Aerosol provision device

Abstract

An aerosol provision device (100) comprises an article receiving portion (110) for receiving, in use, an article (120) comprising aerosol generating material. The aerosol provision device (100) further comprises a heating device (125) configured to heat the article (120) received within the article receiving portion (110). The heating device (125) comprises at least one heating element (130) and a support element (140) to which the at least one heating element (130) is attached. The at least one heating element (130) comprises a semiconducting material.

Description

Technical Field

[0001] This disclosure relates to an aerosol supply device, an aerosol supply system, and a method for manufacturing an aerosol supply device. Background Technology

[0002] Cigarettes, cigars, and other smoking products burn tobacco during use to produce tobacco smoke. Attempts have been made to provide alternatives to these products by manufacturing products that release compounds without combustion. Examples of such products are so-called "heat-not-burn" products or tobacco heating devices or products that release compounds by heating rather than burning the material. The material can be, for example, tobacco or other non-tobacco products, which may or may not contain nicotine. Summary of the Invention

[0003] From a first perspective, an aerosol supply device is provided, comprising: The article receiving section is used to receive articles containing aerosol-generating materials during use; and A heating device is configured to heat the products in the work-in-process receiving section. The heating device includes: At least one heating element comprising a semiconductor material; and A support element, at least one heating element is attached to the support element.

[0004] Optionally, the semiconductor material includes at least one of the following: silicon carbide and gallium nitride.

[0005] Optionally, the support element includes a substantially planar support element, and at least one of the heating elements is substantially planar.

[0006] Optionally, the support element is tubular, and at least one of the heating elements is tubular.

[0007] Optionally, at least one heating element is attached to the inner surface of the support element.

[0008] Optionally, at least one heating element at least partially defines the article receiving portion.

[0009] Optionally, at least one heating element is arranged to contact the work-in-process when it is received within the work-in-process receiving portion.

[0010] Optionally, the support element is formed of electrically insulating and / or thermally insulating material.

[0011] Alternatively, the support element may be formed of borosilicate glass.

[0012] Optionally, the thickness of the support element is at least 80 micrometers, for example at least 100 micrometers.

[0013] Optionally, the thickness of at least one heating element is in the range of 10-500 micrometers, for example 50-100 micrometers.

[0014] Optionally, at least one heating element is deposited on the support element by at least one of physical vapor deposition and chemical vapor deposition.

[0015] Optionally, the support element has a coefficient of thermal expansion less than or equal to 20 x 10⁻⁶. -6 It is made of a material with a coefficient of thermal expansion of / K. This coefficient of thermal expansion can be a linear coefficient of thermal expansion.

[0016] Optionally, the support element is made of a material with a coefficient of thermal expansion that is substantially the same as that of the semiconductor material.

[0017] Optionally, at least one heating element is mechanically attached to the support element.

[0018] Optionally, at least one heating element and a support element together form a sub-assembly, which is assembled during manufacturing and then arranged within the aerosol supply device.

[0019] From another perspective, this disclosure provides an aerosol supply system, comprising: Aerosol supply device according to any of the above embodiments; and Products containing aerosol-generating materials.

[0020] On the other hand, a method for manufacturing an aerosol supply device is provided, the method comprising: Forming support elements; Attaching at least one heating element comprising a semiconductor material to a support element to form a sub-assembly; and The sub-components are arranged at least partially within the housing of the aerosol supply device.

[0021] Optionally, the method steps of attaching at least one heating element to the support element include depositing at least one heating element on the support element by at least one of physical vapor deposition and chemical vapor deposition.

[0022] Optionally, the method of attaching at least one heating element to a support element includes mechanically attaching at least one heating element to the support element. Attached Figure Description

[0023] Various embodiments will now be described by way of example only with reference to the accompanying drawings, wherein: Figure 1 A schematic representation of an aerosol supply system according to an embodiment of the present disclosure is shown; Figure 2aA heating device according to a first embodiment of the present disclosure is shown; Figure 2b A heating device according to a second embodiment of the present disclosure is shown; Figure 3 Another heating device according to a third embodiment of the present disclosure is shown; Figure 4a A heating device subassembly and its associated aerosol supply device housing according to an embodiment of the present disclosure are shown; Figure 4b An assembled aerosol supply device according to an embodiment of the present disclosure is shown; and Figure 5 A flowchart illustrating a method for manufacturing an aerosol supply device according to an embodiment of the present disclosure is shown. Detailed Implementation

