A device for a core pellet with a carrier and a method for manufacturing the device

Abstract

The invention relates to a device with a carrier for a plurality of core tablets, wherein the carrier has at least one through-opening.

Description

Technical Field

[0001] This disclosure relates to at least one device with a carrier for use in core pellets. This disclosure also relates to a method for manufacturing such a device. Summary of the Invention

[0002] In some embodiments, the invention relates to a device for a core, the device having a carrier for a plurality of cores, wherein the carrier has at least one through-hole. In some embodiments, this enables, for example, efficient assembly and / or heat dissipation.

[0003] In some embodiments, multiple through openings may be provided in the carrier.

[0004] In some embodiments, the carrier is configured to include at least one of the following elements: a) a substrate, or b) an interposer.

[0005] In some embodiments, the carrier is made of silicon. In some embodiments, the carrier is made of glass. In some embodiments, the carrier is made of ceramic.

[0006] In some embodiments, the at least one through opening is arranged, for example, at least substantially centrally, for example, at least substantially within the centroidal region of the surface of the carrier, on which the core can be disposed.

[0007] In some embodiments, at least two core particles are arranged on the carrier.

[0008] In some embodiments, the at least one through opening is arranged, for example, at least generally, between the at least two core particles, for example, within the region of the connecting line between the centroids of the respective areas of the at least two core particles.

[0009] In some embodiments, the maximum opening width of the at least one through opening is defined, for example, as the maximum distance between two opposite points within the opening profile of the at least one through opening, which is, for example, between about 2 mm and about 18 mm, or, for example, between about 3 mm and about 8 mm.

[0010] In some embodiments, the opening profile of the at least one through-opening is configured to have an elliptical shape, such as a circle. In some embodiments, the opening profile of the at least one through-opening is configured to have a polygonal shape.

[0011] In some embodiments, the device is configured to have a heat-exporting device, for example for exporting heat energy from the device, wherein at least one component or at least a portion of the heat-exporting device can be, for example, at least partially arranged or has been arranged in the at least one through opening.

[0012] In some embodiments, the heat extraction device is configured to have at least one of the following elements or be constructed as at least one of the following elements: a) a cooling body, or b) a heat pipe (e.g., a heat pipe), or c) a heat diffuser, or d) a heat exchanger, for example for fluid cooling.

[0013] In some embodiments, the heat-exporting device is configured to, for example, completely pass through the at least one through-opening and to form a thermally conductive contact with the surface of the at least one through-opening.

[0014] In some embodiments, the heat-extraction device is configured to have a fixing device for form-locking and / or force-locking fixation to at least one additional component of the device and / or to a carrier for receiving the device. Alternatively or additionally, material-locking fixation may also be employed in some embodiments.

[0015] In some embodiments, the heat extraction device is configured to have at least one external thread.

[0016] In some embodiments, the heat extraction device is configured to have at least one flange.

[0017] In some embodiments, the device is configured to have a housing, for example, made of a plastic material.

[0018] In some embodiments, the housing is configured to have at least one opening, which together with the at least one through opening forms, for example, a continuous through opening.

[0019] Some embodiments relate to a system having a circuit carrier board and at least one device according to the present disclosure disposed on the circuit carrier board.

[0020] Some embodiments relate to a method for manufacturing an apparatus for core pellets, the apparatus having a carrier for a plurality of core pellets, wherein the method includes: providing a carrier having at least one through opening.

[0021] In some embodiments, the method is configured to include: arranging one or more cores on the carrier.

[0022] In some embodiments, the method is configured to include: arranging a heat-exporting device or the heat-exporting device within the area of ​​the at least one through-hole.

[0023] In some embodiments, the provision includes at least one of the following: a) providing a carrier without a through opening and manufacturing the at least one through opening in the carrier, or b) manufacturing the carrier together with the at least one through opening.

[0024] Some embodiments relate to the use of at least one device and / or at least one system and / or at least one method according to the present disclosure for at least one of the following purposes: a) achieving, for example, efficient assembly of the device; or b) achieving, for example, efficient heat dissipation of the device; or c) achieving, for example, efficient alignment, such as centering, of the device on a circuit carrier board; or d) heat dissipation of a multi-core system; or e) avoiding hot spots in a multi-core system; or f) transferring thermal energy from the multi-core system, for example, along two or three mutually orthogonal spatial directions.

