Conductive bracket, substrate, bracket, lamp bead packaging structure, material belt and preparation method

Abstract

This invention relates to the field of lighting, specifically to a conductive bracket, substrate, bracket, LED chip packaging structure, material strip, and manufacturing method. The filament bracket includes a conductive bracket and a filament substrate. The conductive bracket includes a first frame and a second frame disposed opposite to each other. The filament substrate is connected between the first frame and the second frame. The filament substrate includes a first substrate, a second substrate, and a pre-cut wire disposed opposite to each other. The pre-cut wire is disposed on the filament substrate, dividing the filament substrate into the first substrate and the second substrate. The first frame includes a first frame and a first terminal pair. The first terminal pair includes a first conductive terminal and a second conductive terminal disposed opposite to each other and connected to the first substrate. The second frame includes a second frame and a second terminal pair. The second terminal pair includes a third conductive terminal and a fourth conductive terminal disposed opposite to each other and connected to the second substrate. This filament bracket simplifies external wiring operations.

Description

Technical Field

[0001] This invention relates to the field of lighting, specifically to a conductive bracket, substrate, bracket, LED chip packaging structure, material strip, and preparation method. Background Technology

[0002] The filament holder is one of the key components affecting the final performance of the product. Please refer to [link / reference]. Figure 1 This is a schematic diagram of the structure of a filament support in the prior art. The existing filament support 90 includes a support 91 and a ceramic strip 92. The conductive terminals 911 and 912 for electrical connection are located on opposite sides of the ceramic strip 92. After the support 91 is cut along the conductive terminals 911 and 912, the conductive terminals 911 and 912 serve as positive and negative poles. When establishing an electrical connection with an external power source, wires must be led out from both sides, which is a relatively cumbersome operation. Summary of the Invention

[0003] In order to solve the technical problem of low yield of existing filament brackets, the present invention provides a conductive bracket, a substrate, a bracket, a lamp bead packaging structure, a material strip, and a preparation method.

[0004] A first aspect of the present invention provides a conductive support, comprising a first frame and a second frame disposed opposite to each other. The first frame includes a first frame and a first terminal pair. The first terminal pair includes a first conductive terminal and a second conductive terminal disposed at a distance from each other along the length direction of the first frame. The first conductive terminal and the second conductive terminal protrude from the first frame toward the second frame. The second frame includes a second frame and a second terminal pair. The second terminal pair includes a third conductive terminal and a fourth conductive terminal disposed at a distance from each other along the length direction of the second frame. The third conductive terminal and the fourth conductive terminal protrude from the second frame toward the first frame.

[0005] A second aspect of the present invention provides a filament substrate, including a first substrate, a second substrate, and a pre-cutting line. The second substrate is disposed opposite to the first substrate along the length direction of the filament substrate and is connected to the first substrate. The pre-cutting line is disposed on the filament substrate, dividing the filament substrate into the first substrate and the second substrate.

[0006] A third aspect of the present invention provides a filament support, including a conductive support and a filament substrate. The conductive support includes a first frame and a second frame disposed opposite to each other. The filament substrate is connected between the first frame and the second frame. The filament substrate includes a first substrate, a second substrate, and a pre-cut wire. The second substrate is disposed opposite to the first substrate along the length direction of the filament substrate and is connected to the first substrate. The pre-cut wire is disposed on the filament substrate, dividing the filament substrate into the first substrate and the second substrate. The first frame includes a first frame and a first terminal pair. The first terminal pair includes a first conductive terminal and a second conductive terminal disposed at a distance from each other along the length direction of the first frame. The first conductive terminal and the second conductive terminal protrude from the first frame toward the second frame and are connected to the first substrate. The second frame includes a second frame and a second terminal pair. The second terminal pair includes a third conductive terminal and a fourth conductive terminal disposed at a distance from each other along the length direction of the second frame. The third conductive terminal and the fourth conductive terminal protrude from the second frame toward the first frame and are connected to the second substrate.

[0007] A fourth aspect of the present invention provides a lamp bead packaging structure, including a filament support, a first conductive line, a first light-emitting chip, a second conductive line, and a second light-emitting chip as provided in the third aspect of the above embodiments. The first conductive line is disposed on the first substrate and electrically connected between the first conductive terminal and the second conductive terminal. The first light-emitting chip is disposed on the first substrate and electrically connected to the first conductive line. The second conductive line is disposed on the second substrate and electrically connected between the third conductive terminal and the fourth conductive terminal. The second light-emitting chip is disposed on the second substrate and electrically connected to the second conductive line.

