A fully automatic plastic packaging machine and a packaging method thereof

Abstract

The application relates to the technical field of packaging machines, in particular to a full-automatic plastic packaging machine and a packaging method thereof. The full-automatic plastic packaging machine comprises a mounting shell, a plurality of storage cabinets are arranged in the mounting shell, semiconductor workpieces are arranged in the storage cabinets, a base is arranged on one side of the storage cabinets, a clamping and conveying mechanism is arranged above the base, a workbench is arranged on one side of the base, a supporting mechanism is arranged at the top of the workbench, a mounting frame is arranged at the top of the workbench, the mounting frame is arranged around the supporting mechanism, liftable cutting knives are arranged around the top of the mounting frame, and a film is arranged between the cutting knives and the supporting mechanism. The flexible film cleaning and protection mechanism is introduced, and a plurality of means such as rotary throwing, negative pressure adsorption and vibration beating are combined, so that efficient and low-loss cleaning of the semiconductor workpieces before plastic pressing is realized, and the machining cleanliness, the production efficiency and the equipment stability are improved by matching the automatic transmission and the waste recovery structure.

Description

Technical Field

[0001] This invention relates to the field of packaging machine technology, and in particular to a fully automatic plastic sealing packaging machine and its packaging method. Background Technology

[0002] In the processing and loading of semiconductor workpieces, due to the small overall thickness and insufficient rigidity of the workpieces, existing clamping devices are prone to causing local deformation of the workpieces when applying clamping force. This leads to slippage at the contact interface, affecting clamping stability and easily causing scratches on the workpiece surface, thus reducing product yield. Furthermore, the lack of effective buffering and protection measures during clamping makes surface damage during repeated positioning and transfers of the workpieces even more pronounced.

[0003] In addition, semiconductor workpieces with complex surface structures that easily adsorb fine particles are highly susceptible to contamination by dust in the environment during loading and transfer. Existing cleaning methods mostly use blowers or brushes, which not only fail to completely remove particles attached to the microstructure, but may also cause new contamination or damage due to airflow disturbances or mechanical contact, making it difficult to meet the requirements of high-cleanliness processing. Summary of the Invention

[0004] The purpose of this invention is to solve the above-mentioned problems existing in the prior art, and to propose a fully automatic plastic sealing packaging machine and its packaging method.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: a fully automatic plastic sealing packaging machine, comprising a mounting housing, wherein a plurality of storage cabinets are placed inside the mounting housing, and semiconductor workpieces are placed inside the storage cabinets. A base is placed on one side of each of the storage cabinets, and a clamping and transporting mechanism is provided above the base. A working platform is provided on one side of the base, and a support mechanism is provided at the top of the working platform. An mounting frame is installed at the top of the working platform, and the mounting frame is arranged around the support mechanism. A liftable cutting blade is provided around the top of the mounting frame, and a film is provided between the cutting blade and the support mechanism. The mounting frame is provided with a transfer mechanism installed on the top of the work platform on one side. The working end of the transfer mechanism is equipped with a first electromagnet and a second electromagnet. The lower end of the first electromagnet is fixed to the mounting block by magnetic attraction. The lower end of the mounting block is equipped with a fan. The mounting block is equipped with a dust removal mechanism around its perimeter. The dust removal mechanism includes several second clamping plates. The second clamping plates are connected to the side wall of the mounting block through an adjustment component. A dust collection device is fixedly installed on the second clamping plates. The input end of the dust collection device is equipped with a dust collection port. The work platform is equipped with an injection molding mechanism on the side away from the base.

[0006] Preferably, the clamping and transporting mechanism includes a first conveyor belt located at the top of the base, and first lead screws arranged vertically on both sides of the base. The moving end of the first lead screw is fixedly connected to a slot, which clamps and fixes the storage cabinet from both sides.

[0007] Preferably, the supporting mechanism includes a support frame located at the top of the work platform. The support frame is connected to the work platform via several second electric telescopic rods. A second conveyor belt installed at the top of the work platform is provided inside the support frame. The second conveyor belt moves in the same direction as the first conveyor belt and they are close to each other.

