A multifunctional full-automatic high-speed test system

Abstract

The application provides a multifunctional full-automatic high-speed test system, comprising: a feeding and discharging buffer device, a compatible carrier device, a turret turnover device, a test quick-change device, a hard material belt splicing device, a soft material belt splicing device, a sealing detection device, a tensile force detection device, a track quick-change device and a tray labeling device. The feeding and discharging buffer device, the compatible carrier device, the hard material belt splicing device, the soft material belt splicing device, the turret turnover device, the test quick-change device, the sealing detection device, the tensile force detection device, the track quick-change device and the tray labeling device are integrated into a complete test system, and the devices are sequentially connected to form a pipeline layout, so that full-process automatic closed-loop production from material feeding by a crane, wafer taking, placing and transferring, appearance detection, material belt splicing, sealing detection, tensile force testing to finished product tray labeling and discharging is realized, manual intervention is reduced, and production efficiency and product consistency are improved.

Description

Technical Field

[0001] This invention relates to the field of semiconductor packaging and testing technology, and more specifically to a multifunctional, fully automated, high-speed testing system. Background Technology

[0002] Semiconductor packaging and testing refers to the back-end process where chips diced from wafers undergo performance testing, appearance inspection, laser marking, and encapsulation in carrier tapes. This production process typically encompasses multiple stages, including wafer loading, chip handling and transfer, electrical testing, appearance inspection, carrier tape taping, and sealing. It is a crucial step in ensuring chip shipment quality. With the rapid development of the semiconductor industry, chip sizes are continuously shrinking and integration levels are constantly increasing, placing increasingly higher demands on the efficiency, accuracy, and automation levels of packaging and testing equipment.

[0003] In the aforementioned semiconductor packaging and testing back-end processes, after wafer expansion, chips need to be removed from the wafer one by one for sequential electrical testing and appearance inspection. Qualified chips are laser-marked, placed into carrier tape, and then heat-sealed with a cover tape to form the finished tape, which is finally wound into a tray for shipment. High-speed chip handling and transfer is the core of the entire production line, and its efficiency directly impacts the overall production capacity. Currently, some equipment uses a turret structure to achieve high-speed chip handling and transfer, delivering chips sequentially to each testing unit via a rotating turret, thus improving production speed to some extent. However, existing turret structures only handle chip handling and transfer, making it difficult to simultaneously complete necessary processes such as appearance inspection during the transfer process. This necessitates separate workstations for inspection or reliance on offline sampling, affecting the overall line cycle time and the timeliness of yield control. Furthermore, the tensile testing after tape sealing, a crucial method for verifying sealing quality, is still predominantly done manually via offline sampling. This is not only time-consuming and labor-intensive but also cannot achieve full online inspection; failure to detect sealing defects in a timely manner can result in batches of scrap. Meanwhile, splicing of carrier tapes, cover tapes and other material tapes still relies on manual operation. The replacement and adjustment of test units and conveyor tracks require complete disassembly and reassembly, which is time-consuming and difficult to guarantee positioning accuracy. The two material forms of wafers and slabs cannot be operated in a compatible manner on the same platform, resulting in poor equipment versatility. The conversion and labeling of finished product trays have also failed to form an automatic connection with the upstream process, and the continuity and automation level of the overall production line are still insufficient.

[0004] To address the aforementioned issues, current technology lacks an automated testing system that integrates the entire process, making it difficult to meet the semiconductor packaging and testing industry's urgent needs for high efficiency, high yield, high compatibility, and full automation. Therefore, it is necessary to propose further solutions to these problems. Summary of the Invention

[0005] The present invention aims to provide a multifunctional, fully automated, high-speed testing system to overcome the shortcomings of existing technologies.

[0006] The objective of this application is achieved through the following technical solution: A multifunctional, fully automated, high-speed testing system, comprising: The loading and unloading buffer device is used to receive externally conveyed materials and perform buffering and loading / unloading. A compatible platform device for accommodating and positioning different types of materials; A turret transfer device is used to pick up chips and transfer them from a compatible platform to the next workstation; A quick-change test unit is used to enable rapid replacement of test units; Rigid strip splicing device, used for automatic splicing of rigid strips; A flexible material strip splicing device is used for the automatic splicing of flexible material strips; The sealing inspection device is used to seal the taped products and to inspect them before and after sealing. Tensile testing device, used to test the tensile strength of the sealed tape; The track quick-change device is used to enable the rapid replacement of the material belt conveyor track; The tray labeling device is used for the automatic transfer and labeling of finished product trays; The loading and unloading buffer device, compatible platform device, turret turnover device, testing quick-change device, hard material strip splicing device, soft material strip splicing device, sealing detection device, tensile testing device, track quick-change device and material tray labeling device are arranged sequentially along the material conveying direction or according to the workstation sequence, and at least some of the devices are used for material turnover with the overhead crane and / or AGV.

[0007] As an improvement to the multifunctional fully automatic high-speed testing system of the present invention, the loading and unloading buffer device includes: The overhead crane docking module is used to communicate and interact with the overhead crane and receive wafers, carrier tapes, cover tapes and reels transported by the overhead crane. The cache module is used to temporarily store materials from the overhead crane docking module and supply materials as needed; The loading and unloading execution module is used to transfer materials in the buffer module to the compatible platform device, and to convey the carrier belt and cover belt to the rigid material belt splicing device and the soft material belt splicing device, respectively.

[0008] As an improvement to the multifunctional fully automatic high-speed testing system of the present invention, the crane docking module of the loading and unloading buffer device maintains real-time communication with the external crane and controls the action sequence of the buffer module and the loading and unloading execution module according to the material information and status signals sent by the crane.

[0009] As an improvement to the multifunctional fully automatic high-speed testing system of the present invention, the compatible stage device includes a wafer positioning module or a square plate positioning module. The wafer positioning module is used to adapt to the loading and positioning of wafer-type materials; The square plate positioning module is used for loading and positioning square plate-type materials.

[0010] As an improvement to the multifunctional fully automatic high-speed testing system of the present invention, the turret turnover device includes: The turret module adopts a DD rotating turret, which is equipped with multiple picking heads to achieve high-speed chip picking and placing; The appearance inspection module is used to detect appearance defects in the chip during the transfer process.