[0008] A fifth aspect of the present invention provides a light chip strip, the light chip strip including a first frame, the first frame including a first housing, the light chip strip further including a plurality of light chip units arranged in a row along the length direction of the first housing, each light chip unit including a first terminal pair, a first substrate, a first conductive line and a first light-emitting chip, the first terminal pair including a first conductive terminal and a second conductive terminal arranged at intervals along the length direction of the first housing, the first conductive terminal and the second conductive terminal protruding from the first housing in a direction away from the first housing, one end of the first substrate being electrically connected to the first conductive terminal and the second conductive terminal, and the other end being suspended, the first conductive line being connected between the first conductive terminal and the second conductive terminal, and the first light-emitting chip being disposed on the first substrate and electrically connected to the first conductive line.

[0009] A sixth aspect of this invention provides a method for preparing LED chip strips, comprising: A conductive support is provided, wherein the conductive support includes a first frame and a second frame disposed opposite to each other. The first frame includes a first frame and a first terminal pair. The first terminal pair includes a first conductive terminal and a second conductive terminal disposed at a distance from each other along the length direction of the first frame. The first conductive terminal and the second conductive terminal protrude from the first frame toward the second frame. The second frame includes a second frame and a second terminal pair. The second terminal pair includes a third conductive terminal and a fourth conductive terminal disposed at a distance from each other along the length direction of the second frame. The third conductive terminal and the fourth conductive terminal protrude from the second frame toward the first frame. A filament substrate is fixed to the conductive support to obtain a filament support. The filament substrate includes a first substrate, a second substrate, and a pre-cut wire. The second substrate is disposed opposite to the first substrate along the length direction of the filament substrate and is connected to the first substrate. The pre-cut wire is disposed on the filament substrate to divide the filament substrate into the first substrate and the second substrate. The filament bracket is encapsulated to obtain a lamp bead encapsulation structure; The first substrate and the second substrate are separated along the pre-cut line to obtain the lamp bead material strip.

[0010] A seventh aspect of this invention provides a method for preparing LED chip strips, comprising: A conductive support is provided, wherein the conductive support includes a first frame and a second frame disposed opposite to each other. The first frame includes a first frame and a first terminal pair. The first terminal pair includes a first conductive terminal and a second conductive terminal disposed at a distance from each other along the length direction of the first frame. The first conductive terminal and the second conductive terminal protrude from the first frame toward the second frame. The second frame includes a second frame and a second terminal pair. The second terminal pair includes a third conductive terminal and a fourth conductive terminal disposed at a distance from each other along the length direction of the second frame. The third conductive terminal and the fourth conductive terminal protrude from the second frame toward the first frame. A filament substrate is provided, the filament substrate including a first substrate, a second substrate and a pre-cutting line, the second substrate being disposed opposite to the first substrate along the length direction of the filament substrate and connected to the first substrate, the pre-cutting line being disposed on the filament substrate, dividing the filament substrate into the first substrate and the second substrate; The filament substrate is disconnected along the pre-cut line to obtain the first substrate and the second substrate; The substrate is fixed to the frame to obtain the lamp bead bracket; The lamp bead bracket is encapsulated to obtain lamp bead material strip.

[0011] Compared to existing technologies, the filament bracket provided in this invention, by setting pre-broken wires on the filament substrate, allows a single filament substrate to simultaneously form two independent substrates: a first substrate and a second substrate. Combined with the first and second frames of the conductive bracket, two LED units can be simultaneously packaged on one filament bracket. Each LED unit's two electrodes are connected to the same frame side, enabling the positive and negative electrodes of a single LED unit to be led out externally on the same side, eliminating the need for separate wiring on both sides as in traditional methods, thus simplifying external wiring operations. Attached Figure Description

[0012] To more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0013] Figure 1 This is a schematic diagram of the structure of a filament support in the prior art; Figure 2 This is a schematic diagram of a filament support structure provided in an embodiment of the present invention; Figure 3 for Figure 1 The diagram shows the structure of the filament substrate. Figure 4 for Figure 2 A schematic diagram of another implementation of the pre-disconnected wire shown; Figure 5 for Figure 1 The diagram shows the structure of the conductive support. Figure 6 for Figure 1 Sectional view along line AA; Figure 7 for Figure 4 A schematic diagram of another embodiment of the conductive support shown; Figure 8 This is a schematic diagram of the structure of a lamp bead strip provided in an embodiment of the present invention; Figure 9 This is a schematic diagram of the structure of a single LED bead provided in an embodiment of the present invention; Figure 10 This is a schematic diagram of a manufacturing process for a single LED bead provided in an embodiment of the present invention; Figure 11 This is a schematic flowchart illustrating a method for preparing LED chip strips according to an embodiment of the present invention. Figure 12This is a schematic diagram of another manufacturing process for a single LED bead provided in an embodiment of the present invention; Figure 13 This is a schematic flowchart illustrating another method for preparing LED chip strips according to an embodiment of the present invention. Detailed Implementation

