Inspection apparatus, inspection method, and electronic device manufactured by the inspection method

Abstract

The present application discloses an inspection apparatus, an inspection method, and an electronic device manufactured by the inspection method. The inspection method includes: generating a virtual image of a unit based on a design drawing of the unit; defining reference coordinates to be inspected in the virtual image of the unit; defining an interference region in which a capture region that captures a portion of the unit and a frame that supports the unit overlap each other; identifying interference coordinates among the reference coordinates that overlap the interference region in a plan view; and setting substitute coordinates that are adjacent to the interference coordinates in the unit and are spaced apart from the interference region in the plan view, wherein a stacked structure at the substitute coordinates is the same as a stacked structure at the interference coordinates.

Description

Technical Field

[0001] This disclosure generally relates to an inspection apparatus, an inspection method, and an electronic device manufactured by the inspection method. More specifically, this disclosure relates to an inspection apparatus, an inspection method, and an electronic device manufactured by the inspection method that reduces process time. Background Technology

[0002] With the rapid popularization of information media such as computers, electronic devices and semiconductor devices are also developing rapidly. In order to improve integration, reliability, or response speed, manufacturing technologies for electronic devices and / or semiconductor devices are being developed.

[0003] Accordingly, as part of enhancing the competitiveness of the semiconductor industry, efforts are underway to develop each cell process that can ensure high production yields, and at the same time, research is being actively conducted on methods and equipment for inspecting process errors in each cell process. Summary of the Invention

[0004] The embodiment provides an inspection method with reduced process time.

[0005] An embodiment provides an inspection device using the inspection method.

[0006] An embodiment provides an electronic device manufactured using this inspection method.

[0007] The inspection method according to embodiments of the present disclosure includes: generating a virtual image of the unit based on a design drawing of the unit; defining reference coordinates to be inspected in the virtual image of the unit; defining an interference region in which a capture area of ​​a capture portion overlaps with a frame, wherein the capture portion captures the unit and the frame supports the unit; identifying interference coordinates in the reference coordinates that overlap with the interference region in a plan view; and setting alternative coordinates that are adjacent to the interference coordinates in the unit and spaced apart from the interference region in a plan view, wherein the stacking structure at the alternative coordinates is the same as the stacking structure at the interference coordinates.

[0008] In the embodiments, the reference coordinates may correspond to one of the metal wires and holes included in the unit.

[0009] In an embodiment, the definition of the interference region may include: obtaining multiple frame coordinates corresponding to the frame; and serializing the multiple frame coordinates.

[0010] In this embodiment, the distance between the interfering coordinates and the alternative coordinates can be within approximately 2 mm when setting the alternative coordinates.

[0011] In an embodiment, the inspection method may further include: after setting alternative coordinates, comparing the planar shape of the unit at the measured coordinates and the alternative coordinates with a virtual image of the unit at the measured coordinates and the alternative coordinates, wherein the measured coordinates are coordinates in the reference coordinates that are spaced apart from the interference area.

[0012] In an embodiment, comparing the planar shape of a unit with the virtual image of the unit may include checking whether the matching degree between the pattern of the planar shape of the unit and the pattern of the virtual image of the unit is greater than a threshold.

[0013] In an embodiment, the threshold may be greater than or equal to about 0.85.

[0014] In an embodiment, the inspection method may further include: when the matching degree between patterns is greater than a threshold, measuring at the measurement coordinates and alternative coordinates of the cell.

[0015] In an embodiment, the inspection method may further include: designing a process for the unit when the matching degree between patterns is less than or equal to a threshold.

[0016] In one embodiment, the redesign of the process for a cell can be carried out in about 7 days.

[0017] In one embodiment, the generation of a virtual image of the cell and the redesign of the process for the cell can be carried out in about 40 days.

[0018] In an embodiment, the process for the cell may include one of an etching process and a cleaning process.

[0019] An inspection apparatus according to an embodiment of the present disclosure includes: a virtual image generator that generates a virtual image of a unit based on a design drawing of the unit, wherein the unit is loaded on a frame; a reference coordinate determination section that defines reference coordinates to be inspected in the virtual image of the unit; a unit capture section that captures the unit set on the frame and defines an interference area overlapping with the frame; and a measurement section that measures the image of the unit captured by the unit capture section.

