A thermocompression bonding apparatus and method

Abstract

This application provides a thermocompression bonding apparatus and method, relating to the field of packaging technology. It effectively suppresses substrate warping during thermocompression bonding, improves bump height uniformity, and thus increases the bonding window of the substrate. The thermocompression bonding apparatus includes a support platform, a bonding module, and a cover plate. The support platform and bonding module are located on opposite sides of the substrate, and the cover plate is located between the bonding module and the substrate. The support platform is used to hold the substrate. The bonding module is used to bond the chip to the substrate. The cover plate applies pressure to the non-bonding areas of the substrate, pressing the substrate onto the support platform.

Description

Technical Field

[0001] This application relates to the field of packaging technology, and more particularly to a thermocompression bonding apparatus and method. Background Technology

[0002] As chips demand ever greater computing power, storage capacity, and data transfer rates, the application of ultra-large-size packaging technologies (such as chiplets and multi-chip modules, MCMs) is increasing. Chiplets are used to break down large system-on-chips (SoCs) into smaller, function-specific modules. MCMs are used to package multiple chips within a single module.

[0003] Thermo-compression bonding (TCB) is a widely used packaging process that uses thermo-compression bonding equipment to simultaneously apply heat and pressure, forming a reliable electrical and mechanical connection between the chip and the substrate. In thermo-compression bonding equipment, a support platform uses vacuum to hold the substrate in place, allowing the chips to be flattened to a certain extent and resulting in more uniform bump heights.

[0004] However, in current applications of ultra-large size packaging technology, the number of substrate layers and thickness are constantly increasing, and the elastic modulus of the substrate is improving. Vacuum adsorption alone cannot suppress substrate warping, which may lead to poor uniformity of bump height and smaller soldering window. Summary of the Invention

[0005] This application provides a thermocompression bonding apparatus and method that can effectively suppress substrate warping during the thermocompression bonding process, improve bump height uniformity, and thereby increase the bonding window of the substrate.

[0006] In a first aspect, a thermoforming bonding apparatus is provided, comprising: a support platform, a bonding module, and a cover plate. The support platform and the bonding module are located on opposite sides of a substrate, and the cover plate is located between the bonding module and the substrate. The support platform is used to hold the substrate. The bonding module is used to bond a chip to the substrate. The cover plate is used to apply pressure to the non-soldering areas of the substrate, pressing the substrate onto the support platform.

[0007] Based on this scheme, the cover plate applies pressure to the non-soldering area, creating a constraint on the substrate and preventing deformation under high temperature and pressure. This pressure distribution helps maintain the flatness of the substrate, resulting in a more uniform and tighter contact between the chip and the substrate, thereby improving soldering quality, such as increasing the uniformity of bump height. Simultaneously, because the flatness of the substrate is guaranteed, the soldering window is expanded, providing more operating space for chip bonding and improving production efficiency and yield.

[0008] In conjunction with the thermocompression bonding equipment provided in the first aspect, in some possible implementations, the cover plate applies pressure to the non-welding areas of the substrate through magnetic force between itself and the support platform. Based on this scheme, using magnetic pressure allows for a rapid and stable connection between the cover plate and the support platform, facilitating operation and adjustment. Simultaneously, magnetic pressure ensures pressure uniformity, further improving the flatness of the substrate during thermocompression bonding, reducing welding defects caused by uneven pressure, and enhancing welding quality.

[0009] In conjunction with the thermocompression bonding equipment provided in the first aspect, in some possible implementations, the cover plate includes a first region and a second region. The first region is used to connect with a support platform, and the second region is used to apply pressure to the non-welding areas of the substrate when the first region is connected to the support platform. Based on this scheme, dividing the cover plate into different functional regions allows for flexible design and adjustment of the cover plate. The connection function of the first region ensures the stable fixation of the cover plate, while the pressure application function of the second region enables precise pressure application to the non-welding areas of the substrate, improving the accuracy of pressure control and meeting the welding requirements of substrates of different sizes and shapes.

