A laser shock peening and pulse electrochemical polishing combined processing device and method

Abstract

The application provides a laser shock peening and pulse electrochemical polishing combined processing device and method, and belongs to the technical field of laser processing. An auxiliary assembly comprises a sliding plate slidingly connected to the inner wall of the third sliding groove, one end of the sliding plate close to the central axis of the processing box is fixedly connected with a supporting plate, a fourth sliding groove is formed in the outer wall close to the middle part of the supporting plate, a first sliding column is fixedly connected to the inner wall of one side of the fourth sliding groove close to the drain, two third elastic plates are fixedly connected to the outer wall of one side of the supporting plate away from the drain, an electrode clamp block is fixedly connected to one end of the third elastic plate away from the supporting plate, and a first tension spring is sleeved with the outer wall of the first sliding column. Through the auxiliary assembly, the supporting plate can be driven to rise or fall by treading the treading ring, so that the feeding and discharging of the workpiece are quickly completed, and the work efficiency of the workers is improved.

Description

Technical Field

[0001] This invention relates to the field of laser processing technology, and in particular to a laser shock peening and pulsed electrochemical polishing composite processing device and method. Background Technology

[0002] Laser shock peening is a surface strengthening technique that utilizes a high-energy, short-pulse laser to induce a plasma explosion, generating a shock wave that causes high-strain-rate plastic deformation in the metal surface. After laser shock peening, the workpiece develops residual compressive stress, refined grains, and a high-density dislocation structure, effectively improving the component's fatigue resistance, wear resistance, and resistance to stress corrosion cracking. Electropolishing, on the other hand, relies on the principle of anodic dissolution to preferentially remove micro-protrusions and defect layers from the metal surface, making it suitable for finishing complex surfaces and small areas.

[0003] Currently, the absorption-free laser shock peening process used in the industry eliminates the absorption layer coating process, offering advantages such as a short process flow, continuous scanning capability, and high degree of automation. However, when high-power-density pulsed lasers directly irradiate metal substrates, the workpiece surface is prone to generating ablation layers, oxide layers, and resolidification layers, while also producing defects such as microcracks, remelting lines, and micro-peaks. Therefore, after processing, electrolytic polishing is required to remove surface ablation products and optimize the workpiece surface quality.

[0004] Taking small and medium-sized square metal sheets as an example, the existing production lines of small and medium-sized processing plants cannot achieve fully automated linkage processing. After the workpiece is laser shock peening, it needs to be manually transferred to the electrolytic polishing station. This manual transfer mode not only reduces the overall processing efficiency, but also causes the ablation residue stripped off during electrolytic polishing to deposit in the polishing tank. As the residue continues to accumulate, it will cause changes in the processing environment of the tank solution, thereby affecting the polishing effect of subsequent workpieces. Therefore, this invention provides a liquid film-constrained, absorption-free laser shock peening and pulsed electrochemical micropolishing composite processing device and method to meet the requirements. Summary of the Invention

[0005] The technical problem to be solved by this invention is to provide a laser shock peening and pulsed electrochemical polishing composite processing device and method. By setting auxiliary components, the pallet can be raised or lowered by stepping on the ring to quickly complete the loading and unloading of workpieces, improving the work efficiency of the workers. In addition, a liquid film can be first laid to carry out laser shock peening to optimize the surface properties of the workpiece, and then micro-defects can be eliminated by electrochemical etching to achieve integrated composite processing. Furthermore, the polishing liquid after processing is filtered and returned to the storage tower for recycling and can clean up residues, which is beneficial to improving the processing quality of the workpieces and solving the problems of low work efficiency and residue residue interfering with the polishing quality of subsequent workpieces.

[0006] To solve the above-mentioned technical problems, the present invention provides the following technical solution: A laser shock peening and pulsed electrochemical polishing composite processing device includes an operating platform. A laser emitter and a processing box are respectively installed on the top of the operating platform. A partition is fixedly connected to the inner wall of the processing box. A third sliding groove is formed on the inner wall of one side of the processing box near the top. A fixing block is fixedly connected to the outer wall of one side of the processing box near the top. A drain outlet is formed on the inner wall of the processing box near the fixing block. A liquid storage tower is fixedly connected to the top of the fixing block. A water flow chamber is formed inside the fixing block near the liquid storage tower. The water flow chamber is connected to the inner wall of the liquid storage tower through a water flow channel. The water flow chamber is connected to the drain outlet through several branch outlets. An auxiliary component is installed on the inner wall of the processing box. The auxiliary component is used to assist the workpiece in processing. The auxiliary component includes a sliding plate slidably connected to the inner wall of the third sliding groove.

[0007] Optionally, a support plate is fixedly connected to one end of the sliding plate near the central axis of the processing box. A fourth sliding groove is formed on the outer wall of the support plate near the middle. A first sliding column is fixedly connected to the inner wall of the fourth sliding groove near the drain outlet. Two third elastic plates are fixedly connected to the outer wall of the support plate away from the drain outlet. An electrode clamp is fixedly connected to the end of the third elastic plate away from the support plate. A first tension spring is sleeved on the outer wall of the first sliding column.

[0008] Optionally, a second sliding column is slidably connected to the outer wall of the first sliding column, a sliding groove is formed on the outer wall of the second sliding column, a first abutting column is fixedly connected to the top of the second sliding column, a first scraper is fixedly connected to the outer wall of the first abutting column on the side away from the first tension spring, an anti-overflow plate is fixedly connected to the outer wall of the sliding plate near the middle, a third sliding column is fixedly connected to the end of the sliding plate away from the support plate, and a second tension spring is fixedly connected to the bottom outer wall of the third sliding column.

[0009] Optionally, a fixing cylinder is fixedly connected to the bottom outer wall of the processing box near the third sliding groove. A first sliding groove is formed on the outer wall of the fixing cylinder near the third sliding groove. A second sliding groove is formed on the outer wall of the fixing cylinder near the top. A cable is fixedly connected to the outer wall of the third sliding column near the top. A foot ring is fixedly connected to the end of the cable away from the third sliding column. Fixing plates are symmetrically fixedly connected to the outer wall of the liquid storage tower near the top.

[0010] Optionally, a first elastic plate is fixedly connected to the end of the fixed plate away from the liquid storage tower, a first limiting plate is fixedly connected to the end of the first elastic plate away from the fixed plate, a first guide plate is fixedly connected to the end of the first limiting plate near the processing box, a second limiting plate is fixedly connected to the bottom outer wall of the processing box away from the fixed cylinder, a fourth limiting plate is symmetrically fixedly connected to the two outer walls of the second limiting plate, and a second elastic plate is fixedly connected to the end of the second limiting plate away from the processing box.

[0011] Optionally, a third limiting plate is fixedly connected to the end of the second elastic plate away from the second limiting plate, a storage box is clamped on the top of the second limiting plate, two pressure plates are fixedly connected to the bottom of the outer wall of the tray near the third elastic plate, a first connecting plate and a first guide column are fixedly connected to the outer wall of the tray near the pressure plate, a fourth elastic plate is fixedly connected to the end of the first connecting plate away from the tray, and a second guide column is fixedly connected to the end of the fourth elastic plate away from the first connecting plate.

