Double-station fixed-light common rail glass cutting and splitting all-in-one machine and method thereof

Abstract

The application discloses a double-station fixed-light common-rail glass cutting and splitting all-in-one machine and a method thereof, and relates to the technical field of glass processing equipment. The double-station fixed-light common-rail glass cutting and splitting all-in-one machine comprises a rack, a fixed-light-path laser cutting assembly, a laser splitting assembly, a first adsorption platform, a second adsorption platform, a common guide rail, a first X-axis driving assembly, a second X-axis driving assembly, a first Y-axis driving assembly, a second Y-axis driving assembly, an X-axis driving assembly, a marble cross beam and a splitting feedback control system. The cutting and splitting all-in-one machine adopts the fixed-light-path laser cutting assembly, ensures the consistency of the cutting quality in the whole processing range, sets the first adsorption platform and the second adsorption platform to share the same common guide rail, reduces the occupied space of the equipment, sets the splitting feedback control system, establishes a two-way closed-loop control of the reverse driving of the cutting parameter adjustment from the splitting quality, and reduces the splitting failure rate.

Description

Technical Field

[0001] This invention relates to the field of glass processing equipment technology, specifically to a dual-station fixed-light co-track glass cutting and splitting integrated machine and its method. Background Technology

[0002] Laser cutting and cleaving of glass substrates are crucial glass processing steps in fields such as flat panel displays, touch screens, and optical devices. Traditionally, cutting typically involves mechanical scribing with a cutting wheel or laser-modified cutting, while cleaving uses mechanical breaking or CO2 laser heating. These two processes are performed sequentially on separate equipment, requiring the glass substrate to be transferred and repositioned between processes. This not only increases equipment space and manual operation steps but also leads to cumulative errors due to repeated repositioning. To address these issues, integrated cutting and cleaving machines have emerged in recent years, combining cutting and cleaving into a single unit. These machines typically have two independent... The machine has two separate work platforms: one for carrying the glass substrate for cutting and the other for carrying the glass substrate for dicing. Each platform is driven by its own drive system and has its own independent guide rails and motion axes. In terms of cutting method, existing integrated cutting and dicing machines mostly adopt a flying optical path structure, that is, the laser cutting head moves with the motion platform or crossbeam. The laser beam is emitted from the laser and then transmitted to the cutting head through a group of follow-up reflectors. The optical path length changes with the cutting head at different processing positions. In terms of control method, the cutting process and dicing process of existing equipment operate independently and each performs the operation according to preset fixed parameters.

[0003] However, the aforementioned existing technologies still have the following shortcomings:

[0004] First, during the cutting process, the laser beam in the flying optical path has a certain divergence angle. When the cutting head moves to different processing positions, the change in the optical path length causes the size of the focused spot and the laser energy density reaching the processing surface to change accordingly. At the same time, the mechanical vibration of the follower mirror group and the flatness deviation of the motion platform will also affect the stability of the beam transmission, resulting in differences in the cutting quality of different areas of the same glass substrate, affecting the consistency of processing.

[0005] Second, the existing dual-station splitting machine has two work platforms each equipped with independent guide rails and drive systems, resulting in a large overall space occupation of the equipment.

[0006] Third, the cleaving parameters are preset and fixed. However, the optimal cleaving energy and speed required for glass substrates of different thicknesses, materials and cutting patterns vary significantly. Improper parameter settings can lead to incomplete cleaving or overheating and damage to the glass. Moreover, the processing quality of the cutting process directly affects the difficulty of cleaving. When a batch of glass substrates fails to cleave continuously due to improper cutting parameter settings, manual shutdown is required to check and readjust the parameters. The equipment cannot make adaptive adjustments. Summary of the Invention

[0007] To address the shortcomings of existing technologies, this invention provides a dual-station fixed-light co-track glass cutting and cleaving integrated machine and method, in order to solve the problems mentioned in the background art.

[0008] To achieve the above objectives, the present invention provides the following technical solution: a dual-station fixed-light co-track glass cutting and cleaving integrated machine, comprising:

[0009] frame;

[0010] A fixed-beam laser cutting assembly, mounted on the frame, is used to output a laser beam to cut a glass substrate;

[0011] A laser cleaving assembly, mounted on the frame, is used to cleave the cut glass substrate;

[0012] The first adsorption platform and the second adsorption platform are both set on the frame and are used to adsorb and fix the glass substrate respectively. The first adsorption platform and the second adsorption platform share the same common guide rail, and the first adsorption platform and the second adsorption platform are configured such that when one adsorption platform moves to the cutting station, the other adsorption platform moves to the avoidance station.

[0013] The cleaving feedback control system is communicatively connected to the laser cleaving assembly and the fixed-beam laser cutting assembly, and is used to adjust the cutting parameters of the fixed-beam laser cutting assembly according to the cleaving status feedback information of the laser cleaving assembly.

[0014] Preferably, the common guide rail extends along the X-axis direction, the first adsorption platform is mounted on the first X-axis drive assembly and driven by the first X-axis drive assembly to move along the common guide rail, and the second adsorption platform is mounted on the second X-axis drive assembly and driven by the second X-axis drive assembly to move along the common guide rail; both the first X-axis drive assembly and the second X-axis drive assembly are linear motors.

[0015] Preferably, it further includes a first Y-axis drive component and a second Y-axis drive component. The first Y-axis drive component is installed at the bottom of the first adsorption platform and drives the first adsorption platform to move along the Y-axis direction. The second Y-axis drive component is installed at the bottom of the second adsorption platform and drives the second adsorption platform to move along the Y-axis direction. The first X-axis drive component, the second X-axis drive component, the first Y-axis drive component, and the second Y-axis drive component together constitute a four-axis independent drive system, so that the first adsorption platform and the second adsorption platform can move independently along the X-axis direction and the Y-axis direction in the horizontal plane.

