Electronic device

Abstract

An electronic device includes a metal backplate and a first circuit board. The metal backplate includes a first plate body and at least one first conductive connection. The first conductive connection is connected to the first plate body and extends at least partially along a first normal of the first plate body. The first circuit board includes a second plate body, a plurality of circuit elements, and at least one second conductive connection. The second plate body has an element side. The circuit elements are disposed on the element side. The second conductive connection is connected to the element side near one of the circuit elements and extends at least partially through the second plate body along a second normal of the second plate body, the second normal being parallel to the first normal. The second conductive connection is at least partially elastically deformable and configured to electrically connect to the first conductive connection. The electronic device can generate a grounding effect during electromagnetic interference testing and can reduce the time required for assembly and disassembly between plates.

Description

Technical Field

[0001] This disclosure relates to a board connection structure for an electronic device, and more particularly to a circuit board connection structure for reducing electromagnetic interference effects. Background Technology

[0002] The circuit boards of display devices are typically located at the back. As integrated circuits become increasingly powerful, the electromagnetic noise generated by the circuit boards also increases. Therefore, components that need to reduce electromagnetic interference are often added to pass electromagnetic interference tests, such as adding shielding or conductive foam to the circuit board to block electromagnetic noise. However, these additional components occupy internal space and increase costs. Therefore, a new technology to reduce electromagnetic noise from the circuit board is needed to overcome the electromagnetic interference problem. Summary of the Invention

[0003] One of the purposes of this disclosure is to provide an electronic device that can generate a grounding effect during electromagnetic interference testing and can reduce the time required for assembly and disassembly between boards.

[0004] According to one embodiment of this disclosure, an electronic device includes a metal backplate and a first circuit board. The metal backplate includes a first plate body and at least one first conductive connection portion. The first conductive connection portion is connected to the first plate body and extends at least partially along a first normal of the first plate body. The first circuit board includes a second plate body, a plurality of circuit elements, and at least one second conductive connection portion. The second plate body has a first side. The circuit elements are disposed on the first side. The second conductive connection portion is connected to a position on the first side near one of the circuit elements and extends at least partially through the second plate body along a second normal of the second plate body, the second normal being parallel to the first normal. The second conductive connection portion is at least partially elastically deformable and configured to electrically connect to the first conductive connection portion.

[0005] In one or more embodiments disclosed herein, the first conductive connection portion and the second conductive connection portion are located between the metal back plate and the first circuit board.

[0006] In one or more embodiments disclosed herein, the first conductive connection portion includes a first body and a retaining sleeve. The first body is connected to a first plate. The retaining sleeve is disposed on the first body and has a slot. The second conductive connection portion includes a second body and two spring arms. The second body is connected to a second plate. The spring arms are parallel to each other and respectively connected to the second body, and the spring arms are configured to at least partially insert into the slot and engage with the retaining sleeve.

[0007] In one or more embodiments disclosed herein, each of the aforementioned spring arms includes an arm body, a first stop structure, and a second stop structure. The arm body is connected to a second body and configured to at least partially insert into a slot. The first stop structure is connected to the arm body. The second stop structure is connected to the arm body and is located away from the second body relative to the first stop structure. A snap-fit ​​space is defined between the second stop structure and the first stop structure, and the retaining sleeve is at least partially located in the snap-fit ​​space and confined between the second stop structure and the first stop structure.

[0008] In one or more embodiments disclosed herein, the arm body described above has a guide surface located at the end of the arm body away from the second body.

[0009] In one or more embodiments disclosed herein, the second plate has at least one opening. The second body includes a first sub-body and a second sub-body. The first sub-body is connected to the spring arm and is perpendicular to the second plate, passing through the opening. The second sub-body is perpendicularly connected to the first sub-body and connected to the first side.

[0010] In one or more embodiments disclosed herein, the first main body includes a third sub-body and a fourth sub-body. The third sub-body is vertically connected to the first plate, and a fixing sleeve is disposed on the third sub-body. The fourth sub-body is connected to the side of the third sub-body away from the first plate and is inclined relative to the third sub-body.

[0011] In one or more embodiments disclosed herein, the electronic device includes a second circuit board. The second circuit board is at least partially stacked on the first board, and a first conductive connection is connected to the side of the second circuit board facing the first circuit board.