[0014] The technical solutions in the embodiments of the present invention will be clearly and completely described below. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of them. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0015] The terminology used in the embodiments of this application is for the purpose of describing particular embodiments only and is not intended to be limiting of this application. The singular forms "a" and "the" as used in the embodiments of this application and the appended claims are also intended to include the plural forms, unless the context clearly indicates otherwise.

[0016] The terms "first" and "second" are used only to describe purposes and to distinguish purposes, such as substances, from one another. The term "multiple" refers to two or more.

[0017] Please see Figure 2 This is a schematic diagram of a filament support structure provided in an embodiment of the present invention. The filament support 100 includes a filament substrate 1 and a conductive support 2. The filament substrate 1 is fixed to the conductive support 2.

[0018] Please see Figure 3 ,for Figure 2 The diagram shows the structure of the filament substrate. The filament substrate 1 is generally a long strip-shaped sheet structure, including a first substrate 11 and a second substrate 12. The second substrate 12 is located along the length of the filament substrate 1. Figure 2 The first substrate 11 is positioned opposite to the second substrate 12 in the center direction (01), and the first substrate 11 is connected to the second substrate 12, which is actually an integrally formed structure.

[0019] The filament substrate 1 is preferably a ceramic strip or a sapphire strip.

[0020] The filament substrate 1 is also provided with a pre-break line 13, the pre-break line 13 being along the width direction of the filament substrate 1. Figure 2 The filament substrate 1 is extended in the middle direction (02), which divides the filament substrate 1 into the first substrate 11 and the second substrate 12 in the length direction.

[0021] The pre-broken line 13 can be formed on the surface of the filament substrate 1 by means of laser cutting, mechanical scribing, or mold pressing, and its depth is less than the thickness of the filament substrate 1, forming a stress concentration area. Of course, the pre-broken line 13 can also be formed directly by mold pressing during the forming process of the filament substrate 1, without the need for additional cutting or scribing after forming.

[0022] In this embodiment, the filament substrate 1 is a ceramic strip. When it is necessary to separate the first substrate 11 and the second substrate 12, a bending force is applied along the pre-break line 13 to make the two break neatly along the line.

[0023] Specifically, the pre-break line 13 can be a groove that extends continuously along the width direction of the filament substrate 1, and its cross-sectional shape can be V-shaped or U-shaped; the pre-break line 13 can also be a dotted line structure formed by multiple perforations spaced apart along the width direction of the filament substrate 1, as long as a stress concentration area is formed at this location for neat breakage.

[0024] In this embodiment, as Figure 3 As shown, there are two pre-cutting lines 13. The two pre-cutting lines 13 are spaced apart along the length of the filament substrate 1, dividing the filament substrate 1 into a first substrate 11, a waste area 14 and a second substrate 12 in sequence along the length.

[0025] The specific positions of the two pre-break lines 13 on the filament substrate 1 are not fixed, but can be adaptively adjusted according to the actual requirements of the target filament bracket for the substrate length. By changing the distance of each of the two pre-break lines 13 from the end of the filament substrate 1, the length dimensions of the first substrate 11 and the second substrate 12 can be controlled respectively. The section of the filament substrate 1 that is not marked into the middle of the first substrate 11 and the second substrate 12 constitutes the waste area 14. This waste area 14 can be broken off and removed by applying external force along the pre-break lines 13 after the filament bracket is assembled, without affecting the structural integrity of the final product.

[0026] Therefore, regardless of the lengths of the first substrate 11 and the second substrate 12, the overall dimensions of the filament substrate 1 and the reference edge used for positioning remain consistent. Thus, when switching between products of different lengths, the processing of multiple product specifications can be completed on the same set of screen printing, die bonding, soldering, and assembly equipment. The same set of equipment can be compatible with the production of multiple product specifications simply by adjusting the marking position of the pre-cut line 13, significantly improving the equipment's versatility and the efficiency of production line changeovers.