[0016] Preferably, the fixed-path laser cutting assembly includes a laser cutting head fixedly mounted on the frame, the laser beam emission position of the laser cutting head remaining fixed in the horizontal plane; when the first adsorption platform moves to the cutting station, the first Y-axis drive assembly drives the first adsorption platform to move along the Y-axis direction, and the first X-axis drive assembly drives the first adsorption platform to move along the X-axis direction, so that the first adsorption platform performs XY interpolation motion relative to the laser cutting head in the horizontal plane to cut arbitrary planar patterns on the glass substrate surface on the first adsorption platform; at this time, the second adsorption platform is located at the avoidance station; when the second adsorption platform moves to the cutting station, the second Y-axis drive assembly drives the second adsorption platform to move along the Y-axis direction, and the second X-axis drive assembly drives the second adsorption platform to move along the X-axis direction, so that the second adsorption platform performs XY interpolation motion relative to the laser cutting head in the horizontal plane to cut arbitrary planar patterns on the glass substrate surface on the second adsorption platform; at this time, the first adsorption platform is located at the avoidance station.

[0017] Preferably, a marble crossbeam is provided above the frame, and the laser dicing assembly includes an X3-axis drive assembly and a laser dicing head. The X3-axis drive assembly is installed upside down below the marble crossbeam, and the laser dicing head is installed on the X3-axis drive assembly and driven by the X3-axis drive assembly to move along the X-axis direction. The laser dicing head is located downstream of the fixed-path laser cutting assembly.

[0018] Preferably, the XY interpolation motion of the first adsorption platform and the second adsorption platform in the horizontal plane is independently executed by the first X-axis drive component and the first Y-axis drive component, as well as the second X-axis drive component and the second Y-axis drive component; the laser cleaving head is driven by the X3-axis drive component to move along the X-axis direction, and the laser cleaving head cooperates with the first Y-axis drive component or the second Y-axis drive component to perform a cleaving operation on the glass substrate surface on the corresponding adsorption platform.

[0019] Preferably, when the first adsorption platform moves to the cutting station for cutting, the X3-axis drive assembly drives the laser cleaving head to move to the right half of the frame, and the second Y-axis drive assembly drives the second adsorption platform to move along the Y-axis, so that the laser cleaving head, in coordination with the Y-axis movement of the second adsorption platform, cleaves the glass substrate on the second adsorption platform; when the second adsorption platform moves to the cutting station for cutting, the X3-axis drive assembly drives the laser cleaving head to move to the left half of the frame, and the first Y-axis drive assembly drives the first adsorption platform to move along the Y-axis, so that the laser cleaving head, in coordination with the Y-axis movement of the first adsorption platform, cleaves the glass substrate on the first adsorption platform.

[0020] Preferably, the cleaving feedback control system includes a sensing module, a judgment module, and a linkage module; the sensing module is integrated into the laser cleaving assembly and includes an infrared thermal imaging sensor and a cleaving state detection sensor. The infrared thermal imaging sensor is used to monitor the temperature field distribution of the glass substrate along the cutting trajectory in real time, and the cleaving state detection sensor is used to detect whether the glass substrate separates along the cutting trajectory in real time; the judgment module is used to judge the cleaving state based on the detection data of the sensing module and output a feedback signal; the linkage module is communicatively connected to the fixed-beam laser cutting assembly and is used to adjust the cutting parameters of the fixed-beam laser cutting assembly according to the feedback signal.

[0021] Preferably, the judgment module has a built-in three-level threshold judgment logic:

[0022] Level 1 threshold: When the peak temperature of the heating zone is lower than the lower limit of the target cleaving temperature, the judgment module outputs a first feedback signal, and the linkage module controls the laser cleaving assembly to increase the laser power or decrease the cleaving speed according to the first feedback signal;

[0023] Secondary threshold: When the glass substrate is not separated after a certain segment of the trajectory is cleaved, the judgment module records the position coordinates of the unseparated segment and outputs a second feedback signal. The linkage module controls the laser cleaving assembly to return to the starting point of the segment and re-execute the cleaving with the enhanced energy according to the second feedback signal.

[0024] Level 3 threshold: When the cumulative number of failed cleaving attempts on the same adsorption platform reaches a set threshold, the judgment module outputs a third feedback signal. The linkage module controls the fixed-path laser cutting component to perform supplementary cutting on the glass substrate on the adsorption platform along the original cutting trajectory according to the third feedback signal. After the supplementary cutting is completed, the laser cleaving component is scheduled to perform cleaving again.

[0025] This invention also discloses a method for cutting and cleaving glass using a dual-station fixed-beam co-track glass cutting and cleaving integrated machine, comprising the following steps:

[0026] Step S1: Loading – The glass substrate to be processed is placed on the first adsorption platform and the second adsorption platform respectively, and fixed by vacuum adsorption;

[0027] Step S2: Cutting station switching and control - Control the first X-axis drive component to drive the first adsorption platform to move along the common guide rail to the cutting station, or control the second X-axis drive component to drive the second adsorption platform to move along the common guide rail to the cutting station; when one adsorption platform moves to the cutting station, the other adsorption platform moves to the avoidance station;

[0028] Step S3: Cutting operation - The fixed-beam laser cutting component is started to output a laser beam. The adsorption platform located at the cutting station performs XY interpolation motion in the horizontal plane, so that the glass substrate fixed on the adsorption platform moves relative to the laser beam emission position of the fixed-beam laser cutting component, so as to cut arbitrary planar patterns on the surface of the glass substrate.

