Lighting device and emblem for automotive parts

Abstract

The lighting device according to an embodiment of the present application includes a substrate, a plurality of light emitting devices disposed on the substrate, a light-transmissive cover disposed on the plurality of light emitting devices, and a resin layer disposed between the substrate and the light-transmissive cover, wherein the resin layer covers the plurality of light emitting devices, the light-transmissive cover includes a plurality of convex portions and a plurality of concave portions, and the resin layer can have protruding portions disposed in the plurality of convex portions, respectively.

Description

Technical Field

[0001] Embodiments of the present invention relate to a lighting device and an emblem on a car part having the lighting device. Embodiments also relate to a method for manufacturing the lighting device or the emblem. Background Technology

[0002] Lighting applications extend beyond vehicle illumination to include backlighting for displays and signage. For example, light-emitting diodes (LEDs) offer advantages over traditional light sources like fluorescent and incandescent lamps, such as lower power consumption, longer lifespan, faster response times, higher safety, and environmental friendliness. These LEDs are used in various lighting fixtures, including displays, indoor lights, and outdoor lights. Recently, the use of LEDs as vehicle light sources has been proposed. Compared to incandescent lamps, LEDs offer lower power consumption. However, due to the smaller angle of incidence of light emitted by LEDs, the luminous area of ​​the fixtures using LEDs in vehicle lighting needs to be increased. The small size of LEDs allows for greater design freedom, and their longer lifespan makes them economical. Currently, research and development are underway to apply LED modules as lighting devices to various vehicle components. Summary of the Invention

[0003] The technical problem that the invention aims to solve

[0004] Embodiments of the present invention provide a lighting device using a decorative film. Embodiments of the present invention provide a lighting device using a decorative film with a logo. Embodiments of the present invention provide a lighting device or logo integrally formed with a light-transmitting cover and a resin layer. Embodiments of the present invention provide a lighting device that transmits light through the logo design on the front surface, rear surface, and steering wheel surface of a vehicle. Embodiments of the present invention provide a lighting device for a logo with a sensing element and emitting light. Embodiments of the present invention provide a lighting device or logo in which a light-transmitting cover and a light-emitting module are sealed by a molding part. Embodiments of the present invention can provide a mobile tool or vehicle having the above-described lighting device or logo.

[0005] Technical means for solving technical problems

[0006] The lighting device according to an embodiment of the present invention includes: a substrate; a plurality of light-emitting devices disposed on the substrate; a light-transmitting cover disposed on the plurality of light-emitting devices; and a resin layer disposed between the substrate and the light-transmitting cover, wherein the resin layer covers the plurality of light-emitting devices, the light-transmitting cover includes a plurality of protrusions and a plurality of recesses, and the resin layer may have protrusions respectively disposed in the plurality of protrusions.

[0007] According to an embodiment of the present invention, the upper surface of the resin layer may have the same shape as the protrusions and recesses of the light-transmitting cover. The light-transmitting cover may contact the upper surface and side surfaces of the resin layer. The plurality of light-emitting devices may overlap with at least one recess of the light-transmitting cover in the vertical direction, and the plurality of light-emitting devices may not overlap with the protrusions of the light-transmitting cover in the vertical direction.

[0008] According to an embodiment of the present invention, a light-shielding film is included between the light-transmitting cover and the plurality of light-emitting devices. The light-shielding film is disposed on the lower surface of the recess of the light-transmitting cover and can face the plurality of light-emitting devices.

[0009] The lighting device according to an embodiment of the present invention may include: a light-emitting module, which includes a substrate, a plurality of light-emitting devices electrically connected to the substrate, and a resin layer disposed on the substrate and sealing the plurality of light-emitting devices; a light-transmitting cover having a space inside for accommodating the light-emitting module; a molding part that seals the surface of the substrate of the light-emitting module, the side surface of the light-emitting module, and the light-transmitting cover; and a sealing space that is sealed between the resin layer of the light-emitting module and the light-transmitting cover.

[0010] According to an embodiment of the present invention, the light-transmitting cover may include a film covering layer and a light-transmitting layer disposed inside the film covering layer. The light-transmitting cover includes a light-transmitting portion of a resin layer facing the light-emitting module and a sidewall covering the periphery of the light-emitting module. The molding portion may include an extension portion extending between the sidewall of the light-transmitting cover and the side surface of the light-emitting module.

[0011] According to an embodiment of the present invention, the light-transmitting cover includes a module support portion supporting the lower periphery of the light-emitting module, and the molded portion can contact the side surface of the resin layer of the light-emitting module and the upper surface of the module support portion. The sidewall of the light-transmitting cover may include a vertical lower inner surface and an upper inner surface that slopes outward from the lower inner surface.

[0012] According to an embodiment of the present invention, the sidewall of the light-transmitting cover includes a lower receiving portion, the lower part of an extension of the molded portion is fixed to the lower receiving portion, the lower receiving portion includes a groove extending outward from the inclined lower end of the sidewall, and the molded portion can fill the lower receiving portion. The lower receiving portion may include a groove located below the lower surface of the light-emitting module. The molded portion can seal a connector or signal cable connected to the substrate.

[0013] According to an embodiment of the present invention, the light-transmitting cover includes a plurality of protrusions and a plurality of recesses in the light-emitting area. A light-shielding film is disposed on the upper or lower surface of the recesses. The plurality of light-emitting devices overlap with at least one of the recesses of the light-transmitting cover in the vertical direction, and the plurality of light-emitting devices may not overlap with the protrusions of the light-transmitting cover in the vertical direction. According to an embodiment of the present invention, the light intensity emitted through the protrusions is higher than the light intensity emitted through the recesses, and the protrusions of the light-transmitting cover may correspond to the shape of the logo design.

[0014] The logo of an automotive component according to an embodiment of the present invention includes: a light-transmitting cover having a protrusion on its outer side corresponding to the shape of the logo design; and an illumination device having a light-shielding film disposed on the inner or outer side of the light-transmitting cover, wherein the illumination device is the illumination device as described in claim 1 or 6, wherein the light-transmitting cover has a recess below the protrusion, and the recess may include a black printed layer on its inner side.

[0015] Invention Effects

[0016] According to embodiments of the present invention, the light extraction efficiency of logos on automotive components can be improved. The physical strength of the cover forming the logo can be increased, and the internal light-emitting module can be protected from external influences. According to embodiments of the present invention, the space between the light-emitting module and the cover can be eliminated, thereby improving light extraction efficiency.

[0017] According to embodiments of the present invention, the number of components constituting the logo can be reduced, thereby improving the defect rate and reliability of the components, reducing the material cost of the components, and shortening the manufacturing process. The cover and the light-emitting module can be integrated, thereby reducing the overall thickness of the logo and increasing design freedom.

[0018] According to embodiments of the present invention, by providing a sealed space between the light-emitting module and the light-transmitting cover, the diffusion efficiency of light emitted from the light-emitting module can be improved. Furthermore, by reducing the number of components constituting the logo, the defect rate can be improved, component reliability increased, component material costs reduced, manufacturing process shortened, and the defect rate due to component assembly reduced. According to embodiments of the present invention, the cover and the light-emitting module are integrated through a molding section, thereby providing a waterproof component, reducing the overall thickness of the logo, and increasing design freedom. According to embodiments of the present invention, the internal sealed space between the cover and the light-emitting module can buffer external impacts and prevent damage to the internal module.

[0019] According to embodiments of the present invention, the light uniformity of the logo can be improved. Furthermore, the optical reliability of the lighting device and the logo can be improved. Attached Figure Description

[0020] Figure 1 This is a perspective view showing a lighting device according to a first embodiment of the present invention.

[0021] Figure 2 yes Figure 1 A magnified view of a portion of the image.

[0022] Figure 3 yes Figure 2 Another example of a light-blocking film.

[0023] Figure 4 yes Figure 1 Another example of a lighting device.

[0024] Figure 5 yes Figure 1 An example of a lighting device with radar elements.

[0025] Figure 6 yes Figure 1 Another example of a lighting device.

[0026] Figure 7 and Figure 8 It is shown Figure 1 A diagram illustrating the manufacturing process of a lighting device.

[0027] Figure 9 (a) and (b) show examples of the off / on states of a car logo using the lighting device according to the embodiment.

[0028] Figure 10 This is a perspective view showing a lighting device according to a second embodiment of the present invention.

[0029] Figure 11 yes Figure 10 A magnified view of a portion of the image.

[0030] Figure 12 It is shown Figure 10 The first example of a light-transmitting cover and a light-emitting module is shown in the figure.

[0031] Figure 13 It is shown Figure 10 The diagram shows a second example of a light-transmitting cover and a light-emitting module.

[0032] Figure 14 It is shown Figure 10 The diagram shows a third example of a light-transmitting cover and a light-emitting module.

[0033] Figures 15 to 17 It is shown Figure 10 A diagram illustrating the manufacturing process of a lighting device.

[0034] Figure 18 It is shown Figure 10 A cross-sectional view of the first modified example of the lighting device.

[0035] Figure 19 It is shown Figure 10 A cross-sectional view of a second variant of the lighting device.