[0011] As an improvement to the multifunctional fully automatic high-speed testing system of the present invention, the turret module of the turret turnover device is equipped with 48 picking heads. After the picking heads pick up the chips from the compatible platform device, they are inspected by the appearance inspection module and then transferred to the next station.

[0012] As an improvement to the multifunctional fully automatic high-speed testing system of the present invention, the quick-change testing device includes: The standardized interface module has a unified installation interface for installation by each test unit; The rapid positioning module is used to achieve rapid positioning and locking of the test unit.

[0013] As an improvement to the multifunctional fully automatic high-speed testing system of the present invention, the test quick-change device is set on the side of the turret turnover device. Each test unit is installed on the test quick-change device through a standardized interface module. When changing product types, the test unit can be quickly disassembled and installed as a whole through the quick positioning module.

[0014] As an improvement to the multifunctional fully automatic high-speed testing system of the present invention, the rigid material strip splicing device includes: The rigid material strip positioning module is used to position the rigid material strips to be spliced. The rigid material strip splicing module is used to automatically splice the positioned rigid material strips.

[0015] As an improvement to the multifunctional fully automatic high-speed testing system of the present invention, the soft material strip splicing device includes: The soft material strip positioning module is used to position the soft material strips to be spliced. The soft material strip splicing module is used to automatically splice the positioned soft material strips.

[0016] As an improvement to the multifunctional fully automatic high-speed testing system of the present invention, the sealing detection device includes: The feeding module is used to drive the tape and reel to be fed forward. The sealing module is used to attach the cover tape to the carrier tape and perform heat sealing; The inspection module is used to inspect the product before and after sealing, including inspection of the back of the product, inspection of the position of the taping groove, inspection of IR defects, and inspection of the sealing effect. The marking module is used to automatically mark products that fail the inspection.

[0017] As an improvement to the multifunctional fully automatic high-speed testing system of the present invention, the feeding module of the sealing detection device adopts a ratchet and a servo motor to drive the tape feeding stepwise; the detection module is set in the front and rear of the sealing module, and is used for product status detection before sealing and sealing effect detection after sealing, respectively.

[0018] As an improvement to the multifunctional fully automatic high-speed testing system of the present invention, the tensile testing device includes: The sealing module is used to seal the tape. The tensile testing module is used to perform online tensile testing on the sealed tape.

[0019] As an improvement to the multifunctional fully automatic high-speed testing system of the present invention, the tensile testing module of the tensile testing device performs online tensile testing on the tape output by the sealing tape module and records the test data, and reports an error when the data exceeds the threshold.

[0020] As an improvement to the multifunctional fully automatic high-speed testing system of the present invention, the track quick-change device includes: Standardized track modules are compatible with material conveying of various sizes and specifications, and are used to connect material flow between various devices; The quick-change positioning module is used to enable rapid positioning and replacement of the conveyor track.

[0021] As an improvement to the multifunctional fully automatic high-speed testing system of the present invention, the standardized track module of the track quick-change device is equipped with a guide structure for compatibility with tapes of different widths. The track module can be quickly disassembled and installed by quickly changing the positioning module to adapt to the conveying needs of different materials.

[0022] As an improvement to the multifunctional fully automatic high-speed testing system of the present invention, the tray labeling device includes: The tray conversion module is used for automatic conversion and stacking of finished product trays; The labeling module is used to automatically attach labels to finished product trays.

[0023] As an improvement to the multifunctional fully automatic high-speed testing system of the present invention, the various devices are connected in sequence to form a production line layout. The material flows sequentially through the loading and unloading buffer device, the compatible platform device, the turret turnover device, the testing quick change device, the sealing detection device, the tensile testing device, and the material tray labeling device. The rigid material strip splicing device and the soft material strip splicing device are set between the testing quick change device and the sealing detection device to provide the spliced ​​continuous material strip for the tape feeding station. The testing quick change device is set next to the turret turnover device, and the track quick change device is set between the devices of material strip flow.

[0024] As an improvement to the multifunctional fully automatic high-speed testing system of the present invention, the overhead crane is connected to the loading and unloading buffer device, the rigid material strip splicing device and the soft material strip splicing device through communication interaction. The overhead crane automatically transports materials to the loading position according to the material balance status of each device, realizing fully automatic material replenishment.

[0025] As an improvement to the multifunctional fully automatic high-speed testing system of the present invention, the loading and unloading buffer device is connected to the hard material strip splicing device and the soft material strip splicing device through independent conveying channels. The hard material strip is spliced ​​by the hard material strip splicing device and then sent into the loading and unloading buffer device, and the soft material strip is spliced ​​by the soft material strip splicing device and then sent into the loading and unloading buffer device.

[0026] Compared with the prior art, the beneficial effects of the present invention are: (1) This invention integrates a loading and unloading buffer device, a compatible platform device, a rigid material strip splicing device, a soft material strip splicing device, a turret turnover device, a test quick change device, a sealing detection device, a tensile testing device, a track quick change device, and a material tray labeling device into a complete testing system. The devices are connected in sequence to form a production line layout, realizing fully automated closed-loop production from crane material receiving, wafer picking and placing and transferring, appearance inspection, material strip splicing, sealing detection, tensile testing to finished product material tray labeling and unloading, reducing manual intervention and improving production efficiency and product consistency.

[0027] (2) The turret turnover device of the present invention adopts a DD rotating turret structure. While realizing high-speed chip picking and placement and position transfer, it integrates an appearance inspection module, which can simultaneously complete the back appearance defect detection during chip transfer. There is no need to set up a separate inspection station, which effectively shortens the production cycle and improves the overall line operation efficiency.

[0028] (3) The present invention integrates the tensile testing device into the production line, and automatically completes the tensile test of the tape sealing online after the sealing process, replacing the traditional manual offline sampling inspection method, realizing real-time monitoring and full inspection coverage of sealing quality, effectively avoiding batch waste caused by poor sealing, and improving product yield and quality control level.