[0012] Optionally, a second abutting post is fixedly connected to the outer wall of the second guide post on the side away from the fourth elastic plate, and two connecting cylinders are fixedly connected to the outer wall of the support plate on the side near the third elastic plate. A fixing post is fixedly connected to the end of the connecting cylinder away from the support plate. A fifth sliding groove is opened at the end of the fixing post near the second limiting plate, a seventh sliding groove is opened at the top of the fixing post, and a sixth sliding groove is opened on the bottom outer wall of the end of the fixing post near the fifth sliding groove.

[0013] Optionally, a second connecting plate is fixedly connected to the bottom outer wall of the end of the fixed column away from the sixth sliding groove, a sliding block is slidably connected to the inner wall of the fifth sliding groove, a fourth connecting plate is fixedly connected to the outer wall of the sliding block near the sixth sliding groove, a pinch plate is fixedly connected to the top of the sliding block, a fifth elastic plate is fixedly connected to the end of the fourth connecting plate away from the sliding block, a third connecting plate is fixedly connected to the middle outer wall of the fourth connecting plate, and a third tension spring is fixedly connected to the outer wall of the third connecting plate near the second connecting plate.

[0014] Optionally, a sixth elastic plate is fixedly connected to the outer wall of the third connecting plate on the side away from the third tension spring, a fifth connecting plate is fixedly connected to the end of the sixth elastic plate away from the third connecting plate, a second scraper is fixedly connected to the end of the fifth elastic plate away from the fourth connecting plate and the end of the fifth connecting plate away from the sixth elastic plate, a third scraper is fixedly connected to the top outer wall of the second scraper, a water pump is fixedly connected to the bottom inner wall of the processing box, a suction pipe and a delivery pipe are fixedly connected to both sides of the water pump, and a filter unit is installed on the inner wall of the processing box near the suction pipe.

[0015] This invention also provides a composite processing method of laser shock peening and pulsed electrochemical polishing, comprising the following steps: Step 1, Processing Preparation: The worker steps on the ring to lift the pallet to load the workpiece, and after the pallet falls back to its original position, the liquid supply channel is opened to form a liquid film on the surface of the workpiece, thus completing the pre-processing preparation work. Step 2, Composite Processing: Relying on the liquid film on the workpiece surface, laser shock peening treatment is first carried out to optimize the surface properties of the workpiece. After the polishing liquid completely immerses the workpiece, the liquid supply channel is closed and the pulse power supply is turned on. Microscopic defects in the workpiece are removed through electrochemical action to complete the composite processing. Step 3: Polishing Fluid Purification: After processing, the water pump extracts the polishing fluid from the chamber, purifies it through the filtration unit, and then returns it to the storage tower for recycling. The equipment can also automatically clean residues, achieving self-purification of the polishing fluid and the equipment. Step 4, workpiece unloading: Step on the foot pedal again to lift the workpiece, release the clamping limit, take out the finished workpiece and collect it for unified cleaning. The equipment returns to its initial state and can proceed with the processing of the next workpiece.

[0016] Compared with the prior art, the present invention has at least the following beneficial effects: In the above scheme, by setting auxiliary components, the pallet can be raised or lowered by stepping on the ring to quickly complete the loading and unloading of workpieces, improving the work efficiency of the staff. It is also possible to first lay a liquid film to carry out laser shock strengthening to optimize the surface performance of the workpiece, and then eliminate micro-defects through electrochemical etching to achieve integrated composite processing. In addition, the polishing liquid after processing is filtered and returned to the storage tower for recycling and can clean up residues, which is conducive to improving the processing quality of the workpiece.

[0017] By setting a tray, a first sliding column, an electrode clamp, a second sliding column, a first abutting column, a fixed cylinder, a third sliding column, a cable, a stepping ring, and a first scraper in the auxiliary components, not only can the loading and unloading of workpieces be completed by raising or lowering the tray, but the liquid supply channel can also be opened to form a liquid film on the surface of the workpiece, thus completing the pre-processing preparation work.

[0018] By incorporating a pressure plate, water pump, suction pipe, delivery pipe, filter unit, first connecting plate, first guide column, and second guide column within the auxiliary components, impurities in the polishing fluid flowing towards the filter unit can be intercepted before the laser strengthening process. This, combined with the filtration of the polishing fluid by the filter unit, further improves the filtration effect of the polishing fluid.

[0019] By setting a connecting cylinder, a fixed column, a second connecting plate, a sliding block, a pinch plate, a fourth connecting plate, a third connecting plate, a fifth connecting plate, a second scraper, and a third scraper on the auxiliary components, the residue trapped on the first and second guide columns can be scraped off by the second scraper. Furthermore, during the process of the pallet rising, the residue on the inner wall of the processing box can be scraped off by the third scraper, thus preventing the residue from affecting the processing of the next workpiece.

[0020] By setting a second limiting plate, a fourth limiting plate, a second elastic plate, a third limiting plate, and a storage box on the auxiliary components, the scraped residue can be collected through the storage box, avoiding the need for subsequent cleaning of the residue by the staff and improving the work efficiency of the staff. Attached Figure Description

[0021] The accompanying drawings, which are incorporated herein and form part of the specification, illustrate embodiments of the invention and, together with the specification, further serve to explain the principles of the invention and enable those skilled in the art to practice and use the invention.

[0022] Figure 1 A three-dimensional structural schematic diagram of a composite processing device and method for liquid film-constrained laser shock peening and pulsed electrochemical micropolishing without an absorption layer; Figure 2 Enlarged 3D structural diagram of the processing box, storage box and liquid storage tower; Figure 3 An enlarged three-dimensional structural diagram of the processing box, the fixed cylinder, and the liquid storage tower; Figure 4 A semi-sectional enlarged three-dimensional structural diagram of the processing box, fixed cylinder and liquid storage tower; Figure 5 An enlarged three-dimensional structural diagram of the cooperation between the support plate, pressure plate, and fixing column; Figure 6 An enlarged three-dimensional structural diagram of the cooperation between the support plate, the pressure plate, and the second tension spring; Figure 7 An enlarged three-dimensional structural diagram of the second sliding column, the first abutting column, and the first scraper in combination; Figure 8 An enlarged three-dimensional structural diagram showing the cooperation between the fixed column, the fourth connecting plate, and the second scraper; Figure 9 An enlarged three-dimensional structural diagram showing the cooperation of the fourth connecting plate, the fifth connecting plate, and the second scraper.

