Laser processing method, apparatus, device, storage medium, and product

Abstract

The application discloses a laser processing method, device, equipment, storage medium and product. The laser processing method comprises the following steps: dividing a substrate into a plurality of processing regions, each laser processing head corresponding to one processing region; placing the substrate on a positioning platform, and controlling the positioning platform to drive the substrate to move to a processing station; acquiring an image of the substrate, and calculating an angle deviation of the substrate; controlling the positioning platform to rotate by a corresponding angle according to the angle deviation; and controlling each laser processing head to process in the corresponding processing region according to a processing instruction and a processing path. The substrate is divided into regions, and a plurality of laser processing heads are used for corresponding processing, which greatly improves the processing efficiency. Before processing, the substrate is detected and angle compensation is performed, the pose error of the substrate in the placing process is eliminated, the processing positioning precision is improved, and the stability and consistency of the laser processing quality are ensured.

Description

Technical Field

[0001] This application belongs to the field of laser processing technology, and in particular relates to a laser processing method, apparatus, equipment, storage medium and product. Background Technology

[0002] With the rapid development of industries such as LCD displays and glass, the application of large-size glass substrates is becoming increasingly widespread. In these industries, permanent markings such as product serial numbers, specifications, production batches, or QR codes are typically required on the glass surface to enable product traceability and quality control. However, large-size glass is prone to cumulative translational and rotational deviations during transport and positioning, leading to inaccurate positioning of the glass by subsequent processing heads. Summary of the Invention

[0003] The embodiments of this application provide a laser processing method, apparatus, equipment, storage medium, and product that can ensure accurate positioning during subsequent processing.

[0004] This application provides a laser processing method, which is executed by a laser processing device. The laser processing device includes multiple laser processing heads and a positioning platform. The positioning platform is used to support a substrate, and the multiple laser processing heads are used to process the substrate. The laser processing method includes:

[0005] The substrate is divided into multiple processing areas, and each laser processing head corresponds to one processing area; The substrate is placed on the positioning platform, and the positioning platform is controlled to move the substrate to the processing station. Acquire an image of the substrate and calculate the angular deviation of the substrate; Based on the angle deviation, control the positioning platform to rotate by a corresponding angle; and According to the processing instructions and processing path, each laser processing head is controlled to perform processing within its corresponding processing area.

[0006] Optionally, a plurality of marker points are formed on the substrate; the step of acquiring an image of the substrate and calculating the angular deviation of the substrate includes: Obtain the image coordinates of any two marked points on the substrate; Calculate the coordinate difference between the two marked points, and then calculate the angle deviation based on the coordinate difference.

[0007] Optionally, before dividing the substrate into multiple processing areas, the laser processing method includes: Import the coded drawing and parse the information in the drawing; Based on the specifications of the substrate, the processing instructions and the processing path are generated.

[0008] Optionally, dividing the substrate into multiple processing areas includes: The substrate is divided into processing areas equal to the number of laser processing heads, and a safety distance is provided between two adjacent processing areas along the first horizontal direction.

[0009] Optionally, each of the processing areas includes a plurality of sub-areas, which are spaced apart along a second horizontal direction, the second horizontal direction being perpendicular to the first horizontal direction; The laser processing method includes: after the laser processing head completes the processing of the current sub-region, controlling the laser processing head to move along the second horizontal direction to process the next sub-region.

[0010] Optionally, controlling each laser processing head to perform processing within its corresponding processing area includes: The galvanometer of the laser processing head is controlled to adjust the direction of the laser beam, marking the processing area; and Simultaneously remove the dust generated during the coding process on the processing area.

[0011] This application also provides a laser processing apparatus, including: A division module is used to divide the substrate into multiple processing areas, with each laser processing head corresponding to one processing area; The control module is used to place the substrate on the positioning platform and control the positioning platform to move the substrate to the processing station; The calculation module is used to acquire an image of the substrate and calculate the angular deviation of the substrate; The compensation module is used to control the positioning platform to rotate by a corresponding angle based on the angle deviation; and The processing module is used to control each laser processing head to perform processing within the corresponding processing area according to the processing instructions and processing path.

