Vapor deposition apparatus

Abstract

The present application belongs to the technical field of evaporation, and discloses an evaporation device, which comprises an evaporation component and a substrate component, the evaporation component comprises a first bearing assembly and an evaporation assembly, the substrate component comprises a second bearing assembly and a substrate, a plurality of groups of evaporation assemblies are rotationally arranged on the first bearing assembly, and the substrate is rotationally arranged on the second bearing assembly; the evaporation component is arranged below the substrate, and the evaporation component can evaporate luminescent material on the substrate. The evaporation assembly is rotationally arranged on the first bearing assembly, and the substrate is rotationally arranged on the second bearing assembly, so that the relative angle between the evaporation assembly and the substrate can be changed, the evaporation angle can be adjusted, the evaporation range can be expanded or reduced, the evaporation device is suitable for different evaporation requirements, a variety of evaporation processes can be met, the functionality of the evaporation device is stronger, and the application range is wider.

Description

Technical Field

[0001] This invention relates to the field of vapor deposition technology, and more particularly to a vapor deposition apparatus. Background Technology

[0002] Currently, small and medium-sized AMOLED (Active-matrix organic light-emitting diode, a display technology) products are mainly manufactured using FMM (Fine Metal Mask) evaporation technology. This process typically requires the use of appropriate evaporation equipment to deposit the light-emitting material onto a substrate. (See attached image) Figure 1 and attached Figure 2 As shown, a number of existing vapor deposition sources 10' are vertically arranged on the existing carrier 20', and each vapor deposition source 10' is angle-limited by an angle limiting plate 30' to adjust the shadow performance of the luminescent material on the product. However, although the vapor deposition angle of the existing vapor deposition sources 10' can be reduced by the angle limiting plate 30', it cannot meet the requirement of increasing the vapor deposition angle in new technologies. Therefore, how to satisfy both the need to reduce and increase the vapor deposition angle, making the vapor deposition angle easy to adjust and the vapor deposition range effectively adjustable, is a problem that needs to be solved by those skilled in the art. Summary of the Invention

[0003] The purpose of this invention is to provide a vapor deposition apparatus that can both reduce and increase the vapor deposition angle, making the vapor deposition angle easy to adjust and the vapor deposition range effectively adjustable.

[0004] To achieve this objective, the present invention adopts the following technical solution:

[0005] A vapor deposition apparatus, comprising:

[0006] A vapor deposition component and a substrate component are provided. The vapor deposition component includes a first support component and a vapor deposition component. The substrate component includes a second support component and a substrate. A plurality of vapor deposition components are rotatably disposed on the first support component, and the substrate is rotatably disposed on the second support component. The vapor deposition component is disposed below the substrate. The vapor deposition component is capable of vapor deposition of luminescent material onto the substrate.

[0007] The vapor deposition apparatus has at least three adjustment states. In the first adjustment state, the vapor deposition angle of the vapor deposition component on the first support component is adjusted while keeping the position of the substrate on the second support component unchanged. In the second adjustment state, the rotation angle of the substrate on the second support component is adjusted while keeping the position of the vapor deposition component on the first support component unchanged. In the third adjustment state, both the vapor deposition angle of the vapor deposition component on the first support component and the rotation angle of the substrate on the second support component are adjusted simultaneously.

[0008] Alternatively, the first carrier component may have at least two of the vapor deposition components arranged facing each other, or spaced apart and arranged away from each other.

[0009] Optionally, it also includes displacement components, the first bearing component being connected to a set of displacement components to perform displacement changes on the X, Y, and Z axes;

[0010] Preferably, the X-axis, Y-axis, and Z-axis are mutually perpendicular to each other.

[0011] Optionally, the second bearing component is also connected to a set of displacement components to perform displacement changes on the X, Y, and Z axes.

[0012] Optionally, the displacement component includes a slide rail and a robot, the slide rail being provided with an X-axis slide rail and a Y-axis slide rail for displacement changes on the X and Y axes, and the robot being supported below the first load-bearing component for displacement changes on the Z-axis.

[0013] Optionally, the first support component includes a support portion and a rotating portion, the rotating portion being rotatably connected to the support portion, and the vapor deposition component being disposed on the rotating portion.

