Vacuumizing device, wafer electroplating equipment and electroplating method

Abstract

The application relates to the technical field of wafer manufacturing equipment, and discloses a vacuumizing device, wafer electroplating equipment and an electroplating method. The vacuumizing device comprises a first negative pressure generating assembly, a second negative pressure generating assembly, and first, second and third pipeline assemblies which can be independently opened and closed. The two ends of the first pipeline assembly are respectively used for being connected with a pretreatment chamber and being communicated with the first negative pressure generating assembly, and the first negative pressure generating assembly can vacuumize the pretreatment chamber. The two ends of the second pipeline assembly are respectively connected with a containing groove and the second negative pressure generating assembly, and the second negative pressure generating assembly can degas liquid in the containing groove. The two ends of the third pipeline assembly are respectively used for being communicated with the containing groove and the first negative pressure generating assembly, so that the first negative pressure generating assembly can degas liquid in the containing groove. The vacuumizing device can continuously degas liquid in the containing groove, can guarantee the vacuumizing efficiency of the pretreatment chamber, and has low manufacturing cost.

Description

Technical Field

[0001] This invention relates to the field of wafer manufacturing equipment technology, and in particular to a vacuum device, wafer electroplating equipment, and electroplating method. Background Technology

[0002] Advanced packaging technology involves electroplating of wafers. Before electroplating, different feature shapes to be plated, such as TSV holes, bumps, and RDLs (rewiring lines), are formed on the wafer surface. After electroplating, these feature shapes are filled or covered by a metal layer. Generally, the side of the wafer with feature shapes is the front side, and the side without feature shapes is the back side.

[0003] In addition to the electroplating chamber used for the electroplating process, electroplating equipment also includes a pretreatment chamber. Before entering the electroplating chamber, wafers need to undergo cleaning and wetting processes in the pretreatment chamber. During pretreatment, the pretreatment chamber is first evacuated to create negative pressure, and then the wafers are cleaned and wetted. Furthermore, to ensure effective cleaning, the cleaning solution undergoes continuous degassing (i.e., removing dissolved air bubbles). In related technologies, the vacuum system for the pretreatment chamber and the degassing system for the cleaning solution are designed and operated independently, resulting in wasted design costs and high manufacturing costs for the wafer electroplating equipment.

[0004] Therefore, there is an urgent need for a vacuum pumping device and wafer electroplating equipment to solve the above-mentioned technical problems. Summary of the Invention

[0005] The first objective of this invention is to provide a vacuuming device that can continuously degas the liquid in the containment tank, ensure the efficiency of vacuuming the pretreatment chamber, and reduce the manufacturing cost of the entire vacuuming device.

[0006] To achieve this objective, the present invention adopts the following technical solution:

[0007] The vacuum pumping device includes a first negative pressure generating component, a second negative pressure generating component, and a first pipe assembly, a second pipe assembly, and a third pipe assembly, each capable of being independently opened and closed, wherein:

[0008] The first end of the first pipe assembly is connected to the pretreatment chamber, and the second end of the first pipe assembly is used to communicate with the first negative pressure generating component. When the first pipe assembly is turned on, the first negative pressure generating component can evacuate the pretreatment chamber.

[0009] The first end of the second pipe assembly is connected to a container containing liquid, and the second end of the second pipe assembly is used to connect to the second negative pressure generating component. When the second pipe assembly is turned on, the second negative pressure generating component can degas the liquid in the container.

[0010] The first end of the third pipe assembly is used to communicate with the receiving tank, and the second end of the third pipe assembly is used to communicate with the first negative pressure generating component. When the third pipe assembly is turned on, the first negative pressure generating component can degas the liquid in the receiving tank.

[0011] As an alternative, the first negative pressure generating component includes a vacuum pump, and the second negative pressure generating component includes a vacuum generator.

[0012] As an alternative, when the first negative pressure generating component evacuates the pretreatment chamber, the third pipeline assembly is closed, and the second negative pressure generating component degasses the liquid;

[0013] When the first pipeline assembly is closed, the second negative pressure generating assembly is closed, the third pipeline assembly is opened, and the first negative pressure generating assembly degasses the liquid.

[0014] As an optional solution, the vacuuming device further includes a pressure detection component, which is used to detect the pressure in the pretreatment chamber. The pressure detection component is communicatively connected to the first pipeline assembly, the third pipeline assembly, and the second negative pressure generating assembly.

