A silicon wafer drying device

Abstract

The application provides a silicon wafer drying device, which comprises a transfer assembly and at least two drying stations, wherein the at least two drying stations are sequentially arranged along a first direction, each drying station is provided with a drying assembly; the transfer assembly is used for transferring silicon wafers, the transfer speed of the silicon wafers between the drying stations is greater than the transfer speed of the silicon wafers at the drying stations; and the included angle between the plane where the cutting surface of the silicon wafer is located and the first direction is not 0. The beneficial effects of the application are as follows: the working tempo of the drying device is controlled, the drying and cooling of multiple groups of silicon wafers are synchronously performed, the time for drying and cooling the silicon wafers is reduced, the working efficiency of the drying device is improved, the energy consumption of the drying device is reduced, the problem of local temperature unevenness is solved, the heat field in the drying device is more uniform, the energy consumption demand is reduced, the temperature difference of the silicon wafers at different positions is reduced, and the parameter deviation is reduced.

Description

Technical Field

[0001] This invention belongs to the field of silicon wafer production technology, and in particular relates to a silicon wafer drying device. Background Technology

[0002] After the silicon wafers have completed processes such as debonding and cleaning, they need to undergo quality inspection. Therefore, it is necessary to remove water stains from the surface of the silicon wafers. The specific method is to put the silicon wafers into the drying line along with the wafer basket. The drying line includes a drying chamber and a conveyor belt that passes through the drying chamber. The wafer basket is placed on the conveyor belt and passes through the drying chamber. Hot air carries away the water stains from the surface of the silicon wafers.

[0003] Currently, the uneven air intake and return of the drying oven leads to uneven heat distribution within the oven, resulting in localized overheating and undercooling issues. In overheated areas, the silicon wafers are at high temperatures, causing the wafers to fail inspection after drying due to thermal expansion and contraction, which leads to deviations in the wafer parameters and inaccurate parameter determination. In undercooled areas, incomplete drying is likely to occur, and the contact area between the silicon wafers and the wafer basket is difficult to dry, leaving watermarks. Summary of the Invention

[0004] In view of the above problems, the present invention provides a silicon wafer drying apparatus to solve the above or other problems existing in the prior art.

[0005] To solve the above-mentioned technical problems, the technical solution adopted by the present invention is: a silicon wafer drying device, comprising a transfer assembly and at least two drying stations, wherein,

[0006] At least two drying stations are arranged sequentially along the first direction, and each drying station is equipped with a drying component;

[0007] The transfer assembly is used to transfer silicon wafers, and the transfer speed of the silicon wafers between drying stations is greater than the transfer speed at the drying station;

[0008] The angle between the plane containing the cut surface of the silicon wafer and the first direction is not 0.

[0009] Furthermore, the drying component extends along the first direction;

[0010] Within each drying station, along the first direction, the turnover speed of the silicon wafers first decreases and then increases.

[0011] Furthermore, the transfer assembly is provided with a first conveying surface extending along a first direction, the first conveying surface being used to place a wafer basket containing silicon wafers, and the drying assembly being provided at least on one side of the first conveying surface along a second direction, the included angle between the first direction and the second direction being not 0.

[0012] Furthermore, the second direction is perpendicular to the plane containing the first conveying surface.

[0013] Furthermore, along the first direction, cooling stations are provided at the discharge ends of multiple drying stations, and each cooling station is equipped with a cooling component.

[0014] Furthermore, the cooling assembly extends along the first direction; within the cooling station, the flow rate of the silicon wafer gradually decreases along the first direction.

[0015] Furthermore, the cooling station extends along a third direction and is used to place several wafer baskets containing silicon wafers, with the silicon wafers in the wafer baskets spaced apart along the first direction.

[0016] The cooling assembly includes a blower, which is located on one side of the cooling station in the third direction, and the extension length of the blower in the first direction is not less than the length of the tray.

[0017] The angle between the first direction and the third direction is not 0.

[0018] Furthermore, along the first direction, the end of the cooling station is provided with a blocking member, the blocking member having an abutment surface extending along a third direction, the abutment surface being able to abut against the tray.

[0019] Furthermore, the cooling assembly also includes a suction component, which is positioned opposite to the blower component on both sides of the cooling station in a third-party orientation.

[0020] Furthermore, along the first direction, the extension length of the suction member is less than the extension length of the blower member, and the suction member is located between the two ends of the blower member in the first direction.

[0021] Furthermore, the transfer assembly includes a conveyor belt extending along a first direction, which sequentially passes through each drying station and cooling station.

[0022] Furthermore, the drying assembly includes an air distribution component and an air return component. The air distribution component includes an air inlet end and an air outlet end that are connected to each other. The air inlet end includes at least one first air inlet, and the air outlet end includes at least two first air outlets. The multiple first air outlets are arranged along a third direction.

[0023] In the second direction, the air distribution component and the air return component are respectively located on both sides of the first conveying surface. The air return component is provided with at least two connected second air inlets and a second air outlet, and multiple second air inlets are arranged sequentially along the third direction.

[0024] Furthermore, a tray detection device is installed between the drying station and the cooling station, and an arrival detection device is installed at the cooling station. The tray detection device and the arrival detection device work in conjunction with the transfer assembly.

[0025] By adopting the above technical solution, the silicon wafer drying device has multiple drying stations and cooling stations. The multiple drying stations and cooling stations are arranged sequentially along the first direction, and the multiple drying stations and cooling stations are connected by a transfer component / robotic arm. Each drying station is equipped with a transfer component, and a transfer component is also set in the cooling station. The transfer speed of the transfer component between the drying stations is greater than the transfer speed at the drying station. The transfer speed of the transfer component at the drying station is the same as the transfer speed at the cooling station, so that the transfer state of the silicon wafer in the drying station is consistent with the transfer state of the silicon wafer in the cooling station. This controls the working cycle of the drying device, and performs drying and cooling of multiple sets of silicon wafers simultaneously, reducing the drying and cooling time of the silicon wafers, improving the working efficiency of the drying device, and reducing the energy consumption of the drying device. Furthermore, the silicon wafers deflect during the transfer process in the drying station or during the transfer process in adjacent drying stations, so that the silicon wafers can be completely dried as a whole.

[0026] In the vertical direction, air distribution components and return air components are set on both sides of the transfer assembly. Both air distribution components and return air components extend upward along the third direction. The air distribution component has multiple first air outlets set along the third direction, and the return air component has multiple second air inlets set along the third direction. Through the cooperation of the air distribution component and the return air component, the airflow entering the drying chamber is uniformized by the air distribution component. The airflow area covers all silicon wafers at the drying station. The airflow can flow evenly over all silicon wafers, making the airflow path in the drying chamber uniform, improving the drying efficiency of silicon wafers, and distributing the air volume and temperature evenly in the drying chamber. This solves the problem of uneven local temperature, makes the heat field in the drying device more uniform, reduces energy consumption, reduces the temperature difference of silicon wafers at different positions, reduces parameter deviation, and can extend the service life of tooling and spare parts in the drying device.

[0027] The cooling station is equipped with blowers and suction devices, forming a cooling airflow in a three-dimensional direction. The cooling airflow flows through multiple silicon wafers in multiple wafer baskets, cooling the wafers and causing the residual heat on the wafer surface to dissipate rapidly through convection. The overall temperature of the wafer drops quickly from the drying temperature to within the allowable deviation range of room temperature. Because the silicon wafers undergo slight lattice expansion and dimensional elongation due to heating during the drying process, this rapid and uniform cooling process can release the internal stress of the silicon wafers, allowing their geometric dimensions to reliably return to the nominal dimensions at room temperature from the heated elongated state. After this cooling and shaping treatment, the flatness and dimensional consistency of the silicon wafers are effectively guaranteed, reducing the detection offset caused by high temperature. This enables the wafers to meet the high-precision positioning and flatness feeding requirements of subsequent optical inspection or electrical performance testing equipment, significantly reducing the false detection or jamming rate caused by thermal deformation. Attached Figure Description

[0028] Figure 1This is a three-dimensional structural schematic diagram of a silicon wafer drying apparatus according to an embodiment of the present invention;

[0029] Figure 2 This is a partial top view of a silicon wafer drying apparatus according to an embodiment of the present invention;

[0030] Figure 3 This is a three-dimensional structural schematic diagram of a silicon wafer drying apparatus according to another embodiment of the present invention;

[0031] Figure 4 This is a top view schematic diagram of a silicon wafer drying apparatus according to an embodiment of the present invention;

[0032] Figure 5 yes Figure 4 A schematic diagram of the AA cross-sectional structure;

[0033] Figure 6 This is a schematic diagram of the structure of a return air component according to an embodiment of the present invention.