[0024] As used herein, the term "aerosol-generating material" is a material capable of generating aerosols, for example, when heated, irradiated, or powered in any other way. Aerosol-generating materials may be in the form of, for example, a solid, liquid, or gel, and may or may not contain active substances and / or flavorings. Aerosol-generating materials may include any plant-based material, such as tobacco-containing materials, and may include, for example, one or more of tobacco, tobacco derivatives, expanded tobacco, reconstituted tobacco, or tobacco substitutes. Aerosol-generating materials may also include other non-tobacco products, depending on the product, which may or may not contain nicotine. Aerosol-generating materials may be in the form of, for example, a solid, liquid, gel, wax, etc. Aerosol-generating materials may also be, for example, a combination or mixture of materials. Aerosol-generating materials may also be referred to as "inhalable materials."

[0025] Aerosol-generating materials may include binders and aerosol-forming agents. Optionally, active substances and / or fillers may also be present. Optionally, a solvent (such as water) may also be present, and one or more other components of the aerosol-generating material may be soluble in the solvent or insoluble in the solvent. In some embodiments, the aerosol-generating material is substantially free of plant material. In some embodiments, the aerosol-generating material is substantially free of tobacco.

[0026] Aerosol-generating materials may include or may be "amorphous solids". Amorphous solids may be "monolithic solids". In some embodiments, the amorphous solid may be a dried gel. An amorphous solid is a solid material that can retain some fluid (such as a liquid) within it. In some embodiments, the aerosol-generating material may, for example, include from about 50 wt%, 60 wt%, or 70 wt% to about 90 wt%, 95 wt%, or 100 wt% of amorphous solids.

[0027] Aerosol-generating materials may include aerosol-generating membranes. Aerosol-generating membranes may include sheets or sheets that may optionally be pulverized to form pulverized sheets. Aerosol-generating sheets or pulverized sheets may be substantially tobacco-free.

[0028] According to this disclosure, a "non-combustible" aerosol supply system (sometimes also referred to as an "aerosol supply system") is an aerosol supply system in which the aerosol generating material is non-combustible or non-ignitable, so as to facilitate the delivery of at least one substance to a user.

[0029] In some implementations, the delivery system is a non-combustible aerosol supply system, such as a powered non-combustible aerosol supply system.

[0030] In some implementations, the non-combustible aerosol supply system is an electronic cigarette, also known as an evaporation device or electronic nicotine delivery system (END), although it is noted that the presence of nicotine in the aerosol generating material is not necessary.

[0031] In some implementations, the non-combustible aerosol supply system is an aerosol-generating material heating system, also known as a heated non-combustible system. An example of such a system is a tobacco heating system.

[0032] In some embodiments, the non-combustible aerosol supply system is a mixing system that uses a combination of aerosol-generating materials to generate aerosols, one or more of which can be heated. Each aerosol-generating material can be in, for example, solid, liquid, or gel form and may or may not contain nicotine. In some embodiments, the mixing system includes liquid or gel aerosol-generating materials and solid aerosol-generating materials. Solid aerosol-generating materials may include, for example, tobacco or non-tobacco products.

[0033] Typically, a non-combustible aerosol supply system may include a non-combustible aerosol supply device and consumables (sometimes referred to as “produced goods”) for use with the non-combustible aerosol supply device.

[0034] In some embodiments, this disclosure relates to consumables comprising aerosol-generating materials and configured for use with non-combustible aerosol supply devices. In this disclosure, such consumables are sometimes referred to as articles.

[0035] In some embodiments, a non-combustible aerosol supply system (such as a non-combustible aerosol supply device) may include a power source (e.g., an energy storage device) and a controller. The power source may be, for example, an electrical power source or an exothermic power source. In some embodiments, the exothermic power source includes a carbon substrate that can be powered to distribute power as heat to aerosol-generating or heat-transferring material adjacent to the exothermic power source.

[0036] In some embodiments, a non-combustible aerosol supply system may include an area for receiving consumables, an aerosol generator, an aerosol generation area, a housing, a nozzle, a filter, and / or an aerosol modifier.

