A vacuum coating apparatus

Abstract

The application relates to the technical field of vacuum coating, in particular to a vacuum coating equipment which comprises a vacuum chamber, a cooling source, a crystal vibration piece bearing seat, a first evaporation source, a second evaporation source, a first baking heat source, a second baking heat source, a thermocouple and a first heat insulation assembly; during the coating process, the first evaporation source and the second evaporation source work alternately to alternately form first coating and second coating on the surface of the crystal vibration piece, the first baking heat source is used for baking the crystal vibration piece from below, the second baking heat source is used for baking the crystal vibration piece from above, and the thermocouple is used for detecting the temperature of the crystal vibration piece during the whole coating process. Since the temperature changes greatly during the alternate working process of the first evaporation source and the second evaporation source, the temperature of the crystal vibration piece is stabilized through the cooling source. Meanwhile, the heat radiation generated by the evaporation source and the baking heat source is isolated from the thermocouple through the first heat insulation assembly, the path of heat transfer from the thermocouple to the crystal vibration piece is blocked, and the temperature of the crystal vibration piece is further stabilized.

Description

Technical Field

[0001] This application relates to the field of vacuum coating technology, and in particular to a vacuum coating apparatus. Background Technology

[0002] In vacuum deposition, the linear relationship between the inherent frequency change caused by the piezoelectric effect of quartz crystal and the change in quartz crystal mass is a commonly used method to indirectly monitor the film deposition thickness. This method involves measuring the inherent oscillation frequency change Δf of an AT-cut quartz crystal and the thickness change Δd of the deposited film. M The mathematical relationship between them is shown in the following formula: In the above formula, ρ M ,ρ Q Here, f represents the density of the thin film and the quartz crystal, respectively; f is the natural oscillation frequency of the quartz crystal (fundamental frequency, such as 5MHz); and N is the frequency constant. For quartz crystals cut by the AT method, N = 1670 Kc·mm.

[0003] This method of determining the thickness of a deposited thin film by measuring the frequency change of a quartz crystal is called the quartz crystal oscillator method. This method offers relatively high precision in controlling film thickness. However, the inherent oscillation frequency of a quartz crystal is affected by temperature, causing frequency drift and directly leading to errors in film thickness during the deposition process. For some high-performance filters, these errors can degrade the filter's spectral performance, such as insufficient transmittance, wavelength shift, and insufficient steepness. Furthermore, the randomness of temperature effects results in poor repeatability of the filter during deposition development, impacting the spectral performance, quality, and yield of filters in mass production.

[0004] Thermal analysis of the crystal oscillator within the vacuum chamber revealed that the primary factor affecting its temperature is thermal radiation within the chamber, including radiation from the evaporation source and the baking source. It is important to note that regardless of temperature variations in these heat sources, the crystal oscillator temperature should be kept as stable as possible or subject to minimal fluctuations to eliminate frequency drift caused by temperature changes.

[0005] In vacuum coating equipment, thermocouples are used to measure the temperature of a crystal oscillator. One end of the thermocouple (hot junction) is fixed near the crystal oscillator to detect its temperature. The other end of the thermocouple (cold junction) is electrically connected to a display outside the vacuum chamber to show the current temperature of the crystal oscillator. The cold junction of the thermocouple is generally also called the reference junction, and its temperature serves as a baseline. To accurately measure the absolute temperature, the cold junction of practical thermocouples typically has temperature compensation functionality.

[0006] Currently, the following methods are used to stabilize the temperature of the crystal oscillator during the coating process: 1. Cooling the crystal oscillator with water. 2. Adding a heat insulation cylinder around the crystal oscillator to isolate heat radiation from the vacuum chamber.

[0007] The existing technical solutions mentioned above have the following drawbacks: Although the above methods can stabilize the temperature of the crystal oscillator to a certain extent during the coating process, the temperature change of the crystal oscillator is still large. Especially for film systems with baking temperatures above 200°C, the temperature change of the crystal oscillator is still large throughout the coating process, which cannot meet the actual production needs. Summary of the Invention

[0008] In order to more effectively stabilize the temperature of the crystal oscillator during the entire coating process, this application provides a vacuum coating device.

