A laser cutting device for processing PCB

Abstract

The application discloses a kind of laser cutting equipment for PCB circuit board processing, related to laser cutting technical field, containing rack, laser cutting mechanism, drive mechanism, two groups of blanking mechanism, cam, gas communication barrel, gas slip ring, double-layer feeding conveying mechanism, base and inclined blanking box, drive mechanism synchronous linkage double-layer conveying mechanism feeding, rotating cylinder carries two groups of blanking mechanism with vacuum chuck, cooperate cam, spring frame realizes blanking frame telescoping, gas slip ring and solenoid valve independently control two groups of blanking mechanism negative pressure on-off, after plate cutting, rotating cylinder rotates ° complete finished product adsorption blanking, hollow inclined blanking box separates small plate waste, frame excess material is discharged separately with conveying belt.The equipment can automatically sort finished product and waste, saves manual sorting station, reduces plate knock defective rate, double blanking mechanism alternate operation, processing rhythm continuous efficient, adapts to PCB scale high-speed laser plate production.

Description

Technical Field

[0001] This invention relates to the field of laser cutting technology, specifically to a laser cutting device for PCB circuit board processing. Background Technology

[0002] As electronic devices develop towards miniaturization and high-density circuit layout, the number of integrated components on PCB circuit boards continues to increase. This leads to increasingly higher requirements for cutting precision and stress-free board material handling during depaneling. Laser depaneling, with its advantages of non-contact cold cutting, flexible cutting contours, and no mechanical stress causing micro-cracks in the PCB, has gradually replaced traditional milling depaneling and V-Cut stamping depaneling processes and is widely used in PCB mass production lines.

[0003] Currently, the mainstream automated laser PCB splitting equipment in the industry adopts a continuous feeding structure with a conveyor belt. The processing flow is as follows: the entire PCB board is placed on the conveyor belt, and the conveyor belt transports the PCB board at a uniform speed to the processing station below the laser cutting head; the laser cutting head completes the PCB splitting and cutting operation according to the preset path; after the cutting is completed, the formed PCB board and the frame residue are not separated and are transported synchronously to the equipment discharge end with the conveyor belt for unified discharge.

[0004] The existing conveyor-type laser PCB separation process has obvious drawbacks: the finished PCB and the leftover frame material are mixed together and discharged simultaneously. After discharge, the finished board and the waste frame must be sorted and separated manually. The production process is cumbersome, increases the number of manual workstations on the production line, and the manual sorting is labor-intensive and inefficient. It is difficult to match the processing capacity of high-speed laser PCB separation equipment and limits the automated continuous production capacity of the entire SMT production line.

[0005] Meanwhile, manual sorting operations also present additional problems: manual handling and sorting can easily cause scratches and bumps on the surface of precision PCBs and surface-mount components, increasing the product defect rate; long-term manual operation in the dust and radiation environment generated by laser processing poses occupational safety hazards; and the continuous allocation of sorting personnel also significantly increases the labor production costs of PCB processing, which is not conducive to the cost reduction and efficiency improvement needs of large-scale mass production. Summary of the Invention

[0006] Based on this, the purpose of the present invention is to provide a laser cutting device for PCB circuit board processing, so as to solve the technical problems mentioned in the background art.