[0036] Figure 20 It is shown Figure 10 A cross-sectional view of the third variant of the lighting device.

[0037] Figure 21 (a), (b), and (c) in the text are examples of the application of... Figure 10The front view of the logo of the lighting fixture, a cross-sectional view along side AA, and enlarged views of areas A1 and A2.

[0038] Figure 22 This is a cross-sectional view showing the detailed structure of the layers of the light-transmitting cover according to the first and second embodiments of the present invention. Detailed Implementation

[0039] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings to enable those skilled in the art to readily implement the present invention. However, it should be understood that the embodiments described in this specification and the configurations depicted in the drawings are merely preferred embodiments of the present invention and can be replaced by various equivalents and modifications at the time of filing this application. In describing the working principle of the preferred embodiments of the present invention in detail, detailed descriptions of well-known functions or configurations are omitted if it is deemed unnecessary to obscure the gist of the invention. The terms described below are defined in consideration of their function in the present invention, and the meaning of each term should be interpreted based on the context of this specification. In all the drawings, the same reference numerals are used for components having similar functions and effects.

[0040] The lighting device according to the present invention can be applied to various lighting devices requiring illumination, such as vehicle lamps, household lighting devices, and industrial lighting devices. For example, when applied to vehicle lamps, the lighting device can be used for logos. These logos are affixed to the surface or appearance of products manufactured by an automotive company to make consumers remember that they are products of that company. In other words, a logo is a simple sign representing a specific company or organization, such as a company name, organization, company mark or logo, or a combination thereof, which takes the form of a shape, symbol, or a combination thereof. The following embodiments will be clearly illustrated by way of the accompanying drawings and description of the embodiments. In the description of the embodiments, when layers (films), areas, patterns, or structures are described as being formed "on" or "below" a substrate, "on" and "below" include both "directly" formed and "indirectly" formed through another layer. Furthermore, the references for "on" or "below" layers will be explained based on the accompanying drawings.

[0041] Reference Figures 1 to 9 The lighting device according to the first embodiment of the present invention is described.

[0042] Reference Figures 1 to 6According to a first embodiment of the present invention, the lighting device 400 may include a housing 201, a light-emitting module 200, and a light-transmitting cover 230. The lighting device 400 may be an integrally formed device with a logo design of a mobile device (e.g., a drone, airplane, or automobile). The logo design may be a logo set on the surface or appearance of a product. The logo design may include luminous and non-luminous areas. The luminous area may be an area corresponding to the logo or a portion thereof. The non-luminous area may be an area other than the logo.

[0043] The lighting device 400 can be a structure or component where the light-transmitting cover 230 and the light-emitting module 200 are integrally formed, and there is no air layer inside. Therefore, the thickness T1 of the lighting device 400, which is the vertical distance from the bottom of the housing 201 to the top of the light-transmitting cover 230, can be less than 10 mm. By setting the thickness T1 of the lighting device to less than 10 mm, a slim logo can be provided. Furthermore, since the thickness T1 of the lighting device 400 is thin, less than 10 mm, a flexible logo can be provided. The thickness T1 of the lighting device 400 can be less than 10 mm, for example, in the range of 3 mm to 10 mm or 5 mm to 7 mm. If the thickness T1 of the lighting device 400 is less than the above range, the brightness of the illumination may be reduced, and the rigidity of the logo may be deteriorated. If the thickness T1 exceeds the above range, material may be wasted, and to prevent a decrease in brightness, the number of light-emitting devices 212 may increase, and the increase in logo size may lead to damage due to external impact.

[0044] The housing 201 is part of the logo assembly and can cover the area of ​​the automotive component where the logo is mounted. The housing 201 can be formed of an insulating material and can provide electrical insulation when the connector 203 is connected to the substrate 210. The housing 201 can be formed of a transparent or opaque material (e.g., metal or non-metal). The housing 201 can be formed by a molding process. The housing 201 can be located in the area where the logo design (e.g., emblem) of the vehicle is formed, which can be at least one of the front, rear, side, interior, or airbag area of ​​the vehicle. The housing 201 can be defined as a support for the logo, or as the bottom of the entire bottom of the logo. An example of the logo can be implemented as a white area, such as... Figure 9 As shown.

[0045] The light-emitting module 200 may include a substrate 210 and a plurality of light-emitting devices 212 disposed on the substrate 210. The light-emitting module 200 may also include a resin layer 220. The substrate 210 may be disposed inside the upper surface of the housing 201. The lower surface of the substrate 210 may be smaller than the area of ​​the upper surface of the housing 201. The resin layer 220 may extend to the upper and side surfaces of the substrate 210 and may contact the upper surface of the housing 201. Therefore, the resin layer 220 may seal the top and side surfaces of the substrate 210.

[0046] The substrate 210 includes a printed circuit board (PCB), and may include, for example, a resin-based PCB, a metal-core PCB, a flexible PCB, a ceramic PCB, or an FR-4 substrate. The substrate 210 can be a flexible substrate or a non-flexible substrate. A circuit pattern may be disposed on the upper part of the substrate 210. The circuit pattern of the substrate 210 may include multiple pads in the area corresponding to the light-emitting device 212. The substrate 210 may include wiring electrically connected to the connector 203, and multiple light-emitting devices 212 may be electrically connected to this wiring.

[0047] The light-emitting device 212 may include an LED chip or a package in which an LED chip is encapsulated. The light-emitting chip may emit at least one of blue, red, green, and ultraviolet (UV) light. The light-emitting device 212 may emit at least one of white, blue, red, and green light. As another example, the light-emitting device 212 may be implemented as an OLED. Multiple light-emitting devices 212 may be connected in series or in parallel. Multiple light-emitting devices 212 may be connected in parallel or in series-parallel connection so that they can be driven individually in each region.

[0048] One or more of the multiple light-emitting elements 212 can be arranged in different areas. The multiple light-emitting elements 212 can be arranged in areas that do not overlap with the logo design in the vertical direction. The multiple light-emitting elements 212 can be spaced apart from each other by area, for example, they can be arranged in areas between adjacent logo designs or in areas outside the logo design. When a logo (such as...) Figure 9 When the logo design shown is implemented by the protrusion 231 of the light-transmitting cover 230, multiple light-emitting devices 212 can be arranged in the area below the protrusion 231, or in the lower part of the outer region adjacent to the protrusion 231.

[0049] A resin layer 220 is disposed on the substrate 210 and can seal the plurality of light-emitting devices 212. The resin layer 220 extends to the upper surface and side surface of the substrate 210 and can seal the substrate 210. The lower surface area of ​​the resin layer 220 can be set to be larger than the upper surface area of ​​the substrate 210. In addition, the length of the lower surface of the resin layer 220 in one direction can be set to be greater than the length of the substrate 210 in one direction. Since the resin layer 220 seals the light-emitting devices 212 and the substrate 210, the moisture resistance of the plurality of light-emitting devices 212 and their circuits can be improved. The resin layer 220 can contact the inner surface of the light-transmitting cover 230. The resin layer 220 can contact the inner surface of the protrusion 231 and the inner surface of the recess 232 of the light-transmitting cover 230. When the light-transmitting cover 230 extends to the side surface of the resin layer 220, the outer surface of the resin layer 220 can contact the inner surface of the outer surface 235 of the light-transmitting cover 230.

[0050] The resin layer 220 includes a light guide portion 222 and a diffuser portion 221. The light guide portion 222 has a plurality of light-emitting devices 212 inside and guides the light emitted from the plurality of light-emitting devices 212 to the diffuser portion 221. The diffuser portion 221 diffuses the light transmitted through the light guide portion 222 into a uniform light distribution, and the diffused light is emitted through the light-transmitting cover 230. The light guide portion 222 of the resin layer 220 is located in the area between or outside the logo design and can be configured in at least one or more ways. Each of the plurality of light guide portions 222 may have one or more light-emitting devices 212 inside. That is, each of the light guide portions 222 may overlap with the light-emitting devices 212 in the vertical direction.

[0051] The diffuser 221 can be disposed on one side, inside, or between the light guides 222, and can be configured in one or more ways. The diffuser 221 can be a region without a light-emitting device 212, or a region spaced apart from a region with a light-emitting device 212. The diffuser 221 can be configured not to overlap with the light-emitting device 212 in the vertical direction. The diffuser 221 has an upwardly protruding protrusion P1. The protrusion P1 can have a shape corresponding to the shape of the logo design. The protrusion P1 can be provided with an inclined outer surface, and the upper surface and the inclined surface of the protrusion P1 can serve as light-emitting surfaces, thereby enhancing the three-dimensionality of the emitted light.

[0052] The protrusion P1 of the resin layer 220 can protrude toward the convexity 231 of the light-transmitting cover 230. When viewed from a side cross-section, the number of protrusions P1 can be the same as the number of convexities 231. When viewed from a cross-section along the length of the logo, the length of the protrusion P1 can extend along the inner length direction of the convexity 231, and the length of the upper surface of the protrusion P1 can be the same as the length of the inner surface of the convexity 231. When viewed from a cross-section along the width of the logo, the width of the upper surface of the protrusion P1 can be the same as the width of the inner surface of the convexity 231. The shape of the protrusion P1 can be the same as the shape of the convexity 231. Thus, the surface of the resin layer 220 can contact the entire inner surface of the light-transmitting cover 230. That is, the resin layer 220 can be integrally formed on the inner side of the light-transmitting cover 230.

