A thermal control system and temperature dynamic regulation method for a high-power on-board device

CN122877375APending Publication Date: 2026-10-09SICHUAN JINGCHEN FUTURE AEROSPACE TECHNOLOGY CO LTD
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Patent Information

Application Number
CN202611237684.6
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2026-08-14
Publication Date
2026-10-09

AI Technical Summary

Benefits of technology

(1)本发明通过相变储能模块、气液两相槽道热管和辐射板等结构实现了物理热调控的效果,同时,本发明通过动态控制可调电致变色窗的电压,可以协同改变安装板的辐射散热能力,进而协同动态调整对星上设备降温或者热补偿与保温,实现了轻量化、低资源需求、模块化、可调散热能力的协同热控。具体地,本发明不再是单纯的隔热或散热设计,而是面向周期性工作这一特性,通过多种热量传递形式协同强化传热路径;根据卫星实时散热需求,动态调整在轨散热能力。与流体回路这类复杂热控技术相比,本发明无需额外热控资源,且实现了模块化、小型化设计,具有较好的实用性。

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Abstract

The application discloses a kind of thermal control system and temperature dynamic regulation and control method of high-power on-board equipment, belong to the technical field of high-power satellite equipment heat management, the thermal control system includes mounting plate, radiation plate, adjustable electrochromic window and gas-liquid two-phase channel heat pipe;The inside of the mounting plate is correspondingly embedded with phase change energy storage module, the other side of the mounting plate is provided with radiation plate, the middle part of the mounting plate is provided with a plurality of gas-liquid two-phase channel heat pipes between radiation plate;Adjustable electrochromic window is arranged on the mounting plate in the non-mounting area of gas-liquid two-phase channel heat pipe;The adjustable electrochromic window is connected with control unit;The outer surface of the mounting plate and the outer side of the radiation plate are respectively sprayed with high-emissivity heat dissipation coating.The voltage of adjustable electrochromic window can be dynamically controlled by the application, which can dynamically adjust the cooling or thermal compensation and heat preservation of on-board equipment, realize the lightweight, low resource demand, modularization, adjustable heat dissipation capacity of collaborative thermal control.
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Description

Technical Field

[0001] This invention belongs to the technical field of thermal management of high-power satellite equipment, specifically relating to a thermal control system and a method for dynamic temperature regulation of high-power on-board equipment. Background Technology

[0002] Currently, most satellite thermal control solutions for high-power onboard equipment employ a passive approach, directly mounting the equipment onto a heat dissipation surface. While this approach is suitable for equipment that operates continuously in orbit, it requires a large heat dissipation area to meet the cooling needs of periodically operating high-power equipment. This leads to a surge in thermal control power consumption during non-operating periods, increasing energy demands. If an active cooling system using a fluid loop is employed, on the one hand, the fluid loop itself and its associated radiating plates significantly increase the satellite's weight. On the other hand, the start and stop of the fluid loop-driven pumps must be coordinated with the periodic operation of the high-power equipment; frequent start-stop cycles causing jitter and rotation increase the difficulty of satellite attitude control, reducing pointing accuracy and stability. Summary of the Invention

[0003] The purpose of this invention is to provide a thermal control system and a dynamic temperature regulation method for high-power on-board equipment, aiming to achieve coordinated thermal control with lightweight, low resource requirements, modularity, and adjustable heat dissipation capabilities for satellite equipment with instantaneous operating heat consumption in the range of 100~200W.

[0004] This invention is mainly achieved through the following technical solutions: A thermal control system for a high-power on-board device includes a mounting plate, a radiating plate, an adjustable electrochromic window, and a gas-liquid two-phase channel heat pipe. The on-board device is mounted on one side of the mounting plate, and a phase-change energy storage module is pre-embedded inside the mounting plate corresponding to the on-board device. A radiating plate is located on the other side of the mounting plate. Several gas-liquid two-phase channel heat pipes are arranged sequentially from top to bottom between the mounting plate and the radiating plate in the middle of the mounting plate. The two sides of the gas-liquid two-phase channel heat pipes are connected to the mounting plate and the radiating plate respectively via fins. An adjustable electrochromic window is located on the mounting plate in the non-mounting area of ​​the gas-liquid two-phase channel heat pipes. The adjustable electrochromic window is connected to a control unit, which dynamically adjusts the infrared transmittance of the adjustable electrochromic window through voltage control. A high-emissivity heat dissipation coating is sprayed onto the outer surface of the mounting plate and the outer side of the radiating plate.

