Optical module

Abstract

This disclosure provides an optical module. The optical emitting component includes a laser chip array, a first lens array, a second lens array, a semiconductor cooler, and a circuit adapter board. The laser chip array is arranged along the width direction of the circuit board, and the laser chip array, the first lens array, and the second lens array are arranged along the length direction of the circuit board. The first and second electrode posts of the semiconductor cooler and the circuit adapter board are all located between the first and second lens arrays. The circuit adapter board connects the circuit board to the first and second electrode posts. A first light receiving component and an optical emitting component are arranged side-by-side along the width direction of the circuit board. In this application, the first and second electrode posts of the semiconductor cooler and the first circuit adapter board are located between the first and second lens arrays, reducing the width dimension of the circuit board occupied by the optical emitting component, so that the optical emitting component and the first light receiving component are arranged side-by-side along the width direction of the circuit board.

Description

optical modules

[0001] This application claims priority to application number 202323147129.9 filed with the China Patent Office on November 21, 2023; and priority to application number 202411366250.7 filed with the China Patent Office on September 27, 2024; all contents of which are incorporated by reference into this application. Technical Field

[0002] The present disclosure relates to the field of optical fiber communication technology, and in particular to an optical module. Background Art

[0003] With the development of new services and applications such as cloud computing, mobile internet, and video, the advancement of optical communication technology has become increasingly important. In optical communication technology, optical modules are tools for converting optical and electrical signals, and are key components in optical communication equipment. Furthermore, the transmission rates of optical modules are constantly increasing as optical communication technology evolves.

[0004] Summary of the Invention

[0005] An embodiment of the present disclosure provides an optical module, including:

[0006] circuit boards;

[0007] The supporting plate is connected to the circuit board and has a first storage groove and a position-limiting support portion. The position-limiting support portion includes a glue dispensing boss. The glue dispensing boss is provided with at least two first support bosses. The area between the two first support bosses is configured as a glue dispensing area.

[0008] A light emitting component is supported on a supporting plate and connected to a circuit board;

[0009] A first light receiving component is provided on the circuit board and is located on one side of the light emitting component; the first light receiving component and the light emitting component are arranged side by side along the width direction of the circuit board;

[0010] The light emitting components include:

[0011] A laser chip array is disposed in the first storage slot, the laser chip array being arranged along the width direction of the circuit board and configured to emit light signals;

[0012] A first lens array is provided in the first placement slot, the first lens array is located in the light emitting direction of the laser chip array, and is configured to collimate the optical signal emitted by the laser chip array;

[0013] a second lens array, located in the collimating direction of the first lens array;

[0014] The transmitting optical fiber array is supported on the first supporting boss and is configured to receive the optical signal converged by the second lens array; the laser chip array, the first lens array, the second lens array, and the transmitting optical fiber array are arranged along the length direction of the circuit board;

[0015] The first semiconductor cooler has a laser chip array and a first lens array on its surface. The first semiconductor cooler includes:

[0016] a first electrode column;

[0017] The second electrode column and the first electrode column are both located between the first lens array and the second lens array;

[0018] The first circuit adapter board is located between the first lens array and the second lens array; one end of the first circuit adapter board is connected to the first electrode column and the second electrode column respectively, and the other end of the first circuit adapter board is connected to the circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the following briefly introduces the drawings required for use in the embodiments or descriptions of the prior art. Obviously, the drawings described below are only some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0020] FIG1 is a partial structural diagram of an optical communication system according to some embodiments;

[0021] FIG2 is a partial structural diagram of a host computer according to some embodiments;

[0022] FIG3 is a structural diagram of an optical module according to some embodiments;

[0023] FIG4 is an exploded view of an optical module according to some embodiments;

[0024] FIG5 is a diagram illustrating the internal structure of an optical module according to some embodiments;

[0025] FIG6 is an exploded view of the internal structure of an optical module according to some embodiments;

[0026] FIG7A is a structural diagram of a first light receiving component according to some embodiments;

[0027] FIG7B is a structural diagram of the first light receiving component at another viewing angle according to some embodiments;

[0028] FIG8 is a structural diagram of another light receiving component according to some embodiments;

[0029] FIG9 is a partial exploded view of the internal structure of an optical module according to some embodiments;

[0030] FIG10 is a partial exploded view of the internal structure of another optical module according to some embodiments;

[0031] FIG11 is a partial exploded view of the internal structure of yet another optical module according to some embodiments;

[0032] FIG12 is a diagram illustrating an emission light path of a light emitting component according to some embodiments;

[0033] FIG13A is a structural diagram of a transmitting optical fiber array according to some embodiments;

[0034] FIG13B is an exploded view of a transmitting optical fiber array according to some embodiments;

[0035] FIG13C is a partial view of a transmitting optical fiber array according to some embodiments;

[0036] FIG14A is a partial structural diagram of a light emitting component according to some embodiments;

[0037] FIG14B is a partially exploded view of a light emitting component according to some embodiments;

[0038] FIG15A is a partial view of a light emitting component according to some embodiments;

[0039] FIG15B is a partial view of a light emitting component at another viewing angle according to some embodiments;

[0040] FIG16A is a block diagram of an isolator array according to some embodiments;

[0041] FIG16B is an exploded view of an isolator array according to some embodiments;

[0042] FIG17 is a structural diagram of a support plate according to some embodiments;

[0043] FIG18 is a structural diagram of another support plate according to some embodiments;

[0044] FIG19 is a structural diagram of yet another supporting plate according to some embodiments;

[0045] FIG20 is a structural diagram of a circuit board according to some embodiments;

[0046] FIG21A is an assembly diagram of a support plate and a circuit board according to some embodiments;

[0047] FIG21B is a cross-sectional view of a support plate and a circuit board according to some embodiments;

[0048] FIG21C is an assembly diagram of a support plate and a circuit board from another perspective according to some embodiments;

[0049] FIG22 is a structural diagram of a first circuit adapter board according to some embodiments;

[0050] FIG23 is a cross-sectional view of the internal structure of an optical module according to some embodiments. DETAILED DESCRIPTION

[0051] Some embodiments of the present disclosure will be described in detail below with reference to the accompanying drawings. However, the embodiments described are only some of the embodiments of the present disclosure, not all of them. All other embodiments obtained by ordinary technicians in this field based on the embodiments of the present disclosure are within the scope of protection of the present disclosure.

[0052] Unless the context requires otherwise, throughout the specification and claims, the term "including" is to be interpreted as open and inclusive, that is, "including, but not limited to"; the terms "first" and "second" are not to be understood as indicating or implying relative importance or indicating an upper limit on quantity; the term "plurality" means two or more; the term "connected" is to be understood in a broad sense, for example, "connected" can be a fixed connection, a detachable connection, or an integral connection, and can be directly connected or indirectly connected through an intermediate medium; the use of the terms "suitable for" or "configured to" means open and inclusive language, which does not exclude equipment that is suitable for or configured to perform additional tasks or steps; terms such as "parallel", "perpendicular", "same", "consistent", "level" and so on are not limited to absolute mathematical theoretical relationships, but also include acceptable error ranges generated in practice, and also include differences based on the same design concept but due to manufacturing reasons.

[0053] In optical communications, information is transferred between information processing devices by loading it onto light and leveraging its propagation speed. This information-carrying light is called an optical signal. Transmitting optical signals through optical information transmission equipment reduces optical power loss, enabling long-distance transmission. Furthermore, optical information transmission equipment, such as optical fiber, is less expensive than electrical information transmission equipment, such as copper wire. Therefore, optical communications technology enables high-speed, long-distance, and low-cost information transmission.

[0054] Information processing equipment typically includes optical network units (ONUs), gateways, routers, switches, mobile phones, computers, servers, tablets, and televisions. Optical information transmission equipment typically includes optical fibers and optical waveguides. Information processing equipment can identify and process electrical signals, while optical communication technology uses optical signals for transmission, requiring optical modules to convert optical and electrical signals.

[0055] Optical modules can enable mutual conversion between optical and electrical signals between information processing equipment and optical information transmission equipment. In some embodiments, at least one of the optical signal input or output ends of the optical module is connected to an optical fiber, and at least one of the electrical signal input or output ends of the optical module is connected to an optical network terminal. A first optical signal from the optical fiber is transmitted to the optical module, which converts the first optical signal into a first electrical signal and transmits the first electrical signal to the optical network terminal. A second electrical signal from the optical network terminal is transmitted to the optical module, which converts the second electrical signal into a second optical signal and transmits the second optical signal to the optical fiber.

[0056] Because multiple information processing devices can transmit information via electrical signals, at least one of the multiple information processing devices needs to be directly connected to the optical module, rather than all of them. Here, the information processing device directly connected to the optical module is also referred to as the optical module's host computer. Furthermore, the optical signal input or output end of an optical module is referred to as an optical port, while the electrical signal input or output end of an optical module is referred to as an electrical port.

[0057] Figure 1 is a partial structural diagram of an optical communication system according to some embodiments. As shown in Figure 1, the optical communication system primarily includes a remote information processing device 1000, a local information processing device 2000, an optical module host computer 100, an optical module 200, an optical fiber 101, and a network cable 103. The optical fiber 101 is an optical information transmission device, and the network cable 103 is an electrical information transmission device.

[0058] In some embodiments, one end of the optical fiber 101 extends toward the remote information processing device 1000, and the other end of the optical fiber 101 is connected to the optical module 200 through the optical port of the optical module 200. The optical signal can undergo total reflection in the optical fiber 101, and the propagation of the optical signal in the direction of total reflection can almost maintain the original optical power. The optical signal undergoes multiple total reflections in the optical fiber 101 to transmit the optical signal from the remote information processing device 1000 to the optical module 200, or transmit the optical signal from the optical module 200 to the remote information processing device 1000, thereby achieving long-distance information transmission with low power loss.

[0059] The optical communication system includes one or more optical fibers 101. In some embodiments, the optical fibers 101 and the optical module 200 are detachably connected; in some embodiments, the optical fibers 101 and the optical module 200 are non-detachably connected.

[0060] The host computer 100 is configured to provide a data signal to the optical module 200 , or receive a data signal from the optical module 200 , or monitor or control the working state of the optical module 200 .

[0061] The host computer 100 includes a housing for accommodating the optical module 200 and an optical module interface 102 provided on the housing. The optical module 200 is inserted into the housing through the optical module interface 102 to establish a unidirectional or bidirectional electrical signal connection between the host computer 100 and the optical module 200.

[0062] The host computer 100 also includes an external electrical interface that can be connected to an electrical signal network. In some embodiments, the external electrical interface includes a Universal Serial Bus (USB) interface or a network cable interface 104. The network cable interface 104 is configured to connect to the network cable 103 to establish a unidirectional or bidirectional electrical signal connection between the host computer 100 and the network cable 103.

[0063] One end of the network cable 103 is connected to the local information processing device 2000, and the other end of the network cable 103 is connected to the host computer 100, so that an electrical signal connection is established between the local information processing device 2000 and the host computer 100 via the network cable 103. In some embodiments, a third electrical signal emitted by the local information processing device 2000 is transmitted to the host computer 100 via the network cable 103. The host computer 100 generates a second electrical signal based on the third electrical signal. The second electrical signal from the host computer 100 is transmitted to the optical module 200. The optical module 200 converts the second electrical signal into a second optical signal and transmits the second optical signal to the optical fiber 101. The second optical signal is transmitted to the remote information processing device 1000 in the optical fiber 101.

