A production assembly process of semiconductor quartz fin boat

Abstract

The application belongs to the technical field of semiconductor manufacturing equipment, and particularly relates to a production and assembly process of a semiconductor quartz fin boat. The process comprises S1: fin pretreatment, cold processing of a quartz fin part, including laser processing and annealing, and fire processing precision burning; S2: boat body forming, reference surface grinding of a quartz boat body assembly, and false connection and welding to form a boat body; S3: precision assembly and welding, in a clean environment, a plurality of fins obtained in S1 are segmented and assembled on the boat body obtained in S2 according to a preset interval, and then fin welding and overall precision burning are performed; S4: multi-stage high-precision cleaning, the fin boat semi-finished product obtained in S3 is sequentially subjected to degreasing cleaning, nitric acid cleaning and hydrofluoric acid cleaning to remove surface contaminants, and a finished product semiconductor quartz fin boat is obtained. The application achieves high-precision, high-stability and high-cleanliness assembly of the fin boat, thereby improving the yield of semiconductor high-temperature processing and reducing production cost.

Description

Technical Field

[0001] This invention belongs to the field of semiconductor manufacturing equipment technology, and particularly relates to a production and assembly process for a semiconductor quartz fin boat. Background Technology

[0002] In semiconductor manufacturing, high-temperature processes such as oxidation, diffusion, and LPCVD are core steps in forming semiconductor device structures. These processes place extremely high demands on wafer support, heat exchange uniformity, and airflow distribution consistency. Semiconductor quartz finned boats, as specialized high-precision quartz carriers, leverage the high-temperature resistance and low impurity release characteristics of quartz material, along with the enhanced heat exchange and airflow guidance advantages of the finned structure, to become a core component for wafer support in high-temperature processes. Their assembly quality directly determines the uniformity of wafer heating and the distribution of reactive gases, thus affecting the performance, yield, and reliability of semiconductor devices. Currently, semiconductor devices are developing towards miniaturization and high integration, making the consistency requirements of high-temperature processes increasingly stringent. The assembly precision and structural stability of quartz finned boats have become key factors restricting process improvement.

[0003] Currently, semiconductor devices are developing towards miniaturization and high integration, making the consistency requirements for high-temperature processes increasingly stringent. However, existing semiconductor quartz fin boat assembly processes generally employ manual positioning combined with traditional bonding or flame welding. The specific process is as follows: operators place the quartz fins one by one into the predetermined positions on the boat body, manually measuring and adjusting the spacing and parallelism of the fins using simple tools such as rulers and calipers. Subsequently, they are bonded and fixed using quartz-specific adhesive, or the joint between the fins and the boat body is welded using a common oxyhydrogen flame. After assembly, only a simple visual inspection is performed to complete the processing. The entire process lacks a dedicated stress relief procedure, and the assembly environment is usually a regular workshop, lacking cleanroom control measures.

[0004] The above-mentioned existing technical solutions have the following technical problems: First, the positioning accuracy is low. Manual positioning relies heavily on the operator's experience and skill level. Coupled with simple measuring tools, it's difficult to guarantee the consistency of all fin spacing and parallelism, resulting in fin spacing deviations typically exceeding 0.2mm and parallelism errors exceeding 0.15mm. This irregular fin arrangement severely disrupts heat exchange and airflow distribution in high-temperature processes, causing wafer process yields to generally fall below 75%.

[0005] Secondly, stress concentration is severe. Both adhesive curing and flame welding introduce significant stress at the junction of the fins and the boat. The volume shrinkage during adhesive curing generates internal stress, while the temperature field in flame welding is difficult to control precisely, and localized overheating or uneven cooling can also lead to stress concentration. Under the repeated thermal shocks of high-temperature semiconductor processes, these residual stresses are easily released, causing cracks at the joint and even fin detachment, ultimately resulting in a scrap rate of over 35% for the finned boat. Considering that the material and processing costs of a single quartz finned boat are as high as 80,000-120,000 RMB, the scrap cost is extremely high.

[0006] Furthermore, there is a high level of residual impurities. Current assembly processes are conducted in ordinary workshop environments, where airborne dust and particles easily adhere to the surfaces of the fins and the hull. Simultaneously, there is no targeted, efficient cleaning process after assembly to remove these contaminants introduced during processing and handling. These residual particulate impurities will become sources of contamination in subsequent high-temperature processes, causing fatal contamination of the wafer and leading to device defects.