[0029] (4) The present invention is equipped with a rigid material strip splicing device and a soft material strip splicing device, which respectively realize automatic splicing of rigid and soft carrier strips and cover strips. The new and old material strips are quickly connected before the material strips are used up, without manual intervention and machine stop operation, ensuring the continuous operation of the production line and effectively improving equipment utilization and production efficiency.

[0030] (5) This invention modularizes each test unit through a quick-change test device, adopting a unified standardized interface and a quick positioning structure. When changing product types, the test unit can be quickly disassembled and installed as a whole. At the same time, the track quick-change device standardizes the material conveyor track, is compatible with multiple sizes and specifications, and supports quick positioning and replacement. The combination of the two significantly shortens the changeover time, ensures the positioning accuracy after changeover, and improves the flexible production capability of the equipment.

[0031] (6) The compatible platform device of the present invention is equipped with a wafer positioning module or a square plate positioning module. The corresponding positioning module can be switched and activated according to the material type, so that the same platform can be adapted to both wafer materials and square plate materials for loading and positioning. There is no need to change the platform, which effectively improves the versatility and utilization of the equipment.

[0032] (7) All devices of the present invention establish communication interaction with the overhead crane. The overhead crane can automatically transport wafers, carrier tapes, cover tapes and reels to the loading position according to the material balance of each device, realize fully automatic material replenishment, avoid downtime due to insufficient materials, and further ensure the continuity and intelligence level of the entire production line. Attached Figure Description

[0033] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0034] Figure 1 This is a system block diagram of an embodiment of the multifunctional fully automatic high-speed testing system of the present invention; Figure 2 This is a three-dimensional schematic diagram of an embodiment of the multifunctional fully automatic high-speed testing system of the present invention; Figure 3 for Figure 2 A three-dimensional schematic diagram of a compatible platform device; Figure 4 for Figure 2 A three-dimensional schematic diagram of the combination of the transfer tower turnover device and the compatible platform device. Detailed Implementation

[0035] The technical solutions of the present invention will be clearly and completely described below with reference to the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0036] like Figure 1 As shown, this invention addresses the technical problems in existing semiconductor packaging and testing back-end processes, such as the dispersed equipment in each process leading to frequent manual intervention, the single function of the turret structure making synchronous testing impossible, the reliance on manual sampling for tensile testing, the time-consuming and labor-intensive process of material splicing and changeover adjustments, poor equipment compatibility, and insufficient automation in finished product unloading. It provides a multi-functional, fully automatic, high-speed testing system.

[0037] The overall technical concept of this invention is to integrate the entire process of wafer loading and caching, compatible stage positioning, high-speed chip turret transfer and appearance inspection, standardized quick-change of test units, automatic splicing of hard and soft strips, sealing inspection, online tensile testing, standardized quick-change of tracks, and automatic conversion and labeling of material trays into a single system. Each device is connected in sequence, and each device and the overhead crane and / or AGV carry out material turnover, thereby realizing a fully automated closed-loop production process from material arrival by the overhead crane to labeling and unloading of finished product trays.

[0038] As a specific implementation of the above-mentioned technical concept, an embodiment of the present invention provides a multifunctional fully automatic high-speed testing system.

[0039] like Figure 1 , 2 As shown, the multifunctional fully automatic high-speed testing system 100 in this embodiment includes: a loading and unloading buffer device 10, a compatible platform device 20, a turret turnover device 30, a test quick-change device 40, a rigid material strip splicing device 50, a flexible material strip splicing device 60, a sealing detection device 70, a tensile testing device 80, a track quick-change device 90, and a material tray labeling device 110. The devices are arranged sequentially along the material conveying direction, and each device communicates with the overhead crane and / or AGV 200 to achieve real-time control of the material status.

[0040] The specific structure, function, and working process of each device are described in detail below.

[0041] The loading / unloading buffer device 10 is located at the beginning of the system 100. Its function is to receive the reels with carrier tape and cover tape transported by the overhead crane 200, temporarily store the materials, and supply them to the downstream devices according to the production sequence. The loading / unloading buffer device 10 specifically includes: an overhead crane docking module 11, a buffer module 12, and a loading / unloading execution module 13.

[0042] The overhead crane docking module 11 is located above or to the side of the loading / unloading buffer device 10. It maintains real-time communication with the overhead crane 200 and is used to receive material information and status signals sent by the overhead crane 200. In one embodiment, the overhead crane docking module 11 is a communication controller located above the loading / unloading buffer device 10. It is connected to the control system of the overhead crane 200 via wired or wireless means, receives incoming material information sent by the overhead crane 200, including material type, quantity, batch number, etc., and feeds back the material balance signal of the buffer module 12 to the overhead crane 200 in real time.

[0043] The buffer module 12 is located downstream of the overhead crane docking module 11. It contains multiple independent buffer zones for temporarily storing carrier tape and cover tape reels. Each buffer zone is equipped with a material detection sensor to monitor the remaining material level in each zone in real time and feeds the level signal back to the overhead crane docking module 11. The overhead crane docking module 11 then sends a replenishment request to the overhead crane 200 to achieve automatic replenishment. In one embodiment, the buffer module 12 is a multi-layer buffer rack or a rotary buffer turntable located in the middle of the loading / unloading buffer device 10. Each buffer zone is isolated from the others, and each zone is equipped with a photoelectric sensor or proximity switch to detect whether there is material in that zone and the type of material.

[0044] The loading / unloading execution module 13 is located downstream of the buffer module 12. It employs a multi-axis robot or an XYZ three-axis linear module, with grippers or suction cups at its ends. It is used to transfer wafers from the buffer module 12 to the compatible stage device 20, and to transport the carrier tape and cover tape reels to the working position, close to the rigid material strip splicing device 50 and the flexible material strip splicing device 60. The timing of the loading / unloading execution module 13 is controlled by the overhead crane docking module 11 based on the material information and status signals sent by the overhead crane 200. In one embodiment, the loading / unloading execution module 13 is a six-axis industrial robot with pneumatic grippers and vacuum suction cups at its ends. The grippers are used to hold the reels, and the suction cups are used to pick up the wafers. According to the timing control signals from the overhead crane docking module 11, the robot sequentially places the wafers onto the compatible stage device 20 and places the carrier tape and cover tape reels at the feeding positions of the rigid material strip splicing device 50 and the flexible material strip splicing device 60, respectively. By setting up the above-mentioned loading and unloading buffer device 10, the automatic docking of materials from the overhead crane 200, temporary storage of materials, and on-demand diversion supply are realized, ensuring a smooth connection between upstream materials and production line rhythm.

