Track automatic adjusting device and alignment control method for BGA post-ball filling

Abstract

The application discloses a track automatic adjusting device and alignment control method for ball supplementing after BGA ball planting, belongs to the technical field of semiconductor packaging and testing, and comprises a base, a guide rail, a ball supplementing head, a visual camera, a rack assembly, a bearing assembly, a locking assembly and an alignment assembly. The rack assembly comprises a seat body slidingly arranged on the guide rail. Through the action that the movable bearing side is close to the fixed bearing side, the influence of the pipeline stoppage error on the subsequent ball supplementing position is reduced. The pressing needle can be respectively attached to different height positions of the edge of the BGA substrate. The inflation member locks the pressing needle, so that the BGA substrate is fixed in the state of keeping the original warping mode, the rigid clamping is avoided to force the BGA substrate to be flattened, the change of the pad position is avoided, and thus the deviation between the ball supplementing head and the ball-lacking pad is reduced.

Description

Technical Field

[0001] This invention belongs to the field of semiconductor packaging and testing technology, specifically an automatic track adjustment device and alignment control method for ball replenishment after BGA ball placement. Background Technology

[0002] BGA (Ball Grid Array) is an integrated circuit packaging technology that makes the bottom surface of the package housing into an array of ball-shaped pins. In the ball-planting process of BGA manufacturing, there may be cases where individual pads are not successfully implanted with solder balls. Specialized ball-replacement equipment must be used to repair them. At this time, an automatic track adjustment device for ball replacement after BGA ball planting is required.

[0003] After the initial high-temperature ball-mounting process, the different thermal expansion rates of the various materials within the substrate can cause physical warping, resulting in a permanent, undulating bend at the substrate edges. When this warped substrate enters the ball-mounting equipment, the track system must clamp and secure it before subsequent operations can proceed. The clamping components on both sides of the track forcibly clamp the bent substrate, and the mechanical thrust forces it flattening. This forced intervention generates concentrated stress within the substrate, causing tensile or torsional deformation on the horizontal plane. This microscopic deformation alters the actual position of the missing ball pads on the substrate. To address these issues, existing track adjustment devices generally employ rigid... The clamping structure directly uses a transmission mechanism to push the track to a fixed width and clamp the substrate. However, this structure cannot absorb or release the internal stress of the substrate. Instead, it will aggravate the horizontal deformation of the substrate. Existing alignment methods rely on a vision camera to record the missing ball position before clamping or to take a static photo for positioning after clamping. The stress change caused by rigid clamping will cause the substrate coordinates to continuously shift dynamically. Existing static vision alignment technology cannot calculate and compensate for this coordinate deformation error caused by mechanical clamping. This will cause a physical deviation between the falling position of the ball replacement component and the actual missing ball position, resulting in ball replacement offset, solder bridging on the pads and substrate damage, affecting the chip repair yield. Summary of the Invention

[0004] To address the problem in the prior art that the automatic track adjustment device is difficult to maintain the correspondence between the detection coordinates and the actual missing ball pads while being compatible with BGA substrates of different widths, the present invention aims to provide an automatic track adjustment device and alignment control method for BGA ball replacement after ball placement.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: An automatic track adjustment device for ball replacement after BGA ball implantation includes a base, a guide rail, a ball replacement head, a vision camera, a frame assembly, a load-bearing assembly, a locking assembly, and an alignment assembly. The frame assembly includes a seat that is slidably disposed on the guide rail. The supporting component includes a first block disposed on the base, and a second block disposed on the base; The locking assembly includes an inflatable component and a second plate disposed within the second block, with a pressure needle passing through the second plate. The alignment component includes a swing element that is mounted on the base; When the base moves, the second block approaches the first block, the swing member rotates and pushes the BGA substrate, the second plate moves, the pressure pin fits the BGA substrate, and the inflator expands and presses the pressure pin.

[0006] Preferably, the guide rail is disposed on the base, there are two guide rails, the two guide rails are spaced apart, the base body is slidably connected to the two guide rails, and the base body is provided with a first driving member, the output end of the first driving member is connected to the second block body.

[0007] Preferably, the first block is connected to the base, the second block is disposed opposite to the first block, and the second block has a groove on the side facing the first block.

[0008] Preferably, the support component further includes a first plate, which consists of two plates. One first plate is located on the side of the first block facing the second block, and the other first plate is located at the bottom of the groove of the second block. The two first plates respectively support the two side edges of the BGA substrate.

[0009] Preferably, the second block has a first cavity and a second cavity, the first cavity being used to accommodate the second plate and the end of the pressure needle, and the second cavity being used to accommodate the inflatable component.

[0010] Preferably, the second block has a groove on the side facing the first block, and the locking assembly also has a first hole. The first hole is formed on the second block and extends from the first cavity to the groove of the second block. The pressure pin slides through the first hole, and the second cavity communicates with the first hole.