[0020] In an embodiment, the reference coordinate determination section may define alternative coordinates adjacent to the interference coordinates, which overlap with the interference area defined by the cell capture section in the plan view.

[0021] In this embodiment, the distance between the interfering coordinates and the alternative coordinates can be within approximately 2 mm.

[0022] In an embodiment, the frame may have a grid shape in the plan view.

[0023] In one embodiment, the frame may include a first frame and a second frame. In this embodiment, the first frame may define a first interference region, and the second frame may define a second interference region. In this embodiment, the interference region may be an area where the first interference region and the second interference region overlap.

[0024] In an embodiment, the reference coordinates may correspond to one of the metal wires and holes included in the unit.

[0025] In an embodiment, the measurement section may measure one of the following: the linewidth of the metal wire defined by reference coordinates; and the position of the hole defined by reference coordinates.

[0026] An electronic device according to an embodiment of the present disclosure includes: a display device; and a processor that drives the display device. In this embodiment, the display device is manufactured by the inspection method described above.

[0027] In embodiments of this disclosure, the inspection method can identify interfering coordinates in the reference coordinates that overlap with the interference area defined by the frame in the plan view. In this embodiment, the interfering coordinates can be replaced with alternative coordinates before measurement by the measurement section. Accordingly, by pre-excluding interfering coordinates that are not measured by the measurement section before measurement, the process correction time after measurement can be shortened. As a result, by defining alternative coordinates before measurement, the overall production efficiency of the process can be improved. Attached Figure Description

[0028] The illustrative and non-limiting embodiments will be more clearly understood from the following detailed description taken in conjunction with the accompanying drawings.

[0029] Figure 1 This is a block diagram illustrating an inspection apparatus according to an embodiment of the present disclosure.

[0030] Figure 2 This is a flowchart illustrating an inspection method according to an embodiment of the present disclosure.

[0031] Figure 3 It is shown in the figure. Figure 2 A flowchart of an embodiment of a method for defining interference regions.

[0032] Figure 4 The diagram shows the inclusion of Figure 2 A plan view of an embodiment of the mother substrate of the unit described herein.

[0033] Figure 5 The diagram shows the components set on the frame. Figure 4 A plan view of the mother substrate.

[0034] Figure 6 It is shown in the figure. Figure 5The diagram shows a plan view of the frame coordinates of the support unit frame.

[0035] Figure 7 The diagram illustrates how to make Figure 6 The planar diagram of the interference coordinates is defined by making the frame coordinates continuous.

[0036] Figure 8 It is shown in the diagram Figure 7 The diagram shows a plan view illustrating the process of defining reference coordinates within a given cell.

[0037] Figure 9 The diagram illustrates the replacement of coordinates with alternative coordinates. Figure 8 A plan view of the process of interfering coordinates that overlap with the frame in the reference coordinates.

[0038] Figure 10 It is shown in the diagram Figure 9 A plan view of the measurement process at each coordinate defined in the diagram.

[0039] Figure 11 This is a block diagram illustrating an electronic device according to an embodiment of the present disclosure.

[0040] Figure 12 According to various embodiments Figure 11 A schematic diagram of the electronic device. Detailed Implementation

[0041] The invention will now be described more fully below with reference to the accompanying drawings, in which various embodiments are illustrated. However, the invention may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art.

[0042] It will be understood that when an element is referred to as being "on" another element, it can be directly on that other element, or there can be an intervening element between them. Conversely, when an element is referred to as being "directly on" another element, there is no intervening element.

[0043] It will be understood that although the terms “first,” “second,” “third,” etc., may be used herein to describe various elements, components, areas, layers, and / or segments, these elements, components, areas, layers, and / or segments should not be limited by these terms. These terms are used only to distinguish one element, component, area, layer, or segment from another. Therefore, the first element, component, area, layer, or segment discussed below may be referred to as the second element, component, area, layer, or segment without departing from the teachings herein.

[0044] It will be understood that when an element is referred to as "connected" or "coupled" to another element, it can be directly connected or coupled to that other element, or there can be intervening elements (multiple). In contrast, when an element is referred to as "directly connected" or "directly coupled" to another element, there are no intervening elements. Other terms used to describe relationships between elements should be interpreted in a similar manner (e.g., "between" versus "directly between," "adjacent to" versus "directly adjacent to," etc.).

