Providing environmental access / sampling ports to semiconductor dies

Abstract

A laminated substrate defines a hole therethrough. The laminated substrate includes a core comprising a first bio-inert material and a first conductive layer adjacent to the core. A spacer comprises a second bio-inert material. The spacer extends from the underside of the laminated substrate. The spacer defines a portion of the hole. The spacer is configured to abut against a sensor chip that covers an end of the hole.

Description

Cross-reference to related applications

[0001] This application claims priority to U.S. Provisional Patent Application 63 / 612,299, filed December 19, 2023, the entire contents of which are incorporated herein by reference. Technical Field

[0002] The topic described in this article relates to providing environmental sampling ports to semiconductor dies. Background Technology

[0003] Traditional methods of bioanalysis involve preparing a sample containing a target analyte and analyzing the analyte using analyte-specific chemistry (e.g., detecting the analyte by attaching it to the sample). Sample preparation may include stripping the biological matrix of the sample from the analyte to be detected, presenting a "clean" sample for detection. Detection may be performed by a sensor including a physical transducer that converts information about the presence of the analyte into a measurable signal (via an intermediate binding step or directly as in mass spectrometry). The interaction between the transducer and the analyte may require an intermediate cleaning step to ensure that there is no interference from other biological species in the stripped and sample-prepared matrix.

[0004] Traditional methods may require combining target-specific chemicals, biological reagents, and cleaning steps as part of a multi-step protocol for analyte detection. The use of these target-specific chemicals, biological reagents, and cleaning steps also necessitates prior assumptions / knowledge about the target being detected as part of the workflow. Furthermore, samples may need to be prepared again each time a new analyte is required for analysis. Therefore, traditional bioanalytical methods can be cumbersome, inefficient, and expensive. Summary of the Invention

[0005] This disclosure relates to providing an environment access / sampling port to a semiconductor die.

[0006] An example implementation of the subject matter described in this disclosure is an analyte sensor having the following features: A laminated substrate defines a hole therethrough. The laminated substrate includes a core comprising a first bioinert material and a first conductive layer adjacent to the core. A spacer comprises a second bioinert material. The spacer extends from an underside of the laminated substrate. The spacer defines a portion of the hole. The spacer is configured to abut against a sensor chip that covers an end of the hole.

[0007] An aspect of the example analyte sensor, which can be combined with the example analyte sensor alone or in combination with other aspects, may include the following: A laminated substrate further includes an upper layer of a third bio-inert material. A first conductive layer is located between the core and the upper layer. A lower layer of a fourth bio-inert material is also included. A second conductive layer is located between the core and the lower layer.

[0008] The aspects of the example analyte sensor, which can be combined with the example analyte sensor individually or in combination with other aspects, may include the following: the first bio-inert material, the second bio-inert material, the third bio-inert material, and the fourth bio-inert material are the same material.

[0009] Aspects of the example analyte sensor that can be combined with the example analyte sensor alone or in combination with other aspects may include the following. The first conductive layer includes grounding or shielding.

[0010] An aspect of the example analyte sensor, which can be combined with the example analyte sensor alone or in combination with other aspects, may include the following: A second conductive layer includes a first trace that couples a first lead of the sensor chip to ground or a shield, and the second conductive layer includes a second trace configured to couple a second lead of the sensor chip to a controller.

[0011] Aspects of the example analyte sensor that can be combined with the example analyte sensor alone or in combination with other aspects may include the following. A lower layer of fourth bioinert material defines a portion of the first trace and a portion of the second trace that are respectively exposed to the openings of the first lead and the second lead.

[0012] An aspect of the example analyte sensor, which can be combined with the example analyte sensor alone or in combination with other aspects, may include the following: An anisotropic conductive paste or film is disposed between the sensor chip and said portion of the first trace or said portion of the second trace.

[0013] Aspects of the example analyte sensor that can be combined with the example analyte sensor alone or in combination with other aspects may include the following. The second bio-inert material includes thermoplastics.

