A packaging device for aerospace sensors

Abstract

This invention provides a packaging device for aerospace sensors, relating to the field of aerospace sensor packaging technology. Its features include: a high-vacuum cavity operating stage, a eutectic patch module assembly, a parallel seam welding module assembly, a multi-parameter sensing network, an edge computing unit, and a human-machine interface. The high-vacuum cavity operating stage provides the packaging environment; the eutectic patch module assembly and the parallel seam welding module assembly complete the core packaging process. The advantages of this invention are: through the high-vacuum cavity, high-precision eutectic patch, and parallel seam welding module, it meets the requirements of MEMS, SiC, and GaN sensors for ±3μm patch accuracy, ±1℃ thermal control uniformity, and ≤1×10⁻⁻⁻⁶. 4 It meets stringent vacuum requirements; integrates multi-parameter sensor networks and edge computing units to monitor key process parameters in real time and intelligently diagnose faults, ensuring batch yield differences of ≤2%; it also supports remote operation and maintenance, and is based on a domestic operating system and CPU to improve the equipment's autonomy and controllability and production line continuity.

Description

Technical Field

[0001] This invention relates to the field of aerospace sensor packaging technology, and particularly to a packaging device for aerospace sensors. Background Technology

[0002] Space sensors must withstand the harsh conditions of the extreme space environment during missions, including extreme temperature variations (from -196°C to thousands of degrees Celsius), high vacuum, intense radiation, and high-intensity vibration and shock. Packaging not only protects sensitive sensor chips from physical damage and chemical corrosion but also improves their electromagnetic compatibility, thermal management capabilities, and long-term operational reliability. Furthermore, a well-designed package facilitates miniaturization, weight reduction, and multifunctional integration, meeting the stringent space, weight, and power consumption constraints of spacecraft, thereby ensuring stable and accurate sensor operation throughout the entire mission lifecycle.

[0003] Currently, my country heavily relies on imported equipment, such as parallel seam welding machines and vacuum eutectic bonding machines, for high-end packaging of aerospace sensors. While these imported machines offer advantages like high precision and stability, they also have some drawbacks. First, domestic substitution is difficult; imported equipment is expensive, has long delivery cycles, and is subject to export controls. Second, they suffer from poor process adaptability; existing domestic equipment struggles to meet the requirements of MEMS chips or SiC / GaN high-temperature sensors for bonding precision (±3μm), thermal uniformity (±1℃), and vacuum level (≤1×10⁻⁻⁻⁶). 4 The equipment faces stringent process requirements, including those related to welding current fluctuations, surface mount pressure deviations, and cavity leakage rates. Furthermore, the lack of intelligent operation and maintenance capabilities means that key parameters such as welding current fluctuations, surface mount pressure deviations, and cavity leakage rates cannot be monitored in real time during equipment operation, leading to large fluctuations in yield (typically varying by 5% to 8%) and delayed fault response. Simultaneously, equipment maintenance relies on original equipment manufacturer (OEM) engineers, and on-site technicians lack effective diagnostic tools, severely impacting production line continuity and product consistency.

[0004] Therefore, there is an urgent need to develop an aerospace sensor packaging device that can meet the requirements of high-precision packaging technology, has intelligent monitoring and maintenance capabilities, and is autonomously controllable. Summary of the Invention

[0005] The purpose of this invention is to provide a packaging device for aerospace sensors, which solves the problems of existing aerospace sensor packaging equipment relying on imports, being unable to meet the requirements of high-precision surface mount and vacuum packaging processes, and lacking real-time monitoring and intelligent operation and maintenance capabilities for key parameters, resulting in large fluctuations in yield, delayed fault response, and poor production line continuity.

