pH / redox potential adjusted water production device, method for producing pH / redox potential adjusted water, and method for producing semiconductor device

Abstract

The pH / redox potential adjusted water manufacturing device has a degassing membrane device having a degassing membrane that removes a gas dissolved as an impurity from pure water, a pH adjusting device that adjusts the pH of the pure water, and a dissolving membrane device having a gas dissolving membrane that dissolves a non-active gas in the pure water, and manufactures pH / redox potential adjusted water having a pH of 9 to 14 and a redox potential of -0.40 V or more and less than +0.40 V at 25°C (relative to Ag / AgCl).

Description

Technical Field

[0001] This invention relates to an apparatus for manufacturing pH / redox potential-adjustable water, a method for manufacturing pH / redox potential-adjustable water, and a method for manufacturing a semiconductor device.

[0002] This application claims priority based on Japanese Special Appeal No. 2024-022868 filed in Japan on February 19, 2024, the contents of which are incorporated herein by reference. Background Technology

[0003] As one of the post-processing steps in semiconductor manufacturing, following the assembly of semiconductor chips, is the dicing process. The dicing process involves cutting a semiconductor substrate with multiple integrated circuits (ICs) onto individual ICs to produce the IC chips. The dicing process typically involves the following steps to manufacture each IC chip: attaching the semiconductor substrate with the ICs fabricated to dicing tape; cutting the semiconductor substrate according to each IC; then cleaning, removing the dicing tape, and extracting the semiconductor chip.

[0004] Methods for cutting semiconductor substrates include blade cutting and laser ablation cutting. Blade cutting involves rotating an extremely thin blade, called a cutting blade, at high speed to cut the semiconductor substrate. Laser ablation cutting, on the other hand, cuts the semiconductor substrate by irradiating it with a high-energy laser, causing partial evaporation and sublimation. Among these methods, blade cutting is the most common.

[0005] In blade cutting, when cutting integrated circuits arranged on a semiconductor substrate, heat and cutting chips are generated due to friction between the cutting blade and the semiconductor substrate. Therefore, to suppress heat generation and remove cutting chips, blade cutting is usually performed while spraying cooling water. Pure water or carbonated water is used as the cooling water. However, because pure water has a high resistivity, friction between the cutting blade and the semiconductor substrate can sometimes cause the substrate to become charged and the devices to be damaged by electrostatic discharge. Therefore, carbonated water, which reduces the resistivity by dissolving carbon dioxide in pure water, is more commonly used.

[0006] However, some cutting blades used in blade cutting have diamond abrasive grains fixed to the outer peripheral end face of a disc-shaped blade with a thickness of about 15 μm using a bonding material. Metals such as nickel, cobalt, copper, tin, silver, and tungsten can be used as the bonding material for the diamond abrasive grains. Since cutting blades are repeatedly used in the cutting process, the outer peripheral end face of the blade wears down with use, leading to a decrease in cutting performance. Therefore, they need to be replaced and discarded periodically.

[0007] However, the performance degradation of cutting blades is not solely due to physical factors such as wear. The weakly acidic carbonated water used as cooling water during cutting dissolves various metals that serve as the bonding material. Therefore, in addition to wear, there is a concern about the deterioration of cutting performance caused by the consumption of the bonding material. Consequently, using carbonated water as cooling water is one reason for increasing the replacement frequency of cutting blades.

[0008] Existing technical documents

[0009] Patent documents

[0010] Patent document 1: Japanese Patent Application Publication No. 2022-78489. Summary of the Invention

[0011] The problem that the invention aims to solve

[0012] The present invention was made in view of the above circumstances, and its object is to provide an apparatus for manufacturing pH / redox potential adjusting water for manufacturing cooling water as cutting blade, a method for manufacturing pH / redox potential adjusting water, and a method for manufacturing a semiconductor device.

[0013] Methods for solving problems

[0014] To address the aforementioned issues, the present invention employs the following configuration.

[0015] [1] A pH / oxidation-reduction potential adjusting water manufacturing device, wherein... The pH / oxidation-reduction potential adjusting water production device has the following features: A degassing membrane device having a degassing membrane for removing gases dissolved as impurities from pure water; pH adjustment device, which adjusts the pH of pure water; and A dissolving membrane device having a gas dissolving membrane that allows inactive gases to dissolve in pure water. The pH / oxidation-reduction potential adjusting water manufacturing device produces pH-9 to 14 water with an oxidation-reduction potential of -0.40V or higher and less than +0.40V (relative to Ag / AgCl) at 25°C.

[0016] [2] According to the pH / redox potential regulating water manufacturing apparatus described in [1], the aforementioned pH regulating device, the aforementioned degassing membrane device, and the aforementioned dissolving membrane device are arranged sequentially along the water flow direction of pure water. The aforementioned pH adjustment device is a device for adding a liquid pH adjuster to the aforementioned pure water.

[0017] [3] The pH / redox potential regulating water manufacturing apparatus according to [2], wherein the aforementioned pH regulator is at least one aqueous solution selected from the group consisting of ammonia, sodium hydroxide, potassium hydroxide, ammonium tetrahydrogen, choline, methylamine, dimethylamine and trimethylamine.

[0018] [4] According to the pH / redox potential regulating water manufacturing device described in [1], the aforementioned degassing membrane device and the aforementioned dissolving membrane device are arranged sequentially along the water flow direction of pure water. The aforementioned pH adjustment device is a device for supplying a pH adjuster of gas to the aforementioned gas dissolution membrane of the aforementioned dissolution membrane device. The aforementioned dissolving membrane device is a device that at least dissolves the aforementioned pH adjuster in the aforementioned pure water.

[0019] [5] The pH / oxidation-reduction potential regulating water manufacturing apparatus according to [4], wherein the aforementioned pH regulator is at least one selected from the group consisting of ammonia, methylamine, dimethylamine and trimethylamine.

[0020] [6] The pH / redox potential regulating water manufacturing apparatus according to [5] further includes an inactive gas in the aforementioned pH regulating agent.

[0021] [7] A pH / oxidation-reduction potential adjusting water manufacturing device, wherein... The pH / oxidation-reduction potential adjusting water production device has the following features: A degassing membrane device having a degassing membrane for removing gases dissolved as impurities from pure water; and pH adjustment device, which adjusts the pH of pure water. The pH / oxidation-reduction potential adjusting water manufacturing device produces pH-9 to 14 water with an oxidation-reduction potential of -0.40V or higher and less than +0.40V (relative to Ag / AgCl) at 25°C.

[0022] [8] According to the pH / redox potential regulating water manufacturing apparatus described in [7], the aforementioned degassing membrane device and the aforementioned pH regulating device are arranged sequentially along the water flow direction of pure water. The aforementioned pH adjustment device is a device that dissolves at least one pH adjuster selected from gases and liquids in the aforementioned pure water.

[0023] [9] The pH / redox potential regulating water manufacturing apparatus according to [7], wherein the aforementioned pH regulator is an aqueous solution containing at least one selected from the group consisting of at least one selected from the group consisting of ammonia, sodium hydroxide, potassium hydroxide, ammonium tetrahydrogen, choline, methylamine, dimethylamine and trimethylamine.

[0024]

[10] The pH / redox potential regulating water manufacturing apparatus according to [7], wherein the aforementioned pH regulator comprises at least one inactive gas selected from the group consisting of ammonia, methylamine, dimethylamine and trimethylamine.

[0025]

[11] A pH / redox potential-adjustable water manufacturing apparatus according to any one of [1] to

[10] , wherein pH / redox potential-adjustable water with pH 9 to 14, redox potential of -0.40V or more and less than +0.40V (relative to Ag / AgCl) at 25°C, and dissolved oxygen concentration of 50 ppb or less at 25°C is manufactured.

[0026]

[12] A pH / redox potential adjusting water manufacturing apparatus according to any one of [1] to

[10] , wherein pH / redox potential adjusting water with pH 9 to 14, redox potential of -0.40V or more and less than +0.40V (relative to Ag / AgCl) at 25°C and hydrogen peroxide concentration of 30 ppb or less is manufactured.

[0027]

[13] A pH / redox potential-adjustable water manufacturing apparatus according to any one of [1] to

[10] , wherein pH / redox potential-adjustable water with pH 9 to 14, redox potential of -0.40V or more and less than +0.40V (relative to Ag / AgCl) at 25°C, dissolved oxygen concentration of 50 ppb or less and hydrogen peroxide concentration of 30 ppb or less at 25°C is manufactured.

[0028]

[14] A pH / redox potential regulating water manufacturing apparatus according to any one of [1] to

[10] , wherein the front section of the aforementioned degassing membrane device has a hydrogen peroxide removal mechanism for removing hydrogen peroxide dissolved as an impurity from pure water.

[0029]

[15] A pH / redox potential regulating water manufacturing apparatus according to any one of [1] to

[10] , wherein the pH / redox potential regulating water manufacturing apparatus has a supply flow path that supplies the aforementioned pH / redox potential regulating water as cooling water for a cutting blade, the cutting blade being formed by fixing diamond abrasive grains with a binder material comprising at least one selected from the group consisting of nickel, cobalt, copper, tin, silver, tungsten and iron.

[0030]

[16] A pH / redox potential regulating water manufacturing apparatus according to any one of [1] to

[10] , wherein the pH / redox potential regulating water manufacturing apparatus has a supply flow path that supplies the aforementioned pH / redox potential regulating water as cooling water in the dicing process of a semiconductor manufacturing process.

[0031]

[17] A method for manufacturing pH / redox potential regulated water, wherein, The manufacturing method produces pH-adjusted water with a pH of 9–14 and a redox potential of -0.40V or higher and less than +0.40V at 25°C by sequentially performing a pH adjustment step, a degassing step, and a gas dissolution step. The redox potential is relative to the Ag / AgCl redox potential. The pH adjustment process involves adding a liquid pH adjuster to the pure water to adjust its pH. The degassing process is a process of removing dissolved gases, which are impurities, from pure water using a degassing membrane. The gas dissolution process is a process in which inactive gases are dissolved in pure water through a gas dissolution membrane.

[0032]

[18] The method for manufacturing pH / redox potential regulated water according to

[17] , wherein the aforementioned pH regulated agent is an aqueous solution comprising at least one selected from the group consisting of ammonia, sodium hydroxide, potassium hydroxide, ammonium tetrahydrogen, choline, methylamine, dimethylamine and trimethylamine.