[0011] Preferably, the locking assembly further includes a second driving member, which is disposed in the second block body. The output end of the second driving member is connected to the second plate body. A second hole is provided on the second plate body, and the pressure pin passes through the second hole.

[0012] Preferably, the second block is provided with an elastic plate covering the first cavity inside the second block. A first elastic element is provided between the elastic plate and the pressure pin. The pressure pin has a disc-shaped pressure cap. One end of the first elastic element abuts against the elastic plate, and the other end of the first elastic element abuts against the disc-shaped pressure cap. The first elastic element pushes the pressure pin to conform to the BGA substrate.

[0013] Preferably, the alignment component further includes a third block, which is disposed on the base. The base has a shaft, the swing member is rotatably mounted on the shaft, the swing member has a rolling element, the rolling element cooperates with the third block, the swing member has a third plate, and the swing member is connected to a second elastic element.

[0014] A method for aligning and controlling an automatic track adjustment device for BGA ball replacement after ball planting includes the following steps: Step 1: The second plate lifts the pressure pin, causing the pressure pin to leave the entry area of ​​the BGA substrate; Step 2: Place the BGA substrate between the first block and the second block, so that the BGA substrate is supported by the carrier component; Step 3: Move the seat along the guide rail, and the seat will cause the second block to move closer to the first block; Step 4: The base body drives the alignment component to move, and the swinging component rotates and pushes the BGA substrate to move, so that the BGA substrate is close to the preset alignment position. Step 5: Release the second board from supporting the pressure pin, and the pressure pin is attached to the non-pad area of ​​the BGA substrate edge; Step 6: Inflate the inflatable component, press the inflatable component against the pressure needle, and keep the pressure needle at the corresponding height; Step 7: The position of the pads on the BGA substrate is acquired by the vision camera, and the ball-filling head fills the balls according to the position acquired by the vision camera; Step 8: After the ball is replenished, the air in the inflation component is deflated, the second plate lifts the pressure pin, the seat moves the second block away from the first block, and the BGA substrate leaves the carrier assembly.

[0015] The beneficial effects of this invention are as follows: I. In this invention, the BGA substrate is supported by the movement of the active bearing side approaching the fixed bearing side, and the alignment action is driven during the track closing process, so that the BGA substrate is close to the preset ball filling position, reducing the impact of pipeline docking error on the subsequent ball filling position. After the BGA substrate is supported and aligned, the pressure pin can be attached to different height positions of the edge of the BGA substrate respectively. The inflator then locks the pressure pin, so that the BGA substrate is fixed while maintaining its original warped shape, avoiding the rigid clamping that forcibly flattens the BGA substrate and causes the pad position to change, thereby reducing the deviation between the ball filling head and the missing ball pad, and improving the stability and repair yield of the ball filling operation after ball planting. Second, in this invention, the alignment process is driven by the same closing action, eliminating the need for a separate adjustment mechanism for the docking error of the BGA substrate. This reduces the number of driving sources and the difficulty of control coordination. The BGA substrate is fixed by locking after bonding, so that the position of the pads captured by the vision camera corresponds to the state of the substrate after clamping. This reduces the burden of subsequent algorithm compensation and reduces substrate damage, ball misalignment and solder bridging caused by clamping stress transmission. Attached Figure Description

[0016] Figure 1 This is a three-dimensional schematic diagram of the overall structure of the present invention; Figure 2 This is a three-dimensional schematic diagram of the seat structure of the present invention; Figure 3 This is the invention Figure 2 Enlarged view of point A in the middle; Figure 4 This is a three-dimensional schematic diagram of the internal structure of the second block of the present invention; Figure 5 This is the invention Figure 4 Enlarged view at point B in the middle; Figure 6 This is a three-dimensional schematic diagram of the third block structure of the present invention; Figure 7 This is a three-dimensional schematic diagram of the swing component structure of the present invention; Figure 8 This is a schematic diagram of the usage state of the present invention.

[0017] In the diagram: 1. Base; 2. Guide rail; 3. Ball head; 4. Vision camera; 5. Frame assembly; 51. Seat body; 52. First drive component; 6. Bearing assembly; 61. First block; 62. Second block; 621. Groove; 622. First cavity; 623. Second cavity; 63. First plate; 7. Locking assembly; 71. First hole; 72. Inflatable component; 73. Second drive component; 74. Second plate; 741. Second hole; 75. Elastic plate; 76. Pressure pin; 77. First elastic component; 8. Alignment assembly; 81. Third block; 82. Shaft; 83. Swinging component; 831. Rolling component; 832. Third plate; 84. Second elastic component. Detailed Implementation

[0018] The present invention will now be further described in conjunction with the accompanying drawings and specific embodiments.

[0019] Please see Figure 1 An automatic track adjustment device and alignment control method for BGA ball replacement after ball planting includes a base 1, a guide rail 2, a ball replacement head 3, a vision camera 4, a frame assembly 5, a load-bearing assembly 6, a locking assembly 7, and an alignment assembly 8.

