mounting head

Abstract

This invention provides a mounting head capable of efficiently mounting semiconductor electronic components onto a substrate. The mounting head includes: a collet having at least one suction hole at the contact surface where the semiconductor electronic components are bent together; and a support unit that supports the collet such that the contact surface of the collet is exposed. The support unit is configured to supply gas from the outside of the contact surface of the collet toward the substrate. The support unit may have at least one gas supply hole for supplying the gas.

Description

Technical Field

[0001] The present invention relates to a mounting head for mounting semiconductor electronic components on a substrate, and a mounting apparatus including the mounting head. Background Technology

[0002] As one method for mounting semiconductor electronic components (semiconductor chips) manufactured on semiconductor wafers containing monocrystalline silicon or sapphire onto a substrate (repository substrate), methods are known for picking up individually segmented semiconductor electronic components from a semiconductor wafer and mounting them onto the substrate. For example, Patent Document 1 discloses a mounting apparatus that uses a mounting head capable of contacting the substrate to hold the semiconductor electronic component in a bent state, and releases the mounting head from holding the semiconductor electronic component while a portion of the semiconductor electronic component is in contact with the substrate, thereby mounting the semiconductor electronic component onto the substrate.

[0003] [Existing Technical Documents]

[0004] [Patent Literature]

[0005] [Patent Document 1] Japanese Patent Application Publication No. 2022-152575 Summary of the Invention

[0006] [The problem the invention aims to solve]

[0007] However, when a semiconductor electronic component is held in a bent state using a mounting head, with a portion of the component in contact with the substrate, and then the mounting head is released to mount the component onto the substrate, gaps sometimes occur at the ends of the component. The presence of these gaps raises concerns about poor bonding of the semiconductor component, leading to a decrease in the yield of the semiconductor product.

[0008] The purpose of this invention is to provide a mounting head and a mounting apparatus including the mounting head that can suppress gaps generated when mounting semiconductor electronic components on a substrate.

[0009] [Technical means to solve the problem]

[0010] One embodiment of the present invention is a mounting head for mounting semiconductor electronic components onto a substrate. The mounting head includes: a collet having at least one suction hole at the contact surface where the semiconductor electronic components are bent together; and a support unit for supporting the collet in such a way that the contact surface of the collet is exposed. The support unit is configured to supply gas from the outside of the contact surface of the collet toward the substrate.

[0011] [The effects of the invention]

[0012] By using the mounting head and mounting device including the mounting head of the present invention, void generation can be suppressed when mounting semiconductor electronic components on a substrate. Attached Figure Description

[0013] Figure 1 This is a schematic three-dimensional diagram illustrating a method for mounting semiconductor electronic components.

[0014] Figure 2 This is a schematic side view of an installation device according to one embodiment of the present invention.

[0015] Figure 3 This is a schematic top view of an installation device according to one embodiment of the present invention.

[0016] Figure 4 This is a schematic perspective view of the mounting head according to one embodiment of the present invention.

[0017] Figure 5 This is a schematic side view of the mounting head according to one embodiment of the present invention.

[0018] Figure 6 This is a schematic side view of the mounting head according to one embodiment of the present invention.

[0019] Figure 7 This is a schematic cross-sectional view of the mounting head according to one embodiment of the present invention.

[0020] Figure 8 This is a schematic cross-sectional view of the mounting head according to one embodiment of the present invention.

[0021] Figure 9 This is a schematic side view illustrating a method for mounting semiconductor electronic components using a mounting apparatus according to one embodiment of the present invention.

[0022] Figure 10 This is a schematic cross-sectional view illustrating a method for mounting semiconductor electronic components using a mounting apparatus according to one embodiment of the present invention.

[0023] Figure 11 This is a schematic cross-sectional view illustrating a method for mounting semiconductor electronic components using a mounting apparatus according to one embodiment of the present invention.

[0024] Figure 12 This is a schematic side view illustrating a method for mounting semiconductor electronic components using a mounting apparatus according to one embodiment of the present invention.

[0025] Figure 13 This is a schematic cross-sectional view illustrating a method for mounting semiconductor electronic components using a mounting apparatus according to one embodiment of the present invention.

[0026] Figure 14 This is a schematic side view illustrating a method for mounting semiconductor electronic components using a mounting apparatus according to one embodiment of the present invention.

[0027] Figure 15 This is a schematic cross-sectional view of the mounting head according to one embodiment of the present invention.

[0028] Figure 16 This is a schematic cross-sectional view of the mounting head according to one embodiment of the present invention.

[0029] Figure 17 This is a schematic bottom view of the mounting head according to one embodiment of the present invention.

[0030] Figure 18 This is a schematic bottom view of the mounting head according to one embodiment of the present invention.

[0031] Figure 19 This is a schematic cross-sectional view of the mounting head according to one embodiment of the present invention.

[0032] Figure 20 This is a schematic cross-sectional view of the mounting head according to one embodiment of the present invention.

[0033] Figure 21 This is a schematic cross-sectional view of the mounting head according to one embodiment of the present invention.