[0045] like Figure 3 As shown, the compatible platform device 20 is located downstream of the loading and unloading buffer device 10. Its function is to receive wafers or slabs, accurately position and support them, so that the turret turnover device 30 can pick up the materials.

[0046] In this embodiment, the compatible stage device 20 is a novel working platform suitable for both PCBs and wafers. The compatible stage device 20 includes: a placement platform 210, a carrier placement stage 220, a support fixture 230, a film expansion plate 240, a two-dimensional drive module 250, a rotation assembly 260, a film expansion lifting assembly 270, and an ejector pin module.

[0047] The placement platform 210 has a central circular hole at its upper surface. The carrier placement stage 220 is fitted around the outer periphery of the central circular hole via bearings. The carrier placement stage 220 has a clearance notch at its center, and the outer circumference of the clearance notch is used to fix a contoured support fixture 230. The support fixture 230 has a square or circular ejection hole at its center, which allows the lower lifting mechanism to pass through for expanding the carrier film. By changing the support fixture 230 to different specifications (central circular hole or central square hole), it can accommodate different materials such as 8-inch wafers, 12-inch wafers, or slabs. The lower circumferential surface of the expanding plate 240 is provided with several sets of downward convex pressing mechanisms, which are used to press the corresponding rings of various wafers or slabs. The outer circumference of the film expansion plate 240 is provided with at least one servo lifting rod 242 and several linear guide rods 243. The power source of the servo lifting rod 242 is the film expansion lifting assembly 270, which drives the film expansion plate 240 to rise and fall. The downward protrusion pressing mechanism includes several downward protrusion pressing points adapted to 8-inch wafers, 12-inch wafers, and square boards, ensuring compatibility with wafers and square boards of different specifications. The two-dimensional drive module 250 includes a servo drive Y module 251 and a servo drive X module 252. The output end of the servo drive Y module 251 is fixed to the servo drive X module 252, and the output end of the servo drive X module 252 is connected to the bottom of the placement platform 210. The servo drive Y module 251 includes two sets of Y-axis platforms 2511 arranged in parallel, a Y-axis servo module 2512, and at least one Y-axis guide rail 2513. The servo drive X module 252 includes a base frame 2521, an X-axis servo module 2522, and at least one X-axis guide rail 2523. The rotating assembly 260 includes a servo motor 261, a transmission structure 262, a first synchronous belt 263, and a second synchronous belt 264. The outer circumference of the carrier placement stage 220 is a synchronous pulley structure. The servo motor 261 is connected to the input end of the transmission structure 262 via the first synchronous belt 263, and the output end of the transmission structure 262 is connected to the synchronous pulley of the carrier placement stage 220 via the second synchronous belt 264, thereby driving the carrier placement stage 220 to rotate. The rotating assembly 260, in conjunction with the two-dimensional drive module 250, is used to adjust the position of the chip on the carrier, ensuring reliable subsequent chip adsorption and transfer.

[0048] During operation, the carrier, along with the ring, is inserted into the gap between the expanding plate 240 and the carrier placement platform 220. Driven by the expanding lifting assembly 270, the expanding plate 240 descends and presses the ring onto the carrier placement platform 220 via the lower convex pressing mechanism. Subsequently, the lower lifting mechanism lifts the carrier upwards through the ejection hole of the support fixture 230, increasing the spacing between the chips and facilitating the subsequent pickup head of the turret turnover device 30 to pick up the chips one by one. The rotating assembly 260, in conjunction with the two-dimensional drive module 250, can drive the carrier to perform precise movements in the X, Y, and R axes in the horizontal plane, ensuring precise alignment of the chips with the pickup position. This two-dimensional drive module 250 and the rotating assembly 260 together constitute a high-precision motion platform, equipped with a mechanical absolute encoder feedback system, enabling rapid and accurate positioning with high repeatability and stable operation; the repeatability can reach ±0.01mm.

[0049] The compatible stage device 20 also includes a pin module (not shown) disposed below the placement platform 210, used to lift the chip from the carrier during material handling by the turret turnover device 30, in order to facilitate material handling. In one embodiment, the pin module includes a pin, a pin holder, and a drive cylinder. The pin is disposed above the pin holder, and the drive cylinder is disposed below the pin holder. The drive cylinder pushes the pin holder up and down, causing the pin to pass through the ejection hole of the support fixture 230 to lift the chip from the carrier. The number of pins can be one or more, and multiple pins are arranged in an array. Through the above-described compatible stage device 20, the same platform can be adapted to both wafer-type materials and board-type materials without replacing the entire stage, effectively improving the versatility and utilization of the equipment.

[0050] like Figure 4 As shown, the turret turnover device 30 is located downstream of the compatible platform device 20. Its function is to pick up chips from the compatible platform device 20 and transfer the chips to the next workstation. The turret turnover device 30 includes a turret module 31 and an appearance inspection module 32.

[0051] The turret module 31 adopts a DD rotary turret with 48 picking heads for high-speed chip picking and placing. Specifically, the turret module 31 includes a picking DD1 motor 311 and a sorting DD2 motor 312. The picking DD1 motor 311 drives the nozzle to pick up the chip from the compatible platform device 20. After picking up the chip, the DD1 motor rotates to the transfer position, where the sorting DD2 motor 312 drives the DD2 nozzle to receive the chip.

[0052] During the chip picking process, the turret turnover device 30 performs three precise positioning operations in sequence: The first step is to position the chip for picking up. Before the pick-up DD1 motor 311 drives the nozzle to pick up the chip from the compatible platform device 20, the two-dimensional drive module 250 and the rotating component 260 of the compatible platform device 20 first precisely position the carrier in the X, Y and R axis directions, so that the center of the chip to be picked up is aligned with the center of the nozzle of the pick-up DD1 motor 311. This ensures that the nozzle can accurately pick up the center position of the chip and avoid the chip falling or being misaligned during the transfer process due to misalignment.