[0014] Optionally, the vapor deposition assembly includes a vapor deposition source and a vapor deposition nozzle, the vapor deposition nozzle being disposed on top of the vapor deposition source and the bottom of the vapor deposition source being connected to the first support assembly.

[0015] Alternatively, the vapor deposition nozzle is positioned toward the substrate, and the luminescent material is sprayed through the vapor deposition nozzle to form a vapor deposition channel.

[0016] Optionally, the angle between the side of the vapor deposition channel and the vertical direction is set as a first tilt angle θ1, which is in the range of 0°-90°.

[0017] Alternatively, the evaporation assembly can perform scanning evaporation of the luminescent material toward the substrate from right to left or from left to right.

[0018] The beneficial effects of this invention are:

[0019] In this invention, the evaporation component is disposed below the substrate. The evaporation component can deposit luminescent materials onto the substrate, which can meet the basic evaporation process requirements. Furthermore, the evaporation component is rotatably disposed on the first support component, and the substrate is rotatably disposed on the second support component. Thus, by adjusting the rotation angle of the evaporation component on the first support component and the rotation angle of the substrate on the second support component according to different adjustment states, the relative angle between the evaporation component and the substrate can be changed accordingly. This allows for adjustment of the evaporation angle and expansion or reduction of the evaporation range, making it suitable for different evaporation requirements and satisfying various evaporation processes. This makes the evaporation device more functional and has a wider range of applications. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the distribution of vapor deposition sources in existing technologies;

[0021] Figure 2 This is a schematic diagram of the structure of a single vapor deposition source in the prior art;

[0022] Figure 3 This is a schematic diagram of the vapor deposition apparatus according to an embodiment of the present invention, wherein the vapor deposition component is rotatable and movable;

[0023] Figure 4 This is another structural schematic diagram of the vapor deposition apparatus described in an embodiment of the present invention, wherein the substrate is rotatable and movable;

[0024] Figure 5 This is a schematic diagram of the vapor deposition components arranged facing each other in the vapor deposition apparatus described in this embodiment of the invention;

[0025] Figure 6 This is a schematic diagram of the vapor deposition components arranged opposite to each other in the vapor deposition apparatus described in this embodiment of the invention;

[0026] Figure 7 This is a right-to-left scan diagram of the vapor deposition components in the vapor deposition apparatus described in this embodiment of the invention;

[0027] Figure 8 This is a left-to-right scan diagram of the vapor deposition components in the vapor deposition apparatus described in this embodiment of the invention;

[0028] Figure 9 This is an installation diagram of the vapor deposition apparatus according to an embodiment of the present invention, wherein the vapor deposition component can rotate and move.

[0029] In the picture:

[0030] 10' - Existing vapor deposition source; 20' - Existing carrier; 30' - Angle limiting plate;

[0031] 10-First load-bearing component; 20-Evaporation component; 30-Substrate; 40-Fixed load-bearing component; 50-Slide rail; 60-Robot;

[0032] 11-Support part; 12-Rotating part; 21-Evaporation source; 22-Evaporation nozzle. Detailed Implementation

[0033] Embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar components or components having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the present invention, and should not be construed as limiting the present invention.

[0034] In the description of this invention, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection or a detachable connection; a mechanical connection or an electrical connection; a direct connection or an indirect connection through an intermediate medium; or the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0035] In the description of this invention, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature being directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0036] Currently, small and medium-sized AMOLED (Active-matrix organic light-emitting diode, a display technology) products are mainly manufactured using FMM (Fine Metal Mask) evaporation technology. This process typically requires the use of appropriate evaporation equipment to deposit the light-emitting material onto a substrate. (See attached image) Figure 1 and attached Figure 2As shown, a number of existing vapor deposition sources 10' are vertically arranged on the existing carrier 20', and each vapor deposition source 10' is angle-limited by an angle limiting plate 30' to adjust the shadow performance of the luminescent material on the product. However, although the vapor deposition angle of the existing vapor deposition sources 10' can be reduced by the angle limiting plate 30', it cannot meet the requirement of increasing the vapor deposition angle in new technologies. Therefore, how to satisfy both the need to reduce and increase the vapor deposition angle, making the vapor deposition angle easy to adjust and the vapor deposition range effectively adjustable, is a problem that needs to be solved by those skilled in the art.

[0037] The technical solution of this embodiment will be further described below with reference to the accompanying drawings and specific implementation methods.