[0064] In some embodiments, a first optical signal from a remote information processing device 1000 propagates through an optical fiber 101, and the first optical signal from the optical fiber 101 is transmitted to the optical module 200. The optical module 200 converts the first optical signal into a first electrical signal. The optical module 200 transmits the first electrical signal to the host computer 100. The host computer 100 generates a fourth electrical signal based on the first electrical signal and transmits the fourth electrical signal to the local information processing device 2000.

[0065] In some embodiments, the optical module is a tool for converting optical signals into electrical signals. During the conversion between optical signals and electrical signals, the information does not change, but the encoding or decoding method of the information changes.

[0066] In addition to the optical network terminal, the host computer 100 also includes an optical line terminal (OLT), an optical network device (ONT) or a data center server.

[0067] Figure 2 is a partial structural diagram of a host computer according to some embodiments. To clearly illustrate the connection between the optical module 200 and the host computer 100, Figure 2 only shows the structure of the host computer 100 related to the optical module 200. As shown in Figure 2, in some embodiments, the host computer 100 further includes a PCB circuit board 105 disposed within the receiving cavity, and a cage 106 disposed on the surface of the PCB circuit board 105; the optical module 200 is inserted into the cage 106 and is fixed by the cage 106;

[0068] In some embodiments, a heat sink 107 is provided on the cage 106 to dissipate heat for the optical module; in some embodiments, the heat sink 107 has a protruding structure such as fins to increase the heat dissipation area.

[0069] In some embodiments, an electrical connector is disposed inside the cage 106 , and the electrical connector is configured to connect to an electrical port of the optical module 200 .

[0070] In some embodiments, the optical module 200 is inserted into the cage 106 of the host computer 100 , and the cage 106 fixes the optical module 200 . The heat generated by the optical module 200 is transferred to the cage 106 and then diffused through the heat sink 107 .

[0071] In some embodiments, the optical module 200 is inserted into the cage 106 of the host computer 100 , and the electrical port of the optical module 200 is connected to the electrical connector inside the cage 106 , thereby establishing an electrical signal connection between the optical module 200 and the host computer 100 .

[0072] In some embodiments, the optical port of the optical module 200 is connected to the optical fiber 101 , so that the optical module 200 establishes an optical signal connection with the optical fiber 101 .

[0073] Figure 3 is a structural diagram of an optical module according to some embodiments, and Figure 4 is an exploded view of an optical module according to some embodiments. As shown in Figures 3 and 4, in some embodiments, the optical module 200 includes a housing, which includes an upper housing 201 and a lower housing 202. The upper housing 201 covers the lower housing 202, forming two openings 204 and 205, one of which is an electrical port and the other is an optical port. In some embodiments, the housing forms a single opening that serves as both an electrical port and an optical port.

[0074] In some embodiments, the upper shell 201 and the lower shell 202 are made of metal materials, which facilitates electromagnetic shielding and heat dissipation.

[0075] The upper shell 201 and the lower shell 202 are combined to facilitate the installation of the circuit board 300, the light emitting component 400, the light receiving component 500a, etc. into the above shell. The upper shell 201 and the lower shell 202 can encapsulate and protect the above components.

[0076] The direction of the line connecting the two openings 204 and 205 can be aligned with or inconsistent with the length of the optical module 200. For example, the opening 204 can be located at the end of the optical module 200 (the right end in FIG3 ), and the opening 205 can also be located at the end of the optical module 200 (the left end in FIG3 ). Alternatively, the opening 204 can be located at the end of the optical module 200, and the opening 205 can be located at the side of the optical module 200.

[0077] In some embodiments, the lower shell 202 includes a base plate 2021 and two lower side plates 2022 located on both sides of the base plate 2021 and arranged perpendicular to the base plate 2021; the upper shell 201 includes a cover plate 2011, and the cover plate 2011 covers the two lower side plates 2022 of the lower shell 202 to form the above-mentioned shell.

[0078] In some embodiments, the lower shell 202 includes a base plate 2021 and two lower side plates 2022 located on both sides of the base plate 2021 and arranged perpendicularly to the base plate 2021; the upper shell 201 includes a cover plate 2011 and two upper side plates located on both sides of the cover plate 2011 and arranged perpendicularly to the cover plate 2011. The two upper side plates are combined with the two lower side plates 2022 to achieve the upper shell 201 covering the lower shell 202.

[0079] As shown in Figures 3 and 4, in some embodiments, the optical module includes a circuit board 300 disposed in a housing. The circuit board 300 includes circuit traces, electronic components, and chips. The electronic components and chips are connected according to the circuit design through the circuit traces to achieve functions such as power supply, electrical signal transmission, and grounding. The electronic components may include, for example, capacitors, resistors, transistors, and metal-oxide-semiconductor field-effect transistors (MOSFETs). The chips may include a microcontroller unit (MCU), a laser driver chip, a transimpedance amplifier (TIA), a limiting amplifier (LA), a clock and data recovery chip (CDR), a power management chip, and a digital signal processing (DSP) chip.

[0080] In some embodiments, the circuit board includes a rigid circuit board. Due to its relatively hard material, the rigid circuit board can also achieve a load-bearing function. For example, the rigid circuit board can stably support the above-mentioned electronic components and chips; the rigid circuit board can also be inserted into the electrical connector in the cage 106 of the host computer 100.

[0081] In some embodiments, the circuit board further includes a flexible circuit board, which can be used independently or in conjunction with a rigid circuit board.

[0082] In some embodiments, the circuit board also includes gold fingers formed on its end surfaces, the gold fingers consisting of multiple independent pins. (Circuit board 300 vs. circuit board; reference numerals are strongly indicative and should be consistent with the form in the figure. If the concept has more embodiments, it is not recommended to include reference numerals; in embodiments consistent with the figures, it is recommended to include reference numerals.)

[0083] In some implementations, the gold fingers are disposed on a surface on one side of the circuit board 300 (e.g., the upper surface shown in FIG. 4 ); in some implementations, the gold fingers are disposed on the upper and lower surfaces of the circuit board 300 to provide a greater number of pins, thereby adapting to situations where a large number of pins are required.

[0084] In some implementations, the circuit board's gold fingers extend from the electrical port and plug into an electrical connector on the host computer 100. The circuit board is inserted into the cage 106, with the gold fingers providing electrical connection to the electrical connector within the cage 106. The gold fingers are configured to establish an electrical connection with the host computer, enabling electrical connection functions such as power supply, grounding, two-wire synchronous serial (I2C) signal transmission, and data signal transmission.

[0085] In some embodiments, the optical module 200 further includes an unlocking component 600 located outside its housing. The unlocking component 600 is configured to achieve a fixed connection between the optical module 200 and the host computer, or to release the fixed connection between the optical module 200 and the host computer.

[0086] For example, the unlocking component 600 is located on the outside of the two lower side panels 2022 of the lower housing 202 and includes a snap-fit ​​component that mates with the cage 106 of the host computer 100. When the optical module 200 is inserted into the cage 106, the snap-fit ​​component of the unlocking component 600 secures the optical module 200 in the cage 106. When the unlocking component 600 is pulled, the snap-fit ​​component of the unlocking component 600 moves accordingly, thereby changing the connection between the snap-fit ​​component and the host computer, thereby releasing the optical module 200 from the cage 106 and allowing the optical module 200 to be removed from the cage 106.

[0087] In some embodiments, the optical module includes a light emitting component 400, as shown in Figures 3 and 4. The light emitting component 400 is used to emit an optical signal.

[0088] In some embodiments, the optical module includes a light receiving component 500, as shown in Figures 3 and 4. The light receiving component 500 is used to receive an optical signal and convert the optical signal into an electrical signal.

[0089] In some embodiments, at least one of the light emitting component 400 or the light receiving component 500 is located on a side of the circuit board 300 away from the gold finger.

[0090] In some embodiments, the light emitting component 400 and the light receiving component 500 are physically separated from the circuit board 300 and then electrically connected to the circuit board 300 through corresponding flexible circuit boards or electrical connectors.

[0091] In some embodiments, at least one of the light emitting component or the light receiving component may be directly disposed on the circuit board 300. For example, at least one of the light emitting component or the light receiving component may be disposed on a surface of the circuit board 300 or a side of the circuit board 300.

[0092] Figure 5 illustrates the internal structure of an optical module according to some embodiments. Figure 6 illustrates an exploded view of the internal structure of an optical module according to some embodiments. As shown in Figures 5 and 6, in some embodiments, the circuit board 300 may have an insertion opening 304. The light emitting component 400 may be placed within the insertion opening 304 of the circuit board 300 so that the light emitting path of the light emitting component 400 is flush with the upper surface of the circuit board 300.

[0093] In some embodiments, the optical module may include a support plate 900. The support plate 900 may be embedded in the embedding opening 304 of the circuit board 300. The support plate 910 may support the light emitting component 400 so that the emission light path of the light emitting component 400 is flush with the upper surface of the circuit board 300. The support plate 900 may be made of metal.

[0094] In some embodiments, a DSP chip 310 may be provided on the surface of the circuit board 300. The DSP chip 310 may process the electrical signals transmitted to it by the optical network terminal through the gold finger, and may also process the electrical signals transmitted to it by the optical receiving component 500.

[0095] In some implementations, a driver chip may be provided on the surface of the circuit board 300, one end of the driver chip may be connected to the DSP chip 310, and the other end of the driver chip may be connected to the light emitting component 400, so that the driver chip 310 provides a high-frequency driving signal under the action of the electrical signal processed by the DSP chip 310, thereby causing the light emitting component 400 to emit a light signal under the action of the high-frequency driving signal.

[0096] In some embodiments, the DSP chip 310 may be integrated with a driver chip. The DSP chip 310 may be connected to the optical emitting component 400 via a first signal line to provide the optical emitting component 400 with a high-frequency drive signal, thereby causing the optical emitting component 400 to emit an optical signal under the action of the high-frequency drive signal. For example, a high-frequency signal pad may be provided on the circuit board 300. The DSP chip 310 may be connected to the high-frequency signal pad via a first signal line. The high-frequency signal pad may then be wire-bonded to the laser chip of the optical emitting component 400.

[0097] In some embodiments, the optical receiving component 500 can be connected to the DSP chip 310 via a second signal line, so that the DSP chip 310 can process the high-frequency electrical signal transmitted to the optical receiving component 500 via the second signal line. For example, the transimpedance amplifier chip of the optical receiving component 500 can be connected to the DSP chip 310 via the second signal line.

[0098] In some embodiments, the optical emitting component 400 and the optical receiving component 500 are staggered along the length of the circuit board 300 (i.e., there is no overlapping portion between the optical emitting component 400 and the optical receiving component 500 along the width of the circuit board 300), and the optical receiving component 500 and the DSP chip 310 are located on the same surface of the circuit board 300. Due to the large size of the DSP chip 310, the DSP chip 310 and the optical receiving component 500 cannot be arranged side by side along the width of the circuit board, and can be placed to the right of the optical receiving component 500. Placing the DSP chip 310 to the right of the optical receiving component 500 may result in a longer distance between the DSP chip 310 and the high-frequency signal pad for the first signal line, thereby affecting the high-frequency performance of the optical module.

