An intelligent insole electronic element arrangement method with an external master box

Abstract

The embodiment of the present disclosure discloses a method for arranging the electronic elements of the smart insole outside the master control box, wherein the method comprises: providing an insole base material with a pressure sensor array arranged on the upper surface, and providing a master control box fixed on the vamp. The wiring of the pressure sensor array is collected to the medial arch area of the insole base material, and a flexible printed circuit lead-out cable is connected to the signal wiring collection end of the medial arch area. Based on the self-fixing system of the lead-out cable, the flexible printed circuit lead-out cable remains stable in position during the process of leading out from the medial edge of the insole base material and wiring along the insole medial vamp. When wiring to the top of the tongue, the end connector is connected with the master control box, and the arrangement of the electronic elements of the smart insole is completed. The embodiment of the present disclosure realizes that the insole is completely washable and the electronic elements are not stepped on impact, solves the industry pain points of poor reliability, difficult maintenance and resource waste of the traditional scheme, and improves the service life, data accuracy and user daily use convenience of the system.

Description

Technical Field

[0001] This disclosure relates to the field of smart insole technology, and in particular to a method for arranging electronic components in a smart insole with an external main control box. Background Technology With the continuous growth in demand for sports and health monitoring, smart insoles, as an important branch of wearable devices, have undergone multiple evolutions in their electronic component layout schemes, from integrated insoles to modular designs embedded in sole grooves, and from wired separate sensors and processing circuits to independent electronic devices attached to the upper.

[0002] However, existing technologies have consistently failed to adequately resolve several system-level contradictions: The integrated insole design, using flexible PCBs and multi-layer packaging, embeds all electronic components into the insole body. While achieving a high degree of functional integration, it cannot solve the reliability issues of electronic components under impact and the hygiene problems of the insole's non-washability. Furthermore, the integrated structure makes repair virtually impossible, and the entire insole is unusable while charging. The modular design with recessed insoles incorporates recesses in the insole's bottom or midsole to accommodate detachable functional modules. However, the footbed curvature varies significantly among different running shoe brands (Nike Pegasus has a radius of curvature of approximately 100-120mm, while Adidas Ultraboost has approximately 80-100mm). Fixed-curvature recessed modules cannot adapt to different shoe shapes, and the recessed area thickens by 4-7mm, creating hard spots and a noticeable foreign body sensation during running. Additionally, the insole's structural strength decreases by 30-50% due to the recessed design. The wired split design of the sensor and processing circuit places the processing circuit outside the insole (such as the ankle strap or the tongue layer), but its wiring is generally led out from the heel - the insole and the sole are tightly fitted at the heel with no natural gaps, and the wiring is squeezed between the two. In addition, the direct effect of the peak pressure of the foot is as high as 300-500kPa, and the risk of the wiring root breaking is extremely high.

[0003] Therefore, one or more methods are needed to solve the above problems.

[0004] It should be noted that the information disclosed in the background section above is only used to enhance the understanding of the background of this disclosure, and therefore may include information that does not constitute prior art known to those skilled in the art. Summary of the Invention

[0005] The purpose of this disclosure is to provide a method, apparatus, device, and medium for arranging electronic components in a smart insole with an externally mounted main control box, thereby overcoming, at least to some extent, one or more problems caused by limitations and defects in related technologies.

[0006] According to one aspect of this disclosure, a method for arranging electronic components in a smart insole with an externally mounted main control box is provided, comprising: A shoe insole substrate is provided, and a pressure sensor array is arranged on the upper surface of the shoe insole substrate. A main control box with internally integrated active electronic components is provided, and the main control box is detachably fixed to the shoe upper through a dual redundancy locking structure. The signal lines of the pressure sensor array are aggregated to the inner arch region of the insole substrate. The inner arch region is the optimal lead-out position determined by multi-dimensional analysis of the extrusion stress, bending fatigue life and signal attenuation of the lead-out path of the cable. A flexible printed circuit is connected to the signal line aggregation end in the inner arch region to lead out the cable. Based on the self-fixing system of the flexible printed circuit lead-out cable, the flexible printed circuit lead-out cable maintains a stable position as it is led out from the inner edge of the insole substrate and runs along the inner side of the shoe upper. The flexible printed circuit leads out along the inner side of the shoe upper to the top of the shoe tongue, and connects to the main control box through the end connector to complete the arrangement of the electronic components of the smart insole.

[0007] In one exemplary embodiment of this disclosure, the extrusion stress analysis of the cable lead-out path includes: Based on the plantar pressure distribution function, the pressure values ​​of the heel area, forefoot area, and medial arch area during the support phase are calculated to obtain the heel pressure function value, forefoot pressure function value, and arch pressure function value, respectively. Through formula Calculate the pressure exerted on the insole by the heel area, forefoot area, and medial arch area of ​​the foot, respectively. in Let P be the pressure exerted by the foot on the insole, and P be the pressure distribution function value of the corresponding area. The pressure-bearing area of ​​the region where the cable lead-out point is located; Through formula The compressive stress in the heel area, forefoot area, and medial arch area is calculated separately, and based on the calculation results, the compressive stress analysis of the summing end in the heel area, forefoot area, and medial arch area is completed. in The compressive stress borne by the summing end, This refers to the area of ​​force applied to the sole of the foot by the string.