[0008] Preferably, the transfer mechanism includes a rotating platform mounted on the top of the work platform, a fixed plate connected to the top of the rotating platform, a second hydraulic rod mounted on the side of the fixed plate near the mounting frame, the telescopic end of the second hydraulic rod being connected to a second electromagnet, a rotating rod rotatably connected to the top of the fixed plate, the rotating rod being driven to rotate by a first self-locking motor fixedly mounted on the fixed plate, a first hydraulic rod fixedly connected to the end of the rotating rod away from the fixed plate, and the telescopic end of the first hydraulic rod being connected to a first electromagnet.

[0009] Preferably, a positioning mechanism is provided around the mounting block. The positioning mechanism includes several first clamping plates. The first clamping plates are connected to the side wall of the mounting block through a third electric telescopic rod. A fifth electric telescopic rod is installed inside the first clamping plate. The telescopic end of the fifth electric telescopic rod is connected to a fixing pin. The fixing pin moves through the bottom wall of the first clamping plate.

[0010] Preferably, the adjustment assembly includes a third self-locking motor installed inside the mounting block, the third self-locking motor being connected to a fourth electric telescopic rod via a reducer, and the telescopic end of the fourth electric telescopic rod being connected to the second clamping plate.

[0011] Preferably, the end of the suction port is designed to be flat and faces the film side.

[0012] Preferably, a waste collection box is provided on one side of the working platform. Inside the waste collection box are two parallel mounting plates. Both mounting plates are fixedly connected to the working platform, and a connecting plate is rotatably mounted at the end of each mounting plate. The connecting plate is driven to rotate by a second self-locking motor mounted on the mounting plate. A rubber roller is rotatably mounted between the two connecting plates. The rubber roller is driven to rotate by a power device mounted on the connecting plate.

[0013] Preferably, the injection molding mechanism includes a lifting device, which is slidably connected to the bottom wall of the mounting housing via a slide rail. A lower mold is installed at the top of the lifting device, and an upper mold is installed on the top wall of the mounting housing above the lower mold. The lower mold and the upper mold cooperate with each other, and a cooling device is provided on one side of the lifting device.

[0014] A packaging method using a fully automatic plastic sealing packaging machine includes the following packaging steps: S1. Insert the storage cabinet into the slot, adjust its position using the first lead screw, so that the lowest semiconductor workpiece contacts the first conveyor belt, and then, together with the first and second conveyor belts, transport it directly below the film. S2. Adjust the third and fourth electric telescopic rods so that the first clamping plate and the second clamping plate are located on the outer side and edge of the workpiece, respectively. Start the first hydraulic rod to press down and achieve initial fixation by piercing the film with the fixing needle. S3. Activate the first and second electric telescopic rods to bring the cutting blade close to the support frame and cut the film, so that the film covers the surface of the semiconductor workpiece; S4. Continue to press down the first hydraulic rod to move the second clamping plate down along the edge and clamp the semiconductor workpiece. At the same time, adjust the third electric telescopic rod to clamp the first clamping plate on other parts, so as to achieve tight film adhesion and workpiece protection. S5. Lift the mounting block, start the first self-locking motor and the rotating table, so that the semiconductor workpiece is flipped and moved above the waste collection box, and the surface particles are thrown off and attached to the film under centrifugal force. S6. Release the second clamping plate and rotate the suction port between the film and the semiconductor workpiece. Start the suction device and swing it in conjunction with the rotating rod to achieve particle adsorption or drop into the waste collection box. S7. Start the fan to make the thin film vibrate and beat the surface of the semiconductor workpiece and form a negative pressure zone of airflow, which further removes residual particles and is adsorbed or collected to achieve non-destructive cleaning. S8. Flip the mounting block again to place the workpiece between the lower mold and the upper mold. Transfer is achieved by switching the second hydraulic rod and the electromagnet. Release the clamping plate, place the workpiece in the lower mold to complete the loading, and perform injection molding and cooling. S9. During the injection molding process, the rotating table moves the mounting block above the waste collection box, starts the rubber roller and related motor to peel the film from the clamping plate and roll it into the waste collection box, and the reset device prepares for the next cycle.