[0020] It should be noted that, as Figure 8 As shown in the figure, K is the BGA substrate, which is the workpiece to be processed. The BGA substrate is not a component of this device. This device is used to support, align, clamp, and fill balls on the BGA substrate.

[0021] like Figure 1 and Figure 2 As shown, the base 1 is preferably made of aluminum alloy and is a horizontally arranged rectangular plate. The base 1 serves as the mounting base for the device. The guide rail 2 is preferably made of stainless steel, and there are two guide rails 2 spaced apart. The guide rail 2 guides the frame assembly 5 to move along the rail. The ball filling head 3 is located on one side of the support assembly 6, with the discharge end of the ball filling head 3 facing the support assembly 6. The ball filling head 3 is used to fill solder balls into the missing solder pads on the BGA substrate. The vision camera 4 is located on one side of the base 1, with the lens of the vision camera 4 facing the support assembly 6. The vision camera 4 is used to collect the position of the solder pads on the BGA substrate. Both the ball filling head 3 and the vision camera 4 correspond to the area between the first block 61 and the second block 62, so that the ball filling head 3 can perform ball filling operations on the BGA substrate according to the position collected by the vision camera 4.

[0022] like Figure 1 and Figure 2As shown, the rack assembly 5 includes a base 51 and a first drive member 52. The base 51 is preferably made of aluminum alloy and is a rectangular slide. The base 51 is slidably connected to the guide rail 2. The side of the base 51 near the base 1 cooperates with the guide rail 2. The guide rail 2 restricts the offset of the base 51 so that the base 51 moves only along the guide rail 2. The first drive member 52 is fixedly connected to the base 1, and the output end of the first drive member 52 is connected to the second block 62.

[0023] When using, combine Figure 1 and Figure 2 When the first drive member 52 is working, the power is directly applied to the second block 62. Through the second block 62, the seat 51 moves along the guide rail 2 after being pushed by the first drive member 52. When the first drive member 52 works in the opposite direction, the seat 51 moves in the opposite direction along the guide rail 2. This transmission relationship is used to drive the movable bearing structure in the bearing assembly 6 to approach the BGA substrate and complete the track width adjustment.

[0024] like Figures 2 to 5As shown, the support component 6 includes a first block 61, which is preferably made of stainless steel. The middle part of the first block 61 is fixedly connected to the base 1 via a mounting seat. The first block 61 is located on one side above the base 51 and does not move with the base 51, forming a fixed support base on one side of the BGA substrate. The second block 62 is preferably made of stainless steel and is arranged opposite to the first block 61. The second block 62 can move with the base 51. When the base 51 approaches the first block 61, the second block 62 simultaneously approaches the first block. 61. The distance between the first block 61 and the second block 62 decreases. When the base 51 moves away from the first block 61, the second block 62 moves away from the first block 61 simultaneously. The distance between the first block 61 and the second block 62 increases. The distance between the first block 61 and the second block 62 is used to accommodate the width of the BGA substrate. A groove 621 is formed on the second block 62. The groove 621 is a side-opening groove. The opening of the groove 621 faces the first block 61. The groove 621 is used to accommodate the side edge of the BGA substrate near the second block 62. After the board enters between the first block 61 and the second block 62, one edge of the BGA substrate is located at the first block 61, and the other edge of the BGA substrate enters the groove 621. The second block 62 has a first cavity 622, which is a long, narrow cavity recessed at the top of the second block 62. The first cavity 622 is used to accommodate the second driving member 73, the second plate 74, the elastic plate 75, the end of the pressure pin 76, and the first elastic member 77. The second block 62 has a second cavity 623, which is also a long, narrow cavity. The second cavity 623 is used to accommodate the inflation component 72. The first plate 63 is preferably made of stainless steel. There are two first plates 63. The two first plates 63 are respectively disposed at the bottom of the first block 61 and the second block 62. One first plate 63 is disposed on the side of the first block 61 facing the second block 62, and the other first plate 63 is disposed at the bottom of the opening of the groove 621. The supporting width of the first plate 63 is less than the width of the non-pad area of ​​the BGA substrate edge, so that the first plate 63 does not block the pad area of ​​the BGA substrate when supporting the BGA substrate.

[0025] When using, combine Figures 2 to 5 The first block 61 forms a fixed bearing reference, and the second block 62 moves with the base 51. After the BGA substrate enters between the first block 61 and the second block 62, the two sides of the BGA substrate are placed on the two first plates 63 respectively. When the first driving member 52 drives the base 51 to move, the second block 62 moves closer to the first block 61, and the two first plates 63 jointly support the two side edges of the BGA substrate.