[0012] This application also provides a laser processing device for performing the laser processing method described in any of the above embodiments. The laser processing device includes a plurality of laser processing heads and a positioning platform. The positioning platform is used to support a substrate and drive the substrate to move relative to the laser processing heads. The laser processing heads are used to process the substrate.

[0013] This application also provides a computer-readable storage medium storing a computer program that, when executed by a processor, implements the laser processing method described in any of the above embodiments.

[0014] This application also provides a computer program product, including a computer program that, when executed by a processor, implements the laser processing method described in any of the above embodiments.

[0015] In the laser processing method, apparatus, equipment, storage medium, and product provided in this application, the substrate is partitioned and processed by multiple laser processing heads, which greatly improves processing efficiency. Furthermore, the substrate is inspected and angle compensated before processing to eliminate positional errors during placement, thereby improving processing positioning accuracy and ensuring the stability and consistency of laser processing quality. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0017] Figure 1 This is a schematic diagram of the structure of the laser processing equipment provided in the embodiments of this application.

[0018] Figure 2 This is a schematic flowchart of a laser processing method provided in an embodiment of this application.

[0019] Figure 3 This is a planar schematic diagram of the substrate provided in an embodiment of this application.

[0020] Figure 4 This is another schematic flowchart of the laser processing method provided in the embodiments of this application.

[0021] Figure 5 This is another schematic diagram of the laser processing method provided in an embodiment of this application.

[0022] Figure 6 This is another schematic diagram of the laser processing method provided in the embodiments of this application.

[0023] Figure 7 This is a schematic diagram of the modules of the laser processing apparatus provided in the embodiments of this application.

[0024] Explanation of icon numbers: Laser processing equipment 100, laser processing head 10, positioning platform 20, drive mechanism 30, adjustment mechanism 40, substrate 200; First horizontal direction X, second horizontal direction Y.

[0025] The purpose, features, and advantages of this application will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0026] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0027] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on or indirectly on that other component. When a component is referred to as being "connected to" another component, it can be directly connected to or indirectly connected to that other component.

[0028] It should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0029] It should be understood that the term "and / or" as used in this application specification and the appended claims refers to any combination of one or more of the associated listed items and all possible combinations, and includes such combinations.

[0030] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0031] Please see Figure 1 This application provides a laser processing equipment 100, which is used to perform a laser processing method. The laser processing equipment 100 includes a plurality of laser processing heads 10 and a positioning platform 20. The positioning platform 20 is used to support a substrate 200 and drive the substrate 200 to move relative to the laser processing heads 10. The laser processing heads 10 are used to process the substrate 200.

[0032] The positioning platform 20 is used to support the substrate 200. The positioning platform 20 is capable of moving in the horizontal plane and rotating about the vertical axis relative to the laser processing head 10 to adjust the position of the positioning substrate 200. Multiple laser processing heads 10 can be suspended or disposed above the positioning platform 20 for emitting laser beams to etch markings on the surface of the substrate 200.

[0033] Optionally, the laser processing equipment 100 also includes a drive mechanism 30. The drive mechanism 30 is connected to a plurality of laser processing heads 10 for driving the plurality of laser processing heads 10 to move synchronously or independently along the second horizontal direction Y.

[0034] Driven by the drive mechanism 30, the laser processing head 10 can cover different positions of the substrate 200 in the second horizontal direction Y, thereby realizing large-scale processing of large-size substrates. At the same time, it also enables the laser processing equipment 100 to adapt to substrates 200 of different sizes in the second horizontal direction Y, improving the versatility of the laser processing equipment 100.

[0035] Optionally, an adjustment mechanism 40 is also provided between two adjacent laser processing heads 10. The adjustment mechanism 40 is used to adjust the spacing between two adjacent laser processing heads 10 in the first horizontal direction. By adjusting the arrangement spacing between the laser processing heads 10 through the adjustment mechanism 40, the laser processing equipment 100 can adapt to substrates with different widths in the first horizontal direction X, ensuring that each laser processing head 10 can accurately cover the corresponding processing area. In addition, when the area to be processed on the substrate 200 changes, the adjustment mechanism 40 can also flexibly adjust the spacing between two adjacent laser processing heads 10 to optimize the processing path.