[0053] like Figure 2 As shown, the thickness T4 of the resin layer 220 can be less than 4 mm, for example, in the range of 2 mm to 4 mm, or in the range of 2.5 mm to 3.5 mm. The thickness T4 of the resin layer 220 is the vertical distance from the upper surface of the substrate 210 to the surface of the protrusion P1 with the maximum height, and is the maximum thickness. If the maximum thickness T4 of the resin layer 220 is less than the above range, the height of the protrusion P1 is reduced, and the three-dimensionality or engraving effect of the logo may be degraded; if it is greater than the above range, the improvement in the three-dimensionality or engraving effect of the logo may be negligible. The minimum thickness T3 of the resin layer 220 is the thickness within the recess 232, or the vertical distance between the substrate 210 and the upper surface of the recess 232 (see...). Figure 2 The minimum thickness T3 of the resin layer 220 can be less than 3 mm, for example, in the range of 1.5 mm to 2.5 mm. If the minimum thickness T3 of the resin layer 220 is less than this range, the light guiding efficiency may decrease; if it is greater than this range, the light extraction efficiency may decrease. The resin layer 220 can be a resin material such as silicone resin or epoxy resin, or it can contain at least one of plastic resin materials, such as polyester (PET) film, PMMA (polymethyl methacrylate) material, or PC (polycarbonate). Preferably, the resin layer 220 can be silicone resin or PMMA. Here, as Figure 2 As shown, a reflective layer 215 can be disposed between the resin layer 220 and the substrate 210. The reflective layer 215 can have multiple holes for the insertion of the light-emitting device 212 and can be formed on the upper surface of the substrate 210. The reflective layer 215 can reflect light emitted from the light-emitting device 212. The area of ​​the reflective layer 215 can be smaller than the area of ​​the upper surface of the substrate 210 and can be in contact with the lower surface of the resin layer 220.

[0054] A light-shielding film 240 may be disposed between the resin layer 220 and a portion of the light-transmitting cover 230. The light-shielding film 240 has an open area OP1 within it (see [reference needed]). Figure 7A light-shielding film 240 is formed on the lower surface of the light-transmitting cover 230 and can overlap or face the light-emitting device 212 in the vertical direction. The light-shielding film 240 can be printed on the lower surface of the light-transmitting cover 230 in single or multiple layers. The light-shielding film 240 contains a reflective material within the resin material, such as one of TiO2, Al2O3, CaCO3, BaSO4, and silicon, and can be printed in single or multiple layers. The light-shielding film 240 is a material that does not completely block incident light, and its transmittance can be less than 10% or less than 5%. The aforementioned light-shielding film 240 can be disposed on all or part of the lower surface of the recess 232 of the light-transmitting cover 230. Because the light-shielding film 240 is disposed on the lower surface of the recess 232 of the light-transmitting cover 230, a brightness difference and a three-dimensional effect can be provided between the protrusion 231 and the recess 232 of the light-transmitting cover 230. To enhance the light-shielding effect on the light emitted from the light-emitting device 212, the edge of the light-shielding film 240 can be positioned further outward than the outermost light-emitting device 212 located below the recess 232. That is, the light-emitting device 212 can be spaced apart from the edge of the recess 232 by a predetermined distance, which can be more than 1.5 times or more than 2 times the spacing between adjacent light-emitting devices 212, and can be more than 1.5 times when considering the light pointing angle of the light-emitting device 212.

[0055] The thickness of the light-shielding film 240 can be greater than 100µm, for example, in the range of 100µm to 200µm. If the thickness of the light-shielding film 240 is less than the above range, hotspots may be generated; if it is greater than the above range, the improvement in light-shielding efficiency is negligible, and the distance between the light-emitting device 212 and the light-shielding film 240 may decrease, thereby reducing the light guiding effect.

[0056] The light-transmitting cover 230 may comprise a resin or plastic material, such as a decorative film or PMMA. The light-transmitting cover 230 can be formed using molding equipment (e.g., in-mold equipment). As another example, the light-transmitting cover 230 can be formed using molding equipment (e.g., out-mold equipment). The light-transmitting cover 230 can be formed after printing the light-shielding film 240. The decorative film can represent designs such as images, text, colors, metallic textures, matte finishes, and textures, and can include various functions such as surface properties, electrical, electromagnetic, and optical functions. Furthermore, the decorative film before molding facilitates the printing or deposition of the light-shielding film 240.

[0057] The thickness of the light-transmitting cover 230 can be less than 1 mm, for example, 0.25 mm to 0.5 mm. If it is less than the above range, the strength may be reduced, and the design shape may be unclear. If it is greater than the above range, the material cost may increase, molding may be difficult, and the light transmittance may decrease. The light-transmitting cover 230 includes protrusions 231 and recesses 232. The protrusions 231 can be provided individually or in multiples, or they can be provided continuously or discontinuously. The recesses 232 can be provided on the inner or outer side of the protrusions 231, or they can be provided in the regions R4, R5, and R6 between the protrusions 231 respectively. The protrusions 231 can be provided in the regions R1, R2, and R3 between the recesses 232 of the light-transmitting cover 230 on one side, the other side, or between them. The intensity of the light emitted through the protrusions 231 can be higher than the intensity of the light emitted through the recesses 232.

[0058] The area of ​​the protrusion 231 is set to white or transparent, and the area of ​​the recess 232 is set to black or opaque. This means that when the light-transmitting cover 230 is multi-layered, the areas of the protrusion 231 and the areas of the recess 232 can have different layering structures. For example, a black ink layer is provided on the inside of the recess 232, so that it is covered in black when viewed from the outside; no black ink layer is provided on the inside of the protrusion 231, so it can be set to white or transparent. The depth T2 of the recess 232 is from the upper surface of the protrusion 231 (see...). Figure 2 The depth of the recess 232 toward the substrate 210 can be 0.3 mm or more, for example, in the range of 0.3 mm to 0.5 mm. If the depth T2 of the recess 232 is less than the above range, the three-dimensionality between the recess 232 and the protrusion 231 may be negligible, and the contrast difference may be reduced.

[0059] like Figure 9As shown, the protrusion 231 can project along the shape of a logo design, such as an emblem. The shape of the protrusion 231 can correspond to the shape of the emblem. At least one of the protrusions 231 can have a convex surface between its edges in the longitudinal direction. The light-transmitting cover 230 includes an outer portion 235, which can extend to the outside of the resin layer 220. The outer portion 235 can extend to the entire side of the resin layer 220 and can extend to the outside of the side of the substrate 210. The outer portion 235 can contact or adhere to the housing 201. The light-emitting module 200 and the resin layer 220 can be disposed in the area between the light-transmitting cover 230 and the housing 201. This logo for automotive parts can provide a thin thickness, thereby increasing design freedom; and since the resin layer 220 contacts the substrate 210 and the light-transmitting cover 230, materials with different refractive indices are not required, thereby improving light extraction efficiency. Traditionally, the resin layer 220 is formed smaller than the upper surface of the substrate 210, so moisture may seep in through the side of the substrate 210; if moisture seeps into the substrate 210, electrical reliability may be reduced and the lifespan of the logo may be shortened.

[0060] This invention provides an air-free region between the light-transmitting cover 230 and the resin layer 220. Therefore, light extraction efficiency is improved because light traveling through the resin layer 220 exits through the light-transmitting cover 230. Furthermore, since the light-transmitting cover 230 and the resin layer 220 are integrally formed, the logo thickness can be set to be at least 50% thinner than existing logos, thereby improving waterproof performance and design freedom. Additionally, since the resin layer 220 covers the side surface of the substrate 210, the electrical reliability of the substrate 210 is improved, and the shortening of the logo's lifespan is prevented. Moreover, the resin layer 220, made of silicone or PMMA, has a light transmittance of at least 90%, thereby improving light extraction efficiency.

[0061] like Figure 3 As shown, the light-shielding film 240 can be located within the recess 232 of the light-transmitting cover 230. The light-shielding film 240 can be disposed on the upper or lower surface of the recess 232 of the light-transmitting cover 230 to overlap with the light-emitting device 212 in the vertical direction. Since the light-shielding film 240 is disposed on the recess 232 of the light-transmitting cover 230, the contact force between the resin layer 220 and the light-transmitting cover 230 can be improved. As another example, the light-shielding film 240 can be configured to overlap with the light-emitting device 212 in the vertical direction in a region spaced apart from the inner side of the light-transmitting cover 230 or from the surface of the recess 232. The light-shielding film 240 can be integrally formed on the inner side of the light-transmitting cover 230 and can include black ink or white reflective material.