[0034] Figure 22 This is a schematic cross-sectional view of the mounting head according to one embodiment of the present invention.

[0035] Figure 23 This is a schematic perspective view of the mounting head according to one embodiment of the present invention.

[0036] Figure 24 This is a schematic cross-sectional view of the mounting head according to one embodiment of the present invention.

[0037] Figure 25 This is a schematic bottom view of the mounting head according to one embodiment of the present invention.

[0038] Explanation of icon numbers

[0039] 100: Installation device

[0040] 110: Pickup device

[0041] 112, 132: Platform

[0042] 114: Pick-up Nozzle

[0043] 116: Mobile organization

[0044] 118: Lifting device

[0045] 120: Arm

[0046] 122, 136: Bootstrap Framework

[0047] 124: Reversing Mechanism

[0048] 130: Engaging device

[0049] 134: Mobile mechanism

[0050] 138: Slider

[0051] 140: Lifting mechanism

[0052] 142: Exhaust device

[0053] 144: Gas supply source

[0054] 146: Control device

[0055] 150: Installation head

[0056] 152: Support Unit

[0057] 152a: Gas supply port

[0058] 152b, 154b: Lower surface

[0059] 152c: Gas flow path

[0060] 152d: concave part

[0061] 152e, 154c: Suction path

[0062] 152f: Opening

[0063] 152g: Area / Suction Port

[0064] 152h: Stepped surface

[0065] 152j: Adsorption pores

[0066] 154: Collet

[0067] 154a: Suction port

[0068] 154d: Base

[0069] 154e: convex part

[0070] 158: Nozzle

[0071] 160: Semiconductor electronic components

[0072] A-A', B-B', C-C', D-D': dotted line

[0073] H: difference

[0074] L: Length

[0075] P1: Handover Location

[0076] P2: Installation location

[0077] S1: Semiconductor wafer

[0078] S2: Substrate

[0079] x, y, z: Direction Detailed Implementation

[0080] Hereinafter, various embodiments of the present invention will be described with reference to the accompanying drawings and other accompanying documents. It should be noted that the present invention may be implemented in various embodiments without departing from its spirit, and is not limited to the description of the embodiments illustrated below.

[0081] Regarding the accompanying drawings, to make the description clearer, the width, thickness, shape, etc. of various parts are sometimes schematically shown compared to the actual embodiments, but these are merely examples and do not limit the interpretation of the invention. In this specification and the various drawings, elements having the same function as those described with respect to the drawings are sometimes given the same symbols, and repeated descriptions are omitted. When representing a part of a structure, a lowercase letter is used after the symbol.

[0082] In this specification and technical solution, when describing an embodiment in which other structures are configured on a certain structure, the term "on" is used in a simple way. Unless otherwise specified, this includes two cases: one where other structures are configured directly above a certain structure in a manner connected to that structure, and the other where other structures are configured above a certain structure and then via another structure.

[0083] In this specification and technical solution, the expression "a structure is exposed from other structures" refers to an embodiment where a portion of a structure is not covered by other structures, and also includes embodiments where the portion not covered by other structures is subsequently covered by another structure. The vertical relationship between the structure and other structures is not considered here. Furthermore, the embodiments represented by this expression also include embodiments where the structure is not connected to other structures.

[0084] <First Implementation>

[0085] The following describes a mounting head according to one embodiment of the present invention, a mounting device including the mounting head, and a method for mounting semiconductor electronic components using the mounting device.

[0086] 1. Assembly of semiconductor electronic components

[0087] One embodiment of the mounting apparatus of the present invention is suitable for mounting semiconductor electronic components, for example, directly mounting semiconductor electronic components onto a substrate in a manner known as hybrid bonding. Figure 1 As schematically shown, a plurality of semiconductor electronic components 160 are formed on a semiconductor wafer S1. A protective film containing silicon oxide is formed on the surface of each semiconductor electronic component 160, and electrodes for receiving various signals are provided exposed from the protective film. The semiconductor wafer S1 is divided into individual semiconductor electronic components 160. In this manner, the surface of the protective film is activated and Si-OH bonds are formed by performing activation treatments such as plasma treatment on the semiconductor wafer S1. On the other hand, as a substrate S2, a glass substrate, a quartz substrate, or a single-crystal silicon substrate is used, and together with various wirings for supplying signals to the electrodes formed on the semiconductor electronic components 160, a protective film containing silicon oxide is formed such that electrodes provided in a portion of the wirings are exposed. The substrate S2 is also activated by plasma treatment or other activation treatments, thereby activating the surface of the protective film and forming Si-OH bonds. These plasma treatments are called pretreatments and are performed using a pretreatment apparatus (not shown).

[0088] Semiconductor electronic components 160 are picked up one by one, flipped upside down, and mounted on substrate S2. As a result, the electrodes of the semiconductor electronic components 160 come into contact with or are close to the electrodes of the wiring formed on substrate S2, and the semiconductor electronic components 160 come into contact with the protective film formed on substrate S2. By repeating this operation, multiple semiconductor electronic components 160 can be mounted on substrate S2.

