A tape-attaching mechanism for semiconductor packaging

Abstract

This invention relates to the field of semiconductor packaging technology and discloses a bonding mechanism for semiconductor packaging, including a base. Side mechanisms are fixedly connected to the left and right sides of the top of the base. A top plate is fixedly connected to the top of each side mechanism. Feed tracks are fixedly connected to the inner sides of both side mechanisms. A first push rod is fixedly connected to the top of the base, and a bonding assembly is fixedly connected to the top of the first push rod. A slide rail is fixedly connected to the inner side of the base. By setting the bonding assembly, during the bonding process, the circular plate first contacts the central area of ​​the blue film and is heated and softened. Then, before the pressure ring contacts the blue film, a controllable pre-stretching effect is applied to the blue film, effectively releasing the internal stress of the blue film and preventing wrinkles or cracks caused by localized stress concentration during subsequent large-scale bonding. This improves the uniformity and consistency of the blue film expansion, thereby enhancing the bonding quality and the stability of subsequent bonding processes.

Description

Technical Field

[0001] This invention relates to the field of semiconductor packaging technology, specifically to a bonding mechanism for semiconductor packaging. Background Technology

[0002] In the semiconductor packaging die bonding process, the die bonding mechanism is a very important hardware configuration of the die bonding equipment. The structural integrity of the die bonding mechanism plays a leading role in the efficiency and quality of die bonding.

[0003] Patent application CN103050425A discloses a wafer stretching mechanism for semiconductor packaging, including a wafer expander base plate. The base plate has a fixedly connected wafer expander ring, and a middle wafer expander ring is located above the expander ring. The upper end of the middle wafer expander ring is fixedly connected to a wafer expander top cover. The top cover is positioned on the base plate via a cylinder guide post and can move up and down along the cylinder guide post. This invention features a wafer expander base plate with a wafer expander ring, a middle wafer expander ring, and a top wafer expander cover. The top cover and middle wafer expander ring can move up and down along the cylinder guide post. The wafer stretching process is achieved through the corresponding cooperation between the wafer expander ring and the middle wafer expander ring, and heating and wafer unloading operations are also possible. The structure is simple and compact, easy to use, highly automated, improves expansion quality, and is safe and reliable.

[0004] When using existing equipment, the stretching operation is usually performed by a single overall lifting method. That is, the pressure ring directly applies a one-time stretching force to the blue film. However, the blue film has uneven residual stress inside in its initial state. When the film is expanded directly, the central area is prone to local wrinkles, stress concentration or even cracking due to excessive instantaneous force and lack of softening treatment. This results in poor flatness of the film surface after expansion, which affects the chip mounting accuracy of subsequent bonding processes. Summary of the Invention

[0005] In view of the shortcomings of the prior art, the present invention provides a bonding mechanism for semiconductor packaging to solve the problems mentioned in the background art.

[0006] To achieve the above objectives, the present invention provides the following technical solution: a semiconductor packaging tensioning mechanism, comprising a base, side mechanisms fixedly connected to the left and right sides of the top of the base, a top plate fixedly connected to the top of the side mechanisms, material feeding tracks fixedly connected to the inner sides of the two side mechanisms, a first push rod fixedly connected to the top of the base, a tensioning assembly fixedly connected to the top of the first push rod, and a slide rail fixedly connected to the inner side of the base;

[0007] The bandage assembly includes:

[0008] A second movable plate has a first connecting plate fixedly connected to its outer wall. The bottom of the first connecting plate is fixedly connected to a first push rod. A connecting frame is fixedly connected to the top of the second movable plate, and a pressure ring is fixedly connected to the top of the connecting frame. A third slider is fixedly connected to the inner wall of the second movable plate. The first push rod is used to control the height of the pressure ring. By setting up the stretching assembly, during the stretching process, the circular plate first contacts the center area of ​​the blue film and is heated and softened. Then, before the pressure ring contacts the blue film, a controllable pre-stretching effect is applied to the blue film, effectively releasing the stress inside the blue film and avoiding wrinkles or cracks caused by local stress concentration during subsequent large-scale stretching. This improves the uniformity and consistency of the blue film expansion, thereby enhancing the stretching quality and the stability of subsequent film bonding processes.