[0015] When the real-time air pressure detected by the air pressure detection component is less than or equal to the preset pressure, the first pipeline component is closed, the second negative pressure generating component is closed, and the third pipeline component is opened.

[0016] As an alternative, the vacuuming device includes at least two second pipe assemblies, each second pipe assembly having its first end connected to a corresponding receiving tank, the receiving tanks containing the same or different liquids.

[0017] As an alternative, the vacuuming device includes at least two of the first pipe assemblies, with each first pipe assembly having its first end connected to one of the pretreatment chambers.

[0018] As an optional embodiment, the vacuuming device further includes a first gas-liquid container, wherein the second end of the first pipe assembly and / or the second end of the third pipe assembly are connected to the inlet end of the first gas-liquid container, and the outlet end of the first gas-liquid container is connected to the first negative pressure generating component. The first gas-liquid container is used to dry the gas drawn by the first negative pressure generating component.

[0019] As an optional solution, the vacuuming device further includes:

[0020] A liquid level detection component, wherein the liquid level detection component is used to detect the liquid level in the first gas-liquid container;

[0021] A drainage pipe, one end of which is connected to the bottom of the first gas-liquid container;

[0022] A drain valve is used to open and close the drain pipe and is communicatively connected to the liquid level detection component. The drain valve is configured to open the drain pipe when the liquid level data detected by the liquid level detection component reaches a preset value.

[0023] As an optional embodiment, the vacuuming device further includes a second gas-liquid container, wherein the second end of the second pipe assembly and / or the first end of the third pipe assembly are connected to the inlet end of the second gas-liquid container, the outlet end of the second gas-liquid container is used to connect to the second negative pressure generating component, and the second gas-liquid container is used to dry the gas drawn by the second negative pressure generating component.

[0024] The second objective of this invention is to provide a wafer electroplating device that, by employing the aforementioned vacuum device, has low design and manufacturing costs and high electroplating efficiency.

[0025] To achieve this objective, the present invention adopts the following technical solution:

[0026] Wafer electroplating equipment includes:

[0027] At least one pre-processing chamber for accommodating the wafer to be processed;

[0028] At least one receiving tank for containing liquid;

[0029] The aforementioned vacuuming device is used to evacuate the pretreatment chamber and degas the liquid in the accommodating tank.

[0030] As an alternative, the wafer electroplating equipment includes two receiving tanks, one of which is used to contain cleaning solution and the other of which is used to contain electroplating solution.

[0031] The third objective of this invention is to provide a wafer electroplating method that achieves high overall electroplating efficiency by employing the aforementioned wafer electroplating equipment.

[0032] To achieve this objective, the present invention adopts the following technical solution:

[0033] The wafer electroplating method, performed using the aforementioned wafer electroplating equipment, includes:

[0034] Step S10: Vacuum the pretreatment chamber using the first negative pressure generating component, and simultaneously degas the liquid in the accommodating tank using the second negative pressure generating component.

[0035] Step S20: Obtain the real-time air pressure in the pretreatment chamber and compare the real-time air pressure with the preset pressure. If the real-time air pressure is greater than the preset pressure, return to step S10; if the real-time air pressure is less than or equal to the preset pressure, proceed to step S30.

[0036] Step S30: Close the first pipeline assembly, close the second negative pressure generating assembly, and open the third pipeline assembly to degas the liquid in the accommodating tank through the first negative pressure generating assembly.

[0037] The beneficial effects of this invention are:

[0038] The vacuuming device of the present invention includes a first negative pressure generating component, a second negative pressure generating component, and a first pipe assembly, a second pipe assembly, and a third pipe assembly that can be independently opened and closed. While the first negative pressure generating component evacuates the pretreatment chamber, the second negative pressure generating component degassing the liquid in the receiving tank. That is, the first negative pressure generating component concentrates its vacuuming of the pretreatment chamber, thereby ensuring the efficiency of vacuuming the pretreatment chamber and improving the efficiency of the entire electroplating process. After the gas pressure in the pretreatment chamber reaches a preset pressure, the first pipe assembly and the second negative pressure generating component close, and the third pipe assembly opens. At this time, the first negative pressure generating component connects... The second negative pressure component degassing the liquid in the container tank ensures continuous degassing. Since the second negative pressure generating component only needs to degas the liquid in the container tank when the first negative pressure generating component evacuates the pretreatment chamber, it does not need to work at other times. Therefore, the second negative pressure generating component only needs to be a suitable, low-cost, intermittently operating negative pressure generating component to enable the vacuuming device to continuously degas the liquid in the container tank and ensure the efficiency of evacuating the pretreatment chamber. In addition, it can reduce the manufacturing cost of the entire vacuuming device. The degassing of the liquid in the container tank and the evacuation of the pretreatment chamber are completed by a single vacuuming device, resulting in low design cost.

