can penetrate the circuit board 4, with its end facing away from the inductor body 821 located between the circuit board 4 and the cover plate 3. The end of the inductor pin 822 facing away from the inductor body 821 can be freely arranged (i.e., in contact with air, not shown in the figure). To further improve the heat dissipation effect of the power inductor 82, the end of the inductor pin 822 facing away from the inductor body 821 can abut against the cover plate 3 (not shown in the figure), or the end of the inductor pin 822 facing away from the inductor body 821 can abut against the heat-conducting pillar 6 arranged through the circuit board 4 as mentioned above (see...). Figure 16 At this time, the part of the heat-conducting pillar 6 located between the circuit board 4 and the cover plate 3 can be set to be larger in volume so as to achieve contact with the inductor pin 822, and the arrangement of the heat-conducting pillar 6 through the circuit board 4 can be set to be smaller in volume so as to fit the end of the inductor body 811.

[0129] The above descriptions use only the switching transistor 81 and the power inductor 82 as examples to illustrate the heat dissipation schemes for two different types of devices in the inverter. For other types of devices in the inverter besides the surface mount device 83, the heat dissipation scheme of the switching transistor 81 or the power inductor 82 can be selected arbitrarily according to the actual device type, or some adaptive improvements can be made on the basis of these two heat dissipation schemes. The goal is to ensure that the heat dissipation effect is improved while miniaturizing the size of the inverter.

[0130] Additionally, it should be noted that, as mentioned above, the components in the inverter, such as the switching transistor 81 and the power inductor 82, are in contact with at least one of the bottom shell 1, the cover plate 3, and the heat-conducting pillar 6. In this case, a heat-conducting medium 7 can be provided between the components and at least one of the bottom shell 1, the cover plate 3, and the heat-conducting pillar 6 to improve the heat dissipation effect.

[0131] As mentioned above, depending on the type of device to be cooled, the bottom plate of the base shell 1 can be made into an uneven shape, or the cover plate 3 can be made into an uneven shape, thereby forming a thermally conductive contact portion 003 protruding into the cavity. The thermally conductive contact portion 003 is used to abut against the device. In this case, for the plurality of first heat dissipation fins 11 disposed outside the base shell 1 (the plurality of first heat dissipation fins 11 are arranged at intervals along a direction parallel to the circuit board 4), the plurality of first heat dissipation fins 11 have different dimensions along the direction perpendicular to the circuit board 4. However, the ends of the plurality of first heat dissipation fins 11 away from the base shell 1 are arranged flat to give the inverter a regular geometry, which facilitates its installation and stable placement in the application scenario. Similarly, for the plurality of second heat dissipation fins 31 disposed outside the cover plate 3, the plurality of second heat dissipation fins 31 have different dimensions along the direction perpendicular to the circuit board 4. However, the ends of the plurality of second heat dissipation fins 31 away from the cover plate 3 are arranged flat.

[0132] For any of the inverters mentioned above, in some examples, as shown in the appendix... Figure 17 Appendix Figure 18 and attached Figure 20 As shown, at least one of the bottom shell 1 and the cover plate 3 includes: a protrusion 001, the protrusion 001 being arranged to protrude in a direction away from the circuit board 4, the side of the protrusion 001 facing away from the circuit board 4 having a first heat dissipation fin 11 or a second heat dissipation fin 31, and the side of the protrusion 001 facing the circuit board 4 having a third heat dissipation fin 002.

[0133] By arranging the protrusion 001 to protrude in a direction away from the circuit board 4, the protrusion 001 protrudes away from the second chamber relative to the main body portion of the bottom shell 1 or cover plate 3. A corresponding cavity is formed on the side of the protrusion 001 facing the circuit board 4, and the third heat dissipation fin 002 is located within the cavity of the protrusion 001. Regarding the dimension of the third heat dissipation fin 002 in the direction perpendicular to the circuit board 4, this dimension of the third heat dissipation fin 002 can be made less than or equal to the depth of the cavity of the protrusion 001. That is, the end of the third heat dissipation fin 002 facing the circuit board 4 is arranged to avoid protruding from the inner wall of the main body portion of the bottom shell 1 or cover plate 3 as much as possible, so as to avoid affecting the assembly of components on the circuit board 4.