[0009] This application provides a vacuum coating equipment, which adopts the following technical solution: A vacuum coating apparatus, comprising: Vacuum chamber; The cooling source is installed in the upper part of the vacuum chamber; A crystal oscillator carrier is rotatably mounted on the bottom of a cooling source to support the crystal oscillator. The first evaporation source, installed at the bottom of the vacuum chamber, is used to heat the first evaporation material to form a first coating on the surface of the crystal oscillator. The second evaporation source, installed at the bottom of the vacuum chamber, is used to heat the second evaporation material to form a second coating on the surface of the crystal oscillator. The first baking heat source is installed in the lower part of the vacuum chamber and is used to bake the crystal oscillator. The second baking heat source is installed in the upper part of the vacuum chamber and is used to bake the crystal oscillator. A thermocouple, with its axis set vertically, has its bottom end mounted on a cooling source and its top end extending to the outside of a vacuum chamber, and is used to detect the temperature of a crystal oscillator. The first insulation component surrounds the thermocouple and is used for insulation.

[0010] By adopting the above technical solution, during the coating process, the vacuum chamber provides the vacuum environment required for coating. The first and second evaporation sources work alternately to form the first and second coatings alternately on the surface of the crystal oscillator. The first baking heat source is used to bake the crystal oscillator from below, and the second baking heat source is used to bake the crystal oscillator from above. Thermocouples are used to detect the temperature of the crystal oscillator throughout the coating process. Since the temperature changes significantly during the alternating operation of the first and second evaporation sources, a cooling source is used to stabilize the temperature of the crystal oscillator carrier, thereby stabilizing the temperature of the crystal oscillator. Simultaneously, the first heat insulation component isolates the heat radiation generated by the evaporation and baking heat sources from the thermocouples, blocking the path of heat radiation to transfer heat to the crystal oscillator through the thermocouples, further stabilizing the temperature of the crystal oscillator during the coating process. Even in coating processes lasting tens of hours or at high baking temperatures, the temperature variation range of the crystal oscillator is extremely small, with a significant temperature constantness effect, effectively reducing film thickness error, ensuring film thickness consistency, and meeting actual production requirements.

[0011] This application further specifies that the first thermal insulation component includes: The heat insulation cylinder has a heat insulation cavity formed inside its side wall. The heat insulation film is wrapped around the outer wall of the heat insulation cylinder; The upper heat insulation gasket is placed between the top of the heat insulation cylinder and the top wall of the vacuum chamber; The lower insulation gasket is placed between the bottom of the insulation cylinder and the top of the cooling source.

[0012] By adopting the above technical solutions, the overall insulation effect is good.

[0013] This application further specifies that: a first-stage upper sealing groove, a second-stage upper sealing groove, and a third-stage upper sealing groove are formed on the top wall of the vacuum chamber in sequence; The top of the heat insulation cylinder has a first-level lower sealing groove, a second-level lower sealing groove, and a third-level lower sealing groove that are connected in sequence. The top of the upper heat insulation gasket has a series of sequentially connected primary upper sealing protrusions, secondary upper sealing protrusions, and tertiary upper sealing protrusions, and the bottom has a series of sequentially connected primary lower sealing protrusions, secondary lower sealing protrusions, and tertiary lower sealing protrusions. The primary upper sealing protrusions match the primary upper sealing groove; the secondary upper sealing protrusions match the secondary upper sealing groove; the tertiary upper sealing protrusions match the tertiary upper sealing groove; the primary lower sealing protrusions match the primary lower sealing groove; the secondary lower sealing protrusions match the secondary lower sealing groove; and the tertiary lower sealing protrusions match the tertiary lower sealing groove. The structure of the lower heat insulation gasket is the same as that of the upper heat insulation gasket.

[0014] By adopting the above technical solution, the sealing performance between the top of the heat insulation cylinder and the top wall of the vacuum chamber is greatly improved. At the same time, the sealing performance between the bottom of the heat insulation cylinder and the top of the cooling seat is also greatly improved.

[0015] This application further includes: The second insulation component is located inside the insulation cylinder and surrounds the thermocouple.

[0016] By adopting the above technical solution, under certain operating conditions, the second heat insulation component further blocks the path of heat radiation transferring heat to the crystal oscillator through the thermocouple, thereby further stabilizing the temperature of the crystal oscillator during the coating process. Furthermore, even when the first heat insulation component fails to seal, the second heat insulation component alone can minimize the temperature variation range of the crystal oscillator.