[0062] The first region R1 of the protrusion 231 of the light-transmitting cover 230 may be provided with a light-shielding pattern 237. For example... Figure 4As shown, a light-shielding pattern 237 can be formed on the surface of the protrusion 231 of the light-transmitting cover 230. The light-shielding pattern 237 can be disposed on the upper surface of the protrusion 231 of the light-transmitting cover 230. The light-shielding pattern 237 can include a light-shielding structure such as a matrix, mesh, or grid pattern. The pattern can include a shape with a polygonal upper surface or side cross-section, a circle, or a portion of the pattern having a curve. Light can be emitted through the open area 238 where the light-shielding pattern is absent, and the design of the main logo portion can be diversified with different patterns when viewed from the outside. Furthermore, as... Figure 9 As shown, the light-shielding pattern 237 allows the text, logo, or symbol in the emblem to be revealed through the open area 238 on the first region R1. The light-shielding pattern 237 can be printed on the first region R1. Here, the light-shielding pattern 237 can be printed on the adhesive layer 236 on the light-transmitting cover 230. The adhesive layer 236 can be made of resin material or adhesive material and can be removed. The light-shielding pattern 237 can be implemented as a single layer or multiple layers. As another example, the light-shielding pattern 237 can be provided on the lower or upper surface of the protrusion 231 on the first region R1 of the light-transmitting cover 230. The light-shielding pattern 237 can have an open area on the lower or upper surface of the protrusion 231 and can be printed together with or separately from the light-shielding film 240.

[0063] The logo may include a sensing element 260 inside. For example... Figure 5 As shown, the sensing element 260 can be disposed on the upper part of the substrate 210 and has an electrode pattern (not shown). As another example, if the electrode pattern is made of a transparent material, the sensing element 260 can be a radar element disposed inside the light-transmitting cover 230. When a logo with a radar element is provided, the radar element transmits a signal through the light-transmitting cover 230 using a predetermined wavelength (i.e., a wavelength of less than 10 mm or less). That is, the radar element can sense external objects in front of or behind the vehicle and provide this signal to the user or the vehicle control system. The sensing element 260 emits electromagnetic waves in the radio frequency band of 30 to 300 GHz with a wavelength less than 10 mm, thus enabling accurate sensing of complex road conditions.

[0064] like Figure 6As shown, since the light-transmitting cover 230 is a decorative film, it can have an electrode pattern on its inner side or lower surface. When the transparent electrode pattern is set on the lower surface of the light-transmitting cover 230, the light-emitting device 212 can be mounted on the electrode pattern on the lower surface of the recess 232 of the light-transmitting cover 230. Since the light-emitting device 212 is mounted on the lower surface of the recess 232, the resin layer 220 seals the sides and lower surface of the light-emitting device 212. Furthermore, the reflective layer 215 can be formed on the surface of the housing 201, and a separate substrate is no longer required. Therefore, the thickness of the logo can be further reduced. The light-shielding film 240 can have multiple holes 242 through which each light-emitting device 212 passes. After the electrode pattern is formed on the lower surface of the recess 232 of the light-transmitting cover 230, the light-shielding film 240 can be printed, the light-emitting device 212 can be mounted on the electrode pattern, and then covered with the resin layer 220. The electrode pattern can be made of transparent or opaque material and can be formed as a single layer or multiple layers. If the black ink layer is disposed on the inside of the light-transmitting cover 230, the electrode pattern can be formed of an opaque material. In this way, the light-transmitting cover 230 is configured as a logo with a structure that integrally includes a light-shielding film 240, a resin layer 220, and a light-emitting device 212, and can therefore be flexible due to its thinner thickness, and can improve the bonding strength with the housing 201 or automotive parts.

[0065] The method for manufacturing a lighting device or logo according to the first embodiment is as follows.

[0066] Reference Figure 7 and Figure 8 ,like Figure 7 As shown in (a) and (b), a light-shielding film 240 is printed on the surface of the light-transmitting cover 230. The light-shielding film 240 may include a portion corresponding to the protrusion 231 (see Figure 231). Figure 1 The open area OP1. Afterwards, as... Figure 7 As shown in (b), the light-transmitting cover 230 is thermally compressed using an in-mold forming device to form the protrusion 231. The protrusion 231 of the light-transmitting cover 230 can be a region without the light-shielding film 240. The inclined surface 233 connected to the protrusion 231 of the light-transmitting cover 230 can be a region without the light-shielding film 240 or a region with the light-shielding film 240 formed. Furthermore, the outer surface 235 of the light-transmitting cover 230 protrudes in the opposite direction to the protrusion 231 to form the internal space SP1.

[0067] like Figure 7As shown in (b) and (c), the liquid resin layer 220 is dispensed into the internal space SP1 of the light-transmitting cover 230. The liquid resin layer 220 fills the internal space of the light-transmitting cover 230 and can form a thickness up to the height of the outer surface 235. Therefore, the space SP1 between the light-transmitting cover 230 and the resin layer 220 can be filled without an air layer, thereby preventing a decrease in light extraction efficiency.

[0068] like Figure 8 (a) and Figure 8 As shown in (b), a substrate 210 with multiple light-emitting devices 212 mounted on its lower part is joined to a housing 201, and then pressed against the material of a resin layer 220 before curing. The positions of the multiple light-emitting devices 212 can be aligned to correspond to the recesses of the light-transmitting cover 230, and then the substrate 210 and the housing 201 can be pressed against the resin layer 220 within the light-transmitting cover 230. The multiple light-emitting devices 212 can be embedded below the upper surface of the resin layer 220, and the substrate 210 can also be embedded below the upper surface of the resin layer 220. Subsequently, when the resin layer 220 cures, the substrate 210 can be bonded within the resin layer 220, and the housing 201 can contact the resin layer 220 and the exterior 235 of the light-transmitting cover 230. Therefore, since the housing 201 is in contact with the exterior 235 of the light-transmitting cover 230, the internal space SP1 of the light-transmitting cover 230 is sealed. Therefore, the waterproof characteristics of the components between the light-transmitting cover 230 and the housing 201 can be improved. Therefore, since the light-emitting module 200 is integrally embedded in the light-transmitting cover 230 having a resin layer 220, the waterproof efficiency of the electrical pattern of the light-emitting device 212 and the substrate 210 can be improved, the electrical reliability of the logo can be improved, and the shortening of component life can be prevented.

[0069] like Figure 22 As shown, the light-transmitting cover 230 may include a support layer 31, a light-transmitting layer 32, adhesive layers 33 and 34, printed layers 36 and 37, and a protective layer 35. The light-transmitting cover 230 will be described using a decorative film as an example. The support layer 31 provides support for strength and mechanical properties and may be a substrate sheet selected from synthetic resins, fibers, paper, etc. The support layer 31 is not particularly limited, but may be a thermoplastic substrate sheet, including at least one selected from, for example, acrylonitrile-butadiene-styrene (ABS) resin, polycarbonate (PC), polyvinyl chloride (PVC), polyurethane (PU, TPU, etc.), and polyolefins such as polyethylene (PE) and polypropylene (PP). The support layer 31 serves as a molding adhesive and can be removed after film manufacturing.

[0070] The light-transmitting layer 32 is a layer made of a high-transmittance plastic material and may include at least one of polyester (PET) film, PMMA (polymethyl methacrylate) material, or PC (polycarbonate). To provide support, the thickness of the light-transmitting layer 32 may be formed to be greater than 50 μm, for example in the range of 50 μm to 100 μm.

[0071] Adhesive layers 33 and 34 can be bonded between the light-transmitting layer 32 and the protective layer 35. Adhesive layers 33 and 34 may include a first adhesive layer 33 located on the light-transmitting layer 32 and a second adhesive layer 34 located between the protective layer 35 and the first adhesive layer 33. The first adhesive layer 33 and the second adhesive layer 34 can be bonded to each other and can bond the light-transmitting layer 32 to the protective layer 35, and can be formed of a light-transmitting material.

[0072] Printed layers 36 and 37 include a first printed layer 36 and a second printed layer 37, and are formed on adhesive layers 33 and 34. The first printed layer 36 and the second printed layer 37 determine the appearance of the product and can be formed into layers including patterns, text, embossing, metallic finishes, etc., depending on the purpose of the cover. For example, gravure printing, rotary screen printing, etc., can be used as printing methods. The printed layers can be manufactured using a paste ink composition (e.g., colored ink or black ink) including adhesive resin, organic or inorganic pigments, solvents, additives, etc. There are no particular limitations on the method of forming a metallic-textured printed layer; for example, printing, sputtering, or coating using inks such as pearlescent inks can be used. The metal used to impart a metallic texture to the translucent cover 230 can include one or more of, for example, aluminum, copper, silver, platinum, tin, chromium, and nickel. Inorganic pigments include rutile titanium dioxide, zinc oxide, iron oxide, chromium oxide, etc., and may also include aluminum oxide, zinc sulfide, etc. Organic pigments can include both natural and synthetic pigments, and have the advantages of a wide and vibrant color range and excellent tinting strength. In addition, organic or inorganic pigments may include other pigments within the range that does not affect the reactivity or processability of the foaming agent.