[0033]

[19] A method for manufacturing pH / redox potential regulated water, wherein, The manufacturing method produces pH-adjusted water with a pH of 9-14 and a redox potential of -0.40V to less than +0.40V at 25°C by sequentially performing a degassing process and a pH adjustment process. The redox potential is relative to the Ag / AgCl redox potential. The degassing process involves removing gases that are dissolved in pure water as impurities from the pure water using a degassing membrane. The process of adjusting the pH of pure water is a process of supplying a pH adjuster with gas through a gas dissolving membrane to adjust the pH of the pure water.

[0034]

[20] The method for manufacturing pH / redox potential regulated water according to

[19] , wherein the aforementioned pH regulator is at least one selected from the group consisting of ammonia, methylamine, dimethylamine and trimethylamine.

[0035]

[21] The method for manufacturing pH / redox potential regulated water according to

[20] further includes an inactive gas in the aforementioned pH regulator.

[0036]

[22] A method for manufacturing pH / redox potential regulated water, wherein, The manufacturing method produces pH-adjusted water with a pH of 9-14 and a redox potential of -0.40V to less than +0.40V at 25°C by sequentially performing a degassing process and a pH adjustment process. The redox potential is relative to the Ag / AgCl redox potential. The degassing process involves removing gases dissolved in pure water as impurities using a degassing membrane. The pH adjustment process is a process of adjusting the pH of pure water by adding at least one pH adjuster selected from gases and liquids.

[0037]

[23] The method for manufacturing pH / redox potential regulated water according to

[22] , wherein the aforementioned pH adjuster is an aqueous solution comprising at least one selected from the group consisting of ammonia, sodium hydroxide, potassium hydroxide, ammonium tetrahydrogen, choline, methylamine, dimethylamine and trimethylamine.

[0038]

[24] The method for manufacturing pH / redox potential regulated water according to

[22] , wherein the aforementioned pH regulator comprises at least one inactive gas selected from the group consisting of ammonia, methylamine, dimethylamine and trimethylamine.

[0039]

[25] A method for manufacturing pH / redox potential-adjustable water according to any one of

[17] to

[24] , wherein pH / redox potential-adjustable water with pH 9 to 14, redox potential of -0.40V or more and less than +0.40V (relative to Ag / AgCl) at 25°C, and dissolved oxygen concentration of 50 ppb or less at 25°C is manufactured.

[0040]

[26] A method for manufacturing pH / redox potential-adjustable water according to any one of

[17] to

[24] , wherein pH / redox potential-adjustable water with pH 9 to 14, redox potential of -0.40V or more and less than +0.40V (relative to Ag / AgCl) at 25°C and hydrogen peroxide concentration of 30 ppb or less is manufactured.

[0041]

[27] The method for manufacturing pH / redox potential adjusted water according to any one of

[17] to

[24] , wherein pH / redox potential adjusted water with pH 9 to 14, redox potential of -0.40V or more and less than +0.40V (relative to Ag / AgCl) at 25°C, dissolved oxygen concentration of 50 ppb or less and hydrogen peroxide concentration of 30 ppb or less at 25°C is manufactured.

[0042]

[28] The method for manufacturing pH / redox potential regulated water according to

[17] wherein a hydrogen peroxide removal step is performed before the aforementioned pH adjustment step, the hydrogen peroxide removal step being a step of removing hydrogen peroxide dissolved in pure water as an impurity from pure water.

[0043]

[29] The method for manufacturing pH / redox potential regulated water according to

[19] or

[22] , wherein a hydrogen peroxide removal process is performed before the aforementioned degassing process, the hydrogen peroxide removal process being a process of removing hydrogen peroxide dissolved in pure water as an impurity from pure water.

[0044]

[30] A method for manufacturing a semiconductor device, wherein the aforementioned pH / redox potential-adjusting water manufactured by any one of the pH / redox potential-adjusting water manufacturing methods described in any one of

[17] to

[24] is used as cooling water for a cutting blade, the cutting blade being formed by fixing diamond abrasive grains using a metal layer comprising at least one selected from the group consisting of nickel, cobalt, copper, tin, silver, tungsten and iron.

[0045]

[31] A method for manufacturing a semiconductor device, wherein the aforementioned pH / redox potential-adjusting water manufactured by the method for manufacturing pH / redox potential-adjusting water according to any one of

[17] to

[24] is used as cooling water in the cutting process of a semiconductor manufacturing process.

[0046] The effects of the invention

[0047] The pH / redox potential adjusting water manufacturing apparatus according to the present invention can produce pH / redox potential adjusting water with low dissolved gas concentration, pH adjusted to 9-14, and pH and redox potential stabilized by the dissolution of inactive gases. Such pH / redox potential adjusting water can suppress the dissolution of various metals constituting the binder material of the cutting blade. Therefore, according to the present invention, an apparatus for manufacturing pH / redox potential adjusting water for use as cooling water for blade cutting can be provided, which can suppress the exchange frequency of the cutting blade.

[0048] The pH / redox potential-adjustable water manufacturing apparatus of the present invention adjusts the pH of pure water by adding a liquid pH adjuster to the pH adjustment device of pure water, removes dissolved gases in the pure water by a degassing membrane device, and dissolves inactive gases in the pure water by a dissolving membrane device. By using a liquid pH adjuster, the pH of the pH-adjusted pure water will not change even if it is degassed. Therefore, it is possible to manufacture pH / redox potential-adjustable water with stable pH and redox potential.

[0049] According to the pH / redox potential adjusting water manufacturing apparatus of the present invention, the pH adjusting device is a device that adds at least one aqueous solution selected from the group consisting of ammonia, sodium hydroxide, potassium hydroxide, ammonium tetrahydrogen, choline, methylamine, dimethylamine and trimethylamine as a pH adjusting agent to pure water, and thus can adjust the pH of the pH / redox potential adjusting water to the range of 9 to 14.

[0050] The pH / oxidation-reduction potential-adjustable water manufacturing apparatus of the present invention removes dissolved gases from pure water through a degassing membrane device, supplies a pH adjuster for the gas to a gas dissolving device through a pH adjusting device, and adds the pH adjuster for the gas to the pure water through the gas dissolving device. Since the pH of the pre-degassed pure water is adjusted, the pH of the pure water does not change, thus enabling the production of pH / oxidation-reduction potential-adjustable water with stable pH and oxidation-reduction potential.

[0051] According to the pH / redox potential adjusting water manufacturing apparatus of the present invention, since the gas dissolution device adds at least one pH adjuster selected from the group consisting of ammonia, methylamine, dimethylamine and trimethylamine to pure water, the pH of the pH / redox potential adjusting water can be adjusted to the range of 9 to 14.

[0052] According to the pH / redox potential regulating water manufacturing apparatus of the present invention, the gas dissolution device dissolves an inactive gas together with a pH adjusting agent in pure water, thereby stabilizing the pH and redox potential of the pH / redox potential regulating water.

[0053] The pH / redox potential adjusting water manufacturing apparatus according to the present invention can produce pH / redox potential adjusting water with low dissolved gas concentration and pH adjusted to 9-14. Such pH / redox potential adjusting water can suppress the dissolution of various metals constituting the binder material of the cutting blade. Therefore, according to the present invention, it is possible to provide a pH / redox potential adjusting water manufacturing apparatus for use as cooling water for blade cutting that can suppress the exchange frequency of the cutting blade.

[0054] The pH / redox potential-adjustable water manufacturing apparatus of the present invention is an apparatus that removes dissolved gases from pure water by a degassing membrane device and adjusts the pH of pure water by adding at least one pH adjuster selected from gases and liquids. Since the pH of the pre-degassed pure water is adjusted, the pH of the pure water does not change, and pH / redox potential-adjustable water with stable pH and redox potential can be manufactured.

[0055] According to the pH / redox potential adjusting water manufacturing apparatus of the present invention, since the pH adjusting device adds at least one pH adjusting agent selected from the group consisting of ammonia, methylamine, dimethylamine and trimethylamine to pure water, the pH of the pH / redox potential adjusting water can be adjusted to the range of 9 to 14.

[0056] According to the pH / redox potential regulating water manufacturing apparatus of the present invention, since the pH regulating device adds a pH regulating agent containing at least one inactive gas selected from the group consisting of ammonia, methylamine, dimethylamine and trimethylamine to pure water, the pH of the pH / redox potential regulating water can be adjusted to the range of 9 to 14, and the pH and redox potential can be stabilized.

[0057] The pH / redox potential adjusting water manufacturing apparatus according to the present invention is an apparatus for manufacturing pH / redox potential adjusting water with a pH of 9 to 14, a redox potential of -0.40V or higher and less than +0.40V (relative to Ag / AgCl) at 25°C, and a dissolved oxygen concentration of 50 ppb or less at 25°C. This pH / redox potential adjusting water can suppress the dissolution of various metals constituting the binder material of the cutting blade, and therefore can manufacture pH / redox potential adjusting water for use as cooling water for blade cutting that can suppress the exchange frequency of the cutting blade.

[0058] The pH / redox potential adjusting water manufacturing apparatus according to the present invention is an apparatus for manufacturing pH / redox potential adjusting water with a pH of 9 to 14, a redox potential of -0.40V or higher and less than +0.40V (relative to Ag / AgCl) at 25°C, and a hydrogen peroxide concentration of 30 ppb or less. This pH / redox potential adjusting water can suppress the dissolution of various metals constituting the binder material of the cutting blade, and therefore can manufacture pH / redox potential adjusting water for use as cooling water for blade cutting that can suppress the exchange frequency of the cutting blade.

[0059] The pH / redox potential adjusting water manufacturing apparatus according to the present invention is an apparatus for manufacturing pH / redox potential adjusting water with a pH of 9 to 14, a redox potential of -0.40V or more and less than +0.40V (relative to Ag / AgCl) at 25°C, a dissolved oxygen concentration of 50 ppb or less and a hydrogen peroxide concentration of 30 ppb or less at 25°C. This pH / redox potential adjusting water can suppress the dissolution of various metals constituting the binder material of the cutting blade, and therefore can manufacture pH / redox potential adjusting water for use as cooling water for blade cutting that can suppress the exchange frequency of the cutting blade.

[0060] According to the pH / redox potential regulating water manufacturing apparatus of the present invention, since a hydrogen peroxide removal mechanism is provided in the front section of the degassing membrane device to remove hydrogen peroxide dissolved as an impurity from pure water, the concentration of hydrogen peroxide in pure water can be reduced, and the redox potential of the pH / redox potential regulating water can be stably maintained in the range of -0.40V or higher and less than +0.40V (relative to Ag / AgCl).