[0029] Step S4: Fracturing Station Switching - Control the X3 axis drive assembly to drive the laser fracturing head to move along the X-axis to the side corresponding to the adsorption platform that is not in the cutting station;

[0030] Step S5: Cleaving Operation - The laser cleaving head is started, and the corresponding Y-axis drive component drives the adsorption platform that is not in the cutting position to move along the Y-axis direction, so that the laser cleaving head cooperates with the Y-axis movement of the adsorption platform to cleave the glass substrate; during the cleaving process, the cleaving feedback control system monitors the cleaving status in real time and adjusts the cutting parameters according to the cleaving status feedback information.

[0031] Step S6: Unloading – The glass substrate that has been cut and sharded is removed from the first adsorption platform and the second adsorption platform.

[0032] The technical effects and advantages of this invention are as follows:

[0033] This dual-station fixed-beam co-track glass cutting and sharding machine features a fixed-beam laser cutting assembly. The laser beam exit position of the laser cutting head remains fixed in the horizontal plane, and the optical path length remains constant throughout the entire processing. Compared to the flying optical path structure, the fixed-beam design eliminates the need for a moving reflector group, avoiding differences in the focused spot size and laser energy density at different processing positions due to changes in optical path. This ensures consistent cutting quality across the entire processing area, making it particularly suitable for glass substrate processing scenarios where strict requirements are placed on the uniformity and precision of the cut surface.

[0034] Secondly, by setting the first adsorption platform and the second adsorption platform to share the same common guide rail, and driving them respectively by the first X-axis drive assembly and the second X-axis drive assembly, the two adsorption platforms share a single guide rail, achieving a compact structural layout and reducing the space occupied by the equipment. At the same time, when one adsorption platform moves to the cutting station, the other adsorption platform moves to the avoidance station, and the laser dicing head driven by the X3 axis drive assembly performs dicing operations on the other side, realizing parallel operation of cutting and dicing, and improving equipment utilization and processing speed.

[0035] Third, by setting up a cleaving feedback control system, the temperature field distribution and glass separation status during the cleaving process are monitored in real time. The cleaving feedback control system has a built-in three-level threshold judgment logic to respond to the cleaving status in a graded manner. Based on the feedback signal, the cleaving parameters of the laser cleaving component are dynamically adjusted or the fixed-path laser cutting component is scheduled to perform supplementary cutting. Cleaving failure information is fed back to the cutting parameter database to optimize subsequent cutting parameters. A two-way closed-loop control system is established, which drives the adjustment of cutting parameters from the reverse direction of cleaving quality. This solves the problem that the cleaving process cannot perceive and respond to cutting quality defects, thereby reducing the cleaving failure rate and product scrap rate. Attached Figure Description

[0036] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0037] Figure 1 This is a schematic diagram showing the installation location of the sharding feedback control system of the present invention;

[0038] Figure 2 This is a three-dimensional schematic diagram of the overall structure of the present invention;

[0039] Figure 3 This is a front view of the overall structure of the present invention;

[0040] Figure 4 This is a diagram of the sharding feedback control system architecture of the present invention;

[0041] Figure 5 This is the logic diagram for the three-level threshold judgment of the present invention;

[0042] Figure 6 This is a diagram showing the bidirectional linkage of the cutting and splitting of the fragments in this invention;

[0043] Figure 7 This is a flowchart of the overall method of the present invention.

[0044] In the diagram: 1. Frame; 2. Fixed-path laser cutting assembly; 21. Laser cutting head; 3. Laser dicing assembly; 31. Laser dicing head; 4. First adsorption platform; 5. Second adsorption platform; 6. Common guide rail; 7. First X-axis drive assembly; 8. Second X-axis drive assembly; 9. First Y-axis drive assembly; 10. Second Y-axis drive assembly; 11. X3-axis drive assembly; 12. Marble crossbeam; 13. Dicing feedback control system; 131. Sensing module; 132. Judgment module; 133. Linkage module; 14. Infrared thermal imaging sensor; 15. Dicing status detection sensor. Detailed Implementation

[0045] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0046] This embodiment discloses a dual-station fixed-beam co-track glass cutting and cleaving integrated machine, according to the attached... Figure 1 To be continued Figure 7 As shown, it includes a frame 1, a fixed-path laser cutting assembly 2, a laser dicing assembly 3, a first adsorption platform 4, a second adsorption platform 5, a common guide rail 6, a first X-axis drive assembly 7, a second X-axis drive assembly 8, a first Y-axis drive assembly 9, a second Y-axis drive assembly 10, an X3-axis drive assembly 11, a marble crossbeam 12, and a dicing feedback control system 13.

[0047] The frame 1, as the basic load-bearing structure of the entire equipment, is made of high-strength steel and welded and aged, giving it sufficient rigidity and stability. The bottom of the frame 1 is equipped with multiple adjustable feet to adjust the overall level of the equipment. A marble crossbeam 12 is fixedly installed on the top of the frame 1. The marble crossbeam 12 extends along the X-axis and is made of natural granite, which has a low coefficient of thermal expansion, providing a stable installation reference for subsequent motion axes.

[0048] The fixed-beam laser cutting assembly 2 is mounted on the frame 1 and is used to output a laser beam to cut the glass substrate. The fixed-beam laser cutting assembly 2 includes a laser cutting head 21 fixedly mounted on the frame 1. The laser beam emission position of the laser cutting head 21 is kept fixed in the horizontal plane. This embodiment adopts a fixed-beam design. After the laser is emitted from the laser, it is reflected and focused by a fixed optical lens group and then emitted from the laser cutting head 21. The optical path length remains constant throughout the entire processing. Since the laser beam has a certain divergence angle, different optical path lengths will cause differences in the size of the focused spot and the energy density. The fixed-beam design ensures that the focused light quality is consistent at every point on the processing area. The laser cutting head 21 is equipped with a focusing lens. The focal length of the focusing lens is selected according to the processing requirements. The laser cutting head 21 also integrates an air blowing device, which blows compressed air or inert gas into the processing area during the cutting process to remove the slag and debris generated during cutting, and at the same time, it cools the glass substrate.