[0015] Compared with existing technologies, the advantages of this invention are: 1. This application introduces a thin film over the semiconductor workpiece for covering, which effectively isolates external dust particles during the loading and transfer process, preventing micro-contamination from directly adhering to the workpiece surface. At the same time, the thin film replaces the rigid clamping surface, so that the first clamping plate and the second clamping plate do not need to directly contact the workpiece, reducing the risk of scratches caused by friction, and improving the surface cleanliness and integrity of the product from the source. It is especially suitable for the processing needs of high-precision semiconductor devices.

[0016] 2. This application uses the combined rotation of the rotating table and the rotating rod to cause the surface particles of the semiconductor workpiece to be thrown off under the action of centrifugal force, and then adsorbed and collected by the thin film. At the same time, the dust suction port and the dust suction device are used for synchronous cleaning, realizing a multi-stage cleaning method of throwing off, adsorption and collection. Compared with the traditional single blowing or adsorption method, the cleaning is more thorough and avoids secondary pollution of particles, thus improving the overall cleaning efficiency.

[0017] 3. This application utilizes a fan to drive the thin film to generate periodic vibrations, which in turn flexibly tap the surface of the semiconductor workpiece. Without causing hard contact damage, it effectively shakes off fine particles attached to the unevenness of the microstructure. At the same time, the thin film can penetrate into the gaps of the microstructure during the bonding process, eliminating dead corners that are difficult to reach by traditional cleaning methods, improving the cleaning effect at the micro level, and ensuring the stability of device performance.

[0018] 4. This application achieves automatic transfer of semiconductor workpieces from storage and cleaning to loading and molding by using an electromagnetic adsorption structure in conjunction with a hydraulic drive and rotation mechanism. This reduces manual intervention and repetitive positioning errors. At the same time, the close linkage between the various actuators ensures seamless connection between the cleaning and molding processes, improving production cycle and processing consistency. This is suitable for large-scale continuous production scenarios.

[0019] 5. This application uses a rubber roller to wind and release the used film, causing it to automatically detach from the clamping structure and fall into the waste collection bin. At the same time, the fixing pin can retract to avoid interference, realizing centralized treatment of waste, preventing residual pollution of the equipment environment, ensuring the long-term stability and cleanliness of the device, reducing maintenance costs and improving the overall reliability of the equipment.

[0020] In summary, this application achieves efficient and low-damage cleaning of semiconductor workpieces before compression molding by introducing a flexible film cleaning and protection mechanism and combining it with various methods such as rotational ejection, negative pressure adsorption, and vibration tapping. At the same time, the automated transmission and waste recycling structure improves the cleanliness of the process, production efficiency, and equipment stability. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the overall structure of a fully automatic plastic sealing packaging machine proposed in this invention; Figure 2This is a schematic diagram of the internal structure of a fully automatic plastic sealing packaging machine proposed in this invention; Figure 3 This is a cross-sectional view of the mounting housing of a fully automatic plastic sealing packaging machine proposed in this invention; Figure 4 This is a schematic diagram of the storage cabinet of a fully automatic plastic sealing packaging machine proposed in this invention; Figure 5 This is a schematic diagram of the upper and lower molds of a fully automatic plastic sealing packaging machine proposed in this invention; Figure 6 This is a schematic diagram of the mounting frame of a fully automatic plastic sealing packaging machine proposed in this invention; Figure 7 This is an exploded view of the mounting frame of a fully automatic plastic sealing packaging machine proposed in this invention; Figure 8 This is a schematic diagram of the mounting block of a fully automatic plastic sealing packaging machine proposed in this invention; Figure 9 This is a full cross-sectional structural diagram of the mounting block of a fully automatic plastic sealing packaging machine proposed in this invention; Figure 10 This is a schematic diagram of the structure of the second clamping plate of a fully automatic plastic sealing packaging machine proposed in this invention; Figure 11 This is a full cross-sectional schematic diagram of the first clamping plate of a fully automatic plastic sealing packaging machine proposed in this invention.