[0089] Next, the substrate S2 is heated. The heating temperature is, for example, 450°C or higher, and below the melting point, strain point, or glass transition temperature of the substrate S2. Pressure (e.g., 0.2 MPa or higher and 5 MPa or lower) may also be applied at this time. Through this heat treatment, the semiconductor electronic component 160 condenses with the Si-OH bonds on the surface of the protective film formed on the substrate S2 to form siloxane bonds, and the electrodes of the semiconductor electronic component 160 diffusely bond with the electrodes of the substrate S2. Through this mechanism, the semiconductor electronic component 160 can be firmly fixed to the substrate S2. Furthermore, it is not necessary to use conductive adhesives such as solder to form bumps to achieve electrical connection between the electrodes of the semiconductor electronic component 160 and the electrodes of the substrate S2, thus allowing for high-density mounting of the semiconductor electronic component 160 on the substrate S2. Therefore, by utilizing hybrid bonding, high integration of the semiconductor electronic component 160 can be achieved.

[0090] In addition, Figure 1 In the example shown, the substrate S2 is circular or approximately circular, but there are no restrictions on the shape or size of the substrate S2, and substrates S2 of various shapes such as rectangular can be used.

[0091] 2. Structure of the installation device

[0092] A schematic side view and a top view of the mounting device 100 according to an embodiment of the present invention are shown respectively. Figure 2 and Figure 3 The mounting apparatus 100 includes a control device 146, a pickup device 110 controlled by the control device 146, and a bonding device 130. The pickup device 110 picks up a semiconductor electronic component 160 from the diced semiconductor wafer S1, reversing its orientation. The bonding device 130 receives the reversed semiconductor electronic component 160 from the pickup device 110 and mounts it onto the substrate S2. These structures will be described in detail below. In the following description, for convenience, the horizontal plane is designated as the xy plane, and the vertical direction as the z-direction. The z-direction is the up-down direction. Sometimes the upward direction is referred to as the +z direction, and the downward direction as the -z direction.

[0093] 1-1. Pickup device

[0094] As a basic structure, the pickup device 110 includes: a stage 112 for holding the semiconductor wafer S1; a pickup nozzle 114 for adsorbing and holding the semiconductor electronic components 160; and a moving mechanism 116 for moving the pickup nozzle 114 in a horizontal or vertical direction. The semiconductor wafer S1, divided into individual semiconductor electronic components 160, is disposed on the stage 112 via a tray or an adhesive sheet. Although not shown, the stage 112 may be provided with pins for raising each semiconductor electronic component 160 upwards (i.e., towards the pickup nozzle 114). An exhaust device (not shown) is connected to the pickup nozzle 114, thereby generating a negative pressure on the lower end face of the pickup nozzle 114, which adsorbs and holds the semiconductor electronic components 160 in the pickup nozzle 114. Although not shown, the pickup device 110 may be provided with a moving mechanism for moving the stage 112 in a horizontal plane. By setting up the aforementioned moving mechanism, the pin can also be moved relative to the platform 112.

[0095] Furthermore, there are no restrictions on the structure of the moving mechanism 116; a structure capable of moving the pickup nozzle 114 along the x, y, and z directions can be appropriately adopted. For example, such as... Figure 2 and Figure 3As shown, the moving mechanism 116 may also include: an arm 120 for holding the pickup nozzle 114, a lifting device 118 configured to move the arm 120 in a vertical direction, and a guide frame 122 provided with a guide rail (not shown) for moving the arm 120 and the lifting device 118 together in a horizontal direction. The lifting device 118 is configured to move horizontally along the guide frame 122, and the guide frame 122 is configured to move the arm 120 in a horizontal direction perpendicular to its extension direction. For example, the lifting device 118 may also be a ball screw mechanism driven by a servo motor. By providing this moving mechanism 116, the pickup nozzle 114 can be moved to any position on the semiconductor wafer S1, and can be moved in a vertical direction. Furthermore, the vertical direction mentioned here is also the direction of contact separation relative to the semiconductor wafer S1 placed on the stage 112.

[0096] The pickup nozzle 114 is configured to rotate about an axis extending from or parallel to the arm 120. Specifically, a reversing mechanism 124 is provided in the lifting device 118. Therefore, the pickup nozzle 114 can reverse the vertical orientation of the adsorbed and held semiconductor electronic component 160. The reversing mechanism 124 is configured to be connected to the arm 120 via the lifting device 118, and the pickup nozzle 114 is reversed by rotating the arm 120 axially along its extension direction. Furthermore, the reversing mechanism 124 may be, for example, an actuator including a drive source such as a motor.