[0049] The laser cleaving assembly 3 is mounted on the frame 1 and is used to cleave the cut glass substrate. The laser cleaving assembly 3 includes an X3-axis drive assembly 11 and a laser cleaving head 31. The X3-axis drive assembly 11 is inverted and mounted below the marble crossbeam 12. By inverting and mounting the X3-axis drive assembly 11 below the marble crossbeam 12 instead of mounting it on the side or above the crossbeam, the installation height of the laser cleaving head 31 can be reduced, making the overall structure more compact. At the same time, the overhang length of the laser cleaving head 31 during movement is reduced, which is beneficial to improving motion rigidity and positioning accuracy. The X3-axis drive assembly 11 includes an X3-axis linear motor, an X3-axis guide rail, and an X3-axis slider. The stator of the X3-axis linear motor is fixedly mounted on the marble crossbeam 12. On the lower surface, the X3 axis guide rail is fixedly installed on both sides of the lower surface of the marble beam 12 along the X-axis direction. The X3 axis slider is slidably installed on the X3 axis guide rail. The mover of the X3 axis linear motor is fixedly connected to the X3 axis slider. The laser dicing head 31 is fixedly installed on the X3 axis slider. The laser dicing head 31 is driven by the X3 axis drive assembly 11 to move along the X-axis direction. The laser dicing head 31 is located downstream of the fixed beam laser cutting assembly 2, that is, along the processing flow direction. The glass substrate is first cut by the laser cutting head 21 and then diced by the laser dicing head 31. The laser dicing head 31 usually uses a CO2 laser as the dicing light source. By heating the glass substrate along the cutting trajectory, thermal stress is generated, causing the glass to separate along the cutting trajectory.

[0050] The first adsorption platform 4 and the second adsorption platform 5 are both mounted on the frame 1 and are used to adsorb and fix the glass substrate, respectively. The first adsorption platform 4 and the second adsorption platform 5 have the same structure, both including a platform substrate and vacuum adsorption holes disposed on the upper surface of the platform substrate. The vacuum adsorption holes are arranged in an array and are connected to an external vacuum generator through pipes. When the glass substrate is placed on the upper surface of the adsorption platform, the vacuum generator is activated, and the glass substrate is adsorbed and fixed to the surface of the adsorption platform through the vacuum adsorption holes, preventing the glass substrate from shifting during cutting and sharding. The first adsorption platform 4 and the second adsorption platform 5 share the same common guide. The common guide rail 6 extends along the X-axis and is fixedly installed on the upper surface of the frame 1. The first adsorption platform 4 is installed on the first X-axis drive assembly 7 and is driven by the first X-axis drive assembly 7 to move along the common guide rail 6. The second adsorption platform 5 is installed on the second X-axis drive assembly 8 and is driven by the second X-axis drive assembly 8 to move along the common guide rail 6. Both the first X-axis drive assembly 7 and the second X-axis drive assembly 8 are linear motors. Compared with the traditional screw drive method, the linear motor drive has the advantages of fast response speed, large acceleration, no backlash, and high positioning accuracy, which can meet the needs of high-speed and high-precision processing.

[0051] The first X-axis drive assembly 7 includes a stator and a mover of a first X-axis linear motor and a first X-axis slider. The stator of the first X-axis linear motor is fixedly installed along the length direction of the common guide rail 6. The mover of the first X-axis linear motor is fixedly connected to the first X-axis slider. The first adsorption platform 4 is fixedly installed on the first X-axis slider. The second X-axis drive assembly 8 includes a stator and a mover of a second X-axis linear motor and a second X-axis slider. The stator of the second X-axis linear motor is fixedly installed along the length direction of the common guide rail 6. The mover of the second X-axis linear motor is fixedly connected to the second X-axis slider. The second adsorption platform 5 is fixedly installed on the second X-axis slider. The stators of the first X-axis drive assembly 7 and the second X-axis drive assembly 8 are arranged side by side along the length direction of the common guide rail 6 and do not interfere with each other.

[0052] The first adsorption platform 4 and the second adsorption platform 5 are configured such that when one adsorption platform moves to the cutting station, the other adsorption platform moves to the avoidance station. The cutting station is located in the middle area of ​​the equipment along the X-axis, that is, directly below the laser beam emission position of the laser cutting head 21. The avoidance station is located in the left or right edge area of ​​the equipment along the X-axis. When the first adsorption platform 4 moves to the cutting station, the second adsorption platform 5 moves to the right avoidance station; when the second adsorption platform 5 moves to the cutting station, the first adsorption platform 4 moves to the left avoidance station. This alternating working mode ensures that only one adsorption platform is directly below the laser cutting head 21 at any given time, avoiding motion interference between the two adsorption platforms.