[0023] Figure label: 1. Operating platform; 2. Laser emitter; 3. Processing box; 4. Fixing cylinder; 5. First sliding groove; 6. Second sliding groove; 7. Third sliding groove; 8. Fixing block; 9. Drain outlet; 10. Storage tower; 11. Flow trough; 12. Flow chamber; 13. Diverter; 14. Fixing plate; 15. First elastic plate; 16. First limiting plate; 17. First guide plate; 18. Suction pipe; 19. Water pump; 20. Water delivery pipe; 21. Filter unit; 22. Second limiting plate; 23. Second elastic plate; 24. Third limiting plate; 25. Fourth limiting plate; 26. Partition; 27. Storage box; 28. Cable; 29. ​​Step ring; 30. Support plate; 31. Fourth sliding groove; 32. First sliding column; 33. First tension spring; 34. Second sliding column; 3 5. Sliding groove; 36. First contact post; 37. First scraper; 38. Sliding plate; 39. Third sliding post; 40. Second tension spring; 41. Anti-overflow plate; 42. Third elastic plate; 43. Electrode clamp; 44. Pressure plate; 45. First connecting plate; 46. Fourth elastic plate; 47. First guide post; 48. Second guide post; 49. Second contact post; 50. Connecting cylinder; 51. Fixed post; 52. Fifth sliding groove; 53. Sixth sliding groove; 54. Seventh sliding groove; 55. Second connecting plate; 56. Sliding block; 57. Pinch plate; 58. Fourth connecting plate; 59. Second scraper; 60. Third scraper; 61. Fifth connecting plate; 62. Third connecting plate; 63. Third tension spring; 64. Fifth elastic plate; 65. Sixth elastic plate.

[0024] As shown in the figure, specific structures and devices are marked in the figure to clearly illustrate the structure of the embodiments of the present invention. However, this is only for illustrative purposes and is not intended to limit the present invention to this specific structure, device and environment. Those skilled in the art can adjust or modify these devices and environments according to specific needs. Detailed Implementation

[0025] The following is a detailed description of the liquid film-constrained, absorption-free laser shock peening and pulsed electrochemical micropolishing composite processing apparatus and method provided by the present invention, with reference to the accompanying drawings and specific embodiments. It should be noted that, to make the embodiments more detailed, the following embodiments are the best and preferred embodiments, and those skilled in the art can use other alternative methods to implement some known technologies; moreover, the accompanying drawings are only for more specific description of the embodiments and are not intended to specifically limit the present invention.

[0026] It should be noted that the use of terms such as "an embodiment," "an embodiment," "an exemplary embodiment," and "some embodiments" in the specification indicates that the described embodiment may include a specific feature, structure, or characteristic, but not every embodiment necessarily includes that specific feature, structure, or characteristic. Furthermore, when a specific feature, structure, or characteristic is described in connection with an embodiment, implementing such a feature, structure, or characteristic in conjunction with other embodiments (whether explicitly described or not) should be within the knowledge of those skilled in the art.

[0027] like Figures 1 to 9 As shown, an embodiment of the present invention provides a liquid film-constrained, absorption-free laser shock peening and pulsed electrochemical micropolishing composite processing device and method, including an operating platform 1. A laser transmitter 2 and a processing box 3 are respectively installed on the top of the operating platform 1. The processing box 3 is a square box with a carbon steel frame and an inner PVDF lining. A partition 26 is fixedly connected to the inner wall of the processing box 3. The partition 26 is a plate with an overall N-shaped structure and a sloping top. The partition 26 can divide the processing box 3 into two chambers. One chamber is in contact with the polishing liquid, and the other chamber is not in contact with the polishing liquid. A third sliding groove 7 is formed on the inner wall of one side of the processing box 3 near the top. The third sliding groove 7 is a square groove. The third sliding groove 7 is connected to the chamber in the processing box 3 that is in contact with the polishing liquid. A fixing block 8 is fixedly connected to the outer wall of one side of the processing box 3 near the top. A drain outlet 9 is formed on the inner wall of the processing box 3 near the fixing block 8. The drain outlet 9 is a square groove. The top of the fixing block 8 is fixedly connected to a liquid storage tower 10. The fixing block 8 is used to connect the liquid storage tower 10 and the processing box 3. The liquid storage tower 10 is a hollow cylinder. The liquid storage tower 10 is used to store polishing liquid that can withstand laser shock waves. The fixing block 8 has a water flow chamber 12 near the interior of the liquid storage tower 10. The water flow chamber 12 is a circular tank. The water flow chamber 12 is connected to the inner wall of the liquid storage tower 10 through a water flow trough 11. The water flow trough 11 is a circular tank, and a water flow trough 11 is provided inside. Equipped with a one-way valve, the polishing slurry in the storage tower 10 can enter the flow chamber 12 through the flow channel 11. The flow chamber 12 is connected to the drain outlet 9 through several branch outlets 13. The branch outlets 13 are circular tanks, and the branch outlets 13 are arranged in an arc array. The polishing slurry in the flow chamber 12 can enter the drain outlet 9 through the branch outlets 13 and be discharged from the drain outlet 9. An auxiliary component is installed on the inner wall of the processing box 3 to assist in the processing of the workpiece. By setting the auxiliary component, this application can not only quickly complete the loading and unloading of workpieces by stepping on the step ring 29 to drive the pallet 30 to rise or fall, thereby improving the work efficiency of the workers, but also first lay a liquid film to carry out laser shock strengthening to optimize the surface performance of the workpiece, and then eliminate micro-defects through electrochemical etching to achieve integrated composite processing. In addition, after processing, the polishing slurry is filtered and returned to the storage tower 10 for recycling and residue can be cleaned, which is beneficial to improving the processing quality of the workpiece.

[0028] In this embodiment, as Figures 2 to 7 As shown, the auxiliary component includes a sliding plate 38 slidably connected to the inner wall of the third sliding groove 7. The sliding plate 38 is a square plate, and the outer contour of the sliding plate 38 is adapted to the inner contour of the third sliding groove 7. The sliding plate 38 can slide on the inner wall of the third sliding groove 7. A support plate 30 is fixedly connected to one end of the sliding plate 38 near the central axis of the processing box 3. The support plate 30 is an N-shaped plate, and the overall contour of the support plate 30 is adapted to the outer contour of the partition 26. Therefore, the support plate 30 can be fitted onto the outer wall of the partition 26. A fourth sliding groove 31 is formed on the outer wall of the support plate 30 near the middle. The fourth sliding groove 31 is L-shaped. The fourth sliding groove 31 has a first sliding column 32 fixedly connected to its inner wall near the drain outlet 9. The first sliding column 32 is a circular column. Two third elastic plates 42 are fixedly connected to the outer wall of the support plate 30 away from the drain outlet 9. The third elastic plates 42 are C-shaped plates. When the third elastic plates 42 are subjected to force, they will deform along their bending direction. An electrode clamp 43 is fixedly connected to the end of the third elastic plate 42 away from the support plate 30. The electrode clamp 43 is a square titanium block, and the outer wall of the electrode clamp 43 near the bottom has a slope. A first tension spring 33 is sleeved on the outer wall of the first sliding column 32. When subjected to force, the first sliding column 32 will deform along its bending direction. A second sliding column 34 is slidably connected to the outer wall of the first sliding column 32. The second sliding column 34 is an L-shaped column with a sliding circular groove 35 on its outer wall. The sliding circular groove 35 is a circular groove. A first abutting column 36 is fixedly connected to the top of the second sliding column 34. The first abutting column 36 is a square column with inclined surfaces on both sides near its top. The inclination angle of the inclined surfaces of the first abutting column 36 matches the inclination angle of the inclined surface on the electrode clamp 43. When the inclined surface of the first abutting column 36 abuts against the electrode clamp 43… When the slope is inclined, the electrode clamp 43 will move away from the support plate 30 under the pushing action of the first abutment post 36. The first scraper 37 is fixedly connected to the outer wall of the first abutment post 36 away from the first tension spring 33. The first scraper 37 is an S-shaped plate, and the side of the first scraper 37 away from the first abutment post 36 is provided with an inclined surface. When the first scraper 37 is subjected to force, it will deform along its bending direction. One end of the first tension spring 33 is fixedly connected to the inner wall of the fourth sliding groove 31 near the first sliding post 32, and the other end of the first tension spring 33 is fixedly connected to the outer wall of the second sliding post 34 away from the first scraper 37.