[0053] The second step is the handover positioning. After the pick-up motor DD1 311 picks up the chip, it rotates to the handover position with the sorting motor DD2 312. The nozzles of the pick-up motor DD1 311 and the sorting motor DD2 312 are precisely aligned at the handover position to ensure that the chip can be smoothly transferred from the nozzle of the pick-up motor DD1 311 to the nozzle of the sorting motor DD2 312, avoiding chip handover failure or damage due to misalignment of the two nozzles.

[0054] The third step is material feeding and positioning. After the sorting DD2 motor 312 picks up the chip, the turret module 31 continues to rotate, transferring the chip to the target station. Before feeding, the position of the target station has been pre-calibrated. The nozzle of the sorting DD2 motor 312 precisely places the chip in the predetermined position of the target station, ensuring that the chip's position is accurate in subsequent processes.

[0055] Through the coordination of the above three positioning methods, the turret turnover device 30 achieves precise positioning throughout the entire process from material picking, handover and transfer to material unloading, effectively ensuring the positional accuracy and reliability of the chips during high-speed transfer.

[0056] The appearance inspection module 32 is located at the station where the DD1 motor is located. Specifically, it is a back-side AOI optical inspection module used to simultaneously inspect the back of the chip for appearance defects during the chip transfer process from DD1 to DD2. In one embodiment, the appearance inspection module 32 includes a high-resolution industrial camera, a ring light source, and an image processing unit. The industrial camera and ring light source are positioned above the station where the DD1 motor is located, with the camera lens facing the back of the chip. The image processing unit is connected to the camera and is used to receive the images captured by the camera and perform defect identification. Defect types include scratches, cracks, stains, and defects. After the picking head picks up the chip from the compatible platform device 20, it first passes through the appearance inspection module 32 for inspection. The inspection results are recorded and flow with the chip, and then the chip is transferred to the next station by the turret module 31. Through the above-mentioned turret turnover device 30, the appearance inspection module 32 is integrated while realizing high-speed chip picking and placement and position transfer. It can simultaneously complete the back-side appearance defect inspection during chip transfer, eliminating the need for a separate inspection station, effectively shortening the production cycle and improving the overall line operating efficiency.

[0057] It should be noted that in the system architecture of the present invention, the chip testing unit can be set downstream of the turret turnover device 30 or integrated into the subsequent work station of the turret turnover device 30 according to actual production needs. Its specific implementation is a mature existing technology, which will not be described in detail here.

[0058] The test quick-change device 40 is located on the side of the turret turnover device 30 and is arranged opposite to the turret turnover device 30. Its function is to carry each test unit and realize the quick change of the test unit.

[0059] The test quick-change device 40 includes a standardized interface module 41 and a quick-positioning module 42. The standardized interface module 41 has a unified installation interface for mounting various test units, ensuring that different test units have the same installation dimensions and positioning reference. When a test unit needs to be replaced or maintained, it can be completely removed from the standardized interface module 41. The quick-positioning module 42 is located between the standardized interface module 41 and the test unit, and can achieve quick positioning and locking of the test unit using positioning pins and holes, quick clamps, or magnetic locking. In one embodiment, the standardized interface module 41 is a uniformly sized mounting base plate with mounting holes and positioning holes, and each test unit has a matching mounting base at its bottom. The quick-positioning module 42 is a quick clamp mounted on the mounting base plate; rotating the handle of the quick clamp locks or releases the test unit. The turret turnover device 30 picks up the chip from the compatible stage device 20 and transfers it to the test unit on the test quick-change device 40 for testing. When changing product types, operators only need to loosen the quick-positioning module 42, remove the original test unit from the standardized interface module 41 as a whole, and then push or place the new test unit into place along the standardized interface module 41. The quick-positioning module 42 is then used to re-lock the unit, eliminating the need for disassembling and recalibrating each part individually. This quick-change test device 40 significantly shortens changeover time and ensures positioning accuracy after the changeover.

[0060] The rigid material strip splicing device 50 and the soft material strip splicing device 60 are located downstream of the test quick-change device 40. Both are independent splicing stations, used to automatically splice rigid material strips and soft material strips respectively, and can operate independently.

[0061] The rigid and flexible tapes are used for packaging and encapsulating the tested chips. The rigid tape serves as the carrier tape to hold the chip, while the flexible tape acts as a cover tape attached to the rigid tape. The carrier tape and cover tape, which encapsulate the chip and are then combined, are called a tape package. The tape packaged with the chip is then wound up to complete the unloading process.

[0062] The rigid strip splicing device 50 includes a rigid strip positioning module 51 and a rigid strip splicing module 52. The rigid strip positioning module 51 is equipped with a clamping mechanism and a positioning structure, used to clamp and position the end of the previous roll of rigid strip that is about to run out and the beginning of the next roll of new rigid strip to the same splicing position. The rigid strip splicing module 52 is located at this splicing position and can join the ends of the two strips together using methods such as gluing, hot pressing, or ultrasonic welding. After splicing, the clamping mechanism is released to achieve continuous feeding.

[0063] Similarly, the soft material strip splicing device 60 includes a soft material strip positioning module 61 and a soft material strip splicing module 62. Its structural principle is the same as that of the hard material strip splicing device 50, but the clamping force of the positioning module and the splicing parameters of the splicing module are adaptively adjusted to the material characteristics of the soft material strip to avoid damage. The hard material strip splicing device 50 and the soft material strip splicing device 60 are connected to the loading and unloading buffer device 10 through independent conveying channels. After splicing, the continuous material strip is fed into the buffer module 12 of the loading and unloading buffer device 10 via this conveying channel for later use. Through the above two sets of splicing devices, automatic splicing is achieved for both hard carrier strips and soft cover strips, completing the rapid connection of old and new material strips before the material strips are exhausted. No manual intervention or machine stoppage is required, ensuring continuous operation of the production line and effectively improving equipment utilization and production efficiency.

[0064] The sealing inspection device 70 is located downstream of the rigid material tape splicing device 50 and the flexible material tape splicing device 60. Its function is to seal the product after tape splicing and to inspect the sealing process before and after sealing. Specifically, it inspects the bonding between the carrier tape (rigid material tape) and the cover tape (flexible material tape).