[0099] To solve this problem, in some embodiments, the optical receiving component 500 and the optical emitting component 400 are arranged side by side along the width direction of the circuit board 300, and the DSP chip 310 is moved to the left along the circuit board 300. The distance between the DSP chip 310 and the first signal line between the high-frequency signal pad becomes smaller, thereby reducing the distance between the DSP chip 310 and the optical emitting component 400, thereby improving the high-frequency performance of the optical module.

[0100] The width of the circuit board 300 is limited. In order to allow the light-emitting component 400 and the light-receiving component 500 to be arranged side by side along the width of the circuit board, in some embodiments, the electrode columns of the semiconductor cooler array of the light-emitting component 400 are arranged in the emission direction of the emission light path. The width of the circuit board 300 is limited, but the length of the circuit board 300 is relatively ample. The electrode columns of the semiconductor cooler array of the light-emitting component 400 are arranged on the emission light path, so that the light-emitting component 400 occupies a larger dimension in the length direction of the circuit board 300 and a smaller dimension in the width direction 300 of the circuit board. The width of the circuit board 300 is limited, and the dimension occupied by the light-emitting component 400 in the width direction 300 of the circuit board is reduced, so that the light-emitting component 400 and the light-receiving component 500 can be arranged side by side along the width direction of the circuit board.

[0101] In some embodiments, the light receiving component 500a may include a first light receiving component 502. The first light receiving component 502 may be located on one side of the light emitting component 400. The first light receiving component 502 may be disposed on a surface of the circuit board 300. For example, the first light receiving component 502 is located on the upper surface of the circuit board 300.

[0102] The light receiving component 500a may include a second light receiving component 501. The second light receiving component 501 may be located on the other side of the light emitting component 400. The second light receiving component 501 may be disposed on a surface of the circuit board 300. For example, the second light receiving component 501 may be disposed on the upper surface of the circuit board 300.

[0103] Figure 7A is a structural diagram of a first light receiving component according to some embodiments. Figure 7B is a structural diagram of the first light receiving component according to some embodiments from another perspective. As shown in Figures 7A and 7B, in some embodiments, the first light receiving component 502 may include a receiving fiber array 5021. The end face of the receiving fiber array 5021 is an inclined surface so that the optical signal within the receiving fiber array 5021 can be reflected downwardly by the end face.

[0104] The first light receiving component 502 may include a light receiving chip 5022. The light receiving chip 5022 may be located below the receiving fiber array 5021 to receive light signals reflected from the end face of the receiving fiber array 5021 and convert the received light signals into high-frequency current signals.

[0105] The first light receiving component 502 may include a transimpedance amplifier chip 5023. The transimpedance amplifier chip 5023 may be wire-bonded to the light receiving chip 5022 to convert a high-frequency current signal into a high-frequency voltage signal. The other end of the transimpedance amplifier chip 5023 may be connected to the DSP chip 310 via a second signal line to transmit the high-frequency voltage signal to the DSP chip 310, which then processes the signal and transmits it to the gold finger.

[0106] The structure of the second light receiving component 501 may be the same as that of the first light receiving component 502 , and also includes a receiving optical fiber array, a light receiving chip, and a transimpedance amplifier chip.

[0107] FIG8 is a structural diagram of another light receiving component according to some embodiments. As shown in FIG8 , in some embodiments, the light receiving component 500 b may be fixed to the surface of the circuit board 300 via a support substrate 560 .

[0108] In some embodiments, the optical receiving component 500b may include a fiber collimator array 510, which can collimate the received optical signal. The optical receiving component 500b may include a wave splitter 520, which can split the optical signal into eight optical signals of different wavelengths. The optical receiving component 500b may include a second focusing lens array 530, which can focus the eight optical signals of different wavelengths onto a reflector array 540. The optical receiving component 500b may include a reflector array 540, which can reflect the focused eight optical signals of different wavelengths onto an optical receiving chip array 550. The optical receiving component 500b may include a light receiving chip array 550, which can convert the eight optical signals of different wavelengths into eight electrical signals.

[0109] In some embodiments, the fiber collimator array 510 may include one fiber collimator, one fiber adapter, and one collimating lens. The fiber collimator is used to collimate the received optical signal, the fiber adapter is used to receive the optical signal, and the collimating lens is used to collimate the optical signal received by the fiber adapter. The fiber adapter and the collimating lens are combined into one fiber collimator, and both the fiber collimator and the fiber collimator are used to collimate the received optical signal.

[0110] In some embodiments, the fiber collimator array 510 includes two fiber adapters and two collimating lenses, one fiber adapter is corresponding to one collimating lens, and one fiber adapter and one collimating lens are combined into one fiber collimator, which is used to collimate the received optical signal.

[0111] In some embodiments, the second focusing lens array 530 may include eight focusing lenses arranged in parallel. One focusing lens can focus one optical signal onto the reflector array 540 , so the second focusing lens array 530 can focus eight optical signals of different wavelengths onto the reflector array 540 .

[0112] In some embodiments, the reflector array 540 may include two reflectors arranged in parallel. One reflector can reflect four focused optical signals of different wavelengths to the optical receiving chip array 550, and the reflector array 540 can then reflect eight focused optical signals of different wavelengths to the optical receiving chip array 550.

[0113] In some embodiments, the optical receiver chip array 550 includes eight optical receiver chips arranged in parallel. One optical receiver chip can convert one optical signal into one electrical signal, so the optical receiver chip array 550 is used to convert eight optical signals of different wavelengths into eight electrical signals.

[0114] FIG9 is a partial exploded view of the internal structure of an optical module according to some embodiments. As shown in FIG9 , in some embodiments, the optical emitting component 400a may include a laser chip array 410. The laser chip array 410 may include at least one laser chip to emit at least one optical signal; for example, the laser chip array 410 may include 4 or 8 laser chips, each of which emits one optical signal. For example, the laser chip array 410 may include 8 laser chips arranged in parallel along the width direction of the circuit board (i.e., the Y-axis direction) to emit 8 optical signals. The laser chip may be a 100G EML laser chip, and one 100GEML laser chip emits a 100G optical signal of one wavelength according to a high-frequency driving signal, so that the laser chip array 410 emits 8 100G optical signals.

[0115] In some embodiments, laser chip array 410 may include laser chip array 410a. Laser chip array 410a may include four laser chips arranged side by side along the width of the circuit board to transmit four optical signals. Laser chip array 410 may include laser chip array 410a. Laser chip array 410b may include four laser chips arranged side by side along the width of the circuit board to transmit four optical signals. Laser chip array 410a and laser chip array 410b may be arranged side by side along the width of the circuit board.

[0116] In some embodiments, the light emitting component 400 may include a first lens array 420. The first lens array 420 may be disposed on the support plate 900. The first lens array 420 is a collimating lens array that can collimate optical signals. The first lens array 420 may be located in the light emitting direction of the laser chip array 410 to collimate the optical signals emitted by the laser chip array 410.

[0117] The first lens array 420 may include at least one collimating lens to collimate at least one optical signal. For example, the first lens array 420 includes eight collimating lenses arranged in parallel along the width of the circuit board (i.e., the Y-axis) to collimate the eight optical signals. The collimating lenses have light-transmitting surfaces, through which the optical signals pass.

[0118] In some embodiments, the first lens array 420 may include a first lens array 420a, which may include four collimating lenses arranged in parallel along the width of the circuit board to collimate four optical signals. The first lens array 420 may include a first lens array 420b, which may include four collimating lenses arranged in parallel along the width of the circuit board to collimate four optical signals. The first lens array 420a and the first lens array 420b may be arranged in parallel along the width of the circuit board.

[0119] The number of the first lens arrays 420 is the same as the number of the laser chip arrays 410 , so that the laser chips of the laser chip array 410 correspond one to one with the collimating lenses of the first lens array 420 .

[0120] For example, the collimating lenses of the first lens array 420a correspond one-to-one to the laser chips of the laser chip array 410a, wherein the collimating lenses can be located on the light-emitting path of the laser chips.

[0121] In some examples, the collimating lenses of the first lens array 420 b correspond one-to-one to the laser chips of the laser chip array 410 b .

[0122] In some embodiments, the light emitting component 400 may include a second lens array 430. The second lens array 430 may be disposed on the support plate 900. The second lens array 430 is a converging lens array that can converge light signals. The second lens array 430 may be located in the collimation direction of the first lens array 420 to converge the light signals collimated by the first lens array 420.

[0123] The second lens array 430 may include at least one converging lens to converge at least one optical signal. For example, the second lens array 430 may include eight converging lenses arranged in parallel along the width of the circuit board (i.e., the Y-axis) to converge eight optical signals. The converging lenses have light-transmitting surfaces, through which the optical signals converge and pass.

[0124] In some embodiments, the second lens array 430 may include a second lens array 430a, which may include four converging lenses arranged in parallel along the width of the circuit board to converge four optical signals. The second lens array 430 may include a second lens array 430b, which may include four converging lenses arranged in parallel along the width of the circuit board to converge four optical signals. The second lens array 430a and the second lens array 430b may be arranged in parallel along the width of the circuit board.

[0125] The number of second lens arrays 430 is the same as the number of first lens arrays 420, so that the converging lenses of the second lens array 430 correspond one-to-one with the collimating lenses of the first lens array 420. For example, the converging lenses of the second lens array 430a correspond one-to-one with the collimating lenses of the first lens array 420a, and the converging lenses of the second lens array 430b correspond one-to-one with the collimating lenses of the first lens array 420b.

[0126] In some examples, the converging lens may be located on the light-emitting path of the collimating lens.

[0127] Because the optical signal between first lens array 420 and second lens array 430 is collimated light, the distance between first lens array 420 and second lens array 430 can be shortened or lengthened, facilitating the placement of more components. This flexibility not only increases the tolerance of the emission optical path, making it more tolerant to variations in component position and angle, but also improves its stability.

[0128] In some embodiments, the light emitting component 400 may include an isolator array 440. The isolator array 440 may be disposed on the support plate 900. The isolator array 440 may be located in the collimation direction of the first lens array 420 to prevent the optical signal from returning to the laser chip array 410.

[0129] The isolator array 440 may include at least one isolator to prevent at least one optical signal from returning to the laser chip array 410 . For example, the isolator array 440 includes eight isolators arranged in parallel along the width of the circuit board (i.e., the Y-axis direction) to prevent the eight optical signals from returning to the laser chip array 410 .

[0130] The number of the isolator arrays 440 is the same as the number of the second lens arrays 430 , so that the isolators of the isolator array 440 correspond one to one with the converging lenses of the second lens array 430 .

[0131] In some examples, the isolator can be located in the light path of the converging lens.