[0022] In the diagram: 1. Mounting housing, 2. Sliding door, 3. Storage cabinet, 4. Working platform, 5. Membrane, 6. Rotary table, 7. Lifting device, 8. Lower mold, 9. Upper mold, 10. Cooling device, 11. Base, 12. Fixing plate, 13. Mounting bracket, 14. First lead screw, 15. Semiconductor workpiece, 16. First conveyor belt, 17. Slot, 18. First electric telescopic rod, 19. Rotating rod, 20. First hydraulic rod, 21. First electromagnet, 22. First self-locking motor, 23. Second hydraulic rod, 24. Second electromagnet, 25. Mounting block, 26. Rubber roller, 27. Second self-locking motor, 28. Waste collection box, 29. Second electric telescopic rod, 30. Second conveyor belt, 31. Support frame, 32. Mounting plate, 33. Cutting blade, 34. Third electric telescopic rod, 35. First clamping plate, 36. Second clamping plate, 37. Dust suction port, 38. Fan, 39. Fourth electric telescopic rod, 40. Third self-locking motor, 41. Dust suction device, 42. Fifth electric telescopic rod, 43. Fixing pin. Detailed Implementation

[0023] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments.

[0024] Reference Figures 1 to 11 A fully automatic plastic sealing packaging machine includes a mounting housing 1, with sliding doors 2 on all four sides of the mounting housing 1. Each sliding door 2 has an observation window. Several storage cabinets 3 are placed inside the mounting housing 1. A base 11 is placed on one side of each storage cabinet 3. The top of the base 11 is provided with two parallel first conveyor belts 16 or a single first conveyor belt 16. The first conveyor belt 16 is existing technology, and its specific structural design will not be described in detail here. First lead screws 14 are installed on both sides of the base 11 in a vertical arrangement. The moving end of the first lead screw 14 is fixedly connected to a slot 17, which clamps and fixes the storage cabinets 3 from both sides.

[0025] A working platform 4 is provided on one side of the base 11. A support frame 31 is provided on the top of the working platform 4 near the base 11. The support frame 31 is connected to the working platform 4 through several second electric telescopic rods 29. A second conveyor belt 30 is installed on the top of the working platform 4 inside the support frame 31. The second conveyor belt 30 moves in the same direction as the first conveyor belt 16 and they are close to each other. A mounting frame 13 is installed on the top of the working platform 4. The mounting frame 13 is distributed around the support frame 31. Cutting blades 33 are provided around the top of the mounting frame 13. The cutting blades 33 are connected to the mounting frame 13 through a first electric telescopic rod 18. The lifting and lowering of the cutting blades 33 as a whole can be controlled by the first electric telescopic rod 18. A film 5 is provided between the cutting blades 33 and the support frame 31. A take-up roller is provided on one side of the mounting frame 13 along the moving direction of the film 5, and an unwinding roller is provided on the other side.

[0026] A rotating platform 6 is mounted on the top of the work platform 4 on one side of the mounting frame 13. A fixed plate 12 is connected to the top of the rotating platform 6. A second hydraulic rod 23 is mounted on the side of the fixed plate 12 near the mounting frame 13. A second electromagnet 24 is mounted on the telescopic end of the second hydraulic rod 23. A rotating rod 19 is rotatably connected to the top of the fixed plate 12. The rotating rod 19 is driven to rotate by a first self-locking motor 22 fixedly mounted on the fixed plate 12. A first hydraulic rod 20 is fixedly connected to the end of the rotating rod 19 away from the fixed plate 12. A first electromagnet 21 is connected to the telescopic end of the first hydraulic rod 20. A mounting block 25 is fixed to the lower end of the first electromagnet 21 by magnetic attraction. A fan 38 is mounted at the middle position of the lower end of the mounting block 25. The fan 38 is existing technology, and its specific structural design will not be described here. Positioning mechanisms and dust removal mechanisms are provided around the mounting block 25. The positioning mechanism includes several first clamping plates 35 located on both sides. The first clamping plate 35 is connected to the side wall of the mounting block 25 via the third electric telescopic rod 34. A fifth electric telescopic rod 42 is installed inside the first clamping plate 35. A fixing pin 43 is connected to the telescopic end of the fifth electric telescopic rod 42. The fixing pin 43 moves through the bottom wall of the first clamping plate 35. The dust removal mechanism includes several second clamping plates 36 located in the middle position. The second clamping plates 36 are connected to the side wall of the mounting block 25 via the fourth electric telescopic rod 39. A dust collection device 41 is fixedly installed on the second clamping plate 36. A dust collection port 37 is installed at the input end of the dust collection device 41. The end of the dust collection port 37 is flat and faces the film 5. A third self-locking motor 40 is installed inside the mounting block 25. The third self-locking motor 40 is connected to the bottom of the fourth electric telescopic rod 39 via a reducer, so that when the third self-locking motor 40 is running, it can drive the second clamping plate 36 to rotate through the fourth electric telescopic rod 39.