[0026] like Figures 2 to 5As shown, the locking assembly 7 includes a first hole 71, which is a circular straight hole. The first hole 71 is formed on the second block 62 and extends from the bottom wall of the first cavity 622 to the groove 621. There are multiple first holes 71, which are spaced apart. The first holes 71 are used to guide the movement of the pressure needle 76. The second cavity 623 communicates with the multiple first holes 71. The second cavity 623 forms a lateral opening at the hole wall of each first hole 71. This lateral opening is used to allow the inflatable component 72 to contact the pressure needle 76. The inflatable component 72 is preferably made of silicone and is a flexible hollow tube. The inflatable component 72 is disposed in the second cavity 623, and one side of the inflatable component 72 is subjected to... The cavity wall of the second cavity 623 restricts the pressure needle 76 through the lateral opening of the first hole 71 on the other side of the inflator 72. The inflator 72 is connected to the air source. When the inflator 72 is not inflated, the pressure needle 76 can move within the first hole 71. After the inflator 72 is inflated, it squeezes the pressure needle 76 through the lateral opening of the first hole 71. After being subjected to lateral pressure, the pressure needle 76 abuts against the hole wall of the first hole 71, thereby locking the pressure needle 76 at the corresponding height. The second drive 73 is fixedly connected to the middle of the bottom of the first cavity 622. The output end of the second drive 73 is connected to the second plate 74. The second drive 73 is preferably a miniature cylinder. The second drive 73 is used to drive the second plate 74 to move.

[0027] like Figures 2 to 5 As shown, the second plate 74 is preferably made of aluminum alloy. The second plate 74 is a horizontally arranged rectangular plate. The second plate 74 is disposed inside the first cavity 622. There is a movement gap between the outer periphery of the second plate 74 and the cavity wall of the first cavity 622. This movement gap prevents the second plate 74 from scraping the cavity wall of the first cavity 622 when it moves. The second plate 74 has a second hole 741. The second hole 741 is a circular through hole. There are multiple second holes 741, and each of the multiple second holes 741 corresponds to a multiple first holes 71. The second holes 741 are used for the pressure needle 76 to pass through. The diameter of the second hole 741 is larger than the outer diameter of the rod of the pressure needle 76. When the second plate 74 moves away from the base 1, the second plate 74 can support the pressure needle 76 and move synchronously.

[0028] like Figures 2 to 5As shown, the elastic plate 75 is preferably made of spring steel plate. The elastic plate 75 is a horizontally positioned cover plate, fixedly connected to the top of the second block 62. The elastic plate 75 covers the opening of the first cavity 622. The side of the elastic plate 75 near the base 1 is used to abut against the first elastic element 77, providing a pressure-bearing foundation for the first elastic element 77. The pressure needle 76 is preferably made of stainless steel and includes a disc-shaped pressure cap, a cylindrical rod, and a hemispherical contact head. The disc-shaped pressure cap is located on the side of the second block 74 away from the base 1, and the disc-shaped pressure cap is located on the side of the elastic plate 75 near the base 1. The outer diameter is larger than the aperture of the second hole 741. When the second plate 74 moves away from the base 1, the second plate 74 can support the side of the disc-shaped pressure cap near the base 1. The cylindrical rod extends from the disc-shaped pressure cap towards the base 1. The cylindrical rod passes through the second hole 741 and the first hole 71. The hemispherical contact head is connected to the end of the cylindrical rod near the base 1. The hemispherical contact head extends into the groove 621. There is a sliding gap between the cylindrical rod and the hole wall of the first hole 71. There is a sliding gap between the cylindrical rod and the hole wall of the second hole 741. The pressure needle 76 can move along the first hole 71 and the second hole 741.

[0029] like Figures 2 to 5 As shown, the first elastic element 77 is preferably a compression spring. The first elastic element 77 is disposed between the elastic plate 75 and the disc-shaped pressure cap of the pressure needle 76. One end of the first elastic element 77 abuts against the elastic plate 75, and the other end of the first elastic element 77 abuts against the disc-shaped pressure cap of the pressure needle 76. The first elastic element 77 applies elastic pressure toward the base 1 to the disc-shaped pressure cap. The disc-shaped pressure cap drives the cylindrical rod and the hemispherical contact head to move toward the base 1. The hemispherical contact head can thus press against the edge surface of the BGA substrate.

[0030] When using, such as Figures 2 to 5The output end of the second driving member 73 extends away from the base 1. The second driving member 73 pushes the second plate 74 to move away from the base 1. The second plate 74 contacts the disc-shaped pressure cap of the pressure needle 76. As the second plate 74 continues to move, it lifts the pressure needle 76. The hemispherical contact head of the pressure needle 76 moves away from the BGA substrate entry area. A space for the edge of the BGA substrate to enter is formed in the groove 621. The output end of the second driving member 73 retracts towards the base 1. The second plate 74 moves towards the base 1 with the second driving member 73. The second plate 74 releases the lifting of the disc-shaped pressure cap. The first elastic member 77 pushes the disc-shaped pressure cap towards the base 1. The disc-shaped pressure cap drives the cylindrical rod and the hemispherical contact head to move. In the non-pad area of ​​the BGA substrate edge, multiple pressure pins 76 correspond to different positions on the BGA substrate edge. When the BGA substrate edge is warped, the pressure pins 76 at different positions remain at different heights. The multiple pressure pins 76 together form a pressing state that adapts to the shape of the BGA substrate edge. After the pressure pins 76 are attached to the BGA substrate, the inflation member 72 inflates. The second cavity 623 restricts the inflation member 72 from expanding in the direction away from the first hole 71. The inflation member 72 presses against the cylindrical rod of the pressure pin 76 through the lateral opening of the first hole 71. After being subjected to lateral pressure, the cylindrical rod abuts against the hole wall of the first hole 71. The inflation member 72, the cylindrical rod and the hole wall of the first hole 71 form a frictional locking relationship, and the pressure pin 76 is held at the corresponding height. The multiple pressure pins 76 together maintain the warped shape of the BGA substrate edge.