[0014] Aspects of the example analyte sensor that can be combined with the example analyte sensor alone or in combination with other aspects may include the following: The interface between the gasket and the sensor chip is configured to seal the liquid within the orifice.

[0015] An aspect of the example analyte sensor, which can be combined with the example analyte sensor alone or in combination with other aspects, may include the following: A gasket abuts against a core at a first end of the gasket and is configured to abut against a sensor chip at a second end of the gasket.

[0016] An example embodiment of the subject matter described in this disclosure is a method having the following characteristics: A sample fluid is received in a vial. The vial is partially defined by a laminated substrate. The laminated substrate includes a core having a first bioinert material and a conductive layer adjacent to the core. The analyte is sensed by a sensor defining the bottom of the vial.

[0017] An aspect of the example method that can be combined with the example method alone or in combination with other aspects may include the following: directing current from a controller to a sample fluid.

[0018] Aspects of the example method, which can be combined with the example method individually or in combination with other aspects, may include the following: The conductive layer includes a first trace and a second trace. The method further includes the following features: Current is guided from the sample fluid to the controller via the first trace. Current is guided from the sample fluid to the sensor. Current is guided from the controller to the sensor via the second trace.

[0019] An example embodiment of the subject matter described in this disclosure is an analyte sensing system having the following features: An analyte sensor is coupled to a sample vial. The analyte sensor includes a laminated substrate defining a hole therethrough. The laminated substrate includes the following features: A core comprising a first bioinert material. An upper layer comprising a second bioinert material. A first conductive layer between the core and the upper layer. A lower layer comprising a third bioinert material. A second conductive layer between the core and the lower layer. A gasket extending from the underside of the laminated substrate. The gasket defining a portion of the hole. A sensor chip abutting the gasket. The sensor chip covering the end of the hole. A controller is configured to direct current to the contents of the sample vial and receive current from the sensor chip in response to the directed current.

[0020] Aspects of the example analyte sensing system that can be combined with the example analyte sensing system, either alone or in combination with other aspects, may include the following: The gasket comprises thermoplastic material.

[0021] Aspects of the example analyte sensing system that can be combined with the example analyte sensing system, either alone or in combination with other aspects, may include the following: The interface between the gasket and the sensor chip is configured to seal the liquid within the orifice.

[0022] Aspects of the example analyte sensing system that can be combined with the example analyte sensing system individually or in combination with other aspects may include the following: a first bio-inert material, a second bio-inert material, or a third bio-inert material comprising different materials.

[0023] An aspect of the example analyte sensing system, which can be combined with the example analyte sensing system alone or in combination with other aspects, may include the following: A pad abuts against a core at a first end of the pad and a sensor chip at a second end of the pad.

[0024] Aspects of the example analyte sensing system that can be combined with the example analyte sensing system individually or in combination with other aspects may include the following. The first conductive layer includes grounding or shielding.

[0025] Aspects of the example analyte sensing system that can be combined with the example analyte sensing system individually or in combination with other aspects may include the following. The second conductive layer includes a first trace that couples a first lead of the sensor chip to ground or a shield, and a second trace configured to couple a second lead of the sensor chip to a controller.

[0026] Aspects of the example analyte sensing system that can be combined with the example analyte sensing system, either alone or in combination with other aspects, may include the following: A lower layer of third bioinert material defines a portion of the first trace and a portion of the second trace that are respectively exposed to the openings of the first lead and the second lead.

[0027] An aspect of the example analyte sensing system, which can be combined with the example analyte sensing system alone or in combination with other aspects, may include the following: An anisotropic conductive paste or film is disposed between the sensor chip and said portion of the first trace or said portion of the second trace. Attached Figure Description

[0028] These and other features will be more readily understood from the following detailed description taken in conjunction with the accompanying drawings.