[0008] In one exemplary embodiment of this disclosure, the bending fatigue life analysis of the cable lead-out path includes: Based on foot and ankle biomechanical analysis, the bending radius of the medial arch region was determined to be greater than or equal to 25 mm and less than or equal to 35 mm. The bending radius of the heel region was determined to be greater than or equal to 5 mm and less than or equal to 15 mm by measuring the insole bending shape under simulated real running conditions. Through the bending strain formula Calculate the bending strain in the heel area and the medial arch area respectively; Where ε is the bending strain, t is the thickness of the flexible printed circuit lead wire, and R is the bending radius; Through the fatigue life formula The bending fatigue life of the flexible printed circuit lead wires in the heel area and the inner arch area is calculated respectively to complete the bending fatigue life analysis of the lead wires. in Where C is the bending life, β is the material constant, and β is the material index.

[0009] In one exemplary embodiment of this disclosure, the signal attenuation analysis of the ribbon cable lead-out path includes: Based on the lead-out length of the flexible printed circuit's lead-out cable, using the formula... The resistance of the flexible printed circuit lead-out ribbon cable in the heel area and the inner arch area is calculated respectively to complete the resistance and signal attenuation analysis of the lead-out ribbon cable. in, ρ is the resistance of the ribbon cable, L is the resistivity of copper, W is the length of the ribbon cable, and m is the width of the trace.

[0010] In one exemplary embodiment of this disclosure, the medial arch region is configured as follows: Take the direction from the heel of the insole to the toe of the insole as the longitudinal Y-axis, and the direction from the big toe side of the insole to the little toe side of the insole as the transverse X-axis; The heel of the insole is set to 0% of the Y-axis, and the toe of the insole is set to 100% of the Y-axis. The big toe side of the insole is set to 0% of the X-axis, and the little toe side of the insole is set to 100% of the X-axis. The inner arch region is defined as the area where 55% ≥ Y ≥ 45% and 22% ≥ X ≥ 15%.

[0011] In one exemplary embodiment of this disclosure, the self-fixing system of the flexible printed circuit lead-out cable includes: The outer surface of the flexible printed circuit lead cable is encapsulated with silicone material to form a silicone encapsulation layer. Based on the surface contact friction between the silicone encapsulation layer and the inner side upper fabric of the shoe, a surface adhesion constraint is formed. By utilizing the natural safety distance between the inner sides of the feet during the running gait, a passive avoidance constraint is formed between the flexible printed circuit lead-out cable and the inner side of the shoe upper. Based on the preformability of the silicone encapsulation layer, when encapsulating the flexible printed circuit lead wires, the flexible printed circuit lead wires are made to match the curvature of the inner side of the shoe upper, forming a shape adaptive constraint.

[0012] In one exemplary embodiment of this disclosure, the dual redundancy locking structure includes a shear direction locking structure and a vertical direction locking structure: The shearing direction locking structure uses a mushroom-head Velcro connector. Based on the interlocking effect of the mushroom-head Velcro connector in the shearing direction, it resists the horizontal inertial force of the main control box during running. Based on the vertically separable characteristic of the mushroom-shaped Velcro connector, the main control box is allowed to detach from the shoe upper in a vertical direction during charging. The vertical locking structure adopts a C-shaped opening shoelace groove integrally formed with the outer shell of the main control box. Utilizing the size fit relationship that the opening width of the C-shaped opening shoelace groove is smaller than the diameter of a standard sports shoelace, the sports shoelace undergoes elastic compression deformation under external pressure and passes through the opening of the C-shaped opening shoelace groove to complete the connection between the C-shaped opening shoelace groove and the shoe body. Based on the mechanical fixation of the sports shoelace, it resists the vertical inertial force of the main control box during running. Based on the rewinding, unwinding, and elastic compression characteristics of the athletic shoelaces, during charging, the athletic shoelaces are allowed to be untied and removed from above the C-shaped opening shoelace slot, thus separating the main control box from the shoe upper.

[0013] In one exemplary embodiment of this disclosure, the arrangement of the dorsum of the foot inertial measurement unit and the heel inertial measurement module is also included: A separately packaged heel inertial measurement module is provided, and the heel inertial measurement module is fixed to the outside of the heel of the shoe; A dorsalis inertial measurement unit is provided, and the dorsalis inertial measurement unit is arranged in the main control box; The following inertial measurement module wirelessly synchronizes its time with the main control box via a low-power Bluetooth isochronous channel.

[0014] In one exemplary embodiment of this disclosure, it further includes: Based on the acceleration amplitude and step frequency collected by the instep inertial measurement unit and the heel inertial measurement module, the exercise intensity level is set; Based on the aforementioned exercise intensity level, the sampling rate of the pressure distribution collected by the pressure sensor array in the main control box is adjusted.