[0034] In the picture:

[0035] 1. Transfer assembly; 2. Drying assembly; 20. Air distribution component; 200. Ventilation duct; 2000. First air inlet; 2001. First air outlet; 201. Frame; 21. Return air component; 210. Second air inlet; 211. Second air outlet; 3. Blower; 4. Suction component; 5. Drying station; 6. Cooling station; 7. Exhaust device; 8. Water shield; D1. First direction; D2. Second direction; D3. Third direction. Detailed Implementation

[0036] The present invention will be further described below with reference to the accompanying drawings and specific embodiments.

[0037] Figure 1 A schematic diagram of an embodiment of the present invention is shown. This embodiment relates to a silicon wafer drying device for drying and cooling silicon wafers after debinding and cleaning. The device includes a drying assembly with air outlets arranged perpendicular to the silicon wafer transfer direction to homogenize the airflow, ensuring that hot drying air can flow over all silicon wafers and that all silicon wafers at the drying station are uniformly heated and dried. A cooling station has blowing and suction components on both sides to cool the dried silicon wafers, releasing internal stress and restoring them to their room temperature dimensions. The device controls the speed of the transfer assembly between the drying and cooling stations, ensuring that the speed between the drying stations is greater than the speed within the drying station, thereby improving the working efficiency of the silicon wafer drying device.

[0038] A silicon wafer drying apparatus, such as Figure 1-5As shown, the device includes a transfer assembly 1 and at least two drying stations 5. Multiple drying stations 5 are arranged sequentially along a first direction D1. Each drying station 5 is equipped with a drying assembly 2, which heats and dries the silicon wafers transferred to the drying station 5 to remove water stains from the surface. The arrangement of multiple drying stations 5 allows the silicon wafers to undergo multiple drying cycles to ensure complete drying. Furthermore, the multiple drying stations 5 enable the drying device to dry multiple sets of silicon wafers simultaneously, improving its efficiency. The multiple drying stations 5 are arranged sequentially along the first direction D1. One end of each drying station 5 is a loading end, and the other end is a unloading end. Silicon wafers are loaded from the loading end, sequentially dried at each drying station 5, and then unloaded from the unloading end.

[0039] The transfer component 1 is used to transfer silicon wafers, allowing them to flow between multiple drying stations 5. That is, the transfer component 1 is set along the first direction D1 and passes through multiple drying stations 5. It sequentially transfers the silicon wafers fed from the loading end to each drying station 5. The silicon wafers flow through each drying station 5 in sequence and are dried at each drying station 5, realizing the transfer and drying of the silicon wafers. The transfer speed of the silicon wafers between the drying stations 5 is greater than the transfer speed at the drying station 5, which shortens the transfer time of the silicon wafers between the drying stations 5, thereby shortening the transfer time of the silicon wafers in the drying device and improving the working efficiency of the drying device. At the same time, due to the different transfer speeds, the silicon wafers are deflected in the wafer basket under the action of inertia, so that the contact area between the silicon wafers and the wafer basket is also dried, avoiding incomplete drying at the contact area between the silicon wafers and the wafer basket and the presence of watermarks.

[0040] The transfer component 1 transfers the silicon wafers; therefore, the first direction D1 is the flow direction of the silicon wafers, and the flow speed of the silicon wafers is controlled by the transfer component 1.

[0041] The angle between the plane containing the cut surface of the silicon wafer and the first direction D1 is not 0. In the wafer basket, the cut surface of the silicon wafer extends along the second direction D2. That is, the second direction D2 intersects with the first direction D1, and the angle between them is not 0. Preferably, the second direction D2 is perpendicular to the first direction D1.

[0042] In each drying station 5, the drying component 2 is used to form a drying airflow along the second direction D2. The drying airflow flows through the two cut surfaces of the silicon wafer, removes water stains from the cut surfaces of the silicon wafer, and quickly dries the silicon wafer.

[0043] To facilitate the transfer of silicon wafers, multiple silicon wafers placed on the transfer assembly 1 are arranged in groups. Each group of silicon wafers is placed in a wafer basket to improve the transfer efficiency of silicon wafers and enhance the automation of silicon wafer drying. For ease of description, each group of silicon wafers mentioned below refers to multiple silicon wafers placed in a wafer basket.

[0044] Specifically, the aforementioned drying component 2 extends along the first direction D1, such that the drying component 2 can cover at least one drying station 5 in the first direction D1. When the length of the drying component 2 in the first direction D1 is sufficient, it can cover all drying stations 5. When the length of the drying component 2 in the first direction D1 is only enough to cover one drying station 5, the number of drying components 2 is consistent with the number of drying stations 5, and a drying component 2 is provided at each drying station 5.

[0045] The aforementioned transfer component 1 is provided with a first conveying surface extending along the first direction D1. The first conveying surface is used to place a wafer basket containing silicon wafers. In order to enable each drying station 5 to dry multiple sets of silicon wafers simultaneously, the first conveying surface has a certain width along the third direction D3. Multiple sets of silicon wafers can be placed side by side on the first conveying surface in the third direction D3. The first conveying surface has a certain length in the first direction D1 so that the first conveying surface can penetrate multiple drying stations 5, allowing the silicon wafers to flow between each drying station 5.

[0046] The angle between the first direction D1 and the third direction D3 is not 0, that is, the first direction D1, the second direction D2, and the third direction D3 are intersected pairwise, and the angles between them are not 0. Preferably, the plane formed by the third direction D3, the first direction D1, and the second direction D2 is perpendicular to each other, that is, the first direction D1 is perpendicular to the second direction D2, the second direction D2 is perpendicular to the third direction D3, and the first direction D1 is perpendicular to the third direction D3. In some feasible embodiments, the second direction D2 is a vertical direction, the plane formed by the first direction D1 and the third direction D3 is a horizontal plane, and the first conveying surface is set in the plane formed by the first direction D1 and the third direction D3, that is, the first conveying surface is set horizontally, so that the wafer basket placed on the first conveying surface is set horizontally, the second direction D2 is perpendicular to the plane where the first conveying surface is located, and the silicon wafers located in the wafer basket are set vertically.

[0047] Of course, it is understandable that the drying stations 5 can be connected without the transfer component 1. Adjacent drying stations 5 can be connected via a robotic arm. Wafer baskets flowing from one drying station 5 are transported to the next drying station 5 by the robotic arm. The flow speed of the silicon wafers is controlled between two drying stations 5 by the robotic arm, and within each drying station 5, the flow speed of the silicon wafers is controlled by the transfer component 1. In this structure, there can be multiple transfer components 1, with one transfer component 1 installed in each drying station 5.

[0048] The drying component 2 is disposed at least on one side of the first conveying surface along the second direction D2. The drying component 2 can be located above the first conveying surface. While extending along the first direction D1, the drying component 2 also extends along the third direction D3. The drying component 2 is used to homogenize the airflow entering the drying station 5. Since the drying component 2 is disposed along the third direction D3, the airflow is homogenized along the third direction D3, so that the silicon wafers in each basket on the first conveying surface are all flowed by the airflow, so that the silicon wafers in each basket are dried evenly, avoiding the situation where the temperature is low in the middle and high on both sides along the third direction D3, and the heat distribution is uniform along the third direction D3.

[0049] The transfer assembly 1 includes a conveyor belt extending along a first direction D1. The conveyor belt is positioned at each drying station 5 and the cooling station 6 (described below), or the conveyor belt sequentially passes through each drying station 5 and the cooling station 6. In some feasible embodiments, the conveyor belt is a conveyor chain structure with multiple conveyor chains arranged side-by-side along a third direction D3. Each pair of conveyor chains forms a group, supporting and conveying a wafer basket. There is a gap between adjacent conveyor chains to allow hot drying air to pass through, avoiding obstruction of the hot drying air's flow in the second direction D2. Each conveyor chain is arranged along the first direction D1 and is rotatable in the first direction D1 to realize the conveying of silicon wafers; that is, the first direction D1 is the flow direction of the silicon wafers. The conveyor chain is composed of multiple rotating rollers, forming a porous, hollow structure to allow hot drying air to pass through, avoiding obstruction of the hot drying air's flow in the second direction D2.

