Standard led light source and method for manufacturing the same, lighting device

Abstract

This application provides a standard LED light source, its fabrication method, and an illumination device. The fabrication method of the standard LED light source includes the following steps: providing a packaging bracket; forming three optically isolated independent chambers inside the packaging bracket; placing a first blue light chip in the middle chamber; placing an ultraviolet / violet light chip in the first chamber; and placing a second blue light chip in the second chamber; configuring three types of non-mixable phosphor colloids, each type of phosphor colloid adapted to excite the chip in its corresponding chamber; and independently driving and adjusting the chips in the three independent chambers to calibrate the spectrum to match the target CIE standard light source. The standard LED light source, its fabrication method, and the illumination device provided in this application fundamentally eliminate mutual absorption losses between phosphors by constructing three optically isolated independent chambers within the packaging bracket, where the phosphors in each chamber are physically isolated from each other.

Description

Technical Field

[0001] This application belongs to the field of LED light source technology, and in particular relates to a standard LED light source, its preparation method, and a lighting device. Background Technology

[0002] In the field of light source applications, in order to match the spectral characteristics of standard light sources such as CIE (Commission Internationale de l'Eclairage, International Commission on Illumination) standard D65 and A light sources, LED (Light Emitting Diode) devices are often used to simulate the spectrum of standard light sources to meet the needs of various precision optical testing, color calibration and other scenarios. Accurately replicating the spectrum of standard light sources is the core key to LED light source research and development.

[0003] Currently, the mainstream LED spectral replication methods in the industry are mainly divided into three types, each with inherent defects. The multi-chip mixing method uses multi-color independent LED chips to mix and form the light, but it suffers from problems such as a wide variety of chips, complex driver circuit fabrication, and significant differences in the light decay rate of each chip, leading to spectral shifts over long-term use. The single-chip multi-layer phosphor method is prone to problems such as mutual absorption of phosphor spectra and upper-layer powder blocking of lower-layer blue light, directly causing light source efficiency loss, and making it difficult to control spectral accuracy. While the external filter method can correct the spectrum, it suffers from drawbacks such as high light loss, high manufacturing costs, and a relatively large overall device size.

[0004] In summary, current technologies cannot simultaneously meet the requirements of simplified structure, precise and controllable spectrum, avoidance of adverse phosphor interactions, and compatibility with multiple standard light sources. There is a lack of LED standard light source preparation schemes that are highly adaptable, stable in performance, and have a simplified structure, resulting in significant technical shortcomings. Summary of the Invention

[0005] In view of this, embodiments of this application provide a standard LED light source and its preparation method, as well as an illumination device, to solve the technical problem of unavoidable adverse interactions between phosphors in existing LED light sources.

[0006] In a first aspect, embodiments of this application provide a method for preparing a standard LED light source, comprising the following steps: A packaging bracket is provided, in which three optically isolated independent chambers are formed, the three optically isolated independent chambers including an intermediate chamber and a first chamber and a second chamber located on both sides of the intermediate chamber; A first blue light chip is arranged in the intermediate chamber, an ultraviolet / violet light chip is arranged in the first chamber, and a second blue light chip is arranged in the second chamber; Three types of unmixed phosphor colloids are configured, each suitable for exciting the chip in the corresponding cavity and outputting continuous visible light, short-wave compensated blue light, and near-infrared light respectively. The three types of phosphor colloids were respectively dotted into their respective independent chambers, degassed, and cured by heating. The chips in the three independent chambers are driven and adjusted independently to calibrate the spectrum to match the target CIE standard light source.

[0007] Furthermore, forming three optically isolated independent chambers inside the packaging bracket includes: setting two reflective isolation barriers inside the packaging bracket to divide the bracket cavity into three optically isolated independent chambers; and setting a high-reflectivity coating on the surface of the reflective isolation barriers to block light crosstalk between the chambers.

[0008] Furthermore, when three types of unmixed phosphor colloids are configured respectively, the phosphor colloid in the intermediate chamber contains yellow, green, red, and cyan-green complementary phosphors, which output continuous visible light of 450~700nm after being excited by the first blue light chip; the phosphor colloid in the first chamber is a blue light emitting phosphor, which is excited by the ultraviolet / violet light chip alone and outputs short-wavelength compensated blue light; the phosphor colloid in the second chamber is a Cr (chromium) doped infrared phosphor, which outputs a near-infrared spectrum of 700~1000nm after being excited by the second blue light chip.

[0009] In some embodiments, the phosphor colloid in the first chamber includes blue phosphor with emission peak wavelengths of 415~425nm and blue phosphor with emission peak wavelengths of 450~470nm, respectively, and the mass ratio of the two is (3~5):1; The phosphor colloid in the second chamber includes far-infrared phosphor with emission peak wavelengths of 700~710nm, infrared phosphor with emission peak wavelengths of 750~770nm, and infrared phosphor with emission peak wavelengths of 810~830nm, and the mass ratio of the three is (10~12):1:(4~5). The phosphor colloid in the intermediate chamber comprises green phosphor with emission peak wavelengths of 510-520nm, yellow phosphor with emission peak wavelengths of 540-560nm, red phosphor with emission peak wavelengths of 600-630nm, and red phosphor with emission peak wavelengths of 650-670nm, and the mass ratio of the four phosphors is (3-4):1:(2-3):1.

[0010] In some embodiments, the first chamber includes blue phosphors with emission peak wavelengths of 415-425 nm and 450-470 nm, and the mass ratio of the two is 4:1. The mass ratio of silica gel to phosphor in the first chamber is 1:5. The second chamber includes far-infrared phosphor with emission peak wavelengths of 700-710nm, infrared phosphor with 750-770nm, and infrared phosphor with 810-830nm, and the mass ratio of the three is 11:1:4. The mass ratio of silica gel to phosphor in the second chamber is 1:6. The intermediate chamber contains green phosphor with emission peak wavelengths of 510-520nm, yellow phosphor with emission peak wavelengths of 540-560nm, red phosphor with emission peak wavelengths of 600-630nm, and red phosphor with emission peak wavelengths of 650-670nm, with a mass ratio of 4:1:2:1. The mass ratio of silica gel to phosphor in the intermediate chamber is 1:3.