[0015] In one exemplary embodiment of this disclosure, it further includes: Based on timestamps, spatial sparse coding is used to calculate the difference between the pressure distribution of the current time frame and the average pressure distribution of the previous five time frames to obtain the differential pressure distribution, and the differential pressure distribution exceeding a preset threshold is transmitted to an external device.

[0016] Based on the embodiments of this disclosure, an insole substrate with a pressure sensor array on its upper surface is provided, along with a main control box fixed to the shoe upper. The wiring of the pressure sensor array is converged to the inner arch region of the insole substrate, and a flexible printed circuit lead-out cable is joined to the converged signal wiring end in the inner arch region. Based on this self-fixing system of the lead-out cable, the flexible printed circuit lead-out cable maintains a stable position as it extends from the inner edge of the insole substrate and runs along the inner side of the shoe upper. When the wiring reaches above the tongue, it connects to the main control box via an end connector, completing the arrangement of the intelligent insole's electronic components. The disclosed embodiments achieve fully washable insoles and zero impact on electronic components, solving industry pain points such as poor reliability, difficult maintenance, and resource waste associated with traditional solutions, and improving system lifespan, data accuracy, and user convenience. It should be understood that the above general description and the following detailed description are exemplary and explanatory only and do not limit the scope of this disclosure.

[0017] The technical solutions of this disclosure will be further described in detail below with reference to the accompanying drawings and embodiments. Attached Figure Description

[0018] The accompanying drawings, which form part of this specification, illustrate embodiments of this disclosure and, together with the description, serve to explain the principles of this disclosure.

[0019] This disclosure will become clearer with reference to the accompanying drawings and the following detailed description, wherein: Figure 1 This is a flowchart illustrating a method for arranging electronic components in an intelligent insole with an externally mounted main control box, according to one embodiment of the method disclosed herein. Figure 2 This is a schematic diagram of a method for arranging electronic components in an intelligent insole with an externally mounted main control box, according to an embodiment of the method disclosed herein. Figure 3 A comparative diagram of plantar pressure distribution in the medial arch region of a smart insole electronic component arrangement method with an externally mounted main control box, as an embodiment of the method disclosed herein. Figure 4 This is a cross-sectional view of the stress relief structure of the flexible printed circuit lead-out cable in a method for arranging electronic components of an externally mounted smart insole according to an embodiment of the present disclosure. Figure 5 This is a three-dimensional force analysis diagram of a dual-redundancy locking structure for a smart insole electronic component arrangement method with an external main control box, according to an embodiment of the method disclosed herein. Detailed Implementation

[0020] Exemplary embodiments will now be described more fully with reference to the accompanying drawings. However, these exemplary embodiments can be implemented in many forms and should not be construed as limited to the embodiments set forth herein; rather, they are provided so that this disclosure will be thorough and complete, and will fully convey the concept of the exemplary embodiments to those skilled in the art. The same reference numerals in the drawings denote the same or similar parts, and therefore repeated descriptions of them will be omitted.

[0021] Furthermore, the described features, structures, or characteristics can be combined in any suitable manner in one or more embodiments. Numerous specific details are provided in the following description to give a thorough understanding of embodiments of this disclosure. However, those skilled in the art will recognize that the technical solutions of this disclosure can be practiced without one or more of the specific details described, or other methods, components, materials, apparatuses, steps, etc., can be employed. In other instances, well-known structures, methods, apparatuses, implementations, materials, or operations are not shown or described in detail to avoid obscuring various aspects of this disclosure.

[0022] The block diagrams shown in the accompanying drawings are merely functional entities and do not necessarily correspond to physically independent entities. That is, these functional entities can be implemented in software, or in one or more software-hardened modules, or in different network and / or processor devices and / or microcontroller devices.

[0023] In this embodiment of the disclosure, a method for arranging electronic components in a smart insole with an externally mounted main control box is first provided; see reference. Figure 1 As shown, the method for arranging electronic components in a smart insole with an externally mounted main control box may include the following steps: Step S110: Provide an insole substrate, arrange a pressure sensor array on the upper surface of the insole substrate, provide a main control box with internally integrated active electronic components, and detachably fix the main control box to the shoe upper through a dual redundancy locking structure. Step S120: The signal lines of the pressure sensor array are aggregated to the inner arch region of the insole substrate. The inner arch region is the optimal lead-out position determined by multi-dimensional analysis of the extrusion stress, bending fatigue life and signal attenuation of the lead-out path of the cable. A flexible printed circuit is connected to the signal line aggregation end in the inner arch region to lead out the cable. Step S130: Based on the self-fixing system of the flexible printed circuit lead-out cable, the flexible printed circuit lead-out cable is kept in a stable position as it is led out from the inner edge of the insole substrate and runs along the inner side of the shoe upper. In step S140, the flexible printed circuit leads out a ribbon cable that runs along the inner side of the shoe upper to the top of the shoe tongue, and connects to the main control box through the end connector to complete the arrangement of the electronic components of the smart insole.