[0025] Other features, applications, and advantages of the invention will become apparent from the following description of embodiments of the invention, illustrated in the accompanying drawings. Herein, all described or illustrated features, whether present individually or in any combination, constitute the content of this invention, regardless of whether they are encapsulated in the claims or their references, or whether they are described or illustrated in the specification or drawings. Attached Figure Description

[0026] The attached diagram shows: Figure 1 A schematic top view is shown. Figure 2 A side view is shown schematically. Figure 3 A side view is shown schematically. Figure 4 A schematic side view showing a partial section is shown. Figure 5 A side view is shown schematically. Figure 6 The flowchart is shown schematically. Figure 7 A schematic top view is shown. Figure 8 A schematic side view showing a partial section is shown. Figure 9 A schematic side view showing a partial section is shown. Figure 10 A schematic side view showing a partial section is shown. Figure 11 A schematic side view showing a partial section is shown. Figure 12 An example application is illustrated. Detailed Implementation

[0027] Some embodiments ( Figure 1The invention relates to a device 100 for a core, the device having a carrier 110 for a plurality of cores 120-1, 120-2, ..., wherein the carrier 110 has at least one through opening 112. In some embodiments, this enables, for example, efficient assembly and / or heat dissipation, for example, for a multi-core system having a plurality of cores.

[0028] In some embodiments (not shown), a plurality of through openings may also be provided in the carrier 110.

[0029] In some embodiments, the carrier 110 is configured to have at least one of the following elements: a) a substrate, or b) an interlayer.

[0030] In some embodiments, the carrier 110 is configured to be made of silicon, glass, or ceramic.

[0031] In some embodiments ( Figure 1 In the configuration, the at least one through opening 112 is arranged, for example, at least approximately centered, for example, at least approximately located within the centroid region M of the surface 110a of the carrier 110, on which the core particles 120-1, 120-2, ... can be arranged.

[0032] In some embodiments ( Figure 1 In this configuration, at least two core particles 120-1 and 120-2 are arranged on the carrier 110. In some embodiments (see, for example, the following description), Figure 7 (as described above), more or fewer cores can also be set and arranged on carrier 110.

[0033] In some embodiments ( Figure 1 In the configuration, the at least one through opening 112 is arranged, for example, at least generally, between the at least two cores 120-1, 120-2, for example, within the region of the connecting line between the centroids of the respective areas of the at least two cores 120-1, 120-2.

[0034] In some embodiments ( Figure 1 The maximum opening width OW of the at least one through opening 112 is set in the configuration. max For example, it is defined as the maximum distance between two opposite points within the opening profile of the at least one through opening 112, which is, for example, between about 2 mm and about 18 mm, or, for example, between about 3 mm and about 8 mm.

[0035] In some embodiments ( Figure 1 In some embodiments, the opening profile of the at least one through opening 112 is configured to have an elliptical shape, such as a circle. In others, the opening profile of the at least one through opening is configured to have a polygonal shape (not shown).

[0036] Figure 2 A side view of the device 100 is shown schematically.

[0037] In some embodiments ( Figure 3 The device 100a is configured to have a heat-exporting device 130, for example, for exporting heat energy from the device 100a, wherein at least one component or at least part of the heat-exporting device 130 can be arranged or has been arranged in the at least one through opening 112.

[0038] In some embodiments, the heat extraction device 130 is configured to have at least one of the following elements or be constructed as at least one of the following elements: a) a cooling body, or b) a heat pipe (e.g., a heat pipe), or c) a heat diffuser, or d) a heat exchanger, for example for fluid cooling.

[0039] In some embodiments ( Figure 3 The heat-exporting device 130 is configured to, for example, completely pass through the at least one through-hole 112 and be able to form a thermally conductive contact with the surface 112a of the at least one through-hole 112.

[0040] In some embodiments ( Figure 3 The heat-exporting device 130 is configured to have a fixing device 132a for form-locking and / or force-locking fixation to at least one additional component of the device 100a. Alternatively or additionally, material-locking fixation may also be used in some embodiments.

[0041] In some embodiments, the heat dissipation device 130 is configured to have external threads 134 at least in a partial area. For example, in some embodiments, the external threads 134 may interact with the fixing device 132a.