[0011] In some embodiments, the infrared phosphors described above are all YAG:Cr 3+ The yellow phosphor with an emission peak wavelength of 540~560nm is YAG:Ce 3+ Red phosphors with emission peak wavelengths of 600~630nm and 650~670nm are CaAlSiN3:Eu 2+ The green phosphor with an emission peak wavelength of 510~520nm is β-sialon:Eu 2+ .

[0012] In some other embodiments, the phosphor colloid within the intermediate chamber comprises YAG:Ce 3+ Yellow-green fluorescent powder, β-sialon:Eu 2+ Green phosphor, CaAlSiN3:Eu 2+ Red fluorescent powder and LuAG:Ce 3+ Greenish-blue phosphor, (Sr,Ca)AlSiN3:Eu 2+ At least three of the orange-red fluorescent powders; The phosphor colloid in the first chamber includes BaMgAl 10 O 17 Eu 2+ (BAM) blue phosphor and / or (Sr,Ba)3MgSi2O8:Eu 2+ Blue phosphor; The phosphor colloid in the second chamber includes YAG:Ce 3+ Yellow fluorescent powder, ZnGa2O4:Cr 3+ Infrared phosphor, LiGa5O8:Cr 3+ Infrared phosphor, Gd3Ga5O 12 :Cr 3+ Infrared phosphor, La3Ga5SiO 14 :Cr 3+ At least one of the infrared phosphors.

[0013] In some embodiments, the phosphor colloid in the intermediate chamber is composed of YAG:Ce 3+ Yellow-green fluorescent powder, β-sialon:Eu 2+ Green phosphor, CaAlSiN3:Eu 2+ Red fluorescent powder, LuAG:Ce 3+ It is composed of green phosphor and silica gel, with a mass ratio of silica gel to phosphor of 1:(2~3). The phosphor colloid in the first chamber is composed of BaMgAl 10 O 17 Eu 2+ (BAM) blue phosphor and / or (Sr,Ba)3MgSi2O8:Eu 2+ It is composed of blue phosphor and silica gel, with a mass ratio of silica gel to phosphor of 1:(3~5). The phosphor colloid in the second chamber is composed of ZnGa2O4:Cr 3+ Infrared phosphor and / or LiGa5O8:Cr 3+ It is composed of infrared phosphor and silica gel, with a mass ratio of silica gel to phosphor of 1:(4~6).

[0014] Furthermore, the chips in the three independent chambers are driven and adjusted independently. When calibrating the spectrum to match the target CIE standard light source, the light output intensity of the three chambers is independently controlled by adjusting the drive current or PWM duty cycle.

[0015] Preferably, the packaging bracket is a 2835 / 3030 bracket made of EMC or PCT material. EMC and PCT materials have good heat resistance and reflectivity, and 2835 / 3030 is a common packaging size in the industry, which facilitates industrial production and application integration.

[0016] Secondly, embodiments of this application also provide a standard LED light source, which is prepared using the above-described preparation method.

[0017] Furthermore, the peak wavelengths of the first blue light chip and the second blue light chip are 450±10nm; the peak wavelength of the ultraviolet / violet light chip is 385~410nm, and the excitation bands of the phosphors located in the three independent chambers do not overlap.

[0018] Furthermore, the output spectrum of the standard LED light source can be matched with CIE D65, A, and D50 standard light sources, and the deviation of the visible light spectrum from the standard light source is less than 5%.

[0019] Thirdly, this application also provides a lighting device, including a driving power supply, a control module, and the aforementioned standard LED light source. The driving power supply has three independent adjustable output channels, each corresponding to a chip in one of the three chambers of the light source. The control module has a built-in PWM adjustment unit and a standard light source spectral database. The three independent adjustable driving power supplies, combined with the control module with the built-in standard light source spectral database, enable the lighting device to automatically calculate and output the corresponding driving ratio based on the target standard light source, achieving intelligent and high-precision standard light source simulation.

[0020] The standard LED light source fabrication method provided in this application constructs three optically isolated independent chambers within a single packaged bracket. The phosphors in each chamber are physically isolated from each other, fundamentally eliminating mutual absorption losses between phosphors. Simultaneously, the three chips can be independently driven and adjusted, achieving precise and independent control of the continuous visible spectrum, short-wavelength blue light compensation, and near-infrared spectrum. This allows for high-precision matching of the CIE standard light source, and the luminous efficacy of the standard LED light source is 20% to 35% higher than that of a single-chamber mixed phosphor LED light source.

[0021] The standard LED light source provided in this application embodiment has a three-chamber optical isolation structure, which can realize independent and accurate output of continuous visible spectrum, short-wave blue light compensation and near-infrared spectrum.

[0022] The lighting device provided in this application embodiment has three independent adjustable drive power supplies and a control module with a built-in standard light source spectral database, which enables the lighting device to automatically calculate and output the corresponding drive ratio according to the target standard light source, thereby realizing intelligent and high-precision standard light source simulation. Attached Figure Description

[0023] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0024] Figure 1 A schematic diagram of the three-chamber structure of a standard LED light source packaging bracket; Figure 2 This is a schematic diagram of the standard LED light source fabrication method.

[0025] The reference numerals in the attached figures are explained as follows: 1. Packaging bracket; 2. Intermediate chamber; 3. First chamber; 4. Second chamber; 5. Reflective isolation barrier; 6. High reflective coating; 7. First blue light chip; 8. Ultraviolet / violet light chip; 9. Second blue light chip. Detailed Implementation

[0026] In the following description, specific details such as particular system architectures and techniques are set forth for illustrative purposes and not for limitation, in order to provide a thorough understanding of the embodiments of this application. However, those skilled in the art will understand that the embodiments of this application can also be implemented in other embodiments without these specific details. In other instances, detailed descriptions of well-known systems, apparatuses, circuits, and methods are omitted so as not to obscure the description of the embodiments of this application with unnecessary detail.

[0027] It should also be understood that the term "and / or" as used in the specification of embodiments of this application and the appended claims refers to any combination of one or more of the associated listed items and all possible combinations, and includes such combinations.

[0028] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on or indirectly on that other component. When a component is referred to as being "connected to" another component, it can be directly connected to or indirectly connected to that other component.

[0029] It should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", and "outer" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the embodiments of this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application.

[0030] Furthermore, in the description of the embodiments and the appended claims of this application, the terms "first," "second," "third," etc., are used only for distinguishing descriptions and should not be construed as indicating or implying relative importance.