[0007] Finally, assembly efficiency is low. Relying entirely on manual positioning, measurement, and connection of each component means that the assembly time for a single finned boat typically exceeds 48 hours. This not only results in low efficiency but also poor product consistency, failing to meet the growing demand for high-volume, high-quality supply in the semiconductor industry. Summary of the Invention

[0008] The purpose of this invention is to address the aforementioned technical problems by providing a production and assembly process for semiconductor quartz finned boats, achieving high-precision, high-stability, and high-cleanliness assembly of the finned boats, thereby improving the yield of high-temperature semiconductor processes and reducing production costs.

[0009] In view of this, the present invention provides a manufacturing and assembly process for a semiconductor quartz finned boat, comprising the following steps: S1: Fin pretreatment, cold working processes including laser processing and annealing are carried out on the quartz fin parts, and fire processing is carried out to ensure the flatness of the fins and initially eliminate the internal stress of the fins. S2: Forming the boat body: Grinding the reference surface of the quartz boat body component, and performing dummy joints and welding to form the boat body; S3: Precision assembly and welding. In a clean environment, multiple fins obtained in S1 are assembled into the boat body obtained in S2 in sections according to a preset spacing using positioning fixtures. Then, fin welding and overall precision firing are carried out to form a fin boat semi-finished product. S4: Multi-stage high-precision cleaning. The semi-finished finned boat obtained in S3 is sequentially degreased, cleaned with nitric acid, and cleaned with hydrofluoric acid to remove surface contaminants and obtain the finished semiconductor quartz finned boat.

[0010] In this technical solution, by introducing laser processing and annealing as the core of fin pretreatment, high-precision shape processing and stress release can be achieved at the component stage. Laser processing is characterized by non-contact operation, a small heat-affected zone, and high precision, avoiding the precision loss and surface contamination that may occur with traditional machining methods such as MC machining. The subsequent annealing treatment effectively eliminates residual stress generated by laser processing and previous processes, providing a high-quality fin with extremely low internal stress for subsequent welding processes. This is key to solving the problem of cracking and detachment of the final product due to stress concentration from the source. The subsequent heat treatment and fine sintering step strictly controls the flatness of the fin, ensuring that the fin's dimensional and positional tolerances meet the requirements of high-precision assembly.

[0011] During the hull forming process, the reference surfaces of key components such as the groove bar, flange, and top plate are ground to ensure that the entire hull structure has a precise and reliable assembly reference. Dimensional adjustments and welding after the initial joining ensure the dimensional stability and structural strength of the main body structure.

[0012] The precision assembly and welding processes are performed in a clean environment, thus avoiding the introduction of environmental particles. More importantly, this invention abandons traditional manual, arbitrary positioning and instead uses positioning fixtures for segmented assembly. The use of fixtures eliminates human error, precisely ensuring the position, spacing (controlled within 0.05mm), and parallelism (≤0.08mm) of each fin with the reference plane. Segmented assembly and precision control make the assembly of large, multi-finned quartz boats controllable and inspectable, greatly improving product consistency and reliability. The overall precision firing after welding not only strengthens the connection strength but also eliminates welding stress, complementing the annealing in the fin pretreatment step and creating a closed-loop stress management system throughout the entire process.

[0013] Finally, multi-stage high-precision cleaning steps are the core technical means to ensure product cleanliness. Conventional single-pass cleaning cannot effectively remove residual grease, metal particles, and fine quartz powder from processing and assembly. This invention sequentially employs degreasing cleaning (removing grease), nitric acid cleaning (removing metal contaminants), and hydrofluoric acid cleaning (etching away tiny quartz fracture layers and particles on the surface). Through the synergistic effect of these three cleaning solutions with different chemical mechanisms, thorough removal of surface contaminants can be achieved, ensuring that the semiconductor fin boat will not become a source of contamination during high-temperature processes.

[0014] Furthermore, the pretreatment of S1 fins specifically includes the following steps: sequentially completing quartz raw material receiving, feeding, flat grinding, engineering cleaning, laser cutting, annealing, grinding and chamfering, fire finishing, deburring, engineering dimension inspection, adhesive point processing, secondary finishing and secondary annealing to obtain qualified fin components.