[0029] When the worker places the workpiece on the pallet 30, one side of the workpiece abuts against the outer wall of the first abutment post 36 away from the first scraper 37. Then, the workpiece is pushed along the direction of the third elastic plate 42. The first abutment post 36 slides along the outer wall of the pallet 30 due to the workpiece's movement, and the second sliding post 34 slides synchronously along the inner wall of the fourth sliding groove 31. During this process, the inner wall of the sliding groove 35 of the second sliding post 34 adheres to the outer wall of the first sliding post 32, preventing the second sliding post 34 from detaching from the fourth sliding groove 31. As the second sliding post 34 slides, the first tension spring 33 experiences tension and bends, while the first scraper 37 moves with the first abutment post 36, its end away from the first abutment post 36 adhering to the top outer wall of the pallet 30, removing residue from the top surface of the pallet 30 and preventing uneven placement of the workpiece, which could affect subsequent laser strengthening operations. The first abutment post 36 moves along the outer wall of the pallet 30 towards the third elastic plate 42. When the sliding plate 42 slides, the inclined surface of the first abutting post 36 near the first scraper 37 presses against the inclined surface of the two electrode clamping blocks 43 away from the third elastic plate 42. Under the pushing action of the inclined surface, the two electrode clamping blocks 43 move away from the support plate 30, and the third elastic plate 42 is bent and deformed by the force. Until the second sliding post 34 slides along the outer wall of the first sliding post 32 to the end of the first sliding post 32 near the third elastic plate 42, the side wall of the first abutting post 36 away from the first scraper 37 presses against the inclined surface of the electrode clamping block 43 near the third elastic plate 42. At this time, the third elastic plate 42 is unloaded and rebounds to reset, and simultaneously drives the electrode clamping block 43 to reset. The bottom outer wall of the electrode clamping block 43 presses against the top surface of the workpiece, completing the workpiece limiting. During this process, as the bottom of the support plate 30 is attached to the top outer wall of the partition plate 26, the outer wall of the partition plate 26 away from the drain outlet 9 abuts against the outer wall of the second sliding post 34, realizing the limiting of the second sliding post 34.

[0030] like Figures 2 to 7As shown, an anti-overflow plate 41 is fixedly connected to the outer wall of the sliding plate 38 near the middle. The anti-overflow plate 41 is a square plate, and the outer wall of the anti-overflow plate 41 near the support plate 30 will abut against the outer wall of the processing box 3 near the third sliding groove 7. The anti-overflow plate 41 can prevent the polishing liquid in the processing box 3 from overflowing from the third sliding groove 7. A third sliding column 39 is fixedly connected to the end of the sliding plate 38 away from the support plate 30. The third sliding column 39 is a circular column. A fixing cylinder 4 is fixedly connected to the bottom outer wall of the processing box 3 near the third sliding groove 7. The fixing cylinder 4 is a hollow cylinder. A first sliding groove 5 is opened on the outer wall of the fixing cylinder 4 near the third sliding groove 7. The first sliding groove 5 is a square groove, and the outer wall contour of the sliding plate 38 is consistent with the first sliding groove 5. The inner wall contours are matched, so the sliding plate 38 can slide along the inner wall of the first sliding groove 5. The outer wall contour of the third sliding column 39 is matched with the inner wall contour of the fixed cylinder 4, so the sliding plate 38 can slide along the inner wall of the first sliding groove 5 and drive the third sliding column 39 to slide along the inner wall of the fixed cylinder 4. A second tension spring 40 is fixedly connected to the bottom outer wall of the third sliding column 39, and the other end of the second tension spring 40 is fixedly connected to the bottom inner wall of the fixed cylinder 4. When the second tension spring 40 is stressed, it will deform along its bending direction. A second sliding groove 6 is provided on the outer wall of the fixed cylinder 4 near the top. The second sliding groove 6 is a semi-circular groove. A cable 28 is fixedly connected to the outer wall of the third sliding column 39 near the top. One end of the cable 28 is fixedly connected to the top of the third sliding column 39. The end of the cable 28 away from the third sliding column 39 is fixedly connected to a foot ring 29. When the operator steps on the foot ring 29, the foot ring 29 moves towards the ground, pulling the cable 28. At this time, the third sliding column 39 slides along the inner wall of the fixed cylinder 4 towards the top of the fixed cylinder 4 under the influence of the cable 28. The second tension spring 40, under stress, deforms along its bending direction. The third sliding column 39 drives the sliding plate 38 to slide along the inner wall of the third sliding groove 7. Simultaneously, the support plate 30 moves synchronously under the influence of the sliding plate 38. This releases the restriction on the second sliding column 34, and the workpiece restricted at the top of the support plate 30 will move with the support plate 30. During the process, the workpiece is pushed towards the top of the storage tower 10 by the first abutting column 36. A fixed plate 14, a square plate, is symmetrically fixed to the outer wall of the storage tower 10 near the top. A first elastic plate 15, a C-shaped plate, is fixedly connected to the end of the fixed plate 14 away from the storage tower 10. When the first elastic plate 15 is subjected to force, it deforms along its bending direction. A first limiting plate 16, a square plate, is fixedly connected to the end of the first elastic plate 15 away from the fixed plate 14. A first guide plate 17, an inclined square plate, is fixedly connected to the end of the first limiting plate 16 near the processing box 3. The first guide plate 17 provides guidance for the workpiece sliding between the two first limiting plates 16.As the workpiece moves along the pallet 30, it is pushed towards the top of the storage tower 10 by the first abutting post 36. Guided by the two first guide plates 17, the workpiece slides between the two first limiting plates 16. During this process, the two first limiting plates 16 move away from the storage tower 10 under the pressure of the workpiece. At this time, the first elastic plate 15 is subjected to force and deforms along its bending direction. Simultaneously, under the elasticity of the first elastic plate 15, it drives the two first limiting plates 16 to move towards the central axis of the storage tower 10, thus clamping the workpiece. This structural arrangement not only allows for the loading and unloading of workpieces by raising or lowering the pallet 30, but also opens the liquid supply channel to form a liquid film on the workpiece surface, completing the pre-processing preparation work.