[0042] In some embodiments, the heat dissipation device is configured to have at least one flange, see below for details. Figure 10 , 11 The description.

[0043] In some embodiments, the heat-exporting device may have a flange (not shown), for example, located on a first side, and the heat-exporting device may be secured from a second side, for example: (a) provided with internal threads and thus threaded, or (b) riveted, or (c) secured by a spring retainer.

[0044] In some embodiments ( Figure 4 The device 100b is configured to have a housing 140, for example, made of a plastic material.

[0045] In some embodiments ( Figure 4The housing 140 is configured such that it has at least one opening 142a, 142b, which together with the at least one through opening 112 forms, for example, a continuous through opening 142a, 112, 142b, for example, to accommodate a heat dissipation device 130. In this way, in some embodiments, heat energy can be efficiently dissipated from the interior 140a of the housing 140, for example.

[0046] Some embodiments ( Figure 5 The system 1000 has a circuit carrier board 1002, such as a printed circuit board (PCB), and has at least one device 100, 100', ... arranged on the circuit carrier board 1002 according to the present disclosure.

[0047] Some embodiments ( Figure 6 The invention relates to a method for manufacturing apparatus 100, 100a, 100b for cores, the apparatus having a carrier 110 for a plurality of cores, wherein the method comprises: providing a carrier 110 having at least one through opening 112.

[0048] In some embodiments, the method is configured to include: arranging one or more cores 120 202 on a carrier 110.

[0049] In some embodiments, the method is configured to include: arranging a heat-exporting device or the heat-exporting device 130 204 within the area of ​​the at least one through opening 112.

[0050] In some embodiments ( Figure 6 The provision 200 is configured to include at least one of the following: a) providing a carrier without a through opening, wherein the at least one through opening 112 is manufactured in the carrier, or b) manufacturing the carrier 110 together with the at least one through opening 112.

[0051] Other aspects and embodiments are described below, which—in other embodiments—may be combined with at least one of the above aspects and / or embodiments individually or in any combination thereof.

[0052] Figure 7 A schematic top view of an apparatus according to some embodiments is shown, wherein four cores 120-1, 120-2, 120-3, 120-4 are arranged on a carrier 110' made of silicon material, for example configured as an interposer. For example, the interposer 110' may, in addition to mechanically holding the cores, enable electrical contact (not shown) with at least some of the cores. Also shown is a portion of a housing 140 and a through-hole 112, currently arranged, for example, centrally, having an exemplary circular opening profile.

[0053] Figure 8 Schematic illustration based on Figure 7 A side view of the configuration shows that, in some embodiments, the device may be arranged on PCB 1002. Exemplarily, the openings of the interposer 110', housing 140, and PCB 1002 are constructed and arranged relative to each other such that these openings form a continuous through opening, for example for passing through a heat pipe and / or for fixing elements, such as screws or bolts.

[0054] Figure 9 A side view of a device according to another embodiment is schematically shown. A heat pipe 130-1 passes through a continuous through-hole in the interlayer 110', housing 140, and PCB 1002, and is secured thereto, for example, by two nuts 1320a, 1320b. For example, the heat pipe 130-1 may at least (e.g., axially) partially have external threads (not in... Figure 9 As shown in the figure, the external thread can work together with nuts 1320a and 1320b.

[0055] Optionally, one or more mounting elements, such as at least generally plate-shaped or disc-shaped, such as metal plates or annular discs 1320c, 1320d, may be provided. These mounting elements, in addition to providing mechanical clamping when threaded with nuts 1320a, 1320b, can also additionally facilitate heat transfer, for example, along their virtual disc surface, for example, radially inward toward heat pipe 130-1, see arrow a1. Arrow a2 symbolically represents heat dissipation of the device through heat pipe 130-1.

[0056] In some embodiments, at least one flange may be provided on the heat pipe 130-1, which can be achieved, for example, by fixing element 1320c or elements 1320a, 1320c to the heat pipe 130-1 (e.g., by material-locking connection or heat shrinking). For example, the flange may also be directly molded onto the heat pipe. In some embodiments, the optional flange provides further freedom of choice when fixing the heat dissipation device 130.

[0057] In some embodiments, the heat pipe 130-1—for example, provided the tolerances are small enough—can also be inserted into the through opening, where, for example, no nut or mounting element is used.

