Method of manufacturing a device

Abstract

The manufacturing method of the device of the present invention includes the following steps: Step 1, forming a plurality of elements on an element substrate in a laminate comprising a support substrate, an adhesive layer and an element substrate, to obtain a laminated substrate having a support substrate, an adhesive layer and element components comprising the element substrate and a plurality of elements stacked sequentially; Step 2, performing a first process and a second process, wherein the first process cuts the support substrate, the adhesive layer and the element components in the edge region of the laminated substrate, and the second process provides continuous or discontinuous cuts through the element substrate and reaching the adhesive layer in the region of the laminated substrate where no elements exist to divide the plurality of elements; Step 3, providing a protective layer on the element components of the laminated substrate; Step 4, separating the laminated components comprising the element components and the protective layer from the adhesive layer and the element components by mechanical peeling; and Step 5, peeling the protective layer from the element components in the laminated components to obtain a device monolithically formed by each element.

Description

Technical Field

[0001] This invention relates to a method for manufacturing a device. Background Technology

[0002] Currently, electronic devices include solar cells (PV), liquid crystal panels (LCD), organic OLED panels, and communication modules. Furthermore, there are light-receiving sensors that detect electromagnetic waves, X-rays, ultraviolet light, visible light, or infrared light. In addition, there are various electronic devices that detect acceleration, sound, and contact. A method for manufacturing an electronic device has been proposed (Patent Document 1).

[0003] Patent Document 1 discloses a method for manufacturing an electronic device using a laminate. The laminate sequentially comprises: a support substrate having hydroxyl groups on its surface, and the support substrate being a glass plate or a silicon wafer; an organosilicon resin layer having hydroxyl groups; and a substrate. The substrate is a polyimide resin substrate, or a laminated substrate having at least one layer each of a polyimide resin substrate and a gas barrier film. The peel strength between the organosilicon resin layer and the substrate of the laminate is greater than the peel strength between the support substrate and the organosilicon resin layer. More specifically, the method for manufacturing the electronic device described in Patent Document 1 includes: a component forming step, forming electronic device components on the surface of the substrate of the laminate to obtain a laminate containing electronic device components; and a separation step, removing the support substrate containing the support substrate and the organosilicon resin layer from the laminate containing the electronic device components to obtain an electronic device having a substrate and electronic device components.

[0004] Existing technical documents

[0005] Patent documents

[0006] Patent Document 1: International Publication No. 2019 / 142750 Summary of the Invention

[0007] In Patent Document 1, when forming electronic device components on a substrate of a laminate, a resin solution (such as a photoresist solution) or inorganic material used in the manufacture of the electronic device comes into contact with the end faces of the laminate, forming a film that extends across the end faces of the supporting substrate, the silicone resin layer, and the substrate. Because of this film, mechanical peeling between the substrate and the silicone resin layer is difficult, resulting in difficulties in manufacturing the electronic device.

[0008] Furthermore, in electronic devices and other components, substrate thinning is underway. When the substrate is thin, it is easily damaged, making it difficult to monolithically manufacture devices formed on the substrate after peeling it off from the silicone resin layer. Additionally, monolithically manufacturing devices before peeling off the substrate from the silicone resin layer requires peeling the substrate from the silicone resin layer for each device, resulting in low production efficiency. Moreover, thin substrates are easily damaged, making this even more difficult. Therefore, when thinning the substrate, it is difficult to efficiently manufacture monolithically manufactured devices, and currently, there is no effective method for manufacturing such devices.

[0009] The purpose of this invention is to provide a method for manufacturing a device that enables the fabrication of a monolithic device even when the substrate is thinned.

[0010] The inventors conducted in-depth research and found that the above-mentioned problems can be solved by the following configuration.

[0011] A method for manufacturing a device includes: step 1, forming a plurality of elements on a component substrate in a laminate comprising a support substrate, an adhesive layer, and a component substrate, to obtain a laminated substrate having a support substrate, an adhesive layer, and component components comprising the component substrate and the plurality of elements sequentially stacked; step 2, performing a first processing and a second processing, wherein the first processing cuts the support substrate, the adhesive layer, and the component components at an edge region of the laminated substrate, and the second processing divides the plurality of elements by providing continuous or discontinuous cuts through the component substrate and reaching the adhesive layer in regions of the laminated substrate where no elements exist; step 3, providing a protective layer on the component components of the laminated substrate; step 4, separating the laminated component comprising the component components and the protective layer from the adhesive layer and the component components by mechanical peeling; and step 5, peeling the protective layer from the component components in the laminated component to obtain a device monolithically formed for each component.

[0012] (2) The manufacturing method of the device according to (1) further includes, prior to step 1, the following step: thinning the thickness of the glass substrate in a laminated substrate comprising a support substrate, an adhesive layer and a glass substrate to obtain a laminate comprising a support substrate, an adhesive layer and a component substrate.