[0097] 1-2. Joining device

[0098] The bonding device 130 includes: a stage 132 for holding a substrate S2 on which a semiconductor electronic component 160 is mounted; a mounting head 150 for adsorbing, holding, and mounting the semiconductor electronic component 160 onto the substrate S2; and a moving mechanism 134 for moving the mounting head 150 in the horizontal and vertical directions. The moving mechanism 134 is configured to rotate the mounting head 150 about the z-axis. Figure 2 Although not shown, the bonding device 130 includes an imaging device for reading alignment marks formed on the substrate S2, a gas supply source for supplying humidity-controlled gas, and an exhaust device for generating reduced pressure to adsorb the semiconductor electronic component 160. The gas supply source and exhaust device are connected to the mounting head 150. In addition, the bonding device 130 includes a moving mechanism for moving the stage 132 in the horizontal direction (y direction).

[0099] The moving mechanism 134 can be any structure capable of moving the mounting head 150 in both the horizontal (x-direction) and vertical (z-direction) directions. For example, such as Figure 2 and Figure 3As shown, the moving mechanism 134 may include: a lifting mechanism 140 that holds and raises / lowers the mounting head 150; a guide frame 136 provided with a guide rail (not shown) for moving the lifting mechanism 140 in a horizontal direction (e.g., the x-direction); and a slider 138 configured to move the mounting head 150 together with the lifting mechanism 140 along the guide rail of the guide frame 136. The slider 138 may be configured to allow the mounting head 150 to move in a horizontal direction perpendicular to the extension direction of the guide frame 136 via a ball screw mechanism driven by a servo motor, or to allow the guide frame 136 to move in the aforementioned direction. Furthermore, the lifting mechanism 140 may, for example, be a structure that allows the mounting head 150 to move in a vertical direction via a ball screw mechanism driven by a servo motor. The moving mechanism 134 reciprocates the mounting head 150 between a junction position P1 and a mounting position P2. At the handover position P1, the semiconductor electronic component 160 held by the pickup nozzle 114 of the pickup device 110 is handed over to the mounting head 150. At the mounting position P2, the mounting head 150 holds the semiconductor electronic component 160 and moves it in the -z direction, thereby allowing the semiconductor electronic component 160 to be mounted at any location on the substrate S2.

[0100] 1-3. Structure of the mounting head

[0101] A schematic three-dimensional illustration of the mounting head 150 is shown in Figure 4 and Figure 23 A schematic side view of the mounting head 150 is shown. Figure 5 and Figure 6 Additionally, it will follow... Figure 4 Schematic diagrams of the cross sections of dashed line A-A' and dashed line B-B' are shown in [the diagrams]. Figure 7 and Figure 8 . Figure 4 This is a perspective view of the mounting head 150 from below. Figure 23 This is a schematic perspective view showing the state in which the collet 154 constituting the mounting head 150 is separated from the support unit 152. Figure 7 It is a cross-sectional view parallel to the yz plane through the suction hole 154a described later. Figure 8 It is a cross-sectional view parallel to the yz plane through the gas supply port 152a described later.

[0102] Support unit 152 is a component that supports collet 154; therefore, as Figure 23As shown, the device has an opening 152f for receiving the collet 154. The opening 152f is a through hole, and a stepped surface 152h is provided in the opening 152f as a surface for supporting the collet 154. The collet 154 is fixed to a support unit 152, which is arranged to surround the collet 154. The support unit 152 is configured not to cover the lower surface 154b of the collet 154; that is, the lower surface 154b of the collet 154, which serves as the contact surface with the semiconductor electronic component 160, is exposed from the support unit 152. The collet 154 and the support unit 152 contain, for example, metals such as molybdenum, titanium, tantalum, tungsten, copper, or aluminum, or alloys containing metals selected from these.

[0103] The method of fixing the support unit 152 and the collet 154 is arbitrary; it can be fixed using bolts or lead screws, or it can be fixed by reducing pressure. For example, Figure 23 and its cross-sectional view along the dotted line D-D' ( Figure 24 As shown in the diagram, multiple adsorption holes 152j can also be provided on the step surface 152h, and suction can be performed from the suction port 152g connected to the adsorption holes 152j through an exhaust device (not shown). By utilizing the above structure, a negative pressure is formed between the step surface 152h and the clamp 154, which can fix the support unit 152 and the clamp 154.

[0104] The collet 154 functions as a receiving portion for receiving a semiconductor electronic component 160 from the pick-up nozzle 114 at the handover position P1, and as a component for mounting the semiconductor electronic component 160 onto the substrate S2 at the mounting position P2. The collet 154 has a base 154d and a protrusion 154e projecting from the base 154d (see reference). Figure 23 The lower surface 154b, which is the surface of the protrusion 154e, functions as a surface for holding the semiconductor electronic component 160. The lower surface 154b is also the bottom surface of the collet 154. There are no restrictions on the planar shape of the lower surface 154b (the shape viewed from above, specifically from the z-direction; the same applies below), but a shape suitable for the shape or size of the semiconductor electronic component 160 to be mounted is selected. Preferably, the planar shape of the lower surface 154b is a square or a rectangle, or a quadrilateral. Hereinafter, as... Figure 4 and Figure 23 As shown, the description is based on the case where the planar shape of the protrusion 154e of the collet 154 is rectangular and its long side is in the y-direction. Furthermore, when the planar shape of the protrusion 154e is rectangular, its long side direction can be parallel to the extension direction of the guide frame 122 of the pickup device 110 or the guide frame 136 of the engagement device 130, or it can be perpendicular to these directions, or it can intersect these directions at any angle.