[0012] According to another embodiment of this disclosure, an electronic device includes a metal backplate. The metal backplate includes a first plate, a first circuit board, a second circuit board, at least one first conductive connection portion, and at least one second conductive connection portion. The second circuit board is at least partially stacked between the first plate and the first circuit board. The first conductive connection portion is connected to a first side of the second circuit board facing the first circuit board and is fixed to a ground terminal of the second circuit board. The second conductive connection portion is connected to a second side of the first circuit board facing away from the second circuit board and extends at least partially through the first circuit board toward the second circuit board; the second conductive connection portion is electrically connected to the first conductive connection portion.

[0013] According to another embodiment of this disclosure, an electronic device includes a first circuit board, a metal backplate, and at least one second conductive connection portion. The metal backplate includes at least one first conductive connection portion. The first conductive connection portion is connected to a first side of the metal backplate facing the first circuit board. The first conductive connection portion includes a first body, which is integrally formed with the metal backplate and extends toward the first circuit board. The second conductive connection portion is at least fixed to a second side of the first circuit board facing away from the metal backplate and at least partially extends through the first circuit board toward the metal backplate. The first circuit board and the metal backplate are spaced apart by a certain distance. The second conductive connection portion is electrically connected to the first conductive connection portion between the first circuit board and the metal backplate, and the second conductive connection portion and the first conductive connection portion form a grounding circuit.

[0014] The above-described embodiments disclosed herein have at least the following advantages:

[0015] (1) Since the first circuit board is electrically connected to the metal back plate through the first conductive connection part and the second conductive connection part and forms ground, the second conductive connection part can be connected to any position on the second board body where the electromagnetic interference reduction effect is best, and the first conductive connection part is formed at the corresponding position on the first board body, thereby meeting the standard of passing the electromagnetic interference test.

[0016] (2) Since the structure of the second conductive connection part of the first circuit board and the first conductive connection part of the metal back plate is simple, and the connection between the two does not require additional locking elements, it can also replace some of the locking structures of studs and rivets. Therefore, it can effectively reduce the production cost of the first circuit board and the metal back plate, and reduce the assembly or disassembly time.

[0017] (3) For different electronic devices, the length of the first sub-body or the distance between the first stop structure and the second stop structure can be designed according to actual needs to adapt to the first circuit board and metal back plate of different electronic devices, so that the first circuit board and the first plate can remain parallel and are not affected by the structural height. Attached Figure Description

[0018] Figure 1 A perspective view of an electronic device according to an embodiment of this disclosure is provided.

[0019] Figure 2 For illustration Figure 1 An enlarged schematic diagram of the range M;

[0020] Figure 3 For illustration Figure 2 A three-dimensional schematic diagram of the second conductive connection part;

[0021] Figure 4 For illustration Figure 2 A partial perspective view of the first circuit board, in which the second conductive connection part is omitted;

[0022] Figure 5 For illustration Figure 2 A partial three-dimensional schematic diagram of the metal back plate, in which the first conductive connection part is not connected to the second conductive connection part;

[0023] Figure 6 This is a partial perspective view of an electronic device according to another embodiment of the present disclosure.

[0024] [Symbol Explanation]

[0025] 100: Electronic devices

[0026] 110: Metal back panel

[0027] 111: First Plate

[0028] 112: First conductive connection part

[0029] 1121: First Subject

[0030] 1121a: Third Sub-Subject

[0031] 1121b: Fourth Sub-Subject

[0032] 1122: Fixing sleeve

[0033] 120: First circuit board

[0034] 121: Second Plate

[0035] 122: Second conductive connection part

[0036] 1221: Second Subject

[0037] 1221a: First Sub-Subject

[0038] 1221b: Second Sub-Subject

[0039] 1221c: Foolproof structure

[0040] 1222: Spinning Arm

[0041] 1222a: Arm Body

[0042] 1222b: First stop structure

[0043] 1222c: Second stop structure

[0044] 123: Circuit elements

[0045] 130: Second circuit board

[0046] C: Clip space

[0047] H: Card slot

[0048] M: Range

[0049] N1: First normal line

[0050] N2: Second normal line

[0051] OP1: First opening

[0052] OP2: Second opening

[0053] SE: Component side

[0054] SG: Guiding surface Detailed Implementation

[0055] The following describes several embodiments of this disclosure with reference to the accompanying drawings. For clarity, many practical details will be described in the following description. However, it should be understood that these practical details should not be used to limit this disclosure. That is, these practical details are not essential in some embodiments of this disclosure. Furthermore, for the sake of simplicity, some conventional structures and elements will be shown in the drawings in a simple schematic manner, and in all drawings, the same reference numerals will be used to denote the same or similar elements. And, where feasible, the features of different embodiments can be interchanged.