[0039] The wafer electroplating equipment of the present invention includes at least one pretreatment chamber, at least one receiving tank, and the aforementioned vacuum device. The receiving tank is used to hold the wafer to be processed, and the receiving tank is used to hold a liquid. The vacuum device is used to evacuate the pretreatment chamber and degas the liquid in the receiving tank. This wafer electroplating equipment, by employing the aforementioned vacuum device, has low design cost, low manufacturing cost, and high electroplating efficiency.

[0040] The wafer electroplating method of the present invention includes: step S10, evacuating the pretreatment chamber using a first negative pressure generating component, and simultaneously degassing the liquid in the receiving tank using a second negative pressure generating component; step S20, acquiring the real-time air pressure in the pretreatment chamber and comparing the real-time air pressure with a preset pressure; if the real-time air pressure is greater than the preset pressure, returning to step S10; if the real-time air pressure is less than or equal to the preset pressure, proceeding to step S30; step S30, turning off the second negative pressure generating component, turning on the third pipeline component, and degassing the liquid in the receiving tank using the first negative pressure generating component. This wafer electroplating method, by employing the aforementioned wafer electroplating equipment, achieves high overall electroplating efficiency. Attached Figure Description

[0041] Figure 1 This is a schematic diagram of the airflow during vacuuming of the pretreatment chamber in the wafer electroplating equipment provided in a specific embodiment of the present invention.

[0042] Figure 2 This is a schematic diagram of the airflow after the pretreatment chamber is evacuated, provided by a specific embodiment of the present invention, in the wafer electroplating equipment.

[0043] In the picture:

[0044] 10. First negative pressure generating component; 11. Vacuum pump; 12. First connecting pipe; 13. First on / off valve;

[0045] 20. Second negative pressure generating component; 21. Vacuum generator; 22. Second connecting pipe; 23. Second on / off valve;

[0046] 30. First piping assembly; 31. First pipe fitting; 32. First valve;

[0047] 40. Second piping assembly; 41. Second pipe fitting; 42. Second valve;

[0048] 50. Third piping assembly; 51. Third pipe fitting; 52. Third valve;

[0049] 60. Pretreatment chamber;

[0050] 70. Receiving groove; 71. First receiving groove; 72. Second receiving groove;

[0051] 81. First gas-liquid container; 82. Liquid level detection assembly; 83. Drainage pipe; 84. Drain valve;

[0052] 91. Second gas-liquid container. Detailed Implementation

[0053] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are for illustrative purposes only and are not intended to limit the scope of the invention. Furthermore, it should be noted that, for ease of description, the accompanying drawings show only the parts relevant to the present invention and not the entire structure.

[0054] In the description of this invention, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0055] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0056] In the description of this embodiment, the terms "upper," "lower," "right," etc., refer to the orientation or positional relationship shown in the accompanying drawings. They are used only for ease of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the present invention. In addition, the terms "first" and "second" are used only for distinction in description and have no special meaning.

[0057] This embodiment provides a wafer electroplating device, which can be referred to as [reference needed]. Figure 1 As shown, the wafer electroplating equipment includes at least one pretreatment chamber 60, at least one receiving tank 70, and a vacuum device. The pretreatment chamber 60 is used to hold the wafer to be processed, the receiving tank 70 contains liquid, and the vacuum device is used to evacuate the pretreatment chamber 60 and to degas the liquid in the receiving tank 70.

[0058] In some embodiments, reference may continue to be made to Figure 1The wafer electroplating equipment includes two receiving tanks 70, one of which is designated as the first receiving tank 71, and the other as the second receiving tank 72. The first receiving tank 71 is used to contain cleaning solution, and the second receiving tank 72 is used to contain electroplating solution. The cleaning solution in the first receiving tank 71 is used to flow into the pretreatment chamber 60 to clean the wafers within the pretreatment chamber 60. In addition, the wafer electroplating equipment also includes an electroplating chamber. After the wafers are cleaned and pre-wetted in the pretreatment chamber 60, they are sent into the electroplating chamber. The electroplating solution in the second receiving tank 72 is used to flow into the electroplating chamber to electroplat the wafers.