[0036] Wherein, the first horizontal direction X is the width direction of the substrate 200, and the second horizontal direction Y is the length direction of the substrate 200.

[0037] Please see Figure 2 This application provides a laser processing method, which is performed using the aforementioned laser processing equipment 100. The laser processing method includes: Step S10: Divide the substrate 200 into multiple processing areas E, with each laser processing head 10 corresponding to one processing area E.

[0038] When the substrate 200 has a wide area, a single laser processing head 10 is insufficient to cover the entire substrate 200. To cover the entire area of ​​the substrate 200, a large number of motion strokes are required, resulting in low processing efficiency. This application employs multiple laser processing heads 10 operating in parallel to improve processing efficiency.

[0039] The division of processing areas E can be based on the number of laser processing heads 10, their spacing, and the overall dimensions of the substrate 200. The substrate 200 is uniformly divided into multiple independent processing areas E, with the number of processing areas E corresponding one-to-one with the number of laser processing heads 10, and there are no processing blind spots.

[0040] For example, if the laser processing equipment 100 includes four laser processing heads 10, the substrate 200 can be divided into four independent processing areas E along the width direction, such as... Figure 1 As shown, each laser processing head 10 is only responsible for processing one processing area E, which shortens the moving distance of a single processing head and enables multiple laser processing heads 10 to work in parallel to improve efficiency.

[0041] Step S20: Place the substrate 200 on the positioning platform 20 and control the positioning platform 20 to move the substrate 200 to the processing station.

[0042] The substrate 200 can be transferred to the positioning platform 20 via a transmission line or a robotic arm. The positioning platform 20 can be equipped with vacuum suction holes or clamping mechanisms to fix the substrate 200 and prevent relative displacement of the substrate 200 during processing. After fixing, the positioning platform 20 moves the substrate 200 to a preset initial processing position.

[0043] Step S30: Acquire an image of the substrate 200 and calculate the angular deviation of the substrate 200. Step S40: Based on the angular deviation, control the positioning platform 20 to rotate by the corresponding angle.

[0044] It is understandable that for a large substrate 200, the positioning angle deviation will be linearly amplified. If no corresponding compensation is made, it may cause the processing position of the edge area to be misaligned, resulting in defects in the QR code or serial number patterns processed later.

[0045] Therefore, the laser processing method provided in this application requires position compensation for the substrate 200. The laser processing equipment 100 may include one or more CCD cameras, which may be mounted on the frame of the laser processing equipment 100 or integrated into the laser processing head 10. The real-time acquired image of the substrate 200 is compared with a preset standard image via contour comparison or feature point alignment calculation to determine the angular deviation of the current substrate 200 relative to the standard mounting position.

[0046] After acquiring the angular deviation data, the positioning platform 20 rotates the substrate 200 by the corresponding angle to offset the previous deviation, thereby correcting the angular orientation of the substrate 200 to a standard state and ensuring the accuracy and consistency of subsequent processing steps. The rotation direction is opposite to the deviation direction. For example, if it is calculated that the substrate 200 has deflected counterclockwise by 0.5 degrees, the positioning platform 20 is controlled to rotate clockwise by 0.5 degrees.

[0047] Step S50: According to the processing instructions and processing path, control each laser processing head 10 to perform processing in the corresponding processing area E.

[0048] After completing the deviation compensation of the glass substrate 200, according to the pre-entered processing instructions and preset processing paths, the processing instructions include the marking content of each processing area E, the engraving depth, the laser power, and the processing speed, etc., and the processing path is the movement trajectory of each laser processing head 10 within the corresponding processing area E. Subsequently, multiple laser processing heads 10 are controlled to start and complete laser marking or engraving operations according to the preset processing paths and process parameters. Each laser processing head 10 can start and process synchronously, which greatly improves the processing efficiency of large-size glass substrates 200.

[0049] By partitioning the substrate 200 and processing it using multiple laser processing heads 10, the processing efficiency is greatly improved. Furthermore, the substrate 200 is inspected and its angle is compensated before processing to eliminate the pose error of the substrate 200 during placement, thereby improving the processing positioning accuracy and ensuring the stability and consistency of laser processing quality.