[0031] In the description of embodiments in this application, references to "some embodiments" or "some embodiments" mean that one or more embodiments of this application include a specific feature, structure, or characteristic described in connection with that embodiment. Therefore, the phrases "in some embodiments," "in some embodiments," "in other embodiments," "in still other embodiments," etc., appearing in different parts of this specification do not necessarily refer to the same embodiments, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized. The terms "comprising," "including," "having," and variations thereof mean "including but not limited to," unless otherwise specifically emphasized. "A plurality" refers to two or more.

[0032] It should be noted that the Chinese meanings of the chemical formulas for the phosphors mentioned in this article are as follows: Cr 3+ Doped infrared phosphors include: YAG:Cr 3+ Chromium-doped yttrium aluminum garnet, ZnGa2O4:Cr 3+ Chromium-doped zinc gallate, LiGa5O8:Cr 3+ Chromium-doped lithium pentagallate, Gd3Ga5O 12 :Cr3+: Chromium-doped gadolinium gallium garnet (GGG:Cr 3+ ), La3Ga5SiO 14 :Cr 3+ Chromium-doped lanthanum gallium silicate; Ce³ + Doped garnet phosphors include: YAG:Ce 3+ Cerium-doped yttrium aluminum garnet (commercially known as yttrium aluminum garnet yellow powder), LuAG:Ce 3+ : Cerium-doped lutetium aluminum garnet; Eu² + Nitride-doped phosphors include: CaAlSiN3:Eu 2+ Europium-doped calcium aluminum silicon nitride, (Sr,Ca)AlSiN3:Eu 2+ Europium-doped strontium calcium aluminum silicon nitride; Eu² + Doped silon phosphors include: β sialon:Eu 2+ Europium-doped β-type silron (β-silron green phosphor); Eu² + Doped aluminate / silicate blue phosphors include: BaMgAl 10 O 17 Eu 2+ (BAM): Europium-doped barium magnesium aluminate (abbreviated as BAM blue powder), (Sr,Ba)3MgSi2O8:Eu 2+ Europium-doped strontium barium magnesium disilicate.

[0033] like Figure 1 and Figure 2 As shown in the figure, this application provides a method for preparing a standard LED light source, including the following steps: S10. A packaging bracket is provided, in which three optically isolated independent chambers are formed, including an intermediate chamber and a first chamber and a second chamber located on both sides of the intermediate chamber. S20. A first blue light chip is placed in the intermediate chamber, an ultraviolet / violet light chip is placed in the first chamber, and a second blue light chip is placed in the second chamber. S30. Three types of unmixed phosphor colloids are respectively configured. The three types of phosphor colloids are respectively adapted to excite the chip in the corresponding cavity and respectively output continuous visible light, short-wave compensated blue light, and near-infrared light. S40. The three types of phosphor colloids are respectively dotted into the corresponding independent chambers, degassed, and cured by heating. S50 allows for independent driving and adjustment of the chips within the three independent chambers, calibrating the spectrum to match the target CIE standard light source.

[0034] By constructing three optically isolated independent chambers within a single packaged bracket, the phosphors in each chamber are physically isolated from each other, fundamentally eliminating mutual absorption losses between phosphors. At the same time, the three chips can be independently driven and adjusted, achieving precise and independent control of the continuous visible spectrum, short-wavelength blue light compensation, and near-infrared spectrum. This allows for high-precision matching of CIE standard light sources. The luminous efficacy of the standard LED light source provided in this application embodiment is 20% to 35% higher than that of a single-chamber mixed phosphor LED light source.

[0035] In application, this technology comprehensively addresses multiple shortcomings of existing technologies through three independent optical isolation chambers for zoned crystal placement, zoned adhesive application, zoned curing, and independent dimming of three light sources. First, the substrate is pre-divided into three non-interfering chambers, eliminating phosphor mixing and layering at the packaging structure level. This completely avoids the light efficiency loss issues inherent in traditional single-chip multi-layer phosphors, such as short-wavelength emission being reabsorbed by long-wavelength phosphors and blue light excitation being blocked by upper-layer phosphors. Compared to multi-layer coating solutions, this directly improves light output efficiency by 20%~35%. Second, the middle and side chambers each house different functional chips, paired with dedicated phosphor colloids, enabling the physical separation and preparation of three light sources: continuous visible light, short-wavelength blue light compensation, and near-infrared spectrum. These three spectra are free from optical coupling interference during the packaging stage, resulting in a clean spectral substrate and laying the hardware foundation for high-precision matching with CIE standard light sources. Finally, an independent drive calibration step is incorporated at the end of the process, allowing for individual adjustment of the output ratio of the three spectral segments. A single packaging structure requires no mold or substrate changes; only the phosphor formulation and drive parameters need to be adjusted to adapt to various standard light sources such as D65, A, and D50, significantly reducing the development and molding costs of multi-specification standard light sources. The entire process integrates lead frame molding, die bonding, dispensing, encapsulation, and spectral calibration. The processes are seamless, eliminating the need for additional filters, simplifying the assembly process, reducing the overall size of the light source, and ensuring even heat dissipation of the distributed chips, thus delaying the light decay of the chips and phosphors. This results in a significant reduction in spectral drift over long-term use.

[0036] In some embodiments, forming three optically isolated independent chambers within the packaging holder includes: Two reflective isolation barriers are set inside the packaging bracket to divide the bracket cavity into three independent chambers that are optically isolated from each other; A highly reflective coating is applied to the surface of the reflective isolation barrier to block light crosstalk between chambers.

[0037] The reflective isolation barrier, combined with a high-reflectivity coating, effectively prevents light crosstalk between chambers while physically isolating the phosphors in each chamber, ensuring the purity and independence of the spectral output of each chamber.

[0038] In application, a dual structure of two reflective isolation barriers dividing the cavity and a high-reflectivity coating on the barriers brings multiple key technological benefits. First, the physical barriers completely isolate the three chambers, preventing contact and cross-mixing of phosphor colloids in each chamber. This eliminates optical absorption losses between different phosphors at the source, preventing light emitted from one chamber from entering other chambers and being absorbed secondary by dissimilar phosphors, thus stabilizing the upper limit of luminous efficacy. Second, the high-reflectivity coating on the barrier surface directionally reflects the light emitted by the excitation of each chip and phosphor within the chambers towards the light-emitting surface, reducing light loss caused by absorption by the support sidewalls and isolation barriers, further improving the overall luminous flux output. Third, the high-reflectivity coating blocks crosstalk between chambers. Full-spectrum visible light from the central chamber will not enter the infrared and blue light compensation chambers on either side, and short-wave and infrared light from the sides will not mix into the central main spectrum. The three spectra are independent and free from stray light interference, significantly improving spectral purity. This prevents stray peak interference during subsequent dimming and calibration, and the deviation between the visible light spectrum and the CIE standard light source can be controlled within 5%. This structure requires no additional light-shielding parts, as it is integrated into the bracket without increasing the packaging volume or assembly steps, and combines the triple advantages of optical isolation, enhanced reflectivity, and miniaturization.