[0027] It is understandable that when the sum of the actual required lengths of the first substrate 11 and the second substrate 12 equals the total length of the filament substrate 1, the number of pre-broken wires 13 can be only one, such as... Figure 4 As shown.

[0028] Please see Figure 5 ,for Figure 2 The diagram shows the structure of the conductive support. The conductive support 2 is integrally formed from a conductive metal sheet through punching or etching. The conductive support 2 includes a first frame 21 and a second frame 22 arranged opposite to each other.

[0029] The first frame 21 includes a first frame 211 and a first terminal pair 212. The first frame 211 is a long strip, extending along its length ( Figure 5 In the center direction (02), a plurality of first terminal pairs 212 are provided. Each first terminal pair 212 includes a first conductive terminal 2121 and a second conductive terminal 2122 that are spaced apart from each other along the length direction of the first frame 211. The first conductive terminal 2121 and the second conductive terminal 2122 extend from the first frame 211 toward the second frame 22 (i.e., Figure 5 The first conductive terminal 2121 and the second conductive terminal 2122 are arranged in a cantilevered structure that is separated from each other and relatively spaced apart, protruding outward from the edge of the first frame 211.

[0030] It should be noted that "protruding setting" here refers to the spatial shape of the terminal protruding outward from the edge of the frame. It is formed by cutting the same material as the frame, and the interval between the terminals is a hollow area.

[0031] The first conductive terminal 2121 and the second conductive terminal 2122 are respectively connected to the first substrate 11. Specifically, the first conductive terminal 2121 and the second conductive terminal 2122 can respectively abut against the opposite two sides of the first substrate 11.

[0032] The ends of the first conductive terminal 2121 and the second conductive terminal 2122 may be provided with opposing gripping structures, namely opposing C-shaped and reverse C-shaped gripping structures, to respectively wrap around the opposite sides of the first substrate 11 along the width direction, thereby clamping and fixing the first substrate 11, such as... Figure 6 As shown. A conductive adhesive layer is further provided between the first substrate 11 and the first conductive terminal 2121, and between the first substrate 11 and the second conductive terminal 2122, to achieve electrical connection and mechanical reinforcement. The conductive adhesive layer can be made of conductive adhesive, specifically silver paste and / or solder paste.

[0033] The second frame 22 includes a second frame 221 and a second terminal pair 222. The second frame 221 is parallel to and opposite the first frame 211. The second terminal pair 222 includes components along the length direction of the second frame 221. Figure 5 A third conductive terminal 2221 and a fourth conductive terminal 2222 are arranged at a relative interval in the direction of the center (02). The third conductive terminal 2221 and the fourth conductive terminal 2222 are located from the second frame 221 toward the first frame 21 (i.e., Figure 5 The third conductive terminal 2221 and the fourth conductive terminal 2222 are respectively connected to the second substrate 12. The connection method between the second substrate 12 and the third conductive terminal 2221 and the fourth conductive terminal 2222 is the same as the connection method of the first substrate 11 mentioned above, and will not be described again here.

[0034] In this embodiment, there are multiple first terminal pairs 212, which are arranged at equal intervals along the length of the first frame 211; there are also multiple second terminal pairs 222, which correspond one-to-one with the first terminal pairs 212; there are also multiple filament substrates 1, and the first substrate 11 and the second substrate 12 of each filament substrate 1 are respectively connected to the corresponding first terminal pair 212 and the second terminal pair 222 to form an array-type filament support strip.

[0035] It should be noted that when the lengths of the first terminal pair 212 and the second terminal pair 222 are too long, they are prone to deformation during transportation. To improve structural stability, a second connecting portion 24 and a third connecting portion 25 can also be provided, such as... Figure 5 , 7 As shown. The second connecting portion 24 is located on the side of the first frame 21, connecting between two adjacent first terminal pairs 212, and simultaneously connecting between the first conductive terminal 2121 and the second conductive terminal 2122 of each first terminal pair 212; the third connecting portion 25 is located on the side of the second frame 22, connecting between two adjacent second terminal pairs 222, and simultaneously connecting between the third conductive terminal 2221 and the fourth conductive terminal 2222 of each second terminal pair 222. The second connecting portion 24 and the third connecting portion 25 are cut off in a subsequent process.

[0036] It should be noted that the first frame 21 and the second frame 22 can be separate structures, such as... Figure 5 As shown; the first frame 21 and the second frame 22 can also be an integral structure, with a first connecting part 23 provided between the first frame 21 and the second frame 22, such as Figure 7As shown. When the second connecting part 24 and the third connecting part 25 are provided, the first connecting part 23 can be directly connected between the second connecting part 24 and the third connecting part 25; in other embodiments, the first connecting part 23 can be directly connected between the first frame 211 and the second frame 221.