[0045] The terminology used herein is for the purpose of describing particular exemplary embodiments only and is not intended to limit the inventive concept. As used herein, the singular forms “a” and “the (described)” are intended to include the plural forms as well, unless the context clearly indicates otherwise. Thus, a reference to “the” element following a reference to “a” element in a claim includes one element and multiple elements. For example, “a element” has the same meaning as “at least one element”, unless the context clearly indicates otherwise. “At least one” should not be construed as limited to “a”. “Or” means “and / or”. As used herein, the term “and / or” includes any and all combinations of one or more of the associated listed items. It will be further understood that the terms “comprising” or “including” and / or variations thereof, when used in this specification, specify the presence of the described features, integrals, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components, and / or groups thereof.

[0046] Furthermore, relative terms such as “below” or “bottom” and “above” or “top” may be used herein to describe the relationship between one element and another illustrated in the figures. It will be understood that, in addition to the orientations depicted in the figures, the relative terms are intended to cover different orientations of the device. For example, if the device in one of the figures is flipped, the element described as being “below” the other element will subsequently be oriented to be “above” the other element. Thus, depending on the specific orientation of the figure, the term “below” can cover both “below” and “above” orientations. Similarly, if the device in one of the figures is flipped, the element described as being “below” or “under” the other element will subsequently be oriented to be “above” the other element. Thus, the terms “below” or “under” can cover both above and below orientations.

[0047] Given the measurements discussed and the errors associated with the measurement of a particular quantity (i.e., limitations of the measurement system), the terms “about” or “approximately” as used herein include the stated value and mean within an acceptable range of deviation for a particular value as determined by one of ordinary skill in the art. For example, “about” may mean within one or more standard deviations of the stated value, or within ±30%, ±20%, ±10%, or ±5% of the stated value.

[0048] Unless otherwise defined, all terms used herein (including technical and scientific terms) shall have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure pertains. It will be further understood that terms (such as those defined in common dictionaries) shall be interpreted as having a meaning consistent with their meaning in the context of the relevant field and shall not be interpreted in an idealized or overly formal sense unless expressly defined herein.

[0049] In the following description, various embodiments of the present disclosure will be illustrated with reference to the accompanying drawings. The same reference numerals are used for the same parts in the drawings, and any repetitive detailed descriptions of the same parts will be omitted or simplified.

[0050] In this specification, a plane can be defined by a first direction D1 and a second direction D2 intersecting the first direction D1. For example, the second direction D2 can be perpendicular to the first direction D1. Furthermore, a third direction D3 can be the normal direction of the plane. That is, the third direction D3 can be perpendicular to the plane defined by the first direction D1 and the second direction D2.

[0051] Figure 1 This is a block diagram illustrating an inspection apparatus according to an embodiment of the present disclosure. Figure 2 This is a flowchart illustrating an inspection method according to an embodiment of the present disclosure.

[0052] refer to Figure 1 and Figure 2 The embodiment of the inspection device MPA can be implemented in electronic devices (e.g., Figure 11The patterning result is predicted during the manufacturing process of the electronic device 10, semiconductor device, or battery. In embodiments, for example, the electronic device 10 or semiconductor device may include a mobile phone, smartphone, tablet PC, mobile communication terminal, electronic notebook, e-book, portable multimedia player (PMP), navigation device, or ultra-mobile PC (UMPC). In another embodiment, for example, the electronic device 10 or semiconductor device may be a television, laptop computer, monitor, billboard, or display portion of the Internet of Things (IoT). In yet another embodiment, for example, the electronic device 10 or semiconductor device may include wearable devices such as smartwatches, watch phones, glasses displays, and head-mounted displays (HMDs).

[0053] An embodiment of the inspection device MPA may include a virtual image generator (IGP), a reference coordinate determination section (RCP), a cell capture section (CCP), and a measurement section (MPP). In an embodiment, each of the virtual image generator (IGP), the reference coordinate determination section (RCP), the cell capture section (CCP), and the measurement section (MPP) may include, or be defined by, circuitry that executes instructions corresponding to the operations described herein.