[0056] Unless otherwise defined, all terms used herein (including technical and scientific terms) have their ordinary meanings, meanings that are understandable to those skilled in the art. Furthermore, the definitions of the aforementioned terms in commonly used dictionaries should be interpreted in the context of this specification as having the meaning consistent with the relevant field of this disclosure. Unless specifically defined, these terms will not be interpreted as having idealized or overly formal meanings.

[0057] Please refer to Figures 1-2 . Figure 1 A perspective view of an electronic device 100 according to an embodiment of the present disclosure is provided. Figure 2 For illustration Figure 1 An enlarged schematic diagram of the range M. In this embodiment, as... Figures 1-2As shown, an electronic device 100 includes a metal backplate 110 and a first circuit board 120. The metal backplate 110 includes a first plate body 111 and at least one first conductive connection portion 112. The first conductive connection portion 112 is connected to the first plate body 111 and extends at least partially along a first normal N1 of the first plate body 111. In some embodiments, the first conductive connection portion 112 is a folded portion of the first plate body 111, and the first conductive connection portion 112 and the first plate body 111 are integrally formed, but are not limited thereto. The first circuit board 120 includes a second plate body 121, a plurality of circuit elements 123, and at least one second conductive connection portion 122. The second plate body 121 has an element side SE, which is the side of the second plate body 121 facing away from the first plate body 111, and the circuit elements 123 are disposed on the element side SE. The second conductive connection portion 122 is connected to the element side SE of the second plate 121 near one of the circuit elements 123, and extends at least partially through the second plate 121 along the second normal N2 of the second plate 121. The second normal N2 is parallel to the first normal N1. The second conductive connection portion 122 can be at least partially elastically deformed and is configured to electrically connect to the first conductive connection portion 112. In some embodiments, the second conductive connection portion 122 is welded to the second plate 121, but it is not limited to this. Other structures can also be designed to fix the second conductive connection portion 122 and electrically connect it to the second plate 121.

[0058] In some embodiments, the first circuit board 120 is electrically connected to the metal back plate 110 through the first conductive connection portion 112 and the second conductive connection portion 122 and forms a ground. The second conductive connection portion 122 can be connected to any position on the second board 121 where the electromagnetic interference reduction effect is optimal, and the first conductive connection portion 112 is formed at the corresponding position on the first board 111, thereby meeting the standard for passing the electromagnetic interference test.

[0059] Specifically, the high-frequency signal components in circuit element 123 are sources of electromagnetic interference, such as high-frequency signal sources or high-voltage circuit components. The second conductive connection part 122 can be connected to the second board 121 near the electromagnetic interference source to shorten the grounding circuit length and effectively reduce electromagnetic interference. Traditional electromagnetic interference solutions have various drawbacks. For example, metal shielding covers usually need to cover the entire circuit board, which is bulky and limited by the internal space of the product housing. Conductive foam is prone to displacement and detachment. Metal studs and bolts are limited by the structure of the circuit components and backplate of the circuit board and cannot be designed near the electromagnetic interference source. In one embodiment disclosed herein, the first normal N1 of the first plate 111 and the second normal N2 of the second plate 121 both extend in a vertical direction. During assembly, the first circuit board 120 can move vertically from top to bottom relative to the metal back plate 110, and the second conductive connection portion 122 of the first circuit board 120 is aligned with the first conductive connection portion 112 of the metal back plate 110, so that the first conductive connection portion 112 and the second conductive connection portion 122 can be detachably connected together, which can save the time of assembling the electronic device 100 and avoid the problem of assembly misalignment.

[0060] Please refer to Figure 3 . Figure 3 For illustration Figure 2 A perspective view of the second conductive connection portion 122. In some embodiments, such as Figure 3 As shown, the second conductive connection portion 122 of the first circuit board 120 includes a second body 1221 and two spring arms 1222. The spring arms 1222 are parallel to each other and are respectively connected to the second body 1221. The second conductive connection portion 122 can be made of a conductive and elastic metal material, such as copper, galvanized steel or other similar metals. The two sides of the spring arms 1222 can be pressed and will at least partially deform and move towards each other. When the pressure is released, they will elastically return to their original position.