[0058] Figure 10 A side view of a device according to another embodiment is schematically shown. A heat pipe 130-1 is shown, for example, which can pass through or be inserted into a through opening 112. Figure 1The heat pipe 130-1 has two plate-shaped fixing elements 1322 and 1324, which may be identical components. The fixing elements 1322 and 1324 may have internal threads (not shown), for example, in the form of nuts, for example, for screwing onto the external threads (not shown) of the heat pipe 130-1. Optionally, the fixing elements 1322 and 1324 may have widened axial sections 1322a and 1324a, respectively, which exemplarily contact the heat pipe 130-1 in a thermally conductive manner, thereby further improving the thermal adhesion between the elements 1322 and 1324 and the heat pipe 130-1.

[0059] In some embodiments, fixing elements 1322, 1324 ( Figure 10 ) or 1320c, 1320d ( Figure 9 The planar portions of the component, such as disc-shaped or plate-shaped portions, can be constructed as planes, for example, completely flat. However, in other embodiments, the surface may also have, for example, a relatively small degree of curvature, such that, in the installed state, around the carrier 110, 110' and the core 120 or housing 140, the radially outer edge of the surface is slightly closer to a virtual plane, for example, characterized by the surface of the core, than the radially inner region. This shape can, in some embodiments, generate an elastic force during assembly or tightening, which can, for example, improve the thermal contact between the components 110, 110', 120 and each other.

[0060] In some embodiments, Figure 10 The configuration can also be used for example. Figure 9 The layer structure is 110', 120, and 140.

[0061] Figure 11 A side view of a device according to other embodiments is schematically shown. Instead of a heat pipe, a cooling body 130-2 is provided in the current embodiment, which is fixed to the housing 140, for example, by screws 130-2a and nuts 130-2b, wherein screws 130-2a pass through a through opening 112 ( Figure 1 This allows for the introduction of force into the arrangement at the center. Optionally, at least one disc-shaped mounting element 130-2c may be provided, for example, between the nut 130-2b and the PCB 1002.

[0062] In some embodiments, for example instead of a separate nut 130-2b, a corresponding threaded section may be provided in the mounting element 130-2c or in the PCB 1002.

[0063] In some embodiments, rivets (not shown) may be provided instead of screws, wherein, for example, the device or the core system is secured or has been secured to a heat sink, such as a cooling body, by means of the rivets passing through, for example, a centrally located through-hole 112.

[0064] In some embodiments, for example instead of screws or rivets, a thermally conductive connector (not shown, but resembling a heat pipe) may pass through the through opening 112, wherein the connector thermally connects a heat diffuser disposed on one side of the device, such as the core system, to a component of the core system and optionally to another heat diffuser disposed on the opposite side of the core system, and optionally also provides a mechanical connection. In some embodiments, the thermally conductive connector and / or at least one of the heat diffusers may, for example, be welded to each other and / or to a carrier, such as a PCB.

[0065] Some embodiments ( Figure 12 The use 300 relates to at least one device and / or at least one system and / or at least one method according to the present disclosure, for at least one of the following uses: a) enabling 301, for example, efficient assembly of the device; or b) enabling 302, for example, efficient heat dissipation of the device; or c) enabling 303, for example, efficient alignment of the device, for example, centering, for example, on circuit carrier board 1002; or d) heat dissipation of multi-core system 304; or e) avoiding 305 hot spots in multi-core system; f) transferring heat energy from multi-core system, for example, along two or three mutually orthogonal spatial directions 306.

[0066] In some embodiments, the through opening 112 can achieve one or more mechanical advantages, such as allowing heat pipes or coolants or heat exchangers or the like to be directly inserted (e.g., "through hole mounting"), for example, in the area between a plurality of cores disposed on or capable of being placed on the carriers 110, 110', and / or enabling the introduction of a force at the center that can further improve the thermally effective contact of the mating members.

Claims

1. An apparatus (100; 100a; 100b) for a plurality of cores (120-1, 120-2, ...), comprising a carrier (110) for a plurality of cores (120-1, 120-2, ...), wherein, The carrier (110) has at least one through opening (112).

2. The apparatus (100; 100a; 100b) according to claim 1, wherein, The carrier (110) includes at least one of the following elements: a) a substrate, or b) an interlayer.