[0061] The pH / redox potential adjusting water manufacturing apparatus according to the present invention has a supply flow path that supplies the manufactured pH / redox potential adjusting water as cooling water for a cutting blade made by fixing diamond abrasive grains with a binder material. Therefore, it can prevent the dissolution of the binder material of the cutting blade and suppress the exchange frequency of the cutting blade.

[0062] The pH / redox potential adjusting water manufacturing apparatus according to the present invention has a supply flow path that supplies the manufactured pH / redox potential adjusting water as cooling water in the cutting process of semiconductor manufacturing, thereby suppressing the switching frequency of the cutting blade.

[0063] The method for manufacturing pH / redox potential adjusted water of the present invention involves adjusting the pH of pure water by adding a liquid pH adjuster to the pure water in the pH adjustment step, removing dissolved gases in the pure water in the degassing step, and dissolving inactive gases in the pure water in the gas dissolution step. By using a liquid pH adjuster, the pH of the pH-adjusted pure water will not change even after degassing. Therefore, it is possible to manufacture pH / redox potential adjusted water with both pH and redox potential adjusted to a desired range.

[0064] According to the method for manufacturing pH / redox potential regulated water of the present invention, in the pH adjustment step, since at least one aqueous solution selected from the group consisting of ammonia, sodium hydroxide, potassium hydroxide, ammonium tetrahydrogen, choline, methylamine, dimethylamine and trimethylamine is added to pure water as a pH adjuster, the pH of the pH / redox potential regulated water can be adjusted to the range of 9 to 14.

[0065] According to the method for manufacturing pH / redox potential regulated water of the present invention, dissolved gases in pure water are removed in a degassing step, and then a pH adjuster for the gas is added to the pure water in a gas dissolution step, thereby adjusting the pH of the pre-degassed pure water and thus preventing changes in the pH of the pure water.

[0066] According to the method for manufacturing pH / redox potential regulated water of the present invention, since the pH adjuster is at least one selected from the group consisting of ammonia, methylamine, dimethylamine and trimethylamine, the pH of the pH / redox potential regulated water can be adjusted to the range of 9 to 14.

[0067] According to the method for manufacturing pH / redox potential regulated water of the present invention, since the pH adjuster contains an inactive gas, the pH of the pH / redox potential regulated water can be adjusted to the range of 9 to 14, and the pH and redox potential of the pH / redox potential regulated water can be stabilized.

[0068] According to the pH / redox potential adjusting water manufacturing apparatus of the present invention, dissolved gases are removed from pure water in the degassing step, and a liquid pH adjuster is added to pure water in the pH adjusting step to adjust the pH of the pure water. Therefore, it is possible to manufacture pH / redox potential adjusting water in which the pH and redox potential are adjusted to a desired range.

[0069] According to the method for manufacturing pH / redox potential regulated water of the present invention, in the pH adjustment step, an aqueous solution of at least one selected from the group consisting of ammonia, sodium hydroxide, potassium hydroxide, ammonium tetrahydrogen, choline, methylamine, dimethylamine and trimethylamine is added to pure water as a pH adjuster, thereby enabling the pH of the pH / redox potential regulated water to be adjusted to the range of 9 to 14.

[0070] According to the method for manufacturing pH / redox potential regulated water of the present invention, in the pH adjustment step, since a substance containing at least one inactive gas selected from the group consisting of ammonia, methylamine, dimethylamine and trimethylamine is added to pure water as a pH adjuster, the pH of the pH / redox potential regulated water can be adjusted to the range of 9 to 14, and the pH and redox potential can be stabilized.

[0071] The method for manufacturing pH / redox potential-adjusting water of the present invention is a method for manufacturing pH / redox potential-adjusting water with a pH of 9 to 14, a redox potential of -0.40V or higher and less than +0.40V (relative to Ag / AgCl) at 25°C, and a dissolved oxygen concentration of 50 ppb or less at 25°C. This pH / redox potential-adjusting water can suppress the dissolution of various metals constituting the binder material of the cutting blade, thereby enabling the manufacture of pH / redox potential-adjusting water for use as cooling water for blade cutting that can suppress the exchange frequency of the cutting blade.

[0072] The method for manufacturing pH / redox potential-adjusting water of the present invention is a method for manufacturing pH / redox potential-adjusting water with a pH of 9 to 14, a redox potential of -0.40V or higher and less than +0.40V (relative to Ag / AgCl) at 25°C, and a hydrogen peroxide concentration of 30 ppb or less. This pH / redox potential-adjusting water can suppress the dissolution of various metals constituting the binder material of the cutting blade, thereby enabling the manufacture of pH / redox potential-adjusting water for use as cooling water for blade cutting that can suppress the exchange frequency of the cutting blade.

[0073] The method for manufacturing pH / redox potential-adjusting water of the present invention is a method for manufacturing pH / redox potential-adjusting water with a pH of 9 to 14, a redox potential of -0.40V or higher and less than +0.40V (relative to Ag / AgCl) at 25°C, a dissolved oxygen concentration of 50 ppb or less and a hydrogen peroxide concentration of 30 ppb or less at 25°C. This pH / redox potential-adjusting water can suppress the dissolution of various metals constituting the binder material of the cutting blade, thereby enabling the manufacture of pH / redox potential-adjusting water for use as cooling water for blade cutting that can suppress the exchange frequency of the cutting blade.

[0074] According to the method for manufacturing pH / redox potential adjusted water of the present invention, a hydrogen peroxide removal step is performed before the degassing step to remove hydrogen peroxide dissolved as an impurity from pure water. Therefore, the concentration of hydrogen peroxide in pure water can be reduced, and the redox potential of the pH / redox potential adjusted water can be stably maintained in the range of -0.40V or higher and less than +0.40V (relative to Ag / AgCl).

[0075] According to the semiconductor device manufacturing method of the present invention, since the manufactured pH / redox potential adjusting water is used as cooling water for a cutting blade made by fixing diamond abrasive grains with a binder material, the dissolution of the binder material of the cutting blade can be prevented and the exchange frequency of the cutting blade can be suppressed.

[0076] According to the semiconductor device manufacturing method of the present invention, since the manufactured pH / redox potential adjusting water is used as cooling water in the cutting process of the semiconductor manufacturing process, the switching frequency of the cutting blade can be suppressed. Attached Figure Description

[0077] Figure 1 This is a schematic diagram showing an apparatus for producing pH / redox potential regulated water as a first embodiment of the present invention.

[0078] Figure 2 This is a schematic diagram showing an apparatus for producing pH / redox potential regulated water as a second embodiment of the present invention.

[0079] Figure 3 This is a schematic diagram showing an apparatus for producing pH / redox potential regulated water as a third embodiment of the present invention. Detailed Implementation

[0080] The pH / redox potential-adjustable water manufacturing apparatus of the present invention comprises at least: a degassing membrane device having a degassing membrane for removing gases dissolved as impurities from pure water; and a pH adjusting device for adjusting the pH of the pure water. Furthermore, the pH / redox potential-adjustable water manufacturing apparatus of the present invention may also include a gas dissolving membrane device having a gas dissolving membrane for dissolving inactive gases in pure water. Additionally, the pH adjusting device can supply a pH adjusting agent containing gas to the gas dissolving membrane device. Moreover, the pH / redox potential-adjustable water manufacturing apparatus of the present invention is capable of producing pH / redox potential-adjustable water with a pH of 9 to 14 and a redox potential of -0.40V or higher and less than +0.40V (relative to Ag / AgCl) at 25°C.

[0081] Hereinafter, with reference to the accompanying drawings, a detailed description will be provided of the apparatus and method for manufacturing pH / redox potential regulated water as embodiments of the present invention.

[0082] [First Implementation Method]

[0083] <A device for producing water with pH / oxidation-reduction potential adjustment>

[0084] Figure 1 This invention illustrates a pH / redox potential adjusting water manufacturing apparatus according to a first embodiment of the present invention. Figure 1 The pH / redox potential regulating water manufacturing apparatus 1 shown has the following components on the pure water W supply line 2: a resin column 3 loaded with platinum group metals as a hydrogen peroxide removal mechanism, a pH regulator injection line 4 (pH regulating device), a degassing membrane device 5 for degassing dissolved gases in the pure water, a gas dissolution device 6 for dissolving inactive gases in the pure water, and a storage tank 7 for storing the regulated pH / redox potential regulating water (hereinafter sometimes referred to as regulating water).

[0085] To ensure that the hydrogen peroxide concentration of the pure water W, which serves as the raw water, is below 30 ppb, a resin column 3 loaded with platinum group metals is provided as a hydrogen peroxide removal mechanism. However, the hydrogen peroxide removal mechanism is not necessary in this embodiment; it may be omitted as long as the hydrogen peroxide concentration of the pure water W is below 30 ppb.

[0086] In this embodiment, the platinum group metals used as the platinum group metal supported resin in the platinum group metal supported resin column 3 include ruthenium, rhodium, palladium, osmium, iridium, and platinum. These platinum group metals can be used alone, in combination of two or more, as alloys of two or more, or even without separating the refined product of the naturally occurring mixture into monomers. Among these, platinum, palladium, and platinum / palladium alloys, alone or in mixtures of two or more of these, are preferred due to their strong catalytic activity. Furthermore, nanoscale particles of these metals can be used particularly well.

[0087] In the resin column 3 loaded with platinum group metals, ion exchange resins can be used as the support resin for the platinum group metals. Among these, anion exchange resins are particularly preferred. Platinum group metals are negatively charged, and therefore are stably loaded onto the anion exchange resin and are difficult to strip. The exchange groups of the anion exchange resin are preferably OH-type. The resin surface of the OH-type anion exchange resin becomes basic, promoting the decomposition of hydrogen peroxide.

[0088] pH adjuster injection line 4 (pH adjustment device) is not particularly limited and can use general dosing devices. For example, Figure 1 The pH adjuster injection line 4 shown merges with the supply line 2 to add liquid pH adjuster to pure water. The pH adjuster injection line 4 has a pH adjuster tank 4A and a liquid supply mechanism 4B connected to the pH adjuster tank 4A.

[0089] pH adjuster tank 4A is capable of storing liquid pH adjuster. pH adjuster tank 4A may have a non-reactive gas supply mechanism. It is preferable to use non-reactive gas for purging inside pH adjuster tank 4A, or to provide a mechanism for removing dissolved oxygen from the pH adjuster inside the tank using a degassing membrane.

[0090] For supplying the pH adjuster to the liquid, the liquid supply mechanism 4B can use a pump such as a diaphragm pump. Alternatively, a pressure pump can be used where the pH adjuster tank 4A is a sealed container, and the pH adjuster is added together with an inactive gas such as N2 gas, and the reagent is expelled by the pressure of the inactive gas.