[0015] In this technical solution, the S1 fin pretreatment includes two annealing processes. The first annealing is set after laser cutting to eliminate the processing stress generated by laser cutting. The second annealing is set after fin bonding point processing and fin fine firing to eliminate the thermal stress generated by bonding points and fire processing. This solves the technical problems of internal stress introduced by machining and easy cracking during high-temperature use.

[0016] Furthermore, in the fire-processing and fine-sintering process of the S1 fin pretreatment step, the flatness of the pretreated fins is controlled to be less than 0.1 mm.

[0017] Furthermore, in the grinding and chamfering process of the S1 fin pretreatment, the fin ends are chamfered on both sides with a C0.5 chamfer, and the deburring process eliminates burrs and curling defects on the fin surface.

[0018] In this technical solution, this is a specific and quantifiable quality control point. Controlling the flatness of the fins themselves within an extremely small tolerance range is a prerequisite for their reliable and high-precision assembly onto the main structure. If the fins themselves are bent or twisted, even the most precise fixtures and references cannot guarantee the final spacing and parallelism.

[0019] Furthermore, in the S1 fin pretreatment step, a full inspection process is set up for the adhesive point processing step to control the difference between the height of the adhesive point tip and the height of the root to be less than 0.05mm.

[0020] Furthermore, in the S2 hull body forming step, the objects of dummy joining and welding include at least the groove bar, flange and top plate, and the hull body forming step also includes the step of adjusting the size of the groove bar after dummy joining.

[0021] In this technical solution, the dummy joint is a temporary fixing method used for fine-tuning of dimensions and position before final welding. Adjusting the dimensions of the groove bar can correct for accumulated errors that may exist in the early processing, ensuring the dimensional accuracy of the entire boat frame.

[0022] Furthermore, in the S3 precision assembly and welding process, the clean environment is a Class 100,000 cleanroom. The segmented assembly is divided into multiple segments according to the fin position, and the fin precision within each segment and between segments is controlled separately.

[0023] Furthermore, the S3 precision assembly and welding process also includes a step of confirming and adjusting the fin dimensions after welding.

[0024] In this technical solution, the welding process may cause slight dimensional deviations due to thermal stress. Adding post-weld verification and adjustment procedures can promptly identify and correct these problems, serving as a "safety net" measure to ensure that the final product's dimensional accuracy fully meets design requirements.

[0025] Furthermore, in the multi-stage high-precision cleaning process, a neutral and powerful degreasing agent is used for degreasing.

[0026] Furthermore, in the multi-stage high-precision cleaning process, the nitric acid concentration used for nitric acid cleaning is 15%-25%, the hydrofluoric acid concentration used for hydrofluoric acid cleaning is 10%-20%, and the cleaning time is 15-30 minutes.

[0027] The beneficial effects of this invention are: 1. Significantly Improved Assembly Precision: By employing high-precision laser processing, annealing, and flatness control at the component stage, coupled with a cleanroom segmented assembly process based on positioning fixtures, this invention effectively solves the problem of low accuracy in manual positioning in existing technologies. Ultimately, it can stably control the fin spacing deviation within 0.05mm and the parallelism error ≤0.08mm. This improvement in precision directly leads to more uniform heat exchange and airflow distribution in high-temperature processes, thereby significantly increasing the yield of semiconductor high-temperature processes from below 75% to over 98%.

[0028] 2. Significantly Reduced Scrap Rate and Production Costs: This invention establishes a comprehensive stress management system. Cold working stress is eliminated through annealing at the fin component stage, and hot working stress is eliminated through overall precision sintering after fin welding. Combined with an optimized connection structure, residual stress at the fin-to-boat joint is significantly reduced. This minimizes the risk of cracking and detachment due to stress release in high-temperature environments, reducing the scrap rate of the fin boat from over 35% to below 0.1%. Based on a monthly output of 30 units, scrap costs alone can be reduced by approximately 870,000 yuan, while the improved yield increases monthly output value by approximately 3.2 million yuan.