[0031] like Figure 1 , Figure 6 and Figure 7 As shown, the alignment component 8 includes a third block 81, which is preferably made of stainless steel. The third block 81 is fixedly connected to the base 51 and moves with the base 51. The third block 81 has an inclined pushing surface and a pressure holding surface. The inclined pushing surface is arc-shaped and is used to push the swing member 83 to rotate. The pressure holding surface is straight and is used to keep the swing member 83 in its rotated position. The shaft 82 is preferably made of stainless steel and is a cylindrical shaft. The shaft 82 is fixedly connected to the top of the base 1 to support the swing. The oscillating component 83 rotates. The oscillating component 83 is preferably made of aluminum alloy. The oscillating component 83 is a bent rod and includes three sections: a force-bearing section, a rotating section, and an oscillating section. The direction of the force-bearing section is parallel to the guide rail 2. The rotating section is sleeved on the surface of the shaft 82. The direction of the oscillating section is perpendicular to the force-bearing section. Thus, when the force-bearing section is pushed, the oscillating section is driven to move around the rotating section as the rotation center. A rolling element 831 is provided on the side of the force-bearing section away from the rotating section, and a third plate 832 is provided on the end of the oscillating section away from the rotating section.

[0032] like Figure 6 and Figure 7As shown, the rolling element 831 is preferably made of stainless steel and is a cylindrical roller. The outer circumferential surface of the rolling element 831 contacts the third block 81. When the third block 81 moves, the inclined pushing surface of the third block 81 pushes the rolling element 831 first. The rolling element 831 drives the swinging element 83 to rotate around the shaft 82. After the third block 81 continues to move, the rolling element 831 contacts the pressure-holding surface of the third block 81. The pressure-holding surface keeps the position of the rolling element 831 stable, and the swinging element 83 thus remains in the corresponding rotation position. The third plate 832 is preferably made of stainless steel and is a vertically arranged rectangular plate. The third plate 832 is located on the side of the BGA substrate conveying area. When the swinging element 83 rotates, the third plate 832 enters the BGA substrate conveying area. The third plate 832 is used to push the BGA substrate to move. The edge of the third plate 832 near the base 1 is higher than the bearing surface of the first plate 63, so that it does not scrape the first plate 63 when moving.

[0033] like Figure 6 and Figure 7 As shown, the second elastic element 84 is preferably formed by winding spring steel wire. The second elastic element 84 is a tension spring. One end of the second elastic element 84 is connected to the swing element 83, and the other end of the second elastic element 84 is connected to a fixed seat. The fixed seat is installed on one side of the top of the base 1. The second elastic element 84 applies a pulling force to the swing element 83. This pulling force keeps the rolling element 831 close to the third block 81. After the third block 81 releases its push on the rolling element 831, the second elastic element 84 pulls the swing element 83 back to its original position. When the swing element 83 returns to its original position, the third plate 832 exits the BGA substrate delivery area.

[0034] When using, combine Figure 1 , Figure 6 and Figure 7 The first driving member 52 drives the base 51 to move, and the base 51 drives the third block 81 to move synchronously. The inclined pushing surface of the third block 81 contacts the rolling member 831. When the base 51 continues to move, the inclined pushing surface pushes the rolling member 831. After being pushed by the inclined pushing surface, the rolling member 831 drives the swing member 83 to rotate around the shaft 82. The swing member 83 drives the third plate 832 into the BGA substrate conveying area. The third plate 832 contacts the edge of the BGA substrate and pushes the BGA substrate to move. As the plate approaches the preset alignment position, the seat 51 continues to move, and the rolling element 831 transitions from the inclined pushing surface of the third block 81 to the pressure holding surface of the third block 81. After the rolling element 831 contacts the pressure holding surface, the swing element 83 no longer increases the rotation angle, and the third plate 832 remains in the corresponding position. The third plate 832 maintains the position of the BGA substrate and does not continue to push the BGA substrate. This cooperation enables the third plate 832 to complete the alignment action and avoids continuous pressure on the BGA substrate.