[0010] In conjunction with the thermocompression bonding equipment provided in the first aspect, in some possible implementations, the first region is a magnetic region, used for connection to the support platform via magnetic force. Based on this scheme, designing the first region as a magnetic region and using magnetic force to connect to the support platform simplifies the installation and disassembly process of the cover plate, improving the automation level of the equipment. Magnetic connection is not only stable and reliable, but also enables rapid positioning and alignment, improving production efficiency, while avoiding the wear and loosening problems that may arise from traditional mechanical connections.

[0011] In conjunction with the thermocompression bonding equipment provided in the first aspect, some possible implementations of the thermocompression bonding equipment also include an automation module. The automation module is used to place the cover plate in the non-soldering area during thermocompression bonding. The automation module is also used to move the cover plate away from the non-soldering area at the end of thermocompression bonding. Based on this scheme, introducing the automation module can realize the automatic placement and removal of the cover plate, greatly improving the automation level and production efficiency of the equipment. During the thermocompression bonding process, the automation module can accurately place the cover plate in the non-soldering area, ensuring the accuracy and stability of pressure application; and after welding, it can promptly remove the cover plate without affecting subsequent chip bonding operations, reducing manual intervention and lowering the risk of operational errors.

[0012] In conjunction with the thermocompression bonding equipment provided in the first aspect, in some possible implementations, the non-welding area refers to the area excluding components. Based on this scheme, since the non-welding area excludes components, it can be ensured that applying pressure to the cover plate will not damage the components on the substrate. This effectively protects existing components while ensuring that appropriate pressure is applied to the non-welding area to suppress substrate warping, improving the welding quality of the welding area, and achieving reasonable protection and utilization of different areas of the substrate.

[0013] In conjunction with the thermocompression bonding equipment provided in the first aspect, in some possible implementations, the shape and size of the cover plate are the same as the support surface of the support platform. The support surface refers to the surface of the support platform used to place the substrate. Based on this scheme, making the shape and size of the cover plate the same as the support surface of the support platform can ensure that the cover plate fully covers and uniformly presses the non-welding areas of the substrate during the pressing process. This effectively avoids uneven pressure or local stress concentration caused by mismatch between the cover plate and the support surface, ensuring that the entire substrate maintains good flatness during the thermocompression bonding process and improving the consistency and reliability of the welding.

[0014] In conjunction with the thermocompression bonding equipment provided in the first aspect, in some possible implementations, the non-windowed area of ​​the cover plate is used to contact the non-soldering area to apply pressure to the non-soldering area. The window is used by the bonding module to bond the chip to the soldering area of ​​the substrate. Based on this scheme, by setting a window on the cover plate, precise clearance of the substrate soldering area can be achieved, ensuring that the bonding module can smoothly bond the chip to the substrate soldering area. Simultaneously, the contact pressure between the non-windowed area and the non-soldering area ensures effective compression of the substrate non-soldering area without affecting the chip bonding operation in the soldering area, achieving coordinated pressure application and chip bonding, thus improving the functional integration and working efficiency of the equipment.

[0015] In conjunction with the thermocompression bonding equipment provided in the first aspect, in some possible implementations, magnets are provided along the edge of the cover plate, and magnetic steel is provided in the area of ​​the support platform opposite to the edge of the cover plate. The cover plate applies pressure to the non-welding area of ​​the substrate through the magnetic force between the magnets and the magnetic steel. Based on this scheme, by placing magnets along the edge of the cover plate and cooperating with the magnetic steel of the support platform to apply pressure, a stable connection and uniform pressure can be achieved between the cover plate and the support platform. The magnetic force between the magnets and the magnetic steel not only provides sufficient pressure to suppress substrate warping but also ensures uniform pressure distribution along the edge of the cover plate, avoiding uneven substrate deformation caused by excessive or insufficient local pressure. In addition, this magnetic connection method is easy to install and disassemble, which is beneficial for equipment maintenance and adjustment.