[0091] The degassing membrane device 5 is located downstream of the pH adjuster injection line 4. The degassing membrane device 5 is a membrane-type device with a degassing membrane. Furthermore, a vacuum pump (VP) 5A is connected to the gas phase side of the degassing membrane in the degassing membrane device 5. The degassing membrane device 5 is configured such that by flowing pure water to one side (liquid phase side) of the degassing membrane, the vacuum pump (VP) 5A draws air from the other side (gas phase side), thereby causing dissolved gases such as dissolved oxygen to pass through the degassing membrane and be transferred to the gas phase chamber side for removal. The degassing membrane can be any membrane through which gases such as oxygen, nitrogen, and vapor pass but not through water; examples include silicone rubber-based, polytetrafluoroethylene-based, polyolefin-based, and polyurethane-based membranes. Various commercially available degassing membranes can be used as this degassing membrane.

[0092] The gas dissolution device 6 is located downstream of the degassing membrane device 5. The gas dissolution device 6 has a gas dissolution membrane, the gas phase chamber side of which is connected to a source of N2 gas, which is an inert gas. The gas dissolution membrane device 6 dissolves the inert gas in the regulating water W1 by flowing conditioning water W1 to one side (liquid phase side) of the gas dissolution membrane and supplying N2 gas to the other side (gas phase side). It should be noted that the inert gas is not limited to N2 gas; argon and helium, etc., can also be used preferentially.

[0093] The storage tank 7 is located downstream of the gas dissolution device 6. The storage tank 7 is capable of storing conditioning water W1. In this embodiment, the storage tank 7 is purged with an inactive gas.

[0094] Then, the feed line 2, passing through the storage tank 7, reaches the usage point UP. The usage point UP reached by the feed line 2 can be exemplified as a cutting apparatus for cutting semiconductor substrates. As a cutting apparatus, a cutting apparatus that cuts semiconductor substrates using a cutting blade can be exemplified. Furthermore, as a cutting blade, a cutting blade in which diamond abrasive grains are fixed to the outer peripheral end face of a disc-shaped blade using an adhesive material can be exemplified. As an adhesive material for the diamond abrasive grains, materials composed of metals such as nickel, cobalt, copper, tin, silver, and tungsten can be exemplified.

[0095] Furthermore, in this embodiment, downstream of the gas dissolution device 6 of the supply line 2, for example in the storage tank 7, a pH meter (not shown) serving as a pH measuring mechanism and an ORP meter (oxidation-reduction potential) serving as an oxidation-reduction potential measuring mechanism, and other water quality monitoring mechanisms are respectively installed. These pH meters and ORP meters are connected to a control device such as a personal computer. Moreover, based on the measurements from these pH meters and ORP meters, the control device can control the amount of pH adjuster injected and the amount of platinum group metal-loaded resin column 3.

[0096] <Pure Water>

[0097] In this embodiment, the pure water W used as the raw water is preferably ultrapure water with, for example, a resistivity of 18.1 MΩ·cm or higher, particles with a diameter of 50 nm or higher and less than 1000 particles / L, viable bacteria of 1 cell / L or less, total organic carbon (TOC) of 1 μg / L or less, total silicon of 0.1 μg / L or less, metals of 1 ng / L or less, ions of 10 ng / L or less, hydrogen peroxide of 30 μg / L or less, and a water temperature of 25 ± 2 °C. However, in this embodiment, the pure water W used as the raw water contains more than 30 ppb of hydrogen peroxide, contains more than 50 ppb of dissolved oxygen, and sometimes has a pH less than 9.

[0098] <pH adjuster>

[0099] In this embodiment, the pH adjuster injected from the pH adjuster tank 4A is not particularly limited. To adjust the pH of the adjusting water to 9-14, an aqueous solution of at least one selected from the group consisting of ammonia, sodium hydroxide, potassium hydroxide, ammonium tetrahydrogen, choline, methylamine, dimethylamine, and trimethylamine can be used. When the adjusting water is used as cooling water for the cutting process, it is preferable to make it alkaline to prevent the dissolution of the metal in the bonding material. However, alkali metal solutions such as sodium hydroxide are sometimes unsuitable because they contain metal components. Therefore, in this embodiment, ammonia, ammonium tetrahydrogen, choline, methylamine, dimethylamine, and trimethylamine are most preferably used.

[0100] <Method for producing pH / oxidation-reduction potential adjusted water>

[0101] The following describes a method for manufacturing pH / redox potential-adjusted water using the pH / redox potential-adjusted water manufacturing apparatus 1 of this embodiment, which has the configuration described above.

[0102] In this embodiment, the hydrogen peroxide removal process, pH adjustment process, degassing process, gas dissolution process, and supply process are performed.

[0103] The hydrogen peroxide removal process removes dissolved hydrogen peroxide from the pure water W, reducing the hydrogen peroxide concentration to below 30 ppb. However, this hydrogen peroxide removal process is not necessarily required in this embodiment; it can be omitted as long as the hydrogen peroxide concentration in the pure water W is below 30 ppb. The redox potential of the pure water with a hydrogen peroxide concentration limited to below 30 ppb is in the range of -0.40 V to +0.40 V (relative to Ag / AgCl).

[0104] In addition, the pH adjustment process adjusts the pH of the purified water after the hydrogen peroxide removal process to the range of 9 to 14.

[0105] In addition, the degassing process removes dissolved gases from the pure water, reducing the dissolved oxygen concentration to below 50 ppb.

[0106] Furthermore, the gas dissolution process stabilizes the pH and redox potential of the water by dissolving inactive gases in pure water.

[0107] The supply process supplies conditioning water W1 to the semiconductor manufacturing process via supply line 2.

[0108] The following details each process.

[0109] Pure water W, used as raw water, typically contains hydrogen peroxide at levels of tens of ppb. Therefore, to accurately control and adjust the redox potential of the water, it is necessary to remove hydrogen peroxide from the pure water W beforehand. Thus, as a hydrogen peroxide removal process, pure water W is supplied from supply line 2 to a resin column 3 loaded with platinum group metals. In this resin column 3, the hydrogen peroxide in the pure water W is decomposed and removed by the catalytic action of the platinum group metals, thus functioning as a hydrogen peroxide removal mechanism.

[0110] Next, in the pH adjustment process, liquid pH adjuster is injected into pure water W from pH adjuster tank 4A. The amount of pH adjuster added can be appropriately set according to the desired pH, the flow rate of supply line 2, and the concentration of pH adjuster. For example, if the conditioning water used as cooling water in the cutting process is set to alkaline, an amount of pure water with a pH in the range of 9 to 14 can be added.

[0111] Next, in the degassing process, the pH-adjusted conditioning water W1 is degassed using a degassing membrane device 5. In the degassing membrane device 5, the conditioning water W1 flows towards the liquid phase chamber side of the liquid phase chamber and the gas phase chamber, which are composed of a hydrophobic gas permeable membrane. A vacuum pump (VP) 5A depressurizes the gas phase chamber, thereby causing dissolved gases such as dissolved oxygen in the conditioning water W1 to transfer to the gas phase chamber through the hydrophobic gas permeable membrane and be removed. This reduces the dissolved oxygen concentration in the conditioning water W1 to a very low level. Furthermore, the liquid pH adjuster is not degassed; therefore, by degassing after the conditioning water W1 is produced, the risk of liquid leakage during vacuum degassing of these agents can be reduced.

[0112] Next, as a gas dissolution process, an inactive gas is supplied to the conditioning water W1 after the degassing process using a gas dissolution membrane device 6, thereby stabilizing the properties of the conditioning water W1 and producing stable conditioning water W1. It should be noted that the inactive gas can be dissolved to saturation.

[0113] This process is carried out in such a way that after the conditioning water W1 is produced, it is stored in the storage tank 7. However, since the storage tank 7 is purged with inactive gas, it is possible to prevent oxygen and carbon dioxide from dissolving in the conditioning water W1 and to prevent changes in pH and redox potential during the storage of the obtained conditioning water W1. At this time, based on the measurement results of a pH meter and an ORP meter (not shown), the amount of pH adjuster added from the pH adjuster tank 4A and the resin column 3 loaded with platinum group metals are controlled by a control device, thereby ensuring a stable supply of conditioning water W1 adjusted to the desired pH and redox potential.

[0114] The pH of the prepared water W1 is 9–14, and the oxidation-reduction potential at 25°C is above -0.40V and less than +0.40V (relative to Ag / AgCl).

[0115] In addition, the dissolved oxygen concentration of the manufactured conditioning water W1 can be below 50 ppb at 25°C.

[0116] In addition, the hydrogen peroxide concentration of the manufactured conditioning water W1 can be below 30 ppb.

[0117] Furthermore, the pH of the prepared water W1 is 9–14, the redox potential at 25°C is above -0.40V and less than +0.40V (relative to Ag / AgCl), the dissolved oxygen concentration at 25°C is below 50 ppb, and the hydrogen peroxide concentration can be below 30 ppb.

[0118] Then, the conditioning water W1 produced in this way is supplied as a supply process and transported to the point of use UP via supply line 2.

[0119] (Example of water supply for pH / redox potential adjustment)

[0120] The following describes the case where the conditioning water W1, manufactured as described above, is used as cooling water for the cutting process.

[0121] In this embodiment, conditioning water W1 is supplied to the semiconductor manufacturing process via supply line 2. Here, as a semiconductor manufacturing process, a cutting apparatus that cuts a semiconductor substrate using a cutting blade can be exemplified. The cutting blade is a disc-shaped blade with diamond abrasive grains fixed to its outer peripheral end face by an adhesive material. The adhesive material for the diamond abrasive grains is composed of any one of the following metals: nickel, cobalt, copper, tin, silver, tungsten, etc.

[0122] When cutting semiconductor substrates using a cutting blade, conditioning water is supplied as cooling water. The conditioning water has a pH of 9–14 and a redox potential of -0.40V to less than +0.40V at 25°C (relative to Ag / AgCl). Furthermore, the conditioning water meets one or both of the following conditions at 25°C: dissolved oxygen concentration below 50 ppb or hydrogen peroxide concentration below 30 ppb. This conditioning water is alkaline, and its redox potential is within the range of ±0.40V, thus preventing the dissolution of the metal in the bonding material constituting the cutting blade. Therefore, blade deterioration can be prevented, and the blade replacement frequency can be reduced.