[0035] The following is the working principle of this embodiment: Preparation stage, combined with Figures 1 to 5 The first driving member 52 positions the second block 62 away from the first block 61. The second block 62 is supported on the guide rail 2 by the base 51. The guide rail 2 guides the base 51, allowing the second block 62 to move stably along the guide rail 2. At this time, a gap is formed between the first block 61 and the second block 62 for the BGA substrate to enter. The output end of the second driving member 73 extends away from the base 1. The second driving member 73 pushes the second plate 74 to move away from the base 1. After the second plate 74 moves, it contacts the disc-shaped pressure cap of the pressure pin 76. When the second plate 74 continues to move, the second plate 74 lifts the disc-shaped pressure cap. The disc-shaped pressure cap drives the cylindrical rod and the hemispherical contact head to move synchronously. The hemispherical contact head moves away from the BGA substrate entry area. A space is formed in the groove 621 for the edge of the BGA substrate to enter. This state is used to avoid the BGA substrate from scraping against the pressure pin 76 when it enters the groove 621.

[0036] During the board bearing stage, combined with Figures 2 to 5 and Figure 8 The BGA substrate enters the bearing area between the first block 61 and the second block 62. One edge of the BGA substrate is placed on the first plate 63 located at the first block 61, and the other edge of the BGA substrate enters the groove 621 and is placed on the first plate 63 located at the bottom of the opening of the groove 621. The two first plates 63 jointly support the two edges of the BGA substrate. The pad area of ​​the BGA substrate is located between the first block 61 and the second block 62. The support width of the first plate 63 is smaller than the width of the non-pad area of ​​the BGA substrate edge. Therefore, the first plate 63 only supports the edge area of ​​the BGA substrate and does not block the pad area on the BGA substrate. The ball filling head 3 and the vision camera 4 correspond to the area between the first block 61 and the second block 62, providing working space for subsequent identification and ball filling.

[0037] During the orbital closure phase, combined Figures 1 to 5 After the BGA substrate is placed, the first driving unit 52 operates. The output end of the first driving unit 52 directly acts on the second block 62. After the second block 62 is pushed by the first driving unit 52, it drives the seat 51 to move along the guide rail 2. The guide rail 2 restricts the offset of the seat 51, so that the second block 62 can stably approach the first block 61. When the second block 62 approaches the first block 61, the slot 621 simultaneously approaches the corresponding edge of the BGA substrate. After the second block 62 moves to the set position, one edge of the BGA substrate is supported by the first plate 63 at the first block 61, and the other edge of the BGA substrate is supported by the first plate 63 at the bottom of the opening of the slot 621. The first block 61 and the second block 62 together form a bearing state that adapts to the width of the BGA substrate.

[0038] During the coordinated positioning phase, combined with Figure 1 , Figure 6 and Figure 7 When the second block 62 moves under the action of the first driving member 52, the seat 51 moves synchronously along the guide rail 2 with the second block 62. The third block 81 is fixedly connected to the seat 51, so the third block 81 moves synchronously with the seat 51. During the movement of the third block 81, the inclined pushing surface of the third block 81 gradually contacts the rolling member 831. The rolling member 831 is located in the force-bearing section of the swing member 83. After the rolling member 831 is pushed by the inclined pushing surface, the force-bearing section drives the rotating section to rotate around the shaft 82. When the rotating section rotates, it drives the swing section to move. The swing section drives the third plate 832 into the BGA substrate conveying area. The third plate 832 contacts the edge of the BGA substrate and pushes the BGA substrate to move. The BGA substrate approaches the preset alignment position under the push of the third plate 832.

[0039] During the pressure holding and positioning stage, combined with Figure 6 and Figure 7 As the base 51 continues to move, the third block 81 continues to move with the base 51. The rolling element 831 transitions from the inclined pushing surface of the third block 81 to the pressure holding surface of the third block 81. The pressure holding surface is straight. After the rolling element 831 contacts the pressure holding surface, the swinging element 83 no longer increases the rotation angle. The third plate 832 remains in the corresponding position and maintains the position of the BGA substrate. Since the third plate 832 no longer increases the pushing amount on the BGA substrate, the BGA substrate will not be continuously pushed by the third plate 832 after the alignment is completed. The second elastic element 84 applies a pulling force to the swinging element 83, so that the rolling element 831 remains close to the third block 81. This cooperation enables the third plate 832 to complete the alignment during the movement of the third block 81 and maintain the position of the BGA substrate after the alignment is completed.

[0040] During the conformal pressing stage, combined with Figures 2 to 5 After the BGA substrate completes its bearing and alignment, the output end of the second drive member 73 retracts towards the base 1. The second plate 74 moves towards the base 1 along with the second drive member 73. The second plate 74 releases its support for the disc-shaped pressure cap of the pressure pin 76. One end of the first elastic member 77 abuts against the elastic plate 75, and the other end of the first elastic member 77 abuts against the disc-shaped pressure cap. The first elastic member 77 applies elastic pressure towards the base 1 to the disc-shaped pressure cap. The disc-shaped pressure cap drives the cylindrical rod to move along the second hole 741 and the first hole 71. The cylindrical rod drives the hemispherical contact head to move towards the edge surface of the BGA substrate. The hemispherical contact head contacts the non-pad area of ​​the edge of the BGA substrate.