[0054] A virtual image generator (IGP) can generate a virtual image based on at least one layer illustrated in a design drawing. The design drawing may include a layout diagram of each of multiple layers, and the IGP can generate the virtual image by sequentially stacking the multiple layers. In this case, the multiple layers may include at least one metallic layer and at least one organic layer.

[0055] In an embodiment, the virtual image generator IGP can generate a virtual image including a first layer, a virtual image including a first layer and a second layer, and a virtual image including a first layer to a third layer (operation S100). Accordingly, the virtual image generator IGP can generate virtual images based on design drawings of semiconductor devices, etc. However, the embodiments of this disclosure are not limited thereto.

[0056] The Reference Coordinates Determination (RCP) section defines the reference coordinates (RC, see [reference image]) to be inspected (or measured) within this virtual image. Figure 8 (Operation S200). The Reference Coordinate Determination (RCP) section can receive multiple virtual images from the Virtual Image Generator (IGP) and determine reference coordinates (RC) for each of the multiple virtual images.

[0057] In an embodiment, the Reference Coordinate Determination Section (RCP) may determine multiple reference coordinates (RCs) for each virtual image. In another embodiment, for example, the RCP may determine the reference coordinates (RCs) by receiving user input, but this disclosure is not limited thereto. The reference coordinates (RCs) may include at least one region defined by a layer, at least one metal wire, or at least one hole.

[0058] The cell capture section (CCP) can capture cells (CLs) that are to be inspected. Figure 4 or Figure 9 In an embodiment, the unit capture portion CCP may include an optical device (e.g., a camera) for capturing a real image of the unit to be inspected. In an embodiment, the unit capture portion CCP may receive the captured image from the unit from an external source or from an external device. The unit capture portion CCP may be based on a capture area (CTA, see...) Figure 10 The system performs pattern matching of the target to be inspected (operation S600) and can confirm whether the real image and virtual image of the target to be inspected meet the preset matching degree (operation S700).

[0059] The measurement section (MPP) can perform measurements on the capture area CTA based on the reference coordinate RC (operation S800). The measurement section (MPP) can measure the linewidth, hole location, and shape and size of the capture area CTA. The measurement section (MPP) can also be used to measure critical dimensions based on the reference coordinate RC.

[0060] In an embodiment, for example, the measurement portion MPP can be used to perform measurements of the linewidth, aperture, or region of the capture region CTA by performing at least one pattern measurement based on reference coordinates RC, including overlay, refractive index, and thickness. By performing overlay pattern measurements, the measurement portion MPP can measure line misalignment.

[0061] The following will refer to Figures 4 to 9 , to Figure 2 The diagram shows the defined interference area (IFA, see figure). Figure 7 (Operation S300) process to replace coordinates (AC, see) Figure 9 Replace interference coordinates (IFC, see below) Figure 8 The process of (operating S500) is described.

[0062] Figure 3 It is shown in the figure. Figure 2 A flowchart of an embodiment of a method for defining interference regions.

[0063] refer to Figure 1 , Figure 2 and Figure 3 In an embodiment of the method for defining the interference region (operation S300), the cell capture portion CCP can obtain a frame (FR) overlapping with the cell CL in the plan view. Figure 5 ) frame coordinates (FRC, see Figure 6 (Operation S310). Thereafter, the element capture portion CCP can define an interference region IFA with a linear shape in the planar diagram by making the frame coordinates FRC continuous (Operation S320). The following will refer to... Figure 6 and Figure 7 This describes the definition of the interference region IFA by the CCP of the unit capture part.

[0064] Figure 4 The diagram shows the inclusion of Figure 2 A plan view of an embodiment of the mother substrate of the unit described herein.

[0065] refer to Figure 2 and Figure 4 An embodiment of the mother substrate MS may include a plurality of units CL. The units CL may be arranged on the mother substrate MS along a first direction D1 and / or a second direction D2. Each of the units CL may include a substrate, etc., included in a display device.

[0066] In an embodiment, such as Figure 4 As shown, the mother substrate MS and the unit CL may have a rectangular shape in the plan view, but the embodiments of this disclosure are not limited to this. In another embodiment, the mother substrate MS may have one of various other shapes such as a circle, an ellipse, or other polygons in the plan view.