[0029] Figure 1 This is a side cross-sectional view of the sample analyzer sensor;

[0030] Figure 2 This is a plan view of the first conductive layer;

[0031] Figure 3 This is a plan view of the second conductive layer;

[0032] Figure 4 This is a bottom perspective view of the sample analyte sensor;

[0033] Figure 5 This is a bottom perspective view of an example analyzer without a sensor chip;

[0034] Figure 6 This is a block diagram of an example controller that can be used with various aspects of this disclosure; and

[0035] Figure 7 This is a flowchart of an example method that can be used in conjunction with various aspects of this disclosure. Detailed Implementation

[0036] This disclosure generally relates to methods that can be used to characterize samples (e.g., electrochemical solutions containing analytes and redox substances). Methods and systems that can be used with the subject matter described herein are described, for example, in U.S. Patent Application No. 18 / 488,569, which is hereby incorporated by reference.

[0037] This disclosure describes a sensor that can be combined with a sample vial of an analyte detection system configured to receive a sample fluid for analysis. The sensor itself may include a laminated substrate defining a hole therethrough. The laminated substrate includes a core comprising a first bioinert material and a first conductive layer adjacent to the core. A gasket comprising a second bioinert material. The gasket extends from an underside of the laminated substrate. The gasket defines a portion of the hole. The gasket is configured to abut against a sensor chip that covers an end of the hole. In some implementations, the sensor and vial are consumable components.

[0038] In some implementations, consumable components and / or instruments can be modified to suit a specific application. Consumables may include sensors having interface geometries configured to interface with a sample containing an analyte. Interface geometries may include nanoscale electrochemical interfaces described in U.S. Patent Application No. 16 / 016,468, U.S. Patent Application No. 17 / 317,422, and U.S. Patent No. 9,285,336, the entire contents of which are incorporated herein by reference. Consumables may be integrated with sample collection mechanisms (e.g., syringes, pipettes, breath analyzers). Alternatively, consumables may be integrated with sample storage devices (e.g., storage caps, vials / tubes, vacuum containers, beakers, desiccant cards, microtiter plates, culture / other flasks, microfluidic cartridges, etc.). In some implementations, consumables and / or instruments may be integrated with sample handling robots. Instruments may be integrated with consumables (e.g., they may be configured to receive electrical signals indicating detection of the consumables). Instruments can have low throughput (e.g., single consumable read), medium throughput (e.g., 6 consumable reads), or high throughput (e.g., 24 to 1536 consumable reads). Medium-throughput and high-throughput instruments can perform multiple reads / scans of a sample across multiple consumables.

[0039] In the following detailed description, reference is made to the accompanying drawings, which form a part thereof. In the drawings, like symbols generally identify like parts unless the context otherwise requires. The illustrative alternatives described in the detailed description, drawings, and claims are not intended to be limiting. Other alternatives may be used and other changes may be made without departing from the spirit or scope of the subject matter presented herein. It will be readily understood that aspects as generally described herein and shown in the drawings can be arranged, substituted, combined, and designed in a wide variety of different configurations, all of which are explicitly considered and constitute a part of this application.

[0040] Unless otherwise defined, all technical terms, symbols, and other scientific terms or expressions used herein are intended to have the meaning commonly understood by one of ordinary skill in the art to which this application pertains. In some cases, terms with their commonly understood meanings are defined herein for clarity and / or for ease of reference, and these definitions contained herein are not necessarily to be construed as representing a material difference from the meaning commonly understood in the art. Many of the techniques or procedures described or mentioned herein are well understood by one of ordinary skill in the art and are typically employed by one of ordinary skill in the manner of practice.

[0041] Figure 1 This is a side cross-sectional view of an example analyte sensor 100 coupled to a sample vial 102. The sensor 100 includes a laminated substrate 104 defining an aperture 106 therethrough. The laminated substrate 104 includes a core 108. Between the core 108 and an upper layer 110 is an upper conductive layer 112. The upper conductive layer 112 may include, for example, copper traces. In some implementations, the upper conductive layer 112 is adjacent to the core 108. In some implementations, the upper layer 110 may be omitted. A lower layer 114 may also be included. A second lower conductive layer 116 is located between the core 108 and the lower layer 114. The lower conductive layer 116 may be substantially similar to the first conductive layer, except for any differences described herein.