[0016] In a second aspect, a thermocompression bonding method is provided, applicable to a thermocompression bonding apparatus according to any implementation of the first aspect. The method includes: placing a substrate on a support platform; placing a cover plate on a non-soldering area of ​​the substrate to press the substrate onto the support platform; and bonding a chip to the substrate using a chip head.

[0017] It should be understood that the second aspect of this application is consistent with or corresponds to the technical solution of the first aspect of this application, and therefore the beneficial effects obtained by the corresponding feasible implementation are similar, which will not be repeated here. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the structure of a TCB device;

[0019] Figure 2 This is a schematic diagram illustrating how a TCB device causes substrate warping.

[0020] Figure 3 This is a schematic diagram of the structure of a thermocompression bonding device provided in an embodiment of this application;

[0021] Figure 4 This is a top view of a cover plate provided in an embodiment of this application;

[0022] Figure 5 A top view schematic diagram of another cover plate provided in an embodiment of this application;

[0023] Figure 6 This is a schematic diagram showing the dimensions of a cover plate provided in an embodiment of this application. Detailed Implementation

[0024] The thermocompression bonding apparatus and method of the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. The present invention may be implemented in various forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art.

[0025] It should be noted that the accompanying drawings are all in a very simplified form and use non-precise proportions, and are only used to facilitate and clearly illustrate the purpose of the embodiments of the present invention.

[0026] In this application embodiment, "connection" not only means that one component is directly connected to another component, but also that one component is indirectly connected to another component via an intermediate component. In addition, unless specifically mentioned otherwise, the singular form can include the plural form, and vice versa.

[0027] References to "one embodiment" or "some embodiments" as described in this application mean that one or more embodiments of this application include a specific feature, structure, or characteristic described in connection with that embodiment. Therefore, the phrases "in one embodiment," "in some embodiments," "in other embodiments," "in still other embodiments," etc., appearing in different parts of this specification do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized. The terms "comprising," "including," "having," and variations thereof mean "including but not limited to," unless otherwise specifically emphasized.

[0028] Furthermore, in the embodiments of this application, words such as "exemplarily" and "for example" are used to indicate examples, illustrations, or descriptions. Any embodiment or design scheme described as an "example" in this application should not be construed as being more preferred or advantageous than other embodiments or design schemes. Specifically, the use of the term "example" is intended to present concepts in a concrete manner. In the embodiments of this application, "of," "corresponding (relevant)," and "corresponding" may sometimes be used interchangeably, and it should be noted that their intended meanings are consistent unless their distinction is emphasized.

[0029] The application scenarios described in this application are for the purpose of more clearly illustrating the technical solutions of this application, and do not constitute a limitation on the technical solutions provided in this application. As those skilled in the art will know, with the emergence of new scenarios, the technical solutions provided in this application are also applicable to similar technical problems.

[0030] To facilitate understanding, the application scenarios of the embodiments of this application will be described below.

[0031] With the rapid development of artificial intelligence (AI) and network interaction technologies, the demand for computing power, storage capacity, and data transmission rates in chips is growing exponentially, driving the application of ultra-large-size packaging technology. Ultra-large-size packaging technology is an advanced packaging technology in the semiconductor field, primarily used to meet the high computing power requirements of high-performance computing, artificial intelligence, and other high-performance computing scenarios.

[0032] However, when traditional secondary packaging processes (such as flip-chip bonding) are applied to ultra-large-size packages, bridging (short circuit between adjacent solder joints) and cold solder joints (weak connections due to insufficient soldering) defects are prone to occur.

[0033] Specifically, substrate materials are typically glass fiber, metal, organic materials, etc., and the inherent coefficient of thermal expansion (CTE) of these materials is much greater than that of the chip material (the CTE of the substrate material is about four times that of the chip material). Therefore, during high-temperature soldering, the distance between adjacent controllable collapse chip connection bumps (C4bumps) and pads decreases, increasing the risk of contact and potentially leading to bridging.