[0053] The first Y-axis drive assembly 9 is mounted on the bottom of the first adsorption platform 4 and drives the first adsorption platform 4 to move along the Y-axis direction. Specifically, the first Y-axis drive assembly 9 includes a first Y-axis linear motor, a first Y-axis guide rail, and a first Y-axis slider. The first Y-axis guide rail is fixedly mounted on the upper surface of the first X-axis slider along the Y-axis direction, and the first Y-axis slider is slidably mounted on the first Y-axis guide rail. The stator of the first Y-axis linear motor is fixedly mounted on the first X-axis slider, and the mover of the first Y-axis linear motor is fixedly connected to the first Y-axis slider. The first adsorption platform 4 is fixedly mounted on the first Y-axis slider. The second Y-axis drive assembly 10 is mounted on the bottom of the second adsorption platform 5 and drives the second adsorption platform 5 to move along the Y-axis direction. Specifically, the second Y-axis drive assembly 10 includes a second Y-axis linear motor, a second Y-axis guide rail, and a second Y-axis slider. The second Y-axis guide rail is fixedly mounted on the upper surface of the second X-axis slider along the Y-axis direction. The second Y-axis slider is slidably mounted on the second Y-axis guide rail. The stator of the second Y-axis linear motor is fixedly mounted on the second X-axis slider. The mover of the second Y-axis linear motor is fixedly connected to the second Y-axis slider. The second adsorption platform 5 is fixedly mounted on the second Y-axis slider. The first X-axis drive assembly 7, the second X-axis drive assembly 8, the first Y-axis drive assembly 9, and the second Y-axis drive assembly 10 together constitute a four-axis independent drive system. The four-axis independent drive system enables the first adsorption platform 4 and the second adsorption platform 5 to move independently along the X-axis and Y-axis directions in the horizontal plane. That is, the first adsorption platform 4 can be driven by the first X-axis drive assembly 7 and the first Y-axis drive assembly 9 to perform any XY composite motion in the horizontal plane, and the second adsorption platform 5 can be driven by the second X-axis drive assembly 8 and the second Y-axis drive assembly 10 to perform any XY composite motion in the horizontal plane. Moreover, the movements of the two adsorption platforms are independent of each other and do not interfere with each other.

[0054] When the first adsorption platform 4 moves to the cutting station, the first Y-axis drive assembly 9 drives the first adsorption platform 4 to move along the Y-axis, and the first X-axis drive assembly 7 drives the first adsorption platform 4 to move along the X-axis, so that the first adsorption platform 4 performs XY interpolation motion relative to the laser cutting head 21 in the horizontal plane, thereby cutting arbitrary planar patterns on the glass substrate surface on the first adsorption platform 4. At this time, the second adsorption platform 5 is located in the clearance station. When the second adsorption platform 5 moves to the cutting station, the second Y-axis drive assembly 10 drives the second adsorption platform 5 to move along the Y-axis, and the second X-axis drive assembly 8 drives the second adsorption platform 5 to move along the X-axis, so that the second adsorption platform 5 performs XY interpolation motion relative to the laser cutting head 21 in the horizontal plane, thereby cutting arbitrary planar patterns on the glass substrate surface on the second adsorption platform 5. At this time, the first adsorption platform 4 is located in the clearance station. During the cutting process, the laser beam emission position of the laser cutting head 21 remains fixed, and the adsorption platform carries the glass substrate to perform XY interpolation motion in the horizontal plane to achieve the cutting of arbitrary planar patterns.

[0055] The XY interpolation motion of the first adsorption platform 4 and the second adsorption platform 5 in the horizontal plane is independently executed by the first X-axis drive assembly 7 and the first Y-axis drive assembly 9, and the second X-axis drive assembly 8 and the second Y-axis drive assembly 10. The laser dicing head 31 is driven by the X3-axis drive assembly 11 to move along the X-axis direction, and the laser dicing head 31 cooperates with the first Y-axis drive assembly 9 or the second Y-axis drive assembly 10 to perform dicing operations on the glass substrate surface on the corresponding adsorption platform. Since the laser dicing head 31 only has the ability to move in the X-axis direction, when it is necessary to dice the glass substrate on a certain adsorption platform, the Y-axis drive assembly of the adsorption platform drives the adsorption platform to move along the Y-axis direction, so that the laser dicing head 31 performs XY composite motion relative to the glass substrate in the horizontal plane, thereby completing the dicing along the cutting trajectory. The laser dicing head 31 provides the movement in the X-axis direction, and the Y-axis drive assembly of the adsorption platform provides the movement in the Y-axis direction. The two cooperate to achieve two-dimensional coverage of the dicing trajectory.

[0056] When the first adsorption platform 4 moves to the cutting station for cutting, the X3 axis drive assembly 11 drives the laser cleaving head 31 to move to the right half of the frame 1, and the second Y-axis drive assembly 10 drives the second adsorption platform 5 to move along the Y-axis, so that the laser cleaving head 31 cooperates with the Y-axis movement of the second adsorption platform 5 to cleave the glass substrate on the second adsorption platform 5. At this time, the first adsorption platform 4 performs cutting in the middle area of ​​the equipment, and the second adsorption platform 5 performs cleaving in the right area of ​​the equipment. Cutting and cleaving are performed in parallel without interfering with each other. When the second adsorption platform 5 moves to the cutting station for cutting, the X3 axis drive assembly 11 drives the laser cleaving head 31 to move to the left half of the frame 1, and the first Y-axis drive assembly 9 drives the first adsorption platform 4 to move along the Y-axis, so that the laser cleaving head 31 cooperates with the Y-axis movement of the first adsorption platform 4 to cleave the glass substrate on the first adsorption platform 4. At this time, the second adsorption platform 5 performs cutting in the middle area of ​​the equipment, and the first adsorption platform 4 performs cleaving in the left area of ​​the equipment. Cutting and cleaving are also performed in parallel.

[0057] The cleaving feedback control system 13 is communicatively connected to the laser cleaving assembly 3 and the fixed-beam laser cutting assembly 2. It is used to adjust the cutting parameters of the fixed-beam laser cutting assembly 2 according to the cleaving status feedback information of the laser cleaving assembly 3. The cleaving feedback control system 13 includes a sensing module 131, a judgment module 132 and a linkage module 133.