[0007] To achieve the above objectives, the present invention provides the following technical solution: a laser cutting equipment for PCB circuit board processing, including a frame, a laser cutting mechanism installed on the top of the frame, and a first feeding conveyor mechanism and a second feeding conveyor mechanism installed on both sides inside the frame, wherein the first feeding conveyor mechanism and the second feeding conveyor mechanism are used to clamp and convey the entire PCB board. The frame is equipped with a drive mechanism, which includes a drive rod rotatably connected to the frame. The two sides of the drive rod are rotatably connected to the frame via bearings, and a motor with its output end fixedly connected to the drive rod is installed on one side of the frame. Furthermore, a rotating cylinder is fixed on one side of the drive rod, and two sets of feeding mechanisms are connected to the rotating cylinder. The feeding mechanism includes a feeding frame that is elastically and radially slidably connected to the rotating cylinder, and multiple sets of vacuum suction cups are installed side by side on the feeding frame. Each set of feeding racks has a fixed roller fixed at the bottom of the side away from the rotating cylinder. The frame has a cam that cooperates with the fixed roller, and the cam is located outside the drive rod and is fixedly connected to the frame through the fixed bracket. The feeding mechanism also includes an air extraction pipe and a connecting pipe. The ports on one side of the multiple sets of vacuum suction cups are connected in a centralized manner through the air extraction pipe, and the connecting pipe is connected to the air extraction pipe. The connecting pipe is a metal corrugated flexible hose. The feeding mechanism also includes a spring frame, which is fixed between the feeding frame and the rotating cylinder and is used to reset the feeding frame after it is disengaged from the cam limit. The laser cutting mechanism includes two sets of supports fixed to the top of the frame, and each set of supports has a slide rail fixed to its top. The top of each of the two sets of slide rails is fixed with a movable frame, and a laser cutting module is installed on the movable frame. The movable frame is driven by a power drive structure, which drives the laser cutting module to move back and forth. The drive rod has a hollow structure on the side near the rotating cylinder, and the hollow structure is divided into two cavities by a partition. A gas communication cylinder is fixed to the outside of the drive rod. The gas communication cylinder has two sets of communication holes that are connected to two sets of cavities. The gas communication cylinder also has two sets of cavities inside. The two sets of cavities inside the gas communication cylinder are connected to two sets of communication pipes. A slip ring is installed on one side of the drive rod, and the fixed ring of the slip ring is fixedly connected to the frame, the movable ring is fixedly connected to the drive rod, and the two sets of air pipes on the movable ring are respectively connected to the two sets of cavities inside the drive rod. The fixed ring is connected to an external vacuum generating device through a pipe, and an electromagnetic reversing valve is installed between the fixed ring and the vacuum generating device. The first feeding and conveying mechanism includes a power wheel, two sets of driven wheels and a conveyor belt, wherein the power wheel is fixed on the drive rod; The second feeding and conveying mechanism includes two sets of conveyor wheels and a conveyor belt. The drive rod and one of the sets of conveyor wheels transmit power through a gear transmission structure or an external drive module is installed. The bottom of the frame is fixed with a base, which is made of multiple sets of square tubes spliced ​​and welded together. An inclined feeding box is installed inside the base, and the inclined feeding box adopts a hollow design.

[0008] In summary, the present invention has the following main beneficial effects: This invention utilizes a synchronously linked double-layer conveying mechanism, a rotary unloading module with an independent vacuum path, and a matching mechanical linkage structure to automatically separate and store shaped PCB boards and excess material frames, eliminating the need for manual sorting stations and significantly reducing labor costs. The entire process involves vacuum negative pressure transfer of the boards, avoiding scratches and damage to circuits and components caused by manual sorting, thus reducing product defect rates. The timing of the equipment's feeding, adsorption, laser cutting, and rotary unloading actions is precisely synchronized, with two sets of unloading mechanisms operating alternately, resulting in continuous and efficient processing cycles, suitable for high-speed laser cutting capacity and large-scale mass production. Attached Figure Description

[0009] Figure 1 This is a first-view structural diagram of the entire invention; Figure 2 This is a schematic diagram of the internal structure of the present invention; Figure 3 This is an exploded view of the drive mechanism of the present invention; Figure 4 This is an exploded view of the feeding mechanism of the present invention; Figure 5 This is a schematic diagram of the assembly structure of the feeding mechanism and the rotating cylinder of the present invention; Figure 6 This is a cross-sectional view of the two sets of feeding racks and rotating cylinders assembled in this invention; Figure 7 This is an enlarged cross-sectional view of the gas communicating tube of the present invention; Figure 8 This is a second-view structural diagram of the entire invention.

[0010] In the picture: 1. Frame; 2. Laser cutting mechanism; 201. Support; 202. Slide rail; 203. Moving frame; 204. Laser cutting module; 3. Drive mechanism; 301. Drive rod; 302. Motor; 303. Rotating cylinder; 304. Partition plate; 4. Feeding mechanism; 401. Feeding rack; 402. Vacuum suction cup; 403. Air extraction pipe; 404. Connecting pipe; 405. Fixed roller; 406. Spring frame; 5. Cam; 6. Fixture; 7. Gas connecting cylinder; 701. Connecting hole; 8. Gas slip ring; 9. First feeding conveyor mechanism; 901. Power wheel; 10. Second feeding conveyor mechanism; 11. Base; 12. Inclined feeding box. Detailed Implementation

[0011] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0012] The embodiments of the present invention will now be described.