[0134] By having a third heat dissipation fin 002 on the side of the protrusion 001 facing the circuit board 4, it is clear that the third heat dissipation fin 002 is located inside the second cavity. This design draws on the concept of bionic teeth, allowing the third heat dissipation fin 002 to be rooted in the cavity. This can further increase the heat dissipation area in a limited space. Furthermore, the first heat dissipation fin 11, the second heat dissipation fin 31, and the third heat dissipation fin 002 are distributed in different positions of the inverter, enabling the inverter to exchange heat with the surrounding air both inside and outside the cavity. This is more beneficial for enhancing the heat dissipation efficiency of the inverter and improving the heat exchange efficiency.

[0135] In some examples, the surface mount device 83 and the third heat sink 002 can be located in the same chamber, thereby improving the heat dissipation effect of the surface mount device 83 based on the third heat sink 002.

[0136] The arrangement of the third heat dissipation fin 002 is illustrated below using both the single-board upright mounting scheme and the single-board inverted mounting scheme.

[0137] See Figure 17 This example illustrates a single-board flip-chip design. The inverter components include a switching transistor 81, a power inductor 82, and a surface-mount device 83. The switching transistor 81 and power inductor 82 are fixed to the side of the circuit board 4 facing the bottom housing 1, while the surface-mount device 83 is fixed to the side of the circuit board 4 facing the cover plate 3. The cover plate 3 includes a protrusion 001, which protrudes in a direction away from the circuit board 4. The side of the protrusion 001 facing away from the circuit board 4 has a second heat sink fin 31, and the side of the protrusion 001 facing the circuit board 4 has a third heat sink fin 002. In some examples, the surface-mount device 83 is positioned as close as possible to the third heat sink fin 002 to improve its heat dissipation.

[0138] Continuing with the single-board standard mounting solution as an example, Figure 17 An example is shown where the protrusion 001 is provided on the cover plate 3. Figure 18The example shows that the protrusion 001 can also be set on the bottom shell 1, or both the bottom shell 1 and the cover plate 3 can be set with the protrusion 001 (not shown in the figure). On the basis of miniaturizing the inverter, the more protrusions 001 are set, the better the heat dissipation effect of the inverter.

[0139] See Figure 19 and Figure 20 This example illustrates a single-board mounting scheme. The inverter components include a switching transistor 81, a power inductor 82, and a surface-mount device 83. The switching transistor 81 and the power inductor 82 are fixed to the side of the circuit board 4 facing the cover plate 3, and the surface-mount device 83 is fixed to the side of the circuit board 4 facing the bottom shell 1. The bottom shell 1 includes a protrusion 001, which protrudes in a direction away from the circuit board 4. The side of the protrusion 001 facing away from the circuit board 4 has a first heat dissipation fin 11, and the side of the protrusion 001 facing the circuit board 4 has a third heat dissipation fin 002. In some examples, the surface-mount device 83 can be positioned as close as possible to the third heat dissipation fin 002 to improve the heat dissipation effect of the surface-mount device 83.

[0140] Continuing with the single-board flip-chip solution as an example, Figure 20 The example shows a protrusion 001 provided on the bottom shell 1. In other embodiments, the protrusion 001 may also be provided on the cover plate 3 (not shown in the figure), or it is also possible for both the bottom shell 1 and the cover plate 3 to be provided with protrusions 001 (not shown in the figure).

[0141] For any of the inverters mentioned above, in some examples, as shown in the appendix... Figure 21 As shown, the inverter also includes an electric fan 9, which is located in the second chamber and electrically connected to the circuit board 4. The electric fan 9 can be fixedly connected to the circuit board 4, the bottom housing 1, or the cover plate 3.

[0142] By further installing an electric fan 9 inside the second chamber of the inverter, air cooling can be achieved inside the inverter. When the electric fan is running, it can promote the rapid flow of air in the second chamber, forming forced convection and realizing turbulence inside the chamber. This is very beneficial for accelerating the heat transfer rate, balancing the chamber temperature, and improving heat dissipation efficiency.

[0143] By strategically positioning the electric fan 9, air can be directed directly to hot spots inside the inverter, such as areas with multiple components or corners where heat dissipation is difficult. This effectively reduces the temperature of these hot spots, prevents malfunctions caused by excessively high temperatures, and ensures the normal operation of the inverter.