[0061] Furthermore, such as Figure 3As shown, each of the spring arms 1222 includes an arm body 1222a, a first stop structure 1222b, and a second stop structure 1222c. The arm body 1222a is connected to the second main body 1221. Both the first stop structure 1222b and the second stop structure 1222c are connected to the arm body 1222a, while the second stop structure 1222c is located away from the second main body 1221 relative to the first stop structure 1222b, and a latching space C is defined between the second stop structure 1222c and the first stop structure 1222b. That is, the arm body 1222a between the first stop structure 1222b and the second stop structure 1222c is recessed to form the latching space C, or the first stop structure 1222b and the second stop structure 1222c protrude from the arm body 1222a, so that the spring arm 1222 engages with the first conductive connection portion 112. In one embodiment disclosed herein, the first stop structure 1222b protrudes further from the arm body 1222a than the second stop structure 1222c.

[0062] Furthermore, such as Figure 3 As shown, each of the projectile arms 1222 has a guide surface SG on its arm body 1222a, located at the end of the arm body 1222a away from the second body 1221. In practice, the end of the arm body 1222a away from the second body 1221 has a rounded or beveled corner, and the guide surface SG is a rounded or beveled surface. For example, as... Figure 3 As shown, the end of the arm 1222a gradually tapers inward to form a bevel, and the end has a rounded corner. The guide surface SG is the surface of the bevel and the rounded corner, which can guide the arm 1222a to be inserted into the first conductive connection part 112.

[0063] On the other hand, such as Figure 3 As shown, the second main body 1221 includes a first sub-body 1221a and a second sub-body 1221b. One end of the first sub-body 1221a is connected to the arm 1222a of the spring arm 1222, and the second sub-body 1221b is perpendicularly connected to the other end of the first sub-body 1221a. In practical applications, the second main body 1221 also includes a foolproof structure 1221c, which is connected to the side of the second sub-body 1221b away from the first sub-body 1221a and perpendicular to the second sub-body 1221b.

[0064] Please refer to Figure 4 . Figure 4 For illustration Figure 2 A partial perspective view of the first circuit board 120, wherein the second conductive connection portion 122 is omitted. In one embodiment disclosed herein, as... Figure 4As shown, the first circuit board 120 can be a main circuit board or a power supply board. The second body 121 of the first circuit board 120 has a first opening OP1 and a second opening OP2, which are located near an electromagnetic interference source (i.e., one of the circuit elements 123), such as a high-frequency signal connector, signal line, chip, or high-voltage circuit element. Please also refer to... Figures 2-4 The width of the first opening OP1 is greater than or equal to the width of the spring arm 1222. During assembly, the spring arm 1222 of the second conductive connection 122 and the first sub-body 1221a can pass through the first opening OP1 of the second plate 121, and the foolproof structure 1221c of the second conductive connection 122 is inserted into the second opening OP2, so that the first sub-body 1221a passes perpendicularly through the second plate 121, while the second sub-body 1221b connects to the component side SE (i.e., the side with the electromagnetic interference source) of the second plate 121 and is located between the first opening OP1 and the second opening OP2. The component side SE of the second plate 121 with the electromagnetic interference source is away from the spring arm 1222. Figure 2 As shown. The second sub-body 1221b of the second conductive connection portion 122 can then be welded to the second plate 121 for fixation.

[0065] In one embodiment disclosed herein, the second conductive connection portion 122 is a one-piece integrally molded structure, while the spring arm 1222, the first sub-body 1221a, the second sub-body 1221b, and the foolproof structure 1221c are all sheet-like. Correspondingly, as... Figure 4 As shown, both the first opening OP1 and the second opening OP2 are elongated to facilitate the insertion of the spring arm 1222, the first sub-body 1221a, and the foolproof structure 1221c, respectively.

[0066] Please refer to Figure 5 . Figure 5 For illustration Figure 2 A partial perspective view of the metal back plate 110, wherein the first conductive connection portion 112 is not connected to the second conductive connection portion 122. In one embodiment disclosed herein, as... Figure 5 As shown, the first conductive connection portion 112 of the metal back plate 110 includes a first body 1121 and a fixing sleeve 1122. The first body 1121 is connected to the first plate 111, while the fixing sleeve 1122 is disposed on the first body 1121 and has a slot H.

[0067] Furthermore, such as Figure 5As shown, the first main body 1121 includes a third sub-body 1121a and a fourth sub-body 1121b, which are integrally formed as a single piece. The third sub-body 1121a is vertically connected to the first plate 111, and a fixing sleeve 1122 is disposed on the third sub-body 1121a. The fourth sub-body 1121b is connected to the side of the third sub-body 1121a away from the first plate 111 and is inclined relative to the third sub-body 1121a.