[0027] A waste collection box 28 is provided on one side of the work platform 4. The waste collection box 28 is close to the rotating platform 6. Inside the waste collection box 28 are two parallel mounting plates 32. Both mounting plates 32 are fixedly connected to the work platform 4, and connecting plates are rotatably mounted at the ends of both mounting plates 32. The connecting plates are driven to rotate by a second self-locking motor 27 mounted on the mounting plates 32. A rubber roller 26 is rotatably mounted between the two connecting plates. The rubber roller 26 is driven to rotate by a power device mounted on the connecting plates.

[0028] A lifting device 7 is provided on the side of the working platform 4 away from the base 11. The lifting device 7 is slidably connected to the bottom wall of the mounting housing 1 via a slide rail. A lower mold 8 is installed at the top of the lifting device 7. An upper mold 9 is installed on the top wall of the mounting housing 1 above the lower mold 8. The lower mold 8 and the upper mold 9 cooperate to form a closed mold cavity during operation. A cooling device 10 is provided on one side of the lifting device 7. The cooling device 10 is existing technology and is used to cool the semiconductor workpiece 15.

[0029] In use, when the semiconductor workpiece 15 needs to be press-molded, the storage cabinet 3 is first inserted into the slot 17. Then, the position of the slot 17 is adjusted by the first lead screw 14, so that the semiconductor workpiece 15 at the bottom of the storage cabinet 3 comes into contact with the surface of the first conveyor belt 16. Then, the first conveyor belt 16 and the second conveyor belt 30 are started, so that the semiconductor workpiece 15 moves directly below the film 5. The mounting frame 13 is fixedly mounted on the work platform 4. The cutting blade 33 is connected to the mounting frame 13 through the first electric telescopic rod 18. The support frame 31 is connected to the work platform 4 through the second electric telescopic rod 29. The two ends of the film 5 are respectively wound around the take-up roller and the unwind roller on both sides of the mounting frame 13 and pass through the space between the support frame 31 and the cutting blade 33. After the semiconductor workpiece 15 is moved directly below the thin film 5, the length of the third electric telescopic rod 34 is adjusted so that the projection of the first clamping plate 35 on the thin film 5 is at a certain distance from the edge of the semiconductor workpiece 15. Then the length of the fourth electric telescopic rod 39 is adjusted so that the projection of the second clamping plate 36 on the thin film 5 is exactly at the edge of the semiconductor workpiece 15. Then, the first hydraulic rod 20 is activated to move the mounting block 25 downward. At this time, the fixing pin 43 on the first clamping plate 35 will pierce the film 5 to complete the initial fixation of the film 5. Then, the first electric telescopic rod 18 and the second electric telescopic rod 29 are activated to move the cutting blade 33 and the support frame 31 closer to each other. The cutting blade 33 is used to cut the film 5. The cut film 5 will cover the surface of the semiconductor workpiece 15. At this time, the first hydraulic rod 20 is activated to move the mounting block 25 downward, thereby moving the first clamping plate 35 and the second clamping plate 36 downward. The second clamping plate 36 moves downward along the edge of the semiconductor workpiece 15. Then, the fourth electric telescopic rod 39 is activated to clamp the second clamping plate 36 on the semiconductor workpiece 15, thereby fixing the film 5 more tightly on the surface of the semiconductor workpiece 15.