[0123] [Second Implementation]

[0124] <A device for producing water with pH / oxidation-reduction potential adjustment>

[0125] Figure 2 A pH / oxidation-reduction potential adjusting water manufacturing apparatus 11 according to a second embodiment of the present invention is shown. Figure 2In this document, the same symbols used for the same components as those in the first embodiment described above are omitted from detailed description.

[0126] Figure 2 The pH / oxidation-reduction potential adjusting water production apparatus 11 shown has a degassing membrane device 5 for degassing dissolved gases in the pure water and a gas dissolving device 16 for dissolving gases in the pure water on the pure water supply line 2. Additionally, Figure 2 The pH / redox potential adjusting water production apparatus 11 shown has a pH adjusting agent injection line 14 (pH adjusting device) that supplies pH adjusting agent to the gas dissolution device 16.

[0127] It should be noted that, in Figure 2 In the pH / redox potential-adjusted water manufacturing apparatus 11 shown, a resin column loaded with platinum group metals, serving as a hydrogen peroxide removal mechanism, can be provided upstream of the degassing membrane device 5. Additionally, a storage tank for storing the adjusted pH / redox potential-adjusted water (adjusted water) can be provided downstream of the gas dissolution device 16.

[0128] To ensure that the hydrogen peroxide concentration of the pure water W, which serves as the raw water, is below 30 ppb, a resin column loaded with platinum group metals is provided as a hydrogen peroxide removal mechanism. However, the hydrogen peroxide removal mechanism is not necessary in this embodiment; it may be omitted as long as the hydrogen peroxide concentration of the pure water W is below 30 ppb. The details of the resin column loaded with platinum group metals are the same as in the first embodiment.

[0129] The degassing membrane device 5 is a membrane-type degassing membrane device, which has a degassing membrane. In addition, a vacuum pump (VP) 5A is connected to the gas phase side of the degassing membrane of the degassing membrane device 5. The detailed configuration is the same as that of the first embodiment.

[0130] The gas dissolution device 16 is located downstream of the degassing membrane device 5. The gas dissolution device 16 has a gas dissolution membrane, the gas phase chamber side of which is connected to the pH adjuster injection line 14 (pH adjustment device). The gas dissolution membrane device 16 adjusts the pH of the pure water W1 to 9-14 by allowing pure water W to flow to one side (liquid phase side) of the gas dissolution membrane and supplying the pH adjuster to the other side (gas phase side), causing the pH adjuster to dissolve in the pure water W1. It should be noted that the gas dissolution device 16 can also dissolve inert gases together with the pH adjuster in the pure water W1. Besides N2 gas, argon and helium are also preferable as inert gases. The inert gases can be dissolved to saturation.

[0131] The pH adjuster injection line 14 (pH adjustment device) is not particularly limited, as long as it is a pipe that can supply gaseous pH adjuster. Figure 2The pH adjuster injection line 14 shown is connected to the gas phase chamber side of the gas dissolution membrane of the gas dissolution device 16, supplying the gas pH adjuster to the gas phase chamber side of the gas dissolution membrane. Furthermore, the pH adjuster injection line 14 can supply inactive gas along with the gas pH adjuster to the gas dissolution device 16. That is, the pH adjuster injection line 14 can supply a mixture of pH adjuster and inactive gas to the gas dissolution device 16. Upstream of the pH adjuster injection line 14, there may be a pH adjuster tank filled with pH adjuster, an inactive gas source, and a gas pressurization mechanism for pressurizing and supplying the pH adjuster and inactive gas.

[0132] The storage tank is configured as needed at the downstream end of the gas dissolution device 16. The storage tank is capable of storing conditioning water W1. In this embodiment, the storage tank is purged with an inactive gas.

[0133] Then, the feed line 2, passing through the gas dissolution device 16 or the storage tank, reaches the usage point UP. As the usage point UP reached by the feed line 2, a cutting apparatus that cuts a semiconductor substrate using a cutting blade can be exemplified. Furthermore, as the cutting blade, a cutting blade in which diamond abrasive grains are fixed to the outer peripheral end face of a disc-shaped blade using an adhesive material can be exemplified. As the adhesive material for the diamond abrasive grains, materials composed of metals such as nickel, cobalt, copper, tin, silver, and tungsten can be exemplified.

[0134] Furthermore, in this embodiment, downstream of the gas dissolution device 6 of the supply line 2, for example in a storage tank, are respectively provided a pH meter (not shown) as a pH measuring mechanism and an ORP meter (not shown) as a redox potential measuring mechanism, and other water quality monitoring mechanisms. These pH meters and ORP meters are connected to a control device such as a personal computer. Moreover, based on the measurements from these pH meters and ORP meters, the control device can control the amount of pH adjuster injected and the amount of platinum group metal-loaded resin column.

[0135] <Pure Water>

[0136] In this embodiment, the pure water W used as the raw water is the same as in the first embodiment.

[0137] <pH adjuster>

[0138] In this embodiment, the pH adjuster injected from the pH adjuster injection line 14 is not particularly limited to any gas. To adjust the pH of pure water to 9-14, at least one selected from the group consisting of ammonia, methylamine, dimethylamine, and trimethylamine can be used. Furthermore, inactive gases such as nitrogen, argon, and helium can be mixed into the pH adjuster. All of these pH adjusters are supplied in a gaseous state.

[0139] <Method for producing pH / oxidation-reduction potential adjusted water>

[0140] The following describes a method for manufacturing pH / redox potential-adjustable water using the pH / redox potential-adjustable water manufacturing apparatus 11 of this embodiment, which has the configuration described above.

[0141] In this embodiment, a degassing process, a gas dissolution process to dissolve the pH adjuster, and a supply process are performed. Additionally, a hydrogen peroxide removal process can be performed before the degassing process.

[0142] The hydrogen peroxide removal process removes dissolved hydrogen peroxide from the pure water W, reducing the hydrogen peroxide concentration to below 30 ppb. However, this hydrogen peroxide removal process is not necessarily required in this embodiment; it can be omitted as long as the hydrogen peroxide concentration in the pure water W is below 30 ppb. The redox potential of the pure water with a hydrogen peroxide concentration limited to below 30 ppb is in the range of -0.40 V to +0.40 V (relative to Ag / AgCl).

[0143] In addition, the degassing process removes dissolved gases from the pure water, reducing the dissolved oxygen concentration to below 50 ppb.

[0144] Furthermore, the gas dissolution process adjusts the pH of the pure water by dissolving a pH adjuster in it. Additionally, by supplying an inert gas, the pH of the adjusted water and its redox potential are stabilized.

[0145] The supply process supplies conditioning water W1 to the semiconductor manufacturing process via supply line 2.

[0146] The following details each process.

[0147] Pure water W, used as raw water, typically contains hydrogen peroxide at levels of tens of ppb. Therefore, to accurately control and adjust the redox potential of the water, it is necessary to remove hydrogen peroxide from the pure water W beforehand. Thus, as a hydrogen peroxide removal process, pure water W is supplied from supply line 2 to a resin column 3 loaded with platinum group metals. In this resin column 3, the hydrogen peroxide in the pure water W is decomposed and removed by the catalytic action of the platinum group metals, thus functioning as a hydrogen peroxide removal mechanism.

[0148] Next, in the degassing process, the pure water W1 is degassed using a degassing membrane device 5. In the degassing membrane device 5, the pure water W flows through the liquid phase chamber, which is composed of a hydrophobic gas permeable membrane, and the gas phase chamber is depressurized using a vacuum pump (VP) 5A. This causes dissolved gases, such as dissolved oxygen, contained in the pure water W to be transferred to the gas phase chamber through the hydrophobic gas permeable membrane and removed. As a result, the dissolved oxygen concentration of the pure water W can be reduced to a very low level, for example, below 50 ppb.

[0149] It should be noted that, in this embodiment, a degassing process is required before the gas dissolution process in order to adjust the pH of the conditioned water to the range of 9-14. If the degassing process is performed after the gas dissolution process, the pH adjuster added to the pure water in the gas dissolution process will be degassed, and the pH of the conditioned water may deviate from the range of 9-14.

[0150] Next, as a gas dissolution process, a gaseous pH adjuster is supplied to the gas dissolution membrane from the pH adjuster injection line 14. The gaseous pH adjuster dissolves in pure water through the gas dissolution membrane to adjust the pH of the pure water. The amount of pH adjuster added can be appropriately set according to the desired pH, the flow rate of the supply line 2, and the concentration of the pH adjuster. For example, if the conditioning water used as cooling water in the cutting process is alkaline, an amount of pure water is added to achieve a pH in the range of 9 to 14. Alternatively, inactive gases can be dissolved together with the pH adjuster in pure water W. By dissolving inactive gases, the contamination of oxygen and carbon dioxide can be prevented, stabilizing the pH and redox potential. The inactive gases can be dissolved to a saturation level.

[0151] This process allows the prepared water W1 to be stored in the storage tank 7 after production. Since the storage tank 7 is purged with an inactive gas, changes in pH and redox potential are prevented during the storage of the prepared water W1 due to the dissolution of oxygen and carbon dioxide. At this time, based on measurements from a pH meter and an ORP meter (not shown), the amount of pH adjuster added from the pH adjuster injection line 14 and the resin column loaded with platinum group metals are controlled using a control device, thereby ensuring a stable supply of prepared water W1 adjusted to the desired pH and redox potential.

[0152] The quality of the conditioning water W1 produced is the same as that in the first embodiment.

[0153] Then, the conditioning water W1 produced in this way is supplied to the point of use UP via the supply line 2 as a supply process, and is used as cooling water for the cutting process.

[0154] [Third Implementation Method]

[0155] <A device for producing water with pH / oxidation-reduction potential adjustment>

[0156] Figure 3 A pH / oxidation-reduction potential adjusting water manufacturing apparatus 21 according to a third embodiment of the present invention is shown. Figure 3 In this document, the same symbols used for the same components as those in the first embodiment described above are omitted from detailed description. Figure 3The pH / oxidation-reduction potential regulating water production apparatus 21 shown has a degassing membrane device 5 for degassing dissolved gases in the pure water and a pH regulating agent injection line 24, which serves as a pH regulating device for adjusting the pH of the pure water, on the pure water supply line 2.

[0157] It should be noted that, in Figure 3 In the pH / redox potential-adjusted water production apparatus 21 shown, a resin column loaded with platinum group metals, serving as a hydrogen peroxide removal mechanism, can be provided upstream of the degassing membrane device 5. Additionally, a storage tank for storing the adjusted pH / redox potential-adjusted water (adjusted water) can be provided downstream of the pH adjustment device 24.