[0031] like Figures 4 to 6As shown, two pressure plates 44 are fixedly connected to the bottom of the outer wall of the pallet 30 near the third elastic plate 42. The pressure plates 44 are square plates. A water pump 19 is fixedly connected to the bottom inner wall of the processing box 3. The water pump 19 is a prior art and will not be described in detail. A suction pipe 18 and a delivery pipe 20 are fixedly connected to both sides of the water pump 19. Both the suction pipe 18 and the delivery pipe 20 are metal round pipes with an anti-corrosion coating on the inner wall. The end of the suction pipe 18 away from the water pump 19 is connected to the outer wall of the partition 26 away from the drain outlet 9. The end of the delivery pipe 20 away from the water pump 19 is fixedly connected to the outer wall of the storage tower 10 near the top. A filter unit 21 is installed on the inner wall of the processing box 3 near the suction pipe 18. The filter unit 21 can be connected to the water pump 19. After startup, the polishing liquid entering the filter unit 21 is filtered. The two pressure plates 44 press down on the filter unit 21 when the support plate 30 is attached to the outer wall of the partition plate 26, providing a certain degree of fixation. When the water pump 19 starts, the polishing liquid in the processing box 3, filtered by the filter unit 21, enters the water pump 19 through the suction pipe 18. The water pump 19 then delivers the filtered polishing liquid to the storage tower 10 through the water delivery pipe 20. A first connecting plate 45 and a first guide column 47 are fixedly connected to the outer wall of the support plate 30 near the pressure plate 44. The first connecting plate 45 is a square plate, while the first guide column 47 is a column with a right-angled triangular cross-section, and the inclined surface of the first guide column 47 has serrations. The first connecting plate 45 is located away from the support plate 3. One end of the plate 0 is fixedly connected to a fourth elastic plate 46, which is a C-shaped plate. When the fourth elastic plate 46 is subjected to force, it will deform along its bending direction. The end of the fourth elastic plate 46 away from the first connecting plate 45 is fixedly connected to a second guide column 48, which is a column with a right-angled triangular cross-section and has serrations on its inclined surface. A second abutment column 49 is fixedly connected to the outer wall of the second guide column 48 away from the fourth elastic plate 46. The second abutment column 49 is a square column with an open bottom end. When the support plate 30 is attached to the outer wall of the partition plate 26, the end of the second abutment column 49 away from the second guide column 48 will drive the second guide column 48 toward the top of the processing box 3. As the part moves in the direction of the bending, the fourth elastic plate 46 will be stressed and deform along its bending direction. At this time, the polishing liquid flows out from the drain outlet 9. Under the guidance of the overall tilt of the support plate 30, the polishing liquid will flow to the toothed outer wall of the second guide column 48. Guided by the inclined surface of the second guide column 48, the polishing liquid on the second guide column 48 will flow to the toothed outer wall of the first guide column 47. Finally, the polishing liquid guided by the inclined surface of the first guide column 47 will flow to the filter unit 21. During this process, the teeth on the second guide column 48 and the first guide column 47 will intercept impurities in the polishing liquid, which is beneficial to improving the filtration effect of the subsequent filter unit 21. The above structural settings can be used during the laser strengthening process.The first guide column 47 and the second guide column 48 intercept impurities in the polishing fluid flowing towards the filter unit 21, further improving the filtration effect of the polishing fluid in conjunction with the filtration unit 21.

[0032] like Figures 5 to 9As shown, two connecting cylinders 50 are fixedly connected to the outer wall of the support plate 30 near the third elastic plate 42. The two connecting cylinders 50 are symmetrical about the central axis of the support plate 30. A fixing post 51 is fixedly connected to the end of the connecting cylinder 50 away from the support plate 30. The fixing post 51 is a square column. A fifth sliding groove 52 is formed at the end of the fixing post 51 near the second limiting plate 22. The fifth sliding groove 52 is a square groove. A seventh sliding groove 54 is formed at the top of the fixing post 51. The seventh sliding groove 54 is a square groove. A sixth sliding groove 53 is formed on the bottom outer wall of the end of the fixing post 51 near the fifth sliding groove 52. The sixth sliding groove 53 is a square groove. The fixing post 51 is located away from the sixth sliding groove 53. A second connecting plate 55 is fixedly connected to the bottom outer wall of one end. The second connecting plate 55 is a square plate. A sliding block 56 is slidably connected to the inner wall of the fifth sliding groove 52. The sliding block 56 is a square block, and the outer contour of the sliding block 56 matches the inner contour of the fifth sliding groove 52. Therefore, the sliding block 56 can slide on the inner wall of the fifth sliding groove 52. A pinch plate 57 is fixedly connected to the top of the sliding block 56. The pinch plate 57 is a square plate with rounded corners at the top, and the bottom outer contour of the pinch plate 57 matches the inner contour of the seventh sliding groove 54. Therefore, the pinch plate 57 can slide along the inner wall of the seventh sliding groove 54, and drive the sliding block 56 to slide along the inner wall of the fifth sliding groove 52. The sliding block 56 approaches the sixth sliding groove 52. A fourth connecting plate 58 is fixedly connected to one outer wall of the sliding groove 53. The fourth connecting plate 58 is a square plate with an overall L-shaped structure, and the outer contour of the fourth connecting plate 58 matches the inner contour of the sixth sliding groove 53. Therefore, the fourth connecting plate 58 can slide along the inner wall of the sixth sliding groove 53. A fifth elastic plate 64 is fixedly connected to the end of the fourth connecting plate 58 away from the sliding block 56. The fifth elastic plate 64 is a C-shaped plate. When the fifth elastic plate 64 is subjected to force, it will deform along its bending direction. A third connecting plate 62 is fixedly connected to the middle outer wall of the fourth connecting plate 58. The third connecting plate 62 is a convex plate, and the outer contour of the top of the third connecting plate 62 matches the inner contour of the sixth sliding groove 53. Therefore, the third connecting plate 62 can slide along the inner wall of the sixth sliding groove 53. The connecting plate 62 can slide along the inner wall of the sixth sliding groove 53. A third tension spring 63 is fixedly connected to the outer wall of the third connecting plate 62 near the second connecting plate 55. The end of the third tension spring 63 away from the third connecting plate 62 is fixedly connected to the outer wall of the second connecting plate 55 near the third connecting plate 62. When the third tension spring 63 is subjected to force, it will deform along its bending direction. A sixth elastic plate 65, which is a C-shaped plate, is fixedly connected to the outer wall of the third connecting plate 62 away from the third tension spring 63. When the sixth elastic plate 65 is subjected to force, it will deform along its bending direction. A fifth connecting plate 61, which is a square plate, is fixedly connected to the end of the sixth elastic plate 65 away from the third connecting plate 62.A second scraper 59 is fixedly connected to the end of the fifth elastic plate 64 away from the fourth connecting plate 58 and the end of the fifth connecting plate 61 away from the sixth elastic plate 65, respectively. The second scraper 59 is a triangular plate, and its outer walls near the bottom are provided with teeth. Since the teeth on the second scraper 59 are compatible with the teeth on the second guide column 48 and the first guide column 47, a third scraper 60 is fixedly connected to the top outer wall of the second scraper 59. The third scraper 60 is a prism with a triangular cross-section. The third scraper 60 can abut against one side of the inner wall of the processing box 3. When the third scraper 60 moves towards the top of the processing box 3 along with the second scraper 59, it scrapes away the residue remaining on the inner wall of the processing box 3.