[0039] In some embodiments, when three types of unmixed phosphor colloids are configured, the phosphor colloid in the intermediate chamber contains yellow, green, red, and cyan-green complementary phosphors, which output continuous visible light from 450 to 700 nm after being excited by the first blue light chip; the phosphor colloid in the first chamber is a blue light emitting phosphor, which is excited separately by an ultraviolet / violet light chip and outputs short-wavelength compensated blue light; the phosphor colloid in the second chamber is a Cr-doped infrared phosphor, which outputs a near-infrared spectrum from 700 to 1000 nm after being excited by the second blue light chip. The three chambers respectively undertake the functions of continuous basic spectrum, short-wavelength blue light compensation, and near-infrared supplementary light, and the excitation bands of each phosphor do not overlap, realizing precise spectral function partitioning.

[0040] In applications, the intermediate chamber incorporates yellow, green, red, and cyan complementary phosphors, collaboratively outputting a complete and continuous visible light spectrum from 450 to 700 nm. This fills the spectral gaps of monochromatic and dual-color phosphors, significantly improving the light source's color rendering index (Ra), red (R9), and blue (R12), meeting the requirements of high-precision color detection for high-color-rendering standard light sources. The first chamber is separately configured with blue-emitting phosphors, exclusively excited by an ultraviolet / violet chip, independently supplementing the short-wavelength blue light band. It also specifically optimizes the blue saturation index (R12), compensating for the insufficient short-wavelength blue light of full-spectrum phosphors and resolving color calibration errors caused by the lack of blue spectral coverage in traditional light sources. The second chamber uses Cr-doped infrared phosphors, stably outputting near-infrared light from 700 to 1000 nm, extending the spectrum into the infrared range, making it suitable for applications requiring infrared wavelengths, such as plant lighting and spectrometer calibration. The three types of phosphors are used independently in separate chambers, eliminating the problems of powders overlapping or absorbing each other. Each phosphor can be fully excited by its corresponding chip, maximizing phosphor utilization. At the same time, the three spectral zones are controllable, allowing for flexible adjustment of the power ratio of visible light, short-wave blue light, and infrared light, enabling rapid fitting of CIE standard light sources with different color temperatures and different wavelength weights.

[0041] In some embodiments, the phosphor colloid in the first chamber includes blue phosphor with emission peak wavelengths of 415-425nm and blue phosphor with emission peak wavelengths of 450-470nm, respectively, and the mass ratio of the two is (3-5):1. The phosphor colloid in the second chamber includes far-infrared phosphor with emission peak wavelengths of 700-710nm, infrared phosphor with emission peak wavelengths of 750-770nm, and infrared phosphor with emission peak wavelengths of 810-830nm, and the mass ratio of the three is (10-12):1:(4-5). The phosphor colloid in the intermediate chamber includes green phosphor with emission peak wavelengths of 510~520nm, yellow phosphor with emission peak wavelengths of 540~560nm, red phosphor with emission peak wavelengths of 600~630nm, and red phosphor with emission peak wavelengths of 650~670nm, and the mass ratio of the four phosphors is (3~4):1:(2~3):1.

[0042] In some embodiments, the first chamber includes blue phosphors with emission peak wavelengths of 415-425 nm and 450-470 nm, and the mass ratio of the two phosphors is 4:1. The mass ratio of silica gel to phosphor in the first chamber is 1:5. That is, the mass ratio of blue phosphors with emission peak wavelengths of 415-425 nm and 450-470 nm is 4:1, and the ratio of the sum of the masses of the two phosphors to the mass of silica gel in the first chamber is 5:1.

[0043] The second chamber contains far-infrared phosphors with emission peak wavelengths of 700-710nm, infrared phosphors with emission peak wavelengths of 750-770nm, and infrared phosphors with emission peak wavelengths of 810-830nm, with a mass ratio of 11:1:4. The mass ratio of silica gel to phosphors in the second chamber is 1:6. The mass ratio of far-infrared phosphors with emission peak wavelengths of 700-710nm, infrared phosphors with emission peak wavelengths of 750-770nm, and infrared phosphors with emission peak wavelengths of 810-830nm is 11:1:4, and the mass ratio of the sum of the three types of phosphors to the mass of silica gel in the second chamber is 6:1.

[0044] The intermediate chamber contains green phosphor with emission peak wavelengths of 510–520 nm, yellow phosphor with 540–560 nm, red phosphor with 600–630 nm, and red phosphor with 650–670 nm, in a mass ratio of 4:1:2:1. The mass ratio of silica gel to phosphor in the intermediate chamber is 1:3. In other words, the mass ratio of the green phosphor with emission peak wavelengths of 510–520 nm, yellow phosphor with 540–560 nm, red phosphor with 600–630 nm, and red phosphor with 650–670 nm is 4:1:2:1, and the sum of the masses of the four phosphors is 3:1 compared to the mass ratio of silica gel in the intermediate chamber.

[0045] In some embodiments, the infrared phosphors described above are all YAG:Cr 3+ The yellow phosphor with an emission peak wavelength of 540~560nm is YAG:Ce 3+ Red phosphors with emission peak wavelengths of 600~630nm and 650~670nm are CaAlSiN3:Eu 2+ The green phosphor with an emission peak wavelength of 510~520nm is β-sialon:Eu 2+ .

[0046] In other embodiments, the phosphor colloid in the intermediate chamber comprises YAG:Ce 3+ Yellow-green fluorescent powder, β-sialon:Eu 2+ Green phosphor, CaAlSiN3:Eu 2+ Red fluorescent powder and LuAG:Ce 3+ Greenish-blue phosphor, (Sr,Ca)AlSiN3:Eu 2+ At least three of the orange-red fluorescent powders; The phosphor colloid in the first chamber includes BaMgAl 10 O 17 Eu 2+ (BAM) blue phosphor and / or (Sr,Ba)3MgSi2O8:Eu 2+ Blue phosphor; The phosphor colloid in the second chamber includes YAG:Cr 3+ Infrared phosphor, ZnGa2O4:Cr 3+ Infrared phosphor, LiGa5O8:Cr 3+ Infrared phosphor, Gd3Ga5O 12 :Cr 3+ Infrared phosphor, La3Ga5SiO 14 :Cr 3+ At least two of the infrared phosphors.