[0029] 3. Ensuring Ultra-High Cleanliness: Through assembly in a Class 100,000 cleanroom, early engineering cleaning, and a final multi-stage (degreasing-nitric acid-hydrofluoric acid) high-precision chemical cleaning process, this invention ensures cleanliness control throughout the entire chain from component processing to finished product assembly. The multi-stage cleaning process specifically removes grease, metal ions, and fine quartz particles, fundamentally avoiding wafer defects caused by carrier contamination and significantly improving the production quality and reliability of semiconductor devices.

[0030] 4. Improved Assembly Efficiency and Consistency: This invention employs positioning fixtures for semi-automated operation, eliminating the inefficient model that relies entirely on manual measurement and positioning. This reduces the assembly time for a single finned boat from over 48 hours to less than 24 hours, significantly improving production efficiency. Simultaneously, standardized fixtures and processes ensure high product consistency, meeting the semiconductor industry's demand for high-precision quartz carriers in large-volume, high-quality supply. Attached Figure Description

[0031] Figure 1This is a general process flow diagram of the semiconductor quartz finned boat assembly process of the present invention.

[0032] Figure 2 This is a detailed process flow diagram of the fin component processing steps of the present invention.

[0033] Figure 3 This is a detailed process flow diagram of the body spur welding and fin assembly welding process of the present invention.

[0034] Figure 4 This is a schematic diagram illustrating the control of fin flatness after heat treatment and sintering in this invention. Figure 5 This is a schematic diagram illustrating the segmented precision control during the assembly and positioning of the fins. The markings in the diagram are as follows: 1. Fins; 2. Boat body. Detailed Implementation

[0035] The technical solutions of the embodiments of this application will be clearly described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application are within the scope of protection of this application.

[0036] In the description of this application, it should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to this application. For ease of description, the dimensions of the various parts shown in the drawings are not drawn to actual scale. Techniques, methods, and devices known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and devices should be considered part of the specification. In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters in the following drawings denote similar items; therefore, once an item is defined in one drawing, it need not be further discussed in subsequent drawings.

[0037] It should be noted that the terms "first," "second," etc., used in the specification and claims of this application are used to distinguish similar objects and not to describe a specific order or sequence. It should be understood that such use of data can be interchanged where appropriate so that embodiments of this application can be implemented in orders other than those illustrated or described herein, and the objects distinguished by "first," "second," etc., are generally of the same class and are not limited in number; for example, a first object can be one or more. Furthermore, in the specification and claims, "and / or" indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0038] It should be noted that in the description of this application, the directional terms such as "front, back, up, down, left, right", "horizontal, vertical, horizontal" and "top, bottom" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description. Unless otherwise stated, these directional terms do not indicate or imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on the scope of protection of this application. The directional terms "inner" and "outer" refer to the inner and outer contours relative to the outline of each component itself.

[0039] It should be noted that, in this application, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element. Furthermore, it should be noted that the scope of the methods and apparatuses in the embodiments of this application is not limited to performing functions in the order shown or discussed, but may also include performing functions substantially simultaneously or in the reverse order, depending on the functions involved. For example, the described methods may be performed in a different order than described, and various steps may be added, omitted, or combined. Additionally, features described with reference to certain examples may be combined in other examples.

[0040] Example 1: like Figure 1-5 As shown, this embodiment provides an assembly process for a semiconductor quartz finned boat, including the following steps: fin pretreatment step, body forming step, precision assembly and welding step, and multi-stage high-precision cleaning step.

[0041] S1, Fin Pretreatment Steps: 1. Material requisition: Production personnel requisition high-purity semiconductor-grade quartz raw materials according to the product manufacturing number, processing drawings, and production operation order (POR). They verify the raw material grade, quartz purity, and appearance, and make a requisition record to ensure that the purity of the raw materials meets the standards for use in semiconductor carriers.

[0042] 2. Cutting: Quartz raw materials are cut using crystal drilling and cutting equipment and ring cutting equipment to obtain fin blanks that meet the basic size requirements.

[0043] 3. Waterjet cutting rough machining: High-pressure waterjet cutting equipment is used to rough machine the shape of the fin blank, remove excess material, and make the shape of the blank close to the basic outline of the finished fin.

[0044] 4. Surface grinding: Rough surface grinding and fine surface grinding are carried out in sequence to grind the two planes of the fins and accurately control the overall thickness and initial flatness of the fins.