[0058] The sensing module 131 is integrated into the laser cleaving assembly 3 and includes an infrared thermal imaging sensor 14 and a cleaving state detection sensor 15. The infrared thermal imaging sensor 14 is installed near the laser cleaving head 31 and moves with it. It is used to monitor the temperature field distribution of the glass substrate along the cutting trajectory in real time. During the cleaving process, the CO2 laser heats the glass substrate along the cutting trajectory to generate a temperature field. The infrared thermal imaging sensor 14 obtains the temperature distribution data of the heated area by detecting infrared radiation. The cleaving state detection sensor 15 is installed near the laser cleaving head 31 and moves with it. It is used to detect in real time whether the glass substrate has separated along the cutting trajectory. The cleaving state detection sensor 15 is preferably a laser rangefinder. It determines whether the glass has successfully separated along the cutting trajectory by detecting the height change of the glass substrate surface before and after cleaving. When the glass separates along the cutting trajectory, a height difference will be generated on the two sides of the glass surface at the separation point. The laser rangefinder can determine whether the cleaving was successful by measuring this height difference. The sensing module 131 transmits the collected temperature data and cleaving state data to the judgment module 132.

[0059] The judgment module 132 is used to determine the fracture state based on the detection data of the sensing module 131 and output a feedback signal. The judgment module 132 has a built-in three-level threshold judgment logic:

[0060] Level 1 threshold: When the peak temperature of the heating zone is lower than the lower limit of the target cleaving temperature, for example, 5°C lower than the set value, it indicates that the current cleaving energy is insufficient. The judgment module 132 outputs the first feedback signal, and the linkage module 133 controls the laser cleaving component 3 to increase the laser power or decrease the cleaving speed according to the first feedback signal, for example, by increasing by 3% or decreasing by 5% in steps, until the temperature reaches the target. By monitoring the temperature in real time and dynamically adjusting the cleaving parameters, it is ensured that the cleaving process is always in the optimal energy state.

[0061] Secondary threshold: When the glass substrate is not separated after a certain segment of the trajectory is cleaved, for example, if the height difference is less than the set threshold, it indicates that the cleaving of that segment has failed. The judgment module 132 records the position coordinates of the unseparated segment and outputs a second feedback signal. The linkage module 133 controls the laser cleaving component 3 to return to the starting point of the segment and re-execute the cleaving with the enhanced energy according to the second feedback signal. The secondary threshold enables precise re-cleaving of local cleaving failure segments, avoiding rework of the entire plate.

[0062] Level 3 Threshold: When the cumulative number of cleaving failures on the same adsorption platform reaches the set threshold, such as the cumulative number of cleaving failures ≥ 3 times, or a certain trajectory still fails to separate after two re-cleaving attempts, it indicates that there may be a problem with the cutting quality of the glass substrate at this station, such as insufficient cutting depth or deviation in the cutting trajectory. The judgment module 132 outputs a third feedback signal, and the linkage module 133 controls the fixed-path laser cutting component 2 to perform supplementary cutting along the original cutting trajectory on the adsorption platform according to the third feedback signal, that is, to perform a second cutting along the original trajectory to deepen the cutting. After the supplementary cutting is completed, the laser cleaving component 3 is scheduled again to perform cleaving.

[0063] The linkage module 133 is communicatively connected to the fixed-beam laser cutting component 2 and is used to adjust the cutting parameters of the fixed-beam laser cutting component 2 according to the feedback signal. The core function of the linkage module 133 is to drive the adjustment of cutting parameters by reverse feedback of the cleaving. When cleaving failure occurs frequently at a certain station, such as when the second or third level threshold is triggered and the number of failures exceeds the preset threshold, it indicates that there may be a problem with the cutting quality of the station. The linkage module 133 feeds this information back to the cutting parameter database and automatically optimizes the cutting parameters of the same batch of glass in the future, such as increasing the laser power and reducing the cutting speed, thereby reducing the cleaving failure rate from the source.

[0064] The working process of this device will be described in detail below with reference to specific embodiments:

[0065] This embodiment takes the parallel working mode of the first adsorption platform 4 cutting and the second adsorption platform 5 splitting as an example, combined with the attached... Figure 1 To be continued Figure 7 The workflow is explained in detail below:

[0066] Step S1: Loading – Place the first glass substrate to be processed on the first adsorption platform 4, place the second glass substrate to be processed on the second adsorption platform 5, start the vacuum generator, and adsorb and fix the first glass substrate and the second glass substrate respectively through the vacuum adsorption holes of the first adsorption platform 4 and the second adsorption platform 5.

[0067] Step S2: Cutting station switching and control - Control the first X-axis drive assembly 7 to drive the first adsorption platform 4 to move along the common guide rail 6 to the cutting station, which is the middle area of ​​the equipment, directly below the laser cutting head 21; at the same time, control the second X-axis drive assembly 8 to drive the second adsorption platform 5 to move along the common guide rail 6 to the right-side clearance station.

[0068] Step S3: Cutting Operation - Start the fixed-path laser cutting assembly 2, the laser cutting head 21 outputs a laser beam, the first X-axis drive assembly 7 drives the first adsorption platform 4 to move along the X-axis direction, and the first Y-axis drive assembly 9 drives the first adsorption platform 4 to move along the Y-axis direction, so that the first adsorption platform 4 performs XY interpolation motion relative to the laser cutting head 21 in the horizontal plane. The laser beam scans along the preset cutting trajectory on the surface of the first glass substrate to complete the laser cutting of any planar pattern. During the entire cutting process, the laser beam emission position of the laser cutting head 21 remains fixed in the horizontal plane, and the optical path length remains constant.

[0069] Step S4: Fracturing Station Switching - While the first adsorption platform 4 is performing the cutting operation, the X3 axis drive assembly 11 is controlled to drive the laser fracturing head 31 to move along the X-axis to the right half of the frame 1, corresponding to the second adsorption platform 5 located in the right-side clearance station.