[0038] like Figures 2-9 As shown, this embodiment provides a vapor deposition apparatus, including a vapor deposition component and a substrate component. The vapor deposition component includes a first support component 10 and a vapor deposition component 20. The substrate component includes a second support component and a substrate 30. A plurality of vapor deposition components 20 are rotatably disposed on the first support component 10, and the substrate 30 is rotatably disposed on the second support component. The vapor deposition component is disposed below the substrate 30. The vapor deposition component is capable of vapor deposition of luminescent material onto the substrate 30.

[0039] The vapor deposition apparatus has at least three adjustment states. In the first adjustment state, the vapor deposition angle of the vapor deposition component 20 on the first support component 10 is adjusted while keeping the position of the substrate 30 on the second support component unchanged. In the second adjustment state, the rotation angle of the substrate 30 on the second support component is adjusted while keeping the position of the vapor deposition component 20 on the first support component 10 unchanged. In the third adjustment state, both the vapor deposition angle of the vapor deposition component 20 on the first support component 10 and the rotation angle of the substrate 30 on the second support component are adjusted simultaneously.

[0040] Specifically, in this embodiment, the evaporation component is disposed below the substrate 30. The evaporation component can deposit the luminescent material onto the substrate 30, which can meet the basic evaporation process requirements. Furthermore, the evaporation component 20 in the evaporation component is rotatably disposed on the first support component 10, and the substrate 30 in the substrate component is rotatably disposed on the second support component. Thus, by adjusting the rotation angle of the evaporation component 20 on the first support component 10 and the rotation angle of the substrate 30 on the second support component according to different adjustment states, the relative angle between the evaporation component 20 and the substrate 30 can be changed accordingly. This allows for adjustment of the evaporation angle and expansion or reduction of the evaporation range, making it suitable for different evaporation requirements and satisfying various evaporation processes. This makes the evaporation device more functional and has a wider range of applications.

[0041] The specific structure of the vapor deposition apparatus in this embodiment will be described below.

[0042] like Figures 3-9 As shown, the vapor deposition apparatus in this embodiment includes a vapor deposition component, a substrate component, and a displacement component. Specifically, the vapor deposition component is located below the substrate component, and the displacement component is disposed on both the vapor deposition component and the substrate component, thereby enabling corresponding changes in their positions. For example, the displacement component connected to the vapor deposition component is disposed below the vapor deposition component, and the displacement component connected to the substrate component is disposed above the substrate component, thereby avoiding any interference with the vapor deposition process of the vapor deposition component on the substrate component.

[0043] Optionally, the evaporation component can deposit the luminescent material onto the substrate component, and in this embodiment, both the evaporation component and the substrate component are connected to a displacement component. Specifically, the displacement component can change its three-axis displacement along the X, Y, and Z axes, thereby fulfilling different positional requirements of the evaporation component and the substrate component, realizing the multi-functionality of the evaporation operation of the evaporation apparatus, and being suitable for processes requiring increased evaporation angles, thereby improving the evaporation effect and efficiency. Preferably, the X, Y, and Z axes are arranged perpendicularly to each other in pairs, and the specific directions can be set according to the needs of the connected evaporation component and substrate component.

[0044] like Figure 3 and Figure 4 As shown, in this embodiment, the evaporation component includes a first support component 10 and an evaporation component 20, while the substrate component includes a second support component (not shown) and a substrate 30. Exemplarily, several sets of evaporation components 20 are rotatably disposed on the first support component 10, and the substrate 30 is also rotatably disposed on the second support component. The evaporation component is disposed below the substrate 30, and it can deposit the luminescent material onto the substrate 30. Thus, with both the evaporation component 20 and the substrate 30 having adjustable angles, their relative positions and angles can be adjusted according to the evaporation process requirements to ensure accurate evaporation of the luminescent material onto the substrate 30, improving product yield and production efficiency, and ensuring uniform film thickness.