[0009] According to the above technical solution, the lateral mechanism includes a side plate, the bottom of which is fixedly connected to the base. Vertical rails are fixedly connected to both the front and rear sides of the side plate, and a fixing component is movably connected to the outer wall of the vertical rail. The vertical rail is used to limit the range of motion of the fixing component. By setting the lateral mechanism, the height position of the fixing component is mechanically locked after the fixing component completes the clamping and positioning of the blue film. This prevents the fixing component from sliding due to force fluctuations, thereby maintaining a constant clamping force between the fixing ring and the blue film, avoiding the blue film from loosening or slipping during the bandaging process, and improving the positioning accuracy of the bandaging operation.

[0010] According to the above technical solution, the fixing component includes a movable frame, with a second slider fixedly connected to each of the four corners of the movable frame. The inner wall of the second slider is movably connected to a vertical track. A fixing ring is fixedly connected to the inner side of the movable frame, and a connecting block is fixedly connected to the outer wall of the movable frame. An inclined groove is formed on the outer wall of the connecting block. The fixing ring is used to fix the blue film. By setting the fixing component, the fixing rings on the upper and lower sides are driven to apply symmetrical clamping force from the edge of the blue film to the center simultaneously. This can pre-tension the blue film circumferentially evenly before stretching, effectively preventing the semiconductor chip from shifting or tilting under the subsequent stretching force, enhancing the accuracy and reliability of material positioning before stretching, and providing stable initial boundary conditions.

[0011] According to the above technical solution, a second push rod is fixedly connected to the inner side of the side plate, a first movable plate is fixedly connected to the movable end of the second push rod, a first slider is fixedly connected to the outer wall of the first movable plate, and the outer wall of the first slider is movably connected to the inclined groove. The second push rod is used to adjust the position of the first slider, thereby controlling the height of the fixing component.

[0012] According to the above technical solution, a fixing plate is connected to the inner side of the side plate. The fixing plate is used for front and rear extension and contraction, and is used to lock the position of the fixing component.

[0013] According to the above technical solution, the inner wall of the second movable plate is movably connected to a sliding column, the outer wall of the third slider is movably connected to the sliding column, the top of the sliding column is fixedly connected to a circular plate, and the bottom of the sliding column is provided with a square groove. The top of the circular plate is used to heat the blue film. By setting a tensioning assembly, after the circular plate has completed heating and pre-stretching and risen to a set position, the pressure plate limits and locks the square groove at the bottom of the sliding column, reliably fixing the pre-rising circular plate part. When the pressure ring subsequently rises to perform secondary expansion, this fixing structure can effectively isolate the interference of the lateral tension brought by the rise of the pressure ring on the softened central area, ensuring that the central area does not undergo unexpected deformation or displacement, thereby improving the flatness of the film surface before chip mounting.

[0014] According to the above technical solution, a third push rod is fixedly connected to the inner wall of the base, a U-shaped plate is fixedly connected to the movable end of the third push rod, a fourth slider is fixedly connected to the bottom of the U-shaped plate, the bottom of the fourth slider is movably connected to the slide rail, pressure wheels are rotatably connected to both sides of the U-shaped plate through bearings, and a pressure plate is fixedly connected to the top of the U-shaped plate. The third push rod is used to control the position of the pressure wheels.

[0015] According to the above technical solution, a second connecting plate is fixedly connected to the outer wall of the bottom of the sliding column, and a grooved plate is fixedly connected to the bottom of the second connecting plate. The bottom of the grooved plate is in contact with the pressure wheel, wherein the movement of the pressure wheel is used to control the height of the second connecting plate.

[0016] Compared with the prior art, the present invention provides a bonding mechanism for semiconductor packaging, which has the following advantages:

[0017] 1. This invention, by setting up a stretching assembly, allows the circular plate to first contact the central area of ​​the blue film and be heated and softened during the stretching process; then, before the pressure ring contacts the blue film, a controllable pre-stretching effect is applied to the blue film, effectively releasing the internal stress of the blue film and avoiding wrinkles or cracks caused by local stress concentration during subsequent large-scale stretching, thereby improving the uniformity and consistency of the blue film expansion, and thus enhancing the stretching quality and the stability of subsequent film bonding processes.

[0018] 2. By setting up a tensioning assembly, after the circular plate has been heated and pre-stretched and risen to a set position, the pressure plate limits and locks the square groove at the bottom of the sliding column, reliably fixing the pre-rising circular plate portion. When the pressure ring subsequently rises to perform secondary expansion, this fixing structure can effectively isolate the interference of the lateral tension brought by the rise of the pressure ring on the softened central area, ensuring that the central area does not undergo unexpected deformation or displacement, thereby improving the flatness of the film surface before chip mounting.