[0006] To achieve the above-mentioned objectives, the technical solution adopted by this invention is as follows:

[0007] A packaging device for an aerospace sensor includes: a high-vacuum cavity operating stage, a eutectic patch module assembly, a parallel seam weld module assembly, a multi-parameter sensing network, an edge computing unit, and a human-machine interface;

[0008] The high-vacuum chamber operating stage provides a packaging environment;

[0009] The eutectic chip module assembly and the parallel seam welded module assembly complete the core packaging process;

[0010] The multi-parameter sensor network collects process data;

[0011] The edge computing unit processes data and diagnoses faults;

[0012] The human-computer interaction interface enables device control and status display;

[0013] The eutectic patch module assembly and the parallel seam welding module assembly are disposed inside the high vacuum chamber operating table or connected to its process port.

[0014] The multi-parameter sensing network is distributed in each key process module to collect data in real time, and the edge computing unit is communicatively connected to the multi-parameter sensing network.

[0015] The human-machine interface is externally placed on the high-vacuum cavity operating platform and is connected to the eutectic patch module assembly, the parallel seam welding module assembly and the edge computing unit respectively to realize centralized control and status feedback.

[0016] Furthermore, the high-vacuum chamber operating table adopts a double-layer stainless steel structure and is equipped with a composite pumping system, with an ultimate vacuum degree ≤1×10⁻ 4 Pa, the leakage rate of the cavity can be monitored in real time by quadrupole mass spectrometry or pressure drop method.

[0017] Furthermore, the eutectic patch module is equipped with a vision alignment system and a six-degree-of-freedom precision motion platform, with patch positioning accuracy ≤ ±3μm, and includes an infrared heating platform with thermal control uniformity ≤ ±1℃.

[0018] Furthermore, the parallel seam welding module integrates a high-frequency pulse power supply and an adaptive pressure control system, with a pressure adjustment range of 0.1N to 10N and an adjustment resolution of 0.01N, achieving hermetically sealed metal casing.

[0019] Furthermore, the multi-parameter sensing network includes a residual gas analyzer, a fiber optic temperature array, a Hall current sensor, and a piezoelectric pressure sensor, and the collected parameters cover core process data such as welding current, patch pressure, and thermal field distribution.

[0020] Furthermore, the edge computing unit runs a lightweight artificial intelligence model that can identify fault modes such as cavity microleakage and electrode wear, and automatically lock the device and sound an alarm when parameters are abnormal.

[0021] Furthermore, the human-machine interface supports connection to external terminals via industrial Ethernet or 5G communication modules to achieve remote monitoring, parameter configuration, and firmware upgrades.

[0022] Furthermore, the device is compatible with the packaging of MEMS chips, SiC high-temperature sensors and GaN power sensors, with batch-to-batch yield differences of ≤2%, and the control system is based on a domestic real-time operating system and a domestic CPU.

[0023] A packaging system for aerospace sensors also includes a central control server, a process database, and a digital twin module, enabling centralized management of multiple devices, storage of process recipes, and virtual simulation operation and maintenance of equipment.

[0024] Furthermore, the digital twin module synchronizes the operating parameters of the physical device, reproduces the packaging process, and triggers a parameter deviation warning;

[0025] The process database supports calling packaging process recipes categorized by sensor type.

[0026] The beneficial effects of this invention are as follows: the device, through the eutectic patch module assembly and the parallel seam welding module assembly, achieves patch positioning accuracy ≤ ±3μm, thermal control uniformity ≤ ±1℃, and high vacuum degree (≤1×10⁻). 4 (Pa), which can be adapted to aerospace sensors with stringent packaging process requirements such as MEMS chips, SiC high-temperature sensors and GaN power sensors, thereby meeting the high-precision packaging process requirements.

[0027] By collecting core process data such as welding current, chip placement pressure, and thermal field distribution in real time through a multi-parameter sensor network, and combining it with edge computing units for fault diagnosis, the yield difference between batches is effectively controlled (≤2%), which is better than existing equipment (typical difference of 5%~8%).

[0028] The device integrates a multi-parameter sensor network and an edge computing unit, which can monitor key process parameters in real time and identify faults such as cavity microleakage and electrode wear through a lightweight artificial intelligence model. When parameters are abnormal, the device will automatically lock the equipment and issue an alarm, thereby improving the reliability of equipment operation and the continuity of production line.