[0005] To better realize the present invention, the adjustable electrochromic window further includes a conductive substrate, an electrochromic layer and an ion storage layer, wherein the electrochromic layer and the ion storage layer are sequentially disposed inside the conductive substrate; the conductive substrate is ITO-plated quartz glass or FTO-plated quartz glass, the ion storage layer is a lithium-based salt or a sodium-based salt, and the electrochromic layer is an inorganic electrochromic material.

[0006] To better realize the present invention, the two ends of the other side of the mounting plate are further connected to the adjustable electrochromic window via heat insulation pads.

[0007] To better realize the present invention, the heat insulation pad is further made of fiberglass or polyimide.

[0008] To better realize the present invention, the mounting plate is a composite lattice sandwich material, the phase change energy storage module includes a metal shell and a phase change material disposed inside the metal shell; the radiating plate is an alloy plate or an aluminum honeycomb plate.

[0009] To better realize the present invention, high thermal conductivity fillers are further provided between the mounting plate and the on-board equipment, between the fins and the mounting plate, and between the fins and the radiation plate.

[0010] To better realize the present invention, the high thermal conductivity filler is further described as thermally conductive silicone grease or thermally conductive pad.

[0011] This invention is mainly achieved through the following technical solutions: A method for dynamic temperature control of high-power on-board equipment, based on the aforementioned thermal control system of such equipment, employs a pulse width modulation or graded gradual voltage increase strategy to dynamically adjust the voltage of an adjustable electrochromic window. When T <T l Furthermore, when T shows a continuous decreasing trend, the voltage U of the adjustable electrochromic window is continuously increased until T≥T. l Or U=U max Maintain the current voltage and stabilize the output voltage; When T>T l Furthermore, when T continues to rise and ΔT ≥ the threshold, the voltage U of the adjustable electrochromic window is continuously reduced until U = U min Alternatively, if T starts to decrease, maintain the current voltage and stabilize the output; Wherein: T l The lower operating temperature; T represents the temperature of the onboard equipment; U min This is the minimum allowable voltage value; U max This is the maximum allowable voltage. ΔT is the rate of temperature change of the onboard equipment.

[0012] To better realize the present invention, the temperature change rate when the on-board equipment is powered on is further used as the threshold of the temperature change rate.

[0013] To better realize the present invention, the heat generated by the on-board equipment during operation is sequentially transferred to the phase change energy storage module, the gas-liquid two-phase channel heat pipe and the radiant plate, and radiated into space through a high emissivity heat dissipation coating; when the temperature of the phase change energy storage module is less than or equal to the phase change temperature, the latent heat of phase change inside the phase change energy storage module begins to be released to provide thermal compensation for the on-board equipment.

[0014] The beneficial effects of this invention are as follows: (1) This invention achieves physical thermal regulation through structures such as phase change energy storage modules, gas-liquid two-phase channel heat pipes, and radiant plates. Simultaneously, by dynamically controlling the voltage of the adjustable electrochromic window, this invention can synergistically change the radiative heat dissipation capacity of the mounting plate, thereby dynamically adjusting the cooling or thermal compensation and insulation of onboard equipment. This achieves lightweight, low-resource-demand, modular, and adjustable heat dissipation capacity through synergistic thermal control. Specifically, this invention is no longer a simple insulation or heat dissipation design, but rather addresses the characteristic of periodic operation by synergistically strengthening the heat transfer path through multiple heat transfer methods; and dynamically adjusting the on-orbit heat dissipation capacity according to the satellite's real-time heat dissipation needs. Compared with complex thermal control technologies such as fluid loops, this invention requires no additional thermal control resources and achieves modular and miniaturized design, making it highly practical.

[0015] (2) This invention can dynamically adjust the satellite's heat dissipation capacity, reducing the thermal shock to the satellite caused by periodically operating high-power on-board equipment before and after power-on and power-off. Specifically, this invention continuously adjusts the voltage of the electrochromic window to change its infrared transmittance, ensuring both heat dissipation during operation and insulation during power-off. Furthermore, its ability to maintain stable voltage output further reduces the power consumption required for temperature control during power-off. This invention fully utilizes the satellite's own structure, reducing the satellite's weight and energy costs. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the thermal control system of the high-power on-board equipment of the present invention; Figure 2 A schematic diagram of the adjustable electrochromic window; Figure 3 This is a flowchart of the dynamic temperature control method for high-power on-board equipment according to the present invention; Figure 4 This is the temperature change curve of the device in Example 2.