[0013] (3) The manufacturing method of the device according to (1) further includes, prior to step 1, the following step: thinning the thickness of the first glass substrate and the second glass substrate in a laminated substrate comprising a first glass substrate, an adhesive layer and a second glass substrate, to obtain a laminate comprising a support substrate, an adhesive layer and an element substrate, wherein the thickness of the support substrate is thicker than the thickness of the element substrate.

[0014] (4) A method for manufacturing a device according to any one of (1) to (3), wherein, in step 2, a cut is made by laser irradiation.

[0015] (5) A method for manufacturing a device according to any one of (1) to (4), wherein the thickness of the element substrate is 250 μm or less.

[0016] (6) A method for manufacturing a device according to any one of (1) to (5), wherein the sealing layer comprises an organosilicon resin.

[0017] (7) A method for manufacturing a device according to any one of (1) to (6), wherein, in step 2, the first process and the second process are performed simultaneously by laser irradiation.

[0018] (8) A method for manufacturing a device according to any one of (1) to (7), wherein, between step 4 and step 5, a further step is performed: a process for reducing the adhesion between the protective layer and the component parts is carried out.

[0019] According to the present invention, a method for manufacturing a device is provided that enables the fabrication of a monolithic device even when the substrate is thinned. Attached Figure Description

[0020] Figure 1 This is a schematic cross-sectional view of one step in an example of a method for manufacturing a device according to an embodiment of the present invention.

[0021] Figure 2 This is a schematic cross-sectional view of one step in an example of a method for manufacturing a device according to an embodiment of the present invention.

[0022] Figure 3 This is a schematic cross-sectional view of one step in an example of a method for manufacturing a device according to an embodiment of the present invention.

[0023] Figure 4 This is a schematic cross-sectional view of one step in an example of a method for manufacturing a device according to an embodiment of the present invention.

[0024] Figure 5 This is a schematic cross-sectional view of one step in an example of a method for manufacturing a device according to an embodiment of the present invention.

[0025] Figure 6 This is a schematic cross-sectional view of one step in an example of a method for manufacturing a device according to an embodiment of the present invention.

[0026] Figure 7 This is a schematic cross-sectional view of one step in an example of a method for manufacturing a device according to an embodiment of the present invention.

[0027] Figure 8This is a schematic cross-sectional view of one step in an example of a method for manufacturing a device according to an embodiment of the present invention.

[0028] Figure 9 This is a schematic cross-sectional view of one step in an example of a method for manufacturing a device according to an embodiment of the present invention.

[0029] Figure 10 This is a schematic plan view illustrating an example of the arrangement of elements in an embodiment of the present invention.

[0030] Figure 11 This is a schematic cross-sectional view illustrating a first example of a method for manufacturing a laminate used in a device manufacturing method according to an embodiment of the present invention.

[0031] Figure 12 This is a schematic cross-sectional view illustrating a second example of a method for manufacturing a laminate used in a device manufacturing method according to an embodiment of the present invention. Detailed Implementation

[0032] Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. However, the following embodiments are merely examples to illustrate the present invention, and the present invention is not limited to the embodiments shown below. It should be noted that various modifications and substitutions can be made to the following embodiments without departing from the scope of the present invention.

[0033] The numerical range indicated by “~” below refers to the range including the values ​​recorded before and after “~” as the lower and upper limits.

[0034] The manufacturing method of the device of the present invention is characterized by comprising: step 1, forming a plurality of elements on an element substrate in a laminate comprising a support substrate, an adhesive layer and an element substrate, to obtain a laminated substrate having a support substrate, an adhesive layer and element components comprising the element substrate and a plurality of elements stacked sequentially; step 2, performing a first process and a second process, wherein the first process cuts the support substrate, the adhesive layer and the element components in the edge region of the laminated substrate, and the second process divides the plurality of elements by providing continuous or discontinuous cuts through the element substrate and reaching the adhesive layer in the region of the laminated substrate where no elements exist; step 3, providing a protective layer on the element components of the laminated substrate; step 4, separating the laminated components comprising the element components and the protective layer by mechanical peeling between the adhesive layer and the element components; and step 5, peeling the protective layer from the element components to obtain a device monolithically formed by each element.

[0035] Therefore, when multiple components are formed on a component substrate, even if the resin solution (resist solution, etc.) or inorganic material used in the component formation comes into contact with the end faces of the laminate, forming a film that covers the end faces of the support substrate, the adhesive layer, and the component substrate, the film can be removed by cutting the support substrate, the adhesive layer, and the component components in the edge region of the laminate. This does not hinder the mechanical peeling between the adhesive layer and the component components, thus achieving the desired effect.

[0036] Furthermore, in the device manufacturing process, the substrate of the component is being made thinner. When the substrate is thin, it is easily damaged, and after peeling it off from the adhesive layer, it is difficult to monolithically integrate the components formed on the substrate. Additionally, monolithically integrating the components before peeling off the adhesive layer requires peeling the adhesive layer off for each component, resulting in low production efficiency. Moreover, if the substrate is thin, it is easily damaged, making the process even more difficult.