[0068] During assembly, the inclined surface of the fourth sub-body 1121b can guide the spring arm 1222 of the second conductive connection part 122, allowing the spring arm 1222 to slide along the fourth sub-body 1121b towards the slot H of the fixing sleeve 1122. This facilitates positioning and connecting the first conductive connection part 112 during assembly, preventing misalignment. Furthermore, when the spring arm 1222 is inserted into the fixing sleeve 1122, the guiding surface SG can guide the arm body 1222a of the spring arm 1222 to at least partially insert into the slot H of the fixing sleeve 1122. In one embodiment disclosed herein, the spring arms 1222 are at least partially deformed and move towards each other under pressure from the fixing sleeve 1122 or by manual pressure, allowing the second stop structure 1222c to pass through the slot H and the arm body 1222a to engage with the fixing sleeve 1122. After assembly, the fixing sleeve 1122 at least partially... Figure 2 The latching space C shown is located between the second stop structure 1222c and the first stop structure 1222b, and is restricted by the second stop structure 1222c and the first stop structure 1222b.

[0069] Since the second conductive connection portion 122 of the first circuit board 120 and the first conductive connection portion 112 of the metal back plate 110 have simple structures, and the connection between the two does not require additional locking elements, and can also replace some of the locking structures of studs and rivets, the production cost of the first circuit board 120 and the metal back plate 110 can be effectively reduced, and the assembly or disassembly time can be reduced.

[0070] In one embodiment disclosed herein, the first circuit board 120 can be separated from the metal back plate 110. For example, the second stop structure 1222c can be pressed from both sides manually or with tools to bring the spring arms 1222 closer to each other, allowing the fixing sleeve 1122 of the first conductive connection portion 112 to disengage from the snap-fit ​​space C and no longer be restricted by the second stop structure 1222c and the first stop structure 1222b. Then, the first circuit board 120 is lifted to separate the second conductive connection portion 122 from the first conductive connection portion 112 of the metal back plate 110.

[0071] As mentioned above, in some embodiments, the first conductive connection portion 112 is formed by folding a part of the first plate 111, wherein the first plate 111, the third sub-body 1121a, the fourth sub-body 1121b and the fixing sleeve 1122 are integrally formed structures, for example, they can be made by stamping, but are not limited thereto.

[0072] For different electronic devices, the length of the first sub-body 1221a or the distance between the first stop structure 1222b and the second stop structure 1222c can be designed according to actual needs to adapt to the first circuit board 120 and the metal backplate 110 of different electronic devices. In some embodiments, a single-size metal backplate 110 and the first conductive connection portion 112 can be matched with second conductive connection portions 122 of different lengths and sizes. For example, the protrusions on the first plate 111 and the flat surface both have first conductive connection portions 112. The first conductive connection portion 112 on the protrusion corresponds to a shorter second conductive connection portion 122, so that the first circuit board 120 and the first plate 111 can remain parallel and are not affected by the structural height.

[0073] Please refer to Figure 6 . Figure 6 This is a partial perspective view of an electronic device 100 according to another embodiment of the present disclosure. In this embodiment, as... Figure 6 As shown, the electronic device 100 further includes a second circuit board 130. The second circuit board 130 is at least partially stacked on the first plate 111 of the metal backplate 110 and located between the first plate 111 and the first circuit board 120. A first conductive connection portion 112 connects to the side of the second circuit board 130 facing the first circuit board 120 and is electrically connected to the second conductive connection portion 122 of the first circuit board 120. In some embodiments, the first conductive connection portion 112 may be fixed to a ground terminal on the second circuit board 130, for example by soldering or other means, and is electrically connected to the first plate 111. In some embodiments, the electronic device 100 may be a display device, the first circuit board 120 may be a main circuit board, and the second circuit board 130 may be a timing control circuit board.

[0074] In summary, the technical solution disclosed in the above embodiments has at least the following advantages:

[0075] (1) Since the first circuit board is electrically connected to the metal back plate through the first conductive connection part and the second conductive connection part and forms ground, the second conductive connection part can be connected to any position on the second board body where the electromagnetic interference reduction effect is best, and the first conductive connection part is formed at the corresponding position on the first board body, thereby meeting the standard of passing the electromagnetic interference test.