[0059] In some embodiments, the wafer plating equipment further includes a spraying mechanism for spraying cleaning solution onto the front side of the wafer (generally facing upwards). In some embodiments, the wafer plating equipment also includes a handling robot capable of grasping the back side of the wafer located within the pretreatment chamber 60 and placing the wafer into a wafer fixture within the plating chamber for electroplating.

[0060] Typically, cleaning solutions and electroplating solutions require continuous degassing (i.e., removing dissolved air bubbles from the cleaning solution) to ensure cleaning or electroplating quality. Furthermore, before the wafers are cleaned in the pre-processing chamber 60, the pre-processing chamber 60 needs to be evacuated. In existing technologies, the vacuum system of the pre-processing chamber and the degassing system of the cleaning solution are designed and operated independently, wasting design costs and leading to high manufacturing costs for wafer electroplating equipment.

[0061] To address this, this embodiment provides a vacuum pumping device, please refer to... Figure 1 and Figure 2 The vacuuming device includes a first negative pressure generating component 10, a second negative pressure generating component 20, and a first pipe assembly 30, a second pipe assembly 40, and a third pipe assembly 50, each capable of being independently opened and closed. Specifically: the first end of the first pipe assembly 30 is connected to a pretreatment chamber 60, and the second end of the first pipe assembly 30 is connected to the first negative pressure generating component 10. When the first pipe assembly 30 is open, the first negative pressure generating component 10 can evacuate the pretreatment chamber 60. The first end of the second pipe assembly 40 is connected to a liquid-containing container 70, and the second end of the second pipe assembly 40 is connected to the second negative pressure generating component 20. When the second pipe assembly 40 is open, the second negative pressure generating component 20 can evacuate and degas the liquid in the container 70. The first end of the third pipe assembly 50 is connected to the container 70, and the second end of the third pipe assembly 50 is connected to the first negative pressure generating component 10. When the third pipe assembly 50 is open, the first negative pressure generating component 10 can degas the liquid in the container 70.

[0062] In actual use, please continue to refer to Figure 1 , Figure 1 The arrows indicate the airflow direction. When a vacuum needs to be applied to the pretreatment chamber 60, the first pipe assembly 30 opens, the second pipe assembly 40 opens, and the third pipe assembly 50 closes. During this process, the first negative pressure generating component 10 evacuates the pretreatment chamber 60, while the second negative pressure generating component 20 degasses the liquid in the receiving tank 70. In other words, the output of the first negative pressure generating component 10 is concentrated on evacuating the pretreatment chamber 60, thus ensuring the efficiency of evacuating the pretreatment chamber 60 and improving the efficiency of the entire electroplating process. Please refer to... Figure 2 , Figure 2 The arrows indicate the airflow direction. After the pretreatment chamber 60 is evacuated, the first pipeline assembly 30 is closed, the second negative pressure generating assembly 20 is closed, and the third pipeline assembly 50 is opened. At this time, the first negative pressure generating assembly 10 can take over from the second negative pressure generating assembly 20 to degas the liquid in the container 70, thereby ensuring continuous degassing of the liquid in the container 70. Since the second negative pressure generating assembly 20 only needs to degas the liquid in the container 70 when the first negative pressure generating assembly 10 evacuates the pretreatment chamber 60, it does not need to work at other times. Therefore, the second negative pressure generating assembly 20 only needs to be a suitable, intermittently operating, and low-cost negative pressure generating assembly to ensure that the vacuuming device can continuously degas the liquid in the container 70 and ensure the efficiency of evacuating the pretreatment chamber 60. In addition, it can also reduce the manufacturing cost of the entire vacuuming device. The degassing of the liquid in the container 70 and the evacuation of the pretreatment chamber 60 are completed by a single vacuuming device, resulting in low design cost.