[0105] According to Figure 4 , Figure 5, Figure 6 As understood, the lower surface 154b is not parallel to the xy plane, but is curved downwards. More specifically, the lower surface 154b is curved downwards when viewed from the x direction. Therefore, the protrusion 154e can be a semi-cylindrical shape, or it can be a shape obtained by cutting a cylinder with a face perpendicular to its bottom surface. Alternatively, the shape of the lower surface 154b when viewed from the x direction can be an arc shape, or it can be a V-shape. In the case of a V-shape, its curved portion is formed by a curve. As will be described later, since the semiconductor electronic component 160 is adsorbed onto the lower surface 154b of the collet 154, by including the shape described above in the protrusion 154e, the semiconductor electronic component 160 can be adsorbed and held in a curved state on the lower surface 154b of the protrusion 154e without damage to the semiconductor electronic component 160. Therefore, although it also depends on the size of the semiconductor electronic component 160 to be mounted, when the shape of the protrusion 154e in top view is rectangular, its length L in the long side direction (refer to Figure 7 Simply set it to 100 mm or less, 75 mm or less, 50 mm or less, or 25 mm or less. The lower limit of the length L can be selected from the range of 5 mm or more and 20 mm or less. If the shape of the collet 154 is square when viewed from above, simply set the length of one side to 100 mm or less, 75 mm or less, 50 mm or less, or 25 mm or less, and the lower limit of the length of one side can also be selected from the range of 5 mm or more and 20 mm or less.

[0106] like Figure 4 and Figure 23 As shown, at least one suction hole 154a for adsorbing and holding the semiconductor electronic component 160 is provided on the lower surface 154b of the protrusion 154e. The at least one suction hole 154a may include multiple suction holes 154a. When multiple suction holes 154a are provided, they can all be arranged in one row, or they can be arranged in multiple rows. Alternatively, the multiple suction holes 154a can be arranged in a zigzag pattern. Figure 7 As shown, a suction port 154a is formed inside the collet 154 and is connected to the exhaust device 142 via a suction path 154c that leads to the opening 152f of the support unit 152. With this structure, gas can be suctioned from the lower surface 154b side of the collet 154 via the suction path 154c, creating a negative pressure on the lower surface 154b side. This negative pressure reliably holds the semiconductor electronic component 160 to the lower surface 154b of the collet 154. Furthermore, releasing the negative pressure releases the holding of the semiconductor electronic component 160.

[0107] The support unit 152 is configured to supply humidity-controlled gas to the vicinity of the collet 154. Specifically, as... Figure 4 , Figure 23 , Figure 7 As shown, at least one gas supply hole 152a is provided on the lower surface of the support unit 152. The at least one gas supply hole 152a may include multiple gas supply holes 152a. When multiple gas supply holes 152a are provided, they can simply be arranged to surround the collet 154. There are no restrictions on the shape of the gas supply holes 152a (the shape of the lower surface 152b), and they can also be polygons including circles or ellipses, squares or rectangles, etc. Furthermore, the aspect ratio of the shape of the gas supply holes 152a can be arbitrarily determined. Therefore, as... Figure 25 As shown, the gas supply hole 152a can also be slit-shaped.

[0108] like Figure 8 As shown, the gas supply port 152a is connected to the gas supply source 144 via a gas flow path 152c provided within the support unit 152. The gas supply source 144 is configured to supply a humidity-controlled gas. Specifically, the gas supply source 144 is configured to supply a gas with a relative humidity of 20% or less, 15% or less, or 10% or less. The lower limit of the relative humidity of the supplied gas can be selected from the range of 0% or more and 10% or less. The supplied gas includes one or more selected from nitrogen, oxygen, argon, and helium. For example, the supplied gas can be air with a relative humidity of 20% or less. Thus, gas can be supplied from the outside of the contact surface of the collet 154, that is, the area surrounding the contact surface of the collet 154.

[0109] Here, as Figures 4 to 7 As shown, with the mounting head 150 installed on the lifting mechanism 140, the mounting head 150 is configured such that the lowest part of the support unit 152 (e.g., the surface where the gas supply hole 152a is provided) is higher than the lowest part of the collet 154 (i.e., the apex or ridge of the protrusion 154e). Since the lowest part of the collet 154 is a portion protruding below the contact surface with the semiconductor electronic component 160, i.e., the lower surface 154b, the mounting head 150 is configured such that the protrusion of the lower surface 154b is located below the lowest part of the support unit 152 (in...). Figure 7In the example shown, the lower surface 152b) is positioned. That is, the lowermost part of the collet 154 is configured to be located closer to the substrate S2 than the lowermost part of the support unit 152. There is no restriction on the height difference H between the lowermost part of the collet 154 and the lowermost part of the support unit 152, for example, it can be 5 mm or more and 20 mm or less. By adopting this structure, not only can a sufficient amount of humidity-controlled gas be supplied between the mounting head 150 and the substrate S2, but also, as described later, the semiconductor electronic component 160 can be mounted on the substrate S2 without the associated poor bonding of the semiconductor electronic component 160.