[0037] This invention provides a filament LED chip packaging structure, including the aforementioned filament support 100. A first conductive line (such as a copper foil line or silver paste line) is provided on the upper surface of the first substrate 11. One end of the first conductive line is electrically connected to the first conductive terminal 2121, and the other end is electrically connected to the second conductive terminal 2122. A first light-emitting chip (such as an LED flip chip) is soldered onto the first conductive line by eutectic bonding or reflow soldering to achieve electrical connection and mechanical fixation. A second conductive line is provided on the upper surface of the second substrate 12. One end of the second conductive line is electrically connected to the third conductive terminal 2221, and the other end is electrically connected to the fourth conductive terminal 2222. A second light-emitting chip is soldered onto the second conductive line.

[0038] The first light-emitting chip and the second light-emitting chip may each contain one or more LED chips. When multiple LED chips are included, the multiple LED chips may be connected in series, in parallel, or in a series-parallel combination on the corresponding conductive lines.

[0039] The filament LED chip encapsulation structure may further include an encapsulating layer (such as silicone or epoxy resin) covering the first and second light-emitting chips. This encapsulating layer may contain phosphor to convert the light emitted by the LED chip into white light of the desired color temperature. The encapsulating layer may further cover part or all of the surfaces of the first substrate 11 and the second substrate 12 to protect the circuitry and the light-emitting chips.

[0040] By breaking the filament and LED chip packaging structure along the pre-cut line 13, two LED chip strips 4 can be obtained, such as... Figure 8 As shown.

[0041] One of the LED chip strips 4a includes the first frame 21 and a plurality of LED chip units 41a, the plurality of LED chip units 41a being along the length direction of the first frame 211 ( Figure 8 The lamp beads are arranged at equal intervals (in the direction of 02). Each lamp bead unit 41a includes the first terminal pair 212, the first substrate 11, the first conductive line, and the first light-emitting chip. After the filament lamp bead packaging structure is broken along the pre-cut line 13, one end of the first substrate 11 is connected to the first conductive terminal 2121 and the second conductive terminal 2122, and the other end is suspended.

[0042] The other LED chip strip 4b includes the second frame 22 and a plurality of LED chip units 41b, which are arranged at equal intervals along the length of the second frame 221. Each LED chip unit 41b includes the second terminal pair 222, the second substrate 12, the second conductive line, and the second light-emitting chip. The structure of the LED chip strip 4b is mirror-symmetrical to that of the LED chip strip 4a along the length of the filament substrate 1, and will not be described further here.

[0043] Along the junction of the first terminal pair 212 and the first frame 211, the first frame 211 is cut off by punching or laser cutting to completely separate the first conductive terminal 2121 and the second conductive terminal 2122. The entire first frame 211 is cut off to obtain the individual LED bead 5. Figure 9 As shown, the first conductive terminal 2121 and the second conductive terminal 2122 serve as the positive and negative electrodes of the individual lamp bead 5.

[0044] Similarly, along the junction of the second terminal pair 222 and the second frame 221, the second frame 221 is cut off by punching or laser cutting to completely separate the second frame 221 from the third conductive terminal 2221 and the fourth conductive terminal 2222. The second frame 221 is completely cut off to obtain the individual lamp bead 5. The third conductive terminal 2221 and the fourth conductive terminal 2222 serve as the positive and negative electrodes of the individual lamp bead 5.

[0045] It is understandable that if the first connecting part 23, the second connecting part 24 and the third connecting part 25 are provided, the first connecting part 23, the second connecting part 24 and the third connecting part 25 need to be cut off.

[0046] Compared to existing technologies, the filament bracket provided in this invention, by setting pre-broken wires on the filament substrate, allows a single filament substrate to simultaneously form two independent substrates: a first substrate and a second substrate. Combined with the first and second frames of the conductive bracket, two LED units can be simultaneously packaged on one filament bracket. Each LED unit's two electrodes are connected to the same frame side, enabling the positive and negative electrodes of a single LED unit to be led out externally on the same side, eliminating the need for separate wiring on both sides as in traditional methods, thus simplifying external wiring operations.

[0047] Furthermore, a pre-cut line is set on the filament substrate, so that a single filament substrate can simultaneously form the first substrate and the second substrate. With the first frame and the second frame of the conductive bracket, two lamp bead units can be packaged on one filament bracket, thereby improving the yield.