[0017] This application further specifies that the second thermal insulation component includes: An inner spiral condenser tube is arranged around the thermocouple, with a first cooling medium inlet at the bottom and a first cooling medium outlet at the top. An outer spiral condenser tube surrounds an inner spiral condenser tube, with a second cooling medium outlet at the bottom and a second cooling medium inlet at the top; the second cooling medium outlet is connected to the first cooling medium inlet. The first cooling medium inlet pipe is connected to the second cooling medium inlet; The first cooling medium outlet pipe is connected to the first cooling medium outlet.

[0018] By adopting the above technical solution and using the series connection of inner and outer spiral condenser tubes, a double-layer isolation mechanism is achieved, which not only has a good heat insulation effect, but also reduces the space occupied by the second heat insulation component.

[0019] This application further specifies that the cooling source includes: The cooling base is rotatably connected to the crystal oscillator carrier at its bottom. The second cooling medium inflow pipe is connected to the cooling base; The second cooling medium outlet pipe is connected to the cooling base.

[0020] This application further includes: A rotary actuator is mounted at the top of the vacuum chamber, and its output shaft is fixedly connected to the top of the crystal oscillator carrier via a transmission rod; a display is connected to a thermocouple.

[0021] This application further specifies that the first evaporation source includes: The first mounting base is installed at the bottom of the vacuum chamber; An evaporating dish, mounted on a first mounting base, is used to heat a first evaporating material; The structure of the second evaporation source is the same as that of the first evaporation source.

[0022] This application further specifies that the first baking heat source includes: The second mounting base is installed in the lower part of the vacuum chamber; The first dryer, mounted on the second mounting base, is used to bake the crystal oscillator.

[0023] This application further specifies that the second baking heat source includes: The third mounting base is installed on the upper part of the inner wall of the vacuum chamber; The second dryer, mounted on the third mounting base, is used to bake the crystal oscillator.

[0024] In summary, the beneficial technical effects of this application are as follows: 1. During the coating process, a vacuum chamber provides the necessary vacuum environment. A first evaporation source and a second evaporation source work alternately to form a first coating and a second coating on the surface of the crystal oscillator. A first baking heat source bakes the crystal oscillator from below, and a second baking heat source bakes it from above. Thermocouples are used to monitor the temperature of the crystal oscillator throughout the coating process. Because the temperature fluctuates significantly during the alternating operation of the first and second evaporation sources, a cooling source is used to stabilize the temperature of the crystal oscillator support, thereby stabilizing the temperature of the crystal oscillator. Simultaneously, a first heat insulation component isolates the heat radiation generated by the evaporation and baking heat sources from the thermocouples, blocking the path of heat radiation to the crystal oscillator via the thermocouples, further stabilizing the crystal oscillator temperature during the coating process. Even in coating processes lasting tens of hours or at high baking temperatures, the temperature variation range of the crystal oscillator is extremely small, demonstrating a significant temperature control effect. This effectively reduces film thickness error, ensuring film thickness consistency and meeting actual production requirements.

[0025] 2. The second heat insulation component further blocks the path of heat radiation from the thermocouple to the crystal oscillator, thus further stabilizing the temperature of the crystal oscillator during the coating process. Even when the first heat insulation component fails to seal, the second heat insulation component alone can minimize the temperature variation of the crystal oscillator. Attached Figure Description

[0026] Figure 1 This is a schematic diagram of the internal structure of an embodiment of a vacuum coating equipment; Figure 2 yes Figure 1 A magnified view of a portion of region A in the middle; Figure 3 This is a schematic diagram of the internal structure of another embodiment of the vacuum coating equipment; Figure 4 yes Figure 3 A magnified view of a portion of region B in the middle.