[0063] In some embodiments, the first negative pressure generating component 10 includes a vacuum pump 11, and the second negative pressure generating component 20 includes a vacuum generator 21. The vacuum pump 11 is suitable for long-term, continuous, and stable operation and is highly efficient. On the one hand, it ensures rapid and efficient evacuation of the pretreatment chamber 60, thereby improving cleaning efficiency and correspondingly improving electroplating efficiency. On the other hand, even when the pretreatment chamber 60 is not evacuated, the vacuum pump 11 continuously degasses the liquid in the receiving tank 70, ensuring the quality of the liquid and thus guaranteeing the cleaning / electroplating effect. The vacuum generator 21 is suitable for intermittent operation, meeting the requirement of degassing the liquid in the receiving tank 70 within the short time required for the vacuum pump 11 to evacuate the pretreatment chamber 60. Furthermore, its cost is relatively lower than that of the vacuum pump 11, thus reducing the overall cost of the vacuuming device.

[0064] Please continue to refer to Figure 1The first negative pressure generating component 10 also includes a first connecting pipe 12 and a first on / off valve 13. One end of the first connecting pipe 12 is connected to the inlet end of the vacuum pump 11, and the other end is used to connect directly or indirectly to the second end of the first pipeline component 30 and to connect directly or indirectly to the second end of the third pipeline component 50. The first on / off valve 13 is disposed on the first connecting pipe 12 and is used to open and close the first connecting pipe 12.

[0065] Please continue to refer to Figure 2 The second negative pressure generating component 20 also includes a second connecting pipe 22 and a second on / off valve 23. One end of the second connecting pipe 22 is connected to the inlet end of the vacuum generator 21, and the other end is used to connect directly or indirectly to the second end of the second pipeline assembly 40. The second on / off valve 23 is disposed on the second connecting pipe 22 and is used to open and close the second connecting pipe 22.

[0066] In some embodiments, the vacuuming device further includes a pressure detection component, which detects the pressure within the pretreatment chamber 60. The pressure detection component is communicatively connected to the first pipeline assembly 30, the third pipeline assembly 50, and the second negative pressure generating assembly 20. When the real-time pressure detected by the pressure detection component is less than or equal to a preset pressure, the first pipeline assembly 30 and the second negative pressure generating assembly 20 are closed, and the third pipeline assembly 50 is opened. By setting the pressure detection component to detect the pressure within the pretreatment chamber 60, it is possible to promptly determine whether the pressure within the pretreatment chamber 60 has reached the required state, thereby enabling timely closure of the second negative pressure generating assembly 20 and timely switching of the suction path of the first negative pressure generating assembly 10, achieving automated control. Optionally, the pressure detection component can be a thermocouple vacuum gauge, a thermal conductivity vacuum gauge, etc., and is not specifically limited here.

[0067] In some embodiments, please continue to refer to Figure 1 The first pipeline assembly 30 includes a first pipe fitting 31 and a first valve 32. One end of the first pipe fitting 31 is connected to and communicates with the pretreatment chamber 60, and the other end of the first pipe fitting 31 is directly or indirectly connected to the first negative pressure generating assembly 10. The first valve 32 is disposed on the first pipe fitting 31 and is used to control the opening and closing of the first pipe fitting 31, thereby realizing the opening and closing of the entire first pipeline assembly 30.

[0068] In some embodiments, please continue to refer to Figure 1 The second pipeline assembly 40 includes a second pipe fitting 41 and a second valve 42. One end of the second pipe fitting 41 is connected to and communicates with the receiving groove 70, and the other end of the second pipe fitting 41 is directly or indirectly connected to the second negative pressure generating assembly 20. The second valve 42 is disposed on the second pipe fitting 41 and is used to control the opening and closing of the second pipe fitting 41, thereby realizing the opening and closing of the entire second pipeline assembly 40.

[0069] In some embodiments, please continue to refer to Figure 1 The third pipeline assembly 50 includes a third pipe fitting 51 and a third valve 52. One end of the third pipe fitting 51 is used to connect directly or indirectly to the first negative pressure generating assembly 10, and the other end can be directly or indirectly connected to the receiving groove 70. The third valve 52 is installed on the third pipe fitting 51 and is used to control the opening and closing of the third pipe fitting 51, thereby realizing the opening and closing of the entire third pipeline assembly 50.

[0070] In some embodiments, please continue to refer to Figure 1 The wafer electroplating equipment includes at least two pretreatment chambers 60, each of which can independently perform pretreatments such as cleaning on the wafer. Correspondingly, the vacuum device includes at least two first pipe assemblies 30, and each pretreatment chamber 60 can be connected to a first negative pressure generating assembly 10 through one of the first pipe assemblies 30. Figure 1 In the illustrated embodiment, two pretreatment chambers 60 and two first pipe assemblies 30 are provided. In other embodiments, three, four, or more pretreatment chambers 60 and first pipe assemblies 30 may be provided, and no specific limitation is made here.