[0019] 3. By setting a fixing component, the present invention drives the fixing rings on the upper and lower sides to apply symmetrical clamping force from the edge of the blue film to the center at the same time; it can pre-tension the blue film circumferentially evenly before stretching, effectively preventing the semiconductor chip from shifting or tilting under the subsequent stretching force, enhancing the accuracy and reliability of material positioning before stretching, and providing stable initial boundary conditions.

[0020] 4. By setting a side mechanism, the present invention mechanically locks the height position of the fixing component after the fixing component has completed clamping and positioning the blue film; this prevents the fixing component from sliding due to force fluctuations, thereby maintaining a constant clamping force between the fixing ring and the blue film, avoiding the blue film from loosening or slipping during the bandaging process, and improving the positioning accuracy of the bandaging operation. Attached Figure Description

[0021] The accompanying drawings are provided to further illustrate the invention and form part of the specification. They are used in conjunction with embodiments of the invention to explain the invention and do not constitute a limitation thereof. In the drawings:

[0022] Figure 1 This is a schematic diagram of the overall structure of the present invention;

[0023] Figure 2 This is a partial structural diagram of the present invention. Figure 1 ;

[0024] Figure 3 This is a partial structural diagram of the present invention. Figure 2 ;

[0025] Figure 4 This is a partial structural diagram of the present invention. Figure 3 ;

[0026] Figure 5 Schematic diagram of the fixing component of the present invention Figure 1 ;

[0027] Figure 6 Schematic diagram of the fixing component of the present invention Figure 2 ;

[0028] Figure 7 Schematic diagram of the bandage assembly of the present invention Figure 1 ;

[0029] Figure 8 Schematic diagram of the bandage assembly of the present invention Figure 2 ;

[0030] Figure 9 Schematic diagram of the bandage assembly of the present invention Figure 3 ;

[0031] Figure 10 Schematic diagram of the bandage assembly of the present invention Figure 4 .

[0032] In the diagram: 1. Base; 101. Material feeding track; 102. Top plate; 103. First push rod; 104. Slide rail; 2. Side mechanism; 201. Side plate; 202. Vertical track; 203. Second push rod; 204. First movable plate; 205. First slider; 206. Fixed plate; 21. Fixed assembly; 211. Movable frame; 212. Second slider; 213. Fixed ring; 214. Connecting block; 215. 3. Inclined groove; 4. Tensioner assembly; 5. Second movable plate; 6. First connecting plate; 7. Third slider; 8. Connecting frame; 9. Pressure ring; 10. Sliding column; 11. Circular plate; 2. Square groove; 32. Second connecting plate; 4. Groove plate; 5. Third push rod; 6. U-shaped plate; 7. Fourth slider; 8. Pressure wheel; 9. Pressure plate. Detailed Implementation

[0033] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments.

[0034] Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the invention, and should not be construed as limiting the invention.

[0035] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0036] Example 1: See Figures 1-6The present invention provides a technical solution: a semiconductor packaging bonding mechanism, including a base 1, with side mechanisms 2 fixedly connected to the left and right sides of the top of the base 1, a top plate 102 fixedly connected to the top of the side mechanisms 2, and material feeding tracks 101 fixedly connected to the inner sides of the two side mechanisms 2. A first push rod 103 is fixedly connected to the top of the base 1, and a bonding assembly 3 is fixedly connected to the top of the first push rod 103. A slide rail 104 is fixedly connected to the inner side of the base 1. When bonding is required, the blue film with the chip already mounted is transported to the inside of the mechanism along the material feeding track 101. The chip is accurately placed to the bonding station. Then, the second push rod 203 is activated to fix the blue film, and the bonding assembly 3 is activated to expand the wafer on the blue film.

[0037] The side mechanism 2 includes a side plate 201. The bottom of the side plate 201 is fixedly connected to the base 1. Vertical rails 202 are fixedly connected to both the front and rear sides of the side plate 201. A fixing component 21 is movably connected to the outer wall of the vertical rail 202. The vertical rail 202 is used to limit the range of motion of the fixing component 21.