[0144] It should be noted that for any of the inverters mentioned above, please refer to [link / reference needed]. Figure 1 and Figure 2The inverter provided in this embodiment further includes a switching assembly 12. For example, the switching assembly 12 includes a knob, a connecting rod, and a switch body. The knob and the switch body are located on the outer and inner sides of the bottom shell 1, respectively. The knob is connected to the switch body via the connecting rod. The switch body is fixedly connected to the circuit board 4. The switch body includes multiple disconnecting units, each of which includes pins. The pins of each disconnecting unit are connected to the circuit board 4. One end of its PV connector 5 is located inside the bottom shell 1 and connected to the circuit board 4. The other end of the PV connector 5 extends through the bottom shell 1 to the outer side of the bottom shell 1. The PV connector 5 is used to transmit DC power to the switching transistor 81. The PV connector 5 is connected to some pins of the switch body via metal traces on the circuit board 4. Other pins of the switch body are connected to the device via metal traces on the circuit board 4.

[0145] In summary, the inverter provided in this embodiment cleverly utilizes the space between the bottom shell 1 and the front shell 2, and further provides a cover plate 3 and a heat-conducting column 6 for heat dissipation within its cavity. The bottom shell 1 with the first heat dissipation fin 11, the cover plate 3 with the second heat dissipation fin 31 and optional third heat dissipation fin 002, and the heat-conducting column 6 work together to construct an efficient heat dissipation structure within a limited space, and make the heat dissipation structure highly integrated with the overall structure of the inverter. This not only meets the space requirements of the inverter, but also achieves high-efficiency heat dissipation, which is conducive to the miniaturization and high-density development of the inverter.

[0146] The inverters described above in this disclosure can be residential inverters, or inverters used in industrial, commercial, and power plants. Furthermore, the inverters can be used in photovoltaic power generation systems or wind power generation systems. Taking a photovoltaic power generation system as an example, it includes photovoltaic modules, inverters, etc. The photovoltaic modules include multiple solar panels connected in series or parallel. The output terminal of the photovoltaic modules is electrically connected to the inverter. The inverter converts the direct current from the photovoltaic modules into fixed-frequency, fixed-voltage or frequency- and voltage-regulated alternating current for grid connection or direct supply to loads.

[0147] In another aspect, embodiments of this disclosure also provide a photovoltaic system, which includes an inverter and a photovoltaic module. The inverter is as described in any of the above-described inverters and is electrically connected to the photovoltaic module for power conversion of the photovoltaic module.

[0148] The photovoltaic system provided in this disclosure has all the advantages of any of the inverters mentioned above, and will not be repeated here.

[0149] For example, a photovoltaic module includes at least one photovoltaic panel, which is connected to a photovoltaic inverter. As a further example, a photovoltaic module includes multiple photovoltaic panels connected in series, where the direct current from the multiple photovoltaic panels is collected and then connected to the inverter.

[0150] In some examples, the photovoltaic system includes at least one of photovoltaic modules, photovoltaic optimizers, combiner boxes, box-type transformers, power sensors, energy storage systems, grid-connected / off-grid controllers, and smart subarray controllers, as well as an inverter. Users can combine at least one of the photovoltaic modules, photovoltaic optimizers, combiner boxes, box-type transformers, power sensors, energy storage systems, grid-connected / off-grid controllers, and smart subarray controllers with an inverter as needed.

[0151] The above description is only for the purpose of enabling those skilled in the art to understand the technical solutions disclosed herein, and is not intended to limit the scope of this disclosure. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this disclosure should be included within the protection scope of this disclosure.

Claims

1. An inverter, characterized in that, The inverter includes: A bottom shell (1) and a top shell (2) are provided, which together form a first chamber. The surface of the bottom shell (1) facing away from the top shell (2) has a first heat dissipation fin (11). Cover plate (3), the cover plate (3) is located in the first chamber and surrounds the bottom shell (1) to form a second chamber, the surface of the cover plate (3) facing away from the bottom shell (1) has a second heat dissipation fin (31); Circuit board (4), said circuit board (4) is fixed in the second cavity; PV connector (5), one end of which is located in the second cavity and electrically connected to the circuit board (4), and the other end of which penetrates the side wall of the bottom shell (1) and is used to connect photovoltaic modules; A power conversion circuit is used to convert direct current from the photovoltaic module into alternating current. The power conversion circuit includes a switching transistor (81), which is fixed to the circuit board (4) and located in the second chamber. The switching transistor (81) abuts against one of the bottom shell (1) and the cover plate (3).