[0033] As the tray 30 moves toward the top of the storage tower 10, the second contact column 49 no longer contacts the top of the filter unit 21. The second guide column 48, driven by the fourth elastic plate 46, moves to a position flush with the first guide column 47. At this point, the two second scrapers 59, under the elasticity of the two fifth elastic plates 64 and the sixth elastic plate 65 respectively, move toward the first guide column 47 until the teeth on the second scrapers 59 engage with the teeth on the first guide column 47 and the second guide column 48 respectively. Then, the operator pinches the pinch plate 57 and moves it along the inner wall of the seventh sliding groove 54 toward the sixth sliding groove. When sliding occurs in direction 53, the fourth connecting plate 58 and the fifth elastic plate 64 move synchronously with the sliding block 56, while the third connecting plate 62, the sixth elastic plate 65, and the fifth connecting plate 61 move synchronously with the fourth connecting plate 58. The two second scrapers 59 move synchronously under the drive of the fifth connecting plate 61 and the fifth elastic plate 64, respectively. With the above structure, the second scrapers 59 can scrape off the residue trapped on the first guide column 47 and the second guide column 48. During the rise of the pallet 30, the third scraper 60 can scrape off the residue on the inner wall of the processing box 3, so as to avoid the residue affecting the processing of the next workpiece.

[0034] like Figures 1 to 3As shown, a second limiting plate 22 is fixedly connected to the bottom outer wall of the processing box 3 on the side away from the fixed cylinder 4. The second limiting plate 22 is an L-shaped plate. A fourth limiting plate 25 is symmetrically fixedly connected to the two outer walls of the second limiting plate 22. The fourth limiting plate 25 is an L-shaped plate. A second elastic plate 23 is fixedly connected to the end of the second limiting plate 22 away from the processing box 3. The second elastic plate 23 is a C-shaped plate. When the second elastic plate 23 is subjected to force, it will deform along its bending direction. A third limiting plate 24 is fixedly connected to the end of the second elastic plate 23 away from the second limiting plate 22. The third limiting plate 24 is a square plate, and a curved part is provided at the top of the third limiting plate 24. A storage box 27 is clamped at the top of the second limiting plate 22. The storage box 27 is a square box. When the worker... When the storage box 27 is placed on top of the second limiting plate 22, the bottom of the storage box 27 will slide between the two fourth limiting plates 25 under the guidance of the curved part of the third limiting plate 24. At this time, the second elastic plate 23 will be subjected to force and deform along its bending direction. At the same time, under the action of the elasticity of the second elastic plate 23, it will drive the third limiting plate 24 to move towards the processing box 3 and form a limiting and fixing of the storage box 27. As the tray 30 moves towards the top of the liquid storage tower 10, the storage box 27 can collect the residue scraped off by the second scraper 59 from the first guide column 47 and the second guide column 48. The above structure can collect the scraped residue through the storage box 27, avoiding the need for subsequent cleaning of the residue by the staff and improving the work efficiency of the staff.

[0035] This invention also provides a method for using a liquid film-constrained, absorption-free laser shock peening and pulsed electrochemical micropolishing composite processing device, comprising the following steps: Step 1, Processing Preparation: The worker steps on the step ring 29, which lifts the pallet 30 via the cable 28, pushing the workpiece above the storage tower 10. When placing the workpiece, the scraper on the first contact column 36 automatically cleans the debris from the pallet 30. The electrode clamp 43 clamps the workpiece under the action of the elastic element to complete the positioning. After releasing the step ring 29, the pallet 30 falls back and adheres to the partition 26, and the drain outlet 9 is opened. The one-way valve is opened, and the polishing liquid in the storage tower 10 flows through the pipeline to the surface of the workpiece to form a liquid film, completing the preliminary processing preparation.

[0036] Step 2, Composite Processing: The laser emitter 2 is started based on the polishing liquid film on the workpiece surface to carry out laser shock strengthening, optimize the mechanical properties of the workpiece surface, and the processing debris is initially intercepted by two-stage toothed guide columns. The polishing liquid flows into the filter unit 21 and is continuously replenished until the workpiece is completely immersed. Then the liquid supply valve is closed and the pulsed electrochemical power supply is turned on. The micro-defects of the workpiece are removed in a small amount using the polishing liquid as a conductive medium. The composite processing of strengthening and precision leveling is completed in an integrated manner.

[0037] Step 3, Polishing fluid purification: After processing is completed, start the water pump 19. The polishing fluid in the processing box 3 first passes through the filter unit 21 to remove impurities, and then is transported back to the storage tower 10 for recycling through the pipeline. The equipment has a self-cleaning mechanism. After stepping on the foot ring 29 to raise the pallet 30, the guide column is aligned. The operator pulls the pinch plate 57 to drive the scraper to scrape off the residue trapped by the guide tooth pattern. The residue falls into the collection box 27 for centralized collection, and the polishing fluid circulation and residue cleaning are realized simultaneously.

[0038] Step 4, workpiece unloading: After the lifting pallet 30 is lifted, the first tension spring 33 rebounds and pushes the workpiece between the guide limit plates. It is positioned by elastic clamping. After the residue is cleaned, the staff takes out the finished workpiece and transfers it to the centralized cleaning station. The equipment returns to the initial standby state. After emptying the residue collection box 27, a new workpiece can be clamped and the next round of composite strengthening processing can be carried out.

[0039] The working principle of the technical solution provided by this invention is as follows: In use, the operator steps on the foot ring 29, which moves towards the ground and pulls the cable 28. At this time, the cable 28 will drive the third sliding column 39 to slide along the inner wall of the fixed cylinder 4 towards the top of the fixed cylinder 4. The second tension spring 40 will be subjected to tension and bend. The third sliding column 39 will simultaneously drive the sliding plate 38 to slide along the inner wall of the third sliding groove 7. The pallet 30 will move synchronously with the sliding plate 38. The workpiece placed on the top of the pallet 30 will be pushed above the liquid storage tower 10 by the first abutment column 36 as the pallet 30 moves.