[0045] 5. Engineering cleaning: Place the flat-ground fins into the cleaning tank and clean them with pure water and neutral detergent to remove impurities such as quartz powder, coolant, and dust that adhered during the cold working process. After cleaning, allow them to dry naturally.

[0046] 6. Laser finishing: The fins are finished using an industrial laser cutting machine. The finishing process includes fin shape trimming and equidistant slot processing. Laser processing eliminates mechanical extrusion and the introduction of metal debris, and the processing accuracy can reach the micron level.

[0047] 7. First annealing: The laser-processed fins are placed in a quartz annealing furnace and heated, held, and slowly cooled according to the standard annealing process for quartz materials to completely eliminate the local mechanical and thermal stresses generated by laser cutting and slotting, and to prevent the fins from cracking later.

[0048] 8. Grinding and chamfering: Use specialized grinding equipment to chamfer both ends of the fins, uniformly processing them into a double-sided C0.5 chamfer structure to remove sharp edges.

[0049] 9. Precision Firing: The fins are precision shaped at high temperature using an oxyhydrogen flame. The flame temperature and movement speed are controlled uniformly. After processing, the flatness of the fins is checked to ensure that the flatness of a single fin is <0.1mm. (Reference) Figure 4 As shown, ensure that the line connecting the two measurement points ① and ② on fin 1 is absolutely horizontal, thereby ensuring that the flatness of the entire fin is less than 0.1mm.

[0050] 10. Deburring and edge curling: Fine grinding is used to remove tiny burrs and edge curling caused by heat treatment and chamfering processes, ensuring that the fin surface is smooth and flat.

[0051] 11. Engineering Inspection: Quality inspection personnel use high-precision calipers, dial indicators, flat screens and other inspection tools to inspect the fin thickness, flatness, external dimensions and slot spacing item by item. Unqualified products are sorted and scrapped separately, while qualified products flow into the next process.

[0052] 12. MC auxiliary processing and LAP / POLISH polishing: perform micro-mechanical finishing and mirror polishing on the mating positions of the fin ends to ensure tight bonding of subsequent adhesive points.

[0053] 13. Bonding point processing: The bonding points are processed at preset positions on both ends of the fin using an oxyhydrogen flame. The bonding points are the core stress points connecting the fin and the boat body.

[0054] 14. 100% inspection of adhesive points: 100% inspection of each adhesive point is carried out to control the height of the tip and the height of the root of the adhesive point, ensuring that the height difference between the two is <0.05mm; at the same time, the upward tilting of the fin nails is checked, and the control range is X2-0.2mm-X2mm, to prevent poor shape and excessive tilting of adhesive points.

[0055] 15. Secondary firing of fins: The fins that have completed the bonding point processing are fired again to correct the minor deformation caused by the bonding point processing.

[0056] 16. Second annealing: Perform the annealing process again to eliminate the thermal stress generated by the sticking point processing and secondary firing, and complete the secondary stress release.

[0057] 17. Engraving, re-inspection, and warehousing: Engrav the product number and specifications at the designated location on the fins, re-inspect the appearance and dimensions a second time, and store the qualified fins in a dedicated parts warehouse for assembly and use.

[0058] S2, Forming steps of the boat body 2: 1. Reference surface grinding: Take out the groove bar, flange, and top plate components that are matched with the boat body, and perform high-precision grinding on all assembly reference surfaces to unify the dimensional reference of the whole boat and ensure that the assembly reference of each component is consistent.

[0059] 2. Environment switch: All hull components were transferred to a Class 100,000 cleanroom for processing, and all subsequent mortise and tenon joints, welding, and testing were completed in this environment.

[0060] 3. Temporary connection of grooved bar: Place the grooved bar in the preset assembly position of the flange or top plate, and use a low-power oxyhydrogen flame to perform short-term spot melting to complete the temporary connection and fixation; the connection depth is very shallow and the bonding strength is low, which only serves as a temporary positioning function and will not cause permanent deformation.

[0061] 4. Adjustment of groove bar dimensions: Use high-precision fixtures and digital calipers to correct the dimensions of the groove bars after the initial connection, and adjust the spacing, straightness and parallelism between the groove bars to ensure that the reference dimensions of the boat frame meet the requirements of the drawings.