[0042] A gasket 118 extends from the underside of the laminate substrate 104. The gasket 118 defines a portion of an aperture 106 and is configured to abut against a semiconductor die, such as a sensor chip 120 covering an end of the aperture 106. More specifically, the gasket 118 abuts against a core 108 at a first end and is configured to abut against the sensor chip 120 at a second end. The interface between the gasket 118 and the sensor chip 120 is configured to seal liquid within the aperture 106, for example, liquid within a vial 102.

[0043] Core 108, gasket 118, and upper and lower layers 110 (if included) may contain bio-inert materials. Bio-inert materials may include thermoplastics such as polyethylene terephthalate (PET), polyetheretherketone (PEEK), polytetrafluoroethylene (PTFE), acrylonitrile butadiene styrene (ABS), liquid crystal polymers (LCP), or polyimide. In some implementations, non-thermoplastic bio-inert materials, such as ceramics, may be used. In some implementations, each component (core 108, gasket 118, upper layer 110, and lower layer 114) may contain the same bio-inert material. In some implementations, some or all of the components may contain different bio-inert materials from each other.

[0044] In implementations that include a lower layer, the lower layer may define an opening 122 that exposes a portion of the lower conductive layer, for example, to allow leads of the sensor chip 120 to be electrically coupled to the lower conductive layer 116. This coupling can be achieved by a conductive paste or film extending between the leads of the sensor chip 120 and the lower conductive layer 116 through the defined opening 122. In some implementations, the conductive paste or film 124 may be anisotropically conductive.

[0045] Figure 2 This is a plan view of the upper conductive layer 112. In the illustrated implementation, the upper conductive layer 112 extends substantially across the entire laminate substrate 104 (e.g., across core 108) (greater than 60% of the planar surface area) and serves as a shield to prevent electromagnetic interference. In some embodiments, this upper conductive layer may act as a ground or be coupled to ground.

[0046] Figure 3 This is a plan view of the lower conductive layer 116. In some implementations, the lower conductive layer 116 may include at least a first trace 302 and a second trace 304. In some implementations, the first trace may be arranged to couple a first lead (not shown) of the sensor chip 120 to ground or a shield. For example, refer back to... Figure 1 In some implementations, the first trace 302 can be, for example, via conduit 126 ( Figure 1The conduit is coupled to the upper conductive layer 112, the conduit being defined by the core 108 and at least partially filled with a conductive material that allows conduction between the upper conductive layer 112 and the lower conductive layer 116. The lower conductive layer may include an additional second trace 304 coupling a second lead (not shown) to the controller 306. Further details regarding the interaction between the sensor 100 and the controller 306 are discussed throughout this disclosure. In some embodiments, a ground is connected to the ground of the controller 306. Although primarily described as having a shielded upper conductive layer and a traced lower conductive layer, the conductive layers (112, 116) may be arranged in alternative configurations without departing from this disclosure; for example, in some implementations, the ground / shielding may be located in the lower conductive layer 116, while the first trace 302 and the second trace 304 may be located in the upper layer.

[0047] Figure 4 This is a bottom perspective view of an example analyte sensor, showing the sensor chip 120 connected to the first trace 302 and the second trace 304 using a conductive film or paste 124, more specifically, the lower layer is omitted. Figure 5 The same view without sensor chip 120 is shown. In the illustrated implementation, ground trace 302 includes pads for receiving three leads of sensor chip 120, while the trace to be coupled to controller 306 includes a single pad for receiving a single lead of sensor chip 120. An opening 122 defined by lower layer 114 provides pathways to pads coupled to first trace 302 and second trace 304. Alternative arrangements may be used without departing from this disclosure. For example, some implementations may have a greater number of traces and / or a greater number of leads on sensor chip 120.

