Intelligent wearable knee pain therapeutic instrument

Abstract

The application relates to an intelligent wearable knee joint pain treatment instrument, and relates to the technical field of medical instruments. The treatment instrument comprises a wearing carrier used for being worn at a knee joint; a plurality of treatment zones are distributed on the inner side of the wearing carrier; a laser assembly comprises a plurality of laser chips, the laser chips are arranged on the inner side of the wearing carrier, and each treatment zone is provided with a laser chip; a temperature sensing assembly comprises a plurality of temperature sensing chips, the temperature sensing chips are arranged on the inner side of the wearing carrier, and each treatment zone is provided with a temperature sensing chip; a control assembly is arranged on the wearing carrier, and the laser chips and the temperature sensing chips are electrically connected with the control assembly; the control assembly is used for collecting detection data of the temperature sensing chips and correspondingly controlling the laser chips in the same treatment zone. The application can perform regional targeted treatment according to the distribution of actual pain lesion areas of different patients, thereby improving the targeting of treatment and improving the stability and consistency of treatment effect.

Description

Technical Field

[0001] This application relates to the technical field of medical devices, and in particular to a smart wearable knee pain treatment device. Background Technology

[0002] Knee pain is often caused by osteoarthritis, rheumatoid arthritis, sports injuries, and poor postoperative tissue repair. The lesions are usually not evenly distributed throughout the entire knee joint, and the location and depth of pain vary among different patients and at different times.

[0003] Currently, there are three main types of existing knee pain treatment devices: The first category is physical stimulation devices, such as heating pads and vibrating massage gear, whose effects are limited to the surface muscle tissue.

[0004] The second category is laser therapy equipment, which typically uses a single high-power light source to irradiate the entire knee joint area in a uniform manner. Its principle lies in the fact that photobiological modulation therapy uses near-infrared light of a specific wavelength, which is absorbed by mitochondrial cytochrome C oxidase, promoting ATP synthesis, improving local microcirculation, and downregulating pro-inflammatory factors, thereby achieving anti-inflammatory and analgesic effects and tissue repair. It is a safe and non-invasive physical therapy method.

[0005] The third category is wearable protective gear, which mostly uses passive heating or transcutaneous electrical stimulation (TENS) to apply physical stimulation to the entire knee joint.

[0006] Regarding the aforementioned technologies, all three treatment devices target the entire knee joint, resulting in a generally fixed therapeutic effect and treatment location. However, the location of knee pain lesions varies from person to person. This means that when different patients use the same treatment device, the device cannot provide targeted treatment to different lesion locations, leading to unstable treatment outcomes. Summary of the Invention

[0007] This application provides an intelligent wearable knee pain treatment device, the purpose of which is to improve the treatment targeting of the device and enhance the stability and accuracy of treatment efficiency.

[0008] The intelligent wearable knee pain treatment device provided in this application adopts the following technical solution: A smart wearable knee pain treatment device includes: a wearable carrier for wearing on the knee joint; a plurality of treatment zones distributed on the inner side of the wearable carrier; a laser component including a plurality of laser chips disposed on the inner side of the wearable carrier, and each treatment zone containing a laser chip; a temperature sensing component including a plurality of temperature sensing chips disposed on the inner side of the wearable carrier, and each treatment zone containing a temperature sensing chip; and a control component disposed on the wearable carrier, wherein the laser chips and the temperature sensing chips are electrically connected to the control component, and the control component is used to collect detection data from the temperature sensing chips and correspondingly control the laser chips within the same treatment zone.

[0009] By adopting the above technical solution, after the patient wears the wearable device on the knee joint, the temperature-sensing chips distributed in each treatment area detect the temperature of the knee joint area they are facing, thereby obtaining the temperature distribution of the entire knee joint with the cooperation of several temperature-sensing chips.

[0010] Since knee pain lesions are often accompanied by local inflammatory reactions, the tissue temperature in the inflammatory area is higher than that of the surrounding normal tissue due to vasodilation and accelerated metabolism. Therefore, an abnormal increase in temperature at the location corresponding to a certain treatment area indicates the presence of a pain lesion in the area directly opposite the treatment area. Based on this, the control component can indirectly sense and locate the pain lesion based on temperature distribution.

[0011] Based on this, the control component can drive the laser chip in the same treatment area to target the painful lesion area, so that temperature detection and laser treatment are spatially aligned in the same treatment area, forming a closed-loop targeted control where the detection position and the treatment position are highly consistent.

[0012] Therefore, since the temperature detection in each treatment area corresponds spatially with the laser treatment, the control component can adaptively target only the painful lesion area based on the temperature feedback of each treatment area, thus narrowing the fluctuation of treatment effect caused by the difference in lesion distribution among different patients and improving the regional targeting consistency of treatment.

[0013] Optionally, it also includes a pressure-sensitive component, which includes a plurality of pressure-sensitive chips disposed inside the wearable carrier, and each of the treatment areas contains a pressure-sensitive chip; the pressure-sensitive chip is electrically connected to the control component, and the control component is also used to collect the detection data of the pressure-sensitive chip.

[0014] By adopting the above technical solution, the pressure-sensitive chip in each treatment area detects the contact pressure between the knee joint area it faces and the wearable carrier, thereby obtaining the pressure distribution of the entire knee joint.

[0015] Since painful lesions are often accompanied by increased temperature, as well as tissue swelling, exudation, and tenderness, the contact pressure in this area changes abnormally relative to the surrounding normal tissue. Therefore, pressure distribution can assist in the perception and localization of painful lesions from the perspective of pressure.

[0016] Based on this, the control component coordinates the detection data of the pressure-sensitive chip with the temperature detection data of the temperature-sensitive chip in the same treatment area, so that temperature and pressure constitute two independent criteria for cross-validation. This makes up for the possible omissions and misjudgments that may occur when relying solely on the single indicator of temperature due to interference from non-lesion factors such as blood vessel distribution and ambient temperature fluctuations, thereby improving the accuracy and robustness of pain lesion area identification.

[0017] Meanwhile, the pressure-sensitive chip can also reflect the degree of fit between the wearable device and the skin in each treatment area in real time, providing a data basis for fit monitoring.

[0018] Optionally, the device may also include an electromyography (EMG) sensing component, which includes a plurality of EMG electrode pads embedded inside the wearable carrier; the EMG electrode pads are electrically connected to the control component, which is also used to collect detection data from all the EMG electrode pads.

[0019] By adopting the above technical solution, electromyographic electrode pads can collect surface electromyographic signals of the muscles around the knee joint. These signals reflect the real-time contraction activity and muscle tension level of the muscles around the patient's knee joint.

[0020] When pain occurs, the patient's pain-protective muscle spasms cause characteristic changes in the frequency and amplitude of electromyography (EMG) signals in the corresponding area. Therefore, the control component coordinates the detection data of EMG signals with the temperature detection data of the temperature sensing chip to make temperature and EMG two independent physical dimensions to cross-validate pain, further reducing the misjudgment rate caused by fluctuations of a single indicator and improving the reliability of pain lesion area identification.

[0021] Optionally, there are no fewer than two laser chips in the same treatment area, and the wavelengths of the lasers output by each laser chip in the same treatment area are different.

[0022] By adopting the above technical solution, no less than two laser chips in the same treatment area output lasers of different wavelengths. Since the penetration depth of different wavelength lasers in human tissues varies, the control component can select a single wavelength laser chip that matches the depth of the patient's painful lesion for targeted irradiation, or drive laser chips of different wavelengths simultaneously for layered synergistic irradiation. This enables differentiated layered treatment for knee joint lesions of different depths, expanding the therapeutic adaptability of the treatment device to lesions of different depths.