[0132] In some embodiments, the light emitting component 400 may include a transmitting optical fiber array 450. The transmitting optical fiber array 450 may be disposed on the supporting plate 900. The transmitting optical fiber array 450 may be located in the convergence direction of the second lens array 430, so that the end faces of the optical fibers of the transmitting optical fiber array 450 may be located at the focal point of the second lens array 430, thereby allowing the optical fibers of the transmitting optical fiber array 450 to receive optical signals.

[0133] In some embodiments, the transmitting fiber array 450 may include a transmitting fiber array 451. The transmitting fiber array 451 may be located in the convergence direction of the second lens array 430a so that the transmitting fiber array 451 can receive optical signals. The transmitting fiber array 450 may include a transmitting fiber array 452. The transmitting fiber array 452 may be located in the convergence direction of the second lens array 430b so that the transmitting fiber array 452 can receive optical signals. The transmitting fiber array 451 and the transmitting fiber array 452 may be arranged side by side along the width direction of the circuit board.

[0134] In some embodiments, the isolator array 440 can be located between the second lens array 430 and the transmitting optical fiber array 450. When no other devices need to be placed between the first lens array 420 and the second lens array 430, the distance between the second lens array 430 and the first lens array 420 can be shortened. When other devices need to be placed between the first lens array 420 and the second lens array 430, space can be left to facilitate the placement of other devices.

[0135] In some embodiments, the light emitting component 400 may include a semiconductor cooler (TEC) array 460. The TEC array 460 may be disposed on a support plate 900. The laser chip array 410 may be placed on the TEC array 460 to control the operating temperature of the laser chip array 410 within a target temperature range. The first lens array 420 may be placed on the TEC array 460 so that the central axis of the first lens array 420 is aligned with the light outlet of the laser chip array 410.

[0136] Semiconductor cooler array 460 may include at least one semiconductor cooler. The semiconductor cooler may include a first electrode column and a second electrode column. Both the first electrode column and the second electrode column are connected to the output terminal of a driving circuit, so that the driving circuit provides an operating current to the semiconductor cooler. The driving circuit provides the operating current to the semiconductor cooler to heat or cool the semiconductor cooler, thereby controlling the temperature of the laser chip array 410 within a target temperature range.

[0137] The MCU can be connected to the driving circuit so that the MCU can control the output current of the driving circuit, thereby achieving heating or cooling of the semiconductor cooler, thereby controlling the operating temperature of the laser chip array 410 within the target temperature range.

[0138] In some embodiments, the light emitting component 400 may include a thermistor array 470. The thermistor array 470 may be placed on the semiconductor cooler array 460. The thermistor array 470 may be located around the laser chip array 410. The thermistor array 470 may be used to collect the temperature around the laser chip array 410 and identify the temperature around the laser chip array 410 as the operating temperature of the laser chip array 410, thereby enabling monitoring of the operating temperature of the laser chip array 410.

[0139] The thermistor array 470 may include at least one thermistor. A thermistor is a temperature-sensitive element whose resistance value changes with temperature. Therefore, the temperature around the thermistor can be determined by the resistance value of the thermistor.

[0140] The thermistor array 470 can be connected to the MCU so that the MCU can determine the temperature around the thermistor array 470 based on the resistance value of the thermistor array 470, and then the MCU can control the output current of the driving circuit based on the temperature around the thermistor array 470, thereby achieving heating or cooling of the semiconductor cooler.

[0141] Figure 10 is a partially exploded view of the internal structure of another optical module according to some embodiments. As shown in Figure 10 , in some embodiments, the optical emitting component 400b may include a laser chip array 410, which can emit optical signals. The optical emitting component 400b may include a first focusing lens array 480, which can converge the optical signals. The optical emitting component 400b may also include a transmitting optical fiber array 450, which can receive the optical signals converged by the first focusing lens array 480.

[0142] In some embodiments, the laser chip array 410 may include eight parallel laser chips. For example, the laser chips are 100G EML laser chips. Each 100G EML laser chip emits a 100G optical signal of one wavelength according to a driving current, so that the laser chip array 410 emits eight 100G optical signals.

[0143] In some embodiments, the first focusing lens array 480 may include eight focusing lenses, and the transmitting fiber array 450 may include eight optical fibers, with one focusing lens corresponding to each optical fiber. For example, the first focusing lens array 480 may focus eight 100G optical signals onto respective optical fibers within the transmitting fiber array 450.

[0144] FIG11 is a partial exploded view of the internal structure of another optical module according to some embodiments. As shown in FIG11 , in some embodiments, the optical emitting component 400c may include a laser chip array 410, which may emit optical signals. The optical emitting component 400c may include a first lens array 420, which may collimate the optical signals. The optical emitting component 400c may include a wavelength division multiplexer array 490, which may combine eight optical signals into two optical signals. The optical emitting component 400c may include a second lens array 430, which may converge optical signals. The optical emitting component 400c may include a fiber optic adapter 700, which may receive the optical signals converged by the second lens array 430.

[0145] In some embodiments, the first lens array 420 includes eight collimating lenses, the wavelength division multiplexer array 490 includes two wavelength division multiplexers, the second lens array 430 includes two focusing lenses, and the fiber adapter assembly includes two fiber adapters 700. Each fiber adapter 700 corresponds to one focusing lens, each focusing lens corresponds to one wavelength division multiplexer, each wavelength division multiplexer corresponds to four collimating lenses, and each collimating lens corresponds to one laser chip. The first lens array 420 collimates the eight optical signals. The four collimated optical signals are then combined into one optical signal via the wavelength division multiplexer. The two optical signals are then coupled to the fiber adapter assembly via the second lens array 430.

[0146] Figure 12 is a diagram of the transmission optical path of a light emitting component according to some embodiments. As shown in Figure 12, a laser chip array 410 transmits eight optical signals, which are collimated by a first lens array 420. The collimated eight optical signals are then converged by a second lens array 430, pass through an isolator array 440, and converge onto a transmission fiber array 450.

[0147] FIG13A is a structural diagram of a transmitting optical fiber array according to some embodiments. FIG13B is an exploded view of a transmitting optical fiber array according to some embodiments. FIG13C is a partial view of a transmitting optical fiber array according to some embodiments. As shown in FIG13A, FIG13B, and FIG13C, in some embodiments, the first transmitting optical fiber array 451 may include a bottom plate layer 4511, optical fibers 4513, and a cover plate layer 4512. The cover plate layer 4512 covers the bottom plate layer 4511 to form a second storage slot for accommodating the optical fibers 4513. The bottom plate layer 4511 may be made of glass.

[0148] In some embodiments, the bottom plate layer 4511 has a second storage groove for placing the optical fiber 4513.

[0149] In some embodiments, the bottom plate layer 4511 has a first storage groove portion, the cover plate layer 4512 has a second storage groove portion, the first storage groove portion and the second storage groove portion form a second storage groove, and the second storage groove is used to place the optical fiber 4513.

[0150] In some embodiments, the cover layer 4512 has a second storage groove 4515 , and the second storage groove 4515 is used to place the optical fiber 4513 .

[0151] In some embodiments, the length of the bottom layer 4511 is less than or equal to the length of the cover layer 4512 .

[0152] In some embodiments, the length of the bottom plate layer 4511 is greater than the length of the cover plate layer 4512. The bottom plate layer 4511 is located below the optical fibers extending from the first transmitting optical fiber array 451. The bottom plate layer 4511 provides support for the optical fibers extending from the first transmitting optical fiber array 451. The optical fibers extending from the first transmitting optical fiber array 451 are not easily bent downward, thereby reducing stress damage caused by the optical fibers bending downward.

[0153] In order to fix the bottom layer 4511, the cover layer 4512 and the optical fiber 4513, in some embodiments, the first transmitting optical fiber array 451 further includes a fixing part 4514, one end of the fixing part 4514 fixes the optical fiber 4513 to the bottom layer 4511, and the other end of the fixing part 4514 fixes the cover layer 4512 to the bottom layer 4511.

[0154] In some embodiments, the fixing portion 4514 is a colloid formed after the glue is cured.

[0155] In some embodiments, the fixing portion 4514 is a structural member.

[0156] Figure 14A is a partial structural diagram of a light emitting component according to some embodiments. Figure 14B is a partial exploded view of a light emitting component according to some embodiments. As shown in Figures 14A and 14B, in some embodiments, the laser chips 411 of the laser chip array 410 are fixed to the semiconductor cooler array 460 via a fourth substrate 412. The size of the fourth substrate 412 is smaller than that of the laser chips 411, so that when there is a large amount of coupling glue between the laser chips 411 and the fourth substrate 412, it can flow to the sides of the fourth substrate 412, preventing the coupling glue from connecting to adjacent laser chips 411, thereby preventing the laser chips 411 from shifting.

[0157] In some embodiments, the collimating lenses 421 of the first lens array 420 are fixed to the semiconductor cooler array 460 via a fifth substrate 422. The size of the fifth substrate 422 is smaller than that of the collimating lenses 421, so that when a large amount of coupling glue between the fifth substrate 422 and the collimating lenses 421 is present, it can flow toward the sides of the fifth substrate 422, preventing the coupling glue from connecting to adjacent collimating lenses 421, thereby preventing the collimating lenses 421 from shifting.

[0158] The fifth substrate 422 and the collimating lens 421 have approximately the same or equal coefficients of thermal expansion, so that the thermal deformation of the fifth substrate 422 and the collimating lens 421 is approximately the same or equal, reducing stress or deformation caused by the thermal expansion difference, thereby improving the stability of the emission light path. For example, the fifth substrate 422 and the collimating lens 421 can both be made of glass.

[0159] In some embodiments, the semiconductor cooler array 460 may include a first semiconductor cooler 461. The laser chip array 410a and the first lens array 420a may be disposed on the first semiconductor cooler 461. The first semiconductor cooler 461 may include a first substrate 4611. The upper surface of the first substrate 4611 may be provided with a first conductive region.

[0160] In some embodiments, first semiconductor cooler 461 may include a second substrate 4612. The upper surface of second substrate 4612 may be used to place laser chip array 410 and first lens array 420. A second conductive region is provided on the lower surface of second substrate 4612. The first conductive region of second substrate 4612 may be connected to the second conductive region of first substrate 4611 via semiconductor group 4613.

[0161] In some embodiments, the upper surface of the first substrate 4611 may be provided with a first electrode column 4615 and a second electrode column 4614. The first electrode column 4615 and the second electrode column 4614 may be arranged side by side along the Y-axis. The first electrode column 4615 and the second electrode column 4614 are respectively connected to the first conductive area, and the first electrode column 4615 and the second electrode column 4614 are respectively connected to the output end of the driving circuit, so that the current of the driving circuit is supplied to the first semiconductor cooler 461.

[0162] The first electrode column 4615 is connected to the positive output terminal of the driving circuit, and the second electrode column 4614 is connected to the negative output terminal of the driving circuit, so that the first substrate 4611 acts as a cold plate to absorb heat and the second substrate 4612 acts as a hot plate to release heat.

[0163] The first electrode column 4615 is connected to the negative output terminal of the driving circuit, and the second electrode column 4614 is connected to the positive output terminal of the driving circuit, so that the second substrate 4612 acts as a cold plate to absorb heat and the first substrate 4611 acts as a hot plate to release heat.