[0041] During the contouring and bonding stage, combined with Figures 2 to 5 and Figure 8Multiple pressure pins 76 correspond to different positions on the edge of the BGA substrate. When the BGA substrate is warped after the ball-mounting process, the distance between different positions on the edge of the BGA substrate and the pressing edge of the groove 621 is inconsistent. Each pressure pin 76 moves independently under the action of the first elastic member 77. After the hemispherical contact head contacts the edge of the BGA substrate at the corresponding position, the pressure pin 76 stops moving towards the base 1. Since each pressure pin 76 can move within the corresponding first hole 71 and second hole 741, multiple pressure pins 76 can stop at different heights. Multiple pressure pins 76 together form a pressing state that matches the warped shape of the BGA substrate edge. The pressure applied by the pressure pins 76 to the BGA substrate comes from the first elastic member 77. The elastic force of the first elastic member 77 is less than the pressure required to force the BGA substrate to flatten. Therefore, when the pressure pins 76 are attached to the BGA substrate, they follow the height change of the BGA substrate edge and do not force the BGA substrate to flatten.

[0042] Lateral locking phase, combined Figures 2 to 5 After the pressure pin 76 completes the conformal fitting, the inflation component 72 is introduced with gas and expands. The second cavity 623 accommodates the inflation component 72. One side wall of the second cavity 623 restricts the inflation component 72 from expanding in the direction away from the first hole 71. The inflation component 72 expands toward the pressure pin 76 through the lateral opening at the hole wall of the first hole 71. The inflation component 72 squeezes the cylindrical rod of the pressure pin 76. After being subjected to the lateral pressure of the inflation component 72, the cylindrical rod abuts against the hole wall of the first hole 71. A frictional locking relationship is formed between the inflation component 72, the cylindrical rod, and the hole wall of the first hole 71. Each pressure pin 76 is held at the corresponding height. Multiple pressure pins 76 together maintain the warped shape of the BGA substrate edge. The BGA substrate is fixed in the crimping state and is not forced flattened due to clamping.

[0043] During the positioning phase of the rebound, combined with Figure 1 and Figure 8 After the BGA substrate is pressed and locked by multiple pins 76, the vision camera 4 captures the position of the pads on the BGA substrate. Since the edge of the BGA substrate is held in a conformal state by the pins 76, the warped shape of the BGA substrate remains stable after clamping. The position of the pads captured by the vision camera 4 corresponds to the state of the BGA substrate after clamping. The ball filling head 3 fills the corresponding area of ​​the missing ball pad according to the position captured by the vision camera 4. The ball filling head 3 fills the missing ball pad with solder balls. This process is used to reduce the change of pad position caused by rigidly flattening the substrate.

[0044] During the unlocking phase, combined with Figures 2 to 5After the ball is replenished, the inflation component 72 deflates, releasing the lateral pressure on the cylindrical rod of the pressure needle 76. The frictional locking relationship between the pressure needle 76 and the hole wall of the first hole 71 is released. The second driving component 73 extends away from the base 1 again. The second driving component 73 pushes the second plate 74 to move away from the base 1. The second plate 74 contacts and lifts the disc-shaped pressure cap of the pressure needle 76. The disc-shaped pressure cap drives the cylindrical rod and the hemispherical contact head to move away from the base 1. The hemispherical contact head leaves the edge of the BGA substrate, and the groove 621 reforms to provide space for the BGA substrate to leave.

[0045] During the reset and ejection stage, combined with Figure 1 , Figure 6 and Figure 7 The first driving member 52 works in reverse, driving the second block 62 away from the first block 61. The second block 62 moves in the opposite direction along the guide rail 2 via the seat 51. The seat 51 drives the third block 81 to move away from the rolling member 831 simultaneously. The third block 81 releases its push on the rolling member 831. The second elastic member 84 pulls the swing member 83 to reset around the axis 82. When the swing member 83 resets, the third plate 832 exits the BGA substrate conveying area. The distance between the first block 61 and the second block 62 increases, and the BGA substrate can leave the carrier assembly 6 along the original conveying direction.

[0046] The above description is merely an embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structural or procedural transformations made based on the content of the present invention's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of the present invention.