[0030] Next, the third electric telescopic rod 34 is activated to move the first clamping plate 35, thereby clamping other parts of the semiconductor workpiece 15. By covering the surface of the semiconductor workpiece 15 with the film 5, it is possible to prevent tiny dust particles from adhering to the surface of the semiconductor workpiece 15 during the feeding process, and to avoid direct contact between the first clamping plate 35, the second clamping plate 36 and the semiconductor workpiece 15, reducing scratches caused by sliding friction. In addition, the front side of the semiconductor workpiece 15 is completely covered by the mounting block 25, which can reduce the impact of external foreign objects on the front side of the semiconductor workpiece 15.

[0031] Then, the first hydraulic rod 20 is activated to lift the mounting block 25. The first self-locking motor 22 is activated, driving the rotating rod 19 to rotate 180 degrees. At the same time, the rotating table 6 is activated, driving the mounting block 25 to rotate 90 degrees clockwise, so that the mounting block 25 is moved directly above the waste collection box 28. At this time, the front of the semiconductor workpiece 15 is facing down, and the film 5 is located below the semiconductor workpiece 15. During the rotation, under the centrifugal force of the fixed plate 12 rotating with the rotating table 6 and the rotating rod 19 rotating around the center of the first self-locking motor 22, dust particles on the front of the semiconductor workpiece 15 are thrown off and then adhere to the film 5. Then, the fourth electric telescopic rod 39 is extended, causing the second clamping plate 36 to release the semiconductor workpiece 15 while the first clamping plate 35 remains stationary. At this time, the film 5 is no longer tightly attached to the semiconductor workpiece 15. Then, the third self-locking motor 40 is started to drive the fourth electric telescopic rod 39 to rotate, thereby driving the dust suction port 37 to rotate, so that the dust suction port 37 is located between the film 5 and the semiconductor workpiece 15. Then, the dust suction device 41 is started to adsorb the dust particles on the film 5. During this process, the first self-locking motor 22 can be started to drive the rotating rod 19 to rotate left and right, so that the dust particles are more easily adsorbed by the dust suction port 37 or fall from the film 5 into the waste collection box 28. Subsequently, with the semiconductor workpiece 15 facing downwards and the thin film 5 positioned below it, the blower 38 is activated to blow and suck air. Since the thin film 5 is no longer in direct contact with the semiconductor workpiece 15, the blower 38's upward airflow causes the thin film 5 to vibrate slightly. When the thin film 5 is close to the front of the semiconductor workpiece 15, it taps the surface, dislodging particles adhering to the front. When the thin film 5 moves away from the front, it creates a negative pressure zone, carrying particles away from the surface. Some particles adhere to the thin film 5, while others are sucked into the suction port 37 or fall into the waste collection bin 28. Using the thin film 5 to tap the front of the semiconductor workpiece 15 minimizes mechanical wear, ensuring that the microstructure and performance of the semiconductor workpiece 15 are not damaged. In addition, the flexible film 5 can not only completely cover the front of the semiconductor workpiece 15, but also closely adhere to every tiny bump and groove structure of the semiconductor workpiece 15 when it is tapped, eliminating cleaning dead corners.

[0032] After cleaning the front side of the semiconductor workpiece 15, the rotating table 6 is started, driving the fixed plate 12 to continue rotating clockwise by 90 degrees. At the same time, the first self-locking motor 22 is started, driving the rotating rod 19 to rotate by 180 degrees. At this time, the mounting block 25 is located between the lower mold 8 and the upper mold 9, and the film 5 is located above the semiconductor workpiece 15. Then, the second hydraulic rod 23 is extended, driving the second electromagnet 24 to move. The second electromagnet 24 is then activated to attract the mounting block 25. The first electromagnet 21 is then disconnected, and the second hydraulic rod 23 is activated to move the semiconductor workpiece 15 directly above the lower mold 8. The position and height of the lifting device 7 are adjusted, and the first clamping plate 35 is released, placing the semiconductor workpiece 15 on the lower mold 8, thus completing the loading of the semiconductor workpiece 15. After loading is completed, the upper mold 9 moves downward to form a sealed mold cavity with the lower mold 8, and then injection molding begins. After injection molding is completed, the upper mold 9 is removed, and the semiconductor workpiece 15 is cooled using the cooling device 10, completing this compression molding process.