[0048] The structure of the aforementioned LED chip strip has been described above. Please refer to [link / reference]. Figure 10 and Figure 11 ,in, Figure 10 This is a schematic diagram of a manufacturing process for a single LED bead provided in an embodiment of the present invention. Figure 11 This is a schematic flowchart illustrating a method for preparing LED chip strips according to an embodiment of the present invention. The method for preparing the LED chip strip includes: 101. Provide the conductive support 2.

[0049] Specifically, the conductive support 2 can be formed on a metal sheet by stamping. During stamping, the area between each terminal is punched out to form a hollow. The first conductive terminal 2121 and the second conductive terminal 2122 protrude from the first frame 211, and the third conductive terminal 2221 and the fourth conductive terminal 2222 protrude from the second frame 221.

[0050] 102. Fix the filament substrate 1 to the conductive bracket 2 to obtain the filament bracket 100.

[0051] The filament substrate 1 is obtained by cutting a ceramic sheet. Pre-cut lines 13 are cut on the filament substrate 1, which divide the filament substrate 1 into a first substrate 11 and a second substrate 12.

[0052] It should be noted that the timing of the pre-cutting of the wire 13 can be performed before the ceramic sheet is cut, after the cutting, before the filament substrate 1 is fixed to the conductive bracket 2, or after it is fixed to the conductive bracket 2. The timing can be flexibly selected according to the convenience of the production process.

[0053] The step of fixing the filament substrate 1 to the conductive support 2 to obtain the filament support 100 specifically includes: The first substrate 11 is fixed to the first conductive terminal 2121 and the second conductive terminal 2122; The second substrate 12 is fixed to the third conductive terminal 2221 and the fourth conductive terminal 2222. For fixing, a wrap-and-bond process can be used. Specifically, conductive adhesive can be applied to the contact points between the filament substrate 1 and each terminal using a dispensing machine. Then, the first substrate 11 is stacked on the surface of the first conductive terminal 2121 and the second conductive terminal 2122, and the second substrate 12 is stacked on the surface of the third conductive terminal 2221 and the fourth conductive terminal 2222. Then, a riveting machine is used to deform each terminal. The end of the first conductive terminal 2121 is bent into a C-shape to cover one edge of the first substrate 11, and the end of the second conductive terminal 2122 is bent into an inverted C-shape to cover the other edge of the first substrate 11. The end of the third conductive terminal 2221 is bent into a C-shape to cover one edge of the second substrate 12, and the end of the fourth conductive terminal 2222 is bent into an inverted C-shape to cover the other edge of the second substrate 12. Thus, the first substrate 11 is clamped and fixed between the first conductive terminal 2121 and the second conductive terminal 2122, and the second substrate 12 is clamped and fixed between the third conductive terminal 2221 and the fourth conductive terminal 2222.

[0054] 103. The filament bracket 100 is encapsulated to obtain the lamp bead encapsulation structure.

[0055] In this process, after conductive lines are formed on the surfaces of the first substrate 11 and the second substrate 12 of the filament substrate 1, light-emitting chips are soldered onto the conductive lines, and an encapsulating adhesive layer is applied to obtain the lamp bead encapsulation structure. Specifically, the conductive lines can be formed on the surfaces of the first substrate 11 and the second substrate 12 by screen printing silver paste lines or plating copper foil lines, and pads are formed at corresponding positions of each conductive line. Light-emitting chips are soldered onto the pads by eutectic bonding or reflow soldering, so that the light-emitting chips and the corresponding conductive lines are electrically connected.

[0056] 104. Separate the first substrate 11 and the second substrate 12 along the pre-cut line 13 to obtain the lamp bead material strip 4.

[0057] The separation method can be to apply bending force along the pre-break line 13 to break it, or to cut it by laser cutting or blade cutting.

[0058] It is understandable that when there is only one pre-cutting line 13, the filament substrate 1 can be directly broken along the pre-cutting line 13 to obtain two independent LED chip strips 4a and 4b. When there are two pre-cutting lines 13 on the filament substrate 1, the waste area 14 will naturally detach when the first substrate 11 and the second substrate 12 are broken, without the need for additional processes.

[0059] 105. Cut the frame along the junction of the terminal pair and the frame to obtain the individual LED bead 5.