[0158] To ensure that the hydrogen peroxide concentration of the pure water W, which serves as the raw water, is below 30 ppb, a resin column loaded with platinum group metals is provided as a hydrogen peroxide removal mechanism. However, the hydrogen peroxide removal mechanism is not necessary in this embodiment; it may be omitted as long as the hydrogen peroxide concentration of the pure water W is below 30 ppb. The details of the resin column loaded with platinum group metals are the same as in the first embodiment.

[0159] The degassing membrane device 5 is a membrane-type degassing membrane device, which has a degassing membrane. In addition, a vacuum pump (VP) 5A is connected to the gas phase side of the degassing membrane of the degassing membrane device 5. The detailed configuration is the same as that of the first embodiment.

[0160] The pH adjusting agent injection line 24, as a pH adjusting device, is not particularly limited as long as it can add at least one pH adjusting agent selected from gases and liquids to pure water. The pH adjusting agent injection line 24 has a pH adjusting agent tank 24A and a supply mechanism 24B connected to the pH adjusting agent tank 24A. The pH adjusting agent tank 24A may have a supply mechanism for inactive gases such as nitrogen.

[0161] When the pH adjuster is a liquid, the supply mechanism 24B can use a pump such as a diaphragm pump. In this case, it is preferable to purge the pH adjuster tank 24A with an inert gas, or to install a mechanism that uses a degassing membrane to remove dissolved oxygen from the pH adjuster liquid in the tank. Alternatively, it is also preferable to use a pressure pump that pre-adds the pH adjuster along with an inert gas such as N2 gas into the pH adjuster tank 24A and uses the pressure of the inert gas to expel these reagents.

[0162] In addition, when the pH adjuster is a gas, the supply mechanism 24B can use a direct gas-liquid contact device such as a gas permeation membrane module or an ejector.

[0163] The storage tank is positioned downstream of the pH adjuster injection line 24 as needed. The storage tank is capable of storing the adjusting water W1. In this embodiment, the storage tank is purged with an inactive gas.

[0164] Then, it reaches the usage point UP via the pH adjuster injection line 24 or the supply line 2 of the storage tank. The usage point UP reached by the supply line 2 can be exemplified as a cutting apparatus that cuts a semiconductor substrate using a cutting blade. Furthermore, as the cutting blade, an example can be a cutting blade in which diamond abrasive grains are fixed to the outer peripheral end face of a disc-shaped blade using an adhesive material. As the adhesive material for the diamond abrasive grains, examples can be materials composed of metals such as nickel, cobalt, copper, tin, silver, and tungsten.

[0165] Furthermore, in this embodiment, downstream of the pH adjuster injection line 24 of the supply line 2, for example in a storage tank, a pH meter (not shown) serving as a pH measurement mechanism and an ORP meter (not shown) serving as a redox potential measurement mechanism, and other water quality monitoring mechanisms, are respectively installed. These pH meters and ORP meters are connected to a control device such as a personal computer. Moreover, based on the measurements from these pH meters and ORP meters, the control device can control the amount of pH adjuster injected and the amount of platinum group metal-loaded resin column.

[0166] <Pure Water>

[0167] In this embodiment, the pure water W used as the raw water can be the same water as in the first embodiment.

[0168] <pH adjuster>

[0169] In this embodiment, the pH adjuster injected from the pH adjuster injection line 24 is not particularly limited, as long as it is at least one pH adjuster selected from gases and liquids. Specifically, as a liquid pH adjuster for adjusting the pH of pure water to 9 to 14, an aqueous solution containing at least one selected from the group consisting of ammonia, sodium hydroxide, potassium hydroxide, ammonium tetrahydrogen, choline, methylamine, dimethylamine, and trimethylamine can be used. Furthermore, as a gaseous pH adjuster, a substance containing at least one inactive gas selected from the group consisting of ammonia, methylamine, dimethylamine, and trimethylamine can be used.

[0170] <Method for producing pH / oxidation-reduction potential adjusted water>

[0171] The following describes a method for manufacturing pH / redox potential-adjustable water using the pH / redox potential-adjustable water manufacturing apparatus 21 of this embodiment, which has the configuration described above.

[0172] In this embodiment, a degassing step of degassing pure water, a pH adjustment step of adjusting the pH of pure water, and a supply step are performed. Additionally, a hydrogen peroxide removal step can be performed before the degassing step.

[0173] The hydrogen peroxide removal process removes dissolved hydrogen peroxide from the pure water W, reducing the hydrogen peroxide concentration to below 30 ppb. However, this hydrogen peroxide removal process is not necessarily required in this embodiment; it can be omitted as long as the hydrogen peroxide concentration in the pure water W is below 30 ppb. The redox potential of the pure water with a hydrogen peroxide concentration limited to below 30 ppb is in the range of -0.40 V to +0.40 V (relative to Ag / AgCl).

[0174] The degassing process removes dissolved gases from pure water to reduce the dissolved oxygen concentration to below 50 ppb.

[0175] The pH adjustment process adjusts the pH of pure water by adding at least one pH adjuster selected from gases and liquids. Additionally, the pH and redox potential of the adjusted water are stabilized by supplying an inert gas.

[0176] The supply process supplies conditioning water W1 to the semiconductor manufacturing process via supply line 2.

[0177] The following details each process.

[0178] Pure water W, used as raw water, typically contains hydrogen peroxide at levels of tens of ppb. Therefore, to accurately control and adjust the redox potential of the water, it is necessary to remove hydrogen peroxide from the pure water W beforehand. Thus, as a hydrogen peroxide removal process, pure water W is supplied from supply line 2 to a resin column 3 loaded with platinum group metals. In this resin column 3, the hydrogen peroxide in the pure water W is decomposed and removed by the catalytic action of the platinum group metals, thus functioning as a hydrogen peroxide removal mechanism.

[0179] Next, in the degassing process, the pure water W1 is degassed using a degassing membrane device 5. In the degassing membrane device 5, the pure water W flows through the liquid phase chamber, which is composed of a hydrophobic gas permeable membrane, and the gas phase chamber is depressurized using a vacuum pump (VP) 5A. This causes dissolved gases, such as dissolved oxygen, contained in the pure water W to be transferred to the gas phase chamber through the hydrophobic gas permeable membrane and removed. As a result, the dissolved oxygen concentration of the pure water W can be reduced to a very low level, for example, below 50 ppb.

[0180] Next, in the pH adjustment process, at least one pH adjuster selected from gases and liquids is injected into the pure water W from the pH adjuster tank 24A. The amount of pH adjuster added can be appropriately set according to the desired pH, the flow rate of the supply line 2, and the concentration of the pH adjuster. For example, if the conditioning water used as cooling water in the cutting process is alkaline, an amount of pure water is added to achieve a pH in the range of 9 to 14. Furthermore, when using a gaseous pH adjuster for pH adjustment, by adding an inactive gas along with the pH adjuster to the pure water, the introduction of oxygen and carbon dioxide can be prevented, thus stabilizing the pH and redox potential.

[0181] This process allows the prepared water W1 to be stored in a retention tank after production. Because the retention tank is purged with an inactive gas, changes in pH and redox potential are prevented during the storage of the prepared water W1, as oxygen and carbon dioxide dissolve in it. At this time, based on measurements from a pH meter and an ORP meter (not shown), a control device is used to control the amount of pH adjuster added from the pH adjuster injection line 24 and the resin column loaded with platinum group metals, thereby ensuring a stable supply of prepared water W1 adjusted to the desired pH and redox potential.

[0182] The quality of the conditioning water W1 produced is the same as that in the first embodiment.

[0183] Then, the conditioning water W1 produced in this way is supplied to the point of use UP via the supply line 2 as cooling water for the cutting process.

[0184] As explained above, the pH / redox potential adjusting water manufacturing apparatus and method according to this embodiment can produce adjusting water with low dissolved gas concentration, a pH adjusted to 9-14, and a redox potential adjusted to -0.40V or higher and less than +0.40V (relative to Ag / AgCl). Such adjusting water can suppress the dissolution of various metals constituting the binder material of the cutting blade. Therefore, according to this embodiment, it is possible to provide a pH / redox potential adjusting water manufacturing apparatus and method for use as cooling water for blade cutting that can suppress the exchange frequency of the cutting blade.

[0185] Example

[0186] The present invention will be described in more detail below through examples.

[0187] [Preparation of conditioning water in Example 1]

[0188] use Figure 3The pH / redox potential adjusting water manufacturing apparatus shown uses a hydrogen peroxide removal mechanism to reduce the hydrogen peroxide content to below 30 ppb for pure water. Then, a degassing membrane device 5 is used to reduce the dissolved oxygen content in the pure water to below 50 ppb. Based on this, ammonia water is added from the pH adjusting agent tank 24A as adjusting water W1 to produce an ammonia-hydrogen peroxide aqueous solution (ammonia concentration: 1 ppm, pH 9 (23°C), hydrogen peroxide concentration: 30 ppb, redox potential: +0.31 V).

[0189] [Preparation of conditioning water in Example 2]

[0190] As in Example 1, an ammonia-hydrogen peroxide aqueous solution (ammonia concentration: 100 ppm, pH 10 (23°C), hydrogen peroxide concentration: 30 ppb, redox potential: +0.17 V) was prepared as conditioning water W1.

[0191] [Preparation of conditioning water in Example 3]

[0192] As in Example 1, an ammonia-hydrogen peroxide aqueous solution (ammonia concentration: 100 ppm, pH 10 (23°C), hydrogen peroxide concentration: less than 1 ppb, redox potential: +0.15 V) was prepared as conditioning water W1.

[0193] [Preparation of conditioning water in Example 4]

[0194] use Figure 1 The pH / redox potential adjusting water manufacturing apparatus shown uses a hydrogen peroxide removal mechanism to reduce hydrogen peroxide to below 30 ppb for pure water. Then, a degassing membrane device 5 is used to reduce dissolved oxygen in the pure water to below 50 ppb. Based on this, ammonia water is added from the pH adjusting agent tank 4A, and nitrogen is further dissolved using a gas dissolving membrane device. As adjusting water W1, an ammonia-hydrogen peroxide aqueous solution is manufactured (ammonia concentration: 100 ppm, pH 11 (23°C), hydrogen peroxide concentration: less than 1 ppb, redox potential: +0.15V).