[0034] Furthermore, during high-temperature soldering, there is a difference in warpage between the substrate and the chip itself. As the package size increases, this warpage difference worsens, making it impossible to control the C4 bump height. Consequently, some C4 bumps may be too low in height, causing the solder tin (Sn) to be squeezed out, resulting in sufficient contact pressure and distance between adjacent C4 bumps to produce a cold solder joint.

[0035] TCB (Through-Chip Packaging) is a high-precision process in semiconductor packaging that enables reliable connections between the chip and the substrate, thus mitigating some of the problems encountered by traditional two-stage packaging processes. For example, please refer to... Figure 1 This is a schematic diagram of the structure of a TCB device. It should be understood that... Figure 1 This is merely an illustrative example of a TCB device; in practical applications, TCB devices may include more than [specific examples / specifications]. Figure 1 The following description includes more or fewer components, which are not limited here.

[0036] like Figure 1 As shown, the TCB device includes a bonding module 101, a support platform 102, and a heating plate ( Figure 1 (not shown in the image), vacuum adsorption system ( Figure 1 (not shown in the image) and optical alignment system ( Figure 1 (Not shown in the image). The bonding module 101 can be composed of a placement head 111 and a pick-up tip 121. The structural relationships and functions of each component are described below.

[0037] The support platform 102 (chuck, also known as the bond stage) is located at the bottom of the device and is used to place and fix the substrate. The support platform 120 is a flat platform with high-precision flatness and stability, thereby ensuring that the substrate will not shift or deform during the bonding process.

[0038] The vacuum system can be configured in the support platform to fix the substrate on the platform by vacuum adsorption, preventing the substrate from moving during the bonding process.

[0039] The hot pedestal, located above the support platform, is used to preheat the substrate. Hot pedestals typically offer good temperature uniformity and a rapid heating rate, allowing for precise temperature control of the substrate. The temperature of the hot pedestal is usually set between 150°C and 200°C to reduce the difference in thermal expansion between the substrate and the chip, thus lowering the risk of bridging and cold soldering.

[0040] The bonding module 101 is used to bond the chip to the substrate. The bonding head 111, located above the heating plate, is used to pick up, align, and place the chip. The bonding module is typically driven by a high-precision linear servo motor, capable of precisely controlling the chip's vertical movement and pressure application.

[0041] The nozzle 121 is located at the bottom of the placement head 111 and is used to directly contact and hold the chip. The nozzle 121 is designed to ensure that the chip remains flat during heating and pressure application, preventing chip displacement or damage. The size of the nozzle 121 matches the chip size, and it is usually made of single crystal with excellent thermal conductivity. It also has a vacuum channel inside to firmly hold and fix the chip.

[0042] The optical alignment system includes upper and lower cameras for precise alignment of the chip and substrate. The camera system features a thermally controlled design to prevent image distortion due to high temperatures, ensuring accurate alignment.

[0043] Based on the above introduction, it should be understood that the main heat inputs of the TCB equipment are the heating plate above the substrate and the suction head 121. This reduces the expansion caused by heat input below the substrate, lowering the risk of bridging between the bump and adjacent pads during ultra-large size packaging. Additionally, the TCB equipment uses a vacuum suction system to flatten the substrate and chip to a certain extent, which helps improve the height uniformity of the bump and reduces the risk of cold soldering.

[0044] However, with the continuous increase in the number and thickness of substrate layers in ultra-large-scale packaging technology, the elastic modulus of the substrate increases, and vacuum adsorption alone may not be effective in suppressing substrate warping. For example... Figure 2 As shown, warping of substrate P leads to a reduction in the soldering process window (the area of ​​the substrate decreases when viewed from above), and deterioration of the uniformity of the C4 bump height on chip I.

[0045] To address the aforementioned issues, this application provides a thermocompression bonding apparatus and method that can effectively suppress substrate warping during the thermocompression bonding process, improve bump height uniformity, and thereby increase the substrate's bonding window.