[0017] Among them: 1-High thermal conductivity filler, 2-Phase change energy storage module, 3-Gas-liquid two-phase channel heat pipe, 4-Radiation plate, 5-Mounting plate, 6-On-board equipment, 7-Adjustable electrochromic window, 71-Conductive substrate, 72-Electrochromic layer, 73-Ion storage layer, 8-Insulation pad, 9-Temperature sensor, 10-Control unit. Detailed Implementation

[0018] Example 1: A thermal control system for high-power on-board equipment, such as Figure 1 As shown, it includes: a high thermal conductivity filler 1, a phase change energy storage module 2, a gas-liquid two-phase channel heat pipe 3, a radiant plate 4, an adjustable electrochromic window 7, a heat insulation pad 8, a temperature sensor 9, and a control unit 10.

[0019] like Figure 1 As shown, an on-board device 6 is installed on the left side of the mounting plate 5, and a high thermal conductivity filler 1 is provided between the mounting plate 5 and the on-board device 6. A phase change energy storage module 2 is pre-embedded in the center of the interior of the mounting plate 5. A radiant plate 4 is provided on the right side of the mounting plate 5, and several gas-liquid two-phase channel heat pipes 3 are arranged sequentially from top to bottom in the middle between the mounting plate 5 and the radiant plate 4. Adjustable electrochromic windows 7 are respectively provided at both ends of the right side of the mounting plate 5 located in the non-installation area of ​​the gas-liquid two-phase channel heat pipes 3, and several heat insulation pads 8 are provided between the adjustable electrochromic windows 7 and the mounting plate 5.

[0020] Preferably, the gas-liquid two-phase channel heat pipe 3 has double fins. One end of the fin is coated with high thermal conductivity filler 1 and installed on the outer surface of the mounting plate 5 in an area without adjustable electrochromic window 7. The other end of the fin is coated with high thermal conductivity filler 1 and installed on the inner side of the radiating plate 4. The outer side of the radiating plate 4 is sprayed with a high emissivity heat dissipation coating.

[0021] Specifically, a high thermal conductivity filler 1 is applied to the mounting surface of the on-board equipment 6, and the mounting surface of the on-board equipment 6 is mounted on the mounting plate 5; the mounting plate 5 has a corresponding pre-embedded phase change energy storage module 2, and the outer surface of the mounting plate 5 is sprayed with a high emissivity heat dissipation coating. The mounting plate 5 is fixed to the adjustable electrochromic window 7 by a heat insulation pad 8, and the adjustable electrochromic window 7 is voltage controlled by the control unit 10 to achieve dynamic adjustment.

[0022] Preferably, the mounting plate 5 is a composite lattice sandwich material such as an aluminum honeycomb panel; The high thermal conductivity filler 1 is a high thermal conductivity material such as thermal grease or thermal pad. The phase change energy storage module 2 has a high thermal conductivity magnesium and aluminum alloy-like metal shell and is filled with phase change material inside. The radiant plate 4 is a high thermal conductivity alloy plate such as an aluminum plate or a copper plate, or an aluminum honeycomb plate; like Figure 2As shown, the adjustable electrochromic window 7 includes a conductive substrate 71, an electrochromic layer 72, and an ion storage layer 73. The electrochromic layer 72 and the ion storage layer 73 are sequentially disposed inside the conductive substrate 71. The conductive substrate 71 of the adjustable electrochromic window 7 is ITO or FTO plated quartz glass, the ion storage layer 73 is lithium-based or sodium-based salt, and the electrochromic layer 72 is an inorganic electrochromic material. The heat insulation pad 8 is made of fiberglass or polyimide, etc.