[0023] Optionally, the laser assembly further includes microlenses, which are configured in a one-to-one correspondence with the laser chip and are fixed to the light-emitting side of the laser chip.

[0024] By adopting the above technical solution, the divergent laser beam emitted by the laser chip is shaped by the corresponding microlens and forms a uniform spot when it penetrates the skin surface. On the one hand, the laser power density is limited to a safe and efficient treatment range, and on the other hand, the divergence angle of a single laser chip is limited, avoiding large-area overlap of adjacent laser spots on the skin surface, which would lead to local irradiation dose overload.

[0025] Optionally, the control component includes a flexible substrate, a controller, and a power supply. The flexible substrate is disposed within the wearable carrier, and a plurality of laser chips and a plurality of temperature sensing chips are disposed on the flexible substrate. The controller includes a housing and a control chip. The control chip and the power supply are both located within the housing. The housing is fixed to the outside of the wearable carrier, and the flexible substrate is electrically connected to the control chip.

[0026] By adopting the above technical solution, the flexible substrate's own bendable characteristics enable it to conform to the curvature of the knee joint with the wearable carrier, so that the laser chip and temperature sensing chip can still perform their functions when the knee joint is bent.

[0027] Optionally, the control component further includes a wireless communication module, which is located inside the housing and is communicatively connected to the control chip.

[0028] By adopting the above technical solution, the control chip can synchronously upload treatment data, such as collected temperature distribution data, pain lesion area identification results, and irradiation records of each laser chip, to the patient's mobile terminal or remote medical system via the wireless communication module. This allows doctors to remotely view the patient's real-time treatment status and historical treatment reports. Simultaneously, doctors can remotely send adjustment commands for treatment parameters to the control chip via the wireless communication module through the medical system. The control chip receives and executes these commands, operating according to the updated parameters. This enables data exchange and remote treatment guidance between doctors and patients while the patient uses the treatment device at home.

[0029] Optionally, an interactive screen is provided on the outside of the housing, and the interactive screen is electrically connected to the control chip.

[0030] By adopting the above technical solution, patients can directly perform operations such as powering on, powering off, and selecting and switching treatment modes through the interactive screen set on the outside of the casing. The operating status of the treatment device, the current treatment mode, and the identification results of the painful lesion area are directly displayed on the interactive screen. Patients can independently complete local operations and status checks without relying on external mobile terminals, which reduces the operation threshold and improves the convenience and intuitiveness of using the treatment device independently.

[0031] Optionally, the wearable carrier is further provided with a heat dissipation component, which includes a plurality of ceramic sub-plates, a plurality of heat spreaders, and a plurality of heat dissipation pillars; each ceramic sub-plate corresponds to a laser chip, the ceramic sub-plate is fixed on the flexible substrate, and the laser chip is bonded to the side of the corresponding ceramic sub-plate facing away from the flexible substrate; each heat spreader corresponds to a ceramic sub-plate, and the heat spreader is attached to the side of the flexible substrate facing away from the corresponding ceramic sub-plate; each heat dissipation pillar corresponds to a heat spreader, one end of the heat dissipation pillar is connected to the corresponding heat spreader, and the other end extends to the outside of the wearable carrier.

[0032] By adopting the above technical solution, when the laser chip is working, the heat it generates is sequentially transferred through the ceramic sub-plate, flexible substrate, heat spreader, and heat sink, and finally transferred from the end of the heat sink to the air outside the wearable carrier. In this process, the ceramic sub-plate, heat spreader, and heat sink form a heat conduction channel. On the one hand, this conducts the heat generated by the laser chip away from the human body to prevent burns; on the other hand, because flexible substrates generally have poor thermal conductivity, adding a ceramic sub-plate, heat spreader, and heat sink with good thermal conductivity can accelerate the heat dissipation of the flexible substrate.

[0033] Optionally, the heat dissipation assembly further includes a metal isolation grating, which is fixed on the flexible substrate. The metal isolation grating has a plurality of isolation grid holes formed on it, and each of the temperature sensing chips and each of the laser chips is located in different isolation grid holes.

[0034] By adopting the above technical solution, each temperature sensing chip and each laser chip are located in different isolation grid holes of the metal isolation grating. On the one hand, the metal isolation grating can block lateral optical crosstalk between the beams emitted from adjacent laser chips, ensuring that the boundary of each target spot is clear and independent of each other. On the other hand, the metal material itself has high thermal conductivity, which can help absorb the heat emitted laterally by the laser chip and conduct it to the flexible substrate. This makes the heat dissipation path of the laser chip sidewall and the main heat dissipation path through the ceramic sub-plate form a parallel synergistic heat conduction structure, further reducing the overall operating temperature of the laser chip.

[0035] In summary, this application includes at least one of the following beneficial technical effects: 1. This application uses a control component to identify the painful lesion area based on the temperature detection data of the temperature sensing chip in each treatment area, and then controls the laser chip in the same treatment area to perform targeted irradiation accordingly. This forms a closed-loop targeted control between temperature detection and laser treatment in the same treatment area, thereby improving the targeting of the treatment and increasing the stability of the treatment efficiency.

[0036] 2. This application, through the combined design of temperature-sensitive chip, pressure-sensitive chip and / or electromyographic electrode pads, enables the identification of pain lesion areas to be cross-validated by multiple independent criteria, thereby reducing the rate of missed and false positives caused by non-lesion factors such as blood vessel distribution, ambient temperature fluctuations or motion artifacts, and improving the accuracy of pain lesion area identification.

[0037] 3. This application enables targeted treatment of knee joint lesions at different depths by setting laser chips of different wavelengths in the same treatment area. Attached Figure Description

[0038] Figure 1 This is a schematic diagram of the inner structure of the treatment device according to Embodiment 1 of this application.

[0039] Figure 2 This is a schematic diagram of the outer structure of the treatment device according to Embodiment 1 of this application.

[0040] Figure 3 This is a partial cross-sectional view of the treatment device according to Embodiment 1 of this application.

[0041] Figure 4 This is a wiring diagram of the laser component, temperature sensing component, and control component of Embodiment 1 of this application.

[0042] Figure 5 This is a schematic diagram of the inner structure of the treatment device according to Embodiment 2 of this application.

[0043] Figure 6 This is a schematic diagram of the inner structure of the treatment device according to Embodiment 3 of this application.

[0044] Figure 7 This is a schematic diagram of the inner structure of the treatment device according to Embodiment 4 of this application.

[0045] In the diagram, 1. Wearable device; 11. Elastic strap; 12. Adjustable buckle; 13. Treatment area; 2. Laser components; 21. Laser chip; 22. Microlens; 3. Temperature sensing component; 31. Temperature sensing chip; 4. Control components; 41. Flexible substrate; 42. Controller; 421. Housing; 422. Control chip; 423. Interactive screen; 43. Power supply; 44. Wireless communication module; 5. Heat dissipation components; 51. Metal isolation grating; 511. Isolation mesh holes; 52. Ceramic sub-plate; 53. Heat spreader; 54. Heat dissipation column; 6. Pressure-sensitive component; 61. Pressure-sensitive chip; 7. Electromyography (EMG) sensing components; 71. EMG electrode pads. Detailed Implementation

[0046] The following is in conjunction with the appendix Figure 1 -Appendix Figure 7 This application will be described in further detail below.