[0045] Specifically, the vapor deposition apparatus has at least three adjustment states. In the first adjustment state, the vapor deposition angle of the vapor deposition component 20 on the first support component 10 is adjusted while keeping the position of the substrate 30 on the second support component unchanged. In the second adjustment state, the rotation angle of the substrate 30 on the second support component is adjusted while keeping the position of the vapor deposition component 20 on the first support component 10 unchanged. In the third adjustment state, both the vapor deposition angle of the vapor deposition component 20 on the first support component 10 and the rotation angle of the substrate 30 on the second support component are adjusted simultaneously. Thus, the relative angle between the vapor deposition component 20 and the substrate 30 can be adjusted in a timely manner according to the three adjustment states to ensure that the light-emitting material can be completely and extensively vapor-deposited on the substrate 30, thereby improving the vapor deposition efficiency and ensuring an increase in the vapor deposition yield.

[0046] Furthermore, the first support component 10 is connected to a set of displacement components, thereby enabling the displacement of the vapor deposition component 20 along the X, Y, and Z axes. This means the vapor deposition component 20 can be adjusted relative to the substrate 30 to move forward / backward, left / right, or up / down, thus ensuring the vapor deposition effect. Combined with... Figure 9 As shown, by way of example, the length direction of the first carrier component 10 is set as the X-axis, the width direction of the first carrier component 10 is set as the Y-axis, and the extension direction of the vapor deposition component 20 during vapor deposition is set as the Z-axis, so that the position of the first carrier component 10 on the X-axis, Y-axis and Z-axis can be changed.

[0047] For example, the displacement component connected to the vapor deposition assembly 20 includes a slide rail 50 and a robot 60. The slide rail 50 is provided with an X-axis slide rail and a Y-axis slide rail. The robot 60 is supported below the first support assembly 10, thereby enabling the displacement of the vapor deposition assembly 20 on the Z-axis. Specifically, both the X-axis and Y-axis slide rails are linear guides, i.e., they include a slider and a track. For example, the slider is fixed to the bottom of the first support assembly 10, and both the X-axis and Y-axis slide rails are communicatively connected to the control system. The operator can set their endpoint coordinates on the control system as needed. Then, the sliders on the X-axis and Y-axis slide rails can plan their routes according to the endpoint coordinates, so that the slider on the X-axis track drives the first support assembly 10 to move in the X-axis direction, and the slider on the Y-axis track drives the first support assembly 10 to move in the Y-axis direction. For example, in this embodiment, the X-axis and Y-axis slide rails can be made of ball-type linear guides, roller-type linear guides, etc. Specifically, ball-type linear guides have low frictional resistance, while roller-type linear guides have high rigidity and strong load-bearing capacity. The specific structure can be selected according to the needs.

[0048] For example, the robot 60 includes a fixed post, a support arm, and a rocker arm. Specifically, the support arm is height-adjustable and rotatably mounted on the fixed post, the rocker arm is rotatably mounted on the other end of the support arm, and both the support arm and the rocker arm are telescopic structures. The end of the rocker arm opposite to the support arm is supported below the first load-bearing component 10. Optionally, the height of the robot 60 is lower than the height of the lower surface of the first load-bearing component 10 to the ground to avoid interfering with the movement of the first load-bearing component 10.

[0049] Optionally, the robot 60 is communicatively connected to a control system. The control system allows for setting the height of the robot 60's support arm, the extension and retraction lengths of the support arm and rocker arm, the rotation angle of the support arm relative to the fixed post, and the rotation angle of the rocker arm relative to the support arm. Specifically, adjusting the height of the support arm on the fixed post can synchronously change the height of the rocker arm, thereby adjusting the height of the first bearing component 10 and enabling the vapor deposition component 20 to move along the Z-axis. Further, adjusting the rotation angle of the support arm relative to the fixed post, and / or adjusting the rotation angle between the rocker arm and the support arm, can change the displacement of the first bearing component 10 along the X-axis. Similarly, adjusting the extension and retraction lengths of the support arm and / or the rocker arm can change the displacement of the first bearing component 10 along the Y-axis, thereby achieving automated movement of the first bearing component 10 along the X, Y, and Z axes and improving adjustment efficiency. In other embodiments, different control effects of the robot 60 can also achieve movement of the first bearing component 10 in three directions; this is not limited here.

[0050] like Figure 4 As shown, the second support component is also connected to a set of displacement components, thereby enabling the substrate 30 to change its displacement along the X, Y, and Z axes. This means the substrate 30 can be moved relative to the vapor deposition assembly 20 in a forward / backward, left / right, or up / down motion, thereby improving vapor deposition quality and production efficiency. For example, the length direction of the substrate 30 is set as the X-axis, the width direction as the Y-axis, and the direction of the substrate 30 toward the vapor deposition assembly 20 and perpendicular to its surface is set as the Z-axis. This allows the substrate 30 to change its position along the X, Y, and Z axes. The specific displacement components can be similarly configured to those connected to the vapor deposition component to ensure the positional movement of the substrate 30. The specific structure will not be described in detail here.