[0195] [Preparation of conditioning water in Example 5]

[0196] use Figure 3 The pH / redox potential adjusting water manufacturing apparatus shown uses a hydrogen peroxide removal mechanism to reduce the hydrogen peroxide content to below 30 ppb for pure water. Then, a degassing membrane device 5 is used to reduce the dissolved oxygen content in the pure water to below 50 ppb. Based on this, a sodium hydroxide aqueous solution is added from the pH adjusting agent tank 24A as adjusting water W1 to produce a sodium hydroxide-hydrogen peroxide aqueous solution (sodium hydroxide concentration: 1000 ppm, pH 12 (23°C), hydrogen peroxide concentration: 30 ppb, redox potential: +0.05 V).

[0197] [Preparation of conditioning water in Example 6]

[0198] use Figure 3 The pH / redox potential adjusting water manufacturing apparatus shown uses a hydrogen peroxide removal mechanism to reduce the hydrogen peroxide content to below 30 ppb for pure water. Then, a degassing membrane device 5 is used to reduce the dissolved oxygen content in the pure water to below 50 ppb. Based on this, a sodium hydroxide aqueous solution is added from the pH adjusting agent tank 24A as adjusting water W1 to produce a sodium hydroxide-hydrogen peroxide aqueous solution (sodium hydroxide concentration: 5%, pH 14 (23°C), hydrogen peroxide concentration: 30 ppb, redox potential: -0.20V).

[0199] [The production of conditioning water in Comparative Example 1]

[0200] use Figure 3 The pH / redox potential adjusting water manufacturing apparatus shown uses a hydrogen peroxide removal mechanism to reduce hydrogen peroxide concentration to below 30 ppb for pure water, and then uses a degassing membrane device 5 to reduce dissolved oxygen concentration in the pure water to below 50 ppb, thereby producing ultrapure water (pH below 9 (23°C), hydrogen peroxide concentration: 30 ppb, redox potential: +0.40V) as adjusting water W1.

[0201] [Comparative Example 2: Production of Conditioned Water]

[0202] use Figure 3 The pH / redox potential regulating water manufacturing apparatus shown uses a hydrogen peroxide removal mechanism to reduce hydrogen peroxide to below 30 ppb for pure water. Then, a degassing membrane device 5 is used to reduce the dissolved oxygen content in the pure water to below 50 ppb. Further, carbon dioxide is added to the pure water from the pH adjustment line 24 to produce carbonated water (carbonic acid concentration: 30 ppm, pH below 9 (23°C), hydrogen peroxide concentration: 30 ppb, redox potential: +0.41 V) as regulating water W1.

[0203] (Solubility of Ni film)

[0204] A square test piece of 20 mm×20 mm was cut out from a nickel film-attached substrate with a diameter of 300 mm. The test piece was immersed in the conditioned water of Examples 1 to 6 and Comparative Examples 1 to 2 respectively at 23°C for 20 minutes. The surface of the nickel film of the immersed test piece was observed with an atomic force microscope (AFM, Atomic Force Microscope), and the surface roughness (root mean square roughness (Rms)) was confirmed (the same applies hereinafter). In addition, the amount of nickel eluted into the immersion liquid was analyzed by inductively coupled plasma mass spectrometry (ICP-MS), the dissolution rate of nickel was obtained from the amount of nickel eluted by immersion, and the reliability of the dicing blade was evaluated based on the dissolution rate. Further, the charging potential of the immersed test piece was measured using a surface potentiometer. The results are shown in Table 1.

[0205] It should be noted that the evaluation criteria for the surface roughness of the nickel film are as follows.

[0206] [Surface Roughness]

[0207] Good: The root mean square roughness (Rms) of the nickel film is less than 1 nm.

[0208] Fair: The root mean square roughness (Rms) of the nickel film is 1 nm or more and less than 3 nm.

[0209] Poor: The root mean square roughness (Rms) of the nickel film is 3 nm or more.

[0210] Regarding the reliability of dicing blades, using the conditioned water of Examples 1 to 6 and Comparative Examples 1 to 2, the blade wear amount during dicing with a dicing blade was estimated based on the dissolution rate of nickel. The smaller the wear amount, the better the reliability is evaluated. The prerequisite dicing blade and dicing conditions are shown below. It should be noted that the dissolution rate of nickel is correlated with the blade wear amount during dicing under the following conditions, and the reliability of the blade was evaluated according to the following criteria based on the estimated blade wear amount. Those evaluated as "Good" and "Fair" are regarded as acceptable.

[0211] Workpiece for dicing: 10 silicon wafers (wafer diameter 12 inches, wafer thickness 400 μm).

[0212] Dicing blade: diameter 55 mm, actual thickness 32.5 μm, diamond abrasive grain diameter 2000 nm, concentration 70, bonding material is Ni.

[0213] Dicing conditions: cutting depth 400 μm, feed speed 30 mm / s, spindle speed 30000 rpm, processing time 7 hours, processing water supply rate 2 L / min.

[0214] [Reliability of Dicing Blade]

[0215] Good: Blade wear is less than 20μm.

[0216] Good: The blade wear is greater than 20μm and less than 40μm.

[0217] Defect: The blade wear is greater than 40μm.

[0218] As shown in Table 1, in Examples 1-6, the dissolution rate of Ni was 0.002-0.003 nm / min, indicating a low value. This suggests low consumption of the binder material in the cutting blade. Furthermore, observation of the surface roughness of the nickel film confirmed some surface roughness degradation due to etching, but this was deemed acceptable. Additionally, a charge potential of -1V was observed in all cases. This value is also within the acceptable range.

[0219] On the other hand, as shown in Table 1, in Comparative Example 1, the dissolution rate was 0.004 nm / min, indicating a slightly high value, suggesting high consumption of the binder material in the cutting blade. Furthermore, observation of the surface roughness of the nickel film confirmed degradation due to etching, classifying it as defective. Moreover, the charged potential reached -15V, raising concerns about potential electrostatic damage to the semiconductor device.

[0220] In Comparative Example 2, the dissolution rate was 0.005 nm / min, showing a slightly high value, indicating high consumption of the binder material in the cutting blade. Furthermore, observation of the surface roughness of the nickel film confirmed that it was degraded due to etching, classifying it as defective.

[0221] [Table 1]

[0222] (Solubility in Cu films)

[0223] Square test pieces measuring 20 mm × 20 mm were cut from a 300 mm Φ Cu film-coated substrate. These test pieces were immersed in the conditioning water used in Examples 1–4 and Comparative Examples 1–2 at 23 °C for 20 minutes each. The surface roughness of the Cu film on the immersed test pieces was confirmed by atomic force microscopy (AFM). Furthermore, the amount of Cu dissolved into the immersion solution was analyzed by inductively coupled plasma mass spectrometry (ICP-MS), and the dissolution rate of Cu was determined from the amount of Cu dissolved through immersion. Additionally, the charge potential of the immersed test pieces was measured using a surface potentiometer. The results are shown in Table 2.

[0224] It should be noted that the evaluation criteria for the surface roughness of the Cu film and the evaluation criteria for the reliability of the cutting blade are based on the same criteria as those for the nickel film.

[0225] As shown in Table 2, in Examples 1-4, the dissolution rate of Cu was a low value of 0.001-0.005 nm / min. This indicates low consumption of the binder material in the cutting blade. Furthermore, observation of the surface roughness of the Cu film confirmed some degradation due to etching, but this was deemed acceptable. Additionally, the charged potential was observed to be -1V in all cases. This value is also within a acceptable range.

[0226] On the other hand, as shown in Table 2, in Comparative Example 1, the dissolution rate was 0.05 nm / min, which is a considerably high value, indicating that the consumption of the binder material in the cutting blade was extremely high. Furthermore, observation of the surface roughness of the Cu film confirmed that the surface roughness was degraded due to etching, and was therefore deemed defective. Moreover, the charged potential reached -15V, raising concerns about the possibility of electrostatic damage to the semiconductor device.

[0227] In Comparative Example 2, the dissolution rate was 0.1 nm / min, showing a slightly high value, indicating a large consumption of the binder material in the cutting blade. Furthermore, observation of the surface roughness of the Cu film confirmed that the surface roughness was degraded due to etching, and was therefore deemed defective.

[0228] [Table 2]

[0229] (Solubility in Co membranes)

[0230] Square test pieces measuring 20 mm × 20 mm were cut from a 300 mm Φ Co-coated substrate. These test pieces were immersed in the conditioning water specified in Examples 1–6 and Comparative Examples 1–2 at 23 °C for 20 minutes each. The surface roughness of the Co film on the immersed test pieces was confirmed by atomic force microscopy (AFM). Furthermore, the amount of Co dissolved into the immersion solution was analyzed by inductively coupled plasma mass spectrometry (ICP-MS), and the dissolution rate of Co was determined from the amount of Co dissolved during immersion. The charged potential of the immersed test pieces was further measured using a surface potentiometer. The results are shown in Table 3.

[0231] It should be noted that the evaluation criteria for the surface roughness of the Co film and the evaluation of the reliability of the cutting blade are based on the same criteria as those for the nickel film.

[0232] As shown in Table 3, in Examples 1-6, the dissolution rate of Co was 0.005-0.008 nm / min, indicating a low value. This suggests low consumption of the binder material in the cutting blade. Furthermore, observation of the surface roughness of the Co film confirmed some degradation due to etching, but this was deemed acceptable. Additionally, the charged potential was observed to be -1V in all cases. This value is also within a acceptable range.

[0233] On the other hand, as shown in Table 3, in Comparative Example 1, the dissolution rate was 0.3 nm / min, which is a considerably high value, indicating that the consumption of the binder material in the cutting blade was extremely high. Furthermore, observation of the surface roughness of the Co film confirmed that the surface roughness was degraded due to etching, classifying it as defective. Moreover, the charged potential reached -15V, raising concerns about the possibility of electrostatic damage to the semiconductor device.

[0234] In Comparative Example 2, the dissolution rate was 0.5 nm / min, which is a considerably high value, indicating a large consumption of the binder material in the cutting blade. Furthermore, observation of the surface roughness of the Co film confirmed that the surface roughness was degraded due to etching, classifying it as defective.

[0235] [Table 3]

[0236] Industrial applicability

[0237] The present invention, as cooling water for blade cutting, can suppress the exchange frequency of the cutting blade, and thus has the potential for industrial application.

[0238] Explanation of reference numerals in the attached figures

[0239] 1, 11, 21: pH / redox potential regulating water production device; 2: Supply line; 3: Resin column loaded with platinum group metals (hydrogen peroxide removal mechanism); 4, 14, 24: pH adjuster injection line (pH adjustment device); 5: Degassing membrane device; 6, 16: Gas dissolution device; 7: Storage tank.