[0067] In embodiments, each of the units CL may include multiple layers, and the multiple layers may include at least one metal layer and at least one organic layer. Furthermore, the multiple layers in each of the units CL may include at least one region defined by a layer, at least one metal line, or at least one hole. That is, each of the units CL may be a display panel included in a display device. However, embodiments of this disclosure are not necessarily limited thereto.

[0068] Figure 5 The diagram shows the components set on the frame. Figure 4 A plan view of the mother substrate.

[0069] refer to Figure 2 , Figure 4 and Figure 5 In one embodiment, the frame FR can be disposed below the mother substrate MS. For example, in another embodiment, the frame FR can be disposed along a third direction D3 from the mother substrate MS. Accordingly, the frame FR can support the mother substrate MS.

[0070] In an embodiment, the frame FR can extend in a first direction D1 and a second direction D2. That is, the frame FR can have a grid shape in a planar view. In an embodiment, as... Figure 5 As shown, the frame FR may include eight support members extending in the first direction D1 and four support members extending in the second direction D2, but the embodiments of this disclosure are not limited thereto. The planar shape and number of the frame FR may be varied according to various embodiments.

[0071] In an embodiment, the frame FR may comprise metal, etc. For example, the frame FR may comprise aluminum (Al) or copper (Cu), etc. When the cell capture portion (CCP, see...) Figure 1 When capturing cell CL, because frame FR contains metal, it may not be possible to accurately capture cell CL in areas overlapping with frame FR. To solve this problem, or to accurately capture cell CL in areas overlapping with frame FR, it is desirable to capture the image excluding the portion of cell CL that overlaps with frame FR in the planar view.

[0072] Figure 6 It is shown in the figure. Figure 5 The diagram shows a plan view of the frame coordinates of the support unit frame. Figure 7 The diagram illustrates how to make Figure 6 The planar diagram of the interference coordinates is defined by making the frame coordinates continuous.

[0073] refer to Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 and Figure 6 In an embodiment, the cell capture portion CCP can capture cell CL. The cell capture portion CCP can obtain the frame coordinates FRC of the frame FR that overlaps with cell CL in the plan view. The frame coordinates FRC may vary depending on the image quality or magnification of the cell capture portion CCP, depending on the embodiment. In an embodiment, for example, the cell capture portion CCP may capture cell CL at a magnification of about 70x to about 100x. However, the embodiments of this disclosure are not limited to this.

[0074] Further reference Figure 7 The element capture portion of the CCP can enable frame coordinate FRC serialization. In an embodiment, such as... Figure 7 As illustrated in the figure, the cell capture portion CCP can define the interference region IFA (operation S300) by serializing (or continuousizing) the frame coordinates FRC. In an embodiment, for example, the interference region IFA may refer to an area in the cell CL that overlaps with the frame FR in the planar view and cannot be captured by the cell capture portion CCP.

[0075] In an embodiment, the interference area IFA can be defined by multiple measurement components. For example, in an inspection device MPA (in... Figure 1 In the case of a first inspection device and a second inspection device (as illustrated in the figure), the first inspection device may include a first measuring portion, and the second inspection device may include a second measuring portion. In this embodiment, as shown in the reference... Figure 7 As described, a first measurement section can define a first interference region, and a second measurement section can define a second interference region. The inspection device MPA can define the area where the first and second interference regions overlap as an interference region IFA. Because the interference region IFA is defined by multiple measurement sections, interference regions IFA not captured by the cell capture section CCP can be defined more precisely.

[0076] Figure 8 It is shown in the diagram Figure 7 The diagram shows a plan view illustrating the process of defining reference coordinates within a given cell. Figure 9 The diagram illustrates the replacement of coordinates with alternative coordinates. Figure 8 A plan view of the process of interfering coordinates that overlap with the frame in the reference coordinates.

[0077] Specifically, Figure 8 It is shown in the figure. Figure 2 A planar diagram of the process of defining reference coordinates RC (operation S200) in a virtual image. Figure 9 It is shown in the figure. Figure 2 A plan view of the process of replacing the interfering coordinate IFC that overlaps with the frame FR in the reference coordinate RC with the alternative coordinate AC (operation S500).