[0040] The worker then places the workpiece onto the pallet 30, with one side of the workpiece abutting against the outer wall of the first contact post 36 away from the first scraper 37. The workpiece is then pushed towards the third elastic plate 42. The first contact post 36 slides along the outer wall of the pallet 30 due to the push from the workpiece, while the second sliding post 34 slides synchronously along the inner wall of the fourth sliding groove 31. During this sliding process, the inner wall of the sliding groove 35 of the second sliding post 34 adheres to the outer wall of the first sliding post 32, and the first sliding post 32 acts as a limiting element to prevent the second sliding post 34 from detaching from the fourth sliding groove 31. As the second sliding post 34 slides, the first tension spring 33 experiences tension and bends, causing the first scraper 37 to move synchronously with the first contact post 36, with its end away from the first contact post 36 adhering to the pallet 30. On the top surface, remove any remaining debris from the pallet 30 to prevent uneven placement of the workpiece and interference with subsequent laser strengthening processing. During this process, the inclined surface of the first contact post 36 near the first scraper 37 will push the inclined surface of the two electrode clamping blocks 43 away from the third elastic plate 42, forcing the two electrode clamping blocks 43 to move away from the pallet 30. The third elastic plate 42 will bend and deform under the force until the second sliding post 34 slides along the outer wall of the first sliding post 32 to one end of the first sliding post 32 near the third elastic plate 42. The side wall of the first contact post 36 away from the first scraper 37 will press against the inclined surface of the electrode clamping block 43 near the third elastic plate 42. At this time, the third elastic plate 42 will be relieved of force and spring back to its original position, simultaneously driving the electrode clamping block 43 to reset. The bottom outer wall of the electrode clamping block 43 will press against the top surface of the workpiece, completing the workpiece positioning.

[0041] After the staff releases the foot ring 29, the second tension spring 40 releases its tension and rebounds to its original position, pulling the third sliding column 39 to slide along the inner wall of the fixed cylinder 4 toward the ground; the sliding plate 38, the overflow plate 41 and the support plate 30 move down synchronously until the bottom surface of the support plate 30 is in contact with the top surface of the partition 26. During the downward movement, the overflow plate 41 covers the third sliding groove 7, and the side wall of the second sliding column 34 abuts against the partition 26 away from the outer wall of the liquid storage tower 10, thereby limiting the second sliding column 34. At this time, the first tension spring 33 remains in a stretched deformation state.

[0042] At this time, the outer wall of the pallet 30 near the liquid storage tower 10 moves down and no longer blocks the drain outlet 9, and the one-way valve in the water flow tank 11 is opened. The polishing liquid inside the liquid storage tower 10 will flow sequentially through the water flow tank 11, the water flow chamber 12, the diversion port 13, and the drain outlet 9 to the workpiece to be strengthened area, forming a polishing liquid film on the workpiece surface. Then the laser transmitter 2 can be started to carry out laser strengthening processing. The debris generated during processing flows with the polishing liquid to the second guide column 48 with a toothed outer wall. After being guided by the inclined surface of the second guide column 48, the polishing liquid flows to the first guide column 47, which also has a toothed surface, and finally flows into the filter unit 21 along the inclined surface of the first guide column 47. During this process, the toothed surface of the first guide column 47 and the second guide column 48 can intercept solid impurities in the polishing liquid in advance.

[0043] As polishing fluid is continuously introduced into the processing box 3 until the workpiece is completely submerged in the liquid, the one-way valve of the water tank 11 is closed; the pulse electrochemical power supply is turned on, and the current is conducted to the clamp body through the external cable of the electrode clamp 43, which, together with the polishing fluid, achieves the removal of microscopic defects on the surface of the workpiece.

[0044] After the polishing process is completed, the water pump 19 is started. The polishing liquid in the processing box 3 is first filtered by the filter unit 21, and then sent to the water pump 19 through the water suction pipe 18. The water pump 19 transports the filtered clean polishing liquid back to the storage tower 10 through the water delivery pipe 20. The residue generated by polishing will be continuously intercepted and retained by the teeth of the first guide column 47 and the second guide column 48.

[0045] The worker steps on the foot ring 29 again, and the pallet 30 carrying the workpiece moves upward toward the storage tower 10. The second sliding column 34 moves synchronously with the pallet 30, and its side wall separates from the partition 26 and moves away from the outer wall of the storage tower 10. After the first tension spring 33 is released from the limiting constraint, it rebounds and resets, pulling the second sliding column 34 to slide along the inner wall of the fourth sliding groove 31 toward the top of the processing box 3. The first abutting column 36 moves synchronously with the second sliding column 34 and pushes the workpiece toward the first guide plate 17. The workpiece slides between the two first limiting plates 16 under the guidance of the two first guide plates 17. The workpiece squeezes the two first limiting plates 16 and moves away from the storage tower 10. The first elastic plate 15 will be stressed and deform along its bending direction. At the same time, it pushes the two first limiting plates 16 toward the central axis of the storage tower 10 by its own elasticity, clamping and positioning the workpiece.

[0046] At this point, the second contact column 49 disengages from the top surface of the filter unit 21, and the second guide column 48 moves to a position flush with the first guide column 47 under the elastic force of the fourth elastic plate 46. The two second scrapers 59 move towards the first guide column 47 under the elastic force of the fifth elastic plate 64 and the sixth elastic plate 65, respectively, until the teeth of the second scrapers 59 mesh with the teeth of the first guide column 47 and the second guide column 48. Then, the operator pinches the pinch plate 57 and moves it along the seventh sliding path. The inner wall of the groove 54 slides towards the sixth sliding groove 53. The sliding block 56 will simultaneously drive the fourth connecting plate 58 and the fifth elastic plate 64 to move. The third connecting plate 62, the sixth elastic plate 65, and the fifth connecting plate 61 will move synchronously with the fourth connecting plate 58. The two second scrapers 59 will move synchronously under the drive of the fifth connecting plate 61 and the fifth elastic plate 64, respectively, and scrape off the residue trapped between the teeth of the first guide column 47 and the second guide column 48. The scraped residue will fall into the storage box 27 for unified collection.

[0047] Finally, the staff took out the two workpieces clamped by the first limit plate 16 and transferred them to the cleaning station, so that the next workpiece to be processed could be replaced. The processed workpieces could be cleaned in a centralized manner.

[0048] This invention encompasses any substitutions, modifications, equivalent methods, and solutions made within the spirit and scope of this invention. To provide the public with a thorough understanding of this invention, specific details are described in detail in the following preferred embodiments; however, those skilled in the art will fully understand the invention even without these details. Furthermore, to avoid unnecessary misunderstanding of the essence of this invention, well-known methods, processes, procedures, components, and circuits are not described in detail.

[0049] The above description is only a preferred embodiment of the present invention. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the principle of the present invention, and these improvements and modifications should also be considered within the scope of protection of the present invention.