[0013] Example like Figure 1-8 As shown, a laser cutting equipment for PCB circuit board processing includes a frame 1, a base 11 fixedly installed at the bottom of the frame 1, the base 11 is formed by splicing and welding multiple sets of square tubes, and an inclined feeding box 12 is fixedly installed inside the base 11. The inclined feeding box 12 adopts a hollow structure design.

[0014] A laser cutting mechanism 2 is fixedly mounted on the top of the frame 1. The laser cutting mechanism 2 includes two sets of brackets 201, both of which are fixed on the upper end of the frame 1. A slide rail 202 is fixedly installed on the top of each set of brackets 201. A movable frame 203 is fixedly mounted on the two sets of slide rails 202. A laser cutting module 204 is mounted on the movable frame 203. The movable frame 203 is externally connected to a power drive structure. The power drive structure drives the movable frame 203 and the laser cutting module 204 to move back and forth linearly along the slide rail 202 to complete the adjustment of the PCB board separation and cutting path.

[0015] The first feeding conveyor 9 and the second feeding conveyor 10 are respectively installed on the left and right sides inside the frame 1. The first feeding conveyor 9 and the second feeding conveyor 10 work together to clamp and continuously convey the assembled PCB board; the second feeding conveyor 10 is arranged above the first feeding conveyor 9.

[0016] The first feeding and conveying mechanism 9 includes a power wheel 901, two sets of driven wheels, and a matching conveyor belt. The power wheel 901 is fixedly mounted on the drive rod 301 of the drive mechanism 3. The second feeding and conveying mechanism 10 includes two sets of conveyor wheels and a matching conveyor belt. The drive rod 301 and one set of conveyor wheels of the second feeding and conveying mechanism 10 transmit power through a gear transmission structure. Alternatively, an external drive module can be connected to provide operating power.

[0017] A drive mechanism 3 is installed in the center of the frame 1. The drive mechanism 3 includes a drive rod 301. Both ends of the drive rod 301 are rotatably connected to the frame 1 through bearings. A motor 302 is fixedly installed on the outer side wall of the frame 1. The output shaft end of the motor 302 is fixedly connected to the end of the drive rod 301. The motor 302 drives the drive rod 301 to rotate as a whole. A rotating cylinder 303 is fixedly installed on the outer side of the rod of the drive rod 301 near the middle of the frame 1. Two sets of feeding mechanisms 4 are elastically connected to the outer wall of the rotating cylinder 303 along the radial direction.

[0018] Each feeding mechanism 4 includes a feeding frame 401, multiple sets of vacuum suction cups 402, an air extraction pipe 403, a connecting pipe 404, a fixed roller 405, and a spring frame 406. The spring frame 406 is fixedly connected at both ends to the feeding frame 401 and the rotating cylinder 303, respectively. The spring frame 406 is used to achieve radial reset of the feeding frame 401 after it disengages from the cam 5 limit position. Multiple sets of vacuum suction cups 402 are fixedly installed side-by-side on the feeding frame 401. The air extraction ports of all vacuum suction cups 402 are uniformly connected to the air extraction pipe 403 to complete the air path collection. One end of the connecting pipe 404 is connected to the air extraction pipe 403. The connecting pipe 404 is made of corrugated metal hose, and the other end is connected to the gas connecting cylinder 7. A fixed roller 405 is fixedly mounted on the bottom side of the feeding frame 401 away from the rotating cylinder 303.

[0019] A cam 5 is fixedly mounted inside the frame 1. The cam 5 is located on the outside of the drive rod 301. The cam 5 is locked and fixed to the inner wall of the frame 1 by the fixing bracket 6. The outer contour of the cam 5 is in close contact with the fixed roller 405 at the bottom of the feeding mechanism 4. When the drive rod 301 drives the rotating cylinder 303 to rotate, the fixed roller 405 rolls along the surface of the cam 5. The cam 5 pushes the feeding frame 401 to extend outward radially by the protruding contour of the cam 5.