[0027] Reference numerals: 110, Vacuum chamber; 120, Cooling source; 121, Cooling base; 122, Second cooling medium inlet pipe; 123, Second cooling medium outlet pipe; 130, Crystal oscillator carrier; 141, First evaporation source; 1411, First mounting base; 1412, Evaporation dish; 142, Second evaporation source; 151, First baking heat source; 1511, Second mounting base; 1512, First dryer; 152, Second baking heat source; 1521, Third mounting base; 1522, Second dryer; 160, Thermocouple; 170, First heat insulation component; 171, Heat insulation cylinder; 1711, Heat insulation cavity; 172, Heat insulation film ; 173. Upper heat insulation gasket; 1731. Primary upper sealing protrusion; 1732. Secondary upper sealing protrusion; 1733. Tertiary upper sealing protrusion; 1734. Primary lower sealing protrusion; 1735. Secondary lower sealing protrusion; 1736. Tertiary lower sealing protrusion; 174. Lower heat insulation gasket; 180. Second heat insulation assembly; 181. Inner spiral condenser tube; 1811. First cooling medium outlet; 182. Outer spiral condenser tube; 1821. Second cooling medium inlet; 183. First cooling medium inlet pipe; 184. First cooling medium outlet pipe; 191. Rotary actuator; 1911. Transmission rod; 192. Display. Detailed Implementation

[0028] The following is in conjunction with the appendix Figure 1-4 This application will be described in further detail.

[0029] Reference Figure 1This application discloses a vacuum coating apparatus, including a vacuum chamber 110, a cooling source 120, a crystal oscillator carrier 130, a first evaporation source 141, a second evaporation source 142, a first baking heat source 151, a second baking heat source 152, a thermocouple 160, and a first heat insulation component 170. The cooling source 120 is installed in the upper part of the vacuum chamber 110. The crystal oscillator carrier 130 is rotatably installed at the bottom of the cooling source 120 for supporting the crystal oscillator. The first evaporation source 141 is installed at the bottom of the vacuum chamber 110 for heating a first evaporation material to form a first coating on the surface of the crystal oscillator. The second evaporation source 142 is installed at the bottom of the vacuum chamber 110 for heating a second evaporation material to form a second coating on the surface of the crystal oscillator. The first baking heat source 151 is installed in the lower part of the vacuum chamber 110 for baking the crystal oscillator from below. The second baking heat source 152 is installed in the upper part of the vacuum chamber 110 for baking the crystal oscillator from above. Thermocouple 160 is vertically oriented, with its bottom end mounted on cooling source 120 and located near crystal oscillator carrier 130. Its top end extends outside vacuum chamber 110 to detect the temperature of the crystal oscillator. A first heat insulation component 170 surrounds thermocouple 160 for heat insulation. During the coating process, vacuum chamber 110 provides the necessary vacuum environment. First evaporation source 141 and second evaporation source 142 work alternately to form a first coating and a second coating on the surface of the crystal oscillator. First baking heat source 151 bakes the crystal oscillator from below, and second baking heat source 152 bakes the crystal oscillator from above. Thermocouple 160 is used to detect the temperature of the crystal oscillator throughout the coating process. Because the temperature changes significantly (several hundred degrees Celsius) during the alternating operation of first evaporation source 141 and second evaporation source 142, cooling source 120 is used to stabilize the temperature of crystal oscillator carrier 130, thereby stabilizing the temperature of the crystal oscillator. Meanwhile, the first heat insulation component 170 isolates the heat radiation generated by the evaporation source and the baking heat source from the thermocouple 160, blocking the path of heat radiation to transfer heat to the crystal oscillator through the thermocouple 160, further stabilizing the temperature of the crystal oscillator during the coating process. Even in coating processes lasting tens of hours (30-90 hours) or with high baking temperatures (above 200℃), the temperature variation range of the crystal oscillator is extremely small (1℃-5℃), demonstrating a significant temperature constantness effect. This effectively reduces film thickness error, helps ensure film thickness consistency, and meets actual production requirements.

[0030] It should be noted that the first evaporation material and the second evaporation material are existing technologies and will not be described in detail here.