[0065] The sealing detection device 70 includes: a feeding module 71, a sealing module 72, a detection module 73, and an identification module 74.

[0066] The feeding module 71 uses a ratchet and a servo motor to drive the tape feeding forward in a step-by-step manner, ensuring accurate positioning of the tape during transport. In one embodiment, the feeding module 71 includes a servo motor, a reducer, and a ratchet mechanism. The servo motor drives the ratchet to rotate intermittently through the reducer. The pitch of the ratchet teeth matches the hole spacing of the tape. Each rotation of the ratchet tooth pitch causes the tape to advance one station. The sealing module 72 is located in the middle of the feeding module 71 and is used to attach the cover tape to the carrier tape and perform heat sealing, sealing the chip between the carrier tape and the cover tape. In one embodiment, the sealing module 72 includes an upper heat-sealing knife and a lower support base. The upper heat-sealing knife is a heated metal block with a lower end face that matches the width of the carrier tape. The lower support base is located below the carrier tape. The upper heat-sealing knife presses down to press and heat the cover tape and carrier tape together, causing them to thermally fuse and bond. The detection module 73 includes multiple detection units, respectively located before and after the sealing module 72. The front-end detection unit is used to detect the back condition of the product, the position of the taping groove, and IR defects before sealing. The back-end detection unit is used to detect the sealing effect after sealing, confirming whether the heat seal is complete and whether there are any lifting or poor sealing phenomena. In one embodiment, the front-end detection unit includes a back-end detection camera, a taping groove position detection sensor, and an IR detector. The back-end detection camera is used to detect whether there are defects on the back of the chip, the taping groove position detection sensor is used to confirm whether the chip is accurately placed in the taping groove, and the IR detector is used to detect whether there are any defects such as cracks inside the chip. The back-end detection unit includes a sealing effect detection camera, used to detect whether the seal is complete and whether there are any lifting or poor sealing phenomena. The marking module 74 is located downstream of the back-end detection unit and is used to automatically mark products that fail the inspection, so that subsequent processes can identify and reject them.

[0067] In one embodiment, the marking module 74 can employ a dotting mechanism to mark dots on the tape surface corresponding to the defective product using ink or laser. In another embodiment, the marking module 74 can also employ a labeling mechanism to mark the defective product by attaching a label to the tape surface or carrier tape edge corresponding to the defective product. With the aforementioned sealing inspection device 70, multi-dimensional inspections are performed before and after sealing, ensuring that only qualified products enter the next process, and defective products are marked in a timely manner, effectively improving product yield.

[0068] The tensile testing device 80 is located downstream of the sealing testing device 70 and is used to perform tensile testing on the sealed tape. The tensile testing referred to here means applying a force to the cover tape bonded to the carrier tape to test the strength of the bond.

[0069] The tensile testing device 80 includes a sorting module 81 and a tensile testing module 82. The sorting module 81 performs necessary sorting operations on the tape before tensile testing to ensure the tape is in a flat state suitable for testing. In one embodiment, the sorting module 81 may include a cutting unit and a fixing unit. The cutting unit can cut a section of tape and fix it on a testing table. It should be noted that the tape tensile testing does not need to be continuous; it can be performed when the winding is completed and the material is unloaded. For example, the tail material can be cut off for testing and placed on the testing table. This will not affect the winding of the tape.

[0070] The tensile testing module 82 is arranged adjacent to the finishing module 81. It can apply a force to the cap tape using a suction cup or similar device and stretch it at a set speed and force, recording the tensile data in real time. When the measured tensile value exceeds a preset threshold, it automatically reports an error, prompting the operator to check the sealing quality. With the tensile testing device 80, the tensile testing of the tape sealing process is automatically completed online after the sealing process, replacing the traditional manual offline sampling inspection method. This achieves real-time monitoring and full inspection coverage of sealing quality, effectively avoiding batch defects caused by poor sealing.

[0071] The quick-change track device 90 is used to quickly change the track of the material conveyor belt. The quick-change track device 90 includes a standardized track module 91 and a quick-change positioning module 92. The standardized track module 91 is compatible with material conveying of various sizes and specifications, and is used to connect material flow between different devices. It is equipped with a guide structure to accommodate tapes of different widths. Accordingly, multiple standardized track modules 91 can be configured, each corresponding to a material of a certain size and specification.

[0072] A quick-change positioning module 92 is installed at the connection between the standardized track module 91 and each device frame. When a product specification needs to be changed, the operator can use the quick-change positioning module 92 to completely disassemble the standardized track module 91 and replace it with a track module adapted to the new specification. The positioning structure automatically centers and locks the module. In one embodiment, the quick-change positioning module 92 includes a positioning seat fixed to the frame and a positioning block fixed to the bottom of the track module. The positioning seat has a tapered positioning pin, and the positioning block has a tapered positioning hole that mates with the tapered positioning pin. After the track module is placed in position, it automatically centers through the tapered engagement and is then locked by a knob. Through the above-mentioned quick-change track device 90, rapid positioning and replacement of the conveyor track are achieved to adapt to the conveying needs of different materials, further improving changeover efficiency.

[0073] The tray labeling device 110 is located at the end of the system 100 and its function is to automatically label the finished product trays containing chips. The tray labeling device 110 includes a tray conversion module 111 and a labeling module 112.

[0074] The tray conversion module 111 receives a full tray from the upstream winding mechanism. The full tray is pushed to the unloading relay station, where it moves to the labeling position to await labeling. Simultaneously, the tray conversion module 111 automatically switches to the next empty tray so that the upstream winding mechanism can continue its winding operation.

[0075] The labeling module 112 includes: a label machine, a label receiving and transfer mechanism, and a labeling relay mechanism.

[0076] The label printer is located on one side of the labeling module 112 and is used to print and dispense labels. A label receiving and transferring mechanism is located between the label printer and the labeling relay mechanism. This mechanism receives the labels dispensed by the label printer and transfers them to the labeling relay mechanism. After the labeling relay mechanism picks up the label, it rotates 90 degrees and affixes the label to the full-load tray located at the labeling position, completing the labeling action. After labeling, the relay mechanism places the full-load tray into the full-load tray box, completing the automatic labeling and unloading of the finished product tray. Through the installation of the tray labeling device 110, the automatic conversion, labeling, and packing of finished product trays are achieved, forming a fully automated connection with upstream processes and ensuring the overall automation level and shipping efficiency of the production line.