[0047] Example 1: A smart wearable knee pain treatment device, referring to... Figure 1 and Figure 2 The device includes a wearable carrier 1, a laser component 2, a temperature sensing component 3, and a control component 4. The laser component 2 includes a plurality of laser chips 21, which are disposed inside the wearable carrier 1. The temperature sensing component 3 includes a plurality of temperature sensing chips 31, which are embedded inside the wearable carrier 1. Both the laser chips 21 and the temperature sensing chips 31 are electrically connected to the control component 4.

[0048] With this structural design, the patient can wear the wearable carrier 1 to the knee joint. At this time, all the temperature sensing chips 31 in the temperature sensing component 3 collect temperature data of each area of ​​the knee joint in real time to identify the painful lesion area. The control component 4 controls the corresponding laser chip 21 in the laser component 2 to work according to the data collected by the temperature sensing component 3, so that the corresponding laser chip 21 can be targeted to the corresponding painful lesion area, thereby realizing regional targeted treatment of the painful lesion area of ​​the knee joint.

[0049] Reference Figure 1 The wearable carrier 1 is made of elastic material, and its shape is designed according to the anatomical structure of the human knee joint so that when the wearable carrier 1 is worn at the knee joint, the inner side of the wearable carrier 1 can conform to the curvature of the knee joint. The wearable carrier 1 is provided with an elastic strap 11, and the elastic strap 11 is provided with an adjustment buckle 12.

[0050] In this embodiment, the wearable carrier 1 is integrally molded from medical-grade liquid silicone. In other embodiments, the wearable carrier 1 may also be made of thermoplastic polyurethane elastomer, medical silicone rubber, neoprene rubber, polyamide elastomer, or medical-grade spandex composite fabric.

[0051] Based on the design of the wearable carrier 1, its inherent elasticity and the coordinated design of the elastic strap 11 and adjustment buckle 12 allow the inner side of the wearable carrier 1 to fit snugly against the skin surface of the knee joint and adapt to different leg circumferences. This improves the stability of the wearable carrier 1 and ensures it conforms as closely as possible to the skin of the knee joint, resulting in a relatively stable distance between the temperature sensing chip 31 and the laser chip 21 and the corresponding skin. This leads to relatively stable temperature detection data and laser treatment effects, thereby improving the consistency and accuracy of the treatment.

[0052] Reference Figure 1 and Figure 2 In the laser component 2, several laser chips 21 are distributed inside the wearable carrier 1, and all of the laser chips 21 are electrically connected to the control component 4. Among them, the laser chips 21 are vertical cavity surface-emitting laser chips (VCSEL chips), the emission wavelength of the laser chip 21 is 980nm, and the maximum output power of a single chip is 50mW.

[0053] With this laser chip selection 21, the VCSEL chip possesses physical characteristics such as a small beam divergence angle, low threshold current, and ease of integration into a two-dimensional planar array. Near-infrared lasers with an emission wavelength of 980nm can penetrate the skin surface and reach deep into the knee joint, including the infrapatellar fat pad, synovium, and cartilage. Through photobiological regulation, it promotes local microcirculation and downregulates pro-inflammatory factors to achieve anti-inflammatory and analgesic effects.

[0054] Reference Figure 1 and Figure 3 The laser assembly 2 also includes microlenses 22, which are configured one-to-one with the laser chip 21 and are fixed to the light-emitting side of the laser chip 21. The microlenses 22 are plano-convex microlenses made of fused silica.

[0055] Based on the microlens 22, the divergent laser beam emitted from the laser chip 21 is shaped by the microlens 22, forming a uniform light spot when it penetrates the skin surface. On the one hand, this limits the laser power density output by the laser chip 21 to a safe range; on the other hand, it limits the divergence angle of a single laser chip 21, preventing large-area overlap of laser spots from adjacent laser chips 21 irradiating the skin, which could lead to local irradiation dose overload.

[0056] Reference Figure 1 and Figure 2In the temperature sensing component 3, a plurality of temperature sensing chips 31 are distributed inside the wearable carrier 1, and all of the temperature sensing chips 31 are electrically connected to the control component 4. The temperature sensing chips 31 are arranged in a one-to-one correspondence with the laser chips 21, and are arranged adjacent to and spaced apart from their corresponding laser chips 21. The temperature sensing chips 31 are infrared temperature measuring chips with a measurement accuracy of ±0.2℃ and a sampling rate of not less than 10Hz; in other embodiments, the temperature sensing chips 31 may also be contact-type digital body temperature sensing chips.

[0057] In this embodiment, refer to Figure 1 and Figure 2 The inner side of the wearable carrier 1 is divided into several treatment areas 13. The temperature sensing chip 31 and the laser chip 21 are set one-to-one with the treatment areas 13, and the temperature sensing chip 31 and the corresponding laser chip 21 are located in the same treatment area 13.

[0058] With this design, each temperature sensing chip 31 can detect the temperature of the knee joint and the corresponding treatment area 13, and thus, with the cooperation of all temperature sensing chips 31, the temperature distribution of the entire knee joint can be obtained.

[0059] Based on this, since knee pain usually originates from pathological processes such as osteoarthritis, synovitis, tissue damage, or poor postoperative repair, these pathological processes are often accompanied by local inflammatory reactions. Due to vasodilation, accelerated local metabolism, and accumulation of inflammatory mediators, the tissue temperature in the inflammatory area will be higher than that of the surrounding normal tissue. Therefore, when the temperature at the location corresponding to each treatment area 13 is abnormally higher than its normal state, it indicates that there is a painful lesion in the knee joint area directly opposite the treatment area 13. This achieves indirect perception and localization of the location of the painful lesion based on temperature distribution.

[0060] Based on this, the control component 4 compares the temperature detected by each temperature sensing chip 31 with the normal temperature baseline of the treatment area 13. Once the temperature deviation of a certain treatment area 13 exceeds the set threshold, it is determined that the area directly opposite the treatment area 13 is the painful lesion area, and the laser chip 21 of the treatment area 13 is driven to target and irradiate the painful lesion area.

[0061] Reference Figure 2 and Figure 4 The control component 4 includes a flexible substrate 41, a controller 42, and a power supply 43.

[0062] Reference Figure 3 and Figure 4 The flexible substrate 41 is embedded in the wearable carrier 1, and several laser chips 21 and several temperature sensing chips 31 are fixed on the flexible substrate 41.

[0063] Reference Figure 2 and Figure 4The controller 42 includes a housing 421, a control chip 422, and an interactive screen 423. The control chip 422 and a power supply 43 are integrated inside the housing 421, and the interactive screen 423 is disposed on the outside of the housing 421. The housing 421 is fixed to the outside of the wearable carrier 1. The flexible substrate 41 is electrically connected to the control chip 422 inside the housing 421 via flexible wires. The power supply 43 and the interactive screen 423 are both electrically connected to the control chip 422.

[0064] Based on the structural design of the control component 4, a driving circuit is pre-etched on the flexible substrate 41. The driving circuit includes independent positive driving lines corresponding to each laser chip 21 and a common negative driving line shared by each laser chip 21. The positive terminal of each laser chip 21 is connected to the corresponding independent positive driving line, and the negative terminal of each laser chip 21 is connected to the common negative driving line. This allows each laser chip 21 to be electrically connected in parallel to the same driving circuit and to have its own independent driving branch. This enables the parallel packaging of several laser chips 21 and allows the control chip 422 to independently control the on / off state and power drive of each laser chip 21.

[0065] Similarly, the temperature sensing chip 31 is connected in parallel to the control chip 422 via a data acquisition bus pre-etched on the flexible substrate 41. Each temperature sensing chip 31 is sequentially addressed and read by the control chip 422 according to a preset address, thereby realizing the partitioned acquisition and centralized processing of temperature data from all temperature sensing chips 31.