[0023] During operation, when the on-board device 6 operates and generates heat, the heat is conducted to the phase change energy storage module 2 through the high thermal conductivity filler 1. The phase change energy storage module 2 absorbs heat, its temperature rises to the phase change temperature, and a phase change occurs. The heat is continuously absorbed as latent heat, and the temperature of the on-board device 6 tends to stabilize. After the phase change energy storage module 2 completes the phase change, the heat is transferred to the gas-liquid two-phase channel heat pipe 3, and then to the radiating plate 4. The radiating plate 4, facing the cold background surface of space, is coated with a high emissivity heat dissipation coating, radiating heat into space. When the on-board device 6 stops operating, the phase change energy storage module 2 begins to cool down while the gas-liquid two-phase channel heat pipe 3 continues to transfer heat to the radiating plate 4. When the temperature drops to the phase change temperature, the latent heat of the phase change begins to be released, providing thermal compensation for the on-board device 6. Throughout this process, the temperature of the on-board device 6 is monitored in real time, and the voltage of the adjustable electrochromic window 7 is dynamically controlled to achieve coordinated dynamic adjustment of cooling, thermal compensation, and insulation of the on-board device 6.

[0024] Example 2: A method for dynamic temperature control of high-power on-board equipment involves dynamically adjusting the voltage of an adjustable electrochromic window 7 based on the temperature feedback from the temperature sensor 9 on the on-board equipment 6. This changes the infrared transmittance of the adjustable electrochromic window 7, thereby altering the radiative heat dissipation capacity of the mounting plate 5. The control logic is as follows: When the equipment temperature T is lower than the lower operating limit temperature T l As the voltage continues to decrease, the control unit 10 continuously increases the voltage U until T ≥ T. l Maintain the current regulated output, but the voltage must not exceed the maximum allowable value U. max ; When T is higher than T l And it continues to show an upward trend and the rate of temperature change Time (e.g.) The temperature change rate when the equipment is turned on (the specific value can be obtained through whole-satellite thermal simulation and ground vacuum environment thermal balance test). The control unit 10 continuously reduces the voltage until the minimum allowable value U is reached. min .

[0025] Specifically, the adjustable electrochromic window 7 has a voltage range of 0.2 to 3V depending on the electrochromic material used. Therefore, the control unit 10 selects a drive power supply with a range of 0.2 to 3V, an output step of ≤10mV, and a resolution of ≥12 bits, and adopts a pulse width modulation (PWM) or graded gradual voltage increase drive strategy to ensure its voltage regulation requirements.

[0026] As the voltage of the adjustable electrochromic window 7 decreases, its surface gradually lightens until it becomes transparent. When the voltage reaches its minimum value, it becomes nearly transparent, at which point the infrared transmittance reaches its maximum of approximately 0.8 and the visible light transmittance reaches its maximum of approximately 0.52. At this point, the mounting plate 5 radiates heat into space unimpeded. When the voltage of the adjustable electrochromic window 7 reaches its maximum value, its surface becomes grayish-black, at which point the infrared transmittance reaches its minimum of approximately 0.53 and the visible light transmittance reaches its minimum of 0.02, reducing the heat dissipation capacity of the mounting plate 5 into space and providing insulation.

[0027] Preferably, such as Figure 3 As shown, the dynamic temperature control method includes the following steps: (1) The on-board equipment 6 starts working and executes steps (2) and (3) in parallel. (2) The voltage of the adjustable electrochromic window 7 is dynamically adjusted by adopting a pulse width modulation or graded gradual voltage increase driving strategy; (21) When T>T l Furthermore, when T continues to rise and ΔT ≥ the threshold, the voltage U of the adjustable electrochromic window 7 is continuously reduced until U = U min Alternatively, if voltage T starts to decrease, maintain the current voltage and stabilize the output; otherwise, maintain the status quo. (22) When T <T l Furthermore, when T shows a continuous decreasing trend, the voltage U of the adjustable electrochromic window 7 is continuously increased until T≥T l Or U=U max If the voltage is maintained, the current voltage will be stabilized and the output will be regulated; otherwise, the status quo will be maintained.

[0028] (3) At the same time, when the temperature of the phase change energy storage module 2 rises to the phase change temperature, the phase change energy storage module 2 undergoes a phase change, and the heat is continuously absorbed in the form of latent heat, so that the temperature of the on-board equipment 6 tends to stabilize; when the phase change energy storage module 2 completes the phase change, the phase change energy storage module 2 transfers the heat to the radiation plate 4 through the gas-liquid two-phase channel heat pipe 3, and then radiates heat to space through the high emissivity heat dissipation coating.