[0070] Step S5: Cleaving Operation – The laser cleaving head 31 is activated, and the second Y-axis drive assembly 10 drives the second adsorption platform 5 to move along the Y-axis. The laser cleaving head 31, in coordination with the Y-axis movement of the second adsorption platform 5, cleaves the second glass substrate along the cutting trajectory. During the cleaving process, the infrared thermal imaging sensor 14 of the sensing module 131 monitors the temperature field distribution of the second glass substrate along the cutting trajectory in real time, and the cleaving status detection sensor 15 detects in real time whether the second glass substrate has separated along the cutting trajectory. The judgment module 132 judges the cleaving based on the detection data of the sensing module 131. Glass status: If the peak temperature of the heating zone is lower than the lower limit of the target cleaving temperature, the linkage module 133 controls the laser cleaving assembly 3 to increase the laser power or decrease the cleaving speed; if the glass is not separated after cleaving a certain segment of the trajectory, the linkage module 133 controls the laser cleaving head 31 to return to the starting point of that segment and re-execute the cleaving with the increased energy; if the cumulative number of cleaving failures at the same station reaches the set threshold, the linkage module 133 controls the fixed-path laser cutting assembly 2 to re-cut the glass substrate at that station along the original cutting trajectory, and after the re-cutting is completed, the laser cleaving head 31 is re-scheduled to cleave.

[0071] Step S6: Unloading – After the first glass substrate is cut and the second glass substrate is cleaved, turn off the vacuum generator and remove the cut and cleaved glass substrate from the first adsorption platform 4 and the second adsorption platform 5.

[0072] Finally, it should be noted that the above are merely preferred embodiments of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A dual-station fixed-light co-track glass cutting and cleaving integrated machine, characterized in that, include: Rack (1); A fixed-beam laser cutting assembly (2) is mounted on the frame (1) and is used to output a laser beam to cut the glass substrate; A laser cleaving assembly (3) is installed on the frame (1) and is used to cleave the cut glass substrate. The first adsorption platform (4) and the second adsorption platform (5) are both set on the frame (1) and are used to adsorb and fix the glass substrate respectively. The first adsorption platform (4) and the second adsorption platform (5) share the same common guide rail (6), and the first adsorption platform (4) and the second adsorption platform (5) are configured such that when one of the adsorption platforms moves to the cutting station, the other adsorption platform moves to the avoidance station. The cleaving feedback control system (13) is communicatively connected to the laser cleaving assembly (3) and the fixed-beam laser cutting assembly (2), and is used to adjust the cutting parameters of the fixed-beam laser cutting assembly (2) according to the cleaving status feedback information of the laser cleaving assembly (3).

2. The dual-station fixed-light co-track glass cutting and cleaving integrated machine according to claim 1, characterized in that, The common guide rail (6) extends along the X-axis direction. The first adsorption platform (4) is mounted on the first X-axis drive assembly (7) and driven by the first X-axis drive assembly (7) to move along the common guide rail (6). The second adsorption platform (5) is mounted on the second X-axis drive assembly (8) and driven by the second X-axis drive assembly (8) to move along the common guide rail (6). Both the first X-axis drive assembly (7) and the second X-axis drive assembly (8) are linear motors.

3. The dual-station fixed-light co-track glass cutting and cleaving integrated machine according to claim 2, characterized in that, It also includes a first Y-axis drive assembly (9) and a second Y-axis drive assembly (10). The first Y-axis drive assembly (9) is installed at the bottom of the first adsorption platform (4) and drives the first adsorption platform (4) to move along the Y-axis direction. The second Y-axis drive assembly (10) is installed at the bottom of the second adsorption platform (5) and drives the second adsorption platform (5) to move along the Y-axis direction. The first X-axis drive assembly (7), the second X-axis drive assembly (8), the first Y-axis drive assembly (9) and the second Y-axis drive assembly (10) together constitute a four-axis independent drive system, so that the first adsorption platform (4) and the second adsorption platform (5) can move independently along the X-axis direction and the Y-axis direction in the horizontal plane.

4. The dual-station fixed-light co-track glass cutting and cleaving integrated machine according to claim 3, characterized in that, The fixed-path laser cutting assembly (2) includes a laser cutting head (21) fixedly mounted on the frame (1). The laser beam emission position of the laser cutting head (21) remains fixed in the horizontal plane. When the first adsorption platform (4) moves to the cutting station, the first Y-axis drive assembly (9) drives the first adsorption platform (4) to move along the Y-axis direction, and the first X-axis drive assembly (7) drives the first adsorption platform (4) to move along the X-axis direction, so that the first adsorption platform (4) performs XY interpolation motion relative to the laser cutting head (21) in the horizontal plane, so as to place the glass substrate on the first adsorption platform (4) The second adsorption platform (5) is located at the avoidance station. When the second adsorption platform (5) moves to the cutting station, the second Y-axis drive assembly (10) drives the second adsorption platform (5) to move along the Y-axis direction, and the second X-axis drive assembly (8) drives the second adsorption platform (5) to move along the X-axis direction, so that the second adsorption platform (5) performs XY interpolation motion relative to the laser cutting head (21) in the horizontal plane to cut arbitrary planar patterns on the glass substrate surface on the second adsorption platform (5). At this time, the first adsorption platform (4) is located at the avoidance station.