[0066] Based on this, the control chip 422 is equipped with the following control logic for pain lesion area identification and targeted driving: Within the initial 60 seconds after treatment begins, the control chip 422 enters a temperature baseline establishment phase (the first 30 seconds are a static stabilization waiting period, and the last 30 seconds are a data acquisition period). The control chip 422 acquires the readings of the temperature sensing chips 31 in each treatment area 13 at a frequency of 10Hz. The average of the data acquired in the last 30 seconds is taken as the individual temperature baseline value in each treatment area 13, and the standard deviation is calculated as a reference for the temperature fluctuation threshold of each treatment area 13. Afterwards, a treatment detection cycle begins, and the control chip 422 continuously acquires the real-time temperature of each temperature sensing chip 31 at a frequency of 1Hz and calculates the temperature deviation. When the temperature deviation of a certain treatment area 13 exceeds the set threshold, the control chip 422 determines that treatment area 13 as a pain lesion area and then drives the corresponding laser chip 21 to target and irradiate the pain lesion area. The purpose of setting the static stabilization waiting period is to eliminate transient temperature drift in the initial stage of wearing the device, making the baseline more accurately reflect the true temperature distribution.

[0067] Based on this, in this embodiment, the control chip 422 has three preset treatment modes: The first mode is a mild mode: the control chip 422 controls the output power of the laser chip 21 at a lower level, for example, 20%-30%; the single irradiation duration of a single treatment area 13 is set to a shorter duration, for example, 5-10 minutes; at the same time, the temperature deviation judgment threshold is set to a higher value, for example, 1.5℃-1.7℃. This treatment mode is suitable for mild pain or daily health care treatment.

[0068] The second mode is the moderate mode: the control chip 422 controls the output power of the laser chip 21 at a moderate level, for example, 50%-60%; the single irradiation duration of a single treatment area 13 is set to a moderate duration, for example, 15-20 minutes; and the temperature deviation judgment threshold is set to an intermediate value, for example, 1.0℃-1.2℃. This treatment mode is suitable for moderate pain, such as early osteoarthritis or the recovery period of sports injuries.

[0069] The third type is the severe mode: the control chip 422 controls the output power of the laser chip 21 to a higher level, such as 90%-100%; the single irradiation duration of a single treatment area 13 is set to a longer duration, such as 25-30 minutes; and the temperature deviation judgment threshold is set to a lower value, 0.5℃-0.7℃. This treatment mode is suitable for severe joint pain or acute inflammation.

[0070] With this design, patients with different levels of pain can select the corresponding treatment mode through the interactive screen 423 according to their own situation. The control chip 422 automatically operates according to the laser power, irradiation time and judgment threshold parameters corresponding to the selected mode, without requiring patients to manually adjust each parameter one by one. This reduces the operating threshold while ensuring a reasonable match between the treatment dose and recognition sensitivity for different levels of pain.

[0071] In this embodiment, refer to Figure 4 The flexible substrate 41 is made of polyimide copper-clad laminate or polyester copper-clad laminate to provide overall flexibility and bendability.

[0072] In this embodiment, refer to Figure 4 The control chip 422 employs a field-programmable gate array (FPGA) chip. The FPGA chip uses parallel logic to implement independent PWM drive signal outputs for each laser chip 21, with a drive response time of less than 1ms. In other embodiments, the control chip 422 may also be an ARM microcontroller.

[0073] In this embodiment, refer to Figure 4 The controller 42 also integrates a wireless communication module 44, which is electrically connected to the control chip 422. The wireless communication module 44 can be a 4G, 5G, Bluetooth, or WiFi module.

[0074] With the wireless communication module 44 in its design, the control chip 422 can synchronously upload treatment data such as temperature distribution data collected by the therapeutic instrument, pain lesion area identification results, and irradiation records of each laser chip 21 to the patient's mobile terminal or a remote medical system via the wireless communication module 44, allowing doctors to remotely view the patient's real-time treatment status and historical treatment reports. At the same time, doctors can remotely send adjustment instructions for treatment parameters to the control chip 422 via the wireless communication module 44 through the medical system. After receiving and executing the corresponding instructions, the control chip 422 operates according to the updated parameters, thereby achieving data communication and remote treatment guidance between doctors and patients while the patient uses the therapeutic instrument at home.

[0075] In this embodiment, refer to Figure 2 and Figure 4 The power supply 43 includes a lithium battery and a charging interface. The lithium battery is located inside the housing 421, and the charging interface is located on the housing 421. Both the charging interface and the lithium battery are electrically connected to the control chip 422.

[0076] Reference Figure 3 and Figure 4 The wearable carrier 1 is also equipped with a heat dissipation component 5, which includes a metal isolation grating 51, several ceramic sub-plates 52, several heat dissipation plates 53 and several heat dissipation columns 54.

[0077] Reference Figure 3 Each ceramic sub-board 52 corresponds to a laser chip 21. The ceramic sub-board 52 is fixed on the flexible substrate 41, and the laser chip 21 is bonded to the side of the corresponding ceramic sub-board 52 facing away from the flexible substrate 41. The ceramic sub-board 52 is made of aluminum nitride ceramic substrate or alumina ceramic copper-clad laminate.

[0078] Based on the design of the ceramic sub-board 52, a metallized circuit layer corresponding to the electrodes of the laser chip 21 is provided on the side of the ceramic sub-board 52 facing away from the flexible substrate 41. The laser chip 21 is electrically connected to this metallized circuit layer by bonding. On the side of the ceramic sub-board 52 facing the flexible substrate 41, the metallized circuit layer is led to the bottom surface of the ceramic sub-board 52 through metallized vias penetrating the thickness direction of the ceramic sub-board 52, and then soldered to the circuit on the flexible substrate 41 via bottom pads. Thus, based on the electrical insulation of the ceramic material itself, an electrical path is constructed between the laser chip 21 and the flexible substrate 41 by means of the metallized circuit layer and the metallized vias. Therefore, the design of the ceramic sub-board 52 achieves both electrical interconnection and insulation isolation, and can also quickly conduct concentrated heat, avoiding wavelength drift or optical power attenuation of the laser chip 21.

[0079] Reference Figure 3The temperature distribution plate 53 corresponds one-to-one with the ceramic sub-plate 52. The temperature distribution plate 53 is attached to the side of the flexible substrate 41 away from the corresponding ceramic sub-plate 52, and the temperature distribution plate 53 is positioned directly opposite the ceramic sub-plate 52 along the thickness direction of the flexible substrate 41. The temperature distribution plate 53 is a graphene temperature distribution plate or a copper foil temperature distribution plate.

[0080] Based on the design of the heat spreader 53, the heat spreader 53 evenly diffuses the point heat over a large area, reducing the local peak temperature and preventing local overheating of the wearable carrier 1.

[0081] Reference Figure 3 Each heat dissipation column 54 is configured to correspond one-to-one with a heat spreader 53. One end of the heat dissipation column 54 is connected to the corresponding heat spreader 53, and the other end extends to the outer surface of the wearable carrier 1. The heat dissipation column 54 is made of copper or aluminum alloy.

[0082] Based on the design of the heat dissipation column 54, the heat dissipation column 54 can quickly conduct heat away from the heat spreader 53, thereby achieving the heat dissipation function.

[0083] Reference Figure 3 and Figure 4 The metal isolation grating 51 is fixed on the flexible substrate 41 and welded to the flexible substrate 41. A plurality of isolation grid holes 511 are formed on the metal isolation grating 51, and each temperature sensing chip 31 and laser chip 21 are located in different isolation grid holes 511.