[0071] Optionally, the wafer plating equipment includes at least two receiving tanks 70, and the liquids in the different receiving tanks 70 can be the same or different. Correspondingly, the vacuuming device includes at least two second pipe assemblies 40, with the first end of each second pipe assembly 40 connected to a receiving tank 70. This arrangement allows for more flexible control over whether to vacuum and degas the liquids in each receiving tank 70.

[0072] In some embodiments, please continue to refer to Figure 1 The wafer electroplating equipment includes two receiving tanks 70, one being a first receiving tank 71 and the other a second receiving tank 72. The first receiving tank 71 is used to contain cleaning solution, and the second receiving tank 72 is used to contain electroplating solution. In this embodiment, the first receiving tank 71 can be directly or indirectly connected to the second negative pressure generating component 20 through a second pipe assembly 40, and the second receiving tank 72 can be directly or indirectly connected to the second negative pressure generating component 20 through another second pipe assembly 40.

[0073] In some embodiments, please continue to refer to Figure 1At least two receiving slots 70 are connected to the first negative pressure generating component 10 via the same third pipe assembly 50. This configuration simplifies the piping layout of the entire vacuuming device, resulting in lower costs and easier control. Specifically, the second end of the third pipe assembly 50 is used to directly or indirectly connect to the first negative pressure generating component 10, and the second ends of the second pipe assemblies 40, which are respectively connected to different receiving slots 70, are all connected to the first end of the third pipe assembly 50. In this embodiment, the opening and closing of the third pipe assembly 50 can simultaneously control whether at least two receiving slots 70 are vacuumed and degassed by the second negative pressure generating component 20.

[0074] In some embodiments (not shown), the number of third pipe assemblies 50 provided in the vacuum device is the same as the number of receiving slots 70, and each receiving slot 70 is connected to the second negative pressure generating assembly 20 through a corresponding third pipe assembly 50. In this embodiment, it is possible to independently control whether each receiving slot 70 is vacuumed through the second negative pressure generating assembly 20, thus providing greater flexibility.

[0075] In some embodiments, the vacuuming device further includes a first gas-liquid container 81. The second end of the first pipe assembly 30 and the second end of the third pipe assembly 50 are connected to the inlet end of the first gas-liquid container 81, and the outlet end of the first gas-liquid container 81 is connected to the first negative pressure generating assembly 10. The first gas-liquid container 81 is used to dry the gas drawn by the first negative pressure generating assembly 10. By setting the first gas-liquid container 81, it can be ensured that the gas entering the vacuum pump 11 is dry gas, avoiding corrosion damage to the first negative pressure generating assembly 10 caused by undehydrated gas. Optionally, the first gas-liquid container 81 includes a receiving cavity and a dehydration device disposed in the receiving cavity. The water dehydrated by the dehydration device is stored in the receiving cavity. Without departing from the inventive concept of this application, the dehydration device can be any of the prior art.

[0076] In other embodiments, the second end of the first pipe assembly 30 may be connected to the inlet end of the first gas-liquid container 81, and the second end of the third pipe assembly 50 may be directly connected to the first negative pressure generating assembly 10.

[0077] In other embodiments, the second end of the third pipe assembly 50 may be connected only to the inlet end of the first gas-liquid container 81, while the second end of the first pipe assembly 30 may be directly connected to the first negative pressure generating assembly 10.

[0078] After the first negative pressure generating component 10 has been operating for a period of time, the liquid level in the first gas-liquid container 81 will increase. For details, please refer to some embodiments. Figure 1The vacuuming device also includes a liquid level detection component 82, a drain pipe 83, and a drain valve 84. The liquid level detection component 82 is used to detect the liquid level in the first gas-liquid container 81. One end of the drain pipe 83 is connected to the bottom of the first gas-liquid container 81. The drain valve 84 is used to open and close the drain pipe 83 and is communicatively connected to the liquid level detection component 82. The drain valve 84 is configured to open the drain pipe 83 when the liquid level data detected by the liquid level detection component 82 reaches a preset value.