[0062] 5. Formal welding: After the dimensions are corrected and qualified, increase the flame power and extend the heating time to perform high-temperature welding at the joint position of the groove bar with the flange and top plate to form a high-strength permanent connection.

[0063] 6. Fine firing of the main body: The entire hull after welding is finely fired to release the welding thermal stress and correct the minor deformations that occurred during the welding process.

[0064] 7. Engineering Inspection: Inspect the overall dimensions of the hull, the appearance of welding points, the fullness of welds, and the parallelism of the frame. Defective products are reworked, and qualified products proceed to the fin assembly process.

[0065] S3, Regarding precision assembly and welding steps: 1. Three-piece positioning and assembly: Maintaining a Class 100,000 clean environment, the fin assembly is carried out using the three-piece positioning method: such as... Figure 5 As shown, a single long fin is divided into three independent areas: the front positioning area, the middle positioning area, and the rear positioning area. The fin position, slot alignment, fin spacing, and parallelism of each area are precisely positioned to ensure that the dimensions of the three areas are continuous and without misalignment.

[0066] 2. Fin welding: After all fins are positioned, the bonding points at the ends of the fins are welded to the joints with the hull to ensure that the welding quality of all connection points is uniform and consistent.

[0067] 3. Finished product overall fine firing: The assembled quartz fin boat is subjected to full-area fire-firing fine firing to fully release the residual thermal stress generated by assembly and welding, and to correct the overall deformation.

[0068] 4. Fin size confirmation and fine-tuning: High-precision testing equipment is used to perform full-size testing on the finished fins, and minor corrections are made for small dimensional deviations to ensure that the fin spacing deviation is ≤0.05mm and the fin parallelism error is ≤0.08mm.

[0069] 5. Final visual inspection: Inspect the overall appearance of the boat, all welding points, and the surface condition of the fins. If there are no cracks, missing materials, or obvious deformation, it is considered qualified and will proceed to the cleaning process.

[0070] S4, Regarding the multi-stage high-precision cleaning steps: 1. Degreasing and cleaning: Place the finished product into the degreasing and cleaning tank and immerse it in imported neutral and strong degreasing agent to remove the grease and organic contaminants attached during the assembly process. The cleaning time is 20 minutes.

[0071] 2. First-level pure water rinsing: Use deionized pure water to rinse thoroughly to remove surface degreasing agent residue, and rinse at least 3 times.

[0072] 3. Nitric acid cleaning: Prepare a 20% nitric acid solution and immerse the finished product in the solution for 20 minutes to remove surface metal ions and metal particle impurities using nitric acid.

[0073] 4. Secondary pure water rinsing: Rinse multiple times with pure water to thoroughly remove nitric acid residue.

[0074] 5. Hydrofluoric acid cleaning: Prepare a 15% hydrofluoric acid solution, immerse the finished product in the solution for 20 minutes to gently corrode the quartz surface and remove quartz micro-fragments and stubborn adhering particles.

[0075] 6. Three-stage pure water rinsing: High-purity ultrapure water is used for deep rinsing until the conductivity of the rinsing water meets the standard and it is confirmed that there is no acid residue.

[0076] 7. Class 1000 Cleanroom Packaging: The cleaned and dried finished products are transferred to a Class 1000 cleanroom and vacuum-sealed using semiconductor-specific dust-free packaging materials.

[0077] 8. Registration and Warehousing: Label the finished products with specifications, numbers and production dates, classify and register them, and then send them to the finished product warehouse.

[0078] The entire process described above was applied to the mass production of semiconductor quartz finned boats. After three months of continuous production, a total of 900 units were produced. Sampling inspection data and customer feedback from on-site use are as follows: 1. Accuracy indicators: The maximum deviation of fin spacing is 0.042mm, and the maximum parallelism error is 0.075mm, all of which meet the design requirements of ≤0.05mm and ≤0.08mm. 2. Structural stability: After 900 units were delivered to the customer, no cracking or fin detachment issues were observed under high-temperature cyclic conditions, with a scrap rate of 0.08%. 3. Cleanliness: The finished product surface is free of particles and metal impurities, and the customer's wafer fabrication yield is consistently between 98.2% and 99.1%. 4. Production efficiency: The average processing time per unit is 20-22 hours, and the daily production capacity is increased by 55% compared with traditional processes, which can stably achieve large-scale mass production.