[0164] The first electrode column 4615 of the first semiconductor cooler 461 and the second electrode column 4614 of the first semiconductor cooler 461 can be respectively arranged with the laser chip array 410 along the length direction of the circuit board 300 (i.e., the X-axis direction), which can reduce the width dimension of the first semiconductor cooler 461, and then reduce the width dimension of the position where the first semiconductor cooler 461 is located in the embedded port 304, thereby increasing the width dimension of the position corresponding to the first semiconductor cooler 461 in the circuit board 300, so that the light emitting component 400 and the light receiving component 500a can be arranged side by side along the Y-axis direction.

[0165] In some embodiments, the semiconductor cooler array 460 may include a second semiconductor cooler 462. The laser chip array 410b and the first lens array 420b may be disposed on the second semiconductor cooler 462. The second semiconductor cooler 462 may include a first substrate 4621. The upper surface of the first substrate 4621 may be provided with a first conductive region.

[0166] In some embodiments, the second semiconductor cooler 462 may include a second substrate 4622. The upper surface of the second substrate 4622 may be used to place the laser chip array 410 and the first lens array 420. The lower surface of the second substrate 4622 may be provided with a second conductive region. The first conductive region of the second substrate 4622 may be connected to the second conductive region of the first substrate 4621 via a semiconductor group.

[0167] In some embodiments, the upper surface of the first substrate 4621 may be provided with a first electrode column 4623 and a second electrode column 4624. The first electrode column 4623 and the second electrode column 4624 may be arranged in parallel along the Y-axis. The first electrode column 4623 and the second electrode column 4624 are respectively connected to the first conductive region, and the first electrode column 4623 and the second electrode column 4624 are respectively connected to the output end of the driving circuit so that the current of the driving circuit is supplied to the second semiconductor cooler 462.

[0168] The first electrode column 4623 is connected to the positive output terminal of the driving circuit, and the second electrode column 4624 is connected to the negative output terminal of the driving circuit, so that the first substrate 4621 acts as a cold plate to absorb heat and the second substrate 4622 acts as a hot plate to release heat.

[0169] The first electrode column 4623 is connected to the negative output terminal of the driving circuit, and the second electrode column 4624 is connected to the positive output terminal of the driving circuit, so that the second substrate 4622 acts as a cold plate to absorb heat and the first substrate 4621 acts as a hot plate to release heat.

[0170] The first electrode column 4623 of the second semiconductor cooler 462 and the second electrode column 4624 of the second semiconductor cooler 462 can be respectively arranged with the laser chip array 410 along the length direction of the circuit board 300 (i.e., the X-axis direction), which can reduce the width dimension of the second semiconductor cooler 462, and then reduce the width dimension of the position where the second semiconductor cooler 462 is located in the embedded port 304, thereby increasing the width dimension of the position corresponding to the second semiconductor cooler 462 in the circuit board 300, so that the light emitting component 400 and the light receiving component 500a can be arranged side by side along the Y-axis direction.

[0171] Second semiconductor cooler 462 can be located to one side of first semiconductor cooler 461. This not only facilitates accurate temperature control of the laser chips in laser chip array 410, ensuring that the temperature of laser chip array 410 is within a target temperature range, but also ensures that the deformation of each position of semiconductor cooler array 460 is approximately the same, so that the light outlet of laser chip array 410 coincides with the central axis of first lens array 420, thereby improving the stability of the emission light path. For example, first semiconductor cooler 461 and second semiconductor cooler 462 can be arranged side by side along the Y-axis.

[0172] In some embodiments, the thermistor array 470 may include a first thermistor 472. The first thermistor 472 may be placed on the first semiconductor cooler 461 via a third substrate 474. The first thermistor 472 may be located around the laser chip array 410 to collect the operating temperature of the laser chip array 410.

[0173] The first thermistor 472 and the laser chip array 410 can be arranged along the length direction of the circuit board 300 (i.e., the X-axis direction), which can reduce the width dimension of the first semiconductor cooler 461, and then reduce the width dimension of the position where the first semiconductor cooler 461 is located in the insertion port 304, thereby increasing the width dimension of the position corresponding to the first semiconductor cooler 461 in the circuit board 300, so that the light emitting component 400 and the light receiving component 500a can be arranged side by side along the Y-axis direction.

[0174] In some embodiments, thermistor array 470 may include a second thermistor 471. The second thermistor 471 may be placed on the second semiconductor cooler 462 via a third substrate 473. The second thermistor 471 may be located around the laser chip array 410 to collect the operating temperature of the laser chip array 410.

[0175] The second thermistor 471 and the laser chip array 410 can be arranged along the length direction of the circuit board 300 (i.e., the X-axis direction), which can reduce the width dimension of the second semiconductor cooler 462, and then reduce the width dimension of the position where the second semiconductor cooler 462 is located in the embedded port 304, thereby increasing the width dimension of the position corresponding to the second semiconductor cooler 462 in the circuit board 300, so that the light emitting component 400 and the light receiving component 500a can be arranged side by side along the Y-axis direction.

[0176] In some embodiments, the first thermistor 472 and the second thermistor 471 may be arranged in parallel along the Y-axis direction to facilitate accurate knowledge of the temperature of the laser chips in the laser chip array 410 .

[0177] Figure 15A is a partial view of a light emitting component according to some embodiments. Figure 15B is a partial view of a light emitting component according to some embodiments from another perspective. As shown in Figures 15A and 15B, in some embodiments, the first and second electrode columns of the semiconductor cooler array 460 and the thermistor array 470 can be located between the first lens array 420 and the second lens array 430.

[0178] In some embodiments, a circuit adapter board array 320 is disposed between the first lens array 420 and the second lens array 430. One end of the circuit adapter board array 320 can be connected to the electrode posts of the semiconductor cooler array 460 and the thermistor array 470. Another end of the circuit adapter board array 320 can be connected to a solder pad on the circuit board 300 to achieve electrical connection between the semiconductor cooler array 460 and the thermistor array 470 and the circuit board 300.

[0179] The circuit adapter board array 320 may include a first circuit adapter board 322. One end of the first circuit adapter board 322 may be connected to the first semiconductor cooler 461 and the first thermistor 472, and the other end of the first circuit adapter board 322 may be connected to a solder pad on the circuit board 300 to achieve electrical connection between the first semiconductor cooler 461 and the first thermistor 472 and the circuit board 300.

[0180] The circuit adapter board array 320 may include a second circuit adapter board 321. One end of the second circuit adapter board 321 may be connected to the second semiconductor cooler 462 and the second thermistor 471, and the other end of the second circuit adapter board 321 may be connected to a solder pad on the circuit board 300 to achieve electrical connection between the second semiconductor cooler 462 and the second thermistor 471 and the circuit board 300.

[0181] In some embodiments, the top surface of the circuit adapter board array 320, the top surface of the electrode columns of the semiconductor cooler array 460, and the top surface of the thermistor array 470 are all lower than the light-transmitting surface of the first lens array 420 or the light-transmitting surface of the second lens array 430 to avoid the circuit adapter board array 320, the electrode columns of the semiconductor cooler array 460, and the thermistor array 470 blocking the light signal.

[0182] In some embodiments, the first thermistor 472 or the second thermistor 471 may be located between two adjacent collimating lenses of the first lens array 420 to prevent the first thermistor 472 or the second thermistor 471 from blocking the optical signal.

[0183] In some embodiments, the converging lenses 431 of the second lens array 430 can be fixed to the supporting plate 900 via a sixth substrate. The size of the sixth substrate 432 is smaller than that of the converging lenses 431, so that when there is a lot of coupling glue between the sixth substrate 432 and the converging lenses 431, it can flow to the side of the sixth substrate 432, thereby preventing the coupling glue from connecting to adjacent converging lenses 431, thereby preventing the converging lenses 431 from shifting.

[0184] The sixth substrate 432 and the converging lens 431 have approximately the same or equal coefficients of thermal expansion, so that the sixth substrate 432 and the converging lens 431 experience approximately the same or equal amounts of thermal deformation. This reduces stress or deformation caused by the difference in thermal expansion, thereby improving the stability of the emission light path. For example, the sixth substrate 432 and the converging lens 431 can both be made of glass.

[0185] In some embodiments, the first transmitting optical fiber array 451 can be fixed to the supporting plate 900 through the seventh substrate 453 to reduce the impact of the deformation of the supporting plate 900 on the first transmitting optical fiber array 451.

[0186] The size of the seventh substrate 453 is smaller than that of the first transmitting optical fiber array 451, so that when there is a lot of coupling glue between the seventh substrate 453 and the first transmitting optical fiber array 451, it can flow to the side of the seventh substrate 453, reducing the contamination of the first transmitting optical fiber array 451 by the coupling glue.

[0187] Figure 16A is a structural diagram of an isolator array according to some embodiments. Figure 16B is an exploded view of an isolator array according to some embodiments. As shown in Figures 16A and 16B, in some embodiments, the isolator array 440 may include at least one isolator 441. Isolator 441 may include a first polarizer, a Faraday plate, and a second polarizer. The Faraday plate rotates in the same direction. Polarized light passing through the first polarizer cannot return to the first polarizer after Faraday rotation, thus providing the isolator composed of the first polarizer, the Faraday plate, and the second polarizer with a reverse isolation effect.

[0188] Faraday plates can only operate in the presence of a magnetic field. When isolator 441 is inherently magnetic, isolator array 440 may comprise only isolator 441. When isolator 441 is non-magnetic, isolator array 440 may comprise isolator 441 and magnetic element 442. Magnetic element 442 provides a magnetic field, enabling the Faraday plates to operate properly in a magnetic field.

[0189] In some embodiments, the magnetic member 442 may include a support base 4421 . The bottom surface of the isolator 441 may be connected to the upper surface of the support base 4421 , so that the support base 4421 can support the isolator 441 .

[0190] The supporting base plate 4421 has a preset height to increase the height of the isolator 441 so that the optical signal can pass through the isolator 441 .

[0191] In some embodiments, the magnetic member 442 may include at least one supporting plate 4422. The side of the isolator 441 may be connected to the supporting plate 4422 to provide the isolator 441 with a mounting reference surface to facilitate installation of the isolator 441. At least one supporting plate 4422 may be connected to the upper surface of the support base 4421 to enclose at least two third storage slots 4423. The bottom surface of the third storage slot 4423 is the upper surface of the support base 4421, the side surface of the third storage slot 4423 is a side surface of the supporting plate 4422, the bottom surface of the isolator 441 is connected to the bottom surface of the third storage slot 4423, and the side surface of the isolator 441 is connected to the side surface of the third storage slot 4423.

[0192] FIG17 is a structural diagram of a support plate according to some embodiments. As shown in FIG17 , in some embodiments, a support plate 900 may include a support plate body 901 . The edges of the support plate body 901 may support the circuit board 300 . The center of the support plate body 901 may support the light emitting component 400 .

[0193] The supporting plate body 901 may have a first storage groove 902. The first storage groove 902 may be formed by an inward depression on the upper surface of the supporting plate body 901, and the semiconductor cooler array 460 may be placed in the first storage groove 902.