[0050] Please see Figure 3 and Figure 4 Optionally, multiple marker points M are formed on the substrate 200. Acquiring an image of the substrate 200 and calculating the angular deviation of the substrate 200, step S30 includes: Step S31: Obtain the image coordinates of any two marker points M on the substrate 200.

[0051] Several marker points M are pre-formed on the surface of the substrate 200 to be processed. The marker points M are used as reference positioning marks for measuring the orientation deviation of the substrate 200. The marker points M are cross-shaped reference marks with clear contrast made in the corner areas of the substrate 200. They are etched onto the substrate 200 by chemical etching during the manufacturing stage. The marker points M are distributed on the substrate 200. They can be arranged at the four corners of the substrate 200, or in pairs along the long or short sides of the substrate 200, or arranged in a matrix on the substrate 200, etc.

[0052] All marker points M are extracted from the image of substrate 200. Any two marker points M on substrate 200 are selected as calculation references, and the two-dimensional image coordinate values ​​corresponding to these two marker points M in the camera imaging coordinate system are obtained. Preferably, these two marker points M should be selected in the diagonal direction of substrate 200 or at a relatively far distance to reduce the influence of measurement error on angle calculation.

[0053] Step S32: Calculate the coordinate difference between the two marker points M, and calculate the angle deviation based on the coordinate difference.

[0054] Calculate the coordinate difference ΔX between the two marker points M in the first horizontal direction X and the coordinate difference ΔY in the second horizontal direction Y. ΔX represents the relative offset of the two marker points M in the horizontal direction, and ΔY represents the relative offset of the two marker points M in the vertical direction. The actual vector constructed from ΔX and ΔY can reflect the actual line direction connecting the two marker points M on the current substrate 200, representing the true attitude of the substrate 200 after positional offset and rotation.

[0055] Specifically, by using the arctangent function to solve for the vector angles of ΔX and ΔY, the actual tilt angle of the line connecting the two points relative to the standard reference direction can be obtained. The difference between the actual tilt angle and the preset standard tilt angle is calculated, and the final angle difference is the rotation angle deviation generated by the substrate 200 as a whole.

[0056] The coordinate difference calculated in step S32 can be used not only to calculate the angular deviation but also to calculate the translational deviation of the substrate 200. Specifically, by comparing the actual center coordinates of the two marker points M with the theoretical center coordinates, the translational offset of the substrate 200 in the X and Y axes can be calculated. Based on this translational offset, the positioning platform 20 is controlled to perform translational compensation in the first horizontal direction X and the second horizontal direction Y, realizing pose compensation for rotation and translation, and further ensuring the accuracy of the processing position of the laser processing head 10 within its corresponding processing area E.

[0057] Please see Figure 5 Optionally, before dividing the substrate 200 into multiple processing areas E, the laser processing method includes: Step S01: Import the coded drawing and parse the information in the drawing.

[0058] Step S02: Based on the specifications of the substrate 200, generate processing instructions and processing paths.

[0059] In step S01, the marking drawing is typically generated by host computer software such as CAD software or dedicated laser marking software. It contains the graphic elements to be processed, such as product serial numbers, QR codes, company logos, or production dates. The parsing process involves identifying the types of graphic elements in the drawing, such as lines, arcs, text, dimensional parameters, layer information, and processing parameters. By parsing this information, the graphic data is converted into recognizable vector data or dot matrix data, constructing a digital model of the graphic to be processed.

[0060] The process then proceeds to step S02. The specifications of the substrate 200 include its length, width, thickness, and material type. These parameters can be manually input, automatically measured by sensors, or automatically obtained by scanning the barcode on the substrate 200. Combining the drawing information obtained in step S01 with the specifications of the substrate 200, the layout position of the graphic to be processed on the substrate 200 is determined, and a specific processing path is generated.

[0061] In actual laser processing, each laser processing head 10 operates within its corresponding processing area E. If the processing areas E are not properly planned, the boundaries of adjacent processing areas E may overlap, leading to localized repetitive marking. Alternatively, adjacent laser processing heads 10 may collide due to intersecting motion trajectories during processing.