[0037] In some embodiments, consumables for use with a non-combustible aerosol supply device may include aerosol generating material, aerosol generating material storage area, aerosol generating material transfer component, aerosol generator, aerosol generating area, housing, packaging, filter, nozzle and / or aerosol modifier.

[0038] The aerosol generating apparatus can receive articles containing aerosol generating material for heating. In this context, "article" refers to a component that includes or contains aerosol generating material (which is heated to atomize the aerosol generating material) and optionally other components in use. A user can insert the article into the aerosol generating apparatus before it is heated to generate an aerosol for subsequent inhalation by the user. The article may, for example, have a predetermined or specific size, configured to be arranged within a heating chamber of the apparatus sized to receive the article.

[0039] Figure 1 A schematic diagram of an aerosol supply system 102 according to an embodiment of the present disclosure is shown. The aerosol supply system 102 includes an aerosol supply device 100 according to an embodiment of the present invention, and an article 120 comprising aerosol-generating material. The aerosol supply device 100 includes an article receiving portion 110 configured to receive the article 120. The article receiving portion 110 may be in the form of a cavity or chamber within the aerosol supply device 100 for receiving the article 120 therein. However, it should be understood that the article receiving portion 110 may take any suitable form capable of appropriately receiving the article 120.

[0040] As depicted, article 120 may be detachable from aerosol supply device 100 (e.g., detachable or removable from the aerosol supply device). Article 120 may contain aerosol-generating material that, when heated, will generate an aerosol that can be inhaled by a user of the aerosol supply system 102. As described above, the aerosol-generating material may include any suitable material.

[0041] The aerosol supply device 100 also includes a heating device 125 configured to heat the article 120 when it is received in the article receiving portion 110. Since the heating device 125 heats the article 120 when it is received therein, it can be considered an aerosol generator. The heating device 125 includes a heating element 130 comprising a semiconductor material (e.g., at least partially formed therefrom); and a support element 140 to which the heating element 130 is attached. As will be understood, the semiconductor material of the heating element 130 may have resistance to current flowing through it. Therefore, the heating element 130 comprising semiconductor material can generate heat when current is applied to it. Therefore, the heating element 130 comprising semiconductor material can be considered to form a resistive heating element. The heating element 130 may be formed of semiconductor material.

[0042] In addition to the components described above, the aerosol supply device 100 may also include a power source 150. The power source 150 may include, for example, at least one of the following: a battery (which may be disposable or rechargeable), a rechargeable capacitor (e.g., a rechargeable supercapacitor), a rechargeable solid-state battery (SSB), a rechargeable lithium-ion battery (LiB) or the like, a sealed battery, a pouch battery, or some combination thereof. The power source 150 may be charged by plugging a power cord into the aerosol supply device 100, or the power source 150 may be replaceable, for example, in the form of a replaceable battery. Although not depicted, the aerosol supply device 100 may also include a controller configured to control the supply of electrical energy from the power source 150 to the heating device 125 (specifically, its heating element 130).

[0043] The aerosol supply device 100 may include various other components, such as activation switches or buttons, a central controller, and other components commonly found in aerosol supply devices. However, for the sake of brevity, these components will not be discussed here. Nevertheless, those skilled in the art will readily understand how to utilize some or all of these components, if necessary, when practicing the invention.

[0044] It has been found that when at least some semiconductor materials are used in the production of the heating element of the aerosol supply device 100, the heating element may be brittle and prone to breakage, for example, after being subjected to the stresses of daily use. The applicant has recognized that by attaching the heating element 130 (which includes semiconductor material) to the support element 140, the heating element 130 can be made more durable, for example, less prone to breakage. The support element 140 can be used to protect the heating element 130 from damage. When attached to the support element 140, the heating element 130 effectively acquires the strength characteristics of the support element 140, rather than the strength characteristics of the heating element 130 itself.

[0045] In some embodiments, the semiconductor material of the heating element 130 may include at least one of silicon carbide and gallium nitride. In embodiments where the semiconductor material includes silicon carbide, the silicon carbide may be doped with nitrogen or phosphorus to form an n-type semiconductor. Alternatively, silicon carbide may be doped with beryllium, boron, aluminum, or gallium to form a p-type semiconductor. Obtaining a p-type or n-type semiconductor allows the doped semiconductor to have a lower or higher conductivity upon heating, respectively. Therefore, a suitable selection of semiconductor material type and doping type can be made to obtain a heating element 130 with the desired characteristics for the heat of generation suitable for a particular aerosol supply device.