[0046] The thermocompression bonding apparatus provided in the embodiments of this application will be described below. It should be noted that the thermocompression bonding apparatus and method provided in the embodiments of this application can be applied to, but are not limited to, secondary packaging of substrates in packaging technologies such as flip chip ball grid array (FCBGA), chip on wafer on substrate (CoWoS), and fan-out package (FOP).

[0047] Please refer to Figure 3 This is a schematic diagram of the structure of a hot-press bonding device provided in an embodiment of this application. Figure 3 As shown, the device may include a bonding module 301, a support platform 302, and a cover plate 303. The support platform 302 and the bonding module 301 are located on opposite sides of the substrate P, and the cover plate 303 is located between the bonding module 301 and the substrate P.

[0048] The support platform 302 is used to place the substrate P. The bonding module 301 is used to bond the chip I to the substrate P. For a description of the support platform 302 and the bonding module 301, please refer to the relevant descriptions in the foregoing embodiments; they will not be repeated here.

[0049] The cover plate 303 can contact the non-soldering area of ​​the substrate P to apply pressure (i.e., a force pointing towards the support platform 302) to the non-soldering area, pressing the substrate P onto the support platform 302. In this way, the pressure applied by the cover plate 303 to the non-soldering area of ​​the substrate P creates a constraint force on the substrate P, preventing deformation of the substrate P under high temperature and pressure. In other words, the pressure applied by the cover plate 303 to the non-soldering area of ​​the substrate P helps maintain the flatness of the substrate P, resulting in a more uniform and tighter contact between the chip I and the substrate P, thereby improving soldering quality, such as improving the uniformity of bump height. Simultaneously, because the flatness of the substrate P is guaranteed, the soldering window is expanded, providing more operating space for bonding the chip I to the substrate P, which is beneficial for improving production efficiency and yield.

[0050] In the embodiments of this application, the non-soldering area of ​​the substrate can refer to the area on the substrate that does not contain components such as capacitors, pads, or sn. In other words, the contact area between the cover plate and the substrate, that is, the area where the cover plate applies pressure to the substrate, does not contain components such as capacitors, pads, or sn.

[0051] For example, please refer to Figure 4 This is a top view schematic diagram of a cover plate provided in an embodiment of this application. Figure 4As shown, the cover plate 303 may include a first region 113, a second region 123, and a window 133. During thermocompression bonding, the first region 113 may be connected to a support platform, and the second region 123 may contact the non-soldering area of ​​the substrate P, applying pressure to the non-soldering area. The window 133 is used to expose the soldering area of ​​the substrate P so that the bonding module 301 can perform soldering.

[0052] In some possible implementations, the first region 113 or a portion thereof may be a magnetic region. For example, the magnetic region may be distributed in, for instance... Figure 4 The two sides of the cover plate 103 shown (such as) Figure 4 (As shown on the left and right sides). For example, as... Figure 5 As shown, one or more magnets 501 can be provided on the left and right sides of the cover plate 103. Figure 5 (Taking four magnets as an example). Correspondingly, the area where the support platform contacts the first region 113 can be made of magnetic steel to achieve a magnetic connection between the cover plate 103 and the support platform. Thus, using magnetic force to connect with the support platform simplifies the installation and disassembly process of the cover plate, improving the automation level of the equipment. Magnetic connection is not only stable and reliable, but also enables rapid positioning and alignment, improving production efficiency, while avoiding the wear and loosening problems that may arise from traditional mechanical connections. Furthermore, by placing magnets along the edge of the cover plate to cooperate with the magnetic steel of the support platform to apply pressure, a stable connection and uniform pressure can be achieved between the cover plate and the support platform. The magnetic force between the magnets and the magnetic steel not only provides sufficient pressure to suppress substrate warping, but also ensures uniform pressure distribution along the edge of the cover plate, avoiding uneven substrate deformation caused by excessive or insufficient local pressure.