[0060] It should be noted that if the first connecting part 23, the second connecting part 24, and the third connecting part 25 are provided: The first connecting portion 23 can be cut off before step 104 to separate the first frame 21 and the second frame 22 from each other; it can also be cut off after step 104 and before step 105, or removed along with the frame removal in step 105. The second connecting portion 24 and the third connecting portion 25 can be cut off together with the first frame 211 and the second frame 221 in step 105. That is, when the terminal pair is separated from the frame, the connecting portion between the adjacent terminal pairs is cut off at the same time, without the need for a separate cutting process.

[0061] Please see Figure 12 and 13 ,in, Figure 12 This is a schematic diagram of another manufacturing process for a single LED bead, provided as an embodiment of the invention. Figure 13 This is a schematic flowchart illustrating another method for preparing LED chip strips according to an embodiment of the invention. The method for preparing the LED chip strip includes: 201. Provide the conductive support 2.

[0062] 202. Provide the filament substrate 1.

[0063] 203. Disconnect the filament substrate 1 along the pre-break line 13 to obtain the first substrate 11 and the second substrate 12.

[0064] The separation method can be to apply bending force along the pre-break line 13 to break it, or to cut it by laser cutting or blade cutting.

[0065] 204. Fix the substrate to the frame to obtain the lamp bead bracket.

[0066] During fixation, a wrap-around bonding process can be used. The first substrate 11 is fixed to the first conductive terminal 2121 and the second conductive terminal 2122; the second substrate 12 is fixed to the third conductive terminal 2221 and the fourth conductive terminal 2222.

[0067] It should be noted that if the first connecting part 23 is provided, the first connecting part 23 is cut off before step 204 to obtain the separate first frame 21 and second frame 22.

[0068] It is understood that the first frame 21 and the second frame 22 are separated from each other after the first connecting portion 23 is cut off. Since their structures are essentially the same, both serve as the frame and do not need to be distinguished in step 203; a uniform fixing operation can be performed. Similarly, the first substrate 11 and the second substrate 12 have already been separated from each other along the pre-cut line 13 in step 202. Since their structures are essentially the same, both serve as the substrate and do not need to be distinguished in step 203. Therefore, in step 204, it is only necessary to fix the multiple substrates with identical structures one by one to the multiple frames with identical structures.

[0069] 205. The lamp bead bracket is encapsulated to obtain the lamp bead strip 4.

[0070] In this process, after conductive lines are formed on the surface of the substrate, light-emitting chips are soldered onto the conductive lines and an encapsulating adhesive layer is applied to obtain the LED chip strip 4.

[0071] 206. Cut the frame along the junction of the terminal pair and the frame to obtain the individual LED bead 5.

[0072] It should be noted that if the second connecting part 24 and the third connecting part 25 are provided, they can be cut off together with the frame in step 206. That is, when the terminal pair is separated from the frame, the connecting part between the adjacent terminal pairs is simultaneously removed, without the need for a separate cutting process.

[0073] The above description is merely a preferred embodiment of the present invention and is not intended to limit the invention. Various modifications and variations can be made to the present invention by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. A conductive support, comprising a first frame and a second frame disposed opposite to each other, characterized in that: The first frame includes a first frame and a first terminal pair. The first terminal pair includes a first conductive terminal and a second conductive terminal that are spaced apart from each other along the length of the first frame. The first conductive terminal and the second conductive terminal protrude from the first frame toward the second frame. The second frame includes a second frame and a second terminal pair. The second terminal pair includes a third conductive terminal and a fourth conductive terminal that are spaced apart from each other along the length of the second frame. The third conductive terminal and the fourth conductive terminal protrude from the second frame toward the first frame.

2. A filament substrate, characterized in that, include: First substrate; The second substrate is disposed opposite to the first substrate along the length direction of the filament substrate and is connected to the first substrate; A pre-cut wire is provided on the filament substrate, which divides the filament substrate into a first substrate and a second substrate.

3. The filament substrate according to claim 2, characterized in that, The number of pre-disconnected wires is one, or... The number of pre-cut lines is two, and the two pre-cut lines are spaced apart along the length direction of the filament substrate, dividing the filament substrate into the first substrate, the waste area and the second substrate in sequence along the length direction.

4. A filament holder, comprising: A conductive support and a filament substrate, wherein the conductive support comprises a first frame and a second frame disposed opposite to each other, and the filament substrate is connected between the first frame and the second frame, characterized in that: The filament substrate includes: First substrate; The second substrate is disposed opposite to the first substrate along the length direction of the filament substrate and is connected to the first substrate; A pre-cut wire is provided on the filament substrate, dividing the filament substrate into a first substrate and a second substrate. The first frame includes: A first frame and a first terminal pair, the first terminal pair including a first conductive terminal and a second conductive terminal disposed at a distance from each other along the length direction of the first frame, the first conductive terminal and the second conductive terminal protruding from the first frame toward the second frame and connected to the first substrate. The second frame includes: The second frame and the second terminal pair, the second terminal pair including a third conductive terminal and a fourth conductive terminal arranged at intervals along the length of the second frame, the third conductive terminal and the fourth conductive terminal protruding from the second frame toward the first frame and connected to the second substrate.