Claims

1. A pH / oxidation-reduction potential adjusting water production device, wherein, The pH / oxidation-reduction potential adjusting water production device has the following features: A degassing membrane device having a degassing membrane for removing gases dissolved as impurities from pure water; pH adjustment device, which adjusts the pH of pure water; as well as A dissolving membrane device having a gas dissolving membrane that allows inactive gases to dissolve in pure water. The pH / oxidation-reduction potential adjusting water manufacturing device produces pH 9-14 water with an oxidation-reduction potential of -0.40V or higher and less than +0.40V at 25°C. The oxidation-reduction potential is relative to the oxidation-reduction potential of Ag / AgCl.

2. The pH / oxidation-reduction potential adjusting water production apparatus according to claim 1, wherein, The pH adjustment device, the degassing membrane device, and the dissolving membrane device are arranged sequentially along the direction of pure water flow. The pH adjustment device is a device for adding a liquid pH adjuster to the pure water.

3. The pH / oxidation-reduction potential adjusting water production apparatus according to claim 2, wherein, The pH adjuster is an aqueous solution of at least one selected from the group consisting of ammonia, sodium hydroxide, potassium hydroxide, ammonium tetrahydrogen, choline, methylamine, dimethylamine, and trimethylamine.

4. The pH / oxidation-reduction potential adjusting water production apparatus according to claim 1, wherein, The degassing membrane device and the dissolving membrane device are arranged sequentially along the direction of pure water flow. The pH adjustment device is a device that supplies a pH adjuster of gas to the gas dissolution membrane of the dissolution membrane device. The dissolving membrane device is a device that at least dissolves the pH adjuster in the pure water.

5. The pH / oxidation-reduction potential adjusting water production apparatus according to claim 4, wherein, The pH adjuster is at least one selected from the group consisting of ammonia, methylamine, dimethylamine, and trimethylamine.

6. The pH / oxidation-reduction potential adjusting water production apparatus according to claim 5, wherein, The pH adjuster also contains inactive gases.

7. A pH / oxidation-reduction potential adjusting water production device, wherein, The pH / oxidation-reduction potential adjusting water production device has the following features: A degassing membrane device having a degassing membrane for removing gases dissolved as impurities from pure water; as well as pH adjustment device, which adjusts the pH of pure water. The pH / oxidation-reduction potential adjusting water manufacturing device produces pH 9-14 water with an oxidation-reduction potential of -0.40V or higher and less than +0.40V at 25°C. The oxidation-reduction potential is relative to the oxidation-reduction potential of Ag / AgCl.

8. The pH / oxidation-reduction potential adjusting water production apparatus according to claim 7, wherein, The degassing membrane device and the pH adjustment device are arranged sequentially along the direction of pure water flow. The pH adjusting device is a device that dissolves at least one pH adjusting agent selected from gases and liquids in the pure water.

9. The pH / oxidation-reduction potential adjusting water manufacturing apparatus according to claim 8, wherein, The pH adjuster is an aqueous solution containing at least one selected from the group consisting of at least one selected from the group consisting of ammonia, sodium hydroxide, potassium hydroxide, ammonium tetrahydrogen, choline, methylamine, dimethylamine and trimethylamine.

10. The pH / oxidation-reduction potential adjusting water manufacturing apparatus according to claim 8, wherein, The pH adjuster comprises at least one inactive gas selected from the group consisting of ammonia, methylamine, dimethylamine, and trimethylamine.

11. The pH / oxidation-reduction potential adjusting water production apparatus according to any one of claims 1 to 10, wherein, To produce pH / oxidation-reduction potential adjusted water with pH 9-14, oxidation-reduction potential above -0.40V and less than +0.40V at 25°C, and dissolved oxygen concentration below 50ppb at 25°C, wherein the oxidation-reduction potential is relative to Ag / AgCl.

12. The pH / oxidation-reduction potential adjusting water production apparatus according to any one of claims 1 to 10, wherein, To produce pH / redox potential adjusted water with pH 9-14, redox potential above -0.40V and less than +0.40V at 25°C, and hydrogen peroxide concentration below 30ppb, wherein the redox potential is relative to Ag / AgCl.

13. The pH / oxidation-reduction potential adjusting water production apparatus according to any one of claims 1 to 10, wherein, The method produces pH / oxidation-reduction potential adjusted water with a pH of 9-14, an oxidation-reduction potential of -0.40V and less than +0.40V at 25°C, a dissolved oxygen concentration of less than 50 ppb and a hydrogen peroxide concentration of less than 30 ppb at 25°C, wherein the oxidation-reduction potential is relative to Ag / AgCl.

14. The pH / oxidation-reduction potential adjusting water production apparatus according to any one of claims 1 to 10, wherein, The degassing membrane device has a hydrogen peroxide removal mechanism at the front end for removing hydrogen peroxide dissolved as an impurity from the pure water.

15. The pH / oxidation-reduction potential adjusting water manufacturing apparatus according to any one of claims 1 to 10, wherein, The pH / oxidation-reduction potential adjusting water production device has a supply flow path. The supply path supplies the pH / redox potential-adjusting water as cooling water for the cutting blade, which is formed by fixing diamond abrasive grains with a binder material containing at least one selected from the group consisting of nickel, cobalt, copper, tin, silver, tungsten, and iron.

16. The pH / oxidation-reduction potential adjusting water production apparatus according to any one of claims 1 to 10, wherein, The pH / oxidation-reduction potential adjusting water production device has a supply flow path. The supply path supplies the pH / redox potential regulated water produced therefrom as cooling water in the dicing process of semiconductor manufacturing.

17. A method for producing pH / redox potential regulated water, wherein, The manufacturing method produces pH-adjusted water with a pH of 9–14 and a redox potential of -0.40V or higher and less than +0.40V at 25°C by sequentially performing a pH adjustment step, a degassing step, and a gas dissolution step. The redox potential is relative to the Ag / AgCl redox potential. The pH adjustment process involves adding a liquid pH adjuster to the pure water to adjust its pH. The degassing process is a process of removing dissolved gases, which are impurities, from pure water using a degassing membrane. The gas dissolution process is a process in which inactive gases are dissolved in pure water through a gas dissolution membrane.

18. The method for producing pH / redox potential adjusted water according to claim 17, wherein, The pH adjuster is an aqueous solution containing at least one selected from the group consisting of ammonia, sodium hydroxide, potassium hydroxide, ammonium tetrahydrogen, choline, methylamine, dimethylamine, and trimethylamine.

19. A method for producing pH / redox potential adjusted water, wherein, The manufacturing method produces pH-adjusted water with a pH of 9-14 and a redox potential of -0.40V to less than +0.40V at 25°C by sequentially performing a degassing process and a pH adjustment process. The redox potential is relative to the Ag / AgCl redox potential. The degassing process involves removing gases that are dissolved in pure water as impurities from the pure water using a degassing membrane. The process of adjusting the pH of pure water is a process of supplying a pH adjuster with gas through a gas dissolving membrane to adjust the pH of the pure water.

20. The method for producing pH / redox potential adjusted water according to claim 19, wherein, The pH adjuster is at least one selected from the group consisting of ammonia, methylamine, dimethylamine, and trimethylamine.

21. The method for producing pH / redox potential adjusted water according to claim 20, wherein, The pH adjuster also contains inactive gases.

22. A method for producing pH / redox potential regulated water, wherein, The manufacturing method produces pH-adjusted water with a pH of 9-14 and a redox potential of -0.40V to less than +0.40V at 25°C by sequentially performing a degassing process and a pH adjustment process. The redox potential is relative to the Ag / AgCl redox potential. The degassing process involves removing gases dissolved in pure water as impurities using a degassing membrane. The pH adjustment process is a process of adjusting the pH of pure water by adding at least one pH adjuster selected from gases and liquids.

23. The method for producing pH / redox potential regulated water according to claim 22, wherein, The pH adjuster is an aqueous solution containing at least one selected from the group consisting of ammonia, sodium hydroxide, potassium hydroxide, ammonium tetrahydrogen, choline, methylamine, dimethylamine, and trimethylamine.

24. The method for producing pH / redox potential adjusted water according to claim 22, wherein, The pH adjuster comprises at least one inactive gas selected from the group consisting of ammonia, methylamine, dimethylamine, and trimethylamine.

25. A method for producing pH / redox potential regulated water according to any one of claims 17 to 24, wherein, To produce pH / oxidation-reduction potential adjusted water with pH 9-14, oxidation-reduction potential above -0.40V and less than +0.40V at 25°C, and dissolved oxygen concentration below 50ppb at 25°C, wherein the oxidation-reduction potential is relative to Ag / AgCl.

26. The method for producing pH / redox potential regulated water according to any one of claims 17 to 24, wherein, To produce pH / redox potential adjusted water with pH 9-14, redox potential above -0.40V and less than +0.40V at 25°C, and hydrogen peroxide concentration below 30ppb, wherein the redox potential is relative to Ag / AgCl.

27. A method for producing pH / redox potential regulated water according to any one of claims 17 to 24, wherein, The method produces pH / oxidation-reduction potential adjusted water with a pH of 9-14, an oxidation-reduction potential of -0.40V and less than +0.40V at 25°C, a dissolved oxygen concentration of less than 50 ppb and a hydrogen peroxide concentration of less than 30 ppb at 25°C, wherein the oxidation-reduction potential is relative to Ag / AgCl.

28. The method for producing pH / oxidation-reduction potential regulated water according to claim 17, wherein, A hydrogen peroxide removal process is performed before the pH adjustment process. This hydrogen peroxide removal process is a process of removing hydrogen peroxide, which is dissolved in pure water as an impurity, from pure water.

29. The method for producing pH / oxidation-reduction potential regulated water according to claim 19 or claim 22, wherein, A hydrogen peroxide removal process is performed before the degassing process. This hydrogen peroxide removal process is a process of removing hydrogen peroxide, which is dissolved in pure water as an impurity, from pure water.

30. A method for manufacturing a semiconductor device, wherein, The pH / redox potential-adjusting water manufactured by the method of manufacturing pH / redox potential-adjusting water according to any one of claims 17 to 24 is used as cooling water for cutting blades, the cutting blades being formed by fixing diamond abrasive grains with a metal layer comprising at least one selected from the group consisting of nickel, cobalt, copper, tin, silver, tungsten and iron.

31. A method for manufacturing a semiconductor device, wherein, The pH / redox potential-adjusted water manufactured by the method for manufacturing pH / redox potential-adjusted water according to any one of claims 17 to 24 is used as cooling water in the cutting process of a semiconductor manufacturing process.

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