[0020] The drive rod 301 has a hollow cavity structure inside the rod body near the rotating cylinder 303. A partition 304 is fixed horizontally inside the hollow cavity, dividing the hollow cavity into two independent cavities. A gas connecting cylinder 7 is fixedly mounted on the outer wall of the drive rod 301. Two sets of connecting holes 701 are opened inside the gas connecting cylinder 7, and the two sets of connecting holes 701 are respectively connected to the two sets of cavities inside the drive rod 301. The gas connecting cylinder 7 is also divided into two independent cavities, and the two sets of cavities are respectively connected to the connecting pipes 404 of the two feeding mechanisms 4.

[0021] An air slip ring 8 is mounted on the end of the drive rod 301 facing the outside of the frame 1. The air slip ring 8 is divided into two parts: a fixed ring and a movable ring. The fixed ring of the air slip ring 8 is fixedly locked to the side wall of the frame 1, and the movable ring of the air slip ring 8 is fixedly connected to the end of the drive rod 301. Two sets of independent air pipes are led out from the movable ring, and the two sets of air pipes are respectively connected to two sets of cavities inside the drive rod 301. The fixed ring of the air slip ring 8 is connected to an external vacuum generating device through an external pipe. An electromagnetic reversing valve is installed on the pipeline between the fixed ring and the vacuum generating device. The electromagnetic reversing valve controls the opening and closing and depressurization of the vacuum circuits of the two feeding mechanisms 4 respectively.