[0084] Based on the design of the metal isolation grating 51, on the one hand, it can block lateral optical crosstalk between the emitted beams of adjacent laser chips 21; on the other hand, the metal material itself has high thermal conductivity, which can help absorb the heat emitted laterally by the laser chip 21 and conduct it to the flexible substrate 41.

[0085] In this embodiment, the metal isolation grating 51 is a flexible sheet structure, which is formed by stamping copper sheet or other metal sheet. Furthermore, the bottom surface of the metal isolation grating 51 is fixed to the grounding ring trace reserved on the flexible substrate 41 by reflow soldering, so that the metal isolation grating 51 achieves both mechanical fixation and forms an auxiliary conductive loop for heat dissipation through grounding.

[0086] Reference Figure 3 and Figure 4Through the coordinated design of the ceramic sub-plate 52, the heat spreader 53, the heat dissipation column 54, and the metal isolation grating 51, the concentrated heat generated by the laser chip 21 during operation is sequentially conducted through the ceramic sub-plate 52 to the flexible substrate 41, and then sequentially conducted to the outside of the wearable carrier 1 through the corresponding heat spreader 53 and heat dissipation column 54. This design serves two purposes: firstly, it can conduct the heat generated by the laser chip 21 away from the human body to prevent burns; secondly, because the flexible substrate 41 generally has poor thermal conductivity, the addition of the ceramic sub-plate 52, heat spreader 53, and heat dissipation column 54, which have good thermal conductivity, can accelerate the heat dissipation of the flexible substrate 41.

[0087] Meanwhile, with the auxiliary heat absorption of the metal isolation grating 51, the heat emitted laterally by the laser chip 21 is further absorbed and conducted, so that the heat dissipation path of the side wall of the laser chip 21 and the main heat dissipation path through the ceramic sub-plate 52 form a parallel synergistic heat conduction structure, which further reduces the overall operating temperature of the laser chip 21.

[0088] In this embodiment, in order to improve heat dissipation efficiency, a heat-conducting hole is provided through the flexible substrate 41, and a metal heat-conducting pillar is filled in the heat-conducting hole. The two ends of the heat-conducting pillar are respectively connected to the corresponding ceramic sub-plate 52 and the heat spreader 53, so that the heat on one side of the ceramic sub-plate 52 can be quickly conducted to the heat spreader 53 on the other side of the flexible substrate 41 through the metal heat-conducting pillar.

[0089] It should be noted that the smart wearable knee pain treatment device of this application can be derived into different models according to different treatment needs and applicable groups. The main difference lies in the number of treatment areas 13, laser chips 21 and temperature sensing chips 31.

[0090] The implementation principle of this application embodiment is as follows: When the treatment begins, the patient fixes the wearable carrier 1 to the knee joint in a way that fits the curved surface of the knee joint, and adjusts it to a state of close contact with the skin through the elastic strap 11 and the adjustment buckle 12. Then, the patient turns on the device through the interactive screen 423 and selects the corresponding treatment mode as needed.

[0091] Within the first 60 seconds after the start of treatment, the control chip 422 enters the temperature baseline establishment phase. For the first 30 seconds, it waits in a static and stable state to allow the wearable carrier 1 to reach thermal equilibrium with the skin contact temperature. For the next 30 seconds, it collects the temperature sensing chip 31 readings in each treatment area 13 at a frequency of 10Hz and takes the average value as the individual temperature baseline value of each treatment area 13. At the same time, it calculates the standard deviation as a reference for the fluctuation threshold for subsequent judgment.

[0092] Subsequently, the control chip 422 enters the treatment detection cycle, continuously collecting the real-time temperature of the temperature sensing chip 31 in each treatment area 13 at a frequency of 1Hz and calculating its deviation from the baseline.

[0093] When the temperature deviation of a certain treatment area 13 exceeds the set threshold corresponding to the selected treatment mode, the control chip 422 determines that the area directly opposite the treatment area 13 is the painful lesion area, and the control chip 422 drives the corresponding laser chip 21 to work to achieve anti-inflammatory and analgesic effects.

[0094] Example 2: A smart wearable knee pain treatment device, referring to... Figure 5 The difference between this embodiment and embodiment 1 is that: within the same treatment area 13, there are at least two laser chips 21, and the wavelengths of the lasers emitted by the two laser chips 21 are different.

[0095] In this embodiment, two laser chips 21 within the same treatment area 13 are used as an example. Within the same treatment area 13, the two laser chips 21 emit lasers with wavelengths of 980nm and 808nm, respectively. With this design, the penetration depth of the 980nm wavelength laser is approximately 2mm to 4mm, while the penetration depth of the 808nm wavelength laser is approximately 5mm to 8mm, resulting in a difference in the depth of action between the two wavelengths.

[0096] Based on this, during the treatment process, the control chip 422 selects the corresponding wavelength laser chip 21 for targeted irradiation according to the depth difference of the patient's painful lesion, or drives two laser chips 21 to work synchronously to achieve treatment at different depths.

[0097] In this embodiment, the control chip 422 performs depth classification based on the value of the pain index in the treatment area 13. When the pain index is between the set threshold and the first preset value, the control chip 422 determines that the corresponding location of the treatment area 13 is a superficial lesion and drives only the laser chip 21 with a laser wavelength of 980nm in the treatment area 13 to work. When the pain index exceeds the first preset value, the control chip 422 determines that the corresponding location of the treatment area 13 is a deep lesion and drives both laser chips 21 to work synchronously.

[0098] The method for calculating the pain index is as follows: .

[0099] in, This indicates the deviation between the temperature measured in the corresponding treatment area 13 during the treatment detection cycle and the temperature baseline.

[0100] Regarding the selection of the aforementioned threshold and the first preset value, the following calibration method is adopted in this embodiment: The threshold value is set to a range of 0.8℃ to 1.2℃ for preliminary screening of treatment areas 13 with abnormally high temperatures. The threshold is set to 1.0℃ by default at the factory. Patients can fine-tune it within the above range according to their own pain sensitivity through the interactive screen 423.

[0101] The first preset value is set to 1.8 to 2.2 times the set threshold. In this embodiment, it is set to 2.0 times the set threshold by default. That is, when the set threshold is 1.0℃, the first preset value is 2.0℃.

[0102] The first preset value is used to distinguish between superficial and deep lesions: when the pain index is between the set threshold and the first preset value, it indicates that the painful lesion is mainly located in superficial tissues such as the infrapatellar fat pad, which can be effectively covered by 980nm laser irradiation; when the pain index exceeds the first preset value, it indicates that the painful lesion has affected deep tissues such as the synovium and cartilage of the joint. At this time, it is necessary to drive the laser chip 21 with two wavelengths of 980nm and 808nm simultaneously to perform synergistic irradiation of superficial and deep lesions to ensure sufficient coverage of the treatment depth.

[0103] However, it should be noted that the above threshold settings are not absolute, and their calibration needs to be determined based on clinical data. This embodiment only uses this example to illustrate the design method and working principle of the treatment device of this application.

[0104] The implementation principle of this application embodiment is as follows: the patient wears the wearable carrier 1 on the knee joint and turns it on through the interactive screen 423, and the control chip 422 enters the temperature baseline establishment stage.

[0105] After the temperature baseline is established, the treatment monitoring cycle begins, and the temperature deviation of each treatment area 13 is calculated in real time. When the temperature deviation exceeds the set threshold, it is marked as a painful lesion area.