[0037] However, by creating continuous or discontinuous cuts through the component substrate and reaching the bonding layer in areas where no components exist in the laminated substrate, multiple components can be separated according to each component, regardless of the thickness of the component substrate, without peeling the bonding layer off each component, thus enabling the efficient fabrication of monolithic devices.

[0038] <An example of a device manufacturing method>

[0039] Figures 1-9 This is a schematic cross-sectional view illustrating an example of a manufacturing method for a device according to an embodiment of the present invention, arranged in the order of process steps. Figure 10 This is a schematic plan view illustrating an example of the arrangement of elements in an embodiment of the present invention.

[0040] In the manufacturing method of the device in this embodiment, preparation Figure 1 The laminate shown includes a support substrate 10, an adhesive layer 12, and a component substrate 14.

[0041] In the laminate 15, an adhesive layer 12 is disposed on the surface 10a of the support substrate 10, and a component substrate 14 is disposed on the surface 12a of the adhesive layer 12. The support substrate 10, the adhesive layer 12, and the component substrate 14 are laminated in the lamination direction Ds.

[0042] Next, as Figure 2 As shown, a plurality of elements 16 are formed on the element substrate 14 in the laminate 15. Thus, a laminated substrate 18 (step 1) is obtained, in which a support substrate 10, an adhesive layer 12, and an element component 17 containing the element substrate 14 and the plurality of elements 16 are sequentially stacked. The element component 17 has a plurality of elements 16 disposed on the surface 14a of the element substrate 14.

[0043] For example, the stacked substrate 18 Figure 10 As shown, on the surface 14a of the component substrate 14, a plurality of components 16 are arranged in a two-dimensional shape with spacing between them. Figure 2 The cross section shown is equivalent to Figure 10 The cross section of line A-A.

[0044] Next, as Figure 3 As shown, the first and second processes are performed. In the first process, the support substrate 10, the sealing layer 12 and the component 17 are cut along the stacking direction Ds in the edge region 18d of the laminated substrate 18. In the second process, a continuous or discontinuous cut 19b is made along the stacking direction Ds in the region 18b of the laminated substrate 18 where there are no components 16 to divide a plurality of components 16 (step 2).

[0045] In step 2, during the first process described above, along... Figure 10 The first cut line Lf setting shown Figure 3 The cut 19a shown is a continuous or discontinuous cut that penetrates the component substrate 14 and reaches the support substrate 10, and is a full cut relative to the support substrate 10, the sealing layer 12 and the component component 17. Figure 10 The outer edge region 18d of the first cut line Lf shown is a cut-off portion. The outer edge region 18d of the first cut line Lf is removed as an unwanted portion. Thus, a layer is formed on the laminated substrate 18. Figure 4 The new end face 18e is shown.

[0046] In step 2, in the second process described above, along Figure 10 The second cut line Lh shown is formed Figure 3 The cut 19b is shown. The second cut line Lh is provided in the region 18b of the laminated substrate 18 where no component 16 exists. The cut 19b is a continuous or discontinuous cut that penetrates the component substrate 14 and reaches the bonding layer 12, and is a half-cut that does not cut through the support substrate 10. Through the cut 19b, a component substrate 14 is divided into multiple substrates 14d, and the component 16 is divided in a state where it is disposed on the substrate 14d of the component substrate 14. For example Figure 3 As shown, a component 16 is disposed on a substrate 14d obtained by separating the component substrate 14.

[0047] The aforementioned cuts 19a and 19b can be formed, for example, by laser irradiation or blade cutting.

[0048] The aforementioned continuous cut 19a refers to the state in which the cut 19a is formed without gaps along the first cut line Lf. The aforementioned discontinuous cut 19a refers to the state in which the cut 19a is formed by setting up areas where the cut 19a is not formed at predetermined intervals along the first cut line Lf.

[0049] The aforementioned continuous cut 19b refers to the state in which the cut 19b is formed seamlessly along the second cut line Lh. The aforementioned discontinuous cut 19b refers to the state in which the cut 19b is formed by setting up areas where no cut 19b is formed at predetermined intervals along the second cut line Lh.

[0050] Next, as Figure 4 As shown, a protective layer 20 is provided on the component 17 of the laminated substrate 18 to protect the component 17 (step 3). The protective layer 20 is applied to the component 17 of the laminated substrate 18 using a known laminator, and more specifically, to cover a plurality of components 16 on the surface 14a of the component substrate 14. The protective layer 20 can also be formed by applying a protective layer precursor liquid to the component 17 and then curing it by ultraviolet irradiation and heat treatment. The configuration including the component 17 and the protective layer 20 is referred to as the laminated component 24.

[0051] Next, as Figure 5 As shown, the adsorption pad 22 is adsorbed onto the surface 20a of the protective layer 20, for example, using a vacuum. It should be noted that the adsorption pad 22 is not limited to using a vacuum; it could also be an electrostatic chuck.