[0073] like Figure 1 and Figure 22As shown, the printed layers 36 and 37 include a first printed layer 36 located on the second adhesive layer 34 and a second printed layer 37 located on the first printed layer 36. Each of the first printed layer 36 and the second printed layer 37 can be formed into different layers using a paste ink composition including adhesive resin, organic or inorganic pigments, solvents, additives, etc. The area of ​​the light-transmitting cover 230 where the printed layers 36 and 37 are formed can be the area of ​​the recess 232. That is, the outer or peripheral area of ​​the logo design can be covered by the printed layers 36 and 37 to provide a three-dimensional effect through the protrusion 231 and the recess 232 where the printed layers 36 and 37 are formed. A protective layer 35 is formed on the adhesive layer 34 and the printed layers 36 and 37. The protective layer 35 can be made of transparent resin or plastic material, and can be made of soft acrylic material. For surface protection, the protective layer 35 can be set to a thickness of 200µm or more, for example in the range of 200µm to 400µm. The light-transmitting cover 230 has regions R4, R5, and R6 with recesses 232 having printed layers 36 and 37, and regions R1, R2, and R3 with protrusions 231 not having printed layers 36 and 37. A resin layer 220 can be integrally formed on one surface. Therefore, since the light-transmitting cover 230 is integrally formed with the light-emitting module 200, the waterproof properties of the logo can be improved, electrical reliability enhanced, and a thin profile can be provided. This increases the design freedom for illuminated logos.

[0074] like Figure 9 (a) shows the logo when it is off, as shown in the image. Figure 9 As shown in (b), when the logo is illuminated, the light-emitting device can be turned off / on depending on whether the logo is working. The logo can be visually configured as recessed areas of black regions R4 and R5 and raised areas of white regions R1, R2, and R3. Here, the first region R1 can include a black area within the raised area and can be formed as a printed layer or a light-shielding pattern.

[0075] Reference Figures 10 to 20 A lighting device according to a second embodiment of the present invention will be described. The configuration of the second embodiment of the present invention is based on the configuration and description of the first embodiment, and any configuration and description overlapping with the first embodiment can be applied to the second embodiment.

[0076] Reference Figure 10 and Figure 11 According to a second embodiment of the present invention, the lighting device 100 may include a light-emitting module 110, a light-transmitting cover 120, and a molding portion 150. The lighting device 100 may be a structure or component in which the light-transmitting cover 120 and the light-emitting module 110 are integrated, and a sealed space 125 is provided inside. The sealed space 125 may be defined as a diffusion region or an air-filled layer (hereinafter referred to as an air layer). The refractive index of the sealed space 125 may be lower than the refractive index of the resin layer 113.

[0077] The thickness T1 of the lighting device 100 is the vertical distance from the upper surface of the molding portion 150 to the lower end of the light-transmitting cover 120, and can be less than 10 mm, for example, in the range of 5 mm to 10 mm or in the range of 7 mm to 8.5 mm. By setting the thickness T1 of the lighting device 100 to less than 10 mm, a thin logo with a thickness of less than 1 / 3 of that of a conventional logo can be provided. Furthermore, since the thickness T1 of the lighting device 100 is thin, less than 10 mm, a flexible logo can be provided. If the thickness T1 of the lighting device 100 is less than the above range, the light intensity of the illumination may decrease, and the rigidity of the logo may deteriorate. If it is greater than the above range, not only is material wasted, but the number of light-emitting devices 112 required to prevent a decrease in light intensity may increase, or the size of the logo may increase, which may lead to damage due to external impact.

[0078] The light-emitting module 110 may include a substrate 111, a plurality of light-emitting devices 112 disposed on the substrate 111, and a resin layer 113 disposed on the substrate 111 and sealing the plurality of light-emitting devices 112. The substrate 111 may include the configuration and description of the first embodiment. The light-emitting devices 112 may include LED chips or packages in which LED chips are encapsulated. The light-emitting chips may emit at least one of blue light, red light, green light, and ultraviolet (UV) light. These light-emitting devices 112 may include the configuration and description of the light-emitting devices of the first embodiment.

[0079] When the lighting device achieves, for example, through the transparent areas R1 and R2 of the light-transmitting cover 120, such as Figure 21 When designing the logo (i.e., the symbol design), the plurality of light-emitting devices 112 can be disposed in the non-transparent area R4 or in the outer area that does not overlap with the transparent areas R1 and R2 in the vertical direction. Here, the vertical direction is the thickness direction of the lighting device 100, or the direction from the lower surface of the light-transmitting cover 120 toward the upper surface of the molding portion 150.

[0080] A resin layer 113 is disposed on a substrate 111 and can seal the plurality of light-emitting devices 112. The resin layer 113 is disposed on the lower surface of the substrate 111 and can seal the lower surface of the substrate 111. The area of ​​the lower surface of the resin layer 113 can be set to be equal to or greater than the area of ​​the upper surface of the substrate 111. Furthermore, the length of the lower surface of the resin layer 113 in one direction can be set to be equal to or greater than the length of the substrate 111 in one direction. Since the resin layer 113 seals the lower surface of the light-emitting devices 112 and the substrate 111, the moisture-proof characteristics of the plurality of light-emitting devices 112 and their circuits can be improved. The material of the resin layer 113 is a light-transmitting material, as described with reference to the resin layer of the first embodiment. A separate diffusing agent may also be included within the resin layer 113.

[0081] To diffuse the light emitted from the light-emitting device 112, the thickness of the resin layer 113 can be less than 3 mm, for example, in the range of 0.8 mm to 3 mm. If the thickness is less than the above range, the sealing effect of the light-emitting device 112 is reduced; if it is greater than the above range, the thickness of the light-emitting module 110 is increased. To diffuse the light emitted from the light-emitting device 112, a light diffusion structure (not shown) or a light extraction structure can be further formed on the lower surface or surface of the resin layer 113. The light diffusion structure or light extraction structure may include a prism-shaped concave-convex pattern in the area overlapping with the light-emitting device 112 in the vertical direction. The lower surface of the resin layer 113 can be a horizontal plane, or it may have a concave or convex pattern. Reflective layer 115 (see...) Figure 12 The reflective layer 115 can be disposed between the resin layer 113 and the substrate 111. The reflective layer 115 can have multiple holes for insertion of the light-emitting device 112 and can be formed on the lower surface of the substrate 111. The reflective layer can reflect light emitted from the light-emitting device 112. The area of ​​the reflective layer can be less than or equal to the area of ​​the lower surface of the substrate 111 and can be in contact with the upper surface of the resin layer 113.

[0082] The light-transmitting cover 120 may include a film covering layer 121 and a light-transmitting layer 122. The film covering layer 121 may be the surface of the lighting device 100 or a logo. The film covering layer 121 may contain a resin or plastic material, such as a decorative film or PMMA. The light-transmitting layer 122 may be a resin material, such as silicone or epoxy resin; or it may contain at least one of a plastic resin material, such as polyester (PET) film, PMMA (polymethyl methacrylate) material, or PC (polycarbonate). Preferably, the light-transmitting layer 122 may be silicone or PMMA.

[0083] The film cover layer 121 can be formed together with the light-transmitting layer 122 using molding equipment (e.g., in-mold equipment). As another example, the film cover layer 121 can be formed together with the light-transmitting layer 122 using molding equipment (e.g., out-of-mold equipment). The film cover layer 121 can be printed, such as... Figure 12 and Figure 13 The light-shielding film 140 shown is formed subsequently. The decorative film can express designs such as pictures, text, colors, metallic textures, matte finishes, and textures, and can include various functions such as surface properties, electrical, electromagnetic, and optical properties. In addition, the decorative film before forming facilitates the printing or deposition of the light-shielding film 140.

[0084] The thickness of the area of ​​the light-transmitting cover 120 that overlaps with the substrate 111 or the light-emitting module 110 in the vertical direction can be the thickness of the inner region. This thickness can be the vertical distance from the lower surface of the film covering layer 121 to the lower surface of the module support portion 22, or the vertical distance to the lower surface of the sealing space 125. The thickness of the light-transmitting cover 120 can be less than 4 mm, for example, 1 mm to 4 mm or 1 mm to 3 mm. If it is less than the above range, the strength may be reduced, and the design shape may be unclear; if it is greater than the above range, the material cost may increase, molding may be difficult, and the light transmittance may decrease. The thickness of the inner region of the light-transmitting cover 120 is the thickness of the area that overlaps with the sealing space 125 in the vertical direction.

[0085] The aforementioned light-transmitting cover 120 includes a light-transmitting portion 21 and a sidewall 23. The light-transmitting portion 21 allows light emitted from the light-emitting module 110 to exit. The light-transmitting portion 21 may face the exiting surface of the light-emitting module 110, such as the resin layer 113. The light-transmitting portion 21 may overlap with the light-emitting module 110 in the vertical direction.

[0086] The light-transmitting cover 120 has a module housing space inside, within which the light-emitting module 110 is housed. The sidewall 23 of the light-transmitting cover 120 covers the outer side of the light-emitting module 110. The sidewall 23 covers the entire side surface of the light-emitting module 110. Here, the light-transmitting portion 21 of the light-transmitting cover 120 corresponds to the emission side region of the light-emitting module 110, and may include the central or lower region of the film covering layer 121 and the central or lower region of the light-transmitting layer 122, or may include only the central or lower region of the light-transmitting layer 122. Here, the sidewall 23 of the light-transmitting cover 120 corresponds to the outer region of the light-emitting module 110, and may include the sidewall region of the film covering layer 121 and the sidewall region of the light-transmitting layer 122, or may include only the sidewall region of the light-transmitting layer 122.