2. The inverter according to claim 1, characterized in that, The inverter further includes a heat-conducting pillar (6) located on at least one of the side of the bottom shell (1) facing the circuit board (4) and the side of the cover plate (3) facing the circuit board (4), the heat-conducting pillar (6) being used to thermally connect the circuit board (4) to at least one of the bottom shell (1) and the cover plate (3).

3. The inverter according to claim 1, characterized in that, The heat-conducting pillar (6) includes a first heat-conducting pillar (61) and a second heat-conducting pillar (62) distributed along a direction perpendicular to the circuit board (4); The first heat-conducting pillar (61) is located on the side of the bottom shell (1) facing the circuit board (4), and the second heat-conducting pillar (62) is located on the side of the cover plate (3) facing the circuit board (4). Both the first heat-conducting pillar (61) and the second heat-conducting pillar (62) abut against the circuit board (4).

4. The inverter according to claim 3, characterized in that, The orthographic projection of the first heat-conducting pillar (61) on the circuit board (4) coincides with the orthographic projection of the second heat-conducting pillar (62) on the circuit board (4).

5. The inverter according to claim 3, characterized in that, The orthographic projection of the first heat-conducting pillar (61) on the circuit board (4) is separate from the orthographic projection of the second heat-conducting pillar (62) on the circuit board (4).

6. The inverter according to claim 2, characterized in that, The heat-conducting pillar (6) penetrates the circuit board (4); One end of the heat-conducting column (6) is located on the side of the cover plate (3) facing the circuit board (4), and the other end of the heat-conducting column (6) away from the cover plate (3) abuts against the bottom shell (1); or, One end of the heat-conducting pillar (6) is located on the side of the bottom shell (1) facing the circuit board (4), and the other end of the heat-conducting pillar (6) away from the bottom shell (1) abuts against the cover plate (3).

7. The inverter according to any one of claims 2-6, characterized in that, Along a direction parallel to the circuit board (4), the distance between the switching tube (81) and the heat-conducting pillar (6) is less than or equal to a set distance threshold.

8. The inverter according to any one of claims 2-7, characterized in that, The inverter also includes a power inductor (82), which is fixed to the circuit board (4) and located in the second chamber. One end of the power inductor (82) facing away from the circuit board (4) abuts against one of the bottom shell (1) and the cover plate (3), and the other end of the power inductor (82) facing the circuit board (4) abuts against the heat-conducting column (6) arranged through the circuit board (4).

9. The inverter according to any one of claims 1-8, characterized in that, At least one of the bottom shell (1) and the cover plate (3) includes a protrusion (001) that protrudes in a direction away from the circuit board (4); The protrusion (001) has a first heat dissipation fin (11) or a second heat dissipation fin (31) on the side away from the circuit board (4), and a third heat dissipation fin (002) on the side of the protrusion (001) facing the circuit board (4).

10. The inverter according to claim 6, characterized in that, The bottom shell (1) or the cover plate (3) has a boss (63) or a groove (64) on the side facing the circuit board (4), and one end of the heat-conducting pillar (6) abuts against the boss (63) or is located in the groove (64).

11. The inverter according to claim 6, characterized in that, The heat-conducting column (6) is connected to at least one of the bottom shell (1), the cover plate (3), and the circuit board (4) by fasteners (65).

12. The inverter according to any one of claims 1-11, characterized in that, The heat-conducting column (6) has a heat-conducting medium (7) between it and at least one of the bottom shell (1), the cover plate (3), and the circuit board (4).

13. The inverter according to any one of claims 1-12, characterized in that, The inverter also includes an electric fan (9), which is located in the second chamber and electrically connected to the circuit board (4).

14. The inverter according to any one of claims 1-13, characterized in that, Along a direction parallel to the circuit board (4), the heat-conducting pillars (6) are arranged in a plurality of spaced-apart configurations.

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