[0052] Next, as Figure 6 As shown, the laminated component 24 containing the element component 17 and the protective layer 20 is separated from the sealing layer 12 and the element component 17 by mechanical peeling while the adsorption pad 22 is adsorbed on the surface 20a of the protective layer 20 (step 4).

[0053] In step 4, the adhesive layer 12 is mechanically peeled from the component 17 using the surface 12a of the adhesive layer 12 as the peeling interface, separating the laminated component 24 and the support substrate 10. The mechanical peeling between the adhesive layer 12 and the component 17 can be performed using a known peeling device.

[0054] Here, as a mechanical peeling method, for example, is to bend the support substrate 10 or the component substrate 14 to peel the component substrate 14 from the adhesive layer 12.

[0055] In addition, for example, a method of peeling by applying physical force (bending, etc.) to the interface between the component substrate 14 and the adhesive layer 12 can be used. In this case, a scraper can also be pressed against the edge of the component substrate 14 to apply shear force (physical force) to the interface between the component substrate 14 and the adhesive layer 12 for peeling.

[0056] Alternatively, when performing mechanical peeling, a blade can be inserted into the sealing layer 12 to set a peeling starting point on the sealing layer 12.

[0057] Next, for example, stop using the adsorption pad 22, such as Figure 7 The absorbent pad 22 is removed from the surface 20a of the protective layer 20, as shown.

[0058] Next, as Figure 8 As shown, the protective layer 20 is peeled off from the component 17 in the stacked assembly 24. If the protective layer 20 is peeled off from the component 17 in the stacked assembly 24, a component substrate 14 is separated into multiple substrates 14d through the cut 19b, as shown. Figure 9 As shown, device 26, which is monolithically generated from component 17, is obtained (step 5).

[0059] Device 26 is, for example, a configuration in which a component 16 is disposed on a substrate 14d obtained by separating the component substrate 14.

[0060] Furthermore, in the manufacturing method of the device, it is preferable to further include a process between the above-mentioned process 4 and process 5 to reduce the adhesion force between the protective layer 20 and the component 17.

[0061] More specifically, such as Figure 8 As shown, when peeling the protective layer 20 from the element component 17 in the laminated component 24, if the protective layer 20 has properties that decrease in adhesion within a specific temperature range, then as a process to reduce adhesion, a cooling treatment or a heating treatment is performed according to the characteristics of the protective layer 20. If the protective layer 20 has properties that decrease in adhesion due to ultraviolet light, then as a process to reduce adhesion, an ultraviolet light exposure treatment is performed. As a result, the adhesion between the protective layer 20 and the element component 17 is reduced, and the protective layer 20 can be easily peeled off from the surface 14a of the element substrate 14.

[0062] In the manufacturing methods of devices, such as Figure 2 As shown, when forming a component 16 on a component substrate 14, the resin solution (resist solution, etc.) and inorganic materials used in forming the component 16 come into contact with the end face 14c of the component substrate 14, the end face 12c of the adhesive layer 12, and the end face 10c of the support substrate 10. In the laminated substrate 18, a film (not shown) is formed throughout the end face 14c of the component substrate 14, the end face 12c of the adhesive layer 12, and the end face 10c of the support substrate 10. However, by setting the first process... Figure 3 The cut 19a shown removes the edge region 18d of the laminated substrate 18 as an unwanted portion. Therefore, even though the aforementioned film is formed on the laminated substrate 18, since the film is removed, thus... Figure 6As shown, when the laminated component 24 containing the component 17 and the protective layer 20 is separated from the component 17 by mechanical peeling (step 4), mechanical peeling is not hindered.

[0063] In the device manufacturing method, a first processing and a second processing are performed in step 2. The first processing cuts the support substrate 10, the adhesive layer 12, and the component 17 at the edge region 18d of the laminated substrate 18. The second processing divides the laminated substrate 18 into multiple components 16 by creating cuts 19b through the component substrate 14 and reaching the adhesive layer 12 in areas where no components 16 exist. Before mechanically peeling the adhesive layer 12 from the component substrate 14, the components 16 are divided and a protective layer 20 is provided for mechanical peeling. By peeling off the protective layer 20, the divided components 16 are separated, resulting in multiple monolithically mounted devices 26. A protective layer 20 is provided in a state where the component substrate 14 is monolithically divided into multiple components 16 by cutting 19b. Then, the protective layer 20 is peeled off by mechanically peeling off the sealing layer to obtain multiple devices 26. Since the monolithically divided component substrate 14 is not individually processed, multiple devices 26 can be obtained even when the component substrate 14 is about 250 μm thin.

[0064] Therefore, after peeling between the component substrate 14 and the adhesive layer 12, it is difficult to monolithically form the component 16 formed on the component substrate 14, but such a process is unnecessary. Alternatively, monolithically forming the component 16 before peeling between the component substrate 14 and the adhesive layer 12 requires peeling the adhesive layer off for each component, resulting in low production efficiency. Furthermore, thin component substrates are easily damaged, making this process even more difficult, but such a process is also unnecessary.