[0046] In some embodiments, the heating device 125 may include a plurality of heating elements 130. Each of the plurality of heating elements 130 may be attached to the same support element 140 or to different support elements. Each of the plurality of heating elements 130 may have substantially the same shape, or they may each vary in physical dimensions to deliver a specific and customized heat distribution to the article 120. In some embodiments, the heating element 130 (or each heating element when multiple heating elements are provided) may have a length that corresponds to the length of the article receiving portion 110. Figure 1 The length L depicted in the figure is substantially the same. In other embodiments, at least one heating element 130 may extend along a portion of the length L of the article receiving portion 110.

[0047] The heating device 125 may take any suitable form, and its specific form may depend on the type of article 120 used with it or the type of aerosol-generating material therein. Figure 2a , Figure 2b , Figure 3 Different forms and shapes of the heating element relative to the supporting element are shown, and will be discussed in more detail below. These embodiments are merely... Figure 1 Examples of possible forms of the heating device 125 shown. As will be understood, those skilled in the art will be able to implement various shapes of the heating element 130. For example, the cross-section of the heating element may be irregular, or it may vary in shape and size along one or more of its axes.

[0048] The support element, and thus the heating element attached thereto, can have any suitable form. In some embodiments, the support element may include a substantially planar support element, such as... Figure 2a and Figure 2b As shown, exemplary heating devices 225a and 225b are illustrated. Figure 2aAs shown, the heating device 225a may include a substantially (e.g., completely) planar support element 240a to which the heating element 230a may be attached. As depicted, the heating element 230a may similarly be substantially (e.g., completely) planar. Such a heating device 225a can be used for... Figure 1 The aerosol supply device 100 shown. Figure 2a The substantially planar heating device 225a shown is very suitable for heating substantially planar products.

[0049] In some embodiments, the aerosol supply device 100 may utilize multiple heating elements as part of a heating device.

[0050] like Figure 2a As shown, the heating element 230a may have the same size and shape as the support element 240a, such that the heating element 230a contacts the entire surface of the support element 240a.

[0051] Alternatively, in some implementations, such as Figure 2b As shown, the support element 240b may be larger than the heating element 230b in planar dimensions, but it may also be smaller. Having the support element 240b have a larger planar dimension than the heating element 230b it supports can advantageously allow for improved overall robustness of the heating device 225b.

[0052] The substantially planar heating elements 225a, 225b can be positioned (e.g., arranged to define) along one or more sides of the article receiving portion 110. In some embodiments, the article receiving portion 110, for example, has four sides in its longitudinal direction. Figure 2a , Figure 2b The heating devices 225a and 225b of the type shown can be positioned along each of the four sides.

[0053] While in some embodiments the support element may be substantially planar, it should be understood that the support element may take any other suitable shape. In some embodiments, the support element may be tubular. This is in Figure 3The diagram illustrates an exemplary heating device 325 having a tubular support element 340 and a heating element 330 attached to the tubular support element. In such an embodiment, the tubular support element 340 and the heating element 330 may surround an article receiving portion 310. In some embodiments, the tubular support element 340 and the heating element 330 may be used to define the article receiving portion 310. At least one heating element 330 may also be tubular, as depicted. The tubular shape of the support element 340 and the heating element 330 may have a constant cross-sectional area in the direction along the longitudinal axis of the heating device 325. Alternatively, in some embodiments, the cross-sectional area may vary continuously or discontinuously along the longitudinal axis. For example, the support element 340 may taper toward the distal end, and the heating element 330 may have the same configuration.

[0054] Although Figure 3 The tubular heating device 325 depicted has a circular cross-section, but it should be understood that the configuration of the tubular heating device 325 can be extended to articles of other shapes. For example, the heating element 330 and the support element 340 can be arranged as concentric quadrilaterals or hexagonal hollow prisms. In other words, although the cross-section of the tubular heating device 325 is circular, the cross-section can also be quadrilateral or hexagonal. Any shape of cross-section can be used, and it can be constructed from a single heating element and a single support element, or from multiple heating elements and support elements combined to form the desired cross-section. The flexibility of arranging the heating elements and support elements in this way allows for the support of receiving portions of articles of any suitable shape.