[0048] Figure 6 An example controller 306 is shown that can be used with various aspects of this disclosure. Among other things, controller 306 can monitor parameters of signals sent by the system to actuate such a system and / or adjust various operating parameters of such a system. Figure 6 As shown, controller 306 may include one or more processors 650 and a non-transitory computer-readable storage device (e.g., memory 652) containing instructions that cause processor 650 to perform the operations described herein. Processor 650 is coupled to input / output (I / O) interface 654 for sending and receiving communications with components in the system, including traces (302, 304). In some cases, controller 306 may additionally transmit status and send actuation and / or control signals to one or more various system components (including, for example, a computer, cloud service, or sensor chip 100) and other sensors (e.g., temperature sensors, vibration sensors, and other types of sensors) that provide signals to controller 306.

[0049] In operation, controller 306 directs current to the contents, such as liquid, within sample vial 102. The controller can then receive current from the sensor chip in response to the directed current. The controller can use the received current to identify the generated spectrum. In some implementations, the controller can then determine the presence of a target analyte based on the generated spectrum. Alternatively or additionally, controller 306 can perform basic calibration tasks to correct for drift and other errors in the current and voltage measured at the sensor interface.

[0050] Figure 7 This is a flowchart of an example method 700 that can be used with various aspects of this disclosure. In some implementations, some or all of the methods may be executed by a controller 306. At 702, a sample fluid is received by a vial 102. The vial is partially defined by a laminated substrate 104. At 704, a sensor 100 defining the bottom of the vial 102 senses the analyte.

[0051] In some implementations, current is exchanged between the controller and the sample fluid, for example, via traces on the upper conductive layer 112 or the lower conductive layer 116 (sent to and from the controller). Current can also be guided from the sample fluid within vial 102 to the sensor. Current can also be exchanged between the controller 306 and the sensor 100 via another trace (sent to and from the controller).

[0052] Unless otherwise defined, all technical terms, symbols, and other scientific terms or expressions used herein are intended to have the meaning commonly understood by one of ordinary skill in the art to which this disclosure pertains. In some cases, terms with commonly understood meanings are defined herein for clarity and / or for ease of reference, and such definitions contained herein are not necessarily to be construed as representing a material difference from the meaning commonly understood in the art. Many of the techniques or procedures described or mentioned herein are well understood by one of ordinary skill in the art and are typically employed by one of ordinary skill in the use of conventional methods.

[0053] Unless the context clearly specifies otherwise, the singular forms “a,” “an,” and “the” include plural indicators. For example, the term “a cell” includes one or more cells, including mixtures thereof. In this document, “A and / or B” is used to include all the following alternative forms: “A,” “B,” “A or B,” and “A and B.”

[0054] It should be understood that the aspects and implementations of this disclosure described herein include aspects and implementations that are “comprising”, “consisting”, and “consisting essentially of”.

[0055] As used herein, “comprising” is synonymous with “including,” “containing,” or “characterized in,” and is inclusive or open-ended, and does not exclude additional, unlisted elements or method steps. The term “comprising” in any statement herein, particularly in the description of the components of a composition or the steps of a method, is to be understood to cover compositions and methods that are substantially composed of and comprised of the listed components or steps. As used herein, “composed of” excludes any element, step, or component not specified in the claimed composition or method. As used herein, “substantially composed of” does not exclude materials or steps that do not materially affect the essential and novel characteristics of the claimed composition or method.

[0056] Where ranges of values ​​are provided, those skilled in the art will understand that all ranges disclosed herein encompass any and all possible subranges and combinations thereof. Any range listed can be readily identified as adequately describing the same range and capable of being decomposed into at least two, three, four, five, ten, etc., equal parts. As a non-limiting example, each range discussed herein can be readily decomposed into a lower third, a middle third, and an upper third, etc. As will also be understood by those skilled in the art, all terms such as “at most,” “at least,” “greater than,” “less than,” etc., include the listed numbers and refer to ranges that can subsequently be decomposed into subranges as discussed above. As will be understood by those skilled in the art, a range includes each individual member. Thus, for example, a group having 1 to 3 items means a group having 1, 2, or 3 items. Similarly, a group having 1 to 5 items means a group having 1, 2, 3, 4, or 5 items, and so on.