[0047] Furthermore, the phosphor colloid in the intermediate chamber is composed of YAG:Ce 3+ Yellow-green fluorescent powder, β-sialon:Eu 2+ Green phosphor, CaAlSiN3:Eu 2+ Red fluorescent powder, LuAG:Ce 3+ The mixture is composed of a bluish-green phosphor and silica gel, with a mass ratio of silica gel to phosphor of 1:(2~3); in other embodiments, the phosphor colloid in the intermediate chamber is composed of YAG:Ce. 3+ Yellow-green phosphor, CaAlSiN3:Eu 2+ Red phosphor, (Sr,Ca)AlSiN3:Eu 2+ It consists of orange-red fluorescent powder and silica gel.

[0048] The phosphor colloid in the first chamber is composed of BaMgAl 10 O 17 Eu 2+ (BAM) blue phosphor and / or (Sr,Ba)3MgSi2O8:Eu 2+ It is composed of blue phosphor and silica gel, with a mass ratio of silica gel to phosphor of 1:(3~5). The phosphor colloid in the second chamber consists of ZnGa2O4:Cr 3+ Infrared phosphor and / or LiGa5O8:Cr 3+ The second chamber is composed of infrared phosphor and silica gel, with a mass ratio of silica gel to phosphor of 1:(4~6). In other embodiments, the phosphor colloid in the second chamber is composed of Gd3Ga5O. 12 :Cr 3+ Infrared phosphor, La3Ga5SiO 14 :Cr 3+ Composed of infrared phosphors.

[0049] Specifically, the mass ratio of silica gel to phosphor in the phosphor colloid in the intermediate chamber is 1:3, the mass ratio of silica gel to phosphor in the phosphor colloid in the first chamber is 1:5, and the mass ratio of silica gel to phosphor in the phosphor colloid in the second chamber is 1:6. The phosphor concentration in each chamber is optimized according to the chip power density and target spectral intensity to ensure that the spectral output intensity of each band meets the matching requirements of the standard light source.

[0050] In application, the intermediate chamber has a phosphor-to-gel ratio of 1:3, with a moderate phosphor filling amount. This ensures sufficient powder to cover the entire visible light spectrum from 450 to 700 nm without causing severe light scattering or blocking the blue light chip's excitation source due to excessive powder concentration, thus guaranteeing stable luminous efficacy in the main visible light spectrum. The first chamber has a phosphor-to-gel ratio of 1:5 for blue light compensation, with a higher phosphor content. This allows for the full conversion of ultraviolet / violet light chip energy into short-wavelength blue light, enhancing the blue light compensation effect and effectively improving the R12 blue color rendering index. At the same time, the lower silica content reduces the absorption loss of short-wavelength ultraviolet light by the silica. The second chamber has an infrared phosphor-to-gel ratio of 1:6, with the highest phosphor concentration. The Cr-doped infrared powder is fully dispersed, maximizing the near-infrared light output power and meeting the infrared band supplementation requirements of the standard light source. Fixed ratios enable standardized mass production, avoiding problems such as poor spectral consistency and high batch dispersion caused by manual adjustments. The spectral differences of light sources prepared in batches are greatly reduced, eliminating the need for extensive calibration of each unit and reducing the time required for mass production spectral debugging. At the same time, the ratio is compatible with the 150℃ / 2h curing process, making the colloid less prone to cracking and sedimentation, thus improving the yield of packaged finished products.

[0051] In some embodiments, the chips in the three independent chambers are driven and adjusted independently. When calibrating the spectrum to match the target CIE standard light source, the light output intensity of the three chambers is independently controlled by adjusting the drive current or PWM duty cycle. This method does not require changes to the hardware structure and can achieve rapid adaptation to different standard light sources through electrical adjustments only, offering high flexibility.

[0052] In this application, two control methods—drive current or PWM duty cycle—are employed to achieve independent adjustment of the three-channel spectrum, overcoming the shortcomings of traditional multi-chip light source drive coupling, mutual interference in spectral adjustment, and limited compatibility with a single standard light source. Adjusting the drive current linearly changes the luminous power of the corresponding chamber chip, enabling continuous fine-tuning of spectral intensity. PWM pulse width modulation achieves high-precision, low-loss dynamic dimming. Both methods can be used individually or in combination, adapting to different circuit schemes such as constant current drive and switching drive. The drive circuits of the three chamber chips are completely independent; adjusting the light intensity of any one channel will not change the spectral output of the other two channels, avoiding the spectral distortion problem of traditional mixed-light chips where one channel's intensity increases at the expense of the other. It can accurately match the power ratio of different CIE standard light sources such as D65, A, and D50. For single-cavity chip or phosphor light decay that occurs during use, the drive power of the corresponding channel can be increased to compensate for the light decay, significantly improving spectral stability over long-term use and preventing the entire light source from becoming unusable. Furthermore, this control method is highly digitalized, allowing connection to the built-in spectral database of the control module and one-click switching to standard light source modes, eliminating the need for repeated manual adjustments and greatly improving ease of use in optical inspection, laboratory calibration, and plant lighting scenarios.

[0053] In some embodiments, the packaging bracket is a 2835 / 3030 bracket made of EMC (Epoxy Molding Compound) or PCT (PolyCyclohexylene Dimethylene Terephthalate). EMC and PCT materials have good heat resistance and reflectivity, and 2835 / 3030 is a common packaging size in the industry, which facilitates industrial production and application integration.