[0022] The working principle of this invention is as follows: This device is fixed on the base 11 by the frame 1, wherein the base 11 is made of square tubes welded together, and electronic components such as vacuum generator, power supply module, and control module required by this device can be installed inside; The frame 1 has a first feeding conveyor 9 and a second feeding conveyor 10 installed on both sides. The second feeding conveyor 10 is located above the first feeding conveyor 9. It contacts the PCB board through two sets of conveyor belts and can feed the PCB board by friction. The power wheel 901 of the first feeding conveyor 9 is fixed on the drive rod 301 of the drive mechanism 3. The power of the second feeding conveyor 10 is transmitted to the power wheel 901 of the first feeding conveyor 9 by installing an additional drive module or by a gear transmission structure. A laser cutting mechanism 2 is installed above the frame 1 and is fixed to the frame 1 by a bracket 201. A slide rail 202 is fixed on the top of both brackets 201. A movable frame 203 is slidably connected between the two slide rails 202. A laser cutting module 204 is installed inside the movable frame 203. An additional power drive module can drive the movable frame 203 and the laser cutting module 204 to move back and forth, so as to realize the laser separation operation of the PCB board. Specifically, the laser cutting module 204 does not require significant movement; its built-in optical path system enables the movement of the PCB board's separation path. The drive rod 301 of the drive mechanism 3 is rotatably connected to the frame 1 on both sides by bearings, and the drive rod 301 is driven to rotate by the motor 302. A rotating cylinder 303 is fixed on one side of the drive rod 301, and two sets of feeding mechanisms 4 are radially elastically slidably connected to the outside of the rotating cylinder 303. The unloading mechanism 4 has an unloading frame 401 that slides elastically radially with the rotating cylinder 303 via a spring frame 406, and multiple sets of vacuum suction cups 402 are installed on the unloading frame 401, with multiple sets of PCB single boards installed on each set of vacuum suction cups 402. Specifically, when the entire PCB board is conveyed to the laser cutting module 204 via the first feeding conveyor 9 and the second feeding conveyor 10, the drive mechanism 3 rotates synchronously, and the rotating cylinder 303 rotates a set of unloading mechanisms 4 above it and keeps it in a vertical state. Moreover, under the action of cam 5 and fixed roller 405, the set of feeding mechanisms 4 located above is passively lifted and raised, so that the multiple sets of vacuum suction cups 402 on the upper feeding mechanism 4 are raised to a certain height, so that their suction nozzles are tightly attached to the bottom surface of the PCB board. At the same time, the vacuum generator, together with the air slip ring 8, gas connecting cylinder 7, connecting hole 701, connecting pipe 404 and air extraction pipe 403, extracts the air inside the multiple sets of vacuum suction cups 402, thereby creating a certain degree of negative pressure between the suction nozzle of the vacuum suction cup 402 and the PCB board, which then completes the fixation of the PCB board to be laser-separated. Then, the laser cutting mechanism 2 starts working, first separating multiple PCB boards in a single row on the entire PCB board; After the laser separation is completed, the drive mechanism 3 rotates 180 degrees. At the same time, in the early stage of rotation, the fixed roller 405 of the unloading mechanism 4, which has the shaped PCB single board adsorbed, disengages from the protruding part of the cam 5. Under the action of the spring frame 406, the unloading mechanism 4 as a whole retracts radially relative to the rotating cylinder 303. As the rotating cylinder 303 rotates, the multiple shaped PCB single boards are rotated to the bottom. At this time, the multiple vacuum suction cups 402 of the unloading mechanism 4 are depressurized, and then the multiple shaped PCB single boards are lowered into the inclined unloading box 12. Meanwhile, another set of unloading mechanisms 4 rotates to the top of the rotating cylinder 303 and is in a vertical position. At the same time, the drive rod 301 will also drive the power wheel 901 synchronously. The synchronous rotation of the power wheel 901 will advance the entire PCB board one station through the conveyor belts of the first loading conveyor mechanism 9 and the second loading conveyor mechanism 10, so that the next row of PCB boards will move to the bottom of the laser cutting module 204. Furthermore, the drive wheel 901 rotates 180 degrees, meaning that half the circumference of the drive wheel 901 is consistent with the length of the PCB board. When the rotating cylinder 303 rotates 180 degrees, the entire PCB board will be conveyed forward by the length of one PCB board. Furthermore, even when multiple PCB boards are arranged side by side and continuously fed, the width of the frame can be ignored because each PCB board has a border. Furthermore, the interior of the drive rod 301 near the rotating cylinder 303 is divided into two cavities by a partition 304. One side of each cavity is connected to the two air pipes of the air slip ring 8. An electromagnetic reversing valve is also installed between the air slip ring 8 and the vacuum generator. One end of the two sets of connecting pipes 404 is connected to the two sets of suction pipes 403, and the other end is connected to the gas connecting cylinder 7. The two sets of connecting holes 701 inside the gas connecting cylinder 7 are connected to the two sets of cavities inside the drive rod 301, so that the vacuum suction cups 402 of the two sets of feeding mechanisms 4 can be controlled independently. In summary, the present invention is equipped with a first feeding conveyor mechanism 9 and a second feeding conveyor mechanism 10 as the material conveying carriers. The power wheels 901 of the two conveyor mechanisms are synchronously driven by the drive rod 301 of the drive mechanism 3. Together with the motor 302, cam 5, spring frame 406 and rotating cylinder 303, they form a rotating unloading module. During laser cutting, the vacuum suction cup 402 adsorbs and fixes the finished PCB board. After cutting, the drive mechanism 3 drives the rotating cylinder 303 to rotate 180°, which moves the unloading mechanism adsorbing the finished product to the unloading station and releases the pressure. The finished board automatically falls into the inclined unloading box 12. The remaining material frame that is not adsorbed by the suction cup is continuously output with the conveyor belt, which automatically completes the separation of finished products and waste materials, completely eliminates the manual sorting link, simplifies the production line process, matches the high-speed processing capacity of laser cutting, and improves the continuous automated processing capability of the entire SMT production line. The remaining material frame will continue to move forward with the conveyor belt and eventually fall into the external collection box. At the same time, the connecting board used to connect the PCB boards will also fall into the tilting unloading box 12. Since the tilting unloading box 12 adopts a hollow design, the connecting board will fall through the hollow hole of the tilting unloading box 12 during the falling process, thus completing the rapid separation from the formed PCB board. Among them, the motor 302, vacuum generator, electromagnetic reversing valve, air slip ring 8, various induction sensors, whole machine PLC control system, and laser cutting module 204 motion control unit are all conventional existing electrical control components in this field. Their basic power supply, signal acquisition, motion logic, and vacuum on / off control methods are mature existing technologies, which will not be elaborated in this application.

[0023] Although embodiments of the present invention have been shown and described, these specific embodiments are merely explanations of the invention and are not intended to limit it. The specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. After reading this specification, those skilled in the art may make modifications, substitutions, and variations to the embodiments as needed without departing from the principles and spirit of the invention, but such modifications, substitutions, and variations are protected by patent law as long as they are within the scope of the claims of the present invention.