3. The apparatus (100; 100a; 100b) according to at least one of the preceding claims, wherein, The carrier (110) is made of silicon, glass or ceramic.

4. The apparatus (100; 100a; 100b) according to at least one of the preceding claims, wherein, The at least one through opening (112) is arranged, for example, at least approximately centered.

5. The apparatus (100; 100a; 100b) according to at least one of the preceding claims, wherein, At least two core particles (120-1, 120-2, ...) are arranged on the carrier (110).

6. The apparatus (100; 100a; 100b) according to claim 5, wherein, The at least one through opening (112) is arranged, for example, at least generally, between the at least two cores (120-1, 120-2, ...).

7. The apparatus (100; 100a; 100b) according to at least one of the preceding claims, wherein, The maximum opening width (OW) of the at least one through opening (112) max The maximum opening width is, for example, between about 2 mm and about 18 mm, defined as the maximum distance between two opposite points within the opening profile of the at least one through opening (112).

8. The apparatus (100; 100a; 100b) according to at least one of the preceding claims, comprising a heat dissipation device (130), wherein, For example, at least one component or at least a portion of the heat-exporting device (130) can be arranged or has been arranged in the at least one through opening (112).

9. The apparatus (100; 100a; 100b) according to claim 8, wherein, The heat extraction device (130) has at least one of the following elements or is configured to be at least one of the following elements: a) a cooling body, or b) a heat pipe, or c) a heat diffuser, or d) a heat exchanger, for example for fluid cooling.

10. The apparatus (100; 100a; 100b) according to claim 8 or 9, wherein, The heat-exporting device (130) is capable of passing completely through the at least one through-opening (112) and is capable of forming a thermally conductive contact with the surface (112a) of the at least one through-opening (112).

11. The apparatus (100; 100a; 100b) according to at least one of claims 8 to 10, wherein, The heat dissipation device (130) has a fixing device (132a) for form-locking and / or force-locking and / or material-locking fixing to at least one additional component of the device (100; 100a; 100b).

12. The apparatus (100; 100a; 100b) according to at least one of claims 8 to 11, wherein, The heat dissipation device (130) has at least one external thread (132a).

13. The apparatus (100; 100a; 100b) according to at least one of claims 8 to 12, wherein, The heat extraction device (130) has at least one flange.

14. The device (100; 100a; 100b) according to at least one of the preceding claims has a housing (140).

15. The apparatus (100; 100a; 100b) according to claim 14, wherein, The housing (140) has at least one opening (142a, 142b), which together with the at least one through opening (112) form, for example, a continuous through opening (112, 142a, 142b).

16. A system (1000) having a circuit carrier board (1002) and at least one device (100; 100a; 100b; 100') disposed on the circuit carrier board (1002) according to at least one of the preceding claims.

17. A method for manufacturing an apparatus (100; 100a; 100b) for use with core pellets, said apparatus having a carrier (110) for a plurality of core pellets (120), wherein, The method includes: providing (200) the carrier (110) having at least one through opening (112).

18. The method of claim 17, comprising: One or more cores (120) are arranged (202) on the carrier (110).

19. The method according to claim 17 or 18, comprising: The heat dissipation device (130) is arranged (204) in the area of ​​the at least one through opening (112).

20. The method according to at least one of claims 17 to 19, wherein, The provision (200) includes at least one of the following: a) providing (200a) a carrier without a through opening (112), wherein the at least one through opening (112) is manufactured (200b) in the carrier, or b) manufacturing the carrier (110) together with the at least one through opening (112) (200c).

21. At least one device (100; 100a; 100b) according to at least one of claims 1 to 15 and / or at least one system (1000) according to claim 16 and / or at least one method according to at least one of claims 17 to 20, for use (300) in at least one of the following: a) enabling (301) for example, efficiently assembling the device (100; 100a; 100b), or b) enabling (302) for the device... The device (100; 100a; 100b) is configured to, for example, efficiently dissipate heat, or (c) enable (303) to efficiently align, for example, center, for example, on the circuit carrier board (1002), or (d) enable (304) to dissipate heat from the multi-core system, or (e) enable (305) to avoid hot spots in the multi-core system, or (f) transfer (306) heat energy from the multi-core system, for example, along two or three mutually orthogonal spatial directions.

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