[0078] refer to Figure 1 , Figure 2 , Figure 7 , Figure 8 and Figure 9 In an embodiment, the reference coordinate determination portion RCP can be defined in the cell CL as the reference coordinate RC for the capture target (operation S200). The reference coordinate RC may include at least one region defined by a layer included in the cell CL, at least one metal wire, or at least one hole. However, embodiments of this disclosure are not limited thereto.

[0079] The reference coordinate RC can include the interference coordinate IFC that overlaps with the interference region IFA in the plan view, and the measurement coordinate MC that does not overlap with the interference region IFA.

[0080] After defining the reference coordinate RC, the inspection device MPA can identify the interfering coordinate IFC in the reference coordinate RC that overlaps with the interfering region IFA in the planar view (operation S400). Subsequently, the inspection device MPA can replace the interfering coordinate IFC with a substitute coordinate AC, so that the cell capture portion CCP can capture the substitute coordinate AC (operation S500). The stack-up structure at the substitute coordinate AC can be the same as the stack-up structure at the interfering coordinate IFC. In an embodiment, for example, when the interfering coordinate IFC is a region with a hole region, the substitute coordinate AC can be defined as a region with a hole region.

[0081] In an embodiment, the distance between the interfering coordinate IFC and the surrogate coordinate AC in a plan view can be within approximately 2 mm. In another embodiment, for example, the distance between the interfering coordinate IFC and the surrogate coordinate AC in a plan view can be within approximately 1 mm. The component located at the surrogate coordinate AC in unit CL and the component located at the interfering coordinate IFC in unit CL can be manufactured using the same process during the manufacturing process. By satisfying the aforementioned range of the distance between the surrogate coordinate AC and the interfering coordinate IFC, the stack-up structure at the surrogate coordinate AC can be substantially the same as the stack-up structure at the interfering coordinate IFC. Therefore, even if the surrogate coordinate AC is captured and measured, substantially the same data can be obtained, just as if the unit CL were measured at the interfering coordinate IFC.

[0082] After defining the alternative coordinates AC, the cell CL can be captured at the measurement coordinates MC and the alternative coordinates AC by the cell capture part CCP, and the matching of the real image and the virtual image can be confirmed by comparing the virtual image and the captured image in the same area (specifically, comparing the planar shape of the cell CL at the measurement coordinates MC and the alternative coordinates AC with the virtual image of the cell CL at the measurement coordinates MC and the alternative coordinates AC) (operation S600) (operation S700).

[0083] In an embodiment, when the matching degree between the real image and the virtual image is greater than a threshold, a measurement can be performed by measuring a portion of the MPP (operation S800). In an embodiment, for example, the threshold may be greater than or equal to about 0.85. In an embodiment, for example, the threshold may be greater than or equal to about 0.9.

[0084] In an embodiment, for example, when the matching degree between the real image and the virtual image is greater than a threshold, measurement can be initiated at the measurement coordinate MC and the alternative coordinate AC of the unit CL. The following will refer to... Figure 10 This describes the measurement of cell CL.

[0085] In an embodiment, for example, when the matching degree between the real image and the virtual image is less than or equal to a threshold, a process redesign for the cell CL can be performed. The process redesign for the cell CL can be performed in approximately 7 days. In an embodiment, for example, the process redesign can be performed in approximately 6 days. The process for the cell CL may include one of an etching process and a cleaning process. However, embodiments of this disclosure are not necessarily limited thereto.

[0086] If there is no process to replace the interfering coordinate IFC with the alternative coordinate AC, the process redesign may take approximately 7.5 days because the reference coordinate RC should be corrected during the process redesign. According to embodiments of this disclosure, by performing the process of replacing the interfering coordinate IFC with the alternative coordinate AC (operation S500) before measuring the cell CL (operation S800), the time required for process redesign can be shortened. Accordingly, the process time for the cell CL can be shortened, thereby improving overall process efficiency.

[0087] Figure 10 It is shown in the diagram Figure 9 A plan view of the measurement process at each coordinate defined in the diagram.