[0065] In the manufacturing method of the device, in step 2, a cut 19a is formed by a first process and a cut 19b is formed by a second process. However, the first and second processes can be performed before the protective layer 20 of the protective element component 17 is installed (step 3), and the order of the first and second processes is not particularly limited. Therefore, the processes can be performed in the order of the first and second processes, or in the order of the second and first processes, or even simultaneously. By performing the first and second processes simultaneously, the manufacturing time can be shortened.

[0066] It should be noted that performing the first and second processes simultaneously means performing the first process to form the cut 19a and the second process to form the cut 19b by performing a single step. Performing the second process to form the cut 19b after performing the first process to form the cut 19a is not included in performing the first and second processes simultaneously.

[0067] After the step (step 4) of separating the laminated component 24 containing the component 17 and the protective layer 20 from the adhesive layer 12 and the component 17 by mechanical peeling, the component substrate 14 can be thinned or the shape of the cut 19b can be smoothed by immersing the laminated component 24 in a solution that dissolves the component substrate 14. By thinning the component substrate 14, the device 26 can be further thinned. In addition, if the component substrate is thin, it is easily damaged, but by smoothing the shape of the cut 19b, the end strength of the substrate 14d after miniaturization is improved, and damage to the substrate 14d can be suppressed.

[0068] In addition to hydrofluoric acid, strongly alkaline aqueous solutions such as sodium hydroxide aqueous solution and potassium hydroxide aqueous solution can also be used as the solution for dissolving the substrate 14. When immersing the laminated component 24 in the solution for dissolving the substrate 14, it is preferable to subject the laminated component 24 to shaking, vibration, or to stir the solution for dissolving the substrate 14 in order to ensure that the solution for dissolving the substrate 14 penetrates the cut 19b. Alternatively, the cut 19b can be enlarged by applying stress to the laminated component 24 before immersion in the solution for dissolving the substrate 14, making it easier for the solution for dissolving the substrate 14 to penetrate.

[0069] here, Figure 11 This is a schematic cross-sectional view illustrating a first example of a method for manufacturing a laminate used in a method for manufacturing a device according to an embodiment of the present invention. Figure 12 This is a schematic cross-sectional view illustrating a second example of a method for manufacturing a laminated body used in a method for manufacturing a device according to an embodiment of the present invention. It should be noted that, in Figure 11 and Figure 12 In the middle, to and Figures 1-10 Components with the same structure are labeled with the same symbol, and their detailed descriptions are omitted.

[0070] In the manufacturing method of the device, prior to step 1 above, the following step may be further performed: ... Figure 11 The thickness of the glass substrate 28 in the laminated substrate 29, which includes the support substrate 10, the adhesive layer 12, and the glass substrate 28, is reduced to obtain... Figure 1 The process shown is that of a laminate 15 including a support substrate 10, an adhesive layer 12 and a component substrate 14.

[0071] In this case, after forming an adhesive layer 12 on the surface 10a of the support substrate 10, for example by spin coating or molding, the glass substrate 28 is attached to the surface 12a of the adhesive layer 12 to form a laminated substrate 29.

[0072] The thickness d0 ratio of glass substrate 28 Figure 1 The thickness d of the component substrate 14 in the laminate 15 shown is [thickness d]. The thickness dc of the support substrate 10 is [thickness dc]. Figure 1The thickness dc of the supporting substrate 10 of the laminate 15 shown is the same. The thickness of the glass substrate 28 is reduced by etching or grinding.

[0073] Before step 1 above, the following step may be further performed: ... Figure 12 The thickness of the first glass substrate 30 and the second glass substrate 32 in the laminated substrate 33, which includes the first glass substrate 30, the adhesive layer 12 and the second glass substrate 32, is reduced to obtain a laminate 15 that includes a support substrate 10, an adhesive layer 12 and a component substrate 14, and the thickness dc of the component substrate 14 is thicker than the thickness d of the component substrate 14.

[0074] In this case, after forming an adhesive layer 12 on the surface 30a of the first glass substrate 30, for example by spin coating or molding, the second glass substrate 32 is attached to the surface 12a of the adhesive layer 12 to form a laminated substrate 33.

[0075] The thickness d1 of the first glass substrate 30 is compared to Figure 1 The thickness dc of the supporting substrate 10 of the laminate 15 shown is greater than that of the second glass substrate 32. Figure 1 The thickness d of the component substrate 14 of the laminate 15 shown is [thickness d]. The thickness of the first glass substrate 30 and the thickness of the second glass substrate 32 are reduced by etching or grinding.

[0076] The following describes the support substrate, bonding layer, component substrate, component, and protective layer used in the manufacturing method of the device.

[0077] (Support substrate)

[0078] The support substrate 10 is a component that supports and reinforces the adhesive layer 12. In addition, the support substrate 10 functions as a transport substrate.

[0079] The support substrate 10 may be, for example, a glass plate.