[0053] It should be understood that Figure 5 The number and distribution of magnets shown are merely exemplary and do not represent a limitation of this application. This application does not limit the material, size, number, distribution, or other aspects of the cover plate in its embodiments.

[0054] In some other possible implementations, the cover plate 303 may apply pressure to the non-welded area based on its own mass (or weight).

[0055] In other possible implementations, the cover plate 303 can be locked to the support platform 302 using screws, clamps, or other devices, thereby applying pressure to the non-soldering area of ​​the substrate P. This application does not limit the mechanical devices used to lock the cover plate 303 to the support platform 302.

[0056] To improve production efficiency and reduce human intervention and operational errors, an automation module can be installed in the TCB equipment. This module can place the cover plate in the non-welding area during thermoforming bonding and move it away from the non-welding area after the bonding process is complete. Examples of the automation module include mechanical clamps, mechanical jigs, and robotic arms, among others. Introducing this module enables automatic placement and removal of the cover plate, thereby improving the automation level and production efficiency of the TCB equipment.

[0057] It should be understood that by designing the operating logic and movement trajectory of the automation module, it can be ensured that the cover plate will not interfere with or collide with the internal components of the TCB equipment during the movement and transfer of the cover plate.

[0058] In this embodiment, the shape and size of the cover plate can be the same as the support surface of the support platform (i.e., the surface of the support platform used to place the substrate). This ensures complete coverage and uniform pressure on the non-welding areas of the substrate during the pressing process, effectively avoiding uneven pressure or localized stress concentration caused by mismatch between the cover plate and the support surface. This ensures the entire substrate maintains good flatness during thermoforming bonding, improving the consistency and reliability of the welding. It should be understood that the shape and size of the cover plate can also differ from the support surface; this is not specifically limited here.

[0059] When performing packaging operations with substrate sizes exceeding 70*70um, chip sizes exceeding 50*50um, and bump distances less than 150um, the thermoforming bonding equipment provided in this application embodiment can achieve a bump slice height deviation within 7um, exhibiting good uniformity. This is verified through experiments below.

[0060] Please refer to Figure 6 This is a schematic diagram of the dimensions of a cover plate provided in an embodiment of this application, such as... Figure 6 As shown, the cover plate 601 includes windows 611 and 621, and 20 magnets 602. The 20 magnets 602 are distributed in a 2*10 pattern on both sides of the cover plate 601, with a width of 13mm for each side. The substrate P1 is thermo-bonded to the window 611. The two sides of the cover plate 601 press against the substrate P1 within a 3mm radius. The substrate P2 is the same as substrate P1 and will not be described further. The width of windows 611 and 621 is 109mm. The dimensions of substrates P1 and P2 are both 115*77.5mm, with a thickness of 2.4mm. The outer contour dimensions of the support platform are the same as those of the cover plate.

[0061] During thermocompression bonding, chip A is bonded to substrate P1, and chip B is bonded to substrate P2. The temperature of the bonding head during bonding is 300 degrees Celsius, the temperature of the support platform is 160 degrees Celsius, and the total bonding time is 45 seconds. Thus, at the end of the thermocompression bonding process, the bump height distribution on chips A and B is shown in Table 1 (unit: μm).

[0062] Table 1

[0063]

[0064] As can be seen from Table 1, the deviation of bump height is within 7 μm, indicating good uniformity.

[0065] With the welding head temperature at 320 degrees Celsius, the support platform temperature at 170 degrees Celsius, and the total welding time at 30 seconds, the height distribution of bumps on chip A and chip B after the thermosetting bonding process is shown in Table 2 below (unit: μm).

[0066] Table 2

[0067]

[0068] As can be seen from Table 2, the deviation of bump height is within 7 μm, indicating good uniformity.