[0029] The human-machine interface supports remote monitoring, parameter configuration, and firmware upgrades; the control system is based on a domestically developed real-time operating system and a domestically developed CPU, which helps to achieve independent control of key technologies and reduce dependence on imported equipment.

[0030] The high-vacuum chamber operating stage adopts a double-layer stainless steel structure and a composite pumping system, with a high ultimate vacuum degree. The leakage rate can be monitored in real time by a quadrupole mass spectrometer or pressure drop method, ensuring the airtightness and stability of the packaging process. Attached Figure Description

[0031] Figure 1 This is a three-dimensional view of the overall structure of a packaging device for an aerospace sensor according to the present invention.

[0032] Figure 2 This is an overall architecture diagram of a packaging system for an aerospace sensor according to the present invention.

[0033] Figure 3 This is a flowchart of the fault diagnosis and alarm logic of the edge computing unit of the present invention.

[0034] Figure 4 This is a process flow diagram of aerospace sensor packaging according to the present invention.

[0035] In the figure: 1. High vacuum chamber operating stage; 2. Eutectic patch module assembly; 3. Parallel seam welding module assembly; 4. Human-machine interface. Detailed Implementation

[0036] To make the content of this invention easier to understand, the technical solutions of the embodiments of this invention will be clearly and completely described below with reference to the accompanying drawings. Identical components are indicated by the same reference numerals.

[0037] like Figure 1 As shown, a packaging device for an aerospace sensor includes: a high-vacuum cavity operating platform 1, a eutectic patch module assembly 2, a parallel seam weld module assembly 3, a multi-parameter sensor network, an edge computing unit, and a human-machine interface 4. The high-vacuum cavity operating platform 1 provides the packaging environment; the eutectic patch module assembly 2 and the parallel seam weld module assembly 3 complete the core packaging process; the multi-parameter sensor network collects process data; the edge computing unit processes the data and diagnoses faults; and the human-machine interface 4 enables device control and status display. The eutectic patch module assembly 2 and the parallel seam weld module assembly 3 are located inside the high-vacuum cavity operating platform 1 or connected to its process ports; the multi-parameter sensor network is distributed across key process modules to collect data in real time, and the edge computing unit is communicatively connected to the multi-parameter sensor network; the human-machine interface 4 is externally located on the high-vacuum cavity operating platform 1 and is signal-connected to the eutectic patch module assembly 2, the parallel seam weld module assembly 3, and the edge computing unit to achieve centralized control and status feedback.

[0038] The high-vacuum chamber operating stage 1 provides a stable, high-vacuum, and high-cleanliness environment for the encapsulation of aerospace sensors. It employs a double-layer stainless steel structure and is equipped with a composite evacuation system, achieving a vacuum level of ≤1×10⁻⁻⁻⁻⁶. 4The ultimate vacuum level is measured in Pa, and the cavity leakage rate can be monitored in real time using a quadrupole mass spectrometer or the pressure drop method. This effectively isolates the cavity from external contamination and oxidation, ensuring that core processes such as eutectic bonding and parallel seam soldering are reliably performed under stringent vacuum conditions, thereby guaranteeing the hermeticity and long-term reliability of the package.

[0039] Eutectic bonding module 2 is responsible for high-precision, high-reliability mounting of the sensor chip to the substrate. This module is equipped with a vision alignment system and a six-degree-of-freedom precision motion platform, achieving a bonding positioning accuracy of ≤±3μm, and ensuring thermal uniformity of ≤±1℃ through an infrared heating platform. Its advantages lie in meeting the extremely high requirements of advanced aerospace sensors such as MEMS, SiC, and GaN for bonding position and temperature control, laying a solid foundation for subsequent packaging steps and improving overall yield.

[0040] Parallel seam welding module assembly 3 is used for hermetically sealing the sensor's metal housing in a high-vacuum environment. This assembly integrates a high-frequency pulse power supply and an adaptive pressure control system, with a wide pressure adjustment range of 0.1N to 10N and a resolution of 0.01N. This allows for precise control of pressure and energy input during the welding process, resulting in a high-quality, highly consistent hermetically sealed weld, effectively protecting the internal chip from the harsh external space environment.

[0041] Furthermore, the multi-parameter sensor network, edge computing unit, and human-machine interface form an integrated intelligent monitoring and operating system. The multi-parameter sensor network (including various sensors such as residual gas analyzer and fiber optic temperature array) is distributed across key process points, collecting core data such as welding current, chip pressure, and thermal field distribution in real time. The edge computing unit uses a lightweight AI model to process this data locally, instantly identifying faults such as cavity micro-leakage and electrode wear, and automatically locking the equipment alarm in case of anomalies. The human-machine interface is external to the cavity, supporting remote monitoring, parameter configuration, and firmware upgrades. The combination of these three components endows the equipment with powerful real-time monitoring, intelligent diagnostics, and remote operation and maintenance capabilities, significantly improving the stability, reliability, and production line continuity of the equipment, while reducing reliance on on-site engineers.

[0042] like Figure 1 As shown, the high-vacuum chamber operating table 1 adopts a double-layer stainless steel structure and is equipped with a composite pumping system, with an ultimate vacuum degree ≤1×10⁻ 4 Pa, the cavity leakage rate can be monitored in real time using a quadrupole mass spectrometer or the pressure drop method. The eutectic patch module 2 is equipped with a vision alignment system and a six-degree-of-freedom precision motion platform, achieving a patch positioning accuracy of ≤±3μm, and includes an infrared heating platform with thermal control uniformity of ≤±1℃. The parallel seam welding module 3 integrates a high-frequency pulse power supply and an adaptive pressure control system, with a pressure adjustment range of 0.1N to 10N and an adjustment resolution of 0.01N, achieving hermetic sealing of the metal casing.

[0043] like Figure 1 As shown, the multi-parameter sensor network includes a residual gas analyzer, a fiber optic temperature array, a Hall current sensor, and a piezoelectric pressure sensor, collecting parameters covering core process data such as welding current, patch pressure, and thermal field distribution. The edge computing unit runs a lightweight artificial intelligence model that can identify fault modes such as cavity microleakage and electrode wear, automatically locking the equipment and triggering an alarm when parameters are abnormal. The human-machine interface supports connection to external terminals via industrial Ethernet or a 5G communication module, enabling remote monitoring, parameter configuration, and firmware upgrades. The device is compatible with MEMS chips, SiC high-temperature sensors, and GaN power sensors, with batch-to-batch yield differences ≤2%. The control system is based on a domestically developed real-time operating system and a domestically developed CPU.

[0044] like Figure 2 As shown, a packaging system for aerospace sensors also includes a central control server, a process database, and a digital twin module, enabling centralized management of multiple devices, storage of process recipes, and virtual simulation operation and maintenance of equipment. The digital twin module synchronizes the operating parameters of physical devices, reproduces the packaging process, and triggers parameter deviation warnings; the process database supports the categorization and retrieval of packaging process recipes according to sensor type.

[0045] During implementation, firstly, the ultimate vacuum level provided by the high-vacuum chamber operating stage 1 is ≤1×10⁻ 4 In an environment with low pressure, the chip mounting accuracy is ≤±3μm and the thermal uniformity is ≤±1℃ through the vision alignment system and six-degree-of-freedom precision motion platform of the eutectic bonding module 2. Subsequently, the hermetically sealed metal casing is completed using the high-frequency pulse power supply and adaptive pressure control system (pressure adjustment range 0.1N~10N, resolution 0.01N) of the parallel seam welding module 3. Throughout the packaging process, a multi-parameter sensor network (including residual gas analyzer, fiber optic temperature array, Hall current sensor and piezoelectric pressure sensor) collects core process data such as welding current, bonding pressure, and thermal field distribution in real time. The edge computing unit runs a lightweight artificial intelligence model to diagnose faults (such as cavity microleakage, electrode wear, etc.). When parameters are abnormal, the equipment is automatically locked and an alarm is triggered.

[0046] Meanwhile, the human-machine interface 4 supports remote monitoring and configuration via industrial Ethernet or 5G, and the control system is based on a domestic real-time operating system and a domestic CPU. Furthermore, at the packaging system level, the central control server, process database, and digital twin module work together to achieve centralized management of multiple devices, classified calling of process recipes, and virtual simulation operation and maintenance of equipment. The digital twin module synchronizes the operating parameters of physical devices and triggers parameter deviation warnings, thereby ensuring that the yield difference between batches is ≤2%, meeting the high reliability packaging requirements of MEMS chips, SiC high-temperature sensors, and GaN power sensors.

[0047] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. A packaging device for an aerospace sensor, characterized in that, include: High vacuum chamber operating stage (1), eutectic patch module assembly (2), parallel seam welding module assembly (3), multi-parameter sensor network, edge computing unit and human-machine interface (4); The high-vacuum chamber operating stage (1) provides a packaging environment; The eutectic patch module assembly (2) and the parallel seam welded module assembly (3) complete the core packaging process; The multi-parameter sensor network collects process data; The edge computing unit processes data and diagnoses faults; The human-computer interaction interface (4) enables device control and status display; The eutectic patch module assembly (2) and the parallel seam welding module assembly (3) are disposed inside the high vacuum chamber operating table (1) or connected to its process port. The multi-parameter sensing network is distributed in each key process module to collect data in real time, and the edge computing unit is communicatively connected to the multi-parameter sensing network. The human-machine interface (4) is externally placed on the high vacuum cavity operating table (1) and is connected to the eutectic patch module assembly (2), the parallel seam welding module assembly (3) and the edge computing unit respectively to realize centralized control and status feedback.

2. The packaging device for an aerospace sensor according to claim 1, characterized in that, The high-vacuum chamber operating table (1) adopts a double-layer stainless steel structure and is equipped with a composite pumping system, with an ultimate vacuum degree ≤1×10⁻ 4 Pa can be used to monitor the cavity leakage rate in real time using a quadrupole mass spectrometer or the pressure drop method.

3. The packaging device for an aerospace sensor according to claim 1, characterized in that, The eutectic patch module assembly (2) is equipped with a vision alignment system and a six-degree-of-freedom precision motion platform, with patch positioning accuracy ≤ ±3μm, and includes an infrared heating platform with thermal control uniformity ≤ ±1℃.

4. The packaging device for an aerospace sensor according to claim 1, characterized in that, The parallel seam welding module (3) integrates a high-frequency pulse power supply and an adaptive pressure control system, with a pressure adjustment range of 0.1N to 10N and an adjustment resolution of 0.01N, to achieve hermetically sealed metal casing.

5. The packaging device for an aerospace sensor according to claim 4, characterized in that, The multi-parameter sensing network includes a residual gas analyzer, a fiber optic temperature array, a Hall current sensor, and a piezoelectric pressure sensor, and collects parameters covering core process data such as welding current, patch pressure, and thermal field distribution.

6. The packaging device for an aerospace sensor according to claim 5, characterized in that, The edge computing unit runs a lightweight artificial intelligence model that can identify fault modes such as cavity microleakage and electrode wear, and automatically lock the device and sound an alarm when parameters are abnormal.

7. The packaging device for an aerospace sensor according to claim 1, characterized in that, The human-machine interface (4) supports connection with external terminals via industrial Ethernet or 5G communication modules to realize remote monitoring, parameter configuration and firmware upgrade.

8. The packaging device for an aerospace sensor according to claim 1, characterized in that, The device is compatible with MEMS chips, SiC high-temperature sensors and GaN power sensors, with batch-to-batch yield differences of ≤2%. The control system is based on a domestic real-time operating system and a domestic CPU.

9. A packaging system for an aerospace sensor, characterized in that, The packaging device as described in any one of claims 1 to 8 further includes a central control server, a process database, and a digital twin module, enabling centralized management of multiple devices, storage of process recipes, and virtual simulation operation and maintenance of equipment.

10. The packaging system for an aerospace sensor according to claim 9, characterized in that, The digital twin module synchronizes the operating parameters of the physical device, reproduces the packaging process, and triggers a parameter deviation warning. The process database supports calling packaging process recipes categorized by sensor type.

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