[0080] The preferred types of glass for glass sheets are alkali-free borosilicate glass, borosilicate glass, soda-lime glass, high-silica glass, and other oxide-based glasses with silicon dioxide as the main component. Among oxide-based glasses, those with a silicon dioxide content of 40–90% by mass (based on oxide conversion) are preferred.

[0081] More specifically, examples of glass plates include those made of alkali-free borosilicate glass (manufactured by AGC Corporation under the trade name "AN100"), with a linear expansion coefficient of 38 × 10⁻⁶. -7 / ℃, trade name "AN-Wizus" manufactured by AGC Co., Ltd.).

[0082] Glass sheets are typically manufactured by melting glass raw materials and shaping the molten glass into a sheet shape. Such shaping methods can be conventional, such as float glass, fusion glass, and slot-draw glass.

[0083] When the glass plate is not flexible, the thickness of the glass plate is preferably 0.3 mm or more, and more preferably 0.5 mm or more.

[0084] On the other hand, the thickness of the glass plate is preferably 1.0 mm or less.

[0085] The shape of the support substrate 10 when viewed from the normal direction of the surface 10a of the support substrate 10 is not particularly limited. It can be a quadrilateral or a circle, but a quadrilateral is preferred.

[0086] The support substrate 10 is larger than the adhesive layer 12 and the component substrate 14. The surface 10a of the support substrate 10 has a peripheral area where the adhesive layer 12 and the component substrate 14 are not disposed, and the surface 10a of the peripheral area of ​​the support substrate 10 is exposed.

[0087] The width of the peripheral area is not particularly limited, but is preferably 1–30 mm, more preferably 3–10 mm. The width of the peripheral area is equivalent to... Figure 1 The distance from the outer periphery of the support substrate 10 to the end face 14c of the component substrate 14 shown.

[0088] If the width of the peripheral area is less than 30mm, the effective area when forming component 16 is larger, and the manufacturing efficiency of component 16 is improved.

[0089] (Sealed layer)

[0090] The sealing layer 12 is a film used to prevent the peeling of the component substrate 14 disposed thereon.

[0091] The sealing layer 12 is disposed on the surface 10a of the support substrate 10, for example, in such a way that a peripheral area that does not contact the sealing layer 12 remains on the support substrate 10.

[0092] The sealing layer 12 can be an organic layer or an inorganic layer.

[0093] Examples of materials that can be used for the organic layer include acrylic resin, polyolefin resin, polyurethane resin, polyimide resin, silicone resin, polyimide silicone resin, and fluororesin. Alternatively, a mixture of different types of resins can be used to form the adhesive layer 12.

[0094] Examples of materials that can be used as inorganic layers include oxides, nitrides, oxynitrides, carbides, carbonitrides, silicides, and fluorides. Examples of oxides (preferably metal oxides), nitrides (preferably metal nitrides), and oxynitrides (preferably metal oxynitrides) include oxides, nitrides, and oxynitrides of one or more elements selected from Si, Hf, Zr, Ta, Ti, Y, Nb, Na, Co, Al, Zn, Pb, Mg, Bi, La, Ce, Pr, Sm, Eu, Gd, Dy, Er, Sr, Sn, In, and Ba.

[0095] Examples of carbides (preferably metal carbides) and carbonitrides (preferably metal carbonitrides) include carbides, carbonitrides, and carbon oxides selected from one or more elements chosen from Ti, W, Si, Zr, and Nb.

[0096] Examples of silicides (preferably metal silicides) include silicides selected from one or more elements of Mo, W, and Cr.

[0097] Examples of fluorides (preferably metal fluorides) include fluorides of one or more elements selected from Mg, Y, La and Ba.

[0098] The sealing layer 12 can be a plasma-polymerized membrane.

[0099] When the sealing layer 12 is a plasma polymerized film, the materials that form the plasma polymerized film include fluorocarbon monomers such as CF4, CHF3, C2H6, C3H6, C2H2, CH3F, and C4H8; hydrocarbon monomers such as methane, ethane, propane, ethylene, propylene, acetylene, benzene, and toluene; and hydrogen and SF6.

[0100] In terms of heat resistance and peelability, the material of the sealing layer 12 is preferably silicone resin or polyimide silicone resin, more preferably silicone resin, and even more preferably silicone resin formed by condensation reaction type silicone.

[0101] The following details the method of using an organosilicon resin layer as the sealing layer.

[0102] Organosilicon resins are resins containing defined organosiloxane units, typically obtained by curing a curable organosilicon. Curable organosilicones are classified according to their curing mechanism into addition-reaction type, condensation-reaction type, UV-curable type, and electron-beam-curable type, all of which can be used. Condensation-reaction type organosilicones are preferred.

[0103] As a condensation reaction type organosilicon, a hydrolyzable organosilicon compound or a mixture thereof (monomer mixture) may be used as a monomer, or a partially hydrolyzed condensate (organopolysiloxane) obtained by subjecting the monomer or monomer mixture to a partial hydrolysis condensation reaction.

[0104] By using this condensation-reactive organosilicon to perform a hydrolysis-condensation reaction (sol-gel reaction), organosilicon resins can be formed.