[0050] Within each drying station 5, the length of the conveyor chain in the first direction D1 is greater than the length of the corresponding drying station 5 in the first direction D1, so that the conveyor chain can pass through the drying station 5 and realize the transfer of silicon wafers at the drying station 5. Of course, within the cooling station 6, the total length of the transfer assembly 1 in the first direction D1 is also greater than the length of the cooling station 6 in the first direction D1. The specific structure of this conveyor chain line is prior art and will not be described in detail here.

[0051] Each drying station 5 has a certain length in the first direction D1, and the length of the drying station 5 in the first direction D1 is not less than the length of the wafer basket, so that at least one wafer basket can be placed in each drying station 5 in the first direction D1, and multiple silicon wafers in each wafer basket located at the drying station 5 can be dried simultaneously under the action of the drying component 2. At the same time, each drying station 5 has a certain length in the third direction D3, so that multiple wafer baskets can be placed side by side in each drying station 5 along the third direction D3, and the silicon wafers in multiple wafer baskets can be dried simultaneously, improving the working efficiency of the drying device.

[0052] In some feasible embodiments, the silicon wafers rotate at a constant speed within each drying station 5; the silicon wafers also rotate at a constant speed between adjacent drying stations 5. In the first direction D1, there is a certain distance between adjacent drying stations 5. Therefore, the transfer assembly 1 / robotic arm drives the silicon wafers to move, and the silicon wafers rotate at a certain speed between adjacent drying stations 5. Each drying station 5 has a certain length in the first direction D1, and the transfer assembly 1 has a certain speed within each drying station 5. Let v1 be the speed of the transfer assembly 1 between drying stations 5, and v2 be the speed at each drying station 5, where v1 > v2. That is, the silicon wafers rotate at a higher speed between adjacent drying stations 5 and at a lower speed within each drying station 5, thereby improving the working efficiency of the drying device and reducing its energy consumption. Here, the flow rate of silicon wafers between drying stations 5 refers to the speed of the transfer component 1 / robotic arm when the wafer baskets flow between drying stations 5, and the speed of the silicon wafers is determined by the transfer component 1 or the robotic arm; the flow rate of silicon wafers within drying stations 5 refers to the speed of the transfer component 1 when the same wafer baskets flow within drying stations 5, and the speed of the silicon wafers is determined by the speed of the transfer component 1.

[0053] The flow rate of silicon wafers between drying stations 5 and within drying stations 5 can be selected and set according to actual needs; specific requirements are not specified here. When the length of drying station 5 along the first direction D1 is sufficiently large, the flow rate of silicon wafers within drying station 5 can be greater than zero. To make the overall structure of the drying device compact and occupy a small area, and to reduce the energy consumption of the drying device, in some feasible embodiments, the flow rate v2 of silicon wafers within drying station 5 is zero. That is, when a wafer basket containing multiple silicon wafers is located at each drying station 5, the flow rate v2 of the transfer component 1 is 0, the wafer basket is in a stopped state at the corresponding drying station 5, and the silicon wafers in the wafer basket are dried by the action of the drying component 2. After the drying time is reached, the transfer component 1 activates. The transfer component 1 / robotic arm transfers the wafer basket from one drying station 5 to another adjacent drying station 5 at a flow rate v1. The transfer component 1 / robotic arm stops moving, and the flow rate v2 of the transfer component 1 is 0. The silicon wafers in the wafer basket are dried in the drying station 5. After the drying time is reached, the transfer component 1 moves at a flow rate v1 and repeats the above steps to transfer the wafer basket until the wafer basket is dried at the last drying station 5 and is then transferred out from the last drying station 5.

[0054] As can be seen from the movement mode of the above-mentioned transfer component 1, the total drying time t of the silicon wafer in each basket during the drying process is: t=n*t1+(n-1)*t2, where t1 is the drying time of the basket in each drying station 5, t2 is the time of the basket moving between two adjacent drying stations 5, and n is the number of drying stations 5.

[0055] The setting of multiple drying stations 5, and the setting of the flow speed v1 of silicon wafers between adjacent drying stations 5 being greater than the flow speed v2 within the drying station 5, combined with the structure of the wafer basket, the silicon wafers will be deflected in the slots of the wafer basket at different flow speeds, so that after the silicon wafers pass through multiple drying stations 5 in sequence, the water stains on the surface of the silicon wafers are completely dried, and the water stains at the contact position between the silicon wafers and the slots of the wafer baskets are also completely dried, so that there are no watermarks on the surface of the silicon wafers.

[0056] In some other feasible embodiments, the flow of silicon wafers within each drying station 5 is not constant; the silicon wafers flow at varying speeds. The flow speed of silicon wafers between two adjacent drying stations 5 can be constant or variable, which is not specifically required here. Within each drying station 5, along the first direction D1, the flow speed of the silicon wafer first decreases and then increases. That is, the silicon wafer undergoes a deceleration and acceleration process within each drying station 5. During the speed change, due to its own inertia, the silicon wafer will deflect in the first direction D1, thereby ensuring that the entire silicon wafer, including the part in contact with the wafer basket, is blown by the drying hot air within each drying station 5, achieving thorough drying of the silicon wafer without any dead angles.

[0057] Within each drying station 5, the speed of the transfer component 1 is controlled to first decrease and then increase, thereby controlling the speed of the silicon wafer to first decrease and then increase, causing the silicon wafer to deflect in the first direction D1. In this case, the space within each drying station 5 is divided along the first direction D1 into at least a first moving segment and a second moving segment. The silicon wafer decelerates in the first moving segment and accelerates in the second moving segment. Alternatively, a third moving segment can be provided between the first and second moving segments, in which the silicon wafer can move at a constant speed to ensure more thorough drying. For example, let's define the following: The silicon wafer enters the first moving section at a speed of V1. Within this section, it undergoes uniform deceleration, decreasing from V1 to V2. Then, it enters the third moving section, where it moves at a constant speed of V2. Upon entering the second moving section, the wafer's speed is V2 again. Within this section, it undergoes uniform acceleration, increasing from V2 to V1. When the speed reaches V1, the wafer exits the second moving section, completing its flow and drying within a drying station 5. During deceleration and acceleration, the wafer deflects along the first direction D1. Furthermore, within the drying station 5, the drying assembly 2 consistently generates drying airflow along the second direction D2, ensuring simultaneous drying of all silicon wafers.

[0058] Further optimizing the scheme, along the first direction D1, cooling stations 6 are set at the discharge end of multiple drying stations 5. The cooling stations are equipped with cooling components, which are used to form a cooling airflow in the third direction D3. The dried silicon wafers move to the cooling stations 6 and are cooled, reducing the temperature of the silicon wafers and promoting the rapid convection dissipation of residual heat on the surface of the silicon wafers. The overall temperature of the silicon wafers drops rapidly from the drying temperature to the room temperature. During this cooling process, the internal stress of the silicon wafers is released, and its geometric dimensions are reliably restored from the thermally elongated state to the nominal size at room temperature. This effectively ensures the consistency of the shape, size and flatness of the dried silicon wafers, thereby meeting the high-precision positioning and flatness feeding requirements of subsequent optical inspection or electrical performance testing equipment, and significantly reducing the false detection or jamming rate caused by thermal deformation.

[0059] Along the silicon wafer transport direction, the aforementioned transport assembly 1 extends from the discharge end of multiple drying stations 5 to the cooling station 6, so that the transport assembly 1 can transfer the silicon wafers dried at the last drying station 5 to the cooling station 6. That is, the transport assembly 1 extends along the first direction D1 to the cooling station 6. In this structure, the transport assembly 1 passes through each drying station 5 and the cooling station 6. Of course, the silicon wafers can also be transported between the cooling station 6 and the adjacent drying station 5 by a robotic arm. In this case, a transport assembly 1 is provided in the cooling station 6, and no transport assembly 1 is provided between the cooling station 6 and the drying station 5.

[0060] The aforementioned cooling station 6 is arranged along the first direction D1, and the length of the cooling station 6 in the first direction D1 is greater than the length of a wafer basket, so that at least one wafer basket can be placed in the cooling station 6 in the first direction D1. At the same time, in order to place multiple wafer baskets in the cooling station 6, the cooling station 6 is arranged along the third direction D3, so that the cooling station 6 has a certain area and can simultaneously arrange multiple wafer baskets in parallel along the third direction D3, and simultaneously cool the silicon wafers in the multiple wafer baskets.

[0061] The cooling assembly extends along the first direction D1 so that the cooling airflow generated by the cooling assembly can flow through all the silicon wafers in each basket placed along the third direction D3, thereby achieving synchronous cooling of all silicon wafers and improving the cooling efficiency of the silicon wafers.