[0057] Certain ranges are presented herein by numerical values ​​preceded by the term "approximately". The term "approximately" is used herein to provide textual support for the precise figures that follow, as well as figures that are close to or approximate to the figures following the term. In determining whether a number is close to or approximates a specifically listed number, the unlisted number that is close to or approximates may be a number that is a fundamental equivalent of the specifically listed number provided in the context in which it is presented. If the approximation is not readily apparent from the context, "approximately" means within ±10% of the provided value, or rounded to the nearest significant figure, in all cases including the provided value.

[0058] It should be understood that certain features of this disclosure described in the context of individual implementations for clarity may also be provided in combination within a single implementation. Conversely, various features of this disclosure described in the context of individual implementations for brevity may also be provided individually or in any suitable sub-combination. All combinations of implementations belonging to this disclosure are precisely covered by this disclosure and disclosed herein, as if each combination were individually and explicitly disclosed herein. Furthermore, all sub-combinations of various implementations and their elements are also precisely covered by this disclosure and disclosed herein, as if each and every such sub-combination were individually and explicitly disclosed herein.

[0059] The document also describes a non-transitory computer program product (i.e., a physically embodied computer program product) containing instructions that, when executed by one or more data processors of one or more computing systems, cause at least one data processor to perform the operations described herein. Similarly, a computer system is also described that may include one or more data processors and memory coupled to the one or more data processors. The memory may temporarily or permanently store instructions that cause at least one processor to perform one or more of the operations described herein. Furthermore, the methods may be implemented by one or more data processors within a single computing system or distributed among two or more computing systems. Such computing systems may be interconnected and may exchange data and / or commands or other instructions via one or more connections, including connections via networks (e.g., the Internet, wireless wide area networks, local area networks, wide area networks, wired networks, etc.), direct connections between one or more computing systems, etc.

[0060] While this disclosure contains numerous details of specific embodiments, these should not be construed as limiting the scope of what can be claimed, but rather as descriptions of features specific to particular embodiments. Certain features described in the context of separate embodiments in this disclosure may also be implemented in combination in a single embodiment. Conversely, various features described in the context of a single embodiment may also be implemented individually or in any suitable sub-combination in multiple embodiments. Furthermore, although features may be described above as functioning in certain combinations, and even initially claimed in this way, in some cases one or more features in the claimed combination may be removed from the combination, and the claimed combination may refer to a sub-combination or a variation of a sub-combination.

[0061] Similarly, although the operations are depicted in a specific order in the accompanying drawings, this should not be construed as requiring such operations to be performed in the specific order shown or in an ordered sequence, or that all the operations shown can be performed to achieve the desired result. Furthermore, the separation of the various system components in the embodiments described above should not be construed as requiring such separation in all embodiments, and it should be understood that the described components and systems can generally be integrated together in a single product or packaged into multiple products.

[0062] Therefore, specific embodiments of the subject matter have been described. Other embodiments are within the scope of the appended claims. In some cases, the actions stated in the claims can be performed in a different order and still achieve the desired result. Furthermore, the processes depicted in the drawings do not necessarily require the specific order or sequence shown to achieve the desired result.

[0063] Other embodiments are within the scope of the appended claims.

Claims

1. An analyte sensor, comprising: A laminated substrate, the laminated substrate defining a through-hole therethrough, the laminated substrate comprising: A core containing a first bio-inert material; and The first conductive layer adjacent to the core; and A pad containing a second bio-inert material extends from the underside of the laminated substrate, the pad defining a portion of the aperture, and the pad being configured to abut against a sensor chip covering an end of the aperture.