[0024] Below, as Figure 2 As shown, a method for arranging electronic components in an intelligent insole with an externally mounted main control box, according to an embodiment of this disclosure, will be further described.

[0025] In step S110, a shoe insole substrate can be provided, a pressure sensor array is arranged on the upper surface of the shoe insole substrate, a main control box with internally integrated active electronic components is provided, and the main control box is detachably fixed to the shoe upper through a dual redundancy locking structure.

[0026] In some alternative embodiments of this example, the dual redundancy locking structure includes a shear direction locking structure and a vertical direction locking structure: The shear direction locking structure uses mushroom-shaped hook and loop fasteners (such as 3M Dual Lock SJ3550) or equivalent products, such as standard hook and loop fasteners (3M SJ340 series). The core of the selection is to provide high holding force in the shear direction and easy separation in the vertical direction.

[0027] Based on the interlocking effect of the mushroom-shaped Velcro connector in the shear direction, the horizontal inertial force of the main control box is resisted during running. Based on the separable characteristic of the mushroom-shaped Velcro connector in the vertical direction, the main control box is allowed to detach from the shoe upper in the vertical direction during charging.

[0028] In a specific example, the shearing force of the mushroom-head Velcro is greater than 80N / 25cm², the tearing force is less than 25N, and the decrease in fixing force with the number of opening and closing cycles meets the following requirements. ,in For the initial fixing force (approximately 80 N / 25 cm² for 3M Dual Lock), the attenuation coefficient α of the mushroom-shaped Velcro is < 1 × 10⁻⁶. -5 After 10,000 opening and closing cycles, the mushroom-head Velcro retains a fixing force of approximately 72N, with a fixing force retention rate of over 90%. The system employs Velcro fastening. Specifically, a Velcro fastening area of ​​approximately 25×35mm is located on the bottom of the main control box, using mushroom-shaped Velcro. The difference between mushroom-shaped Velcro and standard hook and loop Velcro is that the interlocking unit of the mushroom-shaped Velcro is a mushroom-shaped post, rather than a J-shaped hook and loop. The diameter of the head of each post is larger than the diameter of the stem, and after interlocking, the heads lock together to form a mechanical interlock. This structural characteristic provides extremely high fixing force in the shearing direction, especially parallel to the shoe upper, exceeding 80N over the 25×35mm adhesive area; while in the vertical tearing direction, it can be separated with a smaller force of approximately 15-25N. This characteristic perfectly matches the needs of this application scenario, where resistance to inertial forces in the shearing direction is crucial during running, and easy disassembly in the vertical direction is required during charging.

[0029] The vertical locking structure uses a C-shaped opening shoelace groove integrally formed with the outer shell of the main control box. Utilizing the dimensional relationship that the opening width of the C-shaped opening shoelace groove is smaller than the diameter of a standard sports shoelace, the sports shoelace undergoes elastic compression deformation under external pressure and passes through the opening of the C-shaped opening shoelace groove to complete the connection between the C-shaped opening shoelace groove and the shoe body. Based on the mechanical fixation of the sports shoelace, it resists the vertical inertial force of the main control box during running.

[0030] The opening width of the C-shaped shoelace slot is 3.5-4.0 mm, the diameter of a standard athletic shoelace is 4-5 mm, and the compressive strain when the shoelace is inserted is in the range of 0.1-0.2 mm. The two C-shaped shoelace slots are arranged front-to-back along the length of the shoe, with a spacing of 25-35 mm, consistent with the spacing of adjacent sets of shoelace holes on a standard athletic shoe. The slots are located at the front and rear ends of the main control box housing, with the opening extending downwards from the top of the side wall of the housing into the interior, forming a C-shaped cross-section. The slots are completely embedded within the contour of the housing, without increasing the overall dimensions of the main control box.

[0031] Based on the rewinding, unwinding, and elastic compression characteristics of the athletic shoelaces, during charging, the shoelaces can be untied and removed from above the C-shaped open shoelace slot, allowing the main control box to separate from the shoe upper. The total time for inserting and removing the shoelaces using the open shoelace slot is less than 8 seconds, which is 80% shorter than the disassembly and fitting time of existing O-shaped closed perforated shoelaces, significantly improving users' daily usage willingness.

[0032] In a specific example, such as Figure 4 As shown, the main control box, after double locking, has a displacement of less than 0.3mm in three directions during running.

[0033] The vertical displacement is expressed by the formula. The calculation is performed, where m is the mass of the main control box, which is set to 15-20g; This is the peak value of vertical acceleration, which, according to general understanding of sports biomechanics, is approximately 0.5g to 1g. The vertical equivalent stiffness of the hook and loop fastener is approximately 1.33 N / mm. The vertical equivalent stiffness of the shoelace is approximately 150 N / mm. Calculations show that the vertical displacement is approximately 0.001 mm.

[0034] Meanwhile, the horizontal displacement is minimal and is limited by the mushroom-shaped Velcro connector.