[0062] Optionally, the substrate 200 is divided into multiple processing areas E, i.e., step S10 includes: The substrate 200 is divided into processing areas E, which are equal in number to the number of laser processing heads 10. A safety distance is provided between two adjacent processing areas E along the first horizontal direction X.

[0063] Each processing area E corresponds to an independent laser processing head 10 for operation, and a safe distance is provided between adjacent processing areas E to avoid interference between multiple laser processing heads 10 during operation.

[0064] The safety distance is a preset blank isolation area, which is not part of the processing range of processing area E, but rather a buffer isolation zone between processing areas E. The specific value of the safety distance can be set comprehensively based on factors such as the movement stroke of the laser processing head 10, the structural dimensions of the laser processing head 10, and the diameter of the laser spot.

[0065] Optionally, each processing area E includes multiple sub-areas e, which are spaced apart along a second horizontal direction Y, perpendicular to the first horizontal direction X. The laser processing method includes step S60: after the laser processing head 10 completes the processing of the current sub-area e, it controls the laser processing head 10 to move along the second horizontal direction Y to process the next sub-area e.

[0066] In this way, by dividing the sub-regions e at intervals, the laser processing head 10 does not need to cover the entire width of the substrate 200 at once, but covers it in segments by stepping. That is, the laser processing equipment 100 with a smaller stroke can achieve full-area processing of the large-size substrate 200, thereby reducing processing costs.

[0067] Understandably, the scanning range of the galvanometer in the laser processing head 10 is limited, making it difficult to cover the entire length of the large substrate 200, i.e., the second horizontal direction Y, in a single operation. Using a large-range field lens could lead to a decrease in edge spot quality and high costs.

[0068] The processing area E is divided into multiple sub-regions e, so that the laser processing head 10 can operate within the central area of ​​the galvanometer when processing any sub-region e. By replacing the large-angle deflection of the galvanometer with the overall movement of the laser processing head 10, aberrations and distortions at the edges of the field of view are avoided, ensuring consistent processing accuracy across all positions on the entire substrate 200. The drive mechanism 30 of the laser processing equipment 100 is connected to each laser processing head 10, and the drive mechanism 30 is used to move each laser processing head 10 along the second horizontal direction Y.

[0069] Please see Figure 6 Optionally, each laser processing head 10 is controlled to perform processing within its corresponding processing area E, i.e., step S50 includes: Step S51: Control the galvanometer of the laser processing head 10 to adjust the direction of the laser beam and mark the processing area E.

[0070] The laser processing head 10 integrates an X-axis galvanometer motor and a Y-axis galvanometer motor. By controlling the deflection angle of the galvanometer motor, the projection direction of the laser beam is changed, so that the focused laser spot moves quickly within the processing area E according to a preset processing trajectory, and the spot forms a mark on the surface of the substrate 200.

[0071] When a laser etches the surface of a substrate 200, such as glass or an LCD panel, it will generate fine dust, molten particles or vaporized residue. The dust may adhere to the surface of the substrate 200, resulting in uneven processing depth or blurred markings, and may also contaminate the laser processing head 10.

[0072] Step S52: Simultaneously remove dust generated during the coding process on processing area E.

[0073] Specifically, the laser processing equipment 100 may also include a dust removal device, which is installed on the laser processing head 10 and spaced apart from the galvanometer. During laser processing, high-pressure gas from the dust removal device blows the generated dust off the surface of the substrate 200 and sucks it into a corresponding recycling device. Dust removal during coding ensures that each processing area E can quickly return to a clean state after coding is completed, eliminating the need for subsequent manual wiping, thus improving product yield and the automation level of the production line.

[0074] Please see Figure 7This application also provides a laser processing apparatus 60, which includes a division module 61, a control module 62, a calculation module 63, a compensation module 64, and a processing module 65.

[0075] The partitioning module 61 divides the substrate 200 into multiple processing areas E, with each laser processing head 10 corresponding to one processing area E. The control module 62 places the substrate 200 on the positioning platform 20 and controls the positioning platform 20 to move the substrate 200 to the processing station. The calculation module 63 acquires an image of the substrate 200 and calculates the angular deviation of the substrate 200. The compensation module 64 controls the positioning platform 20 to rotate by a corresponding angle based on the angular deviation. The processing module 65 controls each laser processing head 10 to perform processing within its corresponding processing area E according to the processing instructions and processing path.