[0077] In actual operation, the above-mentioned devices work together according to the following procedures: The overhead crane 200 automatically transports the reel with the carrier tape and cover tape wound onto the loading / unloading buffer device 10 according to the material balance of each device. After receiving the incoming material, the overhead crane docking module 11 of the loading / unloading buffer device 10 temporarily stores the material in the buffer module 12, and then the loading / unloading execution module 13 transports the carrier tape and cover tape to the working position respectively, which also facilitates the tape splicing operation of the rigid material tape splicing device 50 and the flexible material tape splicing device 60.

[0078] The compatible platform device 20 selects the corresponding support fixture 230 (round hole or square hole) according to the current material type. The carrier, along with the ring, is inserted into the gap between the film expansion plate 240 and the carrier placement platform 220. The film expansion plate 240 descends under the drive of the film expansion lifting assembly 270, and the ring is pressed by the lower convex pressing mechanism to fix the carrier on the carrier placement platform 220. Subsequently, the lower lifting mechanism lifts the carrier upward through the ejection hole of the support fixture 230, increasing the spacing between the chips and facilitating the subsequent pickup head of the turret turnover device 30 to pick up the chips one by one.

[0079] Before picking up the chip, the two-dimensional drive module 250 and rotating component 260 of the compatible platform device 20 precisely position the carrier in the X, Y, and R axes, aligning the center of the chip to be picked up with the center of the nozzle of the picking DD1 motor 311, i.e., picking positioning. After positioning, the picking DD1 motor 311 of the turret turnover device 30 drives the nozzle to the picking position, and the ejector pin module 295 of the compatible platform device 20 lifts the chip. The DD1 nozzle picks up the chip and rotates to the transfer position. At the transfer position, the nozzle of the picking DD1 motor 311 is precisely aligned with the nozzle of the sorting DD2 motor 312, and the chip is smoothly transferred, i.e., transfer positioning. During the transfer process, the appearance inspection module 32 performs AOI inspection on the back of the chip. After the inspection is completed, the DD2 nozzle picks up the chip. After the DD2 motor 312 picks up the chip, the turret module 31 continues to rotate, transferring the chip to the target station. The position of the target station has been pre-calibrated before unloading, and the chip is precisely placed in the predetermined position, i.e., unloading positioning. The turret module 31 continues to rotate, transferring the chip to the test unit on the test quick-change device 40 for testing.

[0080] After passing through various detection units, the chip enters the tape-making station. Upon arrival, the chip is placed into a carrier tape, and a cover tape is placed over it to form a tape. When a reel of carrier or cover tape is nearly exhausted, a rigid tape splicing device 50 or a flexible tape splicing device 60 automatically splices the end of the previous roll of tape with the beginning of the next roll, achieving continuous feeding without stopping the machine. After splicing, the tape is conveyed to the tape-making station via a transport channel to continue operation.

[0081] The carrier tape carrying the chip continues to the sealing and inspection device 70. The feeding module 71 uses a ratchet and servo motor to drive the tape feeding stepwise. Before sealing, the front inspection unit inspects the back surface of the chip, the position of the tape grooves, and IR defects. Then, the sealing module 72 heat-seals the cover tape onto the carrier tape. The rear inspection unit inspects the sealing effect to confirm the heat-sealing quality. The marking module 74 automatically marks unqualified products. After sealing and inspection, the tape enters the tensile testing device 80. After the sorting module 81 sorts the tape, the tensile testing module 82 clamps the tape and performs online tensile testing, recording the tensile data in real time. An error alert is issued if the tensile data exceeds the threshold.

[0082] After the tape passes the tensile test, it enters the labeling device 110. The full-loaded tray is pushed to the tray conversion module 111 by the winding mechanism. The relay mechanism moves the full-loaded tray to the labeling position. The labeling module 112 automatically affixes the label to the full-loaded tray. After labeling is completed, the relay mechanism places the full-loaded tray into the material box, completing the finished product shipment.

[0083] When a product type needs to be changed, operators can quickly replace the entire test unit using the quick-change test device 40, and simultaneously replace the entire conveyor track module using the quick-change track device 90, enabling the entire line to quickly switch to the production state of the new product specification. Throughout the changeover process, each device does not require individual disassembly and recalibration, significantly reducing changeover time and ensuring positioning accuracy.

[0084] Throughout the production process, the overhead crane 200 maintains real-time communication with the loading and unloading buffer device 10, the rigid material strip splicing device 50, and the flexible material strip splicing device 60 through communication interaction. It automatically transports materials to the loading position according to the material balance of each device, realizing fully automatic material replenishment, avoiding downtime due to insufficient materials, and ensuring the continuity and intelligence level of the entire production line.

[0085] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the invention can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. Therefore, the embodiments should be considered in all respects as exemplary and non-limiting, and the scope of the invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within the present invention.

[0086] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A multifunctional, fully automated, high-speed testing system, characterized in that, include: The loading and unloading buffer device is used to receive externally conveyed materials and perform buffering and loading / unloading. A compatible platform device for accommodating and positioning different types of materials; A turret transfer device is used to pick up chips and transfer them from a compatible platform to the next workstation; A quick-change test unit is used to enable rapid replacement of test units; Rigid strip splicing device, used for automatic splicing of rigid strips; A flexible material strip splicing device is used for the automatic splicing of flexible material strips; The sealing inspection device is used to seal the taped products and to inspect them before and after sealing. Tensile testing device, used to test the tensile strength of the sealed tape; The track quick-change device is used to enable the rapid replacement of the material belt conveyor track; The tray labeling device is used for the automatic transfer and labeling of finished product trays; The loading and unloading buffer device, compatible platform device, turret turnover device, testing quick-change device, hard material strip splicing device, soft material strip splicing device, sealing detection device, tensile testing device, track quick-change device and material tray labeling device are arranged sequentially along the material conveying direction or according to the workstation sequence, and at least some of the devices are used for material turnover with the overhead crane and / or AGV.