[0035] In step S120, the signal lines of the pressure sensor array can be aggregated to the inner arch region of the insole substrate. The inner arch region is the optimal lead-out position determined by multi-dimensional analysis of the extrusion stress, bending fatigue life and signal attenuation of the lead-out path of the cable. A flexible printed circuit is connected to the signal line aggregation end in the inner arch region to lead out the cable.

[0036] In some optional embodiments of this example, the medial arch region is specifically configured as follows: the direction from the heel of the insole to the toe of the insole is taken as the longitudinal Y-axis, and the direction from the big toe side of the insole to the little toe side of the insole is taken as the transverse X-axis; the heel of the insole is set to 0% of the Y-axis, and the toe of the insole is set to 100% of the Y-axis; the big toe side of the insole is set to 0% of the X-axis, and the little toe side of the insole is set to 100% of the X-axis; the medial arch region is defined as a region where 55% ≥ Y ≥ 45% and 22% ≥ X ≥ 15%.

[0037] Preferably, the medial arch region is set as a region of Y≈48% and X≈18%.

[0038] This area corresponds to the unsupported zone of a normal arch during the support phase, where there is a natural gap of 2-5mm between the sole and the insole, and the stitching is not compressed.

[0039] In some alternative embodiments of this example, such as Figures 2 to 4 As shown, the extrusion stress analysis of the cable lead-out path includes: Based on the plantar pressure distribution function (typical pressure values ​​in each region during the support phase), the pressure values ​​of the heel area, forefoot area, and medial arch area during the support phase are calculated, and the pressure values ​​of the heel area are obtained respectively. Forefoot area Medial arch area ; Through formula Calculate the pressure exerted on the insole by the heel area, forefoot area, and medial arch area of ​​the foot, respectively. in Let P be the pressure exerted by the foot on the insole, and P be the pressure distribution function value of the corresponding area. The pressure-bearing area of ​​the region where the cable lead-out point is located; Then through the formula The compressive stress in the heel area, forefoot area, and medial arch area was calculated separately, and the results were used as a basis. Here, represents the compressive stress borne by the sum of the stresses. This refers to the area of ​​force applied to the sole of the foot by the string.

[0040] During normal arch support, the medial arch area is unsupported or only slightly contacted, with pressure <10 kPa. The cable is not compressed at this point and is routed through the natural gaps after being led out. The value is basically 0, therefore It's essentially zero. During normal arch support, both the heel and forefoot areas need to support the body, and the pressure on the sutures at these points is around 300 kPa. The pressure can reach 300-500 kPa. Excessive pressure repeatedly applied to the flexible printed circuit board leads in the heel and forefoot areas will cause copper foil fatigue, thus affecting its service life.

[0041] In some alternative embodiments of this example, such as Figures 2 to 4 As shown, the bending fatigue life analysis of the cable lead-out path includes: Based on foot and ankle biomechanical analysis, the bending radius of the medial arch region was determined to be greater than or equal to 25 mm and less than or equal to 35 mm. The bending radius of the heel region was determined to be greater than or equal to 5 mm and less than or equal to 15 mm by measuring the insole bending shape under simulated real running conditions.

[0042] Through the bending strain formula Calculate the bending strain in the heel area and the inner arch area respectively, where ε is the bending strain, t is the thickness of the flexible printed circuit lead wire, and R is the bending radius. Through the fatigue life formula The bending fatigue life of the flexible printed circuit lead-out cable in the heel area and the inner arch area was calculated respectively, thus completing the bending fatigue life analysis of the lead-out cable. Where C is the bending life, β is the material constant, and β is the material index.

[0043] In a specific example, the calculation result is: When the thickness t of the flexible printed circuit lead cable is approximately 0.2 mm, and the bending radius R of the follow-up lead path is approximately 10 mm, the bending strain ε in the follow-up area is approximately 1.0%, and the bending life of the flexible printed circuit lead cable in the follow-up area is... ≈10^6 times; When the thickness t of the flexible printed circuit lead-out cable is approximately 0.2 mm, and the bending radius R of the arch lead-out path is approximately 30 mm, the bending strain ε in the medial arch region is approximately 0.33%, and the bending life of the flexible printed circuit lead-out cable in the medial arch region is... ≈9×10^6 times.

[0044] Experimental analysis shows that the lifespan of the arch extension bending is about 9 times that of the heel extension bending.

[0045] In some alternative embodiments of this example, such as Figures 2 to 4 As shown, the signal attenuation analysis of the cable lead-out path includes: Based on the lead-out length of the flexible printed circuit's lead-out cable, using the formula... The resistance of the flexible printed circuit lead-out cables in the heel area and the inner arch area is calculated respectively, and the resistance and signal attenuation analysis of the lead-out cables are completed. ρ is the resistance of the ribbon cable, L is the resistivity of copper, W is the length of the ribbon cable, and m is the width of the trace.