[0110] 3. Operation of the installation device

[0111] The following uses Figures 9 to 14 The operation of mounting semiconductor electronic components 160 on substrate S2 using mounting device 100 will be described. Figure 9 and Figure 12 Is with Figure 2 Corresponding schematic side view, Figure 10 , Figure 11 ,and Figure 13 Is with Figure 7 A corresponding schematic end-face view is provided (wherein, for ease of visibility, the gas flow path 152c is represented by dashed lines). Furthermore, the pretreatment, dicing of the semiconductor wafer S1, and heat treatment can be performed using known methods, therefore descriptions are omitted.

[0112] First, the pick-up device 110 picks up the segmented semiconductor electronic components 160 one by one. Specifically, as follows: Figure 9 As shown, the pickup nozzle 114 is positioned on a semiconductor electronic component 160 using the moving mechanism 116 of the pickup device 110, and the semiconductor electronic component 160 is adsorbed using the pickup nozzle 114. At this time, a pin (not shown) can also be used to raise a semiconductor electronic component 160 toward the pickup nozzle 114 to support the adsorption performed by the pickup nozzle 114.

[0113] In this state, the moving mechanism 116 is controlled to move the pick-up nozzle 114 toward the joining device 130, transporting the semiconductor electronic component 160 to the handover position P1, and the pick-up nozzle 114 is rotated 180° about the extension direction of the arm 120 or a direction parallel to said direction (see reference). Figure 9 (The curved arrow). As a result, the semiconductor electronic component 160 is reversed vertically. On the other hand, the moving mechanism 134 of the bonding device 130 is controlled to move the mounting head 150 to the junction position P1 and place it on the pick-up nozzle 114. As a result, the mounting head 150 overlaps with the pick-up nozzle 114 in the z-direction.

[0114] Then, the semiconductor electronic component 160 is transferred from the pick-up nozzle 114 to the mounting head 150. Specifically, as... Figure 10 As shown, the pickup nozzle 114 is brought close to the mounting head 150, and the exhaust device 142 (see reference) is brought close to the mounting head 150. Figure 7 The system operates by drawing gas from the lower surface 154b side of the collet 154 via the suction path 154c. This creates a negative pressure on the lower surface 154b side of the collet 154. Gas suction can begin when the semiconductor electronic component 160 comes into contact with the lower surface 154b of the collet 154, or it can begin before or after this contact. Furthermore, the suction from the pick-up nozzle 114 stops when the semiconductor electronic component 160 comes into contact with the lower surface 154b of the collet 154, or before or after this contact. As a result, the semiconductor electronic component 160 is adsorbed and held on the lower surface 154b of the collet 154. Figure 11 As described above, the lower surface 154b of the protrusion 154e of the collet 154 is bent in a downwardly projecting manner. Therefore, the semiconductor electronic component 160 is attracted to the lower surface 154b of the collet 154 in a bent state with its edge portion positioned above its center.

[0115] After that, as Figure 12 As shown, the moving mechanism 134 moves the mounting head 150 to the position on the substrate S2 where the semiconductor electronic component 160 is mounted, and the lifting mechanism 140 is controlled to bring the mounting head 150 closer to the substrate S2. When it comes into contact with the substrate S2 near the center of the semiconductor electronic component 160 protruding downwards ( Figure 13 The exhaust device 142 is controlled to stop suction. This releases the negative pressure, and the bent semiconductor electronic component 160 takes on the shape mimicking the surface of the substrate S2, and is then mounted on the substrate S2. At this time, humidity-controlled gas is ejected from the gas supply source 144 through the gas flow path 152c from the gas supply hole 152a. Preferably, the gas ejection begins before the clamp 154 ​​releases its grip on the semiconductor electronic component 160. Alternatively, it can begin simultaneously with the release of the clamp 154's grip on the semiconductor electronic component 160. The gas ejection can be stopped either simultaneously with or after the semiconductor electronic component 160 is mounted on the substrate S2. Furthermore, the start and stop times of gas ejection can be optimized in advance through experiments, etc.

[0116] like Figure 14As shown in the schematic side view, when the semiconductor electronic component 160, bent by the negative pressure formed on the lower surface 154b of the collet 154, returns to its shape mimicking the surface of the substrate S2 on the substrate S2 (refer to the hollow arrow), the gas between the semiconductor electronic component 160 and the substrate S2 is temporarily compressed, then moves to the edge side of the semiconductor electronic component 160 (the unbent edge side, in this example, the edge side of the short side), and is further compressed. The compressed gas expands as it is discharged to the outside of the edge of the semiconductor electronic component 160. As a result, the temperature of the gas decreases due to thermal expansion. When the gas between the semiconductor electronic component 160 and the substrate S2 contains moisture at a relatively high concentration, i.e., when the dew point temperature of the gas is relatively high, the moisture may sometimes condense into fine droplets due to the temperature drop caused by the thermal expansion, thus adhering (condensing) between the semiconductor electronic component 160 and the substrate S2. The temperature drop of the gas is significant at the edge portion of the semiconductor electronic component 160, so the adhesion of fine water droplets is particularly easy to occur at and near the edge portion. The adhesion of water droplets can cause gaps between the semiconductor electronic component 160 and the substrate S2 during the subsequent heat treatment process in the assembly process. These gaps can reduce the bonding strength between the semiconductor electronic component 160 and the substrate S2, or cause poor electrode-to-electrode contact, leading to a decrease in product yield.