[0194] The height of the upper surface of the supporting plate body 901 is lower than the height of the first storage groove 902 , so that the semiconductor cooler array 460 can be placed in the first storage groove 902 .

[0195] In some embodiments, a limiting support portion 903 may be provided on the upper surface of the first end of the supporting plate body 901. The limiting support portion 903 may include a first limiting support portion 9031. The first limiting support portion 9031 may be provided along the length of the supporting plate 900. The first limiting support portion 9031 may limit the position of the circuit board 300 on the supporting plate 900.

[0196] The position limiting support portion 903 may include a second position limiting support portion 9032. The second position limiting support portion 9032 may be disposed along the length of the supporting plate 900. The second position limiting support portion 9032 may be disposed opposite to the first position limiting support portion 9031. The second position limiting support portion 9032 may limit the position of the circuit board 300 on the supporting plate 900.

[0197] The positioning support portion 903 may include a third positioning support portion 9033. One end of the third positioning support portion 9033 may be connected to the first positioning support portion 9031. The other end of the third positioning support portion 9033 may be connected to the second positioning support portion 9032. The third positioning support portion 9033 has at least one receiving groove 9034. The receiving groove 9034 may receive an optical fiber of the transmitting optical fiber array 450. The receiving groove 9034 is recessed relative to the third positioning support portion 9033 to reduce stress on the optical fiber on the third positioning support portion 9033.

[0198] In some embodiments, the support plate 900 may include a support portion 904. The support portion 904 may be formed by expanding outward from the second end of the support plate body 901. The upper surface of the support portion 904 may be connected to the lower surface of the circuit board 300 to support the circuit board 300 and reduce deformation of the circuit board 300 in the thickness direction.

[0199] To reduce the space occupied by the support plate 900 on the circuit board 300, in some embodiments, the support portion 904 may have a notch 9043. The notch 9043 reduces the size of the support portion 904, thereby reducing the size of the support plate 900 and, consequently, the space occupied by the support plate 900 on the circuit board 300. The notch 9043 allows the support portion 904 to be divided into a first support portion 9041 and a second support portion 9042.

[0200] Figure 18 is a structural diagram of another support plate according to some embodiments. Figure 19 is a structural diagram of yet another support plate according to some embodiments. As shown in Figures 18 and 19, in some embodiments, support plates 900b and 900c each include a support plate body 911. A first storage slot 912 may be provided at the first end of the support plate body 911. A semiconductor cooler array may be provided within the first storage slot 912.

[0201] In some embodiments, a position limiting support portion 913 may be provided at the second end of the supporting plate body 911. The position limiting support portion 913 protrudes relative to the supporting plate body 911. The transmitting optical fiber array 450 or the wavelength division multiplexer array 490 may be placed on the position limiting support portion 913.

[0202] In some embodiments, the position limiting support portion 913 may include a glue dispensing boss 9135. The glue dispensing boss 9135 may be located at an end of the position limiting support portion 913 away from the first storage groove 912. Glue may be dispensed on the glue dispensing boss 9135.

[0203] In some embodiments, a first supporting boss 9136 may be provided on the glue-dispensing boss 9135. The emitting optical fiber array 450 may be provided on the first supporting boss 9136. The areas of the glue-dispensing boss 9135 other than the first supporting boss 9136 are all glue-dispensing areas, and glue can be dispensed in the glue-dispensing areas. The glue in the glue-dispensing area and the first supporting boss 9136 are both in contact and connected with the emitting optical fiber array 450. After the glue in the glue-dispensing area is cured, a colloid is formed, which fixes the emitting optical fiber array 450 to the limiting support portion 913. Glue is dispensed on the areas of the glue-dispensing boss 9135 other than the first supporting boss 9136 to increase the thickness of the glue. As the thickness of the glue increases, the strength of the glue body increases, and the bonding force of the glue is also enhanced, thereby improving the stability of the support plate and the emitting optical fiber array 450 or the wavelength division multiplexer array 490, and thereby improving the stability of the optical path. Among them, glue-dispensing refers to glue water.

[0204] In some embodiments, the thickness of the colloid can be equal to the height of the first supporting boss 9136, and also higher than the distance between the bonding surface and the emitting optical fiber array 450, thereby increasing the adhesion of the colloid and improving the stability of the supporting plate and the emitting optical fiber array 450, thereby improving the stability of the optical path.

[0205] In some embodiments, the thickness of the colloid can be greater than the height of the first supporting boss 9136, so that the colloid also adheres to the first supporting boss 9136, thereby increasing the colloid's bonding surface. The colloid's thickness, which is greater than the height of the first supporting boss 9136, not only increases the colloid's bonding surface but also increases its thickness, further enhancing the colloid's bonding strength and improving the stability of the support plate and the transmitting optical fiber array 450, as well as the optical path stability.

[0206] In some embodiments, at least two first supporting bosses 9136 may be provided on the glue-dispensing boss 9135. The at least two first supporting bosses 9136 support the transmitting optical fiber array 450. Glue can be dispensed in the area between any two first supporting bosses 9136. After the glue solidifies, it forms a colloid that secures the transmitting optical fiber array 450 to the position-limiting support portion 913. Glue can be dispensed in the area between any two first supporting bosses 9136 to ensure contact and connection between the glue and the transmitting optical fiber array 450, increase the thickness of the glue, and improve the stability of the support plate 900b or the support plate 900c and the transmitting optical fiber array 450.

[0207] In some embodiments, glue can be dispensed in the area between the two parallel first support bosses 9136 to ensure that the glue is in contact and connected with the transmitting optical fiber array 450, increase the thickness of the glue, and improve the stability of the support plate 900b or the support plate 900c and the transmitting optical fiber array 450.

[0208] In some embodiments, glue can be dispensed in the area between the first supporting bosses 9136 at both ends of the diagonal line, which not only ensures that the glue is in contact and connected with the transmitting optical fiber array 450, thereby improving the stability of the support plate 900b or the support plate 900c and the transmitting optical fiber array 450; it also allows the glue to flow around the first supporting bosses 9136, thereby increasing the contact area between the glue and the transmitting optical fiber array 450, and further improving the stability of the support plate 900b or the support plate 900c and the transmitting optical fiber array 450.

[0209] In some embodiments, the at least two first supporting bosses 9136 may include two first supporting bosses 9136. The two first supporting bosses 9136 support the transmitting optical fiber array 450, the two first supporting bosses 9136 are arranged in parallel, the two first supporting bosses 9136 are located at both ends of a diagonal line, and the area between the two first supporting bosses 9136 is glued.

[0210] In some embodiments, the at least two first support bosses 9136 may include three first support bosses 9136. The three first support bosses 9136 support the transmitting optical fiber array 450, and two of the three first support bosses 9136 are located at both ends of a diagonal of the glue dispensing boss 9135, and the remaining first support boss 9136 is arranged parallel to the first support boss 9136 located at one end of a diagonal, and the area between any two first support bosses 9136 can be glued. For example, the area between the two first support bosses 9136 located at both ends of a diagonal is glued; the area between the two first support bosses 9136 arranged in parallel is glued; the area between the two first support bosses 9136 located at both ends of a diagonal is glued, and the area between the two first support bosses 9136 arranged in parallel is glued.

[0211] In some embodiments, the at least two first supporting bosses 9136 may include four first supporting bosses 9136. The four first supporting bosses 9136 support the transmitting optical fiber array 450, wherein two first supporting bosses 9136 are respectively located at two ends of one diagonal line of the glue dispensing boss 9135, and the remaining two first supporting bosses 9136 are located at two ends of another diagonal line of the glue dispensing boss 9135, and the area between any two first supporting bosses 9136 can be glued.

[0212] In some embodiments, the shape of the first support boss 9136 can be rectangular, square, or circular.

[0213] As shown in Figure 19, in some embodiments, the limiting support portion 913 of the support plate 900c may include a glue guide groove 9134, which is located around the glue dispensing boss 9135. The glue guide groove 9134 is recessed relative to the glue dispensing boss 9135. The glue guide groove 9134 is used to guide the flow of glue to reduce the amount of glue from being excessive and contaminating the optical fiber end face of the emitting optical fiber array 450.

[0214] The protrusions of the glue guide groove 9134 , the glue dispensing boss 9135 and the first supporting boss 9136 are successively deepened to prevent excessive glue from contaminating the optical fiber end face of the emitting optical fiber array 450 .

[0215] The bottom surface of the transmitting optical fiber array 450 can be in contact with and connected to the colloid on the first supporting boss 9136 and the glue dispensing boss 9135 to limit the position of the transmitting optical fiber array 450 in the upper and lower directions of the optical module. In order to further limit the position of the transmitting optical fiber array 450, in some embodiments, the limiting support portion 913 may include a first limiting plate 9133. The first limiting plate 9133 may be located between the first storage groove 912 and the glue guide groove 9134. The end of the transmitting optical fiber array 450 (the end of the transmitting optical fiber array 450 having the optical fiber end face) is in contact with and connected to the first limiting plate 9133 to limit the position of the transmitting optical fiber array 450 in the optical fiber direction (i.e., the left and right direction of the optical module).

[0216] In some embodiments, the position limiting support portion 913 may include a second position limiting plate 9131. The second position limiting plate 9131 may be located between the glue guide groove and the edge of the support plate, that is, the second position limiting plate 9131 may be located at the front end or the rear end of the position limiting support portion 913. The side surfaces of the transmitting optical fiber array 450 are in contact with the second position limiting plate 9131 to define the position of the transmitting optical fiber array 450 in the front-to-back direction of the optical module.

[0217] In some embodiments, the limiting support portion 913 may include two second limiting plates 9131, one limiting plate 9115 is located at the front end of the glue guide groove 9134 and the support plate 900b or the support plate 900c, and one limiting plate 9115 is located at the rear end of the glue guide groove 9134 and the support plate 900b or the support plate 900c, the side of one transmitting optical fiber array 450 is in contact with and connected to one limiting plate 9115, and the side of another transmitting optical fiber array 450 is in contact with and connected to the other limiting plate 9115.

[0218] In some embodiments, the position-limiting support portion 913 may include a second support boss 9132. The second support boss 9132 may be located at one end of the position-limiting support portion 913 near the first storage slot 912. The first position-limiting plate 9133 may be located in the middle of the second support boss 9132, with the second support boss 9132 being recessed relative to the first position-limiting plate 9133. The isolator array may be located on the second support boss 9132.