[0033] During injection molding, the rotary table 6 rotates the fixed plate 12, moving the mounting block 25 above the waste collection bin 28. At this time, the second self-locking motor 27 is activated, rotating the rubber roller 26 180 degrees, bringing it into contact with the film 5. The rubber roller 26 is then activated, and during its rotation, the fifth electric telescopic rod 42 retracts the fixing pin 43 into the first clamping plate 35, causing the film 5 to be rolled away from the first clamping plate 35 by the rubber roller 26. The second self-locking motor 27 is then activated again, rotating the rubber roller 26 180 degrees. During this process, the rubber roller 26 reverses direction, causing the film 5 to fall into the waste collection bin 28. The rotary table 6 then rotates the mounting block 25 back to its initial position, ready to clamp the next semiconductor workpiece 15.

[0034] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A fully automatic plastic sealing packaging machine, comprising a mounting housing (1), characterized in that, The mounting housing (1) contains several storage cabinets (3), each containing a semiconductor workpiece (15). Each of the storage cabinets (3) has a base (11) on one side. A clamping and transporting mechanism is provided above the base (11). A working platform (4) is provided on one side of the base (11). A support mechanism is provided at the top of the working platform (4). An mounting frame (13) is installed at the top of the working platform (4). The mounting frame (13) is arranged around the support mechanism. A liftable cutting blade (33) is provided around the top of the mounting frame (13). A thin film (5) is provided between the cutting blade (33) and the support mechanism. The mounting bracket (13) is provided with a transfer mechanism installed on the top of the working platform (4) on one side. The working end of the transfer mechanism is equipped with a first electromagnet (21) and a second electromagnet (24). The lower end of the first electromagnet (21) is fixed with a mounting block (25) by magnetic adsorption. The lower end of the mounting block (25) is equipped with a fan (38). The mounting block (25) is equipped with a dust removal mechanism around its perimeter. The dust removal mechanism includes several second clamping plates (36). The second clamping plates (36) are connected to the side wall of the mounting block (25) through an adjustment component. A dust collection device (41) is fixedly installed on the second clamping plate (36). The input end of the dust collection device (41) is equipped with a dust collection port (37). The working platform (4) has an injection molding mechanism on the side away from the base (11).

2. The fully automatic plastic sealing packaging machine according to claim 1, characterized in that, The clamping and transporting mechanism includes a first conveyor belt (16) located at the top of the base (11). The base (11) has a first lead screw (14) arranged vertically on both sides. The moving end of the first lead screw (14) is fixedly connected to a slot (17), which clamps and fixes the storage cabinet (3) from both sides.

3. The fully automatic plastic sealing packaging machine according to claim 2, characterized in that, The supporting mechanism includes a support frame (31) located at the top of the work platform (4). The support frame (31) is connected to the work platform (4) via several second electric telescopic rods (29). The inner side of the support frame (31) is provided with a second conveyor belt (30) installed at the top of the work platform (4). The second conveyor belt (30) moves in the same direction as the first conveyor belt (16) and they are close to each other.

4. The fully automatic plastic sealing packaging machine according to claim 3, characterized in that, The transfer mechanism includes a rotating platform (6) installed on the top of the working platform (4). A fixed plate (12) is connected to the top of the rotating platform (6). A second hydraulic rod (23) is installed on the side of the fixed plate (12) near the mounting frame (13). The telescopic end of the second hydraulic rod (23) is connected to a second electromagnet (24). A rotating rod (19) is rotatably connected to the top of the fixed plate (12). The rotating rod (19) is driven to rotate by a first self-locking motor (22) fixedly installed on the fixed plate (12). A first hydraulic rod (20) is fixedly connected to the end of the rotating rod (19) away from the fixed plate (12). The telescopic end of the first hydraulic rod (20) is connected to a first electromagnet (21).

5. The fully automatic plastic sealing packaging machine according to claim 4, characterized in that, The mounting block (25) is also provided with a positioning mechanism around it. The positioning mechanism includes several first clamping plates (35). The first clamping plates (35) are connected to the side wall of the mounting block (25) through a third electric telescopic rod (34). A fifth electric telescopic rod (42) is installed inside the first clamping plate (35). The telescopic end of the fifth electric telescopic rod (42) is connected to a fixing pin (43). The fixing pin (43) moves through the bottom wall of the first clamping plate (35).