[0087] In the light-transmitting cover 120, the light-transmitting layer 122 is disposed inside the light-transmitting portion 21, and the film covering layer 121 is disposed on the lower side. The light-transmitting layer 122 is disposed inside the sidewall 23, and the film covering layer 121 is disposed on the outer side. The light-transmitting layer 122 is disposed on the upper outer side of the sidewall 23, and the film covering layer 121 may be located at or below the upper outer side of the sidewall 23 to prevent the upper part of the film covering layer 121 from peeling off.

[0088] The light-transmitting cover 120 includes a module support portion 22, which can be formed by a stepped structure inside the light-transmitting layer 122. The module support portion 22 can be located around the lower surface of the light-emitting module 110 and can support the lower surface of the light-emitting module 110. The module support portion 22 can have a continuous frame shape or a discontinuous frame shape. The module support portion 22 can be located around the lower surface of the resin layer 113. The upper surface 22A of the module support portion 22 can be provided with an uneven shape along the lower periphery of the resin layer 113.

[0089] The minimum distance D2 between the sidewalls 23 of the light-transmitting cover 120, or the distance between the sidewalls in one direction, is the length of the area where the light-emitting module 110 is installed, and can be greater than the length D1 of the light-emitting module 110. The minimum length D3 of the module support portion 22 of the light-transmitting cover 120 in one direction can be the length of the sealing space 125. The minimum length D3 of the module support portion 22 can be the length of the area that does not affect the light output of the light-emitting module 110. Alternatively, one or more sealing spaces 125 can be provided between the light-emitting module 110 and the light-transmitting cover 120. When multiple sealing spaces 125 are provided, the multiple sealing spaces 125 can be provided in the area that overlaps with the light-emitting device 112 in the vertical direction, or as... Figures 12 to 14 As shown, it can be disposed in the region that overlaps with the transparent regions R1 and R2 in the vertical direction. Here, in the region between the plurality of sealed spaces 125, a portion of the light-transmitting layer 122 can protrude to the lower surface of the resin layer 113.

[0090] The upper surface 22A of the module support portion 22 may overlap with the periphery of the lower surface of the light-emitting module 110 in the vertical direction. Here, the vertical direction is the direction from the lower surface of the light-transmitting cover 120 toward the upper surface of the molding portion 150. The width ((D1-D3) / 2) of the area where the upper surface 22A of the module support portion 22 overlaps with the periphery of the lower surface of the light-emitting module 110 in the vertical direction can be less than 2 mm, for example, in the range of 0.5 mm to 2 mm or 0.8 mm to 1.5 mm. If it is less than the above range, when the light-emitting module 110 is formed into the molding portion 150, problems such as flow or warping of the light-emitting module 110 may occur.

[0091] The sealed space 125 can be the area between the light-emitting module 110 and the light-transmitting cover 120. The sealed space 125 can also be the gap between the resin layer 113 and the light-transmitting layer 122. The lower periphery of the resin layer 113 can contact the upper surface 22A of the module support portion 22 of the light-transmitting layer 122. The height H1 of the sealed space 125 can be less than 2 mm, for example, in the range of 0.1 mm to 2 mm or 0.5 mm to 1.5 mm. When the height of the sealed space 125 is less than this range, the light diffusion effect decreases; when it is greater than this range, the thickness T1 of the lighting device increases.

[0092] The sidewall 23 of the light-transmitting cover 120 can be spaced apart from the side surface of the light-emitting module 110. The sidewall 23 can be spaced apart from the resin layer 113 of the light-emitting module 110 in the horizontal direction. Therefore, the minimum distance D2 between the two sidewalls 23 or the minimum distance between the sidewalls 23 in the first direction can be greater than the length D1 of the light-emitting module 110 in the first direction. The length D1 of the light-emitting module 110 in the first direction can be greater than the length D3 of the sealing space 125 in the first direction. The first direction can be the length of the long side or the length of the short side of the light-transmitting cover 120. The lower inner surface 23A of the sidewall 23 can be spaced apart from the resin layer 113, and the upper surface 22A of the module support 22 can be located above the upper surface of the light-transmitting part 21, and can be bent inward from the lower inner surface 23A of the sidewall 23. The height T8 of the lower inner surface 23A can be less than the thickness T5 of the light-emitting module 110, and can be 0.5 mm or more, for example, in the range of 0.5 mm to 2 mm.

[0093] The upper inner surface 23B of the sidewall 23 of the light-transmitting cover 120 can be provided with an inclined surface to facilitate the insertion of the light-emitting module 110. On the inner side of the sidewall 23, the width between the facing upper inner surfaces 23B can be wider than the width between the facing lower inner surfaces 23A. For example... Figure 11 As shown, the upper inner surface 23C of the sidewall 23 can extend vertically from the upper end of the upper inner surface 23B toward the upper surface of the molding part 150, or it can extend in an inclined structure. The boundary point K1 between the upper inner surface 23C and the upper inner surface 23B of the sidewall 23 can be located above the upper surface or upper end of the light-emitting module 110. That is, since the upper position of the inclined surface 23B is located above the upper side of the light-emitting module 110, it is convenient to insert the light-emitting module 110 and can guide the filling of the molding part 150. In addition, the height T7 from the module support 22 to the upper end of the sidewall 23 can be greater than the thickness T5 of the light-emitting module 110. Therefore, the sidewall 23 makes it possible to insert the light-emitting module 110 into the internal space and facilitates the dispensing process of liquid resin during the injection molding of the molding part 150.

[0094] The molding portion 150 can cover the surface of the light-emitting module 110. The molding portion 150 can seal the upper surface and side surfaces of the light-emitting module 110. The molding portion 150 can seal the upper surface and side surfaces of the substrate 111 and the side surface of the resin layer 113. The extension portion 151 of the molding portion 150 extends to the side surface of the light-emitting module 110 and can contact the inner surface of the sidewall 23 and the side surface of the resin layer 113. The lower end of the extension portion 151 of the molding portion 150 can contact the outer side of the upper surface 22A of the module support portion 22. Therefore, the molding portion 150 can cover the entire upper part of the light-emitting module 110 and seal the entire side surface.

[0095] The thickness T6 of the molding portion 150 is the thickness between the upper surface of the light-emitting module 110 and the uppermost surface of the molding portion 150, or the vertical distance between the upper surface of the substrate 111 and the upper surface of the molding portion 150. The thickness T6 of the molding portion 150 is used to seal the light-emitting module 110 and prevent moisture, and can be 2 mm or more, for example, in the range of 2 mm to 5 mm or in the range of 2.5 mm to 3.5 mm. If the thickness T6 of the molding portion 150 is less than the above range, the moisture-proof effect may be reduced; if it is greater than the above range, the thickness of the lighting device 100 may increase. The molding portion 150 may include a resin material, such as silicone resin or epoxy resin.

[0096] The connector 160 can be connected to the upper or lower surface of the substrate 111 of the light-emitting module 110. The boundary between the connector 160 and the substrate 111, as well as the surface of the connector 160, can be molded by a portion 154 of the molding portion 150. The portion 154 of the molding portion 150 can extend to the side surface of the connector 160, thereby improving the problem of moisture penetration at the boundary between the connector 160 and the substrate 111.

[0097] The outer portion 152 of the molding portion 150 can extend to the upper surface of the sidewall 23 of the light-transmitting cover 120. For example, the outer portion 152 of the molding portion 150 can extend to the upper surface of the sidewall 23 of the light-transmitting layer 122, thereby preventing moisture from seeping in through the boundary between the molding portion 150 and the light-transmitting layer 122. The outer portion 152 of the molding portion 150 can contact the upper outer surface of the film covering layer 121. Here, the upper surface of the sidewall 23 can include a concave groove (not shown), and the groove can be provided at one or more locations along the periphery of the sidewall 23. When the sidewall 23 has a groove, a portion of the molding portion 150 can fill the groove. When a portion of the molding portion 150 fills the groove of the sidewall 23, the adhesive force between the molding portion 150 and the upper end of the sidewall 23 can be increased, and moisture can be prevented from seeping between the molding portion 150 and the upper surface of the sidewall 23, or the path of moisture seepage can be blocked. The shape of the groove can be an inverted triangle, a polygon, or a hemisphere. The substrate 111 can be disposed inside the molding section 150. The upper surface of the substrate 111 can be smaller than the upper surface area of ​​the molding section 150. Furthermore, since the lighting device 100 integrally seals the light-emitting module 110 with the molding section 150, the impact of the external environment or external shock can be reduced, electrical reliability can be improved, and problems caused by poor component assembly can be prevented.

[0098] The lighting device 100 can use the molding portion 150 to seal the entire surface of the light-emitting module 110, seal the boundary between the light-emitting module 110 and the connector 160, and seal the portion between the light-emitting module 110 and the light-transmitting cover 120. Therefore, the molding portion 150 and the light-transmitting cover 120 house the light-emitting module 110 internally and form it as a single unit, thereby providing a waterproof lighting device 100 for the light-emitting module 110. Furthermore, the number of components constituting the lighting device 100 can be reduced, and material and manufacturing costs can be lowered. Additionally, the thickness T1 of the lighting device 100 can be reduced.