[0219] In some embodiments, a fulcrum groove 9137 may be provided at one end of the support plate 900b or the support plate 900c away from the first storage groove 912. There may be no gap between the fulcrum groove 9137 and the edge of the support plate 900b or the support plate 900c, that is, the fulcrum groove 9137 is located in the edge area of ​​the support plate 900b or the support plate 900c. The fulcrum groove 9137 is not only located in the edge area of ​​the support plate 900b or the support plate 900c, but also in the projection area of ​​the transmitting optical fiber array 450. There is a gap between the fulcrum groove 9137 and the transmitting optical fiber array 450. The fulcrum groove 9137 is located to the left of the glue guide groove 9134, and the edge of the transmitting optical fiber array 450 extends to the left over the glue guide groove 9134 and the fulcrum groove 9137. The fulcrum slot 9137 is located to the left of the glue guide slot 9134. The edge of the transmitting fiber array 450 extends to the left, passing over the glue guide slot 9134 and the fulcrum slot 9137. Therefore, the glue guide slot 9134 is away from the edge of the transmitting fiber array 450 relative to the fulcrum slot 9137. The glue guide slot 9134 is away from the edge of the transmitting fiber array 450 relative to the fulcrum slot 9137. There is a gap between the fulcrum slot 9137 and the transmitting fiber array 450. The fulcrum slot 9137 serves as a fulcrum to facilitate separation of the transmitting fiber array 450 from the support plate 900b or the support plate 900c. When disassembling the transmitting fiber array 450, the disassembly tool uses the fulcrum slot 9137 as a fulcrum to pry the transmitting fiber array 450 off the support plate 900b or the support plate 900c.

[0220] The above describes the case where the transmitting optical fiber array 450 is supported on the first supporting protrusion 9136 of the supporting plate 900b or 900c. The wavelength division multiplexer array 490 can replace the transmitting optical fiber array 450 and be supported on the first supporting protrusion 9136 of the supporting plate 900b or 900c. Since the wavelength division multiplexer array 490 can be fixed to the first supporting protrusion 9136 of the supporting plate 900b or 900c without modification or with minor modifications, the structure of the supporting plate 900b or 900c and the assembly of the supporting plate 900b or 900c with the wavelength division multiplexer array 490 will not be described in detail.

[0221] A glue dispensing boss 9135 and a first support boss 9136 as shown in the support plate 900b can be set between the first limit support part 9031 and the second limit support part 9032 of the support plate 900a, or a glue dispensing boss 9135, a first support boss 9136 and a glue guide groove 9134 as shown in the support plate 900c can be set.

[0222] FIG20 is a structural diagram of a circuit board according to some embodiments. FIG21A is an assembly diagram of a support plate and a circuit board according to some embodiments. As shown in FIG20 and FIG21A , in some embodiments, the circuit board 300 may include a first circuit board 301, which may be the other side wall of the insertion opening 304. A gold finger may be formed on one end surface of the first circuit board 301. A first bonding area 3013 may be provided on the other end surface of the first circuit board 301. The first bonding area 3013 may be bonded to the receiving optical fiber array 5021 of the first light receiving component 502.

[0223] The projection area of ​​the first bonding area 3013 on the lower surface of the circuit board 300 may be located within the first supporting portion 9041 to reduce deformation of the projection area of ​​the first bonding area 3013 in the thickness direction of the circuit board 300 .

[0224] The first bonding area 3013 can include multiple gold-plated spots with gaps between them, exposing the surface of the circuit board 300. The bonding surface of the first bonding area 3013 with the glue includes not only the gold-plated spots but also the surface of the circuit board 300. This changes the adhesive material of the glue from being a solid piece of gold to being partly gold and partly circuit board. Because the adhesive force of the glue on the circuit board is greater than the adhesive force of the glue on the gold, the glue in the first bonding area 3013 contacts the gold-plated spots, as well as the circuit board between the gold-plated spots. This not only increases the contact area between the glue and the first and second bonding areas, but also changes the adhesive material of the glue from being gold-plated spots to being gold-plated spots and the circuit board. This further increases the adhesive force between the first and second bonding areas and the glue, thereby enhancing the bonding stability between the receiving fiber array 5021 of the first light receiving component and the first bonding area.

[0225] In some embodiments, a first placement area 3015 may be provided on the other end surface of the first circuit board 301. The first bonding area 3013 and the first placement area 3015 may be arranged along the X-axis direction, that is, the first placement area 3015 may be located to the right of the first bonding area 3013. The first placement area 3015 may be bonded to the transimpedance amplifier chip 5023 of the first light receiving component 502. The light receiving chip 5022 of the first light receiving component 502 may be provided in the area between the second bonding area 3012 and the first bonding area 3013.

[0226] In some embodiments, the other end surface of the first circuit board 301 may be provided with a second bonding area 3012. The second bonding area 3012 may be provided opposite to the first bonding area 3013. The second bonding area 3012 may be bonded to the receiving optical fiber array of the second light receiving component 501.

[0227] In some embodiments, the projection area of ​​the second bonding area 3012 on the lower surface of the circuit board 300 can be located within the second support portion 9042 to reduce the deformation of the projection area of ​​the circuit board 300 where the second bonding area 3012 is located in the thickness direction of the circuit board 300.

[0228] The second bonding area 3012 may include a plurality of gold-plated spots, with gaps between the plurality of gold-plated spots, so that the surface of the circuit board 300 is exposed.

[0229] In some embodiments, a second placement area 3014 may be provided on the other end surface of the first circuit board 301. The second bonding area 3012 and the second placement area 3014 may be arranged along the X-axis, i.e., the second placement area 3014 may be located to the right of the second bonding area 3012. The second placement area 3014 may be bonded to the transimpedance amplifier chip of the second light receiving component 501. The area between the second bonding area 3012 and the second placement area 3014 may be provided with the light receiving chip of the second light receiving component 501.

[0230] In some embodiments, a high-frequency signal pad 3011 may be provided on the other end surface of the first circuit board 301. The high-frequency signal pad 3011 may be located between the second bonding area 3012 and the first bonding area 3013. The high-frequency signal pad 3011 may be wire-bonded to the laser chips of the laser chip array 410 to provide high-frequency drive signals to the laser chips. The high-frequency signal pad 3011 may also be connected to the DSP chip 310 via a first signal line, enabling the DSP chip 310 to provide a high-frequency drive signal.

[0231] In some embodiments, the first placement area 3015 can be close to the gold finger of the circuit board 300 relative to the high-frequency signal pad 3011, that is, the first placement area 3015 is located on the right side of the high-frequency signal pad 3011, so that the area between the first placement area 3015 and the first bonding area 3013 is located on the right side of the high-frequency signal pad 3011, and the laser chip array 410 and the optical receiving chip 5022 of the first optical receiving component 502 can be staggered in the X-axis direction, which not only reduces the signal crosstalk between the laser chip array 410 and the optical receiving chip 5022, but also provides sufficient wiring space for the transimpedance amplifier chip 5023 of the first optical receiving component 502.

[0232] In some embodiments, the second placement area 3014 can be close to the gold finger of the circuit board 300 relative to the high-frequency signal pad 3011, that is, the second placement area 3014 is located on the right side of the high-frequency signal pad 3011, so that the area between the second placement area 3014 and the second bonding area 3012 is located on the right side of the high-frequency signal pad 3011, and the laser chip array 410 and the optical receiving chip 5012 of the second optical receiving component 501 can be staggered in the X-axis direction, which not only reduces the signal crosstalk between the laser chip array 410 and the optical receiving chip 5012, but also provides sufficient bonding space for the transimpedance amplifier chip of the second optical receiving component 501.

[0233] In some embodiments, the circuit board 300 may include a second circuit board 302 , and the second circuit board 302 may be a side wall of the insertion opening 304 . One end of the second circuit board 302 may be connected to the other end of the first circuit board 301 .

[0234] A first solder pad 3021 and a second solder pad 3022 are formed on a side of the upper surface of the second circuit board 302 near the insertion opening 304 (i.e., a side wall surface of the insertion opening 304). One end of the first solder pad 3021 can be connected to one output terminal of the driving circuit, and one end of the second solder pad 3022 can be connected to the other output terminal of the driving circuit, so that the driving circuit is powered through the first solder pad 3021 and the second solder pad 3022.

[0235] A third solder pad 3023 and a fourth solder pad 3024 are formed on the upper surface of the second circuit board 302, on one side of the insertion opening 304 (i.e., a side wall surface of the insertion opening 304). One end of the third solder pad 3023 can be connected to the input terminal of the MCU, and one end of the fourth solder pad 3024 can be connected to the ground layer of the circuit board 300.

[0236] In some embodiments, a limiting notch 3025 is formed at the other end of the second circuit board 302. One side of the limiting notch 3025 can correspond to the second limiting support portion 9032 to define the position of the second circuit board 302 and the supporting plate 900 along the Y-axis. The other side of the limiting notch 3025 can correspond to the third limiting support portion 9033 to define the position of the second circuit board 302 and the supporting plate 900 along the X-axis.

[0237] In some embodiments, the circuit board 300 may include a third circuit board 303, which may be another side wall of the insertion opening. One end of the third circuit board 303 may be connected to the other end of the first circuit board 301. The third circuit board 303 may be disposed opposite the second circuit board 302.

[0238] A first solder pad 3031 and a second solder pad 3032 are formed on the upper surface of the third circuit board 303 on one side of the insertion opening 304 (i.e., the other sidewall surface of the insertion opening 304). One end of the first solder pad 3031 can be connected to one output terminal of the driving circuit, and one end of the second solder pad 3032 can be connected to the other output terminal of the driving circuit, so that the driving circuit is powered through the first solder pad 3031 and the second solder pad 3032.

[0239] A third solder pad 3033 and a fourth solder pad 3034 are formed on the upper surface of the third circuit board 303 near the insertion opening 304. One end of the third solder pad 3033 can be connected to the input terminal of the MCU, and one end of the third solder pad 3033 is connected to the ground layer of the circuit board 300.

[0240] In some embodiments, a limiting notch 3035 is formed at the other end of the third circuit board 303. One side panel of the limiting notch 3035 can correspond to the first limiting support portion 9031 to define the position of the third circuit board 303 and the supporting plate 900 along the Y-axis. The other side panel of the limiting notch 3035 can correspond to the third limiting support portion 9033 to define the position of the third circuit board 303 and the supporting plate 900 along the X-axis.

[0241] In some embodiments, the other end of the third circuit board 303 is not connected to the other end of the second circuit board 302, so that the circuit board 300 forms an embedded port 304 with an opening, which facilitates the optical fiber of the transmitting optical fiber array 450 to pass through the opening 341 of the embedded port 304, thereby reducing stress damage to the optical fiber of the transmitting optical fiber array 450.

[0242] Figure 21B is a cross-sectional view of a support plate and circuit board according to some embodiments. Figure 21C is an assembly view of a support plate and circuit board from another perspective according to some embodiments. As shown in Figures 21B and 21C, in some embodiments, the lower surface of the circuit board 300 can be connected to the edge of the support plate body 901, so that the edge of the support plate body 901 supports the circuit board 300. For example, the lower surface of the second circuit board 302 can be connected to the edge of the support plate body 901, and the lower surface of the third circuit board 303 can be connected to the edge of the support plate body 901.

[0243] In some embodiments, the inner wall of the second circuit board 302 may be arranged to correspond to the second position-limiting support portion 9032 , so as to define the position of the second position-limiting support portion 9032 and the circuit board 300 .

[0244] In some embodiments, the inner wall of the third circuit board 303 may be arranged corresponding to the first position-limiting support portion 9031 , so as to define the positions of the first position-limiting support portion 9031 and the circuit board 300 .