[0051] Combination Figure 7 and Figure 8As shown, further, under the action of the displacement component, the evaporation component 20 can perform a scanning evaporation operation of the light-emitting material towards the substrate 30 from right to left or from left to right, thereby improving the evaporation efficiency and adjusting the corresponding position and angle according to the evaporation requirements of different locations, thereby expanding or shrinking the evaporation range on the substrate 30. For example, when the evaporation component 20 is rotated relative to the first support component 10, the position of the substrate 30 on the second support component remains unchanged, thus ensuring that the evaporation component 20 performs a complete scan of the substrate 30. For example, sensors are provided at both ends of the substrate 30, and the sensors are communicatively connected to the control system. After recognizing that the evaporation component 20 has evaporated at the edge of the substrate 30, the control system can stop the continuous rotation of the evaporation component 20, thereby effectively avoiding waste of light-emitting material and ensuring intelligent control of the working range of the evaporation component 20. For example, the sensors can also be placed at the edge of the substrate 30 where evaporation is required, thereby ensuring the accuracy of the evaporation operation.

[0052] like Figure 3 and Figure 5 , Figure 6 As shown, in this embodiment, the first support component 10 includes a support portion 11 and a rotating portion 12, and the evaporation component 20 includes an evaporation source 21 and an evaporation nozzle 22. Optionally, in this embodiment, at least two evaporation components 20 are provided on the first support component 10, which are spaced apart and facing each other, or spaced apart and facing away from each other. This can effectively expand the evaporation angle and thereby expand the evaporation range on the substrate 30 to meet the process requirement of ensuring uniform film thickness during the evaporation process. Specifically, the evaporation source 21 is located below the evaporation nozzle 22, and the evaporation source 21 is configured as a cylindrical structure, with the evaporation nozzle 22 located at the center of the evaporation source 21.

[0053] like Figure 5 As shown, exemplarily, when two vapor deposition components 20 are arranged facing each other, the length of vapor deposition by each vapor deposition component 20 on the substrate 30 is L1. Under the condition of facing each other, the two vapor deposition ranges overlap, and the combined vapor deposition length L0 on the substrate 30 satisfies L1≤L0≤2*L1. Specifically, relative to the vapor deposition length L' of the existing vapor deposition source 10', the vapor deposition length L0 of the two facing vapor deposition components 20 is > L', thereby effectively expanding the vapor deposition range. Figure 6As shown, for example, when the two evaporation assemblies 20 are arranged opposite to each other, the evaporation length of each evaporation assembly 20 on the substrate 30 is L2, and under the condition of opposite arrangement, the evaporation ranges of the two evaporation assemblies 20 do not overlap, that is, the total evaporation length L0 of the two evaporation assemblies on the substrate 30 satisfies L0<L2. Specifically, compared with the evaporation length L' of the existing evaporation source 10', the evaporation length L0 of the two oppositely arranged evaporation assemblies 20 is greater than L', which can effectively expand the evaporation range, cover more areas of the substrate 30, and meet the corresponding evaporation requirements.

[0054] As Figure 3 shown, specifically, the rotating part 12 is rotatably connected to the supporting part 11, and the evaporation assembly 20 is arranged on the rotating part 12, thereby realizing relative rotation between the evaporation assembly 20 and the first carrying assembly 10. For example, the rotating part 12 and the supporting part 11 are connected by a ball joint, so that the evaporation assembly 20 has a larger rotation range and stronger angle adjustment functionality. For example, a robot assembly is arranged below the supporting part 11, which in this embodiment can be configured as a disc-type robot assembly, so that the disc-type robot assembly can directly achieve the effect of moving the supporting part 11 in different directions and positions to meet the requirement of changing different positions of the first carrying assembly 10.