[0054] In some embodiments, EMC and PCT exhibit excellent high-temperature resistance, capable of withstanding prolonged phosphor curing and baking at 150℃. The bracket cavity will not deform or yellow due to high temperatures, and the reflectivity of the inner wall of the cavity remains stable over the long term, preventing luminous efficacy decay caused by high-temperature aging. The two materials possess strong insulation, ensuring no leakage between the three-zone chip wiring and accommodating three independent drive circuit designs. 2835 and 3030 are standard packaging specifications commonly used in the LED industry. Matching die bonding, dispensing, and packaging equipment requires no special custom molds, ensuring compatibility with existing mature mass production lines. This significantly reduces the cost of production line modification and custom bracket mold opening, enabling large-scale mass production. The standardized bracket is compact, with a small footprint per light source, allowing multiple light sources to be arrayed to form a large-area standard lighting surface, suitable for printing calibration tables, plant lighting boxes, optical integrating spheres, and other equipment. The bracket features an integrated insulating barrier, eliminating the need for additional light-shielding parts, simplifying the packaging process, improving production efficiency, and providing uniform thermal conductivity to disperse chip heat and reduce the rate of luminous decay caused by localized high temperatures.

[0055] Secondly, this application also provides a standard LED light source prepared using the above-described method. Utilizing a three-optical-isolation chamber, zoned chips, and zoned independent phosphor structure, the product eliminates phosphor mutual adsorption and powder shading loss at the hardware level, resulting in a luminous efficacy 20%~35% higher than traditional multilayer phosphor LEDs. The three independent light-emitting units are physically and optically isolated, ensuring no crosstalk in the visible, short-wavelength blue, and near-infrared spectra, resulting in a pure spectral substrate and providing hardware support for high-precision matching of CIE standard light sources. The product incorporates three types of dedicated phosphor systems, fully covering the 450~800nm ​​spectral range, and also features high color rendering visible light and near-infrared supplementary bands, applicable to various fields such as color detection, laboratory calibration, and plant supplemental lighting. The dispersed chip arrangement ensures uniform heat dissipation, lower light decay rate, and long-term spectral stability. Furthermore, the product achieves miniaturization using a standardized 2835 / 3030 bracket, eliminating the need for external spectral filters, resulting in a simple overall structure and low assembly and integration difficulty. The product can flexibly adjust the optical power of each band through three independent drives. A single light source hardware can be adapted to multiple standard light sources by simply changing the drive parameters. The product has strong versatility and reduces the inventory and development costs of multiple specifications of light sources.

[0056] In some embodiments, the peak wavelengths of the first and second blue light chips are 450±10nm; the peak wavelengths of the ultraviolet / violet light chips are 385~410nm, and the excitation bands of the phosphors located in the three independent chambers do not overlap. The peak wavelengths of the three types of chips are precisely selected to correspond to the optimal excitation bands of the phosphors in each chamber. While achieving optimal excitation efficiency, the design of non-overlapping excitation bands further ensures optical isolation between chambers.

[0057] In application, the first and second blue LED chips are uniformly limited to 450±10nm, matching the excitation wavelength of the phosphors in the intermediate and infrared chambers. This allows for stable excitation of full-spectrum powders and Cr-doped infrared powders, achieving the highest excitation efficiency. The ultraviolet / violet LED chip, operating in the 385~410nm range, is only matched with blue compensation phosphors, preventing the excitation of phosphors in the other two regions and eliminating the possibility of ultraviolet light entering the intermediate and infrared chambers and causing stray spectral peaks. The excitation wavelengths of the three phosphors do not overlap, ensuring that the excitation light emitted by each chamber chip only affects the powder within its own chamber, preventing the excitation of phosphors in other chambers and avoiding the generation of extra stray light. The spectral curves are free of extra interference peaks, further improving spectral fitting accuracy. The deviation between visible light and the CIE standard light source is stably controlled within 5%. The standardized wavelength range reduces chip selection dispersion and improves spectral consistency during mass production. The isolated excitation wavelength design reduces ineffective light energy excitation, converting more electrical energy into effective luminous flux in the target wavelength range, further optimizing the light source's luminous efficiency. Simultaneously, it avoids non-target excitation that leads to accelerated phosphor aging, extending the overall lifespan of the light source.

[0058] In some embodiments, the output spectrum of the standard LED light source can be matched with CIE D65, A, and D50 standard light sources, with a visible light spectrum deviation of less than 5% from the standard light source. This performance indicator reflects the significant advantage of the present invention in spectral matching accuracy, and can meet the needs of lighting, testing, and scientific research applications with strict requirements for standard light sources.

[0059] In applications, existing multi-chip mixing and multi-layer phosphor solutions generally exhibit spectral deviations exceeding 8%, failing to meet the calibration requirements of high-precision printing, image color correction, and optical metrology laboratories. This invention, relying on a three-cavity isolation and independently adjustable spectral partition structure, can accurately replicate the spectral energy distribution of three types of standard light sources, controlling the spectral error within 5%. The color rendering index, color temperature, and red-blue light band ratio all comply with CIE specifications, meeting the standards for metrology-grade standard light sources. The same hardware light source can switch between multiple standard spectra without replacing the light source itself; mode switching is achieved simply by adjusting the three drive power channels. One testing device can accommodate calibration requirements for daylight, incandescent lamps, and printing standard light sources, significantly reducing equipment procurement costs. High-precision spectral matching ensures accurate color reproduction, eliminating color deviation detection errors caused by spectral deviations, improving the reliability of color measurement and quality inspection results, and adapting to high-end precision optical testing scenarios.

[0060] Thirdly, embodiments of this application also provide a lighting device, including a driving power supply, a control module, and the aforementioned standard LED light source. The driving power supply has three independent adjustable output channels, each corresponding to a chip in one of the three chambers of the light source. The control module incorporates a PWM (Pulse Width Modulation) adjustment unit and a standard light source spectral database. The three independently adjustable driving power supplies, combined with the control module containing the standard light source spectral database, enable the lighting device to automatically calculate and output the corresponding driving ratio based on the target standard light source, achieving intelligent and high-precision standard light source simulation.

[0061] In application, the drive power supply features three independent adjustable output channels, each corresponding to one of the three chamber chips of the light source. The current and PWM signals of each channel are decoupled, allowing for individual adjustment of the output power across any wavelength band, fully leveraging the core advantage of independent spectral control of the three light sources. The control module incorporates a PWM adjustment unit and a standard light source spectral database, pre-stored with the corresponding power ratio parameters for D65, A, and D50 channels, and supports one-click switching to standard light source modes, eliminating the need for repeated spectral calibration by professionals and lowering the operational threshold. The device integrates a heat dissipation substrate (with matching light source heat dissipation), and combined with the distributed chip layout of the light source, it boasts excellent overall heat dissipation performance, exhibiting no significant temperature rise during prolonged continuous operation and maintaining stable, drift-free spectra. The highly integrated device can be directly used in optical laboratories, printing proofing workshops, plant cultivation light boxes, image color grading rooms, and other scenarios. It provides standardized output compliant CIE standard spectra, eliminating the need for additional filters and spectroscopic correction components, resulting in a smaller, more integrated device that balances ease of use, spectral accuracy, and long-term operational stability.