[0106] The control chip 422 further performs depth grading based on the pain index corresponding to the treatment area 13: When the lesion is determined to be superficial, only the laser chip 21 with a laser wavelength of 980nm within the treatment area 13 is activated. When a deep lesion is identified, the two laser chips 21 in the corresponding treatment area 13 are driven to work simultaneously.

[0107] Example 3: A smart wearable knee pain treatment device, referring to... Figure 6 The difference between this embodiment and Embodiment 1 is that it also includes a pressure-sensitive component 6, which comprises a plurality of pressure-sensitive chips 61. These pressure-sensitive chips 61 are embedded inside the wearable carrier 1 and fixed on a flexible substrate 41. Each pressure-sensitive chip 61 corresponds to a laser chip 21, and the pressure-sensitive chips 61 and their corresponding laser chips 21 are arranged adjacent to each other but spaced apart. The pressure-sensitive chips 61 are flexible digital piezoresistive sensors.

[0108] In this embodiment, the pressure-sensitive chip 61, the temperature-sensitive chip 31, and the laser chip 21 are also configured in a one-to-one correspondence with the treatment area 13, that is, each treatment area 13 is simultaneously provided with a temperature-sensitive chip 31, a pressure-sensitive chip 61, and a laser chip 21.

[0109] In this embodiment, the pressure-sensitive chip 61 is connected in parallel to the control chip 422 via a data acquisition bus pre-etched on the flexible substrate 41. Each pressure-sensitive chip 61 is sequentially addressed and read by the control chip 422 according to a preset address, thereby realizing the partitioned acquisition and centralized processing of pressure data from all pressure-sensitive chips 61.

[0110] With this design, when wearing the therapeutic device, the skin-contacting surface of the pressure-sensitive chip 61 faces the inside of the wearable carrier 1 and touches the skin. At this time, each pressure-sensitive chip 61 can detect the pressure on the knee joint at the position directly opposite the corresponding treatment area 13. Thus, with the cooperation of all the pressure-sensitive chips 61, the pressure distribution of the entire knee joint can be obtained.

[0111] Based on this, since the knee joint pain lesion area is often accompanied by tissue swelling, exudation and tenderness, in addition to the temperature rise caused by local inflammation, the above-mentioned characteristics will cause the contact pressure between the area and the wearable carrier 1 to change abnormally relative to the surrounding normal tissue. Therefore, when the pressure at the position corresponding to each treatment area 13 is abnormal relative to its own normal state, it also indicates that there is a pain lesion in the knee joint area directly opposite the treatment area 13.

[0112] Therefore, the pressure-sensitive chip 61 can assist in sensing and locating the location of painful lesions from the perspective of pressure, making up for the possible omissions and misjudgments that may occur when relying solely on temperature as a single indicator, due to interference from non-lesion factors such as blood vessel distribution and ambient temperature fluctuations.

[0113] In addition, the pressure-sensitive chip 61 can monitor the tightness of the fit between the wearable carrier 1 and the skin in each treatment area 13 in real time. When the pressure reading of a certain treatment area 13 is significantly lower than the normal wearing range, it indicates that the wearable carrier 1 in that treatment area 13 has peeled off, thus providing the control component 4 with a data basis for fit monitoring and safety interlock.

[0114] Based on dual-modal sensing of temperature and pressure, the control chip 422 in this embodiment is equipped with the following multimodal fusion recognition logic: During the temperature baseline establishment phase, the control chip 422 simultaneously establishes the pressure baseline for each treatment zone 13. Subsequently, during the treatment monitoring cycle, the control chip 422 calculates the temperature deviation of each treatment zone 13 in real time. Pressure deviation , and according to Calculate the pain index of each treatment area 13.

[0115] in, This indicates the deviation between the temperature measured in the corresponding treatment area 13 during the treatment detection cycle and the temperature baseline; This represents the standard deviation between the temperature measured in the corresponding treatment area 13 during the temperature baseline establishment phase and the temperature baseline, reflecting temperature fluctuations under normal conditions.

[0116] This indicates the deviation between the pressure measured in the corresponding treatment area 13 during the treatment monitoring cycle and the pressure baseline; This represents the standard deviation between the pressure measured in the corresponding treatment area 13 during the pressure baseline establishment phase and the pressure baseline, reflecting pressure fluctuations under normal conditions.

[0117] 0.6 and 0.4 represent weighting coefficients.

[0118] The control chip 422 marks treatment areas 13 with pain indices exceeding a set threshold as candidate pain points. Then, through morphological dilation operations, adjacent candidate pain points are merged to form a pain connectivity region. Several laser chips 21 corresponding to the pain connectivity region are then driven, enabling them to treat the pain connectivity region. In the above three-modal fusion scheme, the set threshold ranges from 2.0 to 4.0 (dimensionless), with a factory default value of 3.0. This threshold is calibrated as follows: the lower limit is the mean pain index of clinically confirmed pain patients after baseline establishment minus one standard deviation; the upper limit is the mean pain index of healthy subjects under the same conditions plus two standard deviations; and the median value is used as the default set threshold.

[0119] The selection of the above weighting coefficients is based on the fact that temperature deviation is relatively more sensitive to indicative of inflammatory pain, while pressure deviation is relatively more sensitive to indicative of mechanical tenderness and swelling. The two are weighted and fused in a 6:4 ratio to take into account the identification needs of different types of pain lesions.

[0120] In other embodiments, the aforementioned weighting coefficients and pain index thresholds can be adapted and adjusted based on clinical feedback from different patient groups.

[0121] Under this dual-modal fusion recognition, when the temperature index is disturbed by fluctuations in ambient temperature, the pressure index can provide a second criterion independent of temperature for cross-validation, thereby reducing the misjudgment rate caused by fluctuations in a single physical quantity and improving the accuracy and robustness of pain lesion area identification.

[0122] It should be noted that, in this embodiment, the control chip 422 is also pre-loaded with a pre-trained lightweight machine learning model, such as a support vector machine model or a lightweight convolutional neural network model.

[0123] The machine learning model takes the temporal feature vectors of the temperature-sensing chip 31 and pressure-sensing chip 61 in each treatment area 13 within a sliding time window as input, and outputs the pain probability value of each treatment area 13 after inference calculation.

[0124] The control chip 422 cross-validates the pain probability value output by the machine learning model with the pain index calculated by the weighted fusion above. Only when a certain treatment area 13 is determined to be a pain lesion area by both the weighted fusion judgment and the machine learning model, will the control chip 422 finally confirm that the treatment area 13 is a pain lesion area and execute targeted driving, thus forming a dual confirmation mechanism that combines rule judgment and intelligent judgment.

[0125] This design further reduces the misjudgment rate of a single judgment method, thereby improving the accuracy of identifying painful lesion areas.

[0126] In this embodiment, the machine learning model is trained offline using temperature-pressure datasets of patients with knee pain collected clinically before leaving the factory. The trained model parameters are stored in the control chip 422, and the inference process is completed in real time on the control chip 422.

[0127] The implementation principle of this application embodiment is as follows: The patient fixes the wearable carrier 1 to the knee joint in a manner that conforms to the curved surface of the knee joint. After powering on via the interactive screen 423, the control chip 422 enters the temperature baseline establishment stage and simultaneously performs the pressure baseline establishment stage. In this stage, the patient waits statically for the first 30 seconds to allow the contact temperature to reach thermal equilibrium. In the following 30 seconds, the temperature and pressure readings of each treatment area 13 are synchronously collected at a frequency of 10Hz, and the average values ​​are used to establish the temperature baseline and pressure baseline. At the same time, the temperature standard deviation and the pressure standard deviation are calculated.