[0031] Reference Figure 1 and Figure 2In one embodiment, the first heat insulation component 170 includes a heat insulation cylinder 171, a heat insulation film 172, an upper heat insulation gasket 173, and a lower heat insulation gasket 174. A heat insulation cavity 1711 is formed inside the sidewall of the heat insulation cylinder 171. The heat insulation cylinder 171 should be made of a metal material with low heat capacity and light weight. The heat insulation cavity 1711 is a vacuum cavity, which can block heat transfer to ensure the heat insulation effect. The heat insulation film 172 covers the outer wall of the heat insulation cylinder 171. The material selected for the heat insulation film 172 can reflect and absorb heat radiation, reducing heat transfer. The upper heat insulation gasket 173 is placed between the top of the heat insulation cylinder 171 and the top wall of the vacuum chamber 110. The selected material is heat-insulating rubber, which serves as a heat insulation seal. The lower heat insulation gasket 174 is placed between the bottom of the heat insulation cylinder 171 and the top of the cooling seat 121 of the cooling source 120. The selected material is heat-insulating rubber, which also serves as a heat insulation seal. Overall, it has a good heat insulation effect.

[0032] It should be noted that if the sealing effect of the upper heat insulation gasket 173 and the lower heat insulation gasket 174 is poor, it will lead to a larger temperature variation range of the crystal oscillator. Therefore, a first-stage upper sealing groove, a second-stage upper sealing groove, and a third-stage upper sealing groove are formed in sequence on the top wall of the vacuum chamber 110. A first-stage lower sealing groove, a second-stage lower sealing groove, and a third-stage lower sealing groove are formed in sequence at the top of the heat insulation cylinder 171. A first-stage upper sealing protrusion 1731, a second-stage upper sealing protrusion 1732, and a third-stage upper sealing protrusion 1733 are formed in sequence at the top of the upper heat insulation gasket 173, and a first-stage lower sealing protrusion 1734, a second-stage lower sealing protrusion 1735, and a third-stage lower sealing protrusion 1736 are formed in sequence at the bottom. The first-stage upper sealing protrusion 1731 matches the first-stage upper sealing groove, the second-stage upper sealing protrusion 1732 matches the second-stage upper sealing groove, the third-stage upper sealing protrusion 1733 matches the third-stage upper sealing groove, the first-stage lower sealing protrusion 1734 matches the first-stage lower sealing groove, the second-stage lower sealing protrusion 1735 matches the second-stage lower sealing groove, and the third-stage lower sealing protrusion 1736 matches the third-stage lower sealing groove. When the primary upper sealing protrusion 1731 is located within the primary upper sealing groove, the secondary upper sealing protrusion 1732 is located within the secondary upper sealing groove, the tertiary upper sealing protrusion 1733 is located within the tertiary upper sealing groove, the primary lower sealing protrusion 1734 is located within the primary lower sealing groove, the secondary lower sealing protrusion 1735 is located within the secondary lower sealing groove, and the tertiary lower sealing protrusion 1736 is located within the tertiary lower sealing groove, the top wall of the vacuum chamber 110 is bonded to the top of the upper heat insulation gasket 173 using heat insulation sealant, and the top of the heat insulation cylinder 171 is bonded to the bottom of the upper heat insulation gasket 173 using heat insulation sealant. This significantly improves the sealing performance between the top of the heat insulation cylinder 171 and the top wall of the vacuum chamber 110. Similarly, a primary upper sealing groove, a secondary upper sealing groove, and a tertiary upper sealing groove are formed sequentially at the bottom of the heat insulation cylinder 171. A primary lower sealing groove, a secondary lower sealing groove, and a tertiary lower sealing groove are formed sequentially at the top of the cooling seat 121. The structure of the lower heat insulation gasket 174 is the same as that of the upper heat insulation gasket 173. The top of the lower heat insulation gasket 174 has a primary upper sealing protrusion 1731, a secondary upper sealing protrusion 1732, and a tertiary upper sealing protrusion 1733 connected sequentially, and the bottom has a primary lower sealing protrusion 1734, a secondary lower sealing protrusion 1735, and a tertiary lower sealing protrusion 1736 connected sequentially.The primary upper sealing protrusion 1731 of the lower heat insulation gasket 174 is located within the primary upper sealing groove of the heat insulation cylinder 171; the secondary upper sealing protrusion 1732 of the lower heat insulation gasket 174 is located within the secondary upper sealing groove of the heat insulation cylinder 171; the tertiary upper sealing protrusion 1733 of the lower heat insulation gasket 174 is located within the tertiary upper sealing groove of the heat insulation cylinder 171; and the primary lower sealing protrusion 1734 of the lower heat insulation gasket 174 is located within the primary sealing groove of the cooling base 121. When the secondary lower sealing protrusion 1735 of the lower heat insulation gasket 174 is located within the secondary lower sealing groove of the cooling seat 121, and the tertiary lower sealing protrusion 1736 of the lower heat insulation gasket 174 is located within the tertiary lower sealing groove of the cooling seat 121, the bottom end of the heat insulation cylinder 171 and the top end of the lower heat insulation gasket 174 are bonded together using heat insulation sealant, and the top end of the cooling seat 121 and the bottom end of the lower heat insulation gasket 174 are bonded together using heat insulation sealant. This significantly improves the sealing performance between the bottom end of the heat insulation cylinder 171 and the top end of the cooling seat 121.