[0055] Further, the evaporation nozzle 22 is arranged at the top of the evaporation source 21, and the bottom of the evaporation source 21 is connected to the rotating part 12 of the first carrying assembly 10. Optionally, the rotating part 12 is provided with an accommodation groove, and the bottom of the evaporation source 21 can be inserted into the accommodation groove and locked therein, thereby preventing the evaporation source 21 from falling off during operation. For example, a flexible protrusion is provided on the side wall of the accommodation groove to lock the evaporation source 21, and other locking structures such as buckles can also be provided at the accommodation groove, which is not limited herein.

[0056] Optionally, in this embodiment, the inner diameter of the evaporation nozzle 22 is smaller than the inner diameter of the evaporation source 21, and the evaporation nozzle 22 is located at the center of the evaporation source 21, so as to facilitate rapid ejection of the light-emitting material. Specifically, the evaporation nozzle 22 is arranged facing the substrate 30, the light-emitting material can be ejected through the evaporation nozzle 22 to form an evaporation channel, the light-emitting material is evaporated onto the substrate 30 along the evaporation channel, and the range of the evaporation channel affects the operation range of the light-emitting material evaporated on the substrate 30. For example, in this embodiment, the evaporation nozzle 22 has a cylindrical structure, and the edge of the evaporation channel is formed by extending lines connecting the center of the evaporation nozzle 22 and the edge of the cylindrical top surface, so that the light-emitting material can be evaporated to the substrate 30 to the maximum extent through the evaporation nozzle 22.

[0057] In combination with Figure 2 and Figures 5-6As shown, exemplarily, the direction of gravity is set to the vertical direction, and the angle between the side of the evaporation channel and the vertical direction is set as the first tilt angle θ1. The angle between the side of the existing channel formed by the existing evaporation source 10' after being restricted by the angle limiting plate 30' and the vertical direction is set as the second tilt angle θ0. Since at least two evaporation components 20 are provided on the first supporting component 10, which are arranged facing or back to back, the first tilt angle θ1 is greater than the second tilt angle θ0 in the evaporation channel formed by these two evaporation components 20. This can expand the evaporation angle and realize the expansion of the evaporation range, which can not only ensure the uniformity of film thickness, but also improve the evaporation efficiency. Exemplarily, in this embodiment, the range of the first tilt angle θ1 is between 0° and 90°.

[0058] Furthermore, in this embodiment, the substrate 30 is fabricated using TFT (thin film transistor) technology. Combined with... Figure 7 and Figure 8 As shown, in this embodiment, when the two vapor deposition components 20 are arranged facing each other, the length of the substrate 30 is greater than the length L1 of the vapor deposition of a single vapor deposition component 20 on the substrate 30; when the two vapor deposition components 20 are arranged back to back, the length of the substrate 30 is greater than the length L2 of the vapor deposition of the vapor deposition component 20 on the substrate 30. Thus, in conjunction with the rotation effect of the vapor deposition component 20 on the first support component 10, the vapor deposition range can be completely covered on the substrate 30, thereby improving the vapor deposition efficiency.

[0059] Therefore, in this embodiment, the three adjustment states of the evaporation device enable timely adjustment of the rotation angles of the evaporation component 20 and the substrate 30 on the first support component 10 and the second support component, ensuring that the evaporation component 20 can deposit the luminescent material onto the substrate 30 to the maximum extent. Furthermore, with the displacement component in place, the evaporation device also has multiple position adjustment states. Specifically, the displacement component allows for simultaneous position adjustment of the evaporation component 20 and the first support component 10 in the X, Y, and Z axes, and it also allows for simultaneous position adjustment of the substrate 30 and the second support component in the X, Y, and Z axes. Combined with these three angle adjustment states, the evaporation device has a wider range of applications, higher evaporation efficiency, and can effectively improve product qualification rate and production efficiency, ensuring uniform film thickness.

[0060] On the other hand, by way of example, when the substrate 30 is connected to the displacement assembly, a combination of fixed support 40 and vapor deposition assembly 20 can also be used. That is, the original structure of the existing support 20' and the existing vapor deposition source 10' is maintained, and only the direction of the substrate 30 is adjusted up and down, left and right, front and back, and rotation. The vapor deposition assembly 20 is fixed on the fixed support 40, and the fixed support 40 is also fixedly set and will not move. Thus, the relative position and angle between the vapor deposition assembly 20 and the substrate 30 can be adjusted only by adjusting the substrate 30, and it can be quickly used in conjunction with the original structure, without modifying the existing support 20' and the existing vapor deposition source 10'. This method of modifying only the substrate 30 and the above-mentioned method of modifying both the substrate 30 and the vapor deposition assembly can be selected by those skilled in the art as needed, and will not be described in detail here.