[0055] like Figure 3 As shown, the heating element 330 can be attached to the inner surface 345 of the support element 340, wherein the heating element 330 is in complete contact with the inner surface 345 of the support element 340. However, in some embodiments, the heating element 330 may be attached to the support element 340 by only contacting a portion of the surface of the support element 340. That is, gaps may exist between the heating element 330 and the support element 340, which may allow for improved cooling of the heating element 330 when the aerosol supply device 100 is not in use. For example, the support element 340 may include protrusions to which the heating element 330 is attached. In some embodiments, the gaps may be filled with a thermally insulating material to prevent heat loss from the heating element 330 to other locations in the device.

[0056] Return to reference Figure 1 The article receiving portion 110 within the aerosol supply device 100 may be at least partially defined by any suitable portion of the device 100. However, in some embodiments, at least a portion of the article receiving portion 110 is defined by the heating element 130 of the heating device 125. For example, in... Figure 3This may be the case in the embodiment of the heating device 325 shown, where the heating element 330 defines the article receiving portion 310. Any of the heating devices 225a, 225b, 325 described above can be used... Figure 1 The aerosol supply device 100 shown.

[0057] Return to reference Figure 1 When the article 120 is inserted into the article receiving portion 110, the article 120 can directly contact one of the heating elements 130. In some embodiments, the article 120 can contact multiple of the heating elements 130 of the aerosol supply device 100. In some embodiments, the article 120 can contact all the heating elements of the heating device 125 of the aerosol supply device 100. This ensures that as much heat as possible is transferred from the heating elements 130 to the article 120, thereby effectively heating the aerosol-generating material within the article 120. When provided with... Figure 3 In the case of the tubular heating element 330 shown, the article 120 can substantially contact all exposed surfaces of the tubular heating element 330, for example, contact all exposed surfaces.

[0058] refer to Figure 1 Some exemplary embodiments of the aerosol supply device 100 will now be described, specifically relating to a heating device 125 including a support element 140 and a heating element 130. However, it should be understood that the features of the various embodiments discussed below can be equally applied to heating devices 225a, 225b, 325, for example, to their heating elements and support elements. The support element 140 may be formed of an electrically insulating material. In some embodiments, the support element 140 is formed of a thermally insulating material. In another embodiment, the support element 140 is formed of a material that is both electrically and thermally insulating. This can protect the rest of the aerosol supply device 100 from the high temperature of the heating element 130 when it is powered. Using an electrically insulating material also prevents any current flowing through the heating element 130 from causing an electrical short circuit to any other electrical component of the device 100. The electrically insulating material may, for example, be a ceramic or polymer-based material. The thermally insulating material may be a ceramic or polymer-based material.

[0059] In some embodiments, the support element 140 may be formed of borosilicate glass. The support element 140 formed of this material can be more resistant to thermal shock than other common glasses, and thus can remain unbroken under more extreme temperature differences.

[0060] In some embodiments, the thickness of the support element 140 may be at least 80 micrometers, preferably at least 100 micrometers. For example, the support element 140 may be made of Corning® Willow® Glass or other similar thin glass types. Forming the support element 140 from a flexible material, such as Willow® Glass, allows the support element 140 to take any shape required for the specific arrangement of supporting the heating element 130.

[0061] In some embodiments, the thickness of the heating element 130 can be in the range of 10-500 micrometers, preferably between 50-100 micrometers. This thickness range allows the heating element 130 to occupy less space in the aerosol supply device 100, thus making the entire device 100 more compact. It can also provide a heating element 130 with appropriate resistance characteristics to generate a suitable level of heat for aerosol generation.

[0062] The heating element 130 can be attached to the support element 140 in any suitable manner. The heating element 130, comprising semiconductor material, can be attached to the support element 140 using chemical vapor deposition techniques such as atomic layer deposition. In some embodiments, the heating element 130, comprising semiconductor material, can be deposited using physical vapor deposition techniques such as plasma vapor deposition. In other embodiments, particularly when a thickness closer to 10 micrometers is desired, molecular beam epitaxy can be used to perform the deposition of the heating element 130 on the support element 140. It should be understood that depositing the heating element 130 in this manner can also be considered as forming the heating element 130 on the support element 140. In the embodiments discussed above, the joints at the interface between the heating element 130 formed during physical vapor deposition or chemical vapor deposition and the surface of the support element 140 serve to attach the two elements together. Therefore, these joints provide attachment.