[0033] Reference Figure 3 and Figure 4 In another embodiment, the vacuum coating equipment further includes a second heat insulation component 180. The second heat insulation component 180 is disposed inside the heat insulation cylinder 171 and surrounds the thermocouple 160, isolating the thermocouple 160 from the interior of the heat insulation cylinder 171. Under certain operating conditions, the second heat insulation component 180 further blocks the path of heat radiation from the thermocouple 160 to the crystal oscillator, further stabilizing the temperature of the crystal oscillator during the coating process. In the coating process, the temperature variation range of the crystal oscillator is even smaller (0.1-0.5℃). Even when the first heat insulation component 170 fails to seal, the second heat insulation component 180 alone can minimize the temperature variation range of the crystal oscillator. The second heat insulation component 180 includes an inner spiral condenser tube 181, an outer spiral condenser tube 182, a first cooling medium inlet pipe 183, and a first cooling medium outlet pipe 184. An inner spiral condenser tube 181 surrounds the thermocouple 160, with a first cooling medium inlet at its bottom and a first cooling medium outlet 1811 at its top. An outer spiral condenser tube 182 surrounds the inner spiral condenser tube 181, with a second cooling medium outlet at its bottom and a second cooling medium inlet 1821 at its top. The second cooling medium outlet is connected to the first cooling medium inlet. A first cooling medium inlet pipe 183 is connected to the second cooling medium inlet 1821. A first cooling medium outlet pipe 184 is connected to the first cooling medium outlet 1811. Figure 3 and Figure 4The direction of the cooling medium is indicated by the middle arrow. Gaseous or liquid cooling medium flows into the outer spiral condenser tube 182 through the first cooling medium inlet pipe 183 and the second cooling medium inlet pipe 1821. It then flows into the inner spiral condenser tube 181 through the second cooling medium outlet and the first cooling medium inlet pipe, and finally exits the second insulation component 180 through the first cooling medium outlet 1811 and the first cooling medium outlet pipe 184. The series connection of the inner and outer spiral condenser tubes achieves a double-layer insulation mechanism, providing both good insulation and reducing the space occupied by the second insulation component 180.

[0034] Reference Figure 1 In one embodiment, the cooling source 120 includes a cooling base 121, a second cooling medium inlet pipe 122, and a second cooling medium outlet pipe 123. The cooling base 121 is mounted on the upper part of the vacuum chamber 110 via a bracket. The bottom of the cooling base 121 is rotatably connected to the crystal oscillator carrier 130. A cooling coil is disposed inside the cooling base 121. The second cooling medium inlet pipe 122 communicates with the cooling coil of the cooling base 121. The second cooling medium outlet pipe 123 communicates with the cooling coil of the cooling base 121. Figure 1 The direction of the arrow indicates the flow of the cooling medium. Gaseous or liquid cooling medium flows into the cooling coil of the cooling seat 121 via the second cooling medium inlet pipe 122, and then flows out via the second cooling medium outlet pipe 123. The first evaporation source 141 includes a first mounting base 1411 and an evaporating dish 1412. The first mounting base 1411 is fixedly mounted at the bottom of the vacuum chamber 110. The evaporating dish 1412 is mounted on the first mounting base 1411 and is used to heat the first evaporation material. The structure of the second evaporation source 142 is the same as that of the first evaporation source 141. It should be noted that the evaporating dish 1412 can be heated by resistance heating, electron beam heating, or induction coil heating to heat the first / second evaporation material. The first baking heat source 151 includes a second mounting base 1511 and a first dryer 1512. The second mounting base 1511 is fixedly mounted in the lower part of the vacuum chamber 110. The first dryer 1512 is mounted on the second mounting base 1511 and is used to bake the crystal oscillator below. There are two second baking heat sources 152, which are respectively installed on the upper parts of the two opposite inner walls of the vacuum chamber 110. Each second baking heat source 152 includes a third mounting base 1521 and a second dryer 1522. The third mounting base 1521 is fixedly installed on the upper part of the inner wall of the vacuum chamber 110. The second dryer 1522 is installed on the third mounting base 1521 and is used to bake the crystal oscillator above it. It should be noted that the first dryer 1512 and the second dryer 1522 can be resistance wires or halogen tungsten lamps, etc.