[0062] In some feasible embodiments, within each cooling station 6, the flow rate of the silicon wafer gradually decreases along the first direction D1. The silicon wafer decelerates within the cooling station 6. For example, if the silicon wafer enters the cooling station 6 at a speed of V3, its speed gradually decreases from V3 to V4 after entering the cooling station 6. During the deceleration process, the silicon wafer gradually cools down and returns to its nominal size at room temperature. The speed V4 is preferably 0. When the silicon wafer stops moving, it flows to the discharge end of the cooling station 6 for unloading.

[0063] Alternatively, in some other feasible embodiments, the silicon wafers are rotated at a constant speed within each cooling station 6. The silicon wafers move at a constant speed within the cooling station 6. For example, the speed of the silicon wafers when they enter the cooling station 6 is V3. After entering the cooling station 6, the silicon wafers are rotated at a speed of V3 until they are rotated out of the cooling station 6.

[0064] Alternatively, in some other feasible embodiments, within each cooling station 6, along the first direction D1, the flow rate of the silicon wafer first decreases and then increases. The silicon wafer first decelerates and then accelerates within the cooling station 6. For example, the speed of the silicon wafer when it enters the cooling station 6 is V3. After entering the cooling station 6, the speed of the silicon wafer gradually decreases from V3 to V4. Then the silicon wafer accelerates from V4 to V3. During the deceleration and acceleration process, the silicon wafer deflects, so that the entire silicon wafer, including the part in contact with the wafer basket, is cooled and restored to the nominal size at room temperature.

[0065] The aforementioned cooling assembly includes a blower. On the third direction D3, the blower 3 is located on one side of the cooling station 6. The blower 3 blows air onto the silicon wafer, forming a cooling airflow along the third direction D3. The temperature of this airflow is room temperature. The room temperature airflow flows through the silicon wafers in each wafer basket and exchanges heat with the dried silicon wafers. The temperature of the dried silicon wafers (temperature between 110-130℃) is higher than room temperature, thereby reducing the temperature of the dried silicon wafers and achieving cooling of the silicon wafers.

[0066] To ensure that the air blown by the blower 3 flows evenly through each silicon wafer in each wafer basket and achieves uniform cooling of the silicon wafers in the wafer basket, the extension length of the blower 3 (the length of the blower 3 in the first direction D1, which is also the width of the air outlet of the blower 3) along the first direction D1 is not less than the length of the wafer basket containing the silicon wafers. That is, the length of the air belt formed by the air blown by the blower 3 in the first direction D1 can cover the length of the wafer basket. The wafer baskets are placed along the first direction D1, and the air blown by the blower 3 can cover all the silicon wafers in each wafer basket in the first direction D1. In this way, multiple wafer baskets arranged side by side along the third direction D3 are sequentially cooled by the air blown by the blower 3, thereby improving the cooling efficiency of the silicon wafers after drying.

[0067] The length of the cooling station 6 along the first direction D1 is greater than the length of the wafer basket containing the silicon wafers, so that each wafer basket is completely located within the cooling station 6, and each wafer basket is located within the airflow belt blown out by the blower 3. In some feasible embodiments, preferably, the length of the cooling station 6 along the first direction D1 is not less than the length of the blower 3 along the first direction D1, and at least one blower 3 cools the silicon wafers in multiple wafer baskets at the cooling station 6.

[0068] In a further optimized solution, the cooling assembly also includes a suction component 4. The blowing component 3 and the suction component 4 are disposed on both sides of the transfer assembly 1 in the third direction D3. The blowing component 3 and the suction component 4 are arranged opposite to each other. The suction component 4 draws the air flowing through the silicon wafer to form a low-temperature airflow between the blowing component 3 and the suction component 4, which flows from the blowing component 3 to the suction component 4. Within each wafer basket, multiple silicon wafers are arranged along the length of the basket and vertically. The cut surface of each wafer lies within the plane formed by the second direction D2 and the third direction D3. Therefore, along the first direction D1, there is a gap between adjacent wafers, forming a ventilation channel. Along the third direction D3, the wafers in the multiple baskets correspond one-to-one, and the corresponding ventilation channels form a ventilation channel from the blower 3 to the suction component 4. Multiple ventilation channels are arranged sequentially along the first direction D1, dividing the space between the blower 3 and the suction component 4. The air blown by the blower 3 enters each ventilation channel evenly and flows along the ventilation channel before being drawn away by the suction component 4. This ensures that the air blown by the blower 3 flows evenly through each silicon wafer, achieving synchronous heat dissipation and cooling of the wafers in multiple baskets. Wafers that have reached the cooling time are transported to the next process by the transfer assembly 1, where they undergo quality inspection.

[0069] The blower component 3 mentioned above is a hair dryer, and the suction component 4 is an exhaust fan. Both are commercially available products and can be selected and set according to actual needs. No specific requirements are specified here.

[0070] Along the first direction D1, the length of the suction component 4 is less than the length of the blowing component 3. The suction component 4 is located between the two ends of the blowing component 3 in the first direction D1. That is, the length of the blowing band of the blowing component 3 in the first direction D1 is greater than the length of the suction band of the suction component 4 in the first direction D1. This allows the cooling airflow to generate a component along the first direction D1 when entering the suction component 4, which is the cooling airflow being deflected from both sides to the middle. The closer to the suction component 4, the greater the deflection angle of the cooling airflow. When the cooling airflow passes through the silicon wafer, it causes the silicon wafers in the multiple wafer baskets in the third direction D3, especially the multiple silicon wafers in the wafer basket closest to the suction component 4, to be deflected in the first direction D1. Some of the silicon wafers are deflected in the first direction D1 from the feeding side to the discharging side of the cooling station 6, and other silicon wafers are deflected in the first direction D1 from the discharging side to the feeding side of the cooling station 6. As the cooling airflow flows from the blower 3 to the suction unit 4, when it reaches the silicon wafer closest to the suction unit 4, the air in the cooling airflow has already risen. Through the deflection of the silicon wafer, the silicon wafer in the basket closest to the suction unit 4 can fully contact the cooling airflow and be completely cooled.

[0071] In some feasible embodiments, a transfer component 1 is used to connect each drying station 5 and cooling station 6. The transfer component 1 has the same rotational speed at the cooling station 6 as it does at the drying station 5. If the transfer component 1 decelerates and then accelerates at the drying station 5, it also decelerates and then accelerates at the cooling station 6. If the transfer component 1 moves at a constant speed at the drying station 5, it also moves at a constant speed at the cooling station 6. This ensures that when the drying device is in use, the silicon wafers at each drying station 5 and the silicon wafers at the cooling station 6 are in the same state. The silicon wafers at the drying station 5 are dried, and the silicon wafers at the cooling station 6 are cooled. When the silicon wafers at the drying station 5 reach their drying time, the silicon wafers at the cooling station 6 reach their cooling time. The silicon wafers at the drying station 5 and the cooling station 6 are simultaneously transferred to the next station. This controls the working cycle of the drying device, improves its efficiency, and reduces its energy consumption. The rotation speed of the transfer component 1 is controlled by the motor that drives the conveyor chain.

[0072] In other feasible embodiments, multiple transfer components 1 are used to connect the drying station 5 and the cooling station 6. For example, each drying station 5 is provided with a transfer component 1 and each cooling station 6 is provided with a transfer component 1. The transfer components 1 can not operate at the same time and can be in different motion states. In this case, the flow speed of the silicon wafers in each drying station 6 and the flow speed of the silicon wafers in each cooling station 6 can be different. The selection and setting can be made according to actual needs. No specific requirements are made here.

[0073] Along the first direction D1, the end of the cooling station 6 is provided with a blocking member. The blocking member has an abutment surface extending along the third direction D3, which can abut against the wafer baskets, so that multiple wafer baskets entering the cooling station 6 are arranged flush with each other in the third direction D3, thereby ensuring that the silicon wafers in each wafer basket correspond one-to-one and forming a ventilation channel. The blocking member is a plate structure with a certain length along the third direction D3. The blocking member is arranged along the second direction D2 and has a certain width in the second direction D2 so that the blocking member can contact multiple parallel wafer baskets simultaneously. In some feasible embodiments, the blocking member is a rectangular plate structure, and its length in the third direction D3 is the same as the length of the cooling station 6 in the third direction D3. The length of the blocking member in the second direction D2 can be selected and set according to actual needs, and no specific requirements are specified here.