[0063] The coefficient of thermal expansion of the material used to form the support element 140 can be less than or equal to 20 x 10⁻⁶. -6 / K. This coefficient of thermal expansion can be a linear coefficient of thermal expansion.

[0064] To reduce the mechanical stress and / or strain experienced by the semiconductor material of the heating element 130 and its attached support element 140, the materials selected for the heating element 130 and the support element 140 should have substantially the same coefficient of thermal expansion. This ensures that as the heating device 125 expands and contracts in continuous heating and cooling cycles, the heating element 130 and the support element 140 expand and contract at substantially the same rate, thereby reducing the chance of introducing micro- or macro-defects (such as cracks or lattice dislocations) into the materials. In some embodiments, the difference in the coefficients of thermal expansion between the heating element 130 and the support element 140 may be less than 10%, for example, less than 5%.

[0065] Figure 4a One embodiment is shown in which the heating device 425 is formed by a sub-assembly 415 consisting of at least one heating element 430 and at least one support element 440 attached together. For example... Figure 4a As shown, sub-assembly 415 can define the article receiving portion 410. Heating device 425 can have, for example... Figure 3 The tubular configuration is shown, but any other configuration described above is also suitable depending on the desired form factor. Sub-assembly 415 is a separate component that can be arranged within space 405 in housing 401 of aerosol supply device 400 during assembly of aerosol supply device 400.

[0066] like Figure 4a As shown, in some embodiments, the heating element 430 can be attached to the support element 440 by a mechanical means. The mechanical means may include, for example, at least one snap fastener 445 arranged to attach (e.g., retain) the heating element 430 against the support element 440. The mechanical means (e.g., at least one snap fastener 445) may be integrally formed with the support element 440. The mechanical means may include any suitable arrangement for retaining the heating element 430 against the support element 440; the depicted snap fastener 445 is merely an example. In alternative embodiments, portions of the heating element 430 may have protrusions that are received in corresponding recesses in the support element 440, and the two elements may be held together by friction. In other embodiments, the heating element 430 may be attached to the support element 440 by any other suitable means (e.g., by physical vapor deposition or chemical vapor deposition as described above). In some embodiments, as an alternative to or supplement to the mechanical means, the heating element 430 may be attached to the support element 440 by an adhesive (e.g., glue). In some embodiments, the mechanical device may be configured to form an interference fit between the heating element 430 and the support element 440.

[0067] Figure 4bAn assembled aerosol supply device 400 is shown, with a sub-assembly 415 inserted into a space 405 of the housing 401. As in other embodiments, the aerosol supply device 400 has a heating device 425 and an article receiving portion 410 when the heating device 425 is inserted into the space 405. Manufacturing the sub-assembly 415 in this manner allows for a simpler construction of the aerosol supply device 400. It also allows for easier attachment of the heating element 430 to the support element 440. In embodiments where the semiconductor material of the heating element 430 is deposited on the support element 440 using chemical or physical vapor deposition techniques, forming the sub-assembly 415 facilitates the application of these techniques during the deposition process.

[0068] In addition to the various embodiments of the aerosol supply device discussed above, a method 500 for manufacturing the aerosol supply device 400 is also provided, such as... Figure 5 As shown. For ease of reference, the reference will be... Figure 4a , Figure 4b The method is described using the aerosol supply device 400 shown herein, but it should be understood that the method can be applied to any of the embodiments described herein.

[0069] In step 510, a support element 440 is formed. The support element 440 can be formed by any suitable method, and the material chosen can be any suitable material, such as the borosilicate glass mentioned above. Next, step 520 involves attaching at least one heating element 430 to the support element 440, thereby forming the sub-assembly 415 as described above. In some embodiments, attaching at least one heating element 430 to the support element 440 can be achieved by any of the methods described above, for example, by using at least one of chemical vapor deposition and physical vapor deposition. When the heating element 430 is deposited onto the support element 440 using chemical or physical vapor deposition, a joint at the interface between the heating element 430 and the surface of the support element 440 serves to attach the two elements together. Alternatively, some embodiments of step 520 may involve mechanically attaching at least one heating element 430 to the support element 440. In other embodiments, attaching at least one heating element 430 to the support element 440 may include using mechanical attachment as well as at least one of chemical vapor deposition and physical vapor deposition. Other embodiments may include attachment using some form of adhesive.