[0029] The phase change energy storage module 2 begins to cool down as the gas-liquid two-phase channel heat pipe 3 continuously transfers heat to the radiant cooling plate. When the temperature of the phase change energy storage module 2 drops to the phase change temperature, the latent heat of phase change inside the phase change energy storage module 2 begins to be released to provide thermal compensation for the on-board equipment 6.

[0030] This invention has been applied to a certain satellite model. The on-board device 6 is a periodic working device with a power consumption of about 150W and an operating temperature range of 5~50℃, with an optimal operating temperature range of 30~40℃. Due to the overall layout of the satellite, the device cannot be installed on the main heat dissipation surface and can only be installed on the windward side. Therefore, a phase change energy storage module 2 is pre-embedded inside its mounting plate 5, and a gas-liquid two-phase channel heat pipe 3 is attached to the outside of the mounting plate 5 for thermal connection with the satellite's main heat dissipation surface. High thermal conductivity filler 1 is applied between all components to enhance the heat conduction process. An adjustable electrochromic window 7 is heat-insulated and installed on the outside of the mounting plate 5. The specific technical parameters are shown in Table 1.

[0031] Test verification, such as Figure 4 As shown, three types of comparative test groups were set up during the simulation phase: Option I (Traditional thermal control scheme): The heat-conducting device is installed on the inner surface of +X, and heat dissipation surfaces are opened on the +X, +Y, and +Z surfaces. The results show that after about 400 seconds of operation, the device temperature reaches 50℃, and after 1800 seconds, the temperature reaches 75℃. When the device is not in operation, the long-term thermal control power consumption of the satellite is 45W.

[0032] Option II (Traditional Thermal Control Option): Based on Option I, the heat dissipation area of ​​the +Z panel is reduced by half. A gas-liquid two-phase channel heat pipe 3 is attached to the outer surface of the +X panel and connected to the +Y heat dissipation surface to further enhance the heat dissipation of the equipment. The results show that after about 1000 seconds of operation, the equipment temperature reaches 50℃, and after 1800 seconds of operation, the temperature reaches 60℃. When the equipment is not in operation, the long-term thermal control power consumption of the satellite is 37W.

[0033] This scheme: The equipment is thermally conductively installed on the inner surface of the +X compartment panel, with a phase change energy storage module 2 pre-embedded inside. The outer surface of the +X compartment panel is sprayed with white paint and surface-mounted with channel heat pipes connected to the +Y heat dissipation surface. The adjustable electrochromic window 7 is installed with thermal insulation between itself and the outer surface of the +X compartment panel, avoiding the channel heat pipe installation area. The remaining outer surface is covered with multiple layers. When the equipment starts working, the voltage of the adjustable electrochromic window is adjusted in a closed loop according to the temperature change rate feedback value to increase its infrared transmittance. The results show that when the temperature of the equipment reaches about 30℃, the temperature rise rate is significantly reduced due to the phase change energy storage, thereby suppressing the temperature rise of the equipment. After working for 1800s, the temperature reaches 37℃. After the equipment stops working, the release of the latent heat of phase change causes the equipment temperature to plateau. After the equipment is shut down, thermal compensation is performed. After the latent heat of phase change is released, the equipment temperature begins to drop sharply. When it is below the lower limit of the operating temperature, the voltage of the adjustable electrochromic window is adjusted in a closed loop according to the equipment temperature sensor to reduce its infrared transmittance. Finally, the long-term thermal control power consumption of the satellite is 17W.

[0034] Scheme I and Scheme II are commonly used thermal control design schemes, such as Figure 4 As shown in Table 2, the simulation results show that by adopting the proposed solution (this solution), the working time of the on-board equipment 6 can be extended by up to 77.8%, the peak temperature drops by 50.7% after 1800s of operation, and the power consumption of the satellite thermal control can be reduced by up to 62.2% when the equipment is not in operation. Moreover, this solution can be achieved entirely by relying on the satellite's own structure without the need to add an additional heat dissipation structure.

[0035] Table 1 Technical parameters of specific components

[0036] Table 2 Simulation test results

[0037] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention in any way. Any simple modifications or equivalent changes made to the above embodiments based on the technical essence of the present invention shall fall within the protection scope of the present invention.