[0035] Reference Figure 1In one embodiment, the vacuum coating apparatus further includes a rotary driver 191 and a display 192. The rotary driver 191 is mounted on the top of the vacuum chamber 110 via a bracket, and its output shaft is fixedly connected to the top of the crystal oscillator carrier 130 via a transmission rod 1911. The rotary driver 191 can drive the crystal oscillator carrier 130 to rotate via the transmission rod 1911, thereby driving the crystal oscillator to rotate, to ensure the uniformity of the film thickness during the coating process. The display 192 is electrically connected to the top of the thermocouple 160 and is used to display the current temperature of the crystal oscillator.

[0036] Preferably, the rotary driver 191 can be a servo motor, which provides high control precision. Alternatively, the rotary driver 191 can be a stepper motor, which has lower manufacturing costs.

[0037] The implementation principle of this embodiment is as follows: During the coating process, the vacuum chamber 110 provides the vacuum environment required for coating. The first evaporation source 141 and the second evaporation source 142 work alternately to form the first coating and the second coating alternately on the surface of the crystal oscillator. The first baking heat source 151 is used to bake the crystal oscillator from below, and the second baking heat source 152 is used to bake the crystal oscillator from above. Thermocouple 160 is used to detect the temperature of the crystal oscillator throughout the coating process. Since the temperature changes significantly during the alternating operation of the first evaporation source 141 and the second evaporation source 142, the temperature of the crystal oscillator carrier 130 is stabilized by the cooling source 120, thereby stabilizing the temperature of the crystal oscillator. At the same time, the first heat insulation component 170 isolates the heat radiation generated by the evaporation source and the baking heat source from the thermocouple 160, blocking the path of heat radiation to transfer heat to the crystal oscillator through the thermocouple 160, further stabilizing the temperature of the crystal oscillator during the coating process. Even in coating processes that last for tens of hours or involve high baking temperatures, the temperature variation range of the crystal oscillator is extremely small, resulting in a significant temperature control effect. This effectively reduces film thickness error, helps ensure film thickness consistency, and meets actual production needs.

[0038] The embodiments described herein are preferred embodiments of the present invention and are not intended to limit the scope of protection of the present invention. Therefore, all equivalent changes made in accordance with the structure, shape, and principle of the present invention should be covered within the scope of protection of the present invention.

Claims

1. A vacuum coating equipment, characterized in that, include: Vacuum chamber (110); A cooling source (120) is installed in the upper part of the vacuum chamber (110); A crystal oscillator carrier (130) is rotatably mounted on the bottom of the cooling source (120) for supporting the crystal oscillator; A first evaporation source (141) is installed at the bottom of the vacuum chamber (110) to heat the first evaporation material to form a first coating on the surface of the crystal oscillator. The second evaporation source (142) is installed at the bottom of the vacuum chamber (110) to heat the second evaporation material to form a second coating on the surface of the crystal oscillator. A first baking heat source (151) is installed in the lower part of the vacuum chamber (110) for baking the crystal oscillator. A second baking heat source (152) is installed in the upper part of the vacuum chamber (110) for baking the crystal oscillator. Thermocouple (160) with its axis set vertically, its bottom end mounted on the cooling source (120) and its top end extending outside the vacuum chamber (110), is used to detect the temperature of the crystal oscillator. A first thermal insulation component (170) is disposed outside the thermocouple (160) for thermal insulation.