Claims

1. An automatic track adjustment device for ball replacement after BGA ball implantation, comprising a base (1), a guide rail (2), a ball replacement head (3), a vision camera (4), a frame assembly (5), a load-bearing assembly (6), a locking assembly (7), and an alignment assembly (8), characterized in that: The rack assembly (5) includes a seat (51) that is slidably disposed on the guide rail (2); The supporting component (6) includes a first block (61) disposed on the base (1), and a second block (62) disposed on the base (51). The locking assembly (7) includes an inflatable element (72) and a second plate (74) disposed in the second block (62), and a pressure needle (76) is provided inside the second plate (74). The alignment component (8) includes a swing element (83) that is mounted on the base (1). When the base (51) moves, the second block (62) approaches the first block (61), the swing member (83) rotates and pushes the BGA substrate, the second plate (74) moves, the pressure pin (76) adheres to the BGA substrate, and the inflation member (72) expands and presses the pressure pin (76).

2. The automatic track adjustment device for BGA ball replacement after ball planting according to claim 1, characterized in that: The guide rail (2) is provided on the base (1). There are two guide rails (2), which are spaced apart. The base (51) is slidably connected to the two guide rails (2). The base (1) is provided with a first driving member (52), and the output end of the first driving member (52) is connected to the second block (62).

3. The automatic track adjustment device for BGA ball replacement after ball planting according to claim 1, characterized in that: The first block (61) is connected to the base (1), and the second block (62) is disposed opposite to the first block (61). The second block (62) has a groove (621) on the side facing the first block (61).

4. The automatic track adjustment device for BGA ball replacement after implantation according to claim 3, characterized in that: The support component (6) also has a first plate (63), which consists of two plates. One first plate (63) is located on the side of the first block (61) facing the second block (62), and the other first plate (63) is located at the bottom of the groove (621) of the second block (62). The two first plates (63) respectively support the two sides of the BGA substrate.

5. The automatic track adjustment device for BGA ball replacement after ball planting according to claim 1, characterized in that: The second block (62) has a first cavity (622) and a second cavity (623). The first cavity (622) is used to accommodate the end of the second plate (74) and the pressure needle (76), and the second cavity (623) is used to accommodate the inflatable component (72).

6. The automatic track adjustment device for BGA ball replacement after ball planting according to claim 5, characterized in that: The second block (62) has a groove (621) on the side facing the first block (61). The locking component (7) also has a first hole (71), which is opened on the second block (62). The first hole (71) extends from the first cavity (622) to the groove (621) of the second block (62). The pressure pin (76) slides through the first hole (71). The second cavity (623) communicates with the first hole (71).

7. The automatic track adjustment device for BGA ball replacement after ball planting according to claim 1, characterized in that: The locking component (7) also has a second driving member (73), which is located inside the second block (62). The output end of the second driving member (73) is connected to the second plate (74). The second plate (74) has a second hole (741) and the pressure pin (76) passes through the second hole (741).

8. The automatic track adjustment device for BGA ball replacement after ball planting according to claim 5, characterized in that: The second block (62) is provided with an elastic plate (75), which covers the first cavity (622) inside the second block (62). A first elastic element (77) is provided between the elastic plate (75) and the pressure pin (76). The pressure pin (76) has a disc-shaped pressure cap. One end of the first elastic element (77) abuts against the elastic plate (75), and the other end of the first elastic element (77) abuts against the disc-shaped pressure cap. The first elastic element (77) pushes the pressure pin (76) to fit against the BGA substrate.

9. The automatic track adjustment device for BGA ball replacement after ball planting according to claim 1, characterized in that: The alignment component (8) also has a third block (81), which is disposed on the base (51). The base (1) is provided with a shaft (82), and the swing member (83) is rotatably disposed on the shaft (82). The swing member (83) is provided with a rolling member (831), which cooperates with the third block (81). The swing member (83) is provided with a third plate (832), and the swing member (83) is connected to a second elastic member (84).

10. A positioning control method for an automatic track adjustment device for BGA ball replacement after ball implantation, applied to the automatic track adjustment device for BGA ball replacement after ball implantation as described in any one of claims 1 to 9, characterized in that, Includes the following steps: S1: The second plate (74) lifts the pressure pin (76) so that the pressure pin (76) leaves the entry area of ​​the BGA substrate; S2: Place the BGA substrate between the first block (61) and the second block (62) so that the BGA substrate is supported by the carrier component (6); S3: Move the seat (51) along the guide rail (2), and the seat (51) drives the second block (62) to approach the first block (61). S4: The base (51) drives the alignment component (8) to move, and the swing component (83) rotates and pushes the BGA substrate to move, so that the BGA substrate is close to the preset alignment position. S5: Release the second plate (74) from supporting the pressure pin (76), the pressure pin (76) is in contact with the non-pad area of ​​the edge of the BGA substrate; S6: Inflate the inflatable component (72), press the inflatable component (72) against the pressure needle (76), and keep the pressure needle (76) at the corresponding height; S7: The position of the pads on the BGA substrate is acquired by the vision camera (4), and the ball filling head (3) fills the balls according to the position acquired by the vision camera (4); S8: After the ball is replenished, the air inflator (72) is deflated, the second plate (74) lifts the pressure pin (76), the seat (51) drives the second block (62) away from the first block (61), and the BGA substrate leaves the carrier assembly (6).

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