2. The multifunctional fully automatic high-speed testing system according to claim 1, characterized in that, The loading and unloading buffer device includes: The overhead crane docking module is used to communicate and interact with the overhead crane and receive wafers, carrier tapes, cover tapes and reels transported by the overhead crane. The cache module is used to temporarily store materials from the overhead crane docking module and supply materials as needed; The loading and unloading execution module is used to transfer materials in the buffer module to the compatible platform device, and to convey the carrier belt and cover belt to the rigid material belt splicing device and the soft material belt splicing device, respectively.

3. The multifunctional fully automatic high-speed testing system according to claim 2, characterized in that, The overhead crane docking module of the loading and unloading buffer device maintains real-time communication with the external overhead crane and controls the timing of the actions of the buffer module and the loading and unloading execution module according to the material information and status signals sent by the overhead crane.

4. The multifunctional fully automatic high-speed testing system according to claim 1, characterized in that, The compatible stage device includes a wafer positioning module or a square plate positioning module. The wafer positioning module is used to adapt to the loading and positioning of wafer-type materials; The square plate positioning module is used for loading and positioning square plate-type materials.

5. The multifunctional fully automatic high-speed testing system according to claim 1, characterized in that, The turret turnover device includes: The turret module adopts a DD rotating turret, which is equipped with multiple picking heads to achieve high-speed chip picking and placing; The appearance inspection module is used to detect appearance defects in the chip during the transfer process.

6. The multifunctional fully automatic high-speed testing system according to claim 5, characterized in that, The turret module of the turret turnover device is equipped with 48 picking heads. After the picking heads pick up the chips from the compatible platform device, they are inspected by the appearance inspection module and then transferred to the next workstation.

7. The multifunctional fully automatic high-speed testing system according to claim 1, characterized in that, The test quick-change device includes: The standardized interface module has a unified installation interface for installation by each test unit; The rapid positioning module is used to achieve rapid positioning and locking of the test unit.

8. The multifunctional fully automatic high-speed testing system according to claim 7, characterized in that, The test quick-change device is located next to the turret turnover device. Each test unit is installed on the test quick-change device through a standardized interface module. When changing product types, the test unit can be quickly disassembled and installed as a whole through the quick positioning module.

9. The multifunctional fully automatic high-speed testing system according to claim 1, characterized in that, The rigid strip splicing device includes: The rigid material strip positioning module is used to position the rigid material strips to be spliced. The rigid material strip splicing module is used to automatically splice the positioned rigid material strips.

10. The multifunctional fully automatic high-speed testing system according to claim 1, characterized in that, The soft strip splicing device includes: The soft material strip positioning module is used to position the soft material strips to be spliced. The soft material strip splicing module is used to automatically splice the positioned soft material strips.

11. The multifunctional fully automatic high-speed testing system according to claim 1, characterized in that, The sealing detection device includes: The feeding module is used to drive the tape and reel to be fed forward. The sealing module is used to attach the cover tape to the carrier tape and perform heat sealing; The inspection module is used to inspect the product before and after sealing, including inspection of the back of the product, inspection of the position of the taping groove, inspection of IR defects, and inspection of the sealing effect. The marking module is used to automatically mark products that fail the inspection.

12. The multifunctional fully automatic high-speed testing system according to claim 11, characterized in that, The feeding module of the sealing detection device uses a ratchet and a servo motor to drive the tape feeding stepwise; the detection module is set in the front and rear of the sealing module, and is used for product status detection before sealing and sealing effect detection after sealing.

13. The multifunctional fully automatic high-speed testing system according to claim 1, characterized in that, The tensile force detection device includes: The sealing module is used to seal the tape. The tensile testing module is used to perform online tensile testing on the sealed tape.

14. The multifunctional fully automatic high-speed testing system according to claim 13, characterized in that, The tensile testing module of the tensile testing device performs online tensile testing on the tape output by the sealing tape module and records the test data. An error is reported when the tensile strength exceeds the threshold.

15. The multifunctional fully automatic high-speed testing system according to claim 1, characterized in that, The track quick-change device includes: Standardized track modules are compatible with material conveying of various sizes and specifications, and are used to connect material flow between various devices; The quick-change positioning module is used to enable rapid positioning and replacement of the conveyor track.

16. The multifunctional fully automatic high-speed testing system according to claim 15, characterized in that, The standardized track module of the quick-change track device is equipped with a guide structure to accommodate tapes of different widths. The track module can be quickly disassembled and installed by quickly changing the positioning module to meet the conveying needs of different materials.

17. The multifunctional fully automatic high-speed testing system according to claim 1, characterized in that, The tray labeling device includes: The tray conversion module is used for automatic conversion and stacking of finished product trays; The labeling module is used to automatically attach labels to finished product trays.

18. The multifunctional fully automatic high-speed testing system according to claim 1, characterized in that, The various devices are connected in sequence to form a production line layout. The material flows sequentially through the loading and unloading buffer device, the compatible platform device, the turret turnover device, the testing quick change device, the sealing and detection device, the tensile testing device, and the material tray labeling device. The rigid material strip splicing device and the flexible material strip splicing device are set between the testing quick change device and the sealing and detection device to provide the spliced ​​continuous material strip for the tape feeding station. The testing quick change device is set next to the turret turnover device, and the track quick change device is set between the devices that transfer the material strip.

19. The multifunctional fully automatic high-speed testing system according to claim 18, characterized in that, The overhead crane is connected to the loading and unloading buffer device, the rigid material strip splicing device, and the flexible material strip splicing device through communication interaction. The overhead crane automatically transports materials to the loading position according to the material balance of each device, realizing fully automatic material replenishment.

20. The multifunctional fully automatic high-speed testing system according to claim 1, characterized in that, The loading and unloading buffer device is connected to the rigid material belt splicing device and the flexible material belt splicing device through independent conveying channels. The rigid material belt is spliced ​​by the rigid material belt splicing device and then sent into the loading and unloading buffer device. The flexible material belt is spliced ​​by the flexible material belt splicing device and then sent into the loading and unloading buffer device.

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