[0079] In summary, this invention effectively solves many core defects of traditional processes, achieving industry-leading levels in process stability, product quality, and production efficiency, and possesses extremely high industrialization and promotion value.

[0080] The embodiments of this application have been described above with reference to the accompanying drawings. Unless otherwise specified, the embodiments and features in the embodiments of this application can be combined with each other. This application is not limited to the specific embodiments described above. The specific embodiments described above are merely illustrative and not restrictive. Those skilled in the art can make many other forms under the guidance of this application without departing from the spirit and scope of the claims, and all of these forms are within the protection scope of this application.

Claims

1. A manufacturing and assembly process for a semiconductor quartz finned boat, characterized in that... This includes the following steps: S1: Fin pretreatment, cold working processes including laser processing and annealing are carried out on the quartz fin parts, and fire processing is carried out to ensure the flatness of the fins and initially eliminate the internal stress of the fins. S2: Forming the boat body: Grinding the reference surface of the quartz boat body component, and performing dummy joints and welding to form the boat body; S3: Precision assembly and welding. In a clean environment, multiple fins obtained in S1 are assembled into the boat body obtained in S2 in sections according to a preset spacing using positioning fixtures. Then, fin welding and overall precision firing are carried out to form a fin boat semi-finished product. S4: Multi-stage high-precision cleaning. The semi-finished finned boat obtained in S3 is sequentially degreased, cleaned with nitric acid, and cleaned with hydrofluoric acid to remove surface contaminants and obtain the finished semiconductor quartz finned boat.

2. The manufacturing and assembly process of a semiconductor quartz finned boat according to claim 1, characterized in that, The S1 fin pretreatment specifically includes the following steps: sequentially completing quartz raw material receiving, feeding, flat grinding, engineering cleaning, laser cutting, annealing, grinding and chamfering, fire processing and fine sintering, deburring, engineering dimension inspection, adhesive point processing, secondary fine sintering and secondary annealing to obtain qualified fin components.

3. The manufacturing and assembly process of a semiconductor quartz finned boat according to claim 2, characterized in that, In the fire-processing and fine-sintering process of the S1 fin pretreatment step, the flatness of the pretreated fins is controlled to be less than 0.1 mm.

4. The manufacturing and assembly process of a semiconductor quartz finned boat according to claim 2, characterized in that, In the grinding and chamfering process of S1 fin pretreatment, the fin ends are chamfered on both sides with a C0.5 chamfer, and the deburring process eliminates burrs and curling defects on the fin surface.

5. The manufacturing and assembly process of a semiconductor quartz finned boat according to claim 2, characterized in that, In the S1 fin pretreatment step, a full inspection is set up in the adhesive point processing process to control the difference between the height of the adhesive point tip and the height of the root to be less than 0.05mm.

6. The manufacturing and assembly process of a semiconductor quartz finned boat according to claim 1, characterized in that, In the S2 hull body forming step, the objects of dummy joining and welding include at least the groove bar, flange and top plate, and the hull body forming step also includes the step of adjusting the size of the groove bar after dummy joining.

7. The manufacturing and assembly process of a semiconductor quartz finned boat according to claim 1, characterized in that, In the S3 precision assembly and welding process, the clean environment is a Class 100,000 cleanroom. The segmented assembly is divided into multiple segments according to the fin position, and the fin precision within each segment and between segments is controlled separately.

8. The manufacturing and assembly process of a semiconductor quartz finned boat according to claim 1, characterized in that, The S3 precision assembly and welding process also includes a step of confirming and adjusting the fin dimensions after welding.

9. The manufacturing and assembly process of a semiconductor quartz finned boat according to claim 1, characterized in that, In the multi-stage high-precision cleaning process, a neutral and powerful degreasing agent is used for degreasing.

10. The manufacturing and assembly process of a semiconductor quartz finned boat according to claim 9, characterized in that, In the multi-stage high-precision cleaning process, the nitric acid concentration used for nitric acid cleaning is 15%-25%, and the hydrofluoric acid concentration used for hydrofluoric acid cleaning is 10%-20%, with a cleaning time of 15-30 minutes.

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