[0070] After the sub-component 415 is formed, in step 530, the sub-component 415 may be arranged at least partially within the housing 401 of the aerosol supply device 400. In some embodiments, the sub-component 415 may be housed (e.g., completely housed) within the housing 401 of the aerosol supply device 400.

[0071] By performing the steps of the above method, the resulting aerosol supply device 400 can be manufactured more easily, and it can be repaired and maintained more easily when necessary.

[0072] Although the aerosol supply device is described in various embodiments herein as including an article receiving portion, it should be understood that the article receiving portion may alternatively be (e.g., replaced by) an aerosol receiving portion configured to receive an aerosol generating material (e.g., in liquid form), which may or may not be part of the article.

[0073] The various embodiments described herein are provided only to aid in understanding and teaching the claimed features. These embodiments are provided as representative examples of implementation and are not exhaustive or / or exclusive. It should be understood that the advantages, embodiments, examples, functions, features, structures, and / or other aspects described herein should not be considered as limitations on the scope of the invention as defined by the claims, nor as limitations on the equivalents of the claims, and that other embodiments and modifications may be utilized without departing from the claimed scope of the invention. Various embodiments of the invention may suitably comprise, consist of, or substantially consist of suitable combinations of elements, components, features, portions, steps, devices, etc., disclosed beyond those specifically described herein. Furthermore, this disclosure may include other inventions not currently claimed but which may be claimed in the future.

Claims

1. An aerosol supply device, comprising: The article receiving section is used to receive articles containing aerosol-generating materials during use; as well as A heating device configured to heat a product received within the product receiving section, the heating device comprising: At least one heating element comprising a semiconductor material; as well as A support element, wherein the at least one heating element is attached to the support element.

2. The aerosol supply device according to claim 1, wherein the semiconductor material comprises at least one of the following: silicon carbide and gallium nitride.

3. The aerosol supply device according to any one of the preceding claims, wherein the support element comprises a substantially planar support element, and wherein the at least one heating element is substantially planar.

4. The aerosol supply device according to any one of the preceding claims, wherein the support element is tubular, and wherein the at least one heating element is tubular.

5. The aerosol supply device according to any one of the preceding claims, wherein the at least one heating element is attached to the inner surface of the support element.

6. The aerosol supply device according to any one of the preceding claims, wherein the at least one heating element at least partially defines the article receiving portion.

7. The aerosol supply device according to any one of the preceding claims, wherein the support element is formed of borosilicate glass.

8. The aerosol supply device according to any one of the preceding claims, wherein the thickness of the support element is at least 80 micrometers, for example, at least 100 micrometers.

9. The aerosol supply device according to any one of the preceding claims, wherein the thickness of the at least one heating element is in the range of 10-500 micrometers, for example, the thickness is in the range of 50-100 micrometers.

10. The aerosol supply device according to any one of the preceding claims, wherein the at least one heating element is deposited on the support element by at least one of physical vapor deposition and chemical vapor deposition.

11. The aerosol supply device according to any one of the preceding claims, wherein the support element is made of a material whose coefficient of thermal expansion is substantially the same as that of the semiconductor material.

12. The aerosol supply device according to any one of the preceding claims, wherein the at least one heating element is mechanically attached to the support element.

13. The aerosol supply device according to any one of the preceding claims, wherein the at least one heating element and the support element together form a sub-assembly, the sub-assembly being assembled during manufacturing and then arranged within the aerosol supply device.

14. An aerosol supply system, comprising: Aerosol supply device according to any one of the preceding claims; as well as Products containing aerosol-generating media.

15. A method for manufacturing an aerosol supply device, the method comprising: Forming support elements; At least one heating element comprising a semiconductor material is attached to the support element to form a sub-assembly; as well as The sub-component is arranged at least partially within the housing of the aerosol supply device.

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