[0088] refer to Figure 10 In the embodiment, the measurement section (MPP, see Figure 1 It can be based on reference coordinates (RC, see) Figure 8 This is used to perform measurements of the CTA in the capture area (operation S800). The measurement section MPP can measure the measurement points of the CTA in the capture area. Figure 10 The measurement section of MPP can perform critical dimensioning based on the measurement coordinates MC and the alternative coordinates AC. Figure 10 The measurement section (MPP) performs a CD (critical dimension) check. In an embodiment, for example, the measurement section (MPP) can detect the edges of each layer and can perform measurements based on the edges of each layer as a critical dimension check. In an embodiment, for example, the measurement section (MPP) can perform at least one pattern measurement of superposition, refractive index, and thickness based on measurement coordinates MC and alternative coordinates AC. By performing superimposed pattern measurements, the measurement section (MPP) can measure line misalignment. Therefore, the measurement section (MPP) can be used to measure line width, holes, or areas, etc., of measurement points (CD targets).

[0089] In one embodiment, the process from generating the virtual image (operation S100) to measuring the cell CL (operation S800) can be performed in approximately 40 days. In another embodiment, for example, the process from generating the virtual image (operation S100) to measuring the cell CL (operation S800) can be performed in approximately 38 days. In this embodiment, by including replacing the interfering coordinate IFC with the alternative coordinate AC (operation S500) before measuring the cell CL (operation S800), the process time for performing all processes can be shortened.

[0090] Accordingly, this inspection method can identify interfering coordinates IFC in the reference coordinate RC that overlap with the interfering area IFA defined by the frame FR in the plan view before measurement. Before measurement via the measurement section MPP, the interfering coordinates IFC can be replaced with alternative coordinates AC. Consequently, by pre-excluding interfering coordinates IFC that are not measured by the measurement section MPP before measurement, the process correction time after measurement can be shortened. As a result, by defining alternative coordinates AC before measurement, the overall production efficiency of the process can be improved.

[0091] Figure 11 This is a block diagram illustrating an electronic device according to an embodiment of the present disclosure.

[0092] refer to Figure 11 The inspection method according to the embodiments can be applied to various electronic devices 10. The electronic device 10 according to the embodiments may include a display device, and the display device may include components included in a unit (CL, see...) Figure 4 The electronic device 10 may include a display panel in addition to the display device. Furthermore, in addition to the display device, the electronic device 10 may further include modules or devices with other additional functions.

[0093] In this embodiment, the electronic device 10 may include a display module 11, a processor 12, a memory 13, and a power module 14. The display module 11 may correspond to the display panel described above.

[0094] The processor 12 may include at least one selected from a central processing unit (CPU), an application processor (AP), a graphics processing unit (GPU), a communication processor (CP), an image signal processor (ISP), and a controller.

[0095] The memory 13 can store data information used by the processor 12 or the display module 11 for operation. When the processor 12 executes the application stored in the memory 13, image data signals and / or input control signals can be transmitted to the display module 11, and the display module 11 can process the received signals and output image information through the display screen.

[0096] The power module 14 may include a power supply module such as a power adapter or battery device, and a power conversion module that converts the power supplied by the power supply module to generate the power used for the operation of the electronic device 10.

[0097] At least one of the components of the electronic device 10 described above may be included in the display device. Furthermore, some individual modules that are functionally included in a single module may be included in the display device, while other individual modules may be provided separately from the display device. In embodiments, for example, the display device may include a display module 11, and the processor 12, memory 13, and power module 14 may be provided in the electronic device 10 as devices other than the display device.

[0098] Figure 12 According to various embodiments Figure 11 A schematic diagram of the electronic device.

[0099] refer to Figure 11 and Figure 12 Various embodiments of electronic devices to which display devices are applied may include image display electronic devices (such as smartphones 10_1a, tablet PCs 10_1b, laptops 10_1c, televisions 10_1d or desktop monitors 10_1e, etc.), wearable electronic devices containing display modules (such as smart glasses 10_2a, head-mounted displays 10_2b or smartwatches 10_2c, etc.), and vehicle electronic devices 10_3 containing display modules (such as central information displays (CIDs) or rearview mirror displays that may be installed on the dashboard, center console, and instrument panel of a car).