[0117] However, as described above, in the mounting apparatus 100 of one embodiment of the present invention, when the bent semiconductor electronic component 160 is in contact with the substrate S2 in a shape that mimics the surface of the substrate S2, a humidity-controlled gas (e.g., a gas with a relative humidity of 20% or less, or a dew point temperature of 0°C or less) is supplied from the support unit 152. Therefore, even if a temperature drop occurs due to the aforementioned thermal expansion, condensation of moisture can be prevented. As a result, the adhesion of water to the semiconductor electronic component 160 or the substrate S2, and the resulting voids, can be effectively prevented. Consequently, the semiconductor electronic component 160 can be mounted with good yield.

[0118] Furthermore, in the mounting apparatus 100, by supplying a humidity-controlled gas, the dew point of the gas between the semiconductor electronic component 160 and the substrate S2 is lowered, thereby preventing moisture condensation. Therefore, it is unnecessary to heat the substrate S2, reduce the bonding speed between the semiconductor electronic component 160 and the substrate S2, or depressurize the space between the semiconductor electronic component 160 and the substrate S2. Thus, by applying embodiments of the present invention, for example, a mounting apparatus can be provided that includes a bonding device that improves alignment accuracy and throughput without causing a decrease in alignment accuracy due to fluctuations in the heated gas, a decrease in throughput due to the formation of a depressurized environment, or an increase in the size or complexity of the bonding device 130.

[0119] Furthermore, in the mounting apparatus 100, very small semiconductor electronic components 160 can be transferred compared to semiconductor wafers. Therefore, unlike the case of mounting semiconductor wafers with diameters of, for example, 8 inches (approximately 200 mm) to 12 inches (approximately 300 mm), the range for supplying the humidity-controlled gas is limited to a relatively narrow area. Therefore, not only is it unnecessary to use a large amount of humidity-controlled gas, but it is also unnecessary to seal the space for supplying the humidity-controlled gas. Therefore, the mounting head 150 can be configured such that the lowermost part of the support unit 152 for supplying the humidity-controlled gas is positioned above the lowermost part of the collet 154 (see reference). Figure 7 , Figure 13 (etc.). By employing the aforementioned structure, even when a substrate S2 already containing a mounted semiconductor electronic component 160 further mounts the semiconductor electronic component 160, contact and interference between the already mounted semiconductor electronic component 160 and the mounting head 150 (more specifically, the support unit 152) can be prevented. Therefore, the semiconductor electronic component 160 already mounted by the mounting head 150 will not suffer from poor bonding, resulting in the ability to mount the semiconductor electronic component 160 on the substrate S2 with high density.

[0120] <Second Implementation>

[0121] In this embodiment, a variation of the mounting head 150 described in the first embodiment will be described. Descriptions of structures that are the same as or similar to those described in the first embodiment are sometimes omitted.

[0122] 1. Variation Example 1

[0123] In this variation, a mounting head 150 having a structure different from that described in the first embodiment will be described. For example... Figure 15As shown, in Modified Example 1, the support unit 152 has a recess 152d as a bottomed hole instead of an opening 152f extending in the z-direction, and the collet 154 is received in the recess 152d. In this case, since the upper surface of the collet 154 is covered by the support unit 152, a suction path 152e is formed within the support unit 152, which connects to the suction path 154c of the collet 154, and is connected to the exhaust device 142. The suction path 152e can reach the upper surface of the support unit 152, such as... Figure 15 As shown, the gas flow path 152c provided in the support unit 152 can also reach the side of the support unit 152. Similarly, the gas flow path 152c provided in the support unit 152 can reach the upper surface of the support unit 152. Figure 8 ),like Figure 16 As shown, the side of the support unit 152 can also be reached.

[0124] 2. Variation Example 2

[0125] In this variation, different configurations of the gas supply port 152a provided in the support unit 152 described in the first embodiment will be explained. For example... Figure 17 As shown, when the collet 154 has a rectangular planar shape, multiple gas supply holes 152a are arranged on its short side. For example, they can also be arranged in a direction perpendicular to the long side (in... Figure 17 In the example shown, multiple gas supply holes 152a are arranged along a pair of straight lines extending in the x-direction. When the semiconductor electronic component 160 is rectangular, moisture is prone to condensation near the short side due to the temperature drop caused by thermal expansion. Therefore, by arranging the gas supply holes 152a on the short side of the semiconductor electronic component 160, gas can be supplied centrally to areas prone to condensation. Furthermore, since gas can be supplied locally, gas consumption can be reduced.