[0062] Example 1 This embodiment provides a method for preparing a standard LED light source that matches the CIE D65 standard daylight source (color temperature 6500K).

[0063] S10 uses a 2835 package bracket made of PCT or EMC. The bracket has three prefabricated independent compartments, which are separated by a reflective barrier. The reflective barrier has a high-reflectivity coating on its surface to block light crosstalk between the compartments.

[0064] S20. Die-bonding step: Die-bond the first blue light chip with a peak wavelength of 450nm in the middle chamber, die-bond the ultraviolet chip with a peak wavelength of 395nm in the first chamber (left area), and die-bond the second blue light chip with a peak wavelength of 450nm in the second chamber (right area). The chips in the three areas are distributed to effectively avoid heat concentration.

[0065] S30. Phosphor colloid preparation: The intermediate chamber phosphor colloid contains four components: yellow phosphor, green phosphor, red phosphor, and cyan-green complementary phosphor. The mass ratio of silica gel to phosphor is 1:2. After being excited by the first blue light chip, it outputs continuous visible light from 450 to 700 nm.

[0066] The first chamber (left area) uses blue light emitting phosphors such as BAM in the phosphor colloid. The mass ratio of silica gel to phosphor is 1:3. It is excited by the ultraviolet chip alone and outputs short-wavelength compensation blue light with an emission peak of 440~460nm to compensate for the short-wavelength blue light component and improve the color rendering index R12.

[0067] The second chamber (right area) uses Cr phosphor colloid. 3+The silica gel is doped with infrared phosphor, and the mass ratio of silica gel to phosphor is 1:4. After being excited by the second blue light chip, it outputs a near-infrared spectrum of 700~800nm, supplementing the near-infrared component and extending the spectrum into the infrared region.

[0068] S40. Dispensing and Curing: Prepare three phosphor colloids according to the above formula, dispense them into their respective independent chambers, degas under vacuum, and then heat-cur them at 150°C for 2 hours. The phosphors in each chamber are physically isolated from each other, and there is no physical mixing or layering, which completely eliminates the loss of short-wavelength emitted light by the reabsorption of long-wavelength phosphors.

[0069] S50, Debugging steps: Adjust the driving current ratio of the three zones (middle chamber: first chamber: second chamber = 1.0:0.3:0.6), independently control the light output intensity of each chamber through PWM duty cycle, and calibrate the spectrum to match the CIE D65 standard light source.

[0070] The performance indicators of the standard LED light source obtained in this embodiment are as follows: Ra≥96, R9≥92, color temperature CCT is 6500K±200K, contains 700~800nm ​​near-infrared components, has no phosphor mutual absorption, luminous efficacy reaches 120lm / W, and the visible light spectrum deviates from the D65 standard light source by less than 5%.

[0071] The phosphor formulation for this embodiment is shown in the table below:

[0072] Example 2 The embodiments in this application are basically the same as those in Embodiment 1, except that the emission peak wavelengths of the phosphors used are different and the mass ratios are different, as shown in the table below: The phosphor formulation for this embodiment is shown in the table below:

[0073] Example 3 The embodiments in this application are basically the same as those in Embodiment 1, except that the emission peak wavelengths of the phosphors used are different and the mass ratios are different, as shown in the table below:

[0074] Comparative Example 1 Referring to the encapsulation structure of Example 1, the difference is that the reflective isolation barrier is removed, and the yellow phosphor, green phosphor, red phosphor, cyan-green complementary phosphor, BAM blue phosphor, and Cr are encapsulated together. 3+ After all the doped infrared phosphors were mixed, they were coated in the same chamber and excited by a single 450nm blue light chip. The remaining packaging process conditions were the same as in Example 1.

[0075] Under the same driving power conditions, the luminous efficacy of the light source obtained in Comparative Example 1 is 88 lm / W, Ra is 82, R9 is 65, and the visible light spectrum deviates from the CIE D65 standard light source by 18%, which cannot effectively compensate for the short-wavelength blue light component and the near-infrared component.

[0076] Comparing the test results of Example 1 and Comparative Example 1, it can be seen that under the same driving power conditions, after adopting the three-chamber optical isolation structure, the luminous efficacy increased from 88 lm / W to 120 lm / W, an increase of approximately 36%; Ra increased from 82 to over 96; and the spectral deviation decreased from 18% to less than 5%. This indicates that the three-chamber optical isolation structure and the physical isolation design of the phosphors in each chamber significantly eliminated the mutual absorption loss of phosphors, greatly improving the luminous efficacy and spectral matching accuracy, an effect that was unexpected.

[0077] It is understood that the packaging bracket in the above embodiments is not limited to the 2835 bracket, and can also be a 3030 bracket or a bracket of other industry-standard packaging sizes. The bracket material is not limited to PCT, and can also be EMC material.

[0078] It is understood that the transparent encapsulation material in the above embodiments is not limited to transparent silicone, but may also be epoxy resin or other transparent encapsulation materials commonly used in the art.

[0079] Obviously, Cr in the above embodiments 3+ Doped infrared phosphors are not limited to a specific composition; any Cr-doped phosphor material that can output a near-infrared spectrum of 700-800nm ​​under blue light chip excitation is suitable.

[0080] It is understood that the independent drive adjustment method in the above embodiments is not limited to adjusting the drive current. It can also use PWM duty cycle adjustment alone, or combine drive current adjustment with PWM duty cycle adjustment to achieve precise independent control of the light output intensity of each chamber.

[0081] Obviously, this invention is not limited to matching CIE D65 and A standard light sources. By adjusting the phosphor formulation of each chamber and the three-way drive ratio, it can also match other standard light sources such as CIE D50 without changing the hardware structure, thus having high versatility.

[0082] Compared with the prior art, the standard LED light source, its preparation method, and the lighting device provided in this application have the following beneficial effects: 1. By setting two reflective isolation barriers inside the packaging bracket and coating their surfaces with a high-reflectivity coating, the packaging cavity is divided into three optically isolated independent chambers. The phosphors in each chamber are physically isolated from each other, completely eliminating the energy loss problem of the light emitted by short-wavelength phosphor being absorbed by long-wavelength phosphor. Compared with the existing single-chip multi-layer phosphor coating scheme, the luminous efficacy is improved by 20-35%, and a luminous efficacy of 120lm / W can be achieved when matched with a CIE D65 standard light source.