[0105] The sealing layer 12 is preferably formed using a curable composition containing curable silicone.

[0106] In addition to the curable silicone, the curable composition may also contain solvents, platinum catalysts (when using addition-reaction silicone as the curable silicone), leveling agents, metal compounds, etc. Examples of metal elements included in the metal compound include 3d transition metals, 4d transition metals, lanthanides, bismuth (Bi), aluminum (Al), and tin (Sn). The content of the metal compound is not particularly limited and can be adjusted appropriately.

[0107] The adhesive layer 12 preferably has hydroxyl groups. Hydroxyl groups can appear when a portion of the Si-O-Si bonds in the silicone resin constituting the adhesive layer 12 are broken. Alternatively, when using a condensation-reactive silicone, its hydroxyl groups can become the hydroxyl groups of the adhesive layer 12.

[0108] The thickness of the adhesive layer 12 in the normal direction of the surface 10a of the supporting substrate 10 is preferably 50 μm or less, more preferably 30 μm or less, and even more preferably 12 μm or less. On the other hand, the thickness of the adhesive layer 12 is preferably more than 1 μm, and from the perspective of better foreign matter embedding, it is more preferably 6 μm or more. The above thickness is obtained by measuring the thickness of the adhesive layer 12 at any position of 5 or more points using a contact film thickness measuring device and arithmetically averaging them.

[0109] It should be noted that excellent foreign object embedding performance means that even if there are foreign objects between the support substrate 10 and the adhesive layer 12, the foreign objects can be embedded by the adhesive layer 12. If the foreign object embedding performance is excellent, the adhesive layer is less likely to produce protrusions caused by foreign objects, and when the component 16 is formed on the component substrate 14, the risk of wire breakage in the component 16 due to protrusions is suppressed. It should be noted that since the voids formed when the above-mentioned protrusions are generated are observed as bubbles, the foreign object embedding performance can be evaluated based on whether or not bubbles are generated.

[0110] (Component substrate)

[0111] The component substrate 14 is a component that supports and supports the component 16, and is formed into the substrate of the device 26 after being monolithized.

[0112] The component substrate and the support substrate are similarly made of the glass plate described above.

[0113] For example, the thickness d of the component substrate (refer to) Figure 1 The thickness d of the above-mentioned component substrate is preferably 250 μm or less. The thickness d of the component substrate is obtained by measuring the thickness d of the component substrate at any position of 5 or more points using a micrometer and arithmetically averaging them.

[0114] The lower limit of the thickness of the component substrate is preferably, for example, 10 μm.

[0115] The component substrate, apart from glass, is made of, for example, a ceramic substrate, a silicon wafer, a metal foil, or a resin substrate.

[0116] (element)

[0117] Component 16 together with component substrate 14 constitutes device 26. The function of component 16 corresponds, for example, to the use of device 26.

[0118] Components are, for example, components that form circuits or other structures that function as electronic components. More specifically, components can be exemplified by storage circuits such as flash memory, microprocessors, and logic circuits such as FPGAs (Field-Programmable Gate Arrays), ASICs (Application Specific Integrated Circuits), and CPLDs (Complex Programmable Logic Devices). In addition, examples include communication modules such as antennas and wireless tags, and MEMS (Micro Electro-Mechanical Systems). Examples of MEMS include sensors and actuators. Sensors include various sensors that detect acceleration, sound, light, or contact. Components also include those with wiring that transmits only electrical signals.

[0119] In addition, component 16 can be a single component performing a specific function, or multiple components performing a specific function.

[0120] When using semiconductors to form components, the composition of the semiconductors is not particularly limited. Examples of semiconductor compositions include diamond, silicon (Si), germanium (Ge), silicon-germanium (SiGe), silicon carbide (SiC), gallium arsenide (GaAs), gallium nitride (GaN), and gallium oxide.

[0121] (Protective layer)

[0122] The protective layer 20 protects the element 16. The protective layer 20 may be, for example, a film with an adhesive layer that exhibits reduced adhesion due to temperature or ultraviolet light. In this case, to facilitate the peeling of the protective layer 20, it is preferable to perform a cooling treatment, a heating treatment, or an ultraviolet exposure treatment to reduce adhesion, depending on the characteristics of the protective layer 20.

[0123] The protective layer 20 can be made of, for example, cutting tape or back-grinding tape.

[0124] (device)

[0125] Device 26 has a monolithically integrated component substrate 14 and component 16, and performs the function corresponding to component 16.

[0126] As described above, the device 26 is configured, for example, to have one element 16 disposed on a substrate 14d obtained by separating the element substrate 14, but is not limited thereto. It may also be configured to have multiple elements 16 disposed on a substrate 14d obtained by separating the element substrate 14. In this case, by changing... Figure 10 The second cut line Lh shown is used to form a cut 19b, thereby forming a division on a substrate 14d of a component substrate 14 to arrange a plurality of components 16, resulting in a device having a plurality of components 16 arranged on a substrate 14d.