[0126] In addition, such as Figure 18 As shown, the collet 154 can also be configured to not block the entire opening 152f of the support unit 152, but only block a portion of the opening 152f.

[0127] 3. Variation Example 3

[0128] In this variation, different structures of the gas flow path 152c of the support unit 152 described in the first embodiment will be explained. For example, along... Figure 17 A schematic diagram of the end face of the dashed line C-C' ( Figure 19 , Figure 20As shown, in order to supply gas more effectively between the semiconductor electronic component 160 and the substrate S2, the gas flow path 152c can be configured such that at least a portion of the gas flow path 152c, which extends in a straight line from the gas supply hole 152a, is inclined in the z direction, and the closer to the gas supply hole 152a, the smaller the distance from the collet 154 in the y direction.

[0129] 4. Variation Example 4

[0130] In the modified example described, the gas flow path 152c communicating with the gas supply hole 152a within the support unit 152 was explained. However, the structure of the mounting head 150 in the embodiment of the present invention is not limited thereto. For example, a portion of the support unit 152 may be made into a porous body, and the fine pores of the porous body may be used as the gas flow path 152c to supply humidity-controlled gas. Specifically, as Figure 21 As shown, a pair of regions 152g can be formed using a porous material to hold the collet 154. The porous material is configured to penetrate the collet 154 in the z-direction. That is, the porous material is arranged from the upper surface to the lower surface of the support unit 152. Preferably, the pair of regions 152g are arranged such that their long sides are parallel to the short side of the semiconductor electronic component 160. Alternatively, as... Figure 21 As shown, four regions 152g can be arranged along the four sides of the collet 154, or a pair of regions 152g can be arranged with their long sides parallel to the long side of the semiconductor electronic component 160. The porous material is configured, for example, to contain ceramic or sintered metal. In addition, a humidity-controlled gas is supplied to the porous material arranged in the regions 152g.

[0131] In the modified example, it is preferable that the thickness (length in the z-direction) of the porous body provided in the support unit 152 is small. For example, it is sufficient to set the thickness of the support unit 152 to be 5.5 mm or more and 10 mm or less, set the thickness of the collet 154 to be less than or equal to that (for example, 2.5 mm or more and 10 mm or less), and set the thickness of the porous body to be less than or equal to the thickness of the support unit 152. By forming the porous body thin, the resistance to gas flowing within the porous body can be reduced. In addition, since the gas supplied from the porous body is supplied while being rectified through the porous body, the gas can be supplied uniformly to the periphery of the semiconductor electronic component 160. Therefore, a humidity-controlled gas environment can be formed around the semiconductor electronic component 160 without deviation.

[0132] Or, such as Figure 22As shown, the gas flow path 152c may not be provided within the support unit 152, and a humidity-controlled gas may be supplied using a nozzle 158 independent of the support unit 152. In this case, the nozzle 158 may be fixed to the support unit 152, or it may be configured to move independently relative to the mounting head 150 using a second moving mechanism (not shown). Preferably, the nozzle 158 is arranged to be inclined in the z-direction so that a pair of nozzles 158 can be used to supply humidity-controlled gas to the collet 154 side. By adopting this structure, the structure of the support unit 152 can be simplified, and the mounting head 150 can be provided at a low cost. In addition, by appropriately adjusting the number or direction of the nozzles 158, a gas suitable for the size or shape of the semiconductor electronic component 160 can be supplied.

[0133] The various embodiments described as implementations of the present invention can be appropriately combined and implemented as long as they do not contradict each other. Furthermore, any schemes by those skilled in the art that involve appropriate combinations, additions, deletions, or design changes to structural components based on the various embodiments, or combinations, additions, omissions, or condition changes to processes, are also included within the scope of the present invention, as long as they capture the essence of the invention.

[0134] Even if other effects differ from those achieved by the embodiments described herein, effects clearly defined according to this specification, or effects that can be easily predicted by those skilled in the art, can of course be understood as effects brought about by the present invention.

Claims

1. A mounting head for mounting semiconductor electronic components onto a substrate, the mounting head comprising: The collet has at least one suction hole at the contact surface where the semiconductor electronic components are bent together; as well as A support unit is provided to support the collet in such a way that the contact surface of the collet is exposed. The support unit is configured to supply gas from the outside of the contact surface of the collet toward the substrate.

2. The mounting head according to claim 1, wherein the support unit has at least one gas supply port for supplying the gas.

3. The mounting head according to claim 2, wherein the at least one gas supply port comprises a plurality of gas supply ports arranged to surround the collet.

4. The mounting head according to claim 2, wherein the planar shape of the collet is quadrilateral. The at least one gas supply port includes a pair of gas supply ports arranged in a straight line, configured to clamp the collet. The pair of straight lines are perpendicular to the direction of the longer side of the planar shape.

5. The mounting head according to claim 1, wherein the at least one gas supply hole is slit-shaped.

6. The mounting head according to claim 1, wherein a portion of the support unit is a porous material disposed throughout the upper and lower surfaces of the support unit.

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