[0079] Specifically, when the liquid level detection component 82 detects that the liquid level in the first gas-liquid container 81 has reached a first height, the drain valve 84 opens the drain pipe 83 to drain the accumulated liquid in the first gas-liquid container 81; when the liquid level detection component 82 detects that the liquid level in the first gas-liquid container 81 has reached a second height (the second height is lower than the first height), the drain valve 84 closes the drain pipe 83, thereby preventing the liquid level in the first gas-liquid container 81 from being too high and affecting the normal drying of the air. Optionally, the liquid level detection component 82 may be configured to include two liquid level sensors, one of which detects whether the liquid level has risen to the first height, and the other liquid level sensor detects whether the liquid level has decreased to the second height. In other embodiments, the specific structure of the liquid level detection component 82 is not limited.

[0080] In some embodiments, reference may continue to be made to Figure 1 The vacuuming device also includes a second gas-liquid container 91. The second end of the second pipe assembly 40 and the first end of the third pipe assembly 50 are connected to the inlet end of the second gas-liquid container 91. The outlet end of the second gas-liquid container 91 is connected to the second negative pressure generating assembly 20. The second gas-liquid container 91 is used to dry the gas drawn by the second negative pressure generating assembly 20. By providing the second gas-liquid container 91, it can be ensured that the gas entering the second negative pressure generating assembly 20 is dry, avoiding corrosion damage to the second negative pressure generating assembly 20 caused by undried gas. Optionally, the second gas-liquid container 91 includes a receiving cavity and a dehydration device disposed within the receiving cavity. Water dehydrated by the dehydration device is stored in the receiving cavity. Without departing from the inventive concept of this application, the dehydration device can be any of the prior art.

[0081] In other embodiments, the second end of the second pipe assembly 40 may be connected to the inlet end of the second gas-liquid container 91, and the first end of the third pipe assembly 50 may be directly connected to the receiving tank 70 without passing through the second gas-liquid container 91.

[0082] This embodiment also provides a wafer electroplating method, performed using the aforementioned wafer electroplating equipment, the wafer electroplating method comprising:

[0083] In step S10, the pretreatment chamber 60 is evacuated by the first negative pressure generating component 10, and the liquid in the accommodating tank 70 is degassed by the second negative pressure generating component 20.

[0084] Step S20: Obtain the real-time air pressure in the pretreatment chamber 60 and compare the real-time air pressure with the preset pressure. If the real-time air pressure is greater than the preset pressure, return to step S10; if the real-time air pressure is less than or equal to the preset pressure, proceed to step S30.

[0085] Step S30: Close the first pipeline assembly 30, close the second negative pressure generating assembly 20, and open the third pipeline assembly 50 to degas the liquid in the accommodating tank 70 through the first negative pressure generating assembly 10.

[0086] The above-mentioned wafer electroplating method, performed using the above-mentioned wafer electroplating equipment, can not only ensure continuous vacuum degassing of the liquid in the accommodating tank 70, but also ensure the efficiency of vacuuming the pretreatment chamber 60, and the overall design cost and manufacturing cost are low.

[0087] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the implementation of the present invention. For those skilled in the art, based on the concept of the present invention, there will be changes in specific implementation methods and application scope. The content of this specification should not be construed as a limitation of the present invention. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the protection scope of the claims of the present invention.

Claims

1. A vacuum pumping device, characterized in that, It includes a first negative pressure generating component (10), a second negative pressure generating component (20), and a first pipe assembly (30), a second pipe assembly (40), and a third pipe assembly (50) that can be independently opened and closed, wherein: The first end of the first pipe assembly (30) is connected to the pretreatment chamber (60), and the second end of the first pipe assembly (30) is used to communicate with the first negative pressure generating assembly (10). When the first pipe assembly (30) is turned on, the first negative pressure generating assembly (10) can evacuate the pretreatment chamber (60). The first end of the second pipe assembly (40) is connected to the container tank (70) containing liquid, and the second end of the second pipe assembly (40) is used to connect to the second negative pressure generating assembly (20). When the second pipe assembly (40) is turned on, the second negative pressure generating assembly (20) can degas the liquid in the container tank (70). The first end of the third pipe assembly (50) is used to communicate with the receiving tank (70), and the second end of the third pipe assembly (50) is used to communicate with the first negative pressure generating assembly (10). When the third pipe assembly (50) is turned on, the first negative pressure generating assembly (10) can degas the liquid in the receiving tank (70).