[0127] Device 26 can be used, for example, in storage circuits, processors, antennas, communication modules, and receiving sensors. Receiving sensors include electromagnetic wave receiving sensors, X-ray light-receiving sensors, ultraviolet light-receiving sensors, visible light-receiving sensors, and infrared light-receiving sensors. When used as a receiving sensor, the component substrate can also be reinforced using a reinforcing sheet such as resin.

[0128] (Glass substrate, first glass substrate and second glass substrate)

[0129] The glass substrate, the first glass substrate, and the second glass substrate constitute a laminated substrate.

[0130] The first glass substrate serves as a support substrate. The glass substrate and the second glass substrate serve as component substrates. For example, the glass substrate, the first glass substrate, and the second glass substrate have the same structure as the support substrate described above, such as being made of the aforementioned glass plate.

[0131] The thickness d1 of the first glass substrate is preferably 0.3 to 2.8 mm.

[0132] The thickness d0 of the glass substrate and the thickness d2 of the second glass substrate are preferably 0.1 to 1.1 mm.

[0133] The thicknesses d1, d0, and d2 of the first glass substrate are obtained by measuring the thicknesses at any of the five or more points using a micrometer and then averaging them.

[0134] Various embodiments have been described above with reference to the accompanying drawings, but it is self-evident that the present invention is not limited to these examples. Those skilled in the art will readily conceive of various modifications and alterations within the scope of the patent application, and these naturally fall within the technical scope of the present invention. Furthermore, the constituent elements of the above embodiments can be arbitrarily combined without departing from the spirit of the invention.

[0135] It should be noted that this application is based on Japanese patent applications filed on February 28, 2024 (Japanese Patent Application No. 2024-028191) and August 28, 2024 (Japanese Patent Application No. 2024-146347), the contents of which are incorporated herein by reference.

[0136] Symbol Explanation

[0137] 10 Supporting substrate

[0138] 10a surface

[0139] 10c, 12c, 14c, 18e end faces

[0140] 12 Sealing Layer

[0141] 12a, 14a, 20a, 30a surfaces

[0142] 14 Component substrate

[0143] 14d base plate

[0144] 15-layer stack

[0145] 16 components

[0146] 17 Components

[0147] 18-layer substrate

[0148] 18b area

[0149] 18d edge region

[0150] Incisions 19a and 19b

[0151] 20 protective layers

[0152] 22 Adsorption Pads

[0153] 24-layer components

[0154] 26 devices

[0155] 28 Glass substrate

[0156] 29- and 33-layer laminated substrates

[0157] 30 First glass substrate

[0158] 32 Second glass substrate

[0159] Ds Stacking Direction

[0160] Lf First Cut Line

[0161] Lh Second incision line

[0162] Thicknesses d, d0, d1, d2, dc

Claims

1. A method for manufacturing a device, comprising the following steps: Step 1 involves forming a plurality of components on the component substrate in a laminate comprising a support substrate, an adhesive layer, and a component substrate, thereby obtaining a laminated substrate having the support substrate, the adhesive layer, and component components comprising the component substrate and the plurality of components sequentially stacked. Step 2 involves performing the first and second processes. The first process cuts the support substrate, the adhesive layer, and the component parts at the edge region of the laminated substrate. The second process involves creating continuous or discontinuous cuts through the component substrate and reaching the adhesive layer in areas of the laminated substrate where no component is present, thereby dividing the plurality of components. Step 3: A protective layer is formed on the component of the laminated substrate. Step 4 involves separating the laminated components containing the component and the protective layer from the sealing layer using mechanical peeling. Step 5: In the stacked components, the protective layer is peeled off from the component components to obtain a device monolithically formed by each component.

2. The method for manufacturing the device according to claim 1, wherein, Prior to step 1, the following steps are further performed: The thickness of the glass substrate in a laminated substrate comprising a support substrate, an adhesive layer, and a glass substrate is reduced to obtain a laminate comprising the support substrate, the adhesive layer, and the element substrate.

3. The method for manufacturing the device according to claim 1, wherein, Prior to step 1, the following steps are further performed: The thickness of the first glass substrate and the second glass substrate in a laminated substrate comprising a first glass substrate, an adhesive layer and a second glass substrate is reduced to obtain a laminate comprising the support substrate, the adhesive layer and the element substrate, wherein the thickness of the support substrate is greater than the thickness of the element substrate.

4. The method for manufacturing the device according to claim 1, wherein, In step 2, the incision is set by laser irradiation.

5. The method for manufacturing the device according to claim 1, wherein, The thickness of the component substrate is less than 250 μm.

6. The method for manufacturing the device according to claim 1, wherein, The sealing layer contains silicone resin.

7. The method for manufacturing the device according to claim 1, wherein, In step 2, the first and second processes are performed simultaneously by laser irradiation.

8. The method for manufacturing the device according to claim 1, wherein, Between step 4 and step 5, the following step is further performed: A process is implemented to reduce the adhesion between the protective layer and the component.

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