[0074] At cooling station 6, multiple trays arranged side-by-side along the third direction D3 are fed sequentially at intervals along the direction from the blower 3 to the suction unit 4. The cooling time is t3, where Δt = t3 / m, and m is the number of trays arranged side-by-side along the third direction D3. Therefore, the first tray to be fed is the one closest to the blower 3, with a feeding time of t11 = 0 + Δt for the first tray, t12 = t11 + Δt for the second, t13 = t12 + Δt for the third, and so on, until the last tray is fed, which is closest to the suction unit 4. This interval-based feeding method is used because the first tray is closest to the blower, and the air blown from the blower first contacts the first tray. At this point, the air temperature is relatively low. As the air blows sequentially along the third direction D3 past the second, third, and so on, the air temperature gradually increases. Therefore, the tray closest to the suction unit 4 requires a longer residence time for cooling.

[0075] like Figure 5As shown, the drying assembly 2 includes an air distribution member 20 for uniformizing the airflow entering the drying device. In the second direction D2, the air distribution member 20 is located above the first conveying surface. The air distribution member 20 extends along the third direction D3. The air distribution member 20 uniformizes the airflow entering the drying device in the third direction D3 so that the drying hot air covers all silicon wafers in the third direction D3, and the airflow path of the drying hot air in the drying device is uniformized. Considering that the wafer baskets have a certain length, when multiple wafer baskets are placed sequentially along the third direction D3, the projection of the multiple wafer baskets on the horizontal plane (the plane formed by the third direction D3 and the first direction D1) has a certain area. Therefore, while the above-mentioned air-uniforming component 20 extends along the third direction D3, the air-uniforming component 20 also extends along the first direction D1. That is, the air-uniforming component 20 has a certain projected area in the plane formed by the third direction D3 and the first direction D1, so that the airflow after being uniformized by the air-uniforming component 20 can cover multiple sets of silicon wafers, and the drying hot air can flow through the silicon wafers in each wafer basket at the same time, so as to achieve simultaneous drying of multiple silicon wafers in each wafer basket. By extending the air distribution element 20 in the third direction D3, the drying air can cover the silicon wafers in each basket in the third direction D3. The drying station 5 is a hot drying area in the third direction D3. The heat distribution in the drying station 5 in the third direction D3 is uniform, and there is no problem of local overcooling or overheating. For example, there will be no situation where the heat temperature in the middle is low and the heat temperature on both sides is high. This improves the heat uniformity of the drying station 5 area, so that all silicon wafers located in the drying station 5 are uniformly heated and dried.

[0076] In order to enable the airflow to pass through the air distribution element 20 and be homogenized during the process of passing through the air distribution element 20, the air distribution element 20 includes an air inlet end and an air outlet end that are connected to each other. The air inlet end and the air outlet end are arranged sequentially in the second direction D2. The airflow enters the air distribution element 20 from the air inlet end, is homogenized and then flows out from the air outlet end. Since the air inlet end and the air outlet end are arranged sequentially in the second direction D2, the airflow flowing out from the air outlet end flows along the second direction D2 and enters the air ducts (formed by the gap between any two adjacent silicon wafers) in each wafer basket simultaneously.

[0077] The aforementioned air inlet includes at least one first air inlet 2000, and the air outlet includes at least two first air outlets 2001. The multiple first air outlets 2001 are arranged along the third direction D3. The airflow entering the drying device enters the interior of the air distribution member 20 through the first air inlet 2000, flows within the air distribution member 20, and flows out from each of the first air outlets 2001. Since the multiple first air outlets 2001 are arranged along the third direction D3, an air curtain is formed on the third direction D3, which blows and dries the silicon wafers in each wafer basket on the third direction D3.

[0078] The number of first air inlets 2000 can be one, or two or more. When there is one first air inlet 2000, it is connected to multiple first air outlets 2001. When there are two or more first air inlets 2000, it can be connected to one or more first air outlets 2001. When the number of first air inlets 2000 and first air outlets 2001 is the same, multiple first air inlets 2000 are connected to multiple first air outlets 2001 in a one-to-one correspondence. The number of first air inlets 2000, the number of first air outlets 2001, and the connection method between the first air inlets 2000 and the first air outlets 2001 can be selected and set according to actual needs. No specific requirements are made here.

[0079] The number of the aforementioned first air outlets 2001 is two or more, and the multiple first air outlets 2001 are evenly arranged along the third direction D3 so that the silicon wafers in each wafer basket placed on the third direction D3 are all blown by the drying hot air, thereby realizing the air distribution function of the air distribution component 20. The number and arrangement of the first air outlets 2001 are selected and set according to the size of the first air outlets 2001 and the size of the air distribution component 20, and no specific requirements are made here.

[0080] In some feasible embodiments, the aforementioned air distribution element 20 includes a plurality of ventilation ducts 200 arranged sequentially along a third direction D3, each ventilation duct 200 being arranged along a second direction D2. The corresponding axial ends of the plurality of ventilation ducts 200 respectively form an air inlet and an air outlet. That is, the air distribution element 20 is a multi-channel structure with a plurality of ventilation ducts 200. Each ventilation duct 200 can be an independent pipe structure, having openings at both axial ends along its axial direction. One axial opening is a first air inlet 2000, and the other axial opening is a first air outlet 2001, allowing airflow to enter from the first air inlet 2000, flow along the ventilation duct 200, and exit from the first air outlet 2001. The corresponding first air inlets 2000 of the multiple ventilation ducts 200 form the air inlet end of the air-uniformer 20, and the corresponding first air outlets 2001 of the multiple ventilation ducts 200 form the air outlet end of the air-uniformer 20. Airflow enters from the air inlets of each ventilation duct 200, flows along each ventilation duct 200, and flows out from the air outlets of each ventilation duct 200. The arrangement of multiple ventilation ducts 200 guides and uniforms the airflow, realizing the air-uniformer function of the air-uniformer 20. The area formed by the first air outlets 2001 of the multiple ventilation ducts 200 covers multiple sets of silicon wafers at the drying station 5, so that the drying hot air flowing from the multiple ventilation ducts 200 can flow through the air channels between the silicon wafers, realizing the simultaneous drying of multiple sets of silicon wafers. This avoids the situation where the temperature in the middle of the area where multiple sets of silicon wafers are placed at the drying station 5 is low and the temperature on the periphery is high, resulting in good airflow uniformity of the drying hot air in the drying device and high drying efficiency of the silicon wafers. In this structure, the number of the first air inlet 2000 and the first air outlet 2001 of the air distribution component 20 are the same.

[0081] In the case where the ventilation duct 200 is an independent pipe structure, to achieve the installation of the independent pipe structure ventilation duct 200, the air distribution component 20 includes a frame 201 and multiple ventilation ducts 200 disposed within the frame 201. The multiple ventilation ducts 200 are arranged along a third direction D3 and a first direction D1, so that the area of ​​the drying hot air flowing from the air distribution component 20's outlet can cover all silicon wafers, drying all silicon wafers. Each ventilation duct 200 is arranged along a second direction D2, so that the drying hot air flows vertically, and the air outlets of the multiple ventilation ducts 200 are located directly above multiple groups of silicon wafers. The arrangement direction of the multiple silicon wafers in each wafer basket is the silicon wafer flow direction, that is, the first direction D1 is the flow direction.

[0082] The aforementioned frame 201 is a frame structure with a support frame. Circumferential sidewalls are provided along the circumference of the frame 201, with the sidewalls connected end-to-end and fixedly connected to the support frame, forming a frame 201 structure with internal accommodating space. Multiple ventilation ducts 200 are installed within the internal accommodating space of the frame 201. Along the axial direction of the frame 201, the frame 201 does not have axial sidewalls. Each ventilation duct 200 is arranged along the axial direction of the frame 201, and the axial length of the ventilation duct 200 is consistent with the axial length of the frame 201. This prevents the ventilation duct 200 from extending beyond the frame 201 along its axial length, making the air distribution component 20 a compact and regular structure, facilitating its installation. During installation, each ventilation duct 200 of the air distribution component 20 is set along the second direction D2, that is, the axial direction of the air distribution component 20 is vertical. In order to prevent the ventilation duct 200 from falling off, a mounting frame is set at both ends of the frame 201 in the axial direction. The mounting frame is fixedly connected to the support frame. The mounting frame has multiple through holes. The size of the through holes is adapted to the size of the ventilation duct 200. The ventilation duct 200 is interference-fitted with the through holes or fixedly connected, such as by welding, to fix the multiple ventilation ducts 200 in the internal accommodating space of the frame 201, so as to prevent the ventilation ducts 200 from leaking out of the frame 201.