[0038] The fixing component 21 includes a movable frame 211, with second sliders 212 fixedly connected to each of the four corners of the movable frame 211. The inner walls of the second sliders 212 are movably connected to the vertical track 202. A fixing ring 213 is fixedly connected to the inner side of the movable frame 211, and a connecting block 214 is fixedly connected to the outer wall of the movable frame 211. An inclined groove 215 is formed on the outer wall of the connecting block 214. The fixing ring 213 is used to fix the blue film. A second push rod 203 is fixedly connected to the inner side of the side plate 201. A first movable plate 204 is fixedly connected to the movable end of the second push rod 203. A first slider 205 is fixedly connected to the outer wall of the first movable plate 204. The outer wall of the first slider 205 is movably connected to the inclined groove 215. The second push rod 203 is used to adjust the first... The position of the slider 205 controls the height of the fixing component 21. The inner side of the side plate 201 is connected to the fixing plate 206, which is used for forward and backward extension. The fixing plate 206 is used to lock the position of the fixing component 21. Before the blue film with the chip attached needs to be stretched, the second push rod 203 is activated to drive the first movable plate 204 to move horizontally to both sides. The first movable plate 204 drives the first slider 205 to move synchronously. The first slider 205 slides along the inclined groove 215, so that the fixing component 21 moves towards the center as a whole, realizing the centering clamping of the edge of the blue film. After the clamping is in place, the fixing plate 206 is activated to extend forward and press the fixing component 21 to complete the locking and ensure that the position of the blue film remains stable during the stretching process.

[0039] Example 2: Please refer to Figures 7-10Based on Embodiment 1, the present invention provides a technical solution: the bandage assembly 3 includes: a second movable plate 301, a first connecting plate 302 fixedly connected to the outer wall of the second movable plate 301, the bottom of the first connecting plate 302 fixedly connected to a first push rod 103, a connecting frame 304 fixedly connected to the top of the second movable plate 301, a pressure ring 305 fixedly connected to the top of the connecting frame 304, and a third slider 303 fixedly connected to the inner wall of the second movable plate 301, wherein the first push rod 103 is used to control the pressure ring. The height is 305; a sliding column 306 is movably connected to the inner wall of the second movable plate 301, and the outer wall of the third slider 303 is movably connected to the sliding column 306. A circular plate 307 is fixedly connected to the top of the sliding column 306, and a square groove 308 is opened at the bottom of the sliding column 306. The top of the circular plate 307 is used to heat the blue film; a third push rod 3011 is fixedly connected to the inner wall of the base 1, and a U-shaped plate 3012 is fixedly connected to the movable end of the third push rod 3011. A fourth slider is fixedly connected to the bottom of the U-shaped plate 3012. 3013, the bottom of the fourth slider 3013 is movably connected to the slide rail 104. Pressure rollers 3014 are rotatably connected to both sides of the U-shaped plate 3012 via bearings. A pressure plate 3015 is fixedly connected to the top of the U-shaped plate 3012. The third push rod 3011 is used to control the position of the pressure rollers 3014. A second connecting plate 309 is fixedly connected to the outer wall of the bottom of the sliding column 306. A grooved plate 3010 is fixedly connected to the bottom of the second connecting plate 309, and the bottom of the grooved plate 3010 is in contact with the pressure rollers 3014. The movement of the pressure roller 3014 is used to control the height of the second connecting plate 309. When the equipment needs to perform a stretching operation on the blue film with the chip already attached, the third push rod 3011 is activated first to drive the U-shaped plate 3012 to move horizontally to both sides. The movement of the U-shaped plate 3012 drives the pressure roller 3014 to move outward synchronously. The pressure roller 3014 rolls along the bottom surface of the groove plate 3010, and the horizontal movement is converted into the vertical lifting of the second connecting plate 309 through the inclined plane, thereby pushing the sliding column 306 and the circular plate 307 to move upward. During the ascent of the circular plate 307, its top heating element heats and softens the blue film, while simultaneously applying an initial pre-stretching effect. As the third push rod 3011 continues to advance, the pressure plate 3015 at the top of the U-shaped plate 3012 comes into close contact with the inner wall of the square groove 308. When the pressure plate 3015 is fully in contact with the square groove 308, the height positions of the sliding column 306 and the circular plate 307 are mechanically locked to ensure that the central area does not shift during the subsequent stretching process. Subsequently, the first push rod 103 is activated, driving the first connecting plate 302 to rise. The first connecting plate 302 drives the second movable plate 301 and the connecting frame 304 to move upward, thereby causing the pressure ring 305 to continue to rise, performing the final stretching of the pre-stretched blue film.