[0083] 2. The three independent chambers respectively undertake the independent output functions of continuous visible spectrum (450~700nm), short-wave blue light compensation (440~460nm) and near-infrared spectrum (700~800nm). Each chamber chip achieves independent and precise control by adjusting the drive current or PWM duty cycle. The deviation of the visible light spectrum from the standard light source is less than 5%, which is significantly better than the defects of the existing multi-chip mixing method that are limited in spectral control accuracy due to intracavity optical crosstalk. It can be matched with multiple standard light sources such as CIE D65, A, and D50 with high precision.

[0084] 3. By changing the phosphor formula and the three-way driving ratio, different standard light sources can be quickly adapted without changing the hardware structure. The hardware platform has high versatility, which significantly reduces the development cost and cycle in multi-standard light source application scenarios. At the same time, the three-zone chip dispersion effectively avoids heat concentration and helps to extend the life of the light source.

[0085] In the above embodiments, the descriptions of each embodiment have different focuses. For parts that are not described in detail or recorded in a certain embodiment, please refer to the relevant descriptions of other embodiments.

[0086] The above-described embodiments are only used to illustrate the technical solutions of the embodiments of this application, and are not intended to limit them. Although the embodiments of this application have been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application, and should all be included within the protection scope of the embodiments of this application.

Claims

1. A method for preparing a standard LED light source, characterized in that, Includes the following steps: A packaging bracket is provided, in which three optically isolated independent chambers are formed, the three optically isolated independent chambers including an intermediate chamber and a first chamber and a second chamber located on both sides of the intermediate chamber; A first blue light chip is arranged in the intermediate chamber, an ultraviolet / violet light chip is arranged in the first chamber, and a second blue light chip is arranged in the second chamber; Three types of unmixed phosphor colloids are configured, each suitable for exciting the chip in the corresponding cavity and outputting continuous visible light, short-wave compensated blue light, and near-infrared light respectively. The three types of phosphor colloids were respectively dotted into their respective independent chambers, degassed, and cured by heating. The chips in the three independent chambers are driven and adjusted independently to calibrate the spectrum to match the target CIE standard light source.

2. The preparation method according to claim 1, characterized in that, Three optically isolated independent chambers are formed inside the packaging bracket, including: Two reflective isolation barriers are provided inside the packaging bracket to divide the bracket cavity into three independent chambers that are optically isolated from each other; A highly reflective coating is applied to the surface of the reflective isolation barrier to block light crosstalk between chambers.

3. The preparation method according to claim 1, characterized in that, Three types of immiscible phosphor colloids are configured, each adapted to excite the chip within its corresponding cavity and output continuous visible light, short-wavelength compensated blue light, and near-infrared light, respectively. The phosphor colloid in the intermediate chamber contains yellow, green, red, and cyan-green complementary phosphors, which output continuous visible light from 450 to 700 nm. The phosphor colloid in the first chamber is a blue light emitting phosphor, which is excited separately by an ultraviolet / violet light chip; The phosphor colloid in the second chamber is a Cr-doped infrared phosphor that outputs a near-infrared spectrum of 700~1000nm.

4. The preparation method according to claim 1, characterized in that, The phosphor colloid in the first chamber includes blue phosphor with emission peak wavelengths of 415~425nm and blue phosphor with emission peak wavelengths of 450~470nm, respectively, and the mass ratio of the two is (3~5):1; The phosphor colloid in the second chamber includes far-infrared phosphor with emission peak wavelengths of 700~710nm, infrared phosphor with emission peak wavelengths of 750~770nm, and infrared phosphor with emission peak wavelengths of 810~830nm, and the mass ratio of the three is (10~12):1:(4~5). The phosphor colloid in the intermediate chamber comprises green phosphor with emission peak wavelengths of 510-520nm, yellow phosphor with emission peak wavelengths of 540-560nm, red phosphor with emission peak wavelengths of 600-630nm, and red phosphor with emission peak wavelengths of 650-670nm, and the mass ratio of the four phosphors is (3-4):1:(2-3):

1.

5. The preparation method according to claim 4, characterized in that, The first chamber contains blue phosphors with emission peak wavelengths of 415~425nm and 450~470nm, and the mass ratio of the two is 4:

1. The mass ratio of silica gel to phosphor in the first chamber is 1:

5. The second chamber includes far-infrared phosphor with emission peak wavelengths of 700-710nm, infrared phosphor with 750-770nm, and infrared phosphor with 810-830nm, and the mass ratio of the three is 11:1:

4. The mass ratio of silica gel to phosphor in the second chamber is 1:

6. The intermediate chamber contains green phosphor with emission peak wavelengths of 510-520nm, yellow phosphor with emission peak wavelengths of 540-560nm, red phosphor with emission peak wavelengths of 600-630nm, and red phosphor with emission peak wavelengths of 650-670nm, with a mass ratio of 4:1:2:

1. The mass ratio of silica gel to phosphor in the intermediate chamber is 1:

3.

6. The preparation method according to claim 1, characterized in that, The chips in the three independent chambers are driven and adjusted independently to calibrate the spectrum to match the target CIE standard light source, including: The light output intensity of the three chambers can be independently controlled by adjusting the drive current or PWM duty cycle.

7. A standard LED light source, characterized in that, It is prepared by the preparation method according to any one of claims 1 to 6.

8. The standard LED light source as described in claim 7, characterized in that, The peak wavelengths of the first blue light chip and the second blue light chip are 450±10nm; The peak wavelength of the ultraviolet / violet light chip is 385~410nm, and the excitation bands of the phosphors located in the three independent chambers do not overlap.

9. The standard LED light source as described in claim 7, characterized in that, The output spectrum of the standard LED light source can be matched with CIE D65, A, and D50 standard light sources, and the deviation of the visible light spectrum from the standard light source is less than 5%.

10. A lighting device, characterized in that, The device includes a driving power supply, a control module, and a standard LED light source prepared by the preparation method according to any one of claims 1 to 6 or the standard LED light source according to any one of claims 7 to 9. The driving power supply has three independent adjustable output channels, each corresponding to a chip in one of the three chambers of the light source. The control module has a built-in PWM adjustment unit and a standard light source spectral database.

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