[0046] In a specific example, the calculation result is: When the resistivity of copper is ρ = 1.7 × 10⁻⁶ -8 With a trace width W=0.5mm, copper foil thickness m=18μm, and a follow-up lead path L≈30cm, the ribbon cable resistance is approximately 5.7Ω. When the resistivity of copper is ρ = 1.7 × 10⁻⁶ -8 With a trace width W=0.5mm, copper foil thickness m=18μm, and an arch lead path L≈18cm, the ribbon cable resistance is approximately 3.4Ω·m.

[0047] Experimental analysis shows that the resistance of the foot arch lead-out path is reduced by about 40%, and the signal attenuation is significantly reduced.

[0048] In step S130, a self-fixing system for the flexible printed circuit lead-out cable can be used to keep the flexible printed circuit lead-out cable stable in position as it is led out from the inner edge of the insole substrate and runs along the inner side of the shoe upper.

[0049] In some alternative embodiments of this example, the self-fixing system of the flexible printed circuit lead-out cable includes: Surface adhesion constraint is achieved by encapsulating the outer surface of the flexible printed circuit lead-out cable with silicone material to form a silicone encapsulation layer. This silicone encapsulation layer, based on the surface contact friction between the silicone encapsulation layer and the inner side upper fabric of the shoe, forms a surface adhesion constraint. This silicone encapsulation layer is typically 0.8mm thick, with flexible medical-grade silicone being the optimal material. It can also be replaced with TPU film (0.1-0.3mm thick), medical-grade elastomers (such as Pebax®), silicone rubber, etc. However, the silicone encapsulation layer must be biocompatible, have a Shore A 40-60 flexibility, and a flexural strength >1 million cycles.

[0050] Passive avoidance constraint utilizes the natural safe distance between the inner sides of the feet during running gait to form a passive avoidance constraint between the flexible printed circuit lead-out cable and the inner side of the shoe upper.

[0051] Shape adaptive constraint, based on the preformability of the silicone encapsulation layer, when encapsulating the flexible printed circuit lead wire, makes the flexible printed circuit lead wire match the bending shape of the inner side of the shoe upper, forming an arc-shaped stress relief transition section. The radius of curvature of the arc-shaped stress relief transition section is ≥5mm, which disperses the bending stress from the rigid connection point at the root to the arc-shaped transition section, thus achieving the purpose of shape adaptive constraint.

[0052] In step S140, the flexible printed circuit can be led out along the inner side of the shoe upper to the top of the shoe tongue, and connected to the main control box through the end connector to complete the arrangement of the electronic components of the smart insole.

[0053] Optionally, in any of the above embodiments of this disclosure, the arrangement of the dorsum of the foot inertial measurement unit and the heel inertial measurement module may also be included: A separately packaged heel inertial measurement module is provided, which is fixed to the outside of the shoe heel. The heel inertial measurement module has a built-in 9-axis inertial measurement unit, low-power Bluetooth, and button battery. The outer shell is arc-shaped (radius of curvature 80-120mm) and is attached to the outside of the shoe heel with double-sided adhesive.

[0054] A dorsalis inertial measurement unit is provided and arranged inside the main control box. The main control box also integrates an MCU processor (such as an ARM Cortex-M4 core), a Bluetooth SoC (BLE 5.0+), a pressure signal acquisition chip (multi-channel ADC, 16-bit resolution), and a rechargeable lithium battery (300-500mAh).

[0055] The following inertial measurement module wirelessly synchronizes time with the main control box via a low-power Bluetooth isochronous channel, with a synchronization error of less than 1 millisecond.

[0056] In some alternative embodiments of this example, the exercise intensity level is also set based on the acceleration amplitude and step frequency collected by the instep inertial measurement unit and the heel inertial measurement module; Based on the aforementioned exercise intensity level, the sampling rate of the pressure distribution collected by the pressure sensor array in the main control box is adjusted.

[0057] In a specific example, the sampling rate is 100Hz when standing still or walking slowly (acceleration amplitude < 0.5g, cadence < 80 steps / min); the sampling rate is 150Hz when walking briskly (acceleration amplitude 0.5-1.5g, cadence 80-120 steps / min); and the sampling rate is 200Hz when running (acceleration amplitude > 1.5g, cadence > 120 steps / min).

[0058] In some alternative embodiments of this example, the following are also included: Based on timestamps, spatial sparse coding is used to calculate the difference between the pressure distribution of the current time frame and the average pressure distribution of the previous five time frames, obtaining the differential pressure distribution. The differential pressure distribution exceeding a preset threshold is then transmitted to an external device. This method can compress the transmitted data volume to 30%-50% of the original data volume.

[0059] In addition, when the Bluetooth connection is lost, the main control box automatically caches subsequent data to the built-in storage (the storage capacity can cache about 2 hours of 200Hz full-channel data). After the Bluetooth connection is reconnected, the cached data is uploaded in batches according to the original timestamp order.

[0060] It should be noted that although the steps of the method in this disclosure are described in a specific order in the accompanying drawings, this does not require or imply that the steps must be performed in that specific order, or that all the steps shown must be performed to achieve the desired result. Additional or alternative steps may be omitted, multiple steps may be combined into one step, and / or a step may be broken down into multiple steps.