6. The fully automatic plastic sealing packaging machine according to claim 5, characterized in that, The adjustment assembly includes a third self-locking motor (40) installed inside the mounting block (25), the third self-locking motor (40) being connected to a fourth electric telescopic rod (39) via a reducer, and the telescopic end of the fourth electric telescopic rod (39) being connected to a second clamping plate (36).

7. The fully automatic plastic sealing packaging machine according to claim 6, characterized in that, The end of the suction port (37) is designed to be flat and faces the film (5).

8. The fully automatic plastic sealing packaging machine according to claim 7, characterized in that, The work platform (4) is provided with a waste collection box (28) on one side. The waste collection box (28) is provided with two parallel mounting plates (32) inside. Both mounting plates (32) are fixedly connected to the work platform (4), and both mounting plates (32) are rotatably mounted with connecting plates at their ends. The connecting plates are driven to rotate by a second self-locking motor (27) mounted on the mounting plates (32). A rubber roller (26) is rotatably mounted between the two connecting plates. The rubber roller (26) is driven to rotate by a power device mounted on the connecting plates.

9. The fully automatic plastic sealing packaging machine according to claim 8, characterized in that, The injection molding mechanism includes a lifting device (7), which is slidably connected to the bottom wall of the mounting housing (1) via a slide rail. A lower mold (8) is installed at the top of the lifting device (7), and an upper mold (9) is installed on the top wall of the mounting housing (1) above the lower mold (8). The lower mold (8) and the upper mold (9) cooperate with each other. A cooling device (10) is provided on one side of the lifting device (7).

10. A packaging method using a fully automatic plastic sealing packaging machine, characterized in that, Including the fully automatic plastic sealing packaging machine as described in claim 9, the following packaging method is also included: S1. Insert the storage cabinet (3) into the slot (17), adjust its position by the first lead screw (14) so ​​that the lowest semiconductor workpiece (15) contacts the first conveyor belt (16), and cooperate with the first conveyor belt (16) and the second conveyor belt (30) to transport it directly below the film (5); S2. Adjust the third electric telescopic rod (34) and the fourth electric telescopic rod (39) so that the first clamping plate (35) and the second clamping plate (36) are located on the outer side and edge of the workpiece respectively. Start the first hydraulic rod (20) to press down and achieve preliminary fixation by piercing the film (5) through the fixing needle (43). S3. Activate the first electric telescopic rod (18) and the second electric telescopic rod (29) to bring the cutting blade (33) close to the support frame (31) and cut the film (5) so that the film covers the surface of the semiconductor workpiece (15); S4. Continue to press down the first hydraulic rod (20) to make the second clamping plate (36) move down along the edge and clamp the semiconductor workpiece (15). At the same time, adjust the third electric telescopic rod (34) to make the first clamping plate (35) clamp other parts, so as to achieve tight film adhesion and workpiece protection. S5. Lift the mounting block (25), start the first self-locking motor (22) and the rotating table (6) to make the semiconductor workpiece (15) flip and move to the top of the waste collection box (28), and under the centrifugal action, the surface particles are thrown off and attached to the film (5). S6. Release the second clamping plate (36) and rotate the suction port (37) between the film and the semiconductor workpiece (15), start the suction device (41) and swing it in conjunction with the rotating rod (19) to achieve particle adsorption or drop into the waste collection box (28). S7. Start the fan (38) to make the thin film (5) vibrate and beat the surface of the semiconductor workpiece (15) and form a negative pressure zone of airflow to further remove residual particles and adsorb or collect them, so as to achieve non-destructive cleaning. S8. Flip the mounting block (25) again to place the workpiece between the lower mold (8) and the upper mold (9). Transfer is achieved by switching the second hydraulic rod (23) and the electromagnet. Release the clamping plate (35), place the workpiece in the lower mold (8) to complete the loading and injection molding and cooling. S9. During the injection molding process, the rotating table (6) moves the mounting block (25) above the waste collection box (28), starts the rubber roller (26) and related motor to peel the film (5) from the clamping plate (35) and roll it into the waste collection box (28), and the reset device prepares for the next cycle.

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