[0099] Reference Figure 12 and Figure 13 The lower region of the light-transmitting cover 120 may include one or more protrusions 121A and one or more recesses 121B to form the shape of a logo. Preferably, multiple protrusions 121A and recesses 121B may be provided and may be arranged adjacent to each other or alternately. The multiple protrusions 121A may be arranged continuously or discontinuously. The light intensity of light emitted through the protrusions 121A in the light-transmitting cover 120 may be higher than the light intensity of light emitted through the recesses 121B. The area of ​​the protrusions 121A is set as a white or transparent area, and the area of ​​the recesses 121B is set as a black or opaque area. When the light-transmitting cover 120 is multi-layered, the areas of the protrusions 121A and the areas of the recesses 121B may have different layering structures. For example, a black ink layer may be provided on the inside of the recesses 121B so that they are covered in black when viewed from the outside; the inside of the protrusions 121A may not have a black ink layer, so that it can be set as a white or transparent area. The plurality of light-emitting devices 112 may overlap with at least one of the recesses 121B of the light-transmitting cover 120 in the vertical direction, and the plurality of light-emitting devices 112 may not overlap with the protrusions 121A of the light-transmitting cover 120 in the vertical direction. In this case, the light intensity of the light emitted through the protrusion 121A may be higher than the light intensity of the light emitted through the recess 121B.

[0100] In the aforementioned light-transmitting cover 120, the boundary portion 121C between the protrusion 121A and the recess 121B can be configured as an inclined structure. The protrusion 121A can be defined as a transmissive region (R1, R2) for light transmission, and the recess 121B can be defined as a non-transmissive region (R2) for light non-transmission. In the recess 121B, for light blocking, a light-shielding film 140 can be disposed on the inner surface (upper surface) or outer surface (lower surface) of the film covering layer 121. Figure 12 As shown, when the light-shielding film 140 is disposed on the inner side or upper surface of the recess 121B, it is adhered to or printed in the region corresponding to the recess 121B between the film covering layer 121 and the light-transmitting layer 122, and the region of the recess 121B can be formed as a non-transparent region R2. Figure 13As shown, when the light-shielding film 140 is disposed on the outer side or lower surface of the recess 121B, it is adhered or printed on the lower surface of the film covering layer 121 in the region corresponding to the recess 121B, and the region of the recess 121B can be formed as a non-transparent region R4. The light-shielding film 140 can be spaced apart from the transmissive regions R1 and R2 or the protrusion 121A. The light-shielding film 140 can be printed on the upper or lower surface of the film covering layer 121 and then formed together with the light-transmitting cover 120. The protrusion 121A and the transparent regions R1 and R2 can protrude along the shape of a logo design, such as a logo. Figure 21 As shown in (A) and (B), the shape of the protrusion 121A may correspond to the shape of the logo. At least one of the protrusions 121A may be disposed between the recesses, or may have a convex curved surface on the inner or outer side of the recess. The light-transmitting cover 120 may include Figure 22 The configuration or the configuration of the first embodiment.

[0101] like Figure 14 As shown, for the non-transparent area R4, a light-shielding film 141 can be printed on the area corresponding to the recess 121B on the lower surface of the resin layer 113 of the light-emitting module 110. The light-shielding film 141 can be exposed to the sealed space 125. Figures 12 to 14 In the process, light-shielding films 140 and 141 contain a reflective material within the resin material, such as one of TiO2, Al2O3, CaCO3, BaSO4, and silicon, and can be printed in single or multiple layers. Light-shielding films 140 and 141 are materials that do not completely block incident light, and their transmittance can be less than 10% or less than 5%.

[0102] Because the light-shielding films 140 and 141 are disposed in the area corresponding to the recess 121B of the light-transmitting cover 120, the areas of the protrusion 121A and the recess 121B of the light-transmitting cover 120 can provide a brightness difference and a three-dimensional effect. The depth of the recess 121B from the lower surface of the protrusion 121A can be 0.3 mm or more, for example, in the range of 0.3 mm to 0.5 mm. If the depth of the recess 121B is less than the above range, the three-dimensional effect between the recess 121B and the protrusion 121A may be negligible, and the brightness difference may be reduced.

[0103] To enhance the light-shielding effect on the light emitted from the light-emitting device 112, the edges of the light-shielding films 140 and 141 can be located further outward than the outermost light-emitting device 112 located on the recess 121B. Specifically, the areas of the light-shielding films 140 and 141 can be set to cover the area where the light-emitting device 112 is located and overlap with the light-shielding films 140 and 141 in the vertical direction, for example, in the range of 101% to 120% of the size of the area covering the area where the light-emitting device 112 is located. The thickness of the light-shielding films 140 and 141 can be 100 μm or more, for example, 100 μm to 200 μm. If the thickness of the light-shielding films 140 and 141 is less than the above range, hot spots may occur; if it is greater than the above range, the improvement in light-shielding efficiency may be negligible.

[0104] Figures 15 to 17 This is a diagram illustrating the manufacturing process of a lighting device according to a second embodiment of the present invention. (Refer to...) Figure 15 In (A) and (B), the light-transmitting cover 120 can be thermally compressed using an in-mold device to compress the film covering layer 121 onto the surface of the light-transmitting layer 122. At this time, a protrusion corresponding to the logo shape can be formed on the lower part of the light-transmitting cover 120 (see [link]). Figure 4 and Figure 12 After the light-transmitting cover 120 is injection molded, the pre-manufactured light-emitting module 110 is integrated into the internal space 125A. A connector 160 can be connected to the substrate 111 of the light-emitting module 110. The lower periphery of the light-emitting module 110 sits on the module support portion 22 of the light-transmitting cover 120, and this integration provides the lighting assembly 100M. A filling space 125B may exist between the side surface of the light-emitting module 110 and the side wall 23 of the light-transmitting cover 120. This filling space 125B is filled by the molding portion described later. The space 125 between the light-emitting module 110 and the light-transmitting cover 120 can become a sealed space when the molding portion described later is filled. The light-emitting module 110 is manufactured by mounting a plurality of light-emitting devices 112 on the substrate 111, applying a liquid resin layer 113, and then curing it.

[0105] Figure 16The illustration shows the lighting assembly 100M being incorporated into the internal space 305 of the lower mold 301. The sidewall portion 303 of the lower mold 301 can protrude to a level equal to or higher than the upper surface of the lighting assembly 100M. The bottom shape of the internal space 305 can correspond to the bottom shape of the light-transmitting cover 120. As another example, after the light-transmitting cover 120 is placed inside the lower mold 301, the light-emitting module 110 can be incorporated into its upper portion. At this time, the inner lower surface of the resin layer 113, except for the area contacting the module support portion 22, is separated from the upper surface of the light-transmitting layer 122 by the sealing space 125. (See reference...) Figure 17 (A) and (B) are used to attach the lighting component 100M into the lower mold 301, and then attach the upper mold 310 onto the lower mold 301. The lower space 211 of the upper mold 310 can be spaced apart from the upper surface of the light-emitting module 110 by approximately the thickness T6 of the molding portion 150 (see Figure 150). Figure 11 At this point, liquid resin is injected into the upper mold 310 through one or more injection holes 212, and then seals the entire upper surface and the entire side surface of the light-emitting module 110. The molding section 150 can then seal the space 125 between the light-transmitting cover 120 and the light-emitting module 110, and the space 125 can be a sealed space, a diffusion area, or an air layer. The liquid resin can be a resin with low pressure and low curing temperature to protect the light-emitting module 110 and prevent damage. Subsequently, when the molding resin hardens, the upper mold 310 is separated and the lower mold 301 is separated, thereby completing the lighting device 100. Here, the molding resin remaining in the injection holes 213 can be removed by cutting.

[0106] Figures 18 to 20 It shows Figure 10 A variation of the lighting device.

[0107] according to Figure 18 The lighting device 100A has a lower portion of the sidewall 23 of the light-transmitting cover 120 that can extend further outward than the lower end 23P of the inclined upper inner surface 23B, and can have a lower receiving portion 23D. The lower receiving portion 23D can include a groove in which the fixing end 151A of the extension 151 of the molding portion 150 is formed. The fixing end 151A can be continuously provided along the inner periphery of the sidewall 23 along the lower receiving portion 23D, or it can be provided in multiple discontinuous arrangements. Therefore, the molding portion 150 can be integrally formed with the light-transmitting cover 120 and the light-emitting module 110, and can be engaged with the lower inner part of the light-transmitting cover 120 in a hook structure, thereby preventing the molding portion 150 from separating from the light-transmitting cover 120.

[0108] according to Figure 19In the lighting device 100B, the lower receiving portion 23D of the side wall 23 of the light-transmitting cover 120 can extend outward beyond the lower end 23P of the inclined upper inner surface 23B, and can include a groove extending downward beyond the outer lower surface of the light-emitting module 110. The lower receiving portion 23D can extend to the outer periphery of the module support portion 22. The module support portion 22 is located further inward than the lower edge of the light-emitting module 110, and the internal space of the lower receiving portion 23D can overlap with the lower periphery of the light-emitting module 110 in the vertical direction. The module support portion 22 is located in an area that does not affect the light-emitting area of ​​the light-emitting module 110, and can be provided in one or more continuous or discontinuous frame shapes.