[0083] The cross-sectional shape of the ventilation duct 200 can be circular, elliptical, square or polygonal, and can be selected and set according to actual needs. No specific requirements are made here.

[0084] Of course, the above-mentioned air-uniforming component 20 can also be other structures that can form a uniform airflow channel to achieve the function of uniform airflow. In some other feasible embodiments, the structure of the above-mentioned air-uniforming component 20 can be: including a frame 201 and multiple partitions disposed in the frame 201. The partitions are corrugated plate structures. The multiple partitions are installed in the internal space of the frame 201. The multiple partitions are arranged sequentially along the third direction D3. When the multiple partitions are installed, the protrusions correspond one-to-one with the protrusions and the grooves correspond one-to-one with the grooves, so that multiple ventilation channels are formed between two adjacent partitions. Multiple first air outlets 2001 are formed at the air outlet end of the air-uniforming component 20. The multiple first air outlets 2001 are arranged sequentially along the third direction D3. In this structure, one axial end of the frame 201 has multiple first air outlets 2001, forming the air outlet end of the air distribution component 20; the other axial end of the frame 201 has multiple first air inlets 2000, forming the air inlet end of the air distribution component 20. At this time, the structures at both axial ends of the frame 201 are identical, and each partition is fixedly connected to the frame 201, such as by welding. Alternatively, an air inlet component is installed at the other axial end of the frame 201. The air inlet component has a channel structure, with an opening at each axial end, and the opening size at one end is larger than the opening size at the other end. Air enters from the smaller opening of the air inlet component and flows out from the larger opening at the other end, entering the interior of the frame 201. The smaller opening of the air inlet component is the first air inlet 2000 of the air distribution component 20. Of course, it is understandable that there can be multiple smaller openings, so that the air distribution component 20 has multiple first air inlets 2000.

[0085] Alternatively, the structure of the aforementioned air distribution component 20 can be: including a frame 201 and a partition disposed within the frame 201, the partition being fixedly connected to the frame 201, such as by welding, the partition being a honeycomb core, the shape of the partition being adapted to the shape of the internal accommodating space of the frame 201, and the length of the partition being adapted to the axial length of the frame 201, the perforated channels of the honeycomb core being arranged along the axial direction of the frame 201, the airflow being able to flow along the perforated channels of the honeycomb core, each perforation on the air outlet side of the honeycomb core forming multiple first air outlets 2001 of the air distribution component 20, and each perforation on the air inlet side of the honeycomb core forming multiple first air inlets 2000 of the air distribution component 20. Of course, it is understood that when using a honeycomb core as a partition, it can be combined with the aforementioned air inlet component, with an air inlet component installed at one end of the frame 201, the air inlet component having one or more small-sized openings to form one or more first air inlets 2000 of the air distribution component 20.

[0086] Alternatively, the aforementioned air distribution component 20 may be a plate structure with multiple through holes, each through hole being the aforementioned ventilation duct 200, with the axial openings at both ends of the through hole being the first air inlet 2000 and the first air outlet 2001, respectively.

[0087] It is understandable that each drying station 5 is equipped with an air distribution element 20, which is located above the first conveying surface. In this case, multiple air distribution plates 20 are arranged sequentially along the first direction D1, and multiple air distribution elements 20 correspond one-to-one with multiple drying stations 5; or, multiple drying stations 5 share one air distribution element 20, and the area of ​​the air distribution element 20 can cover all drying stations 5. The specific setting method of the air distribution element 20 can be selected and set according to actual needs, and no specific requirements are made here.

[0088] Further optimize the plan, such as Figure 5-6 As shown, in order to ensure that the drying device can return air evenly, the drying component 2 mentioned above also includes a return air component 21. The uniform air component 20 and the return air component 21 are respectively disposed on both sides of the first conveying surface. In the second direction D2, the return air component 21 is located below the first conveying surface. The uniform air component 20 performs uniform air outlet, and the return air component 21 performs uniform air return.

[0089] The aforementioned return air component 21 includes a connected second air outlet 211 and at least two second air inlets 210. Multiple second air inlets 210 are arranged along a third direction D3. Airflow entering through the second air inlets 210 flows within the return air component 21 and exits through the second air outlet 211. The number of second air inlets 210 is multiple, and these multiple second air inlets 210 are arranged along a third direction D3, similar to the arrangement of multiple first air outlets 2001. This allows the drying hot air flowing from the outlet end of the uniform air distribution component 20 to dry each group of silicon wafers, and then enters the return air component 21 through each of the second air inlets 210. Within the area covered by the drying hot air after silicon wafer drying, multiple second air inlets 210 are arranged along a third direction D3. The drying hot air after silicon wafer drying can enter the return air component 21 at any position along the third direction D3. The return air component 21 is connected to an external exhaust device. Under the suction action of the exhaust device, the drying hot air for drying silicon wafers enters the return air component 21 through each of the second air inlets 210. The drying hot air for drying silicon wafers is drawn at various positions in the third direction D3, which further makes the drying hot air flowing out from the uniform air component 20 flow evenly in the second direction D2 and cover the area where the drying station 5 is located. A unidirectional flow field from top to bottom is formed between the uniform air component 20 and the return air component 21, which significantly reduces the temperature gradient along the third direction D3 at the drying station 5, solving the problem of local overcooling or overheating areas in the original drying device.

[0090] The number of second air inlets 210 on the third direction D3 is selected and set according to the length of the return air component 21 and the size of the second air inlets 210, and no specific requirements are made here. Considering the size of the return air component 21 on the first direction D1, in order to increase the efficiency of the return air, multiple second air inlets 210 can be set along the first direction D1 so that the surface of the return air component 21 is evenly covered with the second air inlets 210. Each second air inlet 210 is connected to the internal space of the return air component 21 so that the drying hot air entering the return air component 21 flows in the internal space of the return air component 21 and flows out from the second air outlet 211.

[0091] Specifically, the aforementioned return air component 21 is a pipe structure, and its cross-sectional shape can be circular, square, or other shapes, depending on actual needs. No specific requirements are specified here. One axial end of the return air component 21 is a second air outlet 211, and the other axial end is a closed structure with an internal cavity structure. At least two second air inlets 210 are provided on the side wall of the return air component 21. Multiple second air inlets 210 are arranged along the third direction D3 and the circumference of the return air component 21. The circumferential side wall of the return air component 21 is covered with second air inlets 210. The airflow carrying the remaining heat after the silicon wafer drying is completed enters the internal cavity of the return air component 21 from each second air inlet 210 and is uniformly returned along the third direction D3.

[0092] In some feasible embodiments, preferably, the return air component 21 is a circular tube structure with an internal cavity. Multiple second air inlets 210 are provided on the peripheral sidewall of the return air component 21. The multiple second air inlets 210 are arranged in multiple groups, and the number of second air inlets 210 in each group is multiple. The multiple second air inlets 210 in each group are arranged sequentially along the axial direction of the return air component 21, and the multiple groups of second air inlets 210 are arranged sequentially along the circumferential direction of the return air component 21, so that the peripheral sidewall of the return air component 21 is covered with second air inlets 210. One axial end of the return air component 21 is open. Airflow entering the internal cavity of the return air component 21 from each of the second air inlets 210 flows axially along the return air component 21 and exits from the open end, which is the second air outlet 211 of the return air component 21. The other axial end of the return air component 21 is closed to prevent airflow from entering the internal cavity of the return air component 21 from this end. Since the return air component 21 is connected to an external extraction device, the drying hot air used to dry the silicon wafers is forcibly drawn in by the external extraction device, creating negative pressure at the return air component 21. The dimension of the other axial end of the return air component 21 is larger than the dimension of the second air inlet 210 to avoid complete drying. A large amount of hot air from the return air unit 21 enters the interior of the return air unit 21 from this end. In order to prevent the hot air from the uniform air unit 20 from flowing downward along the edge of the drying station 5 under the suction of the air extraction device, the other end of the return air unit 21 is made into a closed structure. This allows the airflow that flows out uniformly from the outlet of the uniform air unit 20 to flow directly downward in the vertical direction (second direction D2) and enter the return air unit 21 from each of the second air inlets 210. This achieves uniform air intake and uniform air return on both sides of the first conveying surface in the drying station 5, forming a uniform airflow field between the uniform air unit 20 and the return air unit 21. The hot air flows uniformly over each silicon wafer.