5. A dual-station fixed-light co-track glass cutting and cleaving integrated machine according to claim 3, characterized in that, A marble crossbeam (12) is provided above the frame (1). The laser dicing assembly (3) includes an X3 axis drive assembly (11) and a laser dicing head (31). The X3 axis drive assembly (11) is installed upside down below the marble crossbeam (12). The laser dicing head (31) is installed on the X3 axis drive assembly (11) and is driven by the X3 axis drive assembly (11) to move along the X-axis direction. The laser dicing head (31) is located downstream of the fixed-path laser cutting assembly (2).

6. A dual-station fixed-light co-track glass cutting and cleaving integrated machine according to claim 5, characterized in that, The XY interpolation motion of the first adsorption platform (4) and the second adsorption platform (5) in the horizontal plane is independently performed by the first X-axis drive assembly (7) and the first Y-axis drive assembly (9), as well as the second X-axis drive assembly (8) and the second Y-axis drive assembly (10); the laser cleaving head (31) is driven by the X3-axis drive assembly (11) to move along the X-axis direction, and the laser cleaving head (31) cooperates with the first Y-axis drive assembly (9) or the second Y-axis drive assembly (10) to perform cleaving operation on the glass substrate surface on the corresponding adsorption platform.

7. A dual-station fixed-light co-track glass cutting and cleaving integrated machine according to claim 6, characterized in that, When the first adsorption platform (4) moves to the cutting station for cutting, the X3 axis drive assembly (11) drives the laser cleaving head (31) to move to the right half of the frame (1), and the second Y axis drive assembly (10) drives the second adsorption platform (5) to move along the Y axis, so that the laser cleaving head (31) cooperates with the Y axis movement of the second adsorption platform (5) to cleave the glass substrate on the second adsorption platform (5); when the second adsorption platform (5) moves to the cutting station for cutting, the X3 axis drive assembly (11) drives the laser cleaving head (31) to move to the left half of the frame (1), and the first Y axis drive assembly (9) drives the first adsorption platform (4) to move along the Y axis, so that the laser cleaving head (31) cooperates with the Y axis movement of the first adsorption platform (4) to cleave the glass substrate on the first adsorption platform (4).

8. A dual-station fixed-light co-track glass cutting and cleaving integrated machine according to claim 1, characterized in that, The cleaving feedback control system (13) includes a sensing module (131), a judgment module (132), and a linkage module (133). The sensing module (131) is integrated into the laser cleaving assembly (3) and includes an infrared thermal imaging sensor (14) and a cleaving state detection sensor (15). The infrared thermal imaging sensor (14) is used to monitor the temperature field distribution of the glass substrate along the cutting trajectory in real time, and the cleaving state detection sensor (15) is used to detect whether the glass substrate is separated along the cutting trajectory in real time. The judgment module (132) is used to judge the cleaving state based on the detection data of the sensing module (131) and output a feedback signal. The linkage module (133) is communicatively connected to the fixed-beam laser cutting assembly (2) and is used to adjust the cutting parameters of the fixed-beam laser cutting assembly (2) according to the feedback signal.

9. A dual-station fixed-light co-track glass cutting and cleaving integrated machine according to claim 8, characterized in that, The judgment module (132) has a built-in three-level threshold judgment logic: Level 1 threshold: When the peak temperature of the heating zone is lower than the lower limit of the target cleaving temperature, the judgment module (132) outputs a first feedback signal, and the linkage module (133) controls the laser cleaving assembly (3) to increase the laser power or decrease the cleaving speed according to the first feedback signal; Secondary threshold: When the glass substrate is not separated after a certain trajectory is cleaved, the judgment module (132) records the position coordinates of the unseparated segment and outputs a second feedback signal. The linkage module (133) controls the laser cleaving assembly (3) to return to the starting point of the segment and re-execute the cleaving with the enhanced energy according to the second feedback signal. Level 3 threshold: When the cumulative number of failed cleaving attempts on the same adsorption platform reaches the set threshold, the judgment module (132) outputs a third feedback signal, and the linkage module (133) controls the fixed-path laser cutting component (2) to perform supplementary cutting on the glass substrate on the adsorption platform along the original cutting trajectory according to the third feedback signal. After the supplementary cutting is completed, the laser cleaving component (3) is scheduled to perform cleaving again.

10. A method for cutting and cleaving glass using a dual-station fixed-beam co-track glass cutting and cleaving integrated machine as described in any one of claims 1 to 9, characterized in that, Includes the following steps: Step S1: Place the glass substrate to be processed on the first adsorption platform (4) and the second adsorption platform (5) respectively, and fix it by vacuum adsorption; Step S2: Control the first X-axis drive assembly (7) to drive the first adsorption platform (4) to move along the common guide rail (6) to the cutting station, or control the second X-axis drive assembly (8) to drive the second adsorption platform (5) to move along the common guide rail (6) to the cutting station; when one adsorption platform moves to the cutting station, the other adsorption platform moves to the avoidance station; Step S3: Start the fixed-path laser cutting component (2) to output the laser beam. The adsorption platform located at the cutting station performs XY interpolation motion in the horizontal plane, so that the glass substrate fixed on the adsorption platform moves relative to the laser beam emission position of the fixed-path laser cutting component (2) to cut arbitrary planar patterns on the surface of the glass substrate. Step S4: Control the X3 axis drive assembly (11) to drive the laser dicing head (31) to move along the X-axis to the side corresponding to the adsorption platform that is not in the cutting position; Step S5: Start the laser cleaving head (31), and the corresponding Y-axis drive component drives the adsorption platform that is not in the cutting position to move along the Y-axis direction, so that the laser cleaving head (31) cooperates with the Y-axis movement of the adsorption platform to cleave the glass substrate; during the cleaving process, the cleaving feedback control system (13) monitors the cleaving status in real time and adjusts the cutting parameters according to the cleaving status feedback information. Step S6: Remove the glass substrate that has been cut and split from the first adsorption platform (4) and the second adsorption platform (5).

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