[0109] The extension 151 of the molding portion 150 has fixed ends 151A and 151B at its bottom. The fixed ends 151A and 151B may include a first fixed end 151A located outside the light-emitting module 110 and a second fixed end 151B located on the lower periphery of the light-emitting module 110. The first fixed end 151A and the second fixed end 151B can extend from or connect to the extension 151. The first fixed end 151A and the second fixed end 151B may be continuously arranged along the inner periphery of the sidewall 23 along the lower receiving portion 23D, or they may be arranged in multiple discontinuous arrangements. The width of the area 22S of the second fixed end 151B that overlaps with the light-emitting module 110 in the vertical direction may be less than the width of the module support portion 22. The bottom 22C of the lower receiving portion 23D may be located at a position equal to or higher than the bottom of the sealing space 125. Therefore, the molding part 150 can be integrally formed with the light-transmitting cover 120 and the light-emitting module 110, and can be connected to the lower inner part of the light-transmitting cover 120 with a hook structure, thereby preventing the molding part 150 from separating from the light-transmitting cover 120.

[0110] like Figure 20 As shown, the substrate 111 of the light-emitting module 110 can be connected via a signal cable 160A without using a connector, and the joint between the signal cable 160A and the substrate 111 can be sealed by the molding portion 150. In this case, the thickness of the lighting device can be prevented from increasing due to the height of the connector.

[0111] like Figure 21 As shown in (A), (B), and (C), the logo-featured lighting device 100 according to an embodiment of the present invention provides a sealed space 125 between the light-transmitting cover 120 and the light-emitting module 110. Since the light emitted through the light-emitting module 110 is diffused by the sealed space 125 and emitted through the light-transmitting cover 120, light distribution can be improved. Furthermore, since the light-transmitting cover 120 is integrally formed with the molding portion 150, a thinner thickness than existing logos can be provided, waterproofing performance can be improved, and design freedom can be increased. Since the molding portion 150 covers the top and side surfaces of the substrate 111 (see...),... Figure 11 Therefore, the electrical reliability of the substrate 111 can be improved, and the shortening of the logo life can be prevented. The molding portion 150 can be formed of an insulating material (such as silicone or epoxy resin). The molding portion 150 may include light-reflecting or light-absorbing particles inside it.

[0112] like Figure 21 As shown, a light-shielding pattern (not shown) can be provided on the text area or raised area of ​​the light-transmitting cover 120. The light-shielding pattern can be formed on the surface of the raised area of ​​the light-transmitting cover 120. The light-shielding pattern can be located on the lower surface of the raised area of ​​the light-transmitting cover 120. The light-shielding pattern can include a light-shielding structure such as a matrix, mesh, or grid pattern. Light can be emitted through the open area where the light-shielding pattern is not present, and the design of the main logo portion can be diversified with different patterns when viewed from the outside. Furthermore, the light-shielding pattern can make the text, logo, or symbol within the logo visible on the raised area, such as... Figure 21 As shown in (A)-(C). The light-blocking pattern can be printed on the raised area.

[0113] In the second embodiment, since the light-transmitting cover 120 and the light-emitting module 110 are integrally formed by the molding portion 150, the waterproof performance of the logo, including the internal sealing space 125 and the light-emitting module 110, can be improved, electrical reliability can be enhanced, and a slim design can be provided. Therefore, the design freedom of the illuminated logo can be increased. The logo may include a sensing element (not shown) or a radar element inside. The sensing element or radar element may be disposed on the upper part of the substrate 111 and have an electrode pattern (not shown). The radar element can sense external objects in front of or behind the vehicle and provide information to the user or vehicle control system. The sensing element emits electromagnetic waves in the frequency band of 30 to 300 GHz and a wavelength of less than 10 mm, thereby enabling accurate sensing of complex road conditions.

[0114] Lighting devices bearing the aforementioned logo may include at least one of the following: mobile vehicles such as automobiles, mobile vehicles such as drones, marine vehicles such as ships, mobile devices connecting land and sea, and aerial vehicles such as airplanes. Furthermore, lighting devices bearing the aforementioned logo may be applied to fixed lighting installations rather than mobile vehicles.

[0115] The features, structures, effects, etc., described in the above embodiments are included in at least one embodiment of the present invention, but are not necessarily limited to one embodiment. Furthermore, the features, structures, effects, etc., exemplified in the embodiments can be combined or modified by those skilled in the art in other embodiments. Therefore, content related to such combinations and modifications should be interpreted as being included within the scope of the present invention. Moreover, although embodiments have been described above, these are merely examples and do not limit the present invention. Those skilled in the art will understand that various modifications and applications not illustrated above can be made without departing from the essential characteristics of the embodiments. For example, the components specifically shown in the embodiments can be modified. And, differences related to such modifications and applications should be interpreted as being included within the scope of the present invention as defined in the appended claims.

Claims

1. A lighting device, comprising: substrate; Multiple light-emitting devices disposed on the substrate; A light-transmitting cover is disposed on the plurality of light-emitting devices; as well as A resin layer disposed between the substrate and the light-transmitting cover. The resin layer covers the plurality of light-emitting devices. The light-transmitting cover includes multiple protrusions and multiple recesses, and The resin layer includes protrusions respectively disposed within the plurality of protrusions.

2. The lighting device according to claim 1, wherein, The upper surface of the resin layer has a shape corresponding to the protrusion and the recess of the light-transmitting cover.

3. The lighting device according to claim 1, wherein, The light-transmitting cover is in contact with the upper and side surfaces of the resin layer.

4. The lighting device according to any one of claims 1 to 3, wherein, The plurality of light-emitting devices overlap vertically with at least one of the recesses in the light-transmitting cover, and The plurality of light-emitting devices do not overlap with the protrusion of the light-transmitting cover in the vertical direction.

5. The lighting device according to any one of claims 1 to 3, further comprising: A light-shielding film is disposed between the light-transmitting cover and the plurality of light-emitting devices. The light-shielding film is disposed on the lower surface of the recess of the light-transmitting cover and faces the plurality of light-emitting devices.

6. A lighting device, comprising: A light-emitting module includes a substrate, a plurality of light-emitting devices electrically connected to the substrate, and a resin layer disposed on the substrate and sealing the plurality of light-emitting devices; A light-transmitting cover, with an interior space for accommodating the light-emitting module; The molding section seals the surface of the substrate of the light-emitting module and seals the space between the side surface of the light-emitting module and the light-transmitting cover; as well as A sealed space is provided between the resin layer of the light-emitting module and the light-transmitting cover.

7. The lighting device according to claim 6, wherein, The light-transmitting cover includes a film covering layer and a light-transmitting layer disposed on the inner side of the film covering layer. The light-transmitting cover includes a light-transmitting portion of the resin layer facing the light-emitting module and a sidewall covering the periphery of the light-emitting module. The molding portion includes an extension that extends between the side wall of the light-transmitting cover and the side surface of the light-emitting module.

8. The lighting device according to claim 7, wherein, The light-transmitting cover includes a module support portion that supports the lower periphery of the light-emitting module, and The molding part is in contact with the side surface of the resin layer of the light-emitting module and the upper surface of the module support part.

9. The lighting device according to claim 7, wherein, The sidewall of the light-transmitting cover includes a vertical lower inner surface and an upper inner surface that slopes outward from the lower inner surface.

10. The lighting device according to any one of claims 7 to 9, wherein, The sidewall of the light-transmitting cover includes a lower receiving portion, and the lower part of the extension of the molded portion is fixed to the lower receiving portion. The lower receiving portion includes a groove extending outward from the inclined lower end of the side wall, and The molding portion is filled in the lower receiving portion.

11. The lighting device according to claim 10, wherein, The lower receiving portion includes a groove located at a position lower than the lower surface of the light-emitting module.

12. The lighting device according to any one of claims 6 to 9, wherein, The molding portion is configured to be sealed to a connector or signal cable connected to the substrate.

13. The lighting device according to any one of claims 6 to 9, wherein, The light-transmitting cover includes multiple protrusions and multiple recesses in the area where light is emitted. A light-shielding film is provided on the upper or lower surface of the recess, and The plurality of light-emitting devices overlap with at least one of the recesses of the light-transmitting cover in the vertical direction, and the plurality of light-emitting devices do not overlap with the protrusions of the light-transmitting cover in the vertical direction.

14. The lighting device according to claim 13, wherein, The light intensity emitted through the protrusion is higher than the light intensity emitted through the recess, and The protrusion of the light-transmitting cover corresponds to the shape of the logo design.

15. An emblem for an automotive component, comprising: The light-transmitting cover includes a protrusion on the outer side that corresponds to the shape of the logo design; as well as The lighting device includes a light-shielding film disposed on the inner or outer side of the light-transmitting cover. Wherein, the lighting device is the lighting device according to claim 1 or claim 6, and The light-transmitting cover includes a recess lower than the protrusion, and The recess includes a black printed layer on its inner side.

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