[0093] The radial dimension (dimension in the first direction D1) of the return air component 21 is not greater than the dimension of the uniform air component 20 in the first direction D1, so as to achieve uniform return air.

[0094] Since the silicon wafers entering the drying device are silicon wafers that have been cleaned after degumming, they carry undried moisture. To prevent water droplets from the silicon wafers from falling into the return air unit 21, a water shield 8 is provided between the first conveying surface and the return air unit 21. The water shield 8 is set along the third direction D3. The water shield 8 is a plate structure. On the third direction D3, the length of the water shield 8 is not less than the length of the return air unit 21. On the plane formed by the third direction D3 and the first direction D1, the projected area of ​​the water shield 8 is not less than the projected area of ​​the return air unit 21. The water shield 8 completely covers the return air unit 21, and the water on the silicon wafers drips directly onto the water shield 8 and will not enter the return air unit 21.

[0095] Of course, it is understandable that, in order to prevent water falling on the water shield 8 from flowing into other parts of the drying device, a groove can be provided on the side of the water shield 8 facing the first conveying surface to store the water. Under the high temperature environment of the drying device, the water falling on the water shield 8 will evaporate into water vapor and flow with the airflow after the silicon wafer drying is completed.

[0096] To dry the silicon wafer, the airflow passing through it needs to be high-temperature, such as 110-130°C. Therefore, a heating element is provided between the air distribution element 20 and the first conveying surface. The heating element extends along the third direction D3 to heat the homogenized airflow. The airflow passing through the air distribution element 20 is relatively cool (compared to the temperature inside the drying device). When the airflow passes through the heating element, it exchanges heat with the heating element, increasing the airflow temperature. This allows the airflow to dry the silicon wafer, removing water stains from its surface. The heating element is a heating tube, which has a disc-shaped or tubular structure. The heating area it forms is adapted to the area of ​​the air distribution element 20, ensuring that all airflow from the air distribution element 20 can pass through the heating tube and exchange heat with it, forming hot air.

[0097] Further optimization of the scheme: the drying device also includes a box with a storage space. Multiple drying stations 5 and drying components 2 are all located inside the box. The cooling station 6 can be located outside or inside the box. In the second direction D2, an air inlet and an air outlet are provided on one side of the box. The air outlet is connected to the return air component 21. The air distribution component 20 is located below the air inlet so that the air entering the box from the air inlet is first homogenized by the air distribution component 20.

[0098] Specifically, the housing consists of a top plate and multiple peripheral side plates connected to the top plate. These peripheral side plates are arranged sequentially along the circumferential direction of the top plate, connected end-to-end, forming an internal accommodating space. Alternatively, the housing may have a bottom plate connected to each peripheral side plate, with the top plate and bottom plate positioned opposite each other. An inlet and an outlet are provided on a set of oppositely positioned side plates of the housing. Silicon wafers to be dried enter the housing through the inlet, and dried / cooled silicon wafers flow out through the outlet, realizing the transfer of silicon wafers. In some feasible embodiments, preferably, the inlet and outlet of the housing are positioned opposite each other in a first direction D1. A temporary storage station is provided on the inlet side of the housing for temporary storage of silicon wafers.

[0099] On one of the two circumferential side plates of the other set of opposite side plates of the box, there is an air inlet and an air outlet. The air inlet and the air outlet are arranged sequentially in the second direction D2. In the second direction D2, the air inlet, the air distribution component 20, the heating component, the drying station 5, the transfer component 1, the water shield 8 and the return air component 21 are arranged sequentially from top to bottom. The return air component 21 is connected to and communicates with the air outlet. The air distribution component 20 and the inner side wall of the box form an air inlet cavity. This cavity is connected to the air inlet. The air entering from the air inlet enters the air inlet cavity and then flows through the air distribution component 20 under the action of suction force and is homogenized by the air distribution component 20.

[0100] Outside the housing, an air extraction device and a dehumidification device are connected sequentially between the air outlet and the air inlet. The air extraction device draws air from inside the housing, creating a negative pressure at the return air component 21. The extracted air is dried by the dehumidification device and then enters the housing through the air inlet. It is then homogenized by the air distribution component 20, heated by the heating component, dried by the silicon wafer, and enters the return air component 21, where it is drawn in again by the air extraction device.

[0101] The aforementioned air extraction device provides power for the airflow within the chamber, creating a unidirectional flow field and enabling cyclical circulation. This air extraction device can be a vacuum pump, a commercially available product, and can be selected and configured according to actual needs; specific requirements are not specified here.

[0102] Since the air drawn from the chamber is the air used for drying the silicon wafers, it carries moisture. The dehumidifier dries this air, ensuring that the air re-entering the chamber is dry. This dehumidifier can be a commercially available dehumidifier, and its configuration can be selected based on actual needs; specific requirements are not specified here.

[0103] The scheme is further optimized by installing a tray detection device between the drying station 5 and the cooling station 6 to detect whether the multiple trays flowing out of the drying station 5 have completely entered the cooling station 6. A positioning detection device is installed at the cooling station 6, which is located on the blocking component to detect whether the trays are in position within the cooling station 6 and whether they are located between the blowing component 3 and the suction component 4, so that the multiple trays are on the same straight line in the third direction D3. The tray detection device and the positioning detection device work together with the transfer component 1.

[0104] The silicon wafer drying apparatus also includes a control device, which is connected to the wafer basket detection device, the position detection device and the transfer assembly 1 respectively. The control device receives signals transmitted by the wafer basket detection device and the position detection device, and controls the flow speed of the transfer assembly 1 according to the received signals, controlling the flow speed of the transfer assembly 1 between the drying stations 5 and the flow speed at the drying station 5.

[0105] The aforementioned tray detection device is a reflective sensor used to detect whether multiple trays arranged side-by-side along direction D3 have all flowed out of the last drying station 5. This prevents trays from shifting on the transfer assembly 1, which could cause a tray to remain in the drying unit for too long, or cause an abnormal flow speed on a conveyor chain, resulting in a tray becoming out of sync with the others. The reflective sensor can determine the position of the abnormal tray on the conveyor chain by the time difference between transmitting and receiving signals. This reflective sensor is a commercially available product; the model should be selected based on actual needs, and no specific requirements are specified here.

[0106] The aforementioned positioning detection device is a positioning sensor, such as mechanical, photoelectric, or magnetic induction type. The model can be selected and set according to actual needs, and no specific requirements are specified here.

[0107] Of course, the control device can also be connected to the heating element, the exhaust device 7, the blowing element 3 and the suction element 4 respectively to control the heating power of the heating element, and control the opening and closing of the exhaust device 7, the blowing element 3 and the suction element 4, etc.

[0108] The working process of the silicon wafer drying device is described below using a specific embodiment.

[0109] The silicon wafer drying device has three drying stations 5 arranged sequentially along the first direction D1, located inside the housing. A cooling station 6 is located outside the housing. Along the second direction D2, a uniform air distribution unit 20 is positioned above the three drying stations 5, covering the total area of ​​the three drying stations 5. A transfer assembly 1 passes through the three drying stations 5 and extends to the cooling station 6. The transfer assembly 1 extends from the inlet to the outlet of the silicon wafer drying device, connecting the three drying stations 5 and the cooling station 6 in series. The side of the transfer assembly 1 facing the uniform air distribution unit 20 is the first conveying surface. A return air unit 21 is positioned below the transfer assembly 1. A blowing unit 3 and a suction unit 4 are located at the cooling station 6. At each drying station 5, five wafer baskets are placed side-by-side along the third direction D3. Along the silicon wafer flow direction, the three drying stations 5 are designated as the first drying station 5, the second drying station 5, and the third drying station 5.

[0110] When the silicon wafer drying device is working, at the feeding port, the robot arm places five wafer baskets on the transfer assembly 1 respectively. The five wafer baskets are arranged side by side along the third direction D3. Each wafer basket is placed on two conveyor chains. During the placement process, the transfer assembly 1 is in a stopped state. The stopping time of the transfer assembly 1 is 150-180s. That is, the robot arm needs to complete the placement of the five wafer baskets within 150-180s.

[0111] After placement, the transfer component 1 moves at a first flow rate to convey the five trays to the first drying station 5. The first flow rate is 60-80 mm / s.

[0112] When all five wafer baskets are completely positioned at the first drying station 5, the transfer assembly 1 stops moving and the flow rate of the transfer assembly 1 is 0. The silicon wafers in the five wafer baskets are dried by the drying hot air flowing from the uniform air distribution unit 20 to the return air distribution unit 21.