Claims

1. A thermal control system for a high-power on-board device, characterized in that, The system includes a mounting plate (5), a radiant plate (4), an adjustable electrochromic window (7), and gas-liquid two-phase channel heat pipes (3); an on-board device (6) is installed on one side of the mounting plate (5), and a phase change energy storage module (2) is pre-embedded inside the mounting plate (5) corresponding to the on-board device (6); a radiant plate (4) is provided on the other side of the mounting plate (5), and several gas-liquid two-phase channel heat pipes (3) are arranged sequentially from top to bottom between the middle of the mounting plate (5) and the radiant plate (4), and the gas-liquid two-phase channel heat pipes... The two sides of the tube (3) are connected to the mounting plate (5) and the radiation plate (4) respectively through fins; an adjustable electrochromic window (7) is provided on the mounting plate (5) located in the non-installation area of ​​the gas-liquid two-phase channel heat pipe (3); the adjustable electrochromic window (7) is connected to the control unit (10), and the control unit (10) is used to dynamically adjust the infrared transmittance of the adjustable electrochromic window (7) through voltage control; the outer surface of the mounting plate (5) and the outer side of the radiation plate (4) are respectively sprayed with a high emissivity heat dissipation coating.

2. The thermal control system for a high-power on-board device according to claim 1, characterized in that, The adjustable electrochromic window (7) includes a conductive substrate (71), an electrochromic layer (72), and an ion storage layer (73). The conductive substrate (71) is provided with the electrochromic layer (72) and the ion storage layer (73) in sequence. The conductive substrate (71) is ITO-plated quartz glass or FTO-plated quartz glass, the ion storage layer (73) is lithium-based salt or sodium-based salt, and the electrochromic layer (72) is an inorganic electrochromic material.

3. A thermal control system for a high-power on-board device according to claim 1 or 2, characterized in that, The two ends of the other side of the mounting plate (5) are connected to the adjustable electrochromic window (7) via heat insulation pads (8).

4. The thermal control system for a high-power on-board device (6) according to claim 3, characterized in that, The heat insulation pad (8) is made of fiberglass or polyimide.

5. The thermal control system for a high-power on-board device according to claim 1, characterized in that, The mounting plate (5) is a composite lattice sandwich material, the phase change energy storage module (2) includes a metal shell and a phase change material disposed inside the metal shell; the radiating plate (4) is an alloy plate or an aluminum honeycomb plate.

6. A thermal control system for a high-power on-board device according to claim 1 or 5, characterized in that, High thermal conductivity fillers (1) are respectively provided between the mounting plate (5) and the on-board equipment (6), between the fins and the mounting plate (5), and between the fins and the radiation plate (4).

7. The thermal control system for a high-power on-board device according to claim 6, characterized in that, The high thermal conductivity filler (1) is thermally conductive silicone grease or thermally conductive pad.

8. A method for dynamic temperature control of high-power on-board equipment, based on the thermal control system of a high-power on-board equipment as described in any one of claims 1 to 7, characterized in that, The voltage of the adjustable electrochromic window (7) is dynamically adjusted by employing a pulse width modulation or graded gradual voltage increase driving strategy: When T <T l When T shows a continuous decreasing trend, the voltage U of the adjustable electrochromic window (7) is continuously increased until T≥T l Or U=U max Maintain the current voltage and stabilize the output voltage; When T>T l Furthermore, T continues to rise, and when ΔT ≥ the threshold, the voltage U of the adjustable electrochromic window (7) is continuously reduced until U = U min Alternatively, if T starts to decrease, maintain the current voltage and stabilize the output; Wherein: T l The lower operating temperature; T represents the temperature of the onboard equipment (6); U min This is the minimum allowable voltage value; U max This is the maximum allowable voltage. ΔT is the temperature change rate of the onboard equipment (6).

9. The method for dynamic temperature control of high-power on-board equipment according to claim 8, characterized in that, The temperature change rate when the on-board equipment (6) is turned on is used as the threshold of the temperature change rate.

10. The method for dynamic temperature control of high-power on-board equipment according to claim 8, characterized in that, The heat generated by the on-board equipment (6) during operation is sequentially transferred to the phase change energy storage module (2), the gas-liquid two-phase channel heat pipe (3) and the radiation plate (4), and is radiated into space through a high emissivity heat dissipation coating; when the temperature of the phase change energy storage module (2) is less than or equal to the phase change temperature, the latent heat of phase change inside the phase change energy storage module (2) begins to be released to provide thermal compensation for the on-board equipment (6).