[0128] Afterwards, the treatment and testing cycle begins, where real-time temperature and pressure data of each treatment area 13 are continuously collected at a frequency of 1Hz. The corresponding temperature deviation and pressure deviation values ​​are then calculated, and the pain index is calculated by weighted fusion according to preset weights to determine the corresponding pain lesion area.

[0129] Finally, the control chip 422 drives the corresponding laser chip 21 to work, thereby achieving the corresponding treatment.

[0130] Example 4: A smart wearable knee pain treatment device, referring to... Figure 7 The difference between this embodiment and embodiment 1 is that an electromyography (EMG) sensing component 7 is also provided. The EMG sensing component 7 includes a plurality of EMG electrode pads 71, which are embedded inside the wearable carrier 1. All EMG electrode pads 71 ​​are electrically connected to the control chip 422.

[0131] The electromyographic electrode pads 71 ​​are distributed on the inner side of the wearable carrier 1 at positions corresponding to the muscles around the knee joint. There are at least two electromyographic electrode pads 71 ​​to form a differential detection circuit.

[0132] In this embodiment, four electromyographic electrode pads 71 ​​are provided, which are respectively attached to the inner side of the wearable carrier 1 at the positions corresponding to the medial head of the quadriceps femoris, the lateral head of the quadriceps femoris, the medial side of the popliteal fossa, and the lateral side of the popliteal fossa.

[0133] The first differential detection circuit consists of two electrodes on the medial head and lateral head of the quadriceps femoris, and the second differential detection circuit consists of two electrodes on the medial and lateral sides of the popliteal fossa.

[0134] The electromyography electrode pad 71 uses silver or silver chloride dry electrodes, and the surface of the electromyography electrode pad 71 is coated with a conductive hydrogel coating to reduce the contact resistance between the skin and the electromyography electrode pad 71.

[0135] The differential signals from each electromyography electrode 71 are amplified differentially, bandpass filtered, and converted from analog to digital by the analog front-end chip integrated on the flexible substrate 41 before being connected to the control chip 422.

[0136] Based on the setup of the electromyography sensing component 7, the electromyography electrode 71 can collect surface electromyography signals of the muscles around the knee joint. The electromyography signals reflect the real-time contraction activity and muscle tension level of the muscles around the patient's knee joint.

[0137] When pain occurs, the patient's pain-protective muscle spasms cause characteristic changes in the frequency and amplitude of electromyographic signals in the corresponding area.

[0138] Therefore, the control chip 422 introduces electromyography (EMG) signals as a second modal criterion in addition to temperature indicators into the fusion recognition calculation of the pain lesion area. This enables cross-validation of pain from two independent physical dimensions, temperature and EMG, further reducing the misjudgment rate caused by fluctuations in a single indicator.

[0139] Based on dual-modal sensing of temperature and electromyography, the control chip 422 in this embodiment is equipped with the following multimodal fusion recognition logic: During the temperature baseline establishment phase, the control chip 422 simultaneously establishes the electromyographic baselines corresponding to each treatment area 13. Subsequently, during the treatment monitoring cycle, the control chip 422 calculates the temperature deviation of each treatment area 13 in real time. and the deviation of the root mean square amplitude (RMS) of the electromyographic signal , and according to Calculate the pain index of each treatment area 13.

[0140] in, This indicates the deviation between the temperature measured in the corresponding treatment area 13 during the treatment detection cycle and the temperature baseline; This represents the standard deviation between the temperature measured in the corresponding treatment area 13 during the temperature baseline establishment phase and the temperature baseline, reflecting temperature fluctuations under normal conditions.

[0141] This indicates the deviation between the RMS measured in the corresponding treatment area 13 during the treatment monitoring cycle and the RMS baseline. This represents the standard deviation between the RMS measured in the corresponding treatment area 13 during the electromyography baseline establishment phase and the RMS baseline, i.e., the RMS fluctuation under normal conditions.

[0142] 0.7 and 0.3 are weighting coefficients.

[0143] The control chip 422 marks treatment areas 13 with pain indices exceeding a set threshold as candidate pain points. Then, through morphological dilation operations, adjacent candidate pain points are merged to form a pain connectivity region. Several laser chips 21 corresponding to the pain connectivity region are then driven, enabling them to treat the pain connectivity region. In the above dual-modal fusion scheme, the set threshold ranges from 2.0 to 4.0 (dimensionless), with a factory default value of 3.0. This threshold is calibrated as follows: the lower limit is the mean pain index of clinically confirmed pain patients after baseline establishment minus one standard deviation; the upper limit is the mean pain index of healthy subjects under the same conditions plus two standard deviations; and the median value is used as the default set threshold.

[0144] The selection of the above weighting coefficients is based on the fact that temperature deviation has a relatively higher sensitivity to the inflammatory manifestations of painful lesions, while electromyography (EMG) features have a relatively high sensitivity to the protective muscle spasms accompanying pain but are easily affected by motion artifacts. The two are weighted and fused in a 7:3 ratio, which can prioritize the accuracy of inflammation identification while taking into account the auxiliary criteria of EMG spasm features. In other embodiments, the above weighting coefficients and judgment thresholds can be adapted and adjusted according to the clinical feedback of different patient groups.

[0145] It should be noted that the control chip 422 in this embodiment is also pre-trained with a two-modal input machine learning model. This model uses the time-series vectors of temperature and electromyography features as input for reasoning and judgment, and cross-validates with the weighted fusion calculation results mentioned above. Only when the two judgments are consistent is it marked as a candidate pain point, thus forming a dual confirmation mechanism that combines rule-based judgment and intelligent judgment.

[0146] The implementation principle of this application embodiment is as follows: The patient fixes the wearable carrier 1 to the knee joint in a manner that conforms to the curved surface of the knee joint. After powering on via the interactive screen 423, the control chip 422 enters the temperature baseline establishment stage, and simultaneously performs the RMS baseline establishment stage. In this stage, the patient waits statically for the first 30 seconds to allow the contact temperature to reach thermal equilibrium, and then simultaneously collects the temperature and electromyographic signals of each treatment area 13 at a frequency of 10Hz for the next 30 seconds to establish the temperature baseline and RMS baseline; at the same time, the temperature standard deviation and RMS standard deviation are calculated.

[0147] Afterwards, the treatment and testing cycle begins, where temperature and electromyographic signal data of each treatment area 13 are continuously collected at a frequency of 1Hz. The corresponding temperature deviation value and RMS deviation value are then calculated, and the pain index is calculated by weighted fusion according to preset weights to determine the corresponding pain lesion area.

[0148] Finally, the control chip 422 drives the corresponding laser chip 21 to work, thereby achieving the corresponding treatment.

[0149] Example 5: A smart wearable knee pain treatment device. The difference between this example and Example 1 is that the wearable carrier 1 is simultaneously equipped with the temperature sensing component 3, the pressure sensing component 6, and the electromyography sensing component 7 described in Examples 1-4.

[0150] The temperature sensing component 3, the pressure sensing component 6, and the electromyography sensing component 7 work together to form a three-modal fusion recognition scheme of temperature, pressure, and electromyography.

[0151] Based on trimodal sensing of temperature, pressure, and electromyography, the control chip 422 in this embodiment is equipped with the following multimodal fusion recognition logic: During the temperature baseline establishment phase, the control chip 422 simultaneously establishes the pressure baseline and electromyographic baseline corresponding to each treatment zone 13. Subsequently, during the treatment monitoring cycle, the control chip 422 calculates the temperature deviation of each treatment zone 13 in real time. Pressure deviation and electromyography RMS deviation , and according to Calculate the pain index of each treatment area 13.