[0076] (2) Since the structure of the second conductive connection part of the first circuit board and the first conductive connection part of the metal back plate is simple, and the connection between the two does not require additional locking elements, it can also replace some of the locking structures of studs and rivets. Therefore, it can effectively reduce the production cost of the first circuit board and the metal back plate, and reduce the assembly or disassembly time.

[0077] (3) For different electronic devices, the length of the first sub-body or the distance between the first stop structure and the second stop structure can be designed according to actual needs to adapt to the first circuit board and metal back plate of different electronic devices, so that the first circuit board and the first plate can remain parallel and are not affected by the structural height.

[0078] Although this disclosure has been described above with reference to embodiments, it is not intended to limit this disclosure. Any person skilled in the art may make various modifications and refinements without departing from the spirit and scope of this disclosure. Therefore, the scope of protection of this disclosure shall be determined by the appended claims.

Claims

1. An electronic device, characterized in that, Include: Metal backplate, including: First plate; and At least one first conductive connection portion connects to the first plate and extends at least partially along a first normal to the first plate; and The first circuit board includes: The second plate has the first side; Multiple circuit elements are disposed on the first side; as well as At least one second conductive connection is connected to a position on the first side near one of the plurality of circuit elements and extends at least partially through the second plate body along a second normal of the second plate body, the second normal being parallel to the first normal. The second conductive connection is at least partially elastically deformable and configured to electrically connect to the first conductive connection.

2. The electronic device as claimed in claim 1, characterized in that, The first conductive connection portion and the second conductive connection portion are located between the metal back plate and the first circuit board.

3. The electronic device as claimed in claim 1, characterized in that, The first conductive connection portion includes: A first main body, connected to the first plate; and A fixing sleeve is disposed on the first body and has a slot. The second conductive connection portion includes: The second main body connects to the second plate; and Two spring arms, parallel to each other and respectively connected to the second body, are configured to at least partially insert into the slot and engage with the retaining sleeve.

4. The electronic device as claimed in claim 3, characterized in that, Each of the two projectile arms comprises: An arm body, connected to the second main body, and configured to at least partially insert into the slot; A first stop structure, connected to the arm body; and The second stop structure is connected to the arm body and is located away from the second body relative to the first stop structure. A snap-fit ​​space is defined between the second stop structure and the first stop structure. The fixing sleeve is at least partially located in the snap-fit ​​space and is confined between the second stop structure and the first stop structure.

5. The electronic device as claimed in claim 4, characterized in that, The arm has a guide surface located at the end of the arm away from the second body.

6. The electronic device as claimed in claim 3, characterized in that, The second plate has at least one opening, and the second body comprises: A first sub-body, connecting the two spring arms and perpendicular to the second plate, passes through the opening; and The second sub-body is vertically connected to the first sub-body and connected to the first side.

7. The electronic device as claimed in claim 3, characterized in that, The first subject includes: A third sub-body is vertically connected to the first plate, and the fixing sleeve is disposed on the third sub-body; and The fourth sub-body is connected to the side of the third sub-body away from the first plate and is inclined relative to the third sub-body.

8. The electronic device as claimed in claim 1, characterized in that, Include: The second circuit board is at least partially stacked on the first board, and the first conductive connection portion is connected to the side of the second circuit board facing the first circuit board.

9. An electronic device, characterized in that, Include: Metal backplate, including: First plate; First circuit board; The second circuit board is at least partially stacked between the first board body and the first circuit board; At least one first conductive connection portion is connected to the first side of the second circuit board facing the first circuit board, and the first conductive connection portion is fixed to the ground terminal of the second circuit board; and At least one second conductive connection is connected to the second side of the first circuit board facing away from the second circuit board, and extends at least partially through the first circuit board toward the second circuit board, wherein the second conductive connection is electrically connected to the first conductive connection.

10. An electronic device, characterized in that, Include: First circuit board; Metal backplate, including: At least one first conductive connection portion is connected to a first side of the metal backplate facing the first circuit board. The first conductive connection portion includes a first body, which is integrally formed with the metal backplate and extends toward the first circuit board. At least one second conductive connection portion is fixed at least to the second side of the first circuit board facing away from the metal back plate, and extends at least partially through the first circuit board toward the metal back plate; The first circuit board is spaced apart from the metal back plate, and the second conductive connection part is electrically connected to the first conductive connection part between the first circuit board and the metal back plate, forming a grounding circuit with the first conductive connection part.

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