[0076] This application also provides a computer-readable storage medium storing a computer program, which, when executed by a processor, implements the laser processing method described in any of the above embodiments.

[0077] This application also provides a computer program product, including a computer program that, when executed by a processor, implements the laser processing method described in any of the above embodiments.

[0078] In the embodiments provided in this application, it should be understood that the disclosed apparatus / devices and methods can be implemented in other ways. For example, the apparatus / device embodiments described above are merely illustrative. For instance, the division of modules or units is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the coupling or direct coupling or communication connection shown or discussed may be through some interfaces; the indirect coupling or communication connection between apparatuses or units may be electrical, mechanical, or other forms.

[0079] The units described above as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the units can be selected to achieve the purpose of this embodiment according to actual needs.

[0080] The above-described embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application, and should all be included within the protection scope of this application.

Claims

1. A laser processing method, characterized in that, The laser processing method is performed by a laser processing device, which includes multiple laser processing heads and a positioning platform. The positioning platform is used to support a substrate, and the multiple laser processing heads are used to process the substrate. The laser processing method includes: The substrate is divided into multiple processing areas, and each laser processing head corresponds to one processing area; The substrate is placed on the positioning platform, and the positioning platform is controlled to move the substrate to the processing station. Acquire an image of the substrate and calculate the angular deviation of the substrate; Based on the angle deviation, control the positioning platform to rotate by a corresponding angle; and According to the processing instructions and processing path, each laser processing head is controlled to perform processing within its corresponding processing area.

2. The laser processing method according to claim 1, characterized in that, Multiple marker points are formed on the substrate; acquiring an image of the substrate and calculating the angular deviation of the substrate includes: Obtain the image coordinates of any two marked points on the substrate; Calculate the coordinate difference between the two marked points, and then calculate the angle deviation based on the coordinate difference.

3. The laser processing method according to claim 1, characterized in that, Before dividing the substrate into multiple processing areas, the laser processing method includes: Import the coded drawing and parse the information in the drawing; Based on the specifications of the substrate, the processing instructions and the processing path are generated.

4. The laser processing method according to claim 1, characterized in that, The step of dividing the substrate into multiple processing areas includes: The substrate is divided into processing areas equal to the number of laser processing heads, and a safety distance is provided between two adjacent processing areas along the first horizontal direction.

5. The laser processing method according to claim 4, characterized in that, Each of the processing areas includes multiple sub-areas, which are spaced apart along a second horizontal direction, which is perpendicular to the first horizontal direction; The laser processing method includes: after the laser processing head completes the processing of the current sub-region, controlling the laser processing head to move along the second horizontal direction to process the next sub-region.

6. The laser processing method according to claim 1, characterized in that, The control of each laser processing head to process within its corresponding processing area includes: The galvanometer of the laser processing head is controlled to adjust the direction of the laser beam, marking the processing area; and Simultaneously remove the dust generated during the coding process on the processing area.

7. A laser processing apparatus, characterized in that, include: A division module is used to divide the substrate into multiple processing areas, with each laser processing head corresponding to one processing area; The control module is used to place the substrate on the positioning platform and control the positioning platform to move the substrate to the processing station; The calculation module is used to acquire an image of the substrate and calculate the angular deviation of the substrate; The compensation module is used to control the positioning platform to rotate by a corresponding angle based on the angle deviation; and The processing module is used to control each laser processing head to perform processing within the corresponding processing area according to the processing instructions and processing path.

8. A laser processing device, characterized in that, The laser processing equipment is used to perform the laser processing method as described in any one of claims 1 to 6. The laser processing equipment includes a plurality of laser processing heads and a positioning platform. The positioning platform is used to support a substrate and drive the substrate to move relative to the laser processing head. The laser processing head is used to process the substrate.

9. A computer-readable storage medium having a computer program stored thereon, characterized in that, When the computer program is executed by the processor, it implements the laser processing method as described in any one of claims 1 to 6.

10. A computer program product, comprising a computer program, characterized in that, When the computer program is executed by the processor, it implements the laser processing method as described in any one of claims 1 to 6.

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