[0152] in, This indicates the deviation between the temperature measured in the corresponding treatment area 13 during the treatment detection cycle and the temperature baseline; This represents the standard deviation between the temperature measured in the corresponding treatment area 13 during the temperature baseline establishment phase and the temperature baseline, reflecting temperature fluctuations under normal conditions.

[0153] This indicates the deviation between the pressure measured in the corresponding treatment area 13 during the treatment monitoring cycle and the pressure baseline; This represents the standard deviation between the pressure measured in the corresponding treatment area 13 during the pressure baseline establishment phase and the pressure baseline, reflecting pressure fluctuations under normal conditions.

[0154] This indicates the deviation between the RMS measured in the corresponding treatment area 13 during the treatment monitoring cycle and the RMS baseline. This represents the standard deviation between the RMS measured in the corresponding treatment area 13 during the electromyography baseline establishment phase and the RMS baseline, i.e., the RMS fluctuation under normal conditions.

[0155] 0.5, 0.3 and 0.2 are weighting coefficients.

[0156] The control chip 422 marks treatment areas 13 with pain indices exceeding a set threshold as candidate pain points. Then, through morphological dilation operations, adjacent candidate pain points are merged to form a pain connectivity region. Several laser chips 21 corresponding to the pain connectivity region are then driven, enabling them to treat the pain connectivity region. In the above dual-modal fusion scheme, the set threshold ranges from 2.0 to 4.0 (dimensionless), with a factory default value of 3.0. This threshold is calibrated as follows: the lower limit is the mean pain index of clinically confirmed pain patients after baseline establishment minus one standard deviation; the upper limit is the mean pain index of healthy subjects under the same conditions plus two standard deviations; and the median value is used as the default set threshold.

[0157] The selection of the above weighting coefficients is based on the following: temperature deviation has the highest sensitivity for indicative of inflammatory pain, pressure deviation has the second highest sensitivity for indicative of mechanical tenderness and tissue swelling, while electromyographic characteristics have an auxiliary indicative role for protective muscle spasms accompanying pain but are easily interfered with by motion artifacts. The three are weighted and fused in a weight ratio of 5:3:2, which can prioritize ensuring the accuracy of inflammation identification while taking into account the auxiliary criteria of mechanical tenderness and muscle spasms. In other embodiments, the aforementioned weighting coefficients and pain index thresholds can be adapted and adjusted based on clinical feedback from different patient groups.

[0158] The implementation principle of this application embodiment is as follows: Under such trimodal fusion recognition, temperature, pressure and electromyography, three independent physical quantities, cross-validate each other. When one of the indicators is interfered with by non-lesion factors such as ambient temperature fluctuations, loosening of the garment or motion artifacts, the other indicators can still provide independent criteria for correction. Thus, under the synergy of the three modes, the misjudgment rate caused by fluctuations in single or dual-modal physical quantities is further reduced, and the accuracy and robustness of the identification of painful lesion areas are further improved.

[0159] The embodiments described in this specific implementation are preferred embodiments of this application and are not intended to limit the scope of protection of this application. Identical components are represented by the same reference numerals. Therefore, all equivalent changes made to the structure, shape, and principle of this application should be covered within the scope of protection of this application.

Claims

1. A smart wearable knee pain treatment device, characterized in that, include: Wearable carrier (1) is used to wear on the knee joint; several treatment areas (13) are distributed on the inner side of the wearable carrier (1); The laser component (2) includes a plurality of laser chips (21), which are disposed inside the wearable carrier (1) and are present in each treatment area (13). The temperature sensing component (3) includes a plurality of temperature sensing chips (31), the temperature sensing chips (31) are disposed inside the wearable carrier (1), and the temperature sensing chip (31) is present in each treatment area (13). A control component (4) is disposed on the wearable carrier (1), and the laser chip (21) and the temperature sensing chip (31) are electrically connected to the control component (4). The control component (4) is used to collect the detection data of the temperature sensing chip (31) and control the laser chip (21) in the same treatment area (13).

2. The intelligent wearable knee pain treatment device according to claim 1, characterized in that, It also includes a pressure-sensitive component (6), which includes a plurality of pressure-sensitive chips (61), which are disposed inside the wearable carrier (1), and each of the treatment areas (13) contains a pressure-sensitive chip (61). The pressure-sensitive chip (61) is electrically connected to the control component (4), and the control component (4) is also used to collect the detection data of the pressure-sensitive chip (61).

3. The intelligent wearable knee pain treatment device according to claim 1, characterized in that, It also includes an electromyography (EMG) sensing component (7), which includes a plurality of EMG electrode pads (71) embedded inside the wearable carrier (1); The electromyographic electrode pads (71) are electrically connected to the control component (4), and the control component (4) is also used to collect detection data from all the electromyographic electrode pads (71).

4. The intelligent wearable knee pain treatment device according to claim 1, characterized in that, There are at least two laser chips (21) in the same treatment area (13), and the wavelengths of the lasers output by each laser chip (21) in the same treatment area (13) are different from each other.

5. The intelligent wearable knee pain treatment device according to claim 1, characterized in that, The laser component (2) further includes a microlens (22), which is configured in a one-to-one correspondence with the laser chip (21), and the microlens (22) is fixed on the light-emitting side of the laser chip (21).

6. The intelligent wearable knee pain treatment device according to claim 1, characterized in that, The control component (4) includes a flexible substrate (41), a controller (42) and a power supply (43). The flexible substrate (41) is disposed inside the wearable carrier (1), and a plurality of laser chips (21) and a plurality of temperature sensing chips (31) are disposed on the flexible substrate (41). The controller (42) includes a housing (421) and a control chip (422). The control chip (422) and the power supply (43) are both located inside the housing (421). The housing (421) is fixed to the outside of the wearable carrier (1). The flexible substrate (41) is electrically connected to the control chip (422).

7. The intelligent wearable knee pain treatment device according to claim 6, characterized in that, The control component (4) further includes a wireless communication module (44), which is located inside the housing (421) and is communicatively connected to the control chip (422).

8. The intelligent wearable knee pain treatment device according to claim 6, characterized in that, An interactive screen (423) is provided on the outside of the outer shell (421), and the interactive screen (423) is electrically connected to the control chip (422).

9. The intelligent wearable knee pain treatment device according to claim 6, characterized in that, The wearable carrier (1) is also provided with a heat dissipation component (5), which includes several ceramic sub-plates (52), several heat dissipation plates (53) and several heat dissipation columns (54). The ceramic sub-plate (52) corresponds one-to-one with the laser chip (21). The ceramic sub-plate (52) is fixed on the flexible substrate (41), and the laser chip (21) is bonded to the side of the ceramic sub-plate (52) that is away from the flexible substrate (41). The temperature equalizer (53) corresponds one-to-one with the ceramic sub-plate (52), and the temperature equalizer (53) is attached to the side of the flexible substrate (41) away from the ceramic sub-plate (52). The heat dissipation column (54) corresponds one-to-one with the heat spreader (53). One end of the heat dissipation column (54) is connected to the corresponding heat spreader (53), and the other end extends to the outside of the wearable carrier (1).

10. The intelligent wearable knee pain treatment device according to claim 9, characterized in that, The heat dissipation component (5) also includes a metal isolation grating (51), which is fixed on the flexible substrate (41). A plurality of isolation grid holes (511) are formed on the metal isolation grating (51), and each of the temperature sensing chips (31) and each of the laser chips (21) are located in different isolation grid holes (511).

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