2. The analyte sensor according to claim 1, wherein, The laminated substrate further includes: The upper layer of the third bio-inert material, wherein the first conductive layer is located between the core and the upper layer; The lower layer of the fourth biological inert material; and A second conductive layer located between the core and the lower layer.

3. The analyte sensor according to claim 2, wherein, The first, second, and third bio-inert materials are the same as the fourth bio-inert material.

4. The analyte sensor according to any one of claims 2-3, wherein, The first conductive layer includes grounding or shielding.

5. The analyte sensor according to claim 4, wherein, The second conductive layer includes: A first trace, the first trace coupling the first lead of the sensor chip to the ground or shield; and A second trace is configured to couple a second lead of the sensor chip to a controller.

6. The analyte sensor according to claim 5, wherein, The lower layer of the fourth bio-inert material defines a portion of the first trace and a portion of the second trace that are respectively exposed to the openings of the first lead and the second lead.

7. The analyte sensor according to any one of claims 5-6, further comprising an anisotropic conductive paste or film between the sensor chip and the portion of the first trace or the portion of the second trace.

8. The analyte sensor according to any one of the preceding claims, wherein, The second bio-inert material includes thermoplastics.

9. The analyte sensor according to any one of the preceding claims, wherein, The interface between the gasket and the sensor chip is configured to seal the liquid within the orifice.

10. The analyte sensor according to any one of the preceding claims, wherein, The pad abuts against the core at a first end of the pad and is configured to abut against the sensor chip at a second end of the pad.

11. A method comprising: A vial receives sample fluid, the vial being partially defined by a laminated substrate comprising: A core containing a first bio-inert material; and The conductive layer adjacent to the core; and The analyte is sensed by a sensor located at the bottom of the vial.

12. The method of claim 11, further comprising: The current is directed from the controller to the sample fluid.

13. The method according to any one of claims 11-12, wherein, The conductive layer includes a first trace and a second trace, and the method further includes: The first trace directs current from the sample fluid to the controller; Directing current from the sample fluid to the sensor; and The second trace directs current from the controller to the sensor.

14. An analyte sensing system, comprising: Sample vials; An analyte sensor coupled to the sample vial, the analyte sensor including a laminated substrate defining a through-hole therethrough, the laminated substrate comprising: A core containing a first biological inert material; The upper layer contains a second biological inert material; A first conductive layer located between the core and the upper layer; The lower layer contains a third biological inert material; and A second conductive layer located between the core and the lower layer; A spacer extending from the underside of the laminated substrate, the spacer defining a portion of the hole; A sensor chip abutting the gasket, the sensor chip covering the end of the hole; and The controller is configured to: Directing current to the contents of the sample vial; and The sensor chip receives current in response to the guided current.

15. The analyte sensing system according to claim 14, wherein, The gasket is made of thermoplastic.

16. The analyte sensing system according to any one of claims 14-15, wherein, The interface between the gasket and the sensor chip is configured to seal the liquid within the orifice.

17. The analyte sensing system according to any one of claims 14-16, wherein, The first bio-inert material, the second bio-inert material, or the third bio-inert material comprises different materials.

18. The analyte sensing system according to any one of claims 14-17, wherein, The pad abuts against the core at its first end and against the sensor chip at its second end.

19. The analyte sensing system according to any one of claims 14-18, wherein, The first conductive layer includes grounding or shielding.

20. The analyte sensing system according to claim 19, wherein, The second conductive layer includes: A first trace, the first trace coupling the first lead of the sensor chip to the ground or shield; and A second trace is configured to couple a second lead of the sensor chip to a controller.

21. The analyte sensing system according to claim 20, wherein, The lower layer of the third bio-inert material defines a portion of the first trace and a portion of the second trace that are respectively exposed to the openings of the first lead and the second lead.

22. The analyte sensing system of claim 21, further comprising an anisotropic conductive paste or film between the sensor chip and the portion of the first trace or the portion of the second trace.

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