Claims

1. A laser cutting device for PCB circuit board processing, comprising a frame (1), characterized in that: The top of the frame (1) is equipped with a laser cutting mechanism (2), and the inside of the frame (1) is equipped with a first feeding conveyor mechanism (9) and a second feeding conveyor mechanism (10) on both sides. The first feeding conveyor mechanism (9) and the second feeding conveyor mechanism (10) are used to clamp and convey the entire PCB board. The frame (1) is equipped with a drive mechanism (3), and the drive mechanism (3) includes a drive rod (301) rotatably connected to the inside of the frame (1), and a rotating cylinder (303) is fixed on one side of the drive rod (301). Two sets of feeding mechanisms (4) are connected to the rotating cylinder (303), and the feeding mechanism (4) includes a feeding rack (401) that is elastically and radially slidably connected to the rotating cylinder (303), and multiple sets of vacuum suction cups (402) are installed in parallel on the feeding rack (401). Each set of feeding racks (401) has a fixed roller (405) fixed on the side away from the rotating cylinder (303) at the bottom. The frame (1) has a cam (5) that cooperates with the fixed roller (405) inside. The cam (5) is located outside the drive rod (301) and is fixedly connected to the frame (1) through the fixing bracket (6).

2. The laser cutting equipment for PCB circuit board processing according to claim 1, characterized in that: The laser cutting mechanism (2) includes two sets of brackets (201) fixed on the top of the frame (1), and each set of brackets (201) has a slide rail (202) fixed on the top. The top of the two sets of slide rails (202) is fixed with a movable frame (203), and a laser cutting module (204) is installed on the movable frame (203). The movable frame (203) is driven by a power drive structure and drives the laser cutting module (204) to move back and forth.

3. The laser cutting equipment for PCB circuit board processing according to claim 1, characterized in that: The drive rod (301) is rotatably connected to the frame (1) on both sides by bearings, and a motor (302) with its output end fixedly connected to the drive rod (301) is installed on one side of the frame (1).

4. The laser cutting equipment for PCB circuit board processing according to claim 1, characterized in that: The feeding mechanism (4) also includes an air extraction pipe (403) and a connecting pipe (404). The ports on one side of multiple sets of vacuum suction cups (402) are connected in a centralized manner through the air extraction pipe (403), and the connecting pipe (404) is connected to the air extraction pipe (403). The connecting pipe (404) is a metal corrugated hose.

5. The laser cutting equipment for PCB circuit board processing according to claim 4, characterized in that: The drive rod (301) has a hollow structure on the side near the rotating cylinder (303), and its interior is divided into two cavities by a partition (304). The drive rod (301) is fixed with a gas communication cylinder (7) on the outside. The gas communication cylinder (7) has two sets of communication holes (701) that are connected to two sets of cavities respectively. The gas communication cylinder (7) also has two sets of cavities. The two sets of cavities in the gas communication cylinder (7) are connected to two sets of communication pipes (404) respectively.

6. The laser cutting equipment for PCB circuit board processing according to claim 5, characterized in that: A slip ring (8) is installed on one side of the drive rod (301), and the fixed ring of the slip ring (8) is fixedly connected to the frame (1), the movable ring is fixedly connected to the drive rod (301), and the two sets of air pipes on the movable ring are respectively connected to the two sets of cavities inside the drive rod (301). The fixed ring is connected to an external vacuum generating device via a pipe, and an electromagnetic reversing valve is installed between the fixed ring and the vacuum generating device.

7. The laser cutting equipment for PCB circuit board processing according to claim 1, characterized in that: The first feeding and conveying mechanism (9) includes a power wheel (901), two sets of driven wheels and a conveyor belt, wherein the power wheel (901) is fixed on the drive rod (301); The second feeding and conveying mechanism (10) includes two sets of conveying wheels and a conveyor belt. The drive rod (301) and one of the sets of conveying wheels transmit power through a gear transmission structure or are equipped with an external drive module.

8. The laser cutting equipment for PCB circuit board processing according to claim 1, characterized in that: The feeding mechanism (4) also includes a spring frame (406), which is fixed between the feeding frame (401) and the rotating cylinder (303) and is used to reset the feeding frame (401) after it is disengaged from the cam (5) limit.

9. The laser cutting equipment for PCB circuit board processing according to claim 1, characterized in that: The bottom of the frame (1) is fixed with a base (11), and the base (11) is made of multiple sets of square tubes spliced ​​and welded together.

10. The laser cutting equipment for PCB circuit board processing according to claim 9, characterized in that: The base (11) is equipped with an inclined feeding box (12), and the inclined feeding box (12) adopts a hollow design.

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