[0100] The embodiments of this disclosure can be applied to various display devices, such as display devices for vehicles, ships and aircraft, portable communication devices, display devices for exhibitions or information transmission, and medical display devices.

[0101] This invention should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the inventive concept to those skilled in the art.

[0102] While the invention has been specifically shown and described with reference to various embodiments thereof, those skilled in the art will understand that various modifications in form and detail may be made therein without departing from the spirit and scope of the invention as defined by the claims.

Claims

1. An inspection method, comprising: A virtual image of the unit is generated based on the unit's design drawing; Define the reference coordinates to be checked in the virtual image of the unit; Define an interference region in which the capture area of ​​the capture portion overlaps with the frame, wherein the capture portion captures the unit and the frame supports the unit; Identify the interference coordinates in the reference coordinates that overlap with the interference area in the planar diagram; as well as An alternative coordinate is set, which is adjacent to the interference coordinate in the cell and spaced apart from the interference region in the plan view, wherein the stacking structure at the alternative coordinate is the same as the stacking structure at the interference coordinate.

2. The inspection method according to claim 1, wherein, In the definition of the reference coordinates, the reference coordinates correspond to one of the metal wires and holes included in the unit.

3. The inspection method according to claim 1, wherein, The definition of the interference region includes: Obtain multiple frame coordinates corresponding to the frame; and The coordinates of the multiple frames are serialized.

4. The inspection method according to claim 1, wherein, In the setting of the alternative coordinates, the interval between the interference coordinates and the alternative coordinates is within 2 mm.

5. The inspection method according to claim 1, further comprising: After the alternative coordinates are set, the planar shape of the cell at the measured coordinates and the alternative coordinates is compared with the virtual image of the cell at the measured coordinates and the alternative coordinates, wherein the measured coordinates are coordinates in the reference coordinates that are spaced apart from the interference region.

6. The inspection method according to claim 5, wherein, The comparison between the planar shape of the unit and the virtual image of the unit includes: Check whether the matching degree between the pattern of the planar shape of the unit and the pattern of the virtual image of the unit is greater than a threshold.

7. The inspection method according to claim 6, wherein, The threshold is greater than or equal to 0.

85.

8. The inspection method according to claim 6, further comprising: When the matching degree between the patterns is greater than the threshold, measurements are performed at the measurement coordinates and the alternative coordinates of the unit.

9. The inspection method according to claim 6, further comprising: When the matching degree between the patterns is less than or equal to the threshold, the process for the unit is then designed.

10. The inspection method according to claim 9, wherein, The redesign of the process for the unit is carried out within 7 days.

11. The inspection method according to claim 10, wherein, The generation of the virtual image of the unit and the redesign of the process for the unit are carried out within 40 days.

12. The inspection method according to claim 9, wherein, The process for the unit includes one of an etching process and a cleaning process.

13. An inspection device, comprising: A virtual image generator generates a virtual image of a unit based on a design drawing of the unit, wherein the unit is loaded onto a frame; The reference coordinate determination section defines the reference coordinates to be checked in the virtual image of the unit; The unit capture section captures the units set on the frame and defines the interference area that overlaps with the frame; as well as The measurement section measures the image of the unit captured by the unit capture section.

14. The inspection device according to claim 13, wherein, The reference coordinate determination section defines alternative coordinates adjacent to the interference coordinates, which overlap with the interference region defined by the unit capture section in the plan view.

15. The inspection device according to claim 14, wherein, The distance between the interference coordinates and the replacement coordinates is within 2 mm.

16. The inspection device according to claim 13, wherein, The frame has a grid shape in the plan view.

17. The inspection device according to claim 13, in, The framework includes a first frame and a second frame. Wherein, the first frame defines a first interference region, and the second frame defines a second interference region, and The interference region is the area where the first interference region and the second interference region overlap.

18. The inspection device according to claim 13, wherein, The reference coordinates correspond to one of the metal wires and holes included in the unit.

19. The inspection device according to claim 13, wherein, The measuring section measures one of the following: The linewidth of the metal line defined by the reference coordinates; and The position of the hole is defined by the reference coordinates.

20. An electronic device comprising: Display device; as well as The processor drives the display device. The display device is manufactured by the inspection method according to any one of claims 1 to 12.

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