[0113] After the first drying time is reached, the transfer component 1 moves at the first flow speed. The first drying time is 150-180s. The five trays are transported from the first drying station 5 to the second drying station 5. The transfer time is 8-10s.

[0114] Once all five wafer baskets are in the second drying station 5, the transfer assembly 1 stops moving and the flow rate of the transfer assembly 1 is 0. The silicon wafers in the five wafer baskets are dried again by the drying hot air flowing from the uniform air unit 20 to the return air unit 21.

[0115] After the second drying time is reached, the transfer component 1 moves at the first flow speed. The second drying time is 150-180s. The five trays are transported from the second drying station 5 to the third drying station 5. The transfer time is 8-10s.

[0116] When all five wafer baskets are completely in the third drying station 5, the transfer assembly 1 stops moving and the flow rate of the transfer assembly 1 is 0. The silicon wafers in the five wafer baskets are dried for the third time by the drying hot air flowing from the uniform air unit 20 to the return air unit 21.

[0117] After the third drying time is reached, the transfer component 1 moves at the first flow speed. The third drying time is 150-180s. The five trays are transported from the third drying station 5 to the cooling station 6. The transfer time is 8-10s.

[0118] Once the five wafer baskets are fully positioned at the cooling station 6, the transfer assembly 1 stops moving and the transfer speed of the transfer assembly 1 is 0. The silicon wafers in the five wafer baskets are cooled by the air blown out from the blower 3, and the cooling time is 150-180 seconds.

[0119] During the 150-180s cooling period, from 30-36s, the robot first unloads the wafer basket closest to the blower 3. From 60-72s, the robot unloads the second wafer basket along the third direction D3. From 90-108s, the robot unloads the third wafer basket along the third direction D3. From 120-144s, the robot unloads the fourth wafer basket along the third direction D3. From 150-180s, the robot unloads the fifth wafer basket along the third direction D3, completing the unloading of five wafer baskets. The wafer baskets closer to the suction component 4 are unloaded last, extending the residence time of the wafer baskets close to the suction component 4 and ensuring the cooling effect of the silicon wafers in the wafer baskets close to the suction component 4.

[0120] Due to the adoption of the above technical solution, the silicon wafer drying device has multiple drying stations and cooling stations, which are arranged sequentially along a first direction and connected to each other via a transfer component / robotic arm. Each drying station has a transfer component, and a transfer component is also provided at the cooling station. The transfer speed of the transfer component between the drying stations is greater than its speed at the drying station. The transfer speed of the transfer component at the drying station is the same as its speed at the cooling station, ensuring that the flow state of the silicon wafers in the drying station is consistent with that in the cooling station, thus controlling the operation of the drying device. The system operates in a synchronized manner, simultaneously drying and cooling multiple sets of silicon wafers. This reduces drying and cooling time, improves the efficiency of the drying equipment, and lowers energy consumption. Furthermore, the silicon wafers deflect during their movement within the drying station or between adjacent drying stations, ensuring that each wafer is completely dried. Vertically, air distribution and return components are installed on both sides of the transfer assembly. Both components extend upwards along a third direction. The air distribution components have multiple first air outlets along this direction, and the return components have multiple second air inlets. Through the cooperation of the air distribution and return components, air enters the drying chamber. The airflow is homogenized by the air distribution components, covering all silicon wafers at the drying station. This ensures the airflow is evenly distributed across all wafers, improving drying efficiency and distributing airflow and temperature uniformly within the drying chamber. This solves the problem of uneven localized temperatures, resulting in a more uniform thermal field within the drying unit, reduced energy consumption, decreased temperature differences between wafers at different locations, reduced parameter deviations, and extended service life of tooling and spare parts within the drying unit. The cooling station is equipped with blowing and suction components, creating a cooling airflow in a three-dimensional direction. This cooling airflow passes over multiple silicon wafers in multiple wafer baskets, cooling them and promoting the drying process. The residual heat on the surface is rapidly dissipated through convection, and the overall temperature drops quickly from the drying temperature to within the allowable deviation range of room temperature. Due to the slight lattice expansion and dimensional elongation of the silicon wafer during the drying process, this rapid and uniform cooling process can promote the release of internal stress in the silicon wafer, allowing its geometric dimensions to reliably recover from the thermally elongated state to the nominal dimensions at room temperature. After this cooling and shaping treatment, the flatness and dimensional consistency of the silicon wafer are effectively guaranteed, reducing the detection offset caused by high temperature. This enables the silicon wafer to meet the high-precision positioning and flatness feeding requirements of subsequent optical inspection or electrical performance testing equipment, and significantly reduces the false detection or jamming rate caused by thermal deformation.

[0121] The embodiments of the present invention have been described in detail above, but the content described is only a preferred embodiment of the present invention and should not be considered as limiting the scope of the present invention. All equivalent changes and improvements made in accordance with the scope of the present invention should still fall within the patent coverage of the present invention.

Claims

1. A silicon wafer drying apparatus, characterized in that: Includes a transfer assembly and at least two drying stations, wherein, At least two of the drying stations are arranged sequentially along a first direction, and each of the drying stations is equipped with a drying component; The transfer assembly is used to transfer silicon wafers, and the transfer speed of the silicon wafers between the drying stations is greater than the transfer speed at the drying station. The angle between the plane containing the cut surface of the silicon wafer and the first direction is not 0.

2. The silicon wafer drying apparatus according to claim 1, characterized in that: The drying assembly extends along the first direction; Within each of the drying stations, along the first direction, the turnover speed of the silicon wafer first decreases and then increases.

3. The silicon wafer drying apparatus according to claim 2, characterized in that: The transfer assembly has a first conveying surface extending along the first direction, the first conveying surface being used to place a wafer basket containing silicon wafers, and the drying assembly is located at least on one side of the first conveying surface along the second direction, the included angle between the first direction and the second direction being not 0.

4. The silicon wafer drying apparatus according to claim 3, characterized in that: The second direction is perpendicular to the plane containing the first conveying surface.

5. The silicon wafer drying apparatus according to any one of claims 1-4, characterized in that: Along the first direction, a cooling station is provided at the discharge end of the plurality of drying stations, and the cooling station is equipped with a cooling component.

6. The silicon wafer drying apparatus according to claim 5, characterized in that: The cooling assembly extends along the first direction; within the cooling station, the flow rate of the silicon wafer gradually decreases along the first direction.

7. The silicon wafer drying apparatus according to claim 6, characterized in that: The cooling station extends along a third direction and is used to place several wafer baskets containing silicon wafers, with the silicon wafers in the wafer baskets spaced apart along the first direction. The cooling assembly includes a blower. In the third direction, the blower is located on one side of the cooling station. Along the first direction, the extension length of the blower is not less than the length of the tray. The angle between the first direction and the third direction is not 0.

8. The silicon wafer drying apparatus according to claim 7, characterized in that: Along the first direction, the end of the cooling station is provided with a blocking member, the blocking member having an abutment surface extending along the third direction, the abutment surface being able to abut against the tray.

9. The silicon wafer drying apparatus according to claim 8, characterized in that: The cooling assembly also includes a suction component, which is positioned opposite to the blowing component on both sides of the cooling station in the third direction.

10. The silicon wafer drying apparatus according to claim 9, characterized in that: Along the first direction, the extension length of the suction member is less than the extension length of the blower member, and the suction member is located between the two ends of the blower member in the first direction.

11. The silicon wafer drying apparatus according to claim 5, characterized in that: The transfer assembly includes a conveyor belt extending along the first direction, which sequentially passes through each of the drying stations and the cooling stations.

12. The silicon wafer drying apparatus according to any one of claims 2-4 and 6-11, characterized in that: The drying assembly includes a uniform air distribution component and a return air component. The uniform air distribution component includes an air inlet end and an air outlet end that are connected to each other. The air inlet end includes at least one first air inlet, and the air outlet end includes at least two first air outlets. The plurality of first air outlets are arranged along a third direction. In the second direction, the air distribution component and the air return component are respectively disposed on both sides of the first conveying surface. The air return component is provided with at least two connected second air inlets and a second air outlet, and a plurality of second air inlets are arranged sequentially along the third direction.

13. The silicon wafer drying apparatus according to claim 5, characterized in that: A tray detection device is provided between the drying station and the cooling station, and an arrival detection device is provided at the cooling station. The tray detection device and the arrival detection device are respectively coordinated with the transfer assembly.

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