[0061] Specifically, in this configuration, the vapor deposition apparatus has at least one adjustment state, namely, adjusting the rotation angle of the substrate 30 on the second support component while keeping the position of the vapor deposition component 20 on the fixed support 40 unchanged, thereby changing the vapor deposition range of the vapor deposition component 20 on the substrate 30. Furthermore, the fixed support 40 is configured with a U-shaped structure and has a limiting protrusion on its inner side. Thus, after the vapor deposition component 20 is inserted into the fixed support 40, it can be limited and fixed within the fixed support 40 by the limiting protrusion, thereby preventing the position of the vapor deposition component 20 from changing during the vapor deposition process. Other fixing methods can also be selected in other embodiments, and are not limited here.

[0062] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the implementation of the present invention. Those skilled in the art can make other variations or modifications based on the above description. It is neither necessary nor possible to exhaustively describe all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the scope of protection of the claims of the present invention.

Claims

1. A vapor deposition apparatus, characterized in that, include: The evaporation component includes a first support component (10) and an evaporation component (20), and the substrate component includes a second support component and a substrate (30). A plurality of the evaporation components (20) are rotatably disposed on the first support component (10), and the substrate (30) is rotatably disposed on the second support component. The evaporation component is disposed below the substrate (30), and the evaporation component is capable of evaporating luminescent material onto the substrate (30). The vapor deposition apparatus has at least three adjustment states. In the first adjustment state, the vapor deposition angle of the vapor deposition component (20) on the first support component (10) is adjusted, while the position of the substrate (30) on the second support component remains unchanged. In the second adjustment state, the rotation angle of the substrate (30) on the second support component is adjusted, while the position of the vapor deposition component (20) on the first support component (10) remains unchanged; In the third adjustment state, the vapor deposition angle of the vapor deposition component (20) on the first support component (10) and the rotation angle of the substrate (30) on the second support component are adjusted simultaneously.

2. The vapor deposition apparatus according to claim 1, characterized in that, At least two of the vapor deposition components (20) are spaced apart and facing each other, or spaced apart and facing away from each other, on the first carrier component (10).

3. The vapor deposition apparatus according to claim 1, characterized in that, It also includes displacement components, wherein the first bearing component (10) is connected to a set of said displacement components to perform displacement changes on the X-axis, Y-axis and Z-axis; Preferably, the X-axis, Y-axis, and Z-axis are mutually perpendicular to each other.

4. The vapor deposition apparatus according to claim 3, characterized in that, The second load-bearing component is also connected to a set of displacement components to perform displacement changes on the X, Y, and Z axes.

5. The vapor deposition apparatus according to claim 3, characterized in that, The displacement component includes a slide rail (50) and a robot (60). The slide rail (50) is provided with an X-axis slide rail and a Y-axis slide rail to perform displacement changes on the X-axis and Y-axis. The robot (60) is supported below the first bearing component (10) to perform displacement changes on the Z-axis.

6. The vapor deposition apparatus according to claim 1, characterized in that, The first support component (10) includes a support part (11) and a rotating part (12), the rotating part (12) being rotatably connected to the support part (11), and the vapor deposition component (20) being disposed on the rotating part (12).

7. The vapor deposition apparatus according to claim 1, characterized in that, The vapor deposition assembly (20) includes a vapor deposition source (21) and a vapor deposition nozzle (22). The vapor deposition nozzle (22) is disposed on the top of the vapor deposition source (21), and the bottom of the vapor deposition source (21) is connected to the first support assembly (10).

8. The vapor deposition apparatus according to claim 7, characterized in that, The vapor deposition nozzle (22) is positioned toward the substrate (30), and the luminescent material can form a vapor deposition channel by being sprayed through the vapor deposition nozzle (22).

9. The vapor deposition apparatus according to claim 8, characterized in that, The angle between the side of the vapor deposition channel and the vertical direction is set as a first tilt angle θ1, and the first tilt angle θ1 is in the range of 0°-90°.

10. The vapor deposition apparatus according to claim 1, characterized in that, The vapor deposition assembly (20) is capable of scanning the luminescent material from right to left or from left to right toward the substrate (30).

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