[0061] The basic principles of this disclosure have been described above with reference to specific embodiments. However, it should be noted that the advantages, benefits, and effects mentioned in this disclosure are merely examples and not limitations, and should not be considered as essential features of each embodiment of this disclosure. Furthermore, the specific details disclosed above are for illustrative and facilitative purposes only, and are not limitations. These details do not limit the scope of this disclosure to the necessity of employing the aforementioned specific details for implementation.

[0062] The various embodiments in this specification are described in a progressive manner, with each embodiment focusing on its differences from other embodiments. Similar or identical parts between embodiments can be referred to interchangeably. For system embodiments, since they largely correspond to method embodiments, the description is relatively simple; relevant parts can be referred to the descriptions in the method embodiments.

[0063] The block diagrams of devices, apparatuses, devices, and systems disclosed herein are merely illustrative examples and are not intended to require or imply that they must be connected, arranged, or configured in the manner shown in the block diagrams. As those skilled in the art will recognize, these devices, apparatuses, devices, and systems can be connected, arranged, and configured in any manner. Words such as “comprising,” “including,” “having,” etc., are open-ended terms meaning “including but not limited to,” and are used interchangeably with them. The terms “or” and “and” as used herein refer to the terms “and / or,” and are used interchangeably with them unless the context clearly indicates otherwise. The term “such as” as used herein refers to the phrase “such as but not limited to,” and is used interchangeably with it.

[0064] The methods of this disclosure may be implemented in many ways. For example, the methods and apparatus of this disclosure may be implemented by software, hardware, firmware, or any combination of software, hardware, and firmware. The above-described order of steps for the methods is for illustrative purposes only, and the steps of the methods of this disclosure are not limited to the order specifically described above, unless otherwise specifically stated. Furthermore, in some embodiments, this disclosure may also be implemented as a program recorded on a recording medium, the program including machine-readable instructions for implementing the methods according to this disclosure. Thus, this disclosure also covers recording media storing programs for performing the methods according to this disclosure.

[0065] It should also be noted that in the apparatus, devices, and methods of this disclosure, the components or steps can be disassembled and / or recombined. These disassemblies and / or recombinations should be considered as equivalent solutions to this disclosure.

[0066] The above description of the disclosed aspects is provided to enable any person skilled in the art to make or use this disclosure. Various modifications to these aspects will be readily apparent to those skilled in the art, and the general principles defined herein may be applied to other aspects without departing from the scope of this disclosure. Therefore, this disclosure is not intended to be limited to the aspects shown herein, but rather to be carried out within the widest scope consistent with the principles and novel features disclosed herein.

[0067] The above description has been given for purposes of illustration and description. Furthermore, this description is not intended to limit the embodiments of this disclosure to the forms disclosed herein. Although numerous exemplary aspects and embodiments have been discussed above, those skilled in the art will recognize certain variations, modifications, alterations, additions, and sub-combinations thereof.

Claims

1. A method for arranging electronic components in a smart insole with an externally mounted main control box, characterized in that, include: A shoe insole substrate is provided, and a pressure sensor array is arranged on the upper surface of the shoe insole substrate. A main control box with internally integrated active electronic components is provided, and the main control box is detachably fixed to the shoe upper through a dual redundancy locking structure. The signal lines of the pressure sensor array are aggregated to the inner arch region of the insole substrate. The inner arch region is the optimal lead-out position determined by multi-dimensional analysis of the extrusion stress, bending fatigue life and signal attenuation of the lead-out path of the cable. A flexible printed circuit is connected to the signal line aggregation end in the inner arch region to lead out the cable. Based on the self-fixing system of the flexible printed circuit lead-out cable, the flexible printed circuit lead-out cable maintains a stable position as it is led out from the inner edge of the insole substrate and runs along the inner side of the shoe upper. The flexible printed circuit leads out along the inner side of the shoe upper to the top of the shoe tongue, and connects to the main control box through the end connector to complete the arrangement of the electronic components of the smart insole.

2. The method according to claim 1, characterized in that, The extrusion stress analysis of the cable lead-out path includes: Based on the plantar pressure distribution function, the pressure values ​​of the heel area, forefoot area, and medial arch area during the support phase are calculated to obtain the heel pressure function value, forefoot pressure function value, and arch pressure function value, respectively. Through formula Calculate the pressure exerted on the insole by the heel area, forefoot area, and medial arch area of ​​the foot, respectively. in Let P be the pressure exerted by the foot on the insole, and P be the pressure distribution function value of the corresponding area. The pressure-bearing area of ​​the region where the cable lead-out point is located; Through formula The compressive stress in the heel area, forefoot area, and medial arch area is calculated separately, and based on the calculation results, the compressive stress analysis of the summing end in the heel area, forefoot area, and medial arch area is completed. in The compressive stress borne by the summing end, This refers to the area of ​​force applied to the sole of the foot by the string.