[0245] Figure 22 is a structural diagram of a first circuit adapter board according to some embodiments. Figure 23 is a cross-sectional view of the internal structure of an optical module according to some embodiments. As shown in Figures 22 and 23, in some embodiments, the first sidewall of the first circuit adapter board 322 can be arranged along the length of the circuit board 300. The first sidewall of the first circuit adapter board 322 can be connected to the circuit board 300 by wire bonding to achieve an electrical connection between the circuit board 300 and the first circuit adapter board 322.

[0246] In some embodiments, the second sidewall of the first circuit adapter board 322 can be disposed along the width direction of the circuit board 300. The second sidewall of the first circuit adapter board 322 is disposed adjacent to the first semiconductor cooler 461. The second sidewall of the first circuit adapter board 322 can be connected to the first semiconductor cooler 461 and the first thermistor 472 to achieve electrical connection between the first circuit adapter board 322, the first semiconductor cooler 461, and the first thermistor 472.

[0247] In some embodiments, the first circuit adapter board 322 may include a first signal adapter line 3221 . One end of the first signal adapter line 3221 may be connected to the first pad 3031 , and the other end of the first signal adapter line 3221 may be connected to the first electrode column 4615 .

[0248] In some embodiments, the first circuit adapter board 322 may include a second signal adapter line 3222 , one end of the second signal adapter line 3222 may be connected to the second solder pad 3032 , and the other end of the second signal adapter line 3222 may be connected to the second electrode column 4614 .

[0249] In some embodiments, the first circuit adapter board 322 may include a third signal adapter line 3223 , one end of the third signal adapter line 3223 may be connected to the third solder pad 3033 , and the other end of the third signal adapter line 3223 may be connected to the first thermistor 472 .

[0250] In some embodiments, the first circuit transfer board 322 may include a fourth signal transfer line 3224 , one end of which may be connected to the fourth pad 3034 , and the other end of which may be connected to the third substrate 474 .

[0251] There is a gap between any two adjacent signal transfer lines among the first signal transfer line 3221 , the second signal transfer line 3222 , the third signal transfer line 3223 and the fourth signal transfer line 3224 to prevent short circuit.

[0252] Similarly, the second circuit adapter board 321 may include a first signal adapter line, a second signal adapter line, a third signal adapter line and a fourth signal adapter line. The first signal adapter line connects the first solder pad 3021 and the first electrode column 4623, the second signal adapter line connects the second solder pad 3022 and the second electrode column 4624, the third signal adapter line connects the third solder pad 3023 and the second thermistor 471, and the fourth signal adapter line connects the fourth solder pad 3024 and the third substrate 473.

[0253] As shown in Figures 21A, 21B, and 23, the projected area of ​​the receiving fiber array 5021 and the light receiving chip 5022 of the first light receiving component 502 on the lower surface of the circuit board 300 can be located within the first support portion 9041. This reduces the deformation of the projected area of ​​the receiving fiber array 5021 and the light receiving chip 5022 in the thickness direction of the circuit board 300, thereby maintaining the spacing between the receiving fiber array 5021 and the light receiving chip 5022 within a preset range. This reduces scattering and attenuation during optical signal transmission, thereby ensuring the responsivity of the light receiving chip 5022. Responsivity refers to the efficiency of the light receiving chip in converting optical signals into electrical signals. For example, the receiving fiber array 5021 of the first light receiving component 502 is bonded to the first bonding area 3013. The projected area of ​​the first bonding area 3013 and the area between the first bonding area 3013 and the first placement area 3015 on the lower surface of the circuit board 300 is located within the first support portion 9041.

[0254] In some embodiments, the projection area of ​​the receiving optical fiber array 5011 and the optical receiving chip 5012 of the second optical receiving component 501 on the lower surface of the circuit board 300 can be located within the second supporting portion 9042. For example, the receiving optical fiber array 5011 of the second optical receiving component 501 is bonded to the second bonding area 3012, and the projection area of ​​the second bonding area 3012 and the area between the second bonding area 3012 and the second placement area 3014 on the lower surface of the circuit board 300 is located within the second supporting portion 9042.

[0255] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present disclosure, rather than to limit them. Although the present disclosure has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the various embodiments of the present disclosure.

Claims

1. An optical module, comprising: Circuit boards; A supporting plate connected to the circuit board, having a first storage slot and a position-limiting support portion, wherein the position-limiting support portion comprises a glue dispensing boss, and at least two first support bosses are arranged on the glue dispensing boss, and an area between two of the first support bosses is configured as a glue dispensing area; A light emitting component, supported by the supporting plate and connected to the circuit board; A first light receiving component is disposed on the circuit board and is located on one side of the light emitting component; The first light receiving component and the light emitting component are arranged side by side along the width direction of the circuit board; Wherein, the light emitting component comprises: A laser chip array is disposed in the first storage slot, the laser chip array is arranged along the width direction of the circuit board, and is configured to emit a light signal; A first lens array, disposed in the first placement slot, the first lens array is located in the light emitting direction of the laser chip array, and is configured to collimate the optical signal emitted by the laser chip array; A second lens array, located in the collimation direction of the first lens array; An emitting optical fiber array is supported on the first supporting boss and is configured to receive the optical signal converged by the second lens array; the laser chip array, the first lens array, the second lens array and the emitting optical fiber array are arranged along the length direction of the circuit board; A first semiconductor refrigerator, the surface of which carries the laser chip array and the first lens array; the first semiconductor refrigerator comprises: a first electrode column; A second electrode column and the first electrode column are both located between the first lens array and the second lens array; The first circuit adapter board is located between the first lens array and the second lens array; one end of the first circuit adapter board is respectively connected to the first electrode column and the second electrode column, and the other end of the first circuit adapter board is connected to the circuit board.

2. The optical module according to claim 1, further comprising: A first thermistor, disposed on the first semiconductor refrigerator and located between the first lens array and the second lens array; The first lens array includes a collimating lens having a light-transmitting surface. The top surface of the first thermistor is lower than the light-transmitting surface. The first thermistor is located between two adjacent collimating lenses of the first lens array. 3 . The optical module according to claim 2 , wherein the top surface of the first circuit adapter board, the top surface of the first electrode column, and the top surface of the second electrode column are all lower than the light-transmitting surface.

4. The optical module according to claim 1, characterized in that: The circuit board has an embedding opening; the supporting plate is arranged in the embedding opening; A side wall of the embedding opening is provided with: A first pad; A second soldering pad and the first soldering pad are respectively connected to the other end of the first circuit adapter board; The other side wall of the embedding opening is connected to the one side wall of the embedding opening, and the surface is provided with: DSP chip; A high-frequency signal pad, one end of which is wire-bonded to the laser chip of the laser chip array to provide a high-frequency driving signal to the laser chip, and the other end of which is connected to the DSP chip; a first bonding area, bonded to the receiving optical fiber array of the first light receiving component; a first placement area, connected to the transimpedance amplifier chip of the first light receiving component; the first placement area is away from the embedding port relative to the first bonding area, and the transimpedance amplifier chip of the first light receiving component is connected to the DSP chip; The first bonding area includes a plurality of gold-plated points, and there are gaps between the plurality of gold-plated points so that the circuit board between the plurality of gold-plated points is exposed; and the first placement area is away from the embedding opening relative to the high-frequency signal pad.

5. The optical module according to claim 4, wherein: The supporting plate comprises: The supporting plate body supports the circuit board at its edge and supports the light emitting component in the middle; the limiting support portion is arranged on the supporting plate body, and the limiting support is configured to limit the position of the circuit board on the supporting plate The position limiting support portion comprises: A first position-limiting support portion connected to a side wall of the embedding opening; A second position-limiting support portion, arranged opposite to the first position-limiting support portion; A third position-limiting support portion, one end of which is connected to the first position-limiting support portion, and the other end of which is connected to the second position-limiting support portion; A supporting portion, used to support the circuit board, comprising: a first support portion; a second supporting portion, arranged opposite to the first supporting portion; Wherein, the first bonding area, and the area between the first bonding area and the first placement area are located within the first supporting portion in a projection area on the lower surface of the circuit board; The second bonding area and the area between the second bonding area and the second placement area are located within the second supporting portion in a projection area on the lower surface of the circuit board.

6. The optical module according to claim 4, wherein: The first circuit adapter board comprises: A first signal adapter wire, one end of which is connected to the first pad, and the other end of which is connected to the first electrode column; A second signal adapter wire, one end of which is connected to the second pad, and the other end of which is connected to the second electrode column; There is a gap between the first signal adapter wire and the second signal adapter wire.

7. The optical module according to claim 1, wherein: An isolator array is provided between the second lens array and the transmitting optical fiber array, and the isolator array is used to prevent the optical signal from returning along the original path, and the isolator array includes: Isolator; Magnetic parts, including: A supporting bottom plate, the upper surface of which is connected to the bottom surface of the isolator; A supporting plate is connected to the side of the isolator.

8. The optical module according to claim 1, wherein: A glue guiding groove is arranged around the glue dispensing boss, the glue guiding groove is recessed relative to the glue dispensing boss, and the glue guiding groove is used to guide the flow of glue.

9. The optical module according to claim 8, wherein: The limiting support part also includes a first limiting plate and a second limiting plate, the first limiting plate is located between the first storage groove and the glue guide groove, the transmitting optical fiber array is in contact with the first limiting plate, the second limiting plate is located between the glue guide groove and the edge of the supporting plate, and the side of the transmitting optical fiber array is in contact with the second limiting plate.

10. The optical module according to claim 9, wherein: The circuit board has an embedding opening, and the supporting plate is fixed to the embedding opening; There is a gap between the second limiting plate and the edge of the supporting plate corresponding to the second limiting plate, there is a gap between the first storage slot and the edge of the supporting plate corresponding to the first storage slot, the gap between the second limiting plate and the edge of the first storage slot and the supporting plate is the edge area of ​​the supporting plate, and the edge area of ​​the supporting plate is in contact with the lower surface of the circuit board; The embedding opening includes a first hollow area and a second hollow area, the first hollow area and the second hollow area are connected, the width of the second hollow area is smaller than the width of the first hollow area, the supporting plate is fixed to the first hollow area, and the second hollow area is used to place the optical fiber extending from the optical fiber group.

11. The optical module according to claim 9, wherein: The limiting support portion also has a second supporting boss, the first limiting plate is located in the middle of the second supporting boss, the second supporting boss is recessed relative to the first limiting plate, and the second supporting boss is configured to place an isolator, which is located between the first focusing lens group and the transmitting optical fiber array.

12. The optical module according to claim 8, wherein: The support plate also has a fulcrum groove, which is located at one end of the support plate away from the first storage groove, with a gap between the fulcrum groove and the transmitting optical fiber array, the fulcrum groove is recessed relative to the glue guide groove, and the fulcrum groove is close to the edge of the transmitting optical fiber array relative to the glue guide groove.

13. The optical module according to claim 1, wherein: Two of the at least two first supporting bosses are located at two ends of a diagonal line of the glue dispensing boss.

14. The optical module according to claim 1, wherein: The transmitting optical fiber array comprises a bottom plate layer, optical fibers and a cover plate layer, wherein the cover plate layer is covered on the bottom plate layer to form a second placement groove, and the second placement groove is configured to place the optical fibers; The length dimension of the bottom plate layer is greater than the length dimension of the cover plate layer.

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