Claims

1. A laser shock peening and pulsed electrochemical polishing composite processing device, characterized in that, The device includes an operating platform, on the top of which a laser emitter and a processing box are respectively installed. A partition is fixedly connected to the inner wall of the processing box. A third sliding groove is formed on the inner wall of one side of the processing box near the top. A fixing block is fixedly connected to the outer wall of one side of the processing box near the top. A drain outlet is formed on the inner wall of the processing box near the fixing block. A liquid storage tower is fixedly connected to the top of the fixing block. A water flow chamber is formed inside the fixing block near the liquid storage tower. The water flow chamber is connected to the inner wall of the liquid storage tower through a water flow channel. The water flow chamber is connected to the drain outlet through several branch outlets. An auxiliary component is installed on the inner wall of the processing box. The auxiliary component is used to assist in the processing of the workpiece. The auxiliary component includes a sliding plate slidably connected to the inner wall of the third sliding groove.

2. The laser shock peening and pulsed electrochemical polishing composite processing device according to claim 1, characterized in that, A support plate is fixedly connected to one end of the sliding plate near the central axis of the processing box. A fourth sliding groove is formed on the outer wall of the support plate near the middle. A first sliding column is fixedly connected to the inner wall of the fourth sliding groove near the drain outlet. Two third elastic plates are fixedly connected to the outer wall of the support plate away from the drain outlet. An electrode clamp is fixedly connected to the end of the third elastic plate away from the support plate. A first tension spring is sleeved on the outer wall of the first sliding column.

3. The laser shock peening and pulsed electrochemical polishing composite processing device according to claim 2, characterized in that, A second sliding column is slidably connected to the outer wall of the first sliding column. A sliding groove is formed on the outer wall of the second sliding column. A first abutting column is fixedly connected to the top of the second sliding column. A first scraper is fixedly connected to the outer wall of the first abutting column on the side away from the first tension spring. An anti-overflow plate is fixedly connected to the outer wall of the sliding plate near the middle. A third sliding column is fixedly connected to the end of the sliding plate away from the support plate. A second tension spring is fixedly connected to the bottom outer wall of the third sliding column.

4. The laser shock peening and pulsed electrochemical polishing composite processing device according to claim 2, characterized in that, A fixing cylinder is fixedly connected to the bottom outer wall of the processing box near the third sliding groove. A first sliding groove is formed on the outer wall of the fixing cylinder near the third sliding groove. A second sliding groove is formed on the outer wall of the fixing cylinder near the top. A cable is fixedly connected to the outer wall of the third sliding column near the top. A foot ring is fixedly connected to the end of the cable away from the third sliding column. Fixing plates are symmetrically fixedly connected to the outer wall of the liquid storage tower near the top.

5. The laser shock peening and pulsed electrochemical polishing composite processing device according to claim 4, characterized in that, A first elastic plate is fixedly connected to the end of the fixed plate away from the liquid storage tower. A first limiting plate is fixedly connected to the end of the first elastic plate away from the fixed plate. A first guide plate is fixedly connected to the end of the first limiting plate near the processing box. A second limiting plate is fixedly connected to the bottom outer wall of the processing box on the side away from the fixed cylinder. A fourth limiting plate is symmetrically fixedly connected to the outer walls on both sides of the second limiting plate. A second elastic plate is fixedly connected to the end of the second limiting plate away from the processing box.

6. The laser shock peening and pulsed electrochemical polishing composite processing apparatus according to claim 5, characterized in that, A third limiting plate is fixedly connected to the end of the second elastic plate away from the second limiting plate. A storage box is clamped on the top of the second limiting plate. Two pressure plates are fixedly connected to the bottom of the outer wall of the tray near the third elastic plate. A first connecting plate and a first guide column are fixedly connected to the outer wall of the tray near the pressure plate. A fourth elastic plate is fixedly connected to the end of the first connecting plate away from the tray. A second guide column is fixedly connected to the end of the fourth elastic plate away from the first connecting plate.

7. The laser shock peening and pulsed electrochemical polishing composite processing apparatus according to claim 6, characterized in that, A second abutting post is fixedly connected to the outer wall of the second guide post on the side away from the fourth elastic plate. Two connecting cylinders are fixedly connected to the outer wall of the support plate on the side near the third elastic plate. A fixing post is fixedly connected to the end of the connecting cylinder away from the support plate. A fifth sliding groove is opened at the end of the fixing post near the second limiting plate. A seventh sliding groove is opened at the top of the fixing post. A sixth sliding groove is opened on the bottom outer wall of the end of the fixing post near the fifth sliding groove.

8. The laser shock peening and pulsed electrochemical polishing composite processing apparatus according to claim 7, characterized in that, A second connecting plate is fixedly connected to the bottom outer wall of the fixed column at the end away from the sixth sliding groove. A sliding block is slidably connected to the inner wall of the fifth sliding groove. A fourth connecting plate is fixedly connected to the outer wall of the sliding block on the side near the sixth sliding groove. A pinch plate is fixedly connected to the top of the sliding block. A fifth elastic plate is fixedly connected to the end of the fourth connecting plate away from the sliding block. A third connecting plate is fixedly connected to the outer wall of the middle part of the fourth connecting plate. A third tension spring is fixedly connected to the outer wall of the third connecting plate on the side near the second connecting plate.

9. The laser shock peening and pulsed electrochemical polishing composite processing apparatus according to claim 8, characterized in that, A sixth elastic plate is fixedly connected to the outer wall of the third connecting plate on the side away from the third tension spring. A fifth connecting plate is fixedly connected to the end of the sixth elastic plate away from the third connecting plate. A second scraper is fixedly connected to the end of the fifth elastic plate away from the fourth connecting plate and the end of the fifth connecting plate away from the sixth elastic plate, respectively. A third scraper is fixedly connected to the top outer wall of the second scraper. A water pump is fixedly connected to the bottom inner wall of the processing box. A suction pipe and a delivery pipe are fixedly connected to both sides of the water pump, respectively. A filter unit is installed on the inner wall of the processing box near the suction pipe.

10. The method for combined liquid laser shock peening and pulsed electrochemical polishing according to any one of claims 1-9, characterized in that, Includes the following steps: Step 1, Processing Preparation: The worker steps on the ring to lift the pallet to load the workpiece, and after the pallet falls back to its original position, the liquid supply channel is opened to form a liquid film on the surface of the workpiece, thus completing the pre-processing preparation work. Step 2, Composite Processing: Relying on the liquid film on the workpiece surface, laser shock peening treatment is first carried out to optimize the surface properties of the workpiece. After the polishing liquid completely immerses the workpiece, the liquid supply channel is closed and the pulse power supply is turned on. Microscopic defects in the workpiece are removed through electrochemical action to complete the composite processing. Step 3: Polishing Fluid Purification: After processing, the water pump extracts the polishing fluid from the chamber, purifies it through the filtration unit, and then returns it to the storage tower for recycling. The equipment can also automatically clean residues, achieving self-purification of the polishing fluid and the equipment. Step 4, workpiece unloading: Step on the foot pedal again to lift the workpiece, release the clamping limit, take out the finished workpiece and collect it for unified cleaning. The equipment returns to its initial state and can proceed with the processing of the next workpiece.

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