3. The method according to claim 1, characterized in that, The bending fatigue life analysis of the cable lead-out path includes: Based on foot and ankle biomechanical analysis, the bending radius of the medial arch region was determined to be greater than or equal to 25 mm and less than or equal to 35 mm. The bending radius of the heel region was determined to be greater than or equal to 5 mm and less than or equal to 15 mm by measuring the insole bending shape under simulated real running conditions. Through the bending strain formula Calculate the bending strain in the heel area and the medial arch area respectively; Where ε is the bending strain, t is the thickness of the flexible printed circuit lead wire, and R is the bending radius; Through the fatigue life formula The bending fatigue life of the flexible printed circuit lead wires in the heel area and the inner arch area is calculated respectively to complete the bending fatigue life analysis of the lead wires. in Where C is the bending life, β is the material constant, and β is the material index.

4. The method according to claim 1, characterized in that, The signal attenuation analysis of the cable lead-out path includes: Based on the lead-out length of the flexible printed circuit's lead-out cable, using the formula... The resistance of the flexible printed circuit lead-out ribbon cable in the heel area and the inner arch area is calculated respectively to complete the resistance and signal attenuation analysis of the lead-out ribbon cable. in, ρ is the resistance of the ribbon cable, L is the resistivity of copper, W is the length of the ribbon cable, and m is the width of the trace.

5. The method according to claim 1, characterized in that, The inner arch region is configured as follows: Take the direction from the heel of the insole to the toe of the insole as the longitudinal Y-axis, and the direction from the big toe side of the insole to the little toe side of the insole as the transverse X-axis; The heel of the insole is set to 0% of the Y-axis, and the toe of the insole is set to 100% of the Y-axis. The big toe side of the insole is set to 0% of the X-axis, and the little toe side of the insole is set to 100% of the X-axis. The inner arch region is defined as the area where 55% ≥ Y ≥ 45% and 22% ≥ X ≥ 15%.

6. The method according to claim 1, characterized in that, The self-fixing system for the flexible printed circuit lead-out cable includes: The outer surface of the flexible printed circuit lead cable is encapsulated with silicone material to form a silicone encapsulation layer. Based on the surface contact friction between the silicone encapsulation layer and the inner side upper fabric of the shoe, a surface adhesion constraint is formed. By utilizing the natural safety distance between the inner sides of the feet during the running gait, a passive avoidance constraint is formed between the flexible printed circuit lead-out cable and the inner side of the shoe upper. Based on the preformability of the silicone encapsulation layer, when encapsulating the flexible printed circuit lead wires, the flexible printed circuit lead wires are made to match the curvature of the inner side of the shoe upper, forming a shape adaptive constraint.

7. The method according to claim 1, characterized in that, The dual redundancy locking structure includes a shear direction locking structure and a vertical direction locking structure: The shearing direction locking structure uses a mushroom-head Velcro connector. Based on the interlocking effect of the mushroom-head Velcro connector in the shearing direction, it resists the horizontal inertial force of the main control box during running. Based on the vertically separable characteristic of the mushroom-shaped Velcro connector, the main control box is allowed to detach from the shoe upper in a vertical direction during charging. The vertical locking structure adopts a C-shaped opening shoelace groove integrally formed with the outer shell of the main control box. Utilizing the size fit relationship that the opening width of the C-shaped opening shoelace groove is smaller than the diameter of a standard sports shoelace, the sports shoelace undergoes elastic compression deformation under external pressure and passes through the opening of the C-shaped opening shoelace groove to complete the connection between the C-shaped opening shoelace groove and the shoe body. Based on the mechanical fixation of the sports shoelace, it resists the vertical inertial force of the main control box during running. Based on the rewinding, unwinding, and elastic compression characteristics of the athletic shoelaces, during charging, the athletic shoelaces are allowed to be untied and removed from above the C-shaped opening shoelace slot, thus separating the main control box from the shoe upper.

8. The method according to claim 1, characterized in that, It also includes the arrangement of the instep inertial measurement unit and the heel inertial measurement module: A separately packaged heel inertial measurement module is provided, and the heel inertial measurement module is fixed to the outside of the heel of the shoe; A dorsalis inertial measurement unit is provided, and the dorsalis inertial measurement unit is arranged in the main control box; The following inertial measurement module wirelessly synchronizes its time with the main control box via a low-power Bluetooth isochronous channel.

9. The method according to claim 8, characterized in that, Also includes: Based on the acceleration amplitude and step frequency collected by the instep inertial measurement unit and the heel inertial measurement module, the exercise intensity level is set; Based on the aforementioned exercise intensity level, the sampling rate of the pressure distribution collected by the pressure sensor array in the main control box is adjusted.

10. The method according to claim 9, characterized in that, Also includes: Based on timestamps, spatial sparse coding is used to calculate the difference between the pressure distribution of the current time frame and the average pressure distribution of the previous five time frames to obtain the differential pressure distribution, and the differential pressure distribution exceeding a preset threshold is transmitted to an external device.

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