[0069] In adopting Figure 1 The thermocompression bonding apparatus shown performs thermocompression bonding on substrates P1 and P2, chip A and chip B. During the bonding process, the temperature of the bonding head is 300 degrees Celsius, the temperature of the support platform is 160 degrees Celsius, and the total bonding time is 45 seconds. The height distribution of bumps on chip A and chip B is shown in Table 3 below (unit: μm).

[0070] Table 3

[0071]

[0072] As can be seen from Table 3, when adopting Figure 1 When using the hot-press bonding device shown, the deviation in bump height reaches 18µm, indicating poor uniformity.

[0073] Based on the above experiments, it can be seen that the hot-press bonding equipment provided in this application embodiment can effectively suppress the warping of the substrate during the hot-press bonding process, improve the uniformity of bump height, and thus increase the bonding window of the substrate.

[0074] This application also provides a thermocompression bonding method, applicable to a thermocompression bonding apparatus in any of the aforementioned embodiments. The method includes: placing a substrate on a support platform; placing a cover plate on a non-soldering area of ​​the substrate to press the substrate onto the support platform; and bonding a chip to the substrate using a chip head.

[0075] It should be understood that each step and possible implementation of the hot-press bonding method provided in this application can be referred to the description of the hot-press bonding equipment in the foregoing embodiments, and no specific limitation is made here.

[0076] The terms “first,” “second,” “third,” “fourth,” etc. (if present) in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a particular order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms “comprising” and “having,” and any variations thereof, are intended to cover non-exclusive inclusion.

[0077] Those skilled in the art should realize that the above one or more examples are only used to illustrate the technical solutions of this application, and not to limit them; although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or make equivalent substitutions for some of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A hot-press bonding device, characterized in that, include: The support platform, the bonding module, and the cover plate are respectively located on both sides of the substrate, and the cover plate is located between the bonding module and the substrate. The support platform is used for placing the substrate; the bonding module is used for bonding the chip to the substrate. The cover plate is used to apply pressure to the non-welded areas of the substrate, pressing the substrate onto the support platform.

2. The hot-press bonding apparatus according to claim 1, characterized in that, The cover plate applies pressure to the non-welded areas of the substrate through magnetic force between itself and the support platform.

3. The hot-press bonding apparatus according to claim 1 or 2, characterized in that, The cover plate includes a first region and a second region. The first region is used to connect with the support platform, and the second region is used to apply pressure to the non-welded area of ​​the substrate when the first region is connected with the support platform.

4. The hot-press bonding apparatus according to claim 3, characterized in that, The first region is a magnetic region, which is used to connect to the support platform by magnetic force.

5. The hot-press bonding apparatus according to any one of claims 1-4, characterized in that, The hot-press bonding equipment further includes an automation module; the automation module is used to place the cover plate in the non-welding area during hot-press bonding; the automation module is also used to move the cover plate away from the non-welding area when the hot-press bonding ends.

6. The hot-press bonding apparatus according to any one of claims 1-5, characterized in that, The non-welded area refers to the area excluding components.

7. The hot-press bonding apparatus according to any one of claims 1-6, characterized in that, The cover plate has the same shape and size as the support surface of the support platform; the support surface refers to the surface of the support platform used to place the substrate.

8. The hot-press bonding apparatus according to claim 7, characterized in that, The cover plate is provided with a window; the non-window area of ​​the cover plate is used to contact the non-welding area to apply pressure to the non-welding area; the window is used by the bonding module to bond the chip to the welding area of ​​the substrate.

9. The hot-press bonding apparatus according to claim 7 or 8, characterized in that, The cover plate is provided with a magnet along its edge, and the support platform is provided with a magnetic steel in the area opposite to the edge of the cover plate; the cover plate applies pressure to the non-welded area of ​​the substrate through the magnetic force between the magnet and the magnetic steel.

10. A hot-press bonding method, characterized in that, Applied to the thermocompression bonding apparatus according to any one of claims 1-9; the method comprises: Place the substrate on the support platform; The cover plate is placed on the non-welding area of ​​the substrate to press the substrate onto the support platform; The chip is bonded to the substrate through the chip head.

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