2. The vacuum coating equipment according to claim 1, characterized in that, The first thermal insulation component (170) includes: The heat insulation cylinder (171) has a heat insulation cavity (1711) formed inside its side wall; A heat insulation film (172) is wrapped around the outer wall of the heat insulation cylinder (171); An upper heat insulation gasket (173) is placed between the top of the heat insulation cylinder (171) and the top wall of the vacuum chamber (110); A lower heat insulation gasket (174) is placed between the bottom end of the heat insulation cylinder (171) and the top end of the cooling source (120).

3. The vacuum coating equipment according to claim 2, characterized in that, The top wall of the vacuum chamber (110) is formed with a first-level upper sealing groove, a second-level upper sealing groove and a third-level upper sealing groove connected in sequence. The top of the heat insulation cylinder (171) is formed with a first-level lower sealing groove, a second-level lower sealing groove and a third-level lower sealing groove connected in sequence. The top end of the upper heat insulation gasket (173) has a first-stage upper sealing protrusion (1731), a second-stage upper sealing protrusion (1732), and a third-stage upper sealing protrusion (1733) connected in sequence, and the bottom end has a first-stage lower sealing protrusion (1734), a second-stage lower sealing protrusion (1735), and a third-stage lower sealing protrusion (1736) connected in sequence; the first-stage upper sealing protrusion (1731) matches the first-stage upper sealing groove; the second-stage upper sealing protrusion (1732) matches the second-stage upper sealing groove; the third-stage upper sealing protrusion (1733) matches the third-stage upper sealing groove; the first-stage lower sealing protrusion (1734) matches the first-stage lower sealing groove; the second-stage lower sealing protrusion (1735) matches the second-stage lower sealing groove; and the third-stage lower sealing protrusion (1736) matches the third-stage lower sealing groove. The structure of the lower heat insulation gasket (174) is the same as that of the upper heat insulation gasket (173).

4. The vacuum coating equipment according to claim 2, characterized in that, Also includes: The second heat insulation component (180) is disposed inside the heat insulation cylinder (171) and surrounds the thermocouple (160).

5. The vacuum coating equipment according to claim 4, characterized in that, The second thermal insulation component (180) includes: An inner spiral condenser tube (181) is arranged around the thermocouple (160), with a first cooling medium inlet at the bottom and a first cooling medium outlet (1811) at the top. An outer spiral condenser tube (182) is arranged outside the inner spiral condenser tube (181), with a second cooling medium outlet at the bottom and a second cooling medium inlet (1821) at the top; the second cooling medium outlet is connected to the first cooling medium inlet. The first cooling medium inlet pipe (183) is connected to the second cooling medium inlet (1821); The first cooling medium outlet pipe (184) is connected to the first cooling medium outlet (1811).

6. The vacuum coating apparatus according to any one of claims 1 to 4, characterized in that, The cooling source (120) includes: The cooling base (121) is rotatably connected to the crystal oscillator support (130) at its bottom; The second cooling medium inflow pipe (122) is connected to the cooling base (121); The second cooling medium outlet pipe (123) is connected to the cooling base (121).

7. The vacuum coating apparatus according to any one of claims 1 to 4, characterized in that, Also includes: A rotary driver (191) is mounted on the top of the vacuum chamber (110), and its output shaft is fixedly connected to the top of the crystal oscillator carrier (130) via a transmission rod (1911). The display (192) is connected to the thermocouple (160).

8. The vacuum coating apparatus according to any one of claims 1 to 4, characterized in that, The first evaporation source (141) includes: The first mounting base (1411) is installed at the bottom of the vacuum chamber (110); An evaporating dish (1412) is mounted on the first mounting base (1411) and is used to heat the first evaporating material; The structure of the second evaporation source (142) is the same as that of the first evaporation source (141).

9. The vacuum coating apparatus according to any one of claims 1 to 4, characterized in that, The first baking heat source (151) includes: The second mounting base (1511) is installed in the lower part of the vacuum chamber (110); A first dryer (1512) is mounted on the second mounting base (1511) for baking the crystal oscillator.

10. The vacuum coating apparatus according to any one of claims 1 to 4, characterized in that, The second baking heat source (152) includes: The third mounting base (1521) is installed on the upper part of the inner wall of the vacuum chamber (110); The second dryer (1522) is mounted on the third mounting base (1521) and is used to bake the crystal oscillator.

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