2. The vacuum pumping device as described in claim 1, characterized in that, The first negative pressure generating component (10) includes a vacuum pump (11), and the second negative pressure generating component (20) includes a vacuum generator (21).

3. The vacuum pumping device as described in claim 1, characterized in that, When the first negative pressure generating component (10) evacuates the pretreatment chamber (60), the third pipeline component (50) is closed, and the second negative pressure generating component (20) degasses the liquid; When the first pipeline assembly (30) is closed, the second negative pressure generating assembly (20) is closed, the third pipeline assembly (50) is opened, and the first negative pressure generating assembly (10) degasses the liquid.

4. The vacuum pumping device as described in claim 3, characterized in that, The vacuuming device also includes a pressure detection component, which is used to detect the pressure in the pretreatment chamber (60). The pressure detection component is communicatively connected to the first pipeline assembly (30), the third pipeline assembly (50), and the second negative pressure generating assembly (20). When the real-time air pressure detected by the air pressure detection component is less than or equal to the preset pressure, the first pipeline component (30) is closed, the second negative pressure generating component (20) is closed, and the third pipeline component (50) is opened.

5. The vacuum pumping device as described in claim 1, characterized in that, The vacuum device includes at least two second pipe assemblies (40), each second pipe assembly (40) having its first end connected to a corresponding receiving tank (70), and the different receiving tanks (70) containing the same or different liquids.

6. The vacuum pumping device as described in claim 1, characterized in that, The vacuuming device includes at least two first pipe assemblies (30), and the first end of each first pipe assembly (30) is connected to one of the pretreatment chambers (60).

7. The vacuum pumping device according to any one of claims 1-6, characterized in that, The vacuum device further includes a first gas-liquid container (81), the second end of the first pipe assembly (30) and / or the second end of the third pipe assembly (50) are connected to the inlet end of the first gas-liquid container (81), the outlet end of the first gas-liquid container (81) is connected to the first negative pressure generating assembly (10), and the first gas-liquid container (81) is used to dry the gas drawn by the first negative pressure generating assembly (10).

8. The vacuum pumping device as described in claim 7, characterized in that, The vacuum pumping device also includes: A liquid level detection component (82) is used to detect the liquid level in the first gas-liquid container (81); A drainage pipe (83), one end of which is connected to the bottom of the first gas-liquid container (81); A drain valve (84) is used to open and close the drain pipe (83) and is communicatively connected to the liquid level detection component (82). The drain valve (84) is configured to open the drain pipe (83) when the liquid level data detected by the liquid level detection component (82) reaches a preset value.

9. The vacuuming device according to any one of claims 1-6, characterized in that, The vacuum device further includes a second gas-liquid container (91), the second end of the second pipe assembly (40) and / or the first end of the third pipe assembly (50) are connected to the inlet end of the second gas-liquid container (91), the outlet end of the second gas-liquid container (91) is used to connect to the second negative pressure generating assembly (20), and the second gas-liquid container (91) is used to dry the gas drawn by the second negative pressure generating assembly (20).

10. Wafer electroplating equipment, characterized in that, The wafer electroplating equipment includes: At least one pre-processing chamber (60) for accommodating the wafer to be processed; At least one receiving tank (70) for containing liquid; The vacuuming device according to any one of claims 1-9, the vacuuming device being used to evacuate the pretreatment chamber (60) and degas the liquid in the accommodating tank (70).

11. The wafer electroplating equipment as described in claim 10, characterized in that, The wafer electroplating equipment includes two receiving tanks (70), one of which is used to hold cleaning solution and the other of which is used to hold electroplating solution.

12. A wafer electroplating method, characterized in that, The wafer electroplating method is performed using the wafer electroplating equipment according to claim 10 or 11, and the wafer electroplating method includes: Step S10: The pretreatment chamber (60) is evacuated by the first negative pressure generating component (10), and the liquid in the accommodating tank (70) is degassed by the second negative pressure generating component (20). Step S20: Obtain the real-time air pressure in the pretreatment chamber (60) and compare the real-time air pressure with the preset pressure. If the real-time air pressure is greater than the preset pressure, return to step S10; if the real-time air pressure is less than or equal to the preset pressure, proceed to step S30. Step S30: Close the first pipeline assembly (30), close the second negative pressure generating assembly (20), and open the third pipeline assembly (50) to degas the liquid in the accommodating tank (70) through the first negative pressure generating assembly (10).

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