5. The filament support according to claim 4, characterized in that, The number of pre-disconnected wires is one, or... The number of pre-cut lines is two, and the two pre-cut lines are spaced apart along the length direction of the filament substrate, dividing the filament substrate into the first substrate, the waste area and the second substrate in sequence along the length direction.

6. A lamp bead packaging structure, characterized in that, include: The filament holder as described in any one of claims 4-5; A first conductive line is disposed on the first substrate and electrically connected between the first conductive terminal and the second conductive terminal; A first light-emitting chip is disposed on the first substrate and electrically connected to the first conductive line; A second conductive line is disposed on the second substrate and electrically connected between the third conductive terminal and the fourth conductive terminal; The second light-emitting chip is disposed on the second substrate and electrically connected to the second conductive line.

7. A LED chip strip, comprising a first frame, the first frame comprising a first housing, characterized in that, It also includes multiple LED units arranged in a queue along the length direction of the first frame, each LED unit comprising: The first terminal pair includes a first conductive terminal and a second conductive terminal that are spaced apart from each other along the length of the first frame, wherein the first conductive terminal and the second conductive terminal protrude from the first frame in a direction away from the first frame. The first substrate has one end electrically connected to the first conductive terminal and the second conductive terminal, and the other end suspended. A first conductive line is connected between the first conductive terminal and the second conductive terminal; A first light-emitting chip is disposed on the first substrate and electrically connected to the first conductive line.

8. A method for preparing a light bead strip, characterized in that, include: A conductive support is provided, wherein the conductive support includes a first frame and a second frame disposed opposite to each other. The first frame includes a first frame and a first terminal pair. The first terminal pair includes a first conductive terminal and a second conductive terminal disposed at a distance from each other along the length direction of the first frame. The first conductive terminal and the second conductive terminal protrude from the first frame toward the second frame. The second frame includes a second frame and a second terminal pair. The second terminal pair includes a third conductive terminal and a fourth conductive terminal disposed at a distance from each other along the length direction of the second frame. The third conductive terminal and the fourth conductive terminal protrude from the second frame toward the first frame. A filament substrate is fixed to the conductive support to obtain a filament support. The filament substrate includes a first substrate, a second substrate, and a pre-cut wire. The second substrate is disposed opposite to the first substrate along the length direction of the filament substrate and is connected to the first substrate. The pre-cut wire is disposed on the filament substrate to divide the filament substrate into the first substrate and the second substrate. The filament bracket is encapsulated to obtain a lamp bead encapsulation structure; The first substrate and the second substrate are separated along the pre-cut line to obtain the lamp bead material strip.

9. The preparation method according to claim 8, characterized in that, The step of fixing the filament substrate to the conductive support to obtain the filament support includes: The first substrate is fixed to the first conductive terminal and the second conductive terminal; The second substrate is fixed to the third conductive terminal and the fourth conductive terminal.

10. A method for preparing a light bead strip, characterized in that, include: A conductive support is provided, wherein the conductive support includes a first frame and a second frame disposed opposite to each other. The first frame includes a first frame and a first terminal pair. The first terminal pair includes a first conductive terminal and a second conductive terminal disposed at a distance from each other along the length direction of the first frame. The first conductive terminal and the second conductive terminal protrude from the first frame toward the second frame. The second frame includes a second frame and a second terminal pair. The second terminal pair includes a third conductive terminal and a fourth conductive terminal disposed at a distance from each other along the length direction of the second frame. The third conductive terminal and the fourth conductive terminal protrude from the second frame toward the first frame. A filament substrate is provided, the filament substrate including a first substrate, a second substrate and a pre-cutting line, the second substrate being disposed opposite to the first substrate along the length direction of the filament substrate and connected to the first substrate, the pre-cutting line being disposed on the filament substrate, dividing the filament substrate into the first substrate and the second substrate; The filament substrate is disconnected along the pre-cut line to obtain the first substrate and the second substrate; The substrate is fixed to the frame to obtain the lamp bead bracket; The lamp bead bracket is encapsulated to obtain lamp bead material strip.

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