[0040] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0041] Finally, it should be noted that the above descriptions are merely preferred embodiments of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A bonding mechanism for semiconductor packaging, comprising a base (1), characterized in that, The base (1) has a side mechanism (2) fixedly connected to the top of the left and right sides. The top of the side mechanism (2) is fixedly connected to a top plate (102). The inner sides of the two side mechanisms (2) are fixedly connected to a material feeding track (101). The top of the base (1) is fixedly connected to a first push rod (103). The top of the first push rod (103) is fixedly connected to a tensioning assembly (3). The inner side of the base (1) is fixedly connected to a slide rail (104). The bandage assembly (3) includes: The second movable plate (301) has a first connecting plate (302) fixedly connected to its outer wall. The bottom of the first connecting plate (302) is fixedly connected to the first push rod (103). The top of the second movable plate (301) is fixedly connected to a connecting frame (304). The top of the connecting frame (304) is fixedly connected to a pressure ring (305). The inner wall of the second movable plate (301) is fixedly connected to a third slider (303). The first push rod (103) is used to control the height of the pressure ring (305).

2. The semiconductor packaging tensioning mechanism according to claim 1, characterized in that: The side mechanism (2) includes a side plate (201), the bottom of which is fixedly connected to the base (1), and vertical rails (202) are fixedly connected to both the front and rear sides of the side plate (201). A fixing component (21) is movably connected to the outer wall of the vertical rail (202), wherein the vertical rail (202) is used to limit the range of motion of the fixing component (21).

3. The semiconductor packaging tensioning mechanism according to claim 2, characterized in that: The fixing component (21) includes a movable frame (211), and a second slider (212) is fixedly connected to each of the four corners of the movable frame (211). The inner wall of the second slider (212) is movably connected to the vertical track (202). A fixing ring (213) is fixedly connected to the inner side of the movable frame (211), and a connecting block (214) is fixedly connected to the outer wall of the movable frame (211). An inclined groove (215) is opened on the outer wall of the connecting block (214). The fixing ring (213) is used to fix the blue film.

4. The semiconductor packaging tensioning mechanism according to claim 3, characterized in that: The inner side of the side plate (201) is fixedly connected to a second push rod (203), the movable end of the second push rod (203) is fixedly connected to a first movable plate (204), the outer wall of the first movable plate (204) is fixedly connected to a first slider (205), the outer wall of the first slider (205) is movably connected to the inclined groove (215), wherein the second push rod (203) is used to adjust the position of the first slider (205), thereby controlling the height of the fixing component (21).

5. A bonding mechanism for semiconductor packaging according to claim 4, characterized in that: The inner side of the side plate (201) is connected to a fixing plate (206), which is used for front and rear extension and retraction. The fixing plate (206) is used to lock the position of the fixing component (21).

6. A semiconductor packaging tensioning mechanism according to claim 5, characterized in that: The inner wall of the second movable plate (301) is movably connected to a sliding column (306), the outer wall of the third slider (303) is movably connected to the sliding column (306), the top of the sliding column (306) is fixedly connected to a circular plate (307), and the bottom of the sliding column (306) is provided with a square groove (308). The top of the circular plate (307) is used to heat the blue film.

7. A bonding mechanism for semiconductor packaging according to claim 6, characterized in that: The inner wall of the base (1) is fixedly connected to a third push rod (3011), the movable end of the third push rod (3011) is fixedly connected to a U-shaped plate (3012), the bottom of the U-shaped plate (3012) is fixedly connected to a fourth slider (3013), the bottom of the fourth slider (3013) is movably connected to the slide rail (104), both sides of the U-shaped plate (3012) are rotatably connected to pressure wheels (3014) through bearings, and the top of the U-shaped plate (3012) is fixedly connected to a pressure plate (3015). The third push rod (3011) is used to control the position of the pressure wheel (3014).

8. A bonding mechanism for semiconductor packaging according to claim 7, characterized in that: The outer wall of the bottom of the sliding column (306) is fixedly connected to a second connecting plate (309), and the bottom of the second connecting plate (309) is fixedly connected to a groove plate (3010). The bottom of the groove plate (3010) is in contact with a pressure wheel (3014), wherein the movement of